Bearing module, tray and test sorting machine

Abstract

The present invention relates to a bearing module, a tray, and a test handler wherein the bearing module comprises: a bearing main body having a receiving groove for receiving an electronic component; the bottom plate part is combined with the bearing main body, and the bottom plate part comprises a bottom plate component used for supporting the bottom surface of the electronic component accommodated in the accommodating groove; and a plurality of electrical connection holes penetrating through the bottom plate part, and the bottom plate part is made of glass.

Description

Technical Field

[0001] This invention relates to a test sorting machine for sorting electronic components for testing. Background Technology

[0002] Memory semiconductor devices, non-memory semiconductor devices, central processing units (CPUs), and other electronic components are manufactured through a variety of processes. For example, electronic components undergo multiple processes, such as testing using sorting equipment like test sorting machines.

[0003] The test sorting machine is used to perform loading, testing, and unloading processes for electronic components. The loading process involves transferring electronic components from the user tray to the tray. The testing process involves electrically connecting the electronic components stored in the tray to the testing equipment. The testing equipment is used to perform predetermined tests on the electronic components. The unloading process involves unloading the electronic components from the tray to the user tray. At this point, the test sorting machine can classify the electronic components according to their grade based on the test results.

[0004] Recently, with the increasing demand for miniaturized electronic components, electronic components known as microchips are being actively developed. For example, electronic components such as high-bandwidth memory (HBM), double-data-rate synchronous dynamic random access memory (DDR), graphics double-data-rate memory (GDDR), and low-power double-data-rate memory (LPDDR) are being actively developed.

[0005] In this way, electronic components are formed to a tiny size; therefore, the multiple component terminals of the electronic components for electrical connection with the test equipment through the test process are formed with a narrow pitch. Consequently, the multiple test terminals of the test equipment for electrical connection with the multiple component terminals also need to be formed with a narrow pitch corresponding to the multiple component terminals.

[0006] Additionally, a carrier module for housing the electronic components is disposed on the tray, and the plurality of component terminals and the plurality of test terminals are electrically connected to each other through the base plate of the carrier module. The plurality of component terminals and the plurality of test terminals are electrically connected to each other through a plurality of electrical connection holes formed in the base plate. The plurality of component terminals and the plurality of test terminals are formed with a narrow spacing; therefore, the plurality of electrical connection holes should also be formed with a narrow spacing corresponding to the plurality of component terminals and the plurality of test terminals.

[0007] Therefore, the base plate is being manufactured using synthetic resins such as films. However, the films are relatively thin, and therefore, they deform with continued use, leading to a decrease in the accuracy of the testing process. Furthermore, when machining electrical connection holes in the film, there are issues such as thermal deformation caused by lasers, thus limiting its ability to handle fine-pitch applications.

[0008] A scheme to manufacture the base plate using ceramic was also proposed. However, due to the properties of ceramic, the base plate has a high coefficient of thermal expansion and high brittleness. Therefore, during the testing process, the electronic components may generate heat, causing the base plate to expand excessively, thus reducing the accuracy of the testing process. Furthermore, there is a risk that the base plate may be damaged or even broken due to impacts. Summary of the Invention

[0009] Technical issues

[0010] The present invention aims to solve the above-mentioned problems, and its purpose is to provide a carrier module, a tray, and a test sorting machine that can improve the accuracy of the testing process for forming electronic components of minute size.

[0011] Technical solution

[0012] To address the aforementioned technical problems, the present invention may include the following technical features.

[0013] The carrier module of the present invention is used to house electronic components, and may include: a carrier body having a storage groove for housing the electronic components; and a base plate portion coupled to the carrier body. The base plate portion may include: a base plate component for supporting the bottom surface of the electronic components housed in the storage groove; and a plurality of electrical connection holes formed through the base plate portion. The base plate component may be made of glass.

[0014] The pallet of the present invention may include: a pallet body; and a carrying module, which is attached to the pallet body.

[0015] The test sorting machine of the present invention may include: a loading unit for performing a loading process of loading electronic components to be tested onto a tray; and a testing unit for performing a testing process of testing the electronic components housed in the tray. The loading unit can house the electronic components to be tested in a carrier module of the tray.

[0016] In the tray and the test sorting machine of the present invention, the carrier module may include: a carrier body having a storage groove for receiving the electronic components; and a base plate portion coupled to the carrier body. The base plate portion may include: a base plate component for supporting the bottom surface of the electronic components received in the storage groove; and a plurality of electrical connection holes formed through the base plate portion. The base plate component may be made of glass.

[0017] Beneficial effects

[0018] According to the present invention, the following effects can be achieved.

[0019] In this invention, the base plate component is made of glass, thus reducing the difference in thermal expansion rates between the electronic components and the base plate component. Therefore, even if the base plate component is heated to adjust the temperature of the electronic components to the test temperature or during the testing process, the relative displacement between the multiple component terminals of the electronic components and the multiple electrical connection holes formed on the base plate component can be reduced. Therefore, this invention improves the stability and accuracy of the electrical connection between the multiple component terminals and the multiple test terminals through the multiple electrical connection holes, thereby improving the reliability of the test results obtained through the testing process.

[0020] In this invention, the base plate component is made of glass, thus enabling it to possess high heat resistance, low thermal expansion coefficient, and low brittleness. Therefore, even during heating or heat generation during the testing process, the accuracy of the electrical connections between multiple component terminals and multiple test terminals via multiple electrical connection holes can be maintained. Consequently, this invention improves the stability and accuracy of the electrical connections between multiple component terminals and multiple test terminals, thereby enhancing the reliability of the test results obtained through the testing process. Attached Figure Description

[0021] Figure 1 This is a schematic block diagram of the test sorting machine of the present invention.

[0022] Figure 2 This is a conceptual top view of the test sorting machine of the present invention.

[0023] Figure 3 This is a schematic perspective view of the carrier module of the present invention.

[0024] Figure 4 This is a schematic exploded perspective view of the carrier module of the present invention.

[0025] Figure 5 Based on Figure 4 Line II in the diagram shows a schematic exploded side sectional view of the base plate portion of the support module of the present invention.

[0026] Figure 6 This demonstrates the connection between electronic components and testing equipment. Figure 5 A schematic side cross-sectional view of the electrical connection status of the base plate.

[0027] Figure 7 This is a schematic top view of the carrier module of the present invention.

[0028] Figure 8 Based on Figure 7 A conceptual top view showing the movement of electronic components to a reference position is shown.

[0029] Figure 9 This is a schematic perspective view of the alignment portion of the carrier module of the present invention.

[0030] Figure 10 This is a schematic side view of the alignment portion of the carrier module of the present invention.

[0031] Figure 11 This is a schematic top view used to illustrate the configuration relationship between the alignment portion and the locking portion of the carrier module of the present invention.

[0032] Figure 12 It is Figure 7 The enlarged portion A in the figure shows a schematic top view of the alignment portion of a modified embodiment of the carrier module of the present invention.

[0033] Figure Labels

[0034] 100: Test Sorting Machine

[0035] 110: Main body of the test sorting machine; 120: Opening and closing section.

