Method and device for processing residual water drops on upper cover of vacuum wetting cavity and semiconductor equipment

Abstract

The invention discloses a method and device for processing residual water drops on an upper cover of a vacuum wetting cavity and semiconductor equipment, and relates to the technical field of semiconductor equipment. The method for treating the residual water drops on the upper cover of the vacuum wetting cavity comprises the step of arranging a brush for removing the water drops in the upper cover on the outer part of the vacuum wetting cavity. When water drops in the upper cover need to be removed, the brush is controlled to extend into the upper cover. And the brush extending into the upper cover is moved to remove water drops on the lower portion of the upper cover. According to the method and the device for treating the residual water drops on the upper cover of the vacuum wetting cavity, the residual water drops on the upper cover can be automatically and actively removed on line. The risk that a water film on the surface of a wafer is damaged or defects are generated due to accumulation and falling of water drops in the upper cover is eliminated, and the reliability and yield of products are improved. And meanwhile, as the production takt is seamlessly embedded, shutdown maintenance is not needed, and high production efficiency and stability of continuous operation of semiconductor equipment are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a method, apparatus and semiconductor equipment for treating residual water droplets on the top cover of a vacuum wetting chamber. Background Technology

[0002] Vacuum wetting chambers are key equipment in semiconductor manufacturing processes such as pre-plating treatment. They spray liquid onto the wafer surface in a vacuum or specific atmosphere to form a uniform and complete water film or reaction layer, laying the foundation for subsequent processes. However, in actual cyclic production, the inner surface of the chamber cover, the internal water inlet pipes, and the nozzle assembly are prone to accumulating a large amount of residual water droplets after repeated spraying processes.

[0003] The presence of these residual water droplets causes a series of problems in subsequent processes. First, the continuously accumulating water droplets may drip onto the already processed wafer surface due to gravity or cavity vibration after the current wafer process is completed. This will disrupt the integrity of the uniform water film formed on the wafer surface, leading to poor local wetting, and thus directly introducing defects in subsequent electroplating steps. Second, these residual water droplets are exposed to the atmosphere inside the cavity, increasing their dissolved oxygen content. If these water droplets with high oxygen content drip onto the wafer surface before or during the next wafer process, especially during micro-via or deep trench electroplating, they are very likely to form microbubbles within the holes. These bubbles become trapped within the structure and cannot escape, causing fatal defects such as incomplete plating filling, voids, or gaps, severely reducing product reliability and yield.

[0004] In the existing technology, in order to solve the above-mentioned technical problems, the machine is usually stopped periodically for manual cleaning, which affects the continuous operation time of semiconductor equipment and reduces production efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a method, apparatus, and semiconductor equipment for treating residual water droplets on the top cover of a vacuum wetting chamber, so as to reduce the probability of residual water droplets falling onto the wafer surface and causing defects in subsequent processes, thereby improving product reliability and yield while ensuring production continuity and efficiency.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A method for treating residual water droplets on the top cover of a vacuum wetting chamber, the method comprising:

[0008] A brush is provided outside the vacuum wetting chamber to remove water droplets from the inside of the upper cover;

[0009] When water droplets inside the top cover need to be removed, the brush is controlled to extend into the inside of the top cover;

[0010] Move the brush that extends into the interior of the top cover to remove water droplets from inside the top cover.

[0011] As an optional method for treating residual water droplets on the upper cover of the vacuum wetting chamber, the interior of the upper cover includes a lower surface of the upper cover;

[0012] When water droplets inside the top cover need to be removed, controlling the brush to extend into the interior of the top cover includes:

[0013] When water droplets on the lower surface of the top cover are detected and need to be removed, the brush is controlled to be at a first height, so that the brush extends into the lower surface of the top cover and makes contact with the lower surface.

[0014] As an optional method for treating residual water droplets on the top cover of the vacuum wetting chamber, the length of the brush is not less than the diameter of the wafer;

[0015] The movable brush extending into the lower surface of the upper cover to remove water droplets inside the upper cover includes:

[0016] The brush is controlled to make at least contacting horizontal movements back and forth on the lower surface of the top cover to remove water droplets from the lower part of the top cover, wherein the scraping area of ​​the brush completely covers the area projected onto the lower surface of the top cover when the wafer is placed horizontally.

