Coil component, electronic component including same, semiconductor component, and substrate

Abstract

A coil component is provided with: a body including a magnetic layer; and a first coil wiring disposed in the body. The magnetic layer includes a resin, a first metal magnetic powder, a first iron oxide magnetic powder, and a void portion, and the average particle diameter of the first metal magnetic powder is larger than the average particle diameter of the first iron oxide magnetic powder.

Description

Technical Field

[0001] This disclosure relates to coil components, electronic components including the coil components, semiconductor components, and substrates. Background Technology

[0002] Inductor components having a blank containing a magnetic layer and a coil conductor formed inside the blank have been studied for a long time. For example, Japanese Patent Application Publication No. 2012-238840 (Patent Document 1) describes a magnetic layer comprising metallic magnetic powder, voids, and resin material.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-238840 Summary of the Invention

[0006] However, the inductor components described in the prior art have the following problems: if the filling rate of the metal magnetic powder used as the magnetic material is increased, the permeability is improved, but on the other hand, the eddy current loss increases and the Q value decreases.

[0007] Therefore, the purpose of this disclosure is to provide a coil component with a high Q value and improved inductance acquisition efficiency.

[0008] To address the aforementioned issues, a coil component according to one embodiment of this disclosure comprises: a blank containing a magnetic layer and a first coil wiring disposed on the same plane within the blank.

[0009] The aforementioned magnetic layer comprises resin, first metallic magnetic powder, first iron oxide magnetic powder, and voids.

[0010] The average particle size of the first metallic magnetic powder is greater than the average particle size of the first iron oxide magnetic powder.

[0011] If a first metallic magnetic powder and a first iron oxide magnetic powder with an average particle size smaller than that of the first metallic magnetic powder are used as magnetic materials, the spaces between the first metallic magnetic powders can be filled with the first iron oxide magnetic powder. This ensures insulation within the magnetic layer, increases the filling rate of the magnetic material, and improves permeability. Furthermore, the average particle size of the first iron oxide magnetic powder is easier to reduce compared to the first metallic magnetic powder. By reducing the average particle size of the first iron oxide magnetic powder, as described above, the spaces between the first metallic magnetic powders can be filled with the first iron oxide magnetic powder, safely increasing the filling rate. Moreover, the voids contained in the resin can be used to alleviate stress caused by heat, etc. As a result, a coil component with a high Q value and improved inductance efficiency can be obtained.

[0012] Average particle size refers to the arithmetic mean obtained by scanning electron microscopy.

[0013] According to one aspect of this disclosure, a coil component with a high Q value and improved inductance acquisition efficiency can be provided. Attached Figure Description

[0014] Figure 1 This is a perspective view of the inductor component according to the first embodiment.

[0015] Figure 2 yes Figure 1 An exploded plan view of the inductor component.

[0016] Figure 3A yes Figure 1 A partially enlarged view of the cross-section.

[0017] Figure 3B yes Figure 3A A summary diagram illustrating the concept.

[0018] Figure 4 This is an explanatory diagram illustrating a portion of the magnetic layer in the first modified example.

[0019] Figure 5 This is a partial enlarged view of the magnetic layer in the first modified example.

[0020] Figure 6A This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0021] Figure 6B This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0022] Figure 6C This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0023] Figure 6D This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0024] Figure 6E This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0025] Figure 6F This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0026] Figure 6G This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0027] Figure 6H This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0028] Figure 6I This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0029] Figure 6J This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0030] Figure 6K This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0031] Figure 6L This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0032] Figure 6M This is a VI-VI cross-sectional view showing the manufacturing process of an inductor component.

[0033] Figure 7A This is section VII-VII, which shows the manufacturing process of the inductor component.

[0034] Figure 7B This is section VII-VII, which shows the manufacturing process of the inductor component.

[0035] Figure 7C This is section VII-VII, which shows the manufacturing process of the inductor component.

[0036] Figure 7D This is section VII-VII, which shows the manufacturing process of the inductor component.

[0037] Figure 7E This is section VII-VII, which shows the manufacturing process of the inductor component.

[0038] Figure 7F This is section VII-VII, which shows the manufacturing process of the inductor component.

[0039] Figure 8 This is an explanatory diagram illustrating a portion of the magnetic layer included in the inductor component of the third embodiment.

[0040] Figure 9 This is a partially enlarged view of the magnetic layer included in the inductor component of the third embodiment.

[0041] Figure 10A This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0042] Figure 10B This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0043] Figure 10C This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0044] Figure 10DThis is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0045] Figure 10E This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0046] Figure 10F This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0047] Figure 10G This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0048] Figure 10H This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0049] Figure 10I This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0050] Figure 10J This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0051] Figure 10K This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0052] Figure 10L This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0053] Figure 10M This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0054] Figure 10N This is a YZ cross-sectional view showing the manufacturing process of an inductor component.

[0055] Figure 10O This is a YZ cross-sectional view showing the manufacturing process of an inductor component. Detailed Implementation

[0056] The following detailed description uses illustrated embodiments to illustrate an inductor component, which is one type of coil component according to the present disclosure. It should be noted that while an inductor component is described in this disclosure, other coil components, capacitor components, etc., may also be used. Furthermore, the accompanying drawings contain schematic diagrams and may not always reflect actual dimensions or proportions.

[0057] <First Implementation>

[0058] Figure 1 This is a perspective view showing the first embodiment of the inductor component 1. Figure 2 This is an exploded plan view of inductor component 1. Figure 3A This is a partially enlarged view of the cross-section of inductor component 1. Figure 3B yes Figure 3AA summary diagram illustrating the concept. It should be noted that, in Figure 1 In the diagram, the external terminals are depicted using double-dotted lines. Figure 1 , Figure 2 The insulating layer is not shown in the drawing.

[0059] Inductor component 1 is, for example, a surface-mount inductor component mounted in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and automotive electronic products. Inductor component 1 can be a semiconductor component. Inductor component 1 can be, for example, a power inductor for a power supply circuit in an electronic device. Alternatively, it can be a substrate containing inductor component 1. However, the application of inductor component 1 is not limited to the examples described above.

[0060] The inductor component 1 is a rectangular parallelepiped in shape. The size of the inductor component 1 is, for example, 1.0 mm × 0.5 mm × 0.5 mm (X dimension × Y dimension × Z dimension). In this disclosure, "rectangular parallelepiped shape" also includes shapes where some or all of the faces have concave or convex shapes. Furthermore, for the "rectangular parallelepiped shape" in this specification, each face does not need to be perfectly parallel to its opposite face; they can be slightly inclined. That is, adjacent faces do not necessarily form right angles. It should be noted that the shape of the inductor component 1 is not particularly limited and can be cylindrical, polygonal prism, frustum conical, or polygonal frustum conical. Additionally, the size of the inductor component 1 is not particularly limited.

[0061] like Figures 1 to 3A As shown, the inductor component 1 includes: a blank 10 containing a magnetic layer 11, inductor wiring (coil wiring) 21, 22, 23 disposed within the blank 10, vertical wiring 81, 82, external terminals 41, 42, and a coating 50. It should be noted that... Figure 2 In this context, the stacking direction is defined as the direction from the top left layer to the bottom right layer (i.e., the Z direction).

[0062] The blank 10 is formed in a generally rectangular parallelepiped shape. The surface of the blank 10 includes: a first end face 15 and a second end face 16 opposite each other, a first side face 13 and a second side face 14 opposite each other, a second main surface (top surface) 17 connecting the first end face 15 and the second end face 16 and the first side face 13 and the second side face 14, and a first main surface (bottom surface) 18 opposite the second main surface 17. When the inductor component 1 is mounted on a mounting substrate (not shown), the first main surface 18 is the surface facing the mounting substrate.

[0063] As shown in the figure, the X direction is orthogonal to the first end face 15 and the second end face 16, and is the direction from the first end face 15 toward the second end face 16. The Y direction is orthogonal to the first side face 13 and the second side face 14, and is the direction from the first side face 13 toward the second side face 14. The Z direction is orthogonal to the second main face 17 and the first main face 18, and is the direction from the second main face 17 toward the first main face 18. The X direction is also called the width direction of the billet 10, the Y direction is also called the length direction of the billet 10, and the Z direction is also called the height direction of the billet 10. The positive Z direction is taken as the upward direction, and the negative Z direction is taken as the downward direction. The X, Y, and Z directions are mutually orthogonal and, when arranged in the order of X, Y, Z, form a right-hand rule. Sometimes the magnitude of the X direction is called the width, the magnitude of the Y direction is called the length, and the magnitude of the Z direction is called the height. The X, Y, and Z directions are also the same in other embodiments and variations.

[0064] The wiring 21, 22, and 23 for the first to third inductors are arranged inside the blank 10.

[0065] The first inductor wiring 21 comprises a conductive material and is wound in a plane. That is, the first inductor wiring 21 is a spiral wiring. Here, a spiral wiring refers to a wiring having the shape of a curve (two-dimensional curve) extending in a plane. In this embodiment, the number of turns formed by the curve in the first inductor wiring 21 is more than one turn. It should be noted that the number of turns may be less than one turn, and there may be multiple curves wound in different directions, or a portion may have straight lines. The direction perpendicular to the plane on which the first inductor wiring 21 is wound is the Z direction (vertical direction) in the figure.

[0066] The first inductor wiring 21 has an inner peripheral surface and an outer peripheral surface. When viewed from above (in the direction of the first main surface 18), the first inductor wiring 21 forms a vortex shape in a clockwise direction from the inner peripheral end 21a to the outer peripheral end 21b. The inner peripheral end 21a and the outer peripheral end 21b are not precise ends; they may extend slightly inward or have protrusions that serve as current paths. The inner peripheral end 21a is formed as a semicircle. The outer peripheral end 21b is formed as a generally rectangular shape. It should be noted that the shape of the inner peripheral end 21a is not limited to a semicircle; it can be a circle including an ellipse, an arc, a polygon, or a combination thereof. The shape of the outer peripheral end 21b is not limited to a generally rectangular shape; it can be a rectangle, a semicircle, a circle including an ellipse, an arc, a polygon, or a combination thereof.

