Lighting device and lamp

Abstract

A lighting device according to an embodiment of the present invention comprises: a support plate; the circuit board is arranged on the supporting plate; the plurality of bonding pads are arranged on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bond pads; a plurality of connection members connecting the plurality of pads to the plurality of bond pads, respectively; and a plurality of molded portions covering different regions of at least one of the plurality of connecting members, in which an uppermost end of at least one of the plurality of molded portions may be disposed at a position higher than a highest point of the plurality of connecting members with respect to an upper surface of the circuit board.

Description

Technical Field

[0001] The embodiments relate to lighting devices and lamps. Background Technology

[0002] Lighting applications include automotive lights and backlighting for displays and signs. Compared to conventional light sources such as fluorescent and incandescent lamps, light-emitting elements such as light-emitting diodes (LEDs) offer advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These LEDs are used in various display devices, such as indoor or outdoor lighting fixtures. Recently, LED-based lamps have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs have the advantage of low power consumption. However, due to the small emission angle of the light emitted from LEDs, the luminous area of ​​the LED lamp needs to be increased when using LEDs as automotive lights. Summary of the Invention

[0003] Technical issues

[0004] Embodiments of the present invention provide a lighting module and a lighting device having a component for fixing at least a portion of a connecting member electrically connecting a light source part to a circuit board. Embodiments of the present invention also provide a lighting module and a lighting device having a component for fixing a portion or all of a plurality of connecting members electrically connecting a light source part to a circuit board.

[0005] Embodiments of the present invention provide a lighting module and a lighting device having a component for fixing a portion of one or more wires to at least one region on the upper surface of a circuit board or the upper surface of a support plate. Embodiments of the present invention also provide a lighting device and a lamp or automotive lamp having the lighting device.

[0006] Technical solution

[0007] The lighting device according to an embodiment of the present invention includes: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light-emitting device and a plurality of bonding pads; a plurality of connecting members, the plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding portions, the plurality of molding portions covering different areas of at least one of the plurality of connecting members, wherein the uppermost end of at least one of the plurality of molding portions may be configured to be positioned above the highest point of the plurality of connecting members with reference to the upper surface of the circuit board.

[0008] According to an embodiment of the present invention, a plurality of pads include a first pad and a second pad adjacent to the light source portion, and a plurality of bonding pads include a first bonding pad and a second bonding pad adjacent to the circuit board. A plurality of connecting members include a first connecting member connecting the first pad and the first bonding pad and a second connecting member connecting the second pad and the second bonding pad. The uppermost end of at least one of the plurality of molding portions may be configured to be at a position higher than the highest point of the first connecting member and the second connecting member, with the upper surface of the circuit board as a reference.

[0009] According to an embodiment of the present invention, a plurality of molding portions include a first molding portion and a second molding portion. The first molding portion is disposed at a first end of a first connecting member connected to a first pad of a light source portion, and the second molding portion is disposed at a first end of a second connecting member connected to a second pad of a light source portion.

[0010] According to an embodiment of the present invention, the first molding portion and the second molding portion may be connected to each other in the area between the first pad and the second pad.

[0011] According to an embodiment of the present invention, the area where the first molding portion and the second molding portion are connected to each other can extend to the area between the light source portion and the circuit board, and cover the middle line portion of the first connecting member and the second connecting member.

[0012] According to an embodiment of the present invention, the plurality of molding portions include a third molding portion and a fourth molding portion, the third molding portion being disposed at the second end of a first connecting member connected to a first bonding pad of a circuit board, and the fourth molding portion being disposed at the second end of a second connecting member connected to a second bonding pad of a circuit board.

[0013] According to an embodiment of the present invention, the third molding portion and the fourth molding portion may be connected to each other in the region between the first bonding pad and the second bonding pad on the circuit board. The regions of the third molding portion and the fourth molding portion connected to each other extend to the region between the light source portion and the circuit board, and may cover the center line portion of the first connecting member and the second connecting member. The plurality of molding portions may include a central molding portion disposed on the intermediate connecting portion between the first end and the second end of the first connecting member and the second connecting member.

[0014] According to an embodiment of the present invention, the first connecting member and the second connecting member include a first end connected to a first pad and a second pad of the light source portion, a second end connected to a first bonding pad and a second bonding pad of the circuit board respectively, and a middle line portion between the first end and the second end, wherein the plurality of molding portions include a first molding portion covering the first end, the middle line portion and the second end of the first connecting member, and a second molding portion covering the first end, the middle line portion and the second end of the second connecting member.

[0015] According to embodiments of the present invention, a first connecting portion may be included to connect the first molding portion and the second molding portion to each other on the light source portion. A second connecting portion may be included to connect the first molding portion and the second molding portion to each other on the circuit board. The support plate may include a concave receiving portion to accommodate the circuit board. According to embodiments of the present invention, each of the plurality of connecting members may be a strip line whose width is greater than twice its thickness.

[0016] A lamp according to an embodiment of the present invention includes: an illumination device that emits white light; and a light guiding module or reflector on the illumination device, wherein the illumination device may include the illumination device disclosed above.

[0017] Beneficial effects

[0018] According to embodiments of the present invention, by supporting and fixing part or all of the connecting members between the light source and the circuit board, deformation and breakage of the connecting members can be prevented, thereby improving electrical reliability caused by the connecting members. According to embodiments of the present invention, part or all of the connecting members connecting the light source and the circuit board are molded by a molding part, thereby preventing flow of the connecting members and blocking electrical contact between the connecting members and the pads, and suppressing any openings or cracks that may occur in the joint between the connecting members and the pads.

[0019] Embodiments of the present invention can improve the reliability of lighting modules and lighting devices including such lighting modules. Attached Figure Description

[0020] Figure 1a This is a perspective view of the lighting device according to the present invention.

[0021] Figure 1b yes Figure 1a A sectional side view of the lighting device.

[0022] Figure 2 It is shown Figure 1a Enlarged view of the light source, circuit board and connecting components.

[0023] Figure 3 (A) and Figure 3 (B) is shown Figure 2 The figure shows an example of a tensile test and crack occurrence of a connecting component.

[0024] Figure 4a This is a perspective view of a lighting device according to a first embodiment of the present invention.

[0025] Figure 4b yes Figure 4a An example of a top view of a lighting device.

[0026] Figure 4c It is shown Figure 4a A perspective view of the connecting components and fixing frame of the lighting device.

[0027] Figure 5 yes Figure 4a Example of a cross-sectional side view of a lighting device.

[0028] Figure 6a This is a first variation of the lighting device according to the first embodiment of the present invention.

[0029] Figure 6b It is shown Figure 6a A diagram of the light source and the fixed frame.

[0030] Figure 7 This is a second variation of the lighting device according to the first embodiment of the present invention.

[0031] Figure 8 It is shown Figure 7 A diagram showing an example of a fixed frame for a lighting device.

[0032] Figure 9 This is a plan view of a lighting device according to a second embodiment of the present invention.

[0033] Figure 10 It is shown Figure 9 A diagram of the molded part, connecting components, and solder pads of the lighting device.

[0034] Figure 11 yes Figure 9 Example of a cross-sectional side view of a lighting device.

[0035] Figure 12 yes Figure 9 The first variation of the lighting device.

[0036] Figure 13 yes Figure 9 The second variation of the lighting device.

[0037] Figure 14 yes Figure 9 The third variation of the lighting device.

[0038] Figure 15 yes Figure 9 The fourth variation of the lighting device.

[0039] Figure 16 yes Figure 15 Example of a cross-sectional side view of a lighting device.

[0040] Figure 17 yes Figure 9 The fifth variation of the lighting device.

[0041] Figure 18 yes Figure 9 The sixth variation of the lighting device.

[0042] Figure 19 yes Figure 9 The seventh variation of the lighting device.

[0043] Figure 20 yes Figure 9 The eighth variation of the lighting device.

[0044] Figure 21 yes Figure 9 The ninth variation of the lighting device.

[0045] Figure 22a yes Figure 11 Another example of a lighting device.

[0046] Figure 22b yes Figure 11 Another example of the light source section of a lighting device.

[0047] Figure 23 (A) to Figure 23 (D) is a plan view showing an example of the shape of a molded portion covering the end of a connecting member on a pad according to a second embodiment of the present invention.

[0048] Figure 24 This is an example of combining a light guiding module with a lighting device according to a first embodiment of the present invention.

[0049] Figure 25 yes Figure 24 Example of a cross-sectional side view of a lighting device.

[0050] Figure 26 Is with Figure 11 An example of a cross-sectional side view of a lighting device combined with a light-guiding module.

[0051] Figure 27 This is a perspective view of a headlight of an application lighting device according to an embodiment of the present invention.

[0052] Figure 28 This is a cross-sectional view of an illumination device with a reflector according to an embodiment of the present invention. Detailed Implementation

[0053] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The technical concept of the invention is not limited to a subset of the described embodiments, but can be implemented in various different forms, and one or more of its components can be selectively combined and substituted among embodiments if within the scope of the technical concept of the invention. Furthermore, unless explicitly defined and described, the terminology (including technical and scientific terms) used in the embodiments of the invention can be interpreted as having a meaning commonly understood by one of ordinary skill in the art, and commonly used terms (such as those defined in dictionaries) can be interpreted in the context of the relevant art.

[0054] The terminology used in embodiments of the present invention is for describing embodiments and is not intended to limit the invention. In this specification, the singular form may include the plural form unless specifically described in the wording, and when described as “at least one (or more than one) of A and / or B and C,” it may include at least one of all combinations that can be formed as A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of embodiments of the present invention. These terms are intended only to distinguish a component from other components and are not determined by their nature, order, or sequence. Furthermore, when a component is described as “connected,” “joined,” or “attached” to another component, this can be not only when the component is directly connected, joined, or attached to another component, but also due to another component “connected,” “joined,” or “attached” between the component and the other component. Furthermore, when components are described as being formed or disposed “above” or “below,” this includes not only the case where two components are in direct contact with each other, but also the case where one or more components are formed or disposed between two components. Furthermore, when expressed as "above" or "below", it can include not only the upward direction based on a component but also the downward direction based on a component.

[0055] <Lighting device>

[0056] Figure 1a This is a perspective view of the lighting device according to the present invention. Figure 1b yes Figure 1a A sectional side view of the lighting device, and Figure 2 It is shown Figure 1a Enlarged view of the light source, circuit board and connecting components.

[0057] Reference Figure 1a , Figure 1b and Figure 2The lighting device 1000 may include a support plate 101, a circuit board 110 disposed on a first region of the support plate 101, a light source 130 disposed on a second region of the support plate 101, and connecting members 141 and 142 electrically connecting the light source 130 and the circuit board 110. The lighting device 1000 can be applied to various lighting devices requiring illumination, such as vehicle lights, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lights, the lighting device can be used for headlights, side mirror lights, side marker lights, fog lights, taillights, brake lights, daytime running lights, vehicle interior lights, door trim lights, rear combination lights, reversing lights, etc. The lighting device can also be used for indoor and outdoor advertising devices, display devices, and various tram depots. The lighting device 1000 can be used, for example, as a headlight.

[0058] In the lighting device 1000, the light source unit 130 and the circuit board 110 can be spaced apart in any direction (e.g., the second direction Y in the first direction X and the second direction Y). The first direction X and the second direction Y are directions orthogonal to each other, and the third direction Z is a direction orthogonal to the first direction X and the second direction Y, and the third direction Z can be a perpendicular direction.

[0059] The support plate 101 supports the circuit board 110 and the light source unit 130, and can conduct heat generated from the circuit board 110 and the light source unit 130. The support plate 101 can be a heat sink. The support plate 101 can be made of metal, or it can be formed by a laminated structure of thermally conductive material and metal layers. The support plate 101 can be formed as a single layer or multiple layers. The thermally conductive material can include ceramic materials, AlN, or aluminum materials with an anodized surface layer. The metal can include at least one of Al, Ni, Mo, Cu, Cu alloy, Cu-W, Ag, or Au, and can be a single layer or a multilayer of two or more metals. The support plate 101 may further include heat sinks at its lower part.

