MEMS controller and MEMS device

By designing the combination of cantilever and flow-encircling element in the MEMS controller to form eddy currents, the problem of MEMS controllers being unable to balance miniaturization and reliable unidirectional flow control is solved, achieving effective control of unidirectional flow and structural simplification.

CN121757790APending Publication Date: 2026-03-31AAC KAITAI TECHNOLOGIES (WUHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-29
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

MEMS controllers struggle to balance miniaturization with reliable unidirectional flow control, resulting in an inability to actively control direction.

Method used

Design a MEMS controller comprising a package and control components. A cantilever is fixed to a base, with its free end close to a flow-encircling element. A first opening and a second opening are located on opposite sides of the flow-encircling element. The projection of the free end of the cantilever perpendicular to the cantilever's vibration direction is located on the flow-encircling element. The flow-encircling element and the cantilever cooperate to form a vortex, thereby achieving unidirectional flow control.

Benefits of technology

By combining the flow-through component and the cantilever, a vortex is formed, which reduces the pressure at the inlet and increases the pressure at the outlet. When the cantilever vibrates, the fluid is drawn into the encapsulation shell from the inlet and discharged from the outlet, achieving a unidirectional flow control effect, simplifying the structure and improving long-term operational reliability.

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Abstract

The invention provides an MEMS controller and an MEMS device, and the MEMS controller comprises a packaging shell which comprises a first plate part, a second plate part and a side wall part, the first plate part, the second plate part and the side wall part jointly define a packaging cavity, the first plate part is provided with a first opening, and the second plate part is provided with a second opening; the control assembly comprises a base, a cantilever and a streaming piece, the streaming piece is fixed to the side wall part, the base is fixed to the second plate part, the fixed end of the cantilever is fixed to the side, away from the second plate part, of the base, and the free end of the cantilever is closer to the streaming piece than the fixed end; the projection of the first opening and the projection of the second opening are at least partially located on the streaming piece, one of the first opening and the second opening is an inlet, the other is an outlet, the size of the side, close to the inlet, of the streaming piece is smaller than that of the side, close to the outlet, of the streaming piece, and the projection, perpendicular to the vibration direction of the cantilever, of the free end of the cantilever is located on the streaming piece. According to the invention, a unidirectional flow control effect can be realized.
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Description

Technical Field

[0001] This invention relates to the field of control device technology, specifically to a MEMS controller and a MEMS device. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) are devices with dimensions of a few millimeters or even smaller, and their internal structures are generally on the micrometer or even nanometer scale. MEMS are developed based on microelectronics technology (semiconductor manufacturing technology) and integrate technologies such as photolithography, etching, thin film processing, LIGA, silicon micromachining, non-silicon micromachining, and precision machining. MEMS technology is widely used in various fields, including but not limited to consumer electronics products such as miniature speakers and MEMS microphones. These products are widely used in devices such as laptops and smartphones due to their advantages of small size, low power consumption, and mass production capabilities.

[0003] In related technologies, MEMS controllers struggle to balance miniaturization with reliable unidirectional flow control, which can easily lead to problems such as the inability to actively control the direction. Summary of the Invention

[0004] This invention provides a MEMS controller and a MEMS device that can at least control the unidirectional movement of fluid.

[0005] The technical solution of the present invention is as follows: In a first aspect, the present invention provides a MEMS controller, comprising: The encapsulation shell includes a first plate portion, a second plate portion, and a sidewall portion connecting the first plate portion and the second plate portion, which are disposed opposite to each other. The first plate portion, the second plate portion, and the sidewall portion together enclose an encapsulation cavity. A first opening penetrating the first plate portion is formed, and a second opening penetrating the second plate portion is formed. A control component is housed within the encapsulation cavity. The control component includes a base, a cantilever, and a flow-encircling element. The flow-encircling element is fixed to the side wall portion, and the base is fixed to the second plate portion. The cantilever has a fixed end and a free end. The fixed end of the cantilever is fixed to the side of the base away from the second plate portion, and the free end of the cantilever is closer to the flow-encircling element than the fixed end. The projection of the free end of the cantilever perpendicular to the vibration direction of the cantilever is located on the flow-encircling element. The first opening and the second opening are respectively located on both sides of the flow-receiving element. The projections of the first opening and the second opening are at least partially located on the flow-receiving element. One of the first opening and the second opening is an inlet and the other is an outlet. The size of the flow-receiving element on the side closer to the inlet is smaller than the size of the flow-receiving element on the side closer to the outlet.

