Circuit board glue brushing device

Abstract

The invention discloses a circuit board glue brushing device which comprises a conveying mechanism used for conveying a circuit board to be brushed with glue; the three-dimensional moving mechanism is connected with a rotating driving part; and the brush assembly is connected with the rotation driving part, the brush assembly is located above the conveying mechanism, and the rotation driving part is used for driving the brush assembly to rotate. According to the application, a worker does not need to carry out brushing, brushing uniformity and brushing consistency of the welding surface of the mainboard of the air conditioner outdoor unit can be well ensured, the brushing efficiency is high, the labor cost is greatly reduced, the use amount of the three-proofing glue can be well controlled, the consumption of the three-proofing glue is effectively reduced, the quality problems such as bubbles are not easy to occur during brushing, and the quality of the mainboard is improved. And the brushing quality and the brushing effect of the welding surface of the main board of the air conditioner outdoor unit can be well guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of applying adhesive to circuit boards, and more specifically, to a device for applying adhesive to circuit boards. Background Technology

[0002] Conformal adhesive is a specially formulated coating used to protect circuit boards and their applications from environmental damage. The three protections are moisture-proof, mildew-proof, and corrosion-proof.

[0003] In air conditioner manufacturing, the soldering surfaces of the mainboard of the outdoor unit need to be coated with conformal adhesive. Currently, there are two main methods for applying conformal adhesive to the soldering surfaces of the mainboard of the outdoor unit: manual application and spraying with a glue sprayer. Manual application is prone to uneven application, and it is difficult to ensure the consistency of the coating on the soldering surfaces of multiple outdoor unit mainboards, which can easily lead to quality problems. In addition, the application efficiency is low and the labor cost is high. On the other hand, the glue spraying method requires adjusting the air pressure valve to adjust the spray width because the spray area varies. This can result in overlapping spray areas, and some areas of the soldering surface of the outdoor unit mainboard may not be able to be sprayed. In such cases, spot spraying or continuous spot spraying is used, which leads to a large amount of glue consumption, and the glue consumption is difficult to control, increasing the cost of conformal adhesive. In addition, air bubbles appear on the soldering surfaces of the outdoor unit mainboard after the glue is applied, which are difficult to eliminate on their own. Manual application of glue is still required to reduce the number of air bubbles, which is quite tedious. Summary of the Invention

[0004] The purpose of this application is to provide a circuit board adhesive application device that eliminates the need for manual application, effectively ensuring uniform and consistent application of adhesive to the solder surfaces of the mainboard of the air conditioner outdoor unit. This device offers high application efficiency, significantly reduces labor costs, and allows for better control of the amount of conformal adhesive used, thus saving on consumption. It also minimizes the occurrence of quality problems such as bubbles during application, thereby ensuring the quality and effectiveness of the adhesive application to the solder surfaces of the mainboard of the air conditioner outdoor unit.

[0005] To achieve the above objectives, this application provides a circuit board adhesive application device, comprising: A conveying mechanism is used to convey circuit boards to be coated with adhesive. A three-dimensional moving mechanism, wherein the three-dimensional moving mechanism is connected to a rotational driving component; A brush assembly is connected to the rotation drive and is located above the conveying mechanism. The rotation drive is used to drive the brush assembly to rotate.

[0006] In the implementation of the above technical solution, the circuit board adhesive application device can be used to apply conformal coating to the soldering surface of the main board of the air conditioner outdoor unit. In practical applications, the conveying mechanism can transport the circuit board to be coated to the area below the brush assembly. The three-dimensional moving mechanism drives the brush assembly to move, so as to initially apply conformal coating to the soldering surface of the main board of the air conditioner outdoor unit. After the initial coating is completed, the angle of the brush assembly can be adjusted by rotating the drive component to apply a second coat of conformal coating to the soldering surface of the main board of the air conditioner outdoor unit from another angle, thereby achieving the effect of cross-coating. Cross-coating can effectively improve the uniformity of conformal coating, adhesion, protective performance, and eliminate air bubbles. This can better ensure the uniformity and consistency of coating on the soldering surface of the main board of the air conditioner outdoor unit, with high coating efficiency. It can eliminate the need for manual coating, greatly reducing labor costs. Furthermore, it can better control the amount of conformal coating used, effectively saving the consumption of conformal coating, and is less likely to have quality problems such as air bubbles during coating. It can better guarantee the coating quality and effect of the soldering surface of the main board of the air conditioner outdoor unit.