[0060] The support plate 101 includes an upper portion 102 and a side portion 103, and the upper surface area of ​​the upper portion 102 can be set to be larger than the area of ​​the circuit board 110, for example, more than twice, or more than ten times. The side portion 103 can be bent downward from the edge of the upper portion 102, and one or more can be arranged along the outer side of the upper portion 102. Here, the downward direction is the direction opposite to the direction in which the circuit board 110 is disposed on the upper surface of the support plate 101. Empty spaces can be provided on the inner side of the side portion 103 and the lower side of the upper portion 102, or structures such as heat sinks can be combined. In the region of the upper portion 102, a plurality of mounting holes 105 and 106 arranged on both sides of the light source portion 130 in the second direction Y can be arranged in the first direction X. Such as the light guiding module 500 (see Figure 24 The external structure of the ) can be connected to the support plate 101 through the connecting holes 105 and 106.

[0061] A light source 130 is disposed on one region of the upper portion 102 of the support plate 101, and a circuit board 110 is disposed on another region of the upper portion 102. The light source 130 may be disposed on one side of the circuit board 110. The light source 130 is disposed on the support plate 101 and may be attached by an adhesive member 138. The adhesive member 138 includes a thermally conductive adhesive member and may be made of an electrically insulating material such as silicone or epoxy resin. The lower surface of the light source 130 may adhere to the upper surface of the support plate 101, or may adhere to a region lower than the upper surface of the support plate 101. The adhesive member 138 may adhere the light source 130 to the upper portion 102. The adhesive member 138 is disposed on the lower surface of the light source 130, protrudes outward from the side surface of the light source 130, and may adhere to the lower side of the light source 130. The adhesive member 138 may conduct heat generated from the light source 130 to the support plate 101.

[0062] The circuit board 110 may comprise resin or metal materials. The circuit board 110 may be formed from any of the following: ceramic-based PCB, metal-core PCB (MCPCB), flexible PCB (FPCB), and resin-based PCB. Figure 5 As shown, the circuit board 110 may include a lower metal layer 110A, a circuit layer (not shown) with pads 111 and 112 on the upper part, a protective layer 110B made of insulating material to protect the circuit layer, and an insulating layer 110C located between the metal layer 110A and the pads 111 and 112. The circuit board 110 may be configured as an MCPCB with a metal layer on the lower part and may transfer heat to the support plate 101.

[0063] Here, the circuit board 110 can be fastened to the upper portion 102 by a fastening device 119, and the fastening device 119 may include one or more bolts for securing the circuit board 110 and bringing it into close contact with the upper portion 102. As another example, the fastening device 119 may include a fastening structure and / or a locking structure. An adhesive film 118 can adhere the circuit board 110 to the upper portion 102 and may be a heat-conducting material. When the circuit board 110 is secured by the fastening device 119, the adhesive film 118 can be removed, and the circuit board 110 can be easily separated. The circuit board 110 can be secured to the upper surface of the support plate 101 using at least one or both of the fastening device 119 or the adhesive film 118.

[0064] The pads 111 and 112 of the circuit board 110 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 can be connected to a connector 115 disposed on the upper surface of the circuit board 110 via a circuit layer of the circuit board 110. The connector 115 can receive drive signals and power from the outside. The pads 111 and 112 may be disposed on one side of the circuit board 110, and the connector 115 may be coupled to the other side of the circuit board 110. A fastening device 119 may be disposed in the area between the pads 111 and 112 and the connector 115. The first pad 111 and the second pad 112 are disposed adjacent to one side of the circuit board 110 and may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and their optional alloys. The first pad 111 and the second pad 112 each include a single layer or multiple layers, and in the case of multiple layers, they may include the same or different metals. The circuit board 110 has a protective layer 110B on the metal layer 110A, and the protective layer 110B can protect the pads 111 and 112 and the circuit layer, and can open the bonding area or upper surface area of ​​the pads 111 and 112. The protective layer 110B can be an insulating material, such as solder resist material, that partially exposes the pads 111 and 112.

[0065] The light source 130 can be bonded to the upper part 102 of the support plate 101 using an adhesive member 138. The adhesive member 138 conducts heat generated from the light source 130 to the support plate 101. The adhesive member 138 may include a thermally conductive adhesive material containing metal or inorganic powder within a resin material, such as a thermal interface material (TIM). A side surface of the light source 130 may face a portion of the side surface of the circuit board 110. The light source 130 and the circuit board 110 may be electrically connected. The light source 130 and the circuit board 110 may be connected to at least one connecting member 141 and 142. The light source 130 may include an OLED or an LED. When powered by the circuit board 110, the light source 130 is driven and emits at least one or more of blue, green, red, and white light. For example, the light source 130 may emit white light.

[0066] The bonding pads 134 and 135 of the light source section 130 are provided on one side adjacent to the circuit board 110. The pads 111 and 112 of the circuit board 110 are provided on the other side adjacent to the light source section 130. The bonding pads 134 and 135 of the light source section 130 can be provided close to the circuit board 110 within the area of ​​the light source section 130.

[0067] Due to the thickness of the circuit board 110, its upper surface can be configured to be higher than the upper surface of the light source section 130. Additionally, the upper surfaces of the pads 111 and 112 of the circuit board 110 can be configured to be higher than the upper surfaces of the bonding pads 134 and 135 of the light source section 130. As another example, such as... Figure 22a As shown, the lower surface of the circuit board 110 can be placed inside the storage section 108, which is located below the upper surface of the support plate 101 on which the light source section 130 is provided.

[0068] The pads of the circuit board 110 may include a first pad 111 and a second pad 112 spaced apart from each other, and the bonding pads of the light source section 130 may include a first bonding pad 134 and a second bonding pad 135 spaced apart from each other. Connecting members 141 and 142 may include a first connecting member 141 and a second connecting member 142 spaced apart from each other. The first pad 111 and the first bonding pad 134 are connected to the first connecting member 141, and the second connecting member 141 may be connected to the second pad 112 and the second bonding pad 135. Although each of the pads 111 and 112, the bonding pads 134 and 135, and the connecting members 141 and 142 is described as two, it may vary to one, three, or four depending on the connection type. Furthermore, the pads 111 and 112, the bonding pads 134 and 135, and the connecting members 141 and 142 are described as having the same number, but at least one may have a different number. For example, the lower end of the light source section 130 may be electrically connected to the support plate 101 through a through-hole structure. In this case, the number of pads 134 and 135, pads 111 and 112, and connecting members 141 and 142 can be reduced to one.

[0069] The first bonding pad 134 can be used as a cathode terminal, and the second bonding pad 135 can be used as an anode terminal. The first bonding pad 134 and the second bonding pad 135 can be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au, and selective alloys thereof. The first bonding pad 134 and the second bonding pad 135 can comprise a single layer or multiple layers, and in the case of multiple layers, they can comprise the same or different metals.

[0070] The first connecting member 141 and the second connecting member 142 may include conductive wires, and may include, for example, at least one metal, such as Au, Cu, Al, Ag, or a selective alloy thereof. The first connecting member 141 and the second connecting member 142 are wider wires, such as strips, whose width is greater than their thickness, and the width W of each may be greater than 0.4 mm, for example, in the range of 0.4 mm to 0.9 mm, and the thickness may be less than 0.15 mm, for example, in the range of 0.07 mm to 0.15 mm. The width W of each of the first connecting member 141 and the second connecting member 142 may be greater than twice the thickness of the connecting members 141 and 142, for example, greater than twice and less than 15 times. When the width W is less than the above range, the connecting members 141 and 142 may tilt downwards, the bonding strength may decrease, the available current may decrease, and the resistance to external forces may weaken. In addition, when the width W of the connecting members 141 and 142 is greater than the above range, there is a problem of increased size or material waste of the bonding pads 134 and 135 or pads 111 and 112.

[0071] The first connecting member 141 and the second connecting member 142 each include a first end 41, a second end 43, and a center line portion 42. The first end 41 is respectively bonded to a first bonding pad 134 and a second bonding pad 135, and the second end 43 is respectively bonded to a first pad 111 and a second pad 112. The center line portion 42 connects the first end 41 and the second end 43 and may have a curved shape. The center line portion 42 may have, for example, a raised curved shape. The center line portion 42 of the first connecting member 141 may connect between the first end 41 bonded to the first bonding pad 134 and the second end 43 bonded to the first pad 111. The center line portion 42 of the second connecting member 142 may connect between the first end 41 bonded to the second bonding pad 135 and the second end 43 bonded to the second pad 112. The center line portion 42 may extend from the other side of the light source portion 130 to one side of the circuit board 110. The center line portion 42 may have a length greater than the distance between the circuit board 110 and the light source portion 130.

[0072] The heights of the upper surfaces of the first end 41 and the second end 43 of the connecting members 141 and 142 can be different from each other. For example, the height of the upper surface of the first end 41 of the connecting members 141 and 142 can be set lower than the height of the upper surface of the second end 43, and the height of the highest point of the intermediate line portion 42 can be higher than the height of the upper surface of the first end 41 of the connecting members 141 and 142, and can be set to a position higher than the upper surface of the first end 41. The height of the highest point of the intermediate line portion 42 can be set higher than the upper surface of the second end 43.

[0073] The first connecting member 141 and the second connecting member 142 may be parallel or non-parallel to each other. When the first connecting member 141 and the second connecting member 142 are parallel to each other, the interval between the first ends 41 and the interval between the second ends 43 of the first connecting member 141 and the second connecting member 142 may be the same. The interval between the middle line portions 42 of the first connecting member 141 and the second connecting member 142 may be the same as the interval between the first ends 41 and the interval between the second ends 43.

[0074] When the first connecting member 141 and the second connecting member 142 are not parallel to each other, the spacing between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be different from the spacing between the second ends 43. For example, as Figure 10 As shown, the interval E1 between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be smaller than the interval E2 between the second ends 43. In this case, the virtual straight lines extending along the first connecting member 141 and the second connecting member 142 can intersect each other.

[0075] like Figure 2 and Figure 3 As shown, the height difference between the upper surface of the support plate 101 and the first connecting member 141 and the second connecting member 142 occurs between the first end 41 and the second end 43 of the upper surface of the support plate 101. When the first end 41 and the second end 43 are respectively bonded to pads 111 and 112 and to pads 134 and 135, poor bonding or opening failure may occur at each of the ends 41 and 43 due to the height difference between the first end 41 and the second end 43 of the first connecting member 141 and the second connecting member 142. The bonding can be performed by an ultrasonic welding process, which generates heat of over 200 degrees Celsius.

[0076] In addition, such as Figure 3As shown in (A), when a wire breakage test is performed after the joining of connecting members 141 and 142, opening defects may occur at the connection or / and bend between the second end 43 of connecting members 141 and 142 and the intermediate line portion 42 due to root cracks, or boundary cracks may occur at the boundary between the first end 41 or the second end 43 and the pads 111 and 112 or the joining pads 134 and 135. To prevent opening defects in connecting members 141 and 142, the design takes into account the straight-line distance between the first end 41 and the second end 43, the angle of inclination extending from the first end 41 to the intermediate line portion 42, and the angle of inclination extending from the second end 43 to the intermediate line portion 42. However, when there are large temperature changes or external impacts, cracks may occur at the boundary between the intermediate line portion 42 and the first end 41 and the second end 43 of connecting members 141 and 142. In other words, it can be seen that the joint where the wire bends during welding is most susceptible to external forces and environmental influences.

