Multi-station eutectic chip mounter

Abstract

The invention discloses a multi-station eutectic chip mounter which comprises a base, a hollow wafer jig capable of translating along an X axis and a Y axis is arranged on the front side of the center of the base, and the hollow wafer jig is used for placing a wafer with a chip. A chip transfer table capable of translating along an X axis and a Y axis, rotating around a Z axis and used for placing a chip to be subjected to eutectic is arranged on the base on the rear side of the hollow wafer jig, a first multi-dimensional self-adaptive deviation correction transfer device used for transferring the chip is arranged on the base, and substrate jigs used for placing substrates are arranged on the base on the left side and the right side of the hollow wafer jig respectively. The substrate jigs can horizontally move along the X axis and the Y axis, an eutectic table used for bearing substrates and chips for eutectic is arranged on the portion, on the rear side of each substrate jig, of the base, the eutectic tables can horizontally move along the X axis and the Y axis and rotate around the Z axis, and second multi-dimensional self-adaptive deviation rectifying and transferring devices used for transferring the substrates are arranged on the two sides of the base respectively. And the base is also provided with a third multi-dimensional self-adaptive deviation correction transfer device for transferring the chip.

Description

A multi-station eutectic chip mounter

[0001] This application claims priority to Chinese Patent Application No. 2024115361059, filed on October 31, 2024, entitled "A Multi-Station Eutectic Mounting Machine", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of chip mounter technology, and more particularly to a multi-station eutectic chip mounter. Background Technology

[0003] Currently, common eutectic bonding machines typically have only one set of eutectic stations, namely one chip loading station, one substrate loading station, and one eutectic station. The overall efficiency of the eutectic bonding machine is limited by the efficiency of the eutectic station, making it difficult to significantly improve. Furthermore, this set of eutectic stations often corresponds to only one substrate-chip combination. The various transfer mechanisms on the eutectic bonding machine need to be optimized according to the substrate-chip combination corresponding to this set of stations to ensure the alignment accuracy of the substrate-chip during eutectic bonding. Therefore, for common eutectic bonding machines, simply adding more eutectic stations to improve efficiency would increase the number of loading stations, eutectic stations, and transfer mechanisms that need to be optimized and coordinated to achieve the required alignment accuracy. These mechanisms would also have overlapping influences, leading to a sharp increase in optimization difficulty. Ultimately, this not only makes it difficult to improve eutectic bonding efficiency but also requires a significant amount of time for equipment debugging. Moreover, the fault tolerance between the loading stations, eutectic stations, and transfer mechanisms becomes extremely small. Any fluctuations in equipment operation during operation will directly affect the subsequent eutectic bonding quality.

[0004] Therefore, overcoming the aforementioned shortcomings has become an important issue that urgently needs to be addressed by those skilled in the art. Summary of the Invention

[0005] This invention overcomes the shortcomings of the above-mentioned technologies and provides a multi-station eutectic bonding machine.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-station eutectic bonding machine, comprising a base, wherein a hollow wafer fixture capable of translation along the X and Y axes is provided on the front center of the base, the hollow wafer fixture being used to place a wafer with a chip, and a chip transfer stage capable of translation along the X and Y axes and rotation around the Z axis is provided on the base behind the hollow wafer fixture for placing the chip to be eutectic bonded; the base is provided with a first multi-dimensional adaptive bias correction transfer device for transferring the chip between the hollow wafer fixture and the chip transfer stage; the hollow wafer fixture is positioned on the left and right sides. Each base on both sides is provided with a substrate fixture for placing the substrate. The substrate fixture can also translate along the X-axis and Y-axis. Each substrate fixture has a eutectic stage on the base behind it for carrying the substrate and chip for eutectic bonding. The eutectic stage can translate along the X-axis and Y-axis and rotate around the Z-axis. Each side of the base is provided with a second multi-dimensional adaptive bias correction transfer device for transferring the substrate between the substrate fixture and the eutectic stage on the corresponding side. The base is also provided with a third multi-dimensional adaptive bias correction transfer device for transferring the chip between the chip transfer stage and the two eutectic stages.

[0007] Preferably, the base is provided with a first Y-axis slide, and a first X-axis slide is driven and connected to the first Y-axis slide. The hollow wafer fixture is detachably connected to the first X-axis slide and is driven to translate by the first X-axis slide.

[0008] Preferably, each substrate fixture has a second X-axis slide on its base, and each second X-axis slide is driven to connect a second Y-axis slide. The substrate fixture is detachably connected to the corresponding second Y-axis slide below and is driven to translate by the second Y-axis slide.

[0009] Preferably, the base is provided with a third X-axis slide, a third Y-axis slide is driven and connected to the third X-axis slide, a first Z-axis turntable is driven and connected to the third Y-axis slide, and the turntable in the chip is detachably connected to the first Z-axis turntable and rotated by the first Z-axis turntable.

