Thermal management system and method for in-vehicle wireless communication module

Abstract

The embodiment of the invention relates to the technical field of vehicle-mounted wireless communication, and discloses a thermal management system and method for a vehicle-mounted wireless communication module, and the system comprises a printed circuit board which is provided with a heating component and a thermistor corresponding to the heating component; the shielding cover is arranged above the heating component in a covering manner and is connected with the printed circuit board; a heat conduction interface material is filled between the heating component and the shielding cover; the thermistor is used for providing a temperature signal representing the corresponding heating component to the control unit; the control unit is configured to execute the switching logic of the state machine according to the priority sequence of the monitored temperature signals, and dynamically adjust at least one working parameter of the module based on the target state of the switched state machine so as to control the temperature rise of the vehicle-mounted wireless communication module; the temperature rise of the module is controlled through active heat dissipation, passive heat dissipation and a heat management strategy.

Description

Thermal management system and method for vehicle-mounted wireless communication modules Technical Field

[0001] This invention relates to the field of wireless communication technology, and in particular to a thermal management system and method for an in-vehicle wireless communication module. Background Technology

[0002] With the rapid development of intelligent connected vehicles and autonomous driving technologies, 5G RedCap (ReducedCapability) wireless communication technology is gaining widespread application in in-vehicle T-Boxes, smart cockpits, remote control, and V2X vehicle-to-everything (V2X) systems due to its comprehensive advantages of low latency, medium-to-high speed, and optimized power consumption. The increasing demand for high-performance wireless communication modules in vehicles is driving continuous improvements in their integration and functional density, resulting in a significant increase in power consumption. However, the increasingly stringent limitations imposed by the vehicle's electrical architecture on module size are driving the development of communication modules towards greater compactness and thinner dimensions. This parallel trend of "high performance and small size" leads to a sharp increase in heat load per unit area. Constrained by limited installation space and insufficient overall heat dissipation capacity, modules operate at high temperatures for extended periods. High temperatures not only accelerate the aging of electronic components, significantly shortening the lifespan of wireless communication modules, but can also cause signal drift, transmission instability, and even hardware failure. In severe cases, it can directly cause thermal damage to core chips or power devices, leading to complete system malfunction and threatening driving safety.

[0003] Against this backdrop, the stability, reliability, and security of automotive wireless communication modules have surpassed traditional performance indicators, becoming a core concern for OEMs and end-users, directly impacting overall vehicle quality and brand reputation. It's worth noting that the application of automotive wireless communication modules is not limited to the automotive industry. With its balanced energy efficiency, moderate cost, and good network compatibility, this technology is rapidly penetrating a wide range of fields, including consumer electronics (such as high-end AR / VR devices and mobile office terminals), industrial instrumentation (remote monitoring and control systems), environmental monitoring networks in smart cities (atmospheric and water quality sensor clusters), and the networking of integrated circuit testing and production equipment, providing crucial communication support for the intelligent and remote upgrades of various industries. This also presents differentiated engineering challenges for its heat dissipation design and long-term reliable operation under different environmental conditions. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal management system and method for an in-vehicle wireless communication module, so as to solve the technical problems in the related art, such as excessively high operating temperature, decreased reliability and shortened service life caused by increased power consumption, reduced size and insufficient heat dissipation capacity of the communication module.

[0005] To address the aforementioned technical problems, a first aspect of the present invention provides a thermal management system for an in-vehicle wireless communication module, comprising: a printed circuit board, on which a heat-generating element is disposed, and a thermistor corresponding to the heat-generating element, wherein the distance between the heat-generating element and the corresponding thermistor is not greater than a preset distance; a shielding cover, disposed above the heat-generating element and connected to the printed circuit board; a thermally conductive interface material is filled between the heat-generating element and the shielding cover, and the heat generated by the heat-generating element is conducted to the shielding cover through the thermally conductive interface material; the thermistor is used to provide a temperature signal characterizing the corresponding heat-generating element to a control unit; the control unit is configured to execute a state machine switching logic according to the priority order of the monitored temperature signals, and dynamically adjust at least one operating parameter of the in-vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the in-vehicle wireless communication module; the priority order corresponds to the order of the maximum temperature values ​​that the heat-generating element can withstand, and the higher the maximum temperature value that can be withstood, the lower the priority of the temperature signal.

[0006] According to some embodiments of this application, a second aspect of this application also provides a thermal management method for an in-vehicle wireless communication module, applied to the thermal management system of the in-vehicle wireless communication module as described in the first aspect. The method includes: the control unit periodically acquiring temperature signals from a first thermistor, a second thermistor, and a third thermistor to obtain a first temperature signal, a second temperature signal, and a third temperature signal; executing switching logic of different state machines according to the priority order of the first temperature signal, the second temperature signal, and the third temperature signal; and dynamically adjusting at least one operating parameter of the in-vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the in-vehicle wireless communication module; wherein the priority of the first temperature signal is greater than the priority of the second temperature signal, and the priority of the second temperature signal is greater than the priority of the third temperature signal.

[0007] The technical solution provided in this application has at least the following advantages: The active thermal management system of the vehicle-mounted wireless communication module of this application collects the temperature signals of the heat-generating components in real time by arranging multiple thermistors near the heat-generating components. Based on the priority order of different temperature signals, it executes switching logic of different state machines. Based on the target state of the switched state machine, it dynamically adjusts at least one operating parameter of the vehicle-mounted wireless communication module to control the temperature rise of the module. This application also configures a thermally conductive interface material filled between the chip and the shielding cover to construct an efficient heat dissipation path, as well as thermally conductive vias, realizing a thermal management mode that combines passive and active heat dissipation. This effectively suppresses the temperature rise of the device while ensuring communication performance, significantly improving the long-term reliability and stability of the vehicle-mounted wireless communication module in high-temperature and harsh environments. Attached Figure Description

