Battery device and cooling system, cooling plate, cooling assembly and cooling method thereof

Abstract

A cooling system for a battery device according to the present disclosure is provided with: a substrate part (2) of a case in which a battery pack is housed; and a cooling plate attached to the substrate part (2), the cooling plate further comprising a first refrigerant flow path and a second refrigerant flow path (A2) spaced apart from the first refrigerant flow path (A1), the back surface of the substrate part (2) constituting a surrounding wall of the first refrigerant flow path (A1) and the second refrigerant flow path (A2), the cooling plate comprising a first plate forming the remaining surrounding wall of the first refrigerant flow path (A1) and a second plate forming the remaining surrounding wall of the second refrigerant flow path (A2), the first plate and the second plate are attached to the rear surface of the substrate part (2) so as to face a region in which the battery pack is disposed.

Description

Battery device and its cooling system, cooling plate, cooling components, cooling method Technical Field

[0001] This disclosure relates to battery devices, cooling plates used therein, cooling systems and cooling components, and cooling methods thereof. Background Technology

[0002] Currently, there is a need to develop a technology for cooling battery devices. Energy storage devices, as an example of battery devices, are used as power sources in vehicles such as electric vehicles and hybrid vehicles, and are capable of outputting large currents. The housing of such energy storage devices is generally rectangular and box-shaped, with a flat substrate portion for directly accommodating and fixing stacked units, either directly or as unit modules. Here, the stacked unit is formed by stacking multiple energy storage packs along the stacking direction. Since the stacked unit generates heat within the housing, a cooler is installed on the housing to forcibly cool the stacked unit. As a typical cooler, such as that disclosed in Patent Document 1, one design involves installing a separate volumetric frame below the housing and circulating cooling water, as the cooling medium, within the frame.

[0003] However, integrating the separate cooler with the housing is not ideal in terms of cost and weight. Furthermore, if the housing and cooler are designed as separate units, heat transfer between them will be hindered (high thermal resistance).

[0004] In response, Patent Document 2 proposes using the back side of the substrate portion (bottom wall) of the housing as the refrigerant flow path enclosure of the cooler. Since the cooling water in the refrigerant flow path is in direct contact with the back side of the substrate portion of the housing, the thermal resistance between the cooling water and the heat source, i.e., the laminated unit, can be reduced.

[0005] As prior art document disclosing technology related to the invention of this application, Patent Document 3 can be cited. In Patent Document 3, multiple cooling devices, independent of the housing, are each separately arranged on the base plate portion of the housing. The cooling devices are arranged in series with respect to the flow direction of the cooling water.

[0006] [Existing technical documents]

[0007] (Patent Documents)

[0008] Patent document 1: Japanese Patent Application Publication No. 2023-12176.

[0009] Patent Document 2: Japanese Patent No. 7167103.

[0010] Patent document 3: Japanese Patent Application Publication No. 2020-510534. Summary of the Invention

[0011] (The problem the invention aims to solve)

[0012] To meet the demands for high output and long lifespan in electric vehicle power supplies in recent years, more stringent temperature management is required for battery packs, such as those using stacked cells. As described in Patent Document 2, by using the back side of the substrate portion of the casing as part of the wall surrounding the refrigerant flow path, cooling efficiency can be improved. In other words, the heat from the stacked cells within the casing can be efficiently transferred to the cooling water flowing through the refrigerant flow path.

[0013] Here, the laminated units are not arranged to completely cover the front side (the side opposite to the back side) of the substrate portion of the housing, thus gaps exist between the laminated units. Since the heat from the laminated units is also conducted to the substrate portion opposite to these gaps (the open substrate portion), if this open substrate portion forms a wall around the refrigerant flow path, the heat from that wall portion will also be transferred to the cooling water. As a result, the cooling capacity of the cooling water is hindered, affecting the cooling capacity of the portion of the substrate portion where the laminated units are located (the actual substrate portion to be cooled).

[0014] In view of the above problems, the purpose of this disclosure is to provide a technology that can help improve the cooling effect of refrigerant on battery devices.

[0015] (Technical means used to solve the problem)

[0016] This disclosure was made to address the aforementioned issues. The cooling system disclosed in the first aspect is a cooling system for a battery device, comprising: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack of the battery device; and a cooling plate mounted on the base plate portion. The cooling system further comprises a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path. The back side of the base plate portion forms the enclosure walls of the first and second refrigerant flow paths. The cooling plate comprises a first plate forming the remaining enclosure walls of the first refrigerant flow path and a second plate forming the remaining enclosure walls of the second refrigerant flow path. The first and second plates are mounted on the back side of the base plate portion facing the area where the battery pack is disposed.

[0017] The battery device according to Method 21 disclosed herein includes: a housing for accommodating a battery pack; and a cooling section disposed on the back side of a substrate portion of the housing. In the configuration of the battery device, the cooling section includes a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path. The back side of the substrate portion forms the enclosure walls of the first and second refrigerant flow paths. The remaining enclosure walls of the first refrigerant flow path are formed by a first plate, and the remaining enclosure walls of the second refrigerant flow path are formed by a second plate. The first and second plates are mounted on the back side of the substrate portion facing the area where the battery pack is disposed.

