Manufacturing process of transparent glass circuit board
By grinding and polishing transparent microcrystalline glass and printing circuits using copper paste, combined with drying and curing lines and laser drilling technology, the problems of high cost and low yield in existing glass circuit board manufacturing have been solved. This enables the manufacturing of multi-layer and fine-line circuits, suitable for applications such as optoelectronic glass and automotive glass.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HU ZHOU KE BIN KE JI YOU XIAN GONG SI
- Filing Date
- 2023-10-07
- Publication Date
- 2026-04-10
AI Technical Summary
Existing glass circuit board manufacturing processes suffer from high manufacturing costs, low yield rates, and difficulty in manufacturing multi-layered and fine circuits, especially the spontaneous breakage and circuit damage caused by physical tempering processes.
The surface of the transparent microcrystalline glass is treated with grinding and polishing equipment and nano-level polishing abrasives. Copper paste is used as the conductive material. The circuit is printed by screen printing machine and dried and cured by drying and curing line to avoid physical tempering process. Laser drilling technology is used.
It reduces manufacturing costs, improves yield and circuit precision, and enables the manufacture of multi-layer glass circuit boards, suitable for fields such as optoelectronic glass, urban lighting, and automotive glass.
Smart Images
Figure CN121842976A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of glass circuit board, in particular to a manufacturing process of transparent glass circuit board. BACKGROUND
[0002] Microcrystalline glass is a good structural material, with good mechanical properties and high temperature chemical stability, so it has attracted widespread attention. In recent years, with the rapid development of computer technology, the microcrystalline glass as a new material for hard disk substrate has been more and more favored in the development of computers. Glass circuit board is a kind of circuit board made of glass, which has the advantages of high thermal stability, corrosion resistance, impact resistance and voltage resistance, and can be used in high temperature, high pressure, high frequency and high precision electronic equipment. So far, there are mainly three manufacturing processes for glass circuit board:
[0003] (1) Silver paste printing physical tempering process: the main process content is that the ordinary white glass is cut, edge polished, drilled, washed and other processes, then silver paste material lines are printed on the air surface of the glass by a special silk screen printing machine, and the glass is physically tempered (650℃-720℃) by a glass physical tempering furnace after preheating in the preheating section of the silk screen printing machine, so that the conductive lines of the silver paste material are fused on the surface of the glass to form a glass circuit board. However, the use of silver paste material to manufacture circuit has high manufacturing cost, and in the manufacturing process, the glass needs to be physically tempered. After physical tempering, the glass may have self-explosion, which reduces the yield. At the same time, the glass may have arch degree and wave degree exceeding the standard after tempering, which is not conducive to the automatic equipment operation in the subsequent tin plating and patching process. In addition, the fine lines may be damaged during the physical tempering process, so it is difficult to manufacture glass circuit boards with very fine lines. More importantly, the hole diameter of the physical tempered glass cannot be too small, otherwise it will break or self-explosion during the physical glass tempering process and after the physical tempering. Multi-layer glass circuit board needs small holes on the glass plate for mounting and filling conductive materials, so the silver paste printing physical tempering process cannot manufacture multi-layer glass circuit board.
[0004] (2) ITO coating physical tempering process: the main process content is that the ordinary white glass is cut, edge polished, drilled, washed, physically tempered (650℃-720℃) and other processes, then a conductive metal layer is formed on the surface of the glass by vacuum magnetron sputtering coating with metal target, then copper film is coated, and finally glass circuit board is made by laser etching method. However, because the coating line and laser etching equipment are used, the manufacturing cost is high, and the technical contradiction between the light transmittance of the glass and the conductivity of the circuit (the better the conductivity, the lower the light transmittance of the glass) cannot be solved.
[0005] (3) ITO coating chemical tempering process: The main process involves cutting, grinding, drilling, cleaning, and chemical tempering of thin glass. Then, a metal target is used to perform vacuum magnetron sputtering coating on the air surface of the glass through a coating line to form a conductive metal layer on the glass surface. A copper film is then deposited, and a glass circuit board is made by laser etching. However, because a coating line and laser etching equipment are used, the manufacturing cost is also high. In addition, this process is suitable for manufacturing thin glass (less than 2mm) circuit boards, but not suitable for making thick glass circuit boards or large-sized glass circuit boards (which are easily broken).
[0006] In view of this, this application proposes a manufacturing process for transparent glass circuit boards to solve the above problems. Summary of the Invention
[0007] The purpose of this invention is to provide a manufacturing process for transparent glass circuit boards to solve the above-mentioned problems.