[0008] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0009] Figure 1 is a schematic diagram of the thermal management system of an in-vehicle wireless communication module according to an embodiment of the present invention; Figure 2 is a schematic diagram of the printed circuit board of the thermal management system of the in-vehicle wireless communication module according to an embodiment of the present invention; Figure 3 is a schematic diagram of the thermal interface material of the thermal management system of the in-vehicle wireless communication module according to an embodiment of the present invention; Figure 4 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under normal operating conditions according to an embodiment of the present invention; Figure 5 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under a first derating state according to an embodiment of the present invention; Figure 6 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under a second derating state according to an embodiment of the present invention; Figure 7 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under a third derating state according to an embodiment of the present invention; Figure 8 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under a fourth derating state according to an embodiment of the present invention; Figure 9 is a schematic diagram of the software control flow of the in-vehicle wireless communication module under a protection shutdown state according to an embodiment of the present invention; Figure 10 is a schematic diagram of the thermal management method of the in-vehicle wireless communication module according to an embodiment of the present invention. Detailed Implementation

[0010] Existing thermal management technologies for automotive wireless communication modules typically rely on one or more of the following basic solutions: First, the most common is passive heat dissipation design, which uses a metal substrate with high thermal conductivity, thermal pads, or a heat sink to naturally dissipate heat from the core chip to the surrounding environment or the entire casing by increasing the heat conduction area and path. This solution is simple in structure and low in cost, but with the continuous increase in module power consumption and increasingly compact installation space, its heat dissipation capacity has approached its physical limit and is difficult to cope with the heat accumulation caused by continuous high-load operation.

[0011] Secondly, some solutions employ simple temperature monitoring and global frequency reduction strategies. Typically, a single temperature sensor is installed within the module. When the temperature exceeds a certain fixed threshold, the control unit or communication chip is frequency-reduced or its transmission power is lowered. While this approach can prevent overheating damage, its response is coarse, lacking fine-grained perception of the differences between multiple heat sources. Often, performance is excessively limited due to a single hotspot before the temperature reaches a dangerous level, impacting communication quality and user experience. Furthermore, it fails to fully exploit the hardware's performance potential while ensuring safety.

[0012] Furthermore, some solutions attempt to introduce active cooling components, such as micro fans or thermoelectric coolers (TECs). These solutions can improve heat dissipation efficiency, but they also significantly increase system complexity, power consumption, cost, and potential mechanical failure risks, which contradicts the core requirements of automotive equipment for high reliability, long lifespan, and low power consumption, and are particularly limited in the space-constrained automotive pre-installation environment.

[0013] Therefore, the core challenge facing existing technologies lies in how to achieve precise, real-time temperature monitoring of multiple key heat sources in an in-vehicle wireless communication module within an extremely limited space, and on this basis, implement intelligent, hierarchical, and zoned thermal control strategies to maximize communication performance and energy efficiency while ensuring the absolute reliability and safety of the module. Existing solutions struggle to balance multiple key indicators such as precise temperature control, performance maintenance, space constraints, and high reliability, and cannot achieve ideal system-level balance and overall optimization under the aforementioned mutually restrictive engineering conditions.

[0014] Based on this, this application provides a thermal management system for an in-vehicle wireless communication module, including: a printed circuit board, on which a heating element and a thermistor corresponding to the heating element are disposed, the distance between the heating element and the corresponding thermistor being no greater than a preset distance; a shielding cover, which is disposed above the heating element and connected to the printed circuit board; a thermally conductive interface material is filled between the heating element and the shielding cover, and the heat generated by the heating element is conducted to the shielding cover through the thermally conductive interface material; the thermistor is used to provide a temperature signal characterizing the corresponding heating element to a control unit; the control unit is configured to execute a state machine switching logic according to the priority order of the monitored temperature signals, and dynamically adjust at least one operating parameter of the in-vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the in-vehicle wireless communication module; the priority order corresponds to the order of the maximum temperature values ​​that the heating element can withstand, and the higher the maximum temperature value that can be withstood, the lower the priority of the temperature signal.

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the various embodiments of the present invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the various embodiments below is for ease of description and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined with and referenced by each other without contradiction.

[0016] As shown in Figure 1, the thermal management system of the vehicle wireless communication module in the embodiment of this application includes a printed circuit board. The printed circuit board is provided with a heating element and a thermistor corresponding to the heating element. The distance between the heating element and the corresponding thermistor is not greater than a preset distance. Preferably, the printed circuit board is a four-layer printed circuit board.

[0017] In this embodiment, Figure 2 shows a schematic diagram of the printed circuit board of this application. As shown, the printed circuit board has multiple heat-conducting holes, through which the heat generated by the circuitry of the printed circuit board is conducted. The multiple heat-conducting holes include blind vias, buried vias, and through-holes. Blind vias are provided between the first and second layers of the printed circuit board, and between the third and fourth layers; buried vias are provided between the second and third layers of the printed circuit board; and through-holes are provided between the first and fourth layers.

[0018] The printed circuit board (PCB) integrates a multi-layered thermal via structure, forming a crucial built-in thermal pathway. Blind vias, buried vias, and through-holes work synergistically to efficiently conduct the main heat generated during operation from the PCB wiring layers and mounted components, especially the main control CPU, RF transceiver, and RF PA, from the heat-generating areas to the large-area ground copper foil on the inner layers of the PCB or the heat dissipation areas on the outer layers. The specific interlayer arrangement is as follows: blind vias are placed between the first signal layer and the second ground layer, and between the third signal layer and the fourth ground layer, to achieve rapid vertical heat conduction from key heat sources on the surface to the adjacent inner layer ground plane; buried vias are placed between the second and third layers to enhance lateral and longitudinal heat diffusion between the intermediate layers of the PCB; and through-holes are placed between the first and fourth layers, spanning the entire board thickness, serving as core heat flow pillars and establishing a globally high thermal conductivity channel from the board surface to the bottom layer or the heat dissipation substrate. This composite thermal via design significantly reduces the lateral and longitudinal thermal resistance of the PCB, making it a key structure for improving the overall system heat dissipation capacity and preventing localized heat accumulation.

[0019] In an embodiment of this application, the vehicle-mounted wireless communication module further includes a shielding cover, which is disposed above the heat-generating component and connected to the printed circuit board. A thermally conductive interface material is filled between the heat-generating component and the shielding cover, and the heat generated by the heat-generating component is conducted to the shielding cover through the thermally conductive interface material. One side of the thermally conductive interface material contacts the shielding cover, and the other side contacts the heat-generating component, forming a heat conduction path.