[0067] Specifically, when viewed from above, the first inductor wiring 21 comprises a first portion 21c extending parallel to the second end face 16 in the opposite Y direction from an inner peripheral end 21a located closer to the second end face 16 than the center line of the first end face 15 and the second end face 16; a second portion 21d connected to the first portion 21c and extending parallel to the first side face 13 in the opposite X direction; a third portion 21e connected to the second portion 21d and extending parallel to the first end face 15 in the Y direction; a fourth portion 21f connected to the third portion 21e and extending parallel to the second side face 14 in the X direction; and a fifth portion 21g connected to the fourth portion 21f and extending parallel to the second end face 16 in the opposite Y direction, having an outer peripheral end 21b. In the first inductor wiring 21, the second portion 21d is closest to the first side face 13. In the first inductor wiring 21, the fourth portion 21f is closest to the second side face 14. In the first inductor wiring 21, the third portion 21e is closest to the first end face 15. In the first inductor wiring 21, the fifth portion 21g is closest to the second end face 16. It should be noted that the corners between the first portion 21c and the second portion 21d, the second portion 21d and the third portion 21e, the third portion 21e and the fourth portion 21f, and the fourth portion 21f and the fifth portion 21g are each bent. It should be noted that these corners may not be bent.

[0068] Part 21c has a width dimension (X-direction dimension) W11. Part 21d has a length dimension (Y-direction dimension) L11. Part 21e has a width dimension W12. Part 21f has a length dimension L12. Part 21g has a width dimension W13. It should be noted that the width dimension refers to the maximum dimension in the X-direction. Similarly, the length dimension refers to the maximum dimension in the Y-direction.

[0069] In the first inductor wiring 21, the width dimension W11 of the first portion 21c is the same as the length dimension L11 of the second portion 21d. The width dimension W12 of the third portion 21e, the length dimension L12 of the fourth portion 21f, and the width dimension W13 of the fifth portion 21g are the same. The length dimension L12 of the fourth portion 21f is more than twice the length dimension L11 of the second portion 21d. It should be noted that "the same value" can mean exactly the same or slightly different. In this embodiment, for the convenience of explaining the inductor wiring, the length dimension L12 is more than twice the length dimension L11, but the values ​​of the length dimensions L11, L12 and the width dimensions W11, W12, W13 are not limited to those described above, and can have different values ​​or the same values. In addition, the values ​​of the length dimension and the width dimension are also referred to as wiring width.

[0070] In the first inductor wiring 21, the spiral wires are spaced apart, for example, by the outer peripheral surface of the first portion 21c and the inner peripheral surface of the fifth portion 21g. This maintains insulation between the spiral wires. The distance between the spiral wires is, for example, 10 μm.

[0071] The height dimension in the Z direction of the first inductor wiring 21 is not particularly limited, for example, it is 10μm to 200μm. It should be noted that the height dimension refers to the maximum dimension in the Z direction.

[0072] As an example of the first inductor wiring 21, the length dimension L11 of the second part 21d is 90μm, the length dimension L12 of the fourth part 21f is 190μm, and the height dimension of the first inductor wiring 21 is 70μm.

[0073] The second inductor wiring 22 is made of a conductive material and is wound in a plane. That is, the second inductor wiring 22 is a spiral wiring. In this embodiment, the number of turns formed by the curves in the second inductor wiring 22 is more than one turn. It should be noted that the number of turns may be less than one turn, and there may be multiple curves wound in different directions, or a portion of them may be straight.

[0074] The second inductor wiring 22 has an inner peripheral surface and an outer peripheral surface. Viewed from above, the second inductor wiring 22 extends from the inner peripheral end 22a to the outer peripheral end 22b in the normal direction and is coiled in a counterclockwise direction into a spiral shape. The inner peripheral end 22a and the outer peripheral end 22b are not precise ends; they may extend slightly inward or have protrusions that serve as current paths. The inner peripheral end 22a is formed as a semicircle. The outer peripheral end 22b is formed as a semicircle. It should be noted that the shapes of the inner peripheral end 22a and the outer peripheral end 22b are not limited to semicircles; they may be circles, arcs, polygons, or combinations thereof, including ellipses.

[0075] Specifically, when viewed from above, the second inductor wiring 22 consists of a first portion 22c extending in the Y direction parallel to the second end face 16 from an inner peripheral end 22a located closer to the second end face 16 than the center line of the first end face 15 and the second end face 16; a second portion 22d connected to the first portion 22c and extending in the opposite X direction parallel to the second side face 14; a third portion 22e connected to the second portion 22d and extending in the opposite Y direction parallel to the first end face 15; a fourth portion 22f connected to the third portion 22e and extending in the X direction parallel to the first side face 13; a fifth portion 22g connected to the fourth portion 22f and extending in the Y direction parallel to the second end face 16; a sixth portion 22h connected to the fifth portion 22g and extending in the opposite X direction parallel to the second side face 14; and a seventh portion 22k connected to the sixth portion 22h and extending in the opposite Y direction parallel to the first end face 15, having an outer peripheral end 22b. In the second inductor wiring 22, the fourth portion 22f is closest to the first side 13. In the second inductor wiring 22, the sixth portion 22h is closest to the second side 14. In the second inductor wiring 22, the seventh portion 22k is closest to the first end face 15. In the second inductor wiring 22, the fifth portion 22g is closest to the second end face 16. It should be noted that the corners between the first portion 22c and the second portion 22d, the second portion 22d and the third portion 22e, the third portion 22e and the fourth portion 22f, the fourth portion 22f and the fifth portion 22g, the fifth portion 22g and the sixth portion 22h, and the sixth portion 22h and the seventh portion 22k can each be bent. It should also be noted that these corners can remain unbent.

[0076] Part 22c has a width dimension W21. Part 22d has a length dimension L22. Part 22e has a width dimension W22. Part 22f has a length dimension L21. Part 22g has a width dimension W23. Part 22h has a length dimension L23. Part 7k has a width dimension W24.

[0077] In the second inductor wiring 22, the width W21 of the first part 22c, the length L22 of the second part 22d, the width W22 of the third part 22e, the length L21 of the fourth part 22f, the width W23 of the fifth part 22g, the length L23 of the sixth part 22h, and the width W24 of the seventh part 22k are all the same value. It should be noted that "same value" can mean completely identical or slightly different. It should also be noted that the wiring widths of the second inductor wiring 22 are not all the same value and can have different values.

[0078] The height dimension of the second inductor wiring 22 in the Z direction is not particularly limited, for example, it is 10μm to 200μm.

[0079] As an example of the second inductor wiring 22, the width dimension W21 of the first part 22c, the length dimension L22 of the second part 22d, the width dimension W22 of the third part 22e, the length dimension L21 of the fourth part 22f, the width dimension W23 of the fifth part 22g, the length dimension L23 of the sixth part 22h, and the width dimension W24 of the seventh part 22k are all 90μm, and the height dimension of the second inductor wiring 22 is 70μm.

[0080] In the second inductor wiring 22, the spiral wires are spaced apart, for example, between the outer peripheral surface of the first portion 22c and the inner peripheral surface of the fifth portion 22g, between the outer peripheral surface of the second portion 22d and the sixth portion 22h, and between the third portion 22e and the seventh portion 22k. This maintains insulation between the spiral wires. The distance between the spiral wires is, for example, 10 μm.

[0081] The third inductor wiring 23 is made of a conductive material. Viewed from above, the third inductor wiring 23 is a straight wiring arranged parallel to the second end face 16. Viewed from above, the third inductor wiring 23 has a first end 23a on the first side face 13 and a second end 23b on the second side face 14. The first end 23a is formed as a semicircle. The second end 23b is formed as a semicircle. It should be noted that the shapes of the first end 23a and the second end 23b are not limited to semicircles, and can be circles, arcs, polygons, and combinations thereof, including ellipses.

[0082] The height dimension in the Z direction of the third inductor wiring 23 is not particularly limited, for example, it is 10μm to 200μm. In the example of the third inductor wiring 23, the height dimension is 70μm.

[0083] The third inductor wiring 23 and the second inductor wiring 22 are on the same plane. When viewed from above, the third inductor wiring 23 is closer to the second end face 16 than the second inductor wiring 22. When viewed from above, the second inductor wiring 22 and the third inductor wiring 23 are spaced apart from each other. Thus, the second inductor wiring 22 and the third inductor wiring 23 are insulated from each other. The distance between the outer peripheral surface of the fifth portion 22g of the second inductor wiring 22 and the surface of the third inductor wiring 23 on the second inductor wiring 22 side is, for example, 10 μm.

[0084] When viewed from the second end face 16, the third inductor wiring 23 has a surface that does not overlap with the second inductor wiring 22. Specifically, when viewed from the second end face 16, the second end 23b of the third inductor wiring 23 is closer to the first side face 13 than the outer peripheral end of the second side face 14 of the second inductor wiring 22. By having this shape, the volume of the magnetic part can be increased, and the efficiency of inductance can be improved.

[0085] When viewed from the second end face 16, the first inductor wiring 21 is separated from the second inductor wiring 22 and the third inductor wiring 23.

[0086] Viewed from above, the second portion 22d and the sixth portion 22h of the second inductor wiring 22 are located on the fourth portion 21f of the first inductor wiring 21. Viewed from above, the third portion 22e and the seventh portion 22k of the second inductor wiring 22 are located on the third portion 21e of the first inductor wiring 21. Viewed from above, the fourth portion 22f of the second inductor wiring 22 is located on the second portion 21d of the first inductor wiring 21. Viewed from above, the fifth portion 22g of the second inductor wiring 22 and the third inductor wiring 23 are located on the fifth portion 21g of the first inductor wiring 21.

[0087] The first inductor wiring 21, the second inductor wiring 22, and the third inductor wiring 23 are made of conductive materials, such as low-resistance metallic materials like Cu, Ag, Au, Fe, or alloys thereof. This reduces the DC resistance of the first inductor wiring 21, the second inductor wiring 22, and the third inductor wiring 23. It should be noted that the first inductor wiring 21, the second inductor wiring 22, and the third inductor wiring 23 can each have different compositions, or they can have the same composition.

[0088] The inductor wiring is connected by via wiring. Additionally, via wiring connects the inductor wiring to the post wiring.

[0089] Specifically, the first via wiring 91 extends in the Z direction, connecting the inner peripheral end 21a of the first inductor wiring 21 to the inner peripheral end 22a of the second inductor wiring 22. The first via wiring 91 has a circular shape. The second via wiring 92 extends in the Z direction, connecting the outer peripheral end 22b of the first inductor wiring 21 to the first end 23a of the third inductor wiring 23. The second via wiring 92 also has a circular shape. It should be noted that the shapes of the first via wiring 91 and the second via wiring 92 are not particularly limited and can be other shapes, such as elliptical shapes.