[0006] Preferably, the size of the outlet is larger than the size of the inlet.

[0007] Preferably, the first plate portion and the second plate portion are arranged opposite to each other in a first direction, the fixed end and the free end of the cantilever are arranged opposite to each other in a second direction perpendicular to the first direction, the cross-sectional shape of the flow-around member cut by the first plane is polygonal or curved, and the first plane is parallel to the plane formed by the first direction and the second direction.

[0008] Preferably, the flow-around element is integrally formed with the sidewall portion.

[0009] Preferably, the second plate is a circuit board, and the cantilever is electrically connected to the circuit board via a bonding wire to receive the drive signal provided by the circuit board.

[0010] Preferably, the base includes a substrate layer and an insulating layer, the cantilever includes a device layer, the substrate layer is connected to the second plate portion, the insulating layer is disposed on the side of the substrate layer away from the second plate portion, and the device layer is disposed on the side of the insulating layer away from the substrate layer.

[0011] Preferably, the frequency of the drive signal received by the cantilever is equal to the resonant frequency of the cantilever; and / or, The frequency of the drive signal received by the cantilever is greater than 20KHz.

[0012] Preferably, the control component includes one of the cantilever arms; or, The control component includes a plurality of cantilever arms, which are spaced apart and arranged in parallel. The fixed ends of the plurality of cantilever arms are all fixed to the base, and the free ends of the plurality of cantilever arms are closer to the flow-through component than the fixed ends.

[0013] Preferably, the MEMS controller includes one of the control components; or, The MEMS controller includes a plurality of control components, which are arranged sequentially at intervals. The package includes a plurality of first openings and a plurality of second openings. The number of first openings is equal to the number of control components and the first openings correspond one-to-one with the control components. The number of second openings is equal to the number of control components and the second openings correspond one-to-one with the control components.

[0014] In a second aspect, the present invention provides a MEMS device, including any of the MEMS controllers provided in the first aspect.

[0015] The beneficial effects of the present invention are as follows: In the MEMS controller and MEMS device of the present invention, the cantilever is fixed to the base and the free end is closer to the flow element than the fixed end. The first opening and the second opening are respectively located on both sides of the flow element and the projection is at least partially located on the flow element. One of the first opening and the second opening is the inlet and the other is the outlet. The size of the flow element on the side closer to the inlet is smaller than the size on the side closer to the outlet. The projection of the free end of the cantilever perpendicular to the vibration direction of the cantilever is located on the flow element. The cooperation between the flow element and the cantilever causes a vortex to be formed around the flow element, thereby reducing the pressure at the inlet and increasing the pressure at the outlet. As a result, the fluid is drawn into the encapsulation shell from the inlet and discharged from the encapsulation shell from the outlet when the cantilever vibrates. The net flow rate of the first opening and the second opening increases alternately over time, thereby achieving the control effect of unidirectional flow. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0017] Figure 2 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0018] Figure 3 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0019] Figure 4 This is a schematic diagram of the working state of a MEMS controller according to Embodiment 1 of the present invention.

[0020] Figure 5 This is a schematic diagram of the working state of a MEMS controller according to Embodiment 1 of the present invention.

[0021] Figure 6 This is a time-domain diagram of the flow velocity in the first and second openings of the MEMS controller in Embodiment 1 of the present invention.

[0022] Figure 7 This is a graph showing the relationship between the cumulative airflow rate and the operating time of the MEMS controller in Embodiment 1 of the present invention.

[0023] Figure 8 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0024] Figure 9 for Figure 8 A magnified view of a portion of the A-structure.

[0025] Figure 10 for Figure 8 BB cross-sectional view.

[0026] Figure 11 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0027] Figure 12 for Figure 11 CC section view.

[0028] Figure 13 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0029] Figure 14 This is a schematic diagram of the structure of a MEMS controller in Embodiment 1 of the present invention, which is used to achieve heat dissipation, with the first opening as the inlet and the second opening as the outlet.

[0030] Figure 15 This is a schematic diagram of the structure of a MEMS controller in Embodiment 1 of the present invention, which uses a first opening as an outlet and a second opening as an inlet for heat dissipation.