[0020] Preferably, the shielding cover is a metal shielding cover. The vehicle-mounted wireless communication module module has an integral metal shielding cover, which covers all core heat-generating components such as the main control CPU and RF PA. The shielding cover is connected to the printed circuit board and can be fixed by soldering or snap-fit, forming a closed or semi-closed electromagnetic shielding cavity. Figure 3 shows a schematic diagram of the thermal interface material of this application. As shown in Figure 3, to further enhance heat dissipation, a thermal interface material with a high thermal conductivity is filled between the upper surface of the package of the heat-generating components (such as the main control CPU, RF power amplifier, and transceiver) and the inner top surface of the shielding cover. One side of this material is in direct contact with the package shell or heat sink of the heat-generating components, and the other side is tightly attached to the inner wall of the shielding cover, thereby establishing a low thermal resistance heat conduction channel between the chip heat source and the shielding cover. The heat generated by the heat-generating components during operation is efficiently conducted to the shielding cover through this thermally conductive interface material layer. From there, it diffuses through the shielding cover surface to the surrounding air or to external heat dissipation structures in contact with it (such as a vehicle center console housing or a separate heatsink), forming a complete thermal management path from the chip to the final heat dissipation environment. This design not only effectively improves the heat dissipation efficiency of key heat-generating points and reduces junction temperature, but also maintains the original electromagnetic shielding performance of the shielding cover, achieving synergistic optimization of thermal management and electromagnetic compatibility. The thermally conductive material can be selected from thermally conductive gel, thermally conductive silicone grease, or phase change thermal pads; no specific limitation is made here.

[0021] In this embodiment, the thermistor is used to provide the control unit with a temperature signal characterizing the corresponding heat-generating component. The components include a crystal oscillator for the heat-generating component, the control unit, N power electronic components, a first thermistor, a second thermistor, and N third thermistors corresponding one-to-one with the N power electronic components, where N is a natural number greater than 1.

[0022] The distance between the first thermistor and the crystal oscillator is no greater than a preset first distance, used to provide the control unit with a first temperature signal characterizing the ambient temperature of the crystal oscillator. The crystal oscillator is a frequency reference source that is highly sensitive to temperature. While not a primary heat-generating component, its output frequency drifts with changes in ambient temperature, directly affecting the clock synchronization accuracy and RF signal quality of the communication module. The first thermistor is positioned close to the crystal oscillator, directly sensing temperature changes in the local environment through heat conduction, causing its resistance to change accordingly. This resistance change is converted into a corresponding analog voltage signal by a voltage divider signal conditioning circuit, then sampled and quantized by the analog-to-digital converter integrated in the control unit to generate an original digital code value. Based on preset temperature-resistance characteristic parameters, the control unit calibrates and calculates this digital code value using a lookup table method or a calculation method, ultimately obtaining a first temperature signal accurately characterizing the ambient temperature of the crystal oscillator. This signal serves as a key input to the thermal management system, specifically for real-time temperature compensation and overheat warning for the temperature-sensitive crystal oscillator.

[0023] In this embodiment, the preset first distance is an optimized proximity distance, designed to enable the first thermistor to preferentially sense and accurately characterize the temperature of the adjacent space of the crystal oscillator, rather than the overall average temperature of the module's interior area far from the crystal oscillator or the ambient temperature dominated by other strong heat sources.

[0024] The second thermistor is integrated within the package of the control unit and provides a second temperature signal characterizing the junction temperature of the control unit. The control unit is the core heat source of the system, and the junction temperature (Tj) of its internal transistors is the most critical parameter determining reliability, performance, and lifespan. The second thermistor, integrated within the control unit package, is located directly adjacent to the junction temperature. By sensing changes in the junction temperature, its resistance changes accordingly. This resistance change is converted into an analog voltage signal by a signal conditioning circuit, and then into a digital code value by an analog-to-digital converter. Based on pre-stored temperature calibration parameters, the control unit uses a lookup table or calculation method to decode this digital code value into a digital temperature value characterizing the junction temperature, thereby generating the second temperature signal for thermal management decisions. This integrated design eliminates the temperature measurement errors and hysteresis introduced by package thermal resistance, enabling real-time and accurate monitoring of the CPU's junction temperature.

[0025] The distance between the third thermistor and the corresponding power electronic component is no greater than a preset second distance, and is used to provide the control unit with a third temperature signal characterizing the operating temperature of the corresponding power electronic component.

[0026] The spatial arrangement of the third thermistor and the corresponding power electronic components follows clearly defined engineering principles. The thermistor is positioned within a specific range from the power device, a distance that ensures it can promptly sense the effective temperature of the device's package surface through heat conduction, while avoiding interference with the device's high-frequency electrical characteristics. During placement, the thermistor is typically located on the main heat dissipation path of the power device or upstream of the heat flow to prioritize capturing the most severe temperature rises, ensuring timely and representative monitoring. This placement scheme has been optimized through thermal simulation and field testing, maintaining the system's electrical integrity and long-term mechanical reliability while ensuring rapid temperature response.

[0027] A third thermistor, closely attached to the power electronic components, converts changes in its surface temperature into changes in its resistance. This change is then converted into a corresponding analog voltage signal by a precision voltage divider circuit. This voltage signal is sampled and quantized by a high-precision analog-to-digital converter, converting it into a raw digital reading. Subsequently, the thermal management firmware in the control unit calls upon pre-stored calibration parameters and performs temperature conversion and nonlinear compensation on this digital value through table lookup or calculation models, ultimately generating a digital signal that accurately characterizes the operating temperature of the power devices—the third temperature signal. This signal is updated in a defined format and periodically, providing real-time and reliable temperature data input for the thermal management system's state decisions.

[0028] In this application, the power electronic components specifically refer to key semiconductor devices that perform high-power processing functions in vehicle wireless communication modules, including but not limited to RF power amplifiers, power diodes, power transistors, power resistors, and power capacitors.

[0029] As typical power devices, radio frequency (RF) power amplifiers operate in efficient amplification modes such as Class AB or Class E, amplifying weak baseband signals to watt-level transmit power in specific frequency bands (e.g., n77 / n79). These devices generate significant thermal dissipation (typically 1-3W) during power conversion, and their junction temperature directly affects key RF parameters such as output power stability, linearity, and adjacent channel leakage ratio. This application utilizes a dedicated third thermistor to achieve real-time monitoring of the PA chip junction temperature or hotspot temperature on the package surface.

