Inductor component, method for manufacturing inductor component, and substrate for manufacturing inductor component

Abstract

An inductor component (10) is provided with a green body (11), a first insulating layer (31), a lower layer inductor wiring (51L), and an upper layer inductor wiring (51U). The lower layer inductor wiring (51L) is provided with a lower layer wiring main body (52L) and a lower layer protruding portion (53L) protruding from the outer surface of the lower layer wiring main body (52L) on the third negative direction (Z2) side. The outer surface of the lower layer wiring body (52L) on the third negative direction (Z2) side is in contact with the outer surface of the first insulating layer (31) on the third positive direction (Z1) side. The lower layer protruding portion (53L) is located within a range surrounded by an outer edge of the lower layer wiring main body (52L) and extends along the lower layer wiring main body (52L) when viewed in the third positive direction (Z1). The outer surface of the upper layer inductor wiring (51U) on the third negative direction (Z2) side is in contact with the surface of the lower layer inductor wiring (51L) on the third positive direction (Z1) side.

Description

Technical Field

[0001] This disclosure relates to inductor components, methods for manufacturing inductor components, and substrates for manufacturing inductor components. Background Technology

[0002] The inductor component disclosed in Patent Document 1 includes a blank and inductor wiring. The blank has a first main surface. The inductor wiring extends parallel to the first main surface within the blank. Furthermore, the inductor wiring is spiral-shaped. That is, the inductor wiring has parallel portions.

[0003] Patent Document 1: Japanese Patent No. 6447368

[0004] In the inductor component disclosed in Patent Document 1, there are cases where the cross-sectional area of ​​the inductor wiring is increased to reduce the DC resistance of the inductor wiring. However, for example, when the width of the inductor wiring is increased, the spacing between the parallel portions of the inductor wiring becomes narrower. Therefore, in the event of manufacturing errors, the possibility of short circuits occurring between the parallel portions of the inductor wiring increases. Summary of the Invention

[0005] To address the aforementioned issues, one aspect of this disclosure provides an inductor component comprising: a blank containing a magnetic material and having a planar main surface; an insulating layer located within the blank and extending in a plane parallel to the main surface; a lower inductor wiring extending within the blank parallel to the main surface; and an upper inductor wiring extending within the blank parallel to the main surface, wherein the lower inductor wiring has one direction orthogonal to the main surface designated as a positive direction and the direction opposite to the positive direction designated as a negative direction, comprising: a lower wiring body extending on the outer surface of the insulating layer on the positive direction side; and a protrusion protruding from the outer surface of the lower wiring body on the negative direction side on the negative direction side. The outer surface of the negative direction side of the lower wiring body is in contact with the outer surface of the positive direction side of the insulating layer. When viewed in the positive direction, the protrusion is located within the area surrounded by the outer edge of the wiring body and extends along the wiring body. When viewed in cross-section using a section orthogonal to the main plane, the dimension of the protrusion in the direction parallel to the main plane is smaller than the dimension of the wiring body in the direction parallel to the main plane at the location where the protrusion is connected. The upper inductor wiring extends along the lower wiring body on the outer surface of the positive direction side of the lower wiring body. The outer surface of the negative direction side of the upper inductor wiring is in contact with the surface of the positive direction side of the lower inductor wiring.

[0006] Additionally, one aspect of this disclosure provides a method for manufacturing an inductor component, comprising: a seed layer forming step, wherein a conductive seed layer is formed on the main surface of a base substrate; an insulating layer forming step, wherein an insulating layer with an opening having a predetermined wiring pattern is formed on the seed layer; a lower resin wall forming step, wherein a lower resin wall is formed on the insulating layer along the outer edge of the opening; and a lower inductor wiring forming step, wherein a lower wiring body is formed within a space surrounded by the lower resin wall by electroplating performed by supplying power to the seed layer, and a lower wiring body is formed within the opening that protrudes from the lower wiring body and runs along the lower resin wall. The process includes: a lower layer protrusion extending from the seed layer; an upper resin wall forming process, in which an upper resin wall is formed on the upper side of the lower layer wiring body along the outer edge of the lower layer wiring body; an upper inductor wiring forming process, in which upper inductor wiring is formed in the space surrounded by the upper resin wall by electroplating performed by supplying power to the seed layer; a blank forming process, in which a magnetic layer containing magnetic material is formed around the lower layer wiring body, the lower layer protrusion, and the upper inductor wiring after the upper inductor wiring forming process; and a seed layer removal process, in which the seed layer is removed after the blank forming process.

[0007] Additionally, one aspect of this disclosure provides a substrate for manufacturing an inductor component, comprising: a base substrate; a seed layer located on the main surface of the base substrate and having conductivity; an insulating layer located on the seed layer and extending parallel to the main surface of the base substrate; a lower inductor wiring located on the insulating layer and extending parallel to the main surface of the base substrate; and an upper inductor wiring located on the lower inductor wiring and extending parallel to the main surface of the base substrate, wherein one direction orthogonal to the main surface of the base substrate is designated as a positive direction, and the direction opposite to the positive direction is designated as a negative direction. The lower inductor wiring includes: a lower wiring body extending on the outer surface of the positive direction side of the insulating layer; and a protrusion protruding from the outer surface of the negative direction side of the lower wiring body towards the negative direction side. When viewed in the positive direction, the protrusion extends along the lower wiring body, and the negative direction side surface of the protrusion contacts the seed layer. The upper inductor wiring extends along the lower wiring body on the outer surface of the positive direction side of the lower wiring body, and the negative direction side surface of the upper inductor wiring contacts the positive direction side surface of the lower inductor wiring.

[0008] It can prevent different parts of the inductor wiring from short-circuiting with each other and reduce the DC resistance of the inductor wiring. Attached Figure Description

[0009] Figure 1This is a perspective view of the inductor component according to the first embodiment.

[0010] Figure 2 This is a side perspective view of the inductor component according to the first embodiment.

[0011] Figure 3 It is along Figure 2 The sectional view along line 3-3.

[0012] Figure 4 It is along Figure 2 The sectional view along line 4-4.

[0013] Figure 5 It is along Figure 3 as well as Figure 4 The sectional view along line 5-5.

[0014] Figure 6 This is a flowchart of the manufacturing process of the inductor component according to the first embodiment.

[0015] Figure 7 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0016] Figure 8 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0017] Figure 9 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0018] Figure 10 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0019] Figure 11 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0020] Figure 12 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0021] Figure 13 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0022] Figure 14 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0023] Figure 15 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0024] Figure 16 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0025] Figure 17 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0026] Figure 18 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0027] Figure 19 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0028] Figure 20 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0029] Figure 21 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0030] Figure 22 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0031] Figure 23 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0032] Figure 24 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0033] Figure 25 This is a perspective view of the inductor component according to the second embodiment.

[0034] Figure 26 This is a perspective view of the inductor component of the second embodiment from the top surface.

[0035] Figure 27 It is along Figure 26 A sectional view along line 27-27.

[0036] Figure 28 This is a flowchart of the manufacturing process of the inductor component according to the second embodiment.

[0037] Figure 29 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0038] Figure 30 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0039] Figure 31 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0040] Figure 32 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0041] Figure 33 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0042] Figure 34 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0043] Figure 35 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0044] Figure 36 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0045] Figure 37 This is a perspective view of the modified inductor component.

[0046] Figure 38 This is a perspective view of the inductor component from the top surface of the modified example.

[0047] Figure 39 This is a cross-sectional view of the inductor component in the modified example.

[0048] Figure 40 This is a cross-sectional view of the inductor component in the modified example.

[0049] Figure 41 This is an explanatory diagram illustrating the manufacturing method of the modified inductor component. Detailed Implementation

[0050] Hereinafter, embodiments of the inductor component will be described with reference to the accompanying drawings. Furthermore, the components are sometimes shown enlarged for ease of understanding. The dimensional ratios of the components may sometimes differ from the actual figures or from those in other figures.

[0051] <Inductor component of the first embodiment>

[0052] Hereinafter, a first embodiment of the inductor component and the method for manufacturing the inductor component will be described.

[0053] (Overall composition)

[0054] Figure 1 As shown, the inductor component 10 is generally rectangular in shape. The inductor component 10 includes a blank 11.

[0055] The blank 11 is generally rectangular. That is, the blank 11 has six planar outer surfaces. One specific surface among these six outer surfaces is designated as the first main surface 11A. The surface located opposite to and parallel to the first main surface 11A is designated as the second main surface 11B. Furthermore, the four surfaces perpendicular to the first main surface 11A, in other words, the outer surfaces other than the first main surface 11A and the second main surface 11B, are designated as the side surfaces 11C of the blank 11. The shapes of the first main surface 11A, the second main surface 11B, and the side surfaces 11C of the blank 11 are all rectangular.

[0056] Here, the axis parallel to the long side of the first main surface 11A is designated as the first axis X. The axis parallel to the short side of the first main surface 11A is designated as the second axis Y. The axis perpendicular to the first main surface 11A is designated as the third axis Z. In this embodiment, the first axis X, the second axis Y, and the third axis Z are orthogonal to each other. Furthermore, a specific direction along the first axis X is designated as the first positive direction X1, and the direction opposite to the first positive direction X1 is designated as the first negative direction X2. Similarly, a specific direction along the second axis Y is designated as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is designated as the second negative direction Y2. Finally, the direction in which the first main surface 11A faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2.

[0057] like Figure 2 As shown, the blank 11, from the third negative direction Z2 side, sequentially comprises a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, a third magnetic layer 25, a third interlayer magnetic layer 26, and a fourth magnetic layer 27 as the magnetic layer 20. Specifically, the outer surface of the fourth magnetic layer 27 facing the third positive direction Z1 is the first main surface 11A. The outer surface of the first magnetic layer 21 facing the third negative direction Z2 is the second main surface 11B. Furthermore, in... Figure 2 In the diagram, the boundaries of each magnetic layer 20 are hypothetically illustrated using double-dotted lines. In reality, clear boundaries are sometimes not observable between these magnetic layers 20.

[0058] The material of the magnetic layer 20, i.e., the material of the blank 11, includes a magnetic material. Specifically, the material of the blank 11 is an organic resin containing metallic magnetic powder. In this embodiment, the metallic magnetic powder is a metallic magnetic powder composed of an Fe-based alloy or an amorphous alloy. More specifically, the metallic magnetic powder is an FeSiCr-based metallic powder containing iron.

[0059] The inductor component 10 has three insulating layers. The three insulating layers are a first insulating layer 31, a second insulating layer 32, and a third insulating layer 33. Each insulating layer is made of insulating resin.

[0060] The first insulating layer 31 extends within the blank 11 on a plane parallel to the first main surface 11A. The first insulating layer 31 contacts the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 31 is the same as that of the first interlayer magnetic layer 22.

[0061] The second insulating layer 32 extends within the blank 11 on a plane parallel to the first main surface 11A. In the third axis Z direction, the position of the second insulating layer 32 is the same as the position of the second interlayer magnetic layer 24.

[0062] The third insulating layer 33 extends within the blank 11 on a plane parallel to the first main surface 11A. The third insulating layer 33 contacts the surface of the fourth magnetic layer 27 on the third negative direction Z2 side. In the third axis Z direction, the position of the third insulating layer 33 is the same as the position of the third interlayer magnetic layer 26. Furthermore, "parallel" simply means substantially parallel, allowing for manufacturing errors. For example, if the acute angle formed by the first insulating layer 31 and the first main surface 11A is less than 5 degrees, it is considered parallel.

[0063] like Figure 2 As shown, the inductor component 10 includes inductor wiring 50. The inductor wiring 50 is located inside the blank 11. The inductor wiring 50 is made of a conductive material. In this embodiment, the inductor wiring 50 is composed of copper with a ratio of 99 wt% or more and sulfur with a ratio of 0.1 wt% or more and 1.0 wt% or less.

[0064] The inductor wiring 50 includes upper inductor wiring 51U and lower inductor wiring 51L.

[0065] The lower inductor wiring 51L extends parallel to the first main surface 11A. The lower inductor wiring 51L is located in the same layer as the first insulating layer 31 and the second magnetic layer 23 in the third axis Z direction. That is, the outer surface of the lower inductor wiring 51L on the third negative direction Z2 side is in contact with the outer surface of the first magnetic layer 21 on the third positive direction Z1 side. The second insulating layer 32 and the upper inductor wiring 51U are located on the outer surface of the lower inductor wiring 51L on the third positive direction Z1 side.

[0066] The lower inductor wiring 51L includes a lower wiring body 52L. The lower wiring body 52L is the portion of the lower inductor wiring 51L located in the same layer as the second magnetic layer 23 in the third axis Z direction. Therefore, the lower wiring body 52L extends on the outer surface of the first insulating layer 31 in the third positive direction Z1 side. That is, the outer surface of the lower wiring body 52L in the third negative direction Z2 side is in contact with the outer surface of the first insulating layer 31 in the third positive direction Z1 side.

[0067] like Figure 3 As shown, when the inductor component 10 is viewed in the third negative direction Z2, the lower inductor wiring 51L extends in a spiral shape. Furthermore, there is a distance between the outer edge of the lower inductor wiring 51L and the side surface 11C of the blank 11. Therefore, the lower inductor wiring 51L is not exposed on the side surface 11C of the blank 11. In this embodiment, other conductive objects reaching the side surface 11C of the blank 11 are not connected to the lower inductor wiring 51L. Therefore, conductive objects electrically connected to the lower inductor wiring 51L are not exposed on the side surface 11C of the blank 11.

[0068] The lower layer routing body 52L has a pair of lower layer pad portions LP and a lower layer routing portion LL. The lower layer pad portions LP are located at both ends of the lower layer routing body 52L. The lower layer pad portion LP located on the first positive direction X1 side is designated as the lower layer inner pad portion LP1. The lower layer pad portion LP located on the first negative direction X2 side relative to the lower layer inner pad portion LP1 is designated as the lower layer outer pad portion LP2. In other words, when viewed in the third negative direction Z2, the lower layer inner pad portion LP1 is located on the first positive direction X1 side relative to the geometric center of the blank 11. The lower layer outer pad portion LP2 is located on the first negative direction X2 side relative to the lower layer inner pad portion LP1.

