Packaging device

Abstract

The aim of the invention is to address various points to be improved so as to correspond to various containers rather than to seal containers of the same size. A packaging device for film-sealing a container, the packaging device being characterized by being provided with: a heating means for heating a mold; and the mounting mechanism can be used for mounting one of a plurality of molds, and the mold mounted on the mounting mechanism is relatively close to the heating mechanism.

Description

Packaging equipment Technical Field

[0001] The present invention relates to a packaging apparatus for covering a pallet containing a packaged item with a film and heat-sealing the film to the edge of the pallet. Background Technology

[0002] As a conventional packaging device, there is a type of packaging device that places food as the packaged item on a weighing scale, then conveys it to a tray supplied to a conveyor belt, and heat-seals a film cover on the tray, thereby sealing a large number of trays (for example, see Patent Document 1).

[0003] Prior art literature, patent literature, patent literature 1: Japanese Patent Publication No. 2013-515654. Summary of the Invention

[0004] The problem this invention aims to solve is that the packaging device described in Patent Document 1 is a device for sealing containers of the same size, not a device for multiple containers, and there are various points that need improvement.

[0005] The packaging apparatus of the present invention, used to solve the problem, has at least the following structure.

[0006] A packaging apparatus for sealing a container with a film, the packaging apparatus being characterized by comprising: a heating mechanism for heating a mold; and an installation mechanism for installing one of a plurality of molds, the mold installed in the installation mechanism being relatively close to the heating mechanism.

[0007] Effects of the Invention According to the present invention, a packaging apparatus capable of packaging various containers can be provided. Attached Figure Description

[0008] Figure 1 shows a right perspective view of the appearance of the packaging device according to an embodiment of the present invention.

[0009] Figure 2 is a left perspective view showing the appearance of the packaging device according to an embodiment of the present invention.

[0010] Figure 3 is a top view showing the appearance of the packaging device according to an embodiment of the present invention.

[0011] Figure 4 is a right-side view of the packaging device according to an embodiment of the present invention.

[0012] Figure 5 is a right-side view of the metering and packaging mechanisms (with part of the equipment frame removed).

[0013] Figure 6 is a perspective view of the measuring and packaging mechanisms (with part of the equipment frame removed).

[0014] Figure 7 is a main sectional view illustrating the upper mold and the upper mold support. Figure 7(a) shows the upper mold support when the upper mold is not filled, Figure 7(b) shows the upper mold unit, and Figure 7(c) shows the state in which the upper mold is filled in the upper mold support.

[0015] Figure 8 shows the upper mold. Figure 8(a) is the top view, Figure 8(b) is the front view, Figure 8(c) is the bottom view, Figure 8(d) is the upper perspective view, and Figure 8(e) is the lower perspective view.

[0016] Figure 9 is a diagram depicting the state of the holding part when it is removed and transported from the upper mold. Figure 9(a) is a top view, Figure 9(b) is a front view, Figure 9(c) is a bottom view, Figure 9(d) is an upper perspective view, and Figure 9(e) is a lower perspective view.

[0017] Figure 10 is a drawing of the holding part when the upper mold is removed and transported, with the metal plate and surrounding base plate omitted. Figure 10(a) is a top view, Figure 10(b) is a front view, Figure 10(c) is a bottom view, Figure 10(d) is a top perspective view, and Figure 10(e) is a bottom perspective view.

[0018] Figure 11 is a diagram showing the state in which the upper mold is filled in the upper mold support. Figure 11(a) is a top view, Figure 11(b) is a front view, Figure 11(c) is a bottom view, Figure 11(d) is a top perspective view, Figure 11(e) is a right side view, and Figure 11(f) is a conceptual diagram showing the heat transfer component.

[0019] Figure 12 shows the state in which the upper mold is not filled in the upper mold support. Figure 12(a) is a top view, Figure 12(b) is a front view, Figure 12(c) is a bottom view, Figure 12(d) is a top perspective view, Figure 12(e) is a right side view, and Figure 12(f) is a partial enlarged view of Figure 12(d) (D).

[0020] Figure 13 is a diagram illustrating the lower mold. Figure 13(a) shows the top view and Figure 13(b) shows the side sectional view.

[0021] Figure 14 is a perspective view showing the installation and removal of the lower mold in the lower mold support.

[0022] Figure 15 illustrates the mechanism of loading status determination.

[0023] Figure 16 is a diagram showing an example of the judgment result displayed on the measurement screen.

[0024] Figure 17 is a diagram showing an example of the layout of the display screen.

[0025] Figure 18 is a diagram showing an example of the layout of the display screen.

[0026] Figure 19 is a diagram showing an example of the layout of the display screen.

[0027] Figure 20 is a partially enlarged view of the side sectional view of the lower mold.

[0028] Figure 21 is a side sectional view showing the change in state of the lower mold relative to the upper mold when it is lifted.

[0029] Figure 22 is a perspective view showing the state in which the upper mold and the lower mold are housed in the mold housing mechanism.

[0030] Figure 23 is a right-side view showing the state in which the upper and lower molds are housed in the mold housing mechanism. Detailed Implementation

[0031] Hereinafter, an example of an embodiment of the packaging device according to the present invention will be described with reference to the accompanying drawings. However, the following drawings are for illustrative purposes only, and unnecessary parts may be intentionally omitted for ease of understanding. Furthermore, for ease of explanation, parts may be intentionally enlarged or reduced in size for illustration, and the drawings are not to show an accurate scale. In addition, in the following description, the same symbol in different figures represents the same functional part, and repeated descriptions in each figure are appropriately omitted.

[0032] (Overall Structure) Figures 1 to 4 show the appearance of the packaging device according to the embodiments of the present invention. Figure 1 is a right perspective view, Figure 2 is a left perspective view, Figure 3 is a top view, and Figure 4 is a right side view. Figures 5 and 6 are diagrams that specifically show the measuring mechanism and the packaging mechanism. Figure 5 is a right side view (with a part of the equipment frame removed), and Figure 6 is a perspective view (with a part of the equipment frame removed).

[0033] The packaging apparatus 100 according to the embodiments of the present invention shown in Figures 1 to 3 automatically performs the following series of actions: weighing the packaged item, moving the tray T containing the packaged item into the equipment, simultaneously performing a gas replacement treatment (one-time treatment of the entire welded part) to extend the shelf life of the packaged item, sealing treatment, and labeling, and then moving it out. In other words, it can be said to be an apparatus where a packaging process exists between the weighing process and the labeling process of the packaged item. More specifically, as shown by the arrow in Figure 3, the packaging apparatus 100 is configured as follows: when the tray T (refer to Figure 5) containing the packaged item is placed on the weighing mechanism 1 (refer to Figure 1), the weight of the packaged item is weighed, and it is moved into the equipment frame having the packaging mechanism 2 by the feed rod IB (refer to Figures 5 and 6). Inside the equipment frame, the lower mold 25 (refer to Figure 1) lifts the tray T upward. First, the film and tray T, which are always in a taut state held at both ends by the film holding mechanism 211 and the remaining film winding mechanism 212 (refer to Figure 1), are replaced with an inactive gas. The air in the space between the two is then used to bring the edge of the tray T into contact with the film. Simultaneously, the lower mold 25 and upper mold 24 (refer to Figure 1) clamp the tray, and the film is heat-sealed. After the film is cut, the lower mold 25 and tray T descend to a predetermined height (fixed position). Through the feed rod IB (refer to Figures 5 and 6), the tray T is moved again in the feeding direction to the rear section 3, and then in the output direction orthogonal to the feeding direction. After being labeled by the labeling mechanism 7, it is discharged to the first discharge station 4, and then moved in the opposite direction to the feeding direction to the second discharge station 5. In this embodiment of the invention, in order to correspond to the three different sizes of tray T ("large", "medium", and "small"), three types of upper and lower molds are prepared and configured to be interchangeable. However, this is only one example; the size types can be "large" and "small", or four or more sizes can be prepared. Furthermore, the tray size can also be only one type, without the need for replacement.

[0034] The measuring mechanism 1, packaging mechanism 2, and rear section 3 are arranged longitudinally from the front side towards the inside of the device. As shown in Figure 1, a control console 6 is located above the measuring mechanism 1 and upstream of it in the conveying direction. The control console 6 has a display or numeric keypad, touch panel, and other operating parts on its front, and a control mechanism inside. To explain this configuration in more detail, the lower end of the housing of the control console 6 is located upstream of the measuring mechanism 1, the center of the control console 6 and the center of the display are both located in the area of ​​the measuring mechanism 1, and the control console 6 is tilted, but the upper end of the housing of the control console 6 is also located upstream of the measuring mechanism 1. Furthermore, the upper part of the rear section 3 becomes a labeling mechanism 7 for printing and affixing product labels containing information such as the measured weight, unit price, and price. Also, a gas replacement mechanism (not shown in Figures 1 and 3) is provided in the lower mold 25. In addition, in this specification, "gas replacement" refers to the broad use of "gas replacement" in the sense of replacing the air inside the packaged product with an inactive gas for extending shelf life (unrelated to other aspects of the specific process). This includes two methods: the narrow use of "gas replacement" in the sense of injecting gas after completely removing the air, and the "gas flushing" method in which gas is sprayed to expel the air.

