Magnetic suction quick release type silicon-based coplanar integrated temperature and salt sensor

Abstract

The invention discloses a magnetic suction quick release type silicon-based coplanar integrated temperature-salinity sensor, and relates to the technical field of ocean detection and environment monitoring. The sensor comprises a silicon-based coplanar integrated detection chip, a magnetic suction quick release connection structure, a diversion protection shell assembly and a full-dimensional protection assembly. According to the silicon-based coplanar integrated detection chip, a four-electrode salinity detection unit and a platinum resistor temperature detection unit are integrated on the same silicon-based substrate in a coplanar manner at an interval of less than or equal to 100 microns, so that temperature and salinity parameters are synchronously acquired in a gapless manner; the magnetic suction quick-release connecting structure adopts a triple fixing design of magnetic suction positioning, thread guiding and buckle locking, so that tool-free second-level disassembly and assembly of the probe are realized. The sensor is small in size (the outer diameter is 25 mm, and the length is 80 mm), high in detection precision (the temperature is + / -0.01 DEG C, and the salinity is + / -0.1%), convenient to maintain, low in cost and suitable for multiple scenes such as ocean survey, lake monitoring and aquaculture, and particularly meets the requirement for light-weight carrier integration.

Description

Technical Field

[0001] This invention relates to the field of marine exploration and environmental monitoring technology, specifically a magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor, which is suitable for high-precision, lightweight, and easy-to-maintain monitoring of water temperature and salinity parameters in various scenarios. Background Technology

[0002] Currently, temperature, salinity and temperature sensors are in the process of transitioning from traditional discrete modular designs to chip-level integration. They are widely used in fields such as marine surveys, inland water monitoring, and aquaculture. However, there are still many bottlenecks in the existing technology that need to be overcome.

[0003] In the field of integrated sensors, mainstream products mostly adopt a multi-channel module splicing design. Although it can achieve the measurement of multiple parameters such as temperature and salinity, it has inherent defects: the separate structure results in a large device size, and the probe is rigidly fixed to the main body, requiring complete disassembly and recycling during maintenance, making it impossible to replace quickly on-site; at the same time, it relies on metal shells and precision machining, with a single unit costing tens of thousands of yuan, making it difficult to meet the needs of large-scale popularization.

[0004] In the field of chip-level integrated sensors, although miniaturization has been achieved through integrated design, and advantages such as maintenance-free operation and anti-adhesion have been achieved, there are still obvious limitations: the entire chip module needs to be replaced when the probe is damaged, resulting in high repair costs; there is a lack of convenient plug-and-play structures, making on-site maintenance operations complicated; the chip processing technology is cumbersome, and the product cost remains high, which seriously restricts the market penetration rate and the expansion of application scenarios.

[0005] In existing technologies, neither integrated nor chip-level sensors have solved the core contradiction of "balancing high-precision integration with convenient maintenance and miniaturization with low cost." They cannot meet the integration application requirements of lightweight carriers such as miniaturized portable monitoring devices and micro buoy arrays. There is an urgent need for a new type of temperature and salinity sensor that combines high integration, quick disassembly and maintenance, low cost, and high stability. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and propose a magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor, which achieves technological breakthroughs such as high-integration synchronous detection, magnetic quick-release assembly and disassembly, all-round corrosion protection, and low-cost mass production. It is fully adaptable to the needs of multiple fields such as marine hydrological surveys, inland lake water quality monitoring, and aquaculture water body monitoring, and especially meets the requirements for integrated application of lightweight carriers.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor is characterized by comprising: a silicon-based coplanar integrated detection chip, which integrates a four-electrode salinity detection unit and a high-sensitivity platinum resistance temperature detection unit on the same silicon substrate using a coplanar layout, enabling synchronous acquisition of temperature and salinity parameters without gaps; a magnetic quick-release connection structure, consisting of a probe base with a magnetic positioning component, an elastic locking buckle, and multiple sealing gaskets, enabling tool-free quick disassembly and assembly of the probe and dual locking; a flow-guiding and protective shell assembly, featuring a biomimetic flow-guiding hole, a sealed terminal slot, and a quick-installation boss, combining flow guidance, protection, and convenient installation functions; and a multi-dimensional protection component, including a scratch-resistant and wear-resistant quartz glass window, corrosion-resistant insulated wires, passivated metal connectors, and a nano-level waterproof and anti-fouling coating, achieving multi-dimensional corrosion protection.

