Electronic equipment, heat conduction pad and manufacturing method of heat conduction pad

Abstract

The embodiment of the invention provides electronic equipment, a heat conduction pad and a manufacturing method thereof. The electronic equipment comprises a heating device, a heat dissipation device and a heat conduction pad. The heat-conducting pad is provided with a first heat-conducting surface and a second heat-conducting surface which are oppositely arranged along a first direction, the first heat-conducting surface is in thermal contact with the heat dissipation device, and the second heat-conducting surface is in thermal contact with the heating device; the heat conduction pad comprises at least two heat conduction layers arranged in a stacked mode in the second direction and heat conduction bonding layers clamped between the adjacent heat conduction layers, each heat conduction bonding layer comprises a metal heat conduction part and a bonding part, the bonding parts are used for bonding the corresponding two adjacent heat conduction layers, and the metal heat conduction parts are used for transferring heat between the adjacent heat conduction layers; the first direction intersects with the second direction, so that the heat conduction performance of the heat conduction pad can be improved, and the heat dissipation efficiency of the heating device is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device, a thermal pad, and a method for manufacturing the same. Background Technology

[0002] In electronic devices, heat dissipation devices typically make thermal contact with heat-generating devices to dissipate heat. A thermal interface material (TIM) is also placed between the heat dissipation device and the heat-generating device to improve heat transfer efficiency.

[0003] However, as the power consumption of heat-generating components in electronic devices continues to increase, the heat generated increases dramatically, and this structure is insufficient to meet the ever-growing heat dissipation requirements. Summary of the Invention

[0004] This application provides an electronic device, a thermal pad, and a method for manufacturing the same, which can improve the thermal conductivity of the thermal pad and thus enhance the heat dissipation efficiency for heat-generating devices.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide an electronic device, including: Heating devices; Heat dissipation devices; A thermal pad has a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along a first direction. The first thermally conductive surface is in thermal contact with a heat dissipation device, and the second thermally conductive surface is in thermal contact with a heat-generating device. The thermal pad includes: At least two thermally conductive layers are stacked along the second direction, and the first direction intersects the second direction; A thermally conductive adhesive layer is sandwiched between adjacent thermally conductive layers. The thermally conductive adhesive layer includes a metal thermally conductive part and an adhesive part. The adhesive part is used to bond two adjacent thermally conductive layers, and the metal thermally conductive part is used to transfer heat between adjacent thermally conductive layers to transfer the heat of the heat-generating device to the heat dissipation device.

[0006] The electronic device provided according to the embodiments of this application: by designing a thermally conductive adhesive layer and placing it between adjacent thermally conductive layers, not only is a stable bond between the interlayer structures achieved through the adhesive portion, but a high thermal conductivity component—a metal thermally conductive portion—is also filled between adjacent thermally conductive layers. Accordingly, the metal thermally conductive portion substantially constructs a high thermal conductivity path between adjacent thermally conductive layers, enhancing the thermal conductivity in the heat transfer direction from the heat-generating device to the heat-dissipating device. Furthermore, the high thermal conductivity component provided by the metal thermally conductive portion between layers facilitates the rapid diffusion of heat within the thermal pad along a second direction, thereby improving the overall heat transfer efficiency of the thermal pad.

[0007] In one implementation, a metal heat-conducting part is disposed on at least one surface of the heat-conducting layer located in the second direction, and the metal heat-conducting part and the surface surround to form an accommodating space; the adhesive part fills the accommodating space.

[0008] In the embodiments of this application, In one implementation, the metal heat-conducting part is configured as a metal nanowire structure, and the projection of the metal nanowire structure on the surface is an overlapping mesh structure.

[0009] In this embodiment, a complete, continuous, and low-resistance substrate is constructed using a metal nanowire structure. The adhesive portion then serves as an auxiliary component for filling and fixing, which helps to enhance the thermal conductivity of the metal nanowire structure, weaken the negative impact of the thermal resistance of the adhesive portion, reduce the contact thermal resistance between the thermally conductive layer and the metal thermally conductive portion, and improve the thermal diffusion performance of the thermal pad in the second direction, thereby enhancing the overall thermal conductivity of the thermal pad.

[0010] In one implementation, the ratio of the dimension of the metal heat-conducting part along the second direction to the dimension of the heat-conducting layer along the second direction is 0.5 to 50.

[0011] In this embodiment, by configuring the ratio of the dimension of the metal heat-conducting part along the second direction to the dimension of the heat-conducting layer along the second direction to be 0.5 to 50, the thermal conductivity of the heat-conducting pad is ensured while its structural stability is also ensured.

[0012] In one implementation, the first dimension of the metal heat-conducting part along the second direction is 0.5 micrometers to 50 micrometers.

[0013] In one implementation, the thermally conductive layer is a graphene layer.

[0014] Secondly, embodiments of this application provide a thermal conductive pad, comprising: A first thermally conductive surface and a second thermally conductive surface are arranged opposite to each other along a first direction. The first thermally conductive surface is used to make thermal contact with a heat dissipation device, and the second thermally conductive surface is used to make thermal contact with a heat-generating device. At least two thermally conductive layers are stacked along the second direction, and the first direction intersects the second direction; A thermally conductive adhesive layer is sandwiched between adjacent thermally conductive layers. The thermally conductive adhesive layer includes a metal thermally conductive part and an adhesive part. The adhesive part is used to bond two adjacent thermally conductive layers, and the metal thermally conductive part is used to transfer heat between adjacent thermally conductive layers to transfer the heat of the heat-generating device to the heat dissipation device.

[0015] The thermal pad provided in this application embodiment: by designing a thermally conductive adhesive layer and placing it between adjacent thermally conductive layers, not only is a stable bond between the interlayer structures achieved through the adhesive portion, but a high thermal conductivity component—a metal thermally conductive portion—is also filled between adjacent thermally conductive layers. Accordingly, the metal thermally conductive portion substantially constructs a high thermal conductivity path between adjacent thermally conductive layers, enhancing thermal conductivity in the heat transfer direction. Furthermore, the high thermal conductivity component provided by the metal thermally conductive portion between layers facilitates rapid heat diffusion along a second direction within the thermal pad, thereby improving the overall heat transfer efficiency of the thermal pad.

[0016] In one implementation, the metal heat-conducting part is a metal nanowire structure, and the projection of the metal nanowire structure on the surface is an overlapping mesh structure.

[0017] In this embodiment, a complete, continuous, and low-resistance substrate is constructed using a metal nanowire structure. The adhesive portion then serves as an auxiliary component for filling and fixing, which helps to enhance the thermal conductivity of the metal nanowire structure, weaken the negative impact of the thermal resistance of the adhesive portion, reduce the contact thermal resistance between the thermally conductive layer and the metal thermally conductive portion, and improve the thermal diffusion performance of the thermal pad in the second direction, thereby enhancing the overall thermal conductivity of the thermal pad.

[0018] Thirdly, embodiments of this application provide a method for manufacturing a thermal pad, comprising: It provides heat-generating components, heat-dissipating components, and multiple thermally conductive layers; A metal thermally conductive portion and an adhesive portion are formed on at least one side surface of each thermally conductive layer located in the second direction; Multiple thermally conductive layers forming the metal thermally conductive part and the adhesive part are stacked along the second direction and then pressed together to obtain a thermally conductive pad. The first and second thermally conductive surfaces of the thermal pad, which are arranged opposite each other along a first direction, are in thermal contact with the heat-generating device and the heat-dissipating device, respectively, wherein the first direction intersects with the second direction.

