Electronic equipment and heat dissipation control method
By introducing a combination of target components and fans into electronic devices, and dynamically adjusting the operating status based on the temperature difference, the heat dissipation problem of chips under high heat flux density is solved, achieving flexible heat dissipation control and safe operation of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-03-31
AI Technical Summary
As the heat flux density of chips increases, the heat dissipation performance of heat dissipation modules in electronic devices faces challenges. Existing technologies struggle to effectively regulate and control chip temperature to prevent water vapor condensation and ensure safe operation of the equipment.
By introducing a target component into the electronic device, the operating state of the target component is dynamically adjusted according to the temperature difference between the heat-generating component and the heat-dissipating component. Dynamic heat dissipation control is achieved by using a combination of a fan and the target component.
It enables flexible switching of target components according to different temperature differences, effectively regulates the temperature of the target area, avoids water vapor condensation, ensures safe operation of equipment, and improves heat dissipation efficiency.
Smart Images
Figure CN121764313A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of thermal management technology, and more specifically, to an electronic device and a heat dissipation control method. Background Technology
[0002] The evolution of chip manufacturing processes has led to an exponential increase in transistor density per unit area, and chip heat flux density is also getting higher and higher, which makes the heat dissipation performance of heat dissipation modules in electronic devices face greater challenges. Summary of the Invention
[0003] In view of the above, this application provides the following technical solution:
[0004] The first aspect of this application provides an electronic device, comprising:
[0005] Heating components;
[0006] A heat dissipation component is thermally connected to the heat-generating component;
[0007] A fan, the airflow generated by the fan can pass through the target area, and the airflow generated by the fan can dissipate heat from the heat-generating component and / or the heat-dissipating component;
[0008] A target component has a first state and a second state. In response to satisfying a first condition, the target component enters the first state. In response to satisfying a second condition, the target component enters the second state. In the first state, the target component enables the temperature of the target area to be a first temperature. In the second state, the target component enables the temperature of the target area to be a second temperature. The first temperature is less than the second temperature.
[0009] The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
[0010] One possible implementation includes:
[0011] The detection component obtains the ambient temperature, and the electronic device is able to determine a target temperature based on the ambient temperature, wherein the target temperature characterizes the critical temperature at which water vapor condenses into dew.
[0012] The first temperature is greater than or equal to the target temperature.
[0013] One possible implementation includes:
[0014] In response to the second temperature difference between the first temperature and the target temperature being lower than a first threshold, the operating parameters of the target component are switched from the first operating parameters to the second operating parameters, and the second temperature difference under the second operating parameters is greater than the second temperature difference under the first operating parameters;
[0015] In response to a second temperature difference between the first temperature and the target temperature being higher than a second threshold, the operating parameters of the target component are switched from the first operating parameters to the third operating parameters, wherein the second temperature difference under the third operating parameters is less than the second temperature difference under the first operating parameters;
[0016] The first threshold is less than the second threshold.
[0017] One possible implementation includes:
[0018] The target component operates based on its maximum operating parameters in the first state. In response to a second temperature difference between the first temperature and the target temperature being lower than a third threshold, the operating parameters of the target component are switched from the maximum operating parameters to a fourth operating parameter, and the component enters the second state, maintaining the second state for a set duration.
[0019] The fourth operating parameter is lower than the minimum operating parameter of the target component, and the second temperature difference under the fourth operating parameter is greater than the second temperature difference under the maximum operating parameter.
[0020] In one possible implementation, when the electronic device is connected to an adapter, the target component is powered by the adapter.
[0021] In one possible implementation, the target component has a cold end and a hot end, and the fan includes a first air outlet and a second air outlet. The first air outlet is connected to the outside of the electronic device and the airflow blown out by the air outlet can dissipate heat from the hot end of the target component. The second air outlet blows out a cooling airflow under the action of the cold end of the target component, and the flow direction of the cooling airflow is towards the heat-generating component.
[0022] A second aspect of this application provides a heat dissipation control method, comprising:
[0023] Obtain the temperatures of the heat-generating and heat-dissipating components;
[0024] If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the first condition, the target component is controlled to enter the first state, and the target component in the first state makes the temperature of the target area the first temperature.
[0025] If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the second condition, the target component is controlled to enter the second state, and the target component in the second state makes the temperature of the target area the second temperature.
