Temperature acquisition circuit and temperature acquisition method

Abstract

The invention discloses a temperature acquisition circuit and a temperature acquisition method, the circuit comprises a current multiplexing module and a constant current source, in the current multiplexing module, a first-stage current multiplexing unit is electrically connected with M platinum resistor temperature sensors, and a second-stage current multiplexing unit is electrically connected with the constant current source and the first-stage current multiplexing unit, the second-stage current multiplexing unit is used for performing switching control to enable the constant current source to provide a constant current signal for the first platinum resistor temperature sensor through the first-stage current multiplexing unit; in the voltage multiplexing module, a first-stage voltage multiplexing unit is electrically connected with M platinum resistor temperature sensors, and a second-stage voltage multiplexing unit is used for performing switching control to enable the first-stage voltage multiplexing unit to collect temperature signals of the first platinum resistor temperature sensor; and the signal conversion module and the data processing module are used for processing the temperature signal of the first platinum resistor temperature sensor to obtain a temperature value. According to the invention, inconvenience caused by manual temperature measurement and error interference caused by a strong magnetic environment are solved.

Description

Technical Field

[0001] This invention relates to the field of temperature measurement technology, and in particular to a temperature acquisition circuit and a temperature acquisition method. Background Technology

[0002] Electrolytic cells are core equipment required in the smelting production lines of some metal products. Taking an aluminum smelting production line as an example, the aluminum smelting production line includes the aluminum electrolysis process, and the core equipment required is the electrolytic cell. During the aluminum electrolysis process, the temperature of the electrolytic cell affects the aluminum electrolysis efficiency, product quality, and production safety. Therefore, temperature monitoring of the electrolytic cell is very important.

[0003] Aluminum smelting plants typically use large-scale electrolytic cell clusters, which have numerous temperature measurement points.

[0004] Currently, the traditional method for large-scale electrolytic cell clusters is manual temperature measurement, which is labor-intensive and inefficient, and easily increases the risk of missed or false alarms in accident reporting. The measurement environment also involves dangerous conditions such as high temperature and strong magnetic field. Summary of the Invention

[0005] This invention provides a temperature acquisition circuit and a temperature acquisition method to solve various problems associated with manual temperature measurement.

[0006] According to one aspect of the present invention, a temperature acquisition circuit is provided, comprising:

[0007] The system includes a current multiplexing module and a constant current source. The current multiplexing module comprises a second-stage current multiplexing unit and N first-stage current multiplexing units. The first-stage current multiplexing units are electrically connected to M platinum resistance temperature sensors. The second-stage current multiplexing units are electrically connected to the constant current source and the first-stage current multiplexing units. The second-stage current multiplexing units are used to perform switching control so that the constant current source provides a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing units. Both N and M are greater than 1.

[0008] A voltage multiplexing module includes a second-level voltage multiplexing unit and N first-level voltage multiplexing units electrically connected to each other. The first-level voltage multiplexing units are electrically connected to M platinum resistance temperature sensors. The second-level voltage multiplexing unit is used to perform switching control so that the first-level voltage multiplexing unit can collect the temperature signal of the first platinum resistance temperature sensor.

[0009] The signal conversion module is electrically connected to the second-stage voltage multiplexing unit and is used to convert the received temperature signal from the first platinum resistance temperature sensor to obtain a temperature voltage signal.

[0010] The data processing module is electrically connected to the signal conversion module and is used to perform temperature conversion on the temperature voltage signal of the first platinum resistance temperature sensor to obtain the temperature value of the first platinum resistance temperature sensor.

[0011] According to another aspect of the present invention, a temperature acquisition method is provided, applied in the temperature acquisition circuit as described above, the temperature acquisition method comprising:

[0012] The switching control is performed by the second-stage current multiplexing unit, so that the constant current source provides a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing unit;

[0013] The switching control is performed by the second-stage voltage multiplexing unit, so that the first-stage voltage multiplexing unit can acquire the temperature signal of the first platinum resistance temperature sensor.

[0014] The signal conversion module is invoked to convert the temperature signal from the first platinum resistance temperature sensor to obtain a temperature voltage signal.

[0015] The data processing module is invoked to perform temperature conversion on the temperature voltage signal of the first platinum resistance temperature sensor to obtain the temperature value of the first platinum resistance temperature sensor.

[0016] In this invention, the temperature acquisition circuit is electrically connected to multiple platinum resistance temperature sensors, making it suitable for large-scale electrolytic cell clusters and electrolytic cell clusters in strong magnetic environments. The temperature acquisition circuit also includes a current multiplexing module and a voltage multiplexing module. The current multiplexing module includes a first-stage current multiplexing unit and a second-stage current multiplexing unit, and the voltage multiplexing module includes a first-stage voltage multiplexing unit and a second-stage voltage multiplexing unit. The constant current signal from the constant current source can be transmitted sequentially to each platinum resistance temperature sensor through the second-stage current multiplexing unit and the first-stage current multiplexing unit. The temperature signal from each platinum resistance temperature sensor can be transmitted sequentially to the signal conversion module through the first-stage voltage multiplexing unit and the second-stage voltage multiplexing unit. The signal conversion module and the data processing module convert the temperature signals from the platinum resistance temperature sensors into temperature values. This invention enables the acquisition of temperature values ​​from each platinum resistance temperature sensor in a large-scale electrolytic cell cluster, thereby achieving temperature control for each electrolytic cell. It is not only suitable for strong magnetic environments but also replaces manual temperature measurement, providing more accurate, convenient, and rapid electrolytic cell temperature measurement and eliminating interference from strong magnetic environments on the temperature acquisition circuit. Furthermore, the use of a temperature acquisition circuit eliminates the inconvenience of manual temperature measurement and the error interference caused by strong magnetic environments. Temperature measurement personnel no longer need to frequently move through the electrolytic cell cluster to measure the temperature of each cell individually, reducing workload, improving work efficiency, and avoiding problems such as missed or incorrect temperature data. In addition, the placement of the temperature acquisition circuit within the electrolytic cell cluster makes it suitable for various electrolytic cell clusters with complex structures, special locations, and harsh environments. It solves the problems of difficulty and inaccessibility associated with manual temperature measurement, eliminating the risk of missed or false alarms and eliminating the need for measurement personnel to be in close contact with dangerous environments such as high temperatures and strong magnetic fields, ensuring the safety of temperature measurement personnel and production safety.

[0017] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a circuit board provided in an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of a temperature acquisition circuit provided in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of a platinum resistance temperature sensor provided in an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of a first current multiplexing module provided in an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of a first voltage multiplexing module provided in an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of a signal conversion module provided in an embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of a data processing module provided in an embodiment of the present invention;

[0026] Figure 8 This is a schematic diagram of a second current multiplexing module provided in an embodiment of the present invention;

[0027] Figure 9 This is a schematic diagram of a second voltage multiplexing module provided in an embodiment of the present invention;

[0028] Figure 10 This is a schematic diagram of another signal conversion module provided in an embodiment of the present invention;

[0029] Figure 11 This is a schematic diagram of a power module provided in an embodiment of the present invention;

[0030] Figure 12 This is a schematic diagram of a first isolation module provided in an embodiment of the present invention;

[0031] Figure 13 This is a schematic diagram of a communication module provided in an embodiment of the present invention;

[0032] Figure 14 This is a schematic diagram of a second isolation module provided in an embodiment of the present invention;

[0033] Figure 15 This is a schematic diagram of a storage module provided in an embodiment of the present invention;

[0034] Figure 16 This is a schematic diagram of a temperature acquisition method provided in an embodiment of the present invention. Detailed Implementation

[0035] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0036] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0037] Electrolytic cells are core equipment required in the smelting production lines of some metal products. The structure of an electrolytic cell includes the cell body, anode, and cathode. Most electrolytic cells use a diaphragm to separate the anode chamber (containing the anode) from the cathode chamber. Applying an electrical signal to the anode and cathode causes an oxidation reaction at the anode-solution interface and a reduction reaction at the cathode-solution interface, thus producing the desired metal product. Optimizing the electrolysis parameters of the electrolytic cell can improve electrolysis efficiency, product quality, and production safety. The temperature within the electrolytic cell is one of the key factors affecting electrolysis efficiency, product quality, and production safety.