[0035] The embodiments of the present invention with this structure perform sealing while gas replacement is carried out between the packaged item and the film, thus improving operational efficiency by performing gas replacement treatment for extending the shelf life of the packaged item and sealing-based packaging treatment approximately simultaneously.

[0036] Furthermore, the structure of the embodiment of the present invention, in which the tray T inserted from the front returns to the front after packaging, greatly improves the efficiency of back-end operations and achieves a compact structure. However, from the viewpoint that gas replacement treatment for extending the shelf life of the packaged goods and sealing-based packaging treatment are performed approximately simultaneously, the structure of the tray returning to the front after being inserted from the front is not necessary. It can also be implemented by a unidirectional conveying method from front to back, or by performing packaging treatment first and then metering treatment. Moreover, it can also be configured as a device combination dedicated solely to packaging treatment, excluding metering treatment and labeling treatment. Another embodiment will be described later.

[0037] The equipment frame shown in Figure 1, especially the upper part, not only houses the packaging mechanism 2 or other mechanisms internally, but also plays a crucial role in isolating the interior from the exterior. Furthermore, a buffer tank BT (refer to Figure 6) is provided in the lower part of the equipment frame for gas replacement. Specifically, to prevent accidents caused by operators accidentally inserting their hands during the sealing process after the metering mechanism 1 has measured and transported the tray T, a baffle 11 (refer to Figure 5) is provided in the area slightly encompassing the metering mechanism 1 between the metering mechanism 1 and the packaging mechanism 2. The baffle 11 blocks the interior and exterior of the frame at the moment the tray T is transported to the packaging mechanism 2 via the feed rod IB (refer to Figures 5 and 6). In this embodiment of the invention, the conveying mechanism is not a belt conveyor, but rather the feed rod IB (refer to Figures 5 and 6), therefore its structure allows the baffle 11 to rise from bottom to top and close, avoiding the chain section (refer to Figure 5). However, the baffle structure can also close from top to bottom, or it can be omitted, with a stop device detected by a sensor to ensure safety.

[0038] To improve ease of transport, the first discharge platform 4 and the second discharge platform 5 are designed to be detachable. Furthermore, after these discharge pipes are disassembled, the labeling mechanism 7 is configured to slide to the left side of FIG. 3 to limit its movement within the range of the equipment frame, so as not to obstruct transport. Conversely, in the "pricing mode" where only price tags are issued without packaging, the operator manually applies the price tags to the goods; therefore, the labeling mechanism 7 slides to the right side of FIG. 3. As a means to achieve this, the packaging apparatus 100 according to the embodiments of the present invention includes a labeling mechanism sliding guide 71 and anti-tipping legs 72. The anti-tipping legs 72 support the entire apparatus so that the packaging apparatus 100 will not tip over due to loss of balance when the labeling mechanism 7 is moved to the far right.

[0039] The measuring mechanism 1 is configured to measure the weight of the packaged item and pallet T, and send the measured weight information to the control mechanism of the control console 6. Furthermore, as shown in FIG5, it is configured such that, relative to the two chains running around the entire circumference of the measuring mechanism 1 from the front to the rear of the packaging mechanism 2, four circumferential feed rods IB are mounted at four locations. These feed rods are positioned towards the equipment frame containing the packaging mechanism 2, allowing the pallet T to be loaded and moved to the rear section 3 in this state. More specifically, as shown in FIG5, in the two chains, a total of eight feed rod support members IB1 for mounting the feed rods IB are provided at four circumferential locations on the two chains, and four antibacterial treated metal rod-shaped feed rods IB are connected to them (see also FIG6). The spacing of the circumferentially arranged feed rods IB is set such that when the feed rods IB perform a temporary retraction action (described later), the feed rods IB will not interfere with the next packaged item placed on the measuring mechanism 1. The height of the feed bar IB relative to the mounting surface of the pallet T is designed to be at the center of the height of the bottom surface and the height of the top surface of the pallet T, but the height can be adjusted appropriately as long as the pallet T can be transported stably.

[0040] As described above, three types of pallets T are provided: "large," "medium," and "small." Upper molds 24 and lower molds 25 are prepared for packaging processes corresponding to each size, and these are interchangeable. Specifically, in this embodiment, upper molds 24A (150mm wide and 150mm deep), 24B (150mm wide and 120mm deep), and 24C (120mm wide and 120mm deep) are provided for large pallets. However, regardless of the pallet size, the molds are all the same size. To properly center the three types of pallets T relative to the feed rod IB, recesses of slightly different depths corresponding to the pallet sizes of "large," "medium," and "small" are provided on the mounting platform of the metering mechanism 1. That is, a deep recess of medium size is provided inside the large-sized recess, and a deeper recess of small size is provided inside the medium-sized recess. The step difference caused by the recess is limited to a slight deviation so as not to obstruct the movement of the tray T by the feed rod IB. In addition, as a centering mechanism, guides 12 with a shape that narrows towards the center are provided on both the left and right sides (refer to Figure 2). Moreover, the centering mechanism can be visually identifiable rather than a recess or guides. Even if a slight lateral shift occurs, the tray T is naturally guided to the appropriate position when lifted by the lower die 25 because the sides of the tray T are inclined.

[0041] In addition, a sliding component, commonly used in cutting machines, can be installed at the lower end of the opening defined by a baffle that is located between the measuring mechanism 1 and the packaging mechanism 2 and slightly includes the area of ​​the measuring mechanism 1. This component is used to correct the width of the opening if it is not centered at the start of the conveying process.

[0042] As shown in Figure 5, the tray T, which has undergone heat sealing and packaging, is transferred from the packaging mechanism 2 to the rear section 3. As shown in Figure 6, the rear section 3 is composed of a conveyor belt, which functions as an ejection mechanism to move the tray T out of the equipment frame, but a labeling mechanism 7 for printing and affixing product labels is provided above it. Therefore, the rear section 3 can also be regarded as the labeling mechanism 7. Thus, the tray T is moved through the rear section 3 in the outgoing direction orthogonal to the input direction and ejected toward the first ejection table 4. The first ejection table 4 shown in Figures 1 and 3 is equipped with drive rollers that move the tray T in the opposite direction to the input direction to the second ejection table 5. The second ejection table 5 is inclined, and the tray T moves by its own weight; therefore, the rollers of the second ejection table 5 are simple rollers without driving force.

[0043] Regarding the upper mold 24 and the lower mold 25, the packaging apparatus 100 according to the embodiments of the present invention includes an upper mold receiving mechanism 24H and a lower mold receiving mechanism 25H as receiving mechanisms capable of accommodating all types of unfilled molds. Therefore, it is not necessary to store unused molds after replacement in a location separate from the main body of the packaging apparatus, thus saving space. The upper mold receiving mechanism 24H and the lower mold receiving mechanism 25H are disposed in the vicinity of the area where the film holding mechanism 211 and the remaining film winding mechanism 212 are provided. More specifically, in the packaging apparatus 100 according to the embodiments of the present invention, the upper mold receiving mechanism 24H and the lower mold receiving mechanism 25H are disposed above the metering mechanism 1 and the packaging mechanism 2 in a manner corresponding to the arrangement of the metering mechanism 1 and the packaging mechanism 2. Furthermore, the lower mold receiving mechanism 25H is disposed above the metering mechanism 1 and is disposed near the control console 6 having a display section and downstream of the control console 6. Of course, this is just one example. The upper mold receiving mechanism 24H and the lower mold receiving mechanism 25H can be configured with opposite positions, or they can be configured with receiving positions for upper and lower molds of different sizes. Details regarding the upper mold receiving mechanism 24H and the lower mold receiving mechanism 25H will be described later.

[0044] Regarding the equipment frame with packaging mechanism 2, in general, in Figure 4, in a manner corresponding to the front and rear arrangement of metering mechanism 1 and packaging mechanism 2 shown in the dashed area, a film holding mechanism 211 for holding the film for packaging the container and a remaining film winding mechanism 212 for winding the remaining film when sealing the container are arranged above the equipment frame, together forming a film suspension frame mechanism 21.