[0077] Embodiments of the present invention may provide a component having a molded portion of resin material on at least one of the following: region A1 of the first end 41, region A2 of the intermediate line portion 42, or region A3 of the second end 43 of the connecting components 141 and 142. The component with the molded portion can mold at least one or both of the following regions: region A1 of the first end 41, region A2 of the intermediate line portion 42, or region A3 of the second end 43 of the connecting components 141 and 142, and fix at least a portion of the connecting components 141 and 142 to prevent external impact, or to inhibit moisture penetration into regions A1 and A3 of the first end 41 and the second end 42 to prevent metal oxidation. The molded portion can mold at least one or both of the first end 41, intermediate line portion 42, and second end 43 of the first connecting component 141. The molded portion can mold at least one or both of the first end 41, intermediate line portion 42, and second end 43 of the second connecting component 142. The component with the molded portion can be made of a material with a low modulus of elasticity. In this case, the stress transmitted to the line can be reduced, and the bonding strength of the joint portion can be increased. When evaluating the line bond strength (permissible strength) throughout the test, the standard bond strength is approximately 135 gf per bonded area, and when molded into a component with a molded portion, it is greater than twice the standard bond strength. The molded portion or the component with a molded portion will be described in detail in the embodiments described later.

[0078] Figures 4a to 4c and Figure 5 This is an example of a lighting device according to the first embodiment of the present invention.

[0079] like Figures 4a to 4c and Figure 5As shown, the lighting device 1000 includes a support plate 101, a circuit board 110 and a light source 130 on the support plate 101, connecting members 141 and 142 connecting the light source 130 and the circuit board 110, and a fixing member 120 having a molded part 122 covering a portion of the connecting members 141 and 142.

[0080] The light source unit 130 includes a support member 133 and a light-emitting device 131 disposed on the support member 133, and the light-emitting device 131 may include one or more light-emitting devices. The light source unit 130 may include a resin member 132, which may be disposed around the light-emitting device 131.

[0081] The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may be provided as a ceramic layer or a metal layer. The support member 133 can conduct heat generated from the light-emitting device 131 through the support plate 101. The support member 133 may be attached to the support plate 101 using an adhesive member 138. The adhesive member 138 may contact along the lower surface and sides of the support member 133. Because the adhesive member 138 contacts the lower surface and sides of the support member 133, the heat generated through the support member 133 can be conducted to the support plate 101.

[0082] The support member 133 can support the light-emitting device 131 and may include conductive patterns electrically connected to the light-emitting device 131. The light source section 130 may have the light-emitting device 131 on one side and bonding pads 134, 135 on the other side. The light-emitting device 131 may be disposed on one side of the support member 131, and the bonding pads 134, 135 may be disposed on the other side of the support member 131. The height of the upper surface of the bonding pads 134 and 135 may be higher than the height of the upper surface of the resin member 132, or may be disposed at the same height as the upper surface of the resin member 132. A protective device (not shown) may be disposed on the support member 133 to protect the light-emitting device 131, and the protective device may be implemented as a thyristor, Zener diode, or transient voltage suppressor (TVS), and may protect the light-emitting device 131 from electrostatic discharge (ESD).

[0083] The light-emitting device 131 may include at least one of a blue LED chip, a green LED chip, or a red LED chip. The light-emitting device 131 may be configured as a vertical, horizontal, or flip-chip. The light-emitting device 131 may include a package having an LED chip and a molded component made of a transparent resin material disposed on the LED chip. The resin component 132 may be formed of a single layer or multiple layers of material comprising silicon or epoxy resin. The resin component 132 may further include a convex lens (not shown) on its upper portion. The light-emitting device 131 may include at least one light-emitting chip 30 disposed on a support member 133 and a wavelength conversion layer 31 disposed on the at least one light-emitting chip 30. The light-emitting chip 30 may be configured as one or more, and may include multiple semiconductor layers made of compound semiconductors of group II and VI elements and / or group III and V elements, and at least one or all of the multiple semiconductor layers may include compound semiconductors of the following series: AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs. A wavelength conversion layer 31 is disposed on the light-emitting chip 30 and may cover the entire upper surface of the light-emitting chip 30. The wavelength conversion layer 31 performs wavelength conversion on a portion of the light emitted from the light-emitting chip 30. The wavelength conversion layer 31 may contact the upper surface of the light-emitting chip 30 and a portion of the resin component 132. The wavelength conversion layer 31 may include at least one or two of yellow phosphors, green phosphors, blue phosphors, and red phosphors. The light-emitting device 131 may emit white light. The light-emitting device 131 may emit light with the highest luminous intensity in a direction perpendicular to the upper surface of the light-emitting device 131. As another example, the light-emitting device 131 may be an LED chip with different wavelengths, and in this case, the wavelength conversion layer may be removed. The LED chips with different wavelengths may include red LED chips, green LED chips, and blue LED chips.

[0084] The light-emitting device 131 can be disposed on the upper part of one region of the support member 133, and the bonding pads 134 and 135 can be disposed on the upper part of another region of the support member 133. The bonding pads 134 and 135 can include a first bonding pad 134 connected to the cathode of the light-emitting device 131 and a second bonding pad 135 connected to the anode of the light-emitting device 131. The support member 133 has an electrode pattern on which the first bonding pad 134 and the second bonding pad 135 are disposed, and the electrode pattern can electrically connect the light-emitting device 131 to the first bonding pad 134 and the second bonding pad 135. The first bonding pad 134 and the second bonding pad 135 can be exposed on the upper surface of another region of the support member 133. The distance between the light source portion 130 and the circuit board 110 can be 3 mm or more, for example, in the range of 3 mm to 10 mm or 3 mm to 8 mm. If the distance is less than this range, the buffer space due to the difference in thermal expansion between the light source 130 and the circuit board 110 will decrease, and the electrical reliability of the first connecting member 141 and the second connecting member 142 may decrease when the light source 130 moves. If the distance between the light source 130 and the circuit board 110 is greater than the above range, the length or material of the first connecting member 141 and the second connecting member 142 will increase.

[0085] The fixing member 120 may be disposed on either or both of the circuit board 110 and the support plate 101. The fixing member 120 includes a molding portion 122, and the molding portion 122 may mold at least one region or different regions of each of the connecting members 141 and 142. The fixing member 120 may include a fixing frame 121 for fixing the molding portion 122. The fixing frame 121 may be disposed on the lower part of the fixing member 120, and the molding portion 122 may be disposed on the upper part of the fixing member 120. The fixing frame 121 may be disposed on at least one or both of the circuit board 110 and the support plate 101. The fixing frame 121 may be adhered to or joined to the circuit board 110 and / or the support plate 101. The fixing frame 121 may fix the position of the molding portion 122 below the molding portion 122. The fixing frame 121 may contact at least a portion of the molding portion 122, may be attached to at least one of the inner or outer sides of the molding portion 122, or may be attached to different areas of the molding portion 122. As another example, the fixing member 120 may be formed by the molding portion 122 without a fixing frame.

[0086] The molding portion 122 can contact at least one or both of the first connecting member 141 and the second connecting member 142, and can fix the position of at least a portion of each of the first connecting member 141 and the second connecting member 142. The molding portion 122 can fix at least one centerline portion 42 of the first connecting member 141 and the second connecting member 142 onto the circuit board 110. Since the molding portion 122 surrounds and supports the periphery of the centerline portion 42 of the first connecting member 141 and the second connecting member 142, the position of the centerline portion 42 can be fixed.

[0087] The fixing frame 121 can be disposed in the area that overlaps with the circuit board 110 in the vertical direction. The molding part 122 molds and supports the area of ​​the center line portion 42 of the first connecting member 141 and the second connecting member 142 that overlaps with the circuit board 110 in the vertical direction. The molding part 122 molds and supports the area of ​​the center line portion 42 of the first connecting member 141 and the second connecting member 142 that overlaps vertically with the area between one side of the circuit board 110 and the pads 111 and 112.

[0088] The fixing frame 121 can be attached or joined to the circuit board 110. The fixing frame 121 can be joined to sub-pads 113 disposed within the circuit board 110 using a joining member (not shown). The fixing frame 121 may include a bottom 21 joined to the sub-pads 113, and support portions 22 and 23 bent from one or both ends of the bottom 21. The support portions 22 and 23 can be bent Z-directionally from one or both ends of the bottom 21 along a third direction of the circuit board 110. The bend between the bottom 21 and the support portions 22 and 23 may include a curved surface. The bottom 21 may be disposed between the pads 111 and 112 and one side of the circuit board 110. Figure 4b As shown, the spacing G1 between the support portions 22 and 23 on both sides of the fixed frame 121 can be greater than the maximum length of the region having pads 111 and 112 in the first direction X. The spacing G1 between the support portions 22 and 23 in the first direction X can be greater than the maximum length D2 of the region having connecting members 141 and 142.

[0089] Sub-pads 113 can be formed of the same material as pads 111 and 112. The fixing frame 121 can be made of a metallic material, such as at least one of Cu, Ti, Al, Pd, Co, Ni, Ag, and Au, or an alloy of two or more of the aforementioned metals. The fixing frame 121 can be formed as a single layer or multiple layers of metal. The number of fixing frames 121 and the number of molding portions 122 can be the same. As another example, the number of molding portions 122 can be greater than the number of fixing frames 121, and in this case, the molding portions 122 can be formed in different regions of the fixing frame 121. As another example, the fixing frame 121 can be made of a non-metallic material.

[0090] A molding portion 122 is disposed on a fixing frame 121, and the fixing frame 121 can be disposed within the area of ​​the molding portion 122. That is, the fixing frame 121 can be attached to the upper surface of the circuit board 110 and embedded in the lower part of the molding portion 122. The molding portion 122 can be disposed in the area between the surface of the bottom 21 of the fixing frame 121 and the support portions 22 and 23. The molding portion 122 can be disposed above and outside the support portions 22 and 23. The molding portion 122 can be disposed around the support portions 22 and 23. Therefore, the molding portion 122 can cover the entire upper surface of the fixing frame 121. In addition, the molding portion 122 can contact at least one or both of the surface of the fixing frame 121 and the upper surface of the circuit board 110.

[0091] The molding portion 122 may be disposed on the region between the first end 41 and the second end 43 of the first connecting member 141. The molding portion 122 may also be disposed on the region between the first end 41 and the second end 43 of the second connecting member 142. The molding portion 122 covers the region of the first connecting member 141 with its highest point, and the height of the uppermost end of the molding portion 122 may be set higher than the highest point of the first connecting member 141. The molding portion 122 covers the region of the second connecting member 142 with its highest point, and the height of the uppermost end of the molding portion 122 may be set higher than the highest point of the second connecting member 142. In other words, the molding portion 122 may cover the region of the highest point of the center line portion 42 of the first connecting member 141 and the second connecting member 142, and may also cover the region of the center line portion 42 on the circuit board 110 that overlaps with the circuit board 110 in the vertical direction.

[0092] The molding portion 122 may include a resin material, such as silicone or epoxy resin, acrylate, polyurethane, polyolefin, UV resin, or insulating material, or an optional mixture thereof. The molding portion 122 may be applied to the fixing frame 121 and then cured using a method selected from high-temperature curing, room-temperature curing, or UV curing. The molding portion 122 may be an adhesive or insulating member attached to the connecting members 141 and 142. The molding portion 122 may include a diffusing agent or a reflective material. The molding portion 122 has a plurality of side surfaces and a top surface, and the edge portions between the plurality of side surfaces may include curved or angled surfaces, for example, having curved surfaces, and the edge portions between each side surface and the top surface may have curved or angled surfaces, such as curved surfaces.