[0038] Taking an aluminum smelting production line as an example, the aluminum smelting production line includes the aluminum electrolysis process, and the core equipment required is the electrolytic cell. During the aluminum electrolysis process, the temperature of the electrolytic cell affects the aluminum electrolysis efficiency, product quality, and production safety. Therefore, monitoring the temperature of the electrolytic cell is very important. The temperature of the electrolytic cell includes at least one of the following: the temperature of the cathode steel rod, the temperature of the side wall of the cell, and the temperature of the bottom of the cell. Aluminum smelting plants typically use large-scale electrolytic cell clusters, which have numerous temperature measurement points.

[0039] Currently, the traditional method for large-scale electrolytic cell clusters is manual temperature measurement. This requires personnel to frequently move through the cluster to measure the temperature of each cell individually, a task that is arduous, inefficient, and prone to omissions or errors in data. Furthermore, the complex structure of electrolytic cell clusters, with some areas in challenging and harsh environments, makes manual temperature measurement particularly difficult, sometimes even inaccessible, increasing the risk of missed or false alarms. Moreover, manual temperature measurement involves close contact with high temperatures and strong magnetic fields, posing a serious risk to the personnel's safety. An accident could not only result in personal injury or death but also potentially trigger a larger production safety incident.

[0040] To address the problems associated with manual temperature measurement, this invention provides a temperature acquisition circuit. Figure 1 This is a schematic diagram of a circuit board provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of a temperature acquisition circuit provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of a platinum resistance temperature sensor provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of a first current multiplexing module provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of a first voltage multiplexing module provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of a signal conversion module provided in an embodiment of the present invention. Figure 7 This is a schematic diagram of a data processing module provided in an embodiment of the present invention. This embodiment is applicable to monitoring the temperature of electrolytic cells in a large-scale electrolytic cell group. (Reference) Figures 1 to 7As shown, the temperature acquisition circuit includes: a constant current source 110 and a current multiplexing module 120. The current multiplexing module 120 includes a second-stage current multiplexing unit 122 and N first-stage current multiplexing units 121. The first-stage current multiplexing units 121 are electrically connected to M platinum resistance temperature sensors 101. The second-stage current multiplexing unit 122 is electrically connected to the constant current source 110 and the first-stage current multiplexing unit 121. The second-stage current multiplexing unit 122 is used for switching control so that the constant current source 110 provides a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing unit 121. N and M are both greater than 1. A voltage multiplexing module 130 is also included, which includes a second-stage voltage multiplexing module 130. The system includes a multiplexing unit 132 and N first-stage voltage multiplexing units 131. The first-stage voltage multiplexing units 131 are electrically connected to M platinum resistance temperature sensors 101. The second-stage voltage multiplexing unit 132 is used for switching control, enabling the first-stage voltage multiplexing units 131 to acquire temperature signals from the first platinum resistance temperature sensors. A signal conversion module 140, electrically connected to the second-stage voltage multiplexing unit 132, is used to convert the received temperature signals from the first platinum resistance temperature sensors to obtain a temperature-voltage signal. A data processing module 150, electrically connected to the signal conversion module 140, is used to perform temperature conversion on the temperature-voltage signal from the first platinum resistance temperature sensors to obtain the temperature value of the first platinum resistance temperature sensors. Optional temperature acquisition circuitry can be integrated on a circuit board 100, which can be a PCB circuit board or other types, without specific limitations.

[0041] like Figure 2 As shown, the optional constant current source 110 is integrated into the signal conversion module 140; in other embodiments, the optional temperature acquisition circuit may include a separate constant current source.

[0042] The optional platinum resistance temperature sensor (PT100) 101 has a three-terminal structure, including a first signal terminal AC1, a second signal terminal AC2, and a reference terminal R. The PT100 is connected to the circuit board 100 containing the temperature acquisition circuit via a 3P terminal. The PT100 uses a three-wire RTD to effectively reduce lead wire errors. The three wires are connected to two constant current sources and the reference resistor Rref, respectively. The PT100 has anti-electromagnetic interference properties. The PT100 can be used in large-scale aluminum electrolysis cell clusters, with one or more PT100 sensors installed in a single cell. The aluminum electrolysis process generates strong magnetism. The use of the PT100 in this invention for large-scale aluminum electrolysis cell clusters allows it to operate in strong magnetic environments without the influence of strong magnetic fields on temperature measurement data errors, and also avoids equipment downtime or malfunctions. The temperature acquisition circuit provided by this invention is suitable for strong magnetic environments. It can not only replace manual temperature measurement, but also achieve more accurate, convenient and fast measurement. At the same time, it can solve the interference caused by strong magnetic environments to the temperature acquisition circuit.

[0043] In this embodiment, the temperature acquisition circuit includes a constant current source 110, which provides a constant current signal, which can be understood as a constant current. Depending on the requirements of the temperature acquisition circuit, the temperature acquisition circuit may include one or more constant current sources 110. Each constant current source 110 provides a constant current signal to the temperature acquisition circuit, and the constant current signals provided by different constant current sources 110 may be the same or different.

[0044] The temperature acquisition circuit includes a current multiplexing module 120, which is electrically connected to a constant current source 110 and multiple platinum resistance temperature sensors 101. The multiple platinum resistance temperature sensors 101 are sequentially labeled PT01, PT02, PT03, PT04, PT05, PT06, PT07, ... The current multiplexing module 120 is used to transmit the constant current signal provided by the constant current source 110 to the multiple platinum resistance temperature sensors 101 in a time-division manner. In this embodiment, taking a temperature acquisition circuit including 36 platinum resistance temperature sensors 101 as an example, the current multiplexing module 120 is electrically connected to the constant current source 110 and the 36 platinum resistance temperature sensors 101 respectively, and the current multiplexing module 120 sequentially transmits the constant current signal provided by the constant current source 110 to the 36 platinum resistance temperature sensors 101.

[0045] The current multiplexing module 120 includes N first-level current multiplexing units 121, which can be sequentially labeled as first-level current multiplexing unit 121(1), first-level current multiplexing unit 121(2), ..., first-level current multiplexing unit 121(N). Each first-level current multiplexing unit 121 is electrically connected to M platinum resistance temperature sensors 101. Specifically, each first-level current multiplexing unit 121 includes output terminals from the first to the Mth, and each of the M output terminals is electrically connected to one of the M platinum resistance temperature sensors 101. The number of platinum resistance temperature sensors 101 electrically connected to two different first-level current multiplexing units 121 may be the same or different. Based on the number of platinum resistance temperature sensors 101 in the temperature acquisition circuit, the number of platinum resistance temperature sensors 101 electrically connected to each first-level current multiplexing unit 121 is reasonably allocated, without specific restrictions here. The current multiplexing module 120 also includes at least one second-stage current multiplexing unit 122. The second-stage current multiplexing unit 122 is electrically connected to the constant current source 110 and N first-stage current multiplexing units 121, respectively. Specifically, the second-stage current multiplexing unit 122 is electrically connected to the input terminal of each first-stage current multiplexing unit 121. If the current multiplexing module 120 includes multiple second-stage current multiplexing units 122, the multiple second-stage current multiplexing units 122 operate in a time-sharing manner.