[0008] Furthermore, the silicon-based coplanar integrated detection chip has a size of 10mm×8mm×0.5mm and adopts coplanar micro-nano fabrication technology, so that the distance between the temperature detection unit and the salinity detection unit is ≤100μm. The detection end and the outer area of ​​the pin are vacuum sealed with parylene, with a packaging thickness of 2μm, which improves the chip's corrosion resistance and structural stability.

[0009] Furthermore, in the magnetic quick-release connection structure, the probe base has an outer diameter of 25mm and is injection molded from ABS engineering plastic. It has a trapezoidal positioning thread (major diameter 22mm, pitch 2mm) on its exterior and three sets of neodymium iron boron magnetic positioning blocks embedded inside, which, together with three high-elasticity fluororubber sealing rings, form a triple seal. The probe base has three elastic locking buckles evenly distributed around its circumference, which, together with the arc-shaped groove of the outer shell assembly, form a mechanical lock. The magnetic positioning and mechanical locking work together to achieve tool-free quick assembly and disassembly.

[0010] Furthermore, the probe base has a built-in isolated wiring cavity and an integrated multi-functional integrated groove structure: a chip positioning and mounting groove with a 0.5mm thick thermally conductive insulating adhesive layer coated on the bottom and baked and cured at 80℃, ensuring uniform heat dissipation and firm fixation of the chip; a pull-resistant wire storage channel running through the base body, with built-in wire limiting buckles; a tail annular sealing groove adapted to fluororubber sealing rings to achieve gradient sealing; and three circumferentially distributed elastic buckle mounting grooves with buckles made of shape memory alloy material to ensure reliable locking after repeated disassembly and assembly.

[0011] The base body has an ultrasonically welded quartz glass window mounting port at the front end, with a welding sealing accuracy of ≤0.01mm, and a gold-plated welding terminal interface at the rear end for connecting corrosion-resistant insulated wires to reduce contact resistance.

[0012] Furthermore, the flow-guiding protective shell assembly is injection molded from ABS engineering plastic, with an overall outer diameter of 25mm and a length of 80mm. It includes: 12 8mm×3mm rectangular flow-guiding holes with a fluid simulation optimized layout, precisely aligned with the probe to guide water to flow smoothly across the chip's detection surface, avoiding detection fluctuations caused by water flow impact while ensuring full water contact; a 20mm deep-sealed terminal slot with built-in waterproof terminals to achieve reliable connection between the chip pins and external circuits and low-loss transmission of temperature and salinity data signals; a trapezoidal internal thread interface with 3 arc-shaped slots, which cooperates with the trapezoidal positioning thread and elastic locking buckle of the probe base to form a triple fixing mechanism of magnetic positioning + thread guidance + buckle locking; an inner wall annular gradient sealing groove, adapted to a fluororubber sealing ring to achieve IP68 deep waterproofing; and a 30mm outer diameter quick-installation boss with 4 evenly distributed mounting holes, adaptable to both bolt fixing and buckle installation methods.

[0013] Furthermore, the all-dimensional protection components include: a scratch-resistant and wear-resistant quartz glass window at the probe tip with a light transmittance ≥98% and a hardness ≥7H, effectively protecting the chip detection surface; corrosion-resistant and insulated polytetrafluoroethylene wire with a temperature range of -40℃ to 120℃ and an insulation resistance ≥100MΩ; galvanized and passivated metal connectors with a salt spray test life ≥5000h; and a nano-level waterproof and anti-fouling coating sprayed on the outer surface of the shell and probe with a contact angle ≥110°, effectively resisting biological adhesion and chemical corrosion.

[0014] This invention has the following characteristics and beneficial effects: (1) Coplanar integration design, breakthrough in both detection accuracy and synchronization: The innovative silicon-based coplanar integration process integrates the temperature and salinity detection units on the same substrate with a spacing of ≤100μm. The chip size is only 10mm×8mm×0.5mm, the overall outer diameter of the sensor is 25mm and the length is 80mm. Compared with the traditional separate sensor, the volume is reduced by more than 70%, making it suitable for lightweight carriers such as micro buoys and small drones. The design without physical spacing makes the synchronous acquisition error of temperature and salinity parameters ≤0.05s, the salinity detection accuracy reaches ±0.1‰, and the temperature detection accuracy reaches ±0.01℃, solving the detection lag and gradient error problems of the traditional separate design.

