Power supply test system and power supply test method

Abstract

The invention provides a power supply test system and a power supply test method. The power supply test system comprises a power supply device and a load control device. The load control device is used for simulating a load change corresponding to at least one operation behavior of the flash memory control chip and extracting a test power supply from the power supply device through the load change. Therefore, the test efficiency of the power supply device can be improved.

Description

Technical Field

[0001] This invention relates to the field of power supply testing technology, and in particular to a power supply testing system and a power supply testing method. Background Technology

[0002] For flash memory controller chips, their power supply circuits need to handle current draws with varying slopes and steps during operation. Therefore, testing the power supply circuit of a flash memory controller chip requires a load capable of simulating read, write, and erase operations. However, traditional testing equipment struggles to accurately reproduce these test cases. Furthermore, limited by external wiring and the internal circuitry of the load instrument, traditional methods exhibit slow load switching and response speeds, failing to capture the true performance of the power supply under rapidly changing loads. Additionally, traditional external electronic loads typically require manual setup, with fixed test modes, making it impossible to flexibly simulate complex and dynamic load scenarios. Summary of the Invention

[0003] This invention provides a power supply testing system and method that can automatically simulate subtle load changes of flash memory control chips or other types of electronic devices under different operating behaviors through specially configured hardware collaboration, thereby solving the above-mentioned problems and improving the testing efficiency of power supply devices.

[0004] An embodiment of the present invention provides a power supply testing system, which includes a power supply device and a load control device. The load control device is connected to the power supply device. The load control device is used to simulate load changes corresponding to at least one operational behavior of a flash memory controller chip, and to draw test power from the power supply device based on the load changes.

[0005] An embodiment of the present invention further provides a power supply testing method for a power supply testing system. The power supply testing method includes: simulating load changes corresponding to at least one operational behavior of a flash memory controller chip by a load control device in the power supply testing system; and drawing test power from a power supply device based on the load changes.

[0006] Based on the above, by simulating the load change corresponding to at least one operation behavior of the flash memory control chip, the power supply test system and power supply test method proposed in this invention can effectively improve the problems of rigid test process and lack of flexibility caused by the traditional method of adjusting the load manually or through test scripts, thereby improving the test efficiency for power supply devices. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of a power supply testing system according to an embodiment of the present invention;

[0008] Figure 2This is a schematic diagram of a load control device, a power supply device, and a monitoring device according to an embodiment of the present invention;

[0009] Figure 3 This is a schematic diagram showing the relative relationship between the control voltage and the test power supply of the first switching circuit according to an embodiment of the present invention and time.

[0010] Figure 4 This is a schematic diagram of a load control device according to an embodiment of the present invention;

[0011] Figure 5 This is a flowchart illustrating a power supply testing method according to an embodiment of the present invention. Detailed Implementation

[0012] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0013] Figure 1 This is a schematic diagram of a power supply testing system according to an embodiment of the present invention. Please refer to... Figure 1 In one embodiment, the power supply testing system 10 may include a power supply device 12 and a load control device 14. The load control device 14 is connected to the power supply device 12.

[0014] In one embodiment, during a power supply test of the power supply device 12, the load control device 14 can simulate load changes corresponding to at least one operational behavior of the flash memory control chip and draw test power from the power supply device 12 based on the load changes. For example, in response to this load change, the power supply device 12 can automatically adjust the output test power (e.g., adjust the current value of the test power).

[0015] In one embodiment, at least one operational action may include read, write, and / or erase operations that the flash memory controller chip may perform on the memory module. In one embodiment, the load change can accurately and / or continuously reflect the actual load change caused by the flash memory controller chip performing at least one operational action on the memory module. By measuring the test power provided by the power supply device 12, managers can accurately evaluate the performance and / or operational stability of the power supply device 12 when actually supplying power to the flash memory controller chip.

