Constant temperature and humidity equipment control method and constant temperature and humidity equipment

Abstract

The invention relates to the technical field of constant temperature and humidity, particularly provides a control method of constant temperature and humidity equipment and the constant temperature and humidity equipment, and aims to solve the technical problems that a constant temperature and humidity box is large in noise vibration, insufficient in control precision and poor in long-term operation stability. In order to achieve the purpose, the control method of the constant-temperature and constant-humidity equipment comprises the steps that the actual temperature and the actual humidity in an inner container are obtained; according to the deviation degree of the actual temperature value relative to the target temperature value, the operation parameters of the semiconductor temperature control module and the operation parameters of the first fan are controlled so as to adjust the temperature in the inner container; and according to the deviation degree of the actual humidity value relative to the target humidity value, the operation parameters of the semiconductor dehumidification module or the humidification module and the operation parameters of the first fan are controlled so as to adjust the humidity in the inner container. The semiconductor technology is adopted, the system is quiet and free of vibration, temperature and humidity are synchronously adjusted through multi-module joint control, the deviation between an actual value and a target value can be accurately responded, and high-precision control is achieved.

Description

Technical Field

[0001] This invention relates to the field of constant temperature and humidity technology, specifically providing a control method and a constant temperature and humidity device. Background Technology

[0002] As a key type of environmental simulation equipment, constant temperature and humidity chambers are widely used in many fields such as materials testing, biological culture, drug stability studies, and electronic product reliability verification. Their core function is to provide continuous, stable, and precisely controllable temperature and humidity conditions to meet the needs of high-standard experiments and testing.

[0003] Traditional constant temperature and humidity chambers mostly rely on a combination of compressor refrigeration and electric heating for temperature control, along with humidification and dehumidification systems for humidity regulation. While this method is relatively mature, it has significant drawbacks: the compressor generates considerable vibration and noise during operation, interfering with the precision experimental environment; the system consumes a lot of energy and generates a large amount of waste heat during operation, increasing the heat dissipation load of the laboratory; furthermore, the compressor has a large start-stop inertia, resulting in slow temperature control response and significant overshoot, limiting accuracy in applications requiring rapid temperature changes or control of small temperature differences.

[0004] In recent years, semiconductor thermostat technology has been gradually applied. This technology utilizes thermoelectric coolers (TECs) based on the Peltier effect for cooling or heating, and has advantages such as no moving mechanical parts, low vibration, compact size, and rapid heating and cooling conversion by adjusting the direction and magnitude of the current. However, in practical applications of thermostatic and humidity chambers, this technology still faces a series of challenges: the thermoelectric cooler itself has relatively low cooling efficiency, generates a large amount of heat in high-power applications, and has high requirements for thermal management; the temperature and humidity coupling control strategy is complex, and its temperature and humidity stability and reliability are still inferior to mature compressor refrigeration systems under wide-range, high-precision, and long-term continuous operation conditions; in addition, the fan cooling device required to dissipate system heat also generates a certain amount of noise.

[0005] Therefore, a new technical solution is needed in this field to solve the above problems. Summary of the Invention

[0006] The present invention aims to solve the above-mentioned technical problems, namely, to solve the technical problems of existing constant temperature and humidity chambers, such as high noise and vibration, insufficient control accuracy, and poor long-term operational stability.

[0007] In a first aspect, the present invention provides a control method for a constant temperature and humidity device, the constant temperature and humidity device comprising an inner liner and a shell surrounding the outer side of the inner liner, the inner liner having a storage space, an air duct forming between the outer wall of the shell and the inner liner, a return air inlet communicating with the air duct and an air inlet communicating with the air duct being provided on the wall of the inner liner, a first fan being provided at the return air inlet or in the air duct, and a semiconductor temperature control module, a semiconductor dehumidification module and a humidification module being provided in the air duct, the control method comprising: S100: Obtain the actual temperature and humidity inside the inner liner; S200: Based on the degree of deviation between the actual temperature value and the target temperature value, control the operating parameters of the semiconductor temperature control module and the operating parameters of the first fan to adjust the temperature inside the inner liner; S300: Based on the degree of deviation of the actual humidity value from the target humidity value, control the operating parameters of the semiconductor dehumidification module or the humidification module and the operating parameters of the first fan to adjust the humidity inside the inner tank.

[0008] In the preferred technical solution of the control method for the above-mentioned constant temperature and humidity equipment, step S200 specifically includes: When the actual temperature is lower than the target temperature value minus a first allowable deviation, the semiconductor temperature control module is controlled to execute a heating mode, and the operating power of the semiconductor temperature control module and the speed of the first fan are increased accordingly based on the degree of negative temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module and the speed of the first fan are positively correlated with the degree of negative temperature deviation; and / or When the actual temperature is higher than the target temperature plus a first allowable deviation, the semiconductor temperature control module is controlled to execute a cooling mode, and the operating power of the semiconductor temperature control module and the speed of the first fan are increased accordingly based on the degree of positive temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module and the speed of the first fan are positively correlated with the degree of positive temperature deviation.

[0009] In the preferred embodiment of the control method for the aforementioned constant temperature and humidity equipment, multiple semiconductor temperature control modules are provided. During the process of "controlling all semiconductor temperature control modules to execute heating mode" or "controlling all semiconductor temperature control modules to execute cooling mode," the control method further includes: Obtain the first total power required for operation of the plurality of semiconductor temperature control modules; The first total power is evenly distributed to each of the semiconductor temperature control modules, so that the plurality of semiconductor temperature control modules operate according to the evenly distributed power; and / or Multiple return air vents are provided, and each of the multiple return air vents is equipped with a first fan. During the operation of the multiple first fans, the control method further includes: Obtain the second total power required for the operation of multiple first wind turbines; The second total power is evenly distributed to each of the first wind turbines so that the plurality of first wind turbines operate at the power after the average distribution.