[0093] The support portions 22 and 23 of the fixing frame 121 are arranged as a first support portion 22 and a second support portion 23 on both sides of the bottom 21 in the first direction X, or they can be arranged as a first support portion 22 or a second support portion 23 at one end or the other end of the bottom 21 in the first direction X. The corner portions of the upper surfaces of the support portions 22 and 23 in the second direction Y can be curved surfaces or angled surfaces. The support portions 22 and 23 can protrude toward the outer region of the centerline portion 42 of each of the first connecting member 141 and the second connecting member 142. The fixing frame 121 may further include a support portion (not shown) protruding into the region between the first connecting member 141 and the second connecting member 142. The support portions 22 and 23 have one or more protruding from the fixing frame 121 toward the upper surface of the molding portion 122, and can be arranged in a region that does not overlap with the centerline portion 42 of the first connecting member 141 and the second connecting member 142 in a direction perpendicular to the upper surface of the support plate 101. The fixing member 120, the first connecting member 141, and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101 (i.e., the Z direction). A portion of the fixing member 120, the first connecting member 141, and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101. A portion of the first connecting member 141 and the second connecting member 142, the fixing member 120, and the circuit board 110 may overlap in a direction perpendicular to the upper surface of the support plate 101. The molded portion 122 of the fixing member 120 and a portion of the first connecting member 141 and the second connecting member 142 may overlap in a direction perpendicular to the upper surface of the support plate 101.

[0094] The fixing member 120 can space the midline portion 42 of the first connecting member 141 and the second connecting member 142 from the upper surface of the circuit board 110. The molding portion 122 can space the midline portion 42 of the first connecting member 141 and the second connecting member 142 from the upper surface of the fixing frame 121. The highest point region of the midline portion 42 can be located between the upper surface of the circuit board 110 and the upper surface of the molding portion 122. The highest point region of the midline portion 42 can be located between the lower surface of the molding portion 122 and the upper surface of the molding portion 122. The highest point region of the midline portion 42 can be located between the fixing frame 121 and the upper surface of the molding portion 122.

[0095] The height H1 of the upper end of the molding portion 122, based on the upper surface of the circuit board 110, can be higher than the height of the highest points of the connecting members 141 and 142. The highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be located between the upper end of the molding portion 122 and the fixing frame 121. The height of the highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be higher than the height of the bottom 21 of the fixing frame 121 and lower than the height of the upper ends of the support portions 22 and 23. As another example, the position of the highest points of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, can be higher than the position of the upper ends of the support portions 22 and 23 of the fixing frame 121.

[0096] At least one or both of the support portions 22 and 23 of the fixing frame 121 may include holes 22A and 23A therein. The molding portion 122 may engage with the holes 22A and 23A of the support portions 22 and 23. Because the molding portion 122 engages with the holes 22A and 23A of the support portions 22 and 23, the support portions 22 and 23 can prevent the molding portion 122 from detaching or separating from the fixing frame 121. The holes 22A and 23A may have a circular or polygonal shape, and one or more holes 22A and 23A may be arranged in each support portion 22 and 23. As another example, the fixing frame 121 may include at least one of a groove, a locking protrusion, or a locking jaw for securing the molding portion 122.

[0097] like Figure 4bAs shown, the length D0 of the fixing member 120 is the length in the first direction X, perpendicular to the extending directions of the connecting members 141 and 142, and is the maximum length of the molding portion 122 in the first direction X. The length D0 of the fixing member 120 in the first direction X can be greater than the maximum length of the area where the first pad 112 and the second pad 111 are provided in the first direction X. The length D0 of the fixing member 120 can be greater than the minimum spacing distance D3 between the first connecting member 141 and the second connecting member 142 in the first direction X, and can be greater than the maximum length D2 of the area where the connecting members 141 and 142 are provided. The length D1 of the fixing frame 121 in the first direction X can be greater than the maximum length of the area where the first bonding pad 134 and the second bonding pad 135 are provided in the first direction X. The length D1 of the fixing frame 121 in the first direction X can be greater than the length D5 of the light source portion 130.

[0098] The length D0 of the fixing member 120 in the first direction X varies according to the extending direction of the connecting members 141 and 142. For example, it may be the length that can cover the middle region of the two connecting members 141 and 142 spaced apart in the first direction X, or it may be more than 1.5 times the length of the region where the two connecting members 141 and 142 are provided (e.g., the maximum spacing distance). The length D1 of the fixing frame 121 in the first direction X may be greater than the maximum length of the region having the first pad 111 and the second pad 112 in the first direction X.

[0099] The two side surfaces of the fixing member 120 in the first direction X are positioned further outward in the first direction X than the outer side of each bonding pad 134 and 135 in the first direction X, and may be positioned further outward in the first direction X than each pad 111 and 112. The fixing member 120 can prevent the first connecting member 141 and the second connecting member 142 from moving in the vertical direction and in the horizontal direction relative to the upper surface of the circuit board 110, thereby preventing short circuit problems caused by contact between the connecting members 141 and 142 and the upper part 102 of the support plate 101.

[0100] The bottom width C2 of the fixing frame 121 in the second direction Y can be equal to or less than the upper surface width of the molding portion 122, and can be less than the bottom width C0 of the fixing member 120. Since the bottom width C0 of the fixing member 120 is set to be greater than the bottom width C2 of the fixing frame 121, the molding portion 122 can seal the fixing frame 121 and increase the bonding area between the molding portion 122 and the circuit board 110.

[0101] The bottom width C0 of the fixing member 120 in the second direction Y is the bottom width of the molding portion 122, and can be less than the distance C1 between the pads 111 and 112 of the circuit board 110 and one side of the circuit board 110. Therefore, the fixing member 120 can be disposed on the upper surface of the circuit board 110 between the pads 111 and 112 and one side of the circuit board 110. The fixing member 120 can be disposed between the light source portion 130 and the pads 111 and 112. The distance D4 between the light source portion 130 and the pads 111 and 112 of the circuit board 110 can be greater than 1 times the bottom width C0 of the fixing member 120, for example, greater than 1 times and less than or equal to 3 times. Here, the width P2 of the first bonding pad 134 and the second bonding pad 135 in the second direction Y can be 0.7 mm or more, for example, in the range of 0.7 mm to 1 mm, and the length P1 in the first direction X can be 1 mm or more, for example, in the range of 1 mm to 1.4 mm. In the second direction Y, the width P4 of the first pad 111 and the second pad 112 can be set within the range of 80% to 120% of the width P2 of the first bonding pad 134 and the second bonding pad 135, respectively. The length P3 of the first pad 111 and the second pad 112 in the first direction can be set within the range of 80% to 120% of the width P2 of the first bonding pad 134 and the second bonding pad 135, respectively.

[0102] The fixed frame 121 may further protrude by predetermined distances K1 and K2 from the outer sides of each of the first connecting member 141 and the second connecting member 142 toward the outer sides of each of the first bonding pad 134 and the second bonding pad 135 in the first direction X. For example, distances K1 and K2 may be in the range of 0.2 mm or more, for example, in the range of 0.2 mm to 0.8 mm. Distances K1 and K2 may be spaced apart from each other to prevent the centerline portion 42 of the connecting members 141 and 142 from moving to both sides in the first direction X.

[0103] The fixing member 120 fixes and supports the connecting members 141 and 142 on the circuit board 110, thereby preventing movement of the connecting members 141 and 142 and the support plate 101, and preventing short circuits between the connecting members 141 and 142 and the support plate 101. Since each of the support portions 22 and 23 of the fixing frame 121 is integrated into the interior of the molding portion 122, expansion or contraction of the molding portion 122 in the first direction X can be suppressed. In addition, by using the molding portion 122 to protect the space between the two ends of the connecting members 141 and 142 by external force, deformation of the connecting members 141 and 142 can be reduced, external exposure can be reduced, and short circuits in the intermediate line portion 42 can be prevented.

[0104] Figure 6a and Figure 6b This is a first variation of the lighting device according to the first embodiment of the present invention.

[0105] Reference Figure 6a and Figure 6b The lighting device includes a recess 105 therein for accommodating a light source portion 130, and the recess 105 can be recessed from one side surface of the circuit board 110 toward the other side surface. The length R2 of the recess 105 in the first direction X can be greater than the length D5 of the light source portion 130 in the first direction (see...). Figure 4b For example, the length R2 can be greater than 1 times the length D5 but less than 2 times the length D5. The length R1 of the recess 105 in the second direction Y can be greater than the length D6 of the light source portion 130 in the second direction (see...). Figure 4b For example, the length R1 can be greater than 0.5 times the length D6 but less than 2 times the length D6. That is, the light source portion 130 can be partially or completely accommodated within the recess 105 in the first direction X. Therefore, a portion of the light source portion 130 can be disposed further inward than one side of the circuit board 110.

[0106] First pad 111 and second pad 112 can be disposed on both sides of the recess 105 of the circuit board 110 in the first direction X. That is, the first pad 111 and the second pad 112 can be spaced apart from each other in the first direction X by a distance greater than the length R2 of the recess 105. The top view shape of the recess 105 can have a shape corresponding to the top view shape of the light source portion 130, and can be, for example, a square shape or a square shape with curved corners. In addition, the top view shape of the recess 105 can be a shape in which at least a portion of the side surface of the recess 105 has a curved surface. When the light source portion 130 is accommodated in the recess 105, an adhesive member 138 for adhering the light source portion 130 to the upper portion 102 can be disposed within the recess 105. The adhesive member 138 can be spaced apart from the inner surface of the recess 105, or can be in contact with the inner surface of the recess 105. The light source portion 130 can be accommodated and stably disposed within the recess 105.

[0107] The fixing members 120A and 120B may include a first fixing member 120A and a second fixing member 120B disposed on both sides of the light source portion 130 and spaced apart in the first direction X. The first fixing member 120A and the second fixing member 120B may correspond to each other on both sides of the recess 105 in the first direction X. For example, the first fixing member 120A and the second fixing member 120B may be arranged to face each other on both sides of the recess 105 in the first direction X.

[0108] The first bonding pad 134 of the light source unit 130 and the first bonding pad 111 of the circuit board 110 are connected by a first connecting member 141, and the second bonding pad 135 of the light source unit 130 and the second bonding pad 112 of the circuit board 110 are connected by a second connecting member 142. The first connecting member 141 and the second connecting member 142 may extend relatively long in the first direction X.

[0109] Each of the first fixing member 120A and the second fixing member 120B includes fixing frames 121A and 121B and molding portions 122A and 122B. The first fixing member 120A may be disposed in the region between the recess 105 and the first pad 111. The second fixing member 120B may be disposed in the region between the recess 105 and the second pad 112. The spacing between the first molding portion 122A and the second molding portion 122B may be greater than or equal to the length R2 of the recess 105 in the first direction X. As another example, each of the first fixing member 120A and the second fixing member 120B may consist of molding portions 122A and 122B without fixing frames 121A and 121B.

[0110] The first molding portion 122A of the first fixing member 120A fixes a portion of the first connecting member 141 to the circuit board 110, and the first molding portion 122A of the second fixing member 120B fixes a portion of the second connecting member 142 to the circuit board 110. The first molding portion 122A may be disposed on the upper surface of the circuit board 110 in a region that vertically overlaps with the center line portion 42 of the first connecting member 141. The second molding portion 122B may be disposed on the upper surface of the circuit board 110 in a region that vertically overlaps with the center line portion 42 of the second connecting member 142. A portion of the first connecting member 141 and a portion of the second connecting member 142 are molded into the molding portions 122A and 122B of the first fixing member 120A and the second fixing member 120B, and the position of the center line portion 42 of the first connecting member 141 and the second connecting member 142 may be fixed by the molding portions 122A and 122B. Each of the mounting frames 121A and 121B can be attached to the circuit board 110 with adhesive, or to the sub-pad 113 (see [link]). Figure 5 ).

[0111] The highest point of the first connecting member 141, based on the upper surface of the circuit board 110, may be lower than the highest point of the first fixing member 120A or the highest point of the first molding portion 122A. The highest point of the second connecting member 142, based on the upper surface of the circuit board 110, may be lower than the highest point of the second fixing member 120B or the highest point of the second molding portion 122B. The length D10 of each of the first fixing member 120A and the second fixing member 120B in the first direction X may be greater than the length C10 in the second direction Y. The length D10 of the first fixing member 120A and the second fixing member 120B in the second direction Y may be greater than the length P3 of the first pad 111 and the second pad 112 in the second direction Y, and the length C10 of the first fixing member 120A and the second fixing member 120B in the first direction X may be greater than the length P4 of the first pad 111 and the second pad 112 in the first direction X. Here, the lengths P3 and P4 of the first pad 111 and the second pad 112 in the first direction X and the second direction Y can vary according to the direction in which the connecting members 141 and 142 extend.