[0007] In a preferred embodiment of this application, the conveying mechanism has an adhesive application station, and a first baffle assembly is provided on the conveying mechanism near the adhesive application station.

[0008] In the implementation of the above technical solution, the glue application station of the conveying mechanism is located below the brush assembly. When the conveying mechanism transports the circuit board to be glued to the glue application station, the first baffle assembly can block the circuit board to be glued, preventing it from continuing to move forward with the conveying mechanism, so that the circuit board to be glued stays at the glue application station of the conveying mechanism for the application of conformal adhesive. The setting of the first baffle assembly allows the conveying mechanism to be applied without stopping when applying conformal adhesive to the circuit board, thus avoiding frequent start-stop of the conveying mechanism, which facilitates the use of the circuit board glue application device and the glue application operation, and improves the practicality of the circuit board glue application device.

[0009] In a preferred embodiment of this application, the conveying mechanism is further provided with a second baffle assembly at a position in front of the glue application station.

[0010] In the implementation of the above technical solution, the second baffle assembly, which is set at the position in front of the glue application station on the conveying mechanism, can block other glue application circuit boards on the conveying mechanism from continuing to move forward and being conveyed to the glue application station when the brush assembly is applying glue to the circuit board to be applied at the glue application station. This can prevent other glue application circuit boards on the conveying mechanism from interfering with the glue application of the circuit board to be applied and affecting the application of the glue application of the circuit board to be applied, and can effectively ensure the integrity of the application of the application.

[0011] In a preferred embodiment of this application, both the first baffle assembly and the second baffle assembly include a blocking cylinder and a circuit board blocking block. The blocking cylinder is mounted on the conveying mechanism, and the circuit board blocking block is mounted on the working end of the blocking cylinder. The blocking cylinder is used to drive the circuit board blocking block to move up and down.

[0012] In the implementation of the above technical solution, the first baffle assembly and the second baffle assembly can drive the circuit board blocking block to move up and down by the movement of the blocking cylinder, thereby blocking the circuit board to be glued. This structure of the first baffle assembly and the second baffle assembly can be easily set on the conveying mechanism, and can play a good blocking effect on the circuit board to be glued.

[0013] In a preferred embodiment of this application, the three-dimensional moving mechanism includes a horizontal moving component and a lifting adjustment component. The lifting adjustment component is movably connected to the horizontal moving component, and the lifting adjustment component is connected to the rotation drive component.

[0014] In the implementation of the above technical solution, the brush assembly can move horizontally in two dimensions under the action of the horizontal moving component, and can move vertically under the action of the lifting adjustment component, thereby realizing three-dimensional movement. The structure of this three-dimensional moving mechanism can better realize the three-dimensional movement of the brush assembly, and can better ensure the smoothness and stability of the brush assembly during movement, thus better ensuring the coating quality and coating effect on the welding surface of the main board of the air conditioner outdoor unit.

[0015] In a preferred embodiment of this application, the horizontal moving assembly includes a gantry, a first linear module, and a second linear module. The gantry frame is erected on both sides of the conveying mechanism; the first linear module is disposed on the gantry frame; the second linear module is slidably connected to the first linear module and is disposed perpendicular to the first linear module; The lifting adjustment component is slidably connected to the second linear module.

