Heat dissipation structure for improving heat dissipation efficiency of power element and electronic load device thereof
By combining the heat dissipation element with the through-hole of the substrate, the problems of heat dissipation and installation efficiency of power components are solved, achieving efficient heat dissipation and high-density configuration, which is suitable for electronic load devices.
Patent Information
- Application Number
- CN202411359269.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, power components suffer from severe heat dissipation problems when used at high power, and traditional installation methods are time-consuming and space-consuming, making it difficult to meet the needs of high-density configurations.
The design incorporates first and second heat dissipation elements with through holes in the substrate, forming a direct heat conduction path with the power components through the protrusions, and is securely clamped by conductive sheets and connecting parts, avoiding screw fastening and improving manufacturing efficiency.
It improves heat dissipation efficiency, saves configuration space, is suitable for high-power and high-density power component configurations, and improves manufacturing yield and convenience.
Smart Images
Figure CN121772146A_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a heat dissipation structure and an electronic load device using the heat dissipation structure, and more specifically, the present invention relates to a heat dissipation structure that can be used to improve the heat dissipation performance of power components and an electronic load device using the heat dissipation structure. [Background Technology]
[0002] Power devices, such as power transistors, are suitable for handling high-power conditions with varying combinations of voltage and current. For example, metal-oxide-semiconductor field-effect transistors (MOSFETs) are a commonly used type of power transistor. Under high-power conditions, power devices generate significant heat. Therefore, the arrangement of the heat dissipation structure for these power devices becomes crucial for stable device operation.
[0003] In the prior art, when power devices use power components, they are often constrained by the heat source problem caused by the demand for high power. Therefore, the power components need to be mounted on the circuit board in a dual in-line package (DIP) to meet the power and heat dissipation requirements. However, this configuration method requires a time-consuming manufacturing process of screw fastening to configure the power components, and the overall configuration space is also limited by this manufacturing method.
[0004] Electronic load devices simulate the power environment by controlling the electron-hole channels of internal power components, allowing current to flow through these components under the current voltage conditions. This causes the MOSFETs to dissipate power and consume electrical energy. Electronic load devices are indispensable testing equipment for the development and manufacturing of power supply units. Therefore, under the demands of high-power applications and corresponding heat dissipation requirements, a configuration method that can improve the density of power transistors and heat dissipation efficiency is needed. [Summary of the Invention]
[0005] The heat dissipation structure disclosed in some embodiments and the power load device using the heat dissipation structure improve heat dissipation efficiency.
[0006] The heat dissipation structure disclosed in some embodiments and the power load device using the heat dissipation structure provide a better configuration of power components, which facilitates manufacturing and saves configuration space.
[0007] According to some embodiments, a heat dissipation structure for improving the heat dissipation efficiency of power components is disclosed, including: a first heat dissipation element and a first circuit module. The first heat dissipation element includes a first protrusion extending from a first mounting side. The first circuit module includes a first substrate disposed on the first mounting side and a first power component disposed on the first substrate. The first substrate includes a first through hole into which the first protrusion extends, so that the first protrusion supports a first polarity portion of the first power component, and the first power component forms a first heat conduction path with the first heat dissipation element through the first protrusion.
[0008] According to some embodiments, an electronic load device is disclosed, including: a first heat dissipation element, a first circuit module, a first connection portion, and a second connection portion. The first heat dissipation element includes a first mounting side and a plurality of first protrusions extending from the first mounting side. The first circuit module includes a first substrate disposed on the first mounting side, a plurality of first power elements disposed on the first substrate, and a first conductive sheet disposed above the first substrate. The first substrate includes a plurality of first through holes into which corresponding first protrusions extend, and at least one of such first power elements is supported by a corresponding first protrusion on a first polarity portion. Each first power element forms a first heat conduction path with the first heat dissipation element through its corresponding first protrusion. The first connection portion is coupled to an end of the first heat dissipation element. The second connection portion is coupled to an end of the first conductive sheet.