[0090] The third via wiring 93 extends in the Z direction, connecting the outer peripheral end 22b of the second inductor wiring 22 to the first columnar wiring 51. The third via wiring 93 has an elliptical shape. The fourth via wiring 94 extends in the Z direction, connecting the second end 23b of the third inductor wiring 23 to the second columnar wiring 52. The fourth via wiring 94 also has an elliptical shape. It should be noted that the shapes of the third via wiring 93 and the fourth via wiring 94 are not particularly limited and can be other shapes, such as circles.

[0091] When viewed from above, the second via wiring 92 is located on the first side 13, and the fourth via wiring 94 is located on the second side 14. When viewed from above, the second via wiring 92 and the fourth via wiring 94 do not overlap. It should be noted that, when viewed from above, at least a portion of the second via wiring 92 and the fourth via wiring 94 may overlap.

[0092] The magnetic layer 11 is contained in the blank 10. The first main surface of the magnetic layer 11 corresponds to the first main surface 18 of the blank 10, and the second main surface of the magnetic layer 11 corresponds to the second main surface 17 of the blank 10.

[0093] The magnetic layer 11 is composed of resin 72, magnetic material 70, and voids 71. In this embodiment, the magnetic material 70 has a first metallic magnetic powder 73 and a first iron oxide magnetic powder 74.

[0094] The magnetic layer 11 clamps the inductor wirings 21, 22, and 23 from both sides in the Z direction, and is disposed on the inner and outer sides of the inductor wirings 21, 22, and 23. Thus, the magnetic layer 11 forms a closed magnetic circuit with respect to the inductor wirings 21, 22, and 23. It should be noted that the magnetic layer 11 can be a stack of multiple magnetic layers, or it can be an integral part of the magnetic layer 11.

[0095] Specifically, the magnetic layer 11 is stacked in the following order: a first magnetic portion 26a (also called a lower magnetic layer), a second magnetic portion 26b, a third magnetic portion 26c, a fourth magnetic portion 26d, a fifth magnetic portion 26e, and a sixth magnetic portion 26f (also called an upper magnetic layer). The second magnetic portion 26b has a first inductor wiring 21, and has an inner magnetic circuit portion 24 disposed inside the first inductor wiring 21, and an outer magnetic circuit portion 25 disposed outside the first inductor wiring 21. The third magnetic portion 26c has first and second via wirings 91 and 92. The fourth magnetic portion 26d has a second inductor wiring 22 and a third inductor wiring 23, and has an inner magnetic circuit portion 24 disposed inside the second inductor wiring 22, and an outer magnetic circuit portion 25 disposed outside the second and third inductor wirings 22 and 23. The fifth magnetic section 26e and the sixth magnetic section 26f have first and second vertical wirings 81 and 82. The fifth magnetic section 26e has third and fourth through-hole wirings 93 and 94.

[0096] Preferably, the height of the first magnetic portion 26a is greater than the height of each of the second to sixth magnetic portions 26b to 26f. With this configuration, the efficiency of inductance can be improved without increasing the difficulty of manufacturing. For example, increasing the height of the magnetic portions 26b to 26f increases the efficiency of inductance, but conversely, it increases the difficulty of forming inductor wiring and via wiring. In the first embodiment, the height of the first magnetic portion 26a is 230 μm, and the height of the sixth magnetic portion 26f is 70 μm. It should be noted that the height of the first magnetic portion 26a can be the same as or smaller than the height of each of the second to sixth magnetic portions 26b to 26f. Furthermore, the heights of each of the second to sixth magnetic portions 26b to 26f can be the same or different.

[0097] An insulating layer 31 is embedded within the blank 10 (magnetic layer 11). The insulating layer 31 directly contacts and covers the first to third inductor wirings 21 to 23. This improves the insulation between the first inductor wirings 21, between the second inductor wirings 22, and between the second inductor wirings 22 and the third inductor wiring 23. It should be noted that the insulating layer 31 may cover at least a portion of the first to third inductor wirings 21 to 23. The insulating layer 31 may directly contact the first to third inductor wirings 21 to 23, or it may be configured with a gap between it and the first to third inductor wirings 21 to 23. For example, it may cover only the bottom surface (lower side) of the first to third inductor wirings 21 to 23, only the top surface (upper side) and the bottom surface, or only the side surface.

[0098] The insulating layer 31 is preferably located in the portion between the spiral wirings of the first inductor wiring 21, in the portion between the spiral wirings of the second inductor wiring 22, and in the portion between the second inductor wiring 22 and the third inductor wiring 23.

[0099] The insulating layer 31 contains a non-magnetic insulating material that does not contain magnetic particles. For example, the insulating layer 31 is formed of an insulating resin material containing inorganic fillers and organic resin materials.

[0100] As a material for the insulating layer 31, a resin containing silica (SiO2) powder can be used, for example. This improves the strength, processability, and electrical properties of the insulating layer 31. It should be noted that the insulating layer 31 does not necessarily contain silica powder.

[0101] Furthermore, the resin contained in the insulating layer 31 may contain an insulating resin, preferably at least one resin selected from epoxy resin, acrylic resin, phenolic resin, polyimide resin, and liquid crystal polymer resin. If the insulating layer 31 contains such insulating resins (organic resins), the first inductor wiring 21, the second inductor wiring 22, and the third inductor wiring 23 are bonded to the resin 72 contained in the magnetic layer 11 through the aforementioned resin in the insulating layer 31, thereby improving the adhesion between the first inductor wiring 21, the second inductor wiring 22, and the third inductor wiring 23 and the magnetic layer 11. In addition, compared with inorganic materials, the insulating layer 31 is more flexible due to its insulating organic resin, thus imparting flexibility to the inductor component 1 and improving its resistance to mechanical strength and thermal shock.

[0102] The thickness of the insulating layer 31 is not particularly limited; for example, it can be 1 μm to 20 μm. In the first embodiment, the insulating layer 31 is connected to the first to third inductor wirings 21 to 23, forming a layer with a thickness of 10 μm. It should be noted that the thickness of the insulating layer 31 refers to the maximum thickness in the direction perpendicular to the surface of the inductor wiring.

[0103] The insulating layer 32 contained in the insulating layer 31 is embedded in the blank 10. The insulating layer 32 is located in the fourth magnetic part 26d. When viewed from the second end face 16, the insulating layer 32 is located on the non-overlapping surface between the third inductor wiring 23 and the second inductor wiring 22.

[0104] The first vertical wiring 81 extends in the Z direction such that the fifth magnetic portion 26e and the sixth magnetic portion 26f are exposed from the outer peripheral end 22b side of the second inductor wiring 22 to the first main surface 18 of the blank 10. Specifically, the first vertical wiring 81 extends upward along the outer peripheral end 22b of the second inductor wiring 22 and extends to the side opposite to the third through-hole wiring 93 and the second inductor wiring 22 that penetrate the fifth magnetic portion 26e, and has a first columnar wiring 51 that penetrates the sixth magnetic portion 26f.

[0105] The second vertical wiring 82 extends in the Z direction such that the fifth magnetic portion 26e and the sixth magnetic portion 26f are exposed from the second end 23b side of the third inductor wiring 23 to the first main surface 18 of the blank 10. Specifically, the second vertical wiring 82 extends upward along the second end 23b of the third inductor wiring 23 and extends to the side opposite to the fourth through-hole wiring 94 penetrating the fifth magnetic portion 26e and the third inductor wiring 23 penetrating the fourth through-hole wiring 94, and has a second columnar wiring 52 penetrating the sixth magnetic portion 26f.

[0106] The first vertical wiring 81 and the second vertical wiring 82 comprise conductive materials, such as low-resistance metals including copper, silver, and gold. It is preferable to use conductors comprising copper or copper compounds as the first vertical wiring 81 and the second vertical wiring 82. By using the materials described above, the manufacturing cost of the first and second vertical wirings 81 and 82 can be reduced, and the DC resistance in the first and second vertical wirings 81 and 82 can be lowered. The first and second vertical wirings 81 and 82 can be formed by copper plating through SAP (Semi-Additive Process). If SAP is used, low-resistance first and second vertical wirings 81 and 82 can be obtained inexpensively. It should be noted that the first and second vertical wirings 81 and 82 can be formed by plating methods other than SAP, sputtering, vapor deposition, coating, etc.

[0107] The first and second external terminals 41 and 42 are electrically connected to the first to third inductor wirings 21 to 23 and are disposed on the first main surface 18 of the blank 10. Specifically, the first external terminal 41 is disposed on the surface of the first vertical wiring 81 disposed on and exposed from the first main surface 18. The second external terminal 42 is disposed on the surface of the second vertical wiring 82 disposed on and exposed from the first main surface 18. It should be noted that in this embodiment, the first and second external terminals 41 and 42 are only disposed on the first main surface 18, but they can be disposed on the first end face 15 and the first main surface 18 adjacent to the first end face 15, and the second end face 16 and the first main surface 18 adjacent to the second end face 16. Additionally, the first external terminal 41 can be disposed on the first end face 15 of the blank body 10 and a portion of the first side face 13, the second side face 14, the second main face 17, and the first main face 18 adjacent to the first end face 15. The second external terminal 42 can be disposed on the second end face 16 and a portion of the first side face 13, the second side face 14, the second main face 17, and the first main face 18 adjacent to the second end face 16.

[0108] Viewed from above, the first external terminal 41 covers the exposed surface of the first vertical wiring 81. The second external terminal 42 covers the exposed surface of the second vertical wiring 82. The areas of the first and second external terminals 41 and 42 are larger than the areas of the first and second vertical wirings 81 and 82. It should be noted that, when viewed from the first main surface 18, the areas of the first and second external terminals 41 and 42 may be smaller than the areas of the first and second vertical wirings 81 and 82.

[0109] The first and second external terminals 41 and 42 are formed of low-resistance metals such as copper, silver, and gold. Conductors made of copper or copper compounds can be used as the first and second external terminals 41 and 42. By having the above-described configuration, the manufacturing cost of the first and second external terminals 41 and 42 can be reduced, and the DC resistance in the first and second external terminals 41 and 42 can be lowered. The first and second external terminals 41 and 42 are preferably laminated in the order of copper, nickel, and gold. As an example of the first and second external terminals 41 and 42, 5μm, 5μm, and 0.1μm layers are laminated in the order of copper, nickel, and gold. It should be noted that the first and second external terminals 41 and 42 can have different compositions.