[0016] In the implementation of the above technical solution, the brush assembly can move horizontally in the first dimension under the action of the first linear module, and can move horizontally in the second dimension under the action of the second linear module. The horizontal movement assembly adopts a gantry frame, which can facilitate the horizontal movement assembly to be mounted on the conveying mechanism. Furthermore, the use of the first linear module and the second linear module can better ensure the smoothness and stability of the brush assembly during movement. At the same time, the brushing speed of the brush assembly can be adjusted by adjusting the first linear module and the second linear module, making the brushing of the brush assembly controllable.

[0017] In a preferred embodiment of this application, the lifting adjustment assembly includes a lifting adjustment cylinder and a mounting plate. The lifting and adjusting cylinder is slidably connected to the second linear module, and the mounting plate is disposed at the working end of the lifting and adjusting cylinder; The rotation drive component is mounted on the mounting plate.

[0018] In the implementation of the above technical solution, the mounting plate is set at the working end of the lifting and adjusting cylinder. Under the action of the lifting and adjusting cylinder, the mounting plate will move up and down synchronously, thereby driving the brush assembly to move up and down, realizing the lifting and moving of the brush assembly. The setting of the lifting and adjusting cylinder can better ensure the stability and smoothness of the brush assembly during movement, and the setting of the mounting plate can facilitate the installation of the rotating drive component and the brush assembly.

[0019] In a preferred embodiment of this application, the three-dimensional moving mechanism is connected to two rotating drive members arranged side by side along the conveying direction of the conveying mechanism; There are two brush assemblies, one of which is connected to a corresponding rotation drive component.

[0020] In the implementation of the above technical solution, by setting two rotating drive components and two brush assemblies, the circuit board gluing device can simultaneously apply conformal adhesive to two circuit boards on the conveying mechanism, which can greatly improve the efficiency of the gluing operation on the soldering surface of the main board of the air conditioner outdoor unit.

[0021] In a preferred embodiment of this application, the brush assembly includes a brush holder and a brush with adhesive. The brush holder is connected to the rotating drive component, and the adhesive brush is disposed on the brush holder.

[0022] In the implementation of the above technical solution, the brush holder is connected to the rotating drive component. Under the action of the rotating drive component, the brush holder will rotate, thereby driving the brush to rotate synchronously. This can better realize the rotation of the brush assembly and better ensure the stability and smoothness of the rotation of the brush assembly.

[0023] In a preferred embodiment of this application, the circuit board adhesive application device further includes a mounting base plate. The conveying mechanism is mounted on the mounting base plate; the three-dimensional moving mechanism is mounted on the mounting base plate and is positioned above the conveying mechanism.

[0024] In the implementation of the above technical solution, the conveying mechanism and the three-dimensional moving mechanism are set on the mounting base plate. The mounting base plate facilitates the installation and use of the circuit board gluing device, and allows the circuit board gluing device to be set next to the production line of the air conditioner outdoor unit.

[0025] This application discloses a circuit board adhesive application device, which, compared with the prior art, has at least the following advantages: The circuit board adhesive application device of this application can be used to apply conformal adhesive to the soldering surface of the mainboard of an air conditioner outdoor unit. It includes a conveying mechanism, a three-dimensional moving mechanism, and a brush assembly. The conveying mechanism transports the circuit board to be coated, the three-dimensional moving mechanism is connected to a rotating drive component, and the brush assembly is connected to the rotating drive component and positioned above the conveying mechanism. In practical applications, the conveying mechanism transports the circuit board to be coated to a position below the brush assembly. The three-dimensional moving mechanism then moves the brush assembly to perform a preliminary application of conformal adhesive to the soldering surface of the mainboard of the air conditioner outdoor unit. After the preliminary application, the angle of the brush assembly can be adjusted using the rotating drive component. Applying a second coat of conformal coating to the soldering surface of the air conditioner outdoor unit's mainboard from another angle achieves a cross-coating effect. Cross-coating effectively improves the uniformity, adhesion, and protective performance of the conformal coating, while also eliminating air bubbles. This ensures a more even and consistent coating on the soldering surface of the air conditioner outdoor unit's mainboard, resulting in higher coating efficiency. It eliminates the need for manual application, significantly reducing labor costs. Furthermore, it allows for better control of the amount of conformal coating used, effectively saving on consumption. It also reduces the likelihood of quality issues such as air bubbles during application, thus guaranteeing a better coating quality and effect on the soldering surface of the air conditioner outdoor unit's mainboard. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is one of the three-dimensional structural schematic diagrams of the circuit board gluing device provided in the embodiments of this application; Figure 2 This is a second three-dimensional structural schematic diagram of the circuit board gluing device provided in the embodiments of this application; Figure 3 This is a three-dimensional structural schematic diagram of the conveying mechanism provided in the embodiments of this application; Figure 4 This is a three-dimensional structural diagram of the three-dimensional moving mechanism provided in the embodiments of this application; Figure 5 This is a three-dimensional structural diagram of the first baffle assembly provided in the embodiments of this application.