[0008] To achieve the above objectives, the present invention provides the following technical solution:
[0009] A manufacturing process for a transparent glass circuit board includes the following steps:
[0010] S1. Grinding and polishing equipment and nano-level polishing abrasives are used to grind and polish the surface of transparent microcrystalline glass;
[0011] S2. Then, the transparent microcrystalline glass undergoes cutting, edge grinding, drilling, and cleaning processes.
[0012] S3. Using copper paste as a conductive material, the circuit is printed on the air surface of the transparent microcrystalline glass using a special screen printing machine.
[0013] S4. Use the drying and curing line to dry and cure the printed conductive lines. The conductive lines formed by the copper paste are distributed on the surface of the transparent microcrystalline glass plate and melt with the glass plate, and the conductive lines become part of the glass plate.
[0014] S5. Finally, air cooling is performed to produce a transparent microcrystalline glass circuit board.
[0015] The present invention is further configured such that, in step S1, the thickness of the transparent microcrystalline glass is typically 3.2 mm, 4 mm, 5 mm, and 6 mm.
[0016] The present invention is further configured such that: in step S1, the grinding and polishing equipment includes a grinding and polishing machine, a polishing pad and a grinding and polishing liquid, and the atoms on the surface of the transparent microcrystalline glass are removed under the impact of abrasive particles, thereby achieving atomic-level removal and obtaining an ultra-smooth surface.
[0017] The present invention is further configured such that, in step S3, the copper paste is characterized by having a mass percentage of 70-82% copper powder, 8-12% tin powder, 4-8% graphene powder, 0.5-2.0% acid anhydride curing agent, and 5-8% other organic solvents, wherein the copper powder and tin powder are granular with a particle size of 50-70 nm, and the graphene powder is granular with a particle size of 11-15 nm.
[0018] The present invention is further configured such that, in step S4, the drying and curing line consists of four structural parts: an upper segment, a circuit drying segment, a circuit curing segment, and a lower segment.
[0019] The present invention is further configured such that, in step S4, during the manufacturing process, the process parameters of the drying and curing line are set differently for glass circuit boards of different thicknesses. When the thickness of the transparent microcrystalline glass is 3.2-4 mm, the drying section temperature is 170℃-280℃, requiring baking for ≥30 minutes, and the curing section temperature is 570℃-600℃, requiring maintenance for ≥30 minutes. When the thickness of the transparent microcrystalline glass is 5 mm, the drying section temperature is 190℃-290℃, requiring baking for ≥35 minutes, and the curing section temperature is 580℃-610℃, requiring maintenance for ≥35 minutes. When the thickness of the transparent microcrystalline glass is 6 mm, the drying section temperature is 210℃-310℃, requiring baking for ≥40 minutes, and the curing section temperature is 590℃-620℃, requiring maintenance for ≥40 minutes.
[0020] The beneficial effects of this invention are:
[0021] 1. In this invention, during the entire glass circuit board manufacturing process, the substrate uses transparent microcrystalline glass, which enhances the strength and heat resistance of the glass circuit board. Copper paste is used for the conductive paste, which reduces manufacturing costs. A special drying and curing line is used to dry and cure the printed conductive lines. At the same time, the glass tempering process is not used. Laser drilling can be used to drill through holes of less than φ2mm on the glass circuit board, thus enabling the manufacture of multi-layered glass circuit boards with stable performance.
[0022] 2. In this invention, after the glass circuit board is manufactured by the microcrystalline glass copper paste manufacturing process, it can still maintain good surface flatness, which is beneficial to the automated operation of subsequent tinning and chip mounting processes. At the same time, without physical tempering, fine conductive lines (width less than 0.3mm) can be made by screen printing, which also improves the yield of glass circuit board manufacturing.
[0023] 3. The manufacturing process of the transparent glass circuit board of the present invention is applicable to the manufacture of optoelectronic glass. The final product can be used in urban lighting, vehicle glass, plant factories and other fields, which reduces the cost of manufacturing optoelectronic glass and improves the yield of optoelectronic glass in the production process. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the drying and curing line for the manufacturing process of copper paste for microcrystalline glass circuit boards, which is a manufacturing process of transparent glass circuit boards according to the present invention.
[0025] Figure 2 This invention provides a process flow diagram for manufacturing a transparent glass circuit board using microcrystalline glass copper paste.