[0017] As an alternative method for treating residual water droplets on the top cover of the vacuum wetting chamber, the length of the brush is smaller than the diameter of the wafer;

[0018] The movable brush extending into the lower surface of the upper cover to remove water droplets inside the upper cover includes:

[0019] The brush is controlled to make at least contactive horizontal movements back and forth and left and right horizontal movements on the lower surface of the top cover to remove water droplets inside the top cover, wherein the scraping area of ​​the brush completely covers the area projected onto the lower surface of the top cover when the wafer is placed horizontally.

[0020] As an optional solution for the method of treating residual water droplets on the upper cover of the vacuum wetting chamber, the upper cover also includes a water inlet pipe located at the lower part of the upper cover;

[0021] When water droplets inside the top cover need to be removed, controlling the brush to extend into the interior of the top cover includes:

[0022] When water droplets on the water inlet pipe inside the top cover are detected and need to be removed, the brush is controlled to be at a second height, so that the brush extends into the lower part of the top cover and makes contact with the water inlet pipe.

[0023] As an optional method for treating residual water droplets on the upper cover of the vacuum wetting chamber, the upper cover also includes a nozzle assembly located at the lower part of the upper cover;

[0024] When water droplets inside the top cover need to be removed, controlling the brush to extend into the interior of the top cover includes:

[0025] When water droplets on the nozzle assembly at the lower part of the upper cover are detected to need to be removed, the brush is controlled to be at a third height, so that the brush extends into the lower part of the upper cover and makes contact with the nozzle assembly.

[0026] As an optional method for treating residual water droplets on the top cover of the vacuum wetting chamber, it further includes:

[0027] Once the brush has finished removing water droplets, it is controlled to move to the outside of the vacuum wetting chamber.

[0028] A device for treating residual water droplets on the top cover of a vacuum wetting chamber, comprising:

[0029] A brush is disposed outside the cavity of the vacuum wetting chamber and is spaced at a certain distance from the cavity. The distance allows the brush to extend under the top cover to remove water droplets and to retract without contacting the cavity after removing the water droplets.

[0030] A drive mechanism, connected to the brush, is used to drive the brush to perform at least one of forward, backward, left, right, and up-down movements to perform the method for treating residual water droplets on the top cover of the vacuum wetting chamber as described in any of the above schemes.

[0031] As an optional solution for the residual water droplet treatment device on the upper cover of the vacuum wetting chamber, the drive mechanism includes a telescopic component connected to the brush, used to control the horizontal movement of the brush back and forth by telescopic control.

[0032] As an optional solution for the residual water droplet treatment device on the upper cover of the vacuum wetting chamber, the driving mechanism further includes a lifting component, which is connected to the telescopic component and is used to drive the brush to move up and down in the vertical direction.

[0033] As an optional solution for the residual water droplet treatment device on the upper cover of the vacuum wetting chamber, the driving mechanism further includes a horizontal moving component, which is disposed at the bottom of the lifting component, and is used to drive the brush to move horizontally left and right by driving the lifting component to move left and right.

[0034] As an optional solution for the residual water droplet treatment device on the upper cover of the vacuum wetting chamber, the brush includes a support element and a scraper mounted above the support element. The scraper is arranged horizontally and facing the lower surface of the upper cover, such that when the brush moves up and down, the scraper maintains horizontal contact with the lower surface of the upper cover.

[0035] As an optional solution for the residual water droplet treatment device on the upper cover of the vacuum wetting chamber, the outer side of the upper cover is provided with a downwardly extending annular protrusion for docking with the cavity below.

[0036] The total height of the support element and the scraper is greater than the vertical distance between the lower surface of the upper cover and the bottom end of the annular protrusion, so that the scraper can make horizontal contact with the lower surface of the upper cover;

[0037] The difference between the total height of the support element and the scraper and the vertical distance is 1mm-5mm, and the scraper can be compressed under external pressure. The thickness of the scraper after compression is 0.1-0.9 times the thickness of the scraper itself.

[0038] A semiconductor device includes a device for treating residual water droplets on the top cover of a vacuum wetting chamber as described above.

[0039] The beneficial effects of this invention are:

[0040] The present invention provides a method for treating residual water droplets on the top cover of a vacuum wetting chamber. A brush is installed outside the vacuum wetting chamber to remove water droplets from inside the top cover. When water droplets inside the top cover need to be removed, the brush is controlled to extend into the interior of the top cover and moved to remove the water droplets. This eliminates the risk of water film damage or defects on the wafer surface caused by the accumulation and falling of water droplets inside the top cover, thus improving product reliability and yield.