[0046] For the current multiplexing module 120, the second-stage current multiplexing unit 122 is used for switching control to select one first-stage current multiplexing unit 121 from N first-stage current multiplexing units 121; the selected first-stage current multiplexing unit 121 is used for switching control to select one platinum resistance temperature sensor 101 from M correspondingly electrically connected platinum resistance temperature sensors 101; then the transmission path between the constant current source 110 and the selected platinum resistance temperature sensor 101 is made conductive through the current multiplexing module 120, and the constant current signal of the constant current source 110 is transmitted to the selected platinum resistance temperature sensor 101 through the current multiplexing module 120. The selected platinum resistance temperature sensor 101 is the first platinum resistance temperature sensor. It can be understood that the first platinum resistance temperature sensor is any platinum resistance temperature sensor 101 in the temperature acquisition circuit. In this embodiment, the first platinum resistance temperature sensor is PT08 to illustrate the acquisition process of the temperature acquisition circuit.

[0047] For example, the second-stage current multiplexing unit 122 performs switching control to select the first-stage current multiplexing unit 121(1) from N first-stage current multiplexing units 121. That is, the second-stage current multiplexing unit 122 controls the transmission path between the constant current source 110 and the input terminal of the selected first-stage current multiplexing unit 121(1) to be connected. The first-stage current multiplexing unit 121(1) performs switching control to select the first platinum resistance temperature sensor PT08 from the corresponding electrically connected platinum resistance temperature sensors PT01 to PT08. That is, the eighth output terminal of the first-stage current multiplexing unit 121(1) is electrically connected to the first platinum resistance temperature sensor PT08. The selected first-stage current multiplexing unit 121(1) controls the transmission path between the input terminal and the eighth output terminal of the first-stage current multiplexing unit 121(1) to be connected. Based on this, the transmission path between the constant current source 110 and the first platinum resistance temperature sensor PT08 is established. The constant current signal of the constant current source 110 is transmitted sequentially to the first platinum resistance temperature sensor PT08 through the second-stage current multiplexing unit 122 and the first-stage current multiplexing unit 121 (1), thus realizing the transmission of the constant current signal of the constant current source 110 to the first platinum resistance temperature sensor PT08. Similarly, the constant current signal of the constant current source 110 can be transmitted to each platinum resistance temperature sensor 101 in a time-division manner through the current multiplexing module 120.

[0048] refer to Figure 4As shown, the optional temperature acquisition circuit includes a first current multiplexing module 120A, in which the M output terminals of the first-stage current multiplexing unit 121A are electrically connected to the first signal terminals AC1 of the M platinum resistance temperature sensors 101; the constant current source 110 is electrically connected to the first current multiplexing module 120A. For example, the first current multiplexing module 120A includes five first-stage current multiplexing units 121A, labeled as 121A(1), 121A(2), 121A(3), 121A(4), and 121A(5) respectively. Each of the first-stage current multiplexing units 121A(1) to 121A(4) is electrically connected to eight platinum resistance temperature sensors 101, and each of the first-stage current multiplexing units 121A(5) is electrically connected to four platinum resistance temperature sensors 101. The eight output terminals IDAC1_1 to IDAC1_8 of the first-stage current multiplexing unit 121A(1) are electrically connected to the first signal terminals AC1 of the eight platinum resistance temperature sensors PT01 to PT08 respectively. Therefore, the eighth output terminal IDAC1_8 of the first-stage current multiplexing unit 121A(1) is electrically connected to the first signal terminal AC1 of the eight platinum resistance temperature sensors PT01 to PT08. The first signal terminal AC1 of a platinum resistance temperature sensor PT08 is electrically connected to the input terminal IDAC1_1_8 of the first-stage current multiplexing unit 121A(1), which is connected to the signal terminal IDAC1_1_8 of the second-stage current multiplexing unit 122A. Similarly, the four output terminals IDAC1_33~IDAC1_36 of the first-stage current multiplexing unit 121A(5) are electrically connected to the first signal terminal AC1 of the four platinum resistance temperature sensors PT33~PT36, respectively. The input terminal IDAC1_33_36 of the first-stage current multiplexing unit 121A(5) is electrically connected to the signal terminal IDAC1_33_36 of the second-stage current multiplexing unit 122A. The input terminal IDAC1 of the second-stage current multiplexing unit 122A is electrically connected to the constant current source 110 to receive the constant current signal IDAC1. Based on this, the process of applying a constant current signal IDAC1 to the first platinum resistance temperature sensor PT08 is as follows: the second-stage current multiplexing unit 122A performs switching control to make the transmission path between its input terminal IDAC1 and the signal terminal IDAC1_1_8 open; the first-stage current multiplexing unit 121A(1) performs switching control to make the transmission path between its input terminal IDAC1_1_8 and the eighth output terminal IDAC1_8 open; then the constant current signal IDAC1 of the constant current source 110 is transmitted sequentially through the second-stage current multiplexing unit 122A and the first-stage current multiplexing unit 121A(1) to the first signal terminal AC1 of the first platinum resistance temperature sensor PT08.

[0049] It should be noted that in several embodiments of the present invention, two ports have the same marking. For example, the signal terminal IDAC1_1_8 of the second-level current multiplexing unit 122A and the input terminal IDAC1_1_8 of the first-level current multiplexing unit 121A(1) use the same marking IDAC1_1_8. In this case, the same marking of different ports can be understood in the circuit as the two ports being connected for signal transmission, which will not be described in detail here.

[0050] It is understandable that if the number of platinum resistance temperature sensors is further increased, such as 72 platinum resistance temperature sensors, then PT01 to PT36 can correspond to one group of second-stage current multiplexing units and first-stage current multiplexing units; PT37 to PT72 can correspond to another group of second-stage current multiplexing units and first-stage current multiplexing units; the second-stage current multiplexing units in different groups operate in a time-division manner, realizing the time-division transmission of the constant current signal from the same constant current source 110 to the 72 platinum resistance temperature sensors.

[0051] The temperature acquisition circuit includes a voltage multiplexing module 130 and a signal conversion module 140. The voltage multiplexing module 130 is electrically connected to the signal conversion module 140 and multiple platinum resistance temperature sensors 101. The voltage multiplexing module 130 is used to sequentially acquire the temperature signal of each platinum resistance temperature sensor 101 and transmit it to the signal conversion module 140 for processing. The voltage multiplexing module 130 includes N first-level voltage multiplexing units 131. The N first-level voltage multiplexing units 131 can be sequentially labeled as first-level voltage multiplexing unit 131(1), first-level voltage multiplexing unit 131(2), ... The first-level voltage multiplexing unit 131 includes the first to the Mth input terminals, and the M input terminals are respectively electrically connected to the M platinum resistance temperature sensors 101. The number of platinum resistance temperature sensors 101 electrically connected to two different first-level voltage multiplexing units 131 may be the same or different. The voltage multiplexing module 130 also includes at least one second-stage voltage multiplexing unit 132. The second-stage voltage multiplexing unit 132 is electrically connected to the signal conversion module 140 and N first-stage voltage multiplexing units 131, respectively. Specifically, the second-stage voltage multiplexing unit 132 is electrically connected to the output terminal of each first-stage voltage multiplexing unit 131. If the voltage multiplexing module 130 includes multiple second-stage voltage multiplexing units 132, the multiple second-stage voltage multiplexing units 132 operate in a time-sharing manner.

[0052] For voltage multiplexing module 130, second-level voltage multiplexing unit 132 is used to perform switching control to select one first-level voltage multiplexing unit 131 from N first-level voltage multiplexing units 131. The selected first-level voltage multiplexing unit 131 is used to perform switching control to select one platinum resistance temperature sensor 101 from M platinum resistance temperature sensors 101 that are electrically connected. Then, the transmission path between signal conversion module 140 and the selected platinum resistance temperature sensor 101 is made open through voltage multiplexing module 130, and the temperature signal of the selected platinum resistance temperature sensor 101 is transmitted to signal conversion module 140 through voltage multiplexing module 130.