[0026] Figure 3 This is a flowchart illustrating the overall manufacturing process of a transparent glass circuit board according to the present invention. Detailed Implementation
[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0028] Please see Figure 1 - Figure 3 A manufacturing process for a transparent glass circuit board includes the following steps:
[0029] Step 1: Using grinding and polishing equipment and nano-sized polishing abrasives, the surface of transparent microcrystalline glass is ground and polished. The thickness of transparent microcrystalline glass is usually 3.2MM, 4MM, 5MM and 6MM. The grinding and polishing equipment includes a grinding and polishing machine, polishing pad and grinding and polishing fluid. The atoms on the surface of transparent microcrystalline glass are removed under the impact of abrasive particles, realizing the removal at the atomic level and obtaining an ultra-smooth surface.
[0030] Step 2: Next, the transparent microcrystalline glass undergoes cutting, edge grinding, drilling, and cleaning processes.
[0031] Step 3: Using copper paste as a conductive material, the circuit is printed on the air surface of the transparent microcrystalline glass using a specialized screen printing machine. The copper paste is characterized by the following mass percentages: 70-82% copper powder, 8-12% tin powder, 4-8% graphene powder, 0.5-2.0% acid anhydride curing agent, and 5-8% other organic solvents. The copper and tin powders are granular with a particle size of 50-70 nm, and the graphene powder is granular with a particle size of 11-15 nm. The drying and curing line consists of four parts: the upper segment, the circuit drying segment, the circuit curing segment, and the lower segment.
[0032] Step 4: Use the drying and curing line to dry and cure the printed conductive lines. The conductive lines formed by the copper paste are distributed on the surface of the transparent microcrystalline glass plate and melt with the glass plate, making the conductive lines part of the glass plate. During the manufacturing process, the process parameters of the drying and curing line are set differently for glass circuit boards of different thicknesses. When the thickness of the transparent microcrystalline glass is 3.2-4 mm, the drying section temperature is 170℃-280℃, requiring baking for ≥30 minutes, and the curing section temperature is 570℃-600℃, requiring maintenance for ≥30 minutes. When the thickness of the transparent microcrystalline glass is 5 mm, the drying section temperature is 190℃-290℃, requiring baking for ≥35 minutes, and the curing section temperature is 580℃-610℃, requiring maintenance for ≥35 minutes. When the thickness of the transparent microcrystalline glass is 6 mm, the drying section temperature is 210℃-310℃, requiring baking for ≥40 minutes, and the curing section temperature is 590℃-620℃, requiring maintenance for ≥40 minutes.
[0033] Step 5: Finally, air cooling is performed to produce a transparent microcrystalline glass circuit board.
[0034] This invention discloses a manufacturing process for a transparent glass circuit board, specifically a microcrystalline glass copper paste manufacturing process. The main process involves using transparent microcrystalline glass. First, the surface of the microcrystalline glass is ground and polished. Then, after processes such as cutting, edge grinding, drilling, and cleaning, copper paste is used as the conductive material. Circuitry is printed onto the air surface of the transparent microcrystalline glass using a specialized screen printing machine. (The copper paste is characterized by: a mass percentage of 70-82% copper powder, 8-12% tin powder, 4-8% graphene powder, and 0.5-10% anhydride curing agent.) 2.0% and other organic solvents 5-8%, of which copper powder and tin powder are granular with a particle size of 50-70nm, and graphene powder is granular with a particle size of 11-15nm. The drying and curing line consists of four parts: the upper segment, the circuit drying segment, the circuit curing segment, and the lower segment. The drying and curing line is used to dry and cure the printed conductive circuit. The conductive circuit formed by the copper paste is distributed on the surface of the transparent microcrystalline glass plate and melts with the glass plate. The conductive circuit becomes part of the glass plate. Finally, it is air-cooled to make a transparent microcrystalline glass circuit board.
[0035] In the equipment of this invention, the commonly used transparent microcrystalline glass thicknesses are 3.2mm, 4mm, 5mm, and 6mm. The drying and curing line consists of four parts: an upper section, a circuit drying section, a circuit curing section, and a lower section. The process parameters for drying and curing the glass circuit board are different for different thicknesses. When the thickness of the transparent microcrystalline glass is 3.2-4mm, the drying section temperature is 170℃-280℃, requiring baking for ≥30 minutes, and the curing section temperature is 570℃-600℃, requiring maintenance for ≥30 minutes. When the thickness of the transparent microcrystalline glass is 5mm, the drying section temperature is 190℃-290℃, requiring baking for ≥35 minutes, and the curing section temperature is 580℃-610℃, requiring maintenance for ≥35 minutes. When the thickness of the transparent microcrystalline glass is 6mm, the drying section temperature is 210℃-310℃, requiring baking for ≥40 minutes, and the curing section temperature is 590℃-620℃, requiring maintenance for ≥40 minutes.