[0045] As shown in Figures 1 and 4, the film suspension mechanism 21 is configured to be confined to the upper part of the equipment frame where the metering mechanism 1 and the packaging mechanism 2 are located. The film is suspended along the same direction as the longitudinal arrangement of the metering mechanism 1, the packaging mechanism 2, and the rear section region 3 from the front side toward the inside of the device. That is, the suspension direction of the film is the same as the conveying direction of the tray T. In conventional packaging devices, the film suspension mechanism is usually configured to extend significantly outward from the outer region of the equipment frame where the packaging mechanism and the like are located, but this embodiment is very advantageous for saving space. In addition, the film suspension mechanism 21 is a structure that is confined to the upper region of the metering mechanism 1 and the packaging mechanism 2, but it can also be a structure in which the remaining film winding mechanism 212 extends to the rear section region 3, or it can be a structure in which the control console 6 is located in another position so that the film holding mechanism 211 extends further forward. Even such a structure can be said to be a space-saving technical concept that is significantly different from the conventional technology of film suspension mechanisms that extend significantly outward from the outer region of the equipment frame. Furthermore, even if the film holding mechanism 211 and the remaining film winding mechanism 212 are arranged with opposite front and rear orientations, it will not be detrimental to saving space. The film holding mechanism 211 can be arranged at the rear and the remaining film winding mechanism 212 at the front.

[0046] Furthermore, as shown in Figure 5, this embodiment employs the following configuration: after the film released from the film holding mechanism 211 is subjected to a constant tension using a tension adjusting roller DR to stabilize the tension, it is wound using two film feed shafts in a manner passing near the lower part of the mounting mechanism, and then wound up using the remaining film winding mechanism 212. The tension adjusting roller DR functions as an adjustment mechanism for adjusting the tension of the film, and is positioned above the metering mechanism 1 and below the film holding mechanism 211.

[0047] In Figure 1, the side panel SP is configured such that its right long side is supported by a shaft and can rotate rearward. This structure allows for the replacement of the film roller from the right side, and, as described later, the replacement of the upper mold 24 and lower mold 25 can also be performed from the right side. Thus, the upper mold 24, film holding mechanism 211, and remaining film winding mechanism 212 can be loaded and unloaded from the same orientation along the winding axis during replacement. The lower mold 25 is replaced by inserting it from the right side and then lowering it slightly downward (see also Figure 12). The labeling mechanism 7 is configured to tilt (rotate) rearward, facilitating the replacement of the film roller or the upper mold 24 and lower mold 25. Furthermore, the rotatable structure also facilitates label replacement itself. Additionally, the rotatable side panel SP can be positioned on the left side instead of the right. That is, the rotatable side panel SP can also be positioned on the same side as the side where the first discharge table 4 is located. However, it is advantageous to make the side panel SP, which is on the same side as the side where the first discharge platform 4 is located, a rotatable structure.

[0048] The top panel UP, front panel FP, and side panels SP of the equipment frame are made of transparent material, or are embedded with transparent plates, so that the state of the film suspended on the film suspension mounting mechanism 21 can be observed. Furthermore, not only for visual inspection but also to respond in case of malfunctions, the top panel UP is configured to slide rearward to a position where it does not contact the labeling mechanism 7, and the front panel FP is also configured to be rotatable with its upper side supported by a shaft. Alternatively, it can be a rotating structure based on a lower side supported by a shaft, or a sliding structure.

[0049] As shown in Figures 5 and 6, an upper mold support 240 for loading the upper mold 24 is provided between the film suspension mounting mechanism 21 and the conveying space of the tray T (based on the feed rod IB). A locking mechanism is provided on the upper mold support 240, which prevents the upper mold 24 from being removed after loading. Removal requires operation of the locking release lever 24L (refer to Figure 11). The locking release lever 24L is configured to prevent the locking release operation from being performed under inappropriate conditions, in conjunction with the various mold processing procedures described later. Furthermore, it can be configured as an automatic locking mechanism, in which case the locking action can be linked to the temperature of the upper mold 24 during the various mold processing procedures described later.

[0050] A heating mechanism 241 for supplying heat for film welding is provided within the upper mold support 240 (refer to FIG. 7(a)). A metal plate 242 (as a sealing portion 242) for transferring heat supplied from the heating mechanism 241 (refer to FIG. 7(b)) and a film cutting mechanism 244 for cutting the film are provided within the upper mold 24 (refer to FIG. 7(b), FIG. 8, FIG. 9, and FIG. 10). The heating mechanism 241 contacts the metal plate 242 of the upper mold 24, which is filled into the upper mold support 240. The metal plate 242 has a protrusion 242a of a size corresponding to the edge of the tray T and a central portion 242b surrounded by the protrusion 242a, allowing heat supplied from the heating mechanism 241 to be transferred to the protrusion 242a, thereby thermally welding the film in contact with the edge of the tray T.

[0051] In the embodiments of the present invention, aluminum with a high thermal conductivity is used as the material of the metal plate 242, but this does not preclude the use of silver, copper, gold, etc. with even higher thermal conductivity. Even if the thermal conductivity is lower than that of aluminum, it does not preclude its use as long as there is no problem in actual use.

[0052] In embodiments of the present invention, the metal plate 242 has a protrusion 242a corresponding to the edge of the tray T, having an uneven shape. However, the protrusion 242a and the central portion 242b are essentially a single-unit structure. Alternatively, it can be configured such that the metal plate is formed by bonding two plates together and a heat pipe is laid between the two plates, allowing heat from the heater to be conducted more quickly, widely, and uniformly. Furthermore, since the protrusion 242a of the metal plate 242, which functions as a sealing portion, fuses the film with the container, the remaining portion, namely the central portion 242b, does not need to be at a high temperature. Conversely, considering the possibility of heat dissipation from the central portion 242b, it is preferable to configure it as a component fixed as insulation material in the central portion 242b; this configuration is also possible.

[0053] A lower mold 25 is positioned below the upper mold support 240, across the conveying space of the tray T. The lower mold 25 lifts the tray T, and the film sequentially fed from the roll film R loaded on the film suspension mechanism 21 is clamped by the metal plate 242 of the upper mold 24 and the lower mold 25 for packaging (sealing). Thus, the film suspension mechanism 21, the upper mold 24, and the lower mold 25 constitute the packaging mechanism 2, which is positioned immediately downstream of the metering mechanism 1 in the conveying direction.

[0054] In this embodiment, the film roll R is supported by having the shaft of the film holding mechanism 211 pass through its central hole. If the delivered film is sealed by the metal plate 242 and cut into the size of the tray T by the film cutting mechanism 244, it becomes a residual state with only the cut peripheral portion remaining, i.e., a state where the inside is hollowed out. This residual state of the film is sequentially wound up by the remaining film winding mechanism 212.

[0055] A metal plate 242, which functions as a sealer, is provided opposite to the delivered film (refer to Figure 7(b) and Figure 8). As the tray T moves upward through the lower mold 25, the film is heat-sealed along the edge of the tray T while the edges of the tray T and the film are held by the metal plates 242 of the lower mold 25 and the upper mold 24 (refer to Figure 7(b) and Figure 8). Before heat sealing, an inactive gas for extending the shelf life of the packaged item is injected into the space formed between the film and the tray T to perform a gas replacement treatment, replacing air with the inactive gas; this will be described later.

[0056] (Based on the conveying action of the feed rod) As shown in Figure 5, the feed rod IB, which serves as the conveying mechanism for the pallet T, is configured as follows: It is mounted at four circumferential positions relative to two chains that circulate around the entire circumference of the front and rear sides from the metering mechanism 1 to the rear side of the packaging mechanism 2. Through the circulation of the chains, the pallet T is conveyed from the metering mechanism 1 to the packaging mechanism 2, and then from the packaging mechanism 2 to the rear section 3. Rollers 31 are arranged in the space between the packaging mechanism 2 and the rear section 3 to allow the pallet T to move smoothly from the packaging mechanism 2 to the rear section 3. Since most of the packaged items are food, the metal feed rod IB has undergone antibacterial and rust-proofing treatment. The feed rod IB is connected to the chains via eight feed rod support members IB1, located at four circumferential positions on the two chains.

[0057] Thus, the conveying operation of the feed rod IB, which is connected to the chain as a drive mechanism and undergoes cyclical motion, and the opening and closing operation of the baffle 11 will be described. In standby mode, the baffle 11 is closed. During metering based on the metering mechanism 1, the baffle 11 descends, connecting the inside and outside of the frame. The tray T placed on the metering mechanism 1 is pushed by the feed rod IB and moved to the packaging mechanism 2, after which the feed rod IB stops. In this state, when the lower mold 25 (described later) rises, it interferes with the feed rod IB, so the feed rod IB temporarily retracts to the area where the metering mechanism 1 is located. As mentioned above, the circumferential spacing of the feed rod IB is set to a spacing at which the temporary retraction of the feed rod IB will not interfere with the next packaged item placed on the metering mechanism 1. At the point when the feed rod IB temporarily retracts, the baffle 11 rises from below the front part of the equipment frame, blocking the outside from the inside and ensuring safety. This blocking state based on the baffle 11 continues until the metering of the next item.