[0018] The cooling method disclosed in Method 22 is a cooling method for a battery device, wherein the battery device includes: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack; a cooling plate mounted on the base plate portion; the battery device further includes a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path; the back side of the base plate portion forms a wall surrounding the first refrigerant flow path and the second refrigerant flow path; the cooling plate includes a first plate forming the remaining wall surrounding the first refrigerant flow path and a second plate forming the remaining wall surrounding the second refrigerant flow path; the first plate and the second plate are mounted on the back side of the base plate portion facing the area where the battery pack is disposed; in this cooling method, refrigerant is supplied to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

[0019] The cooling plate disclosed in Method 23 is used to be mounted to the base plate portion of the housing and together with the base plate portion constitutes a cooling system for the battery device. The interior of the housing is used to accommodate the battery pack of the battery device. The back side of the base plate portion forms a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path. The cooling plate includes: a first plate having a first refrigerant flow path forming recess for forming the remaining walls of the first refrigerant flow path; a second plate having a second refrigerant flow path forming recess for forming the remaining walls of the second refrigerant flow path; and a refrigerant supply section forming recess for supplying refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel and independently. Attached Figure Description

[0020] Figure 1 is a schematic perspective view of the state in which the stacked units are disposed on the top surface of the substrate of the energy storage device according to the first embodiment of the present disclosure.

[0021] Figure 2 is a bottom view of the energy storage device according to the first embodiment of this disclosure.

[0022] Figure 3 is a schematic diagram of a cross-section taken along the direction of arrow III-III in Figure 2.

[0023] Figure 4 is a schematic diagram of a cross-section taken along the direction of arrow IV-IV in Figure 2.

[0024] Figure 5 is a schematic diagram of a cross-section taken along the direction of arrow VV in Figure 2.

[0025] Figure 6 is a schematic diagram of a cross-section taken along the direction of arrow VI-VI in Figure 2.

[0026] Figure 7 is a schematic diagram of a cross-section taken along the direction of arrow VII-VII in Figure 2.

[0027] Figure 8 is a schematic diagram of a cross-section taken along the direction of arrow VIII-VIII in Figure 2.

[0028] Figure 9 is a bottom view of the energy storage device according to the second embodiment disclosed herein.

[0029] Figure 10 is a schematic diagram of a cross-section taken along the direction of arrow XX in Figure 9.

[0030] Figure 11 is a perspective view of the energy storage device according to the third embodiment of this disclosure.

[0031] Figure 12 is a bottom view of the energy storage device according to the fourth embodiment of this disclosure.

[0032] Figure 13 is a schematic diagram of a cross-section taken along the direction of arrow XIII-XIII in Figure 12.

[0033] Figure 14 is a schematic diagram of a cross-section taken along the direction of arrow XIV-XIV in Figure 12.

[0034] Figure 15 is a schematic diagram of a cross-section taken along the direction of the XV-XV arrow in Figure 12.

[0035] Figure 16 is a schematic diagram of a cross-section taken along the direction of the arrow XVI-XVI in Figure 12.

[0036] Figure 17 is a bottom view of the energy storage device according to the fifth embodiment of this disclosure.

[0037] Figure 18 is an enlarged view of a local structure in Figure 17.

[0038] Figure 19 is a schematic diagram of a cross-section taken along the direction of the XIX-XIX arrow in Figure 18.

[0039] Figure 20 is a schematic diagram of a cross-section taken along the direction of the arrow XX-XX in Figure 18.

[0040] Figure 21 is a schematic diagram of a cross-section taken along the direction of the XXI-XXI arrow in Figure 17.

[0041] Figure 22 is a bottom view of the energy storage device according to the sixth embodiment of this disclosure.

[0042] Figure 23 is a bottom view of the energy storage device according to the seventh embodiment of this disclosure.

[0043] Figure 24 is a bottom view of the energy storage device according to the eighth embodiment of this disclosure.

[0044] Figure 25 is an enlarged view of a local structure in Figure 24.

[0045] Figure 26 is a schematic diagram of a cross-section taken along the direction of arrow XXVI-XXVI in Figure 25.

[0046] Figure 27 is a schematic diagram of a cross-section taken along the direction of arrows XXVII-XXVII in Figure 25.

[0047] Figure 28 is a bottom view of the energy storage device according to the ninth embodiment of this disclosure.

[0048] Figure 29 is a bottom view of the energy storage device according to the tenth embodiment of this disclosure.

[0049] Figure 30 is an enlarged view of a local structure in Figure 29.

[0050] Figure 31 is a schematic diagram of a cross-section taken along the direction of arrow XXXI-XXXI in Figure 29.

[0051] Figure 32 is a schematic diagram of a cross-section taken along the direction of arrow XXXII-XXXII in Figure 29.

