Silicon-based thermal insulation board and preparation method thereof

Abstract

The invention provides a silicon-based heat insulation board, which is prepared by synthesizing a silicon-based material and an inorganic material, is in a regular porous shape, and has the advantages of good fireproof and flame retardant properties, light weight (230 + / -20Kg / m), high strength, high temperature resistance (more than 1000 DEG C) and low heat conductivity coefficient (0.04-0.05 w / mk). By adopting a compression molding process, the heat-insulating material is simple to prepare and convenient to construct, and can be widely applied to various heat-insulating and heat-preserving scenes such as internal and external protection of automobile bodies, power battery packs, energy storage battery cabinets and hot air pipes.

Description

A silicon-based thermal insulation board and its preparation method Technical Field

[0001] This invention relates to the field of thermal insulation board technology, specifically to a silicon-based thermal insulation board and its preparation method. Background Technology

[0002] With the continuous development of society and the economy, people have fully recognized the importance of the environment to human development. The rational use and conservation of energy are of great significance to my country's sustainable development, and improving energy efficiency and saving energy have attracted high attention. Developing environmentally friendly thermal insulation materials is one of the most effective and economical measures for energy conservation.

[0003] Currently, thermal insulation composite panels are widely used in civil, industrial, and construction fields as a substitute for traditional insulation materials. Commonly used thermal insulation panels on the market include polyurethane insulation panels, expanded polystyrene insulation panels, extruded polystyrene insulation panels, phenolic resin insulation panels, and rock wool insulation panels, which have the characteristics of good fire resistance and thermal insulation, low thermal conductivity, and durability.

[0004] Polyurethane insulation boards offer good fire resistance, excellent insulation, durability, and a long service life. However, as an organic fire-resistant insulation material, its strength is slightly lower than that of inorganic fire-resistant insulation materials, and its strength decreases under the influence of temperature and ultraviolet radiation. Expanded polystyrene insulation boards offer good insulation and are low in cost, but their strength is relatively poor, and their compressive strength and aging resistance are also unsatisfactory. Extruded polystyrene insulation boards (XPS boards) have a honeycomb structure, high compressive strength, and strong aging resistance, but they are relatively brittle, difficult to bend, prone to cracking and damage, and have low air permeability. There are currently no corresponding standards in China. Phenolic resin insulation boards offer good insulation and fire resistance, are corrosion-resistant, and aging-resistant, but they are brittle, prone to powdering, and are expensive.

[0005] Therefore, the market urgently needs to develop a new type of thermal insulation material that integrates lightweight, high strength, low thermal conductivity, high fire resistance, excellent temperature resistance and good workability to meet the increasingly stringent application requirements of new energy vehicles, high-end buildings, industrial energy conservation and other fields. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the purpose of this invention is to provide a silicon-based thermal insulation board and its preparation method, which is regularly porous, lightweight, high-strength, heat-resistant, and has excellent fire resistance and thermal insulation properties. Moreover, the process is simple, construction is convenient, and it can be mass-produced.

[0007] In a first aspect, the present invention provides a silicon-based thermal insulation board, the raw materials of which include: silicon-based resin, hollow glass microspheres and auxiliary materials, wherein the silicon-based resin is selected from any one of lithium polysilicate resin, lithium silicate resin, potassium silicate resin and sodium silicate resin; the hollow glass microspheres are selected from any one of hollow glass microspheres with a D50 of 65 micrometers, hollow glass microspheres with a D50 of 65 micrometers and hollow glass microspheres with a D50 of 80 micrometers; the auxiliary materials are selected from any one or a combination of at least two of cellulose thickeners, inorganic suspending agents, silica aerogels, antibacterial agents, air-entraining agents, surfactants, chlorovinylidene fluoride fire retardant emulsions, ceramic fibers, and composite flame retardant fibers (1~9 mm).

[0008] In one embodiment of the present invention, the silicon-based thermal insulation board comprises, by weight, 350-450 parts of lithium polysilicate resin or lithium silicate resin, 350-450 parts of hollow glass microspheres with a D50 of 65 micrometers, and 16-117 parts of auxiliary materials.

[0009] Furthermore, the excipients include: 5-15 parts of inorganic suspending agent, 1-2 parts of antibacterial agent, and 10-100 parts of ceramic fiber.

