Conductive paste, elastic electronic textile and preparation method and application thereof
By adding an organic composite solvent to the conductive paste to form a self-adhesive layer, the problem of tensile strength and durability of conductive materials on textile substrates is solved, improving the stability and durability of elastic electronic textiles, achieving high pattern resolution and high durability, and making them suitable for motion monitoring, health monitoring, haptic feedback and wearable devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- THE HONG KONG POLYTECHNIC UNIV
- Filing Date
- 2024-10-09
- Publication Date
- 2026-04-10
AI Technical Summary
Existing conductive materials have limited tensile strength and durability on textile substrates, resulting in insufficient durability and lifespan of elastic electronic textiles in dynamic environments. Low pattern resolution also limits the integration of high-density multi-sensors and complex circuits.
A conductive paste containing conductive materials, polymers, and organic composite solvents is used. The organic composite solvent slightly dissolves the substrate, forming a self-adhesive layer between the conductive film layer and the substrate, thereby improving the interfacial adhesion strength and forming a highly stable interfacial layer.
It significantly improves the adhesion strength between conductive patterns and the substrate, enhances the extensibility and durability of elastic electronic textiles, improves pattern resolution, meets the requirements of repeated stretching and bending, and extends service life.
Smart Images

Figure CN121839243A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of elastic electronic textiles, and particularly relates to a conductive paste, an elastic electronic textile and a preparation method and application thereof. BACKGROUND
[0002] Elastic electronic textiles, by integrating sensors, actuators and circuits in a soft, elastic fiber substrate, are becoming a cutting-edge technology, widely used in sports and health monitoring, haptic feedback, medical treatment and wearable electronic device fields. Due to its elastic and soft properties, such electronic textiles can closely adhere to the human body, providing seamless, invisible and continuous monitoring and interaction. For example, in health monitoring, elastic electronic textiles can track heart rate, breathing pattern and muscle activity in real time, providing valuable data for preventive health care and personalized medicine. In the field of haptic feedback, these textiles can enhance user experience in virtual reality and games by providing haptic feedback, and in medical treatment, they can be used for rehabilitation, drug delivery and other therapeutic applications.
[0003] In the application fields such as sports, health monitoring, haptic feedback and medical treatment, which involve dynamic mechanical deformation, the material needs to have high stretchability and durability. However, the current conductive materials have limited stretchability, durability and pattern density on the textile substrate, restricting the development of high durability and integration of elastic electronic textiles. Although traditional conductive ink / paste is effective in rigid or semi-flexible substrates, it is prone to cracking, delamination and loss of conductivity under repeated stretching and bending conditions required for elastic electronic textiles. This is because the conductive paste lacks sufficient stretchability, and the adhesion between the conductive material and the textile substrate is weak, with limited durability, leading to premature failure under stress. This limitation reduces the durability and service life of electronic textiles in dynamic environments, especially in wearable devices. In addition, high-resolution patterns are very important for integrating complex circuits and high-density multi-sensors in a limited textile area. However, the resolution of printed conductive patterns is usually limited by the viscosity of the paste, the printing technology used, and the texture and porosity of the textile itself. Low pattern resolution limits the functionality and miniaturization of electronic textiles, making it difficult to develop highly integrated systems that are both compact and efficient. SUMMARY
[0004] The present application aims to provide a conductive paste, an elastic electronic textile and a preparation method and application thereof, which aims to solve the problem of limited stretchability and durability of existing conductive materials for elastic electronic textiles on the textile substrate to some extent.
[0005] To achieve the above application purpose, the technical scheme adopted by the present application is as follows:
[0006] In a first aspect, the present application provides a conductive paste for elastic electronic textiles, raw material components including: a conductive material, a polymer and an organic complex solvent; the organic complex solvent containing a first solvent capable of dissolving a substrate in the elastic electronic textiles.
[0007] In a second aspect, the present application provides a method for preparing an elastic electronic textile, including the following steps:
[0008] preparing a polymer elastic fiber substrate;
[0009] preparing a conductive paste including a conductive material, a polymer and an organic complex solvent; the organic complex solvent containing a first solvent capable of dissolving the polymer elastic fiber substrate;
[0010] forming a wet film of the conductive paste into a conductive pattern on the surface of the polymer elastic fiber substrate, and in the process of drying the wet film, the organic complex solvent partially dissolves the polymer elastic fiber substrate, forming a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate, to obtain an elastic electronic textile.
[0011] In a third aspect, the present application provides an elastic electronic textile prepared by the above method, including a polymer elastic fiber substrate, a conductive pattern formed on the surface of the polymer elastic fiber substrate, and a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate.
[0012] In a fourth aspect, the present application provides an application of the elastic electronic textile, applying the above elastic electronic textile to at least one of the fields of sports monitoring, health monitoring, tactile feedback, medical treatment, and wearable electronic devices.
[0013] The conductive paste for the elastic electronic textile provided in the first aspect of the present application is prepared from raw material components including a conductive material, a polymer and an organic complex solvent. The organic complex solvent used in the present application contains an organic complex solvent component capable of dissolving the substrate in the elastic electronic textile and capable of slightly dissolving the elastic fiber substrate in the elastic electronic textile. Based on this, the organic complex solvent capable of slightly dissolving the substrate is used in the conductive paste of the present application. During the film formation of the conductive paste, the slight dissolution of the substrate by the organic complex solvent in the elastic electronic textile can form a self-adhesive layer between the conductive film layer formed by the conductive paste and the substrate, form a highly stable interface layer between the conductive material and the substrate, significantly improve the adhesion strength of the electrode and the substrate interface, and firmly fix the conductive film layer on the substrate surface. The presence of the self-adhesive layer enables the conductive film layer prepared from the conductive paste on the substrate to remain stable during a long time of stretching test. In addition, the composition of the conductive paste is very flexible, in which the conductive material can use any material with excellent conductivity to improve the conductivity, and the polymer can use any polymer material capable of improving the adhesion of the conductive paste and improving the stretchability of the conductive paste after film formation. Thus, the unique formula of the conductive paste provided in the present application improves the adhesion strength of the conductive paste to the substrate interface after film formation, thereby further improving the ductility and durability of the elastic electronic textile.
[0014] The second aspect of the present application is a method for preparing an elastic electronic textile. After preparing a polymer elastic fiber substrate and a conductive paste, the conductive paste is applied to the surface of the polymer elastic fiber substrate to form a wet film of the conductive pattern. During the drying process of the wet film, the organic complex solvent partially dissolves the polymer elastic fiber substrate to form a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate, thereby obtaining an elastic electronic textile. The preparation process is simple and suitable for industrial large-scale production and application. Moreover, the self-adhesive layer is formed between the conductive pattern and the polymer elastic fiber substrate in the prepared elastic electronic textile, forming a highly stable interface layer, significantly improving the adhesion strength of the conductive pattern and the polymer elastic fiber substrate interface, firmly fixing the conductive pattern on the substrate surface, and improving the ductility and durability of the elastic electronic textile. The electronic textile prepared using the conductive paste exhibits extremely high stability and durability.