[0019] According to the manufacturing method of the thermal pad provided in the embodiments of this application: by providing multiple thermal conductive layers, and forming a metal thermal conductive part and an adhesive part with thermal conductive and adhesive functions on at least one side surface of each thermal conductive layer along the second direction, and then stacking and pressing the processed thermal conductive layers along the second direction to finally form a thermal pad, thereby constructing a low thermal resistance heat transfer path in the thermal pad and improving the overall heat dissipation capacity and reliability of the thermal pad.

[0020] In one implementation, a metal thermally conductive portion and an adhesive portion are formed on at least one surface of each thermally conductive layer located in the second direction, including: A metal heat-conducting part is formed on the surface, and the metal heat-conducting part and the surface enclose an accommodating space; The adhesive is filled into the accommodating space and cured to form the adhesive portion.

[0021] In this embodiment, a metal thermally conductive portion is first formed on the surface of the thermally conductive layer, which, together with the surface, encloses an accommodating space. Then, an adhesive is filled and cured within this space to form an adhesive portion. The metal thermally conductive portion constructs a highly thermally conductive substrate, while the adhesive is used to fix adjacent thermally conductive layers. This structural design minimizes the volume percentage of the adhesive in the heat transfer path, reducing the negative impact of the adhesive on the overall thermal resistance, while ensuring the mechanical strength and stability of the interlayer bond between the thermally conductive layer and the thermally conductive adhesive layer.

[0022] In one implementation, a metal heat-conducting portion is formed on the surface, including: A metal nanowire solution is coated on the surface, which is obtained by dissolving metal nanowires in a solvent. The metal nanowire solution is dried to form a thermally conductive metal part on the surface.

[0023] In this embodiment, a simple preparation method is provided to form a metal thermally conductive part by coating a metal nanowire solution onto the surface and then drying it. The metal nanowire solution can be uniformly coated on the surface of the thermally conductive layer, forming a mesh structure after drying. This structure not only has extremely high thermal conductivity, but its naturally formed voids also reserve space for the subsequent penetration of the adhesive, optimizing the thermal and mechanical properties between adjacent thermally conductive layers.

[0024] In one implementation, filling the accommodating space with adhesive includes: Introduce the adhesive into the accommodating space; After the adhesive has penetrated, wipe away any adhesive that has overflowed into the containment space.

[0025] In this embodiment, by first introducing the adhesive to penetrate the accommodating space and then removing the excess portion, it is ensured that the adhesive is accurately and fully filled into the accommodating space. This effectively avoids the increase in thermal resistance at the interface between the thermally conductive layer and the thermally conductive adhesive layer caused by excessive use of adhesive, and ensures that the metal thermally conductive part can fully contact the adjacent layer. Thus, while achieving reliable bonding, the heat transfer function of the metal thermally conductive part is maximized, and the overall performance of the thermal pad is improved. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 This is a schematic diagram of a heat dissipation device in an electronic device that provides heat dissipation for a heat-generating device, according to an embodiment of this application. Figure 3A yes Figure 2 The heat dissipation device shown is a schematic diagram of the heat dissipation structure of the heat-generating device cut along AA. Figure 3B yes Figure 2 The heat dissipation device shown is a schematic diagram of the structure of the heat dissipation device with the thermally conductive adhesive layer cut along BB. Figure 4 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 1 ; Figure 5 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 2 ; Figure 6 This is flowchart three of a method for manufacturing a thermal pad according to an embodiment of this application; Figure 7 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 4 .

[0027] Explanation of reference numerals in the attached figures: 1000 - Electronic equipment; 200 - Heat dissipation device; 300 - Heat-generating device; 100 - Thermal pad; 101-First thermally conductive surface; 102-Second thermally conductive surface; 10-Temperature conductive layer; 11-First end face; 12-Second end face; 13-Surface; 20-Temperature conductive adhesive layer; 21-Adhesive part; 22-Metal thermally conductive part; 23-Third end face; 24-Fourth end face; T1 - First direction; T2 - Second direction; d1 - First dimension; d2 - Second dimension; d3 - Third dimension; d4 - Fourth dimension; d5 - Fifth dimension. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is merely for illustration and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of components in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0029] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0030] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that the terms "inner," "outer," and other terms (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the accompanying drawings are only used to briefly illustrate the technical solutions provided by the embodiments of this application. For example, some housings do not have their wall thickness shown; it should be understood that these housings have walls, and they need not be understood according to the lines shown in the accompanying drawings.

[0032] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities at the point of connection are not connected through a transitional structure, but are simply linked together to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0033] As the power consumption of heat-generating components in electronic devices continues to increase, the heat generated is increasing dramatically, leading to a continuous growth in the demand for heat dissipation from these components.

[0034] In some implementations, the electronic device may be a server.

[0035] It should be noted that the server is only an example of an electronic device, and the embodiments of this application do not impose specific limitations on the types of electronic devices.

[0036] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 This is a schematic diagram of a heat dissipation device in an electronic device that dissipates heat from a heat-generating device, as provided in an embodiment of this application.

[0037] Reference Figure 1 and Figure 2 As shown in the embodiments of this application, the electronic device 1000 includes a heating element 300.

[0038] In some implementations, the heat-generating device 300 can be a chip with high computing power requirements, such as a central processing unit (CPU), a graphics processing unit (GPU), or an embedded neural network processing unit (NPU). Such chips consume a lot of power and generate significant heat when running complex computing tasks.

[0039] In other embodiments, the heat-generating device 300 can be a network communication chip, such as a baseband chip, Wi-Fi / Bluetooth chip, etc. Such chips also generate more heat due to increased power consumption during high-speed data transmission and reception or signal modulation and demodulation.

[0040] It should be noted that CPU, GPU, NPU and network communication chip are only examples of heat-generating device 300. Heat-generating device 300 may also include, but is not limited to, memory chips, power management chips and other electronic components that generate heat and need to be dissipated during operation. The above examples do not constitute a limitation on the types of heat-generating device 300.

[0041] In this embodiment, the electronic device 1000 further includes a heat dissipation device 200. The heat dissipation device 200 is in thermal contact with the heat-generating device 300 to cool the heat-generating device 300. In other words, the heat-generating device 300 can transfer its own heat to the heat dissipation device 200, thereby reducing its own temperature.

[0042] Here, thermal contact can be understood as a physical connection between the heat dissipation device 200 and the heat generation device 300 that allows heat to be directly transferred through the interface. In other words, heat can be transferred between the heat dissipation device 200 and the heat generation device 300.

[0043] In some embodiments, the electronic device 1000 is configured to dissipate heat from the heat-generating device 300 using air cooling, in which case the heat dissipation device 200 can be configured as a heat sink. The heat sink maintains thermal contact with the heat-generating device 300, enabling heat transfer from the heat-generating device 300 to the heat sink. Accordingly, the electronic device 1000 is also equipped with a cooling fan to blow air onto the heat sink, thereby enhancing convective heat transfer between the heat sink surface and the surrounding air, and dissipating heat into the air.

[0044] In some examples, the heat sink is configured as a metal heat sink.

[0045] In other embodiments, the electronic device 1000 is configured to dissipate heat from the heat-generating device 300 using liquid cooling, in which case the heat dissipation device 200 can be configured as a liquid-cooled plate. The liquid-cooled plate maintains thermal contact with the heat-generating device 300, enabling heat transfer from the heat-generating device 300 to the cooling medium within the liquid-cooled plate. Accordingly, the electronic device 1000 is also equipped with a cooling unit for cooling the cooling medium after it has absorbed heat; the cooled cooling medium is then circulated back to the liquid-cooled plate, thereby continuously absorbing the heat generated by the heat-generating device 300.

[0046] It should be noted that the heat sink and liquid cooling plate are only examples of heat dissipation device 200. Heat dissipation device 200 can also be a heat spreader, heat pipe or other heat dissipation device. This application embodiment does not impose specific restrictions on the type of heat dissipation device 200.

