Display panel and electronic device

Abstract

A display panel and an electronic device are provided, the display panel including: a substrate including a display area and a peripheral area; a pad disposed in a peripheral region of the substrate and including a pad electrode; an insulating layer disposed on the pad and defining an opening through which at least a portion of the pad electrode is exposed to the outside; and a pad connection electrode connected to the pad electrode through the opening and contacting the circuit board pad, at least a portion of the pad connection electrode being disposed on the insulating layer.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0143259, filed on October 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to a device, and more specifically, to a display panel and an electronic device. Background Technology

[0003] Mobile electronic devices are widely used. In recent years, in addition to small electronic devices such as mobile phones, tablet PCs have been widely used as mobile electronic devices.

[0004] Mobile electronic devices include display panels for providing visual information (such as images) to users in order to support various functions. Recently, as other components used to drive the display panel have been miniaturized, the proportion of display panels in electronic devices has gradually increased, and a structure that can be bent from a flat state to a specific angle has been developed. Summary of the Invention

[0005] Typically, a display circuit board can be attached to a pad on the display panel. In this case, the size of the display panel substrate may increase because space must be ensured at the rear end of the pad to allow for the connection of the display circuit board. Furthermore, when a portion of the display circuit board bends, forces may be applied to the display panel substrate as the curvature of the display circuit board decreases, potentially damaging the substrate. One or more embodiments include display panels and electronic devices in which the size of the peripheral area can be reduced while minimizing damage to the display panel substrate by reducing the size of the display panel substrate.

[0006] Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments presented.

[0007] According to one or more embodiments, a display panel includes: a substrate including a display area and a peripheral area; a pad disposed in the peripheral area of ​​the substrate and including a pad electrode; an insulating layer disposed on the pad and defining an opening through which at least a portion of the pad electrode is exposed to the outside; and a pad connecting electrode connected to the pad electrode through the opening, at least a portion of the pad connecting electrode being disposed on the insulating layer.

[0008] In this embodiment, the opening may include multiple openings, and the multiple openings may be arranged in a direction that intersects the longitudinal direction of the pad-connected electrode in a plan view.

[0009] In this embodiment, the opening may include multiple openings, and the multiple openings may be arranged in a serpentine shape in a direction that intersects the longitudinal direction of the pad-connected electrode in a plan view.

[0010] In this embodiment, the opening can have an elliptical shape in the plan view.

[0011] In an embodiment, the pad-connected electrode may include uneven portions in the cross-sectional view.

[0012] In one embodiment, the display panel may further include a protrusion disposed on the insulating layer and protruding toward the pad connection electrode.

[0013] In an embodiment, the protrusion may include a plurality of protrusions, and the plurality of protrusions may be arranged in a plan view below a portion of the pad connecting electrode and may be spaced apart from each other.

[0014] In an embodiment, the protrusion may have a linear shape in a planar view.

[0015] In this embodiment, the protrusions may have a grid shape in the plan view.

[0016] In this embodiment, the insulating layer may include organic materials.

[0017] According to one or more embodiments, an electronic device includes a display panel and a circuit board connected to the display panel and including a circuit board pad, and the display panel includes: a substrate including a display area and a peripheral area; a pad disposed in the peripheral area of ​​the substrate and defining a pad electrode; an insulating layer disposed on the pad and including an opening through which at least a portion of the pad electrode is exposed to the outside; and a pad connection electrode connected to the pad electrode through the opening and contacting the circuit board pad, at least a portion of the pad connection electrode being disposed on the insulating layer.

[0018] In this embodiment, the opening may include multiple openings, and the multiple openings may be arranged in a direction that intersects the longitudinal direction of the pad-connected electrode in a plan view.

[0019] In this embodiment, the opening may include multiple openings, and the multiple openings may be arranged in a serpentine shape in a direction that intersects the longitudinal direction of the pad-connected electrode in a plan view.

[0020] In this embodiment, the opening can have an elliptical shape in the plan view.

[0021] In an embodiment, the pad-connected electrode may include uneven portions in the cross-sectional view.

[0022] In an embodiment, the electronic device may further include a protrusion disposed on an insulating layer and protruding toward the pad-connecting electrode.

[0023] In an embodiment, the protrusion may include a plurality of protrusions, and the plurality of protrusions are disposed below a portion of the pad connecting electrode in a plan view and may be spaced apart from each other.

[0024] In an embodiment, the protrusion may have a linear shape in a planar view.

[0025] In this embodiment, the protrusions may have a grid shape in the plan view.

[0026] In this embodiment, the insulating layer may include organic materials.

[0027] Other aspects, features, and advantages disclosed will become more apparent from the accompanying drawings, claims, and detailed description.

[0028] These general and specific embodiments can be implemented using systems, methods, computer programs, or combinations thereof. Attached Figure Description

[0029] The above and other aspects, features, and advantages of certain embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of an electronic device according to an embodiment; Figure 2 It is shown schematically. Figure 1 An exploded perspective view of an electronic device; Figure 3 It is shown schematically. Figure 1 A block diagram of an electronic device; Figure 4 This is a schematic plan view of the display panel according to an embodiment; Figure 5 It shows the setting Figure 4 The equivalent circuit diagram of a pixel in the display area of ​​the display panel; Figure 6 It is along Figure 4 A sectional view taken by line B-B'; Figure 7A It is shown schematically. Figure 1 A cross-sectional view of a part of an electronic device; Figure 7B It is shown schematically. Figure 1 A cross-sectional view of a part of an electronic device; Figure 8 It is shown Figure 7A and Figure 7B An enlarged sectional view of part C; Figure 9A It is shown schematically. Figure 8 A plan view of the pad connecting the electrodes; Figure 9B This is a schematic plan view illustrating the pad connection electrodes of a display panel according to another embodiment; Figure 10 This is a schematic cross-sectional view of a portion of a display panel according to another embodiment; Figures 11A to 11C It is shown schematically. Figure 10 A plan view of the protrusion; Figure 12 This is a block diagram of an electronic device according to an embodiment; and Figures 13 to 15 These are schematic diagrams of electronic devices according to various embodiments. Detailed Implementation

[0030] Referring now to the embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always refer to the same elements. In this respect, the embodiments given may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0031] Because the disclosure allows for various modifications and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in the detailed description. The effects and features of the disclosure, as well as the methods for implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the disclosure is not limited to the following embodiments and can be embodied in various forms.

[0032] In the following description, embodiments will be described in detail with reference to the accompanying drawings, wherein the same or corresponding elements are always represented by the same reference numerals, and repeated descriptions thereof are omitted.

[0033] Although terms such as "first," "second," etc., can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0034] As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” are also intended to include the plural forms.

[0035] It will also be understood that the terms “comprising” or “including” as used herein indicate the presence of the stated feature or component, but do not preclude the presence or addition of one or more other features or components.

[0036] It will also be understood that when a layer, region, or component is referred to as being "on" another layer, region, or component, it may be directly on the other layer, region, or component, or indirectly on the other layer, region, or component, with an intermediary layer, region, or component located therebetween.

[0037] For ease of explanation, the dimensions of components in the accompanying drawings may be exaggerated or reduced. For example, the disclosure is not limited thereto because the dimensions and thicknesses of components in the accompanying drawings are arbitrarily shown for ease of explanation.

[0038] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0039] When an embodiment can be implemented differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously, or they may be performed in the reverse order of the described sequence.

[0040] Figure 1 This is a perspective view schematically showing an electronic device according to an embodiment. Figure 2 It is shown schematically. Figure 1 An exploded perspective view of the electronic device. Figure 3 It is shown schematically. Figure 1 A block diagram of an electronic device.

[0041] Reference Figures 1 to 3 The electronic device 1 for displaying moving or still images can be a portable electronic device (such as a mobile phone, smartphone, tablet PC, mobile communication terminal, electronic notebook, e-book, portable multimedia player (PMP), navigation device, or ultra-mobile PC (UMPC)), or any of various products such as a television, laptop computer, monitor, billboard, or Internet of Things (IoT) product. Optionally, the electronic device 1 according to the embodiment can be a wearable device (such as a smartwatch, watch phone, glasses display, or head-mounted display (HMD)). Optionally, the electronic device 1 according to the embodiment can be a vehicle dashboard, a vehicle center console, or a central information display (CID) mounted on the vehicle dashboard, an interior mirror display replacing the vehicle's side mirrors, or a display mounted on the back of the front seat for entertainment of people in the rear seats of the vehicle.

[0042] For ease of explanation, Figure 1 and Figure 2In this context, electronic device 1 is a smartphone. Electronic device 1 may include a cover window 70, a display panel 10, a data driver 20, a display circuit board 30, a component 40, a bracket 60, a main circuit board 50, a battery 80, and / or a bottom cover 90.

[0043] In the instruction manual, "plan view" refers to the view of the display panel 10 when viewed in a direction perpendicular to the display panel 10 (the z-direction, which may also be referred to as the "z-axis direction" below). The terms "left," "right," "up," and "down" in the plan view refer to the directions when viewing the display panel 10 in a direction perpendicular to the display panel 10. For example, "left" refers to the opposite direction to the x-direction (which may also be referred to as the "x-axis direction" below), "right" refers to the x-direction, "up" refers to the y-direction (which may also be referred to as the "y-axis direction" below), and "down" refers to the opposite direction to the y-direction.

[0044] In a plan view, electronic device 1 can have a substantially rectangular shape. For example, as shown... Figure 1 As shown, the electronic device 1 can have a substantially rectangular shape in the xy-plane, having a short side in the x-axis direction and a long side in the y-axis direction. In this case, the corner where the short side in the x-axis direction and the long side in the y-axis direction intersect can form a right angle, or it can have a circular (rounded) shape with a specific curvature. However, the disclosure is not limited to this, and in the plan view, the electronic device 1 can have a polygonal shape other than a rectangular shape, and can have an elliptical shape or an irregular shape.

[0045] A cover window 70 can be disposed on the display panel 10 to cover the top surface of the display panel 10. The cover window 70 can protect the top surface of the display panel 10.