[0028] Reference numerals: 11. Mounting base plate; 12. Conveying mechanism; 13. Three-dimensional moving mechanism; 131. Horizontal moving component; 1311. Gantry frame; 1312. First linear module; 1313. Second linear module; 132. Lifting and adjusting component; 1321. Lifting and adjusting cylinder; 1322. Mounting plate; 14. Rotation drive component; 15. Brush assembly; 151. Brush bracket; 152. Glue brush; 16. First baffle assembly; 161. Blocking cylinder; 162. Circuit board blocking block. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0031] Furthermore, some of the aforementioned terms, besides indicating location or positional relationships, may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0032] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0033] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0034] Currently, there are two main methods for applying conformal adhesive to the solder surfaces of the mainboard of an air conditioner outdoor unit: manual application and spraying with a glue sprayer. Manual application is prone to uneven application, and it's difficult to ensure consistency across multiple mainboards, leading to quality issues. Furthermore, it's inefficient and labor-intensive. The glue sprayer method, on the other hand, requires adjusting the air pressure valve to control the spray width due to varying spray area sizes, resulting in overlapping areas. Additionally, some areas on the mainboard's solder surfaces may be unsuitable for spraying, necessitating spot or continuous spot spraying, which leads to higher glue consumption that is difficult to control, increasing the cost of conformal adhesive. Moreover, air bubbles appearing after applying the adhesive to the mainboard's solder surfaces are difficult to eliminate on their own, requiring manual application of adhesive to reduce bubbles, which is cumbersome.

[0035] To address the problems in the prior art, this application provides a circuit board adhesive application device that eliminates the need for manual application. It effectively ensures uniform and consistent application of adhesive to the soldering surfaces of the air conditioner outdoor unit's mainboard, resulting in high application efficiency, significantly reduced labor costs, and better control over the amount of conformal adhesive used, thus saving on adhesive consumption. It also reduces the likelihood of quality issues such as air bubbles during application, ensuring better coating quality and effect on the soldering surfaces of the air conditioner outdoor unit's mainboard.

[0036] Example 1 See Figure 1 The circuit board adhesive application device according to this application includes: Conveying mechanism 12 is used to convey the circuit board to be coated with glue; A three-dimensional moving mechanism 13 is connected to a rotation drive component 14. The brush assembly 15 is connected to the rotation drive 14 and is located above the conveying mechanism 12. The rotation drive 14 is used to drive the brush assembly 15 to rotate.

[0037] The circuit board adhesive application device of this application embodiment is suitable for applying conformal coating to the soldering surface of the main board of an air conditioner outdoor unit, and can also be applied to the soldering surface of other circuit boards. Furthermore, it can also be applied to other circuit board applications. It is understood that this application can be the application of other materials, and does not necessarily have to be the application of conformal coating. In this embodiment, the circuit board adhesive application device is applied to the application of conformal coating to the soldering surface of the main board of an air conditioner outdoor unit, and the circuit board adhesive application device is elaborated, described and explained.

[0038] In this embodiment, the conveying mechanism 12 can be used to convey the circuit board to be coated with adhesive to the area below the brush assembly 15 for the application of conformal adhesive. The circuit board to be coated with adhesive can be placed on the conveying mechanism 12 by a picking mechanism (e.g., a picking robot) or by a worker manually placing it on the conveying mechanism 12.