[0016] In one embodiment, during the period when test power is drawn from the power supply device 12, the current value of the test power supply can be automatically changed based on load changes. For example, in response to a decrease in the total load provided by the load control device 14, the power supply device 12 can automatically increase the current value of the test power supply. Alternatively, in response to an increase in the total load provided by the load control device 14, the power supply device 12 can automatically decrease the current value of the test power supply. This reflects the performance and / or operational stability of the power supply device 12 when actually supplying power to the operating flash memory controller chip. In one embodiment, the total load can also be considered as or reflects the total impedance provided by the load control device 14. In one embodiment, a load change can also be considered as or reflects a change in the total impedance provided by the load control device 14.

[0017] In one embodiment, the power supply testing system 10 may further include a monitoring device 13. The monitoring device 13 is used to monitor the test power supply and provide evaluation data. For example, the input of the monitoring device 13 may be connected to the power output of the power supply device 12 to monitor the test power output by the power supply device 12. Based on the monitoring results of the test power supply, the monitoring device 13 can provide evaluation data. This evaluation data can reflect the quality of the test power supply. In one embodiment, for example, the monitoring device 13 may include an oscilloscope or other type of power supply monitoring device.

[0018] In one embodiment, using an oscilloscope as an example, the monitoring device 13 can display the monitored current and / or voltage changes of the test power supply on its screen, and can record the monitored current and / or voltage values ​​of the test power supply at different time points as at least part of the evaluation data. In one embodiment, the monitoring device 13 can also transmit the evaluation data to the host 11 or an external device for management personnel to view.

[0019] In one embodiment, the power supply testing system 10 may further include a host 11. The host 11 is connected to the load control device 14. Before performing a power supply test on the power supply device 12 or after starting the power supply test on the power supply device 12, the host 11 may set parameters (including parameter adjustments) for the load control device 14. In addition, the host 11 may also be used to be responsible for and / or control the overall or partial operation of the power supply test performed by the load control device 14 on the power supply device 12.

[0020] In one embodiment, the load control device 14 may, according to at least one parameter set by the host 11, control (including adjust) at least one of the rising slope, initial value, and final value of the test power supply current value during the period when the test power supply is drawn from the power supply device 12. In particular, this rising slope can be used to influence the rising rate of the test power supply current value.

[0021] In one embodiment, based on at least one parameter set by the host 11, during the period when the load control device 14 draws test power from the power supply device 12, the current value of the test power supply can start from a set initial value and gradually increase to a set final value based on a set rising slope. This effectively simulates the actual operation of the flash memory controller chip drawing power from the power supply device 12 during actual operation, and thus evaluates the performance and / or operational stability of the power supply device 12 when actually supplying power to the flash memory controller chip based on the test power supply.

[0022] In one embodiment, the load control device 14 may include a controller 141 and an impedance adjustment circuit 142 (also referred to as a first impedance adjustment circuit). The impedance adjustment circuit 142 is connected to the controller 141.

[0023] In one embodiment, controller 141 is used to provide an input voltage (also referred to as a first input voltage). For example, controller 141 may include a microcontroller unit (MCU), an embedded controller (EC), or other types of controllers. Controller 141 can provide the first input voltage to impedance regulation circuit 142 via general purpose input / output (GPIO) pins or other types of pins or interfaces.

[0024] In one embodiment, the impedance adjustment circuit 142 may include at least one switching circuit (also referred to as a first switching circuit). For example, the first switching circuit may include a metal-oxide-semiconductor field-effect transistor (MOSFET) or a similar switching element that can be used as a switch.

[0025] In one embodiment, the first input voltage can be used to change the conduction level of the first switching circuit (also referred to as the first conduction level). For example, depending on the first input voltage, the conduction level of the first switching circuit (i.e., the first conduction level) can be switched from an off state (also referred to as a cut-off state, i.e., completely non-conducting) to partial conduction, and then can be switched to full conduction.

[0026] In one embodiment, the impedance adjustment circuit 142 can change its output impedance (also referred to as the first impedance) according to changes in the first conduction level. For example, when the first switching circuit is in the off state, the output impedance (i.e., the first impedance) of the impedance adjustment circuit 142 is at its maximum (e.g., approaching infinity). In response to the first switching circuit switching from a partially conducting state to a fully conducting state, the impedance value of the first impedance can gradually decrease. When the first switching circuit is switched to a fully conducting state, the output impedance (i.e., the first impedance) of the impedance adjustment circuit 142 is at its minimum (e.g., approaching zero or a preset value).