[0110] The first to third inductor wirings 21 to 23, the first and second vertical wirings 81 and 82, and the first and second external terminals 41 and 42 can be made of copper as the main conductor. This configuration improves the bonding strength and conductivity between the first to third inductor wirings 21 to 23, the first and second vertical wirings 81 and 82, and the first and second external terminals 41 and 42. The first and second external terminals 41 and 42 are preferably made of copper plating formed by SAP (Solid Polymerization). By using the SAP method, low-resistance first and second external terminals 41 and 42 can be obtained inexpensively. It should be noted that the first and second external terminals 41 and 42 can be formed by plating methods other than SAP, sputtering, vapor deposition, coating, etc.

[0111] Rust prevention treatment can be applied to the first and second external terminals 41 and 42. Rust prevention treatment refers to forming a film with nickel (Ni), gold, tin (Sn), etc. By performing rust prevention treatment, copper corrosion and rust caused by solder can be suppressed, and the installation reliability of inductor component 1 can be improved.

[0112] A coating film 50 is disposed on the surface of the magnetic layer 11. The coating film 50 covers a portion of the first main surface 18, exposing the end faces of the first and second external terminals 41 and 42. This improves the insulation between the external terminals 41 and 42. Furthermore, the coating film 50 can conceal scratches on the first main surface 18 of the blank 10. It should be noted that the coating film 50 may not be provided. Alternatively, the coating film 50 may be disposed on a surface other than the first main surface 18. Additionally, a portion of the first and second external terminals 41 and 42 may cover a portion of the exposed surface of the coating film 50.

[0113] The thickness of the coating 50 is not particularly limited and can range from 1 μm to 20 μm. For example, the thickness of the coating 50 is 10 μm.

[0114] The coating 50 is made of a non-magnetic insulating material that does not contain magnetic materials. For example, the coating 50 is formed from photoresist, solder resist, or dry film resist containing organic insulating resins such as epoxy resin, phenolic resin, and polyimide resin. It should be noted that the coating 50 can be made of the same material as the insulating layer 31, or it can be made of a different material.

[0115] The magnetic layer 11 will be described in detail below.

[0116] like Figure 3A As shown, the magnetic layer 11 comprises: resin 72, first metallic magnetic powder 73, first iron oxide magnetic powder 74, and voids 71. The average particle size of the first metallic magnetic powder 73 is larger than the average particle size of the first iron oxide magnetic powder 74. It should be noted that... Figure 3B It is recorded Figure 3A A simplified diagram of the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74. Figure 3B The void portion 71 and the resin portion 72 are omitted.

[0117] Previously, attempts were made to increase the filling rate of the magnetic layer by using only the first metallic magnetic powder as the magnetic material. However, if the filling rate of the first metallic magnetic powder is increased, the first metallic magnetic powder particles come into contact with each other, resulting in an increase in the loss tanδ of the magnetic material due to eddy current losses, making it difficult to increase the filling rate of the first metallic magnetic powder.

[0118] In contrast, in this embodiment, first metallic magnetic powder 73 and first iron oxide magnetic powder 74 are used as magnetic material 70. Since the average particle size of the first iron oxide magnetic powder 74 is smaller than the average particle size of the first metallic magnetic powder 73, the first iron oxide magnetic powder 74 can be disposed between the first metallic magnetic powders 73. In this embodiment, by using the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74, the filling rate of the magnetic material 70 can be increased while ensuring insulation, thereby improving permeability. Furthermore, the gaps 71 can be used to alleviate stress generated by heat, etc. In summary, an inductor component 1 with good inductance efficiency can be obtained. It should be noted that "filling rate of magnetic material 70" refers to the ratio of the area of ​​the magnetic material 70 on any cross-section orthogonal to the first side surface 13 and the second side surface 14, and the second main surface 17 and the first main surface 18 of the magnetic layer 11, to the area of ​​the magnetic layer 11.

[0119] The average particle size refers to the arithmetic mean obtained by scanning electron microscopy (SEM) on a cross section orthogonal to the first principal surface 18 and the second principal surface in the inductor component 1 and the magnetic layer 11. Specifically, in SEM images at magnifications that can confirm more than 15 first metallic magnetic powders 73, the area of ​​each first metallic magnetic powder 73 is measured, the equivalent circle diameter is calculated from {4 / π × (area)}^(1 / 2), and the arithmetic mean of these is taken as the average particle size of the first metallic magnetic powder 73. If the outline of the first metallic magnetic powder 73 is unclear in the SEM image, image processing can be used. It should be noted that in the raw material state of the first metallic magnetic powder 73, the average particle size is the median particle size D50, which refers to the particle size equivalent to 50% of the cumulative value in the particle size distribution obtained by laser diffraction and scattering.

[0120] The first metallic magnetic powder 73 can be, for example, a magnetic metal containing iron (Fe). The first metallic magnetic powder 73 can contain monolithic iron or can be an iron-containing alloy. For example, the first metallic magnetic powder 73 is an iron-silicon alloy such as an iron-copper (Cu) alloy, an iron-silicon (Si)-chromium (Cr) alloy, an iron-cobalt (Co) alloy, a permalloy (NiFe) alloy, or an amorphous alloy thereof. Carbonyl iron (carbonyl Fe, Fe(CO)5) is preferably cited as the first metallic magnetic powder 73.

[0121] The first metallic magnetic powder 73 preferably contains Fe and does not contain O. Here, "not containing O" means that the elemental proportion of oxygen in the first metallic magnetic powder 73 is less than 5% by mass, and preferably 0% by mass.

[0122] The first metallic magnetic powder 73 is not necessarily spherical, but is preferably spherical. It should be noted that in this specification, "spherical" includes not only spheres with a constant diameter, but also partially damaged or deformed spheres. The average particle size of the first metallic magnetic powder 73 is, for example, 0.5 μm to 2.5 μm. Here, the average particle size is a value measured using SEM.

[0123] The first metallic magnetic powder 73 may have an insulating coating portion on its surface. That is, the first metallic magnetic powder 73 may have a metallic magnetic powder portion and an insulating coating portion disposed on the surface of the metallic magnetic powder portion.

[0124] The first ferric oxide magnetic powder 74 contains, for example, ferrous oxide (II) (FeO) and ferric oxide (III) (Fe3O4).

[0125] The first ferric oxide magnetic powder 74 may further contain other atoms. Examples of other atoms include Cu, Al, Zr, and C. The first ferric oxide magnetic powder 74 containing other atoms can be obtained, for example, by adding it to a slurry of ferric oxide. By adding other atoms, lattice defects in the first ferric oxide magnetic powder 74 can be reduced, and crystallinity can be controlled. For example, the first ferric oxide magnetic powder 74 may contain 50% to 69% by mass of Fe and 19.5% to 24.7% by mass of O. Furthermore, the first ferric oxide magnetic powder 74 may contain 19.5% to 24.7% by mass of C, 2.2% to 2.5% by mass of Cu, 1.5% to 1.7% by mass of Zr, and less than 1.2% by mass of Al.

[0126] In this disclosure, the average particle size of the first iron oxide magnetic powder 74 is determined using the same method as that of the first metallic magnetic powder 73.

[0127] The first ferric oxide magnetic powder 74 is not necessarily spherical, but is preferably spherical. The average particle size of the first ferric oxide magnetic powder 74 is, for example, 0.01 μm to 0.5 μm.

[0128] The resin 72 preferably contains at least one of an epoxy resin and an acrylic resin. This improves the insulation of the magnetic layer 11. Furthermore, the stress-relieving effect of the resin 72 can be used to improve the mechanical strength of the magnetic layer 11.

[0129] The void portion 71 is contained within the resin 72 and the magnetic material 70. The void portion 71 may be in contact only with the resin 72, or it may be in contact with both the resin 72 and the magnetic material 70. The void portion 71 may be formed, for example, by sintering the composition containing the resin 72 and the magnetic material 70. It should be noted that, hereinafter, the composition containing the resin 72 and the magnetic material 70 will sometimes be referred to as composition C.

[0130] Preferably, at least one first metallic magnetic powder 73 is in contact with at least one first iron oxide magnetic powder 74. With this configuration, the filling rate of the magnetic material 70 increases. Here, "contact" means that at least one first metallic magnetic powder 73 is in contact with at least one first iron oxide magnetic powder 74 on any cross-section orthogonal to the first side surface 13 and the second side surface 14, and the first main surface 18 and the second main surface 17. It should be noted that when the first metallic magnetic powder 73 has an insulating coating portion, the contact between the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74 refers to the contact between the insulating coating portion and the first iron oxide magnetic powder 74.

[0131] The contact between the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74 can be confirmed using images obtained by SEM. To obtain SEM images, firstly, a cross-section of the central portion of the inductor component 1 is exposed using a polishing method. Then, an image of a portion of the magnetic layer 11 in the cross-section of the inductor component 1 is obtained using SEM. Next, at an appropriate magnification, images of at least three different locations in the vertical direction (Z direction) are obtained from the magnetic layer 11 portion in the cross-section of the inductor component 1. By confirming the obtained SEM images, the contact between the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74 is confirmed. It should be noted that the SEM magnification can be appropriately varied depending on the size of the first metallic magnetic powder 73, but it is preferable to be able to confirm at least 15 magnifications of the first metallic magnetic powder 73, for example, in the range of 500x to 5000x, preferably measured at 5000x. The central portion of the inductor component 1 refers to the portion that is orthogonal to the first main surface 18 and the second main surface 17, as well as the first side surface 13 and the second side surface 14, and includes a portion of the inner magnetic circuit portion 24 of the first and second inductor wirings 21 and 22.

[0132] Preferably, at least one first metallic magnetic powder 73 is in contact with at least one first iron oxide magnetic powder 74 and at least one void 71. Even if the first metallic magnetic powder 73 experiences stress due to expansion caused by thermal stress, contact between the first metallic magnetic powder 73 and the void 71 can alleviate the stress in the void 71. Furthermore, since the coefficient of linear expansion of the first iron oxide magnetic powder 74 differs from that of the first metallic magnetic powder 73, a difference in coefficient of linear expansion occurs between them. However, by contacting the void 71 with the first metallic magnetic powder 73, the void 71 can absorb this difference in coefficient of linear expansion, thereby more effectively alleviating the stress. Moreover, since the resistance of the first iron oxide magnetic powder 74 is greater than that of the first metallic magnetic powder 73, contact between the first iron oxide magnetic powder 74 and the first metallic magnetic powder 73 can ensure the insulation between the first metallic magnetic powders 73 and suppress iron loss.