[0015] (2) Magnetic quick-release structure, optimized maintenance efficiency and cost: The first "magnetic positioning + threaded guidance + buckle locking" three-in-one quick-release structure can realize the second-level disassembly and assembly of the probe without special tools (operation time ≤30s); in case of failure, only a single probe needs to be replaced (cost is only 1 / 3 of the whole machine), without the need for overall equipment recycling, which greatly reduces maintenance costs and data interruption risk; the elastic buckle made of memory alloy can withstand ≥1000 repeated disassembly and assembly, meeting the high-frequency maintenance needs of large-scale monitoring networks.

[0016] (3) Low-cost mass production design, significantly improving accessibility: The main body shell and probe base are made of ABS engineering plastic injection molding. Compared with traditional metal processing, the material cost is reduced by more than 50% and the processing efficiency is increased by 3 times; the coplanar integrated chip reduces the number of parts by 40%, simplifies the assembly process, and with the multi-cavity injection mold, the daily output of a single production line can reach more than 500 units. Mass production reduces the unit cost by 60%, breaks the price barrier of high-end sensors, and meets the needs of large-scale popular application.

[0017] (4) Comprehensive protection system, improved stability and lifespan: The system is composed of a five-fold protection system of "parylene chip packaging + fluororubber gradient sealing + waterproof sealing joint + scratch-resistant quartz glass window + nano anti-fouling coating", with a waterproof rating of IP68. It can work stably at a depth of 50 meters underwater for a long time; it has a continuous working life of ≥3 years in a seawater environment with a salinity of 3.5%, which is more than twice the lifespan of existing low-end products; it effectively resists impurities, microbial adhesion and chemical corrosion in water, ensuring the detection stability in complex water environments.

[0018] (5) Multi-scenario adaptable design, upgraded installation convenience: The quick-installation boss is compatible with both bolt fixing and snap-on installation methods, and can be quickly adapted to various carriers such as monitoring equipment, buoys, and brackets; the overall weight is ≤50g, and the size is small and lightweight, which is suitable for multiple scenarios such as marine surveys, lake monitoring, aquaculture, and groundwater detection. At the same time, it meets the integration needs of miniaturized and portable monitoring equipment, and the application scope is greatly expanded. Attached Figure Description

[0019] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the overall structure of a magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor according to an embodiment of the present invention; Figure 2 for Figure 1 Cross-sectional view; In the diagram: 1 is the flow-guiding and protective outer shell assembly; 2 is the biomimetic flow-guiding hole; 3 is the detection probe; 4 is the magnetic quick-release connection area; 5 is the quick-install boss. Detailed Implementation

[0020] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0021] The first aspect of this invention is to provide a magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor. The core structure includes a silicon-based coplanar integrated detection chip, a magnetic quick-release connection structure, a flow-guiding and protective housing assembly, and an all-dimensional protection assembly. The specific implementation of each part is as follows: Specifically, a four-electrode salinity detection unit and a high-sensitivity platinum resistance temperature detection unit are integrated onto the same silicon substrate using coplanar micro-nano fabrication technology, forming a single-chip detection core with dimensions of 10mm × 8mm × 0.5mm. The temperature detection unit adopts a serpentine resistor structure (resistance of 1kΩ at 25℃, temperature coefficient of 3850ppm / ℃), while the salinity detection unit employs a four-electrode layout of "two external electrodes for excitation and two internal electrodes for acquisition" (electrode purity ≥99.99%, effective detection area 0.785mm²). The spacing between the two is ≤100μm, reducing the size and avoiding signal interference. Eight gold-plated pins (1mm spacing, 0.3mm width) are centrally located at the chip edge. The area excluding the detection end and pins is vacuum-encapsulated with parylene (vacuum degree ≤10). ﹣ ³Pa (encapsulation thickness 2μm) improves waterproof and corrosion-resistant performance.