[0015] The elastic electronic textile prepared by the method of the third aspect of the present application comprises a polymer elastic fiber substrate, a conductive pattern formed on the surface of the polymer elastic fiber substrate, and a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate, thereby forming a highly stable interface layer, significantly improving the adhesion strength of the interface between the conductive pattern and the polymer elastic fiber substrate, firmly fixing the conductive pattern on the surface of the substrate, improving the ductility and durability of the elastic electronic textile, and the electronic textile manufactured using the conductive paste exhibits extremely high stability and durability. Moreover, the resolution of the patterning technology on the elastic electronic textile substrate is improved.
[0016] The elastic electronic textile of the fourth aspect of the present application has extremely high stability, durability, ductility and other characteristics, and the resolution of the conductive pattern in the elastic electronic textile is high, which can meet the requirements of repeated stretching and bending of the elastic electronic textile, improve the durability and service life of the elastic electronic textile in a dynamic environment. Moreover, the flexibility, comfort and integration of electronic functions into the fabric make the elastic electronic textile have a wide range of applications in many fields. Therefore, the electronic textile with high comfort, high stretchability and high pattern resolution can be widely applied to the fields of motion monitoring, health monitoring, tactile feedback, medical treatment, wearable electronic devices and the like, and promotes the development of elastic electronic textiles. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0018] Figure 1 is a schematic diagram of the preparation method of the elastic electronic textile provided by the embodiments of the present application;
[0019] Figure 2 is a schematic diagram of the preparation of the elastic electronic textile provided by Embodiment 1 of the present application;
[0020] Figure 3 is an image of the TPU-LM (liquid metal) conductive paste printed on the TPU (thermoplastic polyurethane) polymer elastic fiber substrate with different line widths provided by Embodiment 1 of the present application;
[0021] Figure 4 is a scanning electron microscope test image of the TPU-LM conductive paste printed on the polymer elastic fiber substrate provided by Embodiment 1 of the present application;
[0022] Figure 5Figure 1 is a graph showing the change in resistance of the elastic electronic textile provided in Example 1 of the present application using TPU-LM conductive paste during 50,000 stretching cycles;
[0023] Figure 6 Figure 2 is a graph showing the morphology of the elastic electronic textile provided in Example 1 of the present application using TPU-LM conductive paste and the elastic electronic textile of Comparative Example 1 using commercial silver paste after 50,000 stretching cycles;
[0024] Figure 7 Figure 3 is a graph showing the images of TPU-Ag (silver) conductive paste printed on a TPU polymeric elastic fiber substrate with different line widths provided in Example 2 of the present application;
[0025] Figure 8 Figure 4 is a graph showing the scanning electron microscope test of the TPU-Ag conductive paste printed on a polymeric elastic fiber substrate provided in Example 2 of the present application;
[0026] Figure 9 Figure 5 is a graph showing the morphology test of the printed TPU-Ag conductive paste after stretching provided in Example 2 of the present application;
[0027] Figure 10 Figure 6 is a graph showing the patterns of TPU-Graphene (graphite) conductive paste printed on a TPU elastic fiber substrate with different line widths provided in Example 3 of the present application;
[0028] Figure 11 Figure 7 is a graph showing the scanning electron microscope test of the TPU-Graphene (graphite) conductive paste printed on a polymeric elastic fiber substrate provided in Example 3 of the present application;
[0029] Figure 12 Figure 8 is a graph showing the strain sensing performance of the strain sensing textile provided in Examples 1 and 2 of the present application;
[0030] Figure 13 Figure 9 is a graph showing the application test of the strain sensing textile in sign language recognition provided in Examples 1 and 2 of the present application. DETAILED DESCRIPTION
[0031] In order to make the technical problems to be solved by the present application, the technical solutions and beneficial effects clearer and more apparent, the present application will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.
[0032] In the present application, the term "and / or" describes the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. Wherein A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it.
[0033] In the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or the like means any combination of the items, including any combination of single or multiple items. For example, "at least one of a, b or c", or "at least one of a, b and c", can represent a, b, c, a-b (i.e. a and b), a-c, b-c, or a-b-c, wherein a, b, and c can be single or multiple.
[0034] It should be understood that the size of the sequence number of the above-mentioned processes in various embodiments of the present application does not mean the order of execution, and part or all of the steps can be executed in parallel or in sequence. The execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
[0035] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.
[0036] The weight of the related components mentioned in the embodiments of the present application can not only refer to the specific content of each component, but also represent the proportional relationship between the weights of each component. Therefore, as long as the content of the related components in the embodiments of the present application is enlarged or reduced in proportion, it is within the scope disclosed in the embodiments of the present application. Specifically, the mass mentioned in the embodiments of the present application can be μg, mg, g, kg and other mass units commonly known in the chemical field.
[0037] The terms "first", "second" are only used for description purposes, to distinguish objects such as substances from each other, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. For example, without departing from the scope of the embodiments of the present application, the first XX can also be referred to as the second XX, and similarly, the second XX can also be referred to as the first XX. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features.
[0038] The first aspect of the embodiment of the present application provides a conductive paste for elastic electronic textiles, raw material components including: a conductive material, a polymer and an organic complex solvent; the organic complex solvent contains a first solvent capable of dissolving the substrate in the elastic electronic textiles.
[0039] The first aspect of the embodiment of the present application provides a conductive paste for elastic electronic textiles, raw material components including: a conductive material, a polymer and an organic complex solvent; the organic complex solvent contains a first solvent capable of dissolving the substrate in the elastic electronic textiles.
[0040] In some possible implementation manners, the first solvent includes dimethylformamide; the solvent can dissolve the elastic fiber substrate in the elastic electronic textiles, so that the organic complex solvent slightly dissolves the elastic fiber substrate in the elastic electronic textiles.
[0041] In some possible implementation manners, the organic complex solvent further contains at least one second solvent of tetrahydrofuran, acetone and ethanol. In this case, the organic complex solvent contains an organic solvent component capable of dissolving the elastic fiber substrate in the elastic electronic textiles and a second solvent component, wherein the former organic solvent facilitates the substrate to be dissolved again to form a self-adhesive layer in the conductive paste film forming process, and the latter second solvent component is a low-boiling-point solvent, which can avoid excessive dissolution of the solvent to the substrate to damage the structure of the substrate.
[0042] In some possible implementations, the organic composite solvent includes at least one second solvent of tetrahydrofuran, acetone, ethanol, and dimethylformamide. In this case, dimethylformamide has a relatively high solubility for the polymer and the substrate in the elastic electronic textile, and mainly plays a role of dissolving the polymer in the slurry and the substrate; and the at least one second solvent of tetrahydrofuran, acetone, and ethanol can also dissolve the polymer and disperse the conductive material, but these solvents have a relatively low boiling point and can be rapidly volatilized in the process of forming the conductive pattern on the surface of the substrate, so that excessive dissolution of the substrate can be avoided. Through the synergistic effect of the two solvents, the slightly soluble effect of the conductive slurry on the substrate can be regulated, and a self-adhesive layer can be formed between the conductive pattern and the substrate, so that the ductility and durability of the elastic electronic textile are improved.