[0112] The first fixing member 120A and the second fixing member 120B may include a bottom 21 as shown in FIG. 6(b) and support portions 22 and 23 that are bent on one or both sides of the bottom 21 in the second direction Y. Molded portions 122A and 122B may cover the bottom 21 and the support portions 22 and 23. The height of the highest point of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, may be higher than the bottom 21 of the fixing frame 121A and lower than the height of the upper ends of the support portions 22 and 23. As another example, the height of the highest point of the first connecting member 141 and the second connecting member 142, based on the upper surface of the circuit board 110, may be higher than the height of the upper ends of the support portions 22 and 23 of the fixing frame 121A and lower than the height of the highest point of the molded portions 122A and 122B. The length D10 of each of the molded portions 122A and 122B or the fixing members 120A and 120B in the second direction Y may be less than the length R1 of the recess 105 in the second direction Y. The distance between the first fixing member 120A and the second fixing member 120B in the first direction X is greater than or equal to the length R2 of the recess 105 in the first direction X, and can reduce interference with the light emitted from the light source 130.

[0113] Molded portions 122A and 122B can be formed within the holes 22A and 23A of the support portions 22 and 23. That is, molded portions 122A and 122B extend inside the holes 22A and 23A of the support portions 22 and 23, extending to the inner and outer sides of the support portions 22 and 23, and can be attached and fixed to the fixing frames 121A and 121B. For the beam angle of light emitted from the light-emitting device 131, the inner surfaces of the molded portions 122A and 122B are inclined relative to the upper surface of the circuit board 110, or the region between the first fixing member 120A and the second fixing member 120B, and the region between the molded portions 122A and 122B, may not overlap with the upper region of the light-emitting device 131 in the first direction X. The region between the first fixing member 120A and the second fixing member 120B and the molded portions 122A and 122B may not overlap with the upper region of the light-emitting device 131 in the second direction Y.

[0114] The length D10 of each of the first fixing member 120A and the second fixing member 120B in the second direction Y varies according to the extending direction of the first connecting member 141 and the second connecting member 142. For example, it may be a length capable of covering a portion of each of the connecting members 141 and 142, or it may be the same as the width W of one of the connecting members 141 and 142 (in the second direction Y). Figure 4b Compared to the middle section, it is at least twice, for example, at least three times. The first fixing member 120A and the second fixing member 120B fix and support a portion of the first connecting member 141 and the second connecting member 142 (e.g., a portion of the middle line portion 42) on the circuit board 110, thereby preventing movement of each of the first connecting member 141 and the second connecting member 142 and preventing short circuits between the first connecting member 141 and the second connecting member 142 and the support plate 101.

[0115] Figure 7 and Figure 8 A second variation of the lighting device according to the first embodiment of the present invention is shown.

[0116] Reference Figure 7 and Figure 8 The circuit board 110 may include a concave recess 106 on one side. The top view shape of the recess 106 may be circular, elliptical, or semi-circular. A portion or lower part of the fixing member 120C may be disposed in the recess 106. Since the fixing member 120C is disposed in the recess 106, the gap between the light source section 130 and the circuit board 110 can be reduced.

[0117] The fixing member 120C includes a fixing frame 121C and a molding portion 122C. The fixing frame 121C can be adhered to the upper surface of the support plate 101 with an adhesive or joined by a joining member (not shown). The fixing frame 121C can be integrally formed with the support plate 101. The fixing frame 121C is made of metal and can be joined to the support plate 101. The fixing frame 121C can include a columnar lower frame 25 and a plate-shaped upper frame 26, wherein the columnar part is a circular or polygonal column, and the plate-shaped part can be circular or polygonal in plan view. The diameter D13 or width of the upper frame 26 is greater than the diameter or width of the lower frame 25, and the diameter D13 or width of the upper frame 26 can be greater than the length D2 of the region where the connecting members 141 and 142 are provided in the first direction X (see...). Figure 4b The fixing member 120C may be formed by the molding part 122C without the fixing frame 121C. That is, the diameter D13 is longer than the length of the area that overlaps in the vertical direction with the middle line portion 42 of the first connecting member 141 and the second connecting member 142 with reference to the upper surface of the circuit board 110, or it may have a length longer than the length between the two ends of the middle line portion 42 of the connecting members 141 and 142 in the first direction X.

[0118] Since the molding portion 122C is disposed on the periphery of the lower frame 25 of the fixing member 120C and on the surface and periphery of the upper frame 26, and is captured in the locking structure between the lower frame 25 and the upper frame 26, movement or separation can be prevented by the structure or shape of the fixing frame 121C. The lower part of the molding portion 122C can be formed into a circular column or a polygonal column, and the upper surface of the molding portion 122C can have a convex curved surface or a flat surface. Based on the upper surface of the support plate 101, the upper end of the molding portion 122C can be set to a height H2 higher than the upper end of the fixing frame 121C and higher than the height of the upper surface of the circuit board 110. Based on the upper surface of the support plate 101, the upper end of the molding portion 122C can have a height higher than the height of the highest point of the first connecting member 141 and the second connecting member 142.

[0119] A portion of the molding portion 122C may extend to the upper surface of the circuit board 110. A portion of the molding portion 122C may extend over at least one of the first end 41 and the second end 43 of the first connecting member 141. A portion of the molding portion 122C may extend over at least one of the first end 41 and the second end 43 of the second connecting member 142. A portion of the molding portion 122C may extend over at least one of the first bonding pad 134 and the second bonding pad 135. A portion of the molding portion 122C may extend over at least one of the first pad 111 and the second pad 112. The area extended by the molding portion 122C may include at least one or more of the aforementioned components (e.g., the first end 41, the second end 43, bonding pads 134 and 135, or pads 111 and 112).

[0120] The first connecting member 141 and the second connecting member 142 are respectively connected between the bonding pads 134 and 135 of the light source section 130 and the pads 111 and 112 of the circuit board 110, and extend on the fixing frame 121C. A molding portion 122C is formed within the recess 106 and on the surface of the fixing frame 121C, and surrounds a portion of the first connecting member 141 and the second connecting member 142, such as a portion of the centerline portion 42. Based on the upper surface of the support plate 101, the molding portion 122C can overlap the recess 106 in the vertical direction, protruding above the highest point of the connecting members 141 and 142, and supporting and fixing a portion of the connecting members 141 and 142, namely the centerline portion 42.

[0121] A portion of the molding portion 122C may contact the inner surface of the recess 106 of the circuit board 110 and / or the upper surface of the circuit board 110. A portion of the molding portion 122C may contact the other side of the light source portion 130 and the upper surface of the support plate 101. A portion of the molding portion 122C may contact the surface of the adhesive member 138. The fixing member 120C fixes and supports the connecting members 141 and 142 in the area between the circuit board 110 and the light source portion 110, thereby preventing movement of the connecting members 141 and 142 and preventing short circuits between the connecting members 141 and 142 and the support plate 101.

[0122] Figures 9 to 11 This is a schematic diagram of a lighting device according to a second embodiment of the present invention.

[0123] Reference Figures 9 to 11The lighting device may include a support plate 101, a circuit board 110, a light source 130, connecting members 141 and 142, and molding portions 151, 152, 161, and 162. The configuration of the support plate 101, circuit board 110, light source 130, and connecting members 141 and 142 may include the configuration and description of the first embodiment disclosed above. Molding portions 151, 152, 161, and 162 comprise resin material and may include the configuration and description of the molding portions disclosed in the first embodiment. That is, the material of molding portions 151, 152, 161, and 162 may include resin materials, such as silicone resin or epoxy resin, acrylate, polyurethane, polyolefin, UV resin, or insulating material, or may be an optional mixture of the aforementioned materials.

[0124] Molded portions 151, 152, 161, and 162 may include at least one molded portion disposed on the light source portion 130, and may include, for example, a first molded portion 151 and a second molded portion 152. Molded portions 151, 152, 161, and 162 may include at least one molded portion disposed on the circuit board 110, and may include, for example, a third molded portion 161 and a fourth molded portion 162. The first molded portion 151 and the second molded portion 151 may contact the upper surface of the light source portion 130, excluding the area of ​​the light-emitting device 131. The first molded portion 151 and the second molded portion 152 may contact the surfaces of the bonding pads 134 and 135 and the surrounding area of ​​the upper surface of the light source portion 130 (excluding the area of ​​the light-emitting device 131). The third molded portion 161 and the fourth molded portion 162 may contact the surfaces of the bonding pads 111 and 112 on the upper surface of the circuit board 110, or may contact the bonding pads 111 and 112 and their surrounding area.

[0125] A first molding portion 151 may be disposed on the first bonding pad 134 of the light source portion 130. The first molding portion 151 may be disposed on the first bonding pad 134 and the first end portion 41 of the first connecting member 141. The first molding portion 151 covers the first end portion 41 of the first connecting member 141 and contacts the upper surface of the first bonding pad 134. The first molding portion 151 may cover the surface of the first end portion 41 of the first connecting member 141 and one end portion 42A of the centerline portion 42. A portion of the first molding portion 151 may contact the upper surface of the resin member 132. The area of ​​the lower surface of the first molding portion 151 may be more than 50% of the area of ​​the upper surface of the first bonding pad 134, for example, in the range of 50% to 200% or 80% to 120%. When the area of ​​the lower surface of the first molding portion 151 is smaller than the above-mentioned range, the adhesive force between the first end 41 of the first connecting member 141 and the first bonding pad 134 may be reduced, which may result in an opening defect in the first end 41 of the first connecting member 141, and may also cause oxidation problems such as the metal of the pad or the wire due to the penetration of external moisture.

[0126] The second molding portion 152 may be provided on the second bonding pad 135 of the light source portion 130. The second molding portion 152 may be provided on the second bonding pad 135 and the first end 41 of the second connecting member 142. The second molding portion 152 covers the first end 41 of the second connecting member 142 and contacts the upper surface of the second bonding pad 135. The second molding portion 152 may cover the surface of the first end 41 of the second connecting member 142 and one end 42A of the center line portion 42. A portion of the second molding portion 152 may contact the upper surface of the resin member 132. The area of ​​the lower surface of the second molding portion 152 may be more than 50% of the area of ​​the upper surface of the second bonding pad 135, for example, in the range of 50% to 200% or 80% to 120%. When the area of ​​the lower surface of the second molding portion 152 is smaller than the above range, the adhesive force between the first end 41 of the second connecting member 142 and the second bonding pad 135 may be reduced, which may result in an opening defect in the first end 41 of the second connecting member 142, and due to the penetration of external moisture, problems such as oxidation of the metal of the pad or wire may occur.

[0127] The first molding portion 151 and the second molding portion 152 can cover and fix one end 42A of the centerline portion 42 of the first connecting member 141 and the second connecting member 142. Therefore, each of the first molding portion 151 and the second molding portion 152 can prevent the problem of breakage at the boundary portion or end 42A between the centerline portion 42 of each of the first connecting member 141 and the first end 41.

[0128] The first molding portion 151 and the second molding portion 152 can be spaced apart from the light-emitting device 131 of the light source portion 130. That is, the first molding portion 151 and the second molding portion 152 can be provided in a region that deviates from the beam angle of the light generated from the light-emitting device 131. Therefore, it is possible to prevent a decrease in the extraction efficiency of the light generated from the light-emitting device 131 or a decrease in the uniformity of the beam angle distribution.