[0047] Figure 3A yes Figure 2 The heat dissipation device shown is a schematic diagram of the heat dissipation structure of the heat-generating device cut along AA.

[0048] Combination Figure 3A As shown in the embodiment of this application, the electronic device 1000 further includes a thermal pad 100, which is placed between the heat-generating device 300 and the heat-dissipating device 200. The thermal pad 100 has a first thermally conductive surface 101 and a second thermally conductive surface 102 disposed opposite to each other along a first direction T1. The first thermally conductive surface 101 is in thermal contact with the heat-dissipating device 200, and the second thermally conductive surface 102 is in thermal contact with the heat-generating device 300.

[0049] It should be noted that, in this embodiment of the application, in order to better demonstrate the structure of the thermal pad 100, Figures 2-3B The thickness ratio of the thermal pad 100, the heating element 300, and the heat dissipation element 200 in the figure is not the actual product ratio. Figures 2-3B The image is merely an illustrative representation of the positional relationship between 100, the heating element 300, and the heat dissipation element 200, and does not constitute a limitation on the thickness, dimensions, or proportions of the three components.

[0050] Through the above scheme, the heat from the heating device 300 flows into the thermal pad 100 via the second thermally conductive surface 102, flows out of the thermal pad 100 via the first thermally conductive surface 101, and then flows into the heat dissipation device 200. Thus, the thermal pad 100 reduces the contact thermal resistance between the heating device 300 and the heat dissipation device 200, improving heat transfer efficiency.

[0051] Here, contact thermal resistance refers to the additional thermal resistance encountered during heat conduction across the interface when two solid surfaces are in contact, due to the non-ideal contact interface. Accordingly, in the embodiments of this application, the contact thermal resistance between the heat-generating device 300 and the heat-dissipating device 200 can be understood as follows: due to the microscopic unevenness (including planar warpage and surface roughness) existing on the contact surfaces of the two, gaps exist between the actual contact areas; these gaps are often filled by air, a medium with low thermal conductivity, thereby introducing significant additional thermal resistance in the heat conduction path.

[0052] In some embodiments, the thermal pad 100 is elastic and can be compressed and installed between the heating device 300 and the heat dissipation device 200 to fill the air gaps caused by microscopic unevenness, height difference or tolerance on the surfaces of the heating device 300 and the heat dissipation device 200, thereby achieving stable thermal contact between the thermal pad 100 and the heat dissipation device 200 and the heating device 300.

[0053] In some examples, the distance between the heating device 300 and the heat dissipation device 200 along the first direction T1 can be configured to be less than the distance between the thermal pad 100 and the heat dissipation device 200 along the first direction T1, so that the thermal pad 100 is interference-fitted between the heating device 300 and the heat dissipation device 200, so as to achieve stable thermal contact between the first thermally conductive surface 101 and the second thermally conductive surface 102 and the heating device 300 and the heat dissipation device 200, respectively.

[0054] Figure 3B yes Figure 2 The heat dissipation device shown is a schematic diagram of the thermally conductive adhesive layer cut along BB in the heat dissipation structure of the heat dissipation device.

[0055] Combination Figure 3A and Figure 3B As shown in the embodiment of this application, the thermal pad 100 includes at least two thermally conductive layers 10. The at least two thermally conductive layers 10 are stacked along the second direction T2, and the first direction T1 intersects the second direction T2.

[0056] Here, the thermally conductive layer 10 has good thermal conductivity and is mainly used to provide good thermal conductivity for the thermally conductive pad 100.

[0057] In some embodiments, the heat-conducting layer 10 may be configured to be made of materials such as aluminum oxide, boron nitride, and graphene. This application embodiment does not impose specific limitations on the material of the heat-conducting layer 10.

[0058] In some embodiments, at least two heat-conducting layers 10 are stacked along a second direction T2. ​​Correspondingly, the first end faces 11 of the plurality of heat-conducting layers 10 located on the same side along a first direction T1 together form a first heat-conducting surface 101, and the second end faces 12 of the plurality of heat-conducting layers 10 located on the same side along the first direction T1 together form a second heat-conducting surface 102. In other words, each heat-conducting layer 10 has a first end face 11 and a second end face 12 disposed opposite to each other along the first direction, the plurality of first end faces 11 together form the first heat-conducting surface 101, and the plurality of second end faces 12 together form the second heat-conducting surface 102.

[0059] In some examples, at least two thermally conductive layers 10 have the same first dimension d1 along a first direction, so that at least two thermally conductive layers 10 are stacked along a second direction T2, a plurality of first end faces 11 are flush to form a first thermally conductive surface 101, and a plurality of second end faces 12 are flush to form a second thermally conductive surface 102.

[0060] Here, the first dimension d1 can be understood as the distance between the first end face 11 and the second end face 12 of the heat-conducting layer 10.

[0061] In some examples, the first direction T1 and the second direction T2 are perpendicular or approximately perpendicular to each other.

[0062] In other examples, the angle between the first direction T1 and the second direction T2 includes an acute angle.

[0063] In this embodiment, the thermal pad 100 further includes a thermally conductive adhesive layer 20. The thermally conductive adhesive layer 20 is sandwiched between adjacent thermally conductive layers 10. The thermally conductive adhesive layer 20 includes a metal thermally conductive portion 22 and an adhesive portion 21. The adhesive portion 21 is used to bond two adjacent thermally conductive layers 10, and the metal thermally conductive portion 22 is used to transfer heat between adjacent thermally conductive layers 10, so as to transfer the heat of the heating device 300 to the heat dissipation device 200.

[0064] Therefore, by designing a thermally conductive adhesive layer 20 and placing it between adjacent thermally conductive layers 10, not only is a stable bond between the layers achieved through the adhesive portion 21, but a high thermal conductivity component—a metal thermally conductive portion 22—is also filled between adjacent thermally conductive layers 10. Correspondingly, the metal thermally conductive portion 22 substantially constructs a high thermal conductivity path between adjacent thermally conductive layers 10, enhancing the thermal conductivity in the heat transfer direction from the heat-generating device 300 to the heat-dissipating device 200. Furthermore, the high thermal conductivity component provided by the metal thermally conductive portion 22 between layers facilitates rapid heat diffusion along the second direction T2 within the thermally conductive pad 100, thereby improving the overall heat transfer efficiency of the thermally conductive pad 100.

[0065] In some embodiments, the thermal pad 100 includes two thermally conductive layers 10, and the thermal pad 100 also includes a thermally conductive adhesive layer 20. Thus, the thermally conductive adhesive layer 20 is sandwiched between the two thermally conductive layers 10. Consequently, the outermost edge of the thermal pad 100 along the second direction T2 is the surface of the thermally conductive layer 10, thereby effectively preventing external impurities from adhering to the thermal pad 100 during assembly and use.

[0066] In other embodiments, the thermal pad 100 includes N thermally conductive layers 10, and the thermal pad 100 includes N-1 thermally conductive adhesive layers 20. The N-1 thermally conductive adhesive layers 20 are respectively sandwiched between every two adjacent thermally conductive layers 10. Thus, the outermost part of the thermal pad 100 along the second direction T2 is the thermally conductive layer 10, to maintain the cleanliness of the surface of the thermal pad 100 along the second direction. Here, N is an integer greater than or equal to three.

[0067] Reference Figure 3A As shown, in some embodiments, the thermally conductive adhesive layer 20 has a third end face 23 and a fourth end face 24 disposed opposite to each other along the first direction T1. The first end face 11 of the thermally conductive layer 10 and the third end face 23 of the metal thermally conductive portion 22 together form a first thermally conductive surface 101, and the second end face 12 of the thermally conductive layer 10 and the fourth end face 24 of the metal thermally conductive portion 22 together form a second thermally conductive surface 102.