[0009] According to some embodiments, the system may further include: a second heat dissipation element, a second circuit module, and a plurality of conductive posts. The second heat dissipation element may include a second mounting side and a plurality of second protrusions extending from the second mounting side. The second circuit module may include a second substrate disposed on the second mounting side, a plurality of second power elements disposed on the second substrate, and a second conductive sheet disposed above the second substrate. The second substrate may include a plurality of second through holes into which corresponding second protrusions extend, and at least one of such second power elements is supported by a third polarity portion by a corresponding second protrusion. Each second power element forms a second heat conduction path with the second heat dissipation element through a corresponding second protrusion. One end of each conductive post may be connected to a first conductive sheet, and the other end of each conductive post may be connected to a second conductive sheet, allowing the second conductive sheet to be coupled to the first conductive sheet via these conductive posts. The first heat dissipation element may include a first fin side opposite to the first mounting side, and the second heat dissipation element may include a second fin side opposite to the second mounting side. The first heat dissipation element is connected to the second heat dissipation element with the second fin side facing the first fin side, and the third polarity portion of each second power element is coupled to the second heat dissipation element and a first connecting portion.
[0010] According to some embodiments, the first circuit module may include a first conductive sheet disposed above a first substrate, the first conductive sheet being able to provide downward pressure on a first side of a first power element opposite to the first polarity portion.
[0011] According to some embodiments, the second conductive sheet may be configured to provide downward pressure to the second side of the second power element opposite to each of the third polarities.
[0012] According to some embodiments, the first circuit module may include a plurality of first pads pressed between the first conductive sheet and the first side of the corresponding first power element.
[0013] According to some embodiments, the second circuit module may further include a plurality of second pads pressed between the second conductive sheet and the second side of the corresponding second power element.
[0014] According to some embodiments, the second polarity portion of each first power element is soldered onto the first substrate and coupled to the first conductive sheet and the second connection portion.
[0015] According to some embodiments, the fourth polarity portion of each second power element is soldered onto the second substrate and coupled to the second conductive sheet, and the fourth polarity portion of each second power element is coupled to the first conductive sheet and the second connecting portion through the second conductive sheet.
[0016] According to some embodiments, each first power element and each second power element can be surface-mounted onto the corresponding first substrate or second substrate.
[0017] Accordingly, the heat dissipation structure can improve heat dissipation efficiency, thus enabling its use in higher power components and / or higher power component density. In addition, it also has the advantage of ease of manufacture when used in related power supply devices such as electronic load devices. [Attached Image Description]
[0018] Figure 1 This is a three-dimensional schematic diagram of a heat dissipation structure according to some embodiments; Figure 2 for Figure 1 A schematic diagram of the cross section along line segment AA; Figure 3 for Figure 1 A three-dimensional exploded view; Figure 4 This is an exploded perspective view of a heat dissipation structure according to some other embodiments used in an electronic load device; Figure 5 This is a cross-sectional schematic diagram of a heat dissipation structure according to some embodiments used in an electronic load device; Figure 6 This is a cross-sectional schematic diagram of a heat dissipation structure used in an electronic load device according to some other embodiments.
Detailed Implementation Methods
[0019] To fully understand the purpose, features, and effects of the present invention, the present invention will now be described in detail with reference to the following specific embodiments and accompanying drawings:
[0020] In this application, the terms “a” or “an” are used to describe an element or feature. This is used for convenience only and to provide a general meaning for the scope of this document. Therefore, unless it is clearly intended otherwise, such a description should be understood to include one or at least one, and the singular includes the plural.
[0021] In this application, the terms “comprising,” “including,” “having,” or any other similar terms are not limited to the such elements or features listed herein, but may include other parts not expressly listed but which are generally inherent to the elements or features.
[0022] In this application, the ordinal terms such as "first" or "second" are used to distinguish or refer to elements or features that are related to the same or similar elements or features, and do not necessarily imply a spatial order of such elements or features. It should be understood that in some cases or configurations, ordinal terms may be used interchangeably without affecting the embodiments disclosed or associated with this application.
[0023] In this application, the term "coupled" may refer to two or more elements or features making direct physical contact with each other, or making indirect physical contact with each other, or two or more elements or features operating or acting on each other, or direct or indirect electrical (electrical or electrical signal) connection.
[0024] Please refer to Figures 1 to 3 , Figure 1 This is a three-dimensional schematic diagram of a heat dissipation structure according to some embodiments. Figure 2 for Figure 1 A schematic diagram of the cross section along line segment AA. Figure 3 for Figure 1 A three-dimensional exploded diagram.