[0069] The lower layer wiring section LL connects a pair of lower layer pads LP. Specifically, when viewing the inductor component 10 in the third negative direction Z2, the lower layer wiring section LL extends counterclockwise from the lower inner pad LP1 to the lower outer pad LP2, with the diameter increasing as the number of turns increases. The lower layer wiring section LL has approximately 2.0 turns.

[0070] Furthermore, the number of turns of the lower layer routing section LL is determined based on a hypothetical vector as follows: First, a vector is hypothetically defined as having a starting point and an ending point at the first end of the center line CL of the lower layer routing section LL. In this state, the vector is a zero vector. Then, with the viewpoint directed towards the third negative direction Z2, the starting point of this vector is fixed, while the ending point of the vector is moved along the center line CL of the lower layer routing section LL to the second end of the center line CL. At this time, a 360-degree rotation of the vector's orientation is defined as 1.0 turns, and the number of turns is calculated. For example, if the hypothetical vector rotates 180 degrees, the number of turns is 0.5 turns.

[0071] In the lower wiring section LL, the width dimension in the direction perpendicular to the center line CL and parallel to the first main surface 11A is approximately constant throughout the lower wiring section LL. The center line CL of the lower wiring section LL is determined as follows: When viewed in the third negative direction Z2, the line segment that connects any point on the outer edge of the lower wiring section LL to a point on its opposite outer edge is determined, and the line segment with the shortest distance between those two points is identified. When line segments are determined throughout the entire area of ​​the outer edge of the lower wiring section LL, the line connecting the midpoints of these determined line segments is taken as the center line CL of the lower wiring section LL when viewed in the third negative direction Z2.

[0072] like Figure 2 As shown, the upper inductor wiring 51U extends parallel to the first main surface 11A. The upper inductor wiring 51U is located in the same layer as the second insulating layer 32 and the third magnetic layer 25 in the third axis Z direction. The outer surface of the upper inductor wiring 51U on the third negative direction Z2 side contacts the outer surface of the lower inductor wiring 51L on the third positive direction Z1 side. The third insulating layer 33 is located on the outer surface of the upper inductor wiring 51U on the third positive direction Z1 side.

[0073] The upper inductor wiring 51U includes an upper wiring body 52U. The upper wiring body 52U is the portion of the upper inductor wiring 51U located in the same layer as the third magnetic layer 25 in the third axis Z direction. Therefore, the upper wiring body 52U extends on the outer surface of the second insulating layer 32 in the third positive direction Z1 side. That is, the outer surface of the upper wiring body 52U in the third negative direction Z2 side is in contact with the outer surface of the second insulating layer 32 in the third positive direction Z1 side.

[0074] The shape of the upper inductor wiring 51U is the same as that of the lower inductor wiring 51L. That is, as shown... Figure 4 As shown, when the inductor component 10 is viewed in the third negative direction Z2, the upper inductor wiring 51U extends in a spiral shape. Furthermore, there is a distance between the outer edge of the upper inductor wiring 51U and the side surface 11C of the blank 11. Therefore, the upper inductor wiring 51U is not exposed on the side surface 11C of the blank 11. In this embodiment, other conductive objects reaching the side surface 11C of the blank 11 are not connected to the upper inductor wiring 51U. Therefore, conductive objects electrically connected to the upper inductor wiring 51U are not exposed on the side surface 11C of the blank 11.

[0075] The upper-layer routing body 52U has a pair of upper-layer pads UP and an upper-layer routing section UL. The upper-layer pads UP are located at both ends of the upper-layer routing body 52U. The upper-layer pad UP located on the first positive direction X1 side is designated as the upper inner pad UP1. The upper-layer pad UP located on the first negative direction X2 side relative to the upper inner pad UP1 is designated as the upper outer pad UP2. In other words, the upper inner pad UP1 is located on the third positive direction Z1 side of the lower inner pad LP1. The upper outer pad UP2 is located on the third positive direction Z1 side of the lower outer pad LP2. The shape of each upper-layer pad UP is the same as the shape of the corresponding lower pad LP.

[0076] like Figure 5 As shown, the minimum width dimension 52UW of the upper wiring body 52U is the same as the minimum width dimension 52LW of the lower wiring body 52L. Here, the minimum width dimension 52UW of the upper wiring body 52U refers to the minimum dimension of the upper wiring body 52U in a direction orthogonal to the center line CL of the upper wiring body 52U and parallel to the first main surface 11A. In this embodiment, it is the dimension of the upper wiring portion UL in the aforementioned direction. Similarly, the minimum width dimension 52LW of the lower wiring body 52L refers to the minimum dimension of the lower wiring body 52L in a direction orthogonal to the center line CL of the lower wiring body 52L and parallel to the first main surface 11A. In this embodiment, it is the dimension of the lower wiring portion LL in the aforementioned direction.

[0077] The upper routing section UL connects a pair of upper pads UP. Specifically, when viewing the inductor component 10 in the third negative direction Z2, the upper routing section UL extends counterclockwise from the upper inner pad UP1 to the upper outer pad UP2, with a larger diameter corresponding to a higher number of turns. The number of turns in the upper routing section UL is the same as the number of turns in the lower routing section LL. That is, the number of turns in the upper routing section UL is approximately 2.0 turns. Furthermore, the definition of the number of turns is the same as that in the lower routing section LL.

[0078] like Figure 5 As shown, the total height dimension 50H of the inductor wiring 50 is more than twice the minimum width dimension 52LW of the lower wiring body 52L. Similarly, the total height dimension 50H of the inductor wiring 50 is more than twice the minimum width dimension 52UW of the upper wiring body 52U. In this embodiment, the total height dimension 50H of the inductor wiring 50 is approximately four times the minimum width dimension 52LW of the lower wiring body 52L and the minimum width dimension 52UW of the upper wiring body 52U. Furthermore, the total height dimension 50H mentioned here refers to the sum of the maximum dimension of the lower inductor wiring 51L and the maximum dimension of the upper inductor wiring 51U in the direction orthogonal to the first main surface 11A.

[0079] like Figure 5 As shown, the inductor component 10 includes a lower resin wall 41 and an upper resin wall 42. Each resin wall is made of insulating resin.

[0080] The lower resin wall 41 is stacked on a portion of the surface of the first insulating layer 31 in the third positive direction Z1. The lower resin wall 41 is located in the same layer as the lower wiring body 52L and the second magnetic layer 23 in the third axis Z direction. The lower resin wall 41 covers the side surface 52LS of the lower wiring body 52L in the outer surface of the lower inductor wiring 51L. Furthermore, the lower resin wall 41 also reaches the same layer as the second interlayer magnetic layer 24 and the second insulating layer 32 in the third axis Z direction. That is, the lower resin wall 41 also contacts the side surface 32S of the second interlayer magnetic layer 24 and the second insulating layer 32. Furthermore, the side surface 52LS of the lower wiring body 52L refers to the outer surface of the lower wiring body 52L other than the outer surface in the third positive direction Z1 and the outer surface in the third negative direction Z2. The side surface 32S of the second insulating layer 32 refers to the outer surface of the second insulating layer 32 other than the outer surface in the third positive direction Z1 and the outer surface in the third negative direction Z2.

[0081] The upper resin wall 42 is stacked on the surface of the lower resin wall 41 in the third positive direction Z1. The upper resin wall 42 is located in the same layer as the upper wiring body 52U and the third magnetic layer 25 in the third axis Z direction. The upper resin wall 42 covers the side surface 52US of the upper wiring body 52U in the outer surface of the upper inductor wiring 51U. Furthermore, the upper resin wall 42 also reaches the same layer as the third interlayer magnetic layer 26 and the third insulating layer 33 in the third axis Z direction. That is, the upper resin wall 42 also contacts the side surface 33S of the third interlayer magnetic layer 26 and the third insulating layer 33. Furthermore, the side surface 52US of the upper wiring body 52U refers to the outer surface of the upper wiring body 52U other than the outer surface in the third positive direction Z1 and the outer surface in the third negative direction Z2. The side surface 33S of the third insulating layer 33 refers to the outer surface of the third insulating layer 33 other than the outer surface in the third positive direction Z1 and the outer surface in the third negative direction Z2.

[0082] In addition, Figure 5 The diagram shows the outer surface of the upper resin wall 42 in the third positive direction Z1 side in contact with the outer surface of the fourth magnetic layer 27 in the third negative direction Z2 side. In reality, the outer surface of the upper resin wall 42 in the third positive direction Z1 side may not be in contact with the outer surface of the fourth magnetic layer 27 in the third negative direction Z2 side, but may be embedded in the third insulating layer 33.

[0083] The inductor component 10 includes a first columnar wiring 61A and a second columnar wiring 61B. The material of each columnar wiring is the same as that of the inductor wiring 50. Each columnar wiring extends in a direction intersecting the first main surface 11A. Each columnar wiring is located in the same layer as the third interlayer magnetic layer 26 and the fourth magnetic layer 27 in the third axis Z direction. Each columnar wiring extends in a direction orthogonal to the first main surface 11A, i.e., in the third axis Z direction.

[0084] Each columnar wiring contactes the outer surface of the upper wiring body 52U on the third positive direction Z1 side. Therefore, each columnar wiring is electrically connected to the inductor wiring 50. Specifically, the outer surface of the first columnar wiring 61A on the third negative direction Z2 side contacts the surface of the upper inner pad portion UP1 parallel to the first main surface 11A. The outer surface of the second columnar wiring 61B on the third negative direction Z2 side contacts the surface of the upper outer pad portion UP2 parallel to the first main surface 11A.

[0085] The inductor component 10 includes a first external electrode 81A and a second external electrode 81B. Each external electrode is located on the first main surface 11A of the blank 11. That is, each external electrode covers a portion of the outer surface of the blank 11.

[0086] The first external electrode 81A is located on the first main surface 11A, with its geometric center relative to the first main surface 11A on the side of the first positive direction X1. The second external electrode 81B is located on the first main surface 11A, with its geometric center relative to the first main surface 11A on the side of the first negative direction X2. Furthermore, the first external electrode 81A is in contact with the surface of the first cylindrical wiring 61A facing the third positive direction Z1. The second external electrode 81B is in contact with the surface of the second cylindrical wiring 61B facing the third positive direction Z1.

[0087] The inductor component 10 includes a solder resist 70. The solder resist 70 has higher insulation properties compared to the blank 11. The solder resist 70 covers the portion of the blank 11 facing the third positive direction Z1, excluding at least two external electrodes. That is, the first main surface 11A of the blank 11 is covered by the external electrodes and the solder resist 70, and is therefore not exposed. Furthermore, the outer surface of the solder resist 70 on the third positive direction Z1 side does not need to be completely exposed. For example, a portion of each external electrode may also cover a portion of the outer surface of the solder resist 70 on the third positive direction Z1 side.

[0088] (Regarding the protruding part)

[0089] Next, the detailed configuration of the inductor wiring 50 will be explained.

[0090] like Figure 5As shown, the lower inductor wiring 51L includes a lower wiring body 52L and a lower protrusion 53L. In the manufacturing method described later, the lower inductor wiring 51L is formed in a single process using electroplating. That is, the lower wiring body 52L and the lower protrusion 53L are integrally formed.

[0091] The lower layer protrusion 53L is a portion of the lower layer inductor wiring 51L located in the same layer as the first interlayer magnetic layer 22 in the third axis Z direction. The lower layer protrusion 53L protrudes from the outer surface of the lower layer wiring body 52L on the third negative direction Z2 side. Specifically, the lower layer protrusion 53L protrudes from both the lower layer wiring portion LL and the lower layer pad portion LP. Furthermore, the lower layer protrusion 53L penetrates the first insulating layer 31. In this embodiment, the size of the lower layer protrusion 53L is the same as the size of the first insulating layer 31 in the third axis Z direction. Therefore, the positions of the lower layer protrusion 53L, the first insulating layer 31, and the first interlayer magnetic layer 22 are the same in the third axis Z direction.

[0092] Furthermore, the outer surface of the lower protrusion 53L on the third negative direction Z2 side contacts the blank 11. The side surface 53LS of the lower protrusion 53L contacts the first insulating layer 31. Moreover, the side surface 53LS of the lower protrusion 53L refers to the outer surface of the lower protrusion 53L other than the outer surface on the third negative direction Z2 side. However, since the lower protrusion 53L protrudes from the lower wiring body 52L, it does not have an outer surface on the third positive direction Z1 side.

[0093] like Figure 3 As shown, when viewed in the third positive direction Z1, the lower layer protrusion 53L extends along the lower layer wiring body 52L. Specifically, the lower layer protrusion 53L extends from the lower inner pad portion LP1, through the lower layer wiring portion LL, to the lower outer pad portion LP2. That is, the lower layer protrusion 53L extends over approximately the entire area of ​​the lower layer wiring body 52L. Furthermore, when viewed in the third positive direction Z1, the lower layer protrusion 53L is located within the area surrounded by the outer edge of the lower layer wiring body 52L. More specifically, as... Figure 5 As shown, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimensions of each part of the lower inductor wiring 51L in the direction parallel to the first main surface 11A are defined as the width dimensions. At this time, the width dimension 53LW of the lower protrusion 53L is smaller than the width dimension of the lower wiring body 52L at the location where the lower protrusion 53L is connected in the same cross-section. Furthermore, in Figure 5In the middle, the width dimension of the lower layer wiring body 52L is the minimum width dimension 52LW. That is, the width dimension 53LW of the lower layer protrusion 53L is smaller than the minimum width dimension 52LW of the lower layer wiring body 52L at the part where the lower layer protrusion 53L is connected on the same cross section.

[0094] like Figure 5 As shown, the upper inductor wiring 51U, in addition to the upper wiring body 52U, also has an upper protrusion 53U. In the manufacturing method described later, the upper inductor wiring 51U is formed in a single process by electroplating. That is, the upper wiring body 52U and the upper protrusion 53U are integrally formed.

[0095] The upper protrusion 53U is a portion of the upper inductor wiring 51U located in the same layer as the second interlayer magnetic layer 24 in the third axis Z direction. The upper protrusion 53U protrudes from the outer surface of the upper wiring body 52U on the third negative direction Z2 side. Specifically, the upper protrusion 53U protrudes from both the upper wiring portion UL and the upper pad portion UP. Furthermore, the upper protrusion 53U penetrates the second insulating layer 32. In this embodiment, the size of the upper protrusion 53U is the same as the size of the second insulating layer 32 in the third axis Z direction. Therefore, the positions of the upper protrusion 53U, the second insulating layer 32, and the second interlayer magnetic layer 24 are the same in the third axis Z direction.