[0027] In one embodiment, the impedance value of the first impedance can affect the total load provided by the load control device 14 in real time. For example, the impedance value of the first impedance can be positively correlated with the total load provided by the load control device 14. That is, as the impedance value of the first impedance gradually decreases, the total load provided by the load control device 14 can also gradually decrease. Alternatively, as the impedance value of the first impedance gradually increases, the total load provided by the load control device 14 can also gradually increase.

[0028] In one embodiment, the load control device 14 may further include a load adjustment circuit 143. The load adjustment circuit 143 is connected to the impedance adjustment circuit 142. The load adjustment circuit 143 is used to reflect load changes to the power supply device 12 based on at least one input impedance. For example, the input impedance obtained by the load adjustment circuit 143 includes at least a first impedance. Based on changes in the first impedance, the load adjustment circuit 143 can reflect load changes to the power supply device 12 in real time.

[0029] Figure 2 This is a schematic diagram illustrating a load control device, a power supply device, and a monitoring device according to an embodiment of the present invention. Please refer to... Figure 2 In one embodiment, the impedance adjustment circuit 142 may include a switching circuit 21 (i.e., a first switching circuit) and a charging circuit 22. The charging circuit 22 is connected between the controller 141 and the switching circuit 21.

[0030] In one embodiment, the impedance adjustment circuit 142 may receive a voltage V1 (i.e., a first input voltage) from the controller 141. The impedance adjustment circuit 142 may then charge the charging circuit 22 based on the voltage V1 to change the conduction level of the switching circuit 21 (i.e., a first conduction level).

[0031] In one embodiment, the switching circuit 21 may include a switching element Q1. For example, the switching element Q1 may include a MOSFET or a similar switching element that can be used as a switch.

[0032] In one embodiment, the charging circuit 22 may include an impedance element R1 (also referred to as a first impedance element), a voltage regulator element D1 (also referred to as a first voltage regulator element), and a capacitor element C1. The impedance element R1 is connected to the controller 141. The voltage regulator element D1 is connected between the impedance element R1 and the capacitor element C1. One end of the capacitor element C1 is connected to the control terminal of the switching element Q1. The other end of the capacitor element C1 is grounded (or connected to a reference ground voltage). For example, the impedance element R1 may include at least one resistor, the voltage regulator element D1 may include at least one Zener diode, and the capacitor element C1 may include at least one capacitor.

[0033] In one embodiment, the impedance element R1 and the voltage regulator element D1 can charge the capacitor element C1 according to the voltage V1 to increase the voltage value of V1'. For example, the voltage V1' can be regarded as the gate bias voltage (also known as the control voltage) of the switching element Q1.

[0034] In one embodiment, when the voltage value of V1' is not greater than a threshold value, the switching element Q1 can be in the off state (i.e., completely non-conductive). When the voltage value of V1' rises to a value greater than this threshold value, the electrical path between the source and drain of the switching element Q1 can be made conductive. At this time, the switching element Q1 begins to gradually conduct, and the impedance provided by the impedance adjustment circuit 142 (i.e., the first impedance) begins to gradually decrease.

[0035] In one embodiment, the impedance adjustment circuit 142 may further include a discharge circuit 23. The discharge circuit 23 is connected to the switching circuit 21. The impedance adjustment circuit 142 can restore the switching circuit 21 to the off state (i.e., completely non-conductive) through the discharge circuit 23.

[0036] In one embodiment, the discharge circuit 23 may include an impedance element R2 (also referred to as a second impedance element) and a voltage regulator element D2 (also referred to as a second voltage regulator element). The impedance element R2 is connected to the controller 141. The voltage regulator element D2 is connected between the impedance element R2 and the capacitor element C1. For example, the impedance element R2 may include at least one resistor, and the voltage regulator element D2 may include at least one Zener diode.