[0133] (Variation example)

[0134] Figure 4 This is an explanatory diagram of a first modified example of the inductor component 1 according to the first embodiment. Figure 5 This is a partially enlarged view of a first modified example of the inductor component 1 according to the first embodiment. For example... Figure 4 As shown, in this modified example, the inductor component includes: a blank 10 (magnetic layer 11), a first inductor wiring 21 disposed on the blank 10, and an insulating layer 31 in surface contact with the second main surface 17 side of the first inductor wiring 21. Figure 5 As shown, in this modified example, the inductor component includes a blank 10 (magnetic layer 11) and a first vertical wiring 81. It should be noted that the description in the explanatory drawings is simplified and sometimes does not reflect the actual dimensions and ratios.

[0135] like Figure 4 and Figure 5 As shown, in the magnetic layer 11, at least one first metallic magnetic powder 73 is in contact with the first inductor wiring 21, at least one void 71, and at least one first iron oxide magnetic powder 74. With the above configuration, the fill ratio can be further increased, resulting in an inductor component 1 with good inductance efficiency. It should be noted that, as... Figure 5 As shown, in the magnetic layer 11, at least one first metallic magnetic powder 73 can contact the first vertical wiring 81, at least one void 71, and at least one first iron oxide magnetic powder 74. It should be noted that while the first inductor wiring 21 and the first vertical wiring 81 are listed in this variation, they could also be a second inductor wiring 22, a third inductor wiring 23, or a second vertical wiring 82.

[0136] In a modified example, preferably at least one first metallic magnetic powder 73 is in contact with the first inductor wiring 21, at least one void 71, and at least one first iron oxide magnetic powder 74. With the above configuration, the fill ratio can be further increased, resulting in an inductor component 1 with good inductance efficiency. In this embodiment, since the first inductor wiring 21 can also contact the magnetic layer 11, the inductance efficiency of the inductor component 1 is also improved.

[0137] Preferably, the first metallic magnetic powder 73 contains 95% by mass or more of Fe. By containing a large amount of Fe, the DC superposition characteristics can be improved. There is no particular upper limit to the Fe content in the first metallic magnetic powder 73, for example, it can be 99% by mass or less. In this disclosure, the element content in the first metallic magnetic powder 73 is obtained by measuring the central portion of the first metallic magnetic powder 73 using energy-dispersive X-ray spectroscopy (also known as "EDX"). For example, the element content can be obtained by measuring the element content at four points and calculating their average value. It should be noted that "central" includes not only the complete central portion but also a roughly central portion.

[0138] Preferably, the first metallic magnetic powder 73 contains 1% to 5% by mass of Cu. By containing this amount of Cu, the influence of the demagnetizing field within the first metallic magnetic powder 73 can be reduced. Furthermore, by containing this amount of Cu, compared to the case containing only Fe, the hardness of the first metallic magnetic powder 73 can be reduced.

[0139] The preferred first ferric oxide magnetic powder 74 contains 50% by mass or more of Fe. There is no particular upper limit to the Fe content in the first ferric oxide magnetic powder 74; for example, it can be 85% by mass or less, or 70% by mass or less. In the first ferric oxide magnetic powder 74, by keeping the Fe content below a specified level, the electrical conductivity decreases, the eddy currents between the magnetic particles decrease, and thus iron loss can be suppressed. By keeping the Fe content above a specified level, the DC superposition characteristics are improved.

[0140] The first ferric oxide magnetic powder 74 may contain carbon (C), oxygen (O), copper (Cu), zirconium (Zr), aluminum (Al), etc., along with Fe. For example, it may contain 19% to 25% by mass of C, 5% to 17% by mass of O, 2.2% to 2.5% by mass of Cu, 1.5% to 1.7% by mass of Zr, and less than 1.2% by mass of Al. The content of the elements contained in the first ferric oxide magnetic powder 74 is obtained by measuring the center of the first ferric oxide magnetic powder 74 using EDX in the same manner as the first metallic magnetic powder 73. It should be noted that the first ferric oxide magnetic powder 74 may not contain C, O, Cu, Zr, and Al.

[0141] Preferably, the average particle size of the first metallic magnetic powder 73 is 0.5 μm to 2.5 μm, and the average particle size of the first iron oxide magnetic powder 74 is 0.01 μm to 0.5 μm. The average particle size of the first metallic magnetic powder 73 is more than five times the average particle size of the first iron oxide magnetic powder 74. By micronizing the magnetic material 70, especially the first iron oxide magnetic powder 74, iron loss can be suppressed, and the inductor component 1 can be used in a power inductor that performs high-speed switching operation at high frequencies, specifically 50 MHz to 100 MHz. In addition, by making the average particle size of the first iron oxide magnetic powder 74 smaller than the average particle size of the first metallic magnetic powder 73, the particles of the first metallic magnetic powder 73 can move on the particles of the first iron oxide magnetic powder 74 using a ball bearing effect, thereby increasing the filling rate of the magnetic material 70.

[0142] Preferably, the filling rate of the first metallic magnetic powder 73 in the magnetic layer 11 is greater than the filling rate of the first iron oxide magnetic powder 74. With the above configuration, an inductor component 1 with high DC superposition characteristics can be provided. It should be noted that "the filling rate of the first metallic magnetic powder 73" refers to the area ratio of the first metallic magnetic powder 73 on any cross-section orthogonal to the first side surface 13 and the second side surface 14, and the first main surface 18 and the second main surface 17 of the magnetic layer 11. "The filling rate of the first iron oxide magnetic powder 74" refers to the area ratio of the first iron oxide magnetic powder 74 on any cross-section orthogonal to the first side surface 13 and the second side surface 14, and the first main surface 18 and the second main surface 17 of the magnetic layer 11.

[0143] Preferably, the first metallic magnetic powder 73 includes an insulating coating portion, and at least one of the aforementioned insulating coating portions is in contact with at least one first iron oxide magnetic powder 74. By including the insulating coating in the first metallic magnetic powder 73, the contact between metals can be reduced, thereby reducing iron loss in the magnetic layer 11.

[0144] For example, the first iron oxide magnetic powder 74 can contain iron (Fe) and oxygen (O), with 60% to 85% by mass of Fe and a relatively high O content, second only to Fe. The conductivity of the first metallic magnetic powder 73 is more than 10 times higher than that of the first iron oxide magnetic powder 74. If the Fe content in the first iron oxide magnetic powder 74 is too high, the conductivity will be high, the eddy currents between the magnetic powders will be large, and iron loss will increase. If the Fe content is too low, the DC superposition characteristic will be low. In contrast, by making the Fe content within the above range and the O content relatively high, second only to Fe, iron loss can be suppressed. It should be noted that the conductivity of the first metallic magnetic powder 73 can be 10 times that of the first iron oxide magnetic powder 74. 7 Less than twice. It should be noted that the first iron oxide magnetic powder 74 can contain atoms other than O based on Fe.

[0145] Preferably, the coefficient of linear expansion of the first metallic magnetic powder 73 is greater than that of the first iron oxide magnetic powder 74. If the stress of the first metallic magnetic powder 73 is high, it will deform. Therefore, by adding the first iron oxide magnetic powder 74 with a small coefficient of linear expansion, the internal stress of the inductor component 1 can be mitigated.

[0146] Preferably, the roundness of the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74 is greater than 0.9. With the above configuration, the magnetic powders can slide against each other using a ball bearing effect, further improving the filling rate. Roundness is determined by 4π × (area) / (perimeter). 2 The area and perimeter are determined using image processing software, such as WinROOF2018 (manufactured by Mitani Corporation). Specifically, the roundness is calculated for each of the more than 10 aggregated parts on any cross-section, and the average value is taken as the roundness.

[0147] The magnetic layer 11 may further include a second metallic magnetic powder. With the above configuration, the characteristics of the inductor component 1 can be adjusted. By changing the mixing ratio of the first metallic magnetic powder 73 to the second metallic magnetic powder, the balance between the effective permeability and the DC superposition characteristics can be altered.

[0148] Preferably, the first metallic magnetic powder 73 is a carbonyl iron-based magnetic powder, and the second metallic magnetic powder is an amorphous alloy-based magnetic powder, with the average particle size of the second metallic magnetic powder being larger than that of the first metallic magnetic powder 73. For example, by using materials that are easily oxidized, such as chromium (Cr), the resistivity of the amorphous alloy-based resin powder used as the second metallic magnetic powder can be increased. As a result, even if the average particle size of the amorphous alloy-based resin powder is large, eddy current losses can be suppressed and the permeability can be improved. Furthermore, by using the carbonyl iron-based resin powder as the first metallic magnetic powder 73 together with the amorphous alloy-based resin powder, the filling rate and permeability can be improved. By using the first iron oxide magnetic powder 74 together with the first metallic magnetic powder 73 and the second metallic magnetic powder, the particles of the first metallic magnetic powder 73 and the second metallic magnetic powder can move on the particles of the first iron oxide magnetic powder 74 using a ball bearing effect, thereby further improving the filling rate.

[0149] (Example)

[0150] The SEM image of inductor component 1 is shown below. Figure 3A The measuring apparatus was energy-dispersive X-ray spectroscopy (SEM-EDX) (MicrotracBEL, MT3300-EX), with a magnification of 5000x. In the examples, epoxy resin was used as resin 72, carbonyl iron as the first metallic magnetic powder 73, and magnetite (Fe3O4) as the first iron oxide magnetic powder 74. Figure 3AAs shown, the magnetic layer 11 comprises resin 72, first metallic magnetic powder 73, first iron oxide magnetic powder 74, and voids 71, with the first metallic magnetic powder 73 in contact with the first iron oxide magnetic powder 74 and the voids 71. It should be noted that... Figure 3B The text shows the record. Figure 3A A simplified diagram of the first metallic magnetic powder 73 and the first iron oxide magnetic powder 74.

[0151] Table 1 shows the elemental analysis results of the first metallic magnetic powder 73, and Table 2 shows the elemental analysis results of the first iron oxide magnetic powder 74. According to Table 1, the first metallic magnetic powder 73 contains more than 95% by mass of Fe and 1% to 5% by mass of Cu. It should be noted that the elemental analyses in Tables 1 and 2 are values ​​determined using SEM-EDX.

[0152]

[0153]

[0154] It should be noted that only the major elements are listed in Table 2. Therefore, there are spectra where the total stoichiometry is not 100%. Furthermore, since the particle size of the first ferric oxide magnetic powder 74 is smaller than the resolution of SEM-EDX, the C and O values ​​in Table 2 are sometimes higher than the original composition due to the influence of the surrounding resin 72. Therefore, for more accurate elemental analysis values ​​of the first ferric oxide magnetic powder 74, it is preferable to use SEM-EDX to determine the first ferric oxide magnetic powder 74 before mixing.