[0053] For example, the second-stage voltage multiplexing unit 132 performs switching control to select the first-stage voltage multiplexing unit 131(1) from N first-stage voltage multiplexing units 131. That is, the second-stage voltage multiplexing unit 132 controls the transmission path between the signal conversion module 140 and the output terminal of the first-stage voltage multiplexing unit 131(1). The first-stage voltage multiplexing unit 131(1) performs switching control to select the first platinum resistance temperature sensor PT08 from the corresponding electrically connected platinum resistance temperature sensors PT01 to PT08. That is, the eighth input terminal of the first-stage voltage multiplexing unit 131(1) is electrically connected to the first platinum resistance temperature sensor PT08. The first-stage voltage multiplexing unit 131(1) controls the transmission path between the output terminal of the first-stage voltage multiplexing unit 131(1) and the eighth input terminal to be connected. Based on this, the transmission path between the signal conversion module 140 and the first platinum resistance temperature sensor PT08 is established. The temperature signal of the first platinum resistance temperature sensor PT08 is transmitted to the signal conversion module 140 sequentially through the first-stage voltage multiplexing unit 131(1) and the second-stage voltage multiplexing unit 132, enabling the signal conversion module 140 to acquire the temperature signal of the first platinum resistance temperature sensor PT08. Similarly, the signal conversion module 140 can acquire the temperature signal of each platinum resistance temperature sensor 101 in a time-division manner through the voltage multiplexing module 130.

[0054] refer to Figure 5As shown, the optional temperature acquisition circuit includes a first voltage multiplexing module 130A. The M input terminals of the first-stage voltage multiplexing unit 131A in the first voltage multiplexing module 130A are electrically connected to the first signal terminals AC1 of the M platinum resistance temperature sensors 101. The signal conversion module 140 is electrically connected to the first voltage multiplexing module 130A. For example, the first voltage multiplexing module 130A includes five first-stage voltage multiplexing units 131A, labeled 131A(1), 131A(2), 131A(3), 131A(4), and 131A(5) respectively. Each of the first-stage voltage multiplexing units 131A(1) to 131A(4) is electrically connected to eight platinum resistance temperature sensors 101, and each of the first-stage voltage multiplexing units 131A(5) is electrically connected to four platinum resistance temperature sensors 101. The eight input terminals IDAC1_1 to IDAC1_8 of the first-stage voltage multiplexing unit 131A(1) are electrically connected to the first signal terminals AC1 of the eight platinum resistance temperature sensors PT01 to PT08 respectively. Therefore, the eighth input terminal IDAC1_1 of the first-stage voltage multiplexing unit 131A(1) is... 8 is electrically connected to the first signal terminal AC1 of the first platinum resistance temperature sensor PT08, and the output terminal AIN1_1_8 of the first-stage voltage multiplexing unit 131A(1) is electrically connected to the signal terminal AIN1_1_8 of the second-stage voltage multiplexing unit 132A; and so on, the four input terminals IDAC1_33~IDAC1_36 of the first-stage voltage multiplexing unit 131A(5) are electrically connected to the first signal terminal AC1 of the four platinum resistance temperature sensors PT33~PT36, and the output terminal AIN1_33_36 of the first-stage voltage multiplexing unit 131A(5) is electrically connected to the signal terminal AIN1_33_36 of the second-stage voltage multiplexing unit 132A; the output terminal AIN1 of the second-stage voltage multiplexing unit 132A is electrically connected to the signal conversion module 140. Based on this, the process of acquiring temperature signals from the first platinum resistance temperature sensor PT08 is as follows: the first-stage voltage multiplexing unit 131A(1) performs switching control to connect the transmission path between its eighth input terminal IDAC1_8 and output terminal AIN1_1_8; the second-stage voltage multiplexing unit 132A performs switching control to connect the transmission path between its signal terminal AIN1_1_8 and output terminal AIN1. Then, the temperature signal output from the first signal terminal AC1 of the first platinum resistance temperature sensor PT08 is sequentially transmitted to the signal conversion module 140 through the first-stage voltage multiplexing unit 131A(1) and the second-stage voltage multiplexing unit 132A. The temperature signal provided by the platinum resistance temperature sensor 101 can optionally be a voltage signal.

[0055] It is understandable that if the number of platinum resistance temperature sensors is further increased, such as 72 platinum resistance temperature sensors, then PT01 to PT36 can correspond to one group of second-level voltage multiplexing units and first-level voltage multiplexing units; PT37 to PT72 can correspond to another group of second-level voltage multiplexing units and first-level voltage multiplexing units; the second-level voltage multiplexing units in different groups operate in a time-division manner to realize the time-division acquisition of temperature signals from 72 platinum resistance temperature sensors.

[0056] The signal conversion module 140 converts the received temperature signal from the first platinum resistance temperature sensor PT08 into a temperature voltage signal. The data processing module 150 is electrically connected to the signal conversion module 140. The data processing module 150 obtains the temperature voltage signal from the first platinum resistance temperature sensor PT08 from the signal conversion module 140 and performs a temperature conversion on the signal voltage signal to obtain the temperature value. In other words, the temperature value obtained by the data processing module 150 based on the temperature voltage signal of the first platinum resistance temperature sensor PT08 is the temperature value of the first platinum resistance temperature sensor PT08. Similarly, the data processing module 150 can sequentially acquire the temperature values ​​of each platinum resistance temperature sensor 101.

[0057] refer to Figure 3 and Figure 6 As shown, the reference terminal R of each platinum resistance temperature sensor 101 is electrically connected to node REFP on circuit board 100, and node REFP is electrically connected to the signal terminal REFP0 of signal conversion module 140 through resistor R9. (Reference) Figure 4 and Figure 6 As shown, when the constant current source 110 is integrated into the signal conversion module 140, the constant current source 110 provides a constant current signal to the signal terminal IDAC1 of the signal conversion module 140. The signal terminal IDAC1 of the signal conversion module 140 is electrically connected to the input terminal IDAC1 of the second-stage current multiplexing unit 122A. (Reference) Figure 5 and Figure 6 As shown, the signal terminal AIN1 of the signal conversion module 140 is electrically connected to the output terminal AIN1 of the second-stage voltage multiplexing unit 132A through resistor R11. (Reference) Figure 6 and Figure 7 As shown, the signal terminals with the same markings in the signal conversion module 140 and the data processing module 150 are electrically connected. For example, the signal terminal SPI_CS of the signal conversion module 140 is electrically connected to the signal terminal SPI_CS of the data processing module 150. The connections of other ports with the same markings will not be described in detail.

[0058] Continue to refer to Figures 4 to 7As shown, the data processing module 150 is a control module for the temperature acquisition current. Under the control of the data processing module 150, the signal conversion module 140 provides a constant current signal to the first platinum resistance temperature sensor PT08 through the first current multiplexing module 120A; sequentially, the signal conversion module 140 acquires the temperature signal from the first platinum resistance temperature sensor PT08 through the first voltage multiplexing module 130A; the signal conversion module 140 processes the temperature signal of the first platinum resistance temperature sensor PT08 to obtain a temperature voltage signal, and the data processing module 150 converts the temperature voltage signal into a temperature value to obtain the temperature value of the first platinum resistance temperature sensor PT08.

[0059] The data processing module 150 includes a temperature conversion algorithm. This algorithm uses a proportional measurement method, eliminating the need to convert the ADC output code to voltage. The output code only provides the measured value as a ratio to the reference resistor value, without requiring a precise excitation current value. In the temperature conversion algorithm, the conversion formula between thermistor and temperature is derived from a simplified form of the Callendar-Van Dusen equation: Rt = Ro. (1+A t+B t²), where Rt is the resistance value at temperature t, Ro is the nominal resistance at 0 degrees Celsius (Ro for PT100 is 100.0Ω), and A and B are the temperature coefficients of the platinum resistance.

[0060] It should be noted that the temperature acquisition circuit measures the resistance value of the platinum resistance temperature sensor 101. In other words, the temperature voltage signal provided by the signal conversion module 140 is correlated with the resistance value of the platinum resistance temperature sensor 101. The data processing module 150 performs filtering, error elimination, and temperature conversion algorithms on the temperature voltage signal to obtain the temperature value corresponding to the first platinum resistance temperature sensor PT08. Subsequently, the data processing module 150 transmits the measured temperature value of the first platinum resistance temperature sensor PT08 to the communication bus via the communication module for subsequent interface display.