[0052] Figure 33 is a schematic diagram of a cross-section taken along the direction of arrow XXXIII-XXXIII in Figure 29.

[0053] Figure 34 is a schematic diagram of a cross-section taken along the direction of the arrow XXXIV-XXXIV in Figure 30.

[0054] Figure 35 is a schematic diagram of a cross-section taken along the direction of the arrow XXXV-XXXV in Figure 30.

[0055] Figure 36 is a schematic diagram of a cross-section taken along the direction of arrows XXXVI-XXXVI in Figure 30. Detailed Implementation

[0056] The embodiments disclosed herein will now be described with reference to the accompanying drawings.

[0057] (First Embodiment)

[0058] Figure 1 is a schematic perspective view of the energy storage device of the first embodiment (an example of the battery device disclosed herein) with a stacked unit S disposed on the top surface of the substrate portion 2. The stacked unit S is formed by stacking individual battery cells. The stacked unit S is an example of the "battery pack" disclosed herein, and multiple stacked units S are disposed adjacent to each other at predetermined intervals on the top surface of the substrate portion 2. The substrate portion 2 is made of a metal plate such as SUS and has a specific area 3 on the top surface for disposing of the stacked unit S and a general area 8 for not disposing of the stacked unit S. Control devices, etc., can be disposed in this general area 8. A housing portion can be constructed by erecting sidewalls (not shown) from the periphery of the substrate portion 2 in a manner that surrounds the stacked unit S.

[0059] In the specific region 3, there is an actual cooling target substrate portion 4 and an open substrate portion 6. In the substrate portion 2, the actual cooling target substrate portion 4 is the part in the specific region 3 that is in direct contact with the stacked unit S. In the substrate portion 2, the open substrate portion 6 is the gap portion formed between the stacked units S arranged adjacent to each other in the specific region 3.

[0060] As shown in FIG2, the back surface (bottom surface) of the substrate 2 is provided with first to fourth refrigerant flow paths A1 to A4 as a cooling section. Hereinafter, when referred to as "refrigerant flow path A", it means at least one of the first refrigerant flow path A1 to the fourth refrigerant flow path A4.

[0061] The first to fourth refrigerant flow paths A1 to A4 are formed by a recess (refrigerant flow path forming recess) 10 in a high thermal conductivity metal plate 11 such as SUS and the back side of the substrate portion 2. As shown in FIG2, the metal plate 11 is a strip plate with an opening 100 formed in the center, and the recess 10 is formed by bending the strip plate along the periphery of its central portion. The opening 100 is the unprocessed portion of the metal plate 11. The unprocessed metal plate portion (flange portion) at the periphery of the recess 10 is welded to the substrate portion 2 in a liquid-tight manner. The channels of the recess 10 constitute at least a portion of the surrounding wall of the refrigerant flow path A (see FIG3).

[0062] In Figure 2, cooling water, which serves as the refrigerant, is introduced through inlet 16, flows through the first refrigerant flow path A1, and is discharged from outlet 19. In this example, the first to fourth refrigerant flow paths are labeled with reference numerals A1 to A4, respectively. As shown in Figure 1, in each stacked unit S, individual solar cells are stacked along the refrigerant flow direction of the first to fourth refrigerant flow paths A1 to A4.

[0063] Each stacked unit S is arranged side-by-side in a direction orthogonal to the stacking direction of the individual cells. The stacked unit S opposite to the first to fourth refrigerant flow paths A1 to A4 corresponds to the first to fourth battery packs. The structure of the recess 10 included in the metal plate 11 that constitutes the wall of each refrigerant flow path, as well as the refrigerant inlet 16 and outlet 19, are all the same shape. By unifying the components in this way, it is possible to reduce product costs.

[0064] The number of metal plates 11 used to form the refrigerant flow path can be adjusted arbitrarily depending on the area of ​​the substrate 2. Furthermore, by adjusting the shape and area of ​​the metal plates 11, changes in the area and shape of the substrate 2 can be accommodated. The material and wall thickness of the metal plates 11 can be adjusted arbitrarily. The opening 100 of the metal plates 11 can also be omitted.

[0065] The metal plate 11 used to form the first to fourth refrigerant flow paths A1 to A4 is mounted on the back side of the substrate 2 in the area where the stacked units S are arranged. The "area where the stacked units S are arranged" refers to the area of ​​the substrate 2 that corresponds to the actual cooling target substrate 4 that is in direct contact with the stacked units S; in other words, the corresponding area facing the stacked units S across the substrate 2. Preferably, the metal plate 11 is arranged to cover the "area where the stacked units S are arranged," that is, the actual cooling target substrate 4 that is in contact with the stacked units S.

[0066] In other words, the metal plate 11 used to form the first to fourth refrigerant flow paths A1 to A4 is not disposed on the open substrate section 6. However, this does not preclude the metal plate 11 used to form the first to fourth refrigerant flow paths A1 to A4 from being disposed on the open substrate section 6. The size and shape of the substrate section 2, the number and size of the stacked units S to be disposed on the substrate section 2, etc., can also allow the metal plate 11 to be disposed on the open substrate section 6.