[0068] In some examples, the second dimension d2 of the thermally conductive adhesive layer 20 along the first direction T1 is configured to be equal to the first dimension d1 of the thermally conductive layer 10, so that the first end face 11 of the thermally conductive layer 10 and the third end face 23 of the metal thermally conductive part 22 are flush, forming a flat first thermally conductive surface 101, and the second end face 12 of the thermally conductive layer 10 and the fourth end face 24 of the metal thermally conductive part 22 are flush, forming a flat second thermally conductive surface 102. This increases the thermal contact area between the thermal pad 100 and the heat dissipation device 200 and the heat-generating device 300, reduces contact thermal resistance, and thus improves the overall heat transfer efficiency.

[0069] Here, the second dimension d2 can be understood as the distance between the third end face 23 and the fourth end face 24 of the thermally conductive adhesive layer 20 along the first direction T1.

[0070] In other examples, the thermally conductive adhesive layer 20 can be alternately stacked and bonded with multiple thermally conductive layers 10 to form a thermally conductive pad blank; then the blank can be cut along the second direction T2 to obtain a thermally conductive pad 100 with a flat first thermally conductive surface 101 and a flat second thermally conductive surface 102, thereby ensuring sufficient and uniform thermal contact between it and the heat dissipation device 200 and the heat generation device 300.

[0071] In some embodiments, the metal heat-conducting portion 22 can be formed by curing a metal heat-conducting solution, and the adhesive portion can be formed by curing an adhesive. As an example, an adhesive can be incorporated into the metal heat-conducting solution to form a heat-conducting adhesive solution, and then the heat-conducting adhesive solution can be cured between adjacent heat-conducting layers 10 to form a heat-conducting adhesive layer 20.

[0072] Reference Figure 3B As shown, in some embodiments, the metal thermally conductive portion 22 may be disposed on at least one surface 13 of the thermally conductive layer 10 located in the second direction T2, and the metal thermally conductive portion 22 and the surface 13 enclose an accommodating space (not shown in the figure); the adhesive portion 21 fills the accommodating space to form a thermally conductive adhesive layer 20. Thus, the metal thermally conductive portion 22 constructs a complete, continuous, and low-resistance substrate, and the adhesive portion 21 plays an auxiliary role in filling and fixing, which is beneficial to enhance the thermal conductivity of the metal thermally conductive portion 22, weaken the negative impact of the thermal resistance of the adhesive portion 21, reduce the contact thermal resistance between the thermally conductive layer 10 and the metal thermally conductive portion 22, improve the thermal diffusion performance of the thermal pad 100 in the second direction, and thereby improve the overall thermal conductivity of the thermal pad 100.

[0073] Accordingly, the thermal pad 100 can be used for efficient heat dissipation in TIM1, TIM1.5, or TIM2 scenarios. Here, TIM1, TIM1.5, or TIM2 refer to the grades of TIM materials.

[0074] Regarding the placement of the metal heat-conducting part 22, the heat-conducting layer 10 differs in the following ways depending on its location: In some embodiments, for the two outermost heat-conducting layers 10 located in the second direction T2, a metal heat-conducting part 22 is provided on the surface 13 of the heat-conducting layer 10 located in the second direction T2 towards the inside of the heat-conducting pad 100.

[0075] In some embodiments, for the heat-conducting layer 10 located in the middle of the second direction T2 (i.e., the heat-conducting layer 10 excluding the two outermost heat-conducting layers 10), the metal heat-conducting part 22 is provided on at least one side surface 13 of the heat-conducting layer 10 located in the second direction T2.

[0076] For ease of description, the two surfaces of the central heat-conducting layer 10 in the second direction T2 are referred to as the left surface and the right surface, respectively. The left and right directions are shown in the attached diagram. Figure 3A As shown.

[0077] In some examples, the metal heat-conducting portion 22 is disposed on the right surface of each central heat-conducting layer 10. Accordingly, the right surface of the heat-conducting adhesive layer 20 in the second direction is connected to the left surface of the heat-conducting layer 10 to its right, thereby forming a structure of heat-conducting layers 10 connected to each other.

[0078] Similarly, the metal heat-conducting part 22 can be provided on the left surface of each central heat-conducting layer 10. Accordingly, the left surface of the heat-conducting adhesive layer 20 in the second direction is connected to the right surface of the heat-conducting layer 10 to its left, forming a structure of interconnected heat-conducting layers 10.

[0079] In other examples, a metal heat-conducting portion 22 is provided on both the left and right surfaces of each central heat-conducting layer 10. Correspondingly, along the second direction to the right, the heat-conducting adhesive layer 20 on the right surface of the preceding heat-conducting layer 10 is connected to the heat-conducting adhesive layer 20 on the left surface of the following heat-conducting layer 10 to form a stacked structure of heat-conducting layers 10. Since the heat-conducting adhesive layer 20 itself has a certain elasticity, when two heat-conducting adhesive layers 20 are bonded together, the interface contact will be tighter under the action of elasticity, which is beneficial to improving heat transfer performance.

[0080] The arrangement of the heat-conducting metal part 22 and the surface 13 to form an accommodating space can be achieved in the following ways: In some embodiments, the metal heat-conducting portion 22 can be formed on the surface 13 by patterning processes such as photolithography and etching. In this case, the metal heat-conducting portion 22 is constructed as protrusions that are spaced outward from the surface 13, and the protrusions and the surface 13 surround and form an accommodating space.

[0081] In other embodiments, the metal heat-conducting part 22 may be configured as a metal foam structure having interconnected cavities, the walls of the cavities and the surface 13 forming an accommodating space.

[0082] Reference Figure 3B As shown, in some embodiments, the metal heat-conducting part 22 is configured as a metal nanowire structure. The projection of the metal nanowire structure onto the surface is an overlapping mesh structure. The voids in the mesh structure and the surface 13 enclose an accommodating space.

[0083] In some examples, the metal nanowire structure may include, but is not limited to, being made of one or more of gold, silver, copper, or other metal nanowires.

[0084] In some examples, metal nanowire structures can be obtained by drying a metal nanowire solution. This metal nanowire solution is a dispersion formed by dispersing nanowires in a solvent.

[0085] The solvent in the solution may include one of water, alcohols, acetone, esters, etc. By drying the metal nanowire solution to remove the solvent, a metal thermally conductive part 22 can be obtained attached to the surface 13.

[0086] In some examples, the solubility range of the metal nanowire solution is from 10 g / L to 100 g / L, for example, 10, 17, 35, 100 or other values. This application does not impose specific limitations on the solubility of the metal nanowire solution.

[0087] It should be noted that when the solubility of the metal nanowire solution is less than 10 g / L, the content of metal nanowires is too low to form a metal thermally conductive part with a third dimension d3; when the solubility of the metal nanowire solution is greater than 100 g / L, the content of metal nanowires is too high, resulting in an overly dense metal thermally conductive part with limited space, making it difficult to accommodate sufficient binder for bonding. Therefore, the solubility range of the metal nanowire solution is 10 g / L to 100 g / L.

[0088] The drying process parameters can be configured as follows: the drying temperature can be between 30°C and 120°C, and the drying time can be between 0.5 and 2 hours. The actual drying parameters need to be determined comprehensively based on the size of the metal nanowire structure in the second direction, the type of solvent in the solution, and the type of metal nanowire. This application does not limit the specific drying parameters.

[0089] Here, the dimension of the metal nanowire structure along the second direction can be understood as the distance between the two opposite outer walls of the metal heat-conducting part 22 located in the second direction.

[0090] In some examples, the ratio of the dimension of the metal heat-conducting part 22 along the second direction (understood as the third dimension d3) to the dimension of the heat-conducting layer 10 along the second direction (understood as the fifth dimension d5) is 0.5 to 50, for example 0.5, 12, 28, 50 or other values. The comparison value is not specifically limited in the embodiments of this application.