[0036] 200: Loading section; 210: Loading position

[0037] 220: Loading and Storage Department; 230: Loading Pickup Unit

[0038] 240: Loading buffer; 300: Testing department

[0039] 310: Test chamber; 3100: Contact unit

[0040] 320: First chamber; 330: Second chamber

[0041] 400: Uninstallation Department 410: Uninstallation Location

[0042] 420: Unload Storage Department 430: Unload Picker

[0043] 440: Unloading buffer; 500: Rotating part

[0044] 510: Loading the rotator 520: Unloading the rotator

[0045] 600: Conveying Unit; 10: Testing Equipment

[0046] 11: Test socket 12: Test terminal

[0047] 1: Pallet 2: Pallet body

[0048] 3: Bearing Module 31: Bearing Body

[0049] 311: First opposing surface; 312: Second opposing surface

[0050] 313: Third Opposite Surface; 314: Fourth Opposite Surface

[0051] 315: First corner; 316: Second corner

[0052] 32: Storage slot 4: Base plate

[0053] 41: Base plate component 411: One surface of the base plate component

[0054] 412: The other surface of the base plate component; 42: Electrical connection hole

[0055] 5: Alignment part 5a: First alignment part

[0056] 5b: Second alignment part; 50: Alignment body

[0057] 501: Rotation axis; 51: Alignment surface

[0058] 51a: First alignment surface; 51b: Second alignment surface

[0059] 52: Limiting surface 53: Moving parts

[0060] 54, 54′: Supporting components; 55, 55′: Elastic components

[0061] 56: Actuating hole 57: Limiter

[0062] 58: Limiting hole; 6: Locking part

[0063] 61: Lock body 62: Lock components

[0064] 20: Electronic Components 201: Bottom Surface

[0065] 202: Component terminal; 203: Top surface

[0066] TD: Thickness direction; SP: Reference position

[0067] AP: Alignment Position; RP: Avoidance Position Detailed Implementation

[0068] Hereinafter, embodiments of the test sorting machine of the present invention will be described in detail with reference to the accompanying drawings. On the other hand, the carrier module and the tray of the present invention can be used by the test sorting machine of the present invention for sorting electronic components; therefore, they will be described together with the embodiments of the test sorting machine of the present invention. The test sorting machine of the present invention may also include the carrier module and the tray of the present invention. On the other hand, in Figure 11 and Figure 12 The supporting structure is omitted, and the storage slot is marked with a dashed line.

[0069] Reference Figures 1 to 3 The test sorting machine 100 of the present invention is capable of loading the electronic components 20 to be tested onto the tray 1 (shown in the figure). Figure 2 The process includes a loading process for the electronic components 20 loaded onto the tray 1 and a testing process for testing the electronic components 20 loaded onto the tray 1. The electronic components 20 may be memory semiconductor devices, non-memory semiconductor devices, central processing units (CPUs), etc. The electronic components 20 may also be high-bandwidth memory (HBM), double-data-rate synchronous dynamic random access memory (DDR), graphics double-data-rate memory (GDDR), low-power double-data-rate memory (LPDDR), etc.

[0070] The test sorting machine 100 of the present invention may include a loading unit 200 and a testing unit 300.

[0071] Reference Figures 1 to 3The loading unit 200 is capable of performing the loading process. The loading unit 200 performs the loading process by loading the electronic component 20 to be tested onto the tray 1. The loading unit 200 loads the electronic component 20 to be tested onto the tray 1 located at loading position 210. The loading position 210 is the position of the tray 1 during the loading process. A loading platform (not shown) for supporting the tray 1 may be provided at the loading position 210. The loading unit 200 can perform the loading process on the tray 1 placed in a horizontal position. The loading unit 200 may be integrated with the main body 110. The main body 110 may be installed in a factory.

[0072] The loading unit 200 may include a loading storage unit 220 and a loading pickup unit 230.

[0073] The loading and storage unit 220 can store any one of a wafer ring, a reel, and a user tray. The loading pick-up unit 230 can pick up the electronic component 20 to be tested from any one of the wafer ring, reel, and user tray. The loading and storage unit 220 can be disposed on the main body 110. The loading and storage unit 220 can also be disposed on the outside of the main body 110.

[0074] The loading pickup 230 can pick up the electronic components 20 to be tested from the loading and storage section 220 and store them in the tray 1 located at the loading position 210. The loading pickup 230 can pick up multiple electronic components 20 at a time. The loading pickup 230 can move along a first axis (X-axis direction) and a second axis (Y-axis direction). The first axis (X-axis direction) and the second axis (Y-axis direction) are orthogonal to each other. The loading pickup 230 can move up and down in a vertical direction. The vertical direction (Z-axis direction) is an axis direction that is perpendicular to both the first axis (X-axis direction) and the second axis (Y-axis direction). The tray 1 can hold multiple electronic components 20.

[0075] The loading section 200 may also include a loading buffer 240.

[0076] The loading buffer 240 can temporarily hold the electronic component 20 to be tested. The loading pickup 230 may include a first loading pickup (not shown) for conveying the electronic component 20 to be tested from the loading storage section 220 to the loading buffer 240 and a second loading pickup (not shown) for conveying the electronic component 20 to be tested from the loading buffer 240 to the tray 1. The loading buffer 240 is also movable along at least one of the first axial direction (X-axis direction) and the second axial direction (Y-axis direction).

[0077] Reference Figures 1 to 3 The testing unit 300 is capable of performing the testing process. The testing unit 300 can perform the testing process by electrically connecting the electronic components 20 housed in the tray 1 to the testing equipment 10. A high-precision positioning plate (Hi-fix board) of the testing equipment 10 may be incorporated into the testing unit 300. The testing unit 300 may include a contact unit 3100 (shown in…) for electrically connecting the electronic components 20 housed in the tray 1 to the high-precision positioning plate. Figure 2 (In the middle). The contact unit 3100 can electrically connect multiple electronic components 20 to the high-precision positioning plate at one time. The test unit 300 can perform the test procedure on the tray 1 that is standing vertically. The test unit 300 can be disposed on the main body 110.

[0078] The test unit 300 may include a test chamber 310.

[0079] The testing process can be performed in the test chamber 310. A portion of the test device 10 is inserted into the test chamber 310. The contact unit 3100 is provided in the test chamber 310. The tray 1 can be arranged between the test device 10 and the contact unit 3100, with the second axial direction (Y-axis direction) as a reference. The contact unit 3100 allows the tray 1 to move toward the test device 10, thereby enabling the electronic components 20 housed in the tray 1 to be electrically connected to the test device 10.

[0080] The test unit 300 may further include a first chamber 320.

[0081] The first chamber 320 is capable of transferring the tray 1, after the loading process, to the test chamber 310. With the second axial direction (Y-axis direction) as a reference, the first chamber 320 can be positioned rearward (in the direction of arrow BD) relative to the loading section 200. The rearward (in the direction of arrow BD) position can be configured parallel to the second axial direction (Y-axis direction). The first chamber 320 can transport the tray 1 towards the rearward (in the direction of arrow BD) side while simultaneously adjusting the temperature of the electronic components 20 housed in the tray 1 to the test temperature. The test temperature can be preset by the operator. When the test temperature is higher than room temperature, the first chamber 320 can adjust the temperature of the electronic components 20 housed in the tray 1 to the test temperature by heating. When the test temperature is lower than room temperature, the first chamber 320 can adjust the temperature of the electronic components 20 housed in the tray 1 to the test temperature by cooling. The first chamber 320 and the test chamber 310 can be arranged side-by-side along the first axial direction (X-axis direction). The first chamber 320 can simultaneously transport the tray 1, which is upright in a vertical position, and regulate the temperature of the electronic components 20 housed in the tray 1. The tray 1 can be transported to the test chamber 310 via the first chamber 320.

[0082] The test unit 300 may also include a second chamber 330.

[0083] The second chamber 330 can restore the temperature of the electronic component 20 housed in the tray 1 to the temperature before it was adjusted to the test temperature. For example, the second chamber 330 can adjust the temperature of the electronic component 20 housed in the tray 1 to room temperature by cooling or heating. When the temperature of the electronic component 20 housed in the tray 1 is adjusted to the test temperature by heating the first chamber 320, the second chamber 330 can cool the electronic component 20 housed in the tray 1. When the temperature of the electronic component 20 housed in the tray 1 is adjusted to the test temperature by cooling the first chamber 320, the second chamber 330 can heat the electronic component 20 housed in the tray 1. The second chamber 330 can adjust the temperature of the electronic component 20 housed in the tray 1 while conveying the tray 1, which is upright in a vertical position. The second chamber 330 can adjust the temperature of the electronic component 20 housed in the tray 1 while conveying the tray 1 forward (in the direction of the FD arrow). The front (FD arrow direction) and the rear (BD arrow direction) can be parallel to the second axis direction (Y-axis direction) and opposite to each other. The second chamber 330, the test chamber 310, and the first chamber 320 can be arranged side by side along the first axis direction (X-axis direction). The tray 1 can be transported to the second chamber 330 via the first chamber 320 and the test chamber 310.