[0058] Due to the discontinuous arrangement of the feed rod IB in the circumferential direction, a baffle structure can be achieved that allows the closing action to be performed from below, bypassing the continuously arranged chain section in the circumferential direction. After the pallet T is sealed by the packaging mechanism 2, the feed rod IB advances again, moving the pallet T to the rear section 3. At this time, thanks to the roller 31, the pallet T is smoothly moved without falling between the packaging mechanism 2 and the rear section 3. The height of the feed rod IB relative to the mounting surface of the pallet T is designed to be at the center of the height of the bottom surface and the height of the top surface of the pallet T, but the height can be appropriately changed as long as the pallet T can be transported stably. Based on this structure, this embodiment can transport the packaged items from the metering mechanism through the packaging mechanism to the rear section area through a single conveying mechanism, which greatly helps to save space and costs.

[0059] (Based on the gas replacement and packaging actions of the upper and lower molds) Figure 7 is a main sectional view illustrating the upper mold and its support. Figure 7(a) shows the upper mold support when the upper mold is not filled, Figure 7(b) shows the upper mold unit, and Figure 7(c) shows the state with the upper mold filled in the support. Figure 8 is a diagram illustrating the upper mold. Figure 8(a) is a top view, Figure 8(b) is an upper perspective view, and Figure 8(c) is a lower perspective view. Figure 13 is a diagram illustrating the lower mold. Figure 13(a) is a top view, and Figure 13(b) is a side sectional view. Figure 20 is an enlarged view of part A of Figure 13(b), showing the lower mold rotated 90 degrees to a horizontal configuration. Figure 21 is a side sectional view showing the change in state of the lower mold relative to the upper mold when it is lifted.

[0060] By comparing the main sectional views, namely Figure 7(a) and Figure 7(c), it can be seen that the upper mold 24 is loaded into the upper mold support 240 from the right side. That is, as described above, similar to the film holding mechanism 211 and the remaining film winding mechanism 212, the upper mold 24 can be loaded and unloaded from the same orientation, namely the right side of Figure 1, along the winding axis. Furthermore, as shown in Figure 7(b), the upper mold has a metal plate 242 that performs the sealing function by transferring heat supplied from the heating mechanism 241 and a film cutting mechanism 244 for cutting the film. As shown in Figure 8, the metal plate 242 is a chamfered rectangular shape to correspond to the edge portion of the tray T, and the film cutting mechanism 244 is arranged on its outer periphery. Furthermore, the metal plate 242 is composed of a protrusion 242a of a size corresponding to the edge portion of the tray T and a central portion 242b surrounded by the protrusion 242a. The film cutting mechanism 244 can cut the fused film to the size of the tray T. In addition, the heat from the heating mechanism 241 is only transferred to the metal plate 242, but it does not exclude the possibility of heat being transferred to other metal parts.

[0061] As shown in Figure 7(a), when the upper mold 24 is not loaded, the heating mechanism 241 for supplying heat for film welding is positioned above by a force-applying mechanism (not shown) (see also Figures 12(b) and 12(d)). Here, if the upper mold 24 shown in Figure 7(b) is inserted from the right direction shown in the figure, the abutting portion of the front end of the upper mold 24 abuts against the roller 2431 at the front end of the heater connecting rod 243, as shown in Figure 7(c), and the heater connecting rod 243 presses the heating mechanism 241 downward (see also Figures 11(b) and 11(d)). In this way, the heating mechanism 241 can come into contact with the metal plate 242 of the upper mold 24 and transfer the heat for welding to the metal plate 242.

[0062] In an embodiment of the present invention, the heating mechanism 241 is formed by drilling a hole in an aluminum material and inserting a cartridge heater therein (see also FIG. 12(d)). However, silicone rubber heaters, plate heaters, insert heaters, sheathed heaters, etc., can also be used. Moreover, in addition to heaters that conduct heat, the type of heater can be convection type or radiation type, and is not limited to heat conduction type.

[0063] Furthermore, the heating mechanism can be configured to directly contact the metal plate 242 of the upper mold 24, or it can be configured to indirectly contact the metal plate 242 by attaching a heat transfer component with good thermal conductivity, such as a heat transfer component made of gold, silver, copper, or aluminum, to the metal plate 242. For example, if the extension of the heating mechanism is small relative to the size of the rectangular portion that extends the metal plate 242, the area receiving heat transfer will be limited to the vicinity of the center, resulting in poor efficiency. Therefore, by inserting a heat transfer component HTM with good thermal conductivity, whose size is not less than that of the extension of the metal plate 242, between the heating mechanism and the metal plate 242, the heat transfer area can be effectively increased (see also Figure 11(f)).

[0064] For example, when selecting and installing a mold from multiple sizes to handle packaging processes corresponding to three different sizes—"large," "medium," and "small"—it is common to consider installing heating mechanisms in each mold. However, in this case, the heat source connector needs to be plugged and unplugged every time the mold is changed, which is cumbersome. But in the packaging apparatus 100 according to the embodiments of the present invention, there is no need to reconnect the heater wires, and no additional work to ensure electrical connection is required during the change of the upper mold, thus offering the advantages of simple and efficient changeover.

[0065] As shown in Figure 8, the upper mold 24 has a chamfered rectangular metal plate 242 of the same size and shape as the edge of the tray T. The metal plate 242 is composed of a protrusion 242a of the same size as the edge of the tray T and a central portion 242b surrounded by the protrusion 242a. In this embodiment, an upper mold 24A for a large tray with a width of 150 mm and a depth of 150 mm, an upper mold 24B for a medium-sized tray with a width of 150 mm and a depth of 120 mm, and an upper mold 24C for a small tray with a width of 120 mm and a depth of 120 mm are prepared (the upper mold 24B corresponding to the "medium" sized tray is shown in Figure 8).

[0066] The metal plate 242 transfers heat supplied by the heating mechanism 241, which is disposed in the upper mold support 240 (refer to FIG. 7), to the film and seals it. A cutting blade, serving as a film cutting mechanism 244 for cutting the film after sealing, is provided on the outer periphery of the chamfered rectangular metal plate 242. As shown in FIGS. 8 and 9, the film cutting mechanism 244 is fixed to the upper mold 24 body (refer particularly to FIG. 10). Furthermore, the metal plate 242 and the surrounding base plate 247 are connected to the upper mold 24 body via a force-applying mechanism, with the former's force set to be stronger than the latter's. Therefore, when the edge of the tray T abuts against the tray edge support 254 of the lower mold 25 (refer to FIGS. 13 and 20) and the lower mold 25 is lifted upwards, firstly, the lower mold 25 contacts the surrounding base plate 247 of the upper mold 24; then, the edge of the tray T contacts the metal plate 242a; and finally, the film lifted by the tray T contacts the film cutting mechanism 244. The upper mold 24 has three upper mold holes 245 for detecting the mold size. One of the holes is blocked according to the size. The unblocked hole becomes a light-transmitting part, and the blocked hole functions as a light-blocking part or a reflective part.

[0067] When the upper mold 24 is installed on the upper mold support 240, it can be easily loaded by temporarily placing the notches 248 provided at the lower left and right ends of the upper mold 24 on the guide rails 2401 on the left and right inner surfaces of the upper mold support 240 and then sliding them (see also Figures 12(d) and 12(f)). Furthermore, when removing the upper mold 24 from the upper mold support 240, after pressing down on the locking release lever 24L shown in Figure 11 to release the lock, it can be easily pulled out by holding the pull-out handle 24G and sliding it.

[0068] Furthermore, as shown in Figure 9(b), if the side of the upper mold 24 is held while it has been removed from the upper mold support 240, the film cutting mechanism 244 may fly off the bottom surface of the upper mold 24, which is very dangerous. Therefore, as shown in Figure 8, a handling grip 246 is provided on the upper mold 24. The handling grip 246 is fixed to the surrounding bottom edge 247 and is lifted together with the surrounding bottom edge 247 in accordance with the upward lifting of the lower mold 25. Figure 9 is a diagram in Figure 8 that omits the handling grip 246 for illustrative purposes. Because of the presence of the handling grip 246, when pressing is performed for heat sealing, i.e., when the lower mold 25 is lifted, the film cutting mechanism 244 will fly off downwards. However, when the upper mold 24 is removed and held by hand, the film cutting mechanism 244 can be prevented from flying off. Furthermore, when the holding part 246 holds the upper mold 24 while it is not fully cooled during transport, it helps to prevent burns.