[0010] Preferably, a fourth Y-axis slide is provided on the base below each eutectic stage, a fourth X-axis slide is driven to be connected to each fourth Y-axis slide, and a second Z-axis turntable is driven to be connected to each fourth X-axis slide. The eutectic stage is detachably connected to the corresponding second Z-axis turntable below and is driven to rotate by the second Z-axis turntable.

[0011] Preferably, the first multidimensional adaptive correction and transfer device includes a first camera fixed on a base and facing the area where the hollow wafer fixture is located. The base is provided with a fifth Y-axis slide, a first Z-axis slide is driven and connected to the fifth Y-axis slide, a third Z-axis turntable is driven and connected to the first Z-axis slide, and a flexible adsorption component is driven and connected to the third Z-axis turntable. The flexible adsorption component is used to adsorb chips for transfer. The base is also provided with a chip ejector pin located below the hollow wafer fixture. The chip ejector pin is used to push the chip on the hollow wafer fixture upward so that the flexible adsorption component can adsorb the chip.

[0012] Preferably, the second multidimensional adaptive correction and transport device includes a second camera and a first light source fixed on the base and facing the area where the corresponding side substrate fixture is located. The base is provided with a sixth Y-axis slide, a second Z-axis slide is driven and connected to the sixth Y-axis slide, a fourth Z-axis turntable is driven and connected to the second Z-axis slide, and a flexible adsorption component is also connected to the fourth Z-axis turntable. The flexible adsorption component is used to adsorb the substrate to facilitate the transport of the substrate.

[0013] Preferably, the third multidimensional adaptive correction and transfer device includes a third camera and a fourth camera fixed on the base. The third camera faces the area where the chip transfer stage is located, and the fourth camera has two cameras, each facing the area where a eutectic stage is located. The base is provided with an X-axis slide rail located behind the chip transfer stage and the eutectic stage. A fifth X-axis slide is connected to the X-axis slide rail. A third Z-axis slide is driven to the fifth X-axis slide. A fifth Z-axis turntable is driven to the third Z-axis slide. A flexible adsorption component is also driven to the fifth Z-axis turntable. The flexible adsorption component is used to adsorb the chip to facilitate chip transfer.

[0014] Preferably, the flexible adsorption assembly includes a first crossbar connected to the Z-axis turntable, a first vertical bar extending downward is fixed to the end of the first crossbar, a second crossbar extending in the direction of the corresponding Z-axis turntable is hinged to the first vertical bar, a suction nozzle extending downward is fixed to the second crossbar, the suction nozzle is used to adsorb chips / substrates for easy transfer, and a buffer spring is connected between the first crossbar and the second crossbar.

[0015] Preferably, the base is provided with an ion fan facing the hollow wafer fixture area.

[0016] Preferably, the substrate fixture is further provided with a plurality of finished product storage positions for placing finished substrates that have completed eutectic bonding.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. The multi-station eutectic bonding machine of the present invention sets the hollow wafer fixture and the chip transfer stage in the center of the base, while the two sides of the base are respectively provided with substrate fixture and eutectic stage. In this way, the multi-station eutectic bonding machine of the present invention can perform two eutectic processes at the same time. Furthermore, by using the arrangement of hollow wafer fixtures and chip transfer stations in the center, with substrate fixtures and eutectic stations distributed on both sides, one less set of hollow wafer fixtures and chip transfer stations can be set up. This reduces the space required by the eutectic mounter while still meeting the chip requirements of two eutectic stations, thus improving space utilization. In addition, because of this distribution of hollow wafer fixtures, chip transfer stations, substrate fixtures, and eutectic stations, three multi-dimensional adaptive bias correction and transfer devices can be set up between hollow wafer fixtures and chip transfer stations, between substrate fixtures and eutectic stations, and between chip transfer stations and eutectic stations, respectively. This allows each transfer device to perform substrate and chip rotation simultaneously without interference, while also shortening the transfer path and further improving transfer efficiency.

[0018] 2. The multi-station eutectic bonding machine in this case uses a first multi-dimensional adaptive bias correction transfer device, a second multi-dimensional adaptive bias correction transfer device, and a third multi-dimensional adaptive bias correction transfer device to transfer chips and substrates between each station. During the transfer process, each transfer device can adaptively correct the object being transferred. Moreover, the hollow wafer fixture, substrate fixture, chip transfer stage, and eutectic stage can all adjust their positions to align with each transfer device. This eliminates the need for manual optimization of the eutectic bonding machine and ensures accurate alignment of the substrate and chip. Attached Figure Description

[0019] Figure 1 is one of the schematic diagrams of the multi-station eutectic chip mounter in this application.

[0020] Figure 2 is a second schematic diagram of the multi-station eutectic chip mounter in this application.

[0021] Figure 3 is a schematic diagram of the hollow wafer fixture, chip transfer station and the first multidimensional adaptive correction and transfer device in this application.

[0022] Figure 4 is a schematic diagram of the substrate fixture, eutectic stage, and second multidimensional adaptive correction and transfer device in this application.