[0061] In this invention, the temperature acquisition circuit is electrically connected to multiple platinum resistance temperature sensors, making it suitable for large-scale electrolytic cell clusters and electrolytic cell clusters in strong magnetic environments. The temperature acquisition circuit also includes a current multiplexing module and a voltage multiplexing module. The current multiplexing module includes a first-stage current multiplexing unit and a second-stage current multiplexing unit, and the voltage multiplexing module includes a first-stage voltage multiplexing unit and a second-stage voltage multiplexing unit. The constant current signal from the constant current source can be transmitted sequentially to each platinum resistance temperature sensor through the second-stage current multiplexing unit and the first-stage current multiplexing unit. The temperature signal from each platinum resistance temperature sensor can be transmitted sequentially to the signal conversion module through the first-stage voltage multiplexing unit and the second-stage voltage multiplexing unit. The signal conversion module and the data processing module convert the temperature signals from the platinum resistance temperature sensors into temperature values. This invention enables the acquisition of temperature values ​​from each platinum resistance temperature sensor in a large-scale electrolytic cell cluster, thereby achieving temperature control for each electrolytic cell. It is not only suitable for strong magnetic environments but also replaces manual temperature measurement, providing more accurate, convenient, and rapid electrolytic cell temperature measurement and eliminating interference from strong magnetic environments on the temperature acquisition circuit. Furthermore, the use of a temperature acquisition circuit eliminates the inconvenience of manual temperature measurement and the error interference caused by strong magnetic environments. Temperature measurement personnel no longer need to frequently move through the electrolytic cell cluster to measure the temperature of each cell individually, reducing workload, improving work efficiency, and avoiding problems such as missed or incorrect temperature data. In addition, the placement of the temperature acquisition circuit within the electrolytic cell cluster makes it suitable for various electrolytic cell clusters with complex structures, special locations, and harsh environments. It solves the problems of difficulty and inaccessibility associated with manual temperature measurement, eliminating the risk of missed or false alarms and eliminating the need for measurement personnel to be in close contact with dangerous environments such as high temperatures and strong magnetic fields, ensuring the safety of temperature measurement personnel and production safety.

[0062] Figure 8 This is a schematic diagram of a second current multiplexing module provided in an embodiment of the present invention. Figure 9 This is a schematic diagram of a second voltage multiplexing module provided in an embodiment of the present invention. Figure 10 This is a schematic diagram of another signal conversion module provided in an embodiment of the present invention. (Reference) Figures 4 to 10As shown, the optional current multiplexing module 120 includes a first current multiplexing module 120A and a second current multiplexing module 120B. In the first current multiplexing module 120A, the M output terminals of the first-stage current multiplexing unit 121A are electrically connected to the first signal terminals AC1 of the M platinum resistance temperature sensors 101. In the second current multiplexing module 120B, the M output terminals of the first-stage current multiplexing unit 121B are electrically connected to the second signal terminals AC2 of the M platinum resistance temperature sensors 101. The voltage multiplexing module 130 includes a first voltage multiplexing module 120A and a second current multiplexing module 120B. Using module 130A and second voltage multiplexing module 130B, the M input terminals of the first-stage voltage multiplexing unit 131A in the first voltage multiplexing module 130A are electrically connected to the first signal terminals AC1 of the M platinum resistance temperature sensors 101, and the M input terminals of the first-stage voltage multiplexing unit 131B in the second voltage multiplexing module 130B are electrically connected to the second signal terminals AC2 of the M platinum resistance temperature sensors 101; the constant current source 110 is electrically connected to the first current multiplexing module 120A and the second current multiplexing module 120B respectively. The optional constant current source 110 includes a first constant current source 110A, a second constant current source 110B, and a constant current switching unit 110C. The constant current switching unit 110C is electrically connected to the first constant current source 110A, the first current multiplexing module 120A, the second constant current source 110B, and the second current multiplexing module 120B, respectively. It controls the first constant current source 110A to provide a first constant current signal IDAC1 to the first current multiplexing module 120A, and sequentially controls the second constant current source 110B to provide a second constant current signal IDAC2 to the second current multiplexing module 120B. Optionally, the first and second constant current signals may have the same current value.

[0063] In this embodiment, the circuit structure of the first current multiplexing module 120A is referenced. Figure 4 As shown, without detailed description here, the first current multiplexing module 120A is used to transmit the first constant current signal IDAC1 of the first constant current source 110A to the first signal terminal AC1 of the multiple platinum resistance temperature sensors 101 in a time-division manner. The second current multiplexing module 120B is electrically connected to the second constant current source 110B and the second signal terminal AC2 of the multiple platinum resistance temperature sensors 101. The second current multiplexing module 120B is used to transmit the second constant current signal IDAC2 of the second constant current source 110B to the second signal terminal AC2 of the multiple platinum resistance temperature sensors 101 in a time-division manner. Here, the acquisition process of the temperature acquisition circuit is illustrated using PT08 as an example of the first platinum resistance temperature sensor.

[0064] refer to Figure 8As shown, the second current multiplexing module 120B includes five first-stage current multiplexing units 121B(1) to 121B(5); the input terminal IDAC2_1_8 of the first-stage current multiplexing unit 121B(1) is electrically connected to the signal terminal IDAC2_1_8 of the second-stage current multiplexing unit 122B, and the eight output terminals IDAC2_1 to IDAC2_8 of the first-stage current multiplexing unit 121B(1) are electrically connected to the second signal terminal AC2 of eight platinum resistance temperature sensors PT01 to PT08 in sequence. Among them, the eighth output terminal IDAC2_8 of the first-stage current multiplexing unit 121B(1) is electrically connected to the second signal terminal AC2 of eight platinum resistance temperature sensors PT01 to PT08. The second signal terminal AC2 of the platinum resistance temperature sensor PT08 is connected to the second signal terminal AC2 of the first-stage current multiplexing unit 121B(5). Similarly, the input terminal IDAC2_33_36 of the first-stage current multiplexing unit 121B(5) is electrically connected to the signal terminal IDAC2_33_36 of the second-stage current multiplexing unit 122B. The four output terminals IDAC2_33~IDAC2_36 of the first-stage current multiplexing unit 121B(5) are electrically connected to the second signal terminal AC2 of the four platinum resistance temperature sensors PT33~PT36 respectively. The input terminal IDAC2 of the second-stage current multiplexing unit 122B is electrically connected to the second constant current source 110B to receive the second constant current signal IDAC2. Based on this, the process of applying the second constant current signal IDAC2 to the first platinum resistance temperature sensor PT08 is as follows: the second constant current signal IDAC2 of the second constant current source 110B is transmitted sequentially through the second-stage current multiplexing unit 122B and the first-stage current multiplexing unit 121B(1) to the second signal terminal AC2 of the first platinum resistance temperature sensor PT08.

[0065] Circuit structure reference for the first voltage multiplexing module 130A Figure 5 As shown, without detailed description here, the first voltage multiplexing module 130A is used to transmit the temperature signals from the first signal terminals AC1 of the multiple platinum resistance temperature sensors 101 to the signal conversion module 140. The second voltage multiplexing module 130B is electrically connected to the signal conversion module 140 and the second signal terminals AC2 of the multiple platinum resistance temperature sensors 101, and is used to transmit the temperature signals from the second signal terminals AC2 of the multiple platinum resistance temperature sensors 101 to the signal conversion module 140.