[0069] Figures 11 and 12 illustrate the states of the upper mold support with and without the upper mold. Figure 11 shows the state with the upper mold in the upper mold support; Figure 11(a) is a top view, Figure 11(b) is a front view, Figure 11(c) is a bottom view, Figure 11(d) is a top perspective view, Figure 11(e) is a right side view, and Figure 11(f) is a conceptual diagram of the heat transfer component. Figure 12 shows the state without the upper mold in the upper mold support; Figure 12(a) is a top view, Figure 12(b) is a front view, Figure 12(c) is a bottom view, Figure 12(d) is a top perspective view, Figure 12(e) is a right side view, and Figure 12(f) is a partial enlarged view of Figure 12(d). In addition, unlike Figures 8 to 10, Figure 11 shows the state in which the upper mold 24A corresponding to the "large" size tray is filled.

[0070] By comparing Figures 11(b) and 12(b), or Figures 11(d) and 12(d), it can be seen that when the upper mold 24 is filled, as shown in Figures 11(b) and 11(d), the heater connecting rod 243 presses down on the heating mechanism 241. In contrast, when the upper mold 24 is not filled, as shown in Figures 12(b) and 12(d), the heating mechanism 241 is located above by a force-applying mechanism not shown, so the heater connecting rod 243 also springs up.

[0071] Figure 11(c) shows the metal plate 242 consisting of a protrusion 242a of a size corresponding to the edge of the tray T and a central portion 242b surrounded by the protrusion 242a. Furthermore, Figure 12(d) shows the heating mechanism 241 positioned above by a force-applying mechanism (not shown), from which the hole for inserting the cylindrical heater can be seen.

[0072] By comparing Figure 11(c) and Figure 12(c), it can be seen that the extension of the heating mechanism 241 is smaller than the size of the rectangular portion that extends the metal plate 242. Therefore, as shown in Figure 11(f), by inserting a heat transfer component HTM with good thermal conductivity, whose size is no less than that of the extension of the metal plate 242, between the heating mechanism 241 and the metal plate 242, the heat transfer area can be effectively increased.

[0073] As shown in Figures 13(a) and 13(b), the lower mold 25 includes a gas inlet 251 for gas replacement processing (gas flushing), a gas diffusion step 2510 communicating with the gas inlet 251, and an air outlet 252. The area including the gas inlet 251 and the gas diffusion step 2510 is covered by a protective cover, therefore, in Figure 13(a), the gas inlet 251 and the gas diffusion step 2510 are depicted with dashed lines. Since the gas diffusion step 2510 is triangular in shape when viewed from above, it imparts a diffusivity to the gas, as indicated by the hollow arrow in the figure, making it easy for the gas to diffuse laterally along the tray. In Figure 20, F, represented by the dashed line, represents the film and also the film support surface. However, since there is a protective cover covering the gas diffusion step 2510 and the like at the left end of the dashed line, only this part is depicted with a solid line. Furthermore, as shown by the hollow arrow in Figure 20, the gas diffuses through the gas diffusion step 2510 into the tray T and is then conveyed rearward. Finally, it changes direction downward and exits from multiple air outlets 252. Additionally, the gas inlet 251 is located at the front (corresponding to the long side of the tray), while the air outlet 252 is located at the rear (corresponding to the opposite long side of the tray), but it can also be configured to be located on the side corresponding to the short side of the tray (either both sides or one side). The air outlet 252 communicates downwards, but it can also be configured to communicate rearwards.

[0074] As shown in Figure 13(a), three lower mold holes 253 are provided in the lower mold 25 for detecting the size of the mold. One of the holes is blocked according to the size. The unblocked hole becomes a light-transmitting part, and the blocked hole functions as a light-blocking part or a reflective part. The tray T rises by having its edge supported by a tray edge support 254 provided on the inside of the lower mold 25. In addition, the lower mold 25 extends vertically through the center, at which the container bottom support 26 is fixedly provided to the frame (refer to Figure 21).

[0075] Using Figure 14, the method of installing and removing the lower mold will be explained. Figure 14 is a perspective view showing the state of installing and removing the lower mold in the lower mold support. As shown in Figure 14, with the lower mold 25 installed in the lower mold support 250, the tray inside the tray edge support 254 of the lower mold 25 is held in place by the hole into which the tray falls. That is, the surrounding part, namely the upper surface, lower surface and inner surface, is used as the holding part. By grasping the holding part, the lower mold 25 can be easily installed in or removed from the lower mold support 250.

[0076] Through the coordinated action of the upper mold 24, the upper mold support 240, and the lower mold 25, the tray T is lifted to perform gas displacement treatment to extend the shelf life of the packaged goods, followed by packaging. This action will be explained. Figure 21 is a side sectional view showing the change in the state of the lower mold relative to the upper mold when it is lifted. Figure 21(a) shows the lower mold 25 rising slightly from its lowest position. Figure 21(b) shows the lower mold 25 rising significantly and contacting the film F to form a closed space. Figure 21(c) shows the lower mold 25 continuing to rise and contacting the metal plate 242, then rising further and cutting (hollowing out) the film F through the film cutting mechanism 244. In addition, regarding Figure 21(b) and Figure 21(c), enlarged views of parts B and C are shown below.

[0077] The tray T, conveyed from the metering mechanism 1 via the feed rod IB, is initially supported at its bottom by the container bottom support 26. Then, as the lower mold 25 rises, as shown in FIG21(a), the support of the tray T's bottom surface based on the container bottom support 26 succeeds the support of the tray T's edge surface based on the tray edge support 254 of the lower mold 25. Afterwards, if the lower mold 25 rises to the position shown in FIG21(b), a closed space is formed by the lower mold 25 and the film F, through which inactive gas, displacing the air present in the space formed between the film F and the tray T, is injected via the gas injection port 251 and the gas diffusion step 2510; conversely, air is discharged from the air outlet 252. Thus, a gas replacement process (gas flushing) for extending the shelf life of the packaged goods is performed. Afterwards, the lower mold 25 continues to rise, and the edge of the tray T contacts the metal plate 242 of the upper mold 24 (this state is not shown; the lower mold 25 reaches a height position between FIG21(b) and FIG21(c)). In this state, while sealing or after sealing, the lower mold 25 continues to rise, and the excess length around the sealed film is cut off by the film cutting mechanism 244. As can be seen from Figure 21(c), the tip of the film cutting mechanism 244 is positioned below the upper mold 24's metal plate 242 and the lower mold 25's tray edge support 254 to clamp the film F and the edge of the tray T. The mechanism by which the edge of the tray T first contacts the metal plate 242 and then the film cutting mechanism 244 works as follows: the downward force applied by the metal plate 242 is set to be weaker than the force applied by the film cutting mechanism 244, and the metal plate 242 is configured to retract upward relative to the film cutting mechanism 244. Although not shown, when the lower mold 25 descends, the support of the tray edge support 254 on the edge of the tray T based on the lower mold 25 inherits the support of the container bottom support 26 on the bottom of the tray T, and is then conveyed to the rear section 3 via the feed rod IB.

[0078] (Regarding the adaptation detection of upper and lower molds) As explained above, in the embodiments of the present invention, three types of upper and lower molds are prepared to correspond to the three types of trays T with different sizes: "large," "medium," and "small." Furthermore, the upper mold 24 can be replaced by directly inserting it from the right side of the side panel SP, and the lower mold 25 can be replaced by inserting it from the right side of the side panel SP and then dropping it downwards. Here, the question arises as to whether the correct mold size is being installed. Therefore, in the embodiments of the present invention, research was conducted on methods to detect whether the correct upper mold 24 and the correct lower mold 25 are being installed. That is, as shown in FIG8, the upper mold 24 has three upper mold holes 245, and as shown in FIG13, the lower mold 25 has three lower mold holes 253. One hole is blocked according to its size. At the portions corresponding to both ends of the three holes, a light-emitting element is provided below the lower mold 25, and a light-receiving element is provided above the upper mold 24. In the portion corresponding to the center, a light-projecting element is positioned above the upper mold 24, and a light-receiving element is positioned below the lower mold 25. Originally, two lights should be received, but due to the misalignment of the upper mold 24 and lower mold 25, one light is blocked, resulting in a mismatch between the upper and lower molds, which can be detected. Based on this premise, the configuration is as follows: according to the position of the hole, the size of the molds being aligned and filled can also be detected and determined, and notification can be sent as needed via a display mechanism, voice guidance, or a communication mechanism to other external devices.