[0031] Figure 16 This is a schematic diagram of the structure of the MEMS controller in Embodiment 2 of the present invention. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] Example 1 Please refer to Figure 1According to an embodiment of the present invention, a MEMS controller 10 is provided, including a package shell 1 and a control component 2. The package shell 1 includes a first plate portion 11, a second plate portion 12 and a side wall portion 16. The first plate portion 11 and the second plate portion 12 are disposed opposite to each other. The side wall portion 16 is connected between the first plate portion 11 and the second plate portion 12. The first plate portion 11, the second plate portion 12 and the side wall portion 16 together form a package cavity 13. A first opening 14 is provided on the first plate portion 11 and penetrates the first plate portion 11. A second opening 15 is provided on the second plate portion 12 and penetrates the second plate portion 12. The control component 2 is housed within the encapsulation cavity 13. The control component 2 includes a base 21, a cantilever 22, and a flow-driving element 23. The flow-driving element 23 is fixed to the side wall portion 16, the base 21 is fixed to the second plate portion 12, and the cantilever 22 has a fixed end 221 and a free end 222. The fixed end 221 of the cantilever 22 is fixed to the side of the base 21 away from the second plate portion 12, and the free end 222 of the cantilever 22 is closer to the flow-driving element 23 than the fixed end 221. The first opening 14 and the second opening 15 are respectively located on both sides of the flow-encircling member 23. The projection of the first opening 14 is at least partially located on the flow-encircling member 23, and the projection of the second opening 15 is at least partially located on the flow-encircling member 23. One of the first opening 14 and the second opening 15 is the inlet, and the other of the first opening 14 and the second opening 15 is the outlet. Furthermore, the size of the flow-encircling member 23 near the inlet is smaller than the size of the flow-encircling member 23 near the outlet. The projection of the free end of the cantilever 22 perpendicular to the vibration direction of the cantilever 22 is located on the flow-encircling member 23.

[0034] In this embodiment of the invention, the cantilever 22 is fixed to the base 21 and its free end 222 extends close to the flow-encircling member 23. The first opening 14 and the second opening 15 are respectively located on both sides of the flow-encircling member 23 and their projections are at least partially located on the flow-encircling member 23. One of the first opening 14 and the second opening 15 is the inlet and the other is the outlet. The size of the flow-encircling member 23 near the inlet is smaller than the size near the outlet. The projection of the free end of the cantilever 22 perpendicular to the vibration direction of the cantilever 22 is located on the flow-encircling member 23. The cooperation between the flow-encircling member 23 and the cantilever 22 causes a vortex to be formed around the flow-encircling member 23, thereby reducing the pressure at the inlet and increasing the pressure at the outlet. As the cantilever 22 vibrates, the fluid is drawn into the encapsulation shell 1 from the inlet and discharged from the encapsulation shell 1 from the outlet. As time accumulates, the net flow rate of the first opening 14 and the second opening 15 alternately increases, achieving a unidirectional flow control effect. This avoids the use of various active valves and / or passive valves, simplifies the overall structure, and significantly improves long-term operational reliability.

[0035] As an example, please refer to Figure 1The first plate portion 11 and the second plate portion 12 are disposed opposite each other in a first direction, and the first direction is the thickness direction of the cantilever 22 in its initial state. The projection of the first opening 14 is at least partially located on the flow-encircling member 23, meaning that the projection of the first opening 14 along the first direction is at least partially located on the flow-encircling member 23. That is, the projection of the first opening 14 along the first direction may be partially located on the flow-encircling member 23 or may be completely located on the flow-encircling member 23. The projection of the second opening 15 is at least partially located on the flow-encircling member 23, meaning that the projection of the second opening 15 along the first direction is at least partially located on the flow-encircling member 23. That is, the projection of the second opening 15 along the first direction may be partially located on the flow-encircling member 23 or may be completely located on the flow-encircling member 23.

[0036] As an example, please refer to Figure 1 The base 21 has a first surface 211 and a second surface 212 that are arranged opposite to each other in a first direction, and the cantilever 22 has a third surface 223 and a fourth surface 224 that are arranged opposite to each other in a first direction. The first surface 211 of the base 21 is fixed to the second plate portion 12, and the third surface 223 of the fixed end 221 of the cantilever 22 is fixed to the second surface 212 of the base 21.