[0043] In some possible implementations, the mass ratio of the first solvent to the second solvent in the organic composite solvent is (4-6):(6-4). Specifically, the mass ratio can be 4:4, 4:5, 4:6, 5:4, 5:6, or any interval value between any two point values. The composition of the conductive slurry according to the embodiments of the present application is very flexible, and is suitable for various conductive materials, which can be liquid metal, metal nanomaterial, graphene, carbon nanotube, etc. As long as the amount of the organic composite solvent in the conductive slurry is controlled to an optimal level, the self-adhesive layer can be formed in these types of conductive slurries, and the presence of the self-adhesive layer enables the conductive film layer prepared from the conductive slurry on the substrate to remain stable in a long-time stretching test. In the organic composite solvent, the mass ratio of dimethylformamide to the second solvent is (4-6):(6-4); in this case, the uniformity of dispersion of the conductive slurry is ensured, and at the same time, the self-adhesive layer is formed between the conductive pattern and the substrate. If too much dimethylformamide is used, the substrate can be excessively dissolved and even damaged, and too much second solvent is not conducive to forming a sufficient self-adhesive layer.
[0044] In some possible implementations, the organic composite solvent includes dimethylformamide and tetrahydrofuran, and the two solvents jointly play a role of dissolving the polymer in the slurry and dispersing the conductive material. The two solvents differ in that dimethylformamide has a relatively high solubility for the polymer and mainly plays a role of dissolving the polymer in the slurry and the substrate; and tetrahydrofuran has a relatively low boiling point and can be rapidly volatilized in the process of scraping, so that the substrate can be prevented from being completely dissolved.
[0045] In some specific embodiments, the organic composite solvent includes dimethylformamide and tetrahydrofuran in a weight ratio of 1:1.
[0046] In some possible implementation manners, the conductive paste contains 6-12% of the polymer by mass percentage, 10-72% of the conductive material by mass percentage, and 16-80% of the organic composite solvent by mass percentage. In this case, the sufficient conductive material and the polymer ensure the conductivity of the conductive paste, avoid the decrease of the conductivity of the paste caused by the too high content of the polymer, and avoid the decrease of the tensile property of the conductive paste caused by the too low content of the polymer. The content of the organic composite solvent fully ensures the dispersion uniformity and stability, viscosity and other properties of the conductive paste, is conducive to the deposition of the conductive paste on the surface of the elastic fiber substrate by printing and the like, and ensures the micro-dissolution of the conductive paste to the substrate in the elastic electronic textile, so that a self-adhesive layer is formed between the conductive film layer formed by the conductive paste and the substrate, and the ductility and durability of the elastic electronic textile are improved.
[0047] For example, the conductive paste contains 6%, 8%, 10%, 12% or other typical but non-limiting point values or interval values between any two point values of the polymer by mass percentage, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 72% or other typical but non-limiting point values or interval values between any two point values of the conductive material by mass percentage, and 16%, 20%, 30%, 40%, 50%, 60%, 70%, 80% or other typical but non-limiting point values or interval values between any two point values of the organic composite solvent by mass percentage.
[0048] In some possible implementation manners, the viscosity of the conductive paste ranges from 1000 mPa.s to 10000 mPa.s. In this case, the viscosity of the conductive paste is conducive to the subsequent coating of the conductive paste on the substrate of the elastic electronic textile by silk screen printing, screen printing, template printing and the like, and the conductive pattern is formed on the surface of the substrate after drying, and a self-adhesive layer is formed between the conductive pattern and the substrate. Too low or too high viscosity of the conductive paste will affect the subsequent printing process of the electrode, avoid the overflow of the template during printing caused by too low viscosity of the conductive paste, and avoid the decrease of the high resolution of the printing device caused by too high viscosity of the conductive paste.
[0049] For example, the viscosity of the conductive paste ranges from 1000 mPa.s, 2000 mPa.s, 3000 mPa.s, 4000 mPa.s, 5000 mPa.s, 6000 mPa.s, 7000 mPa.s, 8000 mPa.s, 9000 mPa.s, 10000 mPa.s or other typical but non-limiting point values or interval values between any two point values.
[0050] The conductive performance of the conductive paste according to the embodiments of the present application can be flexibly regulated according to application requirements, and the conductive performance is not specifically limited. In some possible implementation manners, the resistance of the conductive paste is less than 1000 ohms, in which case, the resistance of the conductive paste is less than 1000 ohms, and the conductive paste has good conductivity.
[0051] In some possible implementation manners, the polymer includes at least one of thermoplastic polyurethane, styrene-butadiene-styrene block copolymer, polystyrene-poly(ethylene-butylene)-polystyrene block copolymer, thermoplastic rubber, and thermoplastic elastomer. In this case, the polymer mainly functions to bond the conductive material and improve the stretchability of the conductive paste, so as to facilitate the formation of a flexible film layer of the conductive paste.
[0052] In some possible implementation manners, the conductive material includes at least one of liquid metal, metal nanomaterial, and carbon-based material.
[0053] In some possible implementation manners, the carbon-based material includes at least one of graphene, carbon nanotube, and conductive carbon black. These carbon materials all have excellent conductivity, in which, graphene has extremely high conductivity, up to 10 8 S / m, and the electron movement speed is fast. The carbon nanotube is a nanomaterial composed of carbon atoms, has very high conductivity, and even has better conductivity than copper. The conductivity of the conductive carbon black is closely related to the microstructure, particle size, structure, and surface performance of the conductive carbon black, and the graphitized carbon black generally has high conductivity.
[0054] In some possible implementation manners, the liquid metal includes at least one of gallium-indium alloy, gallium-tin alloy, gallium-indium-tin alloy, gallium-copper alloy, gallium-silver alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin-zinc alloy, and gallium-indium-tin-zinc alloy. These liquid metals are all in liquid state at room temperature and have excellent conductivity, which fully ensures the stretchability and conductivity of the conductive paste. The liquid metal in the conductive paste exists in the form of particles after printing, and only needs to be stretched for about 20 times at 100% strain after printing, without needing to be squeegeed.
[0055] In some possible implementation manners, the metal nanomaterial includes silver nanosheet with a thickness of 100 nm to 300 nm and a flake diameter of 6 μm to 8 μm. In this case, the silver nanosheet has excellent conductivity. After the conductive paste is deposited on the substrate, the two-dimensional silver nanosheet is arranged flat on the substrate, which promotes the electron transmission between the nanosheets, thereby realizing the conductivity. Exemplarily, the thickness of the silver nanosheet can be 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, or any point value or interval value between any two point values of the typical but non-limiting values, and the flake diameter can be 6 μm, 7 μm, 8 μm, or any point value or interval value between any two point values of the typical but non-limiting values.
[0056] In some possible implementation manners, when the conductive material is a liquid metal, the mass percentage of the liquid metal in the conductive paste is greater than 60%, and the mass percentage of the organic composite solvent is 16% to 34%.
[0057] In some possible implementation manners, when the conductive material is a metal nano material, the mass percentage of the metal nano material in the conductive paste is greater than 15%, and the mass percentage of the organic composite solvent is 34% to 68%.
[0058] In some possible implementation manners, when the conductive material is a carbon-based material, the mass percentage of the carbon-based material in the conductive paste is greater than 10%, and the mass percentage of the organic composite solvent is 70% to 80%.