[0039] In this embodiment, the three-dimensional moving mechanism 13 is connected to a rotation drive 14, and the brush assembly 15 is connected to the rotation drive 14. Under the action of the three-dimensional moving mechanism 13, the brush assembly 15 can move in three dimensions, that is, it can move in the XYZ three dimensions. Through the rotation drive 14, the brush assembly 15 can rotate, thus adjusting the angle of the brush assembly 15 and changing the brushing direction of the brush assembly 15. For example, the brush assembly 15 can be rotated 90 degrees by the rotation drive 14, so that the brush assembly 15 can brush in the left and right direction and in the front and back direction, realizing a cross-coating brushing operation. The cross-coating brushing operation can achieve the following effects: Improve coverage uniformity: When applying adhesive in the first direction (e.g., left and right), there may be localized adhesive buildup or incomplete coverage. Cross-coating can fill in these gaps, unevenness, and adhesive buildup when applying adhesive in the second direction (e.g., front and back). Enhanced adhesion: Cross-coating allows the conformal adhesive to better penetrate into the tiny gaps of the circuit board and between the pins of components; Enhanced protective performance: After cross-coating, the resulting protective coating is denser and can more effectively block the intrusion of harmful substances such as moisture, dust, and chemicals. Eliminating air bubbles: During the application of adhesive, air can easily get mixed into the adhesive and form air bubbles. Applying the adhesive in a cross-hatching manner can make it easier to squeeze out and eliminate air bubbles as the brushing motion is in different directions.

[0040] The circuit board adhesive application device of this application embodiment can be used to apply conformal coating to the soldering surface of the main board of an air conditioner outdoor unit. In practical application, the conveying mechanism 12 can convey the circuit board to be coated to the area below the brush assembly 15. The three-dimensional moving mechanism 13 drives the brush assembly 15 to move, so as to initially apply conformal coating to the soldering surface of the main board of the air conditioner outdoor unit. After the initial coating is completed, the angle of the brush assembly 15 can be adjusted by the rotation drive 14, and the conformal coating can be applied to the soldering surface of the main board of the air conditioner outdoor unit at another angle (for example, rotating 90 degrees), thereby achieving cross-coating (for example, first coating from the left and right direction, and then from the right and left direction). Apply the coating in a front-to-back direction; or, first apply it in a front-to-back direction, then in a left-to-right direction. This cross-coating effectively improves the uniformity, adhesion, and protective performance of the conformal coating, while also eliminating air bubbles. This ensures a better uniformity and consistency of the coating on the soldering surfaces of the air conditioner's outdoor unit's mainboard. The coating efficiency is high, eliminating the need for manual application and significantly reducing labor costs. Furthermore, it allows for better control of the amount of conformal coating used, effectively saving on consumption. It also reduces the likelihood of quality problems such as air bubbles during application, thus ensuring a better coating quality and effect on the soldering surfaces of the air conditioner's outdoor unit's mainboard.

[0041] Furthermore, in this embodiment, the three-dimensional moving mechanism 13 is connected to two rotating drive members 14 arranged side by side along the conveying direction of the conveying mechanism 12; There are two brush assemblies 15, one of which is connected to a rotating drive component 14.

[0042] In the above structure, two rotating drive components 14 and two brush assemblies 15 are provided, which enables the circuit board gluing device to simultaneously apply conformal adhesive to two circuit boards on the conveying mechanism 12. This can greatly improve the efficiency of the gluing operation on the soldering surface of the main board of the air conditioner outdoor unit.

[0043] Understandably, in other embodiments, the rotation drive 14 can be configured as one unit, and correspondingly, the brush assembly 15 can be configured as one unit, that is, the circuit board adhesive application device can be used to apply conformal adhesive to a circuit board to be adhesiveed on the conveying mechanism 12.

