High-thermal-conductivity interface structure and preparation method thereof

CN121941016APending Publication Date: 2026-04-28NANJING AIKEMEI THERMAL ENERGY TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NANJING AIKEMEI THERMAL ENERGY TECH CO LTD
Filing Date
2026-03-02
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing heat dissipation interface materials cannot simultaneously achieve good thermal conductivity, compressibility, interface adhesion, and long-term reliability, resulting in low heat dissipation efficiency and poor reliability in high heat flux density applications.

Method used

The high thermal conductivity sheet has alternating grooves on both surfaces, which are filled with elastic viscous thermally conductive material and closely adhere to the heat-generating and heat-dissipating devices during compression and deformation. Combined with a flowable thermally conductive medium to fill the micro-gaps, it forms an efficient heat transfer path.

Benefits of technology

It improves interface thermal conductivity, reduces contact thermal resistance, and enhances long-term reliability and stability, making it suitable for high heat flux density heat dissipation scenarios.

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Abstract

The invention relates to a high-thermal-conductivity interface structure, and belongs to the technical field of thermal-conductivity interface materials, the high-thermal-conductivity interface structure comprises a plate body, the plate body is a high-thermal-conductivity sheet, and the two surfaces of the plate body are provided with alternately distributed grooves, so that the plate body can generate elastic compression deformation when being pressed; a heat-conducting filling layer is arranged in the groove, the surface of the heat-conducting filling layer is flush with the surface of the plate body where the heat-conducting filling layer is located, and the heat-conducting filling layer is made of elastic viscous heat-conducting materials. The heat dissipation structure has the effect of effectively improving the heat conduction performance while the compression performance of the heat dissipation structure is ensured.
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