[0096] Furthermore, the outer surface of the upper protrusion 53U on the third negative direction Z2 side contacts the outer surface of the lower wiring body 52L on the third positive direction Z1 side. The side surface 53US of the upper protrusion 53U contacts the second insulating layer 32. Moreover, the side surface 53US of the upper protrusion 53U refers to the outer surface of the upper protrusion 53U other than the outer surface on the third negative direction Z2 side. However, since the upper protrusion 53U protrudes from the upper wiring body 52U, it does not have an outer surface on the third positive direction Z1 side.

[0097] When viewed in the third positive direction Z1, the upper protrusion 53U extends along the upper wiring body 52U. Specifically, the upper protrusion 53U extends from the upper inner pad portion UP1, through the upper wiring portion UL, to the upper outer pad portion UP2. That is, the upper protrusion 53U extends over approximately the entire area of ​​the upper wiring body 52U. Furthermore, as... Figure 4 As shown, when viewed in the third positive direction Z1, the upper protrusion 53U is located within the area surrounded by the outer edge of the upper wiring body 52U. More specifically, as... Figure 5As shown, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimensions of each part of the upper inductor wiring 51U in the direction parallel to the first main surface 11A are defined as the width dimensions. At this time, the width dimension 53UW of the upper protrusion 53U is smaller than the width dimension of the upper wiring body 52U at the location where the upper protrusion 53U is connected in the same cross-section. Furthermore, in Figure 5 In this context, the width dimension of the upper wiring body 52U is the minimum width dimension 52UW. That is, the width dimension 53UW of the upper protrusion 53U is smaller than the minimum width dimension 52UW of the upper wiring body 52U at the location where the upper protrusion 53U is connected on the same cross-section.

[0098] (Regarding the introduction)

[0099] Next, the detailed structure of each columnar wiring will be explained.

[0100] like Figure 5 As shown, the first columnar wiring 61A includes a first columnar portion 62A and a first lead-out portion 63A. In the manufacturing method described later, the first columnar wiring 61A is formed in a single process by electroplating. Therefore, the first columnar portion 62A and the first lead-out portion 63A are integrally formed. The shapes of the first columnar portion 62A and the first lead-out portion 63A are both approximately semi-circular columns corresponding to the shape of the upper inner pad portion UP1.

[0101] The first columnar portion 62A is a portion of the first columnar wiring 61A located in the same layer as the fourth magnetic layer 27 in the third axis Z direction. The first columnar portion 62A extends from the outer surface of the third positive direction Z1 side of the third insulating layer 33 to the third positive direction Z1 side. That is, the outer surface of the first columnar portion 62A on the third negative direction Z2 side is in contact with the outer surface of the third positive direction Z1 side of the third insulating layer 33.

[0102] The first lead-out portion 63A is a portion located in the same layer as the third interlayer magnetic layer 26 along the third axis Z direction. The first lead-out portion 63A protrudes from the outer surface of the first columnar portion 62A on the third negative direction Z2 side. Furthermore, the first lead-out portion 63A penetrates the third insulating layer 33. Additionally, the dimensions of the first lead-out portion 63A are the same as those of the third insulating layer 33 along the third axis Z direction. Therefore, the positions of the first lead-out portion 63A, the third insulating layer 33, and the third interlayer magnetic layer 26 are identical along the third axis Z direction.

[0103] One end of the first lead-out portion 63A, on the outer surface of the third negative direction Z2 side, contacts the surface of the upper inner pad portion UP1 parallel to the first main surface 11A. The outer edge of the first lead-out portion 63A is parallel to the outer edge of the upper inner pad portion UP1. Furthermore, when viewed in the third positive direction Z1, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the first columnar portion 62A. Moreover, when viewed in the third positive direction Z1, the area surrounded by the outer edge of the first columnar portion 62A is less than 1.3 times the area surrounded by the outer edge of the first lead-out portion 63A.

[0104] The side surface 63AS of the first lead-out portion 63A contacts the third insulating layer 33. Furthermore, the side surface 63AS of the first lead-out portion 63A refers to the outer surface of the first lead-out portion 63A excluding the outer surface on the third negative direction Z2 side. However, the first lead-out portion 63A protrudes from the first columnar portion 62A, and therefore does not have an outer surface on the third positive direction Z1 side.

[0105] Furthermore, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimension of each part of the first columnar wiring 61A in the direction parallel to the first main surface 11A is defined as the width dimension of the first columnar wiring 61A. The width dimension 63AW of the first lead-out portion 63A is smaller than the width dimension 62AW of the first columnar portion 62A at the location where the first lead-out portion 63A is connected on the same cross-section.

[0106] The second columnar wiring 61B includes a second columnar portion 62B and a second lead-out portion 63B. In the manufacturing method described later, the second columnar wiring 61B is formed in a single process by electroplating. Therefore, the second columnar portion 62B and the second lead-out portion 63B are integrally formed. The shapes of the second columnar portion 62B and the second lead-out portion 63B are both approximately quadrangular prisms corresponding to the shape of the upper inner pad portion UP1.

[0107] The second columnar portion 62B is a portion of the second columnar wiring 61B located in the same layer as the fourth magnetic layer 27 in the third axis Z direction. The second columnar portion 62B extends from the outer surface of the third positive direction Z1 side of the third insulating layer 33 to the third positive direction Z1 side. That is, the outer surface of the second columnar portion 62B on the third negative direction Z2 side is in contact with the outer surface of the third positive direction Z1 side of the third insulating layer 33.

[0108] The second lead-out portion 63B is a portion located in the same layer as the third interlayer magnetic layer 26 along the third axis Z direction. The second lead-out portion 63B protrudes from the outer surface of the second columnar portion 62B on the third negative direction Z2 side. Furthermore, the second lead-out portion 63B penetrates the third insulating layer 33. Additionally, the dimensions of the second lead-out portion 63B are the same as those of the third insulating layer 33 along the third axis Z direction. Therefore, the positions of the second lead-out portion 63B, the third insulating layer 33, the third interlayer magnetic layer 26, and the first lead-out portion 63A are identical along the third axis Z direction.

[0109] The outer surface of one end of the second lead-out portion 63B in the third negative direction Z2 is in contact with the surface of the upper outer pad portion UP2 that is parallel to the second main surface 11B. The outer edge of the second lead-out portion 63B is parallel to the outer edge of the upper outer pad portion UP2. Furthermore, when viewed in the third positive direction Z1, the outer edge of the second lead-out portion 63B is parallel to the outer edge of the second columnar portion 62B. Moreover, when viewed in the third positive direction Z1, the area surrounded by the outer edge of the second columnar portion 62B is less than 1.3 times the area surrounded by the outer edge of the second lead-out portion 63B.

[0110] The side surface 63BS of the second lead-out portion 63B contacts the third insulating layer 33. Furthermore, the side surface 63BS of the second lead-out portion 63B refers to the outer surface of the second lead-out portion 63B other than the outer surface on the third negative direction Z2 side. However, the second lead-out portion 63B protrudes from the second columnar portion 62B, therefore it does not have an outer surface on the third positive direction Z1 side.

[0111] Furthermore, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimension of each part of the second columnar wiring 61B in the direction parallel to the first main surface 11A is defined as the width dimension of the second columnar wiring 61B. The width dimension 63BW of the second lead-out portion 63B is smaller than the width dimension 62BW of the second columnar portion 62B at the location where the second lead-out portion 63B is connected on the same cross-section.

[0112] (Regarding the manufacturing method)

[0113] Next, the manufacturing method of the inductor component 10 in the first embodiment will be described. In the manufacturing method of the inductor component 10, a so-called semi-additive process (SAP) is applied.

[0114] like Figure 6As shown, the manufacturing method of the inductor component 10 includes the following 18 steps. That is, the manufacturing method of the inductor component 10 includes a base preparation step S11, an adhesive layer formation step S12, a seed layer formation step S13, a first insulating layer formation step S14, a lower resin wall formation step S15, a lower inductor wiring formation step S16, a second insulating layer formation step S17, an upper resin wall formation step S18, an upper inductor wiring formation step S19, a third insulating layer formation step S20, a columnar wiring formation step S21, an insulating layer cutting step S22, a first blank formation step S23, a solder resist formation step S24, a seed layer removal step S25, a second blank formation step S26, an external electrode formation step S27, and a monolithization step S28.

[0115] like Figure 7 As shown, firstly, a base preparation process S11 is performed. Specifically, a plate-shaped base substrate 91 is prepared. The base substrate 91 is made of ceramic. The dimensions of the main surface 91A of the base substrate 91 are such that multiple inductor components 10 can be formed.

[0116] Here, the axis orthogonal to the main surface 91A of the base substrate 91 is designated as the third axis Z. Furthermore, the direction in which the first main surface 11A faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2. In other words, the third positive direction Z1 is the "upward direction," and the third negative direction Z2 is the "downward direction." That is, the "upper surface" refers to the surface facing the third positive direction Z1, and the "lower surface" refers to the surface facing the third negative direction Z2. Moreover, the third positive direction Z1 during the manufacturing of the inductor component 10 corresponds to the third positive direction Z1 in the manufactured inductor component 10. The same applies to the third negative direction Z2.

[0117] Next, as Figure 8 As shown, the adhesive layer forming process S12 is performed. In the adhesive layer forming process S12, an adhesive layer 92 with adhesive properties is coated on the main surface 91A of the base substrate 91. Specifically, the adhesive layer 92 is made of a resin such as polyimide.

[0118] Next, as Figure 9 As shown, a seed layer formation process S13 is performed. In the seed layer formation process S13, a conductive seed layer 93 is formed on the main surface 91A of the base substrate 91. Specifically, the seed layer 93 is formed on the upper surface of the adhesive layer 92 by sputtering. Furthermore, the material of the seed layer 93 is copper. Moreover, the seed layer 93 formed using the seed layer formation process S13 of this embodiment is not a patterned seed layer. For example, the seed layer 93 is formed entirely on the main surface 91A of the base substrate 91.

[0119] Next, as Figure 10 As shown, a first insulating layer formation step S14 is performed. In the first insulating layer formation step S14, a first insulating layer 31 with a predetermined wiring pattern and a first opening 94 is formed on the upper surface of the seed layer 93 by photolithography. The position and shape of the first opening 94 correspond to the position and shape of the lower layer protrusion 53L of the lower layer inductor wiring 51L formed in subsequent steps. In addition, the range of the first opening 94 is slightly narrower than the range of the lower layer wiring body 52L formed. Therefore, the "determined wiring pattern" in the first insulating layer formation step S14 refers to the position and shape along the lower layer inductor wiring 51L formed in the lower layer inductor wiring formation step S16.

[0120] Next, as Figure 11 As shown, the lower resin wall formation process S15 is performed. In the lower resin wall formation process S15, the lower resin wall 41 is formed on the upper surface of the first insulating layer 31 along the outer edge of the first opening 94 by photolithography. At this time, the lower resin wall 41 is formed at a position slightly separated from the opening edge of the first opening 94.

[0121] Next, as Figure 12 As shown, the lower inductor wiring formation process S16 is performed. In the lower inductor wiring formation process S16, the lower inductor wiring 51L is formed by electroplating by supplying power to the seed layer 93. More specifically, the lower wiring body 52L is formed within the space surrounded by the lower resin wall 41, and a lower protrusion 53L protruding from and extending along the lower wiring body 52L is integrally formed within the first opening 94. In the lower inductor wiring formation process S16, the lower inductor wiring 51L is formed by electroplating in one step, thus the lower wiring body 52L and the lower protrusion 53L are integrally formed.

[0122] Next, as Figure 13 As shown, a second insulating layer formation process S17 is performed. In the second insulating layer formation process S17, a second insulating layer 32 with a predetermined wiring pattern and a second opening 95 is formed on the upper surface of the lower layer wiring body 52L by photolithography. The position and shape of the second opening 95 correspond to the position and shape of the upper layer protrusion 53U of the upper layer inductor wiring 51U formed in a subsequent process. In addition, the range of the second opening 95 is slightly narrower than the range of the upper layer wiring body 52U. Therefore, the "determined wiring pattern" in the second insulating layer formation process S17 refers to the position and shape along the upper layer inductor wiring 51U formed in the upper layer inductor wiring formation process S19.

[0123] Furthermore, in a direction parallel to the main surface 91A, the size of the second opening 95 is the same as the size of the first opening 94. In other words, when viewed towards the third negative direction Z2, the outer edge shape of the second opening 95 is the same as the outer edge shape of the first opening 94. Moreover, "same" means allowing for, for example, a 5% manufacturing tolerance.

[0124] Next, as Figure 14 As shown, the upper resin wall formation process S18 is performed. In the upper resin wall formation process S18, the upper resin wall 42 is formed on the upper surface of the second insulating layer 32 along the outer edge of the second opening 95 by photolithography. At this time, the upper resin wall 42 is formed at a position slightly separated from the opening edge of the second opening 95.

[0125] Next, as Figure 15 As shown, the upper inductor wiring formation process S19 is performed. In the upper inductor wiring formation process S19, the upper inductor wiring 51U is formed by electroplating by supplying power to the seed layer 93. More specifically, the upper wiring body 52U is formed within the space surrounded by the upper resin wall 42, and an upper protrusion 53U protruding from and extending along the upper wiring body 52U is integrally formed within the second opening 95. In the upper inductor wiring formation process S19, the upper inductor wiring 51U is formed by electroplating in one step, thus the upper wiring body 52U and the upper protrusion 53U are integrally formed.

[0126] Next, as Figure 16 As shown, a third insulating layer formation process S20 is performed. In the third insulating layer formation process S20, a third insulating layer 33 with a predetermined pattern of a third opening 96 is formed on the upper surface of the upper wiring body 52U by photolithography. The position and shape of the third opening 96 correspond to the position and shape of the first lead-out portion 63A and the second lead-out portion 63B formed subsequently. On the other hand, the range of the third opening 96 is slightly narrower than the range of each columnar portion.

[0127] Next, as Figure 17 As shown, the columnar wiring formation process S21 is performed. In the columnar wiring formation process S21, by supplying power to the seed layer 93, each lead-out portion is formed in the third opening 96 through electroplating via the inductor wiring 50. Furthermore, each columnar portion is integrally formed on the third positive direction Z1 side of the third insulating layer 33 and the lead-out portion.

