Electrolytic copper foil raised grain abnormity eliminating device and method

Abstract

The invention discloses an electrolytic copper foil raised grain abnormity eliminating device and method.The electrolytic copper foil raised grain abnormity eliminating device comprises an electrolytic bath, an anode plate is laid at the bottom of the electrolytic bath, a liquid outlet is formed in one end of the electrolytic bath, and a lower inserting plate or an upper inserting plate is installed at the position, connected with the anode plate, of the liquid outlet; or an upper inserting plate is installed on the upper side of the lower inserting plate while the lower inserting plate is installed, an acid spraying pipe fitting corresponding to the liquid outlet is arranged on the upper side of the electrolytic tank, a spraying opening of the acid spraying pipe fitting faces the titanium roller in the electrolytic tank, and the acid spraying effect is improved through selective combined installation of the upper inserting plate and the lower inserting plate in cooperation with directional spraying of the acid spraying pipe fitting. The edge point discharge effect and liquid level fluctuation caused by raised grains are specifically solved, the liquid level height can be increased through the upper inserting plate, and the lower inserting plate can shield and disperse an electric field. The method can solve the problem that the unusual smooth surface / rough surface raised grains of the existing electrolytic copper foil are difficult to effectively eliminate and stably control for a long time.

Description

Technical Field

[0001] This invention relates to the field of electrolytic copper foil manufacturing equipment technology, specifically to a device and method for eliminating abnormal wavy patterns on electrolytic copper foil. Background Technology

[0002] During the production of electrolytic copper foil, wavy surface defects are prone to appear on both smooth and rough surfaces. These defects severely affect the appearance quality and subsequent processing compatibility of the copper foil, particularly impacting the application of high-end electronic circuit copper foil such as HTE and RTF, as well as lithium battery copper foil. Currently, the industry lacks unified control standards for these surface defects and systematic, structured improvement methods. Existing technologies largely rely on passive, trial-and-error adjustments based on on-site experience, primarily including adding different types or batches of additives such as HX series defoamers, spraying acid after startup, installing inserts, and adjusting the liquid inlet flow rate.

[0003] However, these existing methods have significant shortcomings: First, there is no standardized process to follow, the improvement effect is unstable and has poor repeatability, and the adjustment results vary greatly among different operators and different production lines; Second, there is a lack of clear mechanistic support and structured intervention methods, which can only temporarily alleviate the abnormality and cannot fundamentally solve the core problem of wavy pattern generation caused by the coupling of "edge tip discharge effect" and "liquid surface fluctuation"; Third, no equipment-based, replicable and scalable solution has been formed, and the adaptability between different production lines and different products varies greatly, resulting in the repeated occurrence of wavy pattern abnormalities.

[0004] In summary, the industry currently lacks a systematic approach to identifying, structurally intervening in, and standardizing the control of surface texture anomalies (both smooth and matte). There is an urgent need for a device with stable structure, adjustable parameters, and strong adaptability, along with corresponding usage methods, to effectively eliminate and maintain long-term stable control of this type of surface quality anomaly, thereby meeting the production quality requirements of different types of copper foil. Summary of the Invention

[0005] This invention provides a device and method for eliminating wavy texture abnormalities on electrolytic copper foil, which can solve the problem that existing electrolytic copper foil surface wavy texture abnormalities are difficult to effectively eliminate and maintain stable control over a long period of time.

[0006] To achieve the above objectives, in a first aspect, the present invention provides the following technical solution: a device for eliminating wavy abnormalities in electrolytic copper foil, comprising an electrolytic cell, an anode plate laid at the bottom of the electrolytic cell, an outlet at one end of the electrolytic cell, a lower insert plate or an upper insert plate installed at the position where the outlet connects with the anode plate, or an upper insert plate installed on the upper side of the lower insert plate while installing the lower insert plate, and an acid spraying pipe corresponding to the outlet provided on the upper side of the electrolytic cell, the nozzle of the acid spraying pipe facing the titanium roller in the electrolytic cell. Through the selective combination of the upper and lower insert plates, and in conjunction with the directional spraying of the acid spraying pipe, the device specifically solves the edge tip discharge effect and liquid surface fluctuation that cause wavy patterns. The upper insert plate can raise the liquid level, the lower insert plate can shield and disperse the electric field, and the acid spraying pipe can clean the titanium roller and counteract liquid splashing. The three work together to achieve efficient elimination of wavy patterns. The device has a simple structure, is compatible with existing electrolytic cell equipment, does not require large-scale modification of the original production line, has strong compatibility, and can be quickly deployed and applied.

