Electronic component

Abstract

An electronic component includes an element main body, an external electrode, and an internal electrode. The internal electrode includes a main electrode portion, and a connection portion connecting the main electrode portion and the external electrode. The connection portion is narrower than the main electrode portion in the first direction and is exposed to a partial region of the end surface located closer to the first main surface. The sintered metal layer includes a first portion and a second portion. The first portion covers the partial region of the end face and is connected to the connecting portion. The second portion covers at least a partial region of the end surface located closer to the second main surface than the partial region. The conductive resin layer includes an end surface side portion on the end surface to cover the first portion and expose the second portion. The plating layer covers the second portion and the end surface side portion.

Description

[0001] Cross-reference to related applications

[0002] This application is based on and claims priority to Japanese Patent Application No. 2024-167005, filed on September 26, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to an electronic component. Background Technology

[0004] Known electronic components include a component body, a plurality of external electrodes disposed on the component body, and a plurality of internal electrodes disposed within the component body (see, for example, Japanese Unexamined Patent Publication No. 2003-243249). Each of the plurality of external electrodes includes a sintered metal layer and a plating layer. Each of the plurality of internal electrodes is electrically connected to a corresponding external electrode among the plurality of external electrodes. Summary of the Invention

[0005] In structures where the external electrodes include a plating layer, hydrogen gas may be generated during the plating process. If the generated hydrogen gas reaches the internal electrodes through the sintered metal layer, the characteristics of the electronic components may deteriorate. For example, the insulation resistance may decrease.

[0006] One aspect of this disclosure is to provide an electronic component that prevents performance degradation.

[0007] An electronic component according to one aspect of this disclosure includes a component body, a plurality of external electrodes, and a plurality of internal electrodes. The component body has a cuboid shape and includes: a first main surface and a second main surface opposite each other in a first direction, a pair of end faces opposite each other in a second direction, and a pair of side faces opposite each other in a third direction. The plurality of external electrodes are disposed at both ends of the component body in the second direction and each includes a sintered metal layer, a conductive resin layer, and a plating layer. The plurality of internal electrodes are disposed on the component body opposite each other in a third direction and are electrically connected to corresponding external electrodes of the plurality of external electrodes. Each of the plurality of internal electrodes includes: a main electrode portion opposite to an adjacent internal electrode of the plurality of internal electrodes in a third direction; and a connecting portion narrower than the main electrode portion in the first direction and connecting the main electrode portion to the corresponding external electrode, the connecting portion being exposed in a portion of the end face closer to the first main surface. The sintered metal layer includes: a first portion covering a portion of the end face and connected to the connecting portion; and a second portion covering at least a portion of the end face closer to the second main surface than the first portion. The conductive resin layer includes: an end-face side portion located on the end face to cover the first portion and expose the second portion. A plating layer covers the second portion and the end-face side portion.

[0008] In one aspect, the connection portion of the internal electrode is exposed to the one portion of the end surface. The one portion of the end surface is covered with the first portion of the sintered metal layer, which is connected to the connection portion of the internal electrode.

[0009] The external electrode includes a conductive resin layer. The conductive resin layer includes an end surface side portion. The end surface side portion is positioned on the end surface to cover the first portion of the sintered metal layer. The conductive resin layer generally includes a plurality of conductive particles and a resin. The resin included in the end surface side portion prevents hydrogen from moving from the plating layer to the first portion of the sintered metal layer. Thus, hydrogen tends not to migrate to the first portion of the sintered metal layer, and tends not to reach the internal electrode. As a result, this aspect can prevent a characteristic from deteriorating.

[0010] As described above, the conductive resin layer generally includes a resin. The conductive resin layer has a resistance greater than that of the sintered metal layer that does not include the resin. The ESR of the multilayer capacitor including the conductive resin layer can increase.

[0011] The plating layer covers the second portion of the sintered metal layer. The second portion of the sintered metal layer is connected to the plating layer with the conductive resin layer interposed therebetween. Thus, in this aspect, the external electrode includes a current path that does not include the conductive resin layer. As a result, this aspect prevents an increase in ESR.

[0012] In this aspect, the sintered metal layer can completely cover the end surface.

[0013] In a structure in which the sintered metal layer completely covers the end surface, the sintered metal layer protects the end surface.

[0014] In this aspect, the plurality of internal electrodes respectively include another connection portion that is narrower than the main electrode portion in the first direction and connects the main electrode portion to the corresponding external electrode, the another connection portion being exposed to another portion of the end surface that is closer to the second main surface. The sintered metal layer can include a third portion that covers the another portion of the end surface and is connected to the another connection portion, and a fourth portion that covers at least a portion of the end surface that is closer to the first main surface than the another portion. The conductive resin layer can include another end surface side portion that is positioned on the end surface to cover the third portion and expose the fourth portion. The plating layer can cover the fourth portion and the another end surface side portion.

[0015] In a structure in which the plurality of internal electrodes respectively include another connection portion, the sintered metal layer includes a third portion and a fourth portion, the conductive resin layer includes another end surface side portion, and the plating layer covers the fourth portion and the another end surface side portion, the another connection portion of the internal electrode is exposed to the another portion of the end surface, the another portion of the end surface is covered with the third portion of the sintered metal layer, and the third portion of the sintered metal layer is connected to the another connection portion of the internal electrode.

[0016] In this structure, the other end surface side portion is positioned on the end surface to cover the third portion of the sintered metal layer. The resin included in the other end surface side portion prevents hydrogen from moving from the plating layer to the third portion of the sintered metal layer. Thus, hydrogen tends not to migrate to the third portion of the sintered metal layer, and tends not to reach the internal electrode. Thereby, this structure further prevents characteristic deterioration.

[0017] In this structure, the plating layer covers the fourth portion of the sintered metal layer. The fourth portion of the sintered metal layer is connected with the plating layer without the conductive resin layer interposed therebetween. Thus, in this structure, the external electrode includes a current path that does not include the conductive resin layer. Thereby, this structure further prevents an increase in ESR.

[0018] In this one aspect, the second portion and the fourth portion can be continuous with each other. The end surface can be completely covered with the external electrode.

[0019] In this one aspect, the second portion and the fourth portion can be separated from each other. The end surface can be exposed from the external electrode in a region between the second portion and the fourth portion.

[0020] In this one aspect, the conductive resin layer can include a first main surface side portion continuous with the one end surface side portion and covering a portion of the first main surface. The main electrode portion can include a first edge opposite to a region of the first main surface covered with the first main surface side portion in the first direction, and a second edge opposite to a region of the first main surface exposed from the conductive resin layer in the first direction. The first edge can include an edge region at a distance from the first main surface in the first direction greater than a distance between the second edge and the first main surface in the first direction.

[0021] In a structure in which the conductive particles of the conductive resin layer include metal particles, migration can occur in the external electrode. For example, migration is considered to occur due to the following matters.

[0022] An electric field acts on the metal particles included in the conductive resin layer, and the metal particles are ionized. The generated metal ions are attracted by the electric field acting on the external electrode, and migrate from the conductive resin layer. The electric field acting on the metal ions includes, for example, an electric field between the external electrode and the internal electrode that are not electrically connected to each other. The metal ions that have migrated from the conductive resin layer react with, for example, electrons supplied from the internal electrode or the external electrode, and are deposited as metal on a surface of the element main body.

[0023] For example, an electric field tends to be generated between the first main surface side portion of the conductive resin layer and the internal electrode that are not electrically connected to each other. The electric field can cause the above-described migration. However, the structure in which the first edge of the main electrode portion includes the edge region reduces the electric field between the first main surface side portion and the internal electrode that are not electrically connected to each other. Thus, this structure prevents the occurrence of migration.

[0024] In this one aspect, the first edge can include only the edge region.

[0025] The structure in which the first edge includes only the edge region further reduces an electric field between the first main face side portion of the conductive resin layer that is not electrically connected to each other and the internal electrode. Therefore, this structure further prevents occurrence of migration.

[0026] In this one aspect, the conductive resin layer can include a side face side portion that is continuous with the one end face side portion and covers a part of the side face. This one aspect can include a virtual conductor that is disposed in the element main body, is adjacent to the side face side portion in the third direction, and is electrically connected to the side face side portion.

[0027] For example, an electric field tends to be generated between the side face side portion of the conductive resin layer that is not electrically connected to each other and the internal electrode. The electric field can cause the above-described migration. However, the structure including the virtual conductor reduces the electric field between the side face side portion that is not electrically connected to each other and the internal electrode. Therefore, this structure prevents occurrence of migration.

[0028] In this one aspect, a length in the first direction from a reference surface that is a surface including the first main face to an edge of the virtual conductor that is opposite to the second main face can be greater than a length in the first direction from the reference surface to the side face side portion.

[0029] In the structure in which the length in the first direction from the reference surface to the edge of the virtual conductor that is opposite to the second main face is greater than the length in the first direction from the reference surface to the side face side portion, the structure reliably reduces the electric field between the side face side portion that is not electrically connected to each other and the internal electrode.