[0079] In this embodiment, the light travel direction is reversed in the portions corresponding to the two ends and the portion corresponding to the center to suppress interference between adjacent lights. However, as long as there is no possibility of light interference, the directions of the three lights can be aligned. Furthermore, depending on the size, one of the three holes can be blocked, but two can also be blocked. However, blocking one hole and using two for detection increases the possibility of judging various different situations, and is therefore a preferred method. Moreover, instead of a combination of light-emitting and light-receiving elements, a reflective sensor can be used; in this case, the hole is not a light-blocking part but a reflective part. Furthermore, it can be configured to capture the features of the upper and lower molds using other optical mechanisms, such as a camera element, and make judgments through image analysis, even if the upper and lower molds are misaligned and in a mismatched state, each of the upper and lower molds can be judged separately. According to this embodiment based on this structure, a highly efficient packaging device can be provided that does not stop the production line due to mismatch between the upper and lower molds.

[0080] As a way problems occur, other errors besides mismatch between the upper and lower molds can sometimes occur. During busy periods, other operations may be interrupted besides packaging, forcing operators to perform other tasks or allowing inexperienced operators to perform the work, which may lead to the mistake of forgetting to fill the mold itself. Furthermore, sometimes even when filling is forgotten, operators may mistakenly believe the replacement is complete and attempt to restart the work. However, in the embodiment of this invention, when neither the upper nor lower mold is filled, the light is not completely blocked by the three holes, so the light emitted from the three light-emitting elements is detected by all three light-receiving elements. By indicating that the three sensors are activated as a sign of forgotten filling, and by notifying this status, further operational errors caused by forgetting to fill the upper and lower molds can be prevented.

[0081] As mentioned above, mismatches between the upper and lower molds and failure to install the upper and lower molds can be detected through the three holes. Sometimes, another type of error may also occur. In the case of an insertion operation occurring midway through a changeover, the possibility that the upper mold has been replaced but the lower mold has not been replaced and installed, or vice versa, will also be considered. Another example of upper and lower mold fit detection that also assumes such an error will be explained.

[0082] Figure 15 shows an example where the upper mold hole 245 and the lower mold hole 253 are provided at five different locations. The requirement for three upper and lower mold holes for consistency determination, and the mechanism for determining consistency by activating two sensors, are the same as in the previously described example. In another example, the upper mold has a hole for determining if the lower mold is not filled, and the lower mold has a hole for determining if the upper mold is not filled. Thus, the control mechanism configured as a packaging device can determine whether the lower mold is not filled or the upper mold is not filled. Of course, it can also determine that neither the upper nor lower mold is filled.

[0083] The mechanism of the determination will be explained. Here, the numbers 2 to 4 marked with circles (hereinafter referred to as 〇2 to 〇4, etc.) are the upper die hole or the lower die hole for consistency determination. Furthermore, 〇1 is the lower die unfilled determination hole, and 〇5 is the upper die unfilled determination hole. In addition, the hole of the lower die opposite to the lower die unfilled determination hole of the upper die 24 is blocked, but it can also be configured to be unperforated to begin with. The same applies to the hole of the upper die opposite to the upper die unfilled determination hole of the lower die 25.

[0084] As shown in Figure 15(a), if the sensor outputs corresponding to positions O2 and O3 are activated, it is determined that a large-sized mold is being filled. Furthermore, as shown in Figure 15(b), if the sensor outputs corresponding to positions O2 and O4 are activated, it is determined that a medium-sized mold is being filled. And, as shown in Figure 15(c), if the sensor outputs corresponding to positions O3 and O4 are activated, it is determined that a small-sized mold is being filled. Although the illustrations are omitted, when only one sensor output is activated, it indicates that the dimensions of the upper and lower molds are mismatched. Conversely, when three sensor outputs are activated, it indicates that neither the upper nor lower mold is being filled. Furthermore, the determination method in the other example described so far, even in the previously described example with only three holes, operates on the same mechanism.

[0085] If either the upper or lower mold is left unfilled, the situation cannot be detected by just three sensors. However, with five sensors, it can be detected appropriately. That is, as can be understood from Figure 15(d), when sensor O1 is turned on, the upper mold has been filled but the lower mold has not. On the other hand, as can be understood from Figure 15(e), when sensor O5 is turned on, the lower mold has been filled but the upper mold has not. When neither the upper nor lower mold is filled, as mentioned above, the outputs of sensors O2 to O4 are turned on, and in addition, the outputs of sensors O1 and O5 are also turned on, meaning all five sensor outputs are turned on.

[0086] Furthermore, both the example with three holes and the example with five holes are configured as follows: the size information of the container associated with the product information is stored in an appropriate storage mechanism, which can detect that the size of the upper and lower molds differs from the size of the container associated with the called product information, and notify the user as needed through a notification mechanism. In the opposite conception, as a control to prevent the call of products that do not correspond to the set mold, the inability to call a product can be used to alert the user that the mold is incompatible.

[0087] The mechanism for determining mold fit can be either an optical determination mechanism or a mechanism utilizing other physical quantities, or it can combine a mechanism utilizing holes with other detection mechanisms. For example, as long as a sensor (contact switch or electromagnetic sensor, etc., the method is not limited) is provided to detect the mold filling status, the sensor shown in Figure 15 (05) can be omitted. Alternatively, a more intelligent mechanism utilizing a camera element can be used, or conversely, a more primitive mechanism can be used. For example, the determination can be made by measuring the weight of the mold or by marking or numbering the mold to visually confirm the mold number; the confirmation mark can also be made of a highly adhesive sticker. Furthermore, even when using a camera element, the determination can be made by reading the barcode displayed on the mold rather than the physical characteristics of the mold itself.

[0088] However, in optical mechanisms or mechanisms utilizing other physical quantities, if a sensor is configured to identify which mold, upper or lower, is being loaded, it becomes possible to determine which size mold is loaded in the upper and lower mold supports, thus facilitating guidance on the display screen described later. Specific examples of sensors include physical sensors, transmission sensors, camera mechanisms, etc., that correspond to the size of each mold.

[0089] (Regarding the timing of determining the filling state of the upper and lower molds) In this embodiment, while considering the device characteristics of the packaging apparatus, the effectiveness of determining the timing of the filling state of the upper and lower molds was studied. When changing the upper and lower molds, the emergency stop button is temporarily pressed to stop the packaging machine. The "emergency stop" button 8 is a mechanical button located on the equipment frame (refer to Figures 1 and 6), but it may not be a mechanical button. When changing the mold or film later, the configuration is such that when the emergency stop button is released after changing the mold, the type of mold is determined, and an error notification is given if the upper and lower molds are different. Furthermore, the configuration is such that when the power is turned on, the type of the currently set mold is determined and displayed, so that the set mold can always be confirmed. Moreover, the configuration is such that when changing the mold, a cleaning is notified, and if a cleaning command is given, a purging process is performed to keep the gas injection port of the mold clean. Alternatively, the configuration may be such that a gas detection sensor is installed to check whether the gas injection is normal, or through trial operation, the air along the entire path to the injection port is completely gasified.

[0090] An example of the display screen layout is also shown, and the timing of determining the mold filling status (including the determination of whether the upper and lower molds are not filled or whether the upper and lower molds are consistent or inconsistent) is explained in detail. First, the explanation begins with the mold display (notification) when the power is turned on. When the device is not running, first, turning on the power will display an initial screen such as date and time confirmation, and then display the main menu shown in Figure 17(a), where you can select "Packaging and Pricing Mode" (from packaging to pricing), "Packaging Mode" (packaging only), or "Pricing Mode" (issuing price tags only without packaging). Here, an example of the screen immediately after selecting "Pricing Mode" is shown. If the button for packaging operation and pricing mode is pressed, the device will switch to a reset mode (not shown) and perform a reset operation. During the reset operation, the determination of whether the upper and lower molds are not filled or whether the upper and lower molds are consistent or inconsistent will be performed, and the determination result will be displayed and notified. In addition, the determination time may not be during the reset operation, but may be changed to any time such as during the initial operation or the display of the main menu. In particular, if the packaging device has a storage mechanism for storing the size information of the container associated with the product information, it is convenient to notify the user when the size of the mold being filled differs from the size of the container associated with the retrieved product information. However, regarding the retrieval of product information, if the product is determined while the confirmation screen displays the next candidate or the candidate after that multiple times, a structure that makes a judgment or notification each time a candidate is displayed before the determination phase would feel like too many warnings. Therefore, it is preferable to configure the judgment or notification to occur at the time the product is placed on the measuring device. Alternatively, the judgment or notification could be configured to occur at the time the product is placed and its weight is detected. However, the method of notifying the user each time the product information is retrieved is not excluded. Figure 16 shows an example of the judgment result displayed on the measuring screen, and its details will be described later.

