Partitioned controllable microfluid heat dissipation system integrated on PCB (Printed Circuit Board)

Abstract

The invention relates to a partition controllable microfluid heat dissipation system integrated on a PCB. The partition controllable microfluid heat dissipation system comprises a PCB substrate, a cover plate and a chip arranged on the cover plate. A heat dissipation flow channel is formed between the cover plate and the PCB substrate, a plurality of heat dissipation subareas are formed in the heat dissipation flow channel, a liquid inlet hole is formed in the PCB substrate, a liquid outlet hole used for outputting a cooling medium is formed in the PCB substrate, and the cooling medium flows into the corresponding heat dissipation subareas of the heat dissipation flow channel through the liquid inlet hole and then flows out of the liquid outlet hole. Cooling the cover plate and the chip on the corresponding heat dissipation subarea; according to the subarea controllable microfluid heat dissipation system integrated on the PCB in the technical scheme, the heat dissipation flow channel is arranged between the cover plate and the PCB substrate, the heat dissipation subareas are formed by the heat dissipation flow channel, the chip is cooled, accurate cooling of the heating chip with non-uniform heat power on the board is achieved by adjusting local flow, and the heat dissipation efficiency of the chip is improved. The problems of local overheating, fast dynamic heat load, uneven temperature distribution, high energy consumption and the like which cannot be handled by a traditional heat dissipation mode are solved, so that the performance and the reliability of the chip are remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB board, and particularly relates to a partition controllable micro-fluid heat dissipation system integrated on a PCB. BACKGROUND

[0002] PCB (printed circuit board) is an important component in the electronic industry. Various electronic devices, from small electronic watches and calculators to large computers, communication electronic devices and military weapon systems, etc., as long as there are integrated circuits and other electronic components, in order to electrically interconnect various components, PCB boards are used.

[0003] Since many chips are generally integrated on a PCB, the cooling of the current PCB generally includes natural cooling, forced air cooling, liquid cooling, thermoelectric refrigeration, phase change material cooling, etc., each of which has corresponding technical advantages. PCB liquid cooling is a high-efficiency heat dissipation scheme, especially suitable for high-power density scenarios. The existing PCB liquid cooling adopts a single flow channel design, which can cool and dissipate heat for multiple sub-regions that need to be cooled, but the single flow channel design is prone to problems such as low heat exchange efficiency, uneven flow field and large flow resistance, and cannot accurately control the temperature of each sub-region.

[0004] Therefore, in order to solve the above problems, a partition controllable micro-fluid heat dissipation system integrated on a PCB is needed. SUMMARY

[0005] The partition controllable micro-fluid heat dissipation system integrated on the PCB can cool and dissipate heat for multiple sub-regions that need to be cooled through the heat dissipation flow channel formed between the cover plate and the PCB substrate. By adjusting the local flow rate, the system can accurately cool the chips with non-uniform heat power on the board, solve the problems of local overheating, dynamic thermal load, uneven temperature distribution and high energy consumption that cannot be solved by traditional cooling methods, and significantly improve the performance and reliability of the chips.

[0006] The technical scheme for solving the above technical problems is as follows:

[0007] A partition controllable micro-fluid heat dissipation system integrated on a PCB, comprising a PCB substrate, a cover plate mounted on the PCB substrate, and a chip disposed on the cover plate; a heat dissipation flow channel is formed between the cover plate and the PCB substrate, the heat dissipation flow channel forms multiple heat dissipation sub-regions, the PCB substrate is provided with an inlet hole for inputting cooling medium into the heat dissipation flow channel, the PCB substrate is provided with an outlet hole for outputting the cooling medium, the cooling medium flows into the corresponding heat dissipation sub-region of the heat dissipation flow channel through the inlet hole and then flows out from the outlet hole, and the cover plate and the chip in the corresponding heat dissipation sub-region are cooled.

[0008] Further, a piezoelectric micro valve chamber is opened on the PCB substrate, a chamber liquid inlet hole and a chamber output hole are arranged in the piezoelectric micro valve chamber, a flow channel opening is opened in the heat dissipation flow channel, the liquid inlet hole is communicated with the chamber liquid inlet hole, the flow channel opening is communicated with the chamber output hole, and a piezoelectric micro valve for controlling the use of the chamber output hole is arranged on the PCB substrate. The cooling medium flows into the flow channel opening and flows out of the liquid outlet hole.