[0023] Figure 5 is a schematic diagram of the chip transfer station, eutectic stage, and third multidimensional adaptive bias correction and transfer device in this application.

[0024] Figure 6 is a schematic diagram of the flexible adsorption component in this application. Detailed Implementation

[0025] The following embodiments further illustrate the features and other related features of the present invention in detail to facilitate understanding by those skilled in the art: As shown in Figures 1 to 5, a multi-station eutectic bonding machine includes a base 1. A hollow wafer fixture 2, capable of translation along the X and Y axes, is provided on the front center of the base 1. The hollow wafer fixture 2 is used to place wafers with chips. A chip transfer stage 3, capable of translation along the X and Y axes and rotation around the Z axis, is provided on the base 1 behind the hollow wafer fixture 2 for placing chips to be eutectic bonded. A first multi-dimensional adaptive bias correction transfer device is provided on the base 1 for transferring chips between the hollow wafer fixture 2 and the chip transfer stage 3. 4. The hollow wafer fixture 2 has a substrate fixture 5 on each of the bases 1 on the left and right sides for placing the substrate. The substrate fixture 5 can also translate along the X-axis and Y-axis. Each substrate fixture 5 has a eutectic stage 6 on the base 1 on the rear side for carrying the substrate and chip for eutectic bonding. The eutectic stage 6 can translate along the X-axis and Y-axis and rotate around the Z-axis. The base 1 has a second multi-dimensional adaptive bias correction transfer device 7 on each side for transferring the substrate between the substrate fixture 5 and the eutectic stage 6 on the corresponding side. The base 1 also has a third multi-dimensional adaptive bias correction transfer device 8 for transferring the chip between the chip transfer stage 3 and the two eutectic stages 6.

[0026] In this application, the multi-station eutectic bonding machine has a hollow wafer fixture 2 and a chip transfer stage 3 arranged front-to-back in the center of the base 1, while a substrate fixture 5 and a eutectic stage 6 are arranged front-to-back on both the left and right sides of the base 1, respectively. Simultaneously, a first multi-dimensional adaptive bias correction transfer device 4 for transferring chips is provided between the hollow wafer fixture 2 and the chip transfer stage 3, and a second multi-dimensional adaptive bias correction transfer device 7 for transferring substrates is provided between the substrate fixture 5 and the eutectic stage 6 on the same side. Furthermore, a third multi-dimensional adaptive bias correction transfer device 8 is provided on the base 1 for transferring chips between the chip transfer stage 3 and the two eutectic stages 6. In this way, when the multi-station eutectic die bonding machine is working, the first multi-dimensional adaptive correction and transfer device 4 can transfer the chip in the wafer placed on the hollow wafer fixture 2 to the chip transfer stage 3. During the transfer, the hollow wafer fixture 2 can align the chip to be transferred with the first multi-dimensional adaptive correction and transfer device 4 by translating in the X and Y axes, so that the first multi-dimensional adaptive correction and transfer device 4 can accurately pick up the chip. The first multi-dimensional adaptive correction and transfer device 4 can correct the chip during the transfer of the chip to the chip transfer stage 3, and the chip transfer stage 3 can also adjust its own orientation by translating in the X and Y axes and rotating in the Z axis to more accurately receive the chip transferred by the first multi-dimensional adaptive correction and transfer device 4.

[0027] While the first multidimensional adaptive correction transfer device 4 is transferring the chip, the substrate is also being transferred simultaneously. Similarly, the second multidimensional adaptive correction transfer device 7 can transfer the substrate placed on the substrate fixture 5 to the eutectic stage 6. During the transfer, the substrate fixture 5 can align the substrate to be transferred with the second multidimensional adaptive correction transfer device 7 by translating in the X and Y axes so that the second multidimensional adaptive correction transfer device 7 can accurately remove the substrate. The second multidimensional adaptive correction transfer device 7 can also correct the substrate during the transfer process. The eutectic stage 6 can also adjust its own orientation by translating in the X and Y axes and rotating in the Z axis to more accurately receive the substrate transferred by the second multidimensional adaptive correction transfer device 7.

[0028] Once a chip is transferred to the chip transfer station 3, the third multi-dimensional adaptive correction transfer device 8 will move the chip on the chip transfer station 3 to one of the eutectic stations 6 on the left or right, depending on the availability of the eutectic station 6. Similarly, the chip transfer station 3 and the eutectic station 6 can also better cooperate with the third multi-dimensional adaptive correction transfer device 8 by translating in the X and Y axes and rotating in the Z axis during this transfer process. The third multi-dimensional adaptive correction transfer device 8 will also correct the chip again during the transfer process.