[0030] These power electronic components share common technical characteristics, including: clearly defined thermal design power specifications and junction temperature-reliability derating curves; their electrical performance parameters (such as gain, efficiency, and noise figure) exhibit regular drift with temperature changes; and they require precise temperature monitoring to ensure performance stability under fluctuating automotive ambient temperatures.

[0031] In this embodiment, the power electronic components can also be other devices, such as power management units, memory controllers and high-speed interface devices, as well as other dedicated processing units.

[0032] In this embodiment, there are N power-type electronic components, where N is a natural number not less than 1. When N equals 1, the configuration is suitable for basic communication modules. In this case, the system only needs to monitor a single main heat source (such as an integrated RF front-end module), achieving cost and complexity optimization while ensuring core thermal management functions.

[0033] When N is greater than 1, the configuration is geared towards multi-RF channel, high integration, or high-performance application scenarios. The system can monitor multiple independent heat sources in parallel (such as discrete RF power amplifiers, power management chips, high-speed interface controllers, etc.), and achieve more refined zoned thermal control through independent acquisition and comprehensive evaluation of the temperature of each heat source.

[0034] The control unit is configured to execute state machine switching logic according to the priority order of the first temperature signal, the second temperature signal, and the third temperature signal, and dynamically adjust at least one operating parameter of the vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the vehicle wireless communication module; the priority of the first temperature signal is greater than the priority of the second temperature signal, and the priority of the second temperature signal is greater than the priority of the third temperature signal.

[0035] In this embodiment, the determination of the temperature value follows a preset priority order; wherein, the first thermistor signal corresponding to the crystal oscillator temperature has the highest priority, the second thermistor signal corresponding to the heating junction temperature of the control unit has the second highest priority, and the third thermistor signal corresponding to the heating junction temperature of the power electronic component has the lowest priority.

[0036] In this embodiment, the priority order is as follows: the first temperature signal has a higher priority than the second temperature signal, and the second temperature signal has a higher priority than the third temperature signal. The first priority is the first temperature signal, which is the temperature signal near the crystal oscillator monitored by the first thermistor. The crystal oscillator is the clock reference source for the entire network communication module. Its frequency drift with temperature will directly lead to modulation / demodulation misalignment, RF carrier offset, and consequently, link synchronization failure and a sharp increase in high-speed data bit error rate. Clock failure means the termination of the entire communication function. The crystal oscillator itself generates very little heat, but it is a temperature-sensitive device, and its overheating is usually caused by the environment or nearby heat sources. Once its ambient temperature exceeds the limit, the frequency accuracy may have already undergone unacceptable degradation. Therefore, as long as the ambient temperature of the crystal oscillator indicates that it may exceed its safe operating range, regardless of the temperature of other devices, the system must prioritize intervention measures (such as reducing the power of nearby heat sources) to protect this irreplaceable and non-redundant system cornerstone. Its threshold setting is strictly based on the frequency-temperature characteristic curve and maximum operating temperature of the crystal oscillator.

[0037] The second priority is the second temperature signal, which is the temperature of the control unit's heating junction monitored by the second thermistor. The control unit is the core of protocol stack processing, resource scheduling, and thermal management algorithm execution. Its thermal failure (such as thermal shutdown or a sharp performance degradation) will directly lead to protocol interruption, control logic disorder, and the loss of all intelligent management capabilities of the module. Furthermore, the CPU is the active heat-generating core, with high integration and high heat flux density. Its junction temperature is a direct indicator of computing load and heat dissipation conditions, and the CPU's thermal stability is second only to the clock. After ensuring clock safety, all efforts are made to ensure the reliable operation of the CPU. Its thresholds (derating threshold and shutdown threshold) are based on the junction temperature-reliability model of semiconductor technology and have a higher priority than other functional units.

[0038] The third priority is the third temperature signal, which is the temperature of the heating junction of the power electronic component monitored by the third thermistor. Power electronic components, such as RF power amplifiers (PAs), are critical functional execution units. Their failure will lead to the loss of specific functions (such as inability to transmit signals or supply power), but the core control and clock functions of the system may still exist. These devices are the main heat sources. Power devices are managed while ensuring the safety of the system core (clock, brain). Their thresholds are set according to the maximum junction temperature or case temperature specified in their respective datasheets, with a certain derating margin.

[0039] Among multiple third temperature signals, further sub-priority can be determined based on the maximum temperature value that the corresponding device can withstand. In the embodiments of this application, when N is greater than 1, the priority order among the N third temperature signals detected by the N third thermistors corresponds to the order of the maximum temperature values ​​that the N power electronic components can withstand. The higher the maximum temperature value that can be withstood, the lower the priority of the third temperature signal among the N third temperature signals.

[0040] In the embodiments of this application, the distance between the crystal oscillator and the control unit, and the distance between the crystal oscillator and each of the N power electronic components, are not less than a preset third distance.

[0041] The control unit is configured to execute switching logic of different state machines according to the priority order of the first temperature signal, the second temperature signal and the third temperature signal, and dynamically adjust at least one operating parameter of the vehicle wireless communication module based on the target state of the switched state machine, so as to control the temperature rise of the vehicle wireless communication module.

[0042] In the embodiments of this application, the control unit collects signals from all thermistors at a preset fixed period and executes a thermal management strategy based on a multi-state machine logic. The multi-state machine includes at least: a normal operating state, multiple progressively derating states, and a protective shutdown state. The control unit drives the state machine to switch between different states based on the comparison result of the collected temperature value and a preset threshold. The normal operating state is defined as the baseline operating mode of the vehicle-mounted wireless communication module, in which the module's data transmission rate, RF transmission power, and network service functions are not limited by the thermal management strategy. The protective shutdown state is defined as the highest level of protection under the thermal management strategy, in which the control unit controls the vehicle-mounted wireless communication module to execute an orderly shutdown process, causing all electronic components to stop working and cool down, thereby achieving ultimate thermal protection for the hardware device.

