Electronic device and chip protector thereof

Abstract

The invention provides an electronic device and a chip protector thereof. The electronic device comprises a circuit board and a chip protector. The circuit board is provided with a board surface, and the board surface is provided with a chip and an electronic element. The chip protection patch comprises a base layer, an elastic layer and a protection layer. The base layer has a first surface, a second surface and a first opening. The elastic layer is stacked on the first surface. The elastic layer comprises a first bonding surface, an outer surface and a second opening part. The first bonding surface is bonded to the first surface. The protective layer is stacked on the second surface. The protective layer comprises a second bonding surface, an attaching surface and a third opening part. The second bonding surface is bonded to the second surface. The first opening part, the second opening part and the third opening part are mutually overlapped to form a chip accommodating space. The attaching surface of the chip protection paster is attached to the board surface, the attaching surface covers the electronic component, and the chip is located in the chip containing space.

Description

Technical Field

[0001] This invention relates to an electronic device and a chip protector thereof, and more particularly to an electronic device and a chip protector thereof capable of protecting electronic components on a circuit board. Background Technology

[0002] When computing chips operate on a circuit board, they generate heat. To maintain the chips at optimal operating temperatures, the industry currently coats their surfaces with thermal interface materials, which then conduct the heat to a heat dissipation module. However, liquid thermal interface materials pose a risk of overflow, potentially causing liquid metal to spill onto electronic components on the circuit board (e.g., capacitors). Since liquid metal is conductive, contact with capacitors can cause them to malfunction. Therefore, when using liquid metal as a thermal interface material, UV adhesive is currently applied to the capacitor surface to prevent liquid metal from contacting the adhesive. However, UV adhesive application requires precision, necessitating expensive equipment. Furthermore, for maintenance purposes, the UV adhesive on the capacitor surface must still be removed using specialized equipment. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic device and its chip protector to solve at least one of the above-mentioned problems.

[0004] In some embodiments, an electronic device is provided, comprising a circuit board and a chip protector. The circuit board has a surface on which a chip and electronic components are disposed, with the electronic components adjacent to the chip. The chip protector includes a base layer, an elastic layer, and a protective layer. The base layer has a first surface, a second surface, and a first opening, the first opening penetrating the first surface and the second surface. The elastic layer is stacked on the first surface. The elastic layer includes a first bonding surface, an outer surface, and a second opening, the first bonding surface being bonded to the first surface, and the second opening penetrating the first bonding surface and the outer surface. The protective layer is stacked on the second surface. The protective layer includes a second bonding surface, an attachment surface, and a third opening, the second bonding surface being bonded to the second surface, and the third opening penetrating the second bonding surface and the attachment surface. The first opening, the second opening, and the third opening overlap each other to form a chip accommodating space. The attachment surface of the chip protector is attached to the circuit board surface and covers the electronic components, with the chip located within the chip accommodating space.

[0005] In some embodiments, the base layer has a lug on one side, the elastic layer has a first edge, the protective layer has a second edge, and the lug protrudes from the first edge and the second edge.

[0006] In some embodiments, the electronic device further includes a fixing member disposed on the surface of the circuit board and pressing against the chip protector to attach the adhesive side to the surface of the board.

[0007] In some embodiments, the fixing member is a heat dissipation member and presses against the outer surface of the elastic layer, and there is liquid metal between the fixing member and the chip, and the liquid metal is confined within the chip accommodating space.

[0008] In some embodiments, the fastener compresses the elastic layer to generate a thrust toward the protective layer.

[0009] In some embodiments, the surface of the protective layer is pressed by the electronic component to form a recess, and the area of ​​the protective layer adjacent to the recess covers the outside of the electronic component.

[0010] In some embodiments, the first opening, the second opening, and the third opening each have an inner edge, and each inner edge is located between the electronic component and the chip.

[0011] In some embodiments, the structural strength of the base layer is greater than that of the protective layer and the elastic layer.

[0012] In some embodiments, a chip screen protector is provided, comprising a base layer, an elastic layer, and a protective layer. The base layer has a first surface, a second surface, and a first opening, the first opening penetrating the first surface and the second surface. The elastic layer is stacked on the first surface. The elastic layer includes a first bonding surface, an outer surface, and a second opening, the first bonding surface being bonded to the first surface, and the second opening penetrating the first bonding surface and the outer surface. The protective layer is stacked on the second surface. The protective layer includes a second bonding surface, an attachment surface, and a third opening, the second bonding surface being bonded to the second surface, and the third opening penetrating the second bonding surface and the attachment surface. The first opening, the second opening, and the third opening overlap each other to form a chip accommodating space.