[0091] On the other hand, during normal packaging operations (hereinafter referred to as "normal time"), when changing molds, it is necessary to wait for the mold to cool down. Furthermore, if the decision is not made after issuing an operation instruction regarding the change, it becomes meaningless, thus limiting the timing of the decision. As mentioned above, during normal time, pressing the emergency stop button displays the screen shown in Figure 17(b), stopping the heating of the upper mold and initiating natural cooling. Alternatively, a structure with a cooling mechanism for forced cooling can be used. As shown in Figure 17(b), the guide screen displays that the current mold is large-size, along with the current mold temperature, the appropriate replacement temperature, and the target time until the appropriate replacement temperature is reached. Regarding the current mold temperature display, if the temperature does not reach the appropriate temperature, it can be made more prominent by changing the display method. For example, while waiting for heating, a message such as "Temperature is 90°C. Please wait until the temperature drops to 35°C" could be displayed in red, and if the appropriate temperature is reached, a message such as "Cooling complete" could be displayed in green.

[0092] If cooling is completed at the appropriate temperature, the screen shown in Figure 18(a) is displayed. The guide screen shows that the current mold is large size and displays a message to press the "Mold Change" button to initiate the change. If the "Mold Change" button is pressed, the packaging apparatus 100 according to this embodiment of the invention performs the following control: rotating the film support axially in the direction of axial loosening or rotating the winding side in the direction of lateral loosening, thereby loosening the film and making mold change easier. This is because the film is very close to the upper mold 24, and may get stuck when the upper mold 24 is pulled out (see Figure 5). Then, the operator performs the mold change operation and presses the "Change Complete" button (not shown) after completing the operation. At this moment, the filling status of the upper and lower molds is determined.

[0093] If the dimensions of the upper and lower molds match, for example, as shown in Figure 18(b), the "Heating Start" button will be activated and pressable when the guide screen displays that both the upper and lower molds are of the same size. Furthermore, it can be configured to start heating simultaneously with the "Heating Start" display without requiring a press operation. Additionally, even if "Heating Start" is not displayed, heating will start if the upper and lower molds match; otherwise, heating will not start.

[0094] On the other hand, if the determination shows a problem with the mold's filling status, the error will be displayed prominently along with the error message. For example, as shown in Figure 19(a), the message "Mold Matching Error" will be prominently displayed, along with the message that the upper mold is large while the lower mold is medium, indicating a size mismatch. Furthermore, the "Heating Start" button will not be activated and will be unpressable. As another example, as shown in Figure 19(b), the message "Mold Matching Error" will be prominently displayed, along with the message that the upper mold is not filled. Again, the "Heating Start" button will not be activated and will be unpressable.

[0095] Furthermore, the display example here corresponds to a structure equipped with sensors that can identify which mold, upper or lower, is being filled. While detection methods based on 3 or 5 holes can determine inconsistencies between the upper and lower molds, they cannot identify which mold is being filled in each. Even so, seeing the "Mold Matching Error" display allows operators to confirm the actual filling status, making it highly meaningful.

[0096] Furthermore, the configuration is as follows: if the filling status of the upper and lower molds is determined to be incompatible or if the upper and lower molds are forgotten to be filled, replacement is performed until the appropriate state is achieved, or until the heating temperature reaches the appropriate temperature, and the process cannot be switched to metering mode.

[0097] (Example of displaying judgment results on the measurement screen) Figure 16 is a diagram showing an example of displaying judgment results on the measurement screen. For the product name "Gauda Cheese", "Large (1)" is displayed in the "Pattern Type Selection" item, and "Width 150 × Depth 150" is displayed in the "Pattern Size" item. If it is a skilled operator, they can identify that it is a size error. Incidentally, "Medium (2)" is "Width 150 × Depth 120", and "Small (3)" is "Width 120 × Depth 120". In addition, for inexperienced operators, the display mode can be changed to the normal mode and made more eye-catching so that it is easy to identify that it is a size error, or a message such as "It is a size error" can be displayed more directly. Moreover, the error can also be notified by voice.

[0098] In addition, it displays the current "Packaging Mode" as "Packaging Price Mode" or the "Heat Sealing Temperature" as "160℃". Regarding this temperature display, it can be made more prominent by changing the display method if the temperature is not yet at its optimal level. For example, it could be displayed in red while waiting for heating, and then changed to green once the optimal temperature is reached.

[0099] Furthermore, when "Pricing Mode" is selected as "Packaging Mode," since no packaging operation is performed, there is no determination or notification regarding the consistency between the mold size associated with the called product and the size of the filling mold. Of course, it can also be configured to perform the determination and notification for packaging operations that will occur later.

[0100] (Regarding gas replacement treatment) Gas replacement treatment for extending the shelf life of packaged goods is performed by replacing air with an inactive gas. The inactive gas is used to extend the shelf life of food by adjusting the ratio of nitrogen, carbon dioxide, and oxygen. While oxygen may seem unnecessary, it is actually essential for maintaining the red color of meat. As described above, the structure that injects gas between the film and the container while the upper and lower molds are closed allows for efficient gas delivery. That is, by simultaneously injecting gas from the gas injection port 251 and extracting air from the mold from the air outlet 252, the gas injection time can be shortened. Furthermore, since the gas injection port 251 is located on the metering mechanism 1 side, gas can be injected from the same position even with molds of different sizes. Moreover, with the gas injection port 251 and air outlet 252 located in the film conveying direction, the film will not shift left or right and can be accurately covered. Here, it is set that only one type of film is prepared to avoid changing the film for each tray size. The same applies to tray T; the width is the same across all trays, only the depth varies (but the height can be prepared in multiple ways), thus allowing for the use of film without waste.

[0101] Previously, gas-displacement packaging almost always referred to the type where gas was injected into the bag during bag manufacturing. This embodiment is significant for achieving efficient gas displacement during sealing by injecting gas while the film is being held in place.

[0102] Furthermore, it can also be configured to allow vacuum packaging by extracting air from the mold through the air outlet 252 without injecting gas through the gas injection port 251. Moreover, it can also be configured to not inject gas or extract air; in other words, general packaging can also be selected.

[0103] The gas replacement time is designed to automatically or manually adjust based on the dimensions of the three trays T: "large," "medium," and "small." Furthermore, the gas replacement time can also be designed to adjust based on the shelf life. This can be configured so that the shelf life is selected directly via the control panel 6, or a recommended shelf life can be pre-associated with product information, automatically adjusting the gas replacement time based on product selection. Moreover, it can be structured with multiple gas injection ports, such as three dedicated injection ports for nitrogen, carbon dioxide, and oxygen, and the optimal gas ratio can be adjusted through settings or automatic control.

[0104] (Regarding the mold receiving mechanism) As described above, the packaging apparatus 100 according to the embodiments of the present invention includes an upper mold receiving mechanism 24H and a lower mold receiving mechanism 25H as receiving mechanisms capable of accommodating all types of unfilled molds, eliminating the need to store unused molds after replacement in a location separate from the main body of the packaging apparatus. The structure in the embodiment is capable of accommodating two unused molds out of three types. However, if the apparatus is enlarged to allow for the storage of all three types of molds without filling when the packaging apparatus is not in use, the structure of the receiving mechanism can be expanded to accommodate all molds. This structure is more efficient when the likelihood of starting operation with molds of any size is high at the time of device use.

[0105] Figure 22 is a perspective view showing the upper and lower molds housed in the mold housing mechanism, and Figure 23 is a right-side view showing the upper and lower molds housed in the mold housing mechanism. Figures 22(a) and 23(a) show the upper and lower molds housed, and Figures 22(b) and 23(b) show the upper and lower molds not housed. Furthermore, Figure 23(c) is an enlarged view of the lower right corner of the upper mold housing mechanism 24H in Figure 23(a).

[0106] In Figures 22 and 23, the upper mold 24B for medium-sized pallets and the lower mold 25B for medium-sized pallets are filled in the support and are in use (not shown). The upper mold 24A for large pallets and the upper mold 24C for small pallets, which are not filled in the support, are accommodated in the upper mold accommodating mechanism 24H. The lower mold 25A for large pallets and the lower mold 25C for small pallets, which are not filled in the support, are accommodated in the lower mold accommodating mechanism 25H.

[0107] The upper mold receiving mechanism 24H and the lower mold receiving mechanism 25H are located near the film, and therefore are covered with protective components to prevent heat from affecting the film. That is, a protective cover is used to prevent unexpected heat from being transferred to the film. Regarding this protective component, heat-insulating or cooling materials can be appropriately used to reduce the thermal impact. Furthermore, more proactively, in addition to the protective component, a waste heat heater or a cooling fan can also be provided. In particular, with a waste heat heater, it is expected that the device can be used more quickly after mold changes.

