Efficient semiconductor base coating process

Abstract

The invention discloses an efficient semiconductor base coating process, and belongs to the field of semiconductor manufacturing. The efficient semiconductor base coating process comprises the following steps that firstly, a semiconductor base is fed to a bearing assembly; 2, a first driving assembly drives the bearing assembly and the semiconductor base on the bearing assembly to rotate, and a cleaning assembly purges the to-be-coated face of the semiconductor base through high-pressure gas; step 3, spraying a glue solution to the middle part of the top side of the semiconductor base by a gluing assembly, and uniformly coating the surface of the semiconductor base with the glue solution through rotation and centrifugal force; 4, collecting thickness data of the coating layer through a thickness detection assembly; and 5, the first driving assembly drives the bearing assembly and the semiconductor base on the bearing assembly to rotate, and the drying assembly dries the glue solution on the semiconductor base. According to the invention, high efficiency and high uniformity in the semiconductor base coating process are ensured through collaborative operation of all the components and integrated and automatic process design.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, in particular to a high-efficiency semiconductor pedestal coating process. BACKGROUND

[0002] In the process of manufacturing semiconductor chips, many process steps need to be carried out in a vacuum or a specific atmosphere. The semiconductor pedestal is a key component for carrying wafers, and the surface performance of the semiconductor pedestal directly affects the uniformity of the process and the quality of the wafers. In order to protect the pedestal and improve its corrosion resistance, insulation or heat transfer performance, a special thin film is usually coated on the surface of the pedestal.

[0003] Chinese patent discloses a semiconductor process equipment, a coating equipment and an exhaust device thereof, application number 201710964140.4, the above-mentioned patent mainly carries the workpiece to be processed by the carrier, the carrier is connected with the driving motor below, the rotation speed of the carrier can be controlled by the driving motor; the nozzle is used to provide the coating material to the workpiece to be processed.

[0004] However, the existing semiconductor coating technology lacks the integration of key auxiliary processes before and after coating, such as the lack of mechanisms or steps for cleaning the workpiece before coating and the lack of integrated drying mechanisms: During storage, loading and unloading into the wafer cassette, the surface of the semiconductor pedestal is prone to adsorb particulate contaminants, dust and other contaminants. If coating is directly performed on such contaminated pedestals, it may cause defects in the coating, affecting the uniformity, adhesion and final performance of the coating; After spin coating, the workpiece surface is covered with a liquid coating that has not yet solidified, and its physical state is unstable, making it difficult to unload the workpiece using vacuum suction or other methods, and making it difficult to immediately transport or process the workpiece.

[0005] This single coating technology, rather than a complete coating process system, makes the production layout adopt a "single process step by step mode", increasing the time cost, positioning error and secondary pollution risk caused by the flow of workpieces between different equipment, which is not conducive to the automation integration of the entire coating process and makes it difficult to achieve efficient and continuous production. SUMMARY

[0006] The present application provides a high-efficiency semiconductor pedestal coating process, which can solve the problem of the prior art that the high-efficiency semiconductor pedestal coating process is not conducive to the automation integration of the entire coating process and is difficult to achieve efficient and continuous production.

[0007] A high-efficiency semiconductor pedestal coating process, comprising the following steps: loading the semiconductor pedestal onto the carrier assembly, the carrier assembly positioning the semiconductor pedestal by vacuum suction; The first driving component drives the carrier component and the semiconductor substrate on it to rotate, and the cleaning component uses high-pressure gas to blow the surface of the semiconductor substrate to be coated. The adhesive coating assembly sprays adhesive onto the center of the top side of the semiconductor substrate. The lifting assembly moves the carrier assembly into the baffle. The first driving assembly drives the carrier assembly and the semiconductor substrate on it to rotate. The adhesive is evenly coated on the surface of the semiconductor substrate by rotation and centrifugal force. The lifting component moves the bearing component to the top of the baffle, and the thickness detection component collects coating thickness data. The first driving component drives the carrier component and the semiconductor substrate thereon to rotate, and the drying component dries the adhesive on the semiconductor substrate.