[0084] Reference Figures 1 to 3 The test sorting machine 100 of the present invention may further include an unloading unit 400.

[0085] The unloading unit 400 is capable of performing an unloading process. The unloading process is the process of unloading the tested electronic component 20 from the tray 1. The unloading unit 400 may be disposed on the front (FD arrow direction) side relative to the second chamber 330. The unloading unit 400 can unload the tested electronic component 20 from the tray 1 located at the unloading position 410. The unloading position 410 is the position where the tray 1 is located when the unloading process is performed. An unloading platform (not shown) for supporting the tray 1 may be provided at the unloading position 410. The unloading unit 400 can perform the unloading process on the tray 1 placed in a horizontal state. The unloading unit 400 may be combined with the main body 110. The unloading unit 400 and the loading unit 200 may be disposed at positions spaced apart from each other along the first axis direction (X-axis direction). The tray 1 may be transported from the second chamber 330 to the unloading unit 400, and after the unloading process is performed by the unloading unit 400, it may be transported to the loading unit 200.

[0086] The unloading unit 400 may include an unloading storage unit 420 and an unloading pickup unit 430.

[0087] The unloading storage unit 420 can store any one of a wafer ring, a reel, and a user tray. The unloading pick-up unit 430 can place the tested electronic components into any one of the wafer ring, reel, and user tray located in the unloading storage unit 420. The unloading storage unit 420 can be disposed on the main body 110. The unloading storage unit 420 can also be disposed outside the main body 110. The unloading storage unit 420 and the loading storage unit 220 can also store storage units of the same type. For example, the test sorting machine 100 of the present invention can pick up multiple electronic components 20 to be tested from the wafer ring and place multiple tested electronic components 20 on the wafer ring. The unloading storage unit 420 and the loading storage unit 220 can also store storage units of different types. For example, the test sorting machine 100 of the present invention can pick up multiple electronic components 20 to be tested from the wafer ring and place multiple tested electronic components 20 on a reel or a user tray.

[0088] The unloading pickup 430 can pick up the tested electronic component 20 from the tray 1 located at the unloading position 410 and store it in any of the wafer ring, reel, and user tray located in the unloading storage section 420. The unloading pickup 430 is movable along the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The unloading pickup 430 is also movable up and down along the vertical direction. The unloading pickup 430 can pick up multiple electronic components 20 at once.

[0089] The unloading unit 400 may also include an unloading buffer 440.

[0090] The unloading buffer 440 is capable of temporarily accommodating the tested electronic component 20. The unloading pick-up unit 430 may include a first unloading pick-up unit (not shown) for conveying the tested electronic component 20 from the tray 1 to the unloading buffer 440 and a second unloading pick-up unit (not shown) for conveying the tested electronic component 20 from the unloading buffer 440 to the unloading storage unit 420. The unloading buffer 440 is also capable of movement along at least one of the first axial direction (X-axis direction) and the second axial direction (Y-axis direction).

[0091] Reference Figures 1 to 3 The test sorting machine 100 of the present invention may further include a rotating part 500 (shown in...). Figure 1 middle).

[0092] The rotating part 500 enables the tray 1 to rotate. The rotating part 500 allows the tray 1 to rotate between a horizontal and a vertical position. The loading and unloading processes can be performed with the tray 1 placed horizontally using the rotating part 500. The testing process can be performed with the tray 1 standing vertically using the rotating part 500. The temperature adjustment process for the electronic components 20 can be performed while the tray 1 is being transported vertically between the first chamber 320 and the second chamber 330 using the rotating part 500.

[0093] The rotating part 500 may include a loading rotator 510 (shown in...). Figure 1 (in the middle) and unloading rotator 520 (shown in) Figure 1 middle).

[0094] The loading rotator 510 is capable of rotating the horizontally positioned tray 1 to a vertical position. After receiving the horizontally positioned tray 1 from the loading section 200, the loading rotator 510 rotates the tray 1 to a vertical position. Then, the loading rotator 510 can supply the vertically positioned tray 1 to the first chamber 320. The loading rotator 510 can be disposed between the loading section 200 and the first chamber 320. The loading rotator 510 can be disposed relative to the loading section 200 on the rear side (direction of arrow BD) and on the upper side of the first chamber 320.

[0095] The unloading rotator 520 is capable of rotating the vertically positioned tray 1 to a horizontal position. The unloading rotator 520 can rotate the tray 1 to a horizontal position after receiving it from the second chamber 330. Then, the unloading rotator 520 can supply the horizontally positioned tray 1 to the unloading section 400. The unloading rotator 520 can be disposed between the unloading section 400 and the second chamber 330. The unloading rotator 520 can be disposed relative to the unloading section 400 on the rear side (direction of arrow BD) and on the upper side of the second chamber 330. With reference to the first axial direction (X-axis direction), the unloading rotator 520 and the loading rotator 510 can be disposed at positions spaced apart from each other.

[0096] Although not shown, the rotating unit 500 can also utilize a rotator to switch the tray 1 between a vertical and a horizontal state. In this case, the rotator can supply the tray 1 received from the loading unit 200 to the first chamber 320 after rotating it from a horizontal to a vertical state. The rotator can also supply the tray 1 received from the second chamber 330 to the unloading unit 400 after rotating it from a vertical to a horizontal state.

[0097] Reference Figures 1 to 3 The test sorting machine 100 of the present invention may include a conveying unit 600 (shown in...). Figure 1 middle).

[0098] The conveying unit 600 is capable of conveying the tray 1. The conveying unit 600 can push the tray 1 along the conveying direction to convey the tray 1. The conveying unit 600 can also pull the tray 1 along the conveying direction to convey the tray 1. The conveying unit 600 can convey the tray 1 to the loading unit 200, the testing unit 300, and the unloading unit 400. During this process, the loading process, the testing process, and the unloading process can be performed on the tray 1. When the unloading process is completed, the conveying unit 600 can convey the tray 1 from the unloading unit 400 to the loading unit 200. In this way, the tray 1 can circulate between the loading unit 200, the testing unit 300, and the unloading unit 400 via the conveying unit 600. When the first chamber 320 is provided, the conveying unit 600 can convey the tray 1 from the loading unit 200 through the first chamber 320 to the testing chamber 310. When the second chamber 330 is provided, the conveying unit 600 can convey the tray 1 from the test chamber 310 to the unloading unit 400 via the second chamber 330. When the rotating unit 500 is provided, the conveying unit 600 can convey the tray 1 from the loading unit 200 to the first chamber 320 via the rotating unit 500. Additionally, the conveying unit 600 can convey the tray 1 from the second chamber 330 to the unloading unit 400 via the rotating unit 500.

[0099] The test sorting machine 100 of the present invention can be used to sort electronic components 20 that are microchips, such as HBM, DDR, GDDR, and LPDDR, which are formed into tiny sizes. For this purpose, the test sorting machine 100 of the present invention can utilize the following tray 1.

[0100] Reference Figures 1 to 6 The tray 1 is capable of accommodating the electronic component 20. The tray 1 may include a tray body 2 (shown in...). Figure 2 (middle) and carrier module 3.

[0101] The tray body 2 can support the support module 3. The support module 3 can accommodate the electronic component 20. The support module 3 can be combined with the tray body 2 and thus supported by the tray body 2. The tray body 2 can be formed as a quadrilateral plate, but is not limited to this, and can also be formed as a disc or other shapes, as long as it can support the support module 3.

[0102] The tray body 2 may include a support hole (not shown). The support hole extends through the tray body 2. The support module 3 can be inserted into the support hole and attached to the tray body 2. The support module 3 can be attached to the tray body 2 by an elastic body (not shown), such as a spring. Therefore, the support module 3 can be attached to the tray body 2 in a way that allows for elastic movement using the elastic force of the elastic body. Therefore, when the test procedure is performed, the support module 3 can be moved toward the test device 10 by the pressure provided by the contact unit 3100, thereby electrically connecting the electronic component 20 to the test device 10. When the pressure provided by the contact unit 3100 is released, the support module 3 can move back to its original position using the restoring force of the elastic body.

