Switching structure, circuit board module, manufacturing method and electronic equipment

Abstract

The invention relates to a switching structure, a circuit board module, a manufacturing method and electronic equipment. The switching structure comprises a switching body, the switching body comprises a first connecting surface and a second connecting surface which are deviated from each other, the first connecting surface comprises a first circuit board mounting surface and an electric device mounting surface, the electric device mounting surface is closer to the second connecting surface than the first circuit board mounting surface, and the second connecting surface comprises a second circuit board mounting surface and a device avoiding surface; the device avoiding surface is closer to the first connecting surface than the second circuit board mounting surface, and a partial area of the device avoiding surface corresponds to the position of the electric device mounting surface; and the electric connecting part is arranged in the adapter body, and the first circuit board mounting surface and the electric device mounting surface are electrically connected with the second connecting surface through the electric connecting part. According to the electronic equipment, the electric device is heightened by utilizing the electric device mounting surface, a special heightening structure does not need to be arranged for the electric device, the space below the electric device mounting surface can be utilized, and the miniaturization design of the electronic equipment is facilitated.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board technology, and in particular to a transition structure, circuit board module, manufacturing method, and electronic device. Background Technology

[0002] Currently, circuit board modules typically employ a stacking technique to reduce their footprint within electronic devices. However, because circuit board modules need to be electrically connected to electrical components or other circuit board modules to enable the functionality of electronic devices, they suffer from insufficient layout space. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides an adapter structure, a circuit board module, a manufacturing method, and an electronic device.

[0004] According to a first aspect of this disclosure, a switching structure is provided, the switching structure comprising:

[0005] The adapter body includes a first connecting surface and a second connecting surface that are opposite to each other. The first connecting surface includes a first circuit board mounting surface and an electrical component mounting surface. The electrical component mounting surface is closer to the second connecting surface than the first circuit board mounting surface. The second connecting surface includes a second circuit board mounting surface and a component clearance surface. The component clearance surface is closer to the first connecting surface than the second circuit board mounting surface. A portion of the component clearance surface corresponds to the position of the electrical component mounting surface.

[0006] An electrical connection portion is disposed within the adapter body, which electrically connects the first circuit board mounting surface and the electrical component mounting surface to the second connection surface, respectively.

[0007] In some embodiments of this disclosure, a device cavity is formed within the adapter body, penetrating the first connecting surface and the second connecting surface, and the device clearance surface constitutes part of the cavity wall of the device cavity.

[0008] In some embodiments of this disclosure, the adapter body has a frame structure, the inner cavity of the frame structure constitutes the device cavity, the two end faces of the frame structure constitute the first connecting surface and the second connecting surface, and the device mounting surface and the device clearance surface are disposed on at least one side frame of the frame structure.

[0009] In some embodiments of this disclosure, the adapter body includes a plurality of isolation layers and a plurality of redistribution layers arranged alternately, and the electrical connection portion is used to electrically connect the first circuit board mounting surface and the electrical component mounting surface to the second connection surface through the plurality of redistribution layers.

[0010] In some embodiments of this disclosure, the plurality of isolation layers and the plurality of rewiring layers include a first rewiring layer, a first isolation layer, a second rewiring layer and a second isolation layer stacked sequentially from the outside to the inside.

[0011] A first clearance groove is provided at the edge region of the first isolation layer and the first rewiring layer. The first clearance groove exposes a portion of the second isolation layer and the second rewiring layer. The outer surfaces of the first isolation layer and the first rewiring layer constitute the first circuit board mounting surface. The surfaces of the second isolation layer and the second rewiring layer exposed through the first clearance groove constitute the electrical component mounting surface.

[0012] In some embodiments of this disclosure, the thickness of the first isolation layer is greater than the thickness of the second isolation layer.

[0013] In some embodiments of this disclosure, the plurality of isolation layers further includes an intermediate isolation layer. A first stacking structure and a second stacking structure are respectively provided on both sides of the intermediate isolation layer along the stacking direction. The first stacking structure includes a first redistribution layer, a first isolation layer, a second redistribution layer, and a second isolation layer. The second stacking structure includes a third redistribution layer and a third isolation layer stacked from the outside to the inside. A second clearance groove is provided on the second stacking structure. The second clearance groove extends into the intermediate isolation layer. The outer surfaces of the third redistribution layer and the third isolation layer constitute the second circuit board mounting surface. The surface of the intermediate isolation layer exposed through the second clearance groove constitutes the device clearance surface.

[0014] In some embodiments of this disclosure, the thickness of the first isolation layer is greater than the thickness of each isolation layer in the second stacked structure.

[0015] In some embodiments of this disclosure, the electrical connection portion includes a plurality of first conductive vias disposed in a region corresponding to the mounting surface of the electrical device; adjacent redistribution layers in the first stacked structure, excluding the first redistribution layer, are electrically connected through the plurality of first conductive vias disposed in an isolation layer between adjacent redistribution layers; and / or,

[0016] The electrical connection portion includes a plurality of second conductive vias disposed in the intermediate isolation layer, the second conductive vias electrically connecting the redistribution layers on both sides of the intermediate isolation layer; and / or,

[0017] The electrical connection portion includes a plurality of third conductive vias disposed in each of the isolation layers of the second stacked structure. Adjacent redistribution layers in the second stacked structure are electrically connected through the plurality of third conductive vias disposed in the isolation layer between adjacent redistribution layers.

[0018] In some embodiments of this disclosure, the first conductive via is a laser via;

[0019] The second conductive via is a mechanically buried via;

[0020] The third conductive via is a laser via.