[0041] The present invention provides a device for treating residual water droplets on the top cover of a vacuum wetting chamber and a semiconductor device for performing the aforementioned treatment method. Through a brush and its driving mechanism located outside the chamber, fully automatic, online, and active removal of residual water droplets from the top cover is achieved. The driving mechanism of the treatment device drives the brush to extend horizontally and precisely cover the area directly above the wafer, directly removing the adhering water droplets through physical scraping. After the scraping operation is completed, the brush automatically retracts to its storage position outside the chamber, avoiding interference with wafer transport and the process. This treatment device effectively prevents water film damage and electroplating bubble defects caused by water droplets falling from the top cover, significantly improving product yield. Furthermore, because it is seamlessly integrated into the production cycle, it requires no downtime for maintenance, ensuring high production efficiency and stability for continuous operation of the semiconductor equipment. Attached Figure Description

[0042] Figure 1This is a schematic diagram of the structure of the vacuum wetting chamber provided in an embodiment of the present invention when the top cover is in the open state;

[0043] Figure 2 This is a schematic diagram of the structure of the upper cover of the vacuum wetting chamber provided in an embodiment of the present invention;

[0044] Figure 3 This is a top view of the vacuum wetting chamber's top cover residual water droplet treatment device during the water scraping operation provided in this embodiment of the invention;

[0045] Figure 4 This is a side view of the vacuum wetting chamber's top cover residual water droplet treatment device during the squeegee operation provided in this embodiment of the invention.

[0046] In the picture:

[0047] 100. Top cover; 101. Water inlet pipe; 102. Water inlet connector; 103. Water outlet connector; 104. Nozzle assembly;

[0048] 200. Cavity;

[0049] 300. Wafer;

[0050] 1. Brushes; 11. Scraping area;

[0051] 2. Telescopic components;

[0052] 3. Lifting assembly. Detailed Implementation

[0053] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0054] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0055] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0056] Unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0057] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0058] like Figures 1-4 As shown, this embodiment provides a semiconductor device, including a vacuum wetting chamber for performing a cleaning or pre-wetting process on a wafer 300. The vacuum wetting chamber includes a cavity 200 and a top cover 100, which are sealed together to form the vacuum wetting chamber for performing the cleaning or pre-wetting process on the wafer 300 within the vacuum wetting chamber. After the cleaning or pre-wetting process is completed, the top cover 100 is opened to remove the processed wafer 300.

[0059] A nozzle assembly 104 and a water inlet pipe 101 for supplying water to the nozzle assembly 104 are connected to the lower part of the upper cover 100. The water inlet pipe 101 is connected to the upper cover 100 through a water inlet connector 102, forming a first gap between the water inlet pipe 101 and the lower surface of the upper cover 100. The water inlet pipe 101 is connected to the nozzle assembly 104 through a water outlet connector 103, forming a second gap between the water inlet pipe 101 and the nozzle assembly 104. The water inlet pipe 101 is located between the nozzle assembly 104 and the lower surface of the upper cover 100. The water inlet connector 102 is connected to a water source outside the upper cover 100. The water supplied by the water source enters the water inlet pipe 101 through the water inlet connector 102, and then enters the nozzle assembly 104 through the water outlet connector 103, controlling the nozzle assembly 104 to spray water, which can perform cleaning or pre-wetting processes on the wafer 300 located in the cavity 200.

[0060] During the cleaning or pre-wetting process of wafer 300 in the vacuum wetting chamber, some water droplets splash onto the lower surface of the upper cover 100 and onto the water inlet pipe 101 and nozzle assembly 104 located below the lower surface and above the wafer 300. These water droplets accumulate and may drip onto the already processed wafer 300 surface due to gravity or vibration of the chamber 200 after the current wafer 300 process is completed. This will disrupt the integrity of the uniform water film already formed on the wafer 300 surface, leading to poor local wetting and directly introducing defects in subsequent electroplating steps. Secondly, these residual water droplets are exposed to the atmosphere inside the chamber 200, increasing their dissolved oxygen content. If these water droplets with high oxygen content drip onto the wafer 300 surface before or during the next wafer 300 process, especially during micro-hole or deep trench electroplating, they are very likely to form microbubbles within the holes. These air bubbles, trapped inside the structure and unable to escape, can cause fatal defects such as incomplete electroplating filling, voids, or gaps, severely reducing product reliability and yield.

[0061] To solve the above technical problems, such as Figure 3 As shown, this embodiment provides a device for treating residual water droplets on the top cover of a vacuum wetting chamber, which is applied to the aforementioned semiconductor equipment. It is used to actively remove residual water droplets inside the top cover 100. This device effectively prevents water film damage and electroplating bubble defects caused by water droplets falling from the top cover 100, significantly improving product yield. At the same time, because it is seamlessly integrated into the production cycle, it does not require downtime maintenance, ensuring high production efficiency and stability for continuous operation of the semiconductor equipment.