[0129] The third molding portion 161 may be disposed on the first pad 111 of the circuit board 110. The third molding portion 161 may be disposed on the first pad 111 and the second end 43 of the first connecting member 141. The third molding portion 161 covers the second end 43 of the first connecting member 141 and contacts the upper surface of the first pad 111. The third molding portion 161 may cover the surface of the second end 43 of the first connecting member 141 and the other end 42B of the center line portion 42. A portion of the third molding portion 161 may contact the upper surface of the circuit board 110, i.e., the upper surface of the protective layer 110B (see...). Figure 11 The area of ​​the lower surface of the third molding portion 161 can be more than 50% of the area of ​​the upper surface of the first pad 111, for example, in the range of 50% to 100% or 50% to 150%. When the area of ​​the lower surface of the third molding portion 161 is less than the above range, the adhesive force between the second end 43 of the first connecting member 141 and the first pad 111 may be reduced, which may result in an opening defect in the second end 43 of the first connecting member 141, and oxidation problems such as those on the pads or wires may occur due to the penetration of external moisture.

[0130] A fourth molding portion 162 may be disposed on the second pad 112 of the circuit board 110. The fourth molding portion 162 may be disposed on the second pad 112 and the second end 43 of the second connecting member 142. The fourth molding portion 162 covers the second end 43 of the second connecting member 142 and contacts the upper surface of the second pad 112. The fourth molding portion 162 may cover the surface of the second end 43 of the second connecting member 142 and the other end 42B of the center line portion 42. A portion of the fourth molding portion 162 may contact the upper surface of the circuit board 110, i.e., the upper surface of the protective layer 110B (see...). Figure 11 The area of ​​the lower surface of the fourth molding portion 162 can be more than 50% of the area of ​​the upper surface of the second pad 112, for example, in the range of 50% to 100% or 50% to 150%. When the area of ​​the lower surface of the fourth molding portion 162 is less than the above range, the adhesive force between the second end 43 of the second connecting member 142 and the second pad 112 may be reduced, which may result in an opening defect in the second end 43 of the second connecting member 142, and oxidation problems such as those on the pads or wires may occur due to the penetration of external moisture.

[0131] The third molding portion 161 and the fourth molding portion 162 can cover and fix the other end 42B of the center line portion 42 of the first connecting member 141 and the second connecting member 142. Therefore, each of the third molding portion 161 and the fourth molding portion 162 can prevent the problem of breakage at the boundary portion between the center line portion 42 of each of the first connecting member 141 and the second end 43 or at the other end 42B.

[0132] The first molding section 151, the second molding section 152, the third molding section 161, and the fourth molding section 162 can be spaced apart from each other by a distance greater than the distance D7 between the light source section 130 and the circuit board 110. The straight length B0 of the connecting members 141 and 142 is the straight length between the two ends of each connecting member 141 and 142, and can be greater than the distance D7 between the light source section 130 and the circuit board 110.

[0133] With reference to the upper surface of circuit board 110, the height H3 of the upper ends of the third molding portion 161 and the fourth molding portion 162 can be higher than the height of the upper ends of the first molding portion 151 and the second molding portion 152. With reference to the upper surface of support plate 101, the height of the upper ends of the third molding portion 161 and the fourth molding portion 162 can be higher than the height H0 of the highest points of connecting members 141 and 142. Therefore, the upper ends of the third molding portion 161 and the fourth molding portion 162 can protect the upper parts of connecting members 141 and 142. The upper parts of the first molding portion 151 and the second molding portion 152 can be higher than the upper surface of circuit board 110 with reference to the upper surface of support plate 101, and can have the same or different heights as the highest points of connecting members 141 and 142. The shape of the upper surface or top view of the first molding portion 151 and the second molding portion 152 can be polygonal, circular, or elliptical. The upper surface or top view shape of the third molding part 161 and the fourth molding part 162 can be polygonal, circular or elliptical.

[0134] The first molding portion 151 and the second molding portion 152 may be spaced apart from each other, and may contact each other as in the variations described later, or may be integrally formed. The third molding portion 161 and the fourth molding portion 162 may be spaced apart from each other, and may contact each other as in the variations described later, or may be integrally formed. The first molding portion 151 and the third molding portion 161 may be spaced apart from each other, and may contact each other as in the variations described later, or may be integrally formed. The second molding portion 152 and the fourth molding portion 162 may be spaced apart from each other, and may contact each other as in the variations described later, or may be integrally formed. As another example, at least a portion of the first molding portion 151 and the second molding portion 152 extends to the other side of the light source portion 130 and may contact the upper surface of the support plate 101. At least a portion of the third molding portion 161 and the fourth molding portion 162 extends to one side of the circuit board 110 and may contact the upper surface of the support plate 101.

[0135] The minimum interval E1 between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be less than or equal to the minimum interval E2 between the second ends 43 of the first connecting member 141 and the second connecting member 142. For example, the minimum intervals E1 and E2 can satisfy the condition E1≤E2, and preferably, E1<E2. This can increase the area of ​​the first pad 111 and the second pad 112 on the circuit board 110, and the interval between the first pad 111 and the second pad 112 can be increased compared to the interval between the first bonding pad 134 and the second bonding pad 135. Therefore, within the minimum intervals E1 and E2, E2 can be greater than 1 to less than 2 times the interval E1. When the minimum interval E2 may be greater than the above range, the material of the connecting members 141 and 142 may be wasted, and each end 41 and 43 may be tilted due to the interval between the connecting members 141 and 142. Therefore, it may become difficult to secure the bonding device used to bond each end 41 and 43. The minimum interval E1 between the first ends 41 of the first connecting member 141 and the second connecting member 142 can be greater than the width W of the connecting members 141 and 142, for example, more than 1 mm or 1 mm to 6 mm.

[0136] The interior angle between the two virtual straight lines extending in the longitudinal direction of the first connecting member 141 and the second connecting member 142 can be greater than 1 degree, for example, in the range of 1 degree to 90 degrees or in the range of 10 degrees to 60 degrees. If the interior angle is smaller than the above range, the adhesive area of ​​the molded portion on the circuit board 110 will be reduced. This can be achieved by using a molded portion with a larger area on the circuit board 110 to support the second ends 43 of the connecting members 141 and 142.

[0137] Figures 12 to 21 A variation of the lighting device of the second embodiment is shown.

[0138] like Figure 12 As shown, the first molding part 153 has Figure 9 The first molding portion 151 and the second molding portion 152 are shown in a connected shape. The first molding portion 153 may be provided on the surfaces of the first bonding pad 134 and the second bonding pad 135 of the light source portion 130. The first molding portion 153 may further be provided in the region between the first bonding pad 134 and the second bonding pad 135, i.e., on the surface of the resin member 132. The first molding portion 153 may extend from the region of the first bonding pad 134 and the second bonding pad 135 to a region adjacent to the other side of the light source portion 130. The first molding portion 153 may cover the first end 41 of the first connecting member 141 and the second connecting member 142, as well as the end 42A of the intermediate line portion 42.

[0139] The third molding portion 161 and the fourth molding portion 162 cover the second ends 43 of the connecting members 141 and 142 provided on each of the third pads 111 and the fourth pads 112 of the circuit board 110, and can cover and protect the other end 42B of the middle line portion 42 of the connecting members 141 and 142. The lower surface area of ​​each of the third molding portion 161 and the fourth molding portion 162 can be smaller than the lower surface area of ​​the first molding portion 153.

[0140] like Figure 13 As shown, the third molding part 163 has Figure 9 The third molding portion 161 and the fourth molding portion 162 are connected in the shape shown. The third molding portion 163 can be disposed on the surface of the first pad 111 and the second pad 112 of the circuit board 110. The third molding portion 163 can also be disposed in the area between the first pad 111 and the second pad 112. The third molding portion 163 can be disposed from the side surface of the first pad 111 and the second pad 112 of the circuit board 110 (i.e., the protective layer 110B of the circuit board 110). Figure 11 The third molding portion 163 extends over the area adjacent to the upper surface of the first connecting member 141 and the second connecting member 142, as well as the other end 42B, which serves as the boundary portion between the second end 43 and the intermediate line portion 42. The sum of the lower surface areas of the first molding portion 151 and the second molding portion 152 may be less than the lower surface area of ​​the third molding portion 163.

[0141] Reference Figure 14 In the lighting device, the first molding part 153 has Figure 9 The shape shown is such that the first molding portion and the second molding portion are connected, and the second molding portion 163A has Figure 9The third and fourth molding portions shown are connected in a shape. A first molding portion 153 may be disposed on the surfaces of the first bonding pad 134 and the second bonding pad 135 of the light source portion 130. The first molding portion 153 may further be disposed in the region between the first bonding pad 134 and the second bonding pad 135, i.e., on the surface of the resin member 132. The first molding portion 153 may extend from the region of the first bonding pad 134 and the second bonding pad 135 to a region adjacent to the other side of the light source portion 130. The first molding portion 153 may cover the first end 41 of the first connecting member 141 and the second connecting member 142, and the end 42A of the intermediate line portion 42. A second molding portion 163A may be disposed on the surfaces of the first pad 111 and the second pad 112 of the circuit board 110. The second molding portion 163A may further be disposed in the region between the first pad 111 and the second pad 112. The second molding portion 163A can extend from the area of ​​the first pad 111 and the second pad 112 to the area adjacent to one side surface of the circuit board 110, that is, the protective layer 110B of the circuit board 110 (see Figure 11 The upper surface of the first molding portion 163A may cover the second end 43 of the first connecting member 141 and the second connecting member 142, as well as the other end 42B of the center line portion 42. Additionally, the second molding portion 163A may cover the other end 42B of the center line portion 42 of the connecting members 141 and 142. The lower surface area of ​​the second molding portion 163A may be larger than the lower surface area of ​​the first molding portion 153.

[0142] Since the first molding portion 153 is molded on the first end 41 of the first connecting member 141 and the second connecting member 142, cracks can be prevented from appearing in the boundary portion between the first end 41 and the center line portion 42. Since the second molding portion 163A is molded on the second end 43 of the first connecting member 141 and the second connecting member 142, cracks can be prevented from appearing in the boundary portion between the third end 43 and the center line portion 42.

[0143] Reference Figure 15 and Figure 16 In the lighting device, a first molded portion 155 is disposed on a first connecting member 141, and a second molded portion 156 is disposed on a second connecting member 142. At least part or all of the first molded portion 155 and the second molded portion 156 can be separated from each other. The gap between the first molded portion 155 and the second molded portion 156 can be less than the minimum gap between the first connecting member 141 and the second connecting member 142. The gap between the first connecting member 141 and the second connecting member 142 can satisfy... Figure 10The minimum distance E1 shown is greater than or less than the maximum distance E2. The spacing between the first molding portion 155 and the second molding portion 156 can be the same depending on the region, or it can be widened from the bonding pads 134 and 135 of the light source portion 130 to the region adjacent to the first pad 111 and the second pad 112 of the circuit board 140. In the second direction Y, the first molding portion 155 and the second molding portion 156 can have a length longer than the length of the first connecting member 141 and the second connecting member 142. The width of the first molding portion 155 and the second molding portion 156 in the first direction X can be constant, or a portion of the width can be formed differently.

[0144] The first molding portion 155 can cover the first end 41, the center line portion 42, and the second end 43 of the first connecting member 141, and can be disposed in the area between the light source portion 130 and the circuit board 110. The second molding portion 156 can cover the first end 41, the center line portion 42, and the second end 43 of the second connecting member 142, and can be disposed in the area between the light source portion 130 and the circuit board 110. Each of the first molding portion 155 and the second molding portion 156 can contact the other side of the light source portion 130, one side of the circuit board 110, and the upper surface of the support plate 101. Each of the first molding portion 155 and the second molding portion 156 can overlap the first connecting member 141 and the second connecting member 142 in the vertical direction with reference to the upper surface of the support plate 101, and for example, can overlap the first end 41, the center line portion 42, and the second end 43 of the first connecting member 141 and the second connecting member 142 in the vertical direction.

[0145] The height of the highest point of each of the first molding portion 155 and the second molding portion 156, with reference to the upper surface of the support plate 101, can be higher than the height of the highest points of the first connecting member 141 and the second connecting member 142. Therefore, the first molding portion 155 and the second molding portion 156 can protect the surfaces of the first connecting member 141 and the second connecting member 142. With reference to the upper surface of the support plate 101, the heights of the uppermost ends of the first molding portion 155 and the second molding portion 156 can be the same or different, and the side profiles of the first molding portion 155 and the second molding portion 156 in the second direction Y can have a circular, elliptical, or polygonal shape.