[0029] As described above, the multi-station eutectic bonding machine of this application sets the hollow wafer fixture 2 and the chip transfer stage 3 in the center of the base 1, while the base 1 has a substrate fixture 5 and a eutectic stage 6 on both sides respectively. In this way, the multi-station eutectic bonding machine of this application can perform two eutectic processes at the same time. Furthermore, by using the arrangement of hollow wafer fixture 2 and chip transfer stage 3 in the center, with substrate fixture 5 and eutectic stage 6 distributed on both sides, one less set of hollow wafer fixture 2 and chip transfer stage 3 can be set up. This reduces the space required by the eutectic mounter while still meeting the chip requirements of two eutectic stages 6, thus improving space utilization. In addition, because of this distribution of hollow wafer fixture 2, chip transfer stage 3, substrate fixture 5 and eutectic stage 6, three multi-dimensional adaptive bias correction and transfer devices can be set between hollow wafer fixture 2 and chip transfer stage 3, between substrate fixture 5 and eutectic stage 6, and between chip transfer stage 3 and eutectic stage 6, respectively. This allows each transfer device to perform substrate and chip rotation simultaneously without interfering with each other, while also shortening the transfer path and further improving transfer efficiency. Meanwhile, since the multi-station eutectic bonding machine in this case uses the first multi-dimensional adaptive correction transfer device 4, the second multi-dimensional adaptive correction transfer device 7 and the third multi-dimensional adaptive correction transfer device 8 to transfer chips and substrates between each station, each transfer device can adaptively correct the object being transferred during the transfer process. Moreover, the hollow wafer fixture 2, the substrate fixture 5, the chip transfer stage 3 and the eutectic stage 6 can adjust their own positions to align with each transfer device. In this way, there is no need for manual optimization of the eutectic bonding machine to ensure accurate alignment of the substrate and the chip.

[0030] As shown in Figures 1 to 3, preferably, the base 1 is provided with a first Y-axis slide 21, and a first X-axis slide 22 is driven and connected to the first Y-axis slide 21. The hollow wafer fixture 2 is detachably connected to the first X-axis slide 22 and is driven to translate by the first X-axis slide 22. In this way, the hollow wafer fixture 2 can be driven to translate along the X-axis direction by the first X-axis slide 22, while the first Y-axis slide 21 can indirectly drive the hollow wafer fixture 2 to translate along the Y-axis direction by driving the first X-axis slide 22 to translate along the Y-axis direction. In this way, the hollow wafer fixture 2 can be translated in the X-axis and Y-axis directions by the cooperation of the first Y-axis slide 21 and the first X-axis slide 22, so that the hollow wafer fixture 2 can adjust the position of the chip and cooperate with the first multi-dimensional adaptive correction and transfer device 4 to transfer the chip.

[0031] As shown in Figures 1, 2, and 4, preferably, each substrate fixture 5 has a second X-axis slide 51 on its base 1 below it, and each second X-axis slide 51 is driven to connect a second Y-axis slide 52. The substrate fixture 5 is detachably connected to the corresponding second Y-axis slide 52 below it and is driven to translate by the second Y-axis slide 52. In this way, the substrate fixture 5 can be driven to translate along the Y-axis direction by the second Y-axis slide 52, while the second X-axis slide 51 can indirectly drive the substrate fixture 5 to translate along the X-axis direction by driving the second Y-axis slide 52 to translate along the X-axis direction. In this way, the substrate fixture 5 can be translated in the X-axis and Y-axis directions by the cooperation of the second X-axis slide 51 and the second Y-axis slide 52, so that the substrate fixture 5 can adjust the position of the chip and cooperate with the second multi-dimensional adaptive correction and transfer device 7 to transfer the substrate.

[0032] As shown in Figures 1, 2, 3, and 5, preferably, the base 1 is provided with a third X-axis slide 31, a third Y-axis slide 32 is driven and connected to the third X-axis slide 31, and a first Z-axis turntable 33 is driven and connected to the third Y-axis slide 32. The turntable 3 in the chip is detachably connected to the first Z-axis turntable 33 and is driven to rotate by the first Z-axis turntable 33. In this way, the third Y-axis slide 32 can be driven to translate along the X-axis direction by the third X-axis slide 31, and the third Y-axis slide 32 can drive the first Z-axis turntable 33 to translate along the Y-axis direction. At the same time, the third X-axis slide 31 can also indirectly drive the first Z-axis turntable 33 to translate along the X-axis direction. This realizes the translation of the first Z-axis turntable 33 along the X-axis and Y-axis directions. Since the chip transfer stage 3 is mounted on the first Z-axis turntable 33 and can be driven by the first Z-axis turntable 33 to rotate around the Z-axis, the third X-axis slide 31 and the third Y-axis slide 32 can also indirectly drive the chip transfer stage 3 to translate along the X-axis and Y-axis directions. Thus, the chip transfer stage 3 can translate along the X-axis and Y-axis and rotate around the Z-axis under the combined drive of the third X-axis slide 31, the third Y-axis slide 32 and the first Z-axis turntable 33, thereby adjusting its own position angle so as to more accurately receive the chip sent out by the first multi-dimensional adaptive correction transfer device 4.