[0066] refer to Figure 9As shown, the second voltage multiplexing module 130B includes five first-stage voltage multiplexing units 131B(1) to 131B(5); the eight input terminals IDAC2_1 to IDAC2_8 of the first-stage voltage multiplexing unit 131B(1) are sequentially electrically connected to the second signal terminals AC2 of eight platinum resistance temperature sensors PT01 to PT08, wherein the eighth input terminal IDAC2_8 of the first-stage voltage multiplexing unit 131B(1) is electrically connected to the second signal terminal AC2 of the first platinum resistance temperature sensor PT08, and the output terminal AIN2_1 of the first-stage voltage multiplexing unit 131B(1) is... 8. The signal terminal AIN2_1_8 of the second-stage voltage multiplexing unit 132B is electrically connected; similarly, the four input terminals IDAC2_33~IDAC2_36 of the first-stage voltage multiplexing unit 131B(5) are electrically connected to the second signal terminals AC2 of the four platinum resistance temperature sensors PT33~PT36, respectively. The output terminal AIN2_33_36 of the first-stage voltage multiplexing unit 131B(5) is electrically connected to the signal terminal AIN2_33_36 of the second-stage voltage multiplexing unit 132B; the output terminal AIN2 of the second-stage voltage multiplexing unit 132B is electrically connected to the signal conversion module 140. Based on this, the process of acquiring the temperature signal from the first platinum resistance temperature sensor PT08 is as follows: the temperature signal output from the second signal terminal AC2 of the first platinum resistance temperature sensor PT08 is transmitted sequentially to the signal conversion module 140 through the first-stage voltage multiplexing unit 131B(1) and the second-stage voltage multiplexing unit 132B.

[0067] The signal conversion module 140 integrates a first constant current source 110A and a second constant current source 110B. The first constant current source 110A provides a first constant current signal IDAC1 to the first signal terminal IDAC1 of the signal conversion module 140 through a constant current switching unit 110C. The second constant current source 110B provides a second constant current signal IDAC2 to the second signal terminal IDAC2 of the signal conversion module 140 through the constant current switching unit 110C. Here, the constant current switching unit 110C controls the first constant current source 110A and the second constant current source 110B to be turned on in a time-division manner. That is, in the first stage, the constant current switching unit 110C controls the first constant current source 110A to provide the first constant current signal IDAC1 to the first current multiplexing module 120A, and the constant current switching unit 110C controls the transmission path between the second constant current source 110B and the second signal terminal IDAC2 of the signal conversion module 140 to be disconnected. In the second stage, which is different from the first stage, the constant current switching unit 110C controls the transmission path between the first constant current source 110A and the first signal terminal IDAC1 of the signal conversion module 140 to be disconnected, and the constant current switching unit 110C controls the second constant current source 110B to provide the second constant current signal IDAC2 to the second current multiplexing module 120B.

[0068] The temperature value of the first platinum resistance temperature sensor PT08 can be the average of a first temperature value and a second temperature value; wherein the first temperature value is obtained based on the first temperature signal of the first platinum resistance temperature sensor PT08 collected by the first voltage multiplexing module 130A, and the second temperature value is obtained based on the second temperature signal of the first platinum resistance temperature sensor PT08 collected by the second voltage multiplexing module 130B.

[0069] In the first stage, the constant current switching unit 110C controls the first constant current source 110A to provide the first constant current signal IDAC1 to the first current multiplexing module 120A. Then, the first constant current signal IDAC1 of the first constant current source 110A is transmitted sequentially through the second-stage current multiplexing unit 122A and the first-stage current multiplexing unit 121A (1) to the first signal terminal AC1 of the first platinum resistance temperature sensor PT08. Sequentially, the temperature signal output by the first signal terminal AC1 of the first platinum resistance temperature sensor PT08 is transmitted sequentially through the first-stage voltage multiplexing unit 131A (1) and the second-stage voltage multiplexing unit 132A to the signal terminal AIN1 of the signal conversion module 140. Sequentially, the temperature signal of the first platinum resistance temperature sensor PT08 received by the signal terminal AIN1 of the signal conversion module 140 is the first temperature signal. The signal conversion module 140 and the data processing module 150 process the first temperature signal of the first platinum resistance temperature sensor PT08 to obtain the first temperature value of the first platinum resistance temperature sensor PT08.

[0070] In the second stage, the constant current switching unit 110C controls the second constant current source 110B to provide the second constant current signal IDAC2 to the second current multiplexing module 120B. Then, the second constant current signal IDAC2 of the second constant current source 110B is transmitted sequentially through the second-stage current multiplexing unit 122B and the first-stage current multiplexing unit 121B (1) to the second signal terminal AC2 of the first platinum resistance temperature sensor PT08. Sequentially, the temperature signal output by the second signal terminal AC2 of the first platinum resistance temperature sensor PT08 is transmitted sequentially through the first-stage voltage multiplexing unit 131B (1) and the second-stage voltage multiplexing unit 132B to the signal terminal AIN2 of the signal conversion module 140. Sequentially, the temperature signal of the first platinum resistance temperature sensor PT08 received by the signal terminal AIN2 of the signal conversion module 140 is the second temperature signal. The signal conversion module 140 and the data processing module 150 process the second temperature signal of the first platinum resistance temperature sensor PT08 to obtain the second temperature value of the first platinum resistance temperature sensor PT08.

[0071] Based on this, the data processing module 150 calculates the average of the first temperature value and the second temperature value of the first platinum resistance temperature sensor PT08, and outputs the average value as the temperature value of the first platinum resistance temperature sensor PT08.

[0072] In this embodiment, the signal conversion module 140 includes two constant current sources, and signal acquisition is performed through chopping settings in the error elimination algorithm. First, a measurement is performed with the first constant current source IDAC1 set to AIN0 and the second constant current source IDAC2 set to AIN3. In this case, the first constant current signal IDAC1 of the first constant current source drives the reference resistor in the platinum resistance temperature sensor. Then, a measurement is performed with the first constant current source IDAC1 set to AIN3 and the second constant current source IDAC2 set to AIN0, i.e., the current sources are switched, and a second measurement is performed. In this case, the second constant current signal IDAC2 of the second constant current source drives the reference resistor in the platinum resistance temperature sensor. In both cases, the reference resistor in the platinum resistance temperature sensor is driven by the sum of the first constant current signal IDAC1 and the second constant current signal IDAC2. By averaging the two chopping cases, mismatch errors can be eliminated from the measurement.

[0073] Two stable, matched constant current sources are used. Each constant current source provides 1 mA, and the typical IDAC current mismatch is approximately 0.07%. Using two stable, matched constant current sources eliminates lead resistance, ensuring that the resistances of transmission lead 1 (AC1) and transmission lead 2 (AC2) of the platinum resistance temperature sensor are identical. The two constant current sources provide a constant current to the same platinum resistance temperature sensor in a time-sharing manner. The output pins of the two constant current sources are interchanged via a program to eliminate lead error. The voltage signal value from the same platinum resistance temperature sensor is acquired and subsequently processed to convert it into a temperature value.

[0074] Figure 11 This is a schematic diagram of a power module provided in an embodiment of the present invention. Figure 12 This is a schematic diagram of a first isolation module provided in an embodiment of the present invention. Figure 13 This is a schematic diagram of a communication module provided in an embodiment of the present invention, for reference. Figures 11 to 13 As shown, the optional temperature acquisition circuit further includes: a power supply module 160, used to provide the required power signal to at least one module in the temperature acquisition circuit, the required power signal including a first power signal; a communication module 180 and a first isolation module 170 electrically connected to the power supply module 160 and the communication module 180, the first isolation module 170 being used to perform power isolation processing on the first power signal to obtain a communication power signal and provide it to the communication module 180. Optionally, the first power signal and the communication power signal have the same voltage value.

[0075] In this embodiment, the temperature acquisition circuit further includes a power supply module 160. The power supply module 160 can convert external power signals into various different power signals and provide them to at least one module in the temperature acquisition circuit. (See reference...) Figure 11As shown, the power module 160 includes a 2405 isolated power supply unit and two LDO units. The 2405 isolated power supply unit converts the 24V power provided by the external switching power supply into the 5V power required by the circuit. The two LDO units convert the 5V power provided by the 2405 isolated power supply unit into a 3.3V power supply.