[0046] The cover window 70 may include a transmissive cover portion DA70 corresponding to the display panel 10 and a light-blocking cover portion NDA70 surrounding the transmissive cover portion DA70. The light-blocking cover portion NDA70 may include an opaque material (e.g., a colored opaque material) for blocking light. The light-blocking cover portion NDA70 may include a pattern that can be shown to the user when no image is displayed.

[0047] Display panel 10 may be disposed below cover window 70. Display panel 10 may be superimposed on the transmissive cover portion DA 70 of cover window 70. Display panel 10 includes display area DA. Display area DA for displaying images may include an area (hereinafter referred to as component area) that transmits light emitted from component 40 disposed below display panel 10. Component may include a sensor or camera that uses visible light, infrared light, or sound.

[0048] Display panel 10 can be a light-emitting display panel including light-emitting diodes (LEDs). The LEDs can be organic light-emitting diodes (OLEDs) including an organic emitting layer, or inorganic light-emitting diodes including inorganic materials. Inorganic LEDs can include PN junction diodes containing inorganic semiconductor materials. When a voltage is applied to a PN junction diode in the forward direction, holes and electrons can be injected, and the energy generated by the recombination of holes and electrons can be converted into light energy to emit light of a specific color. Inorganic LEDs can have widths ranging from a few micrometers to hundreds of micrometers. Inorganic LEDs can be referred to as microLEDs.

[0049] The display panel 10 can be a rigid display panel that is not easily bent, or a flexible display panel that is easily bent, folded, or rolled up. For example, the display panel 10 can be a foldable display panel that can be folded and unfolded, a curved display panel with a curved display surface, a rollable display panel that can be rolled up or unfolded, or a stretchable display panel.

[0050] The display panel 10 can be a transparent display panel, allowing objects or backgrounds disposed on the bottom surface of the display panel 10 to be viewed from the top surface of the display panel 10. Alternatively, the display panel 10 can be a reflective display panel capable of reflecting objects or backgrounds on the top surface of the display panel 10.

[0051] The data driver 20 can be mounted as an integrated circuit (IC) on the display circuit board 30.

[0052] The display circuit board 30 can be attached to one side of the display panel 10. The display circuit board 30 can be a flexible printed circuit board (FPCB), or a composite printed circuit board including both rigid and flexible printed circuit boards. A touch sensor driver can be mounted on the display circuit board 30. The touch sensor driver can be formed as an integrated circuit. The touch sensor driver can be electrically connected via the display circuit board 30 to the touch electrodes of the touchscreen layer of the display panel 10.

[0053] At least a portion of the display circuit board 30 is bendable. In this configuration, the display circuit board 30 can connect the display panel 10 to the main circuit board 50. In this configuration, the display circuit board 30 can be connected to the pad (also known as a "solder pad") of the display panel 10 and can be bent toward the bottom surface of the display panel 10.

[0054] The touchscreen layer of the display panel 10 can detect user touch input using at least one of various touch methods (such as resistive or capacitive methods). When the touchscreen layer of the display panel 10 detects user touch input using a capacitive method, the touch sensor driver can apply a drive signal to the drive electrode in the touch electrode, and can determine whether the user has touched the screen by detecting the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode via the sensing electrode in the touch electrode.

[0055] User touches can include contact touches and proximity touches. A contact touch means that an object such as a user's finger or pen directly contacts the overlay window 70 disposed on the touchscreen layer. A proximity touch means that an object such as a user's finger or pen is positioned near the overlay window 70 (e.g., hovering). The touch sensor driver can transmit sensor data to the main processor 510 based on the detected voltage, and the main processor 510 can calculate the touch coordinates of the touch input by analyzing the sensor data.

[0056] A controller, gate driver, and / or data driver 20 for supplying driving voltages for driving the pixels of the display panel 10 may be disposed on the display circuit board 30.

[0057] A bracket 60 for supporting the display panel 10 may be disposed below the display panel 10. The bracket 60 may include plastic, metal, or both. The bracket 60 may include a first camera hole CMH1 into which a camera device 531 is inserted, a battery hole BH in which a battery 80 is disposed, a cable hole CAH through which a cable connected to the display circuit board 30 passes, and a component hole CPH corresponding to component 40. When viewed in the third direction (z-axis direction), the component hole CPH may overlap with component 40 of the main circuit board 50. For reference, when viewed in the third direction (z-axis direction), the display area DA of the display panel 10 may overlap with component 40 of the main circuit board 50. If necessary, the bracket 60 may not have the component hole CPH.

[0058] Component 40 included in the electronic device 1 may include a first component 41, a second component 42, a third component 43, and a fourth component 44 stacked with the display panel 10. Each of the first component 41, the second component 42, the third component 43, and the fourth component 44 may include at least one of a proximity sensor, an illumination sensor, an iris sensor, a facial recognition sensor, and a camera (or image sensor). The proximity sensor, using infrared light, can detect objects positioned near the top surface of the electronic device 1, and the illumination sensor can detect the brightness of light incident on the top surface of the electronic device 1. Furthermore, the iris sensor can capture an image of the iris of a person located above the top surface of the electronic device 1, and the camera can acquire image data of objects located above the top surface of the electronic device 1. Component 40 is not limited to a proximity sensor, an illumination sensor, an iris sensor, a facial recognition sensor, and / or a camera, and may include another sensor.

[0059] The main circuit board 50 and the battery 80 can be disposed below the bracket 60. The main circuit board 50 can be a rigid printed circuit board or a flexible printed circuit board.

[0060] The main circuit board 50 may include a main processor 510, a camera device 531, a main connector 55, and component 40. The main processor 510 may be formed as an integrated circuit. If necessary, the electronic device 1 may include not only the camera device 531 disposed on the top surface of the main circuit board 50, but also a camera device disposed on the bottom surface of the main circuit board 50. Each of the main processor 510 and the main connector 55 may be disposed on either the top or bottom surface of the main circuit board 50. The main circuit board 50 may be electrically connected to the display circuit board 30 via the main connector 55, etc.

[0061] The main processor 510 can control all functions of the electronic device 1. For example, the main processor 510 can output digital video data to the data driver 20 via the display circuit board 30, causing the display panel 10 to display an image. The main processor 510 can receive detection data from the touch sensor driver. The main processor 510 can determine whether the user is touching the device based on the detection data, and can perform operations corresponding to direct touch (i.e., contact touch) or proximity touch. The main processor 510 can be an application processor, central processing unit, or system chip formed as an integrated circuit.

[0062] Camera device 531 processes image frames (such as still images or moving images) acquired by an image sensor in camera mode and outputs the image frames to main processor 510. Camera device 531 may include at least one of a camera sensor (e.g., CCD or CMOS), a light sensor (or image sensor), and a laser sensor.

[0063] A cable passing through the cable hole CAH of the bracket 60 can be connected to the main connector 55, and the main circuit board 50 can be electrically connected to the display circuit board 30 via a cable.

[0064] Electronic device 1 can be shown as follows Figure 3 The block diagram shown. In addition to the main processor 510, the electronic device 1 may also include, as shown in the diagram. Figure 3 The wireless communication unit 520, input unit 530, sensor unit 540, output unit 550, interface unit 560, memory 570 and / or power supply unit 580 shown are included.

[0065] The wireless communication unit 520 may include at least one of the following: a broadcast receiving module 521, a mobile communication module 522, a wireless internet module 523, a short-range communication module 524, and a location information module 525.

[0066] The broadcast receiving module 521 receives broadcast signals and / or broadcast-related information from an external broadcast management server via a broadcast channel. The broadcast channel may include satellite channels and terrestrial channels.

[0067] Mobile communication module 522 transmits and receives radio signals from at least one of a base station, an external terminal, and a server in a mobile communication network established according to mobile communication technical standards or communication methods (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), and Long Term Evolution Upgrade (LTE-A)). The radio signals may include various types of data transmitted and received based on voice call signals, video call signals, or text / multimedia messages.

[0068] Wireless Internet module 523 refers to a module used for wireless Internet access. Wireless Internet module 523 can be configured to transmit and receive wireless signals in a communication network according to wireless Internet technologies. Wireless Internet technologies can be, for example, Wireless LAN (WLAN), Wi-Fi, Wi-Fi Direct, and / or Digital Living Network Alliance (DLNA).

[0069] The short-range communication module 524 for short-range communication can support short-range communication using at least one of the following technologies: Bluetooth™, Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (USB). The short-range communication module 524 can support wireless communication between electronic device 1 and a wireless communication system, between electronic device 1 and another electronic device, or between electronic device 1 and a network in which another electronic device (or an external server) is located, via a wireless local area network. The wireless local area network can be a wireless personal area network. The other electronic device can be a wearable device capable of exchanging data (or interacting) with electronic device 1.

[0070] The location information module 525 used to obtain the location of electronic device 1 may include a Global Positioning System (GPS) module or a Wi-Fi module.

[0071] Input unit 530 may include an image input unit (such as camera device 531) for inputting image signals, an audio input unit (such as microphone 532) for inputting audio signals, and an input device 533 for receiving information from a user. Camera device 531 processes image frames (such as still or moving images) acquired by an image sensor in video call mode or shooting mode. The processed image frames may be displayed on display panel 10 or stored in memory 570. Microphone 532 processes external audio signals into electronic voice data. The processed voice data may be used in various ways depending on the function (or application) being performed in electronic device 1.

[0072] The main processor 510 can control the operation of the electronic device 1 in response to information input via the input device 533. The input device 533 may include mechanical input devices or touch input devices (such as buttons, dome switches, jog wheels, or jog switches located on the rear or side surface of the electronic device 1). The touch input device may include the touch screen layer of the display panel 10.