[0091] It should be noted that if the ratio is less than 0.5, the third dimension d3 of the metal heat-conducting part 22 is too thin, resulting in weak interlayer bonding with the adjacent heat-conducting layer 10 and low structural stability. If the ratio is greater than 50, the fifth dimension d5 of the heat-conducting layer is too thin, causing the heat-conducting layer to cease to be the main structure of the heat-conducting pad 100, thereby significantly weakening the heat-conducting function of the heat-conducting pad 100. Therefore, the ratio of the dimension of the metal heat-conducting part 22 along the second direction (understood as the third dimension d3) to the dimension of the heat-conducting layer 10 along the second direction (understood as the fifth dimension d5) is between 0.5 and 50.

[0092] In some examples, the third dimension d3 of the metal heat-conducting part 22 along the second direction is 0.5 micrometers to 50 micrometers, such as 0.5, 12, 28, 50 or other values. This application embodiment does not impose a specific limitation on this ratio.

[0093] It should be noted that if the third dimension d3 of the metal heat-conducting part 22 is less than 0.5 micrometers, the metal heat-conducting part 22 cannot form an accommodating space for accommodating the adhesive part 21. If the third dimension d3 of the metal heat-conducting part 22 is greater than 50 micrometers, the metal heat-conducting part 22 will exhibit rigidity due to its higher specific gravity, reducing its thermal contact area with the peripheral interface and hindering the reduction of contact thermal resistance. Therefore, the third dimension d3 of the metal heat-conducting part 22 along the second direction is between 0.5 micrometers and 50 micrometers.

[0094] Here, the third dimension d3 of the metal heat-conducting part 22 can be understood as the distance between the two opposite outer walls of the metal heat-conducting part 22 in the second direction.

[0095] In some examples, when the metal heat-conducting part 22 is configured as a metal nanowire structure, the metal nanowire structure includes multiple metal nanowires, and the diameter of the metal nanowires can be configured to be from 0.05 micrometers to 0.5 micrometers. The length of the metal nanowires can be configured to be from 1 to 500 micrometers.

[0096] In some examples, after the adhesive portion 21 is filled into the accommodating space, the fourth dimension d4 of the resulting thermally conductive adhesive layer 20 along the second direction is equal to the third dimension d3. Thus, in the second direction, the metal thermally conductive portion 22 can directly contact another metal thermally conductive portion 22 or another thermally conductive layer 10 (which can be understood in conjunction with the aforementioned arrangement of the metal thermally conductive portion 22) through multiple points, which helps to reduce interfacial thermal resistance and improve heat transfer efficiency.

[0097] Here, the fourth dimension d4 of the thermally conductive adhesive layer 20 along the second direction can be understood as the distance between the two opposite outer walls of the thermally conductive adhesive layer 20 in the second direction.

[0098] In some embodiments, the dimension of the adhesive portion 21 along the second direction is consistent with the third dimension d3 of the metal heat-conducting portion 22 along the second direction.

[0099] In some examples, the dimension of the adhesive portion 21 along the second direction is positively correlated with the fifth dimension d5 of the thermally conductive layer 10 along the second direction. In other words, the larger the fifth dimension d5 of the thermally conductive layer 10, the larger the dimension of the adhesive portion 21 along the second direction can be configured; correspondingly, the third dimension d3 of the metal thermally conductive portion 22 along the second direction is also configured to be larger, so as to form an adhesive portion 21 with a larger dimension along the second direction. The smaller the fifth dimension d5 of the thermally conductive layer 10, the smaller the dimension of the adhesive portion 21 along the second direction can be configured; correspondingly, the third dimension d3 of the metal thermally conductive portion 22 along the second direction is also configured to be smaller, so as to form an adhesive portion 21 with a smaller dimension along the second direction. Thus, based on the amount of adhesion required to bond adjacent thermally conductive layers 10, the size of the adhesive portion 21 along the second direction can be adaptively configured to improve structural adaptability.

[0100] In some examples, the thermal conductivity of the adhesive can be from 0.5 W / mK to 3 W / mK, such as 0.5, 1.2, 2.8, 3 or other values. This application does not impose specific limitations on the thermal conductivity of the adhesive.

[0101] Correspondingly, the thermal conductivity of the adhesive portion 21 is negatively correlated with its adhesive strength. Through the above approach, while ensuring stable adhesion to adjacent thermally conductive layers 10, a material with high thermal conductivity can be selected to make the adhesive portion 21, thereby ensuring the thermal conductivity performance of the thermal pad 100.

[0102] In some embodiments, the adhesive portion 21 fills the accommodating space by applying an adhesive to the side of the metal heat-conducting portion 22 facing away from the surface 13, that is, applying it to the opening side of the accommodating space. Accordingly, the adhesive is penetrated into the accommodating space by utilizing the capillary action of the accommodating space and / or the gravity acting on the adhesive itself.

[0103] In some embodiments, the thermally conductive layer 10 may be a graphene layer.

[0104] In some examples, the fifth dimension d5 of the monolayer graphene layer along the second direction can be from 0.01 micrometers to 100 micrometers, such as 0.01 micrometers, 12 micrometers, 28 micrometers, 100 micrometers or other values. The embodiments of this application do not impose specific limitations on the fifth dimension d5.

[0105] It should be noted that if the fifth dimension d5 of the monolayer graphene layer is less than 0.01 micrometers, it cannot adequately accommodate the surface irregularities of the heating device 300 and the heat dissipation device 200, reducing the reliability of thermal contact. If the fifth dimension d5 of the monolayer graphene layer is greater than 100 micrometers, the graphene layer is too rigid, reducing the reliability of its thermal contact with the peripheral interface and hindering the reduction of contact thermal resistance. Therefore, the fifth dimension d5 of the monolayer graphene layer along the second direction can range from 0.01 micrometers to 100 micrometers.

[0106] Of course, in other embodiments, the thermal pad 100 may also include a third thermally conductive surface and a fourth thermally conductive surface disposed opposite to each other. The third thermally conductive surface and the fourth thermally conductive surface are parallel to the thermally conductive layer 10 of the thermal pad 100. The third thermally conductive surface is in thermal contact with the heat dissipation device 200, and the fourth thermally conductive surface is in thermal contact with the heat-generating device 300.

[0107] Based on the same concept, this application embodiment also provides a thermal pad 100, which includes a first thermally conductive surface 101 and a second thermally conductive surface 102 disposed opposite to each other along a first direction T. The first thermally conductive surface 101 is used to make thermal contact with the heat dissipation device 200, and the second thermally conductive surface 102 is used to make thermal contact with the heat-generating device 300.

[0108] In this embodiment, the thermal pad 100 further includes at least two thermally conductive layers 10. The at least two thermally conductive layers 10 are stacked along the second direction T2, and the first direction T1 intersects the second direction T2.

[0109] In some embodiments, the heat-conducting layer 10 may be configured to be made of materials such as aluminum oxide, boron nitride, and graphene. This application embodiment does not impose specific limitations on the material of the heat-conducting layer 10.

[0110] In this embodiment, the thermal pad 100 further includes a thermally conductive adhesive layer 20. The thermally conductive adhesive layer 20 is sandwiched between adjacent thermally conductive layers 10. The thermally conductive adhesive layer 20 includes a metal thermally conductive portion 22 and an adhesive portion 21. The adhesive portion 21 is used to bond two adjacent thermally conductive layers 10, and the metal thermally conductive portion 22 is used to transfer heat between adjacent thermally conductive layers 10, so as to transfer the heat of the heating device 300 to the heat dissipation device 200.