[0033] As shown in Figures 1, 2, 4, and 5, preferably, a fourth Y-axis slide 61 is provided on the base 1 below each eutectic stage 6. A fourth X-axis slide 62 is driven and connected to each fourth Y-axis slide 61, and a second Z-axis turntable 63 is driven and connected to each fourth X-axis slide 62. The eutectic stage 6 is detachably connected to the corresponding second Z-axis turntable 63 below and is driven to rotate by the second Z-axis turntable 63. In this way, the fourth X-axis slide 62 can be driven to translate along the Y-axis direction by the fourth Y-axis slide 61, and the fourth X-axis slide 62 can drive the second Z-axis turntable 63 to translate along the X-axis direction. At the same time, the fourth Y-axis slide 61 can also indirectly drive the second Z-axis turntable 63 to translate along the Y-axis direction. This realizes the translation of the second Z-axis turntable 63 along the X-axis and Y-axis directions. Since the eutectic stage 6 is mounted on the second Z-axis turntable 63 and can be driven by the second Z-axis turntable 63 to rotate around the Z-axis, the fourth Y-axis slide 61 and the fourth X-axis slide 62 can also indirectly drive the eutectic stage 6 to translate along the X-axis and Y-axis directions. In this way, the eutectic stage 6 can translate along the X-axis and Y-axis and rotate around the Z-axis under the combined drive of the fourth Y-axis slide 61, the fourth X-axis slide 62 and the second Z-axis turntable 63, thereby adjusting its own position angle so as to more accurately receive the substrate sent by the second multi-dimensional adaptive correction transfer device 7 and the chip sent by the third multi-dimensional adaptive correction transfer device 8.

[0034] As shown in Figures 1, 2, 3, and 6, preferably, the first multidimensional adaptive correction and transfer device 4 includes a first camera 41 fixed on the base 1 facing the area where the hollow wafer fixture 2 is located. The base 1 is provided with a fifth Y-axis slide 42, a first Z-axis slide 43 is driven connected to the fifth Y-axis slide 42, a third Z-axis turntable 44 is driven connected to the first Z-axis slide 43, and a flexible adsorption component 9 is driven connected to the third Z-axis turntable 44. The flexible adsorption component 9 is used to adsorb chips to facilitate chip transfer. The base 1 is also provided with a chip ejector pin 45 located below the hollow wafer fixture 2. The chip ejector pin 45 is used to push the chip on the hollow wafer fixture 2 upward so that the flexible adsorption component 9 can adsorb the chip.

[0035] As described above, the first multidimensional adaptive correction and transfer device 4 in this case includes a chip ejector pin 45 located below the hollow wafer fixture 2. The hollow wafer fixture 2 can move the chip to be transferred to the chip ejector pin 45 by translation in the X and Y axes. The chip ejector pin 45 can then eject the chip from the wafer in the hollow wafer fixture 2. Furthermore, the base 1 is equipped with a first camera 41 facing the hollow wafer fixture 2. This allows the first camera 41 to acquire image information of the chip on the wafer in the hollow wafer fixture 2, and the specific position and offset of the chip can be determined through image recognition. Simultaneously, the base 1 is also equipped with a fifth Y-axis slide 42. The fifth Y-axis slide 42 can drive the first Z-axis slide 43 to translate along the Y-axis, and the first Z-axis slide 43 can drive the third Z-axis turntable 44 to translate up and down along the Z-axis. A flexible adsorption component 9 is connected to the third Z-axis turntable 44. In this way, the flexible adsorption component 9 can be indirectly driven to move back and forth between the hollow wafer fixture 2 and the chip transfer stage 3 along the Y-axis by the fifth Y-axis slide 42, and the flexible adsorption component 9 can be indirectly driven to move up and down along the Z-axis by the first Z-axis slide 43 to lift the chip from the hollow wafer fixture 2 and put it down at the chip transfer stage 3. The flexible adsorption component 9 can be driven to rotate and adjust the chip angle by the third Z-axis turntable 44 based on the chip image information obtained by the first camera 41. In this way, the first multi-dimensional adaptive correction and transfer device 4 can adsorb the chip by the flexible adsorption component 9, and then transfer the chip from the hollow wafer fixture 2 to the chip transfer stage 3 with the cooperation of the fifth Y-axis slide 42 and the first Z-axis slide 43. During the transfer, the chip angle can also be adjusted by the third Z-axis turntable 44 based on the image information obtained by the first camera 41, thereby realizing the correction of chip deviation during transfer.

[0036] As shown in Figures 1, 2, 4, and 6, preferably, the second multidimensional adaptive correction and transfer device 7 includes a second camera 71 and a first light source 72 fixed on the base 1 facing the area where the corresponding side substrate fixture 5 is located. The base 1 is provided with a sixth Y-axis slide 73, and a second Z-axis slide 74 is driven and connected to the sixth Y-axis slide 73. A fourth Z-axis turntable 75 is driven and connected to the second Z-axis slide 74. A flexible adsorption component 9 is also connected to the fourth Z-axis turntable 75. The flexible adsorption component 9 is used to adsorb the substrate to facilitate the transfer of the substrate.