[0026] The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
[0027] One possible implementation also includes:
[0028] Obtain a target temperature, which characterizes the critical temperature at which water vapor condenses into dew, and its value is determined at least based on the ambient temperature.
[0029] The operating parameters of the target component are controlled and adjusted so that the first temperature of the target area is not lower than the target temperature.
[0030] In one possible implementation, the control adjustment of the operating parameters of the target component includes:
[0031] If the second temperature difference between the first temperature and the target temperature is lower than the first threshold, the operating parameters of the target component are controlled to be reduced so that the second temperature difference increases.
[0032] If the second temperature difference between the first temperature and the target temperature is higher than the second threshold, the operating parameters of the target component are increased to reduce the second temperature difference.
[0033] The first threshold is less than the second threshold.
[0034] In one possible implementation, the target component operates in the first state based on maximum operating parameters, and the control adjusts the operating parameters of the target component, including:
[0035] If the second temperature difference between the first temperature and the target temperature is lower than the third threshold, the target component is controlled to enter the second state and maintained in the second state for a set duration; in the second state, the operating parameters of the target component are lower than its minimum operating parameters. Attached Figure Description
[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0037] Figure 1 This is a schematic diagram of the structure of an electronic device disclosed in an embodiment of this application;
[0038] Figure 2 This is a schematic diagram of the air outlet structure of the fan disclosed in an embodiment of this application;
[0039] Figure 3 This is an example diagram of the internal cross-sectional structure of the electronic device disclosed in the embodiments of this application;
[0040] Figure 4 This is a flowchart of a heat dissipation control method disclosed in an embodiment of this application;
[0041] Figure 5 This is a schematic diagram illustrating the implementation process of the heat dissipation control scheme disclosed in the embodiments of this application. Detailed Implementation
[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0043] The embodiments of this application can be applied to electronic devices. This application does not limit the product form of the electronic device, which may include but is not limited to smartphones, tablets, wearable devices, personal computers (PCs), netbooks, etc., and can be selected according to application requirements.
[0044] Figure 1 This is a schematic diagram of the structure of an electronic device disclosed in an embodiment of this application. Figure 2 This is a schematic diagram of the air outlet structure of the fan disclosed in an embodiment of this application. (In conjunction with...) Figure 1 and Figure 2 As shown, the electronic device may include:
[0045] Heating component 10;
[0046] The heat dissipation component 20 is thermally connected to the heat-generating component 10;
[0047] The fan 30 generates airflow that can pass through the target area and dissipate heat for the heat-generating component 10 and / or the heat-dissipating component 20.
[0048] The target component 40 has a first state and a second state. In response to satisfying a first condition, the target component 40 enters the first state. In response to satisfying a second condition, the target component 40 enters the second state. In the first state, the target component 40 enables the temperature of the target area to be a first temperature. In the second state, the target component enables the temperature of the target area to be a second temperature. The first temperature is less than the second temperature.
[0049] The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
[0050] The heat-generating component can be an active heat-generating component or a passive heat-generating component in the electronic device. The active heat-generating component can be a chip (such as a system-on-a-chip, SOC), a circuit board, a resistor, etc., while the passive heat-generating component can be a heat pipe, a heat sink, etc. During operation, the processor, controller, circuit structure, etc., in the chip generate heat, causing the temperature of the chip and its surrounding environment to rise.
[0051] The heat dissipation component may include, but is not limited to, heat dissipation fins, heat spreaders, etc., which can be thermally connected to the heat-generating component to quickly absorb the heat generated by the heat-generating component, so that the heat-generating component can operate in a temperature environment that allows it to operate at a suitable frequency.
[0052] The fan rotates during operation to generate airflow, which can be directed to a specific area via an air outlet channel formed by the internal physical structure of the electronic device. In this application, the airflow generated by the fan can pass through a target area, which may be located between the fan and a heat-generating component or a heat-dissipating component. The airflow generated by the fan is directed towards the heat-generating component and / or the heat-dissipating component via the target area to accelerate the heat exchange rate of the environment surrounding the heat-generating component and / or the heat-dissipating component, thereby cooling the heat-generating component and / or the heat-dissipating component.
[0053] The target component can be a cooling component that activates cooling during operation. Its cold end is adjacent to the target area, thus lowering the temperature of the target area. When airflow generated by the fan passes through the target area, the temperature decreases, becoming a low-temperature airflow. This low-temperature airflow can then be directed towards the heat-generating and / or heat-dissipating components, cooling them. The target component can be connected to a current control device, which inputs a drive current to it, activating the cooling function.