[0103] Multiple load-bearing modules 3 may also be incorporated into the pallet body 2. Figure 2 The diagram shows 16 support modules 3 integrated into the tray body 2, but it is not limited to this; 64, 128, 256, or 512 support modules 3 may also be integrated into the tray body 2. The number of support modules 3 integrated into the tray body 2 corresponds to the number of electronic components 20 that are electrically connected to the test equipment 10 for testing. Multiple support modules 3 may be integrated into the tray body 2 in a matrix configuration. For example, as shown... Figure 2 As shown, multiple carrying modules 3 can be combined in the pallet body 2 in a 4×4 matrix. Although not shown, multiple carrying modules 3 can also be combined in the pallet body 2 in an 8×8 matrix, an 8×16 matrix, a 16×16 matrix, a 16×32 matrix, etc.

[0104] Reference Figures 1 to 6 The carrier module 3 can house the electronic component 20. The loading unit 200 performs the loading process by loading the electronic component 20 into the carrier module 3. The testing unit 300 performs the testing process by electrically connecting the electronic component 20 housed in the carrier module 3 to the testing equipment 10. The unloading unit 400 performs the unloading process by unloading the electronic component 20 from the carrier module 3.

[0105] The carrier module 3 may include a carrier body 31.

[0106] The supporting body 31 can form the overall appearance of the supporting module 3. The supporting body 31 can be combined with the pallet body 2, so that the supporting module 3 is supported by the pallet body 2.

[0107] A storage groove 32 may be formed in the support body 31. The storage groove 32 may penetrate the support body 31. The storage groove 32 may be formed in a shape corresponding to the electronic component 20.

[0108] The supporting module 3 may include a base plate 4.

[0109] The base plate 4 can be attached to the support body 31. The base plate 4 can be attached to one side of the support body 31, thereby covering the storage slot 32. Therefore, the electronic component 20 can be inserted into the storage slot 32 and supported by the base plate 4, thereby maintaining its stored state in the storage slot 32. At this time, the base plate 4 can support the bottom surface 201 of the electronic component 20. The bottom surface 201 of the electronic component 20 may be a portion configured with component terminals 202 for electrical connection with the test equipment 10. Multiple component terminals 202 may be configured on the bottom surface 201 of the electronic component 20. On the other hand, the test equipment 10 may include a test socket 11 corresponding to the support module 3. The test socket 11 may include test terminals 12 for electrical connection with the component terminals 202. The test socket 11 may include multiple test terminals 12. The test process can be performed with multiple test terminals 12 and multiple component terminals 202 electrically connected to each other one-to-one.

[0110] The base plate portion 4 may include a base plate component 41 and an electrical connection hole 42.

[0111] The base plate component 41 can support the bottom surface 201 of the electronic component 20 housed in the storage slot 32. The base plate component 41 can be coupled to the support body 31. The base plate component 41 can be coupled to the support body 31 by fastening units such as bolts. The base plate portion 4 may include a base plate component 41.

[0112] The electrical connection hole 42 can penetrate the base plate component 41. The electrical connection hole 42 can penetrate one surface 411 and another surface 412 of the base plate component 41. One surface 411 of the base plate component 41 can be configured to face multiple component terminals 202 of the electronic component 20 housed in the receiving slot 32. The other surface 412 of the base plate component 41 can face multiple test terminals 12. The test terminals 12 can be inserted into the electrical connection hole 42 during the testing process. Thus, the test terminals 12 can be electrically connected to the component terminals 202 of the electronic component 20 housed in the receiving slot 32. The test terminals 12 can be formed as pogo pins. The base plate portion 4 can include multiple electrical connection holes 42. The multiple electrical connection holes 42 can be formed to penetrate the base plate component 41 at different positions.

[0113] On the other hand, the base plate component 41 can be made of glass. Therefore, the test sorting machine 100 of the present invention can achieve the following effects.

[0114] First, the test sorting machine 100 of the present invention can reduce the difference in thermal expansion rates between the electronic component 20 and the base plate component 41. Therefore, even if the base plate component 41 is heated to adjust the temperature of the electronic component 20 to the test temperature, or if the electronic component 20 generates heat during the test process, the test sorting machine 100 of the present invention can reduce the relative displacement between the plurality of component terminals 202 of the electronic component 20 and the plurality of electrical connection holes 42 formed on the base plate component 41. Therefore, the test sorting machine 100 of the present invention can improve the stability and accuracy of the electrical connection between the plurality of component terminals 202 and the plurality of test terminals 12 through the plurality of electrical connection holes 42, thereby improving the reliability of the test results obtained through the test process.

[0115] Secondly, in the first comparative example where the base plate component 41 is formed using a synthetic resin such as a film, the film is relatively thin, therefore, the probability of deformation during continuous use is high. Furthermore, in the first comparative example, when processing the electrical connection holes 42 in the film, there are problems such as thermal deformation caused by laser, making it difficult to handle fine pitches. Therefore, in the first comparative example, the accuracy of achieving electrical connections between the plurality of component terminals 202 and the plurality of test terminals 12 through the electrical connection holes 42 is reduced.

[0116] In the second comparative example, where the base plate component 41 is formed using ceramic, the base plate component 41 exhibits a high coefficient of thermal expansion and high brittleness due to the properties of ceramic. Therefore, in the second comparative example, heating and other processes during the testing procedure can cause the base plate component 41 to expand excessively, thereby reducing the accuracy of the electrical connection between the plurality of component terminals 202 and the plurality of test terminals 12 through the plurality of electrical connection holes 42. Furthermore, the high brittleness of the base plate component 41 in the second comparative example increases the risk of damage or even breakage due to impacts.

[0117] In contrast, in the test sorting machine 100 of the present invention, the base plate component 41 is made of glass. Therefore, the base plate component 41 can be formed to have high heat resistance, low thermal expansion coefficient, and low brittleness. Thus, even if heating or other heat generation occurs during the testing process, the test sorting machine 100 of the present invention can maintain the accuracy of the electrical connection between the plurality of component terminals 202 and the plurality of test terminals 12 through the plurality of electrical connection holes 42. Therefore, the test sorting machine 100 of the present invention can improve the stability and accuracy of the electrical connection between the plurality of component terminals 202 and the plurality of test terminals 12, thereby improving the reliability of the test results obtained through the testing process.

[0118] When the base plate component 41 is made of glass, the support body 31 can be made of fiber glass. Therefore, the test sorting machine 100 of the present invention can reduce the difference in thermal expansion rates between the support body 31 and the base plate component 41. Therefore, even if the base plate component 41 is heated during the testing process, the test sorting machine 100 of the present invention can maintain a firm bond between the support body 31 and the base plate component 41. Therefore, the test sorting machine 100 of the present invention can improve the stability of the sorting process for the electronic components 20, including the testing process.

[0119] The plurality of electrical connection holes 42 can be formed to have the same spacing, position, and configuration as the plurality of component terminals 202 and the plurality of test terminals 12 of the electronic component 20 housed in the receiving slot 32. Therefore, the plurality of test terminals 12 can be inserted into the base plate component 41 through the plurality of electrical connection holes 42, thereby electrically connecting to each of the component terminals 202. For example, when the electronic component 20 is HBM, the spacing of the plurality of component terminals 202 can be greater than or equal to 0.14 mm and less than 0.17 mm. In this case, the spacing of the plurality of electrical connection holes 42 can also be greater than or equal to 0.14 mm and less than 0.17 mm. The spacing of the plurality of test terminals 12 can also be greater than or equal to 0.14 mm and less than 0.17 mm. Thus, even if the spacing of the plurality of electrical connection holes 42 is formed to be minute, sufficient durability can be achieved because the base plate component 41 is made of glass.