[0022] The magnetic quick-release connection structure includes a probe base with magnetic positioning components, elastic locking buckles, and multi-layer sealing gaskets. The probe base has an outer diameter of 25mm and a length of 35mm. It is injection molded from ABS engineering plastic (model ABS+PC-757). The external thread adopts a trapezoidal positioning thread (major diameter 22mm, pitch 2mm, thread angle 30°). Three sets of N52 type neodymium iron boron magnetic positioning blocks (size 3mm×3mm×5mm, adjacent included angle 120°) are evenly embedded in the circumference. Together with three fluororubber sealing rings (specification Φ22×2.65), a triple seal is formed. The probe base has three memory alloy elastic locking buckles (room temperature protrusion height 3mm, fatigue life ≥1000 times) evenly distributed in the circumference. These buckles form a mechanical lock with the arc-shaped groove of the outer shell component. The magnetic positioning and mechanical locking work together to achieve tool-free quick assembly and disassembly. The probe base features a built-in isolated wiring cavity and integrated functional slots: a chip positioning and mounting slot with a 0.5mm thick thermally conductive insulating adhesive layer (model TC-5021) coated on the bottom and cured at 80℃; a pull-resistant wire storage channel that runs through the base body and incorporates wire limiting clips; a rear annular sealing groove with a fluororubber sealing ring mounting position; and three circumferentially distributed elastic clip mounting slots (5mm deep, 4mm wide). The front end of the base body has an opening for ultrasonically welding a quartz glass window (welding power 500W, time 2s, sealing accuracy ≤0.01mm), and the rear end has a gold-plated welding terminal interface for connecting corrosion-resistant insulated wires to reduce contact resistance. Correspondingly, the outer shell assembly has a trapezoidal internal thread interface with three arc-shaped slots, which cooperates with the trapezoidal positioning thread and elastic locking clips of the probe base to form a triple fixing mechanism of magnetic positioning + threaded guidance + clip locking.

[0023] The flow-guiding and protective shell assembly is injection molded from ABS engineering plastic (model ABS+PC-757), with an overall outer diameter of 25mm and a length of 80mm. It includes 12 rectangular flow-guiding holes (8mm x 3mm, 6mm spacing, 0.5mm rounded corner radius), optimized for layout using ANSYS Fluent fluid simulation (simulating flow velocities of 0.1-1m / s). This ensures precise alignment with the detection probe, guiding water to flow smoothly across the chip's detection surface (with a stable flow velocity of 0.05-0.2m / s). To prevent water flow from damaging the chip; the tail is equipped with a 20mm deep sealed terminal slot with built-in waterproof terminals (model WF16-2.54-08P) to achieve reliable connection between chip pins and external circuits and low-loss transmission of temperature and salt data signals; the inner wall has an annular gradient sealing groove (groove width 3mm, groove depth 2mm) to adapt to fluororubber sealing rings to achieve IP68 protection; the 30mm outer diameter quick-release boss has 4 evenly distributed mounting holes (diameter 4mm) to adapt to both bolt fixing and snap-on installation methods.

[0024] The comprehensive protection components include: a scratch-resistant and wear-resistant quartz glass window at the probe tip (12mm×10mm×2mm, light transmittance ≥98%, hardness ≥7H); corrosion-resistant insulated PTFE wires (2×0.12mm², temperature range -40℃~120℃, insulation resistance ≥100MΩ); galvanized and passivated metal connectors (passivation film thickness ≥5μm, salt spray test life ≥5000h); and a nano-level waterproof and anti-fouling coating (fluorinated polyurethane material, thickness 10-15μm, contact angle ≥110°) sprayed on the outer surface of the housing and probe. This design provides all-around waterproof and corrosion-resistant protection for the sensor, improving its service life and stability in complex aquatic environments.

[0025] The second aspect of this invention provides a method for fabricating a magnetically detachable silicon-based coplanar integrated temperature, salinity, and temperature sensor, comprising six steps: chip fabrication, probe assembly, main body processing, overall assembly, calibration and testing, and use and maintenance. The detailed operation flow of each step is as follows: (1) Fabrication of silicon-based coplanar integrated detector chip: Step 1, silicon substrate pretreatment: Select a 4-inch, 500μm thick N-type silicon wafer (resistivity 1-10Ω·cm, crystal orientation...) <100> Using acetone as the substrate, the substrate was subjected to ultrasonic cleaning (150W power, 10min), ultrasonic cleaning (150W power, 10min), rinsing with deionized water (ultrapure water, resistivity ≥18.2MΩ·cm, 5min, water flow rate 5mL / s), and drying with nitrogen (purity ≥99.999%, flow rate 5L / min, 2min). Then, it was annealed at 1200℃ for 30min in a tube furnace under an argon protective atmosphere (flow rate 10L / min) (heating rate 5℃ / min, cooling rate 3℃ / min) to remove impurities and stress from the substrate surface and improve the flatness and stability of the substrate.