[0062] The residual water droplet removal device for the upper cover of the vacuum wetting chamber provided in this embodiment includes a brush 1 and a driving mechanism. The brush 1 is disposed outside the cavity 200 of the vacuum wetting chamber and is spaced apart from the cavity 200. The distance allows the brush 1 to extend under the upper cover 100 to remove water droplets and to retract without contacting the cavity 200 after removing the water droplets. The driving mechanism is connected to the brush 1 and is used to drive the brush 1 to perform at least one of the following movements: forward and backward, left and right, and up and down. This enables fully automatic, online active removal of residual water droplets inside the upper cover 100, including the lower surface, the water inlet pipe 101, and the nozzle assembly 104. The driving mechanism of this device drives the brush 1 to extend horizontally and precisely cover the area directly above the wafer 300, directly removing the attached water droplets through physical scraping. After the scraping operation is completed, the brush 1 automatically retracts to its storage position outside the cavity 200, avoiding interference with the wafer 300 transfer and process.

[0063] In one embodiment, the brush 1 includes a support element and a scraper mounted above the support element. The scraper is arranged horizontally and facing the lower surface of the upper cover 100, such that the scraper remains in horizontal contact with the lower surface of the upper cover 100 when the brush 1 moves up and down.

[0064] In some possible implementations, the support element is made of metal, and the squeegee is a silicone squeegee. Silicone material is soft and elastic. Its softness ensures that contact cleaning is "surface contact" rather than "line or point contact" when the squeegee scrapes against the lower surface of the top cover 100, the water inlet pipe 101, or the nozzle assembly 104. This greatly cushions and disperses the scraping force, thus avoiding scratches that might be caused by hard bristles or metal squeegees.

[0065] In one embodiment, the outer surface of the upper cover 100 is provided with a downwardly extending annular protrusion for docking with the lower cavity 200. The docking between the upper cover 100 and the cavity 200 includes a sealed or non-sealed docking. Therefore, the total height of the support element and the scraper in the brush 1 is greater than the vertical distance between the lower surface of the upper cover 100 and the bottom end of the annular protrusion, so that the scraper can make horizontal contact with the lower surface of the upper cover 100. The difference between the total height of the support element and the scraper and the vertical distance is 1mm-5mm, and the scraper can be compressed under external pressure, with the thickness of the compressed scraper being 0.1-0.9 times its own thickness.

[0066] In practical use, to ensure the effectiveness and efficiency of wiping, the difference between the total height of the support element and the blade and the vertical distance in brush 1 can be 1-5mm. Preferably, the difference between the total height of the support element and the blade and the vertical distance is 2mm.

[0067] In the actual wiping process, a certain amount of friction is required between the wiping blade and the lower surface of the top cover 100. Therefore, a certain pressure needs to be applied to the wiping blade to compress it. The specific compression depends on the elastic coefficient of the wiping blade material itself. Generally, the wiping blade can be compressed to 0.1-0.9 times its own thickness. Preferably, the wiping blade can be compressed to half its thickness under a certain pressure. For example, if the wiping blade is 2mm thick, it can be compressed from 2mm to 1mm when it contacts the lower surface of the top cover 100 for wiping, thus making the contact between the wiping blade and the lower surface more precise and ensuring wiping efficiency and effectiveness.

[0068] In one embodiment, the drive mechanism includes a telescopic component 2 connected to the brush 1, used to control the horizontal movement of the brush 1 back and forth via telescopic control. When the telescopic component 2 extends, it allows the brush 1 to extend horizontally into the interior of the upper cover 100 for squeezing. After squeezing, the telescopic component 2 retracts, allowing the brush 1 to move horizontally out of the upper cover 100 and retract outside the cavity 200. The brush 1 only extends into the upper cover 100 to perform cleaning tasks when needed, and completely retracts outside the cavity 200 after the operation is completed; this prevents the risk of continuous contamination of the wafer 300 process environment by external particles, fibers, or chemical residues that the brush 1 may carry. Since the drive mechanism is fixed outside the cavity 200, there is no need to integrate complex moving parts into the upper cover 100 or inside the cavity 200, and the structure of the vacuum wetting chamber remains unchanged.