[0037] As an example, please refer to Figure 1 The fixed end 221 and free end 222 of the cantilever 22 are arranged opposite each other in a second direction, which is perpendicular to the first direction. The flow-around element 23 is disposed on the side of the free end 222 of the cantilever 22 away from the fixed end 221 of the cantilever 22. The vibration direction of the cantilever 22 is the first direction. The projection of the free end of the cantilever 22 along the vibration direction perpendicular to the cantilever 22 onto the flow-around element 23 means that the projection of the free end of the cantilever 22 along the second direction is located on the flow-around element 23.

[0038] In some examples, please refer to Figures 1 to 3 The projection of the free end of the cantilever 22 in the second direction is completely located on the flow-encircling member 23, which enables the kinetic energy of the cantilever 22 to be transferred more directly to the flow field around the flow-encircling member 23, promoting the formation of vortices, thereby improving the response speed and reliability of unidirectional flow control.

[0039] It should be noted that in other embodiments, the projection of the free end of the cantilever in the second direction may be located on the flow-around member, which can be set according to the actual situation, and will not be elaborated here.

[0040] In some implementation methods, please refer to Figures 1 to 3, the cantilever 22 has a mid-plane that bisects the cantilever 22 in the thickness direction. The plane 20 where the mid-plane of the cantilever 22 is located in the initial state (when not powered) divides the encapsulation cavity 13 into a first chamber 131 and a second chamber 132. By applying an alternating driving signal to the cantilever 22, the displacement of the free end 222 of the cantilever 22 in the first direction satisfies: , where f0 is the resonant frequency of the cantilever 22 and d0 is the amplitude of vibration of the cantilever 22. Under the vibration of the cantilever 22, the pressure on both sides of the free end 222 of the cantilever 22 alternates, thereby forming eddy currents. As time goes by, the eddy currents drive the fluid to move away from the free end 222 of the cantilever 22 and impact the surface of the flow-around member 2 / 3. After the fluid impacts the surface of the flow-around member 23, it moves along the outer contour of the cross-section of the flow-around member 23 and forms a relatively stable flow-around after a period of time. Due to the asymmetry of the flow-around member 23 itself, a pressure difference is formed in the first chamber 131 and the second chamber 132. The pressure of the encapsulation cavity 13 near the first opening 14 is p1, and the pressure of the encapsulation cavity 13 near the second opening 15 is p2. Please refer to Figure 4 (a) and Figure 4 (b) shown. If p1 < p2, then finally the fluid enters the encapsulation cavity 13 from the first opening 14 and flows out from the second opening 15, forming a unidirectional flow. Please refer to Figure 5 (a) and Figure 5 (b) shown. If p1 > p2, then finally the fluid enters the encapsulation cavity 13 from the second opening 15 and flows out from the first opening 14, also forming a unidirectional flow. The magnitude relationship between p1 and p2 is jointly determined by parameters such as the volume ratio of the first chamber 131 and the second chamber 132, the shape, size and placement position of the flow-around member 23, the size, quantity and placement position of the first opening 14 and the second opening 15, etc., and finally determines the directionality of the unidirectional flow of the fluid. As an example, please refer to Figures 1 to 3 , the position of the plane 20 where the mid-plane of the cantilever 22 is located can be adjusted to adjust the ratio of the height H1 of the first chamber 131 to the height H2 of the second chamber 132, thereby regulating the volume distribution of the first chamber 131 and the second chamber 132; alternatively, the position of the first opening 14 and the second opening 15 in the second direction, and / or, the ratio of the width W1 of the first opening 14 in the second direction to the width W2 of the first opening 14 in the second direction can also be adjusted, thereby regulating the pressure distribution of the fluid in the first chamber 131 and the second chamber 132; alternatively, the shape, size and / or placement position of the flow-around member 23 can also be adjusted, thereby regulating the pressure distribution of the fluid in the first chamber 131 and the second chamber 132.

[0041] Please refer to Figure 6 , when the fluid flows in from the first opening 14 and flows out from the second opening 15, the time-domain diagram of the flow velocity of the first opening 14 is as shown in Figure 6As shown in (a), the flow velocity time-domain plot of the second opening 15 is as follows. Figure 6 As shown in (b), when fluid flows in through the second opening 15 and out through the first opening 14, the time-domain velocity diagram of the first opening 14 is as follows. Figure 6 As shown in (c), the flow velocity time-domain plot of the second opening 15 is as follows. Figure 6 As shown in (d).