[0128] Specifically, although not illustrated, an auxiliary wall made of resin is formed on the upper surface of the third insulating layer 33 along the outer edge of the third opening 96 using photolithography. At this time, the auxiliary wall is formed at a position slightly separated from the opening edge of the third opening 96. Next, each columnar portion is formed within the space surrounded by the auxiliary wall using electroplating. Simultaneously, within the third opening 96, a first lead-out portion 63A protruding from the first columnar portion 62A and a second lead-out portion 63B protruding from the second columnar portion 62B are integrally formed. Then, by removing the auxiliary wall, each columnar wiring is formed.

[0129] Next, as Figure 18 As shown, an insulating layer cutting process S22 is performed. In the insulating layer cutting process S22, excess portions of the first insulating layer 31 are removed by laser. Specifically, portions of the first insulating layer 31 that do not overlap with areas containing inductor wiring 50 and resin walls when viewed from a direction orthogonal to the main surface 91A of the base substrate 91 are cut, so that the seed layer 93 is exposed.

[0130] Next, as Figure 19 As shown, the first blank forming process S23 is performed. In the first blank forming process S23, a magnetic layer 20 containing magnetic material is formed around the lower wiring body 52L, the lower protrusion 53L, the upper wiring body 52U, the upper protrusion 53U, each lead-out portion, and each columnar portion. Specifically, a magnetic layer 20 other than the first magnetic layer 21 is formed around the first insulating layer 31 covering the lower protrusion 53L, around the lower resin wall 41 covering the lower wiring body 52L, around the second insulating layer 32 covering the upper protrusion 53U, around the upper resin wall 42 covering the upper wiring body 52U, around the third insulating layer 33 covering the two leads-out portions, and around the two columnar portions.

[0131] More specifically, in the first blank forming process S23, firstly, a resin containing magnetic powder is coated onto the upper surface of the seed layer 93. At this time, the resin containing magnetic powder is coated so that it also covers the upper surface of each columnar wire. Next, a stamping process is performed to cure the resin containing magnetic powder. Afterward, the portion of the resin on the upper surface side is cut until the upper surface of each columnar wire is exposed. Thus, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, a third magnetic layer 25, a third interlayer magnetic layer 26, and a fourth magnetic layer 27 are formed on the upper surface side of the seed layer 93. Furthermore, in Figures 19-24 In the illustration, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, the third magnetic layer 25, the third interlayer magnetic layer 26, and the fourth magnetic layer 27 are not distinguished, and are instead shown as magnetic layer 20.

[0132] Next, as Figure 20 As shown, a solder resist formation process S24 is performed. In the solder resist formation process S24, solder resist 70 is formed in the areas on the upper surface of the third magnetic layer 25 and the upper surface of each columnar wiring where the first external electrode 81A and the second external electrode 81B are not formed. Specifically, insulating resin is patterned in this area by photolithography.

[0133] Next, as Figure 21 As shown, the seed layer removal process S25 is performed. In the seed layer removal process S25, firstly, the base substrate 91 is cut and removed. Next, the adhesive layer 92 is removed by methods such as desmearing and ashing. Subsequently, the seed layer 93 is removed by etching. Furthermore, the substrate from the upper inductor wiring formation process S19 to the removal of the base substrate 91 in the seed layer removal process S25 is processed into a substrate 99 for inductor component manufacturing.

[0134] Next, as Figure 22 As shown, a second preform forming process S26 is performed. In the second preform forming process S26, a first magnetic layer 21 containing magnetic material is formed on the lower surface of the first insulating layer 31 and the first interlayer magnetic layer 22. Specifically, in the second preform forming process S26, firstly, a resin containing magnetic powder is coated on the lower surface of the first insulating layer 31 and the first interlayer magnetic layer 22. Next, the resin containing magnetic powder is cured by stamping. Subsequently, the lower surface side of the resin is cut to make the dimensions of the inductor component 10 reach the desired value. Thus, the first magnetic layer 21 is formed on the surface of the first insulating layer 31 and the first interlayer magnetic layer 22 on the third negative direction Z2 side. Furthermore, in Figures 22-24 In the illustration, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, the third magnetic layer 25, the third interlayer magnetic layer 26, and the fourth magnetic layer 27 are not distinguished and are instead shown as magnetic layer 20.

[0135] Next, as Figure 23 As shown, an external electrode forming process S27 is performed. In the external electrode forming process S27, a first external electrode 81A and a second external electrode 81B are formed. The area where each external electrode is formed is the area on the upper surface of the fourth magnetic layer 27 and the upper surface of each columnar wiring that is not covered by the solder resist 70. Copper plating, nickel plating, and gold plating are performed sequentially in this area using an electroless plating method. Thus, the first external electrode 81A and the second external electrode 81B are formed in the aforementioned area. Furthermore, in... Figure 23 as well as Figure 24 The diagram does not differentiate between the copper, nickel, and gold plating layers.

[0136] Next, as Figure 24As shown, a monolithic assembly process S28 is performed. In the monolithic assembly process S28, the inductor component 10 is monolithically assembled by cutting. Specifically, the multiple integrally formed inductor components 10 are separated into individual inductor components 10. Furthermore, in Figure 24 In the diagram, the cut surface SL of the inductor component 10 is represented by a dashed line. The inductor component 10 is manufactured through the above processes.

[0137] (Regarding the effects of the first embodiment)

[0138] (1-1) In the above embodiment, the inductor wiring 50 includes a lower inductor wiring 51L and an upper inductor wiring 51U. Therefore, compared to the case where only the lower inductor wiring 51L is present, the cross-sectional area of ​​the inductor wiring 50 is increased by the amount of the upper inductor wiring 51U. As a result, the DC resistance of the inductor wiring 50 can be reduced. Furthermore, since the inductor wiring 50 is larger in the height direction, the likelihood of narrowing the spacing between parallel portions in the inductor wiring 50 is lower compared to the case where the inductor wiring 50 is increased in the width direction. That is, the likelihood of different portions of the inductor wiring 50 short-circuiting with each other is reduced.

[0139] Furthermore, the lower inductor wiring 51L includes a lower wiring body 52L and a lower protrusion 53L. The lower protrusion 53L extends to the location where the first insulating layer 31 is located in a direction orthogonal to the first main surface 11A. Therefore, the cross-sectional area of ​​the lower inductor wiring 51L is increased by the amount of the lower protrusion 53L. As a result, the DC resistance of the lower inductor wiring 51L can be reduced.

[0140] Furthermore, the lower layer protrusion 53L protrudes from the outer surface of the lower layer wiring body 52L on the third negative direction Z2 side and extends along the lower layer wiring body 52L. That is, the lower layer protrusion 53L exists within the range of the outer surface of the lower layer wiring body 52L on the third negative direction Z2 side.

[0141] (1-2) Since the outer surface of the lower protrusion 53L on the third negative direction Z2 side is in contact with the blank 11, it does not come into contact with other conductive objects. As a result, the possibility of different parts of the lower protrusion 53L short-circuiting with each other is reduced.

[0142] (1-3) In the above embodiments, the total height dimension 50H of the inductor wiring 50 is more than twice the minimum width dimension 52LW of the lower wiring body 52L. The total height dimension 50H of the inductor wiring 50 is more than twice the minimum width dimension 52UW of the upper wiring body 52U. If the total height dimension 50H of the inductor wiring 50 is more than twice each minimum width dimension, the DC resistance becomes smaller.

[0143] (1-4) In the above embodiments, the lower wiring body 52L and the lower protrusion 53L are integrally formed. Therefore, electric field disturbance at the boundary surface between the lower wiring body 52L and the lower protrusion 53L is prevented. That is, compared with the case where there is a clear boundary surface between the lower wiring body 52L and the lower protrusion 53L, the DC resistance can be reduced.

[0144] (1-5) In the above embodiments, the inductor wiring 50 and conductive materials are not exposed on the side 11C of the blank 11. Specifically, for example, the wiring used to form the inductor wiring 50 by electroplating is not exposed. As a result, corrosion of the conductive materials exposed on the side 11C of the blank 11 will not erode the inductor wiring 50 inside the blank 11.

[0145] (1-6) In the above embodiments, the side surface 53LS of the lower protrusion 53L is covered by the first insulating layer 31. This further improves the insulation between different parts of the lower protrusion 53L.

[0146] (1-7) In the above embodiments, the inductor component 10 has a first columnar wiring 61A and a second columnar wiring 61B. Thus, in the first main surface 11A or the second main surface 11B of the blank 11, the inductor wiring 50 can be electrically connected to an external electronic substrate.

[0147] (1-8) In the above embodiment, the upper inductor wiring 51U and the first columnar wiring 61A are in contact. Compared to the case where other metal layers are sandwiched between the upper inductor wiring 51U and the first columnar wiring 61A, the boundary surface from the upper inductor wiring 51U to the first columnar wiring 61A is reduced. Therefore, it prevents the resistance between the upper inductor wiring 51U and the first columnar wiring 61A from becoming high. The same applies to the second columnar wiring 61B.

[0148] (1-9) In the above embodiments, the upper inductor wiring 51U includes an upper protrusion 53U. Furthermore, the side surface 53US of the upper protrusion 53U is covered by a second insulating layer 32. This improves the insulation between different parts of the upper protrusion 53U.

[0149] (1-10) In the above embodiments, the upper wiring body 52U and the upper protrusion 53U are integrally formed. Therefore, electric field disturbance at the boundary surface between the upper wiring body 52U and the upper protrusion 53U is prevented. That is, compared with the case where there is a clear boundary surface between the upper wiring body 52U and the upper protrusion 53U, the DC resistance can be reduced.

[0150] (1-11) In the above embodiment, the lower resin wall 41 contacts the side surface 32S of the second insulating layer 32. As a result, the insulation between different parts of the inductor wiring 50 is further improved near the contact area between the lower inductor wiring 51L and the upper inductor wiring 51U.

[0151] (1-12) In the above embodiment, when forming the lower inductor wiring 51L, a wiring pattern is formed in the first insulating layer 31. Therefore, even if the distance between different parts of the lower inductor wiring 51L is formed to be narrow, the possibility of short circuits between them is low. Therefore, compared with the case where the wiring pattern is formed by seed, the narrower space in the blank 11 can be used more effectively.

[0152] Furthermore, the inductor wiring 50 is formed through the upper inductor wiring formation process S19 and the lower inductor wiring formation process S16. Compared with the case where the inductor wiring 50 with a large height dimension is formed by electroplating in one step, the generation of manufacturing errors can be reduced.

[0153] (1-13) In the above embodiment, a second insulating layer 32 is formed when forming the upper inductor wiring 51U. As a result, the possibility of short circuits occurring between different parts of the upper inductor wiring 51U due to manufacturing errors is reduced. That is, the insulation between different parts of the upper inductor wiring 51U is improved.

[0154] (1-14) In the above embodiments, the substrate 99 for manufacturing the inductor component includes a base substrate 91. Therefore, during the manufacturing process of the inductor component 10, the base substrate 91 is held and processed. For example, compared with the case where the blank 11 is directly held and processed, the possibility of damage to the inductor component 10 can be reduced.

[0155] (1-15) In the above embodiments, the substrate 99 for manufacturing the inductor component includes an adhesive layer 92. As a result, compared to the case of cutting the base substrate 91, it is easier to separate the seed layer 93 and the base substrate 91. Therefore, the manufacturing difficulties of the inductor component 10 can be reduced.

[0156] (1-16) In the above embodiment, the inductor wiring 50 is spiral-shaped, and the number of turns of the inductor wiring 50 is greater than 1 turn. In other words, the inductor wiring 50 has different portions connected in parallel with each other. In this case, the inductor wiring 50 also has a lower protrusion 53L, so the cross-sectional area of ​​the inductor wiring 50 can be ensured without increasing the width of the inductor wiring 50. That is, the cross-sectional area of ​​the inductor wiring 50 is easily ensured, and short circuits are prevented between the parallel portions of the inductor wiring 50.

[0157] (1-17) In the above embodiment, each columnar wiring includes a columnar portion and a lead-out portion. Furthermore, each columnar portion is connected to the inductor wiring 50 via a lead-out portion integrally formed with the columnar portion. That is, no other conductive portion such as a seed layer 93 is sandwiched between each columnar wiring and the inductor wiring 50. Therefore, compared to the case where other conductive portions exist between each columnar wiring and the inductor wiring 50, the manufacturing process of the inductor component 10 can be simplified.

[0158] (1-18) In the above embodiment, when viewed in the third positive direction Z1, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the first columnar portion 62A. Furthermore, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the upper inner pad portion UP1. Therefore, the structure is simplified compared to the case where the outer edges are not parallel. The same applies to the outer edges of the second columnar wiring 61B and the upper outer pad portion UP2.

[0159] (1-19) In the above embodiment, when viewed in the third positive direction Z1, the area surrounded by the outer edge of the first columnar portion 62A is less than 1.3 times the area surrounded by the outer edge of the first lead-out portion 63A. With such a small area difference, it is highly likely that the columnar portion can be shaped as designed, even without a conductive portion such as the seed layer 93, by means of power supply via the inductor wiring 50. The same applies to the second columnar portion 62B and the second lead-out portion 63B.

[0160] (1-20) In the above embodiment, each lead-out portion is covered by a third insulating layer 33. This improves the insulation between each lead-out portion and the blank 11.

[0161] (1-21) In the above embodiment, in the columnar wiring forming process S21, each columnar portion and the lead-out portion are integrally formed. That is, during the manufacturing process of the inductor component 10, no other conductive portions such as the seed layer 93 are sandwiched between each columnar wiring and the inductor wiring 50. Therefore, compared with the case where there are other conductive portions between each columnar wiring and the inductor wiring 50, the manufacturing process of the inductor component 10 can be simplified.

[0162] <Inductor component of the second embodiment>

[0163] Hereinafter, a second embodiment of the inductor component and the method for manufacturing the inductor component will be described.

[0164] (Regarding the overall composition)

[0165] like Figure 25 as well as Figure 26As shown, the inductor component 110 of the second embodiment differs from the first embodiment mainly in that it includes a second inductor wiring 150B, a first external electrode 81A to a fourth external electrode 81D, and the blank 11 does not have a second interlayer magnetic layer 24 and a third interlayer magnetic layer 26. Furthermore, since the blank 11 does not include the second interlayer magnetic layer 24, the inductor component 110 does not have a second insulating layer 32. Also, the upper inductor wiring does not have an upper protrusion. In other words, each upper inductor wiring in the second embodiment only has an upper wiring body. Since the blank 11 does not include the third interlayer magnetic layer 26, the inductor component 110 does not have a second insulating layer 32. Furthermore, each columnar wiring does not have a lead-out portion. In the following description, for configurations identical to those in the first embodiment, the same reference numerals will be used, and descriptions will be omitted or simplified.