[0021] In some embodiments of this disclosure, the electrical connection portion includes a plurality of fourth conductive vias disposed in a region corresponding to the device clearance surface, the fourth conductive vias penetrating the first stacked structure and penetrating the device clearance surface.

[0022] In some embodiments of this disclosure, the electrical connection portion includes a plurality of fifth conductive vias disposed in regions other than the regions corresponding to the device clearance surface and the electrical device mounting surface, the fifth conductive vias penetrating the first stacked structure, the intermediate isolation layer and the second stacked structure.

[0023] In some embodiments of this disclosure, the number of redistribution layers and the number of isolation layers in the first stacking structure and the second stacking structure are the same.

[0024] According to a second aspect of this disclosure, a circuit board module is provided, the circuit board module including a first circuit board, a second circuit board, a first electrical component, a second electrical component, and a transition structure as described above, wherein the first circuit board is connected to a mounting surface of the first circuit board, the second circuit board is connected to a mounting surface of the second circuit board, the first electrical component is disposed on the mounting surface of the electrical component, and the second electrical component is disposed on the second circuit board and located between the second circuit board and the device clearance surface.

[0025] In some embodiments of this disclosure, the circuit board module further includes a third electrical component disposed on the side of the first circuit board away from the adapter structure, wherein the height of the first electrical component is lower than the height of the third electrical component, or the height of the first electrical component is the same as that of the third electrical component.

[0026] In some embodiments of this disclosure, the first electrical device includes a board-to-board connector.

[0027] According to a third aspect of this disclosure, a method for manufacturing a circuit board module is provided, the method comprising:

[0028] The second electrical component is mounted on the electrical component mounting surface of the adapter structure;

[0029] Connect the first circuit board assembly, including the first circuit board, to the first circuit board mounting surface of the adapter structure;

[0030] The second circuit board assembly, including the second circuit board, is connected to the second circuit board mounting surface of the adapter structure.

[0031] In some embodiments of this disclosure, the step of placing the first electrical component on the electrical component mounting surface of the adapter structure includes:

[0032] Solder paste is printed onto the mounting surface of the electrical component using a spray-on method;

[0033] The first electrical component is soldered to the mounting surface of the electrical component using the printed solder paste.

[0034] According to a fourth aspect of this disclosure, an electronic device is provided, the electronic device including the adapter structure described above or the circuit board module described above.

[0035] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0036] The first connecting surface on one side of the adapter body is configured to include an electrical component mounting surface and a first circuit board mounting surface for mounting the first circuit board. The electrical component mounting surface is lower than the height of the first circuit board mounting surface, thereby utilizing the adapter body's own structure, i.e., the electrical component mounting surface, to elevate the electrical components without requiring a dedicated elevating structure for the components, thus achieving the reuse of the adapter structure. The second connecting surface on the other side of the adapter body is configured to include a component clearance surface and a second circuit board mounting surface for mounting the second circuit board. The component clearance surface is higher than the height of the second circuit board mounting surface, and a portion of the component clearance surface corresponds to the position of the electrical component mounting surface, allowing the space below the electrical component mounting surface to be utilized. That is, a clearance space is formed between the component clearance surface and the second circuit board mounting surface to accommodate the electrical components on the second circuit board. By reusing the adapter structure, the layout space of the electrical components in the circuit board module is increased without increasing the size of the electronic device, which is beneficial for the miniaturization design of electronic devices.

[0037] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0039] Figure 1 This is a schematic diagram of a longitudinal cross-sectional structure of a circuit board module;

[0040] Figure 2 This is a schematic diagram of the longitudinal cross-sectional structure of another type of circuit board module;

[0041] Figure 3 This is a top view schematic diagram of a transition structure according to an exemplary embodiment;

[0042] Figure 4This is a partial bottom view schematic diagram of the adapter structure according to an exemplary embodiment;

[0043] Figure 5 yes Figure 3 A partial cross-sectional structural diagram of AA;

[0044] Figure 6 This is a partial cross-sectional structural schematic diagram of the transition structure according to an exemplary embodiment;

[0045] Figure 7 This is a partial cross-sectional structural schematic diagram of the transition structure according to another exemplary embodiment;

[0046] Figure 8 This is a schematic diagram of a longitudinal cross-sectional structure of a circuit board module according to an exemplary embodiment;

[0047] Figure 9 This is a schematic flowchart illustrating a method for manufacturing a circuit board module according to an exemplary embodiment;

[0048] Figure 10 This is a flowchart illustrating a method for manufacturing a circuit board module according to another exemplary embodiment.

[0049] In the picture:

[0050] 100 - Adapter structure; 10 - Adapter body; 11 - First connecting surface; 111 - First circuit board mounting surface; 112 - Electrical component mounting surface; 12 - Second connecting surface; 121 - Second circuit board mounting surface; 122 - Component clearance surface; 13 - Isolation layer; 131 - First isolation layer; 132 - Second isolation layer; 133 - Intermediate isolation layer; 134 - Third isolation layer; 135 - Fourth isolation layer; 14 - Redistribution layer; 141 - First redistribution layer; 142 - Second redistribution layer; 143 - Third redistribution layer; 144 - Fourth redistribution layer Wiring layer; 145 - Fifth wiring layer; 146 - Sixth wiring layer; 15 - First clearance slot; 16 - Second clearance slot; 20 - First circuit board; 30 - Second circuit board; 40 - Electrical component; 41 - First electrical component; 42 - Second electrical component; 43 - Third electrical component; 44 - Fourth electrical component; 50 - Electrical connection point; 60 - Board-to-board connector; 70 - Raising plate; 80 - Electrical connection part; 81 - First conductive via; 82 - Second conductive via; 83 - Third conductive via; 84 - Fourth conductive via; 85 - Fifth conductive via. Detailed Implementation