[0043] In the multi-state machine thermal management strategy constructed in this application embodiment, the multiple progressively derating states constitute a gradient control link between performance and thermal load. These states are triggered based on the temperature values ​​monitored by a specific thermistor sequentially exceeding a preset stepped threshold. The multiple progressively derating states include: a first derating state and a second derating state.

[0044] According to the priority order of the first temperature signal, the second temperature signal, and the third temperature signal, the switching logic of the state machine includes: comparing the first temperature signal, the second temperature signal, and the third temperature signal with their respective protection thresholds; when any temperature signal reaches its corresponding protection threshold, the state machine switches to the protection shutdown state.

[0045] In this embodiment, a safety protection judgment is first performed by comparing the first, second, and third temperature signals with their respective protection thresholds. These protection thresholds are the highest temperature limits set based on the thermal damage limits of each component. When any temperature signal reaches or exceeds its protection threshold, the system immediately triggers the highest level of thermal protection response, and the state machine unconditionally switches to the protection shutdown state. In this state, the control unit controls the communication module to execute an orderly shutdown process, completely cutting off power consumption for forced cooling to prevent irreversible hardware thermal damage.

[0046] If none of the temperature signals reach their protection threshold, the second temperature signal and the third temperature signal are compared with their corresponding derating thresholds in sequence according to the priority order. Based on the heat source type and threshold level corresponding to the first signal that reaches its derating threshold, the state machine is controlled to switch to the corresponding derating state.

[0047] The process of sequentially comparing the second temperature signal and the third temperature signal with corresponding derating thresholds includes: comparing the second temperature signal with a corresponding second derating threshold; if the second temperature signal reaches the second derating threshold, then switching the state machine to the corresponding target state based on the second derating threshold; if the second temperature signal does not reach the second derating threshold, then comparing the third temperature signal with a corresponding third derating threshold; if the third temperature signal reaches the third derating threshold, then switching the state machine to the corresponding target state based on the third derating threshold; wherein the second derating threshold and the third derating threshold are both independently set based on the safe operating temperature range of the corresponding heat source.

[0048] In this embodiment, if none of the temperature signals reach the protection threshold, a graded performance derating decision is initiated. At this stage, the crystal oscillator, being a temperature-sensitive rather than heat-generating device, does not participate in the derating triggering; it serves only as the highest-priority protection monitoring. The second temperature signal is judged sequentially, taking precedence over the third temperature signal. First, the second temperature signal (CPU junction temperature) is compared with its second derating threshold. This threshold is set based on the balance between CPU performance and reliability. If the second temperature signal reaches or exceeds this threshold, the control unit is determined to face overheating risk, and the state machine immediately switches to the first derating state, which is associated with CPU thermal management. In this state, the system reduces the heat generated by the core heat source at its source by dynamically reducing the CPU operating frequency or voltage.

[0049] When the second temperature signal does not reach its derating threshold, the third temperature signal is evaluated. The third temperature signal is compared with its third derating threshold. If the third temperature signal reaches or exceeds this threshold, the corresponding power electronic component is determined to be overheating, and the state machine switches to the second derating state, which is associated with the thermal management of the power device. In this state, the system may adopt strategies such as limiting RF transmission power and adjusting data transmission rates to specifically reduce the thermal load of specific functional modules. The second derating state is a set of states that can be further subdivided into multiple sub-states based on the type and function of the specific power electronic component corresponding to the third temperature signal. For example, there might be a third derating state corresponding to an RF power amplifier, a fourth derating state corresponding to a power management chip, etc. Different sub-states correspond to different performance adjustment strategies to achieve precise thermal control of specific power electronic components.

[0050] In an embodiment of the present application, the dynamic adjustment of at least one operating parameter of the vehicle-mounted wireless communication module includes: dynamically adjusting the operating frequency or voltage of the control unit; dynamically adjusting the radio frequency transmission power of the vehicle-mounted wireless communication module; dynamically adjusting the data transmission rate of the vehicle-mounted wireless communication module; restricting or suspending some network service functions of the vehicle-mounted wireless communication module.

[0051] In this embodiment, according to different target states determined by the state machine, the control unit will dynamically adjust at least one key operating parameter of the vehicle-mounted wireless communication module to achieve precise temperature rise control. Specifically, it includes: dynamically adjusting the operating point of the control unit: by means of dynamic voltage and frequency adjustment technology, reducing the operating frequency and / or core voltage of the CPU, directly reducing power consumption and heat generation from the source of the system operation core; dynamically adjusting the radio frequency transmission power: adjusting the transmission power level of the radio frequency front end of the communication module, especially for the power amplifier with high heat generation. By reducing the output power, the power consumption and heat dissipation of the radio frequency link can be significantly reduced; dynamically adjusting the data transmission rate: restricting the data throughput rate of the uplink and / or downlink. Reducing the data rate can reduce the workload of related circuits such as baseband processing and interface transmission, thereby reducing its dynamic power consumption; restricting or suspending specific network service functions: temporarily closing or restricting some non-urgent or high-load network service functions (for example, background data synchronization, secondary network connections, etc.). This is achieved by reducing the overall activity of the system to achieve global heat load reduction.

[0052] In an embodiment of the present application, the derating state includes multiple derating states, and the thermal management strategy includes a hysteresis control mechanism: when the state machine returns from the current i-th derating state to a lower j-th derating state or the normal operating state, where i is greater than j, the derating determination threshold Th_i based on which the i-th derating state is triggered is corrected; including: the actual threshold Th_j' for this return determination is obtained by subtracting a preset positive return value ΔT from the derating determination threshold Th_i, that is, Th_j' = Th_i - ΔT; where the corrected actual threshold Th_j' is lower than the original derating determination threshold Th_i (Th_j' < Th_i), thereby forming a temperature hysteresis interval at the state switching boundary to prevent the vehicle-mounted wireless communication module from frequently switching operating states near the temperature threshold.

[0053] In the thermal management strategy of an embodiment of the present application, a hysteresis control mechanism is integrated to enhance the stability of state switching and prevent frequent oscillations of the operating state due to small fluctuations of the temperature near the threshold point. The core of this mechanism is to introduce an asymmetric threshold determination condition for the state return process.