[0010] In the preferred technical solution of the control method for the above-mentioned constant temperature and humidity equipment, step S300 specifically includes: When the actual humidity is lower than the target humidity value minus the second allowable deviation, the humidification module is activated, and the operating power of the humidification module is determined according to the degree of negative humidity deviation, and the speed of the first fan is increased accordingly; wherein, the operating power of the humidification module is positively correlated with the degree of negative humidity deviation, and the increase in the speed of the first fan is positively correlated with the degree of negative humidity deviation; and / or When the actual humidity is higher than the target humidity value plus a second allowable deviation, the semiconductor dehumidification module is activated, and the operating power of the semiconductor dehumidification module is determined according to the degree of positive humidity deviation, and the speed of the first fan is increased accordingly. The operating power of the semiconductor dehumidification module is positively correlated with the degree of positive humidity deviation, and the increase in the rotational speed of the first fan is positively correlated with the degree of positive humidity deviation.

[0011] In the preferred embodiment of the control method for the aforementioned constant temperature and humidity equipment, multiple return air vents are provided, and a first fan is respectively installed at each of the multiple return air vents. During the operation of the multiple first fans, the control method further includes: Obtain the second total power required for the operation of multiple first wind turbines; The second total power is evenly distributed to each of the first wind turbines, so that the plurality of first wind turbines operate at the evenly distributed power; and / or The semiconductor dehumidification module is provided in multiple ways. When multiple semiconductor dehumidification modules are started, the control method further includes: Obtain the third total power required for the operation of multiple semiconductor dehumidification modules; The third total power is evenly distributed to each of the semiconductor dehumidification modules so that the multiple semiconductor dehumidification modules operate according to the evenly distributed power.

[0012] In a preferred embodiment of the control method for the aforementioned constant temperature and humidity equipment, multiple return air vents are provided, and a first fan is respectively installed at each of the multiple return air vents. Multiple semiconductor temperature control modules are provided. When the actual temperature value is between the target temperature value minus a first allowable deviation and the target temperature value plus the first allowable deviation, and when the actual humidity is between the target humidity value minus a second allowable deviation and the target humidity value plus the second allowable deviation, the control method further includes: The system controls multiple semiconductor temperature control modules to operate with an evenly distributed sustaining power, and controls multiple first fans to operate with an evenly distributed sustaining speed. The semiconductor dehumidification module and the humidification module are stopped from operating.

[0013] In the preferred embodiment of the control method for the above-mentioned constant temperature and humidity equipment, the semiconductor temperature control module includes a first semiconductor chip, a second fan, and a first heat sink and a heat exchange plate disposed on both sides of the first semiconductor chip; the heat exchange plate is located inside the air duct, and the first heat sink and the second fan are located outside the housing. In step S200, "controlling the operating parameters of the semiconductor temperature control module" specifically includes: The operating power of the first semiconductor chip and the speed of the second fan in the semiconductor temperature control module are controlled.

[0014] In the preferred embodiment of the control method for the above-mentioned constant temperature and humidity equipment, the semiconductor dehumidification module includes a second semiconductor chip, a third fan, and a second heat sink and a cold-conducting plate disposed on both sides of the second semiconductor chip; the cold-conducting plate is located inside the air duct, and the second heat sink and the third fan are located outside the housing. In step S300, "controlling the operating parameters of the semiconductor dehumidification module" specifically includes: Control the operating power of the second semiconductor chip in the semiconductor dehumidification module and the rotation speed of the third fan.

[0015] In the preferred embodiment of the control method for the above-mentioned constant temperature and humidity equipment, the humidification module includes a PTC steam generator, a water storage tank, and a water pump. The PTC steam generator has a steam port connected to the air duct. The water pump is used to transport water from the water storage tank to the PTC steam generator. In step S300, "controlling the operating parameters of the humidification module" specifically includes: Control the operating power of the PTC steam generator.

[0016] In a second aspect, the present invention also provides a constant temperature and humidity device, including a controller configured to perform the control method described in any of the preceding claims.

[0017] Those skilled in the art will understand that the technical solution of the present invention provides a control method for a constant temperature and humidity equipment. The constant temperature and humidity equipment includes an inner liner and a shell surrounding the outer side of the inner liner. The inner liner has a storage space, and an air duct is formed between the outer wall of the shell and the inner liner. A return air inlet and an air inlet communicating with the air duct are provided on the wall of the inner liner. A first fan is provided at the return air inlet or in the air duct. A semiconductor temperature control module, a semiconductor dehumidification module, and a humidification module are provided in the air duct. The control method includes: S100: acquiring the actual temperature and actual humidity inside the inner liner; S200: controlling the operating parameters of the semiconductor temperature control module and the first fan according to the deviation of the actual temperature value from the target temperature value to adjust the temperature inside the inner liner; S300: controlling the operating parameters of the semiconductor dehumidification module or the humidification module and the first fan according to the deviation of the actual humidity value from the target humidity value to adjust the humidity inside the inner liner. By adopting the above technical solution, the present invention can effectively solve the technical problems of high noise and vibration, insufficient control accuracy, and poor long-term operational stability in constant temperature and humidity chambers. Specifically, the device of the present invention uses semiconductor components such as semiconductor temperature control module and semiconductor dehumidification module. These components are relatively quiet during operation and do not have the violent movement of traditional mechanical parts, thereby effectively reducing the noise and vibration of the device during operation. By controlling the operating parameters of multiple functional modules at the same time, the temperature and humidity can be regulated, and the device can respond more accurately to the deviation of the actual temperature and humidity from the target value, thereby greatly improving the control accuracy of the device for temperature and humidity.