[0111] In some embodiments, the metal heat-conducting part 22 is configured as a metal nanowire structure. The projection of the metal nanowire structure onto the surface 13 is an overlapping mesh structure.

[0112] It should be noted that the thermal pad 100 is conceived in relation to the aforementioned electronic device 1000 and has the same technical effects as the aforementioned electronic device 1000. Technical features and implementation methods not described in this embodiment can be referred to the technical solution of the aforementioned electronic device 1000, and will not be repeated here.

[0113] Figure 4 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 1 .

[0114] Reference Figure 4 As shown, based on the same concept, this application embodiment also provides a method for manufacturing a thermal pad 100, the manufacturing method including at least steps S10 to S30.

[0115] Step S10: Provide multiple thermally conductive layers 10.

[0116] The thermal conductive layer 10 is the core component of the thermal conductive pad 100. The thermal conductive pad 100 is used to be placed between the heat-generating device 300 and the heat-dissipating device 200 to transfer the heat from the heat-generating device 300 to the heat-dissipating device 200.

[0117] Here, the heat-generating device 300 can be understood as: electronic components that generate heat during the operation of electronic device 1000, including but not limited to: CPU, GPU, NPU, power amplifier and other electronic components.

[0118] The heat dissipation device 200 can be understood as: a device used to transfer heat from the heat-generating device 300 to the surrounding environment, including but not limited to: liquid cooling plate, heat sink, etc.

[0119] Step S20: On at least one side surface 13 of each thermally conductive layer 10 located in the second direction T2, a metal thermally conductive part 22 and an adhesive part 21 are formed.

[0120] Here, the second direction T2 can be understood as the direction in which multiple thermal conductive layers are stacked in 10 layers.

[0121] In some examples, the metal thermally conductive portion 22 can be made of a highly thermally conductive metal material, such as a nanowire structure of silver, copper, or gold. Thus, the metal thermally conductive portion 22 forms a highly thermally conductive component between adjacent thermally conductive layers 10, enhancing the ability of heat transfer from the 300 to the heat dissipation device 200 along the first direction during heat generation.

[0122] In some examples, the adhesive portion 21 may be made of an adhesive, such as thermally conductive silicone, thermally conductive polyurethane adhesive or thermally conductive epoxy adhesive, to fix adjacent thermally conductive layers 10 and fill the gaps between layers to ensure structural stability.

[0123] In some examples, for each thermally conductive layer 10, an aqueous solution of silver nanowires is coated on its upper surface 13, and after drying at 100°C for 1 hour, a silver nanowire structure with a thickness of about 50 micrometers is formed. This structure exhibits a mesh-like porous structure. Subsequently, thermally conductive silicone is coated on the surface 13 of the silver nanowire structure, and the thermally conductive silicone is penetrated into the pores of the silver nanowire structure by capillary action to form a strong adhesive portion 21.

[0124] In another embodiment, for each thermally conductive layer 10, copper nanowire ethanol solution is coated on both sides of its surface 13 respectively, and dried at 80°C for 1 hour to form a double-sided nanowire structure; then thermally conductive polyurethane adhesive is used for filling, and after static curing, a metal thermally conductive part 22 and an adhesive part 21 are formed.

[0125] Figure 5 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 2 .

[0126] Reference Figure 5 As shown, in some embodiments, step S20 can be implemented by steps S21 and S22.

[0127] Step S21: A metal heat-conducting part 22 is formed on the surface 13, and the metal heat-conducting part 22 and the surface 13 form an accommodating space.

[0128] Regarding the placement of the metal heat-conducting part 22, the heat-conducting layer 10 differs at different locations as follows: In some embodiments, for the two outermost heat-conducting layers 10 located in the second direction T2, a metal heat-conducting part 22 is provided on the surface 13 of the heat-conducting layer 10 located in the second direction T2 towards the inside of the heat-conducting pad 100.

[0129] In some embodiments, for the heat-conducting layer 10 located in the middle of the second direction T2 (i.e., the heat-conducting layer 10 excluding the two outermost heat-conducting layers 10), the metal heat-conducting part 22 is provided on at least one side surface 13 of the heat-conducting layer 10 located in the second direction T2.

[0130] For ease of description, the two surfaces 13 of the central heat-conducting layer 10 in the second direction T2 are referred to as the left surface 13 and the right surface 13, respectively, with the left and right directions shown in the attached figure.

[0131] In some examples, the metal heat-conducting portion 22 is disposed on the right surface 13 of each central heat-conducting layer 10. Accordingly, the right surface 13 of the heat-conducting adhesive layer 20 in the second direction T2 is connected to the left surface 13 of the heat-conducting layer 10 to its right, thereby forming a structure of heat-conducting layers 10 connected to each other.

[0132] Similarly, the metal heat-conducting part 22 can be provided on the left surface 13 of each central heat-conducting layer 10. Accordingly, the left surface 13 of the heat-conducting adhesive layer 20 in the second direction T2 is connected to the right surface 13 of the heat-conducting layer 10 to its left, forming a structure of heat-conducting layers 10 connected to each other.

[0133] In other examples, a metal heat-conducting portion 22 is provided on the left and right surfaces 13 of each central heat-conducting layer 10. Correspondingly, along the second direction T2 to the right, the heat-conducting adhesive layer 20 on the right surface 13 of the preceding heat-conducting layer 10 and the heat-conducting adhesive layer 20 on the left surface 13 of the following heat-conducting layer 10 are connected to each other to form a stacked structure of heat-conducting layers 10. Since the heat-conducting adhesive layer 20 itself has a certain elasticity, when two heat-conducting adhesive layers 20 are bonded to each other, the interface contact will be tighter under the action of elasticity, which is beneficial to improving heat transfer performance.

[0134] The arrangement of the heat-conducting metal part 22 and the surface 13 to form an accommodating space can be achieved in the following ways: In some embodiments, the metal heat-conducting portion 22 can be formed on the surface 13 by patterning processes such as photolithography and etching. In this case, the metal heat-conducting portion 22 is constructed as protrusions that are spaced outward from the surface 13, and the protrusions and the surface 13 surround and form an accommodating space.

[0135] In other embodiments, the metal heat-conducting part 22 may be configured as a metal foam structure having interconnected cavities, the walls of the cavities and the surface 13 forming an accommodating space.

[0136] In some embodiments, the metal heat-conducting part 22 is configured as a metal nanowire structure. The projection of the metal nanowire structure onto the surface 13 is an overlapping mesh structure. The voids in the mesh structure and the surface 13 enclose an accommodating space.

[0137] Figure 6 This is flowchart three of a method for manufacturing a thermal pad according to an embodiment of this application.

[0138] Reference Figure 6 As shown, in some embodiments, step S21 may include steps S211 and S212.

[0139] Step S211: Coat surface 13 with a metal nanowire solution, which is obtained by dissolving metal nanowires in a solvent.

[0140] Here, the solution solvent may include one of water, alcohols, acetone, esters, etc. By drying the metal nanowire solution to remove the solution solvent, the attached metal thermally conductive part 22 can be obtained on the surface 13.

[0141] In some examples, a 50 g / L aqueous solution of silver nanowires was used to uniformly coat the surface 13 of the thermally conductive layer 10 using a spraying device.

[0142] In another embodiment, a 10 g / L gold nanowire acetone solution is used to coat a thin layer on the surface 13 of the thermally conductive layer 10 by a blade coating process.

[0143] Step S212: Dry the metal nanowire solution to form a metal thermally conductive part 22 on the surface 13.

[0144] Here, the drying process aims to remove the solvent from the solution, allowing the metal nanowires to adhere to the surface 13 and form a stable structure. The actual drying parameters need to be determined comprehensively based on the dimensions of the metal nanowire structure in the second direction T2, the type of solvent in the solution, and the type of metal nanowires. This application does not limit the specific drying parameters in its embodiments.