[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0052] Electronic devices typically employ a circuit board stacking technique to reduce the size of the electronic device occupied by circuit board modules. For example... Figure 1 As shown, the circuit board module includes an adapter structure 100, a first circuit board 20, a second circuit board 30, electrical components 40, electrical connection points 50, and a board-to-board (BTB) connector 60. The first circuit board 20, adapter structure 100, and second circuit board 30 are stacked. Electrical components 40 are arranged on both the first and second circuit boards 20, which allows the circuit board module to expand the space for electrical component placement in the height direction, reducing the volume occupied by the circuit board module in terms of electronic components. The electrical connection points 50 are used to solder the adapter structure 100, the first circuit board 20, the second circuit board 30, the electrical components 40, and the board-to-board connector 60 together. When it is necessary to electrically connect the first circuit board 20 and the second circuit board 30 to other circuit board modules, the board-to-board connector 60 needs to be provided on the first circuit board 20. Since the board-to-board connector 60 is relatively tall, it increases the height of the circuit board module, which is not conducive to the miniaturization design of electronic devices.

[0053] To address this issue, related technologies have provided a circuit board module, such as... Figure 2 As shown, the circuit board module includes an adapter structure 100, a first circuit board 20, a second circuit board 30, electrical components 40, electrical connection points 50, a board-to-board connector 60, and a riser plate 70. The first circuit board 20, adapter structure 100, and second circuit board 30 are stacked. The riser plate 70 is arranged side-by-side with the adapter structure 100 on the second circuit board 30. The electrical components 40 are arranged on the first circuit board 20 and the second circuit board 30, and the board-to-board connector 60 is disposed on the riser plate 70. The electrical connection points 50 are used for soldering the adapter structure 100, the first circuit board 20, the second circuit board 30, the electrical components 40, the board-to-board connector 60, and the riser plate 70 together. By adding the riser plate 70 to elevate the board-to-board connector 60, the height of the board-to-board connector 60 is made approximately flush with the components on the first circuit board 20, thereby reducing the overall height of the circuit board module. However, because the mounting plate 70 occupies the lateral space of the circuit board module, the layout space of the circuit board module for setting the electrical components 40 is insufficient, the number of electrical components 40 is reduced, and the performance of the electronic equipment is affected.

[0054] Based on this, this disclosure provides an adapter structure that improves the adapter body to reuse it, avoiding the problem of needing to add a riser plate to the circuit board module, which would reduce the layout space of the circuit board module. Moreover, the adapter structure can not only transmit electrical signals and raise electrical components such as board-to-board connectors, but also increase the layout space of the circuit board module, saving circuit board module costs while improving the performance of the circuit board module.

[0055] An exemplary embodiment of this disclosure provides a switching structure, such as Figures 3 to 5 As shown, the adapter structure includes an adapter body 10 and an electrical connection portion 80. The adapter body 10 includes a first connecting surface 11 and a second connecting surface 12 that are opposite to each other. The first connecting surface 11 includes a first circuit board mounting surface 111 and an electrical component mounting surface 112, which are combined with... Figure 8 The first circuit board mounting surface 111 is used to mount the first circuit board 20, as shown in the reference. Figure 5 The component mounting surface 112 is closer to the second connecting surface 12 than the first circuit board mounting surface 111. The second connecting surface 12 includes a second circuit board mounting surface 121 and a component clearance surface 122, combined with... Figure 8 The second circuit board mounting surface 121 is used to mount the second circuit board 30, as shown in the reference. Figure 5 The device clearance surface 122 is closer to the first connecting surface 11 than the second circuit board mounting surface 121, and a portion of the device clearance surface 122 corresponds to the position of the electrical component mounting surface 112. The electrical connection part 80 is disposed in the adapter body 10, and the electrical connection part 80 electrically connects the first circuit board mounting surface 111 and the electrical component mounting surface 112 to the second connecting surface 12 respectively.

[0056] In this embodiment, the first connecting surface on one side of the adapter body is configured to include an electrical component mounting surface and a first circuit board mounting surface for mounting the first circuit board. The electrical component mounting surface is lower than the height of the first circuit board mounting surface, thereby utilizing the adapter body's own structure, i.e., the electrical component mounting surface, to elevate the electrical components without requiring a dedicated elevating structure for the components, thus achieving the reuse of the adapter structure. The second connecting surface on the other side of the adapter body is configured to include a component clearance surface and a second circuit board mounting surface for mounting the second circuit board. The component clearance surface is higher than the height of the second circuit board mounting surface, and a portion of the component clearance surface corresponds to the position of the electrical component mounting surface, allowing the space below the electrical component mounting surface to be utilized. That is, a clearance space is formed between the component clearance surface and the second circuit board mounting surface to accommodate the electrical components on the second circuit board. By reusing the adapter structure, the layout space of the electrical components in the circuit board module is increased without increasing the size of the electronic device, which is beneficial for the miniaturization design of the electronic device.

[0057] For example, the electrical component mounting surface 112 and the component clearance surface 122 can be formed by removing part of the transition structure.

[0058] In one embodiment, a device cavity is formed within the adapter body 10, which extends through the first connecting surface 11 and the second connecting surface 12, and the device clearance surface 122 constitutes part of the cavity wall of the device cavity.

[0059] In this embodiment, the device clearance surface forms part of the cavity wall of the device cavity, so that the clearance space is interconnected with the device cavity to form a larger cavity. This allows the electrical components to be arranged reasonably according to the cavity's capacity, enabling the cavity to accommodate more and larger electrical components and improving the layout space of the circuit board module.