[0067] Here, it is envisioned that the metal plates 11 are arranged apart from each other. Thus, the enclosure formed by the channels of the recess 10 of the first refrigerant flow path A1 (excluding the substrate portion 2) and the enclosure formed by the channels of the recess 10 of the second refrigerant flow path A2 (excluding the substrate portion 2) are separated from each other.

[0068] The metal plate 11 used to form the enclosure of the first refrigerant flow path A1 corresponds to the first plate. The metal plate 11 used to form the enclosure of the second refrigerant flow path A2 corresponds to the second plate. The first plate and the second plate can be formed from a continuous, integral component, or they can be formed from separate components. In either case, the components constituting the cooling plates are preferably formed from materials with excellent thermal conductivity and resistance to refrigerant corrosion (e.g., stainless steel).

[0069] The metal plates used to form the walls of the third refrigerant flow path A3 and the fourth refrigerant flow path A4 are called the third plate and the fourth plate. Since each plate has the same shape, their number can be appropriately increased or decreased depending on the area of ​​the substrate portion 2.

[0070] A cooling plate is constructed using multiple metal plates 11 that form the first to fourth refrigerant flow paths A1 to A4. Regarding an energy storage device, exemplified by a battery device, its cooling system includes: a base plate portion 2 of the housing, wherein a stacked unit S serving as a battery pack for housing the energy storage device is located inside the housing; and a cooling plate mounted on the base plate portion 2.

[0071] In this example, the metal plates 11 used to form each refrigerant flow path A1 to A4 are arranged separately from each other. That is, the metal plates 11 used to form each refrigerant flow path A1 to A4 are independent of each other, thus preventing heat transfer between the metal plates 11.

[0072] Alternatively, the metal plates 11 can be designed as a continuous single unit. In this case, it is preferable to reduce the contact area between the metal plates to minimize mutual thermal interference. Furthermore, thermal insulation material can be placed between the metal plates 11. As the thermal insulation material, adhesive foam resin or the like can be used.

[0073] In this example, as shown in Figures 3 and 4, a portion of the substrate 2 is machined into a recess 200, which protrudes from the opening 100 of the metal plate 11 from the front side of the substrate 2 toward the back side. This increases the area of ​​the substrate 2 and improves its heat dissipation efficiency. Here, if the metal plate 11 does not have an opening, the recess 200 is unnecessary. That is, the recess 200 is not a required structure.

[0074] As shown in Figure 2, the cooling system also includes a refrigerant supply section C and a refrigerant discharge section D for the first to fourth refrigerant flow paths A1 to A4. The refrigerant supply section C includes a refrigerant supply flow path C1 and a connecting path C2.

[0075] As shown in Figure 5, the refrigerant supply path C1 is formed between the elongated bottom plate 21 and the top plate 25. The bottom plate 21 overlaps with the recesses 10 of each refrigerant path A1 to A4, and is arranged perpendicularly to the arrangement direction of the first to fourth refrigerant paths A1 to A4 at their ends. More specifically, as shown in Figure 2, in plan view, the refrigerant supply path C1 is disposed at the end edges of the first to fourth refrigerant paths A1 to A4.

[0076] First to fourth outlet ports 16B are formed on the base plate 21 that defines the refrigerant supply flow path C1. The first to fourth outlet ports 16B are respectively opposite to the openings 16A formed on the surrounding wall of the recess 10 of each refrigerant flow path A1 to A4. The cooling water inlet 16 is formed through the outlet ports 16B and the openings 16A.

[0077] To control the amount of cooling water introduced into each refrigerant flow path A1 to A4, it is preferable to adjust the opening area (flow path cross-sectional area) of the first to fourth outlet ports 16B. For example, the flow path cross-sectional area is gradually increased along the flow direction of the cooling water. Furthermore, the flow path cross-sectional area of ​​the first to fourth outlet ports 16B is preferably smaller than the flow path cross-sectional area of ​​the refrigerant supply flow path C1. Here, the flow path cross-sectional area refers to the area of ​​the cross section perpendicular to the flow direction of the refrigerant.

[0078] At one end of the refrigerant supply path C1, a cooling water inlet port 15B is formed. This inlet port 15B is connected to the connecting path C2 via an opening 15A. The connecting path C2 is formed between the substrate portion 2 and the recess 27 formed by processing a strip-shaped metal plate 28.

[0079] In the metal plate 28, the unprocessed flange-shaped portion surrounding the recess 27 is liquid-tightly welded to the substrate portion 2. An opening 14 is formed at a predetermined location in the substrate portion 2, which communicates with the connecting passage C2. Cooling water is supplied to the opening 14 from the outside.