[0042] Please refer to Figure 7 , Figure 7 Curve S100 is the inlet flow rate curve of the MEMS controller 10 in this embodiment of the invention; curve S200 is the outlet flow rate curve of the MEMS controller 10 in this embodiment of the invention; curve S300 is the inlet flow rate curve of a comparative MEMS controller without a flow-around element; and curve S400 is the outlet flow rate curve of a comparative MEMS controller without a flow-around element (the inlet flow rate curve S300 and the outlet flow rate curve S400 of the comparative MEMS controller without a flow-around element basically overlap). Figure 7 As can be seen, in this embodiment of the invention, the airflow generated by the vibration of the cantilever 22 flows around the flow-around member 23, causing a redistribution of pressure in the first chamber 131 and the second chamber 132. Although the transient flow velocity directions at the inlet and outlet change periodically with the vibration of the cantilever 22, the net flow velocity directions at the inlet and outlet are determined due to the pressure difference in the flow field between the first chamber 131 and the second chamber 132. Under the influence of the net flow rate, the net flow rates at the inlet and outlet alternately increase over time, achieving a unidirectional flow control effect. Figure 7 It can also be seen that in the comparative example without the flow-around element, the pressure distribution in the first and second chambers changes almost symmetrically with the periodic vibration of the cantilever. Therefore, the inlet and outlet flow velocities of the MEMS controller in the comparative example without the flow-around element also change symmetrically and periodically, and cannot accumulate effective net flow over time.

[0043] In some embodiments, the size of the outlet is larger than the size of the inlet. For example, the width of the outlet in the second direction is greater than the width of the inlet in the second direction. It should be noted that in other embodiments, the width of the outlet in the third direction may also be greater than the width of the inlet in the third direction; or, the width of the outlet in the second direction may be greater than the width of the inlet in the second direction, and the width of the outlet in the third direction may also be greater than the width of the inlet in the third direction; the first direction, the second direction, and the third direction are mutually perpendicular.

[0044] In this embodiment, the interaction between the flow-around element 23 and the cantilever 22 generates vortices around the flow-around element 23, resulting in a lower pressure at the inlet and a higher pressure at the outlet. The smaller size of the inlet can increase the inflow velocity and reduce backflow and disturbance at the inlet under low-pressure drive, while the larger size of the outlet can reduce the discharge resistance under high-pressure drive, allowing the outlet to obtain a larger effective flow area under higher pressure. This fully utilizes the pressure difference to increase the net flow rate and overall flow velocity of the fluid, thereby enhancing the fluid drive efficiency and stability of the unidirectional flow.

[0045] In some implementation methods, please refer to Figures 1 to 3 , Figures 1 to 3 The structure shown is a cross-sectional view of the MEMS controller 10 cut by the first plane. The cross-sectional shape of the flow-redirecting element 23 cut by the first plane can be, but is not limited to, a polygon or a curved surface, etc., and is an asymmetrical shape with one end larger than the other in the first direction. Furthermore, the smaller end of the flow-redirecting element 23 in the first direction is closer to the inlet side, and the larger end of the flow-redirecting element 23 in the first direction is closer to the outlet side. The first plane is parallel to the plane formed by the first and second directions, i.e., the first plane is perpendicular to the third direction. As an example, the cross-sectional shape of the flow-redirecting element 23 can be as follows: Figure 1 and Figure 2 The triangle shown, or as Figure 3 The streamline shape is shown. It should be noted that in other embodiments, the cross-section of the flow element cut by the first plane can also be a trapezoid or other polygonal shape, or a teardrop or other curved surface shape.

[0046] In some embodiments, the flow-around component 23 is integrally formed with the encapsulation shell 1, which can reduce assembly steps and avoid gaps or misalignments caused by separate connections. It should be noted that in other embodiments, the flow-around component can also be a separate component.

[0047] In some implementation methods, please refer to Figures 1 to 3 The base 21 is fixed to the second plate portion 12 on the side away from the cantilever 22 in the first direction, and fixed to the side wall portion 16 on the side away from the flow-around component 23 in the second direction. Through multi-directional positioning and fixing, the base 21 is securely limited between the second plate portion 12 and the side wall portion 16, preventing the base 21 from shifting or deflecting, thereby ensuring the relative positional accuracy of the cantilever 22 and the flow-around component 23, improving assembly consistency and flow field control reliability.