[0025] The heat dissipation structure includes a first heat dissipation element 110 and a first circuit module 120. The first heat dissipation element 110 includes a first protrusion 113 extending from a first mounting side 111. The first circuit module 120 includes a first substrate 121 and a first power element 123. The first power element 123 is disposed on the first substrate 121 and can be coupled to a corresponding circuit of the first substrate 121. The first substrate 121 includes a first through hole 1211 penetrating the substrate body. The first substrate 121 is supported by the first heat dissipation element 110. When supported, the first protrusion 113 of the first heat dissipation element 110 can protrude into the corresponding first through hole 1211. In addition, the first protrusion 113 can be used to support the first polarity portion 1231 of the first power element 123.
[0026] The first protrusion 113 may be formed as an extension of the body of the first heat dissipation element 110, or the first protrusion 113 may be an independent body that protrudes from the first mounting side 111 by being mounted on the body of the first heat dissipation element 110. The first mounting side 111 of the first heat dissipation element 110 may be used to support the first circuit module 120. Conversely, the first mounting side 111 or other sides adjacent to the first mounting side 111 may be configured with fins or other shapes with heat dissipation capabilities, or may be combined with other cooling sources.
[0027] The bearing relationship described between the upper surface of the first protrusion 113 and the lower surface (i.e., the first polar part 1231) of the first power element 123 may include direct contact or indirect contact. For example, thermal paste may be additionally filled between the first protrusion 113 and the first polar part 1231 of the first power element 123 to increase the contact area and further improve the heat conduction efficiency, achieving indirect contact or partial indirect contact between the first protrusion 113 and the first polar part 1231 (areas where direct contact cannot be achieved by filling with thermally conductive material). On the other hand, indirect contact may also be achieved by using a thermal pad or other thermally conductive material as a medium between the first protrusion 113 and the first polar part 1231. Furthermore, when the surface flatness of the first protrusion 113 and the first polar part 1231 is sufficient, the upper surface of the first protrusion 113 may contact the lower surface of the first power element 123 solely through direct contact.
[0028] The first power element 123 can form a first heat conduction path with the first heat dissipation element 110 through the first protrusion 113. In other words, the heat or most of the heat generated when the first power element 123 is operating can be directly transferred to the first heat dissipation element 110 through the first protrusion 113 (the first protrusion 113 is like a tentacle extending from the first heat dissipation element 110) to achieve heat dissipation without having to be transferred through the first substrate 121.
[0029] The first protrusion 113 and the matching first through-hole 1211 of the first substrate 121 allow the first power component 123 to be positioned on the first substrate 121, thus forming an overall heat dissipation structure that facilitates space arrangement and saves space. Furthermore, the second polarity portion 1232 of the first power component 123 can be quickly mounted onto the first substrate 121 using soldering or surface mount technology (SMT). Compared to the time-consuming traditional method of manually tightening screws, this improves manufacturing yield and convenience, offering advantages in ease of fabrication and enhanced heat dissipation performance. Therefore, this heat dissipation structure configuration is suitable for use within the limited space of electronic devices, providing excellent heat dissipation performance and facilitating mass production.
[0030] Next, please refer to Figure 4 This is an exploded perspective view of a heat dissipation structure according to other embodiments used in an electronic load device. It includes: a first heat dissipation element 110, a first circuit module 120, a first connection portion 310, and a second connection portion 320. Figure 4 The heat dissipation structure of the embodiment is based on the foregoing Figure 1-3 The embodiments are configured with variations in the number of some components. For example, the first connecting portion 310 and the second connecting portion 320 can each be a conductive sheet, and can be attached (e.g., ...). Figure 4 Example of the first connecting part 310) or an integral part (such as Figure 4 Example of the second connection part 320).
[0031] The first heat dissipation element 110 includes a first mounting side 111 and a plurality of first protrusions 113. Each first protrusion 113 protrudes from the surface of the first mounting side 111.