[0037] As described above, the second multidimensional adaptive correction and transfer device 7 in this application includes a second camera 71 and a first light source 72 positioned facing the substrate fixture 5. This allows the second camera 71 to acquire image information of the substrate on the substrate fixture 5, and image recognition to determine the specific position and offset of the substrate. Simultaneously, the base 1 is also equipped with a sixth Y-axis slide 73. The sixth Y-axis slide 73 can drive a second Z-axis slide 74 to translate along the Y-axis, and the second Z-axis slide 74 can in turn drive a fourth Z-axis turntable 75 to translate vertically along the Z-axis. The fourth Z-axis turntable 75 is also connected to a flexible adsorption component 9. In this way, the flexible adsorption component 9 can be indirectly driven to move back and forth between the substrate fixture 5 and the eutectic stage 6 along the Y-axis by the sixth Y-axis slide 73, and the flexible adsorption component 9 can be indirectly driven to move up and down along the Z-axis by the second Z-axis slide 74 to lift the substrate from the substrate fixture 5 and put it on the eutectic stage 6. The flexible adsorption component 9 can be driven to rotate and adjust the angle of the substrate based on the substrate image information obtained by the second camera 71 by the fourth Z-axis turntable 75. In this way, the second multi-dimensional adaptive correction and transfer device 7 can adsorb the substrate by the flexible adsorption component 9, and then transfer the substrate from the substrate fixture 5 to the eutectic stage 6 with the cooperation of the sixth Y-axis slide 73 and the second Z-axis slide 74. During the transfer, the angle of the substrate can also be adjusted by the fourth Z-axis turntable 75 based on the image information obtained by the second camera 71, thereby realizing the correction processing of the substrate during the transfer.

[0038] As shown in Figures 1, 2, 5, and 6, preferably, the third multi-dimensional adaptive correction and transfer device 8 includes a third camera 81 and a fourth camera 82 fixed on the base 1. The third camera 81 faces the area where the chip transfer stage 3 is located, and the fourth camera 82 has two areas facing the area where a eutectic stage 6 is located. The base 1 is provided with an X-axis slide rail 83 located behind the chip transfer stage 3 and the eutectic stage 6. A fifth X-axis slide 84 is connected to the X-axis slide rail 83. A third Z-axis slide 85 is driven to the fifth X-axis slide 84. A fifth Z-axis turntable 86 is driven to the third Z-axis slide 85. A flexible adsorption component 9 is also driven to the fifth Z-axis turntable 86. The flexible adsorption component 9 is used to adsorb the chip to facilitate chip transfer.

[0039] As described above, the third multidimensional adaptive correction and transfer device 8 in this application includes a third camera 81 facing the chip transfer stage 3 and a fourth camera 82 facing the eutectic stage 6. Thus, the third camera 81 and the fourth camera 82 can respectively acquire image information of the chip on the chip transfer stage 3 and the substrate on the eutectic stage 6. Image recognition can then determine the specific position and offset of the substrate and chip about to undergo eutectic bonding. Simultaneously, the base 1 is also provided with an X-axis slide rail 83, on which a fifth X-axis slide stage 84 capable of moving along the X-axis is connected. The fifth X-axis slide stage 84 can drive a third Z-axis slide stage 85 to translate along the X-axis, while the third Z-axis slide stage 85 can drive a fifth Z-axis turntable 86 to move up and down along the Z-axis. The fifth Z-axis turntable 86 is also connected to a flexible adsorption component 9. In this way, the flexible adsorption component 9 can be indirectly driven to move back and forth between the chip transfer stage 3 and the eutectic stage 6 via the fifth X-axis slide 84. The flexible adsorption component 9 can be indirectly driven to move up and down along the Z-axis via the third Z-axis slide 85 to lift the chip from the chip transfer stage 3 and place it on the eutectic stage 6. The fifth Z-axis turntable 86 can rotate the flexible adsorption component 9 according to the image information of the substrate and chip obtained by the third camera 81 and the fourth camera 82, thereby correcting the chip's angle so that the chip and substrate are accurately aligned and bonded before eutectic bonding. In this way, the third multi-dimensional adaptive correction and transfer device 8 can adsorb the chip through the flexible adsorption component 9, and then transfer the chip from the chip transfer stage 3 to the eutectic stage 6 with the cooperation of the fifth X-axis slide 84 and the third Z-axis slide 85. During the transfer, the chip's angle can be adjusted by the fifth Z-axis turntable 86 according to the image information obtained by the third camera 81 and the fourth camera 82, thereby correcting the chip again according to the actual situation of the substrate and chip before eutectic bonding.