[0155] With the above configuration, the Q value is above 20 at 100MHz, which is excellent.

[0156] (Manufacturing method)

[0157] Figures 6A to 6M This is a VI-VI cross-sectional view showing the manufacturing process of inductor component 1. Figures 7A to 7F This is section VII-VII, showing the manufacturing process of inductor component 1. Using... Figures 6A to 6M and Figures 7A to 7F The manufacturing method of inductor component 1 will be described.

[0158] like Figure 6A As shown, a dummy core substrate 100 is prepared. In this embodiment, the dummy core substrate 100 is a glass epoxy board. Since the thickness of the dummy core substrate 100 does not affect the thickness of the inductor components, a substrate of a thickness and material that is generally easy to handle can be used to avoid warping during processing.

[0159] like Figures 6B to 6E As shown, a first layer with a first inductor wiring 21 is formed.

[0160] First, such as Figure 6B As shown, an insulating material is laminated onto the first main surface 100a of the dummy core substrate 100 using a vacuum laminator, patterned by photolithography, and then cured. Thus, on the YZ cross section, as shown... Figure 6B As shown, from right (second side 14 side of inductor component 1) to left (first side 13 side of inductor component 1), a first opening 101, a first insulating portion 111a, a second insulating portion 111b, and another first opening 101 are formed sequentially. The width of the first insulating portion 111a is approximately twice the width of the second insulating portion 111b. It should be noted that an insulating layer can be formed using a press instead of a vacuum laminator. The aforementioned first insulating portion and the aforementioned second insulating portion 111b form the first insulating layer 111.

[0161] Next, as Figure 6C As shown, a first seed layer 112 is formed on the first insulating layer 111. Specifically, the seed layer is spirally disposed on the side of the first insulating layer 111 opposite to the dummy core substrate 100 by sputtering. A photoresist is disposed on the side of the seed layer opposite to the first insulating layer 111, and the seed is etched by photolithography, after which the photoresist is removed. This forms the first seed layer 112. It should be noted that the width of the first seed layer 112 is smaller than the width of the first insulating layer 111. The first seed layer 112 is a titanium (Ti) / copper (Cu) laminate, with titanium present on the first insulating layer 111.

[0162] The insulating portion is further laminated in a manner that covers the first insulating layer 111 and the first seed layer 112 when viewed from the first main surface 100a side, and patterned by photolithography. Thus, as... Figure 6D As shown, a first insulating portion 311 is provided on the first insulating layer 111, and a second opening 102 is provided in the area surrounded by the first insulating portion 311.

[0163] Subsequently, power is supplied from the first seed crystal layer 112, and electroplating is used to deposit the first plated portion onto the first seed crystal layer 112. Thus, as... Figure 6E As shown, a first inductor wiring 21 is formed on the first seed layer 112. It should be noted that since no seed layer is provided in the first opening 101, no plating portion is formed in the first opening 101.

[0164] The first layer, including the first inductor wiring 21, is formed as described above. Next, as shown below... Figure 6F and Figure 7A , Figure 6G and Figure 7B As shown, a second layer with a second inductor wiring 22 and a third inductor wiring 23 is formed on the first layer.

[0165] First, an insulating material is laminated as the first layer, patterned using photolithography, and then cured. Thus, as... Figure 6F and Figure 7A As shown, a second insulating layer 121 is provided on the first layer. Furthermore, as... Figure 7A As shown, an opening 151 for a first through-hole is provided in the second insulating layer 121, exposing at least a portion of the outer peripheral end 21b of the first inductor wiring 21. Although not shown, an opening for a second through-hole is provided in the second insulating layer 121, exposing at least a portion of the inner peripheral end 21a of the first inductor wiring 21. It should be noted that, as Figure 6F As shown, the second insulating layer 121 has a first insulating portion 121a on the right side and a second insulating portion 121b on the left side, as... Figure 7A As shown, it has a third insulating portion 121c. The width of the first insulating portion 121a is approximately twice the width of the second insulating portion 121b.

[0166] Next, as Figure 6G and Figure 7B As shown, a second seed layer 122 is formed on the side of the second insulating layer 121 opposite to the first inductor wiring 21, using the same method as the first seed layer 112. Specifically, as... Figure 6G As shown, a first seed crystal portion 122a and a second seed crystal portion 122b are provided on the first insulating portion 121a. A third seed crystal portion 122c is provided on the second insulating portion 121b. Figure 7B As shown, a fourth seed layer 122d is provided on the third insulating portion 121c. At this time, a second seed layer 122 is also provided on the first via opening 151 and the second via opening. Subsequently, the second insulating portion 312 is formed using the same method as that used to form the first insulating portion 311. Then, using the same electroplating method as that used to form the first inductor wiring 21, the second inductor wiring 22 is formed on the surface opposite to the second insulating layer 121 on the first to third seed layers 122a to 122c, specifically forming second inductor wirings 221, 222, and 223. Similarly, a third inductor wiring 23 is formed on the surface opposite to the second insulating layer 121 on the fourth seed layer 122d. At this time, a second via wiring 92 is formed on the first via opening 151, and a first via wiring 91 is formed on the second via opening.

[0167] The above forms a second layer including the wiring 22, 23 for the second and third inductors. Next, as shown below... Figure 6H , Figure 7C and Figure 7D As shown, a third layer is formed on the second layer.

[0168] First, an insulating material is laminated over a second layer, patterned using photolithography, and then cured. Thus, as... Figure 6H As shown, a third insulating layer 131 is disposed on the surface of the second inductor wiring 22 opposite to the second seed layer 122, such as... Figure 7C As shown, a fourth insulating layer 141 is provided on the surface of the third inductor wiring 23 opposite to the second seed layer 122. Furthermore, as... Figure 7C As shown, a fourth through-hole opening 152 is provided in the fourth insulating layer 141, exposing the second end 23b side of the third inductor wiring 23. Although not shown, a third through-hole opening is provided in the fourth insulating layer 141, exposing the outer peripheral end 22b side of the second inductor wiring 22.

[0169] Next, as Figure 7D As shown, a third seed layer 142 is formed on and around the fourth via opening 152 using the same method as the first seed layer 112. Subsequently, a second vertical wiring 82 is formed on the third seed layer 142 using the same electroplating method as the formation method of the first inductor wiring 21. At this time, the second vertical wiring 82 has a fourth via wiring 94 and a second columnar wiring 52. Although not shown, a third seed layer 142 is formed on and around the third via opening using the same method as the first seed layer 112, and then a first vertical wiring 81 is formed on the third seed layer 142 using the same electroplating method as the formation method of the first inductor wiring 21. It should be noted that in this disclosure, no insulating portion is provided around the first vertical wiring 81 and the second vertical wiring 82 during their formation; however, insulating portions can be provided before forming the first vertical wiring 81 and the second vertical wiring 82.

[0170] The above forms a third layer including the first vertical wiring 81 and the second vertical wiring 82.

[0171] Next, as Figure 5 , Figure 6I and Figure 7EAs shown, resin 72 and magnetic material 70 are added to form a magnetic layer 11a. At this time, as shown, voids 71 ​​are formed within the magnetic layer 11a. Pressure is applied during hot pressing of the magnetic material 70. If this pressure is applied before the melt viscosity of the magnetic material 70 has completely decreased, the flow of the magnetic material 70 decreases, so the magnetic material 70 is filled with air. Then, the magnetic material 70 is heated, and if the melt viscosity of the magnetic material 70 decreases further, the magnetic material 70 is fully filled, and the magnetic material 70 begins to solidify with the aforementioned air contained within it. This forms voids 71. It should be noted that voids 71 ​​can be formed using other methods. For example, a small molecular weight additive can be added to the interior of the magnetic material 70, and the additive can be decomposed during the solidification of the magnetic material 70, thereby forming voids 71 ​​in the areas where the additive is present. Alternatively, the two methods described above can be combined, or other methods can be used to form voids 71. Alternatively, if the magnetic material 70 is not exposed above the first vertical wiring 81 and the second vertical wiring 82, it can be exposed by grinding to remove the magnetic material 70.

[0172] like Figure 6J and Figure 7F As shown, a coating film 50 is provided on the upper (second main surface). Through holes are formed in the coating film 50 in the area where external terminals are formed, exposing the end faces of the first vertical wiring 81 and the second vertical wiring 82. Thereafter, the first external terminal 41 is provided in a manner connected to the first vertical wiring 81, and the second external terminal 42 is provided in a manner connected to the second vertical wiring 82.

[0173] Then, the dummy core substrate 100 is removed by cutting. For example... Figure 6K As shown, resin 72 and magnetic material 70 are added to the surface in contact with the dummy core substrate 100, and then stamped to form a magnetic layer 11b. It should be noted that other compositions besides resin 72 and magnetic material 70 can be used. It should be noted that magnetic layers 11a and 11b form magnetic layer 11.

[0174] like Figure 6L As shown, multiple portions arranged in a matrix to form inductor components are monolithically formed into inductor component units along line D. Thus, as... Figure 6M As shown, inductor component 1 is formed.

[0175] <Second Implementation>

[0176] The structure of the inductor component in the second embodiment is shown in the same manner as that of the inductor component 1 in the first embodiment. Figure 1 and Figure 2 It should be noted that the configurations described below are the same as those in the first embodiment, except for those described below, and their descriptions are omitted.

[0177] The second embodiment differs from the first embodiment in that it contains a magnetic material and a first metallic magnetic powder. This difference in configuration will be described below. The other configurations are the same as in the first embodiment, and the symbols used in the first embodiment are omitted from the description.

[0178] In the second embodiment, the first metallic magnetic powder contains Fe and two metals selected from those other than Fe. The first metallic magnetic powder contains 80% to 90% Fe by mass. By making the first metallic magnetic powder an alloy containing Fe and two metals selected from those other than Fe, magnetic saturation is more likely to occur compared to the case where carbonyl iron-based magnetic powder is used.

[0179] The metal can be any metal other than Fe, such as chromium (Cr), copper (Cu), zirconium (Zr), aluminum (Al), titanium (Ti), and silicon (Si). It should be noted that, in this disclosure, following conventional practice, Si is considered as a metal for convenience.