[0009] Further, a heat sink flow channel plate is installed in the heat dissipation flow channel, a plurality of heat sink flow channel plates are arranged in parallel in the heat dissipation flow channel, the lower end of the heat sink flow channel plate is fixedly installed on the surface of the heat dissipation flow channel, and the upper end surface of the heat sink flow channel plate is attached to the lower surface of the cover plate. A plurality of heat sink flow channel plates form a plurality of corresponding heat dissipation partitions.

[0010] Further, a plurality of flow channel convex plates are formed in the heat dissipation flow channel, the flow channel convex plates are triangular in shape, and a plurality of flow channel convex plates are arranged in parallel.

[0011] Further, an arc-shaped flow guide area is formed in the heat dissipation flow channel, the flow channel opening is arranged in the arc-shaped flow guide area, the left end of the flow channel convex plate extends to the arc-shaped flow guide area, the right end of the flow channel convex plate extends to the heat sink flow channel plate, and the flared flow channel gradually increases from left to right between adjacent flow channel convex plates. A plurality of flared flow channels are provided, and a plurality of flared flow channels correspond to a plurality of heat dissipation partitions.

[0012] Further, a plurality of piezoelectric micro valve chambers are provided, and the liquid inlet hole is communicated with a plurality of piezoelectric micro valve chambers.

[0013] Further, the flow channel opening is arranged at a position higher than the opening position of the liquid outlet hole.

[0014] Further, a microneedle fin heat sink array guide column is arranged in the heat dissipation flow channel, the lower end of the microneedle fin heat sink array guide column is fixedly installed on the surface of the heat dissipation flow channel, and the upper end surface of the microneedle fin heat sink array guide column is attached to the lower surface of the cover plate.

[0015] Further, the liquid outlet hole is formed at the center position of the microneedle fin heat sink array guide column, a flow collection groove is arranged at the liquid outlet hole, the cross section of the flow collection groove along the depth direction of the liquid outlet hole is in a tapered structure with the upper part large and the lower part small, and a liquid outlet pipe is connected to the lower end of the flow collection groove.

[0016] Further, a temperature sensor for detecting the temperature of the chip is arranged on the cover plate.

[0017] The beneficial effects of the technical solution are as follows:

[0018] The partition controllable microfluid cooling system integrated on the PCB of the technical scheme can cool the chip through the heat dissipation flow channel arranged between the cover plate and the PCB substrate, the multiple heat dissipation partitions formed by the heat dissipation flow channel, the adjustment of the local flow, the accurate cooling of the heat generating chip with non-uniform heat power on the board, and the solution to the problems of local overheating, fast dynamic heat load, uneven temperature distribution and high energy consumption that cannot be solved by the traditional cooling mode, so that the chip performance and reliability are significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the whole explosion of the present application;

[0020] Figure 2 It is a schematic diagram of the PCB substrate of the present application;

[0021] Figure 3 It is a schematic diagram of the whole structure of the present application;

[0022] Figure 4 It is a schematic diagram of the back of the PCB substrate of the present application;

[0023] Figure 5 It is a schematic diagram of the inner surface inclination of the heat dissipation flow channel of the present application;

[0024] Figure 6 It is another schematic diagram of the explosion of the PCB substrate of the present application;

[0025] Figure 7 It is another schematic diagram of the whole structure of the PCB substrate of the present application;

[0026] Figure 8 It is another schematic diagram of the perspective of the PCB substrate of the present application;

[0027] Figure 9 It is another schematic diagram of the back of the PCB substrate of the present application;

[0028] Figure 10 It is a schematic diagram of the present application Figure 3 It is a schematic diagram of the present application

[0029] In the drawings, the components represented by each reference numeral are listed as follows:

[0030] 1-PCB substrate; 2-heat dissipation flow channel; 3-cover plate; 4-heat sink flow channel plate; 5-flow channel area; 6-liquid inlet pipe; 7-liquid outlet pipe; 8-chamber liquid inlet hole; 9-temperature sensor; 10-chip; 11-piezoelectric driver; 12-piezoelectric microvalve diaphragm; 13-piezoelectric microvalve chamber; 14-chamber output hole; 15-sealing plate; 16-piezoelectric microvalve diaphragm; 31-guide plate lower area; 32-guide plate upper area; 33-guide plate middle area; 41-microneedle fin heat sink array guide column; 51-arc-shaped guide area; 52-flow channel convex plate; 61-liquid inlet hole; 71-liquid outlet hole; 72-converging groove; 81-flow channel opening. DETAILED DESCRIPTION

[0031] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of the present application, unless otherwise specified and limited, the term "a plurality of" means two or more.