[0010] In another embodiment of the present invention, the silicon-based heat insulation board comprises, by weight, 300-400 parts of lithium polysilicate resin or lithium silicate resin, 300-400 parts of hollow glass microspheres with a D50 of 65 micrometers, and 28-220 parts of auxiliary materials.

[0011] Furthermore, the auxiliary materials include: 5-15 parts of inorganic suspending agent, 10-100 parts of silica aerogel, 1-2 parts of antibacterial agent, 1-10 parts of air-entraining agent, 10-100 parts of ceramic fiber, and 1-3 parts of composite flame-retardant fiber (1-9 mm).

[0012] In another embodiment of the present invention, the silicon-based heat insulation board comprises, by weight, 150-350 parts of potassium silicate resin or sodium silicate resin, 100-300 parts of hollow glass microspheres with a D50 of 65 micrometers, 30-150 parts of hollow glass microspheres with a D50 of 80 micrometers, and 28-220 parts of auxiliary materials.

[0013] Furthermore, the excipients include: 50-150 parts of chlorovinylidene retardant emulsion, 5-15 parts of cellulose thickener, 1-10 parts of silica aerogel, 1-3 parts of surfactant, 10-50 parts of ceramic fiber, and 1-3 parts of composite flame-retardant fiber (1-9 mm).

[0014] Furthermore, the inorganic suspending agent includes any one or a combination of at least two of bentonite, magnesium aluminum silicate, and fumed silica.

[0015] Furthermore, the antibacterial agent includes any one or a combination of at least two of nano zinc oxide and silver ion antibacterial agents.

[0016] Furthermore, the air-entraining agent includes any one or a combination of at least two of the following: rosin thermal polymer air-entraining agents and sodium dodecyl sulfate.

[0017] Furthermore, the composite flame-retardant fiber includes any one or a combination of at least two of the following: ceramic fiber, basalt fiber, and flame-retardant polypropylene fiber treated with phosphorus-nitrogen flame retardants.

[0018] Furthermore, the cellulose thickener includes any one or a combination of at least two of hydroxypropyl methylcellulose and hydroxyethyl methylcellulose.

[0019] Furthermore, the surfactant includes any one or a combination of at least two of fatty alcohol polyoxyethylene ether and alkylphenol polyoxyethylene ether.

[0020] Furthermore, the composite flame-retardant fiber includes any one or a combination of at least two of the following: ceramic fiber, basalt fiber, and flame-retardant polypropylene fiber treated with phosphorus-nitrogen flame retardants.

[0021] Secondly, the present invention provides a method for preparing a silicon-based thermal insulation board, comprising the following steps: Step 1: Weigh each raw material according to the formula, premix the silicon-based resin and some auxiliary materials (such as surfactants, antibacterial agents, etc.) under low-speed stirring to form a slurry, and premix the hollow glass microspheres, inorganic suspending agents, ceramic fibers and other dry materials in another container to form a dry mixture; Step 2: Slowly add the dry mixture to the slurry, mix evenly under vacuum or low-speed stirring to form a uniform paste mixture; Step 3: Inject the paste mixture into a mold of a predetermined size, mold it, keep it under pressure for 24-72 hours to pre-shape it, and then dry and cure it with hot air circulation at 45-50℃ for 10-12 hours; Step 4: Demold and place it in a constant temperature and humidity environment (temperature 23±2℃, relative humidity 50±5%) for 24-72 hours to obtain the silicon-based thermal insulation board.

[0022] The technical solution of this invention has the following advantages: The silicon-based thermal insulation board provided by this invention is synthesized from silicon-based materials and other inorganic materials. Through modification and other processes, the inorganic materials are stacked to create cavities. Upon heating, especially at temperatures above 1000℃, a third material is formed between the various materials, for example, decomposing into substances such as carbon and lithium to undergo a strong vitrification reaction. After the formation of the third material, the material has durable ultra-high temperature resistance, becoming more stable at higher temperatures, exhibiting excellent fire resistance (reaching Class A fire rating), good thermal insulation performance, and a low thermal conductivity (0.04-0.05 W / (m∙k)). Furthermore, the silicon-based thermal insulation board provided by this invention is lightweight, has a low density (230±20Kg / m³), high strength, a compressive strength of 1 MPa, and high surface hardness. Employing a molding process, it is simple to prepare and easy to install, and can be widely used in various thermal insulation scenarios such as the internal and external protection of automotive bodies, automotive interiors, power batteries, and energy storage battery packs. Detailed Implementation