[0080] In Figure 2, reference numeral D denotes a refrigerant discharge section, which includes a refrigerant discharge path D1 and a connecting path D2. The structure of the refrigerant discharge path D1 and its connection method with each of the refrigerant paths A1 to A4, and the structure of the connecting path D2 and its connection method with the refrigerant discharge path D1 are the same as those of the refrigerant supply section, therefore detailed descriptions are omitted.

[0081] As shown in Figures 4 and 5, cooling water supplied from opening 14 flows through connecting passage C2, then through opening 15A formed in the recess 27 of flow passage C2 on the downstream side of the refrigerant flow direction, and then enters refrigerant supply passage C1 through inlet port 15B. Afterwards, cooling water flows into first refrigerant passage A1 through first outlet port 16B, and then is supplied to second refrigerant passage A2 through second outlet port, to third refrigerant passage A3 through third outlet port, and to refrigerant passage A4 through fourth outlet port.

[0082] Cooling water supplied to each refrigerant flow path A1 to A4 absorbs heat from the substrate portion 2 (actually cooled substrate portion 4) that forms the enclosure of each refrigerant flow path A1 to A4, thereby cooling the laminated unit S. Furthermore, the remaining enclosures (excluding the substrate portion) that define each refrigerant flow path A1 to A4, namely the recess 10 of the metal plate 11, are separated from other recesses 10 that form other refrigerant flow paths, thus suppressing the thermal influence from other laminated units.

[0083] Cooling water from each refrigerant flow path A1 to A4 flows into the refrigerant discharge flow path D1 from the outlet 19, then flows into the connecting path D2 from the opening 18, and then is released to the outside from the opening 17.

[0084] As shown in Figures 6 and 7, the refrigerant discharge path D1 is a path divided by the base plate 31 and the recess 35. As shown in Figure 8, the connecting path D2 is a path divided by the recess 37 and the base plate 2. The cooling system shown in Figure 2 has a symmetrical structure in the vertical direction (the refrigerant discharge path D1 is at the top, and the refrigerant supply path C1 is at the bottom). Therefore, cooling water can be introduced from the opening 17 and discharged from the opening 14.

[0085] In the energy storage device having a cooling section (refrigerant flow path A) configured as shown in Figure 2, the walls of the refrigerant supply flow path C1 and the refrigerant discharge flow path D1 are separated from the base plate 2. That is, the recess 10 used to form the walls of each refrigerant flow path A1 to A4 is provided between the base plate 2 and the bottom plate 21 used to form the walls of the refrigerant supply flow path C1 and the bottom plate 31 used to form the walls of the refrigerant discharge flow path D1.

[0086] Therefore, the cooling water flowing through the refrigerant supply path C1 becomes less susceptible to heat from the substrate 2 and is introduced into each refrigerant path A1 to A4 at the same temperature. Furthermore, when the heated cooling water flowing through each refrigerant path A1 to A4 is discharged, the heat from the heated cooling water is prevented from being transferred back to the substrate 2 because the refrigerant discharge path D1 is also separated from the substrate 2.

[0087] In this example, the connecting paths C2 and D2 are arranged in the general area 8 of the substrate 2 where no stacked unit S is disposed. As a result, the thermal isolation between the stacked unit S and the cooling water is more reliable.

[0088] (Second Implementation)

[0089] Figure 9 shows the cooling section on the bottom surface of the housing portion of the energy storage device according to the second embodiment. In Figure 9, the same reference numerals are used for the same elements as in Figure 2, and their descriptions are omitted.

[0090] As shown in Figure 9, the second embodiment differs from the cooling system of the first embodiment in that it includes a refrigerant supply flow path E. Furthermore, instead of refrigerant supply flow paths C1 and C2, refrigerant discharge flow paths D3 and D4 are provided at positions corresponding to the refrigerant supply flow paths C1 and C2, which also differs from the cooling system of the first embodiment. Here, the shapes and structures of the refrigerant discharge flow paths D3 and D4 are the same as those of the refrigerant supply flow paths C1 and C2, respectively.

[0091] As shown in Figure 9, when viewing the back (bottom) surface of the substrate 2 from a planar perspective, if the refrigerant discharge path D1 is considered to be above and the refrigerant discharge path D3 is considered to be below, then the refrigerant supply path E is arranged in a manner that divides each of the refrigerant paths A1 to A4 in the vertical direction. More specifically, the refrigerant supply path E is preferably arranged in a manner that divides each of the refrigerant paths A1 to A4 into two equal parts in the vertical direction.

[0092] As shown in Figure 10, the refrigerant supply path E is formed by the base plate 121 and the recess 125. Furthermore, the refrigerant supply path E is connected to the substrate portion 2 via a docking portion 130, which connects the opening 114A of the substrate portion 2 to the inlet port 114B of the base plate 121. An outlet port 116B is formed on the base plate 121, through which refrigerant inlets 116 are formed.

[0093] In the cooling section shown in Figure 9, cooling water supplied from the opening 114A of the substrate section 2 is introduced into the refrigerant supply path E through the inlet port 114B via the docking section 130. Afterward, the cooling water is supplied to each refrigerant path A1 to A4 via the outlet port 116B.