[0108] The upper mold receiving mechanism 24H is configured to allow the upper and lower molds to separate and be received in a horizontal position via a sliding mechanism. As shown in Figure 23(c), the lower right and left ends of the upper mold 24 are L-shaped or L-shaped with the sides reversed. The upper mold receiving mechanism 24H is a guide rail shaped like an L-shaped or L-shaped inverted shape, and the lower part of the upper mold 24 can slide by fitting into this guide rail. Furthermore, the relationship of this guide rail shape is the same for both the upper mold 24 and the upper mold support 240, so the same sliding operation can be used for loading into the support and receiving into the mold receiving mechanism.

[0109] The lower mold receiving mechanism 25H is configured to allow the two lower molds to separate and be received in an upright position via a sliding mechanism. The relationship between the end of the mold and the guide rail shape of the receiving mechanism is approximately the same as that for the upper mold. Furthermore, to facilitate the removal of the two lower molds arranged side by side, each side of the frame of the receiving mechanism is shorter than the other side.

[0110] (Regarding other embodiments) While the embodiments described so far have included metering, packaging, and labeling processes, a dedicated packaging mode can also be configured to perform only packaging. This dedicated packaging mode is suitable for fixed-price goods that do not require metering. Since there is no need to move to a later area for labeling, in this dedicated packaging mode, after packaging, the feed rod IB rotates in the reverse direction to discharge the tray towards the front. Alternatively, a dedicated device for packaging alone can also be configured. Even in this case, it falls within the scope of the technical concept that gas replacement treatment for extending the shelf life of the packaged item and sealing-based packaging treatment are performed substantially simultaneously.

[0111] Furthermore, even if the device structure itself is not a packaging-specific mode, but rather a device structure specifically designed for packaging, this invention is also included. That is, it may not have a measuring mechanism or a control console or labeling mechanism for the measuring mechanism, but these structures may be configured as separate devices and communicated with each other to form a dedicated device for packaging processing only.

[0112] In the described embodiment, a metering mechanism is provided at the front of the packaging mechanism 2, but it can also be configured to have the metering function at the position of the container bottom support 26 (refer to FIG. 21) or the rear region 3 (refer to FIG. 5). When the metering function is provided in the rear region 3, metering and labeling are performed after packaging, and the metering object at this time includes the weight of the pallet, the weight of the film, and the weight of the gas, so the weight including these can be tare and then printed. In addition, when the metering function is given to the container bottom support 26 or the rear region 3, the area marked with the dotted line "1" in FIG. 4 is only a placement area for moving the packaged item into the device.

[0113] Alternatively, the packaging mechanism can be positioned at the very front. That is, the upper and lower molds can be configured in the area indicated by the dotted line "1" in Figure 4, and the pallet can be placed directly on the lower mold before metering or labeling. In this case, the metering function is located in the container bottom support 26 or the rear area 3 described above. Furthermore, when using this structure, it is preferable to install a baffle on the front side of the very front section, which is immediately closed once the pallet is placed to ensure safety.

[0114] The described implementation involves filling the inactive gas by blowing gas to flush out the air, but it can also be a (narrowly defined) gas displacement method where gas is injected after the air is extracted. Although the injection time is longer than gas flushing, it is advantageous in terms of gas diffusion and gas reaching every corner. In this case, the air outlet is initially configured as a suction port for extracting air.

[0115] Furthermore, in the described embodiment, the film is configured to be suspended along the same direction as the metering mechanism 1, the packaging mechanism 2, and the rear section 3, which are arranged longitudinally from the front side toward the inside of the device, and the width of the tray is set to be a single size. However, the film can also be configured to be suspended along a direction orthogonal to the metering mechanism 1 and the packaging mechanism 2, and the width of the tray can be changed according to the size of the tray.

[0116] <Summary of Embodiments> [Technical Field] The present invention relates to a packaging apparatus for covering a pallet containing a packaged item with a film and heat-sealing the film to the edge of the pallet.

[0117] [Background Art] As a conventional packaging device, there is a packaging device that places food as the packaged item on a weighing scale, then transports it to a tray supplied to a conveyor belt, and heat-seals a film cover on the tray, thereby sealing a large number of trays (for example, see Patent Document 1).

[0118] [Prior Art Documents][Patent Documents][Patent Document 1] Japanese Patent Publication No. 2013-515654 [Summary of the Invention][Technical Problems to be Solved by the Invention] The packaging device described in Patent Document 1 is a device for sealing containers of the same size, and is not a device for multiple containers, and there are various points that need to be improved.

[0119] [Means for solving technical problems] (1) As explained above, one aspect of this embodiment is a packaging device (100) that seals a container with a film. The packaging device (100) is characterized by having: a heating mechanism (241) for heating a mold; and an installation mechanism (240) capable of installing one of a plurality of molds, wherein the mold installed in the installation mechanism is relatively close to the heating mechanism.

[0120] Based on the above structure, a packaging device capable of packaging various containers can be provided.

[0121] (2) One embodiment of this invention is the packaging device (100) described in (1), wherein the mold (24) can be installed on the loading and unloading mechanism (240) by horizontal movement, and the position of the mold (24) and the position of the heating mechanism (241) change depending on the insertion position of the mold (24).

[0122] Based on the above structure, only the mold installation operation is required, without the need to separate the heating mechanism from the mold, thus making the operation simple.

[0123] (3) One embodiment of this invention is the packaging device (100) described in (1), wherein the heating mechanism (241) is subjected to an upward force, the heating mechanism (241) has a linkage mechanism (243) that abuts against the front end of the linkage mechanism (243) through the front end of the mold (24), and the heating mechanism (241) descends against the applied force and approaches the mold (24).

[0124] Based on the above structure, the structure of the separation heating mechanism and the mold can be simplified.

[0125] (4) One embodiment of this invention is the packaging device (100) described in (1), wherein the plurality of molds (24) are composed of a surrounding base plate (247), a film cutting mechanism (244) and a sealing part (242), and the heating mechanism (241) is close to the sealing part (242) of one of the molds (24).

[0126] Based on the above structure, heat can be transferred to the sealing part that needs to be heated without waste.

[0127] The packaging apparatus 100 according to embodiments of the present invention has been described in detail above with reference to the accompanying drawings. However, the specific structure is not limited to these embodiments, and design changes that do not depart from the spirit and scope of the present invention are also included in the present invention. For example, in the embodiments, a receiving mechanism is provided around the film consisting of a film holding mechanism and a remaining film winding mechanism. However, the technical idea of ​​the present invention is to ensure a storage position for unused molds. Therefore, depending on the size of the apparatus, the provision of a receiving mechanism in that space is not excluded as long as other suitable space can be ensured. Furthermore, in the embodiments, it is configured to accommodate molds on both the upper and lower sides. However, even a structure that only accommodates molds on at least one side (upper or lower) is still included within the scope of the present invention. Although the lower mold is smaller than the upper mold, even accommodating only the upper mold can sufficiently contribute to saving space.

[0128] Symbol Explanation: 100-Packaging device, 1-Metering mechanism, 11-Baffle, 2-Packaging mechanism, 21-Film suspension and mounting mechanism, 211-Film holding mechanism, 212-Remaining film winding mechanism, 24-Upper mold, 24H-Upper mold receiving mechanism, 240-Upper mold support, 241-Heating mechanism, 242-Metal plate (sealing part), 243-Heater connecting rod, 244-Film cutting mechanism, 245-Upper mold hole, 246-Holding part during handling, 247-Surrounding base plate, 25-Lower mold (gas replacement machine) ), 25H-lower mold receiving mechanism, 251-gas injection port, 2510-gas diffusion step section, 252-air outlet, 253-lower mold hole, 26-container bottom support section, 3-rear section area, 4-first discharge platform, 5-second discharge platform, 6-control console (display section), 7-labeling mechanism, 71-labeling mechanism sliding guide rail, 72-anti-tipping support leg, 8-"emergency stop" button, HTM-heat transfer component, BT-buffer tank, T-tray, R-film roll, DR-tension adjustment roller.

Claims

1. A packaging apparatus for sealing a container with a film, the packaging apparatus being characterized by comprising: a heating mechanism for heating a mold; and an installation mechanism for installing one of a plurality of molds, wherein the mold installed in the installation mechanism is relatively close to the heating mechanism.

2. The packaging apparatus according to claim 1, characterized in that, The mold can be mounted on the mounting mechanism by horizontal movement, and the position of the mold relative to the heating mechanism changes depending on the insertion position of the mold.

3. The packaging apparatus according to claim 1, characterized in that, The heating mechanism is subjected to an upward force, and the heating mechanism has a linkage mechanism that abuts against the front end of the linkage mechanism through the front end of the mold. The heating mechanism descends against the applied force and approaches the mold.

4. The packaging apparatus according to claim 1, characterized in that, The plurality of molds are composed of a surrounding base plate, a film cutting mechanism, and a sealing part, and the heating mechanism is located near the sealing part of one of the molds.

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