[0030] In this one aspect, the conductive resin layer can include a side face side portion that is continuous with the one end face side portion and covers a part of the side face. When the side face side portion and an internal electrode of the plurality of internal electrodes that is not electrically connected to the side face side portion are observed from the third direction, the side face side portion and the internal electrode that is not electrically connected to the side face side portion do not overlap with each other.

[0031] In the structure in which the side face side portion and the internal electrode that is not electrically connected to the side face side portion do not overlap with each other as described above, the structure reduces the electric field between the side face side portion and the internal electrode that are not electrically connected to each other. Therefore, this structure prevents occurrence of migration. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a perspective view illustrating a multilayer capacitor according to an embodiment;

[0033] Figure 2 is a view illustrating a cross-sectional structure of the multilayer capacitor;

[0034] is a perspective view illustrating a multilayer capacitor according to an embodiment;Figure 3 is a view showing a cross-sectional structure of a multilayer capacitor;

[0035] Figure 4 is a view showing a cross-sectional structure of a multilayer capacitor;

[0036] Figure 5 is a view showing a structure of a first electrode layer and a second electrode layer;

[0037] Figure 6 is a view showing a cross-sectional structure of a multilayer capacitor according to a modification of the embodiment;

[0038] Figure 7 is a view showing a structure of a first electrode layer and a second electrode layer;

[0039] Figure 8 is a view showing a structure of a first electrode layer and a second electrode layer;

[0040] Figure 9 is a view showing a cross-sectional structure of a multilayer capacitor according to another modification of the embodiment;

[0041] Figure 10 is a view showing a structure of a first electrode layer and a second electrode layer;

[0042] Figure 11 is a view showing a structure of a first electrode layer and a second electrode layer;

[0043] Figure 12 is a view showing a cross-sectional structure of a multilayer capacitor according to still another modification of the embodiment;

[0044] Figure 13 is a view showing a cross-sectional structure of a multilayer capacitor according to still another modification of the embodiment;

[0045] Figure 14 is a view showing a cross-sectional structure of a multilayer capacitor according to still another modification of the embodiment;

[0046] Figure 15 is a view showing a structure of a first electrode layer and a second electrode layer;

[0047] Figure 16 is a perspective view showing a multilayer capacitor according to another embodiment;

[0048] Figure 17 is a view showing a cross-sectional structure of a multilayer capacitor;

[0049] Figure 18 is a view showing a cross-sectional structure of a multilayer capacitor;

[0050] Figure 19is a view showing a structure of the first electrode layer and the second electrode layer;

[0051] Figure 20 is a view showing a cross-sectional structure of a multilayer capacitor according to a modification of another embodiment;

[0052] Figure 21 is a view showing a structure of the second electrode layer. DETAILED DESCRIPTION

[0053] In the following description, reference is made to the accompanying drawings which form a part hereof, and in which similar references are made to similar components throughout the various figures. It is also noted that for the sake of brevity, description of any feasible equivalents are not repeatedly made.

[0054] Referring to Figures 1 to 5 , a structure of a multilayer capacitor C1 in an embodiment is described. Figure 1 is a perspective view showing a multilayer capacitor according to an embodiment. Figure 2 , Figure 3 and Figure 4 are views showing a cross-sectional structure of a multilayer capacitor according to an embodiment. Figure 5 is a view showing a structure of the first electrode layer and the second electrode layer.

[0055] An electronic component can include, for example, the multilayer capacitor C1.

[0056] As shown in Figure 1 , the multilayer capacitor C1 includes an element main body 3 in a cuboid shape, and a plurality of external electrodes 5. For example, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 is provided to a surface of the element main body 3. The pair of external electrodes 5 is separated from each other. The cuboid shape includes, for example, a cuboid shape in which corners and edges are chamfered, or a cuboid shape in which corners and edges are rounded.

[0057] The element main body 3 includes a pair of main faces 3a and 3b opposite to each other, a pair of side faces 3c opposite to each other, and a pair of end faces 3e opposite to each other. The pair of main faces 3a and 3b, the pair of side faces 3c, and the pair of end faces 3e are each rectangular. A direction in which the pair of main faces 3a and 3b are opposite to each other includes a first direction D1, a direction in which the pair of side faces 3c are opposite to each other includes a third direction D3, and a direction in which the pair of end faces 3e are opposite to each other includes a second direction D2. The main face 3b is provided with a mark M for indicating a direction of the element main body 3. The mark M can be a pattern layer formed on the main face 3b, or a region in which at least a part of the main face 3b is colored.

[0058] For example, the multilayer capacitor C1 is solder-mounted to an electronic device. The electronic device includes, for example, a circuit board or other electronic components. In the multilayer capacitor C1, the main face 3a is opposite to the electronic device. The main face 3a is provided so as to constitute a mounting surface. The main face 3a includes the mounting surface. For example, the main face 3a can include a first main face, and the main face 3b can include a second main face.

[0059] The first direction D1 includes a direction perpendicular to the main faces 3a and 3b, and perpendicular to the third direction D3. The second direction D2 includes a direction parallel to each of the main faces 3a and 3b and each of the side faces 3c, and perpendicular to the first direction D1 and the third direction D3. The third direction D3 includes a direction perpendicular to the side faces 3c, and the second direction D2 includes a direction perpendicular to the end face 3e.

[0060] The pair of side faces 3c extends in the first direction D1 to join the pair of main faces 3a and 3b. The pair of side faces 3c extends in the second direction D2. The pair of end faces 3e extends in the first direction D1 to join the pair of main faces 3a and 3b. The pair of end faces 3e extends in the third direction D3.

[0061] For example, the length of the element body 3 in the direction D2 is greater than the length of the element body 3 in the direction D1, and greater than the length of the element body 3 in the direction D3. The direction D2 includes a longitudinal direction of the element body 3. The length of the element body 3 in the direction D1 can also be equal to the length of the element body 3 in the direction D3. The length of the element body 3 in the direction D1 can also be different from the length of the element body 3 in the direction D3.

[0062] The length of the element body 3 in the direction D1 is defined, for example, as a height of the element body 3. The length of the element body 3 in the direction D3 is defined, for example, as a width of the element body 3. The length of the element body 3 in the direction D2 is defined, for example, as a longitudinal length of the element body 3. For example, the height of the element body 3 ranges from 0.1 to 3.2 mm, the width of the element body 3 ranges from 0.1 to 6.3 mm, and the longitudinal length of the element body 3 ranges from 0.2 to 7.5 mm. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the longitudinal length of the element body 3 is 3.2 mm.

[0063] The element body 3 includes two ridge portions 3g, two ridge portions 3h, four ridge portions 3i, and four ridge portions 3j. The ridge portions 3g are located between the end face 3e and the main face 3a. The ridge portions 3h are located between the end face 3e and the main face 3b. The ridge portions 3i are located between the end face 3e and the side face 3c. The ridge portions 3j are located between the main faces 3a and 3b and the side face 3c. For example, each of the ridge portions 3g, 3h, 3i, and 3j is rounded in a curved manner. The element body 3 is subjected to so-called round chamfer processing. The end face 3e and the main face 3a are indirectly adjacent to each other with the ridge portions 3g interposed therebetween. The end face 3e and the main face 3b are indirectly adjacent to each other with the ridge portions 3h interposed therebetween. The end face 3e and the side face 3c are indirectly adjacent to each other with the ridge portions 3i interposed therebetween. The main faces 3a and 3b and the side face 3c are indirectly adjacent to each other with the ridge portions 3j interposed therebetween.

[0064] like Figure 5 As shown, end face 3e includes multiple regions 3e a 3e b and 3e c For example, end face 3e includes three regions 3e a 3e b and 3e c Area 3e a Located closer to the main face 3a. Region 3e b Located closer to main face 3b. Area 3e c Located in area 3e a With region 3e b Between. Region 3e b and 3e c Compared to region 3e a It is closer to the main face 3b.

[0065] Area 3e a Region 3e b and region 3e c In direction D1, in area 3e a Region 3e c and region 3e b The sequential configuration. Region 3e a 3e b and 3e c The lengths along direction D1 can be different or the same. Region 3e a With 3e b The lengths in direction D1 can be the same. Each region is 3e. a 3e b and 3e c The length in direction D3 can be equal to or less than the length of end face 3e in direction D3. For example, region 3e a It may include a portion of the end face 3e, region 3e b It may include another part of the area of ​​end face 3e.

[0066] The component body 3 is constructed by stacking multiple dielectric layers in direction D3. The component body 3 comprises multiple stacked dielectric layers. In the component body 3, the stacking direction of the multiple dielectric layers is consistent with direction D3. Each dielectric layer includes, for example, a sintered body of a ceramic green sheet containing a dielectric material. Examples of dielectric materials include dielectric ceramics. Examples of dielectric ceramics include BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based materials. In the actual component body 3, the dielectric layers are bonded together so tightly that the boundaries between the dielectric layers are indistinguishable.