[0044] Furthermore, in this embodiment, the conveying mechanism 12 adopts a chain-type conveying mechanism 12. It should be noted that, in Figure 1In this embodiment, the chain on the chain-type conveyor 12 is only schematic and does not represent the actual arrangement of the chain on the chain-type conveyor 12. For the actual arrangement of the chain on the chain-type conveyor 12, refer to the existing chain arrangement of the chain on the chain-type conveyor 12, which will not be repeated here. In this embodiment, the chain-type conveyor 12 is driven by a drive motor and a synchronous belt assembly. Specifically, the output shaft of the drive motor is connected to a synchronous pulley in the synchronous belt assembly, and the other synchronous pulley in the synchronous belt assembly is connected to a sprocket of the chain-type conveyor 12 through a connecting shaft.

[0045] In this embodiment, the circuit board to be coated with adhesive is specifically placed on the chain of the chain-type conveyor mechanism 12 for conveying.

[0046] See Figure 2 Preferably, in this embodiment, the circuit board gluing device further includes a mounting base plate 11, a conveying mechanism 12 disposed on the mounting base plate 11, and a three-dimensional moving mechanism 13 disposed on the mounting base plate 11 and located above the conveying mechanism 12.

[0047] In the above structure, the conveying mechanism 12 and the three-dimensional moving mechanism 13 are mounted on the mounting base plate 11. The mounting base plate 11 facilitates the installation and use of the circuit board gluing device, allowing the circuit board gluing device to be installed next to the production line of the air conditioner outdoor unit.

[0048] Example 2 See Figures 1 to 3 , Figure 5 Based on the above embodiment one, the difference between this embodiment and embodiment one is that the circuit board gluing device in this embodiment has a gluing station in the conveying mechanism 12, and a first baffle assembly 16 is provided in the conveying mechanism 12 near the gluing station.

[0049] Specifically, the first baffle assembly 16 is disposed next to the glue application station of the conveying mechanism 12, adjacent to the glue application station of the conveying mechanism 12; in this embodiment, one first baffle assembly 16 is disposed on one side of the conveying mechanism 12; in other embodiments, two first baffle assemblies 16 may be disposed, and the two first baffle assemblies 16 may be symmetrically disposed on both sides of the conveying mechanism 12.

[0050] In the above structure, the glue application station of the conveying mechanism 12 is located below the brush assembly 15. When the conveying mechanism 12 conveys the circuit board to be glued to the glue application station, the first baffle assembly 16 can block the circuit board to be glued, preventing it from continuing to move forward with the conveying mechanism 12, so that the circuit board to be glued stays at the glue application station of the conveying mechanism 12 for the application of conformal adhesive. The setting of the first baffle assembly 16 allows the conveying mechanism 12 to be applied without stopping when applying conformal adhesive to the circuit board, thus avoiding frequent start and stop of the conveying mechanism 12, which facilitates the use of the circuit board glue application device and the glue application operation, and improves the practicality of the circuit board glue application device.

[0051] Furthermore, in this embodiment, the first baffle assembly 16 includes a blocking cylinder 161 and a circuit board blocking block 162. A blocking cylinder 161 is mounted on the conveying mechanism 12, and a circuit board blocking block 162 is mounted on the actuating end of the blocking cylinder 161. The blocking cylinder 161 is used to drive the circuit board blocking block 162 to move up and down.

[0052] In the above structure, the first baffle assembly 16 can drive the circuit board blocking block 162 to move up and down through the movement of the blocking cylinder 161, thereby blocking the circuit board to be glued. This structure of the first baffle assembly 16 can be easily installed on the conveying mechanism 12, and can play a good blocking effect on the circuit board to be glued.

[0053] Example 3 See Figures 1 to 3 , Figure 5 Based on the above embodiment two, the difference between this embodiment and embodiment two is that the circuit board gluing device in this embodiment has a second baffle assembly (not shown in the figure) at the position in front of the gluing station of the conveying mechanism 12.