[0033] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood through specific circumstances.

[0034] The present application will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0035] As Figures 1-5As shown, in the embodiment of the application, a partition controllable microfluidic heat dissipation system integrated on a PCB includes a PCB substrate 1, a cover plate 3 mounted on the PCB substrate 1, and a chip 10 disposed on the cover plate 3; a heat dissipation flow channel 2 is formed between the cover plate 3 and the PCB substrate 1, the PCB substrate 1 is provided with a liquid inlet hole 61 for inputting cooling medium into the heat dissipation flow channel 2, and the PCB substrate 1 is provided with a liquid outlet hole 71 for outputting cooling medium; the cooling medium flows into the heat dissipation flow channel 2 through the liquid inlet hole 61 and flows out of the liquid outlet hole 71 and cools the cover plate 3 and the chip 10.

[0036] The partition controllable microfluidic heat dissipation system integrated on the PCB of the technical solution cools the cover plate 3 (the cover plate 3 is engraved with a circuit for use with the chip to ensure that the chip can be used normally) and the chip 10 by the heat dissipation flow channel 2 disposed between the cover plate 3 and the PCB substrate 1 and by the liquid inlet hole 61 to input the cooling medium, and then discharges the cooling medium through the liquid outlet hole 71 of the PCB substrate 1; the multiple heat dissipation partitions formed in the heat dissipation flow channel 2 cool the chip 10, and by adjusting the local flow, the chip 10 with non-uniform heat power on the board is precisely cooled, solving the problems of local overheating, fast dynamic heat load, uneven temperature distribution, and high energy consumption that cannot be solved by traditional heat dissipation methods, thereby significantly improving the performance and reliability of the chip.

[0037] In the embodiment, the PCB substrate 1 is provided with a piezoelectric microvalve chamber 13, the piezoelectric microvalve chamber 13 is provided with a chamber liquid inlet hole 8 and a chamber output hole 14, the heat dissipation flow channel 2 is provided with a flow channel opening 81, the liquid inlet hole 61 is in communication with the chamber liquid inlet hole 8, the flow channel opening 81 is in communication with the chamber output hole 14, and the PCB substrate 1 is provided with a piezoelectric microvalve (including a piezoelectric driver 11 and a piezoelectric microvalve diaphragm 12 used in cooperation, both of which are used in cooperation, and the specific structure and corresponding cooperation installation are not described here because they are existing components) used in cooperation with the chamber output hole 14 for control, and the cooling medium flows into the flow channel opening 81 and flows out of the liquid outlet hole 71.

[0038] As Figures 1-5As shown, a piezoelectric microvalve chamber 13 is formed on the PCB substrate 1 (the piezoelectric microvalve forms a sealed piezoelectric microvalve chamber after being installed with the PCB substrate 1). A chamber inlet 8 and a chamber outlet 14 are formed within the piezoelectric microvalve chamber 13 (the chamber outlet 14 protrudes upwards to form a hollow columnar structure, used in conjunction with the piezoelectric microvalve diaphragm 16; the piezoelectric microvalve diaphragm 16 controls the flow rate of the cooling medium at the chamber outlet 14 or closes the chamber outlet 14). Through the setting of the piezoelectric microvalve, cooling can be precisely controlled. The flow rate of the medium facilitates precise temperature control of the chip. The cooling medium enters the chamber through the bottom channel via the inlet hole 61 and then into the piezoelectric microvalve chamber 13. The piezoelectric microvalve controls the cooling medium to enter the chamber outlet hole 14. After entering the flow channel opening 81 through the bottom channel, it cools the cover plate 3 installed on the upper end of the heat dissipation channel 2 and the chip 10. The piezoelectric microvalve ensures precise flow control of the cooling medium and improves the temperature control accuracy of the chip 10.

[0039] In this embodiment, a heat sink channel plate 4 is installed inside the heat dissipation channel 2. Multiple heat sink channel plates 4 are arranged parallel to each other within the heat dissipation channel 2. The lower end of each heat sink channel plate 4 is fixedly installed on the surface of the heat dissipation channel 2, and the upper surface of each heat sink channel plate 4 is attached to the lower surface of the cover plate 3. Multiple heat sink channel plates 4 form multiple corresponding heat dissipation zones, such as... Figure 2 As shown, multiple heat sink flow channel plates 4 arranged in parallel to each other are formed with corresponding heat dissipation partitions (here set as three corresponding partitions). Accordingly, the cooling medium passes through the corresponding heat dissipation partitions to perform corresponding temperature control on the chip 10 in the corresponding area, so as to ensure the performance of the chip 10.