[0037] In one embodiment, the impedance element R2 and the voltage regulator element D2 can discharge the capacitor element C1 to reduce the voltage value V1'. By reducing the voltage value V1', the switching circuit 21 can be restored to the off state (i.e., completely non-conductive). Furthermore, during the process of restoring the switching circuit 21 from a fully conductive or partially conductive state to the off state, the impedance value provided by the impedance adjustment circuit 142 (i.e., the first impedance) gradually increases. Thus, through the cyclic operation of the charging circuit 22 and the discharging circuit 23, the conduction state of the switching circuit 21 can be cyclically adjusted to repeatedly perform power supply tests on the power supply device 12.

[0038] In one embodiment, the load regulation circuit 143 may include an impedance element R3 (also referred to as a third impedance element). The impedance element R3 is connected between the impedance regulation circuit 142 (or the switching circuit 21) and the power supply device 12. For example, the impedance element R3 may include at least one resistor.

[0039] In one embodiment, the load regulating circuit 143 can reflect the total load (i.e., load change) provided by the load control device 14 to the power supply device 12 in real time according to the change in impedance (i.e., the first impedance) provided by the impedance regulating circuit 142. This changes the test power output by the power supply device 12.

[0040] In one embodiment, the power supply device 12 may include a power supply circuit 20. The power supply circuit 20 may output a corresponding test power supply at the power output terminal of the power supply device 12 in response to the total load (i.e., load change) provided by the load control device 14. For example, the power supply circuit 20 may include a low dropout regulator (LDO) or other types of power output circuitry.

[0041] Figure 3 This is a schematic diagram illustrating the relative relationship between the control voltage and the test power supply of the first switching circuit according to an embodiment of the present invention and time. Please refer to... Figure 2 and Figure 3 Curve 31 shows that during the charging of the charging circuit 22 based on voltage V1, the voltage value of V1' (i.e., the control voltage) continuously increases. At the same time, curve 32 shows that, in response to the change in the conduction degree (i.e., the first conduction degree) of the switching circuit 21, the current value of the test power supply provided by the power supply device 12 can gradually increase from the set initial value to the set final value based on the set rising slope.

[0042] Please see Figure 3During the period when the charging circuit 22 is charged based on voltage V1, V1' (i.e., control voltage) can be seen as curve 31. At time t1, the switching circuit 21 is in the initial conducting state, and the current value I of the corresponding test power supply is shown as curve 32, that is, it starts to rise at time t1. When it reaches time t2, the switching circuit 21 is in the fully conducting state, and the current value I of the corresponding test power supply is at its maximum.

[0043] It should be noted that, Figure 3 Curves 31 and 32 are merely examples and are not intended to limit the invention. In one embodiment, at least one of curves 31 and 32 may comprise a straight line, a parabola, or other type of line segment or combination of line segments, which is not limited by the invention.

[0044] In one embodiment, at least one of the impedance elements R1-R3 may be implemented as a variable impedance element (e.g., a variable resistor). In another embodiment, the capacitor element C1 may be implemented as a variable capacitor element (e.g., a variable capacitor). Thus, during power supply testing of the power supply device 12, by adjusting the parameters of at least one of the impedance elements R1-R3 and / or the capacitor element C1, the path of curve 32 can be finely adjusted more precisely, thereby further improving the testing flexibility of the power supply device 12.

[0045] In one embodiment, the host 11 can adjust the parameter values ​​of the impedance element R1 and / or the capacitor element C1 to adjust the rate of change of the conduction level (i.e., the first conduction level) of the switching circuit 21 during the charging of the capacitor element C1 according to the voltage V1. By changing the rate of change of the conduction level of the switching circuit 21, the rising slope of the current value of the test power supply provided by the power supply device 12 can be changed accordingly.

[0046] In one embodiment, the load control device 14 can also improve the diversity of load changes reflected to the power supply device 12 through multiple impedance adjustment circuits, thereby more diversely changing the rise slope of the current value of the test power supply provided by the power supply device 12.

[0047] Figure 4 This is a schematic diagram of a load control device according to an embodiment of the present invention. Please refer to... Figure 4 In one embodiment, the load control device 14 may include the load control device 40.