[0013] In summary, in some embodiments of the electronic device, when liquid metal overflows from the chip surface toward the electronic component by covering the electronic component with a chip protector on the circuit board, the chip protector can prevent the liquid metal from contacting the electronic component. The chip protector includes a base layer, an elastic layer, and a protective layer, with the elastic layer and protective layer respectively bonded to the base layer. Therefore, when removing the chip protector from the circuit board, the base layer, elastic layer, and protective layer can be manually separated from the electronic component together, without the need for mechanical equipment to remove the chip protector.

[0014] The following detailed description of the features and advantages of the present invention is sufficient to enable anyone skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the disclosure of this specification, the claims and drawings, anyone skilled in the art can easily understand the related objects and advantages of the present invention. Attached Figure Description

[0015] Figure 1This is a perspective view of an electronic device in some embodiments of the present invention.

[0016] Figure 2 This is a schematic diagram of the assembly of the electronic device in some embodiments of the present invention.

[0017] Figure 3 for Figure 1 Cross-sectional view along the AA direction.

[0018] Figure 4 for Figure 3 A magnified view of the chip protector and a portion of the circuit board on one side.

[0019] Figure 5 This is a schematic diagram of an electronic device implemented in some embodiments of the present invention, showing that the fixing member is a heat sink.

[0020] Figure 6 This is a schematic diagram of the implementation of the electronic device in some embodiments of the present invention, showing that the fixing member is a frame.

[0021] Figure 7 for Figure 5 Another implementation diagram shows an adhesive layer covering an electronic component.

[0022] The attached figures are labeled as follows:

[0023] 100: Electronic devices

[0024] 102: Circuit Board

[0025] 104: Chip Protector

[0026] 106: Plate surface

[0027] 108: Chip

[0028] 110: Electronic Components

[0029] 112: Grassroots

[0030] 114: Elastic layer

[0031] 116: Protective layer

[0032] 118: First Surface

[0033] 120: Second Surface

[0034] 122: First opening

[0035] 122', 128', 134': Inner edge

[0036] 124: First mating surface

[0037] 126: Outer surface

[0038] 128: Second opening

[0039] 130: Second mating surface

[0040] 132: Attachment

[0041] 134: Third opening

[0042] 136: Depression

[0043] 138: Heat sink

[0044] 140, 144: Screws

[0045] 142: Framework

[0046] 146: Avoidance opening

[0047] 148: Pressing part

[0048] 150: Protruding ears

[0049] 152: First Edge

[0050] 154: Second Edge

[0051] 156: Paste Layer

[0052] 158: First adhesive surface

[0053] 160: Second adhesive surface

[0054] 200: Liquid metal

[0055] A: Section lines

[0056] S1: Chip storage space Detailed Implementation

[0057] Please refer to the following: Figure 1 , Figure 2 and Figure 3 . Figure 1 This is a perspective view of an electronic device in some embodiments of the present invention. Figure 2 This is a schematic diagram of the assembly of the electronic device in some embodiments of the present invention. Figure 3 for Figure 1 A cross-sectional view along the AA direction. (See attached image.) Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the electronic device 100 includes a circuit board 102 and a chip protector 104.

[0058] The circuit board 102 has a board surface 106, on which a chip 108 and an electronic component 110 are disposed, with the electronic component 110 adjacent to the chip 108. The chip 108 can be a central processing unit (CPU), a microcontroller, or a graphics processing unit (GPU), and is a chip that generates heat during operation. The electronic component 110 can be an active or passive component.

[0059] For example Figure 3 As shown, a liquid metal 200 is coated on the surface of chip 108, so that when chip 108 is in operation, the liquid metal 200 can conduct heat generated by chip 108 to dissipate into the air. The liquid metal 200 includes, but is not limited to, any one of gallium (Ga), gallium-indium alloy (Ga-In), gallium-indium-tin alloy (Ga-In-Sn), tin-bismuth alloy (Sn-Bi), indium-bismuth alloy In-Bi, or bismuth-indium-tin alloy (Bi-In-Sn), or a combination of any two or more of the foregoing.

[0060] Chip protector 104 includes a base layer 112, an elastic layer 114, and a protective layer 116. Chip protector 104 can cover electronic component 110 to prevent electronic component 110 from contacting liquid metal 200 overflowing from the surface of chip 108 (described in detail later).