[0059] In the above embodiments of the present application, in order to ensure the conductivity of the conductive paste, the resistance is less than 1000 ohms, and the mass percentage of the conductive material needs to be adjusted. However, due to the differences in density and conductivity of the conductive materials, the mass fraction required by different conductive materials is different. For example, when a metal nano material such as a silver nanosheet is used as the conductive material, the mass fraction of the conductive material in the conductive paste needs to be greater than 15%, and the resistance can be less than 20 ohms under this mass fraction. When a liquid metal is used as the conductive material, the mass fraction of the conductive material in the conductive paste needs to be greater than 60%, and the resistance can be less than 10 ohms under this mass fraction. When a carbon-based material such as graphene is used as the conductive material, the mass fraction of the conductive material in the conductive paste needs to be greater than 10%, and the resistance can be less than 1000 ohms under this mass fraction. In addition, the mass fraction of the organic composite solvent in the paste needs to be controlled. The mass percentage of the organic composite solvent in the conductive silver paste is 34% to 68%; the mass percentage of the organic composite solvent in the conductive liquid metal paste is 16% to 34%; and the mass percentage of the organic composite solvent in the conductive graphene paste is 70% to 80%. In this case, it can be ensured that the substrate will not be excessively dissolved.
[0060] In some possible implementation manners, the conductive paste based on the liquid metal has a resistance change of only 8% after 50,000 cycles under a strain of 100%, and is suitable for use as an electrode and a conductive wire in an elastic electronic textile.
[0061] In a second aspect, the embodiments of the present application provide a preparation method of an elastic electronic textile, as shown in FIG. 2, which comprises the following steps: Figure 1
[0062] S10. Preparing a polymer elastic fiber substrate;
[0063] S20. Preparing a conductive paste comprising a conductive material, a polymer, and an organic composite solvent; the organic composite solvent comprising a first solvent capable of dissolving the polymer elastic fiber substrate;
[0064] S30. forming a wet film of the conductive paste into a conductive pattern on the surface of the polymer elastic fiber substrate, and in the drying process of the wet film, the organic composite solvent partially dissolves the polymer elastic fiber substrate to form a self-adhesion layer between the conductive pattern and the polymer elastic fiber substrate, thereby obtaining the elastic electronic textile.
[0065] In the method for preparing the elastic electronic textile, the polymer elastic fiber substrate and the conductive paste are prepared respectively, and then the conductive paste is formed into a wet film of the conductive pattern on the surface of the polymer elastic fiber substrate by coating or the like. In the drying process of the wet film, the organic composite solvent partially dissolves the polymer elastic fiber substrate to form a self-adhesion layer between the conductive pattern and the polymer elastic fiber substrate, thereby obtaining the elastic electronic textile. The preparation process is simple and suitable for industrial large-scale production and application. Moreover, the self-adhesion layer is formed between the conductive pattern and the polymer elastic fiber substrate in the prepared elastic electronic textile, a highly stable interface layer is formed, the adhesion strength of the interface between the conductive pattern and the polymer elastic fiber substrate is significantly improved, the conductive pattern is firmly fixed on the surface of the substrate, and the extensibility and durability of the elastic electronic textile are improved. The electronic textile manufactured by using the conductive paste exhibits extremely high stability and durability.
[0066] In some possible implementations, the electronic textile has a resistance change of only 8% after 50,000 stretching cycles under 100% strain.
[0067] In the above step S10, the polymer elastic fiber substrate is prepared by the following steps:
[0068] In some possible implementations, the preparation of the polymer elastic fiber substrate includes: preparing a polymer electrostatic spinning solution, and performing electrostatic spinning to obtain the polymer elastic fiber substrate. In this case, the breathable polymer elastic fiber substrate can be prepared by the electrostatic spinning process.
[0069] In some possible implementations, the polymer in the polymer electrostatic spinning solution includes at least one of a thermoplastic polyurethane elastomer, a styrene-butadiene-styrene block copolymer, and a polystyrene-poly(ethylene-butylene)-polystyrene block copolymer. In this case, these polymers have good tensile properties, and the substrate prepared from these polymers has good mechanical properties, which is more suitable for flexible electronics that need to be stretched.
[0070] In some possible implementation ways, the solvents in the polymer electrospinning solution include dimethylformamide and tetrahydrofuran in a mass ratio of (8-12):(8-12). In this case, these solvents have better solubility to the polymer, so that the polymer electrospinning solution prepared has better stability, and the electrospinning effect is improved. In some specific embodiments, the mass ratio of dimethylformamide and tetrahydrofuran is 1:1, and in this case, the effect is better. Exemplarily, the mass ratio of dimethylformamide and tetrahydrofuran can be 8:8, 8:9, 8:10, 8:11, 8:12, 9:8, 9:10, 9:11, 9:12, 10:8, 10:9, 10:11, 10:12, 11:8, 11:9, 11:10, 11:12, 12:8, 12:9, 12:10, 12:11, and the like, which are typical but not limited to any point value or interval value between any two point values.
[0071] In some possible implementation ways, the concentration of the polymer electrospinning solution is 12wt%-25wt%. In this case, the concentration of the polymer electrospinning solution is conducive to stable electrospinning. Exemplarily, the concentration of the polymer electrospinning solution can be 12wt%, 15wt%, 18wt%, 20wt%, 22wt%, 23wt%, 25wt%, and the like, which are typical but not limited to any point value or interval value between any two point values.
[0072] In some possible implementation ways, the electrospinning conditions include: under the conditions of a positive voltage of 10kV-15kV, a negative voltage of -2kV--1kV, a liquid feeding speed of 3ml / h-5ml / h, and a distance between the needle and the collector of 12cm-18cm, electrospinning collection is performed. In this case, the polymer electrospinning solution has better spinning effect, and a polymer elastic fiber substrate with good air permeability and high elasticity is obtained. Exemplarily, the positive voltage for electrospinning can be 10kV, 11kV, 12kV, 13kV, 14kV, 15kV, and the like, which are typical but not limited to any point value or interval value between any two point values, the negative voltage can be -2kV, -1kV, and the like, which are typical but not limited to any point value or interval value between any two point values, the liquid feeding speed can be 3ml / h, 4ml / h, 5ml / h, and the like, which are typical but not limited to any point value or interval value between any two point values, and the distance between the needle and the collector can be 12cm, 13cm, 14cm, 15cm, 16cm, 17cm, 18cm, and the like, which are typical but not limited to any point value or interval value between any two point values.
[0073] In some possible implementation manners, the fiber diameter in the polymer elastic fiber substrate is 2-4 μm; specifically, it can be 2 μm, 3 μm, 4 μm, etc. In this case, it is beneficial for the polymer elastic fiber substrate to obtain abundant pores, and the porosity is high, thereby ensuring the air permeability and elasticity of the polymer elastic fiber substrate.
[0074] In some possible implementation manners, the thickness of the polymer elastic fiber substrate is 150-200 μm. In this thickness case, the range covered by the thickness is large, and different application requirements can be met. For example, the thickness of the polymer elastic fiber substrate can be 150 μm, 160 μm, 180 μm, 200 μm, etc. or an interval value between any two point values.
[0075] In the step S20, the following steps are performed:
[0076] In some possible implementation manners, the preparation of the conductive paste includes: mixing the conductive material, the polymer, and the organic composite solvent according to a mass percentage ratio of (6-12) :(10-72):(16-80), and then stirring under the condition of 60-100 ℃ to obtain the conductive paste. In this case, after obtaining the raw material components of the conductive paste according to the ratio, the raw material components are directly mixed and stirred under the heating condition, and the conductive paste with uniform and stable dispersion can be obtained.