[0060] Of course, it is understood that in other embodiments, the device clearance surface 122 can form a separate cavity, and the separate cavity formed by the device clearance surface 122 and the device cavity can respectively accommodate the electronic device 40.

[0061] In one embodiment, the adapter body 10 has a frame structure, the inner cavity of the frame structure constitutes a device cavity, the two end faces of the frame structure constitute a first connecting surface 11 and a second connecting surface 12, and the device mounting surface 112 and the device clearance surface 122 are disposed on at least one side of the frame structure.

[0062] In this embodiment, since the first connecting surface and the second connecting surface are opposite to each other, and the two end faces of the frame structure constitute the first connecting surface and the second connecting surface, the volume of the inner cavity of the frame structure is increased, thereby increasing the volume of the device cavity and improving the layout space of the circuit board module. Simultaneously, placing the device mounting surface and the device avoidance surface on the frame structure's edge further increases the layout space of the circuit board. Moreover, the frame structure also provides shielding, reducing mutual interference between electronic devices within the frame structure and other electronic devices.

[0063] For example, the adapter body 10 can also be in the form of a "C" shape.

[0064] For example, the component mounting surface 112 and the component clearance surface 122 can be disposed on one side of the frame structure, or they can be disposed on multiple side frames of the frame structure, for example, in Figure 7 In the illustrated embodiment, both the electrical component mounting surface 112 and the component clearance surface 122 are located in the corner area of ​​the frame.

[0065] In one embodiment, such as Figure 6As shown, the adapter body 10 includes multiple isolation layers 13 and multiple redistribution layers 14 arranged alternately. The electrical connection part 80 is used to electrically connect the first circuit board mounting surface 111 and the electrical component mounting surface 112 to the second connection surface 12 through the multiple redistribution layers 14.

[0066] In this embodiment, by alternately stacking isolation layers and redistribution layers, not only can the space occupied by the adapter body in electronic devices be reduced, but the transmission of multiple electrical signals can also be achieved. The redistribution layer optimizes the transmission path of electrical signals, while the isolation layer prevents interference between multiple electrical signals. Simultaneously, the first circuit board mounting surface and the electrical component mounting surface can transmit electrical signals to each other through the electrical connection portion and the redistribution layer with the second connection surface, improving the reliability of electrical signal transmission.

[0067] For example, the isolation layer 13 is PP (Prepreg), and the PP can be used to bond different layers of redistribution layer 14 together by means of hot pressing or the like. The material of the redistribution layer 14 may include, for example, copper.

[0068] In one embodiment, the plurality of isolation layers 13 and the plurality of redistribution layers 14 include a first redistribution layer 141, a first isolation layer 131, a second redistribution layer 142, and a second isolation layer 132 stacked sequentially from the outside in. A first clearance groove 15 is provided at the edge regions of the first isolation layer 131 and the first redistribution layer 141, exposing portions of the second isolation layer 132 and the second redistribution layer 142. The outer surfaces of the first isolation layer 131 and the first redistribution layer 141 form a first circuit board mounting surface 111, and the surfaces of the second isolation layer 132 and the second redistribution layer 142 exposed through the first clearance groove 15 form an electrical component mounting surface 112.

[0069] In this embodiment, the outer surfaces of the first isolation layer and the first rewiring layer constitute the first circuit board mounting surface. The first circuit board mounting surface can transmit electrical signals to each other between the first rewiring layer and the second connection surface. The surfaces of the second isolation layer and the second rewiring layer constitute the electrical component mounting surface. The electrical component mounting surface can directly transmit electrical signals to the second connection surface through the second rewiring layer. Furthermore, the first isolation layer and the second isolation layer can reduce interference between electrical signals and improve the reliability of electrical signal transmission.

[0070] In one embodiment, the thickness of the first isolation layer 131 is greater than the thickness of the second isolation layer 132.

[0071] In this embodiment, the thickness of the first isolation layer is greater than the thickness of the second isolation layer, which increases the height of the first clearance groove and expands the clearance space formed between the electrical component mounting surface and the first circuit board mounting surface, thereby increasing the layout space of the circuit board module.

[0072] In one embodiment, the plurality of isolation layers 13 further includes an intermediate isolation layer 133. A first stacking structure and a second stacking structure are respectively provided on both sides of the intermediate isolation layer 133 along the stacking direction. The first stacking structure includes a first redistribution layer 141, a first isolation layer 131, a second redistribution layer 142, and a second isolation layer 132. The second stacking structure includes a third redistribution layer 143 and a third isolation layer 134 stacked from the outside to the inside. A second clearance groove 16 is provided on the second stacking structure. The second clearance groove 16 extends into the intermediate isolation layer 133. The outer surfaces of the third redistribution layer 143 and the third isolation layer 134 constitute a second circuit board mounting surface 121. The surface of the intermediate isolation layer 133 exposed through the second clearance groove 16 constitutes a device clearance surface 122.

[0073] In this embodiment, the outer surfaces of the third isolation layer and the third wiring layer constitute the second circuit board mounting surface. The first connector can transmit electrical signals to each other between the third wiring layer and the second circuit board mounting surface. Furthermore, the third isolation layer can reduce interference between electrical signals, improving the reliability of electrical signal transmission. Moreover, since the electrical components corresponding to the component avoidance surface do not need to transmit electrical signals through the adapter body, by using the surface of the intermediate isolation layer as the component avoidance surface, signal disturbance in the circuit board module is avoided caused by the electrical components transmitting electrical signals through the component avoidance surface, thereby improving the reliability of the adapter structure.