[0023] The following embodiments are provided to better understand the present invention and are not limited to the preferred embodiments described. They do not constitute a limitation on the content and scope of protection of the present invention. Any product that is the same as or similar to the present invention, derived by any person under the guidance of the present invention or by combining the features of the present invention with other prior art, falls within the protection scope of the present invention.

[0024] Where specific experimental steps or conditions are not specified in the embodiments, they can be performed according to the conventional experimental steps or conditions described in the literature in this field. All raw materials or instruments used are commercially available conventional products, including but not limited to those used in the embodiments of this application.

[0025] The technical problem this invention aims to solve is to overcome the shortcomings of existing thermal insulation boards, such as low strength, high brittleness, high cost, and difficulty in on-site construction. To address this, a silicon-based thermal insulation board and its preparation method are proposed. It is prepared by synthesizing silicon-based materials and inorganic materials. Through modification and other processes, the inorganic materials are stacked to create cavities. Upon heating, especially at temperatures above 1000℃, a third material forms between the various materials, for example, decomposing into substances such as carbon and lithium for a strong vitrification reaction. After the formation of this third material, the silicon-based thermal insulation board exhibits long-lasting ultra-high temperature resistance, becoming more stable at higher temperatures. It is heat-resistant, has a low thermal conductivity (0.04-0.05 W / (m∙k)), achieves a fire rating of Class A, is lightweight and low in density (230±20 kg / m³), has high strength, a compressive strength of 1 MPa, and high surface hardness. It adopts a molding process, which is simple to prepare and convenient to construct. It can be widely used in various heat insulation scenarios such as the internal and external protection of automobile bodies, automobile interiors, power batteries and energy storage battery packs.

[0026] Example 1 This example provides a silicon-based thermal insulation board, which, by weight, comprises: 400 parts of lithium polysilicate resin, 400 parts of hollow glass microspheres with a D50 of 65μm, 10 parts of bentonite, 1.5 parts of nano zinc oxide antibacterial agent, and 60 parts of ceramic fiber (6mm in length).

[0027] The preparation method of the silicon-based thermal insulation board in this embodiment includes the following steps: Step 1: Weigh each raw material according to the formula, mix the lithium polysilicate resin and nano zinc oxide evenly in a mixer under low speed stirring to obtain a slurry, and mix hollow glass microspheres, bentonite and ceramic fibers for 2 minutes in another mixer to obtain a dry mixture; Step 2: Slowly add the dry mixture to the slurry, and mix at low speed for 5 minutes in a vacuum mixer to form a uniform paste mixture; Step 3: Inject the paste mixture into a 200mm×200mm×20mm steel mold, mold it under 1.0 MPa pressure, hold the pressure for 2 minutes, and then put the steel mold with the blank into an oven and cure it at 100℃ for 4 hours; Step 4: Demold and place it in an environment of 23℃ and 50% humidity for 48 hours to obtain the finished silicon-based thermal insulation board S1.

[0028] Example 2 This example provides a silicon-based thermal insulation board, which, by weight, comprises: 350 parts lithium silicate resin, 380 parts hollow glass microspheres with a D50 of 65μm, 8 parts fumed silica, 50 parts silica aerogel powder, 1 part nano zinc oxide antibacterial agent, 5 parts rosin thermal polymer air-entraining agent, 80 parts ceramic fiber (3mm in length), and 2 parts flame-retardant ceramic fiber (5mm in length).