[0077] In some possible implementation manners, the organic composite solvent includes at least one second solvent in tetrahydrofuran, acetone, and ethanol and dimethylformamide.
[0078] In some possible implementation manners, in the organic composite solvent, the mass ratio of dimethylformamide to the second solvent is (4-6):(6-4).
[0079] In some possible implementation manners, in the organic composite solvent, the mass ratio of at least one second solvent in tetrahydrofuran, acetone, and ethanol to dimethylformamide is (6-4):(4-6).
[0080] In some possible implementation manners, the conductive material includes at least one of liquid metal, metal nanomaterial, and carbon-based material.
[0081] In some possible implementation manners, the carbon-based material includes at least one of graphene, carbon nanotube, and conductive carbon black.
[0082] In some possible implementation manners, the liquid metal includes at least one of gallium-indium alloy, gallium-tin alloy, gallium-indium-tin alloy, gallium-copper, gallium-silver alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin-zinc alloy, and gallium-indium-tin-zinc alloy.
[0083] In some possible implementation manners, the metal nanomaterial includes silver nanosheets with a thickness of 100 nm to 300 nm and a flake diameter of 6 μm to 8 μm.
[0084] In some possible implementation manners, the polymer includes at least one of thermoplastic polyurethane, styrene-butadiene-styrene block copolymer, polystyrene-poly(ethylene-butylene)-polystyrene block copolymer, thermoplastic rubber, and thermoplastic elastomer.
[0085] In some possible implementation manners, the viscosity of the conductive paste ranges from 1000 mPa.s to 10000 mPa.s.
[0086] In some possible implementation manners, when the conductive material is a liquid metal, the mass percentage of the liquid metal in the conductive paste is greater than 60%, and the mass percentage of the organic composite solvent is 16% to 34%.
[0087] In some possible implementation manners, when the conductive material is a metal nanomaterial, the mass percentage of the metal nanomaterial in the conductive paste is greater than 15%, and the mass percentage of the organic composite solvent is 34% to 68%.
[0088] In some possible implementation manners, when the conductive material is a carbon-based material, the mass percentage of the carbon-based material in the conductive paste is greater than 10%, and the mass percentage of the organic composite solvent is 70% to 80%.
[0089] The beneficial effects of the above-mentioned embodiments of the present application have been described in the foregoing, and will not be described here again.
[0090] In the above step S30:
[0091] In some possible implementation manners, the preparation mode of the wet film of the conductive pattern includes at least one of screen printing, stencil printing, and template printing. In this case, the screen printing, the stencil printing, and the template printing have the characteristics of high cost-effectiveness, large output, and layering capability, and the conductive paste of the embodiments of the present application can realize a minimum resolution of a line width of 50 μm. The resolution of the patterning technology on the elastic electronic textile substrate is improved, and the integration of a complex circuit is possible. The embodiments of the present application combine the screen printing, the stencil printing, the template printing technology, and the conductive paste, so that the high stability and durability in the electronic textile help its wide application, ensure its good performance and user satisfaction, and open up new opportunities for constructing electronic textiles with more functions. Moreover, compared with the high-time-consuming and high-cost photolithography process, the screen printing, the stencil printing, and the template printing have high efficiency, a simpler method, and cost-effectiveness, while maintaining high pattern resolution, are suitable for batch production and application, and are more conducive to industrialized mass production.
[0092] In some possible implementations, a minimum line width of about 50 μm can be achieved by the stencil printing technology, showing the application potential in high-density elastic electronic textile circuit.
[0093] In some possible implementations, the wet film is dried under vacuum at a temperature of 100-120 °C for 10-15 hours. Under this condition, the removal of the organic composite solvent in the wet film can be sufficiently ensured, and a solidified conductive pattern can be obtained. For example, the drying temperature can be 100 °C, 105 °C, 110 °C, 115 °C, 120 °C, or any interval value between any two of the above typical but non-limiting point values.
[0094] In some possible implementations, the polymer elastic fiber substrate is fixed on a glass plate with a tape, and then a metal mask with a desired pattern is placed on the fiber mat. The elastic conductive paste is coated along the mask with a doctor blade to form a preset conductive pattern. After removing the metal mask, the polymer elastic fiber substrate is placed in a vacuum oven at 100 °C for 12 hours to completely remove the organic composite solvent, and an elastic electronic textile is obtained.
[0095] In some possible implementations, the thickness of the self-adhesive layer is 5-20 μm. In this case, the thickness of the self-adhesive layer formed between the conductive pattern and the polymer elastic fiber substrate is sufficient to improve the adhesion strength of the interface between the conductive pattern and the polymer elastic fiber substrate, firmly fix the conductive pattern on the substrate surface, and improve the ductility and durability of the elastic electronic textile. By controlling the mass fraction of the organic composite solvent in the conductive paste, the thickness of the self-adhesive layer can be flexibly adjusted. For example, the thickness of the self-adhesive layer can be 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, or any interval value between any two of the above typical but non-limiting point values.
[0096] In some possible implementations, the line width of the printed conductive pattern is as low as 50 μm, which improves the resolution of the patterning technology on the elastic electronic textile substrate and makes the integration of complex circuits possible.
[0097] In a third aspect, an embodiment of the present application provides an elastic electronic textile prepared by the above method, which includes a polymer elastic fiber substrate, a conductive pattern formed on the surface of the polymer elastic fiber substrate, and a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate.
[0098] The elastic electronic textile prepared by the method has a polymer elastic fiber substrate, a conductive pattern formed on the surface of the polymer elastic fiber substrate, and a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate, thereby forming a highly stable interface layer, significantly improving the adhesion strength of the interface between the conductive pattern and the polymer elastic fiber substrate, firmly fixing the conductive pattern on the surface of the substrate, improving the ductility and durability of the elastic electronic textile, and the electronic textile manufactured by using the conductive paste exhibits extremely high stability and durability. Moreover, the resolution of the patterning technology on the elastic electronic textile substrate is improved.
[0099] In a fourth aspect, the embodiments of the present application provide an application of the elastic electronic textile. The elastic electronic textile is applied to at least one of the fields of motion monitoring, health monitoring, tactile feedback, medical treatment, and wearable electronic devices.
[0100] The elastic electronic textile has extremely high stability, durability, ductility, and other characteristics, and the resolution of the conductive pattern in the elastic electronic textile is high, which can meet the requirements of repeated stretching and bending of the elastic electronic textile, improve the durability and service life of the elastic electronic textile in a dynamic environment. Moreover, the flexibility, comfort, and integration of electronic functions into the fabric make the elastic electronic textile have a wide range of applications in many fields. Therefore, the electronic textile with high comfort, high stretchability, and high pattern resolution can be widely applied to the fields of motion monitoring, health monitoring, tactile feedback, medical treatment, and wearable electronic devices, thereby promoting the development of the elastic electronic textile.
[0101] In some possible implementations, in the medical field, the elastic electronic textile is used for continuous monitoring of vital signs such as heart rate, body temperature, and respiratory rate, including wearable sensors and smart bandages, which can be used for monitoring wound conditions.