[0054] Specifically, in this embodiment, one second baffle assembly is provided, which is disposed on one side of the conveying mechanism 12; in other embodiments, two second baffle assemblies may be provided, and the two second baffle assemblies may be symmetrically disposed on both sides of the conveying mechanism 12.

[0055] In the above structure, the second baffle assembly, located on the conveying mechanism 12 before reaching the glue application station, can prevent other circuit boards on the conveying mechanism 12 from continuing to advance and be conveyed to the glue application station when the brush assembly 15 is applying glue to the circuit board at the glue application station. This can prevent other circuit boards on the conveying mechanism 12 from interfering with the circuit board being applied and affecting the application of the circuit board, thus effectively ensuring the integrity of the application operation.

[0056] Furthermore, in this embodiment, the second baffle assembly adopts the same structure as the first baffle assembly 16. The second baffle assembly includes a blocking cylinder 161 and a circuit board blocking block 162. A blocking cylinder 161 is mounted on the conveying mechanism 12, and a circuit board blocking block 162 is mounted on the actuating end of the blocking cylinder 161. The blocking cylinder 161 is used to drive the circuit board blocking block 162 to move up and down.

[0057] Example 4

[0058] See Figures 1 to 5 Based on any of the embodiments one to three above, the circuit board adhesive application device of this embodiment includes a three-dimensional moving mechanism 13 comprising a horizontal moving component 131 and a lifting adjustment component 132. The lifting adjustment component 132 is movably connected to the horizontal movement component 131, and the lifting adjustment component 132 is connected to the rotation drive component 14.

[0059] In the above structure, the brush assembly 15 can move horizontally in two dimensions under the action of the horizontal moving assembly 131, and can move vertically under the action of the lifting adjustment assembly 132, thereby realizing three-dimensional movement. This structure of the three-dimensional moving mechanism 13 can better realize the three-dimensional movement of the brush assembly 15, and can better ensure the smoothness and stability of the brush assembly 15 during movement, and better ensure the coating quality and coating effect on the welding surface of the main board of the air conditioner outdoor unit.

[0060] Furthermore, in this embodiment, the horizontal movement component 131 includes a gantry frame 1311, a first linear module 1312, and a second linear module 1313. The gantry frame 1311 is mounted on both sides of the conveying mechanism 12; the first linear module 1312 is mounted on the gantry frame 1311; the second linear module 1313 is slidably connected to the first linear module 1312 and is perpendicular to the first linear module 1312. The lifting adjustment component 132 is slidably connected to the second linear module 1313.

[0061] In the above structure, the brush assembly 15 can move horizontally in the first dimension under the action of the first linear module 1312, and can move horizontally in the second dimension under the action of the second linear module 1313. The horizontal movement assembly 131 adopts a gantry frame 1311, which can facilitate the horizontal movement assembly 131 to be mounted on the conveying mechanism 12. The use of the first linear module 1312 and the second linear module 1313 can better ensure the stability and smoothness of the brush assembly 15 during movement. At the same time, the brushing speed of the brush assembly 15 can be adjusted by adjusting the first linear module 1312 and the second linear module 1313, so that the brushing of the brush assembly 15 is controllable.

[0062] Furthermore, in this embodiment, the lifting adjustment assembly 132 includes a lifting adjustment cylinder 1321 and a mounting plate 1322. The lifting and adjusting cylinder 1321 is slidably connected to the second linear module 1313, and the mounting plate 1322 is disposed at the working end of the lifting and adjusting cylinder 1321; The rotation drive component 14 is mounted on the mounting plate 1322.

[0063] In this embodiment, the rotation drive 14 is a rotation cylinder. When there are two rotation drive 14, the two rotation drive 14 are arranged on both sides of the mounting plate 1322.

[0064] In the above structure, the mounting plate 1322 is located at the working end of the lifting and adjusting cylinder 1321. Under the action of the lifting and adjusting cylinder 1321, the mounting plate 1322 will move up and down synchronously, thereby driving the brush assembly 15 to move up and down, thus realizing the lifting and lowering movement of the brush assembly 15. The setting of the lifting and adjusting cylinder 1321 can better ensure the stability and smoothness of the brush assembly 15 during movement. The setting of the mounting plate 1322 can facilitate the installation of the rotating drive component 14 and the brush assembly 15.