[0054] The target component exists in two states during the operation of the electronic device: a first state and a second state. The first state can be understood as the target component being in a working state, capable of cooling and lowering the temperature of the target area. The second state can be understood as the target component being in a non-working state or unable to effectively cool; in the second state, the temperature of the airflow passing through the target area does not decrease. Because the target component can cool in the first state, the first temperature of the target area is lower than the second temperature of the target area in the second state. For example, in the first state, the first temperature of the target area can be 5°C, 10°C, etc., and in the second state, the second temperature of the target area can be 25°C, 30°C, etc. However, this application is not limited to these; those skilled in the art can adjust or set the temperature according to specific needs.
[0055] Since the values within the first range are greater than those within the second range, when the first temperature difference between the heating element and the heat dissipation element is within the first range, it indicates a relatively large temperature difference between the heating element and the heat dissipation element. The heating element needs to cool down quickly to maintain a stable performance state. Therefore, the target component can enter the first state, activating its cooling function to cool the airflow flowing through the target area. The cooled airflow then blows onto the heating element and / or the heat dissipation element, causing the temperature of the heating element to drop rapidly. When the first temperature difference between the heating element and the heat dissipation element is within the second range, it indicates a relatively small temperature difference between the heating element and the heat dissipation element. The heat dissipation requirement of the heating element is lower than when the first temperature difference is within the first range. In this case, even if the target component does not cool down, the temperature of the heating element can remain within its normal range. Therefore, in this case, the target component can enter or remain in the second state, i.e., a state without effective cooling.
[0056] For example, the first range can be [10, 20], and the second range can be (0, 10). The detected temperature of the heat-generating component can be 60℃. If the detected temperature of the heat-dissipating component is 45℃, then the first temperature difference is 60-45=15℃, which is within the first range. In this case, the target component can be controlled to enter the first state and start the cooling function. If the detected temperature of the heat-dissipating component is 52℃, then the first temperature difference is 60-52=8℃, which is within the second range. In this case, the target component can be controlled to enter the second state, without cooling or with low-power cooling.
[0057] The target component can be implemented in different ways, such as a semiconductor cooling component, a heat pipe component, a water cooling component, etc. This application does not impose a fixed limitation on its specific implementation. It can be any component that is currently available in the field or may appear in the future and can be applied to electronic devices with a cooling function.
[0058] In the electronic device described in this embodiment, a fan blows airflow through a target area to the heat-generating and / or heat-dissipating components, cooling them. The target component operates in different states under different conditions. When a first condition is met, it enters a first state, resulting in a lower temperature in the target area. Consequently, the temperature of the airflow flowing through the target area also decreases, allowing for rapid heat dissipation of the heat-generating and / or heat-dissipating components. When a second condition is met, the target component enters a second state, where the airflow from the fan also helps dissipate heat from the heat-generating and / or heat-dissipating components, keeping them within their normal operating temperature range. In this scheme, the target component can dynamically enter different operating states in response to different conditions, providing a more flexible implementation for the heat dissipation control of the electronic device.
[0059] See Figure 2 As shown, in addition to the component structures described in the foregoing embodiments, the electronic device may also include:
[0060] The airflow guiding structure 50 can be installed in the target area and thermally connected to the target component, for guiding the airflow flowing through the target area to the heat-generating component and / or heat-dissipating component.
[0061] The space containing the airflow guiding structure can be the target area. The airflow guiding structure directs the flowing gas in a fixed direction; for example, it can be a heat dissipation fin, airflow holes, or airflow vanes. The spacing between adjacent heat dissipation fins or vanes can be in the range of 0.8-1.2 mm. The airflow direction of the heat dissipation fins can be towards the system-on-a-chip (SoC), which can contact the heat spreader. The airflow passing through the airflow guiding structure can be directed towards the heat spreader and the SoC, enabling a rapid temperature reduction of both.
[0062] The flow guiding structure can be connected to the cold end of the target component, either through planar contact or coupling. In the case of coupling, the heat exchange efficiency between the flow guiding structure and the target component is higher.
[0063] The presence of the airflow guiding structure allows the cooling temperature of the target component to be conducted quickly and evenly, resulting in a more uniform temperature in the target area. This prevents a significant temperature difference between areas close to and far from the target component. At the same time, the fin structure allows the airflow passing through the target area to be directed more concentratedly towards the heat-generating and heat-dissipating components, achieving a better cooling effect.