[0102] In some possible implementations, in the field of sports and fitness, the sensors embedded in the elastic electronic textile in sports clothes can track muscle activity, posture, and movement, help athletes optimize performance and prevent injuries, and also provide data on physical activity and fitness levels.
[0103] In some possible implementations, in the fashion industry, the elastic electronic textile can realize interactive clothing by integrating LEDs (light-emitting diodes), sensors, and actuators, change colors or display patterns, and provide customizable and dynamic designs.
[0104] In some possible implementations, in the military and security fields, enhanced uniforms and safety equipment embedded with sensors and communication systems can be used for health monitoring, location tracking, and context awareness.
[0105] In some possible implementations, elastic electronic textiles also play a role in the field of entertainment and augmented reality, and the technology integrated on the clothing can provide dynamic visual effects and immersive experiences. In order to be applicable to other technical fields, the substrate and device structure can be changed according to specific applications.
[0106] In some possible implementations, environmental monitoring is also an application field, and the elastic electronic textile can track pollution levels or ultraviolet radiation exposure.
[0107] In some possible implementations, in the field of home and life applications, smart bedding elastic electronic textiles can monitor sleep patterns and adjust temperature, and integrated home systems in clothing can allow users to control smart home devices through touch or gestures.
[0108] In some possible implementations, in the field of transportation, smart seats embedded with sensors can monitor the posture and fatigue of drivers, or adjust comfort according to user preferences. These applications demonstrate the versatility and potential of elastic electronic textiles, driving progress in multiple fields.
[0109] In some possible implementations, the present application specifically makes strain sensing textiles, which demonstrate their applications in monitoring pulse, respiration, swallowing, joint movement, and sign language recognition.
[0110] In order to enable the above-mentioned implementation details and operations of the present application to be clearly understood by those skilled in the art, and to embody the significant progress of the conductive paste, elastic electronic textile and its preparation method and application of the embodiments of the present application, the following will be illustrated by multiple examples.
[0111] Example 1
[0112] The present application provides an elastic conductive paste (labeled as TPU-LM paste) and an elastic electronic textile:
[0113] The preparation steps of a TPU-LM paste include: mixing liquid metal gallium-indium alloy (75% gallium, 25% indium), thermoplastic polyurethane (TPU) and organic composite solvent according to a mass ratio of 30:3:17; wherein the organic composite solvent is prepared by mixing dimethylformamide (DMF) and tetrahydrofuran (THF) according to a mass ratio of 1:1. Then, the mixed paste is ultrasonically treated and stirred at 80°C for 12 hours to ensure complete dissolution and uniform mixing, obtaining the TPU-LM paste.
[0114] A preparation schematic diagram of an elastic electronic textile is shown in FIG. 1, including the following steps: Figure 2
[0115]
[0116]
[0117] Example 2
[0118] The embodiments of the present application provide an elastic conductive paste (labeled as TPU-Ag paste) and an elastic electronic textile:
[0119] The preparation steps of a TPU-Ag paste include: mixing silver (Ag) nanoplatelets (thickness of about 200 nm, average flake diameter of 6-8 pm), thermoplastic polyurethane (TPU) and organic composite solvent in a mass ratio of 18:3:17; wherein the organic composite solvent is prepared by mixing dimethylformamide (DMF) and tetrahydrofuran (THF) in a mass ratio of 1:1. Then, the mixed paste is ultrasonically treated and stirred at 80°C for 12 hours to ensure complete dissolution and uniform mixing, thereby obtaining the TPU-Ag paste.
[0120] The preparation of an elastic electronic textile includes the steps of:
[0121]
[0122] The preparation steps of a TPU-Ag paste include: mixing silver (Ag) nanoplatelets (thickness of about 200 nm, average flake diameter of 6-8 pm), thermoplastic polyurethane (TPU) and organic composite solvent in a mass ratio of 18:3:17; wherein the organic composite solvent is prepared by mixing dimethylformamide (DMF) and tetrahydrofuran (THF) in a mass ratio of 1:1. Then, the mixed paste is ultrasonically treated and stirred at 80°C for 12 hours to ensure complete dissolution and uniform mixing, thereby obtaining the TPU-Ag paste.
[0120] The preparation of an elastic electronic textile includes the steps of:
[0121]
[0122] The preparation steps of a TPU-Ag paste include: mixing silver (Ag) nanoplatelets (thickness of about 200 nm, average flake diameter of 6-8 pm), thermoplastic polyurethane (TPU) and organic composite solvent in a mass ratio of 18:3:17; wherein the organic composite solvent is prepared by mixing dimethylformamide (DMF) and tetrahydrofuran (THF) in a mass ratio of 1:1. Then, the mixed paste is ultrasonically treated and stirred at 80°C for 12 hours to ensure complete dissolution and uniform mixing, thereby obtaining the TPU-Ag paste.
[0123] Example 3
[0124] The embodiments of the present application provide an elastic conductive paste (labeled as TPU-Graphene paste) and an elastic electronic textile:
[0125] The preparation steps of the TPU-Graphene paste include: mixing graphene (density about 2.2 g / cm 3 , thermoplastic polyurethane (TPU) and organic composite solvent in a mass ratio of 9:15:107; wherein the organic composite solvent is prepared by mixing dimethylformamide (DMF) and tetrahydrofuran (THF) in a mass ratio of 17:26. Then, the mixed paste is ultrasonically treated and stirred at 80℃ for 12 hours to ensure complete dissolution and uniform mixing, to obtain the TPU-Graphene paste.
[0126] The preparation of an elastic electronic textile includes the steps of:
[0127] ① An electrospinning solution is prepared by dissolving TPU in a mixed solvent (DMF / THF=1:1), and the mass fraction of TPU is 15wt%. The positive and negative voltages during spinning are set to +12kV and -1kV respectively. The feeding speed of the spinning solution is 3ml / h, and the distance between the needle and the collector is set to 15cm. After spinning, the fiber mat is placed in a vacuum oven at 100℃ for 12 hours to completely remove the organic composite solvent, to obtain a polymer elastic fiber base.
[0128] ② The polymer elastic fiber base is fixed on a glass plate with adhesive tape, and then a metal mask with the required pattern is placed on the fiber mat, and the elastic conductive paste is scraped along the mask with a doctor blade to form a predetermined conductive pattern. After removing the metal mask, the polymer elastic fiber base is placed in a vacuum oven at 100℃ for 12 hours to completely remove the organic composite solvent, to obtain an elastic electronic textile.
[0129] Comparative Example 1
[0130] In Comparative Example 1, a commercial silver paste (Shenzhen Yilei Technology Co., Ltd., model LY50) is used as the conductive paste.
[0131] In order to verify the progressiveness of the embodiments of the present application, the above embodiments and comparative examples are subjected to the following performance tests:
[0132] A, performance test for Example 1:
[0133] 1. In order to prove the realization of high-resolution patterns, TPU-LM paste with different line widths is printed on the TPU fiber base by adjusting the size of the metal mask, as shown in FIG. 1. Figure 3As shown, the minimum line width of the TPU-LM paste with liquid metal as the conductive material is about 74 μm.