[0018] Further, step S200 specifically includes: when the actual temperature is lower than the target temperature value minus the first allowable deviation, controlling the semiconductor temperature control module to execute the heating mode, and correspondingly increasing the operating power of the semiconductor temperature control module and the speed of the first fan according to the degree of negative temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module and the speed of the first fan is positively correlated with the degree of negative temperature deviation; and / or, when the actual temperature is higher than the target temperature value plus the first allowable deviation, controlling the semiconductor temperature control module to execute the cooling mode, and correspondingly increasing the operating power of the semiconductor temperature control module and the speed of the first fan according to the degree of positive temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module and the speed of the first fan is positively correlated with the degree of positive temperature deviation. Through this setting, the cooling or heating capacity and air circulation speed can be precisely adjusted. This avoids over-adjustment or under-adjustment, and can stably control the temperature inside the liner within a small range near the target temperature, improving the accuracy of temperature control.

[0019] Furthermore, step S300 specifically includes: when the actual humidity is lower than the target humidity value minus a second allowable deviation, activating the humidification module, and determining the operating power of the humidification module and correspondingly increasing the speed of the first fan based on the degree of negative humidity deviation; wherein, the operating power of the humidification module is positively correlated with the degree of negative humidity deviation, and the increase in the speed of the first fan is positively correlated with the degree of negative humidity deviation; and / or, when the actual humidity is higher than the target humidity value plus the second allowable deviation, activating the semiconductor dehumidification module, and determining the operating power of the semiconductor dehumidification module and correspondingly increasing the speed of the first fan based on the degree of positive humidity deviation; the operating power of the semiconductor dehumidification module is positively correlated with the degree of positive humidity deviation, and the increase in the speed of the first fan is positively correlated with the degree of positive humidity deviation. This setting avoids humidity overshoot or excessive fluctuations, achieving precise humidity control.

[0020] Furthermore, the present invention includes multiple return air vents, each equipped with a first fan, and multiple semiconductor temperature control modules. When the actual temperature value is between the target temperature value minus a first allowable deviation and the target temperature value plus a first allowable deviation, and when the actual humidity value is between the target humidity value minus a second allowable deviation and the target humidity value plus a second allowable deviation, the control method further includes: controlling the multiple semiconductor temperature control modules to operate at an evenly distributed maintenance power, and controlling the multiple first fans to operate at an evenly distributed maintenance speed; and stopping the semiconductor dehumidification module and humidification module. This arrangement avoids significant noise caused by high-power operation of individual modules, improving the overall quietness of the equipment. Attached Figure Description

[0021] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which: Figure 1 This is an isometric view of the constant temperature and humidity equipment of the present invention; Figure 2 This is a rear view of the constant temperature and humidity device of the present invention; Figure 3 This is a cross-sectional view of the constant temperature and humidity device of the present invention; Figure 4 This is an isometric view of the semiconductor temperature control module of the present invention; Figure 5 This is a rear view of the semiconductor temperature control module of the present invention; Figure 6 This is an isometric view of the semiconductor dehumidification module of the present invention; Figure 7 This is a rear view of the semiconductor dehumidification module of the present invention; Figure 8 This is a schematic diagram of the humidification module of the present invention; Figure 9This is a schematic flowchart of the control method for the constant temperature and humidity equipment of the present invention; Figure 10 This is a flowchart illustrating an embodiment of the control method for the constant temperature and humidity equipment of the present invention. Figure 1 ; Figure 11 This is a flowchart illustrating an embodiment of the control method for the constant temperature and humidity equipment of the present invention. Figure 2 ; Figure 12 This is a flowchart illustrating an embodiment of the control method for the constant temperature and humidity equipment of the present invention. Figure 3 .

[0022] List of reference numerals in the attached diagram: 1. Inner liner; 11. Storage space; 12. Return air vent; 13. Air inlet; 14. First fan; 2. Shell; 3. Air duct; 4. Semiconductor temperature control module; 41. First semiconductor chip; 42. Second fan; 43. First heat sink; 44. Heat exchange plate; 5. Semiconductor dehumidification module; 51. Second semiconductor chip; 52. Third fan; 53. Second heat sink; 54. Cold plate; 6. Humidification module; 61. PTC steam generator; 62. Water storage tank; 63. Water pump. Detailed Implementation

[0023] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the following embodiments are described in conjunction with a constant temperature and humidity chamber, the control method for the constant temperature and humidity equipment provided by the present invention is also applicable to other products that need to solve the technical problems of high noise and vibration, insufficient control accuracy, and poor long-term operational stability in constant temperature and humidity control.

[0024] It should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly, for example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] Based on the technical problems of existing constant temperature and humidity chambers, such as high noise and vibration, insufficient control precision, and poor long-term operational stability, as pointed out in the background art, this invention provides a control method for constant temperature and humidity equipment. The method aims to effectively solve these problems by dynamically adjusting a first fan, a semiconductor temperature control module, a dehumidification module, and / or a humidification module according to the deviations of the actual temperature and humidity values ​​from the target temperature and humidity values.

[0026] like Figures 1 to 3 As shown, the present invention provides a constant temperature and humidity device, which includes an inner liner 1 and a shell 2 surrounding the outer side of the inner liner 1. The inner liner 1 has a storage space 11. An air duct 3 is formed between the outer wall of the shell 2 and the outer wall of the inner liner 1. A return air inlet 12 communicating with the air duct 3 and an air inlet 13 communicating with the air duct 3 are provided on the wall of the inner liner 1. A first fan 14 is provided at the return air inlet 12 or in the air duct 3. A semiconductor temperature control module 4, a semiconductor dehumidification module 5 and a humidification module 6 are provided in the air duct 3.