[0007] Preferably, the height of the upper insert plate is 2-15cm, and the height of the lower insert plate is 1.5-8cm. This height range covers different copper foil types and addresses the need for improving waviness. Specifically, an upper insert plate height of 2-6cm is suitable for producing HTE foil with specific physical property requirements, while 7-15cm is suitable for producing RTF foil without such requirements. A lower insert plate height of 1.5-3cm can assist in enhancing the elimination of waviness on the smooth surface of HTE foil, while 4-8cm meets the need for improving the depth of waviness on the rough surface of RTF foil. This adjustable height design allows the device to adapt to the production of copper foils with thicknesses ranging from 12 to 105μm, avoiding the impact of variations in electric field distribution and liquid surface stability caused by differences in copper foil thickness on the waviness elimination effect, thus improving the device's adaptability.

[0008] Preferably, the flow rate adjustment range of the acid spraying fitting is 0.5-2.5L / min. The flow rate range is precisely matched to different wavy pattern elimination requirements. Specifically, 0.5L / min can slightly improve smooth and rough surface wavy patterns; 1.0-1.4L / min can completely eliminate smooth surface wavy patterns; and 1.5-2.5L / min can completely eliminate both smooth and rough surface wavy patterns at the same time.

[0009] Preferably, both the upper and lower insert plates are L-shaped elongated structures. The L-shaped structure facilitates the individual installation or stacking of the upper and lower insert plates. The elongated structure ensures that the insert plates cover the entire length of the titanium roller outlet, making the electric field distribution and liquid level height uniform in the width direction of the copper foil, avoiding local wavy residue, and improving the uniformity of the copper foil surface quality.

[0010] Preferably, when the upper and lower insert plates are installed simultaneously, the horizontal portions of the upper and lower insert plates are close together and fixed to the liquid outlet by through screws. The screw fixing method ensures that the upper and lower insert plates are firmly installed, avoiding relative displacement or detachment of the insert plates under the conditions of liquid impact from the electrolytic cell outlet and electrolyte flow driven by the rotation of the titanium roller, thus ensuring the stability of the intervention effect.

[0011] Preferably, the upper insert plate has multiple reinforcing plates along its length on the side away from the titanium roller. The reinforcing plates can enhance the structural strength of the upper insert plate, especially for upper insert plates with a height of ≥6cm, to avoid deformation and bending of the vertical section caused by the weight of the insert plate itself and the impact of the electrolyte, thus ensuring the accuracy of the insert plate height and maintaining the stability of the liquid level lifting effect.

[0012] Secondly, a method of using the electrolytic copper foil wavy texture elimination device according to the first aspect includes the following steps: Based on the type and quality requirements of the copper foil to be produced, select upper and lower insert plates of different heights, and determine whether to open the acid spraying pipe and the flow rate of the acid spraying pipe. Specifically, this is divided into: If the copper foil to be produced is HTE foil with physical property requirements, and it is necessary to eliminate the wavy texture on the smooth surface, then close the acid spraying pipe and select an upper insert plate with a height ≤6cm and a lower insert plate with a height ≤3cm. If the copper foil to be produced is HTE foil with no physical property requirements, open the acid spraying pipe with a flow rate ≥1.5L / min, and select an upper insert plate with a height ≤6cm and a lower insert plate with a height ≤3cm to completely eliminate the rough surface water ripples. If the copper foil to be produced is RTF foil without physical property requirements, and it is necessary to eliminate the rough surface wavy texture, then select an upper insert plate with a height ≥10cm, or a lower insert plate with a height ≥6cm, or install an upper insert plate and add a lower insert plate to a height ≥12cm.

[0013] The above-mentioned solution allows for the design and application of solutions based on copper foil type and physical property requirements, which is highly targeted and avoids problems such as poor results or unqualified physical properties caused by blind adjustments. It also clarifies the quantitative parameters of the insertion plate height and acid spraying flow rate, forming a standardized operating procedure to replace traditional experience-based adjustments, improve the repeatability and stability of the wavy pattern elimination effect, and facilitates replication and promotion on multiple production lines.

[0014] Preferably, the physical properties include room temperature tensile strength, high temperature tensile strength, high temperature elongation, and rate of change.