[0040] As shown in Figures 1 to 6, preferably, the flexible adsorption component 9 includes a first horizontal bar 91 connected to the Z-axis turntable, a first vertical bar 92 extending downward is fixed to the end of the first horizontal bar 91, a second horizontal bar 93 extending in the direction of the corresponding Z-axis turntable is hinged to the first vertical bar 92, a suction nozzle 94 extending downward is fixed to the second horizontal bar 93, the suction nozzle 94 is used to adsorb chips / substrates for easy transfer, and a buffer spring 95 is connected between the first horizontal bar 91 and the second horizontal bar 93.

[0041] As described above, the flexible adsorption assembly 9 of this invention includes a first horizontal bar 91 connected to the corresponding Z-axis turntable, and a second horizontal bar 93 is hinged to the first horizontal bar 91 via a first vertical bar 92. A suction nozzle 94 is fixed on the second horizontal bar 93, and the suction nozzle 94 coincides with the axis of rotation of the corresponding Z-axis turntable. In this way, when the Z-axis turntable rotates, the suction nozzle 94 can rotate synchronously to adjust the angle of the substrate / chip adsorbed by the suction nozzle 94 to achieve correction. In addition, since a buffer spring 95 is connected between the first horizontal bar 91 and the second horizontal bar 93, when the suction nozzle 94 contacts the substrate / chip, the distance between the first horizontal bar 91 and the second horizontal bar 93 can be changed by the buffer spring 95 to achieve buffering, thereby avoiding damage to the substrate / chip from hard contact between the suction nozzle 94 and the substrate / chip, and also reducing the positional displacement of the substrate / chip caused by contact with the suction nozzle 94.

[0042] As shown in Figure 1, preferably, the base 1 is provided with an ion fan 10 facing the region of the hollow wafer fixture 2. In this way, the ion fan 10 can effectively remove static electricity near the wafer, reduce the probability of chip damage due to static electricity, and improve the yield.

[0043] As shown in Figures 1, 2, and 4, preferably, the substrate fixture 5 is further provided with a plurality of finished product storage positions 56 for placing finished substrates that have completed eutectic bonding.

[0044] As described above, the substrate fixture 5 is also provided with a finished product storage position 56 for placing the finished substrate that has completed eutectic bonding. In addition to transferring the substrate with eutectic bonding on the substrate fixture 5 to the eutectic bonding stage 6, the first multi-dimensional adaptive correction and transfer device 4 can also transfer the finished substrate that has completed eutectic bonding on the eutectic bonding stage 6 back to the finished product storage position 56 of the substrate fixture 5 to wait for removal, thereby improving the turnover efficiency of the substrate in the eutectic bonding machine of this invention.

[0045] As shown in Figures 1, 2, and 4, preferably, the second Z-axis slide 74, the fourth Z-axis turntable 75, and the flexible adsorption component 9 connected to the fourth Z-axis turntable 75 together form the first flexible correction and transfer component. Two sets of the first flexible correction and transfer components are arranged side by side on the sixth Y-axis slide 73. In this way, by setting two sets of the first flexible correction and transfer components on the sixth Y-axis slide 73, the transfer of two substrates can be carried out simultaneously during the process of the second multidimensional adaptive correction and transfer device 7 going back and forth between the substrate fixture 5 and the eutectic stage 6 once, without having to complete the transfer of one substrate and then return completely empty before transferring the other substrate, thereby greatly improving the transfer efficiency.

[0046] As shown in Figures 1, 2, and 5, preferably, the fifth X-axis slide 84, the third Z-axis slide 85, the fifth Z-axis turntable 86, and the flexible adsorption component 9 connected to the fifth Z-axis turntable 86 together form the second flexible correction and transfer component. Two sets of the second flexible correction and transfer components are connected to the X-axis slide rail 83. In this way, by setting two sets of the second flexible correction and transfer components on the X-axis slide rail 83, the second flexible correction and transfer components can be matched one-to-one with the left and right eutectic stages 6 to transfer the chip, thereby greatly improving the chip transfer efficiency.

[0047] As stated above, this application protects a multi-station eutectic bonding machine, and all technical solutions that are the same as or similar to this application should be considered to fall within the protection scope of this application.

Claims

1. A multi-station eutectic bonding machine, characterized in that, The system includes a base (1), a hollow wafer fixture (2) capable of translating along the X and Y axes on the front center of the base (1), the hollow wafer fixture (2) being used to place a wafer with a chip, a chip transfer stage (3) capable of translating along the X and Y axes and rotating around the Z axis on the base (1) behind the hollow wafer fixture (2), and a first multi-dimensional adaptive bias correction transfer device (4) for transferring the chip between the hollow wafer fixture (2) and the chip transfer stage (3) on the base (1). The base (1) on the left and right sides of the hollow wafer fixture (2) is respectively provided with a substrate for placing a substrate. The substrate fixture (5) is also capable of translation along the X-axis and Y-axis. Each substrate fixture (5) has a eutectic stage (6) on the base (1) on the rear side for carrying the substrate and chip for eutectic bonding. The eutectic stage (6) is capable of translation along the X-axis and Y-axis and rotation around the Z-axis. The base (1) has a second multidimensional adaptive correction transfer device (7) on each side for transferring the substrate between the substrate fixture (5) and the eutectic stage (6) on the corresponding side. The base (1) also has a third multidimensional adaptive correction transfer device (8) for transferring the chip between the chip transfer stage (3) and the two eutectic stages (6).