[0036] In the entire glass circuit board manufacturing process, transparent microcrystalline glass is used as the substrate, which enhances the strength and heat resistance of the glass circuit board. Copper paste is used for the conductive paste, reducing manufacturing costs. A dedicated drying and curing line is used to dry and cure the printed conductive lines. Furthermore, no glass tempering process is employed; laser drilling can be used to drill through-holes smaller than φ2mm on the glass circuit board, thus enabling the manufacture of multi-layered, stable glass circuit boards. After the glass circuit board is manufactured using the microcrystalline glass copper paste process, it still maintains good surface flatness, which is beneficial for the automated operation of subsequent tinning and surface mount processes. Moreover, without physical tempering, very fine conductive lines (width less than 0.3mm) can be created using screen printing, which also improves the yield of glass circuit boards. The transparent glass circuit board manufacturing process of this invention is suitable for manufacturing optoelectronic glass. The final product can be used in urban lighting, automotive glass, plant factories, and other fields. This invention reduces the cost of manufacturing optoelectronic glass while improving the yield of optoelectronic glass in the production process.
[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A manufacturing process for a transparent glass circuit board, characterized in that, Includes the following steps: S1. Grinding and polishing equipment and nano-level polishing abrasives are used to grind and polish the surface of transparent microcrystalline glass; S2. Then, the transparent microcrystalline glass undergoes cutting, edge grinding, drilling, and cleaning processes. S3. Using copper paste as a conductive material, the circuit is printed on the air surface of the transparent microcrystalline glass using a special screen printing machine. S4. Use the drying and curing line to dry and cure the printed conductive lines. The conductive lines formed by the copper paste are distributed on the surface of the transparent microcrystalline glass plate and melt with the glass plate, and the conductive lines become part of the glass plate. S5. Finally, air cooling is performed to produce a transparent microcrystalline glass circuit board.
2. The manufacturing process of a transparent glass circuit board according to claim 1, characterized in that: In step S1, the thickness of the transparent microcrystalline glass is typically 3.2 mm, 4 mm, 5 mm, and 6 mm.
3. The manufacturing process of a transparent glass circuit board according to claim 1, characterized in that: In step S1, the grinding and polishing equipment includes a grinding and polishing machine, a polishing pad, and a grinding and polishing liquid. The atoms on the surface of the transparent microcrystalline glass are removed by the impact of abrasive particles, achieving atomic-level removal and obtaining an ultra-smooth surface.
4. The manufacturing process of a transparent glass circuit board according to claim 1, characterized in that: In step S3, the copper paste is characterized by the following mass percentages: 70-82% copper powder, 8-12% tin powder, 4-8% graphene powder, 0.5-2.0% acid anhydride curing agent, and 5-8% other organic solvents. The copper powder and tin powder are granular with a particle size of 50-70 nm, and the graphene powder is granular with a particle size of 11-15 nm.
5. The manufacturing process of a transparent glass circuit board according to claim 1, characterized in that: In step S4, the drying and curing line consists of four parts: an upper segment, a circuit drying segment, a circuit curing segment, and a lower segment.
6. The manufacturing process of a transparent glass circuit board according to claim 1, characterized in that: In step S4, during the manufacturing process, the process parameters of the drying and curing line are set differently for glass circuit boards of different thicknesses. When the thickness of the transparent microcrystalline glass is 3.2-4 mm, the drying section temperature is 170℃-280℃, requiring baking for ≥30 minutes, and the curing section temperature is 570℃-600℃, requiring maintenance for ≥30 minutes. When the thickness of the transparent microcrystalline glass is 5 mm, the drying section temperature is 190℃-290℃, requiring baking for ≥35 minutes, and the curing section temperature is 580℃-610℃, requiring maintenance for ≥35 minutes. When the thickness of the transparent microcrystalline glass is 6 mm, the drying section temperature is 210℃-310℃, requiring baking for ≥40 minutes, and the curing section temperature is 590℃-620℃, requiring maintenance for ≥40 minutes.