[0166] like Figure 25 As shown, the outer surfaces of the first main surface 11A and the second main surface 11B on the outer surface of the blank 11 are approximately square.

[0167] like Figure 26 As shown, the inductor component 110 has a first insulating layer 131. When viewed from the third positive direction Z1 side, the first insulating layer 131 extends in the blank 11 on a plane parallel to the first main surface 11A. The first insulating layer 131 is in contact with the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 131 is the same as that of the first interlayer magnetic layer 22. In this embodiment, corresponding to the case where the inductor component 110 has a first inductor wiring 150A and a second inductor wiring 150B, the first insulating layer 131 exists separately in two locations.

[0168] The inductor component 110 has two inductor wirings. Specifically, the inductor component 110 has a first inductor wiring 150A and a second inductor wiring 150B. The first inductor wiring 150A and the second inductor wiring 150B are located on the same layer in the third axis Z direction. When viewed from the third positive direction Z1 side, the first inductor wiring 150A and the second inductor wiring 150B extend in an S-shape.

[0169] Hereinafter, the lower layer inductor wiring of the first inductor wiring 150A is designated as the first lower layer inductor wiring 151LA, the lower layer wiring portion is designated as the first lower layer wiring portion LLA, the two lower layer pad portions are designated as the first lower layer pad portions LPA, the lower layer wiring body is designated as the first lower layer wiring body 152LA, and the lower layer protrusion is designated as the first lower layer protrusion 153LA. Furthermore, the first lower layer pad portion LPA located on the first positive direction X1 side is designated as the first end lower layer pad portion LP1A, and the first lower layer pad portion LPA located on the first negative direction X2 side is designated as the second end lower layer pad portion LP2A.

[0170] The upper inductor wiring of the first inductor wiring 150A is designated as the first upper inductor wiring 151UA, the upper wiring portion is designated as the first upper wiring portion ULA, the two upper pad portions are designated as the first upper pad portions UPA, and the upper wiring body is designated as the first upper wiring body 152UA. Furthermore, the first upper pad portion UPA located on the first positive direction X1 side is designated as the first end upper pad portion UP1A, and the first upper pad portion UPA located on the first negative direction X2 side is designated as the second end upper pad portion UP2A.

[0171] Furthermore, in the following description, the lower layer inductor wiring included in the second inductor wiring 150B is designated as the second lower layer inductor wiring 151LB, the lower layer wiring portion is designated as the second lower layer wiring portion LLB, the two lower layer pad portions are designated as the second lower layer pad portions LPB, the lower layer wiring body is designated as the second lower layer wiring body 152LB, and the lower layer protrusion is designated as the second lower layer protrusion 153LB. Moreover, the second lower layer pad portion LPB located on the first positive direction X1 side is designated as the first end lower layer pad portion LP1B, and the second lower layer pad portion LPB located on the first negative direction X2 side is designated as the second end lower layer pad portion LP2B.

[0172] The upper inductor wiring of the second inductor wiring 150B is designated as the second upper inductor wiring 151UB, the upper wiring portion is designated as the second upper wiring portion ULB, the two upper pad portions are designated as the second upper pad portions UPB, and the upper wiring body is designated as the second upper wiring body 152UB. Furthermore, the second upper pad portion UPB located on the first positive direction X1 side is designated as the first end upper pad portion UP1B, and the second upper pad portion UPB located on the first negative direction X2 side is designated as the second end upper pad portion UP2B.

[0173] like Figure 27As shown, the outer surface of the first upper inductor wiring 151UA in the third positive direction Z1 side is in contact with the outer surface of the fourth magnetic layer 27 in the third negative direction Z2 side and the outer surface of the columnar wiring in the third negative direction Z2 side. Additionally, although not shown in the figure, the outer surface of the second upper inductor wiring 151UB in the third positive direction Z1 side is in contact with the outer surface of the fourth magnetic layer 27 in the third negative direction Z2 side and the outer surface of the columnar wiring in the third negative direction Z2 side.

[0174] Furthermore, the maximum width dimension 151UW of the first upper layer inductor wiring 151UA is greater than or equal to less than or equal to 20% of the maximum width dimension 152LW of the first lower layer wiring body 152LA. However, the maximum width dimension 152LW of the first lower layer wiring body 152LA refers to the maximum dimension of the first lower layer wiring body 152LA in a direction orthogonal to the centerline of the first lower layer inductor wiring 151LA and parallel to the first main surface 11A. The maximum width dimension 151UW of the first upper layer inductor wiring 151UA is the maximum dimension of the first upper layer inductor wiring 151UA in a direction orthogonal to the centerline of the first upper layer inductor wiring 151UA and parallel to the first main surface 11A.

[0175] The first lower protrusion 153LA of the first inductor wiring 150A has the same configuration as the lower protrusion 53L of the inductor component 10 in the first embodiment. That is, as Figure 27 As shown, the outer surface of the first lower layer protrusion 153LA on the third negative direction Z2 side contacts the blank 11. The side surface 153S of the first lower layer protrusion 153LA contacts the first insulating layer 131. Furthermore, the side surface 153S of the first lower layer protrusion 153LA refers to the outer surface of the first lower layer protrusion 153LA other than the outer surface on the third negative direction Z2 side. However, the first lower layer protrusion 153LA protrudes from the first lower layer wiring body 152LA, and therefore does not have an outer surface on the third positive direction Z1 side.

[0176] When viewed in the third positive direction Z1, the first lower layer protrusion 153LA extends along the first lower layer wiring body 152LA. Specifically, the first lower layer protrusion 153LA extends from the first lower layer pad portion LP1A through the first lower layer wiring portion LLA to the second lower layer pad portion LP2A. That is, the first lower layer protrusion 153LA extends over approximately the entire area of ​​the first lower layer wiring body 152LA.

[0177] In addition, such as Figure 26 As shown, when viewed in the third positive direction Z1, the first lower layer protrusion 153LA is located within the area surrounded by the outer edge of the first lower layer wiring body 152LA. More specifically, as... Figure 27As shown, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimensions of each portion of the first lower inductor wiring 151LA in the direction parallel to the first main surface 11A are defined as the width dimensions. The width dimension 153LW of the first lower protrusion 153LA is smaller than the width dimension of the first lower wiring body 152LA at the location where the first lower protrusion 153LA is connected in the same cross-section. Furthermore, in Figure 27 In this context, the width dimension of the first lower layer wiring body 152LA is the maximum width dimension 152LW. That is, the width dimension 153LW of the first lower layer protrusion 153LA is smaller than the maximum width dimension 152LW of the first lower layer wiring body 152LA at the location where the first lower layer protrusion 153LA is connected on the same cross section.

[0178] like Figure 26 As shown, the inductor component 110 has four columnar wirings. Specifically, the inductor component 110 has a first columnar wiring 161A, a second columnar wiring 161B, a third columnar wiring 161C, and a fourth columnar wiring 161D. The shape of each columnar wiring is a generally rectangular columnar shape corresponding to the shape of the upper-layer pad to which it is connected.

[0179] In this embodiment, when the inductor component 110 is viewed in the third negative direction Z2, the outer edge of each columnar wiring is approximately aligned with the outer edge of the corresponding pad portion. Therefore, the area of ​​the region surrounded by the outer edge of each columnar wiring is the same as the area of ​​the region surrounded by the outer edge of the pad portion to which the columnar wiring is connected. However, "same area" means allowing for, for example, a 5% manufacturing tolerance.

[0180] like Figure 27 As shown, each columnar wiring is located in the same layer as the third magnetic layer 25 in the third axis Z direction.

[0181] One end of the first columnar wiring 161A contacts the surface of the first upper-end pad portion UP1A in the first upper-end pad portion UPA that is parallel to the first main surface 11A. In this embodiment, the difference between the dimension UP1AW of the first upper-end pad portion UP1A in the direction parallel to the first main surface 11A and the dimension 161AW of the first columnar wiring 161A in the direction parallel to the first main surface 11A is approximately zero.

[0182] Furthermore, the difference between the dimension UP1AW of the upper pad portion UP1A at the first end in the direction parallel to the first main surface 11A and the dimension LP1AW of the lower pad portion LP1A at the first end in the direction parallel to the first main surface 11A is approximately zero. Therefore, the difference between the dimension LP1AW of the lower pad portion LP1A at the first end in the direction parallel to the first main surface 11A and the dimension 161AW of the first columnar wiring 161A in the direction parallel to the first main surface 11A is also approximately zero.

[0183] One end of the second columnar wiring 161B contacts the surface of the second upper pad portion UP2A in the first upper pad portion UPA that is parallel to the first main surface 11A. In this embodiment, the difference between the dimension UP2AW of the second upper pad portion UP2A in the direction parallel to the first main surface 11A and the dimension 161BW of the second columnar wiring 161B in the direction parallel to the first main surface 11A is approximately zero.

[0184] Furthermore, the difference between the dimension UP2AW of the upper pad portion UP2A at the second end in the direction parallel to the first main surface 11A and the dimension LP2AW of the lower pad portion LP2A at the second end in the direction parallel to the first main surface 11A is approximately zero. Therefore, the difference between the dimension LP2AW of the lower pad portion LP2A at the second end in the direction parallel to the first main surface 11A and the dimension 161BW of the second columnar wiring 161B in the direction parallel to the first main surface 11A is also approximately zero.

[0185] One end of the second columnar wiring 161B contacts the surface of the second upper pad portion UP2A in the first upper pad portion UPA that is parallel to the first main surface 11A. In this embodiment, the difference between the dimension UP2AW of the second upper pad portion UP2A in the direction parallel to the first main surface 11A and the dimension 161BW of the second columnar wiring 161B in the direction parallel to the first main surface 11A is approximately zero.

[0186] Although figures are omitted, the third columnar wiring 161C and the fourth columnar wiring 161D are the same in these aspects. Furthermore, in this embodiment, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the dimensions of each upper pad portion, the dimensions of the columnar wiring connected to that upper pad portion, and the dimensions of the lower pad portion located on the third negative direction Z2 side of that upper pad portion are the same in a direction parallel to the first main surface 11A. However, "same dimensions" means that a manufacturing tolerance of, for example, 5% is allowed.

[0187] like Figure 25 As shown, the inductor component 110 has four external electrodes. The four external electrodes are a first external electrode 81A, a second external electrode 81B, a third external electrode 81C, and a fourth external electrode 81D.

[0188] The first external electrode 81A is located on the first main surface 11A, relative to the geometric center of the first main surface 11A, on the side of the first positive direction X1 and the side of the second positive direction Y1. The second external electrode 81B is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first negative direction X2 and the side of the second positive direction Y1. The third external electrode 81C is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first positive direction X1 and the side of the second negative direction Y2. The fourth external electrode 81D is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first negative direction X2 and the side of the second negative direction Y2.

[0189] The first external electrode 81A is in contact with the surface of the first cylindrical wiring 161A facing the third positive direction Z1. The second external electrode 81B is in contact with the surface of the second cylindrical wiring 161B facing the third positive direction Z1. The third external electrode 81C is in contact with the surface of the third cylindrical wiring 161C facing the third positive direction Z1. The fourth external electrode 81D is in contact with the surface of the fourth cylindrical wiring 161D facing the third positive direction Z1.

[0190] (Regarding the manufacturing method)

[0191] like Figure 28 As shown, in the second embodiment, the manufacturing method of the inductor component 110 differs from the manufacturing method of the first embodiment mainly in that it does not include the lower resin wall formation step S15, the second insulating layer formation step S17, the upper resin wall formation step S18, the third insulating layer formation step S20, and the insulating layer cutting step S22. Furthermore, in the second embodiment, the manufacturing method of the inductor component 110 differs from the manufacturing method of the first embodiment in that it includes the first DFR formation step S115, the second DFR formation step S117, the third DFR formation step S119, and the DFR removal step S121.

[0192] In addition, Figures 29-36 In the middle, only the illustrations and Figure 27 The diagram corresponding to the cross-sectional view of the inductor component 110 shown. That is, in Figures 29-36 The diagram only shows cross-sections through the first inductor wiring 150A, the first column wiring 161A, and the second column wiring 161B. The same method is used in the cross-sections through the second inductor wiring 150B, the third column wiring 161C, and the fourth column wiring 161D.

[0193] First, in the second embodiment, the process from the base preparation step S111 to the first insulating layer formation step S114 is performed using the same method as in the first embodiment. That is, as in... Figure 29As shown, after the first insulating layer formation step S114 in the second embodiment, an adhesive layer 92 is formed on the upper surface of the base substrate 91. A seed layer 93 is formed on the upper surface of the adhesive layer 92. At this time, the seed layer 93 is formed on the entire main surface 91A of the base substrate 91. On the upper surface of the seed layer 93, the first insulating layer 131 is formed separately in two locations. The position and shape of the first opening 194 of the first insulating layer 131 correspond to the position and shape of the first lower layer protrusion 153LA of the first lower layer inductor wiring 151LA and the position and shape of the second lower layer protrusion 153LB of the second lower layer inductor wiring 151LB formed in subsequent steps.

[0194] Next, as Figure 30 As shown, a first DFR formation process S115 is performed. In the first DFR formation process S115, a first dry film resist DFR1 with two second openings 195 is formed on the upper surface of the seed layer 93 and the first insulating layer 131 by photolithography. The two second openings 195 have a predetermined pattern. Specifically, the position and shape of one second opening 195 correspond to the position and shape of the subsequently formed first lower layer wiring body 152LA. The position and shape of the other second opening 195 correspond to the position and shape of the subsequently formed second lower layer wiring body 152LB.

[0195] Next, as Figure 31 As shown, the lower layer inductor wiring formation process S116 is performed. In the lower layer inductor wiring formation process S116, each lower layer inductor wiring is formed by electroplating by supplying power to the seed layer 93. Specifically, a first lower layer wiring body 152LA is formed in a second opening 195 of the first dry film resist DFR1, and a first lower layer protrusion 153LA protruding from and extending along the first lower layer wiring body 152LA is integrally formed in a first opening 194. Furthermore, a second lower layer wiring body 152LB is formed in another second opening 195, and a second lower layer protrusion 153LB protruding from and extending along the second lower layer wiring body 152LB is integrally formed in another first opening 194.