[0048] In some embodiments, the sidewall portion 16 is a hollow cylindrical structure arranged around the first direction, thereby forming a stable fluid channel around the flow-through member 23 and guiding the fluid to flow along the intended path.

[0049] In some implementation methods, please refer to Figure 8 and Figure 11 , Figure 8 and Figure 11 The structure shown is a cross-sectional view of the MEMS controller 10 cut by the first plane. The sidewall portion 16 includes a first sidewall 161 and a second sidewall 162. Both the first sidewall 161 and the second sidewall 162 are hollow cylindrical structures arranged around the first direction. The first sidewall 161 is connected to the side of the first plate portion 11 facing the second plate portion 12, and the second sidewall 162 is connected between the first sidewall 161 and the second plate portion 12. The flow-through component 23 is fixed to the first sidewall 161, which makes it easier to install the control component 2 into the encapsulation shell 1 in steps and avoids assembly interference.

[0050] As one implementation method, please refer to Figure 10 and Figure 12 , Figure 10 The structure shown is that the MEMS controller 10 is... Figure 8 The cross-sectional view shown is taken from section BB. Figure 12 The structure shown is that the MEMS controller 10 is... Figure 11 The cross-sectional view of the CC section shown. The flow-encircling element 23 is fixed to the first sidewall 161 at both ends in the third direction, so that the position of the flow-encircling element 23 in the encapsulation cavity 13 remains fixed and does not shift, thereby stably guiding the formation of eddy currents and the pressure difference distribution when the cantilever 22 vibrates, and improving the reliability of unidirectional flow control.

[0051] As an example, please refer to Figure 8 , Figure 11 and Figure 13 The first plate 11 and the first side wall 161 are integrally formed, which can reduce assembly processes and avoid gaps or misalignments caused by separate connections.

[0052] As one implementation method, please refer to Figure 8 , Figure 11 and Figure 13 The second board 12 is a circuit board. The cantilever 22 is connected to the circuit board by wire bonding. That is, the cantilever 22 is electrically connected to the circuit board through the bonding wire 3 to receive the driving signal provided by the circuit board. Under the drive of the driving signal, the free end 222 of the cantilever 22 swings back and forth in the first direction.

[0053] As an example, please refer to Figure 8 , Figure 11 and Figure 13 The base 21 has a gap between the end of the base away from the flow member 23 in the second direction and the second side wall 162. The circuit board (second board part 12) is provided with solder balls 4, which are located in the gap. One end of the bonding wire 3 is connected to the cantilever 22, and the other end of the bonding wire 3 is connected to the solder balls 4.

[0054] In some implementations, the driving mode of the cantilever 22 includes, but is not limited to, piezoelectric, electrostatic, electromagnetic, or thermoelectric modes.

[0055] In some implementation methods, please refer to Figure 9 The control component 2 can be implemented based on SOI (Silicon on Isolation) technology. The base 21 includes a substrate layer 213 and an insulating layer 214, and the cantilever 22 includes a device layer. The substrate layer 213 is connected to the second plate portion 12, the insulating layer 214 is disposed on the side of the substrate layer 213 away from the second plate portion 12, and the device layer is disposed on the side of the insulating layer 214 away from the substrate layer 213.

[0056] As one implementation method, please refer to Figure 9 The cantilever 22 is piezoelectrically driven and includes a silicon device layer 225, a bottom metal electrode 226, a piezoelectric film 227, and a top metal electrode 228. The silicon device layer 225, the bottom metal electrode 226, the piezoelectric film 227, and the top metal electrode 228 are sequentially arranged in a first direction away from the insulating layer 214. The piezoelectric film 227 can be, but is not limited to, PZT (lead zirconate titanate), AlN (aluminum nitride), AlScN (aluminum scandium nitride), KNN (potassium sodium niobate), ZnO (zinc oxide), or other piezoelectric materials.

[0057] In some implementations, the frequency of the drive signal received by the cantilever 22 is equal to the resonant frequency of the cantilever 22, thereby maximizing the vibration efficiency of the cantilever 22.

[0058] In some implementations, the frequency of the drive signal received by the cantilever 22 is within the ultrasonic frequency range, that is, the frequency of the drive signal received by the cantilever 22 is greater than 20KHz, so that there is no audible audio excitation and the effect of silent operation is achieved.