[0008] Preferably, the bearing assembly includes a negative pressure pipe rotatably connected to the movable plate and a vacuum suction stage fixed to the top of the negative pressure pipe. A rotary joint is installed at the bottom of the negative pressure pipe, and the fixed end of the rotary joint is connected to an external vacuum system.

[0009] Preferably, the first drive assembly includes a motor fixed to the movable plate and pulleys fixed to the motor output shaft and the negative pressure pipe, and the two pulleys are connected by belt drive.

[0010] Preferably, the lifting assembly includes a first cylinder fixed on the base, and the movable plate is fixed on the drive shaft of the first cylinder.

[0011] Preferably, the cleaning assembly includes a high-pressure gas cylinder, a delivery pipe connected to the high-pressure gas cylinder, a gas supply pipe, and a plurality of air pressure nozzles disposed at the bottom of the gas supply pipe. The air pressure nozzles are inclined to one side, and the delivery pipe is connected to the gas supply pipe through a flexible hose.

[0012] Preferably, the adhesive application assembly includes an adhesive storage tank, a delivery pump connected to the adhesive storage tank, an infusion pipe connected to the delivery pump, an adhesive outlet pipe, and an adhesive application nozzle fixed at the bottom end of the adhesive outlet pipe, wherein the infusion pipe is connected to the adhesive outlet pipe via a flexible hose.

[0013] Preferably, a retaining ring is fixed to the top of the baffle, and the vacuum suction stage moves inside the retaining ring to seal the inside of the baffle during cleaning.

[0014] Preferably, the baffle has a retaining ring fixed on the base inside, the retaining ring and the negative pressure pipe are coaxially arranged at the insertion position, and a discharge pipe is provided between the retaining ring and the baffle for discharging excess adhesive when the semiconductor substrate rotates.

[0015] Preferably, a second cylinder is disposed above the fixing ring, and a mounting plate is fixed on the drive shaft of the second cylinder. The air supply pipe, the glue outlet pipe, the thickness detection component, and the drying component are all disposed on the mounting plate.

[0016] Preferably, the drying assembly includes a heater employing radiant heating.

[0017] This invention provides a high-efficiency semiconductor substrate coating process, which has the following beneficial effects: 1. Precise positioning of the substrate is achieved through vacuum adsorption of the support component. Combined with the rotational drive of the first drive component, the high-pressure gas purging of the cleaning component, the targeted spraying of the adhesive component, and the coordinated operation of the lifting component within the sealed cavity of the baffle, the uniform coating of the adhesive on the substrate surface is achieved using spin coating centrifugal force. Subsequently, the coating thickness is monitored in real time by the thickness detection component, and the drying component completes the curing, ultimately forming a complete and uniform functional coating. This integrated and automated process design ensures high efficiency and high uniformity in the semiconductor substrate coating process.

[0018] 2. The fixing ring and sealing parts at the top of the baffle effectively prevent external contaminants from entering the cavity. When the first drive assembly drives the base to rotate, the adhesive spreads evenly from the center to the edge under the action of centrifugal force. Excess adhesive is thrown to the inner wall of the baffle and collected from the bottom for reuse. Attached Figure Description

[0019] Figure 1 A schematic diagram of the coating process for a high-efficiency semiconductor substrate coating technology provided by the present invention; Figure 2 A schematic diagram of the apparatus structure for a high-efficiency semiconductor substrate coating process provided by the present invention. Figure 1 ; Figure 3 A schematic diagram of the apparatus structure for a high-efficiency semiconductor substrate coating process provided by the present invention. Figure 2 ; Figure 4 A cross-sectional view of the carrier component in the apparatus for a high-efficiency semiconductor substrate coating process provided by the present invention; Figure 5 This is a schematic diagram of the cleaning component, adhesive coating component, thickness detection component, and drying component in the apparatus for a high-efficiency semiconductor substrate coating process provided by the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Bearing assembly; 101. Negative pressure pipe; 102. Vacuum suction stage; 2. First drive assembly; 201. Motor; 202. Pulley; 3. Cleaning assembly; 301. High-pressure gas cylinder; 302. Delivery pipe; 303. Gas delivery pipe; 304. Air pressure nozzle; 4. Glue application assembly; 401. Glue storage cylinder; 402. Delivery pump; 403. Liquid delivery pipe; 404. Glue outlet pipe; 405. Glue application nozzle; 5. Thickness detection assembly; 501. Thickness measurement sensor; 6. Drying assembly; 601. Heater; 7. Lifting assembly; 701. First cylinder; 8. Movable plate; 9. Rotary joint; 10. External pipe; 11. Baffle; 12. Second cylinder; 13. Discharge pipe; 14. Fixing ring; 15. Seal; 16. Retaining ring. Detailed Implementation