[0067] likeFigure 2 As shown, the multilayer capacitor C1 includes a plurality of internal electrodes 7. Each internal electrode 7 is connected with a corresponding external electrode 5 of the plurality of external electrodes 5. The internal electrode 7 is electrically connected and physically connected with the corresponding external electrode 5. Each internal electrode 7 includes an internal conductor provided in the element body 3. Each internal electrode 7 is composed of a conductive material that is typically used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, nickel (Ni) or copper (Cu). Each internal electrode 7 is configured as a sintered body of a conductive paste including the above-described conductive material. For example, the internal electrode 7 includes nickel. In Figure 2 In the present embodiment, for ease of explanation, the internal electrodes 7 adjacent to each other are intentionally shown as being offset from each other in the first direction D1 and the second direction D2.

[0068] The plurality of internal electrodes 7 are arranged at different positions (layers) in the direction D3. The plurality of internal electrodes 7 are arranged to face each other with a space therebetween in the direction D3 in the element body 3. The internal electrodes 7 adjacent to each other in the direction D3 have different polarities from each other. One end of the internal electrode 7 is exposed to a corresponding end surface 3e of the pair of end surfaces 3e. The other end of the internal electrode 7 is located in the element body 3 and is not exposed to the end surface 3e. The internal electrode 7 includes the one end exposed to the corresponding end surface 3e. The plurality of internal electrodes 7 include the internal electrode 7 exposed to one end surface 3e of the pair of end surfaces 3e and the internal electrode 7 exposed to the other end surface 3e of the pair of end surfaces 3e. The internal electrode 7 exposed to the one end surface 3e and the internal electrode 7 exposed to the other end surface 3e are alternately arranged in the direction D3. The plurality of internal electrodes 7 are arranged in the element body 3 in a manner of being aligned in the direction D3. Each internal electrode 7 is located in a plane substantially parallel to the pair of side surfaces 3c. Each internal electrode 7 is located in a plane substantially perpendicular to the pair of main surfaces 3a and 3b. The direction in which the internal electrodes 7 face each other is perpendicular to the direction parallel to the pair of side surfaces 3c.

[0069] Each internal electrode 7 includes a main electrode portion 7a and a connection portion 7b. The main electrode portion 7a and the connection portion 7b are continuous with each other. The main electrode portion 7a and the connection portion 7b are integrally formed.

[0070] The main electrode portion 7a opposes the internal electrode 7 adjacent in the direction D3 among the plurality of internal electrodes 7. The main electrode portion 7a opposes the main electrode portion 7a included in the internal electrode 7 adjacent in the direction D3. The main electrode portions 7a adjacent to each other in the direction D3 oppose each other in the direction D3. The multilayer capacitor C1 exhibits capacitance between the main electrode portions 7a adjacent to each other in the direction D3.

[0071] The connecting portion 7b connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7b is directly connected to the corresponding external electrode 5. The connecting portion 7b electrically connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7b includes: one end connected to the main electrode portion 7a, and a region 3e exposed in the corresponding end face 3e of a pair of end faces 3e. a The other end. The other end of the connecting part 7b is only exposed in region 3e. a The other end of the connecting part 7b is not exposed in the end face 3e except for region 3e. a The other end of the connecting part 7b is not exposed in area 3e. b With region 3e c .

[0072] The connecting portion 7b has a width in direction D1 that is smaller than the width of the main electrode portion 7a. When viewed from direction D3, the connecting portion 7b is located closer to the main surface 3a. In direction D1, the distance between the main surface 3a and the connecting portion 7b is smaller than the distance between the main surface 3b and the connecting portion 7b. In direction D1, the distance between the main surface 3b and the connecting portion 7b is greater than the distance between the main surface 3b and the main electrode portion 7a. The connecting portion 7b is located further away from the main surface 3b than the main electrode portion 7a in direction D1. In direction D1, the distance between the main surface 3a and the connecting portion 7b is approximately the same as the distance between the main surface 3a and the main electrode portion 7a in direction D1. In direction D1, the distance between the main surface 3a and the connecting portion 7b can also be greater than the distance between the main surface 3a and the main electrode portion 7a in direction D1.

[0073] like Figure 1 As shown, external electrodes 5 are disposed at both ends of the component body 3 in the first direction D1. Each external electrode 5 is disposed on a corresponding end face 3e. For example, each external electrode 5 is disposed on a pair of main faces 3a and 3b, a pair of side faces 3c, and an end face 3e. Figures 2 to 4 As shown, the external electrode 5 includes multiple electrode portions 5a, 5b, 5c, and 5e. Electrode portion 5a is located on the main surface 3a and the edge portion 3g. Electrode portion 5b is located on the main surface 3b and the edge portion 3g. Each electrode portion 5c is located on the side surface 3c and the edge portion 3i. Electrode portion 5e is located on the end face 3e. The external electrode 5 includes an electrode portion located on the edge portion 3j.

[0074] The external electrode 5 is formed on the pair of main surfaces 3a and 3b, one end surface, the pair of side surfaces 3c, and the above-mentioned ridge portions 3g, 3h, 3i, and 3j. The electrode portions 5a, 5b, 5c, and 5e, which are adjacent to each other, are physically connected and electrically connected. The electrode portion 5e entirely covers one end of the corresponding internal electrode 7 among the plurality of internal electrodes 7. The electrode portion 5e entirely covers one end of the connecting portion 7b included in the corresponding internal electrode 7. The electrode portion 5e is directly connected to the corresponding internal electrode 7. The external electrode 5 is electrically connected to the corresponding internal electrode 7. As shown in FIG. 2, the external electrode 5 includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5c, and 5e includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4. The electrode portion 5b includes the first electrode layer E1, the third electrode layer E3, and the fourth electrode layer E4. Figures 2 to 4 As shown in FIG. 2, the external electrode 5 includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5c, and 5e includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4. The electrode portion 5b includes the first electrode layer E1, the third electrode layer E3, and the fourth electrode layer E4.

[0075] The first electrode layer E1 of the electrode portion 5a is disposed on the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a covers the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the entire ridge portion 3g. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The side surface 3a is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5a is located on the ridge portion 3g. In the electrode portion 5a, the first electrode layer E1 can be formed on the main surface 3a. The first electrode layer E1 can be disposed on the main surface 3a. The first electrode layer E1 can cover a portion of the main surface 3a located closer to the end surface 3e.

[0076] The second electrode layer E2 of the electrode portion 5a is disposed on the first electrode layer E1 and the main surface 3a. In the electrode portion 5a, the second electrode layer E2 covers the first electrode layer E1 and a portion of the main surface 3a. In the electrode portion 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3a. The second electrode layer E2 of the electrode portion 5a is formed so as to cover the first electrode layer E1 of the electrode portion 5a. In the electrode portion 5a, the second electrode layer E2 indirectly covers the ridge portion 3g such that the first electrode layer E1 is located between the second electrode layer E2 and the ridge portion 3g. The second electrode layer E2 of the electrode portion 5a is located on the main surface 3a. Each of the second electrode layers E2 located on the same main surface 3a has an edge E2a e On the same main surface 3a, the edge E2a e of one second electrode layer E2 is opposite to the edge E2a e of another second electrode layer E2. The second electrode layer E2 of the electrode portion 5a includes, for example, a first main surface side portion covering a portion of the main surface 3a.

[0077] The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5a are disposed on the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5a cover the second electrode layer E2. The third electrode layer E3 of the electrode portion 5a is in contact with the second electrode layer E2. The third electrode layer E3 of the electrode portion 5a is in direct contact with the second electrode layer E2. The third electrode layer E3 of the electrode portion 5a is not in direct contact with the first electrode layer E1. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5a are located on the main surface 3a.

[0078] The first electrode layer E1 of the electrode portion 5b is disposed on the ridge portion 3h. The first electrode layer E1 of the electrode portion 5b covers the entire ridge portion 3h. The first electrode layer E1 of the electrode portion 5b is in contact with the entire ridge portion 3h. In the electrode portion 5b, the first electrode layer E1 is in direct contact with the element main body 3. The main surface 3b is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5a is located on the ridge portion 3h. In the electrode portion 5b, the first electrode layer E1 can be formed on the main surface 3b. The first electrode layer E1 can be disposed on the main surface 3b. The first electrode layer E1 can cover a portion of the main surface 3b located closer to the end surface 3e.

[0079] The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5b are disposed on the first electrode layer E1. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5b cover the first electrode layer E1. The third electrode layer E3 of the electrode portion 5b is in contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5b is in direct contact with the first electrode layer E1. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5b are located on the main surface 3b. The electrode portion 5b does not include the second electrode layer E2. The main surface 3b is not covered by the second electrode layer E2.