[0054] Specifically, when the vehicle-mounted wireless communication module needs to fall back from its current higher derating state (or protection state) to a lower derating state (or normal operating state) due to a temperature drop, the system does not directly use the original temperature threshold Th_i that triggered the entry into the denominator state as the fallback threshold. Instead, Th_i is offset by a preset positive fallback value ΔT, thus forming a more lenient actual threshold Th_j' used to determine whether it can stably maintain the denominator state. The calculation relationship is: Th_j' = Th_i - ΔT, where i>j, ensuring that Th_j' <Th_i。

[0055] The technical advantage of this mechanism lies in creating a temperature hysteresis interval Th_j', Th_i along the state transition path. The system only confirms that the thermal risk has been sufficiently mitigated and allows a rollback to a higher-performance state after the module temperature has dropped from Th_i to below Th_j'. This effectively avoids repeated state jumps near the Th_i critical point caused by temperature measurement noise, thermal inertia, or minor fluctuations in ambient temperature, thereby improving the robustness of thermal control decisions, the stability of system operation, and the user experience. It also helps reduce potential electrothermal stress on components caused by frequent state transitions.

[0056] In embodiments of this application, the control unit includes a main control CPU and a radio frequency transceiver.

[0057] The power consumption and heat generation of the main control CPU are primarily driven by the dynamic power consumption of transistor switching. This power consumption characteristic exhibits significant bursts, resulting in alternating peak and idle periods in heat dissipation; transient thermal pulses are particularly prone to occur during high-load operations such as packet transmission and reception or event processing. To prevent the CPU from triggering thermal shutdown due to overheating, its temperature needs to be closely monitored in real time. In practice, a thermistor can be placed near the heat-generating junction inside the CPU chip to achieve rapid acquisition and feedback of the junction temperature. Furthermore, it should be noted that the heat generated by the CPU under high load can be conducted to nearby RF transceivers through the PCB and shared heat dissipation paths, thereby raising their operating ambient temperature.

[0058] As the control core of the RF power amplifier, the performance of key modules such as the internal oscillator, low-noise amplifier, and filters in the RF transceiver is sensitive to temperature changes. Temperature drift can easily cause center frequency shift, decreased receiver sensitivity, and increased bit error rate, ultimately affecting the stability and quality of the communication link. Therefore, as shown in Figure 1, another thermistor can be placed close to the heating junction of the RF transceiver to accurately obtain its temperature information, providing a crucial input for system-level thermal management.

[0059] The state machine workflow of this application embodiment is shown in Figures 4-9. As shown in the figures, the thermistor (Negative Temperature Coefficient, NTC) placed near the crystal oscillator is denoted as NTC1, and the thermistor built into the control unit package is denoted as NTC2. In this embodiment, N is 2, corresponding to two power electronic components, namely the radio frequency transceiver and the radio frequency PA, and the thermistors corresponding to them are denoted as NTC3 and NTC4, respectively.

[0060] Figure 4 illustrates the software control flow of the wireless communication module in normal operation in this embodiment. After power-on, the module operates in this loop. The control unit collects the temperature values ​​of all thermistors at a fixed 3-second interval and determines whether to maintain the current state or transition to another state based on preset dual threshold and priority rules. All NTC resistors have a minimum monitoring value as a derating trigger threshold: NTC1 is 110℃ (highest priority), NTC2 and NTC3 are both 95℃ (medium priority), and NTC4 is 110℃ (lowest priority). The system determines the temperature value sequentially from highest to lowest priority. Once a temperature value reaches or exceeds its minimum monitoring value, it triggers the transition to the corresponding derating state. Each NTC resistor also has a maximum monitoring value as a protection trigger threshold: NTC1 is 110℃, NTC2 or NTC3 is 105℃, and NTC4 is 130℃. If any temperature value reaches or exceeds its maximum monitoring value, regardless of the current state, the module immediately enters a protection shutdown state and performs a shutdown to protect the hardware. If all temperature values ​​are below the minimum monitoring value, the module remains in normal operation and continues periodic monitoring. To achieve zero-delay protection for the temperature-sensitive crystal oscillator, this application adopts a single-point hard protection strategy for the NTC1: both its derating threshold and protection threshold are set to 110℃. Once this temperature is reached, the protection shutdown is triggered directly to avoid system failure due to crystal oscillator frequency inaccuracy.

[0061] Figure 5 illustrates the software control flow of the vehicle-mounted wireless communication module in the first derating state in this embodiment of the application. When the module enters this state, it executes the corresponding state control loop. In this state, only the temperature value of the NTC4 resistor can be used as a condition to trigger the transition to a higher derating state (second derating state).

[0062] Meanwhile, the system introduces hysteresis control in this state to improve stability: when the module needs to roll back from the first derating state to the normal operating state, a 7°C rollback value is introduced into the judgment threshold used for the NTC4 resistor. That is, the NTC4 temperature threshold used for rollback judgment is temporarily reduced from its original minimum monitoring value of 110°C to 103°C. This design extends the effective maintenance temperature range of the first derating state by 7°C, thereby effectively avoiding repeated switching between the normal operating state and the first derating state caused by small temperature fluctuations near the threshold critical point.

[0063] It should be noted that the backoff value is only applied to the backoff determination for lower load states. No similar backoff is set between higher derating states to ensure that when the temperature rises rapidly, the system can enter a deeper derating or protection state with a faster response time, thereby achieving timely protection of critical components.

[0064] Figure 6 illustrates the software control flow of the vehicle-mounted wireless communication module in the second derating state in this embodiment of the application. When the module enters this state, it executes the corresponding state control loop. In this state, only the temperature value of the NTC4 resistor can be used as a criterion to trigger a transition to a higher derating state.

[0065] To maintain stability, the system also incorporates hysteresis control in this state: when the module needs to roll back from the second derating state to the first derating state, a 7°C rollback threshold is introduced for the NTC4 resistor. That is, the NTC4 temperature threshold used for this rollback determination is temporarily reduced from its initial value of 110°C when it triggered the second derating state to 103°C. This design extends the effective operating temperature range of the second derating state by 7°C, thus preventing unnecessary frequent switching between the first and second derating states when the NTC4 temperature fluctuates around 110°C.

[0066] Figure 7 illustrates the software control flow of the vehicle-mounted wireless communication module in the third derating state in this embodiment of the application. When the module enters this state, it executes the corresponding state control loop. In this state, only the temperature value of the NTC2 or NTC3 resistor can be used as a criterion to trigger a transition to a higher derating state or a protection state.