[0021] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0022] like Figures 1 to 5 As shown, an embodiment of the present invention provides a high-efficiency semiconductor substrate coating process, which includes the following steps: Step 1: The semiconductor substrate is loaded onto the carrier component 1, and the carrier component 1 positions the semiconductor substrate by vacuum adsorption; Step 2: The first driving component 2 drives the carrier component 1 and the semiconductor substrate on it to rotate, and the cleaning component 3 uses high-pressure gas to blow the surface of the semiconductor substrate to be coated. Step 3: The adhesive coating component 4 sprays adhesive onto the center of the top side of the semiconductor base. The lifting component 7 drives the carrier component 1 to move into the baffle 11. The first driving component 2 drives the carrier component 1 and the semiconductor base on it to rotate. The adhesive is evenly coated on the surface of the semiconductor base by rotation and centrifugal force. Step 4: The lifting component 7 moves the bearing component 1 to the top of the baffle 11, and the thickness detection component 5 collects the coating thickness data in real time. Step 5: The first driving component 2 drives the carrier component 1 and the semiconductor base on it to rotate, and the drying component 6 dries the adhesive on the semiconductor base.

[0023] First, the semiconductor substrate to be processed is loaded onto the carrier component 1. The carrier component 1 firmly adsorbs and precisely positions the substrate through preset vacuum adsorption holes, ensuring that it does not shift in subsequent processes. Then, the first drive component 2 is activated, driving the carrier component 1 and the semiconductor substrate on it to rotate around an axis. Simultaneously, the cleaning component 3 precisely blows high-pressure gas through nozzles onto the surface of the semiconductor substrate to be coated, effectively removing adhering particles and providing a clean substrate environment for the adhesive coating process. After cleaning, the nozzle of the adhesive coating component 4 begins to spray a preset amount of adhesive. After spraying, the lifting component 7 immediately moves, lowering the carrier component 1 and the substrate onto it into the sealed cavity formed by the baffle 11. During this process, the first drive component 2 continuously drives the carrier component 1 to rotate at high speed, using the centrifugal force generated by the rotation to evenly spread the adhesive from the center to the edges, thereby achieving complete and uniform coating of the adhesive on the surface of the semiconductor substrate. After coating is completed, the lifting component 7 is activated again, raising the carrier component 1 to the open position at the top of the baffle 11. At this point, the thickness detection component 5 scans the coating layer on the substrate surface, collects coating layer thickness data in real time, and feeds the data back to the control system for monitoring coating quality. Finally, the first drive component 2 drives the carrier component 1 to maintain uniform rotation, and the drying component 6 starts to cure and dry the adhesive uniformly coated on the semiconductor substrate surface, ultimately forming a stable and uniform functional coating, completing the entire coating process. Through integrated and automated process design, high efficiency and high uniformity of the semiconductor substrate coating process are achieved.

[0024] The supporting assembly 1 includes a negative pressure pipe 101 rotatably connected to the movable plate 8 and a vacuum suction table 102 fixed to the top of the negative pressure pipe 101. A rotary joint 9 is installed at the bottom end of the negative pressure pipe 101, and the fixed end of the rotary joint 9 is connected to an external vacuum system. The rotating end of the rotary joint 9 is connected to the negative pressure pipe 101, and its fixed end is fixed with an external pipe 10. The external pipe 10 is connected to an external vacuum system via a connecting hose.

[0025] The negative pressure generated by the external vacuum system is transmitted sequentially through the connecting hose, the external pipe 10 and the rotary joint 9, and finally through the internal channel of the negative pressure pipe 101 to the vacuum suction stage 102 at the top, thereby generating a strong suction force on the base and realizing the reliable clamping of the base.