[0120] Each of the test terminals 12 can be inserted into a plurality of the electrical connection holes 42, so that the plurality of test terminals 12 are electrically connected to a plurality of component terminals 202 of the electronic component 20 housed in the housing slot 32 inside the support body 31. On the other hand, as Figure 5 As shown, when the plurality of component terminals 202 are disposed inside the electronic component 20, the thickness of the base plate component 41 can be formed to be less than the length of the test terminal 12, based on the thickness direction (TD axis direction) of the base plate component 41. Therefore, as Figure 6 As shown, when the plurality of test terminals 12 are inserted into the base plate component 41 through the plurality of electrical connection holes 42, they can protrude from a surface 411 of the base plate component 41, thereby electrically connecting with the respective component terminals 202 disposed inside the electronic component 20. Therefore, the test sorting machine 100 of the present invention can improve compatibility, that is, it can also be applied to electronic components 20 in which the plurality of component terminals 202 are disposed.

[0121] Reference Figures 1 to 11 The carrier module 3 may include an alignment part 5.

[0122] The alignment portion 5 can be integrated with the support body 31. The alignment portion 5 enables the electronic component 20 housed in the receiving groove 32 to move to a reference position SP. The reference position SP is the position where the electronic component 20 is located when the plurality of component terminals 202 are located on the plurality of electrical connection holes 42, or the position where the electronic component 20 is located when the plurality of test terminals are electrically connected to the plurality of component terminals 202 through the plurality of electrical connection holes 42. At this time, the receiving groove 32 can be formed such that its area is larger than the area of ​​the electronic component 20. Therefore, the test sorting machine 100 of the present invention does not need to make the area of ​​the receiving groove 32 precisely match the area of ​​the electronic component 20, and therefore, it is not necessary to strictly require machining tolerances when manufacturing the support body 31. Therefore, the test sorting machine 100 of the present invention can improve the convenience of the manufacturing process for manufacturing the support module 3 and can reduce the manufacturing cost of manufacturing the support module 3. Furthermore, even if the area of ​​the receiving slot 32 is larger than the area of ​​the electronic component 20, the test sorting machine 100 of the present invention can use the alignment part 5 to move the electronic component 20 to the reference position SP, thereby positioning the plurality of component terminals 202 on the plurality of electrical connection holes 42. Therefore, the test sorting machine 100 of the present invention can improve the accuracy of the test process, thereby improving the reliability of the test results obtained through the test process.

[0123] On the other hand, with the planar direction of the electronic component 20 as a reference, the receiving groove 32 can be formed such that its area is larger than the area of ​​the electronic component 20. The planar direction can be an axial direction perpendicular to the thickness direction (TD axis direction). That is, the planar direction can be an axial direction extending radially along the largest surface of the base plate member 41. The area of ​​the receiving groove 32 can be a cross-sectional area based on the planar direction. When the cross-sectional area changes as the receiving groove 32 extends along the depth direction toward the base plate portion 4, the area of ​​the receiving groove 32 can represent the area of ​​the portion corresponding to the depth of the electronic component 20 when the electronic component 20 is supported by the base plate portion 4. Therefore, when the electronic component 20 is supported by the base plate portion 4, a portion of the inner surface of the supporting body 31 facing the receiving groove 32 can be configured to be spaced apart from the electronic component 20.

[0124] The alignment portion 5 enables the electronic component 20 housed in the storage slot 32 to be in close contact with both the first opposing surface 311 and the second opposing surface 312 of the support body 31, thereby positioning the electronic component 20 housed in the storage slot 32 at the reference position SP. The first opposing surface 311 and the second opposing surface 312 may be surfaces of the support body 31 that abut against each other among a plurality of inner surfaces disposed toward the storage slot 32. For example, when the storage slot 32 is formed to have a quadrilateral cross-section with respect to the surface direction, the support body 31 further includes a third opposing surface 313 disposed opposite to the first opposing surface 311 and a fourth opposing surface 314 disposed opposite to the second opposing surface 312. At this time, the alignment portion 5 allows the electronic component 20 housed in the storage groove 32 to move towards the first corner portion 315 where the first opposing surface 311 and the second opposing surface 312 abut against each other, thereby making the electronic component 20 housed in the storage groove 32 in close contact with both the first opposing surface 311 and the second opposing surface 312. On the other hand, the first corner portion 315 may be an edge formed by the first opposing surface 311 and the second opposing surface 312 abutting against each other. The first corner portion 315 may also be formed as a curved surface. A groove or the like may also be formed in the first corner portion 315. On the other hand, a second corner portion 316 may be disposed at the portion where the third opposing surface 313 and the fourth opposing surface 314 abut against each other. The second corner portion 316 and the first corner portion 315 may be configured to face each other along the diagonal direction of the storage groove 32.

[0125] The alignment portion 5 enables the electronic component 20 housed in the storage slot 32 to move along a first direction (arrow direction P1) and a second direction (arrow direction P2), thereby positioning the electronic component 20 housed in the storage slot 32 at the reference position SP. The first direction (arrow direction P1) may be a direction from the third opposing surface 313 toward the first opposing surface 311. The second direction (arrow direction P2) may be a direction from the fourth opposing surface 314 toward the second opposing surface 312. The alignment portion 5 enables the electronic component 20 housed in the storage slot 32 to move along the first direction (arrow direction P1) to make it fit tightly against the first opposing surface 311, and enables the electronic component 20 housed in the storage slot 32 to move along the second direction (arrow direction P2) to make it fit tightly against the second opposing surface 312. At this time, by moving along the first direction (arrow direction P1) and along the second direction (arrow direction P2), the alignment part 5 can move the electronic component 20 housed in the storage slot 32 along a third direction (arrow direction P3). The third direction (arrow direction P3) can be a diagonal line from the second corner 316 toward the first corner 315. Thus, the alignment part 5 can move the electronic component 20 housed in the storage slot 32 toward the first corner 315, positioning it at the reference position SP. On the other hand, when the tray 1 is upright in a vertical position during the test process, the first corner 315 can be located at the lower end of the storage slot 32. Therefore, the test sorting machine 100 of the present invention can maintain the electronic component 20 at the reference position SP during the test process by utilizing the supporting force of the alignment part 5 and the gravity applied to the electronic component 20. Therefore, the test sorting machine 100 of the present invention can further improve the accuracy of the test process. The first corner portion 315 may be located at the left end of the lower end of the storage groove 32 or at the right end of the lower end of the storage groove 32.

[0126] A plurality of alignment portions 5 may be incorporated into the support body 31. A first alignment portion 5a of the plurality of alignment portions 5 allows the electronic component 20 housed in the receiving groove 32 to move along the first direction (arrow direction P1), thereby bringing the electronic component 20 housed in the receiving groove 32 into close contact with the first opposing surface 311. The first alignment portion 5a may be disposed on the third opposing surface 313 and incorporated into the support body 31. A second alignment portion 5b of the plurality of alignment portions 5 allows the electronic component 20 housed in the receiving groove 32 to move along the second direction (arrow direction P2), thereby bringing the electronic component 20 housed in the receiving groove 32 into close contact with the second opposing surface 312. The second alignment portion 5b may be disposed on the fourth opposing surface 314 and incorporated into the support body 31. In this way, the test sorting machine 100 of the present invention can move the electronic component 20 housed in the storage slot 32 along the first direction (arrow direction P1) using the first alignment part 5a, and simultaneously move the electronic component 20 housed in the storage slot 32 along the second direction (arrow direction P2) using the second alignment part 5b, thereby positioning the electronic component 20 housed in the storage slot 32 at the reference position SP. Except for the arrangement position on the support body 31 and the direction of movement of the electronic component 20 housed in the storage slot 32, the second alignment part 5b and the first alignment part 5a can be formed to be substantially identical.