[0196] Next, as Figure 32As shown, a second DFR formation process S117 is performed. In the second DFR formation process S117, a second dry film resist DFR2 with two third openings 196 is formed on the upper surface of the first dry film resist DFR1 by photolithography. The two third openings 196 have a predetermined pattern. Specifically, the position and shape of one third opening 196 correspond to the position and shape of the first upper layer inductor wiring 151UA formed subsequently. The position and shape of the other third opening 196 correspond to the position and shape of the second upper layer inductor wiring 151UB formed subsequently.

[0197] Next, as Figure 33 As shown, the upper inductor wiring formation process S118 is performed. In the upper inductor wiring formation process S118, each upper inductor wiring is formed by electroplating by supplying power to the seed layer 93. Specifically, the first upper inductor wiring 151UA is formed within a third opening 196 of the second dry film resist DFR2. And, the second upper inductor wiring 151UB is formed within another third opening 196.

[0198] Next, as Figure 34 As shown, the third DFR formation process S119 is performed. In the third DFR formation process S119, a third dry film resist DFR3 with four fourth openings 197 is formed on the upper surface of the wiring of each upper layer inductor and on the upper surface of the second dry film resist DFR2 by photolithography.

[0199] Next, as Figure 35 As shown, a columnar wiring formation process S120 is performed. In this process, first columnar wiring 161A to fourth columnar wiring 161D are formed within four fourth openings 197. The positions and shapes of the first columnar wiring 161A to fourth columnar wiring 161D correspond to the positions and shapes of the four fourth openings 197. This forms a first inductor wiring 150A, a second inductor wiring 150B, and first columnar wiring 161A to fourth columnar wiring 161D.

[0200] Next, as Figure 36 As shown, the DFR removal process S121 is performed. In the DFR removal process S121, the first dry film resist DFR1, the second dry film resist DFR2, and the third dry film resist DFR3 are all removed by etching.

[0201] like Figure 28As shown, after the DFR removal process S121, the process proceeds from the first blank formation process S122 to the monolithization process S127 using the same method as in the first embodiment. This manufactures the inductor component 110 of the second embodiment. Furthermore, the state from the upper inductor wiring formation process S118 to the removal of the base substrate 91 using the seed layer removal process S124 is processed into a substrate 199 for inductor component manufacturing.

[0202] (Effects of the second implementation method)

[0203] According to the second embodiment described above, in addition to the effects of (1-1) to (1-7) and (1-10) to (1-15) mentioned above, the following effects are also achieved.

[0204] (2-1) In the above embodiment, the inductor component 110 has a second inductor wiring 150B in addition to the first inductor wiring 150A. Therefore, compared with the case of installing two inductor components with one inductor wiring, the installation area can be reduced.

[0205] (2-2) In the above embodiment, when viewed in cross-section from a direction orthogonal to the first main surface 11A, there is no significant difference between the size of each upper pad portion and the size of each columnar wiring in a direction parallel to the first main surface 11A. Therefore, compared to the case where the difference in each size is large, the DC resistance caused by this difference can be reduced.

[0206] (2-3) In the above embodiment, each upper pad portion is in contact with each columnar wiring, and the size of the lower surface of each columnar wiring is smaller than the size of the upper surface of the pad portion to which the columnar wiring is connected. Therefore, even if manufacturing errors occur in the position of the second dry film resist DFR2 and the position of the third dry film resist DFR3 during the manufacturing process of the inductor component 110, the upper surface of each upper pad portion and each columnar wiring can be formed, thus reliably ensuring the connection cross-sectional area.

[0207] (2-4) In the above embodiment, the maximum width dimension 151UW of the first upper layer inductor wiring 151UA is -20% or more and +20% or less than the maximum width dimension 152LW of the first lower layer wiring body 152LA. When this ratio is less than -20%, the DC resistance in the first upper layer inductor wiring 151UA may become high. In addition, when this ratio is greater than 20%, manufacturing errors may easily occur during the manufacturing of the inductor component 110 due to the difficulty in pressing in magnetic materials, etc. Therefore, by making the maximum width dimension 151UW of the first upper layer inductor wiring 151UA approximately the same as the maximum width dimension 152LW of the first lower layer wiring body 152LA, the DC resistance in the first upper layer inductor wiring 151UA is reduced, and the difficulty in pressing in magnetic materials between the first lower layer wiring body 152LA and the first upper layer inductor wiring 151UA is prevented. The second inductor wiring 150B is also the same in these aspects.

[0208] <Example of Change>

[0209] The above-described embodiments and the following modifications can be combined and implemented in a manner that does not contradict each other technically. For example, modifications of the first embodiment can also be combined with the second embodiment within the scope of technical inconsistency.

[0210] (Regarding the modification of the first embodiment)

[0211] • The shape of the blank 11 is not limited to the examples of the above embodiments. In addition, the blank 11 may not have part of the magnetic layer 20 as long as it functions as an inductor component 10.

[0212] • The metallic magnetic powder used as the material for the blank 11 is not limited to FeSiCr-based magnetic powders. For example, it can also be FeCo-based, FeSiAr-based, iron oxide-based, or combinations thereof. Furthermore, the material for the blank 11, i.e., the organic resin, can be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or combinations thereof; inorganic fillers can also be mixed in with these materials. Additionally, the material for the blank 11 can also be a non-magnetic material.

[0213] The second insulating layer 32 can be made of resin or filler. By including filler, the surface of the second insulating layer 32 becomes uneven. This improves the adhesion between the side 53US of the upper protrusion 53U and the second insulating layer 32. Therefore, near the contact area between the lower wiring body 52L and the upper protrusion 53U, the insulation between different parts of the inductor wiring 50 can be improved. Furthermore, by adjusting the filler content, the coefficient of linear expansion can be adjusted. Therefore, the design freedom of the inductor component 10 is increased. The same applies to the first insulating layer 31 and the third insulating layer 33, which can also include filler.

[0214] • The shape, quantity, position, and other configuration of the inductor wiring 50 are not limited to the examples of the above embodiments. They can also be appropriately changed depending on the shape of the blank 11 and the application of the inductor component 10.

[0215] • On the side 11C of the blank 11, the inductor wiring 50 can also be exposed.

[0216] • The material of the inductor wiring 50 is not limited to a conductor with copper as the main component; it can also be a conductor with Ag, Al, or Au as the main component.

[0217] • The total height dimension 50H of the inductor wiring 50 can also be less than twice the minimum width dimension 52LW of the lower wiring body 52L. In this case, since the lower inductor wiring 51L has a lower protrusion 53L, the cross-sectional area is larger, which can reduce the DC resistance.

[0218] • The lower layer protrusion 53L may not extend continuously from the lower inner pad portion LP1 to the lower outer pad portion LP2. For example, it may extend discontinuously along the inductor wiring 50 as a dashed line. That is, the lower layer protrusion 53L may also be partially interrupted. The same applies to the upper layer protrusion 53U.

[0219] • The lower protrusion 53L and the lower wiring body 52L may not be integrally molded. For example, after the lower protrusion 53L is formed by electroplating, the electroplating process may end, and then electroplating may begin again to form the lower wiring body 52L. Therefore, strictly speaking, an interface may exist between the lower protrusion 53L and the lower wiring body 52L. In this case, it is also considered that the lower wiring body 52L substantially protrudes from the lower protrusion 53L. Furthermore, when the lower protrusion 53L and the lower wiring body 52L are made as separate molded parts, their materials may not be the same. The same applies to the upper protrusion 53U.

[0220] • The side 53LS of the lower protrusion 53L may not contact the first insulating layer 31. For example, another metal layer may be sandwiched between the lower protrusion 53L and the first insulating layer 31. The same applies to the upper protrusion 53U and the second insulating layer 32.

[0221] • In the direction orthogonal to the first main surface 11A, the size of the lower protrusion 53L can also be smaller than the size of the first insulating layer 31. In this case, the tip of the lower protrusion 53L does not extend towards the third negative direction Z2 relative to the first insulating layer 31. Therefore, even if manufacturing errors occur, the tip of the lower protrusion 53L is not easily extended in a direction parallel to the first main surface 11A. As a result, short circuits are prevented between the tip of the lower protrusion 53L and other unwanted conductive parts. The same applies to the upper protrusion 53U.

[0222] • The inductor component 10 may also not have a lower resin wall 41 or an upper resin wall 42.

[0223] • The inductor component 10 may not have columnar wiring. For example, the inductor wiring 50 may be exposed from the side 11C of the blank 11 and connected to the external electrode.

[0224] • The first lead-out portion 63A and the first columnar portion 62A may not be integrally molded. For example, after the first lead-out portion 63A is formed by electroplating and the electroplating process is stopped, the first columnar portion 62A is formed by electroplating again. Therefore, strictly speaking, an interface may be formed between the first lead-out portion 63A and the first columnar portion 62A. In this case, it is also considered that the first columnar portion 62A substantially protrudes from the first lead-out portion 63A. Furthermore, when the first lead-out portion 63A and the first columnar portion 62A are made as separate molded parts, their materials may not be the same. The same applies to the second lead-out portion 63B and the second columnar portion 62B.

[0225] • The configuration of each lead-out portion is not limited to the examples of the above embodiments. For example, the outer edge of the first lead-out portion 63A may not be parallel to the outer edge of the first columnar portion 62A. The first lead-out portion 63A may also not contact the surface parallel to the first main surface 11A on the outer surface of the upper inner pad portion UP1, which is the end of the inductor wiring 50. In addition, the outer edge of the first lead-out portion 63A may not be parallel to the outer edge of the upper inner pad portion UP1. The same applies to the second lead-out portion 63B and the upper outer pad portion UP2.

[0226] • When viewed in the third positive direction Z1, the area surrounded by the outer edge of the first columnar portion 62A can be greater than 1.3 times the area surrounded by the outer edge of the first lead-out portion 63A. In this case, the first columnar wiring 61A has the first lead-out portion 63A, thereby achieving at least the effect described in (1-1). The same applies to the second lead-out portion 63B.

[0227] • The side 63AS of the first lead-out portion 63A may not contact the third insulating layer 33. For example, other components may be sandwiched between the first lead-out portion 63A and the third insulating layer 33. The same applies to the second lead-out portion 63B.

[0228] ·like Figure 23 As shown, the inductor component 10 may or may not have the first insulating layer 31 as long as it has the second insulating layer 32. In addition, the inductor component 10 may also have a third insulating layer 33, which covers the inductor wiring 50 and the surface of the lower resin wall 41 facing the third negative direction Z2.

[0229] • The inductor component 10 may also be without external electrodes and solder resist 70. For example, the columnar wiring may be exposed from the first main surface 11A. This allows for a reduction in the size of the inductor component 10.

[0230] • In the manufacturing method of inductor component 10, the order of each process can be changed as long as inductor component 10 can be manufactured. For example, the solder resist forming process S24 can be performed after the second blank forming process S26.

[0231] • The material of the seed layer 93 is not limited to the examples of the above embodiments. For example, the seed layer 93 may be a single layer of copper, a single layer of silver, or may have multiple layers such as titanium and copper.

[0232] • The material of the seed layer 93 can be different from the material of the lower protrusion 53L. For example, the seed layer 93 can be made of silver, and the inductor wiring 50 containing the lower protrusion 53L can be made of copper. This increases the etching speed when the inductor wiring 50 is stripped from the seed layer 93 by etching. The same applies to the substrate 99 used for manufacturing inductor components.

[0233] • In the adhesive layer forming process S12 to the solder resist forming process S24, inductor wiring 50 and the like can also be formed on both sides of the base substrate 91. In this case, when forming inductor wiring 50 and the like on the third negative direction Z2 side of the base substrate 91, each process can be performed simply by taking the third negative direction Z2 as the upward direction.

[0234] • The adhesive layer forming process S12 can also be omitted. The seed layer 93 can also be formed directly on the upper surface of the base substrate 91. That is, the substrate 99 used for manufacturing inductor components may not have an adhesive layer 92.

[0235] • In the first insulating layer forming process S14, a negative photosensitive resin may also be used as the material for the first insulating layer 31. In this case, by reducing the photocurability of the portion of the first insulating layer 31 removed by the insulating layer cutting process S22, that portion can be easily peeled off in the insulating layer cutting process S22.

[0236] • Depending on the configuration of the manufactured inductor component 10, one or more processes selected from the second insulating layer forming process S17, the columnar wiring forming process S21, the solder resist forming process S24, the second blank forming process S26, and the external electrode forming process S27 may be omitted.

[0237] • Alternatively, the third insulating layer forming process S20 can be omitted, and the columnar wiring forming process S21 can be performed. In this case, during the columnar wiring forming process S21, an auxiliary wall can also be formed on the outer surface of the upper inductor wiring 51U in the third positive direction Z1 side to form each columnar wiring.

[0238] • In the insulating layer cutting process S22, the method for removing a portion of the first insulating layer 31 is not limited to a laser-based method. For example, a portion of the first insulating layer 31 can also be removed by sandblasting. In this case, it is preferable that the third insulating layer 33 is thicker than the first insulating layer 31. Alternatively, it is preferable that the sandblasting resistance of the third insulating layer 33 is higher than that of the first insulating layer 31.

[0239] • If the second blank forming process S26 is omitted, for example, an insulating layer may be formed on the lower surface of the lower protrusion 53L, the first insulating layer 31, and the lower surface of the magnetic layer 20 formed by the first blank forming process S23.

[0240] • In the external electrode forming process S27, the method for forming each external electrode is not limited to the examples of the embodiments described above. For example, copper plating may not be performed.

[0241] ・Reference Figure 37 as well as Figure 38 An example of a combination of modified examples of inductor component 210 will be described.

[0242] like Figure 37As shown, in one example of a modified inductor component 210, there are five external electrodes. Specifically, the inductor component 210 has a first external electrode 81A on the first negative direction X2 side and the second positive direction Y1 side of the first main surface 11A of the blank 11. The inductor component 210 has a second external electrode 81B on the first positive direction X1 side and the second positive direction Y1 side of the first main surface 11A. The inductor component 210 has a third external electrode 81C on the first negative direction X2 side and the second negative direction Y2 side of the first main surface 11A. The inductor component 210 has a fourth external electrode 81D on the first positive direction X1 side and the second negative direction Y2 side of the first main surface 11A. The inductor component 210 has a fifth external electrode 81E at a location approximately at the geometric center of the first main surface 11A.