[0064] The target component has a cold end 41 ( Figure 2 The lower end of the black target component) and the hot end 42 ( Figure 2The fan (located at the upper end of the black target component) may include a first air outlet 31 and a second air outlet 32. The first air outlet 31 can be connected to the outside of the electronic device and the airflow blown out by the air outlet can dissipate heat from the hot end of the target component. The second air outlet 32 can blow out a cooling airflow under the action of the cold end of the target component, and the flow direction of the cooling airflow is towards the heat-generating component.
[0065] In implementation, the hot end of the target component can be connected to the heat dissipation component via a heat pipe 60. This allows the heat dissipation resources of the heat dissipation component (such as water cooling or air cooling) to be applied to the hot end of the target component. The airflow generated by the fan has two functions: first, it carries the heat from the hot end of the target component, or the heat dissipation component, out of the electronic device along the channel corresponding to the first air outlet; second, it blows the cooling airflow from the cold end of the target component towards the heat-generating component along the channel of the second air outlet, thus cooling the heat-generating component. Figure 3 This is an example of the internal cross-sectional structure of the electronic device disclosed in this application, showing the SOC chip (heat-generating component), TEC (target component), heat spreader (heat dissipation component), airflow direction of the fan, temperature change distribution path, etc., which can be combined with... Figure 3 The content relates to the embodiments of this application.
[0066] In one embodiment, in addition to the component structures described above, the electronic device may further include: a detection component; the detection component is a component capable of detecting temperature, and can be a contact sensor or a non-contact sensor, such as a thermocouple sensor, a thermistor sensor, a resistance temperature detector, etc. The detection component obtains the ambient temperature, and the electronic device can determine a target temperature based on the ambient temperature, the target temperature representing the critical temperature at which water vapor condenses into dew; the first temperature is greater than or equal to the target temperature.
[0067] The target temperature is the dew point temperature inside the electronic device. When the temperature at a certain point in the electronic device is lower than the dew point temperature, condensation will occur, affecting the service life of various components of the electronic device and even affecting the safe operation of the device. Therefore, in the implementation, the target temperature is detected and determined in real time, and the first temperature of the target area is greater than or equal to the target temperature.
[0068] In some embodiments, the target temperature can be a fixed value. For example, based on the application environment of the target device, a fixed target temperature can be configured for the electronic device. If the electronic device is a portable device or a desktop computer, which is usually used indoors, the target temperature can be configured to be 12°C. If the electronic device is used in a factory or outdoors, considering the large temperature difference in the environment, the target temperature can be configured to be 10°C, etc. However, this application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.
[0069] In other embodiments, the target temperature may not be a fixed value, but is influenced by many factors, such as temperature, humidity, and air pressure. The dew point temperature is typically in the range of 5.5℃ to 15℃. In normal operating environments, ambient temperature has the greatest impact on it. In implementation, the target temperature can be dynamically determined periodically based on the ambient temperature (internal temperature of the electronic device), thereby improving the accuracy of the target temperature.
[0070] In this embodiment of the application, the electronic device is also provided with a detection component for detecting ambient temperature. The electronic device determines the target temperature based on the ambient temperature. When the ambient temperature is different, the target temperature is also different, which can obtain a more accurate target temperature and help the electronic device to perform temperature control more accurately.
[0071] In one implementation, in response to a second temperature difference between the first temperature and the target temperature being lower than a first threshold, the operating parameters of the target component can be switched from the first operating parameters to the second operating parameters, where the second temperature difference under the second operating parameters is greater than the second temperature difference under the first operating parameters. In response to a second temperature difference between the first temperature and the target temperature being higher than a second threshold, the operating parameters of the target component can be switched from the first operating parameters to the third operating parameters, where the second temperature difference under the third operating parameters is less than the second temperature difference under the first operating parameters. Wherein, the first threshold is less than the second threshold.
[0072] The first threshold can be a relatively small threshold, such as 1, 1.5, or 2. If the second temperature difference between the first temperature and the target temperature is lower than the first threshold, it indicates that the first temperature of the target area is already close to the target temperature. If the first temperature of the target area continues to decrease, condensation may occur, affecting the operation of the equipment. Therefore, it is necessary to adjust the operating parameters of the target component to reduce its cooling efficiency, so that the first temperature of the target area does not continue to decrease. The operating parameters can be voltage or current. The voltage or current corresponding to the first operating parameter is larger, while the voltage or current corresponding to the second operating parameter is smaller. Therefore, when the operating parameters of the target component are switched from the first operating parameter to the second operating parameter, its cooling rate or efficiency decreases, so that the first temperature of the target area does not continue to drop below the target temperature, and condensation does not occur inside the electronic device.