[0080] The first electrode layer E1 of the electrode portion 5c is disposed on the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c covers the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the entire ridge portion 3i. In the electrode portion 5c, the first electrode layer E1 is in direct contact with the element main body 3. The side surface 3c is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5c is located on the ridge portion 3i. In the electrode portion 5c, the first electrode layer E1 can be formed on the side surface 3c. The first electrode layer E1 can be disposed on the side surface 3c. The first electrode layer E1 can cover a portion of the side surface 3c located closer to the end surface 3e.

[0081] The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode portion 5c, the second electrode layer E2 covers a part of the region of the first electrode layer E1 and a part of the region of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the part of the region of the first electrode layer E1 and the part of the region of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed to cover the part of the region of the first electrode layer E1 of the electrode portion 5c. The part of the region of the side surface 3c is, for example, a corner region of the side surface 3c located closer to the main surface 3a and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers a part of the ridge portion 3i such that the first electrode layer E1 is located between the second electrode layer E2 and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2 in a part of the region thereof. The first electrode layer E1 of the electrode portion 5c is exposed from the second electrode layer E2 in a remaining part of the region thereof other than the part of the region covered by the second electrode layer E2. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each of the second electrode layers E2 located on the same side surface 3c has an edge. On the same side surface 3c, the edge of one of the second electrode layers E2 opposes the edge of another of the second electrode layers E2. The second electrode layer E2 of the electrode portion 5c includes, for example, a side surface side portion covering a part of the region of the side surface 3c.

[0082] The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5c are disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 and the fourth electrode layer E4 cover the entire second electrode layer E2 and cover all of the portions of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2 and with all of the portions of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5c are located on the side surface 3c.

[0083] The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e covers the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. In the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e.

[0084] The second electrode layer E2 of the electrode portion 5e is disposed on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 covers a part of the region of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the part of the region of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed to cover the part of the region of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 indirectly covers a region 3e aThe first electrode layer E1 is positioned between the second electrode layer E2 and the end surface 3e. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in the above-described part of the region. The first electrode layer E1 of the electrode portion 5e is exposed from the second electrode layer E2 in the remaining part other than the part covered by the second electrode layer E2. The second electrode layer E2 of the electrode portion 5e includes, for example, an end surface side portion covering the region 3e a of the end surface 3e.

[0085] The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5e are disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 and the fourth electrode layer E4 cover the entire second electrode layer E2 and cover all of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with all of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5e are positioned on the end surface 3e.

[0086] The first electrode layer E1 is formed by sintering a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed to cover one end surface 3e and the corner portions 3g, 3h, 3i, 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) included in the conductive paste. The first electrode layer E1 includes, for example, a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the element body 3. For example, the first electrode layer E1 includes a sintered metal layer composed of copper (Cu). The first electrode layer E1 can also include a sintered metal layer composed of nickel (Ni). The first electrode layer E1 can include a base metal. The conductive paste includes, for example, particles composed of copper or nickel, a glass component, an organic binder, and an organic solvent. The first electrode layers E1 included in the electrode portions 5a, 5b, 5c, 5e are integrally formed and continuous with each other.

[0087] The second electrode layer E2 is formed by curing a conductive resin paste applied on the first electrode layer E1. The second electrode layer E2 is formed on the first electrode layer E1 and the element body 3. The first electrode layer E1 includes a base metal layer for forming the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. The conductive resin paste includes, for example, a resin, a conductive material, and an organic solvent. The resin includes, for example, a thermosetting resin. The conductive material includes, for example, metal particles. The metal particles include, for example, silver particles or copper particles. For example, the second electrode layer E2 includes a plurality of silver particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the ridge portion 3j. The second electrode layer E2 included in the electrode portions 5a, 5c, 5e is integrally formed and continuous with each other.

[0088] The third electrode layer E3 is formed on the second electrode layer E2 and the first electrode layer E1 (a portion of the first electrode layer E1 exposed from the second electrode layer E2) by a plating process. The third electrode layer E3 includes, for example, a metal plating layer. The third electrode layer E3 can include a nickel plating layer. The third electrode layer E3 can include nickel. The third electrode layer E3 includes, for example, a Ni plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The Ni plating layer has more excellent solder erosion resistance than the metal included in the second electrode layer E2. The third electrode layer E3 can be a Sn plating layer, a Cu plating layer, or an Au plating layer. The third electrode layer E3 covers the second electrode layer E2. The third electrode layer E3 included in the electrode portions 5a, 5b, 5c, 5e is integrally formed and continuous with each other.

[0089] The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating process. The fourth electrode layer E4 includes, for example, a solder plating layer. The solder plating layer can include a tin (Sn) plating layer. The solder plating layer is formed on the nickel plating layer. The solder plating layer covers the nickel plating layer. The fourth plating layer E4 can include tin. The fourth electrode layer E4 can include a tin-silver alloy (Sn-Ag) plating layer, a tin-bismuth alloy (Sn-Bi) plating layer, or a tin-copper alloy (Sn-Cu) plating layer. The fourth electrode layer E4 covers the third electrode layer E3. The fourth electrode layer E4 included in the electrode portions 5a, 5b, 5c, 5e is integrally formed and continuous with each other.

[0090] The third electrode layer E3 and the fourth electrode layer E4 include plating layers formed on the second electrode layer E2. The external electrode 5 includes plating layers including the third electrode layer E3 and the fourth electrode layer E4. The plating layers cover the second electrode layer E2. The plating layers can include other plating layers between the second electrode layer E2 and the third electrode layer E3. The plating layers can include other plating layers between the third electrode layer E3 and the fourth electrode layer E4. The plating layers can be a single layer.

[0091] In the multilayer capacitor C1, the second electrode layer E2 continuously covers only a portion of the main face 3a, only a portion of the end face 3e, and only a portion of each of the pair of side faces 3c. The second electrode layer E2 includes the portion that continuously covers only a portion of the main face 3a, only a portion of the end face 3e, and only a portion of each of the pair of side faces 3c. The portion of the end face 3e includes the region 3e a . The second electrode layer E2 covers the entire ridge portion 3g, only a portion of the ridge portion 3i, and only a portion of the ridge portion 3j. A portion of the first electrode layer E1 is exposed from the second electrode layer E2.

[0092] In the electrode portion 5e, the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4 have the following structures.

[0093] The first electrode layer E1 covers the region 3e a , 3e b , and 3e c of the end face 3e. The first electrode layer E1 includes a portion that covers the region 3e a , and a portion that covers the regions 3e b and 3e c . For example, in the first electrode layer E1, the portion that covers the region 3e a may include a first portion, and the portion that covers the regions 3e b and 3e c may include a second portion. The first electrode layer E1 is connected to the internal electrode 7 at the portion that covers the region 3e a . The portion of the first electrode layer E1 that covers the region 3e a is directly connected to the connection portion 7b. The portion that covers the region 3e a is electrically connected to the main electrode portion 7a via the connection portion 7b.

[0094] The second electrode layer E2 is located on the end face 3e to cover the portion of the first electrode layer E1 that includes the region 3e a and to expose the portions of the first electrode layer E1 that include the regions 3e b and 3e c .

[0095] The third electrode layer E3 and the fourth electrode layer E4 cover the portions of the first electrode layer E1 that include the regions 3e b and 3e c . The third electrode layer E3 and the fourth electrode layer E4 cover the second electrode layer E2.

[0096] In the multilayer capacitor C1, the connection portion 7b of the internal electrode 7 is exposed at the region 3e a of the end face 3e. The region 3e aIt is covered by the first electrode layer E1, and the first electrode layer E1 is connected to the connection portion 7b of the internal electrode 7.

[0097] The external electrode 5 includes a second electrode layer E2. The second electrode layer E2 is included in the electrode portion 5e. The second electrode layer E2 included in the electrode portion 5e is located on the end face 3e to cover the coverage area 3e of the first electrode layer E1. a The second electrode layer E2 comprises multiple conductive particles and resin. The second electrode layer E2 of the electrode portion 5e includes resin to prevent hydrogen gas from the coating (e.g., the third electrode layer E3) to the covered area 3e of the first electrode layer E1. a Partial movement. Therefore, hydrogen tends not to migrate to the coverage area 3e of the first electrode layer E1. a The portion of the capacitor tends to not reach the internal electrode 7. Therefore, the multilayer capacitor C1 prevents characteristic degradation. For example, the multilayer capacitor C1 prevents a decrease in insulation resistance.

[0098] As described above, the plating layers (e.g., the third electrode layer E3 and the fourth electrode layer E4) are formed by a plating process. In this plating process, for example, the component body 3, on which the first electrode layer E1 and the second electrode layer E2 are disposed, is immersed in a plating solution. In this case, the plating solution may penetrate into the component body 3. For example, the plating solution may penetrate into the component body 3 from the exposed end of the internal electrode 7 or from the interface between the exposed end of the internal electrode 7 and the component body 3. In electronic components where the plating solution has penetrated into the component body 3, the characteristics of the electronic components may deteriorate.