[0073] Sensor unit 540 may include one or more sensors that sense at least one of information in electronic device 1, environmental information surrounding electronic device 1, and user information, and generate corresponding sensing signals. Main processor 510 may control the driving or operation of electronic device 1, or may perform data processing, functions, or operations related to applications installed in electronic device 1. Sensor unit 540 may be a proximity sensor, illuminance sensor, or facial recognition sensor as described with respect to component 40. Sensor unit 540 may include an accelerometer, magnetic sensor, gravity sensor, gyroscope sensor, motion sensor, RGB sensor, infrared (IR) sensor, finger scanning sensor, ultrasonic sensor, optical sensor, and / or battery gauge. Additionally, sensor unit 540 may include environmental sensors or chemical sensors. Environmental sensors may be, for example, barometers, hygrometers, thermometers, radiation detection sensors, thermal sensors, and / or gas sensors. Chemical sensors may be, for example, electronic noses, healthcare sensors, and / or biometric sensors.

[0074] Output unit 550 for generating visual, auditory, or tactile outputs may include at least one of display panel 10, sound output unit 551, tactile module 552, and light output unit 553.

[0075] Display panel 10 displays (outputs) information processed by electronic device 1. For example, display panel 10 may display execution screen information of an application running in electronic device 1, display a user interface (UI) based on the execution screen information, or display graphical user interface (GUI) information. Display panel 10 may include a display layer for displaying images and a touch screen layer for detecting user touch input. Therefore, display panel 10 can be used as one of the input devices 533 that provide an input interface between electronic device 1 and the user, and can also be used as one of the output units 550 that provide an output interface between electronic device 1 and the user.

[0076] The sound output unit 551 can output sound data received from the wireless communication unit 520 or stored in the memory 570 in call signal receiving mode, call mode, recording mode, voice recognition mode, and / or broadcast receiving mode. The sound output unit 551 can output sound signals related to the functions performed in the electronic device 1 (e.g., call signal receiving sound or message receiving sound). The sound output unit 551 may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generating device attached to the bottom of the display panel 10 and outputting sound by vibrating the display panel 10. The sound generating device may be a piezoelectric element or piezoelectric actuator that contracts or expands according to an electrical signal, or an exciter that generates magnetic force by using a voice coil and vibrates the display panel 10.

[0077] The haptic module 552 generates various tactile effects that the user can perceive. The haptic module 552 can provide vibrations as tactile effects to the user. The haptic module 552 can transmit tactile effects not only through direct contact but also by allowing the user to experience tactile effects through muscle sensations (such as the user's fingers or arm).

[0078] The light output unit 553 outputs a signal to notify of an event by using light from a light source. Examples of events occurring in the electronic device 1 may include message reception, call signal reception, missed call, alarm clock, calendar notification, email reception, and / or information reception via an application. The signal output from the light output unit 553 is realized when the electronic device 1 emits light of a single color or multiple colors from its front or rear surface. The signal output can be terminated when the electronic device 1 detects that the user has acknowledged the event.

[0079] Interface unit 560 serves as a channel for connecting to various types of external devices connected to electronic device 1. Interface unit 560 may include at least one of a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device including an identification module, an audio input / output (I / O) port, a video I / O port, and a headphone port. When an external device is connected to interface unit 560, electronic device 1 can perform appropriate controls associated with the connected external device.

[0080] Memory 570 stores data supporting various functions of electronic device 1. Memory 570 may store multiple applications (applications) running in electronic device 1, as well as multiple data and / or instructions for the operation of electronic device 1. At least some of the multiple applications can be downloaded from an external server via wireless communication. Memory 570 may store applications for the operation of main processor 510 and may temporarily store input / output data (e.g., phone book, messages, still images, and / or moving images). Furthermore, memory 570 may store tactile data for providing vibrations of various modes to tactile module 552 and sound data related to various sounds provided to sound output unit 551.

[0081] The memory 570 may include at least one type of storage medium selected from flash memory, hard disk, solid-state drive (SSD), silicon disk drive (SDD), multimedia card micro, card-type memory (e.g., SD or XD memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, magnetic disk, and optical disk.

[0082] The power supply unit 580, under the control of the main processor 510, receives external and / or internal power and supplies power to each component included in the electronic device 1. The power supply unit 580 may include a battery 80. Furthermore, the power supply unit 580 may include a connection port, and the connection port may be an example of an interface unit 560, to which an external charger for supplying power is electrically connected to charge the battery 80. Optionally, the power supply unit 580 may charge the battery 80 wirelessly. The battery 80 may be configured not to overlap with the main circuit board 50 in the third direction (z-direction). The battery 80 may overlap with the battery hole BH of the bracket 60.

[0083] The lower cover 90 can form the appearance of the electronic device 1 and can define a portion of the display panel 10 through its exposed opening. The lower cover 90 has a surface open shape corresponding to the display panel 10 and can be fastened to the display panel 10. The lower cover 90 can be positioned relative to the cover window 70, and the display panel 10 is located between the lower cover 90 and the cover window 70. The lower cover 90 can be disposed below the main circuit board 50 and the battery 80. The lower cover 90 can be fastened and fixed to the bracket 60. The lower cover 90 can form the appearance of the bottom surface of the electronic device 1. The lower cover 90 can include plastic, metal, or both plastic and metal.

[0084] The bottom surface of the camera device 531, through which the exposed second camera aperture CMH2 can be formed in the lower cover 90. The position of the camera device 531 and the positions of the corresponding first camera aperture CMH1 and second camera aperture CMH2 are not limited to... Figure 2 The position shown can be changed in various ways.

[0085] Figure 4 This is a schematic plan view of a display panel according to an embodiment.

[0086] Reference Figure 4 The display panel 10 may include a display area DA and a peripheral area PA outside the display area DA. The display area DA is the portion where the image is displayed, and multiple pixels may be located within the display area DA. The display area DA may have any of a variety of shapes, such as a circular shape, an elliptical shape, a polygonal shape, or a shape of a specific graphic. Figure 4 In the middle, the display area DA has a basically rectangular shape with rounded (rounded) corners.

[0087] The peripheral region PA can be located outside the display region DA. The peripheral region PA can include a first peripheral region PA1 surrounding at least a portion of the display region DA and a second peripheral region PA2 located at the lower end of the display region DA and extending in a first direction (x-axis direction). The width of the second peripheral region PA2 in the first direction (x-axis direction) can be smaller than the width of the display region DA. With this structure, at least a portion of the second peripheral region PA2 can be easily bent.

[0088] Figure 4 The planar shape of the display panel 10 may be substantially the same as the shape of the substrate 100 included in the display panel 10. As used herein, "planar shape" means the shape of an object in a plan view. When the display panel 10 includes a display area DA and a peripheral area PA outside the display area DA, it may mean that the substrate 100 includes the display area DA and the peripheral area PA outside the display area DA. For convenience, the following description will assume that the substrate 100 includes the display area DA and the peripheral area PA.

[0089] The display panel 10 may include a substrate 100. Various components of the display panel 10 may be disposed on the substrate 100.

[0090] Subpixels can be disposed within a display area DA, and the display area DA can provide an image using light emitted from the subpixels. Each subpixel may include a light-emitting diode (LED), and the LED may be electrically connected to a subpixel circuit PC. The subpixel circuit PC and the LED may be disposed within the display area DA. For convenience, although the subpixel circuit PC and the LED are... Figure 4 The subpixel circuits (PC) and LEDs are positioned side-by-side, but they can actually be at least partially stacked on top of each other. For example, the LEDs can be positioned on the subpixel circuits (PC).

[0091] The gate drive circuit, pad 14, first power supply wiring 15, and second power supply wiring 16 may be disposed in the peripheral region PA. The gate drive circuit may include, for example, a first scan drive circuit 11, a second scan drive circuit 12, and / or an emitt control drive circuit 13.

[0092] The first scan drive circuit 11 can provide scan signals to the sub-pixel circuits PC via scan lines SL. The second scan drive circuit 12 can be configured opposite to the first scan drive circuit 11, with the display area DA located between the second scan drive circuit 12 and the first scan drive circuit 11. Some of the sub-pixel circuits PC located in the display area DA can be electrically connected to the first scan drive circuit 11, and the remaining sub-pixel circuits PC can be connected to the second scan drive circuit 12. If necessary, the second scan drive circuit 12 can be omitted.

[0093] Like the first scan drive circuit 11, the emission control drive circuit 13 can be located on one side of the display area DA. The emission control drive circuit 13 can provide emission control signals to the pixels via the emission control line EL. Although in Figure 4 The emission control drive circuit 13 is only disposed on one side of the display area DA, but the disclosure is not limited thereto. For example, the display panel 10 may include emission control drive circuits 13 disposed on one side and the other side of the display area DA. Optionally, the first scan drive circuit 11 may be disposed on one side of the display area DA, and the emission control drive circuit 13 may be disposed on the other side.

[0094] Pad 14 can be disposed in the second peripheral region PA2 of the substrate 100. Pad 14 can be electrically connected to the display circuit board 30. The circuit board pad 34 of the display circuit board 30 can be electrically connected to the pad 14 of the display panel 10.

[0095] The display circuit board 30 transmits signals or power from the controller to the display panel 10. Control signals generated by the controller can be transmitted to the gate drive circuit via the display circuit board 30. Furthermore, the controller can provide a first power supply voltage ELVDD (see [link to relevant documentation]) to the first power supply wiring 15 and the second power supply wiring 16 respectively. Figure 5 ) and the second power supply voltage ELVSS (see Figure 5 A first power supply voltage ELVDD (hereinafter referred to as the driving voltage) can be provided to each sub-pixel circuit PC via the driving voltage line PL connected to the first power supply wiring 15, and a second power supply voltage ELVSS (hereinafter referred to as the common voltage) can be provided to the common electrode (hereinafter referred to as the second electrode or cathode) of the light-emitting diode LED connected to the second power supply wiring 16. The first power supply wiring 15 can extend in a first direction (x-axis direction). The second power supply wiring 16 can have a loop shape with an opening on one side and can partially surround the display area DA.

[0096] The display circuit board 30 can be bent around a bending axis BAX. For example, a portion of the display circuit board 30 can be connected to the pad 14 of the display panel 10, and another portion of the display circuit board 30 can be connected to the aforementioned portion and can be bent around a bending axis BAX to be disposed on the bottom surface of the display panel 10.

