shielding mechanism
By using a conductive probe to contact the shielding cover, the PCB board and the shielding cover are made conductive, which solves the problems of high cost and low efficiency caused by screw fastening, improves assembly efficiency and reduces production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FIRST ELECTRONICS KUSN
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-28
AI Technical Summary
In existing technologies, the grounding method between the shield and the PCB board relies on screws, which increases production and time costs, and the assembly process is cumbersome and inefficient.
The conductive probe in the conductive component abuts against the shielding cover to achieve conductivity between the PCB board and the shielding cover, eliminating the need for screw connections and simplifying the assembly process.
It reduced production and time costs, improved assembly and production efficiency, and simplified assembly steps.
Smart Images
Figure CN224571683U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic equipment technology, and in particular to a shielding mechanism. Background Technology
[0002] In the field of automotive component design, the widespread use of electronic equipment exposes automotive components to electromagnetic interference (EMI) problems. To ensure the stable operation of equipment in complex electromagnetic environments, shielding covers are often used to block EMI. These shielding covers are mostly made of conductive metals, effectively isolating internal and external EMI.
[0003] In existing technologies, grounding of shielding covers mostly relies on screws securing the PCB board and the shielding cover. Although this method of grounding is reliable, during production and assembly, screw securing requires specialized screws and tools, significantly increasing production and time costs during large-scale production. Furthermore, the installation process is cumbersome, resulting in low production and assembly efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a shielding mechanism that can reduce production and time costs, and improve assembly and production efficiency.
[0005] To achieve this objective, the present invention adopts the following technical solution:
[0006] Shielding mechanisms include:
[0007] A PCB board, wherein multiple electronic components are spaced apart on the PCB board;
[0008] A shielding cover is configured as an open-shaped shell, with one end of the PCB board inserted into the opening of the shielding cover, so that the shielding cover covers at least one of the electronic components;
[0009] A conductive component is fixedly disposed at the other end of the PCB board, and a conductive probe in the conductive component abuts against the shielding cover to make the PCB board and the shielding cover conductive.
[0010] As a further technical solution, the conductive sidewall of the shielding cover is provided with a conductive protrusion, and the conductive probe abuts against the conductive protrusion.
[0011] As a further technical solution, the shielding cover includes a conductive strip, the first end of which is connected to the conductive sidewall, the second end of which is set as a free end, and the middle part of the conductive strip is bent in a direction away from the conductive sidewall to form the conductive protrusion.
[0012] As a further technical solution, the conductive protrusion is disposed on the outer side of the conductive sidewall.
[0013] As a further technical solution, an avoidance opening is provided on the conductive sidewall, and the conductive strip is disposed on the shielding cover corresponding to the avoidance opening, with the second end of the conductive strip located inside the avoidance opening.
[0014] As a further technical solution, the end of the conduction probe away from the PCB board is bent towards the conduction sidewall, so that the middle part of the conduction probe forms an abutment groove that abuts against the conduction protrusion.
[0015] As a further technical solution, the conductive protrusion is disposed at the opening end of the shielding cover.
[0016] As a further technical solution, the end of the conductive probe away from the PCB board is bent away from the conductive sidewall of the shielding cover, and the bending point on the conductive probe abuts against the conductive sidewall.
[0017] As a further technical solution, the conductive probe includes a connecting section and a conductive section. The first end of the connecting section is connected to the PCB board, and the second end extends in a direction away from the PCB board. The first end of the conductive section is perpendicularly connected to the second end of the connecting section, and the second end of the conductive section extends in a direction from the opening end of the shielding cover to the bottom wall of the shielding cover.
[0018] As a further technical solution, the shielding mechanism also includes a limiting member, and the PCB board is limited and positioned inside the shielding cover by the limiting member.
[0019] Compared with the prior art, the technical advantages of the shielding mechanism provided in this utility model embodiment are as follows:
[0020] Since one end of the PCB board is inserted into the opening of the shielding cover, and the conductive component is fixedly mounted on the other end of the PCB board, with the conductive probe in the conductive component abutting against the shielding cover to enable conductivity between the PCB board and the shielding cover. Therefore, conductivity between the PCB board and the shielding cover can be achieved simply by the conductive probe abutting against the shielding cover, without the need for screw connections. Consequently, during production and assembly, specialized screws and tools for screw fastening are unnecessary, saving production costs; simultaneously, the screw tightening step can be omitted, thereby improving production and assembly efficiency and saving time. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the shielding mechanism provided in an embodiment of the present invention;
[0023] Figure 2 This is a side view of the shielding mechanism provided in an embodiment of the present utility model;
[0024] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;
[0025] Figure 4 This is a schematic diagram of the shielding cover in the shielding mechanism provided in this embodiment of the utility model;
[0026] Figure 5 yes Figure 4 A magnified view of a section at point B.
[0027] In the picture:
[0028] 100. PCB board;
[0029] 200. Shielding cover; 201. Conductive sidewall; 210. Conductive protrusion; 220. Conductive strip; 230. Clearance opening;
[0030] 300. Conductive probe; 310. Connecting segment; 320. Conductive segment;
[0031] 400. Limiting components. Detailed Implementation
[0032] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.