[0059] In some implementations, the control component 2 may include one or more cantilever 22.

[0060] As one implementation method, please refer to Figure 10 The control component 2 includes a cantilever 22.

[0061] As one implementation method, please refer to Figure 12The control component 2 includes multiple cantilever arms 22, which are spaced apart and parallel to each other in a third direction. The fixed ends 221 of each cantilever arm 22 are fixed to the base 21, and the free end 222 of each cantilever arm 22 is closer to the flow-passing element 23 than its fixed end 221. As an example, the fixed ends 221 of the multiple cantilever arms 22 are connected as one unit, which not only simplifies assembly and ensures that the fixed ends 221 of each cantilever arm 22 are in the same position, reducing positional deviations caused by individual fixing, but also further improves the consistency of the control component 2's operation and its reliability. In some examples, the control component 2 includes two cantilever arms 22. It should be noted that in other embodiments, the control component may include three or more cantilever arms, which can be set according to actual conditions, and will not be elaborated here.

[0062] In some implementations, the projection of the cantilever 22 in the first direction can be, but is not limited to, a rectangle, trapezoid, triangle, or apodized polygon, etc., which can be set according to the actual situation, and will not be elaborated here.

[0063] In some implementations, the MEMS controller 10 includes one or more control components 2.

[0064] As one implementation method, please refer to Figures 1 to 3 ,as well as Figures 8 to 12 The MEMS controller 10 includes a control component 2.

[0065] As one implementation method, please refer to Figure 13 The MEMS controller 10 includes multiple control components 2, which are arranged sequentially at intervals. The package 1 includes multiple first openings 14 and multiple second openings 15. The number of first openings 14 is equal to the number of control components 2, and each first opening 14 corresponds to a control component 2. Similarly, the number of second openings 15 is equal to the number of control components 2, and each second opening 15 corresponds to a control component 2. For example, the multiple control components 2 are arranged sequentially at intervals in a first direction.

[0066] In some implementations, the MEMS controller 10 can be applied to various applications such as pumps, fans, and material transport. As one implementation, the MEMS controller 10 can be used as a heat sink for heat dissipation.

[0067] As an example, please refer to Figure 14When the MEMS controller 10 controls the fluid to flow from the first opening 14 to the second opening 15, it places the object requiring heat dissipation (such as a CPU chip), i.e., the heat source 30, on one side of the second opening 15, and positions the heat source 30 perpendicular to the air outlet direction of the second opening 15. Driven by the MEMS controller 10, cool air flows in from one side of the first opening 14, flows around inside the encapsulation cavity 13, and flows out from one side of the second opening 15, blowing onto the surface of the heat source 30, thereby efficiently removing the heat from the heat source 30 and achieving active heat dissipation.

[0068] As an example, please refer to Figure 15 When the MEMS controller 10 controls the fluid to flow from the second opening 15 to the first opening 14, it places the object requiring heat dissipation (such as a CPU chip), i.e., the heat source 30, on one side of the first opening 14, and positions the heat source 30 perpendicular to the air outlet direction of the first opening 14. Driven by the MEMS controller 10, cool air flows in from one side of the second opening 15, flows around inside the encapsulation cavity 13, and flows out from one side of the first opening 14, blowing onto the surface of the heat source 30, thereby efficiently removing the heat from the heat source 30 and achieving active heat dissipation.

[0069] It should be noted that in other embodiments, the MEMS controller can also be applied to other applications requiring unidirectional flow, such as loudspeakers, and can be configured according to actual conditions, which will not be elaborated here.

[0070] Example 2 The structure of Embodiment 2 of the present invention is basically the same as that of Embodiment 1. The difference is that in Embodiment 2, the second plate portion 12 is not a circuit board, and the MEMS controller 10 further includes a circuit board 5. The circuit board 5 is fixed between the first sidewall 161 and the second sidewall 162, and is located on the side of the cantilever 22 away from the base 21. The cantilever 22 is electrically connected to the circuit board 5 via conductive adhesive 6 to receive the drive signals provided by the circuit board 5. Please refer to [reference needed]. Figure 16 In other words, in this embodiment, the circuit board 5 and the cantilever 22 use surface mount packaging technology to save the planar size of the chip, thereby making the packaging structure more compact.