[0134] 2. The morphology of the TPU-LM paste printed on the spandex substrate in Example 1 was observed using a scanning electron microscope. The top view and cross-sectional view are shown in Figures 2A and 2B, respectively. Figure 4 As shown, there is a thin layer of about 20 μm between the spandex substrate and the TPU-LM paste, which acts as an adhesive layer to enhance the adhesion between the spandex substrate and the TPU-LM paste. The formation of the self-adhesive layer is achieved by the organic complex solvent in the conductive paste. After printing, the organic complex solvent interacts with the spandex substrate and partially dissolves the spandex substrate, and the self-adhesive layer is formed as the solvent in the conductive paste is removed during the vacuum drying process at 100 °C.
[0135] 3. The TPU-LM paste exhibits high electrical conductivity when coated on the surface of the spandex substrate. The electrical resistance of the TPU-LM lines with different line widths was measured, as shown in Table 1 below:
[0136] Table 1
[0137]
[0138]
[0139] From the above test results, it can be seen that as the line width increases from 74 μm to 833 μm, the electrical resistance decreases from 12 Ω to 1.4 Ω. The electrical conductivity of the TPU-LM is calculated by the formula σ = L / (A x R), where L, A, and R represent the length, cross-sectional area, and electrical resistance of the TPU-LM paste, respectively. The results show that the electrical conductivity ranges from 428742 S / m to 1239771 S / m, exhibiting high electrical conductivity.
[0140] 4. The change in electrical resistance of the elastic electronic textile using the TPU-LM paste of Example 1 was tested over 50000 stretching cycles, as shown in Figure 4A. Figure 5 As shown, the TPU-LM paste exhibits the smallest change in electrical resistance under strain, which can be attributed to the fusion of the TPU matrix portion in the paste with the spandex substrate. When the spandex substrate is stretched to 100% strain, the electrical resistance of the paste only increases by about 14%. After 50000 stretching cycles at 100% strain, the change in electrical resistance between the stretched state and the unstretched state is only 8% compared to the initial sample. Such excellent ductility and stability benefit from the thin adhesive layer between the TPU fiber substrate and the TPU-LM paste, ensuring strong adhesion.
[0141] The morphology of the stretchable electronic textile of Example 1 using TPU-LM paste and the stretchable electronic textile of Comparative Example 1 using commercial silver paste after 50000 stretch cycles was tested, as shown in the SEM images of FIGS. 10A and 10B. Figure 6 The SEM images of FIGS. 10A and 10B show that after 50000 cycles, the liquid metal in the TPU matrix is broken and reconnected, maintaining the conductive path. In addition, the adhesive layer remains stable after 50000 cycles, which is crucial for maintaining the ductility and stability of the paste. In contrast, Figure 6 The commercial silver paste used in Comparative Example 1 of FIG. 11A has fallen off the polymer elastic fiber substrate after 5 stretch cycles due to the lack of an adhesive layer.
[0142] B. Performance tests for Example 2:
[0143] 1. TPU-Ag paste of different line widths was printed on the TPU fiber substrate, as shown in FIG. 12A. Figure 7 As shown in FIG. 12A, the TPU-Ag paste using silver nanosheets as the conductive material has a minimum line width of about 50 pm.
[0144] 2. The TPU-Ag paste exhibits high electrical conductivity when applied to the surface of the polymer elastic fiber substrate. The resistance of the TPU-Ag lines of different line widths was measured, as shown in Table 2 below:
[0145] Table 2
[0146]
[0147]
[0148] From the above test results, as the line width increases from 51 pm to 865 pm, the resistance can be as low as 0.3 W, and the electrical conductivity ranges from 2480158 S / m to 6105006 S / m, exhibiting high electrical conductivity.
[0149] 3. The morphology of the TPU-Ag paste printed on the polymer elastic fiber substrate of Example 2 was observed using a scanning electron microscope, as shown in the top view and cross-sectional view of FIG. 13A. Figure 8 As shown in FIG. 13A, there is a self-adhesive layer between the polymer elastic fiber substrate and the TPU-Ag paste, which is about 10 pm thick.
[0150] 4. The morphology of the printed TPU-Ag paste after stretching was observed, as shown in FIG. 14A. Figure 9As shown, wrinkles appeared in both the adhesive layer and the TPU-Ag slurry after stretching, due to the difference in mechanical properties between the polymer elastic fiber substrate and the TPU-Ag slurry. Despite the wrinkles, the TPU-Ag slurry remained intact and conductive, thanks to the support of the adhesive layer. During stretching, two-dimensional silver nanosheets were observed to be smoothly aligned on the fiber pad, promoting electron transport between the nanosheets and thus achieving conductivity. During stretching, the resistance increased as these silver nanosheets separated. Therefore, the TPU-Ag slurry exhibited a significant strain response during stretching. Furthermore, the wrinkles induced by stretching contribute to the strain response stability of the slurry. This property makes it suitable for high-sensitivity strain sensor applications.
[0151] C. Performance testing for Example 3:
[0152] 1. TPU-Graphene pastes with different linewidths were printed onto a TPU fiber substrate, as shown in the attached image. Figure 10 As shown, the minimum linewidth of TPU-Graphene slurry with graphene as the conductive material is approximately 60 μm.
[0153] 2. The morphology of the TPU-Graphene paste printed on the polymer elastic fiber substrate in Example 3 was observed using a scanning electron microscope. Its top view and cross-sectional view are attached. Figure 11 As shown, there is a self-adhesive layer of about 10 μm thickness between the polymer elastic fiber substrate and the TPU-Graphene slurry.
[0154] D. Strain sensing performance and application performance testing:
[0155] Using stencil printing technology, Example 1 fabricated an elastic electronic textile, namely a strain-sensitive textile, using TPU-LM paste and Example 2 used TPU-Ag paste, respectively. TPU-LM paste is insensitive to strain, while TPU-Ag paste is strain-sensitive. Therefore, TPU-Ag paste serves as the sensing element, while TPU-LM paste serves as the conductive wire and electrode. Due to the good adhesion between the paste and the substrate, tensile strain is effectively transferred to the conductive paste, resulting in a large and rapid response of the strain-sensitive textile.
[0156] Specifically:
[0157] Gain coefficient (GF) and R of strain-sensing textiles 2 The values can reach 5 and 0.98 respectively, as shown in the attached figure. Figure 12 As shown in (1).
[0158] At 30% strain, the response time can be as fast as 71 milliseconds, as shown in the attached figure. Figure 12 As shown in (2).