[0026] The second step is the fabrication of the platinum resistance temperature detection unit: A 250 nm thick platinum metal film was deposited on a silicon substrate using magnetron sputtering (sputtering equipment model JGP-450, vacuum degree 5×10⁻⁶). ﹣4 Pa, argon atmosphere, sputtering power 200W, pressure 0.5Pa, time 30s, film thickness uniformity ≤±5%; then, a serpentine resistivity pattern (resistivity width) is formed on the platinum metal film by photolithography (positive photoresist AZ6130, spin coating speed 3000r / min, time 30s, pre-baking 90℃, 3min, exposure dose 150mJ / cm², time 20s, developer AZ300MIF, time 60s, post-baking 120℃, 5min). The silicon wafer has a diameter of 50 μm, a length of 2000 μm, and a line spacing of 50 μm. Then, an ion etching process (equipment model ICP-200, chlorine and argon mixed gas volume ratio 1:3, etching power 300W, pressure 0.8Pa, time 2min) is used to etch away the platinum metal film not covered by photoresist, forming a platinum resistance temperature sensing unit. Finally, the silicon wafer is placed in an acetone solution for ultrasonic cleaning (power 100W, time 5min) to remove the photoresist, completing the fabrication of the temperature sensing unit.

[0027] Step 3: Fabrication of the four-electrode salinity detection unit: On the silicon substrate where the temperature sensing unit was fabricated, a platinum metal film was deposited again using magnetron sputtering (process parameters were the same as in the second step). Then, four uniformly distributed circular electrodes (electrode diameter of 1 mm) were fabricated around the temperature sensing unit using photolithography and ion etching processes, forming a four-electrode structure with "two outer electrodes for excitation and two inner electrodes for acquisition". The center-to-center distance between adjacent electrodes was 1.5 mm. Subsequently, the silicon wafer was placed in an electrochemical polishing solution (phosphoric acid: sulfuric acid: water = 6:3:1, volume ratio), and the polishing temperature was controlled at 50℃, the polishing current density at 10 mA / cm², and the polishing time at 30 s to improve the surface flatness (Ra≤0.02 μm) and corrosion resistance of the electrodes.

[0028] Step 4: Chip packaging and pin fabrication: A 2μm thick parylene anti-corrosion coating was deposited on the chip surface (excluding the temperature resistance sensor and salinity electrode sensor) using a vacuum chemical vapor deposition process (equipment model PDS-2010) (vacuum degree ≤10). ﹣ The deposition temperature was 80℃, the time was 30 min, and the coating uniformity was ≤±10%. Then, eight gold-plated pins (50nm titanium + 500nm gold metal layer) were prepared on the chip edge by photolithography, sputtering, and etching. Four of these pins are connected to a platinum resistance temperature detection unit (two signal pins and two power pins), and four of these pins are connected to a four-electrode salinity detection unit (two excitation pins and two acquisition pins). Finally, the silicon wafer was placed in a diamond dicing machine (model DAD3210) and diced at a speed of 30 mm / s and a depth of 300 μm. After dicing, a single chip (size 10 mm × 8 mm × 0.5 mm) was obtained, completing the fabrication of the integrated temperature and salinity chip.

[0029] (2) Assembly of the detection probe: Step 1, Probe Base Pretreatment: Place the injection-molded ABS probe base into a deburring machine (model GY-600) and deburr it for 5 minutes using nylon abrasive (0.2mm particle size) to ensure the surface is free of burrs and flash (Ra≤0.8μm); use compressed air (pressure 0.5MPa) to blow away internal wire storage channels and chip mounting slots to remove residual injection molding debris and dust, then wipe the internal slots with anhydrous ethanol and let them air dry; evenly coat the bottom of the chip mounting slots with a 0.5mm thick layer of thermally conductive insulating adhesive (model TC-5021), ensuring no bubbles and no missed coating; install 3 fluororubber sealing rings in the annular sealing groove at the tail of the probe base, ensuring they are fully embedded in the groove without twisting.