[0076] For example, refer to Figure 11 As shown, taking the power signal required by the temperature acquisition circuit as an example, including a first power signal of +5V, the power module 160 can convert the external power signal (+24V) provided by an external power source to obtain the first power signal (+5V). For example, refer to... Figure 11 As shown, taking the power signal required by the temperature acquisition circuit as an example, including the second power signal, which is +3.3V, the power module 160 can perform multiple conversions on the external power signal (+24V) provided by the external power supply to obtain the second power signal (+3.3V).

[0077] The temperature acquisition circuit also includes a first isolation module 170, which is electrically connected to a power supply module 160 and also electrically connected to a communication module 180. The first isolation module 170 is used to obtain a first power signal from the power supply module 160 and perform power isolation processing on the first power signal to obtain a communication power signal, which is then provided to the communication module 180. (Reference) Figure 12 As shown, the first isolation module 170 includes a 0505 isolation unit. The 0505 isolation unit further isolates the 5V power supply provided by the power supply module 160 from the 5V power supply of the circuit. The 0505 isolation unit also isolates the digital ground required by the data processing module 150 and the communication ground of the communication module 180, so that the temperature acquisition circuit can operate normally and stably in a strong magnetic environment.

[0078] The temperature acquisition circuit also includes a communication module 180. (Reference) Figure 13 As shown, the communication module 180 includes an RS485 chip and its associated peripheral circuitry. The peripheral circuitry includes a matching resistor connected to the output terminal via a pin header. When the pin header is connected to a jumper cap, the matching resistor is connected; when the pin header is unconnected, the matching resistor is open. The selectable matching resistor value is 120 ohms, power rating is 250mW, and accuracy is ±1%. The communication module 180 transmits the measured temperature value externally via the 485-MODBUS protocol. The A and B lines of the external 485 communication bus connected to the communication module 180 are connected to the circuit board 100 via a three-port terminal block. The 485 communication bus communicates with the circuit board 100 via the RS485 chip. The RS485 peripheral circuitry includes two TVS / ESD protection devices for electrostatic discharge and surge protection, and a 120-ohm matching resistor for impedance matching.

[0079] For example, refer to Figure 12 As shown, taking +5V as an example, the first isolation module 170 obtains the first power signal (+5V) from the power module 160. The first isolation module 170 performs power isolation processing on the first power signal (+5V) to obtain a communication power signal (+5-1V), which is then provided to the communication module 180. In other words, the first power signal (+5V) from the power module 160 can be provided to at least one module in the temperature acquisition circuit. After the first isolation module 170 performs power isolation processing on the first power signal (+5V), it obtains the communication power signal (+5-1V), which is then provided to the communication module 180. This achieves the effect of power isolation between the power supplies of multiple circuit modules in the temperature acquisition circuit and the power supply of the communication module 180.

[0080] Combination Figures 4 to 10 As shown, the first power signal (+5V) of the power module 160 can be provided to the current multiplexing module 120, voltage multiplexing module 130, signal conversion module 140, data processing module 150, etc.; the second power signal (+3.3V) of the power module 160 can be provided to the signal conversion module 140, etc.; the communication power signal (+5-1V) generated by the first isolation module 170 after performing power isolation processing on the first power signal (+5V) can be provided to the communication module 180.

[0081] This achieves power isolation between the power supplies of multiple circuit modules in the temperature acquisition circuit and the power supply of the communication module 180. In other words, the first isolation module 170 separates the communication lines from the digital signal lines in the temperature acquisition circuit, reducing crosstalk between the communication lines and digital signals in a strong magnetic environment. Furthermore, as shown in reference 11, the first isolation module 170 also isolates the 0V of the switching power supply from the digital signal ground, ensuring the circuit can operate normally in a strong magnetic interference environment.

[0082] Figure 14 This is a schematic diagram of a second isolation module provided in an embodiment of the present invention, as shown below. Figure 14 As shown, the optional power signal also includes a second power signal; the temperature acquisition circuit further includes a second isolation module 190 electrically connected to the power module 160 and the first isolation module 170, used to perform opto-isolation processing on the received second power signal and the communication power signal. Optionally, the first power signal and the communication power signal may have the same voltage value; and / or, the second power signal and the communication power signal may have different voltage values.

[0083] In this embodiment, the temperature acquisition circuit further includes a second isolation module 190. The second isolation module 190 is electrically connected to the power module 160 to receive a second power signal provided by the power module 160. The second isolation module 190 is also electrically connected to the first isolation module 170 to receive a communication power signal provided by the first isolation module 170. This provides opto-isolation for the second power signal and the communication power signal in the temperature acquisition circuit, effectively isolating the data processing module 150 from the communication module 180. (Reference) Figure 14 As shown, the second isolation module 190 includes a digital isolator U57, which opto-isolates the data processing module 150 from the communication module 180, enabling the temperature acquisition circuit to operate normally and stably in a strong magnetic environment.

[0084] For example, refer to Figures 11 to 14 As shown, taking a second power signal of +3.3V as an example, the second isolation module 190 obtains the second power signal (+3.3V) from the power module 160, and obtains the communication power signal (+5.1V) from the first isolation module 170. The second isolation module 190 performs opto-isolation processing on the second power signal (+3.3V) and the communication power signal (+5.1V). This achieves opto-isolation between the power supplies of multiple circuit modules in the temperature acquisition circuit and the power supply of the communication module 180. Combined with... Figures 4 to 10 As shown, the second power signal (+3.3V) of the power module 160 can be provided to the signal conversion module 140, the data processing module 150, etc.

[0085] The temperature acquisition circuit provided in any embodiment of the present invention further includes a storage module. Figure 15 This is a schematic diagram of a storage module provided in an embodiment of the present invention, as shown below. Figure 15 As shown, the optional storage module 200 stores the temperature signals or values ​​from multiple platinum resistance temperature sensors acquired by the temperature acquisition circuit. Based on the analysis of the temperature data from these multiple platinum resistance temperature sensors, the electrolysis temperature of a large-scale electrolytic cell group can be monitored and adjusted. The storage module 200 includes an EEPROM and also stores the device ID and calibration coefficient values ​​of the circuit board 100, facilitating the differentiation of each slave station in subsequent communication. The communication module 180 uses the information stored in the storage module 200 to output the temperature value obtained by the data processing module 150 to the master station.

[0086] Based on the same inventive concept, embodiments of the present invention provide a temperature acquisition method. Figure 16 This is a schematic diagram of a temperature acquisition method provided in an embodiment of the present invention, applicable to the temperature acquisition circuit described in any embodiment of the present invention, such as... Figure 16 As shown, the temperature acquisition method includes:

[0087] Step 310: Switching control is performed through the second-stage current multiplexing unit to enable the constant current source to provide a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing unit;

[0088] Step 320: Switching control is performed through the second-stage voltage multiplexing unit to enable the first-stage voltage multiplexing unit to acquire the temperature signal of the first platinum resistance temperature sensor.

[0089] Step 330: Call the signal conversion module to convert the temperature signal from the first platinum resistance temperature sensor to obtain a temperature voltage signal;

[0090] Step 340: Call the data processing module to perform temperature conversion on the temperature voltage signal of the first platinum resistance temperature sensor to obtain the temperature value of the first platinum resistance temperature sensor.

[0091] The optional constant current source includes a first constant current source and a second constant current source; it also includes: calling the first constant current source to provide a first constant current signal to the first signal terminal of the first platinum resistance temperature sensor, acquiring the first temperature signal of the first signal terminal of the first platinum resistance temperature sensor and processing it to obtain a first temperature value of the first platinum resistance temperature sensor; calling the second constant current source to provide a second constant current signal to the second signal terminal of the first platinum resistance temperature sensor, acquiring the second temperature signal of the second signal terminal of the first platinum resistance temperature sensor and processing it to obtain a second temperature value of the first platinum resistance temperature sensor; and determining the average of the first temperature value and the second temperature value as the temperature value of the first platinum resistance temperature sensor.