[0069] In some possible implementations, the telescopic assembly 2 includes a scissor-type telescopic shaft, which is composed of multiple sets of scissor arms connected in series by a central pivot, forming a foldable parallelogram linkage mechanism. Its fixed end is installed outside the cavity 200, and its moving end is connected to the brush 1. A drive point located near the fixed end is driven to move linearly via a ball screw or linear motor. When the drive point is pushed, the crossing angle of the first pair of scissor arms decreases, and this is transmitted sequentially through the linkage hinge, forcing the entire scissor chain to gradually unfold from a tightly folded state. This amplifies the small linear displacement of the drive point into a large horizontal linear extension of the moving end, allowing the brush 1 to extend into the cavity 200. Conversely, when the drive point retracts, the crossing angle of the scissor arms increases, and the parallelogram linkage mechanism refolds, smoothly pulling the brush 1 back to its initial position (i.e., the storage position) outside the cavity 200. This process achieves a large range of horizontal telescopic movement within a very small storage space, and the multi-triangular support structure after unfolding ensures the rigidity of the brush 1 during operation.

[0070] In one embodiment, the driving mechanism further includes a lifting assembly 3, which is connected to the telescopic assembly 2 and is used to drive the brush 1 to move up and down in the vertical direction. By driving the brush 1 to move up and down in the vertical direction through the lifting assembly 3, residual water droplets on the lower surface of the upper cover 100, the water inlet pipe 101, and the nozzle assembly 104 located at different heights are scraped.

[0071] In some possible implementations, the lifting assembly 3 includes a lifting cylinder and a lifting platform. The drive rod of the lifting cylinder is connected to the lifting platform to drive the lifting platform to rise and fall. The fixed end of the telescopic assembly 2 is located on the lifting platform so that the lifting platform can drive the brush 1 to rise and fall through the telescopic assembly 2 to satisfy the scraping operation of residual water droplets on the lower surface of the upper cover 100, the water inlet pipe 101 and the nozzle assembly 104 located at different heights.

[0072] In one embodiment, the driving mechanism further includes a horizontal moving component, which is disposed at the bottom of the lifting component 3. This horizontal moving component drives the brush 1 to move horizontally left and right by driving the lifting component 3 to move horizontally. For a brush 1 with a length not less than the diameter of the wafer 300, the brush 1 only needs to move back and forth to completely cover the area projected onto the lower surface of the upper cover 100 when the wafer 300 is placed horizontally, thus completely preventing residual water droplets directly above the wafer 300 from falling onto the surface of the wafer 300. However, for a brush 1 with a length less than the diameter of the wafer 300, to achieve complete coverage of the area projected onto the lower surface of the upper cover 100 when the wafer 300 is placed horizontally, not only back and forth horizontal movement is required, but also left and right horizontal movement. By providing the horizontal moving component, the left and right horizontal movement of the brush 1 is achieved, improving the versatility of the upper cover residual water droplet treatment device.

[0073] In some possible implementations, the horizontal movement assembly includes a push cylinder and a push platform. The lifting cylinder is fixed to the push platform, and the push rod of the push cylinder is connected to the push platform to drive the push platform to move the lifting cylinder horizontally to the left and right, thereby moving the brush 1 horizontally to the left and right.

[0074] This embodiment also provides a method for treating residual water droplets on the top cover of a vacuum wetting chamber, applied to the aforementioned device for treating residual water droplets on the top cover. The method includes: setting a brush 1 outside the vacuum wetting chamber for removing water droplets inside the top cover 100; when water droplets inside the top cover 100 need to be removed, controlling the brush 1 to extend into the interior of the top cover 100; moving the brush 1 that extends into the interior of the top cover 100 to remove water droplets at the bottom of the top cover 100.

[0075] The method for treating residual water droplets on the top cover of the vacuum wetting chamber involves setting a brush 1 outside the vacuum wetting chamber to remove water droplets inside the top cover 100. When water droplets inside the top cover 100 need to be removed, the brush 1 is controlled to extend into the interior of the top cover 100 and moved to remove water droplets from the lower part of the top cover 100. This eliminates the risk of water film damage or defects on the surface of the wafer 300 caused by the accumulation and falling of water droplets from the lower part of the top cover 100, thereby improving product reliability and yield.

[0076] The control unit of the semiconductor device controls the opening and closing of the top cover 100 and the operation of the drive mechanism in the top cover residual water droplet treatment device. A humidity sensor is installed inside the top cover 100 to detect the humidity value inside the top cover 100 and send it to the control unit. When the humidity value detected by the humidity sensor exceeds the humidity threshold, the control unit controls the drive mechanism to drive the brush 1 to extend into the interior of the top cover 100. For example, a humidity sensor is installed on the lower surface of the top cover 100, the water inlet pipe 101, and the nozzle assembly 104 to enable independent wiping operations on the lower surface of the top cover 100, the water inlet pipe 101, and the nozzle assembly 104.