[0127] The alignment part 5 can be able to avoid the position RP (in Figure 10 (marked with dashed lines) and alignment position AP (in Figure 10 The alignment portion 5 is coupled to the support body 31 by means of rotation between the two positions (marked with solid lines). The alignment portion 5 can be located at the avoidance position RP to open the receiving slot 32. Therefore, the alignment portion 5 can be configured to not interfere with the electronic component 20 when loading it into the receiving slot 32 and when unloading it from the receiving slot 32. At this time, the alignment portion 5 located at the avoidance position RP can be fully inserted into the interior of the support body 31. After the electronic component 20 is loaded into the receiving slot 32, the alignment portion 5 can move the electronic component 20 stored in the receiving slot 32 to the reference position SP while rotating from the avoidance position RP to the alignment position AP. A portion of the alignment portion 5 located at the alignment position AP can protrude from the support body 31 toward the receiving slot 32. The alignment portion 5 can rotate between the avoidance position RP and the alignment position AP with a rotation axis 501 as an axis. The rotation axis 501 can be a shaft (shaft) rotatably coupled to the support body 31.

[0128] The alignment portion 5 may include an alignment surface 51.

[0129] The alignment surface 51 can be the surface of the alignment portion 5 facing the receiving slot 32. When the electronic component 20 is mounted in the receiving slot 32, and the alignment portion 5 rotates from the avoidance position RP to the alignment position AP, the alignment surface 51 can directly contact the electronic component 20 housed in the receiving slot 32, moving the electronic component 20 to the reference position SP. At this time, the alignment surface 51 can push the side surface of the electronic component 20 housed in the receiving slot 32, causing it to move. When the alignment portion 5 is located at the alignment position AP, the alignment surface 51 can be configured parallel to the side surface of the electronic component 20 housed in the receiving slot 32. The alignment surface 51 can be formed as a plane.

[0130] The alignment portion 5 may include a limiting surface 52.

[0131] The limiting surface 52 protrudes from the alignment surface 51 toward the electronic component 20 housed in the receiving slot 32. The limiting surface 52 may be positioned higher than the upper surface 203 of the electronic component 20 located at the reference position SP. The upper surface 203 of the electronic component 20 is the surface opposite to the bottom surface 201 of the electronic component 20. When the loading and unloading processes are performed on a tray 1 placed horizontally, the upper surface 203 of the electronic component 20 may be configured to face upwards. In this case, the limiting surface 52 may be positioned higher than the upper surface 203 of the electronic component 20 located at the reference position SP. When the testing process is performed on a tray 1 standing vertically, the upper surface 203 of the electronic component 20 may be configured to face forward (in the direction of the FD arrow). In this case, the limiting surface 52 may be positioned relative to the upper surface 203 of the electronic component 20 located at the reference position SP on the forward (in the direction of the FD arrow) side. On the other hand, when performing the test procedure, when the upper surface 203 of the electronic component 20 is configured to face the front (FD arrow direction), the bottom surface 201 of the electronic component 20 can be configured to face the rear (BD arrow direction).

[0132] The limiting surface 52 is positioned higher than the upper surface 203 of the electronic component 20 located at the reference position SP, thereby limiting the distance that the electronic component 20 located at the reference position SP can move in the direction of disengagement from the receiving slot 32. Therefore, the test sorting machine 100 of the present invention, by utilizing the alignment part 5, can improve the accuracy and stability of the test process. The limiting surface 52 may be the surface of the alignment part 5 facing the receiving slot 32. When the electronic component 20 is loaded in the receiving slot 32, and the alignment surface 51 contacts the electronic component 20 stored in the receiving slot 32 as the alignment part 5 rotates from the avoidance position RP to the alignment position AP, the limiting surface 52 may be positioned higher than the upper surface 203 of the electronic component 20. At this time, the limiting surface 52 may also be configured to contact the upper surface 203 of the electronic component 20. When the alignment portion 5 is located at the alignment position AP, the limiting surface 52 can be configured to be parallel to the upper surface of the electronic component 20 housed in the receiving groove 32. The limiting surface 52 can be formed as a plane.

[0133] The alignment part 5 may include an action part 53, a support part 54, and an elastic part 55.

[0134] The actuating member 53 can be used to move the alignment portion 5 to the avoidance position RP. The actuating member 53 can be configured to protrude from the alignment body 50 of the alignment portion 5. When the alignment portion 5 rotates between the avoidance position RP and the alignment position AP about the rotation axis 501, the actuating member 53 can protrude from the alignment body 50 in a direction parallel to the rotation axis 501. The alignment body 50 can form the overall appearance of the alignment portion 5. The alignment body 50 can be coupled to the support body 31 in a manner that allows rotation about the rotation axis 501. Figure 10As shown in solid lines, when the alignment portion 5 is located at the alignment position AP, an opening / closing portion 120 may be disposed on the lower side of the actuating member 53. The side of the opening / closing portion 120 facing the actuating member 53 may be formed such that its size decreases as it extends toward the actuating member 53. At this time, an inclined surface may be formed on one side of the opening / closing portion 120, and the inclined surface is inclined along the direction toward the receiving groove 32 as it extends toward the actuating member 53. When the opening / closing portion 120 rises toward the actuating member 53, the opening / closing portion 120 can apply pressure to the actuating member 53 using the inclined surface. As a result, the alignment portion 5 can rotate about the rotation axis 501 and thus be located at the avoidance position RP. When the alignment portion 5 is in the avoidance position RP, and the opening / closing portion 120 descends and separates from the actuating member 53, the alignment portion 5 can rotate about the rotation axis 501 and thus be located at the alignment position AP. At this time, the alignment part 5 can be rotated using the elastic force of the elastic member 55, thereby positioning itself at the alignment position AP.

[0135] The opening / closing part 120 can be disposed on the loading part 200. When the opening / closing part 120 presses against the actuating member 53 to rotate the alignment part 5 to the avoidance position RP, the loading part 200 can load the electronic component 20 into the storage slot 32. When the electronic component 20 is loaded into the storage slot 32, the opening / closing part 120 can be separated from the actuating member 53. Thus, the alignment part 5 can rotate to the alignment position AP while moving the electronic component 20 stored in the storage slot 32 to the reference position SP.

[0136] The opening / closing part 120 may also be disposed on the unloading part 400. When the opening / closing part 120 presses against the actuating member 53 to rotate the alignment part 5 to the avoidance position RP, the unloading part 400 can unload the electronic component 20 from the receiving slot 32. When the electronic component 20 is unloaded from the receiving slot 32, the opening / closing part 120 can be separated from the actuating member 53. Thus, the alignment part 5 can rotate to the alignment position AP.

[0137] The support member 54 protrudes from the alignment body 50. The support member 54 supports the elastic member 55. One side of the elastic member 55 is supported on the support member 54, and the other side of the elastic member 55 is supported on the bearing body 31. Figure 9Based on this, the lower side of the elastic member 55 can be supported on the support member 54, and the upper side of the elastic member 55 can be supported on the bearing body 31. When the opening / closing part 120 presses on the actuating member 53 to rotate the alignment part 5 to the avoidance position RP, the support member 54 can rotate about the rotation axis 501, thereby pushing and compressing the elastic member 55. In this state, when the opening / closing part 120 is separated from the actuating member 53, the elastic member 55 can extend while the support member 54 rotates about the rotation axis 501. Thus, the alignment part 5 can be located at the alignment position AP. Although not shown, the elastic member 55 can also be connected to the shaft constituting the rotation axis 501. In this case, the elastic member 55 can be a torsion spring.

[0138] Reference Figures 1 to 12 The alignment portion 5 in the modified embodiment may further include a first alignment surface 51a and a second alignment surface 51b.

[0139] The first alignment surface 51a enables the electronic component 20 housed in the storage slot 32 to move to one side of the first opposing surface 311. The first alignment surface 51a enables the electronic component 20 housed in the storage slot 32 to move along the first direction (arrow direction P1), thereby making the electronic component 20 housed in the storage slot 32 in close contact with the first opposing surface 311.