[0033] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0034] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.
[0035] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.
[0036] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values not using relative terms should also be disclosed as specific values with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.
[0037] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.
[0038] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.
[0039] Combination Figures 1 to 5 As shown, the shielding mechanism provided in this embodiment can reduce production costs and time costs, and improve assembly and production efficiency. The shielding mechanism includes: a PCB board 100 with multiple electronic components spaced apart; a shielding cover 200 configured as an open-shaped shell, with one end of the PCB board 100 inserted into the open end of the shielding cover 200, so that the shielding cover 200 covers at least one electronic component; and a conductive assembly fixedly disposed at the other end of the PCB board 100, with a conductive probe 300 in the conductive assembly abutting against the shielding cover 200 to enable electrical connection between the PCB board 100 and the shielding cover 200.
[0040] Since one end of the PCB board 100 is inserted into the opening of the shielding cover 200, and the conductive component is fixedly disposed at the other end of the PCB board 100, with the conductive probe 300 in the conductive component abutting against the shielding cover 200, the PCB board 100 and the shielding cover 200 are made conductive. Therefore, the PCB board 100 and the shielding cover 200 can be made conductive simply by the conductive probe 300 abutting against the shielding cover 200, without the need for screw connection. Thus, during the production and assembly process, no special screws or tools are required for screw fastening, thereby saving production costs; simultaneously, the screw tightening step can be omitted, thereby improving production and assembly efficiency and saving time costs.
[0041] Preferably, the conductive probe 300 includes a connecting section 310 and a conductive section 320. The first end of the connecting section 310 is connected to the PCB board 100, and the second end extends in a direction away from the PCB board 100. The first end of the conductive section 320 is perpendicularly connected to the second end of the connecting section 310, and the second end of the conductive section 320 extends in a direction from the opening end of the shielding cover 200 to the bottom wall of the shielding cover 200.
[0042] Combination Figure 1 and Figure 2As shown, the conductive probe 300 is configured as an "L" shaped component. Through the cooperation of the connecting section 310 and the conductive section 320, it can avoid the opening end of the shielding cover 200, ensuring that the conductive probe 300 and the conductive sidewall 201 on the shielding cover 200 can be effectively connected. At the same time, since the second end of the conductive section 320 extends from the opening end of the shielding cover 200 to the bottom wall of the shielding cover 200, the conductive path of the conductive section 320 and the conductive probe 300 is shortened as much as possible while ensuring the conductive effect between the PCB board 100 and the shielding cover 200.
[0043] In this embodiment, the material of the shielding cover 200 and the conductive probe 300, as well as the shape of the shielding cover 200 and the number of conductive probes 300, are not specifically limited and can be adapted according to the actual situation.
[0044] In this embodiment, two implementation methods are provided for the conduction probe 300, as detailed below:
[0045] The first type
[0046] A conductive protrusion 210 is provided on the conductive sidewall 201 of the shielding cover 200, and the conductive probe 300 abuts against the conductive protrusion 210. This configuration increases the contact force between the conductive probe 300 and the shielding cover 200 by providing the conductive protrusion 210, thereby ensuring the contact effect between the conductive probe 300 and the conductive protrusion 210, and further ensuring the conductivity between the PCB board 100 and the shielding cover 200.
[0047] Furthermore, the conductive protrusion 210 is disposed on the outer side of the conductive sidewall 201. This arrangement ensures the conductivity between the PCB board 100 and the shielding cover 200 while preventing the conductive protrusion 210 from occupying the internal space of the shielding cover 200, thereby reducing the gap between the PCB board 100 and the shielding cover 200, thus minimizing the spatial volume of the shielding mechanism and reducing the probability of the PCB board 100 shaking, shifting, or detaching relative to the shielding cover 200.
[0048] Furthermore, the shielding cover 200 includes a conductive strip 220, the first end of which is connected to the conductive sidewall 201, the second end of which is set as a free end, and the middle part of the conductive strip 220 is bent away from the conductive sidewall 201 to form a conductive protrusion 210.
[0049] Combination Figure 5As shown, by setting the second end of the conductive strip 220 as a free end, the middle and second end of the conductive strip 220 have a certain degree of elasticity. This setting increases the contact force between the conductive probe 300 and the shielding cover 200, thereby ensuring the contact effect between the conductive probe 300 and the conductive protrusion 210. On the other hand, during production assembly, by pressing the second end of the conductive strip 220, the conductive protrusion 210 is moved closer to the inside of the shielding cover 200. After the PCB board 100 is fully inserted into the shielding cover 200, the second end of the conductive strip 220 is no longer pressed, so that the conductive probe 300 abuts against the conductive protrusion 210. In this way, when the PCB board 100 is placed on the shielding cover 200, interference between the conductive probe 300 and the conductive protrusion 210 is avoided, further improving assembly convenience and efficiency.