[0097] The data signal of the data driver 20 can be transmitted to the sub-pixel circuit PC through the input line IL connected to the pad 14, through the circuit board pad 34 set on the display circuit board 30, and through the data line DL electrically connected to the input line IL.

[0098] Figure 5 It shows the setting Figure 4 The equivalent circuit diagram of a pixel in the display area of ​​the display panel.

[0099] Reference Figure 5 The light-emitting diode (LED) can be electrically connected to the sub-pixel circuit PC.

[0100] The sub-pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, a third thin-film transistor T3, a fourth thin-film transistor T4, a fifth thin-film transistor T5, a sixth thin-film transistor T6, a seventh thin-film transistor T7, and a storage capacitor Cst.

[0101] The second thin-film transistor T2, acting as a switching thin-film transistor, can be connected to the scan line SL and the data line DL, and can transmit the data voltage (or data signal Dm) input from the data line DL to the first thin-film transistor T1 based on the scan voltage (or scan signal Sn) input from the scan line SL. The storage capacitor Cst can be connected to the gate electrode of the first thin-film transistor T1 and the drive voltage line PL, and can store the voltage corresponding to the difference between the voltage at the gate electrode of the first thin-film transistor T1 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0102] The first thin-film transistor T1, acting as the driving thin-film transistor, can be connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the light-emitting diode (LED) in response to the value of the voltage stored in the storage capacitor Cst. The LED can emit light with a specific brightness due to the driving current. The second electrode (e.g., the cathode) of the LED can receive a second power supply voltage ELVSS.

[0103] The gate electrode of the third thin-film transistor T3, which serves as a compensation thin-film transistor, can be connected to the scan line SL. The source electrode (or drain electrode) of the third thin-film transistor T3 can be connected to the drain electrode (or source electrode) of the first thin-film transistor T1, and can be connected to the first electrode of the light-emitting diode (LED) via the sixth thin-film transistor T6. The drain electrode (or source electrode) of the third thin-film transistor T3 can be connected to one electrode of the storage capacitor Cst, the source electrode (or drain electrode) of the fourth thin-film transistor T4, and the gate electrode of the first thin-film transistor T1. The third thin-film transistor T3 is turned on according to the scan signal Sn received through the scan line SL, and the first thin-film transistor T1 is diode-connected by connecting the gate electrode and the drain electrode of the first thin-film transistor T1.

[0104] The gate electrode of the fourth thin-film transistor T4, which serves as the initialization thin-film transistor, can be connected to the previous scan line SL-1. The drain electrode (or source electrode) of the fourth thin-film transistor T4 can be connected to the initialization voltage line VL. The source electrode (or drain electrode) of the fourth thin-film transistor T4 can be connected to one electrode of the storage capacitor Cst, the drain electrode (or source electrode) of the third thin-film transistor T3, and the gate electrode of the first thin-film transistor T1. The fourth thin-film transistor T4 can be turned on according to the previous scan signal Sn-1 received through the previous scan line SL-1, and can perform an initialization operation to initialize the voltage of the gate electrode of the first thin-film transistor T1 by supplying an initialization voltage Vint to the gate electrode of the first thin-film transistor T1.

[0105] The gate electrode of the fifth thin-film transistor T5, which serves as the operation control thin-film transistor, can be connected to the emitter control line EL. The source electrode (or drain electrode) of the fifth thin-film transistor T5 can be connected to the drive voltage line PL. The drain electrode (or source electrode) of the fifth thin-film transistor T5 is connected to the source electrode (or drain electrode) of the first thin-film transistor T1 and the drain electrode (or source electrode) of the second thin-film transistor T2.

[0106] The gate electrode of the sixth thin-film transistor T6, which serves as the emitter control thin-film transistor, can be connected to the emitter control line EL. The source electrode (or drain electrode) of the sixth thin-film transistor T6 can be connected to the drain electrode (or source electrode) of the first thin-film transistor T1 and the source electrode (or drain electrode) of the third thin-film transistor T3. The drain electrode (or source electrode) of the sixth thin-film transistor T6 can be electrically connected to the first electrode of the light-emitting diode (LED). The fifth thin-film transistor T5 and the sixth thin-film transistor T6 can be simultaneously turned on according to the emitter control signal En received through the emitter control line EL, so the first power supply voltage ELVDD is supplied to the LED and a driving current flows through the LED.

[0107] The seventh thin-film transistor T7 can be an initialization thin-film transistor used to initialize the first electrode of the light-emitting diode (LED). The gate electrode of the seventh thin-film transistor T7 can be connected to the next scan line SL+1. The source electrode (or drain electrode) of the seventh thin-film transistor T7 can be connected to the first electrode of the LED. The drain electrode (or source electrode) of the seventh thin-film transistor T7 can be connected to the initialization voltage line VL. The seventh thin-film transistor T7 can be turned on according to the next scan signal Sn+1 received via the next scan line SL+1, and can initialize the first electrode of the LED.

[0108] Despite Figure 5 In one embodiment, the fourth thin-film transistor T4 and the seventh thin-film transistor T7 are connected to the previous scan line SL-1 and the next scan line SL+1, respectively. However, in another embodiment, both the fourth thin-film transistor T4 and the seventh thin-film transistor T7 can be connected to the previous scan line SL-1 and can be driven according to the previous scan signal Sn-1.

[0109] The other electrode of the storage capacitor Cst can be connected to the drive voltage line PL. One electrode of the storage capacitor Cst can be connected to the gate electrode of the first thin-film transistor T1, the drain electrode (or source electrode) of the third thin-film transistor T3, and the source electrode (or drain electrode) of the fourth thin-film transistor T4.

[0110] The second electrode (e.g., the cathode) of the light-emitting diode (LED) receives a second power supply voltage, ELVSS. The LED receives a drive current from the first thin-film transistor T1 and emits light.

[0111] A light-emitting diode (LED) can be an organic light-emitting diode (OLED) that includes organic materials as light-emitting materials. In another embodiment, an LED can be an inorganic light-emitting diode that includes inorganic materials. An inorganic LED can include a PN junction diode containing inorganic semiconductor materials. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons can be injected, and the energy generated by the recombination of holes and electrons can be converted into light energy to emit light of a specific color. An inorganic LED can have a width of several micrometers to hundreds of micrometers or several nanometers to hundreds of nanometers. In some embodiments, an LED can include a quantum dot LED. As described above, the emitting layer of an LED can include organic materials, can include inorganic materials, can include quantum dots, can include both organic materials and quantum dots, or can include both inorganic materials and quantum dots. For ease of explanation, the following description will assume that the LED includes an organic light-emitting diode.

[0112] Despite Figure 5 The subpixel circuit PC includes seven transistors and one capacitor; however, in another embodiment, the subpixel circuit PC may include two or more transistors and may include two or more capacitors. Furthermore, the circuit design of the subpixel circuit PC is not limited to... Figure 5 The circuit design shown can be modified in various ways.

[0113] The first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be various types of transistors. In the embodiments, such as Figure 5 As shown, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be p-channel MOSFETs (PMOS). In another embodiment, at least one of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be a PMOS, and the remaining transistors can be n-channel MOSFETs (NMOS). In yet another embodiment, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be NMOS transistors. The positions of the source and drain can be varied depending on the type of transistor (p-type or n-type).

[0114] Figure 5All of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be transistors comprising low-temperature silicon semiconductors. In this case, the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 are not limited thereto, and at least one of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be a transistor having a low-temperature polycrystalline silicon (LTPS) semiconductor layer, and the remaining transistors can be transistors having an oxide semiconductor layer. Optionally, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be transistors having an oxide semiconductor layer.

[0115] Figure 6 It is along Figure 4 The sectional view taken by line B-B'.

[0116] Figure 6 The sub-pixel circuit PC and light-emitting diode (e.g., organic light-emitting diode OLED) are shown in the display area DA of the display panel 10.

[0117] The substrate 100 may include glass, ceramic, metal, or polymer resin. In embodiments, the substrate 100 may have a structure in which a matrix layer comprising a polymer resin and a barrier layer comprising an inorganic insulating material (such as silicon oxide or silicon nitride) are stacked alternately. When the substrate 100 has a stacked structure comprising a matrix layer formed of polymer resin and a barrier layer formed of inorganic insulating material, the flexibility of the electronic device 1 can be improved, and thus, a foldable electronic device 1 can be provided.

[0118] Inorganic insulating materials may include silicon oxide, silicon nitride, or silicon oxynitride.

[0119] The polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. For ease of illustration, the substrate 100 will be described in detail below as being formed of a glass material.

[0120] Subpixel circuit PC can be formed on substrate 100, and light-emitting diodes (e.g., organic light-emitting diodes OLED) can be formed on subpixel circuit PC.

[0121] Before forming the sub-pixel circuit PC on the substrate 100, a buffer layer 201 may be formed on the substrate 100 to prevent impurities from penetrating into the sub-pixel circuit PC. The buffer layer 201 comprises an inorganic insulating material (such as silicon nitride, silicon oxynitride, or silicon oxide) and may have a single-layer structure or a multi-layer structure comprising the above inorganic insulating material.

[0122] The sub-pixel circuit PC may include, as referenced Figure 5 The description includes multiple transistors and storage capacitors. In this regard, Figure 6 The first thin-film transistor T1, the third thin-film transistor T3, and the storage capacitor Cst are shown.

[0123] The first thin-film transistor T1 may include a semiconductor layer (hereinafter referred to as the first semiconductor layer A1) on the buffer layer 201 and a gate electrode (hereinafter referred to as the first gate electrode GE1) superimposed on the channel region C1 of the first semiconductor layer A1. The first semiconductor layer A1 may include a silicon-based semiconductor material (e.g., polycrystalline silicon). The first semiconductor layer A1 may include the channel region C1 and a first region B1 and a second region D1 disposed on both sides of the channel region C1. The first region B1 and the second region D1 are regions having a higher impurity concentration than the channel region C1, and one of the first region B1 and the second region D1 may correspond to the source region and the other may correspond to the drain region.