[0026] In some specific implementation plans, such as Figure 2 and Figure 3As shown. The first drive assembly 2 includes a motor 201 fixed to the movable plate 8 and pulleys 202 fixed to the output shaft of the motor 201 and the negative pressure pipe 101. The two pulleys 202 are connected by belt drive. The lifting assembly 7 includes a first cylinder 701 fixed to the base, and the movable plate 8 is fixed to the drive shaft of the first cylinder 701. The coating process uses spin coating technology to ensure uniformity. Different coating thicknesses correspond to different spin coating times, which are detected by a thickness measuring sensor 501.

[0027] When rotation is required, motor 201 starts, driving the negative pressure pipe 101, vacuum suction table 102, and the adsorbed semiconductor substrate to rotate together via belt drive. Lifting component 7 is responsible for adjusting the height position of bearing component 1. By controlling the extension and retraction of the first cylinder 701, bearing component 1 can be raised or lowered to allow the substrate to move in and out of the baffle 11.

[0028] In some specific implementation plans, such as Figure 2 and Figure 5 As shown. The cleaning component 3 includes a high-pressure gas cylinder 301, a delivery pipe 302 connected to the high-pressure gas cylinder 301, a gas supply pipe 303, and a plurality of air pressure nozzles 304 located at the bottom of the gas supply pipe 303. The air pressure nozzles 304 are inclined to one side. The delivery pipe 302 is connected to the gas supply pipe 303 through a hose. A first valve is provided on the delivery pipe 302. The gas in the high-pressure gas cylinder 301 is preferably nitrogen, which is dry and free from the risk of oil or chemical residue.

[0029] When the support component 1 drives the base to start rotating, the control system opens the first valve. Nitrogen gas in the high-pressure cylinder 301 is released instantly, and after being transported through the delivery pipe 302 and the gas supply pipe 303, it is finally sprayed out from the pressure nozzle 304, forming a purge air curtain to clean the surface of the base to be coated.

[0030] In some specific implementation plans, such as Figure 2 and Figure 5 As shown. The glue application assembly 4 includes a glue storage tank 401, a delivery pump 402 connected to the glue storage tank 401, a liquid delivery pipe 403 connected to the delivery pump 402, a glue outlet pipe 404, and a glue application nozzle 405 fixed at the bottom end of the glue outlet pipe 404. The liquid delivery pipe 403 is connected to the glue outlet pipe 404 through a flexible hose, and a second valve is provided on the liquid delivery pipe 403.

[0031] When the control system issues an adhesive application command, the delivery pump 402 (typically a precision metering pump) starts, and the second valve opens. The delivery pump 402 controls the flow rate and pressure to pump the adhesive from the storage tank 401. After flowing through the delivery pipe 403, the adhesive is delivered to the outlet pipe 404 via a connecting hose, and finally stably sprayed from the application nozzle 405 to the center of the top surface of the semiconductor substrate.

[0032] In some specific implementation plans, such asFigure 4 As shown, a retaining ring 14 is fixedly provided on the top of the baffle 11, and the vacuum suction stage 102 moves inside the retaining ring 14 to seal the inside of the baffle 11 during cleaning. A sealing element 15 is fixed on the inner ring of the retaining ring 14, and the vacuum suction stage 102 slides in contact with the sealing element 15 when it enters and exits the baffle 11. The sealing element 15 seals the connection between the vacuum suction stage 102 and the retaining ring 14, preventing cleaning dust from entering the inside of the baffle 11 and contaminating the adhesive.

[0033] In some specific implementation plans, such as Figure 4 As shown. A retaining ring 16, fixed to the base, is provided inside the baffle 11. The negative pressure tube 101 passes through the base, and the retaining ring 16 and the negative pressure tube 101 are coaxially positioned. When the vacuum stage 102 moves into the baffle 11, its bottom is in near contact with the top of the retaining ring 16, which prevents the adhesive from flowing to the insertion port. A discharge pipe 13 is provided between the retaining ring 16 and the baffle 11. The discharge pipe 13 is embedded in the base and is used to discharge excess adhesive when the semiconductor substrate rotates, allowing for the collection and reuse of the excess adhesive.