[0050] To further reduce the spatial volume of the shielding mechanism, in this embodiment, a clearance opening 230 is provided on the conductive sidewall 201, and a conductive strip 220 is correspondingly disposed on the shielding cover 200 with the clearance opening 230, and the second end of the conductive strip 220 is located inside the clearance opening 230. In other embodiments, the conductive strip 220 can be directly disposed on the outside of the conductive sidewall 201.
[0051] After the conduction probe 300 abuts against the conduction protrusion 210, in order to further increase the contact area between the conduction probe 300 and the conduction protrusion 210 and improve the conduction effect between the PCB board 100 and the shielding cover 200, in this embodiment, the end of the conduction probe 300 away from the PCB board 100 is bent towards the conduction sidewall 201 so that the middle part of the conduction probe 300 abuts against the conduction protrusion 210 in the abutment groove. At the same time, after the PCB board 100 is fully inserted into the shielding cover 200, the probability of the PCB board 100 shaking, shifting, or detaching relative to the shielding cover 200 can be further reduced by the abutment groove cooperating with the conduction protrusion 210.
[0052] In order to further shorten the conduction path between the PCB board 100 and the shielding cover 200 and further improve the conduction effect between the PCB board 100 and the shielding cover 200, in this embodiment, the conduction protrusion 210 is provided at the opening end of the shielding cover 200.
[0053] The second type
[0054] One end of the conduction probe 300 away from the PCB board 100 is bent toward the conduction sidewall 201 on the shielding cover 20, and the bending point on the conduction probe 300 abuts against the conduction sidewall 201.
[0055] In this embodiment, the conductive sidewall 201 does not have a conductive protrusion 210. The end of the conductive probe 300 away from the PCB board 100 is bent directly in the direction away from the conductive sidewall 201, so that a bending point is formed in the middle of the conductive section 320. After the PCB board 100 is placed inside the shielding cover 200, the bending point abuts against the conductive sidewall 201 to achieve effective conduction between the PCB board 100 and the shielding cover 200.
[0056] In both of the above embodiments, the shielding mechanism also includes a limiting member 400, which limits the PCB board 100 within the shielding cover 200. By setting the limiting member 400, the relative position of the PCB board 100 within the shielding cover 200 is restricted, reducing the probability of the PCB board 100 shaking, shifting, or detaching relative to the shielding cover 200, thereby further improving the conductivity between the PCB board 100 and the shielding cover 200.
[0057] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A shielding mechanism, characterized in that, include: A PCB board (100) on which multiple electronic components are spaced apart; A shielding cover (200) is configured as an open-shaped housing, and one end of the PCB board (100) is inserted into the open end of the shielding cover (200) so that the shielding cover (200) covers at least one of the electronic components; A conductive component is fixedly disposed at the other end of the PCB board (100). The conductive probe (300) in the conductive component abuts against the shield (200) to make the PCB board (100) and the shield (200) conduct.
2. The shielding mechanism according to claim 1, characterized in that, The shield (200) has a conductive protrusion (210) on its conductive sidewall (201), and the conductive probe (300) abuts against the conductive protrusion (210).
3. The shielding mechanism according to claim 2, characterized in that, The shielding cover (200) includes a conductive strip (220), the first end of which is connected to the conductive sidewall (201), and the second end is set as a free end. The middle part of the conductive strip (220) is bent away from the conductive sidewall (201) to form the conductive protrusion (210).
4. The shielding mechanism according to claim 3, characterized in that, The conductive protrusion (210) is disposed on the outside of the conductive sidewall (201).
5. The shielding mechanism according to claim 3, characterized in that, An avoidance opening (230) is provided on the conductive sidewall (201), and the conductive strip (220) is disposed on the shield (200) corresponding to the avoidance opening (230), and the second end of the conductive strip (220) is located inside the avoidance opening (230).
6. The shielding mechanism according to claim 2, characterized in that, The end of the conductive probe (300) facing away from the PCB board (100) is bent toward the conductive sidewall (201) so that the middle part of the conductive probe (300) forms an abutment groove that abuts and cooperates with the conductive protrusion (210).
7. The shielding mechanism according to claim 2, characterized in that, The conductive protrusion (210) is disposed at the opening end of the shield (200).
8. The shielding mechanism according to claim 1, characterized in that, The end of the conductive probe (300) facing away from the PCB board (100) is bent away from the conductive sidewall (201) on the shield (200), and the bending point on the conductive probe (300) abuts against the conductive sidewall (201).
9. The shielding mechanism according to any one of claims 1-8, characterized in that, The conductive probe (300) includes a connecting section (310) and a conductive section (320). The first end of the connecting section (310) is connected to the PCB board (100), and the second end extends away from the PCB board (100). The first end of the conductive section (320) is perpendicularly connected to the second end of the connecting section (310), and the second end of the conductive section (320) extends along the direction from the opening end of the shield (200) to the bottom wall of the shield (200).
10. The shielding mechanism according to claim 9, characterized in that, The shielding mechanism also includes a limiting member (400), and the PCB board (100) is limited and positioned inside the shielding cover (200) by the limiting member (400).