[0073] The difference between the second operating parameter and the first operating parameter can be a fixed value, that is, the operating parameter is reduced by a fixed value. For example, if the original driving current of the target component is 4.5A, and the fixed reduction is 1A, then the second operating parameter is 3.5A. Alternatively, a fixed second operating parameter can be pre-configured. As long as the second temperature difference is detected to be lower than the first threshold, the operating parameter of the target component is directly switched to the second operating parameter. For example, if the original driving current of the target component is 4.5A, and the fixed second operating parameter is 3A, then if the second temperature difference is detected to be lower than the first threshold, the driving current of the target component is set to 3A. The fixed second operating parameter can be calibrated.
[0074] The second threshold can be a relatively large threshold, such as 5, 5.5, or 6. If the second temperature difference between the first temperature and the target temperature is higher than the first threshold, it indicates that the first temperature of the target area is still far from the target temperature. If the first temperature of the target area continues to decrease, condensation will not be generated inside the electronic device. Therefore, in order to improve the heat dissipation effect of the electronic device, the cooling speed or efficiency of the target component can be further improved by switching the operating parameters of the target component from the first operating parameter to the third operating parameter. The third operating parameter is greater than the first operating parameter, that is, the current or voltage corresponding to the third operating parameter is greater than the current or voltage corresponding to the first operating parameter. Thus, after switching to the third operating parameter, the target component has a greater cooling efficiency, the first temperature of the target area will continue to decrease, and the airflow flowing through the target area can cool down the heat-generating component and / or heat-dissipating component more quickly.
[0075] Similarly, the difference between the third operating parameter and the first operating parameter can be a fixed value, or a fixed third operating parameter can be pre-configured. As long as the second temperature difference is detected to be higher than the first threshold, the operating parameter of the target component can be directly switched to the third operating parameter.
[0076] In this implementation, the operating parameters of the target component can be dynamically adjusted based on the temperature difference between the first temperature of the target area and the second temperature of the target area, so that the internal temperature of the electronic device will not fall below the target temperature, thereby preventing condensation from affecting the safe operation of the device.
[0077] In one implementation, the target component can operate based on its maximum operating parameters in the first state. In response to a second temperature difference between the first temperature and the target temperature being lower than a third threshold, the operating parameters of the target component can be switched from the maximum operating parameters to a fourth operating parameter, entering the second state and maintaining the second state for a set duration. The fourth operating parameter is lower than the minimum operating parameter of the target component, and the second temperature difference under the fourth operating parameter is greater than the second temperature difference under the maximum operating parameter.
[0078] The third threshold is a relatively small threshold, which can be the same as or smaller than the first threshold mentioned above. When the second temperature difference between the first temperature and the target temperature is lower than the third threshold, it indicates that the first temperature of the target area is very close to the target temperature. In this case, the cooling function of the target component is turned off so that the first temperature of the target area does not continue to drop.
[0079] For example, the driving current of the target component is in the range of 1A to 5A, that is, the minimum driving current of the target component is 1A and the maximum driving current is 5A. When the second temperature difference between the first temperature and the target temperature is lower than the third threshold, the driving current of the target component can be directly reduced to below 1A, or even no power is supplied to the target component, that is, the driving current is 0. This causes the first temperature of the target area to drop rapidly, and prevents condensation from forming inside the electronic device.
[0080] In this implementation, the target component can start the cooling function to operate at maximum power. For example, if a 5A drive current is input to the target component, and the first temperature is close to the target temperature, that is, if the second temperature difference between the first temperature and the target temperature is lower than the third threshold, the cooling function of the target component is directly turned off and maintained for a certain period of time, so that the first temperature of the target area drops rapidly and condensation is avoided in the equipment.
[0081] In applications, the target component can be powered by the system's surplus power. For example, when the electronic device is connected to an adapter, the target component is powered by the adapter instead of directly using the power already stored in the battery of the electronic device. This prioritizes the power supply needs of other components inside the electronic device and also helps to extend the battery life of the electronic device.