[0074] In one embodiment, the thickness of the first isolation layer 131 is greater than the thickness of each isolation layer 13 in the second stacked structure.

[0075] In this embodiment, the first isolation layer affects not only the transmission of electrical signals but also the layout space of the circuit board module. A thicker first isolation layer allows for greater clearance between the component mounting surface and the first circuit board mounting surface, resulting in a larger layout space for the circuit board module. In contrast, the isolation layers in the second stacked structure only affect the transmission of electrical signals, and their thickness requirements are relatively low. Therefore, by making the thickness of the first isolation layer greater than that of each isolation layer in the second stacked structure, the layout space of the circuit board module is increased, which is beneficial for the miniaturization design of electronic devices.

[0076] For example, the number of redistribution layers 14 and the number of isolation layers 13 in the first and second stacked structures are the same; that is, the number of redistribution layers 14 in the first and second stacked structures is symmetrical with respect to the number of intermediate isolation layers 133, and the number of isolation layers 13 in the first and second stacked structures is symmetrical with respect to the number of intermediate isolation layers 133. For example, in Figure 6In the illustrated embodiment, the first stacking structure includes a first rewiring layer 141, a first isolation layer 131, a second rewiring layer 142, a second isolation layer 132, and a fourth rewiring layer 144 stacked sequentially from the outside. The second stacking structure includes a third rewiring layer 143, a third isolation layer 134, a fifth rewiring layer 145, a fourth isolation layer 135, and a sixth rewiring layer 146 stacked sequentially from the outside in. The fourth rewiring layer 144 and the sixth rewiring layer 146 are respectively disposed on both sides of the intermediate isolation layer 133.

[0077] In this embodiment, the number of redistribution layers 14 and isolation layers 13 in the first stacking structure and the second stacking structure are the same. On the one hand, this is beneficial for each redistribution layer and each isolation layer to be stacked step by step from the middle to both sides. On the other hand, it can ensure the structural reliability of the final transition structure and avoid bending of the transition structure due to asymmetry in the number of layers.

[0078] For example, the thickness of the wiring layer 14 can be 0.01mm, 0.02mm, 0.03mm, etc. The thickness of the first isolation layer 131 can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, etc., and the thickness of the intermediate isolation layer 133 can be 0.5mm, 1mm, 1.5mm, etc. The thicknesses of the second isolation layer 132, the third isolation layer 134, and the fourth isolation layer 135 can be the same or different. When the thicknesses of the second isolation layer 132, the third isolation layer 134, and the fourth isolation layer 135 are all the same, the thicknesses of the second isolation layer 132, the third isolation layer 134, and the fourth isolation layer 135 can be 0.01mm, 0.02mm, 0.03mm, etc.

[0079] For example, the thickness of the intermediate isolation layer 133 is greater than the thickness of the first isolation layer 131.

[0080] In one embodiment, such as Figure 7 As shown, the electrical connection portion 80 includes a plurality of first conductive vias 81 disposed in the region corresponding to the electrical component mounting surface 112. The adjacent redistribution layers 14 in the first stacked structure, except for the first redistribution layer 141, are electrically connected through the plurality of first conductive vias 81 disposed in the isolation layer 13 between the adjacent redistribution layers 14.

[0081] In this embodiment, multiple first conductive vias are provided on the mounting surface of the electrical components. Electrical signals can be transmitted between the mounting surface and the transition structure through these vias, improving the reliability of the electrical signal input and output transition structure. Simultaneously, by providing multiple first conductive vias in the isolation layer, these vias can form transmission paths for electrical signals between adjacent redistribution layers of the first stacked structure (excluding the first wiring layer), enabling signal transmission between adjacent redistribution layers and improving the reliability of signal transmission within the first stacked structure. Furthermore, the simple structure of the conductive vias reduces the structural complexity of the transition structure.

[0082] For example, with Figure 6 and Figure 7 For example, the electrical connection portion 80 can be a first conductive via 81 disposed between the second isolation layer 132 and the fourth wiring layer 144. This is understandable. Figure 6 and Figure 7 In the first stacking structure, the redistribution layer 14 has three layers and the isolation layer 13 has two layers. The number of redistribution layer 14 and isolation layer 13 in the first stacking structure is not limited to this, and the number of redistribution layer 14 and isolation layer 13 can be increased according to actual needs.

[0083] For example, the first conductive via 81 is a laser-drilled via. Since the thickness of the isolation layer 13 between adjacent wiring layers 14 other than the first redistribution layer 141 in the first stacked structure can be set to be relatively thin, forming the conductive via by laser drilling reduces the difficulty of forming the first conductive via 81 on the isolation layer 13, thereby improving the efficiency of forming the conductive via.

[0084] In one embodiment, the electrical connection portion 80 includes a plurality of second conductive vias 82 disposed in the intermediate isolation layer 133, the second conductive vias 82 electrically connecting the redistribution layers 14 on both sides of the intermediate isolation layer 133.

[0085] In this embodiment, by providing multiple second conductive vias in the intermediate isolation layer, the second conductive vias can form a transmission path for electrical signals between the redistribution layers on both sides of the intermediate isolation layer, enabling the electrical signals to be transmitted between the redistribution layers on both sides of the intermediate isolation layer, thus improving the reliability of electrical signal transmission. At the same time, the simple structure of the conductive vias reduces the structural complexity of the adapter structure.