[0146] Figure 17 yes Figure 15In a variation, the first molding portion 155 and the second molding portion 156 can be connected to each other on the light source portion 130. That is, the first molding portion 155 and the second molding portion 156 can include a first connecting portion 51 connected to each other. The first connecting portion 51 can be the area on the light source portion 130 where the first molding portion 155 and the second molding portion 156 are connected to each other. The first connecting portion 51 can be disposed in the area between the first bonding pad 134 and the second bonding pad 135 of the light source portion 130, and can be in contact with the surface of the resin member 132. The first connecting portion 51 can be disposed on the upper surface of the light source portion 130, or can extend from the upper surface of the light source portion 130 to a portion of the upper surface of the support plate 101. The first connecting portion 51 can be spaced apart from the light-emitting device 131.

[0147] Figure 18 yes Figure 15 In a variation, the first molding portion 155 and the second molding portion 156 can be connected to each other on the circuit board 110. That is, the first molding portion 155 and the second molding portion 156 may include a second connecting portion 61 connected to each other. The second connecting portion 61 may be the area on the circuit board 110 where the first molding portion 155 and the second molding portion 156 are connected to each other. The second connecting portion 61 may be disposed in the area between the first pad 111 and the second pad 112 of the circuit board 110, and may contact the surface of the protective layer 110B (see [reference]). Figure 11 The second connecting part 61 may be disposed on the upper surface of the circuit board 110, or may extend from the upper surface of the circuit board 110 to a portion of the upper surface of the support plate 101.

[0148] Figure 19 yes Figure 14 In a variation of the lighting device, the molding portion can be disposed in different regions of the connecting members 141 and 142, for example, in two, three, or more regions. The first molding portion 153 can cover the first bonding pad 134 and the second bonding pad 135 on the light source portion 130, the first end 41 of the first connecting member 141 and the second connecting member 142, and one end 42A of the intermediate line portion 42. The second molding portion 163A can cover the first pad 111 and the second pad 112 on the circuit board 110, the second end 43 of the first connecting member 141 and the second connecting member 142, and the other end 42B of the intermediate line portion 42. The height of the uppermost end of the second molding portion 163A, based on the upper surface of the support plate 101, can be higher than the height of the uppermost end of the intermediate line portion 42.

[0149] The central molding portion 165 may be disposed in the region of the first connecting member 141 and the second connecting member 143 in the second direction Y, and may be located in the central region of at least one or both of the first connecting member 141 and the second connecting member 143. The central molding portion 165 may cover at least a portion of the centerline portion 42 of the first connecting member 141 and the second connecting member 143. The central molding portion 165 may cover the region of the highest point of the centerline portion 42. The central molding portion 165 may be disposed between the first molding portion 153 and the second molding portion 163A.

[0150] The central molding portion 165 may cover the upper surface of the centerline portion 42 on the support plate 101 and may have an upper end higher than the highest point of the centerline portion 42. The lower portion of the central molding portion 165 may be disposed in the region between the centerline portion 42 and the support plate 101. The central molding portion 165 may be spaced apart from the first molding portion 153 and the second molding portion 163A in the region between the first molding portion 153 and the second molding portion 163A. As another example, the lower portion of the central molding portion 165 may be connected to at least one or both of the first molding portion 153 and the second molding portion 163A. The lower portion of the central molding portion 165 may contact the surfaces of the adhesive member 138 and the light source portion 130. The lower portion of the central molding portion 165 may contact one side of the circuit board 110, or may contact both one side and the upper surface of the circuit board 110.

[0151] Since the molding portions 153, 163A and 165 are molded on different areas of the first connecting member 141 and the second connecting member 142, each end 41 and 43 of the first connecting member 141 and the second connecting member 142, as well as the area of ​​the highest point, can be protected.

[0152] Reference Figure 20 In the lighting device, the molding portion can be disposed in different areas of the connecting members 141 and 142, for example, in more than two areas. The first molding portion 153A can cover the first bonding pad 134 and the second bonding pad 135 on the light source portion 130, the first end 41 of the first connecting member 141 and the second connecting member 142, and one end 42A of the intermediate line portion 42. The second molding portion 163A can cover the first pad 111 and the second pad 112 on the circuit board 110, the second end 43 of the first connecting member 141 and the second connecting member 142, and the other end 42B of the intermediate line portion 42.

[0153] The first molding portion 153A can extend to the region of the highest point of the midline portion 42 between the first connecting member 141 and the second connecting member 142. The first molding portion 153A can contact the other side surface of the light source portion 130, the adhesive member 138, and the upper surface of the support plate 101. In addition, the lower part of the first molding portion 153A can be further provided in the lower part of the midline portion 42. The height of the highest point of the first molding portion 153A, based on the upper surface of the support plate 101, can be higher than the height of the highest point of the midline portion 42. In the region of the first molding portion 153A, the side surface closest to one side surface of the circuit board 110 is spaced apart from one side surface of the circuit board 110, or at least a portion thereof can contact one side surface of the circuit board 110.

[0154] The first molding portion 153A and the second molding portion 163A can be separated from each other, or at least a portion thereof can be in contact with each other. The lower surface area of ​​the first molding portion 153A can be larger than the lower surface area of ​​the second molding portion 163A. The first molding portion 153A can support the region of one end 42A of the connecting members 141 and 142 and the other side region of the light source portion 130, thereby preventing movement of one end 42A of the connecting members 141 and 142 and the light source portion 130.

[0155] Reference Figure 21 In the lighting device, the molding portion can be provided on different areas of the connecting members 141 and 142, for example, in more than two areas. The first molding portion 153 can cover the first bonding pad 134 and the second bonding pad 135 on the light source portion 130, the first end 41 of the first connecting member 141 and the second connecting member 142, and one end 42A of the intermediate line portion 42. The second molding portion 163B can cover the first pad 111 and the second pad 112 on the circuit board 110, the second end 43 of the first connecting member 141 and the second connecting member 142, and the other end 42B of the intermediate line portion 42.

[0156] The second molding portion 163B can extend to the region of the highest point of the midline portion 42 between the first connecting member 141 and the second connecting member 142. The second molding portion 163B can contact a side surface of the circuit board 110, the upper surface of the support plate 101, and the adhesive member 138. The lower portion of the second molding portion 163B can be further disposed below the midline portion 42. The height of the highest point of the second molding portion 163B, based on the upper surface of the support plate 101, can be higher than the height of the highest point of the midline portion 42. In the region of the second molding portion 163B, the surface closest to the other side surface of the light source portion 130 is spaced apart from the other side surface of the light source portion 130, or at least a portion of this region can contact the other side surface of the light source portion 130.

[0157] The first molding portion 153A and the second molding portion 163B can be separated from each other, or at least a portion thereof can be in contact with each other. The lower surface area of ​​the second molding portion 163B can be larger than the lower surface area of ​​the first molding portion 153A. The second molding portion 163B can support the area of ​​the other end 42B of the connecting members 141 and 142 and the area of ​​one side of the circuit board 110, thereby preventing movement between the other end 42B of the connecting members 141 and 142 and the intermediate line portion 42.

[0158] Figure 22a yes Figure 11 Another example of a support plate for a lighting device.

[0159] like Figure 22a As shown, the support plate 101 may include a concave receiving portion 108 on its upper part. Therefore, the stepped bottom 102A of the upper part 102 of the support plate 101 may be set to be lower than the upper surface of the upper part 102.

[0160] The receiving portion 108 can be configured to a size into which the circuit board 110 can be inserted. The depth of the receiving portion 108 can be at least 0.5 times the thickness of the circuit board 110, for example, 0.5 to 1.5 times. If the depth of the receiving portion 108 is greater than the above range, the rigidity in the stepped area of ​​the upper portion 102 may decrease; if it is less than the above range, the effect of reducing the height of the high point of the conductor may be reduced. Molded portions 151, 152, 161, and 162 can be applied to Figure 11 The embodiments described above can also be applied. Figures 12 to 21 The embodiment is described above. Additionally, the configuration having the storage section 108 can be applied to... Figures 4a to 8 The embodiment described above. That is, the circuit board 110 disclosed in the above embodiment or variation can be applied to the stepped bottom 102A of the upper part 102. Since the height of the upper surface of the circuit board 110 can be reduced based on the upper surface of the support plate 101, the difference between the height of the upper surface of the light source part 130 and the height of the upper surface of the circuit board 110 can be reduced. Therefore, the difference between the height of the upper surface of the bonding pads 134 and 135 of the light source part 130 and the height of the upper surface of the pads 111 and 112 of the circuit board 110 can be reduced, and the connecting members 141 and 142 can reduce the tilt angle extending from each of the ends 41 and 43 to the middle line part 42, and can suppress cracking in the region between each of the ends 41 and 43 and the middle line part 42.

[0161] like Figure 22bAs shown, the bonding pads 134 and 135 of the light source section 130 can be disposed in a region lower than the upper surface of the resin member 132. Therefore, the difference between the height of the upper surface of the bonding pads 134 and 135 of the light source section 130 and the height of the upper surface of the pads 111 and 112 of the circuit board 110 can be reduced, and the connecting members 141 and 142 can reduce the tilt angle extending from each of the ends 41 and 43 to the center line portion 42, and can suppress cracking in the region between each of the ends 41 and 43 and the center line portion 42.

[0162] Figure 23 This is an example illustrating the shape of the molding portion in the above embodiment. The shape of the molding portion represents the top view shape, and the shape extending along the outer contour line may include at least one or both of a straight line, a curve, a concave shape, or a convex shape. In the shape of the side profile of the molding portion in the first direction X or the second direction Y, the contour line may include at least one or both of a convex curved surface, a concave curved surface, and an uneven shape.

[0163] like Figure 23 As shown in (A), pad PA1 is connected to the light source or circuit board, and ends 41 and 43 of connecting members 141 and 142 are connected to pad PA1. Molded portion PP1 is provided on pad PA1 and can seal the entire area of ​​each end 41, 43. The top view shape of molded portion PP1 can be circular or elliptical, and the side profile can be hemispherical or strip-elliptical.

[0164] like Figure 23 As shown in (B), the ends 41 and 43 of the connecting members 141 and 142 on the light source section or circuit board are connected to the pad PA1, and the molding part PP2 is provided on the pad PA1 and can seal the entire area of ​​each end 41 and 43. The top view shape of the molding part PP2 can be a polygonal shape, such as a square shape or a more polygonal shape (e.g., a pentagonal, hexagonal or octagonal shape), and each corner Ra1 of the polygonal shape can be an angled surface or a curved surface, and each side surface Ra2 can have a straight shape.

[0165] like Figure 23 As shown in (C), the ends 41 and 43 of the connecting members 141 and 142 on the light source section or circuit board are connected to the pad PA1, and the molding part PP2 is provided on the pad PA1 and can seal the entire area of ​​each end 41 and 43. The top view shape of the molding part PP2 can be a polygonal shape, such as a square or more polygonal shape, and each corner Ra1 of the polygon can be an angled surface or a curved surface, and is provided on the pad PA1. The side surface Ra4 can have a convex curved shape, and the side surface Sa1 offset from the pad PA can have a straight shape or a curved shape.

[0166] like Figure 23 As shown in (D), the ends 41 and 43 of the connecting members 141 and 142 on the light source or circuit board are connected to the pad PA1, and the molding part PP4 is provided on the pad PA1 and can seal the entire area of ​​each end 41 and 43. The top view shape of the molding part PP4 can be symmetrical with respect to both sides of the center line, and the symmetrical shape can be a semi-circular or semi-elliptical shape. The outer circle of the molding part PP4 can be a convex curved surface Ra5, and the two ends of the center line can have concave regions Ra7. As another example, the shapes formed on both sides of the center line can be the same, but the surface areas formed can be different.