[0140] The second alignment surface 51b enables the electronic component 20 housed in the storage slot 32 to move to one side of the second opposing surface 312. The second alignment surface 51b enables the electronic component 20 housed in the storage slot 32 to move along the second direction (arrow direction P2), thereby making the electronic component 20 housed in the storage slot 32 in close contact with the second opposing surface 312.

[0141] The second alignment surface 51b and the first alignment surface 51a may be formed on the alignment body 50. Therefore, the alignment portion 5 can utilize the second alignment surface 51b and the first alignment surface 51a to move the electronic component 20 housed in the storage slot 32 along the third direction (arrow direction P3), thereby bringing the electronic component 20 housed in the storage slot 32 into close contact with the first opposing surface 311 and the second opposing surface 312. Therefore, the test sorting machine 100 of the present invention can position the electronic component 20 housed in the storage slot 32 at the reference position SP using only one alignment portion 5. Therefore, compared to the embodiment that uses the first alignment portion 5a and the second alignment portion 5b to move the electronic component 20 housed in the storage slot 32 to the reference position SP, the modified embodiment that uses the first alignment surface 51a and the second alignment surface 51b to move the electronic component 20 housed in the storage slot 32 to the reference position SP can reduce the number of alignment portions 5 configured on the carrier module 3.

[0142] In a modified embodiment, the alignment portion 5 can be coupled to the support body 31 by being disposed at the second corner portion 316. In this case, the first alignment surface 51a can be disposed on the third opposing surface 313. The first alignment surface 51a can be formed as a plane parallel to the first opposing surface 311. The second alignment surface 51b can be disposed on the fourth opposing surface 314. The second alignment surface 51b can be formed as a plane parallel to the second opposing surface 312. In another modified embodiment, the alignment portion 5 can be coupled to the support body 31 in a manner that allows movement along the third direction (arrow P3) and a fourth direction opposite to the third direction (arrow P3). Alternatively, in yet another modified embodiment, the alignment portion 5 can be coupled to the support body 31 in a manner that allows linear movement along the third direction (arrow P3) and the fourth direction.

[0143] The alignment portion 5 in the modified embodiment may include the support member 54, the elastic member 55, and the actuation hole 56.

[0144] The support member 54 protrudes from the alignment body 50. The support member 54 protrudes from the alignment body 50 in a direction perpendicular to the third direction (arrow direction P3), and protrudes from the protruding portion toward the fourth direction. The support member 54 can support the elastic member 55. In a modified embodiment, the alignment portion 5 may further include a plurality of the support members 54. In this case, the plurality of support members 54, 54' protrudes from both sides of the alignment body 50 in a direction perpendicular to the third direction (arrow direction P3).

[0145] The elastic member 55 can be supported on the support member 54 and the bearing body 31. One side of the elastic member 55 can be supported on the support member 54, and the other side of the elastic member 55 can be supported on the bearing body 31. A portion of the support member 54 can be inserted into the inner side of the elastic member 55. The elastic member 55 can be configured parallel to the third direction (arrow direction P3). When multiple support members 54 are provided, the alignment portion 5 of the modified embodiment can include multiple elastic members 55. Multiple elastic members 55, 55' can be supported on each support member 54, 54'. The alignment body 50 can be arranged between multiple elastic members 55, 55' based on a direction perpendicular to the third direction (arrow direction P3).

[0146] The actuation hole 56 passes through the alignment body 50. The opening and closing part 120 (shown in...) Figure 10 The alignment part 5 (in the middle) can be configured below the actuation hole 56. When the opening / closing part 120 rises toward the actuation hole 56, the opening / closing part 120 can insert into the actuation hole 56 while applying pressure to the alignment body 50 using the inclined surface. Thus, the alignment part 5 of the modified embodiment can move along the fourth direction, thereby reaching the avoidance position RP. At this time, the support member 54 can push and compress the elastic member 55. With the alignment part 5 of the modified embodiment in the avoidance position RP, when the opening / closing part 120 descends and disengages from the actuation hole 56, the alignment part 5 moves along the third direction (in the direction of arrow P3), thereby reaching the alignment position AP. At this time, the alignment part 5 of the modified embodiment can move to the third direction (in the direction of arrow P3) using the elastic force of the elastic member 55.

[0147] The alignment portion 5 in the modified embodiment may include a limiter 57 and a limiting hole 58.

[0148] The limiter 57 can be inserted into the limiting hole 58 and attached to the support body 31. The limiter 57 can limit the distance that the alignment portion 5 of the modified embodiment can move along the third direction (arrow P3 direction). Therefore, the test sorting machine 100 of the present invention can use the limiter 57 to prevent the alignment portion 5 of the modified embodiment from applying excessive force to the electronic component 20 housed in the receiving slot 32. The limiter 57 can limit the distance that the alignment portion 5 of the modified embodiment can move along the fourth direction. Therefore, the test sorting machine 100 of the present invention can use the limiter 57 to prevent the alignment portion 5 of the modified embodiment from separating from the support body 31.

[0149] The limiting hole 58 may be formed in the support member 54. The limiter 57 may be inserted into the limiting hole 58, thereby being disposed between a plurality of support surfaces of the support member 54. A first support surface of the plurality of support surfaces may be disposed relative to the limiting hole 58 on the third direction (arrow P3 direction). A second support surface of the plurality of support surfaces may be disposed relative to the limiting hole 58 on the fourth direction side. When the alignment portion 5 of the modified embodiment moves along the third direction (arrow P3 direction), the limiter 57 may be supported on the second support surface. Thus, the limiter 57 can limit the distance that the alignment portion 5 of the modified embodiment can move along the third direction (arrow P3 direction). When the alignment portion 5 of the modified embodiment moves along the fourth direction, the limiter 57 may be supported on the first support surface. Thus, the limiter 57 can limit the distance that the alignment portion 5 of the modified embodiment can move along the fourth direction. On the other hand, when the alignment portion 5 of the modified embodiment includes a plurality of the support members 54, the limiting hole 58 may be formed in each of the support members 54, 54'. At this time, the limiters 57 can be inserted into each of the limiting holes 58.

[0150] Reference Figures 1 to 12 The carrying module 3 may include a locking part 6.

[0151] The locking part 6 can be coupled to the support body 31. The locking part 6 can support the electronic component 20 located at the reference position SP. Therefore, the locking part 6 can prevent the electronic component 20 located at the reference position SP from detaching from the receiving slot 32. The locking part 6 can be coupled to the support body 31 in a rotatable manner between an open position and a locked position. The locking part 6 can be located in the open position, thereby opening the receiving slot 32. Therefore, the locking part 6 can be configured to not interfere with the electronic component 20 when loading it into the receiving slot 32 and when unloading it from the receiving slot 32. At this time, the locking part 6 located in the open position can be fully inserted into the interior of the support body 31. After the electronic component 20 is loaded into the receiving slot 32, the locking part 6 can be rotated from the open position to the locked position, thereby supporting the upper surface 203 of the electronic component 20 stored in the receiving slot 32. At this time, after the alignment part 5 is located at the alignment position AP and the electronic component 20 housed in the storage slot 32 is moved to the reference position SP, the locking part 6 can be located in the locked position. The operation of rotating the alignment part 5 to the alignment position AP and the operation of rotating the locking part 6 to the locked position can also be performed simultaneously. The locking part 6 can rotate between the open position and the locked position via a rotation axis (not shown). The rotation axis of the locking part 6 can be a shaft rotatably coupled to the support body 31.

[0152] The locking part 6 may include a locking body 61 and a locking component 62.

[0153] The locking body 61 can be attached to the supporting body 31. The locking body 61 can be entirely disposed inside the supporting body 31. The locking body 61 can be attached to the supporting body 31 in a lifting and lowering manner.

[0154] The locking component 62 is rotatable between the open position and the locked position and is connected to the support body 31. The locking component 62 can rotate between the open position and the locked position as the locking body 61 moves up and down. For example, when the locking body 61 rises with the locking opening / closing part (not shown), the locking component 62 can rotate to the open position. When the locking body 61 falls with the locking opening / closing part, the locking component 62 can rotate to the locked position. At this time, an elastic body (not shown) can be disposed between the locking body 61 and the support body 31. The elastic body can be compressed as the locking body 61 rises and extended as the locking opening / closing part falls, causing the locking body 61 to fall. The locking opening / closing part can be disposed on the underside of the locking part 6.