[0040] like Figures 1-4 As shown; the heat dissipation channel 2 is composed of three parts, including a front section that is triangular in shape, a middle section that is rectangular in shape, and a rear section ( Figure 2 The middle section (from right to left) is a rectangular section consisting of a front section, a middle section, and a rear section. At the middle section, there are parallel heat sink channels 4 arranged at equal intervals. The upper surface of the heat sink channel 4 is attached to the lower surface of the cover plate 3, and the lower surface of the heat sink channel 4 is fixed to the heat dissipation channel 2. The heat sink channel 4 serves to support the cover plate 3 and also acts as the heat exchange base for the cover plate 3 and the chip 10. After the cooling medium passes through the parallel heat sink channel 4, it carries away the heat generated by the chip and flows out through the liquid outlet 71, thus realizing heat exchange with the chip 10.

[0041] In this embodiment, a plurality of channel protrusions 52 are formed in the heat dissipation channel 2. The channel protrusions 52 are triangular in shape and the plurality of channel protrusions 52 are arranged in parallel to each other.

[0042] like Figures 1-4As shown, the flow channel tab 52 adopts a plurality of triangular structures arranged in parallel, and the plurality of flow channel tabs 52 divide the rear section into a plurality of flow channel regions 5. Figure 2 As shown in the middle, two flow channel tabs 52 arranged in parallel are used to cooperate with the inner walls on both sides of the heat dissipation flow channel 2 to form three flow channel regions 5 of the same structure, and the cooling medium flows out in each flow channel region 5, so as to heat the heat sink flow channel plate 4 at different positions and achieve precise cooling of the chips at different positions.

[0043] In this embodiment, the arc-shaped flow guide region 51 is formed in the heat dissipation flow channel 2, the flow channel opening 81 is arranged in the arc-shaped flow guide region 51, the left end of the flow channel tab 52 extends to the arc-shaped flow guide region 51, and the right end of the flow channel tab 52 extends to the heat sink flow channel plate 4. The flared flow channel is gradually increased from left to right between adjacent flow channel tabs 52; the flared flow channel is a plurality of flared flow channels, and each flared flow channel corresponds to a heat dissipation partition, as shown in the left part of Figure 10 The flared flow channel is provided with three flared flow channels, and the corresponding heat dissipation partition is also provided with three flared flow channels. The cooling medium flows into the corresponding heat dissipation partition from the corresponding flared flow channel to cool the chip 10 in the corresponding region.

[0044] As shown in the left part of Figure 2 , Figure 10 The left end (i.e., the tail section) of the heat dissipation flow channel 2 also forms an arc-shaped flow guide region 51, and the corresponding flow channel opening 81 is arranged in the arc-shaped flow guide region 51. The cooling medium flows out through the flow channel opening 81, is buffered and diffused through the arc-shaped flow guide region 51, and then flows into the corresponding heat sink flow channel plate 4 through the flow channel region 5. The flow channel region 5 is provided with three flared flow channels, and each flared flow channel adopts a flared flow channel structure gradually increasing from left to right, so that the cooling medium flowing out from the flow channel opening 81 can be fully diffused at the flared position, solving the problems of low heat exchange efficiency, uneven flow field, and large flow resistance of the traditional single flow channel design, improving the heat exchange efficiency, reducing the system flow resistance, and corresponding the heat sink flow channel plate 4 is divided into three regions (including the upper region of the flow guide plate 32, the middle region of the flow guide plate 33, and the lower region of the flow guide plate 31). The right end of each flow channel tab 52 extends to the left end of the heat sink flow channel plate 4, so as to form a corresponding relationship between the three flow channel regions 5 and the three regions of the heat sink flow channel plate 4, and to achieve precise heat exchange control of the cooling medium on each region of the heat sink flow channel plate 4.

[0045] In this embodiment, the piezoelectric micro valve chamber 13 is provided with a plurality of inlet holes 61, and each inlet hole 61 is in one-to-one correspondence with the piezoelectric micro valve chamber 13.