[0015] Compared with the prior art, the beneficial effects of the present invention are: By selectively combining upper and lower insert plates and using directional spraying of acid spraying pipes, the device effectively addresses the edge-tip discharge effect and liquid surface fluctuations that cause wavy patterns. The upper insert plate raises the liquid level, the lower insert plate shields and disperses the electric field, and the acid spraying pipes clean the titanium rollers and counteract liquid splashing. These three elements work together to efficiently eliminate wavy patterns. The device has a simple structure, is compatible with existing electrolytic cell equipment, requires no large-scale modification to the original production line, has strong compatibility, and can be quickly deployed. Multiple verifications have shown that the wavy pattern on the smooth surface has been improved from a full-surface distribution to scattered crescent-shaped patterns, and the abnormal degradation rate has decreased by more than 90%. After the device adjustment, the wavy pattern abnormality recurrence rate is less than 1%, achieving long-term stable production. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a front sectional view of the present invention; Figure 3 for Figure 2 Enlarged structural diagram at point A.

[0017] Figure label: 1. Electrolytic cell, 2. Anode plate, 3. Liquid outlet, 4. Acid spraying pipe fitting, 5. Upper insert plate, 6. Lower insert plate, 7. Titanium roller, 8. Screw, 9. Reinforcing plate. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0019] like Figure 1-3 As shown, this invention provides a technical solution to address the problem of effectively eliminating and maintaining long-term stable control of abnormal wavy patterns on the smooth / rough surface of existing electrolytic copper foils: an electrolytic copper foil wavy pattern elimination device, comprising an electrolytic cell 1, an anode plate 2 laid at the bottom of the electrolytic cell 1, and an outlet 3 at one end of the electrolytic cell 1. A lower insert plate 6 or an upper insert plate 5 is installed on the outlet 3 at a position where it connects with the anode plate 2, or an upper insert plate 5 is installed on the upper side of the lower insert plate 6 while the lower insert plate 6 is installed. A corresponding surface is provided on the upper side of the electrolytic cell 1 for the outlet 3. The acid spraying fitting 4 has its nozzle facing the titanium roller 7 in the electrolytic cell 1. Through selective combination installation of the upper insert plate 5 and the lower insert plate 6, and in conjunction with the directional spraying of the acid spraying fitting 4, it specifically solves the edge tip discharge effect and liquid surface fluctuation that cause wavy patterns. The upper insert plate 5 can increase the liquid level, the lower insert plate 6 can shield and disperse the electric field, and the acid spraying fitting 4 can clean the titanium roller and counteract liquid splashing. The three work together to achieve efficient elimination of wavy patterns. The device has a simple structure, is compatible with existing electrolytic cell equipment, does not require large-scale modification of the original production line, has strong compatibility, and can be quickly deployed and applied.

[0020] The wavy pattern (crescent-shaped pattern, water ripple pattern) on the surface of electrolytic copper foil is essentially caused by the superposition of two issues: 1. Edge tip discharge effect: The electric field at the edge of the titanium roller is more concentrated than in the middle, resulting in uneven deposition rate of metal ions at the edge of the copper foil, forming irregular patterns; 2. Liquid surface fluctuation: When the titanium roller rotates, the electrolyte splashes and the liquid surface is unstable. The electrolyte is imprinted on the copper foil surface like ripples on water, which aggravates the formation of texture.

[0021] The upper plate 5 serves to raise the liquid level and homogenize the electric field, while the lower plate 6 serves to shield the electric field and extend the cleaning path. Specifically, the acid spraying pipe 4 is installed and fixed on the upper side of the electrolytic cell 1 by the acid spraying pipe fixing bracket. The nozzle of the acid spraying pipe 4 faces the titanium roller 7 inside the electrolytic cell 1, and the vertical distance between the nozzle and the surface of the titanium roller is 15cm.

[0022] In this embodiment, the height of the upper insert plate 5 is 2-15cm, and the height of the lower insert plate 6 is 1.5-8cm. This height range covers different copper foil types and addresses the need for improving waviness. Specifically, the upper insert plate 5, with a height of 2-6cm, is suitable for producing HTE foil with specific physical property requirements, while 7-15cm is suitable for producing RTF foil without such requirements. The lower insert plate 6, with a height of 1.5-3cm, can assist in enhancing the elimination of waviness on the smooth surface of HTE foil, while 4-8cm meets the need for improving the depth of waviness on the rough surface of RTF foil. This adjustable height design allows the device to adapt to the production of copper foils with thicknesses ranging from 12 to 105μm, avoiding the impact of changes in electric field distribution and liquid surface stability caused by differences in copper foil thickness on the waviness elimination effect, thus improving the device's adaptability.

[0023] In this embodiment, the flow rate adjustment range of the acid spraying fitting 4 is 0.5-2.5L / min. The flow rate range is precisely matched to different wavy texture elimination requirements. Specifically, 0.5L / min can slightly improve smooth and rough surface wavy textures; 1.0-1.4L / min can completely eliminate smooth surface wavy textures; and 1.5-2.5L / min can simultaneously and completely eliminate both smooth and rough surface wavy textures.