[0077] It should be noted that when the brush 1 enters the interior of the upper cover 100, the control unit confirms that the wafer 300 has been moved out of the cavity 200 and that the upper cover 100 is in the open state before controlling the drive mechanism to operate.

[0078] In one embodiment, the conditions for controlling the drive mechanism to perform the scraping operation are: once after completing a set number of wafers 300 wetting processes; or once at a set time interval.

[0079] The method for handling residual water droplets on the top cover of this vacuum wetting chamber seamlessly integrates the squeegee operation into the process gaps of the existing production cycle. After the squeegee operation is completed, it is retracted to a storage position outside the chamber 200, avoiding any interference that the brush 1 may cause to the wafer 300 transfer or the process atmosphere. It also facilitates the maintenance and replacement of the brush 1. This method eliminates the need to interrupt production for cleaning, thus achieving a safe, proactive, precise, efficient, and non-disruptive online cleaning method, ensuring production continuity and improving production efficiency.

[0080] In one embodiment, the interior of the cover 100 includes a lower surface of the cover 100; when water droplets inside the cover 100 need to be removed, the brush 1 is controlled to extend into the interior of the cover 100, including: when water droplets on the lower surface of the cover 100 need to be removed, the brush 1 is controlled to be at a first height, so that the brush 1 extends into the lower surface of the cover 100 and makes contact with the lower surface.

[0081] Specifically, when the humidity value detected by the humidity sensor on the lower surface of the upper cover 100 exceeds the humidity threshold, the height corresponding to the lower surface of the upper cover 100 is the first height. The control unit first controls the lifting cylinder to lift and lower, so that the brush 1 is located at the first height, and then controls the telescopic component 2 to extend, so that the brush 1 extends into the lower surface of the upper cover 100 and contacts the lower surface, so that the silicone squeegee stick abuts against the lower surface, thereby realizing the squeegee operation on the lower surface.

[0082] In one embodiment, the length of the brush 1 is not less than the diameter of the wafer 300; moving the brush 1, which extends into the lower surface of the upper cover 100, to remove water droplets from the lower part of the upper cover 100 includes: controlling the brush 1 to make at least contactive back-and-forth horizontal movements on the lower surface of the upper cover 100 to remove water droplets inside the upper cover 100, wherein the scraping area 11 of the brush 1 completely covers the area projected onto the lower surface of the upper cover 100 when the wafer 300 is placed horizontally.

[0083] like Figure 3 As shown, in order to ensure that the swiping operation of the brush 1 can completely cover the wafer 300 inside the cavity 200 and prevent residual water droplets from falling onto the wafer 300, the swiping area 11 of the brush 1 must cover at least the area of ​​the wafer 300. When the length of the brush 1 is not less than the diameter of the wafer 300, the telescopic component 2 is controlled to extend and retract, so that the brush 1 moves horizontally back and forth. After the brush 1 moves horizontally back and forth, the swiping area 11 completely covers the area projected from the lower surface of the upper cover 100 when the wafer 300 is placed horizontally.

[0084] In one embodiment, the length of the brush 1 is less than the diameter of the wafer 300; moving the brush 1, which extends into the lower surface of the upper cover 100, to remove water droplets from the lower part of the upper cover 100 includes: controlling the brush 1 to make at least contactive back-and-forth horizontal movement and left-and-right horizontal movement on the lower surface of the upper cover 100 to remove water droplets from the lower part of the upper cover 100, wherein the scraping area 11 of the brush 1 completely covers the area projected onto the lower surface of the upper cover 100 when the wafer 300 is placed horizontally.

[0085] When the length of brush 1 is less than the diameter of wafer 300, simply controlling the telescopic component 2 to extend and retract is insufficient to completely cover wafer 300. Therefore, while controlling the telescopic component 2 to extend and retract to drive the brush 1 to move horizontally back and forth, the horizontal movement component is also controlled. By controlling the push cylinder to drive the lifting component 3 to move horizontally left and right through the push platform, the brush 1 can be moved horizontally left and right. This ensures that the scraping area 11 after the brush 1 moves horizontally back and forth and horizontally, completely covers the area projected from the lower surface of the upper cover 100 when wafer 300 is placed horizontally.