[0145] In some examples, a silver nanowire aqueous solution with a concentration of 50 g / L is used. The silver nanowire aqueous solution is uniformly coated on the surface 13 of the thermally conductive layer 10 using a spraying device and dried at 100°C for 1 hour. After the solvent has completely evaporated, a metal thermally conductive part 22 with a thickness of about 50 micrometers is formed.

[0146] In another embodiment, a 10 g / L gold nanowire acetone solution is used to coat the surface 13 of the thermally conductive layer 10 with a blade coating process to form a thin layer. After drying at 120°C for 2 hours, the acetone evaporates to form a porous gold nanowire layer with a thickness of about 1 micrometer.

[0147] Step S22: Fill the accommodating space with adhesive and cure the adhesive to form the adhesive portion 21.

[0148] Here, the adhesive is applied to the side of the metal heat-conducting part 22 facing away from the surface 13, that is, to the opening side of the accommodating space. Accordingly, the adhesive is penetrated into the accommodating space by utilizing the capillary action of the accommodating space and / or the gravity acting on the adhesive itself.

[0149] It is easy to understand that the adhesive needs to have appropriate fluidity to fully fill the voids and maintain stable bond strength after curing.

[0150] Therefore, a simple preparation method is provided for forming the metal thermally conductive part 22 by coating the surface 13 with a metal nanowire solution and then drying it. The metal nanowire solution can be uniformly coated on the surface 13 of the thermally conductive layer 10, forming a mesh structure after drying. This structure not only has extremely high thermal conductivity, but its naturally formed voids also reserve space for the subsequent penetration of the adhesive, optimizing the thermal conductivity and mechanical properties between adjacent thermally conductive layers 10.

[0151] Figure 7 This is a process flow of a manufacturing method for a thermal pad provided in an embodiment of this application. Figure 4 .

[0152] Reference Figure 7 As shown, in some embodiments, step S22 may include steps S221 and S222.

[0153] Step S221: Introduce the adhesive into the accommodating space.

[0154] Here, the adhesive portion 21 fills the accommodating space by applying adhesive to the side of the metal heat-conducting portion 22 facing away from the surface 13, that is, applying it to the opening side of the accommodating space. Accordingly, the adhesive penetrates into the accommodating space by utilizing the capillary action of the accommodating space and / or the gravity acting on the adhesive itself.

[0155] Step S222: After the adhesive has penetrated, wipe away any adhesive that has overflowed into the accommodating space.

[0156] To avoid uneven thickness or interference with interfacial contact caused by excess adhesive during lamination, residual adhesive on surface 13 must be removed after penetration. This is typically done by gently wiping with a lint-free cloth or scraper to ensure the surface 13 of the metal heat-conducting part 22 is clean and smooth.

[0157] In some examples, after the thermally conductive silicone has been incorporated into the silver nanowire structure, the surface 13 on the opening side of the accommodating space is gently wiped with a lint-free cloth along the first direction T1 to remove the thermally conductive silicone that has overflowed into the accommodating space.

[0158] In other examples, after the epoxy thermally conductive adhesive penetrates into the accommodating space, a precision scraper is used to remove the epoxy thermally conductive adhesive that has overflowed into the accommodating space, ensuring that the interface between the metal thermally conductive part 22 and the adhesive part 21 along the second direction T2 on the opening side of the accommodating space is flat.

[0159] Therefore, by first introducing the adhesive to penetrate the accommodating space and then removing the excess portion, it is ensured that the adhesive is accurately and fully filled into the accommodating space. This effectively avoids the increase in thermal resistance at the interface between the thermally conductive layer 10 and the thermally conductive adhesive layer 20 due to excessive use of adhesive, and ensures that the metal thermally conductive part 22 can fully contact the adjacent layer. Thus, while achieving reliable bonding, the heat transfer function of the metal thermally conductive part 22 is maximized, and the overall performance of the thermal pad 100 is improved.

[0160] Furthermore, using steps S21 and S22: firstly, a metal thermally conductive portion 22 is formed on the surface 13 of the thermally conductive layer 10, which, together with the surface 13, encloses an accommodating space; then, an adhesive is filled and cured within this space to form an adhesive portion 21. The metal thermally conductive portion 22 constructs a highly thermally conductive substrate, while the adhesive is used to fix adjacent thermally conductive layers 10. This structural design minimizes the volume ratio of the adhesive in the heat transfer path, reduces the negative impact of the adhesive on the overall thermal resistance, and simultaneously ensures the mechanical strength and stability of the interlayer bond between the thermally conductive layer 10 and the thermally conductive adhesive layer 20.

[0161] Step S30: Stack multiple thermally conductive layers 10 forming the metal thermally conductive part 22 and the adhesive part 21 along the second direction T2, and perform a pressing process to obtain a thermally conductive pad 100.

[0162] In some examples, the pressing pressure is positively correlated with the third dimension d3 of the metal heat-conducting part 22. In other words, the larger the third dimension d3 of the metal heat-conducting part 22, the greater the pressing pressure is; the smaller the third dimension d3 of the metal heat-conducting part 22, the smaller the pressing pressure is.

[0163] In some examples, the bonding pressure is positively correlated with the fifth dimension d5 of the thermally conductive layer 10. In other words, the larger the fifth dimension d5 of the thermally conductive layer 10, the greater the bonding pressure is; the smaller the fifth dimension d5 of the thermally conductive layer 10, the smaller the bonding pressure is.

[0164] In some examples, the pressing pressure of the pressing process can be configured to be from 0.1 MPa to 10.1 MPa, for example, 0.1 MPa, 0.5 MPa, 0.75 MPa, 1 MPa or other values. This application embodiment does not impose specific limitations on the pressing pressure.

[0165] According to the manufacturing method of the thermal pad 100 provided in the embodiments of this application: a plurality of thermally conductive layers 10 are provided, and a metal thermally conductive part 22 and an adhesive part 21 with thermal conductivity and adhesion functions are formed on at least one side surface 13 of each thermally conductive layer 10 along the second direction T2. ​​The processed thermally conductive layers 10 are then stacked and pressed together along the second direction T2 to finally form the thermal pad 100. Thus, the thermal pad 100 constructs a low thermal resistance heat transfer path, thereby improving the overall heat transfer efficiency and reliability of the thermal pad.

[0166] In some embodiments, the method for manufacturing the thermal pad 100 may further include the following steps: The thermal pad 100 is cut at intervals along the second direction T2 in the first direction T1 to adjust the size of the thermal pad 100 along the first direction T1.

[0167] Here, cutting the thermal pad 100 along the second direction T2 ensures that the end face of the thermal pad 100 is flat, which is conducive to forming a tight thermal contact with the heat-generating device 300 and the heat-dissipating device 200.

[0168] In some examples, the cutting process may employ die-cutting, laser cutting, or precision sawing, but this application does not limit the cutting method.

[0169] In some examples, the laminated structure is fixed on a die-cutting machine, and a thermal pad 100 with a thickness of 1 mm is cut out along the second direction T2 for filling the TIM1 between the GPU and the liquid cooling plate.

[0170] In other examples, the laminated structure is laser-cut to obtain a thermal pad 100 with a thickness of 0.5 mm, which can be used for TIM2 applications between the chip and the heat sink.

[0171] It should be noted that this manufacturing method is conceived in relation to the aforementioned electronic device 1000 and has the same technical effects as the aforementioned electronic device 1000. Technical features and implementation methods not described in this embodiment can be referred to the technical solution of the aforementioned electronic device 1000, and will not be repeated here.

