Photovoltaic module packaging structure and photovoltaic system

Abstract

The invention discloses a photovoltaic module packaging structure and a photovoltaic system. In the photovoltaic module packaging structure, the adhesive film is filled between the cover plate and the carrier plate which are sequentially stacked in the first direction, so that the solar cell is packaged between the cover plate and the carrier plate, and the bus bar is arranged between the cover plate and the solar cell layer, so that the outgoing line and the bus bar are connected; the outgoing line is arranged on one side close to the cover plate, so that the connecting surface between the outgoing line and the bus bar is located between the solar cell layer and the cover plate in the first direction, and an insulating layer is arranged between the bus bar and the solar cell layer, so that the bus bar close to the outgoing line is insulated from the solar cell layer; therefore, the connection area of the bus bar and the outgoing line can be fully utilized, and the area of the solar cell layer in the photovoltaic module packaging structure can be effectively increased on the premise of the carrier plate with the same specification, so that the power generation efficiency of the photovoltaic module in unit area is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic module processing technology, and in particular to a photovoltaic module packaging structure and a photovoltaic system. Background Technology

[0002] In recent years, global energy shortages and environmental pollution have become increasingly prominent, leading to growing attention on solar cells as an ideal renewable energy source. Solar cells, also known as photovoltaic cells, are devices that directly convert light energy into electrical energy through the photoelectric effect or photochemical effect. Within a few years of their invention, they rapidly achieved high photoelectric conversion efficiency and have promising application prospects.

[0003] With the development of solar cell technology, people have increasingly higher requirements for the performance of solar cells. Please refer to [link / reference]. Figure 1-2 As shown, in the prior art, since the connection area between the lead wire and the busbar is located on one side of the solar cell layer, the area near the connection area between the busbar and the lead wire is obviously not fully utilized, resulting in vacant areas and limited effective power generation area of ​​the photovoltaic module. Summary of the Invention

[0004] The main objective of this application is to provide a photovoltaic module encapsulation structure and a photovoltaic system to solve the problem of limited effective power generation area of ​​photovoltaic modules in the prior art.

[0005] In a first aspect, this application provides a photovoltaic module encapsulation structure, including an encapsulating film and a cover plate, a solar cell layer, and a carrier plate stacked sequentially along a first direction. The encapsulating film fills the space between the cover plate and the carrier plate to encapsulate the solar cell layer between the cover plate and the carrier plate. The encapsulation structure further includes: A busbar and a lead wire, the busbar being disposed between the cover plate and the solar cell layer, the lead wire being connected to the busbar and close to the cover plate, and the connection surface between the lead wire and the busbar being located between the solar cell layer and the cover plate along the first direction; and An insulating layer is disposed between the busbar and the solar cell layer.

[0006] Furthermore, at least one side of the insulating layer is adhesive, such that the insulating layer is bonded to at least one of the solar cell layer and the busbar; Alternatively, the encapsulation structure may further include an adhesive layer, wherein an adhesive layer is disposed between the insulating layer and the solar cell layer, and / or, wherein an adhesive layer is disposed between the insulating layer and the busbar.

[0007] Furthermore, the busbar and the lead wire are connected by a conductive layer.

[0008] Furthermore, the conductive layer is a conductive adhesive, which seals and fills the connection surface between the busbar and the lead wire.

[0009] Furthermore, the conductive layer is formed by laminating silver paste.

[0010] Furthermore, the lead wire is pre-fixed to the busbar by the silver paste.

[0011] Furthermore, butyl rubber is filled between the cover plate and the carrier plate, and the butyl rubber seals the outer periphery of the adhesive film, the solar cell layer, the silver paste and the busbar, and the lead wire seal passes through the butyl rubber; During the high-temperature lamination process of the encapsulation structure by the laminating device, the adhesive film melts and fills between the cover plate and the carrier plate, the silver paste is extruded to form the conductive layer and solidifies, and the butyl adhesive is solidified and connected between the cover plate and the carrier plate.

[0012] Furthermore, the carrier plate is pre-coated with butyl adhesive on the side facing the cover plate and near the edge of the carrier plate, and the part of the lead wire extending out of the adhesive film is pre-fixed by the pre-coated butyl adhesive.