[0124] The first gate insulating layer 203 may be disposed between the first semiconductor layer A1 and the first gate electrode GE1. The first gate insulating layer 203 may include an inorganic insulating material (such as silicon oxide, silicon nitride, or silicon oxynitride), and may have a single-layer structure or a multi-layer structure including the above inorganic insulating materials.

[0125] The first gate electrode GE1 may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may have a single-layer structure or a multi-layer structure comprising the above materials.

[0126] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 stacked on top of each other. In an embodiment, the lower electrode CE1 of the storage capacitor Cst may include a first gate electrode GE1. In other words, the first gate electrode GE1 may include the lower electrode CE1 of the storage capacitor Cst. For example, the first gate electrode GE1 and the lower electrode CE1 of the storage capacitor Cst may be integrally formed with each other.

[0127] The first interlayer insulating layer 205 can be disposed between the lower electrode CE1 and the upper electrode CE2 of the storage capacitor Cst. The first interlayer insulating layer 205 may include an inorganic insulating material (such as silicon oxide, silicon nitride, or silicon oxynitride), and may have a single-layer structure or a multi-layer structure including the above inorganic insulating materials.

[0128] The upper electrode CE2 of the storage capacitor Cst may include a low-resistance conductive material (such as molybdenum (Mo), aluminum (Al), copper (Cu) and / or titanium (Ti)) and may have a single-layer structure or a multi-layer structure including the above materials.

[0129] The second interlayer insulation layer 207 can be disposed on the storage capacitor Cst. The second interlayer insulation layer 207 may include inorganic insulating materials (such as silicon oxide, silicon nitride, or silicon oxynitride), and may have a single-layer structure or a multi-layer structure including the above inorganic insulating materials.

[0130] The semiconductor layer of the third thin-film transistor T3 (hereinafter referred to as the third semiconductor layer A3) may be disposed on the second interlayer insulating layer 207. The third semiconductor layer A3 may include a silicon-based semiconductor material (e.g., polycrystalline silicon).

[0131] The third semiconductor layer A3 may include a channel region C3 and a first region B3 and a second region D3 disposed on both sides of the channel region C3. Either the first region B3 or the second region D3 may be a source region, and the other may be a drain region.

[0132] The third thin-film transistor T3 may include a gate electrode (hereinafter referred to as the third gate electrode GE3) superimposed on the channel region C3 of the third semiconductor layer A3. The third gate electrode GE3 may have a dual-gate structure including a lower gate electrode G3A disposed below the third semiconductor layer A3 and an upper gate electrode G3B disposed above the channel region C3.

[0133] The lower gate electrode G3A can be disposed on the same layer (e.g., the first interlayer insulating layer 205) as the upper electrode CE2 of the storage capacitor Cst. The lower gate electrode G3A can be made of the same material as the upper electrode CE2 of the storage capacitor Cst.

[0134] The upper gate electrode G3B may be disposed on the third semiconductor layer A3, and the second gate insulating layer 209 is located between the upper gate electrode G3B and the third semiconductor layer A3. The second gate insulating layer 209 may include an inorganic insulating material (such as silicon oxide, silicon nitride, or silicon oxynitride), and may have a single-layer structure or a multi-layer structure including the above inorganic insulating material.

[0135] The third interlayer insulating layer 210 may be disposed on the upper gate electrode G3B. The third interlayer insulating layer 210 may include an inorganic insulating material (such as silicon oxynitride) and may have a single-layer structure or a multi-layer structure including the above inorganic insulating material.

[0136] although Figure 6 References are shown Figure 5 The first thin-film transistor T1 and the third thin-film transistor T3 are described among a plurality of thin-film transistors, and a first semiconductor layer A1 and a third semiconductor layer A3 are shown disposed on different layers, but the disclosure is not limited thereto.

[0137] Reference Figure 5The second thin-film transistor T2, the fourth thin-film transistor T4, the fifth thin-film transistor T5, the sixth thin-film transistor T6, and the seventh thin-film transistor T7 described (see...) Figure 5 Each of the items in the reference can be used with the reference. Figure 6 The first thin-film transistor T1 described has the same structure. For example, the second thin-film transistor T2, the fourth thin-film transistor T4, the fifth thin-film transistor T5, the sixth thin-film transistor T6, and the seventh thin-film transistor T7 (see...) Figure 5 Each of the following may include a semiconductor layer disposed on the same layer as the first semiconductor layer A1 of the first thin-film transistor T1 and a gate electrode disposed on the same layer as the first gate electrode GE1 of the first thin-film transistor T1. The second thin-film transistor T2, the fourth thin-film transistor T4, the fifth thin-film transistor T5, the sixth thin-film transistor T6, and the seventh thin-film transistor T7 (see...) Figure 5 The semiconductor layer of A1 can be integrally connected to the first semiconductor layer A1.

[0138] The first thin-film transistor T1 and the third thin-film transistor T3 can be electrically connected to each other via a node connection line 166. The node connection line 166 can be disposed on the third interlayer insulating layer 210. One side of the node connection line 166 can be connected to the first gate electrode GE1 of the first thin-film transistor T1, and the other side of the node connection line 166 can be connected to the third semiconductor layer A3 of the third thin-film transistor T3.

[0139] The node connection line 166 may include aluminum (Al), copper (Cu), and / or titanium (Ti), and may have a single-layer structure or a multi-layer structure comprising the above materials. For example, the node connection line 166 may have a three-layer structure comprising a titanium layer, an aluminum layer, and a titanium layer.

[0140] The first organic insulating layer 211 may be disposed on the node connection line 166. The first organic insulating layer 211 may include an organic insulating material. The organic insulating material may include acrylic (acryl, or "acryloyl material"), benzocyclobutene (BCB), polyimide, or hexamethyldisiloxane (HMDSO).

[0141] The data line DL and the drive voltage line PL can be disposed on the first organic insulating layer 211 and can be covered by the second organic insulating layer 213. Each of the data line DL and the drive voltage line PL can include aluminum (Al), copper (Cu), and / or titanium (Ti), and can have a single-layer structure or a multi-layer structure including the above materials. For example, each of the data line DL and the drive voltage line PL can have a three-layer structure including a titanium layer, an aluminum layer, and a titanium layer.

[0142] The second organic insulating layer 213 may include organic insulating materials (such as acrylic, BCB, polyimide, and / or HMDSO). Although in Figure 6 The data line DL and the drive voltage line PL are formed on the first organic insulating layer 211, but the disclosure is not limited thereto. In another embodiment, either the data line DL or the drive voltage line PL may be disposed on the same layer (e.g., the third interlayer insulating layer 210) as the node connection line 166.

[0143] A light-emitting diode (e.g., an organic light-emitting diode OLED) can be disposed on the second organic insulating layer 213.

[0144] The first electrode 221 of an organic light-emitting diode (OLED) may include a reflective film comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In another embodiment, the first electrode 221 may further include a conductive oxide layer above and / or below the reflective film. The conductive oxide layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and / or aluminum zinc oxide (AZO). In an embodiment, the first electrode 221 may have a three-layer structure comprising an ITO layer, an Ag layer, and an ITO layer.

[0145] A dam layer 215 may be disposed on the first electrode 221. The dam layer 215 may define an opening overlapping the first electrode 221 and may cover the edge of the first electrode 221. The dam layer 215 may include an organic insulating material (such as polyimide).

[0146] Intermediate layer 222 includes an emitting layer 222b. Intermediate layer 222 may include a first functional layer 222a disposed below emitting layer 222b and / or a second functional layer 222c disposed above emitting layer 222b. Emitting layer 222b may include a high molecular weight organic material or a low molecular weight organic material that emits light of a specific color. Second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Each of the first functional layer 222a and the second functional layer 222c may include an organic material.

[0147] The second electrode 223 can be formed of a conductive material with low work function. For example, the second electrode 223 may include a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Optionally, the second electrode 223 may also include a layer formed of ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the above materials.

[0148] The emitting layer 222b can be formed in the display area DA and stacked with the first electrode 221 through the opening of the dam layer 215. On the other hand, the first functional layer 222a, the second functional layer 222c, and the second electrode 223 can completely cover the display area DA.

[0149] Spacer 217 may be formed on dam 215. Spacer 217 and dam 215 may be formed together in the same process or separately in separate processes. In embodiments, spacer 217 may comprise an organic insulating material such as polyimide. Optionally, dam 215 may comprise an organic insulating material containing light-blocking dyes, and spacer 217 may comprise an organic insulating material such as polyimide.

[0150] An organic light-emitting diode (OLED) can be covered by an encapsulation layer 300. The encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. In an embodiment, in... Figure 6 In the process, the thin film encapsulation layer 300 includes a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330.

[0151] Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may have a single-layer structure or a multi-layer structure comprising the above materials. The organic encapsulation layer 320 may include polymeric materials. Examples of polymeric materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. In an embodiment, the organic encapsulation layer 320 may include acrylates.

[0152] The thickness of the first inorganic encapsulation layer 310 and the thickness of the second inorganic encapsulation layer 330 can be different from each other. The thickness of the first inorganic encapsulation layer 310 can be greater than the thickness of the second inorganic encapsulation layer 330. Optionally, the thickness of the second inorganic encapsulation layer 330 can be greater than the thickness of the first inorganic encapsulation layer 310, or the thickness of the first inorganic encapsulation layer 310 and the thickness of the second inorganic encapsulation layer 330 can be the same.

[0153] The input sensing layer 400 may be disposed on the encapsulation layer 300. The input sensing layer 400 may include touch electrodes TE disposed in the display area DA and at least one touch insulating layer. In this respect, Figure 6In the second inorganic encapsulation layer 330, the input sensing layer 400 includes a first touch insulating layer 410 on the second touch insulating layer 410, a first conductive line 420 on the first conductive line 420, a second touch insulating layer 430 on the first conductive line 420, a second conductive line 440 on the second touch insulating layer 430, and a third touch insulating layer 450 on the second conductive line 440.