[0032] The first circuit module 120 includes a first substrate 121, a plurality of first power components 123, and a first conductive sheet 125. The first substrate 121 is disposed on the first mounting side 111 of the first heat dissipation element 110, and includes a plurality of first through holes 1211 into which corresponding first protrusions 113 extend. Each first power component 123 is disposed on the first substrate 121. The first conductive sheet 125 is disposed above the first substrate 121 to allow the first power components 123 to be clamped between the first conductive sheet 125 and the first substrate 121. Further, the first polarity portion 1231 of each first power component 123 can be supported by the corresponding first protrusion 113, and the first conductive sheet 125 can provide downward pressure on the first side 1233 of the first power component 123 opposite to the first polarity portion 1231, so that the first power component 123 can be securely clamped between the first conductive sheet 125 and the first substrate 121.
[0033] The first protrusion 113 can vary depending on the arrangement of the first power element 123 on the first substrate 121. For example... Figure 4 As shown, the first power elements 123 are arranged in two rows of elongated strips on the first substrate 121, and the first protrusions 113 are also arranged in two rows, with each first protrusion 113 corresponding to support multiple first power elements 123. Figure 4 For example, each first protrusion 113 supports four first power elements 123. Furthermore, each first power element 123 can form a first heat conduction path with the first heat dissipation element 110 through its corresponding first protrusion 113, thereby... Figure 4 For example, every four first power elements 123 establish a first heat conduction path between themselves and the first heat dissipation element 110 through a corresponding first protrusion 113.
[0034] The first connecting portion 310 is coupled to the end of the first heat dissipation element 110. The second connecting portion 320 is coupled to the end of the first conductive sheet 125. Figure 4 The example electronic load device is equipped with a first conductive sheet 125, which is relatively large and has an area equivalent to that of the first substrate 121. The first conductive sheet 125 is mounted on the first substrate 121. Through the circuit layout, the second polarity portion 1232 of each first power element 123 can be coupled to the first conductive sheet 125 and the second connection portion 320. The first polarity portion 1231 of each first power element 123 is coupled to the first heat dissipation element 110 and the first connection portion 310 through the support of the corresponding first protrusion 113. The first connection portion 310 can be configured, for example, to be coupled to the positive terminal of the power supply device under test, and the second connection portion 320 is coupled to the negative terminal of the power supply device under test.
[0035] Next, please refer to the following: Figure 4 and Figure 5 , Figure 5 This is a cross-sectional schematic diagram of a heat dissipation structure used in an electronic load device according to some embodiments. Figure 5 Similar to Figure 4 In the example configuration, the first conductive sheet 125 is mounted on the first conductive sheet 125 via a first support 127. The bottom of the first support 127 can protrude through a first groove 117 on the first heat dissipation element 110, thereby allowing for a locking configuration with the first substrate 121. The first circuit module 120 also includes a plurality of first pads 1251 pressed between the first conductive sheet 125 and the first sides 1233 of the corresponding first power elements 123. The first pads 1251 can be insulating soft pads or other pads, which can be used to apply downward pressure to each of the first conductive sheets 125 more evenly.
[0036] Next, please refer to Figure 6This is a cross-sectional schematic diagram of a heat dissipation structure used in an electronic load device according to some other embodiments. Compared to Figure 5 Implementation examples, Figure 6 The example shown is a heat dissipation structure with a second set configured in Figure 5 Below the first set of heat dissipation structures, to form Figure 6 Example configuration of an electronic load device with a greater number of power components. For simplicity, the illustrations are shown below. Figure 5 The component symbols already marked in the text, Figure 6 The same components will not be marked again.
[0037] Figure 6 The second heat dissipation structure illustrated includes a second heat dissipation element 210 and a second circuit module 220. The second heat dissipation element 210 includes a second mounting side 211 and a plurality of second protrusions 213 (similar to...). Figure 4 (The example includes a plurality of first protrusions 113). Each second protrusion 213 protrudes from the surface of the second mounting side 211.
[0038] The second circuit module 220 includes a second substrate 221, a plurality of second power components 223, and a second conductive sheet 225. The second substrate 221 is disposed on the second mounting side 211 of the second heat dissipation element 210, and includes a plurality of second through holes 2211 into which corresponding second protrusions 213 extend. Each second power component 223 is disposed on the second substrate 221. The second conductive sheet 225 is disposed above the second substrate 221 to allow the second power components 223 to be clamped between the second conductive sheet 225 and the second substrate 221. Further, the third polarity portion 2231 of each second power component 223 can be supported by the corresponding second protrusion 213, and the second conductive sheet 225 can provide downward pressure on the second side 2233 of the second power component 223 opposite to the third polarity portion 2231, so that the second power component 223 can be securely clamped between the second conductive sheet 225 and the second substrate 221.