[0086] For example, the second conductive via 82 is a mechanically buried via. Because the intermediate insulating layer 133 is relatively thick, during the laser drilling process, the laser may not be able to penetrate the intermediate insulating layer 133, resulting in the second conductive via 82 being unable to transmit electrical signals. Since mechanically buried vias provide high reliability for forming the second conductive via 82, using a mechanically buried via improves the reliability of electrical signal transmission.

[0087] In one embodiment, the electrical connection portion 80 includes a plurality of third conductive vias 83 disposed in each isolation layer 13 of the second stacked structure. Adjacent redistribution layers 14 in the second stacked structure are electrically connected through the plurality of third conductive vias 83 disposed in the isolation layer 13 between adjacent redistribution layers 14.

[0088] In this embodiment, by providing multiple third conductive vias in the isolation layer, the third conductive vias can form a transmission path for electrical signals between adjacent redistribution layers in the second stacked structure, enabling the electrical signals to be transmitted between adjacent redistribution layers in the second stacked structure, thereby improving the reliability of electrical signal transmission in the second stacked structure. Moreover, due to the simple structure of the conductive vias, the structural complexity of the transition structure is reduced.

[0089] For example, the third conductive via 83 is a laser-drilled via. Since the thickness of the isolation layer 13 in the second stacked structure can be set to be relatively thin, forming the conductive via by laser drilling reduces the difficulty of forming the third conductive via 83 on the isolation layer 13, thereby improving the efficiency of forming the conductive via.

[0090] For example, the shape and size of the first conductive via 81, the second conductive via 82 and the third conductive via 83 can be set as needed. For example, the shape of the via can be circular, square, etc.

[0091] In one embodiment, the electrical connection portion 80 includes a plurality of fourth conductive vias 84 disposed in a region corresponding to the device clearance surface 122, the fourth conductive vias 84 penetrating the first stacked structure and penetrating the device clearance surface 122.

[0092] In this embodiment, by setting multiple fourth conductive vias, the fourth conductive vias can form a transmission path for electrical signals in the first stacked structure, enabling electrical signals to be transmitted in the first stacked structure and improving the reliability of electrical signal transmission in the first stacked structure.

[0093] For example, the fourth conductive via 84 is a mechanically buried via.

[0094] For example, such as Figure 6 and Figure 7As shown, electrical signals between the first circuit board mounting surface 111 and the second circuit board mounting surface 121 can be transmitted through the first rewiring layer 141, the fourth conductive via 84, the second conductive via 82, the sixth rewiring layer 146, the third conductive via 83, the fifth rewiring layer 145, the third conductive via 83, and the third rewiring layer 143. Electrical signals between the component mounting surface 112 and the second circuit board mounting surface 121 can be transmitted through the second rewiring layer 142, the first conductive via 81, the fourth rewiring layer 144, the second conductive via 82, the sixth rewiring layer 146, the third conductive via 83, the fifth rewiring layer 145, the third conductive via 83, and the third rewiring layer 143.

[0095] In one embodiment, the electrical connection portion 80 includes a plurality of fifth conductive vias 85 disposed in other regions outside the regions corresponding to the device avoidance surface 122 and the electrical device mounting surface 112, the fifth conductive vias 85 penetrating the first stacked structure, the intermediate isolation layer 13 and the second stacked structure.

[0096] In this embodiment, by providing a fifth conductive via, which can form a transmission path for electrical signals between the fifth conductive via, the first stacked structure, the intermediate isolation layer, and the second stacked structure, the electrical signals can be transmitted between the transition structures, thereby improving the reliability of electrical signal transmission in the transition structure.

[0097] For example, the fifth conductive via 85 is a mechanically buried via.

[0098] When fabricating the adapter structure provided in this embodiment, a second conductive via 82 can be first set on the intermediate isolation layer 133. Then, a first stacked structure and a second stacked structure are stacked on both sides of the intermediate isolation layer 133 to obtain the initial adapter structure. After the second isolation layer 132 in the first stacked structure is fabricated, a first conductive via 81 is set on the second isolation layer 132 by laser drilling, and then a second redistribution layer 142 is arranged. Similarly, the third isolation layer 134 and the fourth isolation layer 135 in the second stacked structure are also laser-drilled after fabrication, and then redistribution layers are arranged. After the stacking is completed, a fourth conductive via 84 and a fifth conductive via 85 are set by mechanical drilling. Finally, the initial adapter structure is machined using mechanical methods such as CNC (Computerized Numerical Control) to remove portions of the third wiring layer 143, the third isolation layer 134, the fifth wiring layer 145, the fourth isolation layer 135, the sixth wiring layer 146, and the intermediate isolation layer 133, thereby forming the device clearance surface 122. The removed portion can accommodate the devices on the second circuit board 30. The electrical component mounting surface 112 can be formed in a similar manner or obtained by laser removal.

[0099] An exemplary embodiment of this disclosure provides a circuit board module, such as Figure 8 As shown, the circuit board module includes a first circuit board 20, a second circuit board 30, a first electrical component 41, a second electrical component 42, and the adapter structure described above. The first circuit board 20 is connected to the first circuit board mounting surface 111, the second circuit board 30 is connected to the second circuit board mounting surface 121, the first electrical component 41 is disposed on the electrical component mounting surface 112, and the second electrical component 42 is disposed on the second circuit board 30 and located between the second circuit board 30 and the component clearance surface 122.

[0100] In this embodiment, by placing the first electrical component on the electrical component mounting surface of the adapter structure and placing the second electrical component between the second circuit board and the component clearance surface, the number of electrical components connected to the circuit board assembly is increased without increasing the volume of the circuit board module, which is beneficial for the miniaturization design of electronic devices.