[0030] The second step is to fix the chip to the wires: Slowly place the prepared integrated temperature-salinity chip into the chip installation groove of the probe base, and gently press to ensure that the chip is closely fitted with the thermally conductive insulating glue (positioning deviation ≤ 0.1 mm). Then bake it in an 80 °C environment for 30 min to completely cure the thermally conductive insulating glue (hardness shore D ≥ 60 after curing); use spot welding technology (equipment model MWS-30) to weld one end of the polytetrafluoroethylene insulated wire to the gold-plated pin of the chip (welding temperature 300 - 350 °C, time 0.5 - 1 s, solder joint diameter 0.2 - 0.3 mm). The other end of the wire passes through the wire storage channel inside the probe base and extends to the connection terminal at the tail of the probe base, and is fixed by a crimping terminal and then welded. After welding, apply a layer of 1 mm thick waterproof insulating glue (model 704 silicone rubber) to the welding point to cover the entire welding area; install wire limit buckles (spacing 10 mm) in the wire storage channel to fix the wire and prevent the solder joint from falling off due to pulling.

[0031] Step 3, installation of the quartz glass window: Wipe the quartz glass window and the front installation port of the probe base with anhydrous ethanol to remove surface oil stains and dust and let it dry naturally; align the quartz glass window with the installation port, place it in an ultrasonic welding machine (model XY-2000), set the welding power to 500 W, welding time to 2 s, and welding pressure to 0.3 MPa to ensure that the cover plate and the base are firmly connected and sealed reliably (sealing accuracy ≤ 0.01 mm); place the welded probe base in water, apply a pressure of 0.3 MPa and maintain it for 5 min. If no bubbles are observed, the seal is qualified.

[0032] Step 4, installation of the magnetic attraction component and the buckle: Apply a small amount of AB glue (model EP-500) to the installation groove of the magnetic attraction positioning block built in the probe base, and embed the neodymium iron boron magnetic attraction positioning block into the groove (flush with the base end face, adjacent included angle 120°), and let the glue cure for 24 h; in the buckle installation groove at the tail of the probe base, use the injection molding insert process to fix 3 memory alloy elastic buckles, ensuring that the buckles protrude 3 mm outward in the natural state and can deform flexibly without jamming, and complete the assembly of the detection probe.

[0033] (3) Processing and assembly of the sensor main body: Step 1, processing of the main body shell: The main body shell was manufactured using ABS engineering plastic (model ABS+PC-757) through injection molding (injection molding machine model HTF90X1, barrel front temperature 220℃, middle temperature 230℃, rear temperature 210℃, injection pressure 80MPa, holding pressure 60MPa, holding time 10s, cooling time 20s); after molding, it was placed in a deburring machine and deburred with nylon abrasive for 5 minutes, followed by edge trimming with a file to ensure smooth edges; 12 8mm×3mm imitation rectangular guide holes for fluid flow were machined using a CNC machining center (model VMCL1165). The machined parts are designed with a precision of ±0.1mm and an edge fillet radius of 0.5mm. A trapezoidal internal thread interface is machined at the front end (precision grade GB / T14791-20137). Three arc-shaped slots are machined on the inner side of the interface (dimensional precision ±0.05mm, depth 3mm, width 4mm, included angle 120°). An annular gradient sealing groove is machined on the inner wall of the outer shell (groove width 3mm, groove depth 2mm, precision ±0.05mm). A terminal slot is machined at the rear. Four mounting holes with a diameter of 4mm are machined on the quick-release boss (hole position precision ±0.1mm, inner wall 45° chamfer depth 0.5mm).

[0034] Step 2, installation of internal components: Install the waterproof terminal block (model WF16-2.54-08P) in the terminal block slot at the rear of the main housing and secure it with an M2 screw (tightening torque 0.5 N·m); install the waterproof sealing connector (model PG7) at the opening of the terminal block slot, connect it with the thread and tighten it (torque 1 N·m) to ensure a tight connection between the sealing connector and the housing; use compressed air to blow out the inside of the housing to remove residual metal shavings and dust, thus completing the processing and assembly of the sensor body.