[0027] The constant temperature and humidity equipment provided by this invention mainly consists of an inner liner 1 and a shell 2 surrounding the outer side of the inner liner 1. This structural design naturally forms an air duct 3 between the shell 2 and the outer wall of the inner liner 1. The air duct 3 plays an important role in airflow circulation during the operation of the equipment, providing a basic airflow path for subsequent temperature and humidity regulation.

[0028] A return air vent 12 and an air inlet 13 are formed on the wall of the inner liner 1, and both vents are connected to the air duct 3. A first fan 14 is installed at the return air vent 12 or a first fan 4 is installed in the air duct 3. The function of the first fan 14 is to promote the circulation of air between the air duct 3 and the inner liner 1. When the first fan 14 is started, it can draw air from the inner liner 1 into the air duct 3 through the return air vent 12, and at the same time, it can send the air processed by the air duct 3 back into the inner liner 1 through the air inlet 13, forming a complete airflow circulation system.

[0029] Preferably, such as Figure 3 As shown, the return air vent 12 of the present invention is opened on the back of the inner liner 1, the air inlet 13 is opened on the side of the inner liner 1, and the air duct 3 is configured to extend downward from the top of the back of the inner liner 1 to the bottom, then turn and extend horizontally along the bottom surface of the inner liner 1, and finally turn upward to the side of the inner liner 1.

[0030] The air duct 3 extends downward from the top back of the inner liner 1, making full use of gravity to allow air to flow naturally downward within the air duct 3, reducing energy consumption. Then it extends horizontally along the bottom surface, which can expand the air flow range at the bottom of the inner liner 1, ensuring that the temperature and humidity in the bottom area can also be effectively regulated. Finally, it turns upward to the side air inlet 13, which can evenly send the treated air into the inner liner 1, so that the air forms a good circulation path throughout the inner liner 1, improving the uniformity of temperature and humidity control.

[0031] Several key functional modules are installed in the air duct 3, including a semiconductor temperature control module 4, a semiconductor dehumidification module 5, and a humidification module 6. The semiconductor temperature control module 4 is mainly responsible for regulating the temperature. It uses the thermoelectric effect of semiconductors to achieve cooling or heating functions, thereby changing the temperature of the air passing through the air duct 3 and thus affecting the temperature inside the inner tank 1. The semiconductor dehumidification module 5 is used to reduce the humidity in the air. It achieves dehumidification through the principle of semiconductor cooling. The humidification module 6, on the other hand, is used to increase the humidity of the air. For example, it achieves the humidification effect by evaporating water into water vapor and mixing it into the air.

[0032] In addition, such as Figure 9 As shown, the present invention also provides a control method for a constant temperature and humidity device, comprising: S100: Obtain the actual temperature and humidity inside the inner liner 1; S200: Based on the degree of deviation of the actual temperature value from the target temperature value, control the operating parameters of the semiconductor temperature control module 4 and the operating parameters of the first fan 14 to adjust the temperature inside the inner liner 1. S300: Based on the degree of deviation of the actual humidity value from the target humidity value, control the operating parameters of the semiconductor dehumidification module 5 or the humidification module 6 and the operating parameters of the first fan 14 to adjust the humidity inside the inner tank 1.

[0033] For example, the present invention includes a temperature sensor and a humidity sensor inside the device, which can accurately acquire the actual temperature and humidity data inside the inner tank 1 in real time. This data is the basis for temperature and humidity regulation; only by accurately acquiring the current actual state can targeted regulation and control be carried out.

[0034] Traditional temperature and humidity chambers use large mechanical components such as compressors to regulate temperature and humidity, which generate significant noise and vibration during operation. In contrast, the device of this invention uses semiconductor components such as a semiconductor temperature control module 4 and a semiconductor dehumidification module 5. These components operate relatively quietly, without the violent movement of traditional mechanical parts, thus effectively reducing noise and vibration during operation and providing users with a quieter and more comfortable operating environment.

[0035] This invention achieves temperature and humidity regulation by simultaneously controlling the operating parameters of multiple functional modules. For example, during temperature regulation, the parameters of the semiconductor temperature control module 4 and the first fan 14 are controlled simultaneously; during humidity regulation, the parameters of the semiconductor dehumidification module 5, the humidification module 6, and the first fan 14 are comprehensively considered. This multi-parameter collaborative control method can more accurately respond to deviations between actual temperature and humidity and target values, making detailed adjustments according to different degrees of deviation, thereby greatly improving the equipment's control accuracy for temperature and humidity and better meeting the needs of various scenarios with strict environmental temperature and humidity requirements.

[0036] Furthermore, the present invention, through the above-mentioned control method, avoids problems such as excessive wear or performance fluctuations caused by improper parameter adjustment during equipment operation, enabling the equipment to maintain a stable operating state for a longer period of time, reducing maintenance costs and downtime, and improving the efficiency and reliability of the equipment.

[0037] Preferably, such as Figure 4 and Figure 5 As shown, the semiconductor temperature control module 4 includes a first semiconductor chip 41, a second fan 42, and a first heat sink 43 and a heat exchange plate 44 disposed on both sides of the first semiconductor chip 41; the heat exchange plate 44 is located inside the air duct 3, and the first heat sink 43 and the second fan 42 are located outside the housing 2. In step S200, "controlling the operating parameters of the semiconductor temperature control module 4" specifically includes: The operating power of the first semiconductor chip 41 and the speed of the second fan 42 in the semiconductor temperature control module 4 are controlled.