[0155] With the locking mechanism applying pressure to the locking body 61 to rotate the locking component 62 to the open position, the loading unit 200 can load the electronic component 20 into the storage slot 32. The locking mechanism can be configured in the loading unit 200. When the loading unit 200 loads the electronic component 20 into the storage slot 32, the locking mechanism can release the pressure on the locking body 61 to rotate the locking component 62 to the locked position. The locking mechanism can also be configured in the unloading unit 400. With the locking mechanism applying pressure to the locking body 61 to rotate the locking component 62 to the open position, the unloading unit 400 can unload the electronic component 20 from the storage slot 32.

[0156] Although not shown, the locking body 61 and the locking component 62 can be integrally formed and coupled to the support body 31 in a manner that allows them to rotate between the open position and the locked position. In this case, the elastic body can be coupled to the rotation axis of the locking part 6. The elastic body can be a torsion spring. The locking opening / closing part can rise to rotate the locking part 6 to the open position and can fall to rotate the locking part 6 to the locked position.

[0157] When the carrier module 3 includes a first alignment portion 5a disposed on the third opposing surface 313 and a second alignment portion 5b disposed on the fourth opposing surface 314, the locking portion 6 can be coupled to the carrier body 31 by being disposed on the first opposing surface 311 or the second opposing surface 312. Thus, the test sorting machine 100 of the present invention can be configured such that the locking portion 6 and the alignment portion 5b do not interfere with each other. Furthermore, when the alignment portion 5 includes the limiting surface 52, in the test sorting machine 100 of the present invention, the locking portion 6 and the limiting surface 52 can prevent the electronic component 20 housed in the receiving slot 32 from arbitrarily detaching from the carrier module 3 at different positions, thereby improving the stability of multiple processes performed while the electronic component 20 is housed in the carrier module 3. The carrier module 3 may also include multiple locking portions 6. In this case, the multiple locking portions 6 can be coupled to the carrier body 31 by being disposed on the first opposing surface 311 and the second opposing surface 312, respectively.

[0158] When the carrier module 3 includes an alignment portion 5 disposed at the second corner portion 316, the carrier module 3 may include a plurality of locking portions 6. The plurality of locking portions 6 may be respectively disposed on the second opposing surface 312 and the fourth opposing surface 314. Therefore, the test sorting machine 100 of the present invention can be configured such that the plurality of locking portions 6 and the alignment portion 5 do not interfere with each other, and at the same time, the plurality of locking portions 6 can prevent the electronic components 20 housed in the receiving slot 32 from arbitrarily detaching from the carrier module 3 at different positions. The plurality of locking portions 6 may also be respectively disposed on the first opposing surface 311 and the third opposing surface 313. The plurality of locking portions 6 may also be respectively disposed on the first opposing surface 311, the second opposing surface 312, the third opposing surface 313, and the fourth opposing surface 314.

[0159] The present invention described above is not limited to the embodiments and drawings described above. Those skilled in the art will understand that various substitutions, modifications and alterations can be made without departing from the technical concept of the present invention.

Claims

1. A carrier module for housing electronic components, characterized in that, include: The supporting body has a storage slot for storing the electronic components; as well as The base plate is attached to the supporting body. The base plate includes: a base plate component for supporting the bottom surface of electronic components housed in the storage slot; And multiple electrical connection holes, which are formed through the bottom plate portion. The base plate component is made of glass.

2. The carrier module according to claim 1, characterized in that, The supporting body is made of glass fiber.

3. The carrier module according to claim 1, characterized in that, The plurality of electrical connection holes have the same spacing, the same position, and the same configuration as the plurality of component terminals of the electronic components housed in the housing slot and the plurality of test terminals of the test equipment.

4. The carrier module according to claim 1, characterized in that, Each of the test terminals is inserted into the plurality of electrical connection holes so that the plurality of test terminals of the test equipment are electrically connected to the plurality of component terminals of the electronic components housed in the housing slot inside the carrier body.

5. The carrier module according to claim 1, characterized in that, With the thickness direction of the base plate component as a reference, the thickness of the base plate component is less than the length of multiple test terminals of the test equipment.

6. The carrier module according to claim 1, characterized in that, Including the alignment portion attached to the supporting body, The area of ​​the storage slot is larger than the area of ​​the electronic component. The alignment section moves the electronic components housed in the storage slot to a reference position, which is used to electrically connect multiple test terminals of the test equipment to multiple component terminals of the electronic components housed in the storage slot through the multiple electrical connection holes.

7. The carrier module according to claim 6, characterized in that, The alignment portion is coupled to the support body in a manner that allows it to rotate between an avoidance position and an alignment position, wherein the avoidance position is used to open the storage slot, and the alignment position is used to move the electronic components stored in the storage slot to the reference position.

8. The carrier module according to claim 6, characterized in that, The supporting body includes: a first opposing surface configured to face the storage slot; and a second opposing surface configured to abut against the first opposing surface. The alignment portion moves the electronic component housed in the storage slot toward the first corner where the first opposing surface and the second opposing surface abut, and makes the electronic component housed in the storage slot fit tightly against both the first opposing surface and the second opposing surface, thereby positioning the electronic component housed in the storage slot at the reference position.

9. The carrier module according to claim 8, characterized in that, The supporting body is equipped with a plurality of the alignment portions. A first alignment portion of the plurality of alignment portions is disposed on a third opposing surface opposite to the first opposing surface, for moving the electronic components housed in the storage slot toward the first opposing surface. The second alignment portion of the plurality of alignment portions is disposed on a fourth opposing surface opposite to the second opposing surface, for moving the electronic components housed in the storage slot toward the second opposing surface.

10. The carrier module according to claim 9, characterized in that, The device includes a locking mechanism that is rotatably coupled to the support body between a locked position and an open position. The locked position is used to lock the storage slot, and the open position is used to open the storage slot. The locking portion is coupled to the carrier body in such a way that it is disposed on at least one of the first opposing surface and the second opposing surface.

11. The carrier module according to claim 6, characterized in that, The alignment portion includes: an alignment surface for moving an electronic component housed in the storage slot to the reference position; and a limiting surface protruding from the alignment surface toward the electronic component housed in the storage slot. The limiting surface is positioned higher than the upper surface of the electronic component located at the reference position.

12. The carrier module according to claim 8, characterized in that, The alignment portion includes: a first alignment surface that contacts an electronic component housed in the storage slot to move the electronic component housed in the storage slot toward the first opposing surface; and a second alignment surface that contacts an electronic component housed in the storage slot to move the electronic component housed in the storage slot toward the second opposing surface. The alignment portion is provided at the second corner of the supporting body, which is opposite to the first corner.

13. The carrier module according to claim 12, characterized in that, The device includes a locking mechanism that is rotatably coupled to the support body between a locked position and an open position. The locked position is used to lock the storage slot, and the open position is used to open the storage slot. The locking portion is coupled to the support body in such a way that it is disposed on a third opposing surface opposite to the first opposing surface and a fourth opposing surface opposite to the second opposing surface.

14. The carrier module according to claim 12, characterized in that, The device includes a locking mechanism that is rotatably coupled to the support body between a locked position and an open position. The locked position is used to lock the storage slot, and the open position is used to open the storage slot. The locking portion is coupled to the support body in such a way that it is disposed on the first opposing surface and the second opposing surface.

15. A pallet comprising: Pallet body; as well as The carrying module as described in any one of claims 1 to 14 is incorporated into the pallet body.

16. A testing and sorting machine, characterized in that, include: The loading section is used to perform the loading process of loading the electronic components to be tested onto the tray; as well as The testing department is used to perform testing procedures on the electronic components housed in the tray. The loading section houses the electronic components to be tested in the carrier module of the tray as described in any one of claims 1 to 14.

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