[0035] (4) Sensor assembly: The assembled probe is quickly positioned by adsorbing the magnetic positioning block at the tail to the main body shell (positioning deviation ≤ 0.5 mm). The external thread of the probe is aligned with the internal thread interface of the sensor body, and the probe is turned clockwise (torque 1.5 N·m) until the tail of the probe base is in contact with the front end of the main body shell. At this time, the elastic locking buckle at the tail of the probe is just inserted into the arc-shaped groove of the main body shell to achieve triple fixation. Then, the wires of the probe tail connection terminal are connected to the waterproof wiring terminals inside the sensor body (according to the rule of "red - power positive, black - power negative, yellow - temperature signal positive, blue - temperature signal negative, green - salinity excitation positive, white - salinity excitation negative, purple - salinity acquisition positive, gray - salinity acquisition negative", with a wire clamping torque of 0.3 N·m). After the connection is completed, the wires are tidied up and placed in the internal storage space. Finally, the wires of the external acquisition circuit are introduced through the waterproof sealing joint at the tail of the main body and connected to the internal wiring terminals. The locking nut of the sealing joint is tightened (torque 1.2 N·m) to complete the overall assembly of the sensor. After assembly, check the sensor for scratches or deformation, ensure there are no gaps at the connection between the probe and the main body, manually insert and remove it 3 times to ensure the quick-release function is working properly, and apply soapy water to the connection point to check for bubbles, indicating a good seal.

[0036] (5) Calibration Test: Place the assembled sensor into a standard temperature and salinity calibration pool (model HYDROLABHL4) to calibrate the temperature and salinity detection accuracy. The temperature calibration range is 0-40℃. Set the calibration temperatures sequentially to 0℃, 5℃, 10℃, 15℃, 20℃, 25℃, 30℃, 35℃, and 40℃. After each temperature point is stabilized for 30 minutes, record the sensor's temperature detection value and the standard temperature value, calculate the error, and compensate through an external circuit to ensure that the temperature detection accuracy reaches ±0.01℃. The salinity calibration range is 0-70‰. Set the salinity sequentially to 0‰, 10‰, 20‰, 30‰, 40‰, 50‰, 60‰, and 70‰ at each temperature point. After each salinity point is stabilized for 30 minutes, record the sensor's salinity detection value and the standard salinity value, and compensate for the error to ensure that the salinity detection accuracy reaches ±0.1‰. In the synchronization test, set the temperature to 25℃ and the salinity to 35‰, record the temperature and salinity acquisition time, and ensure that the synchronization error is ≤0.05s. Simultaneously, a waterproof performance test is conducted by placing the sensor in a pressure tank (model HS-100) at a depth of 50 meters underwater, applying a pressure of 0.5 MPa, and maintaining this pressure for 24 hours (recording the working status every 6 hours). After removal, it is checked that there is no water accumulation inside and no corrosion on the wiring terminals, indicating that the waterproof performance meets the standards. After the calibration test is passed, a product label (including model, serial number, calibration date, waterproof rating, rated working voltage, etc.) is affixed to the surface of the sensor, completing the product preparation.

[0037] (6) Use and Maintenance: When using, use the quick-release boss on the sensor body to fix the sensor on the monitoring equipment, buoy, or bracket by bolting or snap-on installation. Ensure that the bionic liquid-guiding hole on the main body shell is unobstructed and can fully contact the water body being measured. Connect the external acquisition circuit to the waterproof sealing connector at the tail of the sensor (rated working voltage 5VDC, working current ≤20mA), turn on the acquisition equipment, and the sensor can simultaneously acquire the temperature and salinity data of the water body (acquisition frequency 1-10Hz can be set) and transmit it to the acquisition equipment for storage and analysis. In daily maintenance, wipe the dirt on the shell and probe surface with a soft cloth every 30 days to avoid scratching with sharp tools; check the stability of the acquired data regularly, and store the sensor in a dry and ventilated environment when not in use (temperature -20℃~60℃, relative humidity ≤80%). If abnormal detection data or probe damage is found, first check the external circuit and power supply. If they are normal, the probe is faulty. Simply manually turn the probe counterclockwise (torque 1.5 N·m) to disengage the elastic clip from the slot, remove the faulty probe and replace it with a new, properly calibrated probe, then turn it clockwise to fix it (torque 1.5 N·m). The entire maintenance process can be completed on-site within 30 seconds without the need for professional technicians or special tools.