[0038] The first semiconductor chip 41 is the core component, utilizing the Peltier effect of semiconductor materials to achieve cooling or heating functions. The first heat sink 43 is located on both sides of the first semiconductor chip 41, its main function being to dissipate the heat generated by the first semiconductor chip 41 during operation, ensuring its normal and stable operation. The heat exchange plate 44 is located inside the air duct 3, and it is a key component for heat exchange with the air flowing in the air duct 3. The heat exchange plate 44 transfers the cooling or heating energy generated by the first semiconductor chip 41 to the air, thereby regulating the air temperature. The first heat sink 43 and the second fan 42 are located outside the housing 2. The function of the second fan 42 is to accelerate the airflow around the first heat sink 43, improving heat dissipation efficiency and ensuring that the first semiconductor chip 41 does not suffer performance degradation or even damage due to overheating.

[0039] By precisely controlling the operating power of the first semiconductor chip 41, the required cooling or heating energy can be generated quickly and accurately to meet the temperature regulation needs of the inner liner 1. At the same time, by reasonably controlling the speed of the second fan 42, the first semiconductor chip 41 is always in a good heat dissipation state, avoiding performance degradation due to overheating, thereby improving the working efficiency of the entire semiconductor temperature control module 4 and enabling the temperature inside the inner liner 1 to reach the target value more quickly.

[0040] Furthermore, properly controlling the speed of the second fan 42 can effectively reduce the noise generated during its operation. While meeting heat dissipation requirements, keeping the speed of the second fan 42 at a lower level reduces intense friction and turbulence between the blades and the air, thereby reducing aerodynamic noise, creating a quieter environment for the user, and improving the user experience.

[0041] Preferably, such as Figure 6 and Figure 7 As shown, the semiconductor dehumidification module 5 includes a second semiconductor chip 51, a third fan 52, and a second heat sink 53 and a cold guide plate 54 disposed on both sides of the second semiconductor chip 51; the cold guide plate 54 is located inside the air duct 3, and the second heat sink 53 and the third fan 52 are located outside the housing 2. In step S300, "controlling the operating parameters of the semiconductor dehumidification module 5" specifically includes: The operating power of the second semiconductor chip 51 and the speed of the third fan 52 in the semiconductor dehumidification module 5 are controlled.

[0042] The second semiconductor chip 51 also operates based on the Peltier effect of semiconductors. When current passes through the second semiconductor chip 51, one side cools and the other side heats. A cold-conducting plate 54 is located inside the air duct 3 and is connected to the cooling end of the second semiconductor chip 51, transferring the cooling energy generated by the second semiconductor chip 51 to the air flowing in the air duct 3. When air flows through the cold-conducting plate 54, water vapor in the air condenses into small water droplets upon cooling, thus achieving a dehumidification effect. The second heat sink 53 is installed on the heating end of the second semiconductor chip 51, and its function is to dissipate the heat generated by the heating end of the second semiconductor chip 51, ensuring that the second semiconductor chip 51 can operate continuously and stably. The third fan 52 is located outside the housing 2 and works in conjunction with the second heat sink 53. By accelerating the airflow around the second heat sink 53, it improves heat dissipation efficiency and prevents the second semiconductor chip 51 from being damaged due to overheating.

[0043] By precisely controlling the operating power of the second semiconductor chip 51, the dehumidification capacity can be flexibly adjusted according to the deviation between the actual humidity and the target humidity inside the inner tank 1. Reasonable control of the speed of the third fan 52 ensures that the second heat sink 53 can effectively dissipate the heat generated at the heating end of the second semiconductor chip 51. This prevents the second semiconductor chip 51 from degrading or being damaged due to overheating, extends its service life, and thus improves the stability and reliability of the entire semiconductor dehumidification module 5.

[0044] Furthermore, properly controlling the speed of the third fan 52 can effectively reduce the noise generated during its operation. While meeting heat dissipation requirements, keeping the speed of the third fan 52 at a lower level reduces intense friction and turbulence between the blades and the air, thereby reducing aerodynamic noise, creating a quieter environment for the user, and improving the user experience.

[0045] Preferably, such as Figure 8 As shown, the humidification module 6 includes a PTC steam generator 61, a water storage tank 62, and a water pump 63. The PTC steam generator 61 has a steam port connected to the air duct 3. The water pump 63 is used to transport water from the water storage tank 62 to the PTC steam generator 61. In step S300, "controlling the operating parameters of the humidification module 6" specifically includes: Control the operating power of PTC steam generator 61.

[0046] The PTC steam generator 61 utilizes the characteristics of a PTC (Positive Temperature Coefficient) thermistor to generate steam. The PTC element has an automatic constant-temperature heating function; when current flows through it, its resistance increases with temperature, thus limiting further current increases and ensuring relatively stable heating power. This allows for the safe and stable conversion of water into steam. The PTC steam generator 61 has a steam port connected to the air duct 3. The generated steam enters the air duct 3 through this port and is transported to the inner tank 1 along with the airflow within the air duct 3, thereby humidifying the air in the inner tank 1.

[0047] By precisely controlling the operating power of the PTC steam generator 61, the amount of humidification can be accurately controlled according to the degree of deviation between the actual humidity inside the inner tank 1 and the target humidity.

[0048] Preferably, such as Figure 2 , Figure 3 and Figure 10 As shown, step S200 specifically includes: When the actual temperature is lower than the target temperature value minus the first allowable deviation, the semiconductor temperature control module 4 is controlled to execute the heating mode, and the operating power of the semiconductor temperature control module 4 and the speed of the first fan 14 are increased accordingly based on the degree of negative temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module 4 and the speed of the first fan 14 is positively correlated with the degree of negative temperature deviation. When the actual temperature is higher than the target temperature plus the first allowable deviation, the semiconductor temperature control module 4 is controlled to execute the cooling mode, and the operating power of the semiconductor temperature control module 4 and the speed of the first fan 14 are increased accordingly based on the degree of positive temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module 4 and the speed of the first fan 14 is positively correlated with the degree of positive temperature deviation.