[0061] The base layer 112 has a first surface 118, a second surface 120, and a first opening 122. The first opening 122 extends through the first surface 118 and the second surface 120. In some examples, the base layer 112 has a first structural strength, which may be made of materials such as, but not limited to, polymethyl methacrylate, polyethylene, polyvinyl chloride, polycarbonate, polystyrene, or metal.

[0062] An elastic layer 114 is stacked on a first surface 118. The elastic layer 114 includes a first bonding surface 124, an outer surface 126, and a second opening 128. The first bonding surface 124 is bonded to the first surface 118, and the second opening 128 extends through the first bonding surface 124 and the outer surface 126. In some embodiments, the elastic layer 114 has a second structural strength, which may be, for example, but not limited to, materials such as rubber, sponge, foamed polypropylene, or polyethylene foam.

[0063] A protective layer 116 is stacked on the second surface 120. The protective layer 116 includes a second bonding surface 130, an attachment surface 132, and a third opening 134. The second bonding surface 130 is bonded to the second surface 120, and the third opening 134 penetrates both the second bonding surface 130 and the attachment surface 132. It should be noted that the protective layer 116 is made of a non-conductive material to isolate the electronic component 110 from the liquid metal 200, thereby preventing the electronic component 110 from malfunctioning (e.g., short circuit) due to the influence of the liquid metal 200. In some embodiments, the protective layer 116 has a third structural strength, which can be, for example, but not limited to, elastic materials such as ethylene / vinyl acetate copolymer, rubber, silicone, or high-density polyurethane.

[0064] In some embodiments, the first surface 118 and the first mating surface 124 and / or the second surface 120 and the second mating surface 130 may be adhesively bonded together. Here, the user can simultaneously cover or separate the elastic layer 114 and the protective layer 116 from the board surface 106 by operating the base layer 112.

[0065] In some embodiments, the structural strength of the base layer 112 is greater than the structural strength of the protective layer 116 and the elastic layer 114, that is, the first structural strength is greater than the second and third structural strengths. Here, as... Figure 3 As shown, when the chip protector 104 is attached to the circuit board 102 and the elastic layer 114 is compressed in the direction of the circuit board 102, the elastic layer 114 can apply force to the base layer 112. This causes the base layer 112 to apply force evenly to the protective layer 116 through the bending strength of its own material, so that the protective layer 116 can evenly cover the electronic component 110 and fix it to the circuit board 102.

[0066] Again Figure 3 As shown, the first opening 122, the second opening 128, and the third opening 134 overlap to form a chip accommodating space S1. The attachment surface 132 of the chip protector 104 is attached to the board surface 106 and covers the electronic component 110. The chip 108 is located within the chip accommodating space S1. Therefore, when liquid metal 200 overflows from the surface of the chip 108 towards the electronic component 110, the chip protector 104 can confine the liquid metal 200 within the chip accommodating space S1. In other words, the liquid metal 200 can be isolated from the electronic component 110 by the protective layer 116 to prevent contact between the liquid metal 200 and the electronic component 110, thus avoiding any abnormalities.

[0067] Please see Figure 4 , Figure 4 for Figure 3 A magnified view of the chip protector and a portion of the circuit board on one side. (See attached image.) Figure 4As shown, in some embodiments, the attachment surface 132 of the protective layer 116 is pressed by the electronic component 110 to form a recess 136. The area of ​​the protective layer 116 adjacent to the recess 136 covers the outside of the electronic component 110. Specifically, due to its elastic properties, when the protective layer 116 covers the electronic component 110, the attachment surface 132 is pressed by the electronic component 110 to form a recess 136 with the same shape as the electronic component 110. The recess 136 can completely cover the electronic component 110, thus isolating the electronic component 110 on the circuit board 102. In addition, a portion of the recess 136 is tightly attached to the board surface 106, so when liquid metal 200 overflows toward the electronic component 110, the liquid metal 200 can be blocked outside the recess 136 by the protective layer 116.

[0068] In some embodiments, the electronic device 100 further includes a fastener. The fastener is disposed on the board surface 106 of the circuit board 102 and presses against the chip protector 104, causing the attachment surface 132 of the chip protector 104 to adhere to the board surface 106 based on the pressure of the fastener. The attachment surface 132 and the board surface 106 are not bonded together. The fastener compresses the elastic layer 114 to generate a thrust in the direction of the protective layer 116, allowing the elastic layer 114 to evenly distribute the thrust through the base layer 112, so that the stressed protective layer 116 can tightly cover the electronic component 110. To remove the chip protector 104, the user can first remove the fastener to directly separate the chip protector 104 from the board surface 106 and the electronic component 110. The following fasteners are described below. Figure 5 A heat sink 138 is shown. Figure 6 The example shown is frame 142.