[0048] In one embodiment, the load control device 40 may include a controller 41, impedance adjustment circuits 420-440, and a load adjustment circuit 43. The impedance adjustment circuits 420-440 are connected between the controller 41 and the load adjustment circuit 43.

[0049] In one embodiment, the controller 41 can provide a voltage V1 (i.e., a first input voltage) to the impedance regulation circuit 420 (i.e., a first impedance regulation circuit). The voltage V1 can be used to change the conduction level (i.e., the first conduction level) of the switching element Q1 in the switching circuit 421. For example, the impedance regulation circuit 420 can charge the charging circuit 422 based on the voltage V1 to increase the voltage value of V1'. By increasing the voltage value of V1', the first conduction level can be changed. In response to the change in the first conduction level, the impedance provided by the impedance regulation circuit 420 (i.e., the first impedance) can be changed accordingly.

[0050] In one embodiment, the impedance adjustment circuit 420 may further include a discharge circuit 423. For example, in the discharge circuit 423, the impedance element R2 and the voltage regulator element D2 can discharge the capacitor element C1 to reduce the voltage value of V1'. It should be noted that the charging circuit 422 and the discharge circuit 423 are the same as or similar to... Figure 2 The charging circuit 22 and the discharging circuit 23 are described in detail here, so they will not be repeated.

[0051] In one embodiment, the controller 41 can provide a voltage V2 (also referred to as a second input voltage) to the impedance regulation circuit 430 (also referred to as a second impedance regulation circuit). The voltage V2 can be used to change the conduction level (also referred to as a second conduction level) of the switching element Q2 in the switching circuit 431. For example, the impedance regulation circuit 430 can charge the charging circuit 432 based on the voltage V2 to increase the voltage value of V2'. For example, in the charging circuit 432, the impedance element R4 and the voltage regulator element D3 can charge the capacitor element C2 according to the voltage V2 to increase the voltage value of V2'. By increasing the voltage value of V2', the second conduction level can be changed. In response to the change in the second conduction level, the impedance provided by the impedance regulation circuit 430 (also referred to as a second impedance) can be changed accordingly.

[0052] In one embodiment, the impedance adjustment circuit 430 may further include a discharge circuit 433. For example, in the discharge circuit 433, the impedance element R5 and the voltage regulator element D4 can discharge the capacitor element C2 to reduce the voltage value of V2'. It should be noted that the charging circuit 432 and the discharging circuit 433 are the same as or similar to... Figure 2 The charging circuit 22 and discharging circuit 23 are described in detail here. Furthermore, the switching element Q2 is the same as or similar to the switching element Q1, so it will not be described in detail here either.

[0053] In one embodiment, the controller 41 can provide a voltage V3 (also referred to as a third input voltage) to the impedance regulation circuit 440 (also referred to as a third impedance regulation circuit). The voltage V3 can be used to change the conduction level (also referred to as a third conduction level) of the switching element Q3 in the switching circuit 441. For example, the impedance regulation circuit 440 can charge the charging circuit 442 based on the voltage V3 to increase the voltage value of V3'. For example, in the charging circuit 442, the impedance element R7 and the voltage regulator element D5 can charge the capacitor element C3 according to the voltage V3 to increase the voltage value of V3'. By increasing the voltage value of V3', the third conduction level can be changed. In response to the change in the third conduction level, the impedance provided by the impedance regulation circuit 440 (also referred to as a third impedance) can be changed accordingly.

[0054] In one embodiment, the impedance adjustment circuit 440 may further include a discharge circuit 443. For example, in the discharge circuit 443, the impedance element R8 and the voltage regulator element D6 can discharge the capacitor element C3 to reduce the voltage value of V3'. It should be noted that the charging circuit 442 and the discharge circuit 443 are the same as or similar to... Figure 2 The charging circuit 22 and discharging circuit 23 are described in detail here. Furthermore, the switching element Q3 is the same as or similar to the switching element Q1, so it will not be described in detail here either.