[0154] Each of the first touch insulating layer 410, the second touch insulating layer 430, and the third touch insulating layer 450 may include an inorganic insulating material and / or an organic insulating material. In an embodiment, each of the first touch insulating layer 410 and the second touch insulating layer 430 may include an inorganic insulating material (such as silicon oxide, silicon nitride, and / or silicon oxynitride), and the third touch insulating layer 450 may include an organic insulating material.

[0155] Each of the touch electrodes TE in the input sensing layer 400 may have a structure in which the first conductive line 420 and the second conductive line 440 are connected to each other. Optionally, the touch electrode TE may include either the first conductive line 420 or the second conductive line 440, and in this case, the second touch insulating layer 430 may be omitted.

[0156] Each of the first conductive line 420 and the second conductive line 440 may include aluminum (Al), copper (Cu), and / or titanium (Ti), and may have a single-layer structure or a multi-layer structure comprising the above materials. For example, each of the first conductive line 420 and the second conductive line 440 may have a three-layer structure comprising a titanium layer, an aluminum layer, and a titanium layer.

[0157] Figure 7A It is shown schematically. Figure 1 A cross-sectional view of a part of an electronic device. Figure 7B It is shown schematically. Figure 1 A cross-sectional view of a part of an electronic device.

[0158] Reference Figure 7A and Figure 7B The electronic device 1 may include a substrate 100, a display panel 10 including a display panel layer DLI disposed on the substrate 100, and a cover window 70. In an embodiment, the cover window 70 may be disposed on the front surface of the display panel 10. The "front surface" can be defined as the surface on which a user can view an image provided by the electronic device 1. Furthermore, the electronic device 1 may include a display circuit board 30 and a main circuit board 50. However, the electronic device 1 may also include a heat sink and, as shown in reference [reference missing] Figure 2 The described bracket, battery, camera assembly, and bottom cover.

[0159] The barrier layer 71 can be disposed on one surface of the cover window 70. The barrier layer 71 can be coupled with... Figure 2The light-blocking coverage portion NDA70 corresponds to this. In this case, the blocking layer 71 may include an opaque material that blocks light. In this case, the blocking layer 71 may be disposed between the outer side of the display area and the end of the cover window 70, without overlapping with the display area of ​​the display panel, or it may be disposed inside the end of the cover window 70, while overlapping with at least a portion of the display area.

[0160] An adhesive layer ADR may be disposed between the cover window 70 and the display panel layer DLI. In this case, the adhesive layer ADR may comprise an optically clear adhesive (OCA) or an optically clear resin (OCR) formed of a transparent material. A portion of the barrier layer 71 may be inserted into the adhesive layer ADR. In another embodiment, although not shown, the adhesive layer ADR may be disposed on a side surface of the barrier layer 71.

[0161] In this embodiment, the cover window 70 may be disposed on the top surface 100a of the substrate 100, and the display panel layer DLI may be disposed between the substrate 100 and the cover window 70. In this case, the display panel layer DLI may refer to... Figure 6 The layers shown are either from buffer layer 201 to encapsulation layer 300 or from buffer layer 201 to input sensing layer 400. For ease of explanation, the display panel layer DLI will be described in detail below as extending up to the input sensing layer 400.

[0162] The top surface 100a of the substrate 100 may refer to a surface of the substrate 100 adjacent to the cover window 70, and the bottom surface 100b of the substrate 100 may refer to a surface of the substrate 100 opposite to the top surface 100a.

[0163] In the following text, "top surface" refers to the surface facing the cover window 700 relative to the base 100, that is, the surface facing the z-direction, and "bottom surface" refers to the surface opposite to the top surface, that is, the surface facing the opposite direction of the z-direction.

[0164] In one embodiment, the display circuit board 30 may be at least partially stacked with the substrate 100. In another embodiment, the display circuit board 30 may be at least partially stacked with a pad region. For example, the display circuit board 30 may be attached to the top surface 100a of the substrate 100 using a non-conductive adhesive film. Alternatively, the display circuit board 30 may be attached to the top surface 100a of the substrate 100 using an adhesive.

[0165] In this embodiment, the display circuit board 30 may be at least partially stacked with the main circuit board 50. For example, the display circuit board 30 may be attached to the top surface of the main circuit board 50 using an anisotropic conductive film. Alternatively, the display circuit board 30 may be attached to the top surface of the main circuit board 50 using an adhesive. However, the disclosure is not limited thereto. The display circuit board 30 may also be attached to the bottom surface of the main circuit board 50.

[0166] In this embodiment, the display circuit board 30 can be bent along a bending axis BAX. Specifically, at least a portion of the display circuit board 30 can be bent along a bending axis BAX extending in a first direction (x-direction). In this embodiment, because at least a portion of the display circuit board 30 is bent along the bending axis BAX, at least a portion of the display circuit board 30 and the main circuit board 50 can be located on the bottom surface 100b of the substrate 100. Therefore, because at least a portion of the display circuit board 30 and the main circuit board 50 are located on the bottom surface 100b of the substrate 100, the area of ​​the peripheral region PA, which is a non-display area, can be reduced. That is, the area of ​​ineffective space can be reduced.

[0167] In this embodiment, the data driver 20 may be disposed on the display circuit board 30. Furthermore, the display circuit board 30 may include a first flexible film 31, a second flexible film 33, and wiring 32. In this case, the first flexible film 31 may include at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. However, the material of the first flexible film 31 can be changed in various ways, and the first flexible film 31 may be formed from fiber-reinforced plastics, etc.

[0168] In embodiments, wiring 32 may be formed of metal. For example, wiring 32 may be formed of at least one of metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of said metals. Furthermore, wiring 32 may have a single-layer structure, but the disclosure is not limited thereto. Wiring 32 may have a multilayer structure in which two or more of the above metals and alloys are stacked. However, the disclosure is not limited thereto.

[0169] In an embodiment, the second flexible film 33 may be disposed on the wiring 32. For example, the second flexible film 33 may cover the wiring 32. The second flexible film 33 may be formed of the same material as the first flexible film 31. However, the disclosure is not limited thereto. In an embodiment, the second flexible film 33 may be formed of a different material than the first flexible film 31. However, even when the second flexible film 33 is formed of a different material than the first flexible film 31, the second flexible film 33 may still be formed of an insulating material.

[0170] At least a portion of wiring 32 may be exposed to the outside to form circuit board pad 34. Circuit board pad 34 may be in direct contact with and electrically connected to pad connection electrode 1300.

[0171] The pad connection electrode 1300 can be connected to the pad 14. In this case, a separate insulating layer ILL (hereinafter, it may also be referred to as the "upper insulating layer OL") can be disposed between the pad 14 and the display panel layer DLI. The insulating layer ILL can block a portion of the pad 14 and can expose another portion of the pad 14 to the outside. The pad connection electrode 1300 can be directly connected to the portion of the pad 14 exposed through the insulating layer ILL. In addition, a portion of the pad connection electrode 1300 can be disposed on the top surface of the insulating layer ILL to be exposed to the outside. The lighting circuit CU and / or the anti-static circuit ECM can be disposed in the lower part of the insulating layer ILL. For ease of explanation, the lighting circuit CU and the anti-static circuit ECM will be described in detail below assuming that they are disposed in the lower part of the insulating layer ILL.

[0172] The insulating layer ILL may include inorganic and / or organic insulating layers in the display panel layer DLI. For example, the insulating layer ILL may include the display panel layer DLI... Figure 6 The insulating layer ILL comprises a buffer layer, a first gate insulating layer, a first interlayer insulating layer, a second interlayer insulating layer, a second gate insulating layer, a third interlayer insulating layer, a first organic insulating layer, a second organic insulating layer, a dam layer, spacers, and / or an organic encapsulation layer. At least a portion of the insulating layer ILL may extend from the display panel layer DLI. In another embodiment, although not shown, the insulating layer ILL may be disconnected from a portion of the insulating layer disposed in the display panel layer DLI.

[0173] Figure 8 It is shown Figure 7A and Figure 7B An enlarged sectional view of part C.

[0174] Reference Figure 8 The pad 14 may include a connecting wire 1100 and a pad electrode 1200. In this case, multiple pads 14 may be provided, and the multiple pads 14 may be spaced apart from each other.

[0175] The pad electrode 1200 on the substrate 100 can contact and be electrically connected to the connecting wire 1100.

[0176] The connecting line 1100 can be disposed on the first gate insulating layer 203 and can be connected to the reference. Figure 6 The lower electrode CE1 and / or the first gate electrode GE1 of the described storage capacitor Cst comprise the same material. In another embodiment, the connection line 1100 may be disposed on the substrate 100 and may be a separate metal layer. For ease of illustration, the connection line 1100 will be described in detail below assuming that it is disposed on the first gate insulating layer 203.

[0177] At least one insulating layer (e.g., a first interlayer insulating layer 205, a second interlayer insulating layer 207, a second gate insulating layer 209, and a third interlayer insulating layer 210) may be disposed on the connection line 1100, and the pad electrode 1200 may be connected to the connection line 1100 through contact holes passing through the first interlayer insulating layer 205, the second interlayer insulating layer 207, the second gate insulating layer 209, and the third interlayer insulating layer 210.

[0178] The pad electrode 1200 may include a conductive layer, or may have a structure in which multiple conductive layers are stacked. For example, as Figure 8 As shown, the pad electrode 1200 may include at least one of a first pad conductive layer 1210 and a second pad conductive layer 1220.

[0179] The first conductive layer 1210 can be compared with the reference. Figure 6 The upper electrode CE2, node connection line 166, or lower gate electrode G3A of the third gate electrode GE3 described in the storage capacitor Cst comprises the same material. The second pad conductive layer 1220 may be compatible with the referenced... Figure 6 The upper gate electrode G3B of the third gate electrode GE3, the node connection line 166, or the data line DL and / or the drive voltage line PL described herein are made of the same material. For ease of explanation, the first pad conductive layer 1210 will be formed of the same material as the node connection line 166, and the second pad conductive layer 1220 will be formed of the same material as the data line DL and / or the drive voltage line PL, as will be described in detail below.