[0159] In addition, the adhesive layer enhances the stability of the strain-sensing textile, demonstrating its stable working speed response in the range of 0.5 mm / s to 2 mm / s, as shown in Fig. 4(b). Figure 12
[0160] The high sensitivity, fast and stable response of the strain-sensing textile makes it have great potential in monitoring human physiological activities. By directly attaching it to different parts of the human body, various biological signals can be detected in real time. For example, by fixing the strain-sensing textile at the radial artery of the wrist, the pulse signal can be observed, as shown in Fig. 4(c). Figure 12
[0161] Due to its high sensitivity, three characteristic peaks including the systolic peak (P1), the reflected peak (P2) and the diastolic peak (P3) can be clearly identified. These peaks are helpful to assess the overall health of the cardiovascular system, including heart function, arterial stiffness and blood pressure regulation ability. In addition, by attaching the strain-sensing textile to the abdomen, the breathing condition can also be monitored, as shown in Fig. 4(d), identifying key parameters such as breathing rate and rhythm, which are used for further medical diagnosis. Figure 12
[0162] When it is fixed on the throat, it can also monitor the swallowing action, as shown in Fig. 4(e). During swallowing, the throat muscles deform, causing the strain sensor to deform, thus being able to monitor the number and frequency of swallowing and chewing. Figure 12
[0163] In addition to detecting small vibrations such as pulse, breathing and swallowing, the strain-sensing textile can also monitor larger deformations such as joint movement. In this study, the movement of the wrist, elbow and knee was tested, as shown in Figs. 4(f)-(h). When the joint is in the upright position, the resistance is the smallest; as the joint begins to bend, the resistance gradually increases until the joint reaches the maximum angle, at which point the resistance reaches the maximum. This bending process constitutes a cycle. The movement of the knee joint shows the largest resistance change because the bending amplitude of the knee joint is larger. Figure 12
[0164] In addition to monitoring individual physiological activities, the strain-sensing textile can also be used for complex tasks, such as gesture recognition by connecting multiple devices to form a sensing network. As shown in Fig. 4(i), five strain-sensing textiles are attached to the five fingers, monitoring the bending movement of all five fingers in real time. By analyzing the integrated signal of the strain-sensing textile, different gestures can be accurately identified, thus realizing the recognition of sign language. For example, the sign language letter "POLYU" is successfully recognized, as shown in Fig. 4(j). Figure 13 Figure 13
[0165] The above merely provides preferred embodiments of the application, and is not used to limit the application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the application shall fall within the protection scope of the application.
Claims
1. A conductive paste for use in elastic electronic textiles, characterized in that, The raw material components include: conductive materials, polymers, and organic composite solvents; the organic composite solvents contain a first solvent capable of dissolving the substrate in elastic electronic textiles.
2. The conductive paste for elastic electronic textiles as described in claim 1, characterized in that, The first solvent includes dimethylformamide; And / or, the organic composite solvent further comprises at least one second solvent selected from tetrahydrofuran, acetone, and ethanol; And / or, the conductive material includes at least one of liquid metal, metal nanomaterials, and carbon-based materials; And / or, the polymer includes at least one of thermoplastic polyurethane, styrene-butadiene-styrene block copolymer, polystyrene-poly(ethylene-butene)-polystyrene block copolymer, thermoplastic rubber, and thermoplastic elastomer.
3. The conductive paste for elastic electronic textiles as described in claim 2, characterized in that, In the conductive paste, the polymer has a mass percentage of 6% to 12%; the conductive material has a mass percentage of 10% to 72%; and the organic composite solvent has a mass percentage of 16% to 80%. And / or, in the organic composite solvent, the mass ratio of the first solvent to the second solvent is (4-6):(6-4); And / or, the viscosity range of the conductive paste is 1000 mPa·s to 10000 mPa·s.
4. The conductive paste for elastic electronic textiles as described in claim 2 or 3, characterized in that, The carbon-based material includes at least one of graphene, carbon nanotubes, and conductive carbon black; And / or, the liquid metal includes at least one of gallium indium alloy, gallium tin alloy, gallium indium tin alloy, gallium copper, gallium silver alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, and gallium indium tin zinc alloy; And / or, the metal nanomaterials include silver nanosheets with a thickness of 100 nm to 300 nm and a sheet diameter of 6 μm to 8 μm.
5. The conductive paste for elastic electronic textiles as described in claim 4, characterized in that, When the conductive material is the liquid metal, the mass percentage of the liquid metal in the conductive slurry is greater than 60%, and the mass percentage of the organic composite solvent is 16% to 34%. Alternatively, when the conductive material is the metal nanomaterial, the mass percentage of the metal nanomaterial in the conductive slurry is greater than 15%, and the mass percentage of the organic composite solvent is 34% to 68%. Alternatively, when the conductive material is the carbon-based material, the mass percentage of the carbon-based material in the conductive slurry is greater than 10%, and the mass percentage of the organic composite solvent is 70% to 80%.
6. A method for preparing an elastic electronic textile, characterized in that, Includes the following steps: Preparation of polymer elastic fiber substrate; A conductive slurry comprising a conductive material, a polymer, and an organic composite solvent is prepared; wherein the organic composite solvent contains a first solvent capable of dissolving the polymer elastic fiber substrate. The conductive paste is used to form a wet film with a conductive pattern on the surface of the polymer elastic fiber substrate. During the drying process of the wet film, the organic composite solvent partially dissolves the polymer elastic fiber substrate, forming a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate, thereby obtaining an elastic electronic textile.
7. The method for preparing elastic electronic textiles as described in claim 6, characterized in that, The preparation of the conductive paste includes: mixing the conductive material, the polymer, and the organic composite solvent in a mass percentage ratio of (6%–12%):(10%–72%):(16%–80%), and then stirring the mixture at a temperature of 60°C–100°C to obtain the conductive paste; And / or, the preparation of the polymer elastic fiber substrate includes: preparing a polymer electrospinning solution, performing electrospinning, and obtaining the polymer elastic fiber substrate; And / or, the wet film of the conductive pattern is prepared by at least one of screen printing, stencil printing, and template printing; And / or, the organic composite solvent includes at least one second solvent selected from tetrahydrofuran, acetone, and ethanol in a mass ratio of (6-4):(4-6) and dimethylformamide.
8. The method for preparing elastic electronic textiles as described in claim 7, characterized in that, The polymer electrospinning solution contains at least one of thermoplastic polyurethane elastomer, styrene-butadiene-styrene block copolymer, and polystyrene-poly(ethylene-butene)-polystyrene block copolymer. And / or, in the polymer electrospinning solution, the solvent comprises dimethylformamide and tetrahydrofuran in a mass ratio of (8-12):(8-12); And / or, the concentration of the polymer electrospinning solution is 12wt% to 25wt%; And / or, the conditions for electrospinning include: electrospinning collection under the following conditions: positive voltage of 10kV to 15kV, negative voltage of -2kV to -1kV, liquid inlet rate of 3ml / h to 5ml / h, and distance between needle and collector of 12cm to 18cm. And / or, the drying is performed under vacuum conditions at a temperature of 100°C to 120°C for 10 to 15 hours.
9. The method for preparing the elastic electronic textile according to any one of claims 6 to 8, characterized in that, The fiber diameter in the polymer elastic fiber substrate is 2μm to 4μm; And / or, the thickness of the polymer elastic fiber substrate is 150 μm to 200 μm; And / or, the thickness of the self-adhesive layer is 5 μm to 20 μm; And / or, the linewidth of the printed conductive pattern is as low as 50 μm.
10. An elastic electronic textile prepared according to any one of claims 6 to 9, characterized in that, It includes a polymer elastic fiber substrate, a conductive pattern formed on the surface of the polymer elastic fiber substrate, and a self-adhesive layer between the conductive pattern and the polymer elastic fiber substrate.
11. An application of an elastic electronic textile, characterized in that, The elastic electronic textile as described in claim 10 is applied to at least one of the fields of motion monitoring, health monitoring, haptic feedback, medical treatment, and wearable electronic devices.