[0049] By incorporating a semiconductor temperature control module 4 and a first fan 14, and employing a control strategy that dynamically adjusts the operating power and speed based on the degree of temperature deviation, the system can react quickly when temperature deviations occur. When the temperature is too low or too high, the semiconductor temperature control module 4 increases its power output according to the degree of deviation, while the first fan 14 increases its speed to accelerate air circulation, allowing cold or heat to be transferred to every corner of the inner liner 1 more quickly, greatly shortening the temperature adjustment time and improving the equipment's response speed.

[0050] The operating power of the semiconductor temperature control module 4 and the speed increase of the first fan 14 are positively correlated with the degree of temperature deviation. This precise control method can accurately adjust the cooling or heating capacity and air circulation speed according to the deviation between the actual temperature and the target temperature. This avoids over-adjustment or under-adjustment, and can stably control the temperature inside the inner liner 1 within a small range near the target temperature, improving the accuracy of temperature control and meeting the storage needs of items with high temperature requirements.

[0051] Preferably, multiple semiconductor temperature control modules 4 are provided. During the process of "controlling all semiconductor temperature control modules 4 to execute heating mode" or "controlling all semiconductor temperature control modules 4 to execute cooling mode", the control method further includes: Obtain the first total power required for operation of multiple semiconductor temperature control modules 4; The first total power is evenly distributed to each semiconductor temperature control module 4 so that the multiple semiconductor temperature control modules 4 operate according to the evenly distributed power. Multiple return air vents 12 are provided, and a first fan 14 is installed at each of the multiple return air vents 12. During the operation of the multiple first fans 14, the control method also includes: Obtain the second total power required for the operation of multiple first wind turbines 14; The second total power is evenly distributed to each of the first fans 14 so that the multiple first fans 14 operate at the power after the average distribution.

[0052] One of the main sources of noise is the aerodynamic noise and mechanical vibration noise generated when the fan rotates. This invention evenly distributes the first total power required by multiple semiconductor temperature control modules 4 and the second total power required by multiple first fans 14, thereby reducing the power borne by each semiconductor temperature control module 4 and each first fan 14. With the power reduced, the rotational speed of the second fan 42 in the semiconductor temperature control module 4 and each first fan 14 decreases accordingly. According to aerodynamic principles, fan speed is positively correlated with noise intensity; reducing the speed reduces the eddies and turbulence generated when the fan blades cut through the air, thus significantly reducing aerodynamic noise. Simultaneously, the reduced speed also reduces the vibration of mechanical components such as fan bearings, thus reducing mechanical vibration noise.

[0053] Furthermore, during equipment operation, the simultaneous operation of multiple fans can create a noise superposition effect. If the power and speed of each fan are uneven, the noise frequencies and intensities produced by different fans will differ, and their superposition can result in more complex and harsher noise. By distributing power evenly, the speed and operating status of each fan become more consistent, and the frequency and intensity of the noise become more uniform, reducing noise superposition and mutual interference, and further lowering the overall noise level.

[0054] Preferably, such as Figure 2 , Figure 3 and Figure 11 As shown, step S300 specifically includes: When the actual humidity is lower than the target humidity value minus the second allowable deviation, the humidification module 6 is activated, and the operating power of the humidification module 6 is determined according to the degree of negative humidity deviation, and the speed of the first fan 14 is increased accordingly; wherein, the operating power of the humidification module 6 is positively correlated with the degree of negative humidity deviation, and the increase in the speed of the first fan 14 is positively correlated with the degree of negative humidity deviation. When the actual humidity is higher than the target humidity value plus the second allowable deviation, the semiconductor dehumidification module 5 is activated, and the operating power of the semiconductor dehumidification module 5 is determined according to the degree of positive humidity deviation, and the speed of the first fan 14 is increased accordingly. The operating power of the semiconductor dehumidification module 5 is positively correlated with the degree of deviation from the positive humidity, and the increase in the rotational speed of the first fan 14 is positively correlated with the degree of deviation from the positive humidity.

[0055] By adjusting the operating power of the humidification module 6 and the semiconductor dehumidification module 5, as well as the rotation speed of the first fan 14, according to the degree of negative and positive humidity deviation, the equipment can quickly respond to changes in humidity inside the inner tank 1. When the humidity deviates significantly from the target value, the adjustment intensity is increased to quickly bring the humidity closer to the target value; when the humidity is close to the target value, the adjustment intensity is reduced to avoid overshooting or excessive fluctuations in humidity, thus achieving precise humidity control.

[0056] Preferably, multiple return air vents 12 are provided, and a first fan 14 is respectively provided at each of the multiple return air vents 12. During the operation of the multiple first fans 14, the control method further includes: Obtain the second total power required for the operation of multiple first wind turbines 14; The second total power is evenly distributed to each of the first fans 14 so that the multiple first fans 14 operate according to the evenly distributed power. Multiple semiconductor dehumidification modules 5 are provided. When multiple semiconductor dehumidification modules 5 are started and running, the control method also includes: Obtain the third total power required for the operation of multiple semiconductor dehumidification modules 5; The third total power is evenly distributed to each semiconductor dehumidification module 5 so that the multiple semiconductor dehumidification modules 5 operate according to the evenly distributed power.