[0013] Furthermore, the butyl rubber is filled between the cover plate and the carrier plate, and seals the periphery of both the cover plate and the carrier plate.

[0014] Secondly, this application also provides a photovoltaic system, the photovoltaic system including at least one photovoltaic module encapsulation structure as described in any of the above claims; The solar cell layer is a perovskite cell layer.

[0015] In the photovoltaic module encapsulation structure of this application, the solar cell is encapsulated between the cover plate and the carrier plate, which are stacked sequentially along the first direction, by filling the encapsulating film between the cover plate and the carrier plate. The busbar is disposed between the cover plate and the solar cell layer, connecting the lead wire to the busbar. The lead wire is positioned near the cover plate, so that the connection surface between the lead wire and the busbar is located between the solar cell layer and the cover plate along the first direction. An insulating layer is disposed between the busbar and the solar cell layer, ensuring insulation between the busbar near the lead wire and the solar cell layer. This allows for full utilization of the connection area between the busbar and the lead wire, effectively increasing the area of ​​the solar cell layer in the photovoltaic module encapsulation structure under the premise of the same carrier plate specifications, thereby improving the power generation efficiency of the photovoltaic module per unit area. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of a photovoltaic module in the prior art. The dashed area in the diagram represents the solar cell layer.

[0017] Figure 2 for Figure 1 A schematic diagram of the light-receiving surface of a corresponding existing photovoltaic module. The dashed area in the diagram represents the light-receiving surface of the solar cell layer.

[0018] Figure 3 This is a schematic diagram of a photovoltaic module in one embodiment of the present application, where the dashed area represents the solar cell layer.

[0019] Figure 4 for Figure 3 The schematic diagram of the light-incident surface of the photovoltaic module corresponding to this application shows that the dashed area in the figure represents the light-incident surface of the solar cell layer.

[0020] Figure 5 This is an overall schematic diagram of the photovoltaic module encapsulation structure in one embodiment of this application.

[0021] Figure 6 This is a cross-sectional schematic diagram of the photovoltaic module encapsulation structure in one embodiment of this application.

[0022] Figure 7 This is another cross-sectional schematic diagram of the photovoltaic module encapsulation structure in one embodiment of this application.

[0023] The above figures include the following reference numerals: Encapsulation structure 100, encapsulating film 10, cover plate 20, solar cell layer 30, carrier plate 40, busbar 50, lead wire 60, insulating layer 70, conductive layer 80, butyl rubber 90. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0027] Please see Figure 3-7 and combined Figure 1-2 As shown, in a first aspect, this application provides a photovoltaic module encapsulation structure 100, the encapsulation structure 100 including an encapsulating film 10 and a cover plate 20, a solar cell layer 30 and a carrier plate 40 stacked sequentially along a first direction, the encapsulating film 10 filling the space between the cover plate 20 and the carrier plate 40 to encapsulate the solar cell layer 30 between the cover plate 20 and the carrier plate 40.

[0028] Furthermore, the encapsulation structure 100 also includes a busbar 50, a lead wire 60, and an insulating layer 70. The busbar 50 is disposed between the cover plate 20 and the solar cell layer 30. The lead wire 60 is connected to the busbar 50 and close to the cover plate 20, and the connection surface between the lead wire 60 and the busbar 50 is located between the solar cell layer 30 and the cover plate 20 along the first direction. The insulating layer 70 is disposed between the busbar 50 and the solar cell layer 30.

[0029] The solar cell is encapsulated between the cover plate 20 and the carrier plate 40 by filling the adhesive film 10 between them, which are stacked sequentially along the first direction. The lead wire 60 is connected to the busbar 50 by placing the busbar 50 between the cover plate 20 and the solar cell layer 30, and the lead wire 60 is positioned near the cover plate 20. This ensures that the connection surface between the lead wire 60 and the busbar 50 is located along the first direction within the solar cell. The insulating layer 70 is provided between the layer 30 and the cover plate 20, and between the busbar 50 and the solar cell layer 30, so that the busbar 50 near the lead wire 60 is insulated from the solar cell layer 30. This allows the connection area between the busbar 50 and the lead wire 60 to be fully utilized, and under the premise of the same specification of the carrier plate 40, the area of ​​the solar cell layer 30 in the photovoltaic module encapsulation structure 100 can be effectively increased, thereby improving the power generation efficiency of the photovoltaic module per unit area.