[0099] In the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5e is located on the end face 3e to cover the coverage area 3e of the first electrode layer E1. a Therefore, the second electrode layer E2 is located on the path of plating solution penetration to the exposed end of the internal electrode 7, i.e., the other end of the connection portion 7b. The second electrode layer E2 prevents plating solution from penetrating into the element body 3. As a result, the multilayer capacitor C1 can prevent performance degradation.

[0100] The second electrode layer E2 comprises resin. The second electrode layer E2 has a resistance greater than that of the first electrode layer E1 excluding the resin. The ESR of the multilayer capacitor C1, in which the external electrode 5 includes the second electrode layer E2, may increase.

[0101] The coating covers the coverage area 3e of the first electrode layer E1. b With 3e c Part of it. The coverage area 3e of the first electrode layer E1. b With 3e c The portion of the electrode 5 is connected to the plating layer without the second electrode layer E2 being present. Therefore, in the multilayer capacitor C1, the external electrode 5 includes a current path that does not include the second electrode layer E2. Thus, the multilayer capacitor C1 prevents an increase in ESR.

[0102] In the structure in which the multilayer capacitor Cl is solder-mounted to an electronic device, an external force acting on the multilayer capacitor Cl from the electronic device can act on the element main body 3 through the external electrode 5. For example, the external force is transmitted to the external electrode 5 from a solder leg formed in a solder-mounting process. The electronic device includes, for example, a circuit board or other electronic components.

[0103] In the multilayer capacitor Cl, the external electrode 5 includes the second electrode layer E2. Therefore, the external force tends not to act on the element main body 3 through the external electrode 5. Thus, the multilayer capacitor Cl can prevent a crack from being generated in the element main body 3.

[0104] In the multilayer capacitor Cl, the main face 3b can be provided with a mark M indicating a direction of the element main body 3.

[0105] In the structure in which the first electrode layer El completely covers the end face 3e, the position of the region 3e a is not easily identified. When the mark M is provided on the main face 3b, a face opposite to the face provided with the mark M can be identified as the main face 3a. Thus, the position of the region 3e a closer to the main face 3a can be easily identified. Thus, in the structure in which the mark M is provided on the main face 3b, the second electrode layer E2 can be formed at an appropriate position when the second electrode layer E2 is formed.

[0106] In the multilayer capacitor Cl, the first electrode layer El can completely cover the end face 3e.

[0107] In the structure in which the first electrode layer El completely covers the end face 3e, the first electrode layer El protects the end face 3e.

[0108] Referring to Figures 6 to 8 , a structure of a multilayer capacitor Cl 1 according to a modification of the present embodiment will be described. Figure 6 is a view showing a cross-sectional structure of the multilayer capacitor according to the modification. Figure 7 and Figure 8 are views showing structures of the first electrode layer and the second electrode layer.

[0109] The multilayer capacitor Cl 1 is substantially the same as or similar to the above-described multilayer capacitor Cl. However, the multilayer capacitor Cl 1 differs from the multilayer capacitor Cl in a structure of the internal electrode 7. Differences between the multilayer capacitor Cl 1 and the multilayer capacitor Cl will be mainly described below. Figure 6 In the drawings, for ease of description, the internal electrodes 7 adjacent to each other are intentionally shown as being offset from each other in the first direction Dl and the second direction D2.

[0110] The electronic component includes, for example, the multilayer capacitor Cl 1.

[0111] The internal electrode 7 included in the multilayer capacitor C11 includes a main electrode portion 7a having the following structure.

[0112] like Figure 6 As shown, the main electrode portion 7a has a shape in which the corners of the other ends near the main surface 3a are cut off. The main electrode portion 7a includes an edge 7e1 and an edge 7e2 opposite to the main surface 3a. Edge 7e1 is located on the other end side of the internal electrode 7. Edge 7e1 is opposite to the area of ​​the main surface 3a covered by the second electrode layer E2 in the first direction D1. Edge 7e2 is opposite to the area of ​​the main surface 3a exposed from the second electrode layer E2 in the first direction D1. Edge 7e1 includes an edge region in which the distance between the edge region and the main surface 3a in the first direction D1 is greater than the distance between the edge 7e2 and the main surface 3a in the first direction D1. Edge 7e1 may also only include an edge region in which the distance between the edge region and the main surface 3a in the first direction D1 is greater than the distance between the edge 7e2 and the main surface 3a in the first direction D1. In this structure, the distance between the edge region 7e1 and the main surface 3a in the first direction D1 is greater than the distance from the edge 7e2 to the main surface 3a in the first direction D1 throughout the edge 7e1. For example, edge 7e1 may include a first edge. Edge 7e2 may include a second edge.

[0113] The main electrode portion 7a includes an electrode portion including an edge 7e1 and an electrode portion including an edge 7e2. The electrode portion including edge 7e1 includes the other end of the internal electrode 7. The electrode portion including edge 7e2 is located between the electrode portion including edge 7e1 and the connecting portion 7b in the second direction D2. Figure 7 As shown, when viewed from the first direction D1, the second electrode layer E2 and the inner electrode 7, which are not electrically connected to each other, overlap with the second electrode layer E2, including the electrode portion with edge 7e1, while the electrode portion with edge 7e2 does not overlap with the second electrode layer E2. Using the surface including the end face 3e opposite to the other end of the inner electrode 7 as a reference plane, the distance from the reference plane to the electrode portion including edge 7e2 is greater than the distance from the reference plane to the edge E2a of the second electrode layer E2. e The distance.

[0114] like Figure 8 As shown, when a third party observes the second electrode layer E2 included in the electrode section 5c and the internal electrode 7 among the plurality of internal electrodes 7 that is not electrically connected to the second electrode layer E2 included in the electrode section 5c from D3, the second electrode layer E2 included in the electrode section 5c and the internal electrode 7 that is not electrically connected to the second electrode layer E2 included in the electrode section 5c do not overlap with each other.

[0115] The second electrode layer E2 can be included in the electrode portion 5e and the electrode portion 5a. The second electrode layer E2 included in the electrode portion 5e can be continuous with the second electrode layer E2 included in the electrode portion 5a. The main electrode portion 7a can include the above-described edge 7el, 7e2. The edge 7el can include an edge region in which a distance between the edge region and the main face 3a in the first direction Dl is greater than a distance between the edge 7e2 and the main face 3a in the first direction Dl.

[0116] In a structure in which the second electrode layer E2 includes a plurality of metal particles as the conductive particles, migration can occur in the external electrode 5. For example, migration is considered to occur due to the following matters.

[0117] An electric field acts on the metal particles included in the second electrode layer E2, and the metal particles are ionized. The generated metal ions are attracted by an electric field acting on the external electrode 5, and migrate from the second electrode layer E2. The electric field acting on the metal ions includes, for example, an electric field between the external electrode 5 and the internal electrode 7 that are not electrically connected to each other. The metal ions that migrate from the second electrode layer E2 react with, for example, electrons supplied from the internal electrode 7 or the external electrode 5, and are deposited as metal on a surface of the element main body 3.

[0118] For example, an electric field tends to be generated between the second electrode layer E2 included in the electrode portion 5a that are not electrically connected to each other and the internal electrode 7. The electric field can cause the above-described migration. However, in a structure in which the edge 7el of the main electrode portion 7a includes an edge region in which a distance between the edge region and the main face 3a in the first direction Dl is greater than a distance between the edge 7e2 and the main face 3a in the first direction Dl, the structure reduces the electric field between the second electrode layer E2 included in the electrode portion 5a that are not electrically connected to each other and the internal electrode 7. Thus, the structure prevents occurrence of migration.

[0119] The edge 7el can include only the above-described edge region.

[0120] In a structure in which the edge 7el includes only the above-described edge region, the structure further reduces the electric field between the second electrode layer E2 included in the electrode portion 5a that are not electrically connected to each other and the internal electrode 7. Thus, the structure further prevents occurrence of migration.

[0121] The distance of the edge region 7e1 from the main surface 3a in the first direction D1 can be not greater than the distance from the edge 7e2 to the main surface 3a in the first direction D1 on the whole of the edge 7e1. For example, the distance of the edge region 7e1 from the main surface 3a in the first direction D1 can be greater than the distance from the edge 7e2 to the main surface 3a in the first direction D1 only at a part of the edge 7e1. Even in the structure in which the distance of the edge region 7e1 from the main surface 3a in the first direction D1 can be greater than the distance from the edge 7e2 to the main surface 3a in the first direction D1 only at a part of the edge 7e1, the electric field between the second electrode layer E2 included in the electrode portion 5a and the internal electrode 7 can be reduced.

[0122] The second electrode layer E2 can be included in the electrode portion 5e and the electrode portion 5c. When the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 not electrically connected to the second electrode layer E2 included in the electrode portion 5c are viewed from the third direction D3, the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 not electrically connected to the second electrode layer E2 included in the electrode portion 5c can not overlap with each other.