[0029] The preparation method of the silicon-based thermal insulation board in this embodiment includes the following steps: Step 1: Weigh each raw material according to the formula, mix lithium silicate resin with antibacterial agent and air-entraining agent in a mixer at low speed to obtain a slurry, and mix hollow glass microspheres, fumed silica, aerogel powder, ceramic fiber and flame-retardant ceramic fiber in another mixer for 5 minutes to obtain a dry mixture; Step 2: Slowly add the dry mixture to the slurry, and mix at low speed in a vacuum mixer for 10 minutes to form a uniform paste mixture; Step 3: Inject the paste mixture into a 200mm×200mm×20mm steel mold, mold it under 0.8 MPa pressure, hold the pressure for 2 minutes, and then put the steel mold with the blank into an oven and cure it at 110℃ for 3 hours; Step 4: Demold and place it in an environment of 23℃ and 50% humidity for 48 hours to obtain the finished silicon-based thermal insulation board S2.

[0030] Example 3 This example provides a silicon-based thermal insulation board, which, by weight, comprises: 250 parts potassium silicate resin, 200 parts hollow glass microspheres with a D50 of 65 μm, 80 parts hollow glass microspheres with a D50 of 80 μm, 100 parts chlorovinylidene fluoride fire retardant emulsion, 8 parts hydroxypropyl methylcellulose (HPMC, 100,000 viscosity), 5 parts silica aerogel powder, 2 parts fatty alcohol polyoxyethylene ether (OP-10), 30 parts ceramic fiber (3 mm in length), and 1.5 parts flame-retardant ceramic fiber (5 mm in length).

[0031] The preparation method of the silicon-based thermal insulation board in this embodiment includes the following steps: Step 1: Weigh each raw material according to the formula, disperse HPMC in a small amount of water to make a gel, mix potassium silicate resin, chlorovinylidene emulsion, OP-10 surfactant, and HPMC gel in a mixer at low speed to obtain a slurry, mix hollow glass microspheres, aerogel powder, ceramic fiber, and flame-retardant ceramic fiber in another mixer for 5 minutes to obtain a dry mixture; Step 2: Slowly add the dry mixture to the slurry, mix at low speed in a vacuum mixer for 10 minutes to form a uniform paste mixture; Step 3: Inject the paste mixture into a 200mm×200mm×20mm steel mold, mold it under 1.2 MPa pressure, hold the pressure for 2 minutes, and then put the steel mold with the blank into an oven and cure it at 90℃ for 5 hours; Step 4: Demold and place it in an environment of 23℃ and 50% humidity for 48 hours to obtain the finished silicon-based thermal insulation board S3.

[0032] The performance of the silicon-based thermal insulation boards prepared in Examples 1-3 of this invention was tested in the experimental examples. The test results are shown in Table 1.

[0033] Performance testing methods and standards: Density: GB / T 5486-2008; Compressive strength: GB / T 5486-2008; Thermal conductivity (average temperature 25℃): GB / T 10294-2008 Protective hot plate method; Flammability rating: GB 8624-2012.

[0034] The test results are shown in Table 1.

[0035] Table 1 Performance test results of silicon-based thermal insulation boards prepared in Examples 1-3

[0036] As shown in Table 1, the three types of silicon-based thermal insulation boards prepared in the embodiments of the present invention all exhibit low density, high compressive strength, extremely low thermal conductivity and A1-level non-combustibility, and have good resistance to flames and thermal shock at temperatures above 1000°C, achieving the A1-level fire protection standard.

[0037] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A silicon-based thermal insulation board, characterized in that, Raw materials include: The invention comprises a silicone-based resin, hollow glass microspheres, and excipients, wherein the silicone-based resin is selected from any one of lithium polysilicate resin, lithium silicate resin, potassium silicate resin, and sodium silicate resin; the hollow glass microspheres are selected from any one of hollow glass microspheres with a D50 of 65 micrometers, hollow glass microspheres with a D50 of 65 micrometers, and hollow glass microspheres with a D50 of 80 micrometers; and the excipients are selected from any one or a combination of at least two of cellulose thickeners, inorganic suspending agents, silica aerogels, antibacterial agents, air-entraining agents, surfactants, chloro-vinylidene fluoride fire retardant emulsions, ceramic fibers, and composite flame-retardant fibers (1-9 mm).

2. The silicon-based thermal insulation board according to claim 1, characterized in that, By weight, the raw materials include: 350-450 parts of lithium polysilicate resin or lithium silicate resin, 350-450 parts of hollow glass microspheres with a D50 of 65 micrometers, and 16-117 parts of auxiliary materials.