[0039] Each second power element 223 can form a second heat conduction path with the second heat dissipation element 210 through a corresponding second protrusion 213, similar to... Figure 4 For example, Figure 6 The second power element 223 can also be configured such that every four second power elements 223 establish a second heat conduction path between them and the second heat dissipation element 210 through a corresponding second protrusion 213.
[0040] Please refer to the following at the same time Figure 5 and Figure 6The second heat dissipation element 210 includes a second fin side 215 opposite to the second mounting side 211, and the first heat dissipation element 110 includes a first fin side 115 opposite to the first mounting side 111. The first heat dissipation element 110 is connected to the second heat dissipation element 210 (e.g., by matching structural shapes or other means), and the second fin side 215 faces the first fin side 115. The third polarity portion 2231 of each second power element 223 is coupled to the second heat dissipation element 210. Since the second heat dissipation element 210 is connected to the first heat dissipation element 110, the third polarity portion 2231 of each second power element 223 can be coupled to the first connection portion 310 (which can be referred to together) through the second heat dissipation element 210 and the first heat dissipation element 110. Figure 4 It can then be configured to be coupled to the positive terminal of the power supply device under test.
[0041] Apart from Figure 5 Examples have similarity to Figure 4 In addition to the configuration of the embodiment, Figure 6 Examples also include similar ones Figure 4 Configuration of the Implementation Example ( Figure 4 (Example: first groove 117). Figure 6 In the example, the second conductive sheet 225 is mounted on the second conductive sheet 225 via the second bracket 227. The bottom of the second bracket 227 can protrude through the second groove 217 on the second heat dissipation element 210, thereby allowing for a locking configuration with the second substrate 221.
[0042] On the other hand, a plurality of conductive posts 330 are also included between the first and second heat dissipation structures. One end of each conductive post 330 is connected to the first conductive sheet 125, and the other end of each conductive post 330 is connected to the second conductive sheet 225. Through these conductive posts 330, the downward pressure provided by the first conductive sheet 125 and the second conductive sheet 225 to the corresponding power components can be more effectively ensured, wherein each second pad 2251 is pressed against the second conductive sheet 225 and the second side 2233 of the corresponding second power component 223. In addition, based on the support of the first protrusion 113 or the second protrusion 213 corresponding to each power component, each power component can be securely fixed in the heat dissipation structure without any screws. Furthermore, in this architecture, both the second polarity portion 1232 of the first power component 123 and the fourth polarity portion 2232 of the second power component 223 can be quickly disposed on the corresponding substrate by soldering or surface mount technology (SMT). Compared to the traditional time-consuming processing method that requires additional manual tightening of screws, this improves manufacturing yield and convenience. In other words, it achieves the advantages of ease of manufacture and improved heat dissipation performance.
[0043] In summary, each power element can be configured using various heat dissipation structures in the embodiments, directly establishing a heat conduction path at the bottom electrode of each power element, thereby improving heat dissipation efficiency and providing ease of fabrication. This allows electronic load devices or other electronic devices using power elements to be compatible with higher power and / or more power elements.
[0044] Preferred embodiments have been disclosed above. However, those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention. It should be noted that all equivalent variations and substitutions to the embodiments are to be understood as falling within the scope of this invention. Therefore, the scope of protection of this invention is determined by the scope of the claims. [Attached image labels]
[0045] 110 First heat dissipation element 111 First Installation Side 113 First protrusion 115 First fin side 117 First Groove 120 First Circuit Module 121 First substrate 1211 First Through Hole 123 First power element 1231 First Polarity Section 1232 Second Polarity Section 1233 First side 125 First conductive sheet 1251 First cushion 127 First support 210 Second heat dissipation element 211 Second Installation Side 213 Second protrusion 215 Second fin side 217 Second Groove 220 Second Circuit Module 221 Second substrate 2211 Second Through Hole 223 Second power element 2231 Third Polarity Section 2232 Fourth Polarity Section 2233 Second side 225 Second conductive sheet 2251 Second cushion 227 Second stent 310 First connecting part 320 Second connecting part 330 conductive pillar
Claims
1. A heat dissipation structure for improving the heat dissipation efficiency of power components, comprising: A first heat dissipation element includes a first protrusion extending from a first mounting side; and A first circuit module includes a first substrate disposed on the first mounting side and a first power element disposed on the first substrate, wherein the first substrate includes a first through hole into which a first protrusion extends, so that the first protrusion supports a first polar portion of the first power element, and the first power element forms a first heat conduction path between the first protrusion and the first heat dissipation element.