[0123] For example, the electric field tends to be generated between the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 not electrically connected to each other. The electric field can cause the migration described above. However, in the structure in which the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 not electrically connected to the second electrode layer E2 included in the electrode portion 5c do not overlap with each other when viewed from the third direction D3, the electric field between the second electrode layer E2 included in the electrode portion 5c and the internal electrode 7 not electrically connected to each other is reduced. Thus, the structure prevents the occurrence of the migration.

[0124] Referring to Figures 9 to 11 , the structure of the multilayer capacitor C12 according to another modification example will be described. Figure 9 FIG. 6 is a view for showing a cross-sectional structure of a multilayer capacitor according to another modification example. Figure 10 and Figure 11 FIG. 7 is a view for showing a structure of a first electrode layer and a second electrode layer.

[0125] The multilayer capacitor C12 is substantially the same as or similar to the multilayer capacitor C11 described above. However, the multilayer capacitor C12 differs from the multilayer capacitor C11 in that the multilayer capacitor C12 includes a plurality of conductors 11. Hereinafter, mainly the difference between the multilayer capacitor C12 and the multilayer capacitor C11 will be described. Figure 9 In FIG. 6, for the sake of convenience, the internal electrodes 7 adjacent to each other are intentionally shown as being deviated from each other in the first direction D1 and the second direction D2, and the internal electrodes 7 adjacent to each other and the conductors 11 are intentionally shown as being deviated from each other in the first direction D1 and the second direction D2.

[0126] The electronic component includes, for example, a multilayer capacitor C12.

[0127] In a modification, as shown in Figure 9 and Figure 10 , the multilayer capacitor C12 includes a plurality of conductors 11. The plurality of conductors 11 is disposed in the element body 3. Each of the conductors 11 is composed of an electrically conductive material that is typically used as an internal conductor of a multilayer electronic component. The electrically conductive material includes, for example, a base metal. The electrically conductive material includes, for example, nickel (Ni) or copper (Cu). Each of the conductors 11 is composed of a sintered body of an electrically conductive paste including the above-described electrically conductive material. For example, the conductor 11 includes nickel.

[0128] The conductor 11 is adjacent to the side surface 3c in the D3 direction. The conductor 11 is positioned between the side surface 3c and an internal electrode 7 that is positioned outermost in the D3 direction among the plurality of internal electrodes 7. The conductor 11 is adjacent to the second electrode layer E2 included in the electrode portion 5c in the D3 direction. When the second electrode layer E2 included in the electrode portion 5c and the conductor 11 that is not electrically connected to the second electrode layer E2 included in the electrode portion 5c are viewed from the D3 direction, the second electrode layer E2 included in the electrode portion 5c and the conductor 11 that is not electrically connected to the second electrode layer E2 included in the electrode portion 5c overlap each other.

[0129] The conductor 11 includes one end that is exposed to a corresponding one of the pair of end surfaces 3e and another end that is positioned in the element body 3 and is not exposed to the end surface 3e. The conductor 11 includes a main conductor portion 11a and a connection portion 11b. The main conductor portion 11a and the connection portion 11b are continuous with each other. The main conductor portion 11a and the connection portion 11b are integrally formed.

[0130] The main conductor portion 11a is opposed to the main electrode portion 7a included in the internal electrode 7 that is adjacent to the conductor 11 in the D3 direction.

[0131] The connection portion 11b is positioned on the one end side of the conductor 11. The connection portion 11b is connected to a corresponding one of the plurality of external electrodes 5. The connection portion 11b connects the main conductor portion 11a and the corresponding external electrode 5. The connection portion 11b includes one end that is exposed to a region 3e a of the corresponding end surface 3e. As shown in Figure 11 , the one end of the connection portion 11b is exposed only to the region 3e a . The one end of the connection portion 11b is not exposed to a region other than the region 3e a of the end surface 3e. The one end of the connection portion 11b is not exposed to the region 3e b and the region 3e c . The one end of the connection portion 11b is completely covered with the electrode portion 5e included in the corresponding external electrode 5. The conductor 11 is directly connected to the corresponding external electrode 5. The conductor 11 is electrically connected to the corresponding external electrode 5.

[0132] In a structure where adjacent internal electrodes 7 and conductors 11 are electrically connected in the D3 direction, the multilayer capacitor C12 may not exhibit capacitance between adjacent internal electrodes 7 and conductors 11 in the D3 direction. Conductor 11 includes dummy conductors that tend not to contribute to the formation of capacitance. In a structure where adjacent internal electrodes 7 and conductors 11 are not electrically connected in the D3 direction, the multilayer capacitor C12 may exhibit capacitance between adjacent internal electrodes 7 and conductors 11 electrically connected in the D3 direction.

[0133] The connecting portion 11b has a width in the D1 direction that is smaller than the width of the main body portion 11a. Viewed from the D3 direction, the connecting portion 11b is located closer to the main surface 3a. In the D1 direction, the distance between the main surface 3a and the connecting portion 11b is smaller than the distance between the main surface 3b and the connecting portion 11b. In the D1 direction, the distance between the main surface 3b and the connecting portion 11b is greater than the distance between the main surface 3b and the main body portion 11a. The connecting portion 11b is located further away from the main surface 3b than the main body portion 11a in the D1 direction. The distance between the main surface 3a and the connecting portion 11b in the D1 direction is approximately the same as the distance between the main surface 3a and the other end of the conductor 11 in the D1 direction.

[0134] Using the surface including the main surface as a reference surface, the length L1 of the conductor 11 opposite the main surface 3b from the reference surface SP in the D1 direction is greater than the length L2 of the second electrode layer E2 included in the electrode section 5c from the reference surface SP in the D1 direction. The edge of the conductor 11 opposite the main surface 3b includes, for example, the edge of the main electrode section 11a opposite the main surface 3b. The length L1 can be substantially the same as the length L3 of the inner electrode 7 opposite the main surface 3b in the D1 direction from the reference surface SP. The edge of the inner electrode 7 opposite the main surface 3b includes, for example, the edge of the main electrode section 7a opposite the main surface 3b.

[0135] The multilayer capacitor C12 may include a conductor 11 disposed in the element body 3, adjacent to the second electrode layer E2 included in the electrode portion 5c in the D3 direction, and electrically connected to the second electrode layer E2 included in the electrode portion 5c.

[0136] The structure including conductor 11 reduces the electric field between the internal electrodes 7, which are not electrically connected to each other, and the second electrode layer E2 included in the electrode section 5c. Therefore, this structure prevents migration from occurring.

[0137] Length L1 can be greater than length L2.

[0138] The structure with a length L1 greater than the length L2 reliably reduces the electric field between the internal electrodes 7, which are not electrically connected to each other, and the second electrode layer E2 included in the electrode section 5c.

[0139] Reference Figures 12 to 15 This describes the structure of a multilayer capacitor according to another variation of this embodiment. Figure 12 , 13 Figure 14 shows the cross-sectional structure of a multilayer capacitor according to yet another variation. Figure 15 A diagram illustrating the structure of the first and second electrode layers.

[0140] Figure 12 The multilayer capacitor shown is substantially the same as or similar to the multilayer capacitor C1 described above. However, Figure 12 The multilayer capacitor shown differs from the multilayer capacitor C1 in the structure of the external electrode 5. Figure 13 The multilayer capacitor shown is substantially the same as or similar to the multilayer capacitor C11 described above. However, Figure 13 The multilayer capacitor shown differs from the multilayer capacitor C11 in the structure of the external electrode 5. Figure 14 The multilayer capacitor shown is substantially the same as or similar to the multilayer capacitor C12 described above. However, Figure 14 The multilayer capacitor shown differs from the multilayer capacitor C12 in the structure of the external electrode 5. Figures 12 to 14 In this illustration, adjacent internal electrodes 7 are intentionally shown as being offset from each other in the first direction D1 and the second direction D2.

[0141] Electronic components, for example, include Figures 12 to 14 The multilayer capacitors shown.

[0142] like Figures 12 to 14 As shown, the external electrode 5 may not include electrode portion 5b. The external electrode 5 may only include electrode portions 5a, 5c, and 5e. In the structure where the external electrode 5 does not include electrode portion 5b, the external electrode 5 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c. The main surface 3b is completely exposed from the external electrode 5. On the side surfaces 3c, only the corner regions near the main surface 3a and the end surface 3e are covered by the external electrode 5. Figure 15 As shown, region 3e of end face 3e b The external electrode 5 is fully exposed.

[0143] In electrode section 5e, the first electrode layer E1 completely covers region 3e. a Area 3e b Exposed from the first electrode layer E1. In the electrode portion 5e, the first electrode layer E1 at least covers the region 3e. c The area near 3e a Part of it. The first electrode layer E1 can completely cover region 3e. c The first electrode layer E1 includes a coverage area 3e a Parts and coverage areas 3ec Part of it, but not including coverage area 3e b The part.