3. The silicon-based thermal insulation board according to claim 1 or 2, characterized in that, By weight, the excipients include: 5-15 parts of inorganic suspending agent, 1-2 parts of antibacterial agent, and 10-100 parts of ceramic fiber.

4. The silicon-based thermal insulation board according to claim 1, characterized in that, By weight, the raw materials include: 300-400 parts of lithium polysilicate resin or lithium silicate resin, 300-400 parts of hollow glass microspheres with a D50 of 65 micrometers, and 28-220 parts of auxiliary materials.

5. The silicon-based thermal insulation board according to claim 1 or 4, characterized in that, By weight, the excipients include: 5-15 parts of inorganic suspending agent, 10-100 parts of silica aerogel, 1-2 parts of antibacterial agent, 1-10 parts of air-entraining agent, 10-100 parts of ceramic fiber, and 1-3 parts of composite flame-retardant fiber (1-9 mm).

6. The silicon-based thermal insulation board according to claim 1, 3, or 5, characterized in that, The inorganic suspending agent includes any one or a combination of at least two of bentonite, magnesium aluminum silicate, and fumed silica; the antibacterial agent includes any one or a combination of at least two of nano zinc oxide and silver ion antibacterial agents; the air-entraining agent includes any one or a combination of at least two of rosin thermal polymer air-entraining agents and sodium dodecyl sulfate; the composite flame-retardant fiber includes any one or a combination of at least two of ceramic fiber, basalt fiber, and flame-retardant polypropylene fiber treated with phosphorus and nitrogen flame retardants; the cellulose thickener includes any one or a combination of at least two of hydroxypropyl methylcellulose and hydroxyethyl methylcellulose; the surfactant includes any one or a combination of at least two of fatty alcohol polyoxyethylene ether and alkylphenol polyoxyethylene ether; the composite flame-retardant fiber includes any one or a combination of at least two of ceramic fiber, basalt fiber, and flame-retardant polypropylene fiber treated with phosphorus and nitrogen flame retardants.

7. The silicon-based thermal insulation board according to claim 1, characterized in that, By weight, the raw materials include: 150-350 parts of potassium silicate resin or sodium silicate resin, 100-300 parts of hollow glass microspheres with a D50 of 65 micrometers, 30-150 parts of hollow glass microspheres with a D50 of 80 micrometers, and 28-220 parts of auxiliary materials.

8. The silicon-based thermal insulation board according to claim 1 or 7, characterized in that, By weight, the excipients include: 50-150 parts of chlorovinylidene retardant emulsion, 5-15 parts of cellulose thickener, 1-10 parts of silica aerogel, 1-3 parts of surfactant, 10-50 parts of ceramic fiber, and 1-3 parts of composite flame-retardant fiber (1-9 mm).

9. The silicon-based thermal insulation board according to claim 1 or 8, characterized in that, The cellulose thickener includes any one or a combination of at least two of hydroxypropyl methylcellulose and hydroxyethyl methylcellulose; the surfactant includes any one or a combination of at least two of fatty alcohol polyoxyethylene ether and alkylphenol polyoxyethylene ether; the composite flame-retardant fiber includes any one or a combination of at least two of ceramic fiber, basalt fiber, and flame-retardant polypropylene fiber treated with phosphorus and nitrogen flame retardants.

10. The method for preparing a silicon-based thermal insulation board according to any one of claims 1 to 9, characterized in that, Includes the following steps: Step 1: Weigh all raw materials according to the formula. Premix the silicone resin with some auxiliary materials (such as surfactants, antibacterial agents, etc.) under low-speed stirring to form a slurry. In another container, premix the hollow glass microspheres, inorganic suspending agents, ceramic fibers and other dry materials to form a dry mixture. Step 2: Slowly add the dry mixture to the slurry and mix evenly under vacuum or low-speed stirring to form a uniform paste mixture. Step 3: Inject the paste mixture into a mold of a predetermined size, mold it, and keep it under pressure for 24-72 hours to preliminarily set it. Then, dry and cure it with hot air circulation at 45-50℃ for 10-12 hours. Step 4: Demold and place it in a constant temperature and humidity environment (temperature 23±2℃, relative humidity 50±5%) for 24-72 hours to obtain the silicone-based heat insulation board.

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