[0082] Figure 4 This is a flowchart of a heat dissipation control method disclosed in an embodiment of this application. Figure 4 The method shown can be applied to any of the electronic devices described in the foregoing embodiments. See also Figure 4 As shown, the heat dissipation control method may include:
[0083] Step 401: Obtain the temperature of the heat-generating component and the temperature of the heat-dissipating component.
[0084] The heat-generating component can be a chip, circuit board, resistor, etc., in an electronic device, and the heat-dissipating component can include, but is not limited to, a heat sink, heat dissipation fins, etc. The temperatures of the heat-generating component and the heat-dissipating component can be detected by different temperature sensors. The temperature sensor for detecting the heat-generating component is located near the heat-generating component, and the temperature sensor for detecting the heat-dissipating component is located near the heat-dissipating component.
[0085] Step 402: If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the first condition, the target component is controlled to enter the first state. In the first state, the target component makes the temperature of the target area the first temperature. The first condition indicates that the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component is within the first range.
[0086] Step 403: If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the second condition, control the target component to enter the second state. In the second state, the target component makes the temperature of the target area a second temperature. The second condition indicates that the first temperature difference is within a second range, and the value in the first range is greater than the value in the second range.
[0087] In this embodiment, a first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component is within a first range, indicating a relatively large temperature difference between them. The heating component needs to cool down quickly to maintain a stable performance state. Therefore, the target component enters a first state, activating its cooling function to cool the airflow flowing through the target area. The cooled airflow is then directed towards the heating component and / or the heat dissipation component, causing the temperature of the heating component to decrease rapidly. When the first temperature difference between the heating component and the heat dissipation component is within a second range, it indicates a relatively small temperature difference between them. The heat dissipation requirement of the heating component is lower than when the first temperature difference is within the first range. In this case, even without cooling, the temperature of the heating component can remain within its normal range. Therefore, the target component can enter or remain in a second state, i.e., a state without effective cooling.
[0088] The heat dissipation control method described in this embodiment can control the target component to enter a first state and activate cooling when the temperature difference between the heat-generating component and the heat-dissipating component is within a first range with a relatively large value. This causes the airflow temperature flowing through the target area to decrease, thus dissipating heat from the heat-generating component more quickly. When the temperature difference between the heat-generating component and the heat-dissipating component is within a second range with a relatively small value, the heat dissipation demand of the heat-generating component is smaller compared to when the temperature difference is within the first range. Therefore, the target component is controlled to enter a second state, which also meets the heat dissipation demand of the heat-generating component. In this implementation, the target component can dynamically adjust its operating state in response to different conditions, providing a more flexible implementation for heat dissipation control of electronic devices.
[0089] In one implementation, the heat dissipation control method may further include: obtaining a target temperature, the target temperature being a critical temperature at which water vapor condenses into dew, the value of which is determined at least based on the ambient temperature; and controlling and adjusting the operating parameters of the target component so that a first temperature of the target area is not lower than the target temperature.
[0090] The target temperature is the dew point temperature inside the electronic device. When the temperature at any point inside the electronic device is lower than this dew point temperature, condensation will occur, affecting the lifespan of various components and even the safe operation of the device. Therefore, in implementation, controlling the first temperature of the target area to be greater than or equal to the target temperature can prevent condensation inside the electronic device and ensure its safe operation.
[0091] The control adjustment of the operating parameters of the target component may include: if the second temperature difference between the first temperature and the target temperature is lower than a first threshold, controlling the reduction of the operating parameters of the target component to increase the second temperature difference; if the second temperature difference between the first temperature and the target temperature is higher than a second threshold, controlling the increase of the operating parameters of the target component to decrease the second temperature difference; wherein the first threshold is less than the second threshold.
[0092] The first threshold can be a relatively small threshold. If the second temperature difference between the first temperature and the target temperature is lower than the first threshold, it indicates that the first temperature of the target area is already close to the target temperature. If the first temperature of the target area continues to drop, condensation may be generated, affecting the operation of the equipment. Therefore, it is necessary to reduce the operating parameters of the target component to reduce its cooling efficiency so that the first temperature of the target area will not continue to drop.
[0093] The second threshold can be a relatively large threshold. If the second temperature difference between the first temperature and the target temperature is higher than the first threshold, it indicates that the first temperature of the target area is still far from the target temperature. If the first temperature of the target area continues to drop, it will not cause condensation inside the electronic device. Therefore, in order to make the electronic device have a better heat dissipation effect, the operating parameters of the target component can be increased to further improve the cooling speed or efficiency of the target component.