[0144] refer to Figures 16 to 19 The structure of a multilayer capacitor C13 according to another embodiment is described. Figure 16 This is a perspective view of a multilayer capacitor according to another embodiment. Figure 17 and Figure 18 This is a view showing the cross-sectional structure of a multilayer capacitor according to another embodiment. Figure 19 This is a view showing the structure of the first electrode layer and the second electrode layer.

[0145] The multilayer capacitor C13 is generally similar to or the same as the multilayer capacitor C1 described above. However, the multilayer capacitor C13 differs from the multilayer capacitor C1 in the structure of the external electrode 5 and the internal electrode 7. The following mainly explains the differences between the multilayer capacitor C13 and the multilayer capacitor C1. Figure 17 In this illustration, adjacent internal electrodes 7 are intentionally shown as being offset from each other in the first direction D1 and the second direction D2.

[0146] Electronic components include, for example, multilayer capacitors C13.

[0147] like Figures 16 to 19 As shown, the multilayer capacitor C13, like the multilayer capacitor C1, includes a cuboid-shaped element body 3, a pair of external electrodes 5, and multiple internal electrodes 7 similar to those in the multilayer capacitor C1. In the multilayer capacitor C13, the main surface 3a or main surface 3b is opposite to the electronic device. The main surface 3a or main surface 3b is arranged to form a mounting surface. The main surface 3a or main surface 3b is a mounting surface. For example, the main surface 3a may include a first main surface, and the main surface 3b may include a second main surface.

[0148] Each internal electrode 7 includes a main electrode portion 7a, a connecting portion 7b, and a connecting portion 7c. The main electrode portion 7a, the connecting portion 7b, and the connecting portion 7c are continuous with each other. The main electrode portion 7a, the connecting portion 7b, and the connecting portion 7c are integrally formed.

[0149] The connecting portion 7c connects the main electrode portion 7a and the corresponding external electrode 5 of a pair of external electrodes 5. The connecting portion 7c is directly connected to the corresponding external electrode 5. The connecting portion 7c electrically connects the main electrode portion 7a and the corresponding external electrode 5. The connecting portion 7c includes: one end connected to the main electrode portion 7a, and a region 3e exposed in the corresponding end face 3e of the pair of end faces 3e. b The other end. The other end of the connecting part 7c is only exposed in region 3e. b The other end of the connecting part 7c is not exposed outside the end face 3e except for region 3e. b The other end of the connecting part 7c is not exposed in area 3e.a and region 3e c The internal electrode 7 is not exposed to the region 3e c .

[0150] The connection portion 7c has a width in the direction D1 that is smaller than the width of the main electrode portion 7a. The connection portion 7c is located closer to the main face 3b when viewed in the direction D3. The distance between the main face 3b and the connection portion 7c in the direction D1 is smaller than the distance between the main face 3a and the connection portion 7c. The distance between the main face 3a and the connection portion 7c in the direction D1 is larger than the distance between the main face 3a and the main electrode portion 7a in the direction D1. The connection portion 7c is located farther from the main face 3a than the main electrode portion 7a in the direction D1. The distance between the main face 3b and the connection portion 7c in the direction D1 is substantially equal to the distance between the main face 3b and the main electrode portion 7a in the direction D1. The distance between the main face 3b and the connection portion 7c in the direction D1 can be larger than the distance between the main face 3b and the main electrode portion 7a in the direction D1.

[0151] The electrode portion 5b includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4.

[0152] The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and the main face 3b. The second electrode layer E2 covers the first electrode layer E1 and a part of the region of the main face 3b in the electrode portion 5b. The second electrode layer E2 is in direct contact with the first electrode layer E1 and the main face 3b in the electrode portion 5b. The second electrode layer E2 of the electrode portion 5b is formed to cover the first electrode layer E1 of the electrode portion 5b. The second electrode layer E2 indirectly covers the ridge portion 3h in the electrode portion 5b such that the first electrode layer E1 is located between the second electrode layer E2 and the ridge portion 3h. The second electrode layer E2 of the electrode portion 5b is located on the main face 3b. Each second electrode layer E2 located on the same main face 3b includes an edge E2b e On the same main face 3b, the edge E2b e of one second electrode layer E2 is opposite to the edge E2b e of another second electrode layer E2. The second electrode layer E2 of the electrode portion 5b includes, for example, a second main face side portion that covers a part of the region of the main face 3b.

[0153] The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5b are disposed on the second electrode layer E2. The third electrode layer E3 and the fourth electrode layer E4 cover the second electrode layer E2 in the electrode portion 5b. The third electrode layer E3 is in contact with the second electrode layer E2 in the electrode portion 5b. The third electrode layer E3 is in direct contact with the second electrode layer E2 in the electrode portion 5b. The third electrode layer E3 is not in direct contact with the first electrode layer E1 in the electrode portion 5b. The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion 5b are located on the main face 3b.

[0154] The second electrode layer E2 of electrode portion 5c covers another portion of the first electrode layer E1 and another portion of the side surface 3c. In electrode portion 5c, the second electrode layer E2 is in direct contact with another portion of the first electrode layer E1 and another portion of the side surface 3c. The second electrode layer E2 of electrode portion 5c is formed to cover another portion of the first electrode layer E1 of electrode portion 5c. The other portion of the side surface 3c is, for example, the corner region of side surface 3c located closer to the main surface 3b and the end surface 3e. In electrode portion 5c, the second electrode layer E2 indirectly covers a portion of the edge 3i, such that the first electrode layer E1 is located between the second electrode layer E2 and the edge 3i. The first electrode layer E1 of electrode portion 5c is covered by the second electrode layer E2 in the aforementioned portion and another portion. The remaining portion of the first electrode layer E1 of electrode portion 5c, excluding the portion and another portion covered by the second electrode layer E2, is exposed from the second electrode layer E2.

[0155] The second electrode layer E2 of electrode portion 5e covers another portion of the first electrode layer E1. In electrode portion 5e, the second electrode layer E2 is in direct contact with another portion of the first electrode layer E1. The second electrode layer E2 of electrode portion 5e is formed to cover another portion of the first electrode layer E1 of electrode portion 5e. In electrode portion 5e, the second electrode layer E2 indirectly covers region 3e of end face 3e. b This arrangement places the first electrode layer E1 between the second electrode layer E2 and the end face 3e. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in a portion and another portion of the aforementioned area. The remaining portion of the first electrode layer E1 of the electrode portion 5e, excluding the portion and another portion covered by the second electrode layer E2, is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5e includes, for example, the region 3e covering the end face 3e. b The other end face side.

[0156] In the multilayer capacitor C13, the second electrode layer E2 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c, and continuously covers only another portion of the main surface 3a, only another portion of the end surface 3e, and only another portion of each of the pair of side surfaces 3c. The second electrode layer E2 includes: a first portion continuously covering only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c; and a second portion continuously covering only another portion of the main surface 3a, only another portion of the end surface 3e, and only another portion of each of the pair of side surfaces 3c. The other portion of the end surface 3e includes region 3e. b The second electrode layer E2 covers the entire ridge 3g, only a portion of ridge 3i, and only a portion of ridge 3j, and also covers the entire ridge 3h, only a portion of ridge 3i, and only a portion of ridge 3j.

[0157] In the electrode portion 5e, the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4 have the following structures.

[0158] The first electrode layer E1 covers the region 3e a , 3e b , 3e c . The first electrode layer E1 includes a portion covering the region 3e a , a portion covering the region 3e b , and a portion covering the region 3e c . The portion covering the region 3e c is closer to the main face 3b than the portion covering the region 3e a . The portion covering the region 3e c is closer to the main face 3a than the portion covering the region 3e b . The portion covering the region 3e c is located between the portion covering the region 3e a and the portion covering the region 3e b in the direction D1. For example, in the first electrode layer E1, the portion covering the region 3e a may include a first portion, the portion covering the region 3e b may include a third portion, and the portion covering the region 3e c may include a second portion and a fourth portion. In the multilayer capacitor C13, the second portion and the fourth portion included in the portion covering the region 3e c are continuous with each other. The first electrode layer E1 is connected to the internal electrode 7 at the portion covering the region 3e a and the portion covering the region 3e b . The portion covering the region 3e b of the first electrode layer E1 is directly connected to the connection portion 7c. The portion covering the region 3e b is electrically connected to the main electrode portion 7a through the connection portion 7c.

[0159] The second electrode layer E2 is located on the end face 3e so as to cover the portion covering the region 3e a and the portion covering the region 3e b included in the first electrode layer E1 and expose the portion covering the region 3e c included in the first electrode layer E1.

[0160] The third electrode layer E3 and the fourth electrode layer E4 cover the portion covering the region 3e c included in the first electrode layer E1 and cover the second electrode layer E2.

[0161] In the multilayer capacitor C13, the connecting portion 7c of the internal electrode 7 is exposed to the region 3e of the end face 3e b . The region 3e b is covered by the first electrode layer E1, and the first electrode layer E1 and the connecting portion 7c of the internal electrode 7 are connected to each other.