[0034] In some specific implementation plans, such as Figure 2 and Figure 3 As shown. A second cylinder 12 is installed above the fixed ring 14. The second cylinder 12 is mounted on the machine base by a fixed bracket. A mounting plate is fixed on the drive shaft of the second cylinder 12. The air supply pipe 303, the glue outlet pipe 404, the thickness detection component 5 and the drying component 6 are all mounted on the mounting plate.

[0035] The second cylinder 12 moves the mounting plate up and down, mainly to adjust the distance between the various components on the mounting plate and the vacuum suction table 102. By increasing the distance between them, it is easier for the robot arm with the suction cup to load and unload materials at this gap.

[0036] In some specific implementations, the drying assembly 6 includes a heater 601 employing radiative heating, such as infrared heating or microwave heating. The thickness detection assembly 5 includes a thickness measurement sensor 501, which is either a laser interferometer or a terahertz wave thickness sensor. A terahertz wave thickness sensor is a non-contact measurement device based on terahertz technology; the interferometer method utilizes the principle of light interference to measure film thickness.

[0037] After the semiconductor substrate completes spin coating inside the baffle 11 and is lifted above the fixing ring 14 by the lifting assembly 7, the thickness detection assembly 5 is activated. In this embodiment, the thickness measurement sensor 501 is preferably a terahertz wave thickness sensor. The sensor emits terahertz wave pulses to the wet film on the substrate surface. By accurately measuring the reflection time difference of the pulses at the air-adhesive layer interface and the adhesive layer-substrate interface, the thickness of the wet adhesive film can be calculated in real time and accurately in a non-contact manner. The system controller continuously collects these thickness data and compares them with the preset target thickness range. If a thickness deviation is detected, the controller can adjust subsequent process parameters, such as the spin coating speed for the next coating, thereby achieving control and optimization of the coating thickness.

[0038] Once the thickness is confirmed to meet the standard, the drying component 6 is activated to heat the inside of the coating and the base as a whole, achieving rapid and uniform curing.

[0039] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution will now be briefly explained in conjunction with specific application scenarios: The first cylinder 701 of the lifting assembly 7 drives the movable plate 8 to rise, positioning the vacuum suction table 102 in a convenient loading position. An operator or robotic arm places the semiconductor substrate onto the vacuum suction table 102. The external vacuum system activates, creating a negative pressure on the surface of the vacuum suction table 102 via the rotary joint 9 and negative pressure pipe 101, firmly adhering to the substrate. The motor 201 of the first drive assembly 2 drives the carrier assembly 1 and the substrate to rotate at a uniform speed via belt drive. Simultaneously, high-pressure nitrogen from the cleaning assembly 3 is ejected from the air pressure nozzle 304 through the delivery pipe 302, forming a directional air curtain that blows across the rotating substrate surface, effectively removing dust and contaminants and preparing a clean surface for coating.

[0040] After cleaning, the delivery pump 402 pumps the adhesive from the storage cylinder 401 through the delivery pipe 403 to the application nozzle 405, spraying it onto the center of the top surface of the base. Then, the first cylinder 701 drives the support assembly 1 to lower the base into the sealed cavity formed by the baffle 11. The first drive assembly 2 then drives the base to rotate, and the adhesive, under centrifugal force, spreads evenly from the center to the edges, forming a uniform film. Excess adhesive is thrown onto the inner wall of the baffle 11 and finally collected by the discharge pipe 13 at the bottom for reuse.

[0041] After coating is completed, the first cylinder 701 lifts the supporting component 1 above the baffle 11. The thickness measurement sensor 501 scans the wet film, measures and feeds back the coating thickness data in real time. After the thickness is confirmed to be within the standard range, the heater 601 is activated, and while the base is continuously rotating, it provides uniform and rapid radiant heating to the adhesive layer, promoting the curing of the adhesive and ultimately forming a stable functional coating.

[0042] Through the coordinated operation of the above components, this process achieves high efficiency and high uniformity in the semiconductor substrate coating process.