[0057] Multiple return air vents 12 can draw air from different positions in the inner liner 1, making air circulation more comprehensive and avoiding local air stagnation. The first fan 14 is responsible for drawing air from the return air vents 12 into the air duct 3, accelerating the air flow between the inner liner 1 and the air duct 3, ensuring smooth air circulation, and providing a good air flow basis for humidity regulation.

[0058] Each of the 12 return air vents is equipped with a primary fan 14, forming a multi-fan collaborative operation mode. Compared to a single high-power fan, multiple low-power fans can distribute the workload. Each fan does not need to undertake an excessive air circulation task, and therefore can operate at relatively low and reasonable power and speed.

[0059] This invention is equipped with multiple semiconductor dehumidification modules 5. The semiconductor dehumidification modules 5 utilize the thermoelectric effect of semiconductors to achieve dehumidification; the coordinated operation of multiple modules enhances dehumidification capacity. When high humidity requires rapid dehumidification, multiple modules can operate simultaneously to improve dehumidification efficiency; when humidity is close to the target value, fine dehumidification can be achieved by adjusting the operating power of each module.

[0060] This invention evenly distributes the second total power required by multiple first fans 14 and the third total power required by multiple semiconductor dehumidification modules 5, thereby reducing the power borne by each first fan 14 and semiconductor dehumidification module 5. With the power reduced, the fan speed will decrease accordingly based on the relationship between fan speed and power. Aerodynamic noise is proportional to the cube of the fan speed; reducing the speed reduces the eddies and turbulence generated when the fan blades cut through the air, thus significantly reducing aerodynamic noise. Simultaneously, the reduced speed also reduces the vibration of mechanical components such as fan bearings, lowering mechanical vibration noise.

[0061] Furthermore, during equipment operation, the simultaneous operation of multiple fans can create a noise superposition effect. If the power and speed of each fan are uneven, the noise frequencies and intensities produced by different fans will differ, and their superposition can result in more complex and harsher noise. By distributing power evenly, the speed and operating status of each fan become more consistent, and the frequency and intensity of the noise become more uniform, reducing noise superposition and mutual interference, and further lowering the overall noise level.

[0062] Preferably, such as Figure 2 , Figure 3 and Figure 12 As shown, multiple return air vents 12 are provided, and a first fan 14 is respectively provided at each of the multiple return air vents 12. Multiple semiconductor temperature control modules 4 are provided. When the actual temperature value is between the target temperature value minus the first allowable deviation and the target temperature value plus the first allowable deviation, and when the actual humidity is between the target humidity value minus the second allowable deviation and the target humidity value plus the second allowable deviation, the control method further includes: Multiple semiconductor temperature control modules 4 are controlled to operate with an evenly distributed maintenance power, and multiple first fans 14 are controlled to operate with an evenly distributed maintenance speed. This stops the semiconductor dehumidification module 5 and the humidification module 6 from operating.

[0063] This invention enables multiple semiconductor temperature control modules 4 to operate with an evenly distributed maintenance power. Evenly distributed maintenance power means that the total power required to maintain the current suitable temperature is evenly distributed to each semiconductor temperature control module 4, so that each module operates with a lower power and only serves to maintain the current temperature stability.

[0064] Multiple first fans 14 are controlled to operate at an evenly distributed maintenance speed. Similarly, the speed required to maintain air circulation and uniform temperature distribution is evenly distributed to each first fan 14, allowing them to operate at a lower speed.

[0065] The first fan 14 operates at a relatively low, evenly distributed speed. The noise generated by the fan is primarily related to its speed; reducing the speed significantly decreases both aerodynamic and mechanical vibration noise. Similarly, the semiconductor temperature control module 4 operates at a relatively low, evenly distributed power, reducing the workload of its internal cooling or heating elements. Consequently, the speed of the corresponding fan (second fan 42) also decreases, further reducing the noise generated during the module's operation. The uniform low-power operation of multiple modules avoids the significant noise generated by individual modules operating at high power, further improving the overall noise reduction effect.

[0066] In addition, the constant temperature and humidity device of the present invention also includes a controller, which is configured to execute the control method described above.

[0067] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A control method for a constant temperature and humidity device, characterized in that, The constant temperature and humidity equipment includes an inner liner (1) and a shell (2) surrounding the outer side of the inner liner (1). The inner liner (1) has a storage space (11). An air duct (3) is formed between the shell (2) and the outer wall of the inner liner (1). A return air inlet (12) communicating with the air duct (3) and an air inlet (13) communicating with the air duct (3) are provided on the wall of the inner liner (1). A first fan (14) is provided at the return air inlet (12) or in the air duct (3). A semiconductor temperature control module (4), a semiconductor dehumidification module (5), and a humidification module (6) are provided in the air duct (3). The control method includes: S100: Obtain the actual temperature and humidity inside the inner liner (1); S200: Based on the degree of deviation of the actual temperature value from the target temperature value, control the operating parameters of the semiconductor temperature control module (4) and the operating parameters of the first fan (14) to adjust the temperature inside the inner liner (1); S300: Based on the degree of deviation of the actual humidity value from the target humidity value, control the operating parameters of the semiconductor dehumidification module (5) or the humidification module (6) and the operating parameters of the first fan (14) to adjust the humidity inside the inner tank (1).

2. The control method for the constant temperature and humidity equipment according to claim 1, characterized in that, Step S200 specifically includes: When the actual temperature is lower than the target temperature value minus the first allowable deviation, the semiconductor temperature control module (4) is controlled to execute the heating mode, and the operating power of the semiconductor temperature control module (4) and the speed of the first fan (14) are increased accordingly based on the degree of negative temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module (4) and the speed of the first fan (14) is positively correlated with the degree of negative temperature deviation; and / or When the actual temperature is higher than the target temperature plus a first allowable deviation, the semiconductor temperature control module (4) is controlled to execute the cooling mode, and the operating power of the semiconductor temperature control module (4) and the speed of the first fan (14) are increased accordingly based on the degree of positive temperature deviation; wherein, the increase in the operating power of the semiconductor temperature control module (4) and the speed of the first fan (14) is positively correlated with the degree of positive temperature deviation.