[0086] It should be noted that the first gap between the lower surface of the top cover 100 and the water inlet pipe 101 is greater than or equal to the thickness of the brush 1, so that the brush 1 can move horizontally back and forth and horizontally left and right within the first gap.

[0087] In one embodiment, the upper cover 100 also includes a water inlet pipe 101 located at the lower part of the upper cover 100. When water droplets inside the upper cover 100 need to be removed, the brush 1 is controlled to extend into the interior of the upper cover 100. This includes: when water droplets on the water inlet pipe 101 at the lower part of the upper cover 100 are detected to need to be removed, the brush 1 is controlled to be at a second height, so that the brush 1 extends into the lower part of the upper cover 100 and is in contact with the water inlet pipe 101.

[0088] Specifically, the water inlet pipe 101 is located below the lower surface of the upper cover 100, at a height of the second height. When the humidity value detected by the humidity sensor on the water inlet pipe 101 exceeds the humidity threshold, the control unit first controls the lifting cylinder to lower the telescopic component 2 and the brush 1 to the second height via the lifting platform. Then, it controls the telescopic component 2 to extend, driving the brush 1 to extend into the lower part of the upper cover 100 and abut against the water inlet pipe 101. Then, by controlling the telescopic component 2 to extend and retract, the brush 1 is driven to move horizontally back and forth. Alternatively, the push cylinder is simultaneously controlled to drive the telescopic component 2 and the brush 1 to move horizontally left and right via the push platform to scrape away the water droplets remaining on the water inlet pipe 101.

[0089] It should be noted that the second gap between the water inlet pipe 101 and the nozzle assembly 104 is greater than or equal to the thickness of the brush 1, so that the brush 1 can move horizontally back and forth and horizontally left and right within the second gap.

[0090] In one embodiment, the upper cover 100 also includes a nozzle assembly 104 located at the lower part of the upper cover 100. When water droplets inside the upper cover 100 need to be removed, the brush 1 is controlled to extend into the interior of the upper cover 100. This includes: when water droplets on the nozzle assembly 104 at the lower part of the upper cover 100 are detected to need to be removed, the brush 1 is controlled to be at a third height, so that the brush 1 extends into the lower part of the upper cover 100 and is in contact with the nozzle assembly 104.

[0091] Specifically, the nozzle assembly 104 is located below the water inlet pipe 101 at the third height. The control unit first controls the lifting cylinder to drive the telescopic assembly 2 and brush 1 to descend to the third height via the lifting platform. Then, it controls the telescopic assembly 2 to extend, driving the brush 1 to extend into the lower part of the upper cover 100 and abut against the nozzle assembly 104. Then, by controlling the telescopic assembly 2 to extend and retract, the brush 1 is driven to move horizontally back and forth. Alternatively, the push cylinder is controlled to drive the telescopic assembly 2 and brush 1 to move horizontally left and right via the push platform to scrape away the water droplets remaining on the nozzle assembly 104.

[0092] In one embodiment, when the brush 1 has completed its work of removing water droplets, the brush 1 is controlled to move to the outside of the cavity 200. When the water droplets inside the top cover 100 have been removed, the telescopic component 2 is controlled to retract, thereby driving the brush 1 to move to the initial position outside the cavity 200, i.e., the storage position of the top cover residual water droplet treatment device, to avoid any interference that the brush 1 may cause to the wafer 300 transport or process atmosphere, and also to facilitate the maintenance and replacement of the brush 1.

[0093] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for treating residual water droplets on the top cover of a vacuum wetting chamber, characterized in that, The processing method includes: A brush (1) is provided outside the vacuum wetting chamber for removing water droplets from the inside of the top cover (100); When water droplets inside the top cover (100) need to be removed, the brush (1) is controlled to extend into the interior of the top cover (100); Move the brush (1) that extends into the interior of the top cover (100) to remove water droplets from the interior of the top cover (100).

2. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 1, characterized in that, The interior of the upper cover (100) includes the lower surface of the upper cover (100); When water droplets inside the top cover (100) need to be removed, controlling the brush (1) to extend into the interior of the top cover (100) includes: When water droplets are detected on the lower surface of the cover (100) and need to be removed, the brush (1) is controlled to be at a first height so that the brush (1) extends into the lower surface of the cover (100) and makes contact with the lower surface.

3. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 2, characterized in that, The length of the brush (1) is not less than the diameter of the wafer (300); The movable brush (1) extending into the lower surface of the upper cover (100) to remove water droplets inside the upper cover (100) includes: The brush (1) is controlled to make at least contactive back-and-forth horizontal movements on the lower surface of the upper cover (100) to remove water droplets from the lower part of the upper cover (100), wherein the scraping area (11) of the brush (1) completely covers the area projected onto the lower surface of the upper cover (100) when the wafer (300) is placed horizontally.

4. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 2, characterized in that, The length of the brush (1) is less than the diameter of the wafer (300); The movable brush (1) extending into the lower surface of the upper cover (100) to remove water droplets inside the upper cover (100) includes: The brush (1) is controlled to make at least contactive back-and-forth horizontal movement and left-and-right horizontal movement on the lower surface of the upper cover (100) to remove water droplets inside the upper cover (100), wherein the scraping area (11) of the brush (1) completely covers the area projected onto the lower surface of the upper cover (100) when the wafer (300) is placed horizontally.

5. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 1, characterized in that, The upper cover (100) also includes a water inlet pipe (101) located at the lower part of the upper cover (100); When water droplets inside the top cover (100) need to be removed, controlling the brush (1) to extend into the interior of the top cover (100) includes: When water droplets on the water inlet pipe (101) inside the top cover (100) are detected to need to be removed, the brush (1) is controlled to be at a second height, so that the brush (1) extends into the lower part of the top cover (100) and is in contact with the water inlet pipe (101).

6. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 1, characterized in that, The upper cover (100) also includes a nozzle assembly (104) located in the lower part of the upper cover (100); When water droplets inside the top cover (100) need to be removed, controlling the brush (1) to extend into the interior of the top cover (100) includes: When water droplets on the nozzle assembly (104) at the lower part of the top cover (100) are detected to need to be removed, the brush (1) is controlled to be at a third height so that the brush (1) extends into the lower part of the top cover (100) and is in contact with the nozzle assembly (104).

7. The method for treating residual water droplets on the top cover of the vacuum wetting chamber according to claim 1, characterized in that, Also includes: When the brush (1) has finished removing water droplets, the brush (1) is controlled to move to the outside of the vacuum wetting chamber.

8. A device for treating residual water droplets on the top cover of a vacuum wetting chamber, characterized in that, include: A brush (1) is disposed outside the cavity (200) of the vacuum wetting chamber and has a certain distance between it and the cavity (200). The distance allows the brush (1) to extend under the top cover (100) to remove water droplets and to not contact the cavity (200) after removing water droplets. A drive mechanism, connected to the brush (1), is used to drive the brush (1) to perform at least one of forward, backward, left, right and up movements to perform the method for treating residual water droplets on the top cover of the vacuum wetting chamber as described in any one of claims 1-7.

9. The device for treating residual water droplets on the upper cover of the vacuum wetting chamber according to claim 8, characterized in that, The drive mechanism includes a telescopic component (2) connected to the brush (1) for controlling the horizontal movement of the brush (1) back and forth by telescopic control.

10. The device for treating residual water droplets on the upper cover of the vacuum wetting chamber according to claim 9, characterized in that, The driving mechanism also includes a lifting component (3), which is connected to the telescopic component (2) and is used to drive the brush (1) to move up and down in the vertical direction.

11. The device for treating residual water droplets on the upper cover of the vacuum wetting chamber according to claim 10, characterized in that, The driving mechanism also includes a horizontal moving component, which is disposed at the bottom of the lifting component (3) and is used to drive the brush (1) to move horizontally left and right by driving the lifting component (3) to move left and right.

12. The device for treating residual water droplets on the upper cover of the vacuum wetting chamber according to claim 8, characterized in that, The brush (1) includes a support element and a scraper mounted above the support element. The scraper is arranged horizontally and facing the lower surface of the upper cover (100) so that when the brush (1) moves up and down, the scraper maintains horizontal contact with the lower surface of the upper cover (100).

13. The device for treating residual water droplets on the upper cover of the vacuum wetting chamber according to claim 12, characterized in that, The outer side of the upper cover (100) is provided with a downwardly extending annular protrusion for docking with the cavity (200) below; The total height of the support element and the scraper is greater than the vertical distance between the lower surface of the upper cover (100) and the bottom end of the annular protrusion, so that the scraper can make horizontal contact with the lower surface of the upper cover (100). The difference between the total height of the support element and the scraper and the vertical distance is 1mm-5mm, and the scraper can be compressed under external pressure. The thickness of the scraper after compression is 0.1-0.9 times the thickness of the scraper itself.

14. A semiconductor device, characterized in that, Includes a residual water droplet treatment device for the top cover of the vacuum wetting chamber as described in any one of claims 8-13.

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