[0162] The external electrode 5 includes the second electrode layer E2. The second electrode layer E2 is included in the electrode portion 5e. The second electrode layer E2 included in the electrode portion 5e is located on the end face 3e to cover a portion of the covered region 3e b of the first electrode layer E1. The resin included in the second electrode layer E2 of the electrode portion 5e prevents hydrogen from moving from a plating layer (for example, the third electrode layer E3) to the portion of the covered region 3e b of the first electrode layer E1. Thus, hydrogen tends not to migrate to the portion of the covered region 3e b of the first electrode layer E1, and tends not to reach the internal electrode 7. Thereby, the multilayer capacitor C13 prevents deterioration of characteristics. For example, the multilayer capacitor C13 prevents a decrease in insulation resistance.

[0163] In the multilayer capacitor C13, the second electrode layer E2 included in the electrode portion 5e is located on the end face 3e to cover a portion of the covered region 3e b of the first electrode layer E1. Thus, the second electrode layer E2 is located on a plating solution infiltration path to the exposed end of the internal electrode 7, that is, the other end of the connecting portion 7c. The second electrode layer E2 prevents the plating solution from infiltrating the element body 3. Thereby, the multilayer capacitor C13 prevents deterioration of characteristics.

[0164] The plating layer covers a portion of the covered region 3e c of the first electrode layer E1. The portion of the covered region 3e c of the first electrode layer E1 is connected to the plating layer in a state where the second electrode layer E2 is not interposed. Thus, in the multilayer capacitor C13, the external electrode 5 includes a current path that does not include the second electrode layer E2. Thereby, the multilayer capacitor C13 prevents an increase in ESR.

[0165] The multilayer capacitor C13 can be mounted to an electronic device with the main face 3a or the main face 3b as a mounting face. Thus, the multilayer capacitor C13 is not limited in direction during mounting, and workability of mounting is improved.

[0166] The structure of a multilayer capacitor C14 according to a modification example of another embodiment is described with reference to Figure 20 and Figure 21 . Figure 20 is a view showing a cross-sectional structure of a multilayer capacitor according to a modification example of another embodiment. Figure 21is a view showing the structure of the second electrode layer. The multilayer capacitor C14 is substantially the same as or similar to the multilayer capacitor C13 described above. However, the multilayer capacitor C14 differs from the multilayer capacitor C13 in the structure of the external electrode 5. Hereinafter, the difference between the multilayer capacitor C14 and the multilayer capacitor C13 will be mainly described. Figure 20 In the multilayer capacitor C14, for convenience of description, the internal electrodes 7 adjacent to each other are intentionally shown as being offset from each other in the first direction D1 and the second direction D2.

[0167] The electronic component includes, for example, the multilayer capacitor C14.

[0168] The external electrode 5 is divided into two portions, i.e., a portion located closer to the main face 3a and a portion located closer to the main face 3b. The portion located closer to the main face 3a and the portion located closer to the main face 3b are separated from each other in the direction D1. The element body 3 is exposed from the external electrode 5 between the portion located closer to the main face 3a and the portion located closer to the main face 3b.

[0169] The covered area 3e c is divided into two portions, i.e., a portion continuous with the covered area 3e a and a portion continuous with the covered area 3e b . The portion continuous with the covered area 3e a and the portion continuous with the covered area 3e b are separated from each other in the direction D1. The end face 3e is exposed from the external electrode 5 between the portion continuous with the covered area 3e a and the portion continuous with the covered area 3e b . The end face 3e includes an area exposed from the external electrode 5.

[0170] In this specification, when a certain element is described as being configured on another element, the element can be directly configured on the other element or indirectly configured on the other element. When the element is indirectly configured on the other element, there is an intervening element between the element and the other element. When the element is directly configured on the other element, there is no intervening element between the element and the other element.

[0171] In this specification, when a certain element is described as being located on another element, the element can be directly located on the other element or indirectly located on the other element. When the element is indirectly located on the other element, there is an intervening element between the element and the other element. When the element is directly located on the other element, there is no intervening element between the element and the other element.

[0172] In this specification, when a certain element is described as covering another element, the element can directly cover the other element, or indirectly cover the other element through another element interposed therebetween. When a certain element indirectly covers another element, an element intervenes therebetween. When a certain element directly covers another element, no element intervenes therebetween.

[0173] It should be understood that every aspect, advantage, and feature described herein does not have to be implemented in any particular embodiment. Indeed, various embodiments are described and shown in this specification, and other embodiments can be made without departing from the scope of the subject matter presented herein.

[0174] In each multilayer capacitor C13 and C14, the main electrode portion 7a can have a shape in which a corner portion on the other end side close to the main surface 3a and a corner portion on the other end side close to the main surface 3b are cut away. In this case, each multilayer capacitor C13 and C14 similarly to the multilayer capacitor C11 prevents occurrence of migration.

[0175] Each multilayer capacitor C13 and C14 can include a plurality of conductors 11. In this case, each multilayer capacitor C13 and C14 similarly to the multilayer capacitor C12 prevents occurrence of migration.

[0176] In the present embodiment and modified examples, the electronic component includes a multilayer capacitor. However, the applicable electronic component is not limited to the multilayer capacitor. The applicable electronic component includes, for example, a multilayer inductor, a multilayer varistor, a multilayer piezoelectric actuator, a multilayer thermistor, a multilayer solid-state battery component, a multilayer composite component, or other electronic components than the multilayer electronic components.

Claims

1. An electronic component comprising: The component body is rectangular in shape and includes: a first main face and a second main face that are opposite to each other in a first direction, a pair of end faces that are opposite to each other in a second direction, and a pair of side faces that are opposite to each other in a third direction. Multiple external electrodes are disposed at both ends of the element body in the second direction, and each includes a sintered metal layer, a conductive resin layer, and a plating layer; and Multiple internal electrodes are arranged in the component body to face each other in a third direction, and are respectively electrically connected to a corresponding external electrode among the multiple external electrodes. The plurality of internal electrodes respectively include: The main electrode section is opposite to the third-order adjacent internal electrode among the plurality of internal electrodes; and A connecting portion, narrower than the main electrode portion in a first direction, connects the main electrode portion to the corresponding external electrode. The connecting portion is exposed on the end face in a region closer to the first main surface. The sintered metal layer includes: The first part covers the portion of the end face and is connected to the connecting part; and The second part covers at least a portion of the end face that is closer to the second main face than the first portion of the area. The conductive resin layer includes: an end-face portion located on the end face to cover the first portion and expose the second portion. The coating covers the second portion and the one-end-face side portion.

2. The electronic component according to claim 1, wherein, The sintered metal layer completely covers the end face.

3. The electronic component according to claim 1, wherein, Each of the plurality of internal electrodes includes: another connecting portion, which is narrower than the main electrode portion in a first direction, and connects the main electrode portion to the corresponding external electrode, wherein the other connecting portion is exposed in another region of the end face that is closer to the second main surface. The sintered metal layer includes: The third part covers another portion of the end face and is connected to the other connecting part; and The fourth part covers at least a portion of the end face that is closer to the first main face than the other part of the region. The conductive resin layer includes: a portion on another end face, which is located on the end face to cover the third portion and expose the fourth portion. The coating covers the fourth portion and the other end face portion.

4. The electronic component according to claim 3, wherein, The second part and the fourth part are consecutive to each other. The end face is completely covered by the external electrode.

5. The electronic component according to claim 3, wherein, The second part is separate from the fourth part. The end face is exposed from the external electrode between the second portion and the fourth portion.

6. The electronic component according to any one of claims 1 to 5, wherein, The conductive resin layer includes: a first main surface side portion that is continuous with the one end face side portion and covers a portion of the first main surface. The main electrode section includes: The first edge of the first main surface opposite the area covered by the side portion of the first main surface in the first direction; and The second edge opposite to the area of ​​the first main surface exposed from the conductive resin layer in the first direction. The first edge includes an edge region, wherein the distance between the edge region and the first main surface in the first direction is greater than the distance between the second edge and the first main surface in the first direction.

7. The electronic component according to claim 6, wherein, The first edge includes only the edge region.

8. The electronic component according to any one of claims 1 to 7, further comprising a virtual conductor disposed in the component body, wherein, The conductive resin layer includes: a side portion that is continuous with the one end face side portion and covers a portion of the side face. The virtual conductor is adjacent to the side portion in the third direction and is electrically connected to the side portion.

9. The electronic component according to claim 8, wherein, Using the surface including the first main surface as a reference surface, the length from the reference surface to the edge of the virtual conductor opposite to the second main surface in a first direction is greater than the length of the side portion of the virtual conductor from the reference surface in a first direction.

10. The electronic component according to any one of claims 1 to 9, wherein, The conductive resin layer includes: a side portion that is continuous with the one end face side portion and covers a portion of the side face. When the side portion and the internal electrodes among the plurality of internal electrodes that are not electrically connected to the side portion are viewed from the third direction, the side portion and the internal electrodes that are not electrically connected to the side portion do not overlap with each other.

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