[0243] like Figure 38 As shown, in one example of the modified example, the inductor component 210 has four inductor wirings 50. Specifically, the inductor component 210 has a first inductor wiring 51A inside the blank 11, on the first negative direction X2 side and the second positive direction Y1 side. The inductor component 210 has a second inductor wiring 51B inside the blank 11, on the first positive direction X1 side and the second positive direction Y1 side. The inductor component 210 has a third inductor wiring 51C inside the blank 11, on the first negative direction X2 side and the second negative direction Y2 side. The inductor component 210 has a fourth inductor wiring 51D inside the blank 11, on the first positive direction X1 side and the second negative direction Y2 side.

[0244] In one example of this modification, specifically, the upper outer pad portion UP2A of the first inductor wiring 51A is connected to the first external electrode 81A. The upper outer pad portion UP2B of the second inductor wiring 51B is connected to the second external electrode 81B. The upper outer pad portion UP2C of the third inductor wiring 51C is connected to the third external electrode 81C. The upper outer pad portion UP2D of the fourth inductor wiring 51D is connected to the fourth external electrode 81D. Furthermore, the upper inner pad portion UP1A of the first inductor wiring 51A, the upper inner pad portion UP1B of the second inductor wiring 51B, the upper inner pad portion UP1C of the third inductor wiring 51C, and the upper inner pad portion UP1D of the fourth inductor wiring 51D are connected to the fifth external electrode 81E. Therefore, the fifth external electrode 81E, which is one of a plurality of external electrodes, is connected to both the first end of the first inductor wiring 51A and the first end of the second inductor wiring 51B. Thus, no potential difference is generated between the external electrodes connected to each inductor wiring. Such an electronic component is suitable, for example, as an inductor used in a multiphase DC / DC converter.

[0245] (A variation of the second implementation)

[0246] ·like Figure 39 As shown, in a direction orthogonal to the first main surface 11A, the size 153AH of the first lower layer protrusion 153LA can also be smaller than the size 131H of the first insulating layer 131. In this case, the tip of the first lower layer protrusion 153LA does not extend towards the third negative direction Z2 relative to the first insulating layer 131. Therefore, even if manufacturing errors occur, the tip of the first lower layer protrusion 153LA is less likely to extend in a direction parallel to the first main surface 11A. As a result, short circuits are prevented between the tip of the first lower layer protrusion 153LA and other unwanted conductive parts. The same applies to the second lower layer protrusion 153LB.

[0247] ·like Figure 39 As shown, the inductor component 110 may also have an insulating coating CF that covers the sides of the first lower layer wiring body 152LA, the sides of the first upper layer inductor wiring 151UA, the sides of the first insulating layer 131, the sides of the first columnar wiring 161A, and the sides of the second columnar wiring 161B. This improves the insulation between inductor wirings and between columnar wirings. The same applies to the second inductor wiring 150B.

[0248] • The maximum width dimension 151UW of the first upper layer inductor wiring 151UA relative to the maximum width dimension 152LW of the first lower layer wiring body 152LA can be less than -20% or greater than +20%. In this case, at least the effect described in (1-1) is obtained.

[0249] ·like Figure 39 As shown, the inductor component 110 may also be without external electrodes and solder resist 70. In this case, for example, it is sufficient for each columnar wiring to be exposed from the first main surface 11A. This allows for a reduction in the size of the inductor component 110. Furthermore, in this example, the surface on the third positive direction Z1 side of the columnar wiring functions as an external electrode.

[0250] • The first DFR forming process S115 and the second DFR forming process S117 can also be performed in one process.

[0251] • The conductivity of the outer surface of the first lower layer protrusion 153LA on the third negative direction Z2 side can also be lower than the conductivity of the first lower layer wiring body 152LA or the first upper layer inductor wiring 151UA. For example, the conductivity can be reduced simply by heat-treating and oxidizing the tip of the first lower layer protrusion 153LA. This improves the insulation between the first inductor wiring 150A and the blank 11. The same applies to the second lower layer protrusion 153LB and the second inductor wiring 150B.

[0252] • The size of the end face on the third negative direction Z2 side of each columnar wiring can also be smaller than the size of the face on the third positive direction Z1 side of the pad portion to which the columnar wiring is connected. In this case, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the difference between the dimension UP1AW of the first end upper pad portion UP1A in the first upper pad portion UPA and the dimension 161AW of the first columnar wiring 161A in a direction parallel to the first main surface 11A is preferably 20μm or less. Similarly, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the difference between the dimension UP2AW of the second end upper pad portion UP2A in the second upper pad portion UPB and the dimension 161BW of the second columnar wiring 161B is preferably 20μm or less in a direction parallel to the first main surface 11A.

[0253] Therefore, even if there is a slight manufacturing error in the position of the first dry film resist DFR1 and the position of the second dry film resist DFR2 during the manufacturing process of the inductor component 110, the columnar wiring can be converged within the range of the corresponding pad portion.

[0254] However, even if the difference is greater than 20 μm, the effect described in (1-1) can still be obtained by having protrusions in each wiring body. The same applies to the second upper pad UPB.

[0255] • The outer surface of the third negative direction Z2 side of the first lower protrusion 153LA may not contact the blank 11. For example, it may be as follows: Figure 40 As shown, the inductor component 110 includes a metal layer ML that covers the outer surface of the first lower layer protrusion 153LA in the third negative direction Z2. When viewed in the third positive direction Z1, it is preferable that the metal layer ML extends along the first lower layer protrusion 153LA. For example, if nickel is chosen as the material of the metal layer ML, oxidation of the outer surface of the first lower layer protrusion 153LA in the third negative direction Z2 and deterioration of the outer surface of the first insulating layer 131 in the third negative direction Z2 can be suppressed. Furthermore, instead of performing the seed layer removal process S124, the metal layer ML can be formed by removing the base substrate 91 and etching to cover the first lower layer protrusion 153LA with a seed layer 93. Preferably, the conductivity of the metal layer ML is lower than that of the first inductor wiring 150A. This improves the insulation between the first inductor wiring 150A and the blank 11. The same applies to the second inductor wiring 150B and the second lower layer protrusion 153LB.

[0256] • It can also be like Figure 41As shown, after the DFR removal process S121 and before the first blank formation process S122, a process is performed to cover the sides of each inductor wiring and each columnar wiring with an insulating coating CF. The insulating coating CF can be formed, for example, by chemical vapor deposition (CVD). This improves the insulation between inductor wirings and between columnar wirings.

[0257] <Postscript>

[0258] The following describes the technical concepts derived from the above-described implementation methods and their variations. [1]

[0260] An inductor component, comprising:

[0261] The blank contains magnetic material and has a planar main surface;

[0262] An insulating layer is located within the aforementioned blank and extends in a plane parallel to the aforementioned main surface;

[0263] The lower-level inductor wiring extends parallel to the main surface within the aforementioned blank; and

[0264] The upper inductor wiring extends parallel to the main surface within the aforementioned blank body.

[0265] When the direction orthogonal to the aforementioned principal plane is designated as the positive direction, and the direction opposite to the aforementioned positive direction is designated as the negative direction,

[0266] The aforementioned lower-level inductor wiring includes:

[0267] The lower wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and

[0268] The protrusion protrudes from the outer surface of the lower wiring body on the negative direction side to the negative direction side.

[0269] The outer surface of the negative direction side of the lower wiring body is in contact with the outer surface of the positive direction side of the insulation layer.

[0270] When viewed in the aforementioned positive direction, the aforementioned protrusion is located within the area surrounded by the outer edge of the aforementioned lower wiring body, and extends along the aforementioned lower wiring body.

[0271] When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the protrusion in the direction parallel to the main plane is smaller than the dimension of the lower wiring body at the location where the protrusion is connected in the direction parallel to the main plane.

[0272] The aforementioned upper-layer inductor wiring extends along the lower-layer wiring body on the outer surface of the aforementioned positive-direction side.

[0273] The outer surface of the negative direction side of the upper inductor wiring is in contact with the surface of the positive direction side of the lower inductor wiring. [2]

[0275] According to the inductor components described in [1], wherein,

[0276] The total height dimension is defined as the sum of the maximum dimensions of the lower-layer inductor wiring and the upper-layer inductor wiring in a direction orthogonal to the main plane.

[0277] When the minimum dimension of the lower-level cabling body in the direction orthogonal to the centerline of the lower-level cabling body and parallel to the main surface is set as the minimum width dimension,

[0278] The total height dimension is more than twice the minimum width dimension. [3]

[0280] According to the inductor components described in [1] or [2], wherein,

[0281] The maximum dimension of the lower layer wiring body in a direction orthogonal to the center line of the lower layer inductor wiring and parallel to the main surface is set as the maximum width dimension of the lower layer wiring body.

[0282] When the maximum dimension of the upper-layer inductor wiring is set as the maximum width dimension of the upper-layer inductor wiring in a direction orthogonal to the center line of the upper-layer inductor wiring and parallel to the main surface,

[0283] The maximum width of the upper inductor wiring is more than -20% and less than +20% relative to the maximum width of the lower wiring body. [4]

[0285] According to any one of the inductor components described in [1] to [3], wherein,

[0286] The aforementioned lower wiring body and the aforementioned protrusion are integrally molded. [5]

[0288] According to any one of the inductor components described in [1] to [4], wherein,

[0289] When the outer surface of the blank, excluding the main surface and the surface opposite to the main surface, is defined as the side surface of the blank,

[0290] On the aforementioned side of the blank, the lower inductor wiring and the conductive object electrically connected to the lower inductor wiring, as well as the upper inductor wiring and the conductive object electrically connected to the upper inductor wiring, are not exposed. [6]

[0292] According to any one of the inductor components described in [1] to [5], wherein,

[0293] When the outer surface of the aforementioned protrusion, excluding the outer surface on the negative direction side, is designated as the side surface of the protrusion.

[0294] The aforementioned side of the protrusion is in contact with the aforementioned insulating layer. [7]

[0296] According to the inductor components described in [6], wherein,

[0297] In a direction orthogonal to the main surface, the size of the protrusion is smaller than the size of the insulating layer. [8]

[0299] According to any one of the inductor components described in [1] to [7], wherein,

[0300] It also has columnar wiring that is connected to the outer surface of the positive direction side of the upper inductor wiring and extends in the blank in a direction that intersects with the main surface. [9]

[0302] According to the inductor components described in [8], wherein,

[0303] The aforementioned columnar wiring contacts the outer surface of the positive-direction side of the aforementioned upper-layer inductor wiring.

[10]

[0305] According to the inductor components described in [8] or [9], wherein,

[0306] The outer surface of the lower wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the lower wiring body.

[0307] The outer surface of the upper inductor wiring, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the upper inductor wiring.

[0308] The outer surface of the columnar wiring described above, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the columnar wiring.

[0309] When the outer surface of the aforementioned insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the insulating layer.

[0310] It also has an insulating coating that covers the side surface of the lower wiring body, the side surface of the upper inductor wiring, the side surface of the columnar wiring, and the side surface of the insulating layer.

[11]

[0312] According to any one of the inductor components described in [1] to

[10] , wherein,

[0313] When the aforementioned insulating layer is designated as the first insulating layer and the aforementioned protrusion is designated as the lower protrusion,

[0314] It also includes a second insulating layer, which is located within the blank body and parallel to the main surface.

[0315] The above-mentioned upper-layer inductor wiring includes:

[0316] The upper wiring body extends on the outer surface of the aforementioned positive direction side of the second insulating layer; and

[0317] The upper protrusion protrudes from the outer surface of the upper wiring body on the negative direction side to the negative direction side.

[0318] When viewed in the aforementioned positive direction, the aforementioned upper protrusion is located within the area surrounded by the outer edge of the aforementioned upper wiring body, and extends along the aforementioned upper wiring body.

[0319] The outer surface of the negative direction side of the upper wiring body is in contact with the outer surface of the positive direction side of the second insulating layer.

[0320] When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the upper protrusion in the direction parallel to the main plane is smaller than the dimension of the upper wiring body at the location where the upper protrusion is connected in the direction parallel to the main plane.

[0321] The negative side surface of the upper protrusion is in contact with the outer surface of the positive side of the lower wiring body.

[12]

[0323] According to the inductor components described in

[11] , wherein,

[0324] The aforementioned upper wiring main body and the aforementioned upper protrusion are integrally molded.

[13]

[0326] According to the inductor component described in

[11] or

[12] , wherein,

[0327] The material of the second insulating layer includes resin and filler powder as a crystalline material.

[14]

[0329] According to any one of the inductor components described in

[11] to

[13] , wherein,

[0330] The outer surface of the lower wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the lower wiring body.

[0331] When the outer surface of the second insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the second insulating layer.

[0332] It also includes a lower resin wall that covers the aforementioned side surface of the lower wiring body.

[0333] The lower resin wall is in contact with the side surface of the second insulating layer.

[15]

[0335] A method for manufacturing an inductor component, wherein:

[0336] The seed layer formation process involves forming a conductive seed layer on the main surface of the base substrate;

[0337] In the insulating layer forming process, an insulating layer with an opening having a specified wiring pattern is formed on the seed layer.

[0338] In the lower resin wall forming process, a lower resin wall is formed on the above-mentioned insulating layer along the outer edge of the above-mentioned opening;

[0339] In the lower inductor wiring formation process, electroplating is performed by supplying power to the seed layer to form a lower wiring body in the space surrounded by the lower resin wall, and a lower protrusion is formed in the opening that protrudes from the lower wiring body and extends along the lower wiring body.

[0340] In the upper resin wall forming process, an upper resin wall is formed on the upper side of the lower wiring body along the outer edge of the lower wiring body.

[0341] The upper inductor wiring formation process utilizes electroplating performed by supplying power to the seed layer to form the upper inductor wiring within the space surrounded by the upper resin wall.

[0342] In the blank forming process, after the aforementioned upper inductor wiring forming process, a magnetic layer containing magnetic material is formed around the aforementioned lower wiring body, the aforementioned lower protrusion, and the aforementioned upper inductor wiring; and

[0343] The seed layer removal process is performed after the above-mentioned blank forming process to remove the seed layer.