[0046] As shown in the left part of Figures 1-4As shown, three piezoelectric micro valve chambers 13 are opened on the PCB substrate 1, and three corresponding strip slot structures are opened at the bottom of the PCB substrate 1 (the strip slot opening is installed with a sealing plate 15 to form a cooling medium flow channel), the cooling medium enters from the liquid inlet hole 61 and enters the corresponding piezoelectric micro valve chamber 13 through the corresponding channel, and then is output from the chamber outlet hole 14 through the bottom channel into the flow hole opening 81, and finally realizes the heat exchange process.

[0047] In this embodiment, the opening position of the flow hole opening 81 is higher than the opening position of the liquid outlet hole 71.

[0048] As shown in the drawings, Figures 1-5 A sealing diaphragm layer made of PI film material is arranged on the inner surface of the heat dissipation flow channel 2 to ensure its sealing property during use. The heat dissipation flow channel 2 is arranged at a certain inclination relative to the PCB substrate 1, as shown in the drawings. Figure 5 The heat dissipation flow channel 2 forms an inclined angle a relative to the horizontal direction, and the inclined angle a is 1-3°, which ensures that the cooling medium flowing out of the flow hole opening 81 can smoothly flow to the liquid outlet hole 71 for discharge.

[0049] Each piezoelectric micro valve corresponds to a corresponding chip partition in the heat dissipation flow channel, forming a "valve-chip" distributed liquid supply structure, and realizing the cooling of the distributed non-uniform heat power heating chip through intelligent control (of course, the control system of the valve adopts the control method in the prior art, which is not described here). Through active adjustment of local flow, accurate cooling of the non-uniform heat power heating chip on the board is realized, solving the problems of local overheating, fast dynamic heat load, uneven temperature distribution, high energy consumption and other problems that cannot be solved by traditional cooling methods, thereby significantly improving the performance and reliability of the chip.

[0050] In this embodiment, the heat dissipation flow channel 2 is provided with a micro needle fin heat sink array guide column 41, the lower end of the micro needle fin heat sink array guide column 41 is fixedly installed on the surface of the heat dissipation flow channel 2, and the upper end surface of the micro needle fin heat sink array guide column 41 is attached to the lower surface of the cover plate 3.

[0051] As shown in the drawings, Figures 6-9As shown, it is the second arrangement of the patent, which is different from the first arrangement in that the heat sink runner plate 4 is replaced by a micro-needle fin heat sink array guide column 41 structure, the micro-needle fin heat sink array guide column 41 is uniformly and equidistantly arranged in the middle of the heat dissipation runner 2, the cooling medium enters the chamber outlet hole 14 from the liquid inlet hole 61, flows into the piezoelectric micro-valve chamber 13 through the opening of the piezoelectric micro-valve, and flows out to the runner opening hole 81 through the chamber liquid inlet hole 8, so as to realize heat exchange and cooling of the micro-needle fin heat sink array guide column 41, and finally flow out from the liquid outlet hole 71. The arrangement of the micro-needle fin heat sink array guide column 41 can significantly reduce the flow resistance of the system, and the heat exchange efficiency is obviously improved compared with the traditional micro-channel heat dissipation scheme under the same flow rate.

[0052] In the embodiment, the liquid outlet hole 71 is formed at the center position of the micro-needle fin heat sink array guide column 41, and a flow collection groove 72 is arranged at the liquid outlet hole 71, the flow collection groove 72 has a tapered structure with a large upper part and a small lower part in the cross section along the depth direction of the liquid outlet hole, and the lower end of the flow collection groove 72 is connected with the liquid outlet pipe 7.

[0053] The liquid outlet hole 71 is arranged at the middle position of the heat dissipation runner 2, and the cooling medium is discharged from the liquid outlet hole 71 at the middle position after heat exchange through the micro-needle fin heat sink array guide column 41. The liquid outlet hole 71 is provided with a flow collection groove 72 with a tapered structure with a large upper part and a small lower part in cross section, which facilitates the smooth flow of the cooling medium, and finally is recycled from the liquid outlet pipe 7.

[0054] In the embodiment, the cover plate 3 is provided with a temperature sensor 9 for detecting the temperature of the chip 10.

[0055] Preferably, the temperature sensor 9 is correspondingly installed on the upper part of the chip 10, which can accurately measure the chip. Of course, an external piezoelectric pump is also provided, which introduces the cooling medium through the liquid inlet pipe 6 to form a subsequent cooling cycle. The temperature sensor 9 and the external piezoelectric pump and other control systems can be realized by using the existing technology, which will not be described here.