2. The multi-station eutectic bonding machine according to claim 1, characterized in that, The base (1) is provided with a first Y-axis slide (21), and a first X-axis slide (22) is driven and connected to the first Y-axis slide (21). The hollow wafer fixture (2) is detachably connected to the first X-axis slide (22) and is driven to translate by the first X-axis slide (22). A second X-axis slide (51) is provided on the base (1) below each substrate fixture (5). A second Y-axis slide (52) is driven and connected to each second X-axis slide (51). The substrate fixture (5) is detachably connected to the corresponding second Y-axis slide (52) below and is driven to translate by the second Y-axis slide (52).

3. A multi-station eutectic bonding machine according to claim 1, characterized in that, The base (1) is provided with a third X-axis slide (31), and a third Y-axis slide (32) is driven to the third X-axis slide (31). A first Z-axis turntable (33) is driven to the third Y-axis slide (32). The turntable (3) in the chip is detachably connected to the first Z-axis turntable (33) and is driven to rotate by the first Z-axis turntable (33). A fourth Y-axis slide (61) is provided on the base (1) below each eutectic stage (6). A fourth X-axis slide (62) is driven to the fourth Y-axis slide (61). A second Z-axis turntable (63) is driven to the fourth X-axis slide (62). The eutectic stage (6) is detachably connected to the corresponding second Z-axis turntable (63) below and is driven to rotate by the second Z-axis turntable (63).

4. A multi-station eutectic bonding machine according to claim 1, characterized in that, The first multidimensional adaptive correction and transfer device (4) includes a first camera (41) fixed on the base (1) facing the area where the hollow wafer fixture (2) is located. The base (1) is provided with a fifth Y-axis slide (42). A first Z-axis slide (43) is driven connected to the fifth Y-axis slide (42). A third Z-axis turntable (44) is driven connected to the first Z-axis slide (43). A flexible adsorption component (9) is driven connected to the third Z-axis turntable (44). The flexible adsorption component (9) is used to adsorb the chip so as to facilitate the transfer of the chip. The base (1) is also provided with a chip ejector pin (45) located below the hollow wafer fixture (2). The chip ejector pin (45) is used to push the chip on the hollow wafer fixture (2) upward so that the flexible adsorption component (9) can adsorb the chip.

5. A multi-station eutectic bonding machine according to claim 1, characterized in that, The second multidimensional adaptive correction and transfer device (7) includes a second camera (71) and a first light source (72) fixed on the base (1) facing the area where the corresponding side substrate fixture (5) is located. The base (1) is provided with a sixth Y-axis slide (73), and a second Z-axis slide (74) is driven connected to the sixth Y-axis slide (73). A fourth Z-axis turntable (75) is driven connected to the second Z-axis slide (74). A flexible adsorption component (9) is also connected to the fourth Z-axis turntable (75). The flexible adsorption component (9) is used to adsorb the substrate so as to facilitate the transfer of the substrate.

6. A multi-station eutectic bonding machine according to claim 1, characterized in that, The third multidimensional adaptive correction and transfer device (8) includes a third camera (81) and a fourth camera (82) fixed on the base (1). The third camera (81) faces the area where the chip transfer stage (3) is located, and the fourth camera (82) has two cameras facing the area where a eutectic stage (6) is located. The base (1) is provided with an X-axis slide rail (83) located behind the chip transfer stage (3) and the eutectic stage (6). A fifth X-axis slide (84) is connected to the X-axis slide rail (83). A third Z-axis slide (85) is driven to the fifth X-axis slide (84). A fifth Z-axis turntable (86) is driven to the third Z-axis slide (85). A flexible adsorption component (9) is also driven to the fifth Z-axis turntable (86). The flexible adsorption component (9) is used to adsorb the chip to facilitate the transfer of the chip.

7. A multi-station eutectic bonding machine according to any one of claims 4 to 6, characterized in that, The flexible adsorption assembly (9) includes a first crossbar (91) connected to the Z-axis turntable. A first vertical bar (92) extending downward is fixed to the end of the first crossbar (91). A second crossbar (93) extending in the direction of the corresponding Z-axis turntable is hinged to the first vertical bar (92). A suction nozzle (94) extending downward is fixed to the second crossbar (93). The suction nozzle (94) is used to adsorb chips / substrates for easy transfer. A buffer spring (95) is connected between the first crossbar (91) and the second crossbar (93).

8. A multi-station eutectic bonding machine according to claim 1, characterized in that, An ion fan (10) is provided on the base (1) facing the region of the hollow wafer fixture (2).

9. A multi-station eutectic bonding machine according to claim 1, characterized in that, The substrate fixture (5) is also provided with several finished product storage positions (56) for placing finished substrates that have completed eutectic bonding.

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