[16]

[0345] According to the manufacturing method of the inductor component described in

[15] , wherein,

[0346] When the above-mentioned insulating layer forming process is designated as the first insulating layer forming process, the above-mentioned opening is designated as the first opening, and the above-mentioned insulating layer is designated as the first insulating layer,

[0347] It has the following processes:

[0348] The second insulating layer forming process is performed after the lower inductor wiring forming process and before the upper resin wall forming process. A second insulating layer is formed on the lower wiring body, and the second insulating layer has a second opening along the lower wiring body.

[0349] In the above-mentioned upper resin wall formation process, the upper resin wall is formed on the upper side of the lower wiring body along the outer edge of the second opening of the second insulation layer.

[0350] The aforementioned upper inductor wiring formation process utilizes electroplating performed by supplying power to the seed layer to form an upper wiring body within the space surrounded by the upper resin wall, and forms an upper protrusion protruding from and extending along the upper wiring body within the second opening; and

[0351] In the above-mentioned blank forming process, a magnetic layer made of magnetic material is formed around the lower wiring body, the lower protrusion, the upper wiring body, and the upper protrusion.

[17]

[0353] A substrate for manufacturing an inductor component, comprising:

[0354] Base substrate;

[0355] The seed layer, located on the main surface of the aforementioned base substrate, is conductive;

[0356] An insulating layer is located on the seed layer and extends parallel to the main surface of the base substrate.

[0357] The lower inductor wiring is located on the aforementioned insulating layer and extends parallel to the aforementioned main surface of the aforementioned base substrate; and

[0358] The upper inductor wiring is located on the lower inductor wiring and extends parallel to the main surface of the base substrate.

[0359] When one direction orthogonal to the main surface of the base substrate is designated as the positive direction, and the direction opposite to the positive direction is designated as the negative direction,

[0360] The aforementioned lower-level inductor wiring includes:

[0361] The lower wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and

[0362] The protrusion protrudes from the outer surface of the lower wiring body on the negative direction side to the negative direction side.

[0363] When viewed in the aforementioned positive direction, the aforementioned protrusion extends along the aforementioned lower wiring body.

[0364] The surface on the negative direction side of the aforementioned protrusion is in contact with the aforementioned seed layer.

[0365] The aforementioned upper-layer inductor wiring extends along the lower-layer wiring body on the outer surface of the aforementioned positive-direction side.

[0366] The negative side of the upper inductor wiring is in contact with the positive side of the lower inductor wiring.

[18]

[0368] According to the substrate for manufacturing inductor components described in

[17] , wherein,

[0369] The material of the seed layer is different from the material of the protrusion.

[19]

[0371] According to the substrate for manufacturing inductor components described in

[17] or

[18] , wherein

[0372] It also includes an adhesive layer sandwiched between the base substrate and the seed layer.

[0373] The adhesive layer described above is made of an adhesive resin.

[0374] Explanation of reference numerals in the attached figures

[0375] 10…Inductor component; 11…Bulkhead; 11A…First main surface; 20…Magnetic layer; 31…First insulating layer; 32…Second insulating layer; 33…Third insulating layer; 41…Lower resin wall; 42…Upper resin wall; 50…Inductor wiring; 51L…Lower inductor wiring; 52L…Lower wiring body; LL…Lower wiring section; LP…Lower pad section; 53L…Lower protrusion; 51U…Upper inductor wiring; 52U…Upper wiring body; UL…Upper layer Wiring section; UP… Upper pad section; 53U… Upper protrusion; CL… Centerline; 61A… First columnar wiring; 62A… First columnar portion; 63A… First lead-out portion; 61B… Second columnar wiring; 62B… Second columnar portion; 63B… Second lead-out portion; 70… Solder resist; 81A… First external electrode; 81B… Second external electrode; 91… Base substrate; 92… Adhesive layer; 93… Seed layer; 94… First opening; 95… Second opening; 96… Third opening 99…Substrate for manufacturing inductor components; 110…Inductor component; 131…First insulating layer; 150A…First inductor wiring; 151LA…First lower layer inductor wiring; 152LA…First lower layer wiring body; LLA…First lower layer wiring section; LPA…First lower layer pad section; 153LA…First lower layer protrusion; 151UA…First upper layer inductor wiring; ULA…First upper layer wiring section; UPA…First upper layer pad section; 150B… Second inductor wiring; 151LB…Second lower layer inductor wiring; 152LB…Second lower layer wiring body; LLB…Second lower layer wiring section; LPB…Second lower layer pad section; 153LB…Second lower layer protrusion; 151UB…Second upper layer inductor wiring; ULB…Second upper layer wiring section; UPB…Second upper layer pad section; 161A…First columnar wiring; 161B…Second columnar wiring; 161C…Third columnar wiring; 161D…Fourth columnar wiring.

Claims

1. An inductor component, wherein, have: The blank contains magnetic material and has a planar main surface; An insulating layer is located within the aforementioned blank body and extends in a plane parallel to the aforementioned main surface; The wiring of the lower inductor extends parallel to the main surface within the aforementioned blank. as well as The upper inductor wiring extends parallel to the main surface within the aforementioned blank. When the direction orthogonal to the aforementioned principal plane is designated as the positive direction, and the direction opposite to the aforementioned positive direction is designated as the negative direction, The aforementioned lower-level inductor wiring includes: The lower wiring body extends on the outer surface of the aforementioned positive direction side of the aforementioned insulating layer; and The protrusion protrudes from the outer surface of the lower wiring body on the negative direction side to the negative direction side. The outer surface of the negative direction side of the lower wiring body is in contact with the outer surface of the positive direction side of the insulation layer. When viewed in the aforementioned positive direction, the aforementioned protrusion is located within the area surrounded by the outer edge of the aforementioned lower wiring body, and extends along the aforementioned lower wiring body. When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the protrusion in the direction parallel to the main plane is smaller than the dimension of the lower wiring body at the location where the protrusion is connected in the direction parallel to the main plane. The aforementioned upper-layer inductor wiring extends along the lower-layer wiring body on the outer surface of the aforementioned positive-direction side. The outer surface of the negative direction side of the upper inductor wiring is in contact with the surface of the positive direction side of the lower inductor wiring.

2. The inductor component according to claim 1, wherein, The total height dimension is defined as the sum of the maximum dimensions of the lower-layer inductor wiring and the upper-layer inductor wiring in a direction orthogonal to the main plane. When the minimum dimension of the lower-level cabling body in the direction orthogonal to the centerline of the lower-level cabling body and parallel to the main surface is set as the minimum width dimension, The total height dimension is more than twice the minimum width dimension.

3. The inductor component according to claim 1 or 2, wherein, The maximum dimension of the lower layer wiring body in a direction orthogonal to the center line of the lower layer inductor wiring and parallel to the main surface is set as the maximum width dimension of the lower layer wiring body. When the maximum dimension of the upper-layer inductor wiring is set as the maximum width dimension of the upper-layer inductor wiring in a direction orthogonal to the center line of the upper-layer inductor wiring and parallel to the main surface, The maximum width of the upper inductor wiring is more than -20% and less than +20% relative to the maximum width of the lower wiring body.

4. The inductor component according to any one of claims 1 to 3, wherein, The aforementioned lower wiring body and the aforementioned protrusion are integrally molded.

5. The inductor component according to any one of claims 1 to 4, wherein, When the outer surface of the blank, excluding the main surface and the surface opposite to the main surface, is defined as the side surface of the blank, On the aforementioned side of the blank, the lower inductor wiring and the conductive object electrically connected to the lower inductor wiring, as well as the upper inductor wiring and the conductive object electrically connected to the upper inductor wiring, are not exposed.

6. The inductor component according to any one of claims 1 to 5, wherein, When the outer surface of the aforementioned protrusion, excluding the outer surface on the negative direction side, is designated as the side surface of the protrusion. The aforementioned side of the protrusion is in contact with the aforementioned insulating layer.

7. The inductor component according to claim 6, wherein, In a direction orthogonal to the main surface, the size of the protrusion is smaller than the size of the insulating layer.

8. The inductor component according to any one of claims 1 to 7, wherein, It also has columnar wiring that is connected to the outer surface of the positive direction side of the upper inductor wiring and extends in the blank in a direction that intersects with the main surface.

9. The inductor component according to claim 8, wherein, The aforementioned columnar wiring contacts the outer surface of the positive-direction side of the aforementioned upper-layer inductor wiring.

10. The inductor component according to claim 8 or 9, wherein, It also has an insulating coating. The outer surface of the lower wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the lower wiring body. The outer surface of the upper inductor wiring, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the upper inductor wiring. The outer surface of the aforementioned columnar wiring, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is defined as the side surface of the columnar wiring. When the outer surface of the aforementioned insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the insulating layer. The aforementioned insulating coating covers the aforementioned side surface of the lower layer wiring body, the aforementioned side surface of the upper layer inductor wiring, the aforementioned side surface of the columnar wiring, and the aforementioned side surface of the insulating layer.

11. The inductor component according to any one of claims 1 to 10, wherein, When the aforementioned insulating layer is designated as the first insulating layer and the aforementioned protrusion is designated as the lower protrusion, It also includes a second insulating layer, which is located within the blank body and parallel to the main surface. The above-mentioned upper-layer inductor wiring includes: The upper wiring body extends on the outer surface of the aforementioned positive direction side of the second insulating layer; and The upper protrusion protrudes from the outer surface of the upper wiring body on the negative direction side to the negative direction side. When viewed in the aforementioned positive direction, the aforementioned upper protrusion is located within the area surrounded by the outer edge of the aforementioned upper wiring body, and extends along the aforementioned upper wiring body. The outer surface of the negative direction side of the upper wiring body is in contact with the outer surface of the positive direction side of the second insulating layer. When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the upper protrusion in the direction parallel to the main plane is smaller than the dimension of the upper wiring body at the location where the upper protrusion is connected in the direction parallel to the main plane. The negative side surface of the upper protrusion is in contact with the outer surface of the positive side of the lower wiring body.

12. The inductor component according to claim 11, wherein, The aforementioned upper wiring main body and the aforementioned upper protrusion are integrally molded.

13. The inductor component according to claim 11 or 12, wherein, The material of the second insulating layer includes resin and filler powder as a crystalline material.

14. The inductor component according to any one of claims 11 to 13, wherein, The outer surface of the lower wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the lower wiring body. When the outer surface of the second insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the second insulating layer. It also includes a lower resin wall that covers the aforementioned side surface of the lower wiring body. The lower resin wall is in contact with the side surface of the second insulating layer.

15. A method of manufacturing an inductor component, wherein, have: The seed layer formation process involves forming a conductive seed layer on the main surface of the base substrate; In the insulating layer forming process, an insulating layer with an opening having a specified wiring pattern is formed on the seed layer. In the lower resin wall forming process, a lower resin wall is formed on the above-mentioned insulating layer along the outer edge of the above-mentioned opening; In the lower inductor wiring formation process, by electroplating performed by supplying power to the seed layer, a lower wiring body is formed in the space surrounded by the lower resin wall, and a lower protrusion is formed in the opening that protrudes from the lower wiring body and extends along the lower wiring body. In the upper resin wall forming process, an upper resin wall is formed on the upper side of the lower wiring body along the outer edge of the lower wiring body. The upper inductor wiring formation process utilizes electroplating performed by supplying power to the seed layer to form the upper inductor wiring within the space surrounded by the upper resin wall. In the blank forming process, after the aforementioned upper inductor wiring forming process, a magnetic layer containing magnetic material is formed around the aforementioned lower wiring body, the aforementioned lower protrusion, and the aforementioned upper inductor wiring; and The seed layer removal process is performed after the above-mentioned blank forming process to remove the seed layer.

16. The method for manufacturing an inductor component according to claim 15, wherein, When the above-mentioned insulating layer forming process is designated as the first insulating layer forming process, the above-mentioned opening is designated as the first opening, and the above-mentioned insulating layer is designated as the first insulating layer, It has the following processes: The second insulating layer forming process is performed after the lower inductor wiring forming process and before the upper resin wall forming process. A second insulating layer is formed on the lower wiring body, and the second insulating layer has a second opening along the lower wiring body. In the above-mentioned upper resin wall formation process, the upper resin wall is formed on the upper side of the lower wiring body along the outer edge of the second opening of the second insulation layer. The above-mentioned upper inductor wiring formation process utilizes electroplating performed by supplying power to the above-mentioned seed layer to form an upper wiring body within the space surrounded by the above-mentioned upper resin wall, and forms an upper protrusion that protrudes from the above-mentioned upper wiring body and extends along the above-mentioned upper wiring body within the above-mentioned second opening. as well as In the above-mentioned blank forming process, a magnetic layer made of magnetic material is formed around the lower wiring body, the lower protrusion, the upper wiring body, and the upper protrusion.

17. A substrate for manufacturing an inductor component, wherein, have: Base substrate; The seed layer, located on the main surface of the aforementioned base substrate, is conductive; An insulating layer is located on the seed layer and extends parallel to the main surface of the base substrate. The lower inductor wiring is located on the aforementioned insulating layer and extends parallel to the aforementioned main surface of the aforementioned base substrate. as well as The upper inductor wiring is located on the lower inductor wiring and extends parallel to the main surface of the base substrate. When one direction orthogonal to the main surface of the base substrate is designated as the positive direction, and the direction opposite to the positive direction is designated as the negative direction, The aforementioned lower-level inductor wiring includes: The lower wiring body extends on the outer surface of the aforementioned positive direction side of the aforementioned insulating layer; and The protrusion protrudes from the outer surface of the lower wiring body on the negative direction side to the negative direction side. When viewed in the aforementioned positive direction, the aforementioned protrusion extends along the aforementioned lower wiring body. The surface on the negative direction side of the aforementioned protrusion is in contact with the aforementioned seed layer. The aforementioned upper-layer inductor wiring extends along the lower-layer wiring body on the outer surface of the aforementioned positive-direction side. The negative side of the upper inductor wiring is in contact with the positive side of the lower inductor wiring.

18. The substrate for manufacturing an inductor component according to claim 17, wherein, The material of the seed layer is different from the material of the protrusion.

19. The substrate for manufacturing an inductor component according to claim 17 or 18, wherein, It also includes an adhesive layer sandwiched between the base substrate and the seed layer. The adhesive layer described above is made of an adhesive resin.

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