[0067] To maintain stability, the system introduces hysteresis control for the core heat source in this state: when the module needs to fall back from the third derating state to a lower load state, the fallback thresholds used for NTC2 and NTC3 resistors will each be reduced by 5°C. That is, the temperature thresholds for NTC2 and NTC3 used for this fallback determination are temporarily reduced from the original minimum monitoring value of 95°C that triggered the entry into the third derating state to 90°C. This design extends the effective maintenance temperature range of the third derating state by 5°C, thereby preventing unnecessary frequent switching between the third derating state and the lower load state when the NTC2 or NTC3 temperature fluctuates around 95°C.

[0068] Figure 8 illustrates the software control flow of the vehicle-mounted wireless communication module in the fourth derating state in this embodiment of the application. When the module enters this state, it executes the corresponding state control loop. In this state, if the temperature value of any of the resistors NTC2, NTC3, or NTC4 exceeds its corresponding threshold, it can serve as a condition for triggering the transition to the protection shutdown state.

[0069] To maintain stability during this deep derating state, the system employs differentiated hysteresis control for multiple monitoring points: when a module needs to roll back from the fourth derating state to a lower load state, the temperature threshold used for the rollback determination is adjusted accordingly. Specifically, the rollback determination thresholds for NTC2 and NTC3 resistors are temporarily lowered by 5°C from their trigger values ​​for entering the fourth derating state, while the rollback determination threshold for NTC4 resistor is temporarily lowered by 7°C. This differentiated design effectively expands the temperature range for maintaining the fourth derating state, preventing frequent state switching caused by fluctuations in the temperature of multiple thermistors near their respective threshold points, thus ensuring the stability of system control during the deep derating phase.

[0070] Figure 9 illustrates the software control flow of the vehicle-mounted wireless communication module in the protective shutdown state in this embodiment of the application. When the module enters this state, the final protective shutdown process is executed. Under this process control, the control unit will systematically shut down all functional units of the wireless communication module, causing them to stop working and thus eliminating heat generation inside the module. This aims to allow electronic components to cool naturally under no-load conditions, fundamentally preventing performance degradation or permanent hardware damage caused by continuous high-temperature operation, achieving the ultimate protection goal of the thermal management system.

[0071] In the embodiments of this application, the thermal management system of the vehicle-mounted wireless communication module constructs a distributed temperature sensing network by deploying dedicated thermistors at key heat sources such as crystal oscillators, control units, and multiple power electronic components. The control unit collects the temperature at each point at a fixed period and makes thermal decisions based on a multi-state machine logic based on priority and dual thresholds. This state machine defines a complete set of operating states from normal state, multiple progressively derating states to final protection shutdown. State switching is driven by comparing the collected temperature with preset thresholds. To enhance stability, a control mechanism with hysteresis characteristics is introduced into the state fallback path. Based on the decided target state, the system dynamically adjusts the module's operating parameters (such as data processing rate, RF transmission power, etc.), forming a closed-loop control from sensing to decision-making to execution. This achieves precise and adaptive management of module temperature rise within a limited space, significantly improving the reliability, stability, and service life of the vehicle-mounted wireless communication module in high-temperature and harsh environments.

[0072] This application provides a thermal management method for an in-vehicle wireless communication module, applied to the thermal management system of the in-vehicle wireless communication module, including the process steps shown in FIG10.

[0073] S10, the control unit periodically acquires the temperature signals of the first thermistor, the second thermistor, and the third thermistor to obtain the first temperature signal, the second temperature signal, and the third temperature signal.

[0074] In this embodiment, the control unit synchronously acquires temperature signals from a first thermistor (corresponding to the ambient temperature of the crystal oscillator), a second thermistor (corresponding to the junction temperature of the control unit), and at least one third thermistor (corresponding to the operating temperature of each power electronic component) at a preset fixed period (e.g., 3 seconds). After analog-to-digital conversion and signal processing, the control unit obtains a first temperature signal, a second temperature signal, and a third temperature signal that characterize the real-time temperature state of each heat source point, providing accurate input data for subsequent thermal state decisions.

[0075] S11, according to the priority order of the first temperature signal, the second temperature signal and the third temperature signal, execute the switching logic of different state machines, and dynamically adjust at least one operating parameter of the vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the vehicle wireless communication module; the priority of the first temperature signal is greater than the priority of the second temperature signal, and the priority of the second temperature signal is greater than the priority of the third temperature signal.

[0076] In this embodiment, the control unit sequentially judges the first temperature signal, the second temperature signal, and the third temperature signal according to a preset priority rule; wherein the first temperature signal has the highest priority, followed by the second temperature signal, and the third temperature signal has the lowest priority; based on this priority order, the target operating state that the vehicle wireless communication module should enter is determined, and the target operating state is selected from a predefined set of states including a normal operating state, multiple progressively derating states, and a protective shutdown state; based on the control strategy mapped by the target state, at least one operating parameter of the vehicle wireless communication module is dynamically adjusted to control its temperature rise. The state machine switching logic and hysteresis control mechanism are consistent with those described in the previous system embodiment and will not be repeated here.

[0077] In embodiments of this application, the dynamic adjustment of at least one operating parameter includes at least one of the following methods: dynamically adjusting the operating frequency or voltage of the control unit; dynamically adjusting the radio frequency transmission power of the vehicle wireless communication module; dynamically adjusting the data transmission rate of the vehicle wireless communication module; and limiting or suspending specific network service functions of the vehicle wireless communication module.

[0078] In the embodiments of this application, the operating frequency and voltage of the control unit are dynamically adjusted to reduce heat generation at the source by reducing the computational load; the radio frequency transmission power of the vehicle wireless communication module is dynamically adjusted to control the temperature rise of the main heat source by reducing the power consumption of the radio frequency front end; the uplink or downlink data transmission rate of the vehicle wireless communication module is dynamically adjusted to reduce the dynamic power consumption of related processing units and interface circuits by limiting the data throughput; one or more non-core network service functions of the vehicle wireless communication module are restricted or suspended to reduce the overall system activity and achieve global heat load reduction.