3. The control method for the constant temperature and humidity equipment according to claim 2, characterized in that, The semiconductor temperature control module (4) is provided in multiple forms. During the process of "controlling all semiconductor temperature control modules (4) to execute heating mode" or "controlling all semiconductor temperature control modules (4) to execute cooling mode", the control method further includes: Obtain the first total power required for operation of the multiple semiconductor temperature control modules (4); The first total power is evenly distributed to each of the semiconductor temperature control modules (4) so ​​that the plurality of semiconductor temperature control modules (4) operate according to the evenly distributed power; and / or Multiple return air inlets (12) are provided, and each return air inlet (12) is equipped with a first fan (14). During the operation of the multiple first fans (14), the control method further includes: Obtain the second total power required for the operation of multiple first fans (14); The second total power is evenly distributed to each of the first fans (14) so ​​that the plurality of first fans (14) operate at the power after the average distribution.

4. The control method for the constant temperature and humidity equipment according to claim 1, characterized in that, Step S300 specifically includes: When the actual humidity is lower than the target humidity value minus the second allowable deviation, the humidification module (6) is activated, and the operating power of the humidification module (6) is determined according to the degree of negative humidity deviation, and the speed of the first fan (14) is increased accordingly; wherein, the operating power of the humidification module (6) is positively correlated with the degree of negative humidity deviation, and the increase in the speed of the first fan (14) is positively correlated with the degree of negative humidity deviation; and / or When the actual humidity is higher than the target humidity value plus the second allowable deviation, the semiconductor dehumidification module (5) is activated, and the operating power of the semiconductor dehumidification module (5) is determined according to the degree of positive humidity deviation, and the speed of the first fan (14) is increased accordingly. The operating power of the semiconductor dehumidification module (5) is positively correlated with the degree of positive humidity deviation, and the increase in the rotational speed of the first fan (14) is positively correlated with the degree of positive humidity deviation.

5. The control method for the constant temperature and humidity equipment according to claim 4, characterized in that, Multiple return air inlets (12) are provided, and each return air inlet (12) is equipped with a first fan (14). During the operation of the multiple first fans (14), the control method further includes: Obtain the second total power required for the operation of multiple first fans (14); The second total power is evenly distributed to each of the first fans (14) so ​​that the plurality of first fans (14) operate at the power after the average distribution; and / or The semiconductor dehumidification module (5) is provided in multiple ways. When multiple semiconductor dehumidification modules (5) are started and running, the control method further includes: Obtain the third total power required for the operation of the multiple semiconductor dehumidification modules (5); The third total power is evenly distributed to each of the semiconductor dehumidification modules (5) so that the multiple semiconductor dehumidification modules (5) operate according to the evenly distributed power.

6. The control method for the constant temperature and humidity equipment according to claim 1, characterized in that, Multiple return air vents (12) are provided, and the first fan (14) is respectively provided at each of the multiple return air vents (12). Multiple semiconductor temperature control modules (4) are provided. When the actual temperature value is between the target temperature value minus the first allowable deviation and the target temperature value plus the first allowable deviation, and when the actual humidity is between the target humidity value minus the second allowable deviation and the target humidity value plus the second allowable deviation, the control method further includes: Control the multiple semiconductor temperature control modules (4) to operate with an evenly distributed maintenance power, and control the multiple first fans (14) to operate with an evenly distributed maintenance speed; The semiconductor dehumidification module (5) and the humidification module (6) are stopped from operating.

7. The control method for a constant temperature and humidity equipment according to any one of claims 1 to 6, characterized in that, The semiconductor temperature control module (4) includes a first semiconductor chip (41), a second fan (42), and a first heat sink (43) and a heat exchange plate (44) disposed on both sides of the first semiconductor chip (41); the heat exchange plate (44) is located inside the air duct (3), and the first heat sink (43) and the second fan (42) are located outside the housing (2). In step S200, "controlling the operating parameters of the semiconductor temperature control module (4)" specifically includes: Control the operating power of the first semiconductor chip (41) and the rotation speed of the second fan (42) in the semiconductor temperature control module (4).

8. The control method for a constant temperature and humidity equipment according to any one of claims 1 to 6, characterized in that, The semiconductor dehumidification module (5) includes a second semiconductor chip (51), a third fan (52), and a second heat sink (53) and a cooling plate (54) disposed on both sides of the second semiconductor chip (51); the cooling plate (54) is located inside the air duct (3), and the second heat sink (53) and the third fan (52) are located outside the housing (2). In step S300, "controlling the operating parameters of the semiconductor dehumidification module (5)" specifically includes: Control the operating power of the second semiconductor chip (51) in the semiconductor dehumidification module (5) and the rotation speed of the third fan (52).

9. The control method for a constant temperature and humidity equipment according to any one of claims 1 to 6, characterized in that, The humidification module (6) includes a PTC steam generator (61), a water storage tank (62), and a water pump (63). The PTC steam generator (61) has a steam port connected to the air duct (3). The water pump (63) is used to transport water from the water storage tank (62) to the PTC steam generator (61). In step S300, "controlling the operating parameters of the humidification module (6)" specifically includes: Control the operating power of the PTC steam generator (61).

10. A constant temperature and humidity device, characterized in that, Includes a controller configured to perform the control method according to any one of claims 1 to 9.

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