[0101] For example, the first circuit board 20 can be a radio frequency board, which can wirelessly transmit and receive data. The second circuit board 30 can be a motherboard, through which the electronic device performs data processing and data transmission. Of course, the first circuit board 20 and the second circuit board 30 can also be circuit boards with other functions, and this embodiment does not limit them.

[0102] In one embodiment, the circuit board module further includes a third electrical component 43 disposed on the side of the first circuit board 20 away from the adapter structure, wherein the height of the first electrical component 41 is lower than the height of the third electrical component 43, or the heights of the first electrical component 41 and the third electrical component 43 are flush.

[0103] In this embodiment, the circuit board module also includes a third electrical component, which increases the functionality of the first circuit board and thus improves its performance. Furthermore, by placing the third electrical component on the side of the first circuit board away from the adapter structure, the circuit board module becomes more compact, which is beneficial for the miniaturization design of electronic devices.

[0104] For example, the circuit board module also includes a fourth electrical component 44 disposed on the side of the second circuit board 30 away from the adapter structure, wherein the height of the second electrical component 42 is higher than the height of the fourth electrical component 44.

[0105] In one embodiment, the first electrical component 41 includes a board-to-board connector.

[0106] In this embodiment, because the board-to-board connector is relatively tall, the layout space of the circuit board module needs to be sacrificed to set up a riser plate. The board-to-board connector is then placed on the riser plate to achieve electrical connection between the circuit board module and other circuit board modules. The first electrical component, including the board-to-board connector, allows the adapter structure to raise the board-to-board connector. The circuit board module does not need to be equipped with a riser plate. Reusing the adapter structure increases the layout space of the circuit board module. Moreover, the adapter structure not only transmits electrical signals and raises the board-to-board connector, but also increases the layout space of the circuit board module, saving circuit board module costs while improving circuit board module performance.

[0107] For example, the electrical component 40 is electrically connected to the adapter structure, the first circuit board 20 and the second circuit board 30 through electrical connection points 50.

[0108] For example, electrical connection point 50 can be a solder pad.

[0109] For example, the electrical connection point 50 between the first electrical component 41 and the adapter structure 100 is formed by solder spraying. The electrical connection points 50 between other electrical components 40 and the adapter structure 100, the electrical connection points 50 between other electrical components 40 and the first circuit board 20 and the second circuit board 30, and the electrical connection points 50 between the adapter structure 100 and the first circuit board 20 and the second circuit board 30 are still formed using a stencil, without the need to modify the stencil structure.

[0110] An exemplary embodiment of this disclosure provides a method for manufacturing a circuit board module, such as... Figure 9 As shown, the manufacturing method includes:

[0111] S100. The first electrical component is placed on the electrical component mounting surface of the adapter structure.

[0112] S200, Connect the first circuit board assembly, including the first circuit board, to the first circuit board mounting surface of the adapter structure.

[0113] S300, Connect the second circuit board assembly, including the second circuit board, to the second circuit board mounting surface of the adapter structure.

[0114] In this embodiment, a first electrical component is disposed on the electrical component mounting surface of the adapter structure, increasing the number of electrical components connected to the circuit board module and thus increasing the functionality of the circuit board module. A first circuit board assembly including a first circuit board is connected to the first circuit board mounting surface of the adapter structure, forming an electrical connection between the first circuit board and the adapter structure. A second circuit board assembly including a second circuit board is connected to the second circuit board mounting surface of the adapter structure. Electrically connecting the first and second circuit boards through the adapter structure increases the reliability of signal transmission within the circuit board module.

[0115] In one embodiment, such as Figure 10 As shown, step S100, which involves placing the first electrical component on the electrical component mounting surface of the adapter structure, includes:

[0116] S110. Solder paste is printed on the mounting surface of electrical components using a spray soldering method.

[0117] S120. Solder the first electrical component to the electrical component mounting surface by printing solder paste.

[0118] In this embodiment, because the height of the component mounting surface is lower than the height of the first circuit board mounting surface, the traditional method of dripping solder paste onto the stencil results in the solder paste dripping to a lower height in other areas than onto the component mounting surface, leading to low reliability of soldering the first component to the component mounting surface. By using a spray soldering method to print solder paste separately onto the component mounting surface, the need to modify the stencil is avoided, thereby improving the reliability of soldering the first component.

[0119] For example, the first clearance slot 15 and the second clearance slot 16 of the transition structure can be formed by removing the isolation layer 13 and the redistribution layer 14.

[0120] In one exemplary embodiment, an electronic device is provided, which includes the adapter structure or circuit board module described above.

[0121] For example, the electronic device can be a mobile device such as a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, wearable device, ultra-mobile personal computer (10UMPC), netbook or personal digital assistant (PDA), or a non-mobile device such as a personal computer (PC), television (TV), ATM or self-service machine.

[0122] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0123] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A transition structure, characterized in that, The transition structure includes: The adapter body includes a first connecting surface and a second connecting surface that are opposite to each other. The first connecting surface includes a first circuit board mounting surface and an electrical component mounting surface. The electrical component mounting surface is closer to the second connecting surface than the first circuit board mounting surface. The second connecting surface includes a second circuit board mounting surface and a component clearance surface. The component clearance surface is closer to the first connecting surface than the second circuit board mounting surface. A portion of the component clearance surface corresponds to the position of the electrical component mounting surface. An electrical connection portion is disposed within the adapter body, which electrically connects the first circuit board mounting surface and the electrical component mounting surface to the second connection surface, respectively.

2. The adapter structure according to claim 1, characterized in that, The adapter body forms a device cavity that connects the first connecting surface and the second connecting surface, and the device clearance surface constitutes part of the cavity wall of the device cavity.