[0094] Cooling water supplied to each refrigerant flow path absorbs heat from the substrate portion 2 (actually cooled substrate portion 4) that forms the walls of each refrigerant flow path A1 to A4, thereby cooling the laminated unit S. The cooling water in each refrigerant flow path A1 to A4 flows into the refrigerant discharge flow path D1 and D3 from the outlets 26 and 19, and then flows into the connecting path D2 and D4 from the openings 15 and 18, and then is discharged to the outside from the openings 14 and 17.

[0095] In this cooling unit configuration, the refrigerant supply path E is positioned between the refrigerant discharge paths D1 and D3, which are located at both ends of the refrigerant flow path. Therefore, the distance from the refrigerant inlet to the refrigerant outlet in each refrigerant flow path is shorter. Consequently, the cooling efficiency of the laminated unit S is improved.

[0096] In this example, since each refrigerant flow path A1 to A4 uniformly covers the entire stacked unit S, the refrigerant supply flow path E is positioned at the center of each of the refrigerant flow paths A1 to A4. However, from the viewpoint of uniformly cooling the stacked unit S, it is preferable to position the refrigerant supply flow path E on the back side of the substrate portion 2 at a position corresponding to the arrangement area of ​​the stacked unit S. Furthermore, it is more preferable to position the refrigerant supply flow path E at a position corresponding to the center of the stacked unit S.

[0097] (Third Implementation)

[0098] Figure 11 shows the energy storage device 200A according to the third embodiment. As shown in Figure 11, the third embodiment differs from the energy storage devices in the aforementioned embodiments in that the energy storage device 200A includes a housing portion 201.

[0099] As shown in Figure 11, the housing portion 201 is roughly rectangular in shape when viewed from a planar perspective. The interior of the housing portion 201 is used to house multiple stacked units S and a control device T. In this embodiment, for ease of explanation, the refrigerant flow direction of the refrigerant supply path C1 shown in Figure 11 is defined as the left-right direction, the direction orthogonal to the left-right direction is defined as the front-back direction (inside-outside direction), and the direction orthogonal to both the left-right and front-back directions is defined as the up-down direction.

[0100] The housing portion 201 includes a base plate portion 202, a first side plate portion 210, and a second side plate portion 220. The base plate portion 202 is shaped to be approximately U-shaped when viewed from the side in the front-rear direction. The base plate portion 202 has: a generally rectangular base plate for arranging flow paths, a pair of side plates extending upward from the left and right end edges of the base plate, and a flange portion extending outward from the upper end edge of the pair of side plates. A stacked unit S is mounted on the base plate of the base plate portion 202, and a plate material that engages with the flange portion of the base plate portion 202 is disposed on the side of the stacked unit S opposite to the side where the base plate portion 202 is located. The plate material and the base plate portion 202 are configured to extend outward from the end position of the stacked unit S disposed inside the housing portion 201 in the front-rear direction (outward).

[0101] The first side panel 210 is disposed on the front side of the housing 201 when viewed from the rear-rear direction. The first side panel 210 is formed into a box shape with an opening on the exposed side (front side), and its cross-section when cut along a plane perpendicular to the left-right direction is U-shaped. With the first side panel 210 disposed, the portion formed by the aforementioned extended portion of the base plate 202 overlapping and connecting with the first side panel 210 is the overhang portion 205.

[0102] The second side plate portion 220 is disposed on the rear side of the housing portion 201 when viewed from the rearward direction. The second side plate portion 220 is formed into a box shape with an opening on the exposed side (rear side), and its cross-section when cut along a plane perpendicular to the left-right direction is U-shaped. Here, the width of the second side plate portion 220 in the front-back direction (the direction in which the first side plate portion 210 and the second side plate portion 220 are opposite each other) is shorter than the width of the first side plate portion 210 in the front-back direction. That is, when comparing the cross-section of the first side plate portion 210 and the cross-section of the second side plate portion 220, the dimension of the first side plate portion 210 in the front-back direction is longer than that of the second side plate portion 220.

[0103] The overhang 205 is provided with a refrigerant inlet port C3 and an outlet port D3. The inlet port C3 and the outlet port D3 are provided protruding upwards from the overhang 205. The inlet port C3 and the outlet port D3 are connected to a refrigerant supply pipe (refrigerant supply pipe) and a discharge pipe (refrigerant discharge pipe) (not shown).

[0104] In this example, inlet port C3 and outlet port D3 are provided on the first side plate portion 210 (overhang portion 205). In order to accommodate the inlet port C3, outlet port D3 and the pipes connected to them, an overhang portion 205 is provided, which is formed by widening the base plate portion 202 in the front-rear direction. On the other hand, by designing the width of the second side plate portion 220 in the front-rear direction to be narrower, the mechanical rigidity of the housing portion 201 and the volume for mounting the stacked unit S are ensured.