[0030] In embodiments of this application, at least one side of the insulating layer 70 is adhesive, such that the insulating layer 70 is bonded to at least one of the solar cell layer 30 and the busbar 50. This facilitates the connection of the insulating layer 70 between the solar cell layer 30 and the busbar 50, and also facilitates the positioning and limiting of the insulating layer 70 by utilizing its adhesiveness, preventing the insulating layer 70 from shifting and causing the solar cell housing and the insulating layer 70 to be ineffectively insulated and isolated.

[0031] It is understood that the insulating layer 70 may be adhesive on the side closest to the solar cell layer 30, so that the insulating layer 70 can be bonded to the solar cell layer 30; the insulating layer 70 may also be adhesive on the side closest to the busbar 50, so that the insulating layer 70 can be bonded to the busbar 50; the insulating layer 70 may also be adhesive on both sides, so that the insulating layer 70 can be bonded to both the solar cell layer 30 and the busbar 50.

[0032] In embodiments of this application, the encapsulation structure 100 may further include an adhesive layer for bonding the insulating layer 70 to the solar cell layer 30, i.e., an adhesive layer is disposed between the insulating layer 70 and the solar cell layer 30; or, the adhesive layer is for bonding the insulating layer 70 to the busbar 50, i.e., an adhesive layer is disposed between the insulating layer 70 and the busbar 50; or, an adhesive layer is disposed between the insulating layer 70 and the solar cell layer 30, and another adhesive layer is disposed between the insulating layer 70 and the busbar 50.

[0033] In the embodiments of this application, the insulating layer 70 may also be a non-adhesive insulating material, as long as the insulating layer does not shift or slide after encapsulation.

[0034] Please see Figure 6-7 As shown in the embodiment of this application, the busbar 50 and the lead wire 60 are connected by a conductive layer 80. Compared with the prior art, which connects the busbar 50 and the lead wire 60 by thermoforming, by setting the conductive layer 80, the busbar 50 and the lead wire 60 can be stably connected, while avoiding the high temperature of thermoforming from affecting the performance of the solar cell layer 30, thereby improving the stability and yield of the photovoltaic module.

[0035] In the embodiments of this application, the conductive layer 80 is a conductive adhesive. The conductive adhesive is sealed and filled at the connection surface of the busbar 50 and the lead wire 60. By using the conductive adhesive, the adhesive properties of the conductive adhesive can be fully utilized to bond and pre-fix the connection surface of the busbar 50 and the lead wire 60. Thus, during the process of electrically connecting the lead wire 60 and the busbar 50, it is convenient to adjust the connection position of the lead wire 60 and the busbar 50 in a timely manner, avoiding the inability to adjust the connection position of the lead wire 60 and the busbar 50 due to fusion caused by direct hot-press welding.

[0036] It should be noted that during the encapsulation process, the conductive adhesive only needs to pre-fix and electrically connect the lead wire 60 and the bus bar 50. The conductive adhesive will be cured to form the conductive layer 80 when the entire photovoltaic module is laminated and encapsulated.

[0037] In the embodiments of this application, the conductive adhesive can be silver paste. Therefore, the lead wire 60 is pre-fixed to the busbar 50 by the silver paste, and the conductive layer 80 is formed by laminating silver paste.

[0038] By using the conductive adhesive to electrically connect the busbar 50 and the lead wire 60, the conductive adhesive can adaptively fill the gap between the lead wire 60 and the busbar 50 during lamination, thereby sealing the connection surface between the lead wire 60 and the busbar 50, reducing the risk of moisture ingress, and effectively improving the reliability and stability of the connection between the lead wire 60 and the busbar 50.

[0039] In the embodiments of this application, the silver paste is a low-temperature silver paste, which can achieve low-temperature curing. Compared with ordinary silver paste, which needs to be cured at a temperature of 150°C, the low-temperature silver paste in this application can be fully cured at a temperature of 90°C for 10 minutes. Therefore, it can be adapted to the temperature parameters in the lamination process of this application, thereby simultaneously curing the adhesive film 10, the low-temperature silver paste, and the butyl adhesive 90 during the lamination process.