3. The adapter structure according to claim 2, characterized in that, The adapter body has a frame structure, the inner cavity of the frame structure forms the device cavity, the two end faces of the frame structure form the first connecting surface and the second connecting surface, and the electrical device mounting surface and the device clearance surface are disposed on at least one side of the frame structure.

4. The adapter structure according to claim 1, characterized in that, The adapter body includes multiple isolation layers and multiple redistribution layers arranged in alternating stacks. The electrical connection portion is used to electrically connect the first circuit board mounting surface and the electrical component mounting surface to the second connection surface through the multiple redistribution layers.

5. The adapter structure according to claim 4, characterized in that, The plurality of isolation layers and the plurality of redistribution layers include a first redistribution layer, a first isolation layer, a second redistribution layer and a second isolation layer stacked sequentially from the outside to the inside; A first clearance groove is provided at the edge region of the first isolation layer and the first rewiring layer. The first clearance groove exposes a portion of the second isolation layer and the second rewiring layer. The outer surfaces of the first isolation layer and the first rewiring layer constitute the first circuit board mounting surface. The surfaces of the second isolation layer and the second rewiring layer exposed through the first clearance groove constitute the electrical component mounting surface.

6. The adapter structure according to claim 5, characterized in that, The thickness of the first isolation layer is greater than the thickness of the second isolation layer.

7. The adapter structure according to claim 5, characterized in that, The plurality of isolation layers also includes an intermediate isolation layer. A first stacking structure and a second stacking structure are respectively provided on both sides of the intermediate isolation layer along the stacking direction. The first stacking structure includes a first redistribution layer, a first isolation layer, a second redistribution layer, and a second isolation layer. The second stacking structure includes a third redistribution layer and a third isolation layer stacked from the outside to the inside. A second clearance groove is provided on the second stacking structure. The second clearance groove extends into the intermediate isolation layer. The outer surfaces of the third redistribution layer and the third isolation layer constitute the second circuit board mounting surface. The surface of the intermediate isolation layer exposed through the second clearance groove constitutes the device clearance surface.

8. The adapter structure according to claim 7, characterized in that, The thickness of the first isolation layer is greater than the thickness of each isolation layer in the second stacked structure.

9. The adapter structure according to claim 7, characterized in that, The electrical connection portion includes a plurality of first conductive vias disposed in a region corresponding to the mounting surface of the electrical device. Adjacent redistribution layers in the first stacked structure, excluding the first redistribution layer, are electrically connected through the plurality of first conductive vias in an isolation layer disposed between adjacent redistribution layers; and / or The electrical connection portion includes a plurality of second conductive vias disposed in the intermediate isolation layer, the second conductive vias electrically connecting the redistribution layers on both sides of the intermediate isolation layer; and / or, The electrical connection portion includes a plurality of third conductive vias disposed in each of the isolation layers of the second stacked structure. Adjacent redistribution layers in the second stacked structure are electrically connected through the plurality of third conductive vias disposed in the isolation layer between adjacent redistribution layers.

10. The adapter structure according to claim 9, characterized in that, The first conductive via is a laser via; The second conductive via is a mechanically buried via; The third conductive via is a laser via.

11. The adapter structure according to claim 7, characterized in that, The electrical connection portion includes a plurality of fourth conductive vias disposed in a region corresponding to the device clearance surface, the fourth conductive vias penetrating the first stacked structure and penetrating the device clearance surface.

12. The adapter structure according to claim 7, characterized in that, The electrical connection portion includes a plurality of fifth conductive vias disposed in other regions outside the regions corresponding to the device clearance surface and the electrical device mounting surface, the fifth conductive vias penetrating the first stacked structure, the intermediate isolation layer and the second stacked structure.

13. The adapter structure according to claim 7, characterized in that, The number of redistribution layers and the number of isolation layers are the same in both the first stacking structure and the second stacking structure.

14. A circuit board module, characterized in that, The circuit board module includes a first circuit board, a second circuit board, a first electrical component, a second electrical component, and a transition structure as described in any one of claims 1 to 13. The first circuit board is connected to the mounting surface of the first circuit board, the second circuit board is connected to the mounting surface of the second circuit board, the first electrical component is disposed on the mounting surface of the electrical component, and the second electrical component is disposed on the second circuit board and located between the second circuit board and the device clearance surface.

15. The circuit board module according to claim 14, characterized in that, The circuit board module further includes a third electrical component disposed on the side of the first circuit board away from the adapter structure, wherein the height of the first electrical component is lower than the height of the third electrical component, or the height of the first electrical component is the same as that of the third electrical component.

16. The circuit board module according to claim 14, characterized in that, The first electrical component includes a board-to-board connector.

17. A method for manufacturing a circuit board module, characterized in that, The method for manufacturing the circuit board assembly includes: The first electrical component is placed on the electrical component mounting surface of the adapter structure; Connect the first circuit board assembly, including the first circuit board, to the first circuit board mounting surface of the adapter structure; The second circuit board assembly, including the second circuit board, is connected to the second circuit board mounting surface of the adapter structure.

18. The method for manufacturing a circuit board module according to claim 17, characterized in that, The step of placing the first electrical component on the electrical component mounting surface of the adapter structure includes: Solder paste is printed onto the mounting surface of the electrical component using a spray-on method; The first electrical component is soldered to the mounting surface of the electrical component using the printed solder paste.

19. An electronic device, characterized in that, The electronic device includes the adapter structure as described in any one of claims 1 to 13 or the circuit board module as described in any one of claims 14 to 16.

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