[0105] The configurations of the refrigerant flow paths A1 to A4, refrigerant supply flow paths C1 and C2, and refrigerant discharge flow paths D1 and D2 that constitute the cooling section are the same as those shown in Figure 2, so their descriptions are omitted.

[0106] (Fourth implementation)

[0107] Figures 12 to 16 show the cooling section on the bottom surface of the housing portion of the energy storage device according to the fourth embodiment. The cooling system according to the fourth embodiment includes a substrate portion 402 and metal plates 411a to 411c that are equivalent to cooling plates, but the shapes of the substrate portion 402 and the metal plates 411a to 411c are different from those of the energy storage devices in the aforementioned embodiments.

[0108] As shown in Figure 12, the back surface (bottom surface) of the substrate 402 is provided with first to fourth refrigerant flow paths A11 to A14 as a cooling section. Here, in Figure 12, the z-axis direction is the thickness direction of the substrate 402, and the x and y-axis directions are the planar directions of the substrate 402.

[0109] The first refrigerant flow path A11 has a first flow path group and a second flow path group with the same shape. The first flow path group includes three flow paths A11a to A11c extending along the y-axis direction, and confluence portions 417a and 417b provided at both ends of these flow paths.

[0110] The second flow path group includes three flow paths A11d to A11f extending along the y-axis direction, and confluence portions 417c and 417d provided at both ends of these flow paths. An opening is provided between the first flow path group and the second flow path group, and the first flow path group and the second flow path group are separated from each other by a recess 420 provided on the substrate portion 402.

[0111] Here, the shape protruding towards the negative z-axis direction is referred to as a recess. The second to fourth refrigerant flow paths A12 to A14 are also configured in the same way as the first refrigerant flow path A11. Similar to the first embodiment, the first to fourth refrigerant flow paths A11 to A14 are arranged opposite to the arrangement area of ​​the stacked unit S on the back side of the substrate portion 402, and the recess 410 is formed on the metal plates 411a to 411c.

[0112] The first to fourth refrigerant flow paths A11 to A14 are respectively arranged opposite to the corresponding stacked units S across the substrate portion 402. In each stacked unit S, individual solar cells are stacked along the refrigerant flow direction of the first to fourth refrigerant flow paths A11 to A14, i.e., the y-axis direction. Each stacked unit S is arranged side by side along the x-axis direction. Each stacked unit S opposite to the first to fourth refrigerant flow paths A11 to A14 corresponds to the first to fourth battery packs.

[0113] The first to fourth refrigerant flow paths A11 to A14 are arranged sequentially in the positive x-axis direction. The first to fourth refrigerant flow paths A11 to A14 are spaced apart from each other. Around the periphery of the first to fourth refrigerant flow paths A11 to A14, refrigerant supply flow paths C11 and C12 and refrigerant discharge flow paths D11 and D12 are arranged. Refrigerant supply flow path C11 is located at the end of the substrate portion 402 located in the positive y-axis direction, and refrigerant supply flow path C12 is located at the end of the substrate portion 402 located in the negative x-axis direction.

[0114] The refrigerant supply flow path C11, located on the negative x-axis side, is connected to the refrigerant supply flow path C12, located on the positive y-axis side. Therefore, the refrigerant supply flow paths C11 and C12 are generally L-shaped overall. The refrigerant discharge flow path D11 is located at the end of the substrate portion 402 located on the negative y-axis side, and the refrigerant discharge flow path D12 is located at the end of the substrate portion 402 located on the negative x-axis side. The refrigerant discharge flow path D11, located on the negative x-axis side, is connected to the end of the refrigerant discharge flow path D12, located on the negative y-axis side. Therefore, the refrigerant discharge flow paths D11 and D12 are generally L-shaped overall.

[0115] The first to fourth refrigerant flow paths A11 to A14, the refrigerant supply flow paths C11 and C12, and the refrigerant discharge flow paths D11 and D12 are arranged in the same plane (xy plane). The refrigerant supply flow paths C11 and C12 and the refrigerant discharge flow paths D11 and D12 are arranged in a manner that surrounds the first to fourth refrigerant flow paths A11 to A14.

[0116] The substrate 402 is a flat plate. The refrigerant supply paths C11 and C12, the first to fourth refrigerant paths A11 to A14, and the refrigerant discharge paths D11 and D12 are arranged on the back of the substrate 402 in a non-overlapping manner. The area where the refrigerant supply paths C11 and C12 and the refrigerant discharge paths D11 and D12 are arranged is not the area that faces the laminated unit S across the substrate 402.

[0117] The first to fourth refrigerant flow paths A11 to A14 are linearly symmetrical with respect to the axis of symmetry that extends along the x-axis and passes through the center of the y-direction of the substrate portion 402. Similarly, the refrigerant supply flow paths C11 and C12 and the refrigerant discharge flow paths D11 and D12 are also linearly symmetrical with respect to this axis of symmetry.