[0180] Although the first pad conductive layer 1210 and the second pad conductive layer 1220 are in direct contact with each other, the disclosure is not limited thereto. In another embodiment, a pad insulating layer (e.g., an inorganic insulating layer and / or an organic insulating layer) may be disposed between the first pad conductive layer 1210 and the second pad conductive layer 1220, and the first pad conductive layer 1210 and the second pad conductive layer 1220 may be connected to each other through contact holes in the pad insulating layer.

[0181] The upper insulating layer OL can be disposed on the second pad conductive layer 1220. For example, the upper insulating layer OL may include at least one of a first organic insulating layer 211, a second organic insulating layer 213, a dam layer 215, and a spacer 217. Specifically, when the second pad conductive layer 1220 and the upper gate electrode G3B or node connection line 166 of the third gate electrode GE3 are made of the same material, the upper insulating layer OL disposed on the second pad conductive layer 1220 may include at least one of the first organic insulating layer 211, the second organic insulating layer 213, the dam layer 215, and the spacer 217. In another embodiment, when the second pad conductive layer 1220 is formed of the same material as the data line DL and / or the drive voltage line PL, the upper insulating layer OL may include at least one of the second organic insulating layer 213, the dam layer 215, and the spacer 217. For ease of explanation, the upper insulating layer OL will be described in detail below assuming that it is the second organic insulating layer 213.

[0182] The upper insulating layer OL can define the pad contact hole OL-CNT. In this case, the pad contact hole OL-CNT can pass through the upper insulating layer OL, and the pad electrode 1200 can be exposed to the outside of the upper insulating layer OL through the pad contact hole OL-CNT.

[0183] The pad connection electrode 1300 can be connected to the pad electrode 1200 through the pad contact hole OL-CNT. In this case, the pad connection electrode 1300 can be connected to the reference. Figure 6 The first conductive line 420 and / or the second conductive line 440 described herein comprise the same material.

[0184] The pad connection electrode 1300 can be connected to the pad electrode 1200 and can extend to the flat top surface of the upper insulating layer OL. In this case, the pad connection electrode 1300 can extend to the area where at least one of the lighting circuit CU and the anti-static circuit ECM is disposed. At least a portion of the pad connection electrode 1300 can be superimposed on at least one of the lighting circuit CU and the anti-static circuit ECM in a plan view. In another embodiment, the pad connection electrode 1300 may not be superimposed on the lighting circuit CU and the anti-static circuit ECM. For example, the pad connection electrode 1300 can extend from the pad contact hole OL-CNT to the area where the lighting circuit CU and the anti-static circuit ECM are disposed. Optionally, the pad connection electrode 1300 can be disposed between adjacent lighting circuit CUs and between adjacent anti-static circuit ECMs.

[0185] A circuit board pad 34 can be disposed on the pad connection electrode 1300. In this case, the pad connection electrode 1300 and the circuit board pad 34 can be directly connected to each other. In other cases, a non-conductive adhesive film NCF can be disposed around the pad connection electrode 1300 and the circuit board pad 34 to connect the pad connection electrode 1300 to the circuit board pad 34. Therefore, the display circuit board 30 can be connected to the display panel 10. Specifically, the display circuit board 30 can be positioned closer to the pad electrode 1200 than when it is attached to the pad electrode 1200. Figure 7A and Figure 7B The display panel layer (DLI) is used. Furthermore, the display panel 10 can reduce the space required for mounting the display circuit board 30. Because the radius of curvature of the bent region of the display circuit board 30 when it is attached to the pad connection electrode 1300 and bent is greater than the radius of curvature of the bent region when it is attached to the pad electrode 1200 and bent, the compressive or tensile force generated in the bent region of the display circuit board 30 can be reduced.

[0186] Figure 9A It is shown schematically. Figure 8 A plan view of the pad connecting the electrodes.

[0187] Reference Figure 9A The pad connection electrode 1300 may include a first portion 1300-1 corresponding to the pad contact hole OL-CNT, a second portion 1300-2 connected to the first portion 1300-1, and a third portion 1300-3 connecting to the contact circuit board pad 34. In this case, the width of the planar shape of the first portion 1300-1 and / or the width of the planar shape of the third portion 1300-3 may be greater than the width of the planar shape of the second portion 1300-2. Furthermore, the area of ​​the planar shape of the first portion 1300-1 may be greater than the area of ​​the planar shape of the pad contact hole OL-CNT. In this case, the planar shape of the pad contact hole OL-CNT may be disposed within the planar shape of the first portion 1300-1. Therefore, since the first portion 1300-1 completely covers the pad contact hole OL-CNT, the pad connection electrode 1300 may be electrically connected to the pad electrode 1200. Although not shown, the first portion 1300-1, the second portion 1300-2, and the third portion 1300-3 may be formed in a linear shape. In another embodiment, the planar shape of the first portion 1300-1 and / or the planar shape of the third portion 1300-3 can be a polygonal shape, a circular shape, an elliptical shape, or an irregular shape. In another embodiment, the second portion 1300-2 can have a curved shape or a serpentine shape, instead of... Figure 9A The linear shape shown.

[0188] Multiple pads can be configured to connect electrodes 1300. In this case, multiple circuit board pads 34 can be configured to correspond to the pads connecting electrodes 1300 respectively.

[0189] Multiple pad connection pads 1300 can be arranged so that they do not overlap in a plan view. In this case, the pad contact holes OL-CNTs corresponding to each pad connection electrode 1300 can be arranged in a zigzag or serpentine shape in the x-direction. For example, in a direction different from the longitudinal direction (y-direction) of the pad connection electrode 1300 (e.g., the x-direction), one of the multiple pad contact holes OL-CNTs can be located at a different position than another of the multiple pad contact holes OL-CNTs. Therefore, space can be ensured for forming each pad contact hole OL-CNT, and space can be ensured for setting adjacent pad connection electrodes 1300.

[0190] Figure 9B This is a schematic plan view of the pad connecting electrodes of a display panel according to another embodiment.

[0191] Reference Figure 9B The pad connection electrode 1300 may include a first portion 1300-1, a second portion 1300-2, and a third portion 1300-3. In this case, multiple pad connection electrodes 1300 can be aligned. That is, the first portion 1300-1 of the pad connection electrode 1300 can be aligned in a direction different from the longitudinal direction (y direction) of the pad connection electrode 1300 (e.g., the x direction).

[0192] The planar shape of the pad contact hole OL-CNT can be elliptical. In this case, because the distance between adjacent pad contact holes OL-CNT in the x-direction is ensured, adjacent pad connection electrodes 1300 can be arranged without overlapping each other, and each pad contact hole OL-CNT can be shielded.

[0193] Figure 10 This is a schematic cross-sectional view of a portion of a display panel according to another embodiment. Figure 10 This is a schematic illustration of a display panel according to another embodiment, with... Figure 8 An enlarged sectional view of the part corresponding to AR.

[0194] Reference Figure 10 The protrusion OL-P can be disposed on the upper insulating layer OL and below the pad connection electrode 1300. In this case, the protrusion OL-P can protrude from the top surface of the upper insulating layer OL toward the pad connection electrode 1300. The protrusion OL-P can provide a bend toward the top surface of the pad connection electrode 1300 to increase the bonding force between the pad connection electrode 1300 and the circuit board pad 34.

[0195] The protrusion OL-P can be formed integrally with the upper insulating layer OL or can be formed separately from the upper insulating layer OL. For example, when the protrusion OL-P is formed integrally with the upper insulating layer OL, the upper insulating layer OL can be formed, and then the protrusion OL-P can be formed on the surface of the upper insulating layer OL by etching the surface of the upper insulating layer OL. In another embodiment, when the protrusion OL-P is formed separately from the upper insulating layer OL, if the upper insulating layer OL is formed by... Figure 6 If the first organic insulating layer 211 is formed of the same material, then the protrusion OL-P can be made of the same material as... Figure 6 The second organic insulating layer 213, the dam layer 215, the spacer 217, and the organic encapsulation layer 320 are formed of at least one of the same material. In another embodiment, when the upper insulating layer OL is made of the same material as... Figure 6 When the second organic insulating layer 213 is formed of the same material, the protrusion OL-P can be made of the same material as... Figure 6 The dam layer 215, spacer 217, and organic encapsulation layer 320 are formed of at least one of the same material. In another embodiment, when the upper insulating layer OL is made of the same material as... Figure 6 When the embankment layer 215 is formed of the same material, the protrusion OL-P can be formed by the same material as the embankment layer 215. Figure 6 The spacer 217 and at least one of the organic encapsulation layer 320 are formed of the same material. In another embodiment, when the upper insulating layer OL is made of the same material as... Figure 6 When the spacer 217 is formed of the same material, the protrusion OL-P can be made of the same material as the spacer 217. Figure 6 The organic encapsulation layer 320 is formed of the same material.

[0196] As described above, the pad connection electrode 1300, whose surface is irregularly shaped due to the protrusions OL-P, can contact the circuit board pad 34 through a non-conductive adhesive film NCF. In this case, the pad connection electrode 1300 and the circuit board pad 34 can be connected by thermoforming or ultrasonic bonding.

[0197] Figures 11A to 11C It is shown schematically. Figure 10 A plan view of the protrusion.

[0198] Reference Figure 11A The third portion 1300-3 of the pad connecting electrode may include protrusions OL-P. Multiple protrusions OL-P may be provided. In this case, the planar shape of the protrusions OL-P can be any of a variety of shapes. For example, the planar shape of the protrusions OL-P can be circular, or it can be island-shaped. In this case, the protrusions OL-P can have shapes such as hemispherical, cylindrical, or conical. Multiple protrusions OL-P may be spaced apart from each other. In this case, the distance between adjacent protrusions OL-P can be constant. In another embodiment, the distance between adjacent protrusions OL-P can be different from each other.