[0024] In this embodiment, both the upper insert plate 5 and the lower insert plate 6 are L-shaped long strip structures. The L-shaped structure facilitates the individual installation or stacking of the upper insert plate 5 and the lower insert plate 6. The long strip structure ensures that the insert plate covers the entire length of the titanium roller outlet, making the electric field distribution and liquid level height uniform in the width direction of the copper foil, avoiding local wavy residual patterns, and improving the uniformity of the copper foil surface quality.

[0025] In this embodiment, when the upper insert plate 5 and the lower insert plate 6 are installed simultaneously, the horizontal parts of the upper insert plate 5 and the lower insert plate 6 are close together and fixed to the liquid outlet 3 by the through screws 8. The screw fixing method ensures that the upper and lower insert plates are installed firmly, and avoids relative displacement or falling off of the insert plates under the conditions of liquid impact from the electrolytic cell and electrolyte flow driven by the rotation of the titanium roller, thus ensuring the stability of the intervention effect.

[0026] In this embodiment, multiple reinforcing plates 9 are arranged along the length direction on the side of the upper insert plate 5 away from the titanium roller 7. The reinforcing plates 9 can enhance the structural strength of the upper insert plate, especially for upper insert plates with a height ≥ 6cm, to avoid deformation and bending of the vertical section caused by the weight of the insert plate itself and the impact of the electrolyte, to ensure the accuracy of the insert plate height, and to maintain the stability of the liquid level lifting effect.

[0027] In this embodiment, a method for using the above-described electrolytic copper foil wavy texture elimination device is also provided, comprising the following steps: Based on the type and quality requirements of the copper foil to be produced, select upper insert plates 5 and lower insert plates 6 of different heights, and determine whether to open the acid spraying pipe 4 and the flow rate of the acid spraying pipe 4. The physical properties mentioned include room temperature tensile strength, high temperature tensile strength, high temperature elongation, and rate of change, specifically categorized as follows: If the copper foil to be produced is HTE foil with physical property requirements, and it is necessary to eliminate the wavy texture of the smooth surface, then close the acid spraying pipe 4, and select the upper insert plate 5 with a height ≤ 6cm and the lower insert plate 6 with a height ≤ 3cm. If the copper foil to be produced is HTE foil with no physical property requirements, turn on the acid spraying pipe 4, with a flow rate ≥1.5L / min, and select the upper insert plate 5 with a height ≤6cm and the lower insert plate 6 with a height ≤3cm to completely eliminate the rough surface water ripples. If the copper foil to be produced is RTF foil without physical property requirements, and it is necessary to eliminate the rough surface wavy texture, then select an upper insert plate 5 with a height ≥10cm, or a lower insert plate 6 with a height ≥6cm, or install the upper insert plate 5 and add the lower insert plate 6 to achieve a height ≥12cm.

[0028] The above-mentioned solution allows for the design and application of solutions based on copper foil type and physical property requirements, which is highly targeted and avoids problems such as poor results or unqualified physical properties caused by blind adjustments. It also clarifies the quantitative parameters of the insertion plate height and acid spraying flow rate, forming a standardized operating procedure to replace traditional experience-based adjustments, improve the repeatability and stability of the wavy pattern elimination effect, and facilitates replication and promotion on multiple production lines.

[0029] In this embodiment, the wavy lines are classified into four levels according to their severity, from mild to severe: Level A, Level B, Level C, and Level D. Specific implementation examples include the following: Implementation Case 1: Improvement of the Wavy Texture on the Glossy Surface of HTE Copper Foil (a) Copper foil type: HTE 35μm; (b) Problem description: Wavy texture on a smooth surface; (c) Device configuration: Upper insert plate 5: Added, height 6cm; Lower insert plate 6: Not installed; Acid spray fitting 4: Closed; Result: The wavy lines on the smooth surface were completely eliminated, and the quality inspection judged it to be Grade A in appearance.

[0030] Implementation Case 2: Improvement of the Wavy Texture on the Glossy Surface of HTE Copper Foil (a) Copper foil type: HTE 35μm; (b) Problem description: Wavy texture on a smooth surface; (c) Device configuration: Upper insert plate 5: Added, height 4cm; Lower insert plate 6: Added, height 1.5cm; Acid spray fitting 4: Closed; Result: The wavy lines on the smooth surface were basically eliminated, with only a few scattered crescent-shaped lines at the edges. The quality inspection judged the appearance to be Grade B.