[0180] Of the two materials mentioned above besides Fe, Si and Cr are preferred. Specifically, FeSiCr can be used as the first metallic magnetic powder. By including Si and Cr in the first metallic magnetic powder, the crystal structure of the first metallic magnetic powder is deformed, resulting in a higher permeability of the magnetic layer 11 compared to the case using carbonyl iron-based magnetic powder. In particular, by including Si, the crystal structure of the first metallic magnetic powder is deformed, which improves the permeability of the magnetic layer 11 compared to the case containing only Fe. Since Cr is easily oxidized, if Cr is present on the surface of the first metallic magnetic powder, the surface Cr will oxidize, preventing oxidation into the interior of the first metallic magnetic powder. In summary, by including Si and Cr in the first metallic magnetic powder, a balance between magnetic saturation and the permeability of the magnetic layer 11 can be achieved, thereby improving the permeability of the magnetic layer 11 and enhancing the reliability of the inductor component.

[0181] Preferably, the combined content of Si and Cr relative to the first metallic magnetic powder is 10% by mass or less, and the content of Si is greater than the content of Cr. There is no particular limitation on the lower limit of the combined content of Si and Cr, for example, it can be 1% by mass or more. If the content of Cr is too high, the magnetic properties deteriorate. Therefore, to some extent, a lower Cr content can achieve higher inductance efficiency.

[0182] <Third Implementation Method>

[0183] In the third embodiment, based on the first embodiment, the magnetic layer 11 includes agglomerates 75. In the third embodiment, the shapes of the first and second inductor wirings 21B and 22B, and the shape of the insulating layer 31B, differ from those in the first embodiment. Furthermore, in the third embodiment, the third inductor wiring 23 is absent. All other configurations are the same as in the first embodiment, and their description is omitted.

[0184] Figure 8 This is an explanatory diagram illustrating a portion of the magnetic layer in the third embodiment. Figure 9 This is a partially enlarged view of the magnetic layer in the third embodiment.

[0185] like Figure 8 and Figure 9 As shown, in the third embodiment, the magnetic layer 11B further includes an agglomeration portion 75. This agglomeration portion 75 is formed by the agglomeration of multiple second iron oxide magnetic powders. Since the average particle size of the agglomeration portion 75 is more than twice the average particle size of the first metal magnetic powder 73, the composition of the second iron oxide magnetic powder is the same as that of the first iron oxide magnetic powder 74. Figure 9 In this embodiment, the first metallic magnetic powder 73 is carbonyl iron, and the first iron oxide magnetic powder 74 and the second iron oxide magnetic powder are magnetite. By including the agglomeration section 75, the second iron oxide magnetic powder (i.e., the first iron oxide magnetic powder 74) agglomerates, and magnetic materials other than the first iron oxide magnetic powder 74, i.e., the first metallic magnetic powder 73, can be further added. As a result, the DC superposition characteristics of the inductor component 1B can be improved. Here, the average particle size of the agglomeration section 75 is measured using the same method as that of the first metallic magnetic powder 73. It should be noted that the composition of the second iron oxide magnetic powder may differ from that of the first iron oxide magnetic powder 74. In addition, the first metallic magnetic powder 73 may be the first metallic magnetic powder in the second embodiment.

[0186] The average particle size of the aggregated portion 75 is not particularly limited; for example, it can be less than 50 times the average particle size of the first metallic magnetic powder 73, or less than 40 times. If the average particle size of the aggregated portion 75 is too large, the first iron oxide magnetic powder 74 will not exist between the first metallic magnetic powder 73. As a result, the insulation between the first metallic magnetic powder 73 will decrease, and the loss tanδ of the magnetic material will increase.

[0187] Preferred per 1μm 2 The magnetic layer contains fewer than 0.1 aggregates 75. The lower limit for the aggregates 75 is not particularly limited; for example, it can be less than 1 μm. 2 Magnetic layers can exist for 10 -5 More than one. If there are a large number of aggregates 75, the insulation between the first metallic magnetic powders 73 will decrease, and the loss tanδ of the magnetic material will increase.

[0188] Preferably, the condensation portion 75 is not formed in the inner magnetic circuit portion 24. That is, the condensation portion 75 is formed on at least one of the outer magnetic circuit portion 25, the first magnetic portion 26a, the third magnetic portion 26c, the fifth magnetic portion 26e, and the sixth magnetic portion 26f. More preferably, the condensation portion 75 is formed on at least one of the first magnetic portion 26a, the third magnetic portion 26c, and the fourth magnetic portion 26d. With the above configuration, the efficiency of inductance is increased.

[0189] (Manufacturing method)

[0190] The manufacturing method of inductor component 1B is described.

[0191] like Figure 10A As shown, a dummy core substrate 100B is prepared. Copper foil is provided on both sides of the dummy core substrate 100B. In this embodiment, the dummy core substrate 100B is a glass epoxy board. Since the thickness of the dummy core substrate 100B does not affect the thickness of the inductor array components, a substrate of easily manageable thickness and material can be used to avoid warping during processing.

[0192] Next, copper foil 110B is bonded to the surface of the substrate copper foil. Copper foil 110B is bonded to the smooth surface of the substrate copper foil. Therefore, the adhesion between copper foil 110B and the substrate copper foil is weakened, making it easier to peel the dummy core substrate 100B from copper foil 110B in subsequent processes. The adhesive used to bond the dummy core substrate 100B to the dummy metal layer (copper foil 110B) is preferably a low-adhesion adhesive. Furthermore, to weaken the adhesion between the dummy core substrate 100B and copper foil 110B, the bonding surface between the dummy core substrate 100B and copper foil 110B is preferably a glossy surface.

[0193] Then, an insulating layer 301B is laminated on the copper foil 110B. At this time, the insulating layer 301B is heat-pressed using a vacuum laminator or press to heat-cur it.

[0194] like Figure 10B As shown, an opening 102B is formed in the insulating layer 301B by laser processing or the like. Then, as... Figure 10CAs shown, a dummy copper 113B and an inductor wiring 21B are formed on the insulating layer 301B. Specifically, a power supply film (not shown) for SAP is formed on the insulating layer 301B by electroless plating, sputtering, evaporation, etc. After forming the power supply film, a photosensitive resist is coated or attached to the power supply film, and openings of the photosensitive resist are formed at the locations that form the wiring pattern by photolithography. Subsequently, metal wiring corresponding to the dummy copper 113B and the inductor wiring 21B is formed at the openings of the photosensitive resist layer. After forming the metal wiring, the photosensitive resist is removed by reagent stripping, and the power supply film is etched away. Subsequently, this metal wiring is further used as a power supply section, and additional copper electroplating is performed to obtain wiring in a narrow space. In addition, by SAP to... Figure 10B The formed opening 102B is filled with copper.

[0195] Then, as Figure 10D As shown, the dummy copper 113B and inductor wiring 21B are covered with an insulating layer 311B. The insulating layer 311B is then heat-pressed using a vacuum laminator or pressing machine to achieve thermal curing.

[0196] Next, as Figure 10E As shown, openings 122B and 123B are formed in the insulating layer 311B by laser processing or the like. Figure 10F As shown, dummy copper 124B and inductor wiring 22B are formed on insulating layer 311B using the same method as dummy copper 113B and inductor wiring 21B. Then, as... Figure 10G As shown, the dummy copper 124B and the inductor wiring 22B are covered with insulating layer 321B. Next, as... Figure 10H As shown, an opening 132B is formed in the insulating layer 321B by laser processing or the like.

[0197] Then, the dummy core substrate 100B is peeled off from the copper foil 110B. Subsequently, the copper foil 110B is removed by etching or the like, and the dummy copper 113B and dummy copper 124B are removed by etching or the like. Figure 10I As shown, a hole 141B corresponding to the inner magnetic circuit and a hole 142B corresponding to the outer magnetic circuit are formed.

[0198] Subsequently, as Figure 10J As shown, the opening 322B of the insulating layer is formed by laser processing or the like. Then, as... Figure 10K As shown, vertical wiring 81B is formed on insulating layers 301B and 321B by using SAP to fill the opening 322B of the insulating layer. It should be noted that insulating layers 301B, 311B, and 321B form insulating layer 31B.

[0199] Next, as Figure 10LAs shown, an inductor substrate is formed by covering the inductor wiring, insulating layer, and vertical wiring with a magnetic layer 11B. The magnetic layer 11B is then thermo-pressed using a vacuum laminator or pressing machine to achieve thermal curing. At this time, the holes 141B and 142B are also filled with the magnetic layer 11B.

[0200] Then, as Figure 10M As shown, the upper and lower magnetic layers 11B of the inductor substrate are thinned by a grinding process. At this time, by exposing a portion of the vertical wiring 81B, an exposed portion of the vertical wiring 81B is formed on the same plane as the magnetic layer 11B. By grinding the magnetic layer 11B to a thickness sufficient to obtain the desired inductance value, the inductor component can be made thinner.

[0201] Subsequently, as Figure 10N As shown, an insulating resin (coating film) 50B is formed on the surface of the magnetic material using a printing process. Here, an opening 501B is formed on the insulating resin 50B as the external terminal. In this embodiment, a printing process is used, but the opening 501B can also be formed using photolithography. Then, an electroless copper plating, or a plating film of Ni and Au, etc., is applied to the opening 501B to form the external terminal 51B. Next, as... Figure 10O As shown, the inductor component 1B is obtained by cutting along line D to form a single piece. From Figures 10C to 10H The details are omitted, but inductor substrates are formed on both sides of the dummy core substrate 100B. This allows for high productivity. It should be noted that the inductor substrates can be formed on either both sides or one side.

[0202] It should be noted that this disclosure is not limited to the embodiments described above, and design changes can be made without departing from the spirit of this disclosure. For example, the various feature points of the first to third embodiments can be combined in various ways. In addition, the number of inductor wiring layers and the number of via wiring layers can be increased or decreased. The manufacturing method of the inductor component is not particularly limited. For example, the third embodiment can be manufactured by the manufacturing method of the first embodiment, and the first and second embodiments can be manufactured by the manufacturing method of the third embodiment.

[0203] This application claims priority based on Japanese Patent Application No. 2023-168486 filed on September 28, 2023, the entire contents of which are incorporated herein by reference.

[0204] This disclosure includes the following methods.

[0205] <1> A coil component comprising: a blank containing a magnetic layer and a first coil wiring disposed within the blank,

[0206] The aforementioned magnetic layer comprises resin, first metallic magnetic powder, first iron oxide magnetic powder, and voids.

[0207] The average particle size of the first metallic magnetic powder is greater than the average particle size of the first iron oxide magnetic powder.

[0208] <2> According to the coil component described in <1>, at least one of the first metal magnetic powders is in contact with at least one of the first iron oxide magnetic powders.

[0209] <3> According to the coil component described in <2>, at least one of the first metal magnetic powders is in contact with at least one of the first iron oxide magnetic powders and at least one of the void portions.