[0069] In some embodiments, please refer to Figure 5 , Figure 5 This is a schematic diagram illustrating the implementation of the electronic device in some embodiments of the present invention, showing that the fixing member is a heat sink. For example... Figure 5The fastener shown is a heat sink 138. Specifically, the heat sink 138 presses against the outer surface 126 of the elastic layer 114. Liquid metal 200 exists between the heat sink 138 and the chip 108 (the heat sink 138 is substantially in contact with the liquid metal 200), allowing the liquid metal 200 to conduct heat energy from the chip 108 to the heat sink 138, which then dissipates the heat. It should be noted that the heat sink 138 can be positioned above the chip 108 and secured to the board surface 106 by at least one screw 140. The distance between the heat sink 138 and the board surface 106 can be adjusted using the screw 140. In this way, reducing the distance of the heat sink 138 to the board surface 106 increases the force compressing the elastic layer 114, which is then applied to the base layer 112. Here, the base layer 112 can uniformly apply a pushing force towards the protective layer 116, so that the protective layer 116 can be pressed against the electronic component 110 to form a recess 136, and the electronic component 110 is enclosed in the recess 136 (see...). Figure 4 (recess 136).

[0070] In some embodiments, please refer to Figure 6 , Figure 6 This is a schematic diagram illustrating the implementation of the electronic device in some embodiments of the present invention, showing that the fixing member is a frame. For example... Figure 6 The fastener shown is a frame 142. The frame 142 presses against the outer surface 126 of the elastic layer 114 to compress the elastic layer 114, generating a thrust towards the protective layer 116. Specifically, the frame 142 is secured to the plate surface 106 with at least one screw 144. The distance between the frame 142 and the plate surface 106 can be adjusted by the screw 144 to adjust the thrust applied by the elastic layer 114 to the base layer 112. The electronic component 110 is encased in the recess 136 (see...). Figure 4 (The recessed portion 136). In some embodiments, the frame 142 has a clearance opening 146 and a pressing portion 148. The shape of the pressing portion 148 matches the shape of the elastic layer 114, and when the pressing portion 148 presses against the elastic layer 114, the chip 108 is located in the clearance opening 146.

[0071] In some embodiments, such as Figure 2 and Figure 3As shown, the first opening 122, the second opening 128, and the third opening 134 each have an inner edge (122', 128', 134'), and each inner edge (122', 128', 134') is located between the electronic component 110 and the chip 108. In other words, the protective layer 116 covers the electronic component 110 and extends towards the chip 108. In some embodiments, one of the inner edges (122', 128', 134') contacts the chip 108, so that when the liquid metal 200 overflows from the chip 108, it can be blocked by the inner edge (122', 128', 134'). If the liquid metal 200 still overflows to the board surface 106, the protective layer 116 can also isolate the electronic component 110 from the liquid metal 200.

[0072] In some embodiments, the protective layer 116 is made of a non-porous material (e.g., silicone). This prevents the liquid metal 200 from penetrating into the recess 136 when it comes into contact with the protective layer 116.

[0073] In some embodiments, such as Figure 1 As shown, one side of the base layer 112 has a lug 150. The elastic layer 114 has a first edge 152, and the protective layer 116 has a second edge 154. The lug 150 protrudes from the first edge 152 and the second edge 154. Thus, when a user wants to remove the chip protector 104 from the circuit board 102, the user can use the lug 150 to peel the chip protector 104 off the board surface 106.

[0074] In some embodiments, please refer to Figure 7 , Figure 7 for Figure 5 Another implementation diagram shows the adhesive layer covering the electronic component. For example... Figure 7 As shown, the chip protector 104 also includes an adhesive layer 156. The adhesive layer 156 has a first adhesive surface 158 and a second adhesive surface 160. The first adhesive surface 158 is adhered to the attachment surface 132, and the second adhesive surface 160 is adhered to the electronic component 110. The adhesive layer 156 can be a viscous silicone material (e.g., silicone gel). The heat sink 138 (or...) Figure 6 The frame 142) is locked to the board surface 106, and the heat sink 138 can press against the elastic layer 114, causing the protective layer 116 and the adhesive layer 156 to cover the electronic component 110. The adhesive layer 156 can adhere to the electronic component 110 and the board surface 106, so that the protective layer 116 can maintain a relatively stationary relationship with the electronic component 110 through the adhesive layer 156, so as to prevent the protective layer 116 from shifting off the electronic component 110 during operation.