[0055] In one embodiment, the load regulating circuit 43 may include impedance elements R3, R6, and R9 connected in parallel. The load regulating circuit 43 can receive the impedance (i.e., the first impedance) provided by the impedance regulating circuit 420 through impedance element R3. The load regulating circuit 43 can receive the impedance (i.e., the second impedance) provided by the impedance regulating circuit 430 through impedance element R6. Furthermore, the load regulating circuit 43 can receive the impedance (i.e., the third impedance) provided by the impedance regulating circuit 440 through impedance element R9. The first, second, and third impedances can all be considered as input impedances of the load regulating circuit 43. Subsequently, in response to changes in these input impedances, the load regulating circuit 43 can reflect the corresponding load changes to the power supply device 12.

[0056] In one embodiment, the controller 41 can provide voltages V1-V3 sequentially or simultaneously according to an operating timing setting. In one embodiment, providing voltage V1 to the impedance adjustment circuit 420 can be considered as activating the impedance adjustment circuit 420. In one embodiment, providing voltage V2 to the impedance adjustment circuit 430 can be considered as activating the impedance adjustment circuit 430. In one embodiment, providing voltage V3 to the impedance adjustment circuit 440 can be considered as activating the impedance adjustment circuit 440. In one embodiment, by dynamically controlling the activation or deactivation of at least one of the impedance adjustment circuits 420, 430, and 440, the rise rate, initial value, and / or final value of the current value of the test power supply provided by the power supply device 12 can be varied more variably.

[0057] In one embodiment, the controller 41 can influence (e.g., adjust) the rise slope, initial value, and / or final value of the test power supply provided by the power supply device 12 by activating different impedance adjustment circuits (or combinations of impedance adjustment circuits) at different stages of the test procedure.

[0058] In one embodiment, at least one of the impedance elements R1-R9 may be implemented as a variable impedance element (e.g., a variable resistor). In one embodiment, at least one of the capacitor elements C1-C3 may be implemented as a variable capacitance element (e.g., a variable capacitor). Thus, during a power supply test of the power supply device 12, by adjusting the parameters of at least one of the impedance elements R1-R9 and / or at least one of the capacitor elements C1-C3, the power supply device 12 can be tested. Figure 3 The path of curve 32 is finely adjusted to improve the test flexibility of power supply device 12.

[0059] In one embodiment, during the period when charging circuit 422 is charged based on voltage V1 to change the conduction level of switching circuit 421 (i.e., the first conduction level), the first conduction level changes based on a certain rate of change (also referred to as the first rate of change). Furthermore, during the period when charging circuit 432 is charged based on voltage V2 to change the conduction level of switching circuit 431 (i.e., the second conduction level), the second conduction level changes based on another rate of change (also referred to as the second rate of change). The second rate of change is different from (e.g., higher or lower than) the first rate of change. This further improves the testing flexibility of the power supply device 12.

[0060] In one embodiment, the host 11 may adjust the parameter values ​​of the impedance element R1 and / or the capacitor element C1 to change the first rate of change. In another embodiment, the host 11 may adjust the parameter values ​​of the impedance element R4 and / or the capacitor element C2 to change the second rate of change.

[0061] In one embodiment, the total number of impedance adjustment circuits 420-440 provided in the load control device 40 may be more (e.g., increased to 4 or 5 groups, etc.) or less (e.g., reduced to 2 groups), and the present invention does not limit this.

[0062] It should be noted that, Figure 2 and Figure 4 The connection methods between the components presented in the embodiments are merely exemplary and not intended to limit the invention. In other embodiments, Figure 2 and Figure 4 The connection methods between some of the components can also be adjusted according to practical needs. Furthermore, Figure 2 and Figure 4Some components can also be replaced with components that have the same or similar functions according to practical needs, and / or more useful components can be added. Figure 2 and Figure 4 In order to provide better work efficiency, the present invention is not limited.