[0167] In the lighting device according to an embodiment of the present invention, such as Figure 24 As shown, light emitted from the light source unit 130 can be extracted by a light guiding module 500 made of a transparent material. The lighting device disclosed above can be defined as a light source module.

[0168] like Figure 24 and Figure 25 As shown, the light guiding module 500 includes a transparent plate 510 and a light guiding portion 520. The transparent plate 510 can be made of a transparent plastic material, and the light guiding portion 520 protrudes from the transparent plate 510 and can also be made of a transparent plastic material. The transparent plastic material can include PC and PMMA materials. The transparent plate 510 and the light guiding portion 520 can be made of the same material. The transparent plate 510 and the light guiding portion 520 can be integrally formed using a transparent material.

[0169] The transparent plate 510 aligns the positions of the light source section 130 and the light guide section 520 and can be attached to the support plate 101. In addition, the transparent plate 510 can cover the upper periphery of the light source section 130, so that the light emitted from the light source section 130 can be effectively incident on the light guide section 520.

[0170] The lower or upper surface of the transparent plate 510 can be arranged parallel to the upper surface of the support plate 101. The transparent plate 510 is spaced apart from the upper surface of the support plate 101 by a predetermined distance, and can be located, for example, at a height higher than the upper part of the fixing member 120 in FIG1, for example, more than 2.5 mm, for example, in the range of 2.5 mm to 7 mm.

[0171] The light guide portion 520 is configured in a columnar shape and may include, for example, a circular column or a polygonal column shape. Depending on the beam angle distribution of the light source portion 130, the light guide portion 520 may have a narrow lower region and a larger upper region. The beam angle of the light source portion 130 may be 70 degrees or more, for example, in the range of 70 degrees to 150 degrees.

[0172] The light guide portion 520 may overlap with the light source portion 130 in the vertical direction. The light guide portion 520 emits point light from the light source portion 130 as surface light. The area of ​​the lower surface and / or the area of ​​the upper surface of the light guide portion 520 may be larger than the area of ​​the upper surface of the light source portion 130.

[0173] The diameter or width of the light guide portion 520 may be greater than the length D5 of one side of the light source portion 130 (see [reference]). Figure 10 For example, the length of one side of the light source portion 130 is more than 1.5 times, preferably more than 5 mm, for example, it can be in the range of 5 mm to 10 mm. If the diameter or width of the light guide portion 520 is less than the above range, the amount of incident light may be reduced, and if the diameter or width of the light guide portion 520 is greater than the above range, the light intensity or light intensity distribution may be reduced.

[0174] The transparent plate 510 includes a first support protrusion 531 and a second support protrusion 535 at its lower part. The first support protrusion 531 is located on both sides of the lower outer portion of the transparent plate 510, and the second support protrusion 535 can be located on both sides of the lower inner portion. Here, the inner side can be the direction of the circuit board 110 located at the center of the support plate 101. The transparent plate 510 can be fastened to the support plate 101 by means of the first support protrusion 531 and the second support protrusion 535. The joint portion 535A between the first support protrusion 531 and the second support protrusion 535 can be located on the upper surface of the transparent plate 510, or it can be fitted with a washer or nut.

[0175] The light guiding module 500 can extract light, such as white light, emitted to the outside through the light source section 130 of the lighting device 1000. In addition, the light guiding section 520 is positioned in the direction of the highest light intensity emitted from the light source section 130, and because of the light incident, the light can be emitted to the outside without light loss.

[0176] Figure 25 The lighting device uses the fixing member 120 disclosed above to fix the connecting members 141 and 142 to Figure 5 Example on circuit board 110 shown. Figure 26 The lighting device is an example in which the molding parts 151, 152, 161, and 162 fix the connecting members 141 and 142 to the light source part 130 and the circuit board 110, respectively. Figure 11 As shown. This connecting member can be selectively applied and fixed in the embodiments or variations disclosed above.

[0177] Reference Figure 27A vehicle headlight 90 having a lighting device according to an embodiment includes a light source module 93 and a housing 92. The light source module 93 may be disposed inside the housing 92 to emit light, and the emitted light may be reflected in the emission direction by the inner surface 92A of the housing 92. The housing 92 has a cavity 95 inside, and the cavity 95 is an area that opens in the emission direction or on one side, and the light source module 93 may be incorporated therein. The light source module 93 may include the lighting device disclosed above. When viewed from the outlet or opening direction, the shape of the cavity 95 may be hemispherical, semi-elliptical, circular, or elliptical.

[0178] The housing 92 may comprise a metallic or non-metallic material, and the non-metallic material may include a plastic material. The housing 92 may be a reflector for a headlight. The inner surface 92A of the housing 92 or the inner surface 92A of the chamber 95 may be a surface coated with a highly reflective material, or may include a reflective layer with an anti-reflective (AR) material. For example, the highly reflective material may include at least one metal such as Al, Ag, and Au, and the anti-reflective material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer on the inner surface 92A may be a single layer or multiple layers. Because the chamber 95 is surrounded by a reflective material, it can function as a reflector cup.

[0179] The headlight 90 may include an inner lens and / or an outer lens that projects light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module 93 can be adjusted according to the shape of the inner lens or the number of light source units. The light source module 93 selectively radiates light with high beam and low beam distribution patterns, and the high beam or low beam distribution pattern can be automatically turned on and off according to the driving mode or driving conditions.

[0180] The inner surface 92A of the housing 92 may include a partially dome-shaped or partially elliptical parabolic surface. The inner surface 92A may have multiple facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have free-form portions and / or flat portions and / or curved portions (e.g., any combination thereof). In some embodiments, the facets (or at least the inward-facing surfaces on the facets) may be determined at least approximately or otherwise by algebraic equations. For example, the shape of the facets or inward-facing surfaces may be represented by one or more fifth-order algebraic equations (of course, other equations of any order are possible). In at least one exemplary embodiment, the surface of the facet (or, for example, a coating) has a high reflectivity (e.g., greater than 80%). Non-limiting examples of facets and / or coatings on facets include aluminum and silver, but other reflective materials may be used.

[0181] The inner surface 92A of the housing 92 is spaced laterally from the light source module 93, and light emitted from the light source module 93 is reflected by the inner surface 92A, converging towards the emitting side of the housing 92, and can be illuminated as high beam or low beam. The exterior of the housing 92 may include various features and accessories for mounting or connecting the headlight 90 to the vehicle interior, and may have an electrical interface, such as a socket, for connecting power and / or signals. The housing 92 and chamber 95 described above are examples and can be varied in shape. According to the embodiment, the housing 92 can be used as a reflector for the left and right headlights 90.

[0182] Another example of a lamp is the application of a reflector to a lighting device, such as... Figure 28 As shown. The lighting device disclosed in this embodiment or its variations can be applied to lighting devices.

[0183] like Figure 28 As shown, the lower end of reflector 95A can be disposed on the upper part 102 of support plate 101. The lower end of reflector 95A can be disposed in a region adjacent to the light source portion 130 disposed on support plate 101. The lower end of reflector 95A can be configured to surround at least three sides and the upper surface of light source portion 130. The region between the upper end of reflector 95A and the upper end of support plate 101 can be a region in which light is emitted. The interior of reflector 95A, i.e., the region between reflector 95A and the upper end of support plate 101, is an open region and can be a region for light mixing.

[0184] The vertical distance between the upper end of reflector 95A and the upper surface of support plate 101 can be greater than the distance between the upper surface of light source portion 130 and the point where a virtual straight line perpendicular to the upper surface of light source portion 130 intersects with reflector 95A. Therefore, reflector 95A can emit light emitted from light source portion 130 in a lateral direction. Here, the lateral direction is the direction away from the straight line perpendicular to light source portion 130, and is the direction in which light reflected by reflector 95A and light emitted from light source portion 130 are emitted. As another example, the lower end of reflector 95A can be disposed on circuit board 110. As another example, the lower end of reflector 95A can be disposed on circuit board 110 and the upper part 102 of support plate 101. Depending on the position of reflector 95A, the light emission direction can vary, and for example, the light emission direction between support plate 101 and reflector 95A can be at least one of the directions orthogonal to the virtual straight line perpendicular to light source portion 130.

[0185] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, anything related to such combinations and modifications should be interpreted as being included within the scope of the present invention. Moreover, although embodiments have been primarily described above, these are merely examples and do not limit the invention, and those skilled in the art will understand that various modifications and applications not shown above are possible without departing from the essential characteristics of these embodiments. For example, each component specifically shown in the embodiments can be implemented by modification. Differences related to these modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

1. A lighting device comprising: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bonding pads; a plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding portions covering different regions of at least one of the plurality of connecting members, wherein an uppermost end of at least one of the plurality of molding portions is disposed at a position higher than a highest point of the plurality of connecting members with reference to an upper surface of the circuit board.

2. The lighting device according to claim 1, the plurality of pads including a first pad and a second pad adjacent to the light source portion, wherein, wherein the plurality of bonding pads includes a first bonding pad and a second bonding pad adjacent to the circuit board, wherein the plurality of connecting members includes a first connecting member connecting the first pad and the first bonding pad and a second connecting member connecting the second pad and the second bonding pad, and wherein an uppermost end of at least one of the plurality of molding portions is disposed at a position higher than a highest point of the first connecting member and the second connecting member with reference to an upper surface of the circuit board.

3. The lighting device according to claim 2, wherein the plurality of molding portions includes a first molding portion disposed at a first end portion of the first connecting member connected to the first pad of the light source portion and a second molding portion disposed at a first end portion of the second connecting member connected to the second pad of the light source portion.

4. The lighting device according to claim 3, wherein the first molding portion and the second molding portion are connected to each other in a region between the first pad and the second pad.

5. The lighting device according to claim 4, wherein a region of the first molding portion and the second molding portion connected to each other extends to a region between the light source portion and the circuit board and covers a middle line portion of the first connecting member and the second connecting member.

6. The lighting device according to claim 2 or 3, the plurality of molding portions includes a third molding portion disposed at a second end portion of the first connecting member connected to the first bonding pad of the circuit board and a fourth molding portion disposed at a second end portion of the second connecting member connected to the second bonding pad of the circuit board. wherein, 7. The lighting device according to claim 6, the third molding portion and the fourth molding portion are connected to each other in a region between the first bonding pad and the second bonding pad of the circuit board. wherein 8. The lighting device according to claim 7, a region of the third molding portion and the fourth molding portion connected to each other extends to a region between the light source portion and the circuit board and covers a middle line portion of the first connecting member and the second connecting member. wherein, ​ 9. The lighting device according to claim 7, wherein the plurality of molded portions include a central molded portion disposed on an intermediate connecting portion between the first end portion and the second end portion of the first connecting member and the second connecting member.

10. The lighting device according to claim 2, wherein the first connecting member and the second connecting member include first end portions connected to the first pad and the second pad of the light source portion, respectively, second end portions connected to the first land and the second land of the circuit board, respectively, and an intermediate line portion between the first end portions and the second end portions, wherein the plurality of molded portions include a first molded portion covering the first end portion, the intermediate line portion, and the second end portion of the first connecting member, and a second molded portion covering the first end portion, the intermediate line portion, and the second end portion of the second connecting member.

11. The lighting device according to claim 10, comprising: a first connecting portion connecting the first molded portion and the second molded portion to each other on the light source portion.

12. The lighting device according to claim 10, comprising: a second connecting portion connecting the first molded portion and the second molded portion to each other on the circuit board.

13. The lighting device according to any one of claims 1 to 5, wherein the support plate includes a concave receiving portion to receive the circuit board.

14. The lighting device according to any one of claims 1 to 5, wherein each of the plurality of connecting members is a strip line having a width greater than twice a thickness.

15. A lamp, comprising: a lighting device emitting white light; and a light guiding module or a reflector on the lighting device, wherein the lighting device is the lighting device according to any one of claims 1 to 5. ​

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