[0040] In embodiments of this application, the conductive adhesive may also be other conductive colloids, such as solder paste, graphene colloid, and gold sol.

[0041] Please see Figure 6-7 As shown in the embodiment of this application, butyl rubber 90 is further filled between the cover plate 20 and the carrier plate 40. The butyl rubber 90 seals the outer periphery of the adhesive film 10, the solar cell layer 30, the silver paste, and the busbar 50. The lead wire 60 passes through the butyl rubber 90. Therefore, the connection surface between the lead wire 60 and the busbar 50 can also achieve a second layer of moisture protection through the butyl rubber 90, thereby further improving the reliability and stability of the connection between the lead wire 60 and the busbar 50.

[0042] Furthermore, after the cover plate 20, the carrier plate 40, the solar cell layer 30, the busbar 50, the lead wire 60, the insulating layer 70, the conductive layer 80, the adhesive film 10, and the butyl rubber 90 are respectively placed in their corresponding positions, the stacked components need to be laminated together using a laminating device to complete the encapsulation. During the high-temperature lamination of the encapsulation structure 100 by the laminating device, the adhesive film 10 melts and fills the space between the cover plate 20 and the carrier plate 40, the silver paste is heated and cured to form the conductive layer 80 and then cured, and the butyl adhesive 90 is cured and connected between the cover plate 20 and the carrier plate 40. This allows the solar cell layer 30, the busbar 50, and the lead wire 60 to be fixed between the cover plate 20 and the carrier plate 40, respectively, and to be sealed by the adhesive film 10, the conductive layer 80, and the butyl adhesive 90 to prevent external moisture from entering and affecting the busbar 50 and the solar cell layer 30. In addition, the cover plate 20 and the carrier plate 40 can also be bonded and fixed by the butyl adhesive 90.

[0043] Please see Figure 7 As shown in the embodiment of this application, the carrier plate 40 facing the cover plate 20 and near the edge of the carrier plate 40 is pre-coated with butyl adhesive 90. That is to say, the butyl adhesive 90 is applied in two steps. The first step is only on the carrier plate 40 corresponding to the lead wire 60 leading out of the photovoltaic module. Therefore, the butyl adhesive 90, together with the conductive adhesive, can achieve double pre-fixation of the lead wire 60. This allows the part of the lead wire 60 extending out of the adhesive film 10 to be pre-fixed by the pre-coated butyl adhesive 90, thereby enabling the lead wire 60 to be more stably electrically connected to the busbar 50 and to extend out of the photovoltaic module at the designated position. In addition, the pre-coated butyl adhesive 90 can also wrap the part of the lead wire 60 between the carrier plate 40 and the cover plate 20, thereby achieving effective sealing and further reducing the risk of external moisture entering the photovoltaic module from the lead wire 60.

[0044] Please see Figure 3-5 As shown in the embodiments of this application, the butyl rubber 90 is also filled between the cover plate 20 and the carrier plate 40, and seals the outer peripheral sides of the cover plate 20 and the carrier plate 40 respectively, thereby further improving the sealing effect of the cover plate 20 and the carrier plate 40.

[0045] In the embodiments of this application, the packaging steps of the packaging structure 100 are as follows: First, the solar cell layer 30 is stacked on the carrier plate 40 along the first direction.

[0046] Then, the outer periphery of the solar cell layer 30 and the carrier plate 40 are cleaned.

[0047] Next, the insulating layer 70 is attached to one side of the solar cell layer 30. The insulating layer 70 is typically attached to one of the shorter sides of the solar cell layer 30.

[0048] Next, the busbars 50 are laid on the two opposite long sides of the solar cell layer 30, and the busbars 50 are laid on the insulating layer 70.

[0049] Next, the silver paste is applied to the busbar 50 corresponding to the short side of the solar cell layer 30, which has the insulating layer 70.

[0050] Next, the butyl adhesive 90 is pre-coated on the carrier plate 40 near the silver paste.

[0051] Next, the two leads 60 are pre-fixed to the corresponding silver paste and butyl adhesive 90 of the positive and negative busbars 50, respectively. That is, each lead 60 is provided with silver paste at its connection with the corresponding busbar 50, and each lead 60 is pre-fixed to the carrier plate 40 by pre-applied butyl adhesive 90.