[0199] Although not shown, the planar shape of the protrusion OL-P is not limited to this. For example, the planar shape of the protrusion OL-P may include a polygonal shape and / or an elliptical shape. In addition, the planar shape of the protrusion OL-P may be an irregular shape (such as a star shape or a cross shape) other than a circular shape, a polygonal shape, and an elliptical shape.

[0200] Reference Figure 11B The planar shape of the protrusions OL-P can be linear. In this case, the protrusions OL-P can be arranged to be spaced apart from each other in one direction. The widths of the planar shapes of the protrusions OL-P can be the same or different from each other. Furthermore, besides... Figure 11B In addition to the arrangement direction shown, the protrusion OL-P can be arranged at an angle, or it can be arranged in conjunction with... Figure 11B The arrangement direction is perpendicular to the direction.

[0201] Reference Figure 11C The protrusions OL-P can be arranged in a grid shape. In this case, the planar shape of the area without protrusions OL-P can be quadrilateral. However, the shape of the area without protrusions OL-P is not limited to this and can be any of various shapes. For example, the shape of the area without protrusions OL-P can include circular, polygonal, and / or elliptical shapes, or it can include irregular shapes other than circular, polygonal, and elliptical shapes (such as star or cross shapes).

[0202] The display panel and electronic device according to the embodiment can reduce the area where images are not displayed.

[0203] The display panel and electronic device according to the embodiment can quickly and accurately transmit signals from the display circuit board to the display panel.

[0204] Figure 12 This is a block diagram of an electronic device according to an embodiment.

[0205] Reference Figure 12 According to the embodiment, the electronic device 1 may include a display module 2, a processor 3, a memory 4, and a power module 5. The display module 2 includes a display panel.

[0206] Processor 3 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. According to embodiments, processor 3 may be configured by being divided into two or more processors from a functional or structural perspective. For example, processor 3 may include a main processor as a first driver chip containing the CPU and an auxiliary processor as a second driver chip containing the controller, the auxiliary processor being configured to receive image signals from the main processor and process the image signals according to the interface specifications of display module 2.

[0207] The memory 4 may include at least one of non-volatile memory and volatile memory. The memory 4 may store data information required for the operation of the processor 3 or the display module 2. When the processor 3 executes the application stored in the memory 4, image data signals and / or input control signals may be transmitted to the display module 2, and the display module 2 may be configured to process the received signals and output image information through the display screen.

[0208] The power module 5 may include a power supply module (such as a power adapter or battery device) and a power conversion module configured to convert the power supplied from the power supply module and generate the power required for the operation of the electronic device 1. The power conversion of the power conversion module may include, but is not limited to, direct current (DC) to DC conversion, alternating current (AC) to DC conversion, and DC to AC conversion.

[0209] The electronic device 1 may also include an input module 6, a non-image output module 7, and / or a communication module 8.

[0210] Input module 6 can provide input information to processor 3 and / or display module 2. Input module 6 can include not only physical buttons, keyboards, and microphones, but also various sensor modules. Examples of sensor modules include not only touch sensors, pressure sensors, proximity sensors, position sensors, digitizers, motion recognition sensors, camera sensors, light receiving sensors, photoelectric conversion sensors, and temperature sensors, but also biometric sensors (such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, heart rate sensors, etc.).

[0211] The non-image output module 7 can receive information other than images from the processor 3 and provide that information to the user. Examples of the non-image output module 7 may include a sound module, a tactile module, a light-emitting module, etc., and may also include other functional modules inherent to the electronic device 1 (e.g., a cooling module of a refrigerator, etc.).

[0212] The communication module 8 can be configured to perform the sending and receiving of information between the electronic device 1 and an external device, and may include a receiver and a transmitter. The communication module 8 may include various wireless communication modules (such as mobile communication modules, WiFi modules, Bluetooth modules, etc.) or various wired communication modules.

[0213] At least one of the components of the electronic device 1 described above may be included in the display panel 10 according to the above embodiment. Furthermore, some of the various modules functionally included in the electronic device 1 may be included in the electronic device 1, while other modules may be disposed separately from the electronic device 1. For example, the electronic device 1 may include a display module 2, and the processor 3, memory 4, and power module 5 may be disposed as other devices in the electronic device 1 instead of the display module 2. As another example, the power module 5 may be disposed in the electronic device 1 and may provide power to the processor 3 and memory 4 disposed in the electronic device 1 instead of the display module 2. However, the disclosure is not limited thereto.

[0214] Figures 13 to 15 These are schematic diagrams of electronic devices according to various embodiments. Figures 13 to 15 Examples of various electronic devices, including a display panel 10 according to an embodiment, are shown.

[0215] Figure 13 Examples of electronic devices are shown, including a smartphone 1_1a, a tablet PC 1_1b, a laptop computer 1_1c, a TV 1_1d, and a desktop monitor 1_1e.

[0216] In addition to the display module 2, the smartphone 1_1a may also include an input module (such as a touch sensor) and a communication module. The smartphone 1_1a can process information received through the communication module or other input modules and display the processed information through the display module 2 of the electronic device 1.

[0217] Similar to smartphones 1_1a, tablet PCs 1_1b, laptops 1_1c, TVs 1_1d, and desktop monitors 1_1e may also include display modules and input modules, and may also include communication modules as appropriate.

[0218] Figure 14 The illustration shows an electronic device 1, including a display module 2, that is a wearable electronic device. Wearable electronic devices may include smart glasses 1_2a, HMD 1_2b, smartwatches 1_2c, etc.

[0219] The smart glasses 1_2a and HMD 1_2b may include a display module 2 configured to project a display image and a reflector configured to reflect the projected display image and provide the display image to the user's eyes, so as to provide the user with a virtual reality (VR) or augmented reality (AR) image.

[0220] The smartwatch 1_2c may include a biometric sensor as an input device and may provide the user with biometric information identified by the biometric sensor through the display module 2.

[0221] Figure 15 The illustration shows an electronic device 1, including a display module 2, in the case of a vehicle. For example, the electronic device 1_3 can be used for the vehicle's rangefinder or central instrument panel, or it can be used as a CID (Central Information Display) arranged on the vehicle's dashboard, or as an interior mirror display in place of the side mirrors.

[0222] Although not shown, the electronic device including the display panel 10 according to the embodiment may include not only devices that primarily include a screen display (such as billboards, electronic display panels, game consoles, etc.), but also various household appliances (such as refrigerators, washing machines, dryers, air conditioners, robotic cleaners, etc.) for displaying information through the display module. Furthermore, when the display module has a light-transmitting function, the electronic device may include a smart window or transparent display panel for simultaneously displaying a background and an image. The type of electronic device according to the embodiment is not limited to the examples described above, and various other electronic devices may also be provided.

[0223] It should be understood that the embodiments described herein should be considered descriptive in nature only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the claims.

Claims

1. A display panel, the display panel comprising: The substrate includes the display area and the surrounding area; A pad is disposed in the peripheral region of the substrate and includes a pad electrode; An insulating layer is disposed on the pad and defines an opening through which at least a portion of the pad electrode is exposed to the outside; as well as A pad connection electrode is connected to the pad electrode through the opening, and at least a portion of the pad connection electrode is disposed on the insulating layer.

2. The display panel according to claim 1, wherein, The openings are configured as multiple. The multiple openings are arranged in a plan view in a direction that intersects the longitudinal direction of the electrode connected to the pad.

3. The display panel according to claim 1, wherein, The openings are configured as multiple. The multiple openings are arranged in a serpentine shape in a direction that intersects the longitudinal direction of the electrode connected to the pad in the plan view.

4. The display panel according to claim 1, wherein, The opening has an elliptical shape in the plan view.

5. The display panel according to claim 1, wherein, The pad connecting electrode includes an uneven portion in the cross-sectional view.

6. The display panel according to claim 1, further comprising a protrusion disposed on the insulating layer and protruding toward the pad connecting electrode.

7. The display panel according to claim 6, wherein, The protrusions are configured in multiple ways. The protrusions, which are configured as a plurality, are arranged in the plan view below a portion of the pad connecting electrode and are spaced apart from each other.

8. The display panel according to claim 6, wherein, The protrusion has a linear shape in the plan view.

9. The display panel according to claim 6, wherein, The protrusions have a grid shape in the plan view.

10. The display panel according to claim 1, wherein, The insulating layer comprises organic materials.

11. An electronic device, the electronic device comprising: Display panel; as well as A circuit board, connected to the display panel, includes a circuit board pad. The display panel includes: a substrate, including a display area and a peripheral area; a pad disposed in the peripheral area of ​​the substrate and including a pad electrode; an insulating layer disposed on the pad and defining an opening, at least a portion of the pad electrode being exposed to the outside through the opening; and a pad connecting electrode connected to the pad electrode through the opening and contacting the circuit board pad, at least a portion of the pad connecting electrode being disposed on the insulating layer.

12. The electronic device according to claim 11, wherein, The openings are configured as multiple. The multiple openings are arranged in a plan view in a direction that intersects the longitudinal direction of the electrode connected to the pad.

13. The electronic device according to claim 11, wherein, The openings are configured as multiple. The multiple openings are arranged in a serpentine shape in a direction that intersects the longitudinal direction of the electrode connected to the pad in the plan view.

14. The electronic device according to claim 11, wherein, The opening has an elliptical shape in the plan view.

15. The electronic device according to claim 11, wherein, The pad connecting electrode includes an uneven portion in the cross-sectional view.

16. The electronic device of claim 11, further comprising a protrusion disposed on the insulating layer and projecting toward the pad-connecting electrode.

17. The electronic device according to claim 16, wherein, The protrusions are configured in multiple ways. In this plan view, the protrusions, which are configured as a plurality, are positioned below a portion of the pad connecting electrode and are spaced apart from each other.

18. The electronic device according to claim 16, wherein, The protrusion has a linear shape in the plan view.

19. The electronic device according to claim 16, wherein, The protrusions have a grid shape in the plan view.

20. The electronic device according to claim 16, wherein, The insulating layer comprises organic materials.

Images