[0172] The following is a general description of the manufacturing process of thermal pad 100: Metal nanowire solution is sequentially coated onto the left and right surfaces 13 of each thermally conductive layer 10. The thermally conductive layer 10 with metal nanowire solution is dried to remove the solvent, forming a metal thermally conductive portion 22 on the left and right surfaces 13 of the thermally conductive layer 10. The metal thermally conductive portion 22 and the surface 13 form an accommodating space. An adhesive is coated on the opening side of the accommodating space and left to stand to allow the adhesive to penetrate into the accommodating space. After penetration is complete, excess adhesive overflowing into the accommodating space is wiped off, and the adhesive is allowed to cure to form an adhesive portion 21. The thermally conductive layers 10 forming the thermally conductive adhesive layer 20 are stacked in multiple layers, and the thermally conductive adhesive layer 20 is placed between adjacent thermally conductive layers 10. Then, the layer structure is pressed together under mechanical force to obtain a block-shaped preform of the thermally conductive layer 10. Thus, the thermally conductive layer 10, the metal thermally conductive portion 22, and the adhesive portion 21 are tightly filled through pressing. The block-shaped preform is die-cut along the second direction T2 to obtain a thermally conductive pad 100 of the required thickness.

[0173] Accordingly, some parameter configurations for thermal pad 100 are provided for reference. The following parameter configuration examples for thermal pad 100 do not constitute a limitation on the parameter configuration of thermal pad 100.

[0174] In some embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 30 micrometers, the metal nanowire solution is prepared as an aqueous solution of silver nanowires, the drying process is set to dry at 100°C for 1 hour, and the third dimension d3 of the metal thermally conductive part 22 is 50 micrometers. The thermal conductivity of the adhesive is 3 W / mK, and the bonding pressure is 0.3 MPa.

[0175] In other embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 100 micrometers, the metal nanowire solution is prepared as a silver nanowire ethanol solution, the drying process is set to dry at 80°C for 1 hour, and the third dimension d3 of the metal thermally conductive part 22 is 30 micrometers. The thermal conductivity of the adhesive is 1 W / mK, and the bonding pressure is 0.3 MPa.

[0176] In some embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 10 micrometers, the metal nanowire solution is prepared as a silver nanowire acetone solution, the drying process is set to dry at 120°C for 2 hours, and the third dimension d3 of the metal thermally conductive part 22 is 1 micrometer. The thermal conductivity of the adhesive is 0.5 W / mK, and the bonding pressure is 0.1 MPa.

[0177] In other embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 30 micrometers, the metal nanowire solution is prepared as an aqueous solution of gold nanowires, the drying process is set to dry at 100°C for 1 hour, and the third dimension d3 of the metal thermally conductive part 22 is 10 micrometers. The thermal conductivity of the adhesive is 1 W / mK, and the bonding pressure is 0.3 MPa.

[0178] In some embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 30 micrometers, the metal nanowire solution is prepared as an aqueous solution of copper nanowires, the drying process is set to dry at 100°C for 1 hour, and the third dimension d3 of the metal thermally conductive part 22 is 10 micrometers. The thermal conductivity of the adhesive is 1 W / mK, and the bonding pressure is 0.3 MPa.

[0179] In other embodiments, the fifth dimension d5 of the thermally conductive layer 10 is 0.01 micrometers, the metal nanowire solution is prepared as a silver nanowire ethanol solution, the drying process is set to dry at 80°C for 1 hour, and the third dimension d3 of the metal thermally conductive part 22 is 0.5 micrometers. The thermal conductivity of the adhesive is 1 W / mK, and the bonding pressure is 0.1 MPa.

[0180] For the thermal pad 100 configured with the above parameters, the heating element 300 is set to a temperature of 80℃. After installing the heat dissipation device 200, the thermal contact area along the first direction T1 is configured to be 25 mm. Long-term thermal resistance tests were conducted on the 25mm layer at 85°C and 85%RH. The results showed that the interfacial thermal resistance increased by less than 10%, 15%, 10%, 10%, 15%, and 15% respectively compared to a structure where the thermally conductive layer 10 was entirely filled with thermally conductive adhesive after long-term use. Furthermore, no bubbling or powdering failure was observed. In summary, the thermal pad 100 in the electronic device 1000 provided in this application embodiment exhibits stable thermal conductivity and a long service life during long-term use.

[0181] The above embodiments are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, include: Heating devices; Heat dissipation devices; A thermal pad has a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other along a first direction. The first thermally conductive surface is in thermal contact with the heat dissipation device, and the second thermally conductive surface is in thermal contact with the heat-generating device. The thermal pad includes: At least two thermally conductive layers are stacked along a second direction, wherein the first direction intersects the second direction; A thermally conductive adhesive layer is sandwiched between adjacent thermally conductive layers, and the thermally conductive adhesive layer includes a metal thermally conductive part and an adhesive part. The adhesive part is used to bond two adjacent thermally conductive layers, and the metal thermally conductive part is used to transfer heat between adjacent thermally conductive layers to transfer the heat of the heat-generating device to the heat dissipation device.

2. The electronic device according to claim 1, characterized in that, The metal thermally conductive portion is disposed on at least one surface of the thermally conductive layer located in the second direction, and the metal thermally conductive portion and the surface surround to form an accommodating space; the adhesive portion fills the accommodating space.

3. The electronic device according to claim 2, characterized in that, The metal thermally conductive part is a metal nanowire structure, and the projection of the metal nanowire structure on the surface is an overlapping mesh structure.

4. The electronic device according to claim 2, characterized in that, The ratio of the dimension of the metal heat-conducting part along the second direction to the dimension of the heat-conducting layer along the second direction is 0.5 to 50.

5. The electronic device according to claim 2, characterized in that, The first dimension of the metal heat-conducting part along the second direction is 0.5 micrometers to 50 micrometers.

6. A thermal conductive pad, characterized in that, include: A first heat-conducting surface and a second heat-conducting surface are arranged opposite to each other along a first direction. The first heat-conducting surface is used to make thermal contact with a heat dissipation device, and the second heat-conducting surface is used to make thermal contact with a heat-generating device. At least two thermally conductive layers are stacked along a second direction, wherein the first direction intersects the second direction; A thermally conductive adhesive layer is sandwiched between adjacent thermally conductive layers, and the thermally conductive adhesive layer includes a metal thermally conductive part and an adhesive part. The adhesive part is used to bond two adjacent thermally conductive layers, and the metal thermally conductive part is used to transfer heat between adjacent thermally conductive layers to transfer the heat of the heat-generating device to the heat dissipation device.

7. The thermal conductive pad according to claim 6, characterized in that, The metal thermally conductive part is a metal nanowire structure, and the projection of the metal nanowire structure on the surface is an overlapping mesh structure.

8. A method for manufacturing a thermal conductive pad, characterized in that, include: Provides multiple thermally conductive layers; A metal thermally conductive portion and an adhesive portion are formed on at least one side surface of each of the thermally conductive layers located in the second direction; The plurality of thermally conductive layers forming the metal thermally conductive part and the adhesive part are stacked along the second direction and then pressed together. You obtain a thermal pad.

9. The method for manufacturing a thermal pad according to claim 8, characterized in that, The at least one surface of each of the thermally conductive layers located in the second direction forms a metal thermally conductive portion and an adhesive portion, including: The metal heat-conducting portion is formed on the surface, and the metal heat-conducting portion and the surface enclose an accommodating space. The adhesive is filled into the accommodating space and cured to form the adhesive portion.

10. The method for manufacturing a thermally conductive pad according to claim 9, characterized in that, The process of forming the metal thermally conductive portion on the surface includes: A metal nanowire solution is coated on the surface, the metal nanowire solution being obtained by dissolving metal nanowires in a solvent; The metal nanowire solution is dried to form the thermally conductive metal portion on the surface.

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