[0071] In some embodiments, the first pad on the cantilever 22 and the second pad on the circuit board 5 are directly mounted face-to-face by conductive silver paste or conductive silicone containing nano-silver particles, thereby eliminating the planar dimensions required for wire bonding and making the package structure more compact.

[0072] In some embodiments, the second plate portion 12 and the second sidewall 162 are integrally formed, which can reduce assembly steps and avoid gaps or misalignments caused by separate connections.

[0073] In some embodiments, the MEMS controller 10 also includes a sealant 7, which is disposed around the edge of the circuit board 5 and between the circuit board 5 and the control component 2. The sealant 7 can effectively isolate external moisture and contaminants from entering, prevent short circuits or corrosion between the circuit board 5 and the control component 2, thereby improving the long-term reliability and environmental adaptability of the MEMS controller 10.

[0074] Example 3 The third embodiment of the present invention is a MEMS device, including the MEMS controller 10 provided in any of the above embodiments.

[0075] The above description is merely an embodiment of the present invention. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements all fall within the protection scope of the present invention.

Claims

1. A MEMS controller, characterized in that, include: The encapsulation shell includes a first plate portion, a second plate portion, and a side wall portion connecting the first plate portion and the second plate portion, which are disposed opposite to each other. The first plate portion, the second plate portion, and the side wall portion together enclose an encapsulation cavity. A first opening is provided on the first plate portion, and a second opening is provided on the second plate portion, which is also provided. and A control component is housed within the encapsulation cavity. The control component includes a base, a cantilever, and a flow-encircling element. The flow-encircling element is fixed to the side wall portion, and the base is fixed to the second plate portion. The cantilever has a fixed end and a free end. The fixed end of the cantilever is fixed to the side of the base away from the second plate portion, and the free end of the cantilever is closer to the flow-encircling element than the fixed end. The projection of the free end of the cantilever perpendicular to the vibration direction of the cantilever is located on the flow-encircling element. The first opening and the second opening are respectively located on both sides of the flow-receiving element. The projections of the first opening and the second opening are at least partially located on the flow-receiving element. One of the first opening and the second opening is an inlet and the other is an outlet. The size of the flow-receiving element on the side closer to the inlet is smaller than the size of the flow-receiving element on the side closer to the outlet.

2. The MEMS controller as described in claim 1, characterized in that, The size of the outlet is larger than the size of the inlet.

3. The MEMS controller as described in claim 1, characterized in that, The first plate portion and the second plate portion are arranged opposite to each other in a first direction, the fixed end and the free end of the cantilever are arranged opposite to each other in a second direction perpendicular to the first direction, the cross-sectional shape of the flow-around member cut by the first plane is polygonal or curved, and the first plane is parallel to the plane formed by the first direction and the second direction.

4. The MEMS controller as described in claim 1, characterized in that, The flow-through component is integrally formed with the sidewall portion.

5. The MEMS controller as described in claim 1, characterized in that, The second plate is a circuit board, and the cantilever is electrically connected to the circuit board via bonding wires to receive drive signals provided by the circuit board.

6. The MEMS controller as described in claim 1, characterized in that, The base includes a substrate layer and an insulating layer, the cantilever includes a device layer, the substrate layer is connected to the second plate portion, the insulating layer is disposed on the side of the substrate layer away from the second plate portion, and the device layer is disposed on the side of the insulating layer away from the substrate layer.

7. The MEMS controller as described in claim 1, characterized in that, The frequency of the drive signal received by the cantilever is equal to the resonant frequency of the cantilever; and / or, The frequency of the drive signal received by the cantilever is greater than 20KHz.

8. The MEMS controller as described in claim 1, characterized in that, The control component includes one of the cantilever arms; or... The control component includes a plurality of cantilever arms, which are spaced apart and arranged in parallel. The fixed ends of the plurality of cantilever arms are all fixed to the base, and the free ends of the plurality of cantilever arms are further away from the flow-through component than the fixed ends.

9. The MEMS controller as described in claim 1, characterized in that, The MEMS controller includes one of the aforementioned control components; or... The MEMS controller includes a plurality of control components, which are arranged sequentially at intervals. The package includes a plurality of first openings and a plurality of second openings. The number of first openings is equal to the number of control components and the first openings correspond one-to-one with the control components. The number of second openings is equal to the number of control components and the second openings correspond one-to-one with the control components.

10. A MEMS device, characterized in that, include: The MEMS controller as described in any one of claims 1-9.