[0075] In summary, in some embodiments of the electronic device 100, when liquid metal 200 overflows from the surface of the chip 108 toward the electronic component 110 by covering the electronic component 110 on the circuit board 102 with a chip protector 104, the chip protector 104 can prevent the liquid metal 200 from contacting the electronic component 110. The chip protector 104 includes a base layer 112, an elastic layer 114, and a protective layer 116, with the elastic layer 114 and the protective layer 116 respectively bonded to the base layer 112. Therefore, when removing the chip protector 104 from the circuit board 102, the base layer 112, the elastic layer 114, and the protective layer 116 can be manually separated from the electronic component 110 together, without the need for removal of the chip protector 104 by machine equipment.

[0076] The embodiments described above are only for illustrating the technical ideas and features of this case. Their purpose is to enable those skilled in the art to understand the content of this case and implement it accordingly. They should not be used to limit the scope of the patent in this case. That is, all equivalent changes or modifications made in accordance with the spirit disclosed in this case should still be covered within the claims of this case.

Claims

1. An electronic device, characterized in that, Include: A circuit board has a surface on which a chip and an electronic component are disposed, the electronic component being adjacent to the chip; as well as A chip screen protector, including: A base layer has a first surface, a second surface and a first opening, the first opening penetrating the first surface and the second surface; An elastic layer is stacked on the first surface, the elastic layer including a first bonding surface, an outer surface, and a second opening, the first bonding surface being bonded to the first surface, and the second opening penetrating the first bonding surface and the outer surface; and A protective layer is stacked on the second surface. The protective layer includes a second bonding surface, an attachment surface, and a third opening. The second bonding surface is bonded to the second surface, and the third opening penetrates the second bonding surface and the attachment surface. The first opening, the second opening, and the third opening overlap each other to form a chip accommodating space. The chip protector is attached to the surface of the board and covers the electronic component, with the chip located in the chip housing space.

2. The electronic device as claimed in claim 1, characterized in that, The base layer has a lug on one side, the elastic layer has a first edge, the protective layer has a second edge, and the lug protrudes from the first edge and the second edge.

3. The electronic device as claimed in claim 1, characterized in that, It also includes a fastener disposed on the surface of the circuit board and pressing against the chip protector so that the adhesive side is attached to the surface of the board.

4. The electronic device as claimed in claim 3, characterized in that, The fixing member is a heat sink and presses against the outer surface of the elastic layer. There is a liquid metal between the heat sink and the chip, and the liquid metal is confined within the chip's accommodating space.

5. The electronic device as claimed in claim 3, characterized in that, The fastener compresses the elastic layer to generate a thrust in the direction of the protective layer.

6. The electronic device as claimed in claim 5, characterized in that, The surface of the protective layer is pressed by the electronic component to form a recess, and the area of ​​the protective layer adjacent to the recess covers the outside of the electronic component.

7. The electronic device as claimed in claim 1, characterized in that, The first opening, the second opening, and the third opening each have an inner edge, and each inner edge is located between the electronic component and the chip.

8. The electronic device as claimed in claim 1, characterized in that, The structural strength of the base layer is greater than that of the protective layer or the elastic layer.

9. A chip protector, characterized in that, Include: A base layer has a first surface, a second surface and a first opening, the first opening penetrating the first surface and the second surface; An elastic layer is stacked on the first surface, the elastic layer including a first bonding surface, an outer surface, and a second opening, the first bonding surface being bonded to the first surface, and the second opening penetrating the first bonding surface and the outer surface; and A protective layer is stacked on the second surface. The protective layer includes a second bonding surface, an attachment surface, and a third opening. The second bonding surface is bonded to the second surface, and the third opening penetrates the second bonding surface and the attachment surface. The first opening, the second opening, and the third opening overlap each other to form a chip accommodating space.

10. The chip protector as described in claim 9, characterized in that, The base layer has a lug on one side, the elastic layer has a first edge, the protective layer has a second edge, and the lug protrudes from the first edge and the second edge.

11. The chip protector as described in claim 9, characterized in that, The structural strength of the base layer is greater than that of the protective layer and the elastic layer.

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