[0092] In this invention, the temperature acquisition circuit is electrically connected to multiple platinum resistance temperature sensors, making it suitable for large-scale electrolytic cell clusters and electrolytic cell clusters in strong magnetic environments. The temperature acquisition circuit also includes a current multiplexing module and a voltage multiplexing module. The current multiplexing module includes a first-stage current multiplexing unit and a second-stage current multiplexing unit, and the voltage multiplexing module includes a first-stage voltage multiplexing unit and a second-stage voltage multiplexing unit. The constant current signal from the constant current source can be transmitted sequentially to each platinum resistance temperature sensor through the second-stage current multiplexing unit and the first-stage current multiplexing unit. The temperature signal from each platinum resistance temperature sensor can be transmitted sequentially to the signal conversion module through the first-stage voltage multiplexing unit and the second-stage voltage multiplexing unit. The signal conversion module and the data processing module convert the temperature signals from the platinum resistance temperature sensors into temperature values. This invention enables the acquisition of temperature values ​​from each platinum resistance temperature sensor in a large-scale electrolytic cell cluster, thereby achieving temperature control for each electrolytic cell. It is not only suitable for strong magnetic environments but also replaces manual temperature measurement, providing more accurate, convenient, and rapid electrolytic cell temperature measurement and eliminating interference from strong magnetic environments on the temperature acquisition circuit. Furthermore, the use of a temperature acquisition circuit eliminates the inconvenience of manual temperature measurement and the error interference caused by strong magnetic environments. Temperature measurement personnel no longer need to frequently move through the electrolytic cell cluster to measure the temperature of each cell individually, reducing workload, improving work efficiency, and avoiding problems such as missed or incorrect temperature data. In addition, the placement of the temperature acquisition circuit within the electrolytic cell cluster makes it suitable for various electrolytic cell clusters with complex structures, special locations, and harsh environments. It solves the problems of difficulty and inaccessibility associated with manual temperature measurement, eliminating the risk of missed or false alarms and eliminating the need for measurement personnel to be in close contact with dangerous environments such as high temperatures and strong magnetic fields, ensuring the safety of temperature measurement personnel and production safety.

[0093] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0094] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A temperature acquisition circuit, characterized in that, include: The system includes a current multiplexing module and a constant current source. The current multiplexing module comprises a second-stage current multiplexing unit and N first-stage current multiplexing units. The first-stage current multiplexing units are electrically connected to M platinum resistance temperature sensors. The second-stage current multiplexing units are electrically connected to the constant current source and the first-stage current multiplexing units. The second-stage current multiplexing units are used to perform switching control so that the constant current source provides a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing units. Both N and M are greater than 1. A voltage multiplexing module includes a second-level voltage multiplexing unit and N first-level voltage multiplexing units electrically connected to each other. The first-level voltage multiplexing units are electrically connected to M platinum resistance temperature sensors. The second-level voltage multiplexing unit is used to perform switching control so that the first-level voltage multiplexing unit can collect the temperature signal of the first platinum resistance temperature sensor. The signal conversion module is electrically connected to the second-stage voltage multiplexing unit and is used to convert the received temperature signal from the first platinum resistance temperature sensor to obtain a temperature voltage signal. The data processing module is electrically connected to the signal conversion module and is used to perform temperature conversion on the temperature voltage signal of the first platinum resistance temperature sensor to obtain the temperature value of the first platinum resistance temperature sensor.

2. The temperature acquisition circuit according to claim 1, characterized in that, The constant current source is integrated in the signal conversion module.

3. The temperature acquisition circuit according to claim 1, characterized in that, The current multiplexing module includes a first current multiplexing module and a second current multiplexing module. In the first current multiplexing module, the M output terminals of the first-stage current multiplexing unit are electrically connected to the first signal terminals of the M platinum resistance temperature sensors. In the second current multiplexing module, the M output terminals of the first-stage current multiplexing unit are electrically connected to the second signal terminals of the M platinum resistance temperature sensors. The voltage multiplexing module includes a first voltage multiplexing module and a second voltage multiplexing module. In the first voltage multiplexing module, the M input terminals of the first-stage voltage multiplexing unit are electrically connected to the first signal terminals of the M platinum resistance temperature sensors. In the second voltage multiplexing module, the M input terminals of the first-stage voltage multiplexing unit are electrically connected to the second signal terminals of the M platinum resistance temperature sensors. The constant current source is electrically connected to the first current multiplexing module and the second current multiplexing module respectively.

4. The temperature acquisition circuit according to claim 3, characterized in that, The constant current source includes a first constant current source, a second constant current source, and a constant current switching unit; The constant current switching unit is electrically connected to the first constant current source, the first current multiplexing module, the second constant current source, and the second current multiplexing module, respectively, and is used to control the first constant current source to provide a first constant current signal to the first current multiplexing module, and sequentially control the second constant current source to provide a second constant current signal to the second current multiplexing module.

5. The temperature acquisition circuit according to claim 4, characterized in that, The first constant current signal and the second constant current signal have the same current value.

6. The temperature acquisition circuit according to claim 3, characterized in that, The temperature value of the first platinum resistance temperature sensor is the average of the first temperature value and the second temperature value; The first temperature value is obtained based on the first temperature signal of the first platinum resistance temperature sensor acquired by the first voltage multiplexing module, and the second temperature value is obtained based on the second temperature signal of the first platinum resistance temperature sensor acquired by the second voltage multiplexing module.

7. The temperature acquisition circuit according to claim 1, characterized in that, Also includes: A power module is used to provide the required power signal to at least one module in the temperature acquisition circuit, the required power signal including a first power signal; The communication module and the first isolation module electrically connect the power module and the communication module. The first isolation module is used to perform power isolation processing on the first power signal to obtain a communication power signal and provide it to the communication module.

8. The temperature acquisition circuit according to claim 7, characterized in that, The required power signal also includes a second power signal; The temperature acquisition circuit further includes a second isolation module electrically connected to the power module and the first isolation module, wherein the second isolation module is used to perform opto-isolation processing on the received second power signal and the communication power signal.

9. The temperature acquisition circuit according to claim 8, characterized in that, The first power signal and the communication power signal have the same voltage value; and / or, the second power signal and the communication power signal have different voltage values.

10. A temperature acquisition method, characterized in that, Applied in the temperature acquisition circuit as described in any one of claims 1-9, the temperature acquisition method includes: The switching control is performed by the second-stage current multiplexing unit, so that the constant current source provides a constant current signal to the first platinum resistance temperature sensor through the first-stage current multiplexing unit; The switching control is performed by the second-stage voltage multiplexing unit, so that the first-stage voltage multiplexing unit can acquire the temperature signal of the first platinum resistance temperature sensor. The signal conversion module is invoked to convert the temperature signal from the first platinum resistance temperature sensor to obtain a temperature voltage signal. The data processing module is invoked to perform temperature conversion on the temperature voltage signal of the first platinum resistance temperature sensor to obtain the temperature value of the first platinum resistance temperature sensor.

11. The temperature acquisition method according to claim 10, characterized in that, The constant current source includes a first constant current source and a second constant current source; Also includes: The first constant current source is invoked to provide a first constant current signal to the first signal terminal of the first platinum resistance temperature sensor, and the first temperature signal of the first signal terminal of the first platinum resistance temperature sensor is collected and processed to obtain the first temperature value of the first platinum resistance temperature sensor. The second constant current source is invoked to provide a second constant current signal to the second signal terminal of the first platinum resistance temperature sensor, and the second temperature signal of the second signal terminal of the first platinum resistance temperature sensor is collected and processed to obtain the second temperature value of the first platinum resistance temperature sensor. The average of the first temperature value and the second temperature value is determined as the temperature value of the first platinum resistance temperature sensor.

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