[0065] Example 5

[0066] See Figures 1 to 5 Based on any of the embodiments one to four above, the circuit board adhesive application device of this embodiment includes a brush assembly 15 comprising a brush holder 151 and an adhesive application brush 152. The brush holder 151 is connected to the rotating drive component 14, and the glue brush 152 is mounted on the brush holder 151.

[0067] In the above structure, the brush holder 151 is connected to the rotation drive 14. Under the action of the rotation drive 14, the brush holder 151 will rotate, thereby driving the glue brush 152 to rotate synchronously. This can better realize the rotation of the brush assembly 15 and better ensure the stability and smoothness of the rotation of the brush assembly 15.

[0068] In all the above embodiments, "large" and "small" are relative terms, "more" and "less" are relative terms, and "upper" and "lower" are relative terms. The embodiments of this application will not elaborate further on the expression of such relative terms.

[0069] It should be understood that phrases such as "in one embodiment," "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, phrases such as "in one embodiment," "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0070] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0071] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A circuit board adhesive application device, characterized in that, include: A conveying mechanism is used to convey circuit boards to be coated with adhesive. A three-dimensional moving mechanism, wherein the three-dimensional moving mechanism is connected to a rotating drive component; A brush assembly is connected to the rotation drive and is located above the conveying mechanism. The rotation drive is used to drive the brush assembly to rotate.

2. The circuit board adhesive application device according to claim 1, characterized in that, The conveying mechanism has a glue application station, and a first baffle assembly is provided near the glue application station.

3. The circuit board adhesive application device according to claim 2, characterized in that, The conveying mechanism is also equipped with a second baffle assembly at a position in front of the glue application station.

4. The circuit board adhesive application device according to claim 3, characterized in that, Both the first baffle assembly and the second baffle assembly include a blocking cylinder and a circuit board blocking block. The blocking cylinder is mounted on the conveying mechanism, and the circuit board blocking block is mounted on the working end of the blocking cylinder. The blocking cylinder is used to drive the circuit board blocking block to move up and down.

5. The circuit board adhesive application device according to claim 1, characterized in that, The three-dimensional moving mechanism includes a horizontal moving component and a lifting and adjusting component. The lifting adjustment component is movably connected to the horizontal moving component, and the lifting adjustment component is connected to the rotation drive component.

6. The circuit board adhesive application device according to claim 5, characterized in that, The horizontal movement assembly includes a gantry, a first linear module, and a second linear module. The gantry frame is erected on both sides of the conveying mechanism; the first linear module is disposed on the gantry frame; the second linear module is slidably connected to the first linear module and is disposed perpendicular to the first linear module; The lifting adjustment component is slidably connected to the second linear module.

7. The circuit board adhesive application device according to claim 6, characterized in that, The lifting and adjusting assembly includes a lifting and adjusting cylinder and a mounting plate. The lifting and adjusting cylinder is slidably connected to the second linear module, and the mounting plate is disposed at the working end of the lifting and adjusting cylinder; The rotation drive component is mounted on the mounting plate.

8. The circuit board adhesive application device according to any one of claims 1-7, characterized in that, The three-dimensional moving mechanism is connected to two rotating drive components arranged side by side along the conveying direction of the conveying mechanism; There are two brush assemblies, one of which is connected to a corresponding rotation drive component.

9. The circuit board gluing device according to claim 1, characterized in that, The brush assembly includes a brush holder and a brush with adhesive. The brush holder is connected to the rotating drive component, and the adhesive brush is disposed on the brush holder.

10. The circuit board adhesive application device according to claim 1, characterized in that, The circuit board adhesive application device also includes a mounting base plate. The conveying mechanism is mounted on the mounting base plate; the three-dimensional moving mechanism is mounted on the mounting base plate and is positioned above the conveying mechanism.

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