[0038] In summary, this invention innovatively employs silicon-based coplanar integration technology to integrate the temperature and salinity detection unit onto a single chip without gaps, solving the core problems of large size and asynchronous detection in traditional discrete designs. It pioneers a quick-release structure combining magnetic positioning, threaded guidance, and snap-locking, along with multiple sealing designs, enabling tool-free, second-level disassembly and assembly of the probe, significantly reducing maintenance costs and operational difficulty. The biomimetic fluid-guiding hole design, optimized through fluid simulation, ensures full contact with water while avoiding water flow impact, improving detection stability. The five-fold all-dimensional protection system and engineering plastic injection molding mass production process achieve a synergy of high stability and low cost, expanding the product's application scenarios and widespread adoption potential.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor, characterized in that, include: ‌ A silicon-based coplanar integrated detector chip integrates a four-electrode salinity detection unit and a high-sensitivity platinum resistance temperature detection unit on the same silicon substrate using a coplanar layout. The magnetic quick-release connection structure consists of a probe base with a magnetic positioning component, an elastic locking buckle, and multiple sealing gaskets; The flow-guiding protective housing assembly is equipped with a biomimetic flow-guiding hole, a sealed terminal slot, and a quick-release boss; The all-dimensional protective components include scratch-resistant and wear-resistant quartz glass windows, corrosion-resistant insulated wires, passivated metal connectors, and a nano-level waterproof and stain-resistant coating.

2. The magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, The silicon-based integrated detector chip measures 10mm × 8mm × 0.5mm, and the detector end and the outer area of ​​the pins are vacuum-encapsulated with parylene.

3. The magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, In the magnetic quick-release connection structure, the probe base has an outer diameter of 25mm and is injection molded from ABS engineering plastic. It has a trapezoidal positioning thread (major diameter 22mm, pitch 2mm) on the outside and three sets of neodymium iron boron magnetic positioning blocks embedded inside, which, together with three fluororubber sealing rings, form a triple seal. The probe base has three memory alloy elastic locking buckles evenly distributed around its circumference, which, together with the arc-shaped groove of the outer shell assembly, form a mechanical lock.

4. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor according to claim 3, characterized in that, The probe base has a built-in isolated wiring cavity and integrates a multi-functional integrated groove structure: Chip mounting slots with a 0.5mm thick thermally conductive insulating adhesive layer on the bottom, which are then baked and cured at 80℃; A wire storage channel that runs through the base body and connects the chip area to the tail terminal; Annular sealing groove at the tail end, suitable for use with fluororubber sealing rings; Three circumferentially distributed elastic buckle mounting slots; The base body has an ultrasonically welded quartz glass window mounting port at the front end and a gold-plated welding terminal interface at the rear.

5. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, The flow-guiding and protective outer shell assembly is injection molded from ABS engineering plastic, with an overall outer diameter of 25mm and a length of 80mm, and includes: Twelve 8mm×3mm rectangular flow-through holes are precisely aligned with the detection probe; 20mm deep sealed terminal block groove with built-in waterproof terminals; The trapezoidal internal thread interface with three arc-shaped slots, together with the trapezoidal positioning thread and elastic locking buckle of the probe base, form a triple fixing mechanism. Inner wall annular gradient sealing groove; The quick-install boss has a 30mm outer diameter and four evenly distributed mounting holes.

6. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, In the aforementioned all-dimensional protection component: Scratch-resistant and wear-resistant quartz glass windows have a light transmittance of ≥98% and a hardness of ≥7H. The corrosion-resistant insulated wire is made of polytetrafluoroethylene, with a temperature range of -40℃ to 120℃ and an insulation resistance of ≥100MΩ. Metal connectors are galvanized and passivated, with a salt spray test life of ≥5000h; The nano-level waterproof and anti-fouling coating on the outer surface of the housing and probe has a contact angle ≥110°.

7. The magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, In the silicon-based coplanar integrated detection chip, the temperature detection unit has a serpentine resistor structure with a resistance of 1kΩ at 25℃ and a temperature coefficient of 3850ppm / ℃; the salinity detection unit has a four-electrode layout with an electrode purity of ≥99.99% and an effective detection area of ​​0.785mm².

8. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, The magnetic quick-release connection structure has an elastic locking buckle fatigue life of ≥1000 cycles, a probe disassembly and assembly operation time of ≤30s, and a sensor waterproof rating of IP68, enabling it to work stably underwater at a depth of 50 meters for extended periods.

9. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, The sensor has a synchronous acquisition error of temperature and salinity parameters of ≤0.05s, a temperature detection accuracy of ±0.01℃, a salinity detection accuracy of ±0.1‰, and an overall weight of ≤50g.

10. A magnetic quick-release silicon-based coplanar integrated temperature and salinity sensor as described in claim 1, characterized in that, The sensor has a continuous working life of ≥3 years in a seawater environment with a salinity of 3.5%, and is compatible with both bolt fixing and snap-on installation methods, making it suitable for various scenarios such as marine surveys, lake monitoring, and aquaculture.

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