2. The heat dissipation structure as described in claim 1, wherein, The first circuit module further includes a first conductive sheet disposed above the first substrate, the first conductive sheet providing downward pressure to a first side of the first power element opposite to the first polarity portion.
3. The heat dissipation structure as described in claim 2, wherein, The first circuit module further includes a first pad that is pressed against the first conductive sheet and the first side.
4. The heat dissipation structure as described in any one of claims 1-3, wherein, A second polarity portion of the first power element is soldered onto the first substrate.
5. An electronic load device, comprising: A first heat dissipation element includes a first mounting side and a plurality of first protrusions extending from the first mounting side; A first circuit module includes a first substrate disposed on the first mounting side, a plurality of first power components disposed on the first substrate, and a first conductive sheet disposed above the first substrate. The first substrate includes a plurality of first through holes into which corresponding first protrusions extend. At least one of the plurality of first power components is supported by a corresponding first protrusion on a first polarity portion. Each first power component forms a first heat conduction path with the first heat dissipation element through the corresponding first protrusion. A first connecting portion, coupled to one end of the first heat dissipation element; and A second connecting portion is coupled to one end of the first conductive sheet.
6. The electronic load device as claimed in claim 5, wherein, The first conductive sheet is configured to provide downward pressure to a first side of the plurality of first power elements opposite to each of the first polarities.
7. The electronic load device as claimed in claim 6, wherein, The first circuit module further includes a plurality of first pads pressed between the first conductive sheet and the first side of each of the corresponding first power elements.
8. The electronic load device as claimed in claim 7, wherein, A second polarity portion of each of the first power elements is soldered onto the first substrate and coupled to the first conductive sheet and the second connection portion.
9. The electronic load device as described in any one of claims 5-8, wherein, It further includes: A second heat dissipation element includes a second mounting side and a plurality of second protrusions extending from the second mounting side; A second circuit module includes a second substrate disposed on a second mounting side, a plurality of second power components disposed on the second substrate, and a second conductive sheet disposed above the second substrate. The second substrate includes a plurality of second through holes into which corresponding second protrusions extend. At least one of the plurality of second power components is supported by a corresponding second protrusion on a third polarity portion. Each second power component forms a second heat conduction path with a second heat dissipation element through a corresponding second protrusion. A plurality of conductive posts are provided, one end of each conductive post being connected to the first conductive sheet, and the other end of each conductive post being connected to the second conductive sheet. The second conductive sheet is coupled to the first conductive sheet through the plurality of conductive posts. The first heat dissipation element includes a first fin side opposite to the first mounting side, and the second heat dissipation element includes a second fin side opposite to the second mounting side. The first heat dissipation element is connected to the second heat dissipation element and the second fin side faces the first fin side. The third polarity portion of each second power element is coupled to the second heat dissipation element and the first connection portion.
10. The electronic load device as claimed in claim 9, wherein, The second conductive sheet is configured to provide downward pressure to a second side of the plurality of second power elements opposite to each of the third polarities.
11. The electronic load device as claimed in claim 10, wherein, The second circuit module further includes a plurality of second pads pressed between the second conductive sheet and the second side of the corresponding second power element.
12. The electronic load device as claimed in claim 11, wherein, A fourth polarity portion of each of the second power elements is soldered to the second substrate and coupled to the second conductive sheet, and the fourth polarity portion of each of the second power elements is coupled to the first conductive sheet and the second connection portion through the second conductive sheet.
13. The electronic load device as claimed in claim 12, wherein, Each of the first power components and each of the second power components are surface-mounted onto the corresponding first substrate or second substrate.