[0043] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A high-efficiency semiconductor substrate coating process, characterized in that, Includes the following steps: The semiconductor substrate is loaded onto the carrier component (1), which positions the semiconductor substrate by vacuum adsorption. The first driving component (2) drives the carrier component (1) and the semiconductor base on it to rotate, and the cleaning component (3) uses high-pressure gas to blow the surface of the semiconductor base to be coated. The adhesive coating assembly (4) sprays adhesive liquid onto the middle of the top side of the semiconductor base. The lifting assembly (7) drives the carrier assembly (1) to move into the baffle (11). The first driving assembly (2) drives the carrier assembly (1) and the semiconductor base on it to rotate. The adhesive liquid is evenly coated on the surface of the semiconductor base by rotation and centrifugal force. The lifting component (7) drives the bearing component (1) to move to the top of the baffle (11), and the thickness detection component (5) collects the coating thickness data; The first driving component (2) drives the carrier component (1) and the semiconductor substrate on it to rotate, and the drying component (6) dries the adhesive on the semiconductor substrate.

2. The high-efficiency semiconductor substrate coating process as described in claim 1, characterized in that, The bearing assembly (1) includes a negative pressure pipe (101) rotatably connected to the movable plate (8) and a vacuum suction table (102) fixed to the top of the negative pressure pipe (101). A rotary joint (9) is installed at the bottom of the negative pressure pipe (101), and the fixed end of the rotary joint (9) is connected to an external vacuum system.

3. The high-efficiency semiconductor substrate coating process as described in claim 2, characterized in that, The first drive assembly (2) includes a motor (201) fixed to the movable plate (8) and a pulley (202) fixed to the output shaft of the motor (201) and the negative pressure pipe (101). The two pulleys (202) are connected by belt drive.

4. The high-efficiency semiconductor substrate coating process as described in claim 3, characterized in that, The lifting assembly (7) includes a first cylinder (701) fixed on the base, and the movable plate (8) is fixed on the drive shaft of the first cylinder (701).

5. The high-efficiency semiconductor substrate coating process as described in claim 4, characterized in that, The cleaning component (3) includes a high-pressure gas cylinder (301), a delivery pipe (302) connected to the high-pressure gas cylinder (301), a gas delivery pipe (303), and a plurality of air pressure nozzles (304) located at the bottom of the gas delivery pipe (303). The air pressure nozzles (304) are inclined to one side, and the delivery pipe (302) is connected to the gas delivery pipe (303) through a hose.

6. The high-efficiency semiconductor substrate coating process as described in claim 5, characterized in that, The adhesive application assembly (4) includes an adhesive storage tank (401), a delivery pump (402) connected to the adhesive storage tank (401), an infusion pipe (403) connected to the delivery pump (402), an adhesive outlet pipe (404), and an adhesive application nozzle (405) fixed at the bottom of the adhesive outlet pipe (404). The infusion pipe (403) is connected to the adhesive outlet pipe (404) via a flexible hose.

7. The high-efficiency semiconductor substrate coating process as described in claim 6, characterized in that, A fixing ring (14) is fixedly provided on the top of the baffle (11), and the vacuum suction stage (102) moves inside the fixing ring (14) to seal the inside of the baffle (11) during cleaning.

8. The high-efficiency semiconductor substrate coating process as described in claim 7, characterized in that, The baffle 11 is provided with a retaining ring (16) fixed on the base. The retaining ring (16) and the negative pressure tube (101) are coaxially arranged at the insertion position. A discharge tube (13) is provided between the retaining ring (16) and the baffle (11) for discharging excess adhesive when the semiconductor base rotates.

9. The high-efficiency semiconductor substrate coating process as described in claim 8, characterized in that, A second cylinder (12) is provided above the fixing ring (14). A mounting plate is fixed on the drive shaft of the second cylinder (12). The air supply pipe (303), the glue outlet pipe (404), the thickness detection component (5), and the drying component (6) are all mounted on the mounting plate.

10. The high-efficiency semiconductor substrate coating process as described in claim 9, characterized in that, The drying assembly (6) includes a heater (601) that employs radiant heating.

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