[0094] In one implementation, the target component operates based on its maximum operating parameters in the first state. The control adjustment of the target component's operating parameters includes: if the second temperature difference between the first temperature and the target temperature is lower than a third threshold, controlling the target component to enter the second state and maintaining it in the second state for a set duration. In the second state, the target component's operating parameters are lower than its minimum operating parameters.
[0095] The third threshold is a relatively small threshold, which can be the same as or smaller than the first threshold mentioned above. When the second temperature difference between the first temperature and the target temperature is lower than the third threshold, it indicates that the first temperature of the target area is very close to the target temperature. At this time, the cooling function of the target component is turned off, or the operating parameters provided to the target component are lower than the minimum operating parameters of the target component, so that the first temperature of the target area will not continue to drop.
[0096] In this implementation, when the target component needs to activate the cooling function, it operates at maximum power. When the first temperature approaches the target temperature, that is, when the second temperature difference between the first temperature and the target temperature is lower than the third threshold, the cooling function of the target component is directly turned off and maintained for a certain period of time, so that the first temperature of the target area drops rapidly and condensation is avoided in the equipment.
[0097] Figure 5 This is a schematic diagram illustrating the implementation process of the heat dissipation control scheme disclosed in the embodiments of this application. Combined with... Figure 5As shown in the example, an electronic device can be equipped with multiple temperature sensors to detect multiple temperatures. The detected temperatures include the chip temperature Tj, the heat sink temperature Thrp, and the target area temperature (outlet air temperature) Tair. If the difference between temperature Tj and temperature Thrp is greater than a set value of 45°C, the target component's TEC (Transmission Temperature Coefficient) activates cooling; if the difference is not greater than the set value of 45°C, the target component shuts off its cooling function. During TEC cooling, the TEC input current (adjustable from 0-5A) can be dynamically adjusted based on the chip junction temperature, and the outlet air temperature of the target area is controlled between 20-25°C. If the difference between the outlet air temperature Tair and the dew point temperature Ti is lower than a set threshold, the TEC input current is reduced; if the difference between the outlet air temperature Tair and the dew point temperature Ti is not lower than the set threshold, the TEC input current remains unchanged. This can be combined with... Figure 5 This application is implemented in accordance with the foregoing content.
[0098] For the foregoing method embodiments, in order to simplify the description, they are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.
[0099] The methods described in the above-disclosed embodiments of this application are detailed in terms of the methods. The methods of this application can be implemented by various forms of apparatus. Therefore, this application also discloses an apparatus. Specific embodiments are given below for detailed description.
[0100] The heat dissipation control device disclosed in this application may include:
[0101] Temperature acquisition module, used to acquire the temperature of heat-generating components and heat-dissipating components;
[0102] A first control module is configured to control a target component to enter a first state when the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies a first condition, wherein the target component in the first state causes the temperature of the target area to be a first temperature.
[0103] The second control module is used to control the target component to enter a second state when the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component meets a second condition, wherein the target component in the second state causes the temperature of the target area to be a second temperature.
[0104] The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
[0105] The heat dissipation control device described in this embodiment can control the target component to be in different working states under different conditions. When the first condition is met, the target component is controlled to enter the first state, so that the target area has a lower temperature, thereby reducing the temperature of the airflow flowing through the target area, so that the heat-generating component and / or heat-dissipating component it blows can dissipate heat quickly. When the second condition is met, the target component is controlled to enter the second state, and the heat dissipation requirements of the heat-generating component can also be met in this second state.
[0106] Any of the heat dissipation control devices described in the above embodiments includes a processor and a memory. The temperature acquisition module, the first control module, the second control module, etc. in the above embodiments are all stored in the memory as program modules, and the processor executes the above program modules stored in the memory to realize the corresponding functions.
[0107] The processor contains a kernel, which retrieves the corresponding program modules from memory. One or more kernels can be configured, and the processing of backtracking data can be achieved by adjusting kernel parameters.
[0108] The memory may include non-permanent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.
[0109] In an exemplary embodiment, a computer-readable storage medium is also provided, which can be directly loaded into the internal memory of a computer, and contains software code. After being loaded and executed by the computer, the computer program can implement the steps shown in any of the embodiments of the above-described heat dissipation control method.