[0056] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0057] In addition, it should be understood that although the present specification describes only a single embodiment, it is not to be so limited because the specification can contain several embodiments. The description in the specification is intended for the purpose of clarity and the full scope of the embodiments can be found in the claims.

[0058] The above description is merely illustrative of the application and is not to be taken in a limiting sense. It is contemplated that departures from the specific design choices disclosed can still come within the scope of the application.

Claims

1. A partition controllable microfluidic heat dissipation system integrated on a PCB, characterized in that: The device includes a PCB substrate (1), a cover plate (3) mounted on the PCB substrate (1), and a chip (10) disposed on the cover plate (3). A heat dissipation channel (2) is formed between the cover plate (3) and the PCB substrate (1). The heat dissipation channel forms multiple heat dissipation partitions. The PCB substrate (1) is provided with an inlet hole (61) for inputting cooling medium into the heat dissipation channel (2). The PCB substrate (1) is provided with an outlet hole (71) for outputting cooling medium. The cooling medium flows into the corresponding heat dissipation partition of the heat dissipation channel (2) through the inlet hole (61) and flows out from the outlet hole (71), cooling the cover plate (3) and the chip (10) on the corresponding heat dissipation partition.

2. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 1, characterized in that: The PCB substrate (1) is provided with a piezoelectric microvalve chamber (13), and the piezoelectric microvalve chamber (13) is provided with a chamber liquid inlet hole (8) and a chamber output hole (14). The heat dissipation channel (2) is provided with a channel opening (81). The liquid inlet hole (61) is connected to the chamber liquid inlet hole (8), and the channel opening (81) is connected to the chamber output hole (14). The PCB substrate (1) is provided with a piezoelectric microvalve used for control in conjunction with the chamber output hole (14). The cooling medium flows in from the channel opening (81) and flows out from the liquid outlet hole (71).

3. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 2, characterized in that: The heat dissipation channel (2) is equipped with a heat sink channel plate (4). The heat sink channel plate (4) consists of multiple plates arranged in parallel within the heat dissipation channel (2). The lower end of the heat sink channel plate (4) is fixedly installed on the surface of the heat dissipation channel (2), and the upper end of the heat sink channel plate (4) is attached to the lower surface of the cover plate (3). The multiple heat sink channel plates (4) form the multiple corresponding heat dissipation zones.

4. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 3, characterized in that: The heat dissipation channel (2) has multiple channel protrusions (52) formed inside. The channel protrusions (52) are triangular in shape and the multiple channel protrusions (52) are arranged in parallel to each other.

5. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 4, characterized in that: An arc-shaped flow guiding area (51) is formed in the heat dissipation channel (2). The flow channel opening (81) is arranged in the arc-shaped flow guiding area (51). The left end of the flow channel protrusion (52) extends to the arc-shaped flow guiding area (51), and the right end of the flow channel protrusion (52) extends to the heat sink flow channel plate (4). An flared flow channel that gradually increases from left to right is formed between adjacent flow channel protrusions (52).

6. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 2, characterized in that: The piezoelectric microvalve chamber (13) is provided with multiple chambers, and the liquid inlet (61) is connected to each of the multiple piezoelectric microvalve chambers (13) in a one-to-one correspondence.

7. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 6, characterized in that: The opening position of the flow channel opening (81) is higher than the opening position of the liquid outlet (71).

8. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 1, characterized in that: The heat dissipation channel (2) is provided with a micro-needle fin heat sink array guide post (41). The lower end of the micro-needle fin heat sink array guide post (41) is fixedly installed on the surface of the heat dissipation channel (2), and the upper end of the micro-needle fin heat sink array guide post (41) is attached to the lower surface of the cover plate (3).

9. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 8, characterized in that: The liquid outlet (71) is formed at the center of the microneedle fin heat sink array guide post (41). A manifold (72) is provided at the liquid outlet (71). The manifold (72) has a tapered structure with a larger upper section and a smaller lower section along the depth direction of the liquid outlet. The lower end of the manifold (72) is connected to the liquid outlet pipe (7).

10. The partitioned controllable microfluidic heat dissipation system integrated on a PCB according to claim 1, characterized in that: The cover plate (3) is provided with a temperature sensor (9) that works with the chip (10) to detect temperature.

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