[0052] Next, the butyl adhesive 90 is applied in dots around the outer periphery of the solar cell layer 30.

[0053] Next, the adhesive film 10 is laid on the side of the solar cell layer 30 away from the carrier plate 40.

[0054] Next, the cover plate 20 is placed over the adhesive film 10.

[0055] Finally, the above-mentioned stacked structure is placed in a laminating device for high-temperature hot pressing to ensure that the adhesive film 10 melts and fills between the solar cell layer 30 and the cover plate 20, and that the silver paste forms the conductive layer 80, and that the butyl adhesive 90 is cured.

[0056] Please see Figure 3-7 As shown, in a second aspect, this application also provides a photovoltaic system, which includes at least one photovoltaic module encapsulation structure 100 as described in any of the above claims. Therefore, the photovoltaic system has all the above-mentioned beneficial effects, which will not be repeated here.

[0057] In the embodiments of this application, the solar cell layer 30 is a perovskite layer.

[0058] In embodiments of this application, the photovoltaic system may include a plurality of photovoltaic module encapsulation structures 100 connected in series, and the plurality of photovoltaic module encapsulation structures 100 may be arranged in an array.

[0059] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0060] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0061] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A photovoltaic module encapsulation structure, comprising an encapsulating film and a cover plate, a solar cell layer, and a carrier plate sequentially stacked along a first direction, wherein the encapsulating film fills the space between the cover plate and the carrier plate to encapsulate the solar cell layer between the cover plate and the carrier plate, characterized in that, The packaging structure further includes: A busbar and a lead wire, the busbar being disposed between the cover plate and the solar cell layer, the lead wire being connected to the busbar and close to the cover plate, and the connection surface between the lead wire and the busbar being located between the solar cell layer and the cover plate along the first direction; and An insulating layer is disposed between the busbar and the solar cell layer.

2. The photovoltaic module encapsulation structure according to claim 1, characterized in that, At least one side of the insulating layer is adhesive, such that the insulating layer is bonded to at least one of the solar cell layer and the busbar; Alternatively, the encapsulation structure may further include an adhesive layer, wherein an adhesive layer is disposed between the insulating layer and the solar cell layer, and / or, wherein an adhesive layer is disposed between the insulating layer and the busbar.

3. The photovoltaic module encapsulation structure according to claim 1, characterized in that, The busbar and the lead wire are connected by a conductive layer.

4. The photovoltaic module encapsulation structure according to claim 3, characterized in that, The conductive layer is a conductive adhesive, which is used to seal and fill the connection surface between the busbar and the lead wire.

5. The photovoltaic module encapsulation structure according to claim 3, characterized in that, The conductive layer is formed by laminating silver paste.

6. The photovoltaic module encapsulation structure according to claim 5, characterized in that, The lead wire is pre-fixed to the busbar by the silver paste.

7. The photovoltaic module encapsulation structure according to claim 5, characterized in that, Butyl rubber is also filled between the cover plate and the carrier plate. The butyl rubber seals the outer periphery of the adhesive film, the solar cell layer, the silver paste and the busbar. The lead wire passes through the butyl rubber. During the high-temperature lamination process of the encapsulation structure by the laminating device, the adhesive film melts and fills between the cover plate and the carrier plate, the silver paste is extruded to form the conductive layer and solidifies, and the butyl adhesive is solidified and connected between the cover plate and the carrier plate.

8. The photovoltaic module encapsulation structure according to claim 1, characterized in that, The carrier plate is pre-coated with butyl adhesive on the side facing the cover plate and near the edge of the carrier plate, and the part of the lead wire extending out of the adhesive film is pre-fixed by the pre-coated butyl adhesive.

9. The photovoltaic module encapsulation structure according to claim 8, characterized in that, The butyl rubber is filled between the cover plate and the carrier plate, and seals the periphery of both the cover plate and the carrier plate.

10. A photovoltaic system, characterized in that, The photovoltaic system includes at least one photovoltaic module encapsulation structure as described in any one of claims 1-9; The solar cell layer is a perovskite cell layer.

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