[0063] Figure 5 This is a flowchart illustrating a power supply testing method according to an embodiment of the present invention. Please refer to... Figure 5 In step S501, the load control device in the power supply test system simulates the load change corresponding to at least one operational behavior of the flash memory control chip. Figure 4 R3, R6, and R9 in the diagram correspond to different loads during different operations. For example, R3 corresponds to the erase operation, R6 corresponds to the read operation, and R9 corresponds to the programmable operation. In step S502, test power is drawn from the power supply device based on the load change.

[0064] However, Figure 5 Each step has been explained in detail above and will not be repeated here. It is worth noting that... Figure 5 Each step can be implemented as multiple program codes or circuits, and this invention is not limited thereto. Furthermore, Figure 5 The method can be used in conjunction with the above examples and embodiments, or it can be used alone. This invention does not impose any limitations.

[0065] In summary, the power supply testing system and method proposed in this invention can automatically simulate subtle load changes in flash memory chips or other types of electronic devices under different operating behaviors through specially configured hardware coordination. This effectively improves the testing efficiency for power supply devices.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power supply testing system, characterized in that, include: Power supply equipment; as well as A load control device is connected to the power supply device. The load control device is used to simulate the load change corresponding to at least one operating behavior of the flash memory control chip, and to draw test power from the power supply device through the load change.

2. The power supply testing system according to claim 1, wherein during the period when the test power is drawn from the power supply device, the current value of the test power automatically changes based on the load change.

3. The power supply testing system according to claim 2 further includes: The host is connected to the load control device. The load control device is further configured to control at least one of the rising slope, initial value, and final value of the current value of the test power supply during the period when the test power supply is drawn from the power supply device, based on at least one parameter set by the host.

4. The power supply testing system according to claim 1, wherein the load control device comprises: Controller; as well as A first impedance adjustment circuit is connected to the controller. The first impedance adjustment circuit includes a first switching circuit. The controller is used to provide a first input voltage. The first input voltage is used to change the first conduction level of the first switching circuit, and The first impedance adjustment circuit is used to change the first impedance according to the change in the first conduction level.

5. The power supply testing system according to claim 4, wherein the first impedance adjustment circuit further includes a charging circuit connected to the first switching circuit. The first impedance adjustment circuit is used to receive the first input voltage and charge the charging circuit based on the first input voltage to change the first conduction level.

6. The power supply testing system according to claim 5, wherein the charging circuit includes a first impedance element and a capacitor element, the first impedance element is connected to the capacitor element and the controller, and the capacitor element is connected to the first switching circuit; The capacitor element is a variable capacitor and / or the first impedance element is a variable resistor, to adjust the rate of change of the first conduction level.

7. The power supply testing system according to claim 5, wherein the first impedance adjustment circuit further includes a discharge circuit connected to the first switching circuit. The first impedance adjustment circuit is also used to restore the first switching circuit to the off state through the discharge circuit.

8. The power supply testing system according to claim 4, wherein the load control device further comprises: The load adjustment circuit is connected to the first impedance adjustment circuit. The load regulation circuit is used to reflect the load change to the power supply device according to at least one input impedance, wherein the at least one input impedance includes the first impedance.

9. The power supply testing system according to claim 8, wherein the at least one input impedance further includes a second impedance, and the load control device further includes: The second impedance adjustment circuit is connected to the controller and the load adjustment circuit. The second impedance adjustment circuit includes a second switching circuit. The controller is also used to provide a second input voltage. The second input voltage is used to change the second conduction level of the second switching circuit, and The second impedance adjustment circuit is used to change the second impedance according to the change in the second conduction level.

10. The power supply testing system according to claim 9, wherein the load adjustment circuit receives the first impedance and the second impedance respectively through a plurality of impedance elements connected in parallel.

11. The power supply testing system according to claim 9, wherein the controller provides the first input voltage and the second input voltage sequentially or simultaneously according to the operation timing settings.

12. The power supply testing system according to claim 1, further comprising: A monitoring device is used to monitor the test power supply and provide evaluation data.

13. A power supply testing method, characterized in that, For a power supply testing system, the power supply testing method includes: The load change corresponding to at least one operational behavior of the flash memory controller chip is simulated by the load control device in the power supply test system; and Test power is drawn from the power supply device by the load change.

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