[0031] Implementation Case 3: Elimination of Wavy Texture on HTE Copper Foil (a) Copper foil type: HTE 35μm; (b) Problem description: Wavy texture on a smooth surface; (c) Device configuration: Upper insert plate 5: Added, 4cm high; Lower insert plate 6: Added, height 1.5cm; Acid spray fitting 4: Open, flow rate 1.8L / min; Result: The wavy lines on the smooth surface were eliminated, and the quality inspection department judged the appearance to be Grade A.

[0032] Implementation Case 4: RTF Copper Foil Wavy Removal (a) Copper foil type: RTF 35μm; (b) Problem description: The wavy texture on the surface of the raw foil is obvious; (c) Device configuration: Upper plate 5: Not installed; Lower insert plate 6: Not installed; Acid spray fitting 4: Open, flow rate 2.0L / min; Result: The wavy texture on the surface was eliminated, and the quality inspection passed the grade A appearance test.

[0033] Implementation Case 5: RTF Copper Foil Wavy Removal (a) Copper foil type: RTF 35μm; (b) Problem description: The wavy texture on the surface of the raw foil is obvious; (c) Device configuration: Upper plate 5: Added, height 3cm; Lower insert plate 6: Added, height 1.5cm; Acid spray fitting 4: Open, flow rate 1.8L / min; Result: The wavy texture on the surface was eliminated, and the quality inspection passed the grade A appearance test.

[0034] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0035] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly and specifically defined.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

Claims

1. A device for eliminating abnormal wavy patterns on electrolytic copper foil, comprising an electrolytic cell (1), wherein an anode plate (2) is laid at the bottom of the electrolytic cell (1), and one end of the electrolytic cell (1) is a liquid outlet (3), characterized in that, A lower insert plate (6) or an upper insert plate (5) is installed on the outlet (3) at the position where it connects with the anode plate (2), or an upper insert plate (5) is installed on the upper side of the lower insert plate (6) while the lower insert plate (6) is installed. An acid spraying pipe (4) corresponding to the outlet (3) is provided on the upper side of the electrolytic cell (1), and the nozzle of the acid spraying pipe (4) faces the titanium roller (7) in the electrolytic cell (1).

2. The device for eliminating wavy texture in electrolytic copper foil according to claim 1, characterized in that: The height of the upper insert plate (5) is 2-15cm, and the height of the lower insert plate (6) is 1.5-8cm.

3. The device for eliminating wavy texture in electrolytic copper foil according to claim 2, characterized in that: The flow rate adjustment range of the acid spraying fitting (4) is 0.5-2.5L / min.

4. The device for eliminating wavy texture in electrolytic copper foil according to claim 1, characterized in that: The upper insert plate (5) and the lower insert plate (6) are both long strip structures with an L-shaped cross-section.

5. The device for eliminating wavy texture in electrolytic copper foil according to claim 4, characterized in that: When the upper insert plate (5) and the lower insert plate (6) are installed at the same time, the horizontal parts of the upper insert plate (5) and the lower insert plate (6) are close together and fixed to the liquid outlet (3) by the through screws (8).

6. The device for eliminating wavy texture in electrolytic copper foil according to claim 4, characterized in that: The upper insert plate (5) is provided with multiple reinforcing plates (9) along its length on the side away from the titanium roller (7).

7. A method of using the electrolytic copper foil wavy texture elimination device according to any one of claims 1-6, characterized in that, Includes the following steps: Based on the type and quality requirements of the copper foil to be produced, select upper insert plates (5) and lower insert plates (6) of different heights, and determine whether to open the acid spraying pipe (4) and the flow rate of the acid spraying pipe (4), specifically: If the copper foil to be produced is HTE foil with physical property requirements, and it is necessary to eliminate the wavy texture of the smooth surface, then close the acid spray pipe fitting (4), and select the upper insert plate (5) with a height ≤ 6cm and the lower insert plate (6) with a height ≤ 3cm. If the copper foil to be produced is HTE foil with no physical property requirements, open the acid spraying pipe (4), the flow rate is ≥1.5L / min, and select the upper insert plate (5) with a height ≤6cm and the lower insert plate (6) with a height ≤3cm to completely eliminate the rough surface water ripples. If the copper foil to be produced is an RTF foil without physical property requirements, and it is necessary to eliminate the rough surface wavy texture, then select an upper insert plate (5) with a height ≥10cm or a lower insert plate (6) with a height ≥6cm, or install the upper insert plate (5) and add the lower insert plate (6) to a height ≥12cm.

8. The method of using the electrolytic copper foil wavy texture elimination device according to claim 7, characterized in that: The physical properties mentioned include room temperature tensile strength, high temperature tensile strength, high temperature elongation and rate of change.

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