[0079] The above adjustment methods can be executed individually or in combination according to the target operating state to achieve precise and graded control of the temperature rise of the vehicle wireless communication module.

[0080] In the embodiments of this application, the thermal management of the vehicle wireless communication module is applied to the thermal management system of the vehicle wireless communication module. By periodically collecting multiple temperature signals, and comparing and deciding based on a fixed priority order of crystal oscillator temperature being greater than control unit temperature, and control unit temperature being greater than power electronic component temperature, with a preset threshold, the system drives the state machine switching, including normal operation, multi-level derating, and protective shutdown. Then, based on the target state, the system dynamically adjusts parameters such as CPU frequency, RF power, data rate, or network service, forming a closed-loop control from perception to decision-making to execution, thereby achieving precise adaptive thermal management of the vehicle wireless communication module.

[0081] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A thermal management system for an in-vehicle wireless communication module, characterized in that, include: A printed circuit board (PCB) is provided with a heating element and a corresponding thermistor, the distance between the heating element and the corresponding thermistor being no greater than a preset distance; a shielding cover is placed over the heating element and connected to the PCB; a thermally conductive interface material is filled between the heating element and the shielding cover, and the heat generated by the heating element is conducted to the shielding cover through the thermally conductive interface material; the thermistor is used to provide a temperature signal characterizing the corresponding heating element to the control unit; the control unit is configured to execute state machine switching logic according to the priority order of the monitored temperature signals, and dynamically adjust at least one operating parameter of the vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the vehicle wireless communication module; The priority order corresponds to the order of the maximum temperature values ​​that the heating element can withstand; the higher the maximum temperature value that it can withstand, the lower the priority of the temperature signal.

2. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, The printed circuit board has multiple heat-conducting holes, through which the heat generated by the circuitry of the printed circuit board is conducted. The printed circuit board is a four-layer printed circuit board. The multiple heat-conducting holes include blind vias, buried vias, and through vias. Blind vias are provided between the first and second layers of the printed circuit board, and between the third and fourth layers. Buried vias are provided between the second and third layers of the printed circuit board. Through vias are provided between the first and fourth layers.

3. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, One side of the thermally conductive interface material is in contact with the shielding cover, and the other side is in contact with the heating element. The heat generated by the heating element is conducted to the shielding cover through the thermally conductive interface material, forming a heat conduction path.

4. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, The heating element includes a crystal oscillator, a control unit, and N power electronic components; the thermistor includes a first thermistor corresponding to the crystal oscillator, a second thermistor corresponding to the control unit, and N third thermistors corresponding to the N power electronic components; when N is greater than 1, the priority order of the N third temperature signals monitored by the N third thermistors corresponds to the order of the maximum temperature values ​​that the N power electronic components can withstand. The higher the maximum temperature value that can be withstood, the lower the priority of the third temperature signal among the N third temperature signals.

5. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, According to the priority order of the first temperature signal, the second temperature signal, and the third temperature signal, the switching logic of the state machine includes: comparing the first temperature signal, the second temperature signal, and the third temperature signal with their corresponding protection thresholds respectively; when any temperature signal reaches its corresponding protection threshold, the state machine switches to the protection shutdown state; if none of the temperature signals reach their protection thresholds, then according to the priority order, the second temperature signal and the third temperature signal are compared with their corresponding derating thresholds in sequence, and the state machine is controlled to switch to the corresponding derating state according to the heat source type and threshold level corresponding to the first signal that reaches its derating threshold.

6. The thermal management system for the vehicle-mounted wireless communication module according to claim 5, characterized in that, The process of sequentially comparing the second temperature signal and the third temperature signal with corresponding derating thresholds includes: comparing the second temperature signal with a corresponding second derating threshold; if the second temperature signal reaches the second derating threshold, then switching the state machine to the corresponding target state based on the second derating threshold; if the second temperature signal does not reach the second derating threshold, then comparing the third temperature signal with a corresponding third derating threshold; if the third temperature signal reaches the third derating threshold, then switching the state machine to the corresponding target state based on the third derating threshold; wherein the second derating threshold and the third derating threshold are both independently set based on the safe operating temperature range of the corresponding heat source.

7. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, The dynamic adjustment of at least one operating parameter of the vehicle-mounted wireless communication module includes: dynamically adjusting the operating frequency or voltage of the control unit; dynamically adjusting the radio frequency transmission power of the vehicle-mounted wireless communication module; dynamically adjusting the data transmission rate of the vehicle-mounted wireless communication module; and limiting or suspending some network service functions of the vehicle-mounted wireless communication module.

8. The thermal management system for the vehicle-mounted wireless communication module according to claim 5, characterized in that, The derating state includes multiple derating states, and the thermal management strategy includes a hysteresis control mechanism: when the state machine rolls back from the current i-th derating state to a lower j-th derating state or a normal operating state, where i is greater than j, the derating judgment threshold Th_i used to trigger the entry into the i-th derating state is corrected; this includes: the actual threshold Th_j' used for this rollback judgment is obtained by subtracting a preset positive rollback value ΔT from the derating judgment threshold Th_i, i.e., Th_j' = Th_i - ΔT; wherein, the corrected actual threshold Th_j' is lower than the original derating judgment threshold Th_i (Th_j' < Th_i), forming a temperature hysteresis interval at the state switching boundary to prevent the vehicle wireless communication module from frequently switching operating states near the temperature threshold.

9. The thermal management system for the vehicle-mounted wireless communication module according to claim 1, characterized in that, The control unit includes a main control CPU and an RF transceiver.

10. A thermal management method for an in-vehicle wireless communication module, applied to the thermal management system of the in-vehicle wireless communication module as described in any one of claims 1-9, characterized in that, The method includes: the control unit periodically acquiring temperature signals from a first thermistor, a second thermistor, and a third thermistor to obtain a first temperature signal, a second temperature signal, and a third temperature signal; executing switching logic of different state machines according to the priority order of the first temperature signal, the second temperature signal, and the third temperature signal; and dynamically adjusting at least one operating parameter of the vehicle wireless communication module based on the target state of the switched state machine to control the temperature rise of the vehicle wireless communication module; wherein the priority of the first temperature signal is greater than the priority of the second temperature signal, and the priority of the second temperature signal is greater than the priority of the third temperature signal.

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