[0210] <4> The coil component according to <2> or <3> further includes a first vertical wiring that extends from the first end of the first coil wiring inside the blank in such a way that it is exposed to the first main surface of the blank.

[0211] The aforementioned at least one first metallic magnetic powder is in contact with at least one of the aforementioned first vertical wiring and the aforementioned first coil wiring, as well as at least one of the aforementioned gaps and at least one of the aforementioned first iron oxide magnetic powders.

[0212] <5> According to the coil component described in <4>, at least one of the first metal magnetic powders is in contact with the first vertical wiring, at least one of the gaps and at least one of the first iron oxide magnetic powders.

[0213] <6> The coil component according to any one of <1> to <5>, wherein the first metallic magnetic powder contains 95% by mass or more Fe.

[0214] <7> The coil component according to any one of <1> to <6>, wherein the first metallic magnetic powder contains 1% to 5% Cu by mass.

[0215] <8> The coil component according to any one of <1> to <5>, wherein the first metallic magnetic powder contains Fe and two metals selected from metals other than Fe.

[0216] Compared to the first metallic magnetic powder mentioned above, it contains 80% to 90% by mass of the aforementioned Fe.

[0217] <9> The coil component according to <8>, wherein the above two are Si and Cr.

[0218] <10> The coil component according to any one of <8> or <9>, wherein the total content of the above two types relative to the first metallic magnetic powder is 10% by mass or less.

[0219] The content of Si is higher than the content of Cr.

[0220] <11> The coil component according to any one of <1> to <10>, wherein the average particle size of the first metallic magnetic powder is 0.5 μm to 2.5 μm.

[0221] The average particle size of the aforementioned first iron oxide magnetic powder is 0.01 μm to 0.5 μm.

[0222] The average particle size of the first metallic magnetic powder is more than 5 times the average particle size of the first iron oxide magnetic powder.

[0223] <12> The coil component according to any one of <1> to <11>, wherein, in the magnetic layer, the filling rate of the first metal magnetic powder is greater than the filling rate of the first iron oxide magnetic powder.

[0224] <13> The coil component according to any one of <1> to <12>, wherein the first metallic magnetic powder includes an insulating coating portion.

[0225] At least one of the aforementioned insulating coating portions is in contact with at least one of the aforementioned first iron oxide magnetic powders.

[0226] <14> The coil component according to any one of <1> to <13>, wherein the first iron oxide magnetic powder contains Fe and O,

[0227] Containing 60% to 85% by mass of the above-mentioned Fe,

[0228] The O content mentioned above is second only to the Fe content mentioned above.

[0229] The conductivity of the first metallic magnetic powder is more than 10 times higher than that of the first iron oxide magnetic powder.

[0230] <15> The coil component according to any one of <1> to <14>, wherein the coefficient of linear expansion of the first metal magnetic powder is greater than the coefficient of linear expansion of the first iron oxide magnetic powder.

[0231] <16> The coil component according to any one of <1> to <15>, wherein the magnetic layer further includes a condensation portion,

[0232] The aforementioned agglomerated portion is formed by the agglomeration of the second iron oxide magnetic powder.

[0233] The average particle size of the aforementioned agglomerated portion is more than twice the average particle size of the aforementioned first metallic magnetic powder.

[0234] The composition of the second iron oxide magnetic powder is the same as that of the first iron oxide magnetic powder.

[0235] <17> The coil component according to any one of <1> to <16>, wherein the roundness of the first metal magnetic powder and the first iron oxide magnetic powder is greater than 0.9.

[0236] <18> The coil component according to any one of <1> to <17>, wherein the magnetic layer further comprises a second metallic magnetic powder.

[0237] <19> According to the coil component described in <18>, the first metallic magnetic powder is a carbonyl iron-based magnetic powder.

[0238] The aforementioned second metallic magnetic powder is an amorphous alloy magnetic powder.

[0239] The average particle size of the second metallic magnetic powder is greater than the average particle size of the first metallic magnetic powder.

[0240] <20> A surface-mount electronic component comprising any one of <1> to <19>.

[0241] <21> A semiconductor component comprising any one of <1> to <19>.

[0242] <22> A substrate comprising any one of <1> to <19>.

[0243] Symbol Explanation

[0244] 1.1B Inductor Component

[0245] 10. Green body

[0246] Magnetic layers 11, 11a, 11b, 11B

[0247] 13 First side view

[0248] 14 Second side view

[0249] 15 First end face

[0250] 16 Second end face

[0251] 17 Second Main Face (Top Face)

[0252] 18 First Main Face (Bottom Face)

[0253] Inductor wiring for 21, 22, 23, 221, 222, 223, 21B, 22B

[0254] 21a, 22a Inner peripheral end

[0255] 21b, 22b peripheral ends

[0256] Wiring section for 21c~21g and 22c~22k inductors

[0257] 23a First end

[0258] 23b Second End

[0259] 24 Internal Magnetic Circuit Section

[0260] 25 External Magnetic Circuit Section

[0261] Magnetic parts 26a~26f

[0262] Insulation layers 31, 32, 111, 121, 131, 141, 31B, 301B, 311B, 321B

[0263] 41, 42, 51B External Terminals

[0264] 50 Coated Film

[0265] 51, 52 column wiring

[0266] 70 Magnetic Materials

[0267] 71. Void

[0268] 72 Resin

[0269] 73 First Metal Magnetic Powder

[0270] 74 First Iron Oxide Magnetic Powder

[0271] 75. Condensation Section

[0272] 81, 82, 81B Vertical wiring

[0273] Wiring through holes 91, 92, 93, and 94

[0274] 100, 100B Dummy Core Substrate

[0275] 100a The first main surface of the dummy core substrate

[0276] Openings of 101, 102, 151, 152, 102B, 122B, 123B, 132B, and 501B

[0277] 110B copper foil

[0278] Insulation parts 111a, 111b, 121a~121c

[0279] Insulation layers 111 and 121

[0280] Seed crystal layers 112, 122, 142

[0281] 113B, 124B Dummy Copper

[0282] Seed crystal sections 122a, 122b, 122c, 122d

[0283] Holes 141B and 142B

[0284] 301B, 311B, 321B Insulation Layer

[0285] 311, 312 Insulation Parts

[0286] 322B Insulation layer opening

[0287] Line D

[0288] Length dimensions of L11, L12, L21~L23

[0289] Width dimensions of W11~W13, W21~W24

Claims

1. A coil component comprising: a blank containing a magnetic layer and a first coil wiring disposed within the blank, The magnetic layer comprises resin, first metallic magnetic powder, first iron oxide magnetic powder, and voids. The average particle size of the first metallic magnetic powder is greater than the average particle size of the first iron oxide magnetic powder.

2. The coil component according to claim 1, wherein, At least one of the first metal magnetic powders is in contact with at least one of the first iron oxide magnetic powders.

3. The coil component according to claim 2, wherein, The at least one first metallic magnetic powder is in contact with at least one first iron oxide magnetic powder and at least one of the voids.

4. The coil component according to claim 2 or 3, wherein, It further includes a first vertical wiring that extends from a first end of the first coil wiring inside the blank in such a way that it is exposed to a first main surface of the blank. The at least one first metallic magnetic powder is in contact with at least one of the first vertical wiring and the first coil wiring, as well as at least one of the voids and at least one of the first iron oxide magnetic powders.

5. The coil component according to claim 4, wherein, The at least one first metallic magnetic powder is in contact with the first vertical wiring, the at least one void, and the at least one first iron oxide magnetic powder.

6. The coil component according to any one of claims 1 to 5, wherein, The first metallic magnetic powder contains more than 95% by mass of Fe.

7. The coil component according to any one of claims 1 to 6, wherein, The first metallic magnetic powder contains 1% to 5% Cu by mass.

8. The coil component according to any one of claims 1 to 5, wherein, The first metallic magnetic powder contains Fe and two metals selected from metals other than Fe. The material contains 80% to 90% by mass of the Fe relative to the first metallic magnetic powder.

9. The coil component according to claim 8, wherein, The two metals mentioned are Si and Cr.

10. The coil component according to claim 8 or 9, wherein, The combined content of the two metals, relative to the first metallic magnetic powder, is less than 10% by mass. The content of Si is greater than the content of Cr.

11. The coil component according to any one of claims 1 to 10, wherein, The average particle size of the first metallic magnetic powder is 0.5 μm to 2.5 μm. The average particle size of the first iron oxide magnetic powder is 0.01 μm to 0.5 μm. The average particle size of the first metallic magnetic powder is more than 5 times the average particle size of the first iron oxide magnetic powder.

12. The coil component according to any one of claims 1 to 11, wherein, In the magnetic layer, the filling rate of the first metal magnetic powder is greater than that of the first iron oxide magnetic powder.

13. The coil component according to any one of claims 1 to 12, wherein, The first metallic magnetic powder includes an insulating coating portion. At least one of the insulating coating portions is in contact with at least one of the first iron oxide magnetic powders.

14. The coil component according to any one of claims 1 to 13, wherein, The first iron oxide magnetic powder contains Fe and O. Containing 60% to 85% by mass of the Fe, The content of O is second only to the content of Fe. The conductivity of the first metallic magnetic powder is more than 10 times higher than that of the first iron oxide magnetic powder.

15. The coil component according to any one of claims 1 to 14, wherein, The coefficient of linear expansion of the first metallic magnetic powder is greater than that of the first iron oxide magnetic powder.

16. The coil component according to any one of claims 1 to 15, wherein, The magnetic layer further includes aggregates. The agglomerated section is formed by the agglomeration of the second iron oxide magnetic powder. The average particle size of the agglomerated portion is more than twice the average particle size of the first metallic magnetic powder. The composition of the second iron oxide magnetic powder is the same as that of the first iron oxide magnetic powder.

17. The coil component according to any one of claims 1 to 16, wherein, The roundness of the first metallic magnetic powder and the first iron oxide magnetic powder is greater than 0.

9.

18. The coil component according to any one of claims 1 to 17, wherein, The magnetic layer further comprises a second metallic magnetic powder.

19. The coil component according to claim 18, wherein, The first metallic magnetic powder is a carbonyl iron-based magnetic powder. The second metallic magnetic powder is an amorphous alloy magnetic powder. The average particle size of the second metallic magnetic powder is greater than that of the first metallic magnetic powder.

20. A surface-mount electronic component comprising a coil component according to any one of claims 1 to 19.

21. A semiconductor component comprising the coil component according to any one of claims 1 to 19.

22. A substrate comprising a coil component according to any one of claims 1 to 19.

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