[0110] In an exemplary embodiment, a computer program product is also provided, which can be directly loaded into the internal memory of a computer and contains software code. After being loaded and executed by the computer, the computer program can implement the steps shown in any embodiment of the heat dissipation control method described above.
[0111] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.
[0112] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0113] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.
[0114] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An electronic device, comprising: Heating components; A heat dissipation component is thermally connected to the heat-generating component; A fan, the airflow generated by the fan can pass through the target area, and the airflow generated by the fan can dissipate heat from the heat-generating component and / or the heat-dissipating component; A target component has a first state and a second state. In response to satisfying a first condition, the target component enters the first state. In response to satisfying a second condition, the target component enters the second state. In the first state, the target component enables the temperature of the target area to be a first temperature. In the second state, the target component enables the temperature of the target area to be a second temperature. The first temperature is less than the second temperature. The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
2. The electronic device according to claim 1, comprising: The detection component obtains the ambient temperature, and the electronic device is able to determine a target temperature based on the ambient temperature, wherein the target temperature characterizes the critical temperature at which water vapor condenses into dew. The first temperature is greater than or equal to the target temperature.
3. The electronic device according to claim 2, comprising: In response to the second temperature difference between the first temperature and the target temperature being lower than a first threshold, the operating parameters of the target component are switched from the first operating parameters to the second operating parameters, and the second temperature difference under the second operating parameters is greater than the second temperature difference under the first operating parameters; In response to a second temperature difference between the first temperature and the target temperature being higher than a second threshold, the operating parameters of the target component are switched from the first operating parameters to the third operating parameters, wherein the second temperature difference under the third operating parameters is less than the second temperature difference under the first operating parameters; The first threshold is less than the second threshold.
4. The electronic device according to claim 2, comprising: The target component operates based on its maximum operating parameters in the first state. In response to a second temperature difference between the first temperature and the target temperature being lower than a third threshold, the operating parameters of the target component are switched from the maximum operating parameters to a fourth operating parameter, and the component enters the second state, maintaining the second state for a set duration. The fourth operating parameter is lower than the minimum operating parameter of the target component, and the second temperature difference under the fourth operating parameter is greater than the second temperature difference under the maximum operating parameter.
5. The electronic device according to claim 1, wherein the target component is powered by the adapter when the electronic device is connected to the adapter.
6. The electronic device according to claim 1, wherein the target component has a cold end and a hot end, the fan includes a first air outlet and a second air outlet, the first air outlet is connected to the outside of the electronic device and the airflow blown out by the air outlet can dissipate heat from the hot end of the target component, and the second air outlet blows out a cooling airflow under the action of the cold end of the target component, the flow direction of the cooling airflow being toward the heat-generating component.
7. A heat dissipation control method, comprising: Obtain the temperatures of the heat-generating and heat-dissipating components; If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the first condition, the target component is controlled to enter the first state, and the target component in the first state makes the temperature of the target area the first temperature. If the first temperature difference between the temperature of the heating component and the temperature of the heat dissipation component satisfies the second condition, the target component is controlled to enter the second state, and the target component in the second state makes the temperature of the target area the second temperature. The first condition indicates that the temperature difference between the heating component and the heat dissipation component is within a first range, and the second condition indicates that the first temperature difference is within a second range, wherein the value within the first range is greater than the value within the second range.
8. The heat dissipation control method according to claim 7 further includes: Obtain a target temperature, which characterizes the critical temperature at which water vapor condenses into dew, and its value is determined at least based on the ambient temperature. The operating parameters of the target component are controlled and adjusted so that the first temperature of the target area is not lower than the target temperature.
9. The heat dissipation control method according to claim 8, wherein the control adjustment of the operating parameters of the target component includes: If the second temperature difference between the first temperature and the target temperature is lower than the first threshold, the operating parameters of the target component are controlled to be reduced so that the second temperature difference increases. If the second temperature difference between the first temperature and the target temperature is higher than the second threshold, the operating parameters of the target component are increased to reduce the second temperature difference. The first threshold is less than the second threshold.
10. The heat dissipation control method according to claim 8, wherein the target component operates based on maximum operating parameters in the first state, and the control adjustment of the operating parameters of the target component includes: If the second temperature difference between the first temperature and the target temperature is lower than the third threshold, the target component is controlled to enter the second state and maintained in the second state for a set duration; in the second state, the operating parameters of the target component are lower than its minimum operating parameters.