[0118] The metal plate 411a has recesses 410a to 410f, and recesses 425, 426, 428, and 429. The enclosure of the first refrigerant flow path A11 is formed by the substrate portion 402 and the recesses 410a to 410f. Thus, the first refrigerant flow path A11 is defined by the recesses 410a to 410f and the substrate portion 402.

[0119] In other words, the walls surrounding the refrigerant flow path are defined by recesses 410a to 410f and the substrate portion 402. In the cooling plate, these recesses 410a to 410f can be referred to as refrigerant flow path forming recesses. Here, the configuration of the second refrigerant flow paths A12 to A14 is the same as that of the first refrigerant flow path A11.

[0120] A portion of the enclosure wall of the refrigerant supply flow path C11 is formed by the substrate portion 402 and the recess 426. The enclosure wall of the refrigerant supply flow path C12 is formed by the substrate portion 402 and the recess 425. A portion of the enclosure wall of the refrigerant discharge flow path D11 is formed by the substrate portion 402 and the recess 429. The enclosure wall of the refrigerant discharge flow path D12 is formed by the substrate portion 402 and the recess 428.

[0121] Recesses 425 and 426 can be referred to as recesses for forming a refrigerant supply flow path. Furthermore, recesses 428 and 429 can be referred to as recesses for forming a refrigerant discharge flow path. In this embodiment, the recess for forming a refrigerant supply section is equivalent to the recess for forming a refrigerant supply flow path, and the recess for forming a refrigerant discharge section is equivalent to the recess for forming a refrigerant discharge flow path.

[0122] Although the reference numerals are omitted, the metal plate 411b also has recesses forming the enclosure for the second refrigerant flow path A12, the enclosure for the first flow path group of the third refrigerant flow path A13, a portion of the enclosure for the refrigerant supply flow path C11, and a portion of the enclosure for the refrigerant discharge flow path D11.

[0123] In addition, the metal plate 411c has recesses formed on the wall of the second flow path group that constitutes the fourth refrigerant flow path A14, the third refrigerant flow path A13, a portion of the wall of the refrigerant supply flow path C11, and a portion of the wall of the refrigerant discharge flow path D11.

[0124] Metal plates 411a and 411b are connected to each other via connecting parts 413a and 413b. Metal plates 411b and 411c are connected to each other via connecting parts 413c and 413d. Each connecting part 413a to 413d can be connected, for example, by welding the metal plates that need to be connected together with their opposing faces aligned.

[0125] When metal plate 411a is designated as the first plate, metal plate 411b as the second plate, and the portion of recess 426 overlapping with metal plate 411a is designated as the first refrigerant supply flow path forming recess, and the portion overlapping with metal plate 411b is designated as the second refrigerant supply flow path forming recess, the first and second refrigerant supply flow path forming recesses can be interconnected by joining the first plate and the second plate. Thus, a portion of the refrigerant supply flow path C11 is formed.

[0126] Furthermore, when the portion of recess 429 overlapping with metal plate 411a is designated as the first refrigerant discharge path forming recess, and the portion overlapping with metal plate 411b is designated as the second refrigerant discharge path forming recess, the first and second refrigerant discharge path forming recesses can be interconnected by joining the first plate and the second plate. Thus, a portion of the refrigerant discharge path D11 is formed. Furthermore, similar to the first and second plates, the cooling plate also includes a metal plate 411c having refrigerant flow path forming recesses, refrigerant supply flow path forming recesses, and refrigerant discharge flow path forming recesses. Through the mutual joining of metal plates 411b and 411c, their respective refrigerant supply flow path forming recesses and refrigerant discharge flow path forming recesses are also interconnected.

[0127] Openings 415 and 418 are provided at approximately the center position in the y direction at the end of the substrate portion 402 located in the negative x-axis direction. Opening 415 corresponds to an inlet port for introducing cooling water (refrigerant) into the refrigerant supply flow path C12. Opening 418 corresponds to an outlet port for discharging cooling water from the refrigerant discharge flow path D12.

[0128] The refrigerant supply path C11 is connected to the first to fourth refrigerant paths A11 to A14 via outlet ports 416a to 416h. The refrigerant discharge path D11 is connected to the first to fourth refrigerant paths A11 to A14 via discharge ports 419a to 419h.

[0129] The cross-sectional area of ​​the outlet ports 416a to 416h is smaller than that of the refrigerant supply flow path C11, thus enabling the outlet ports 416a to 416h to function as throttling orifices. Similarly, the cross-sectional area of ​​the outlet ports 419a to 419h is smaller than that of the refrigerant discharge flow path D11, thus enabling the outlet ports 419a to 419h to function as throttling orifices. By utilizing the function of the throttling orifices, the flow rate of cooling water flowing through the first to fourth refrigerant flow paths A11 to A14 can be adjusted.

[0130] Cooling water introduced into refrigerant supply path C12 from opening 415 flows through refrigerant supply path C12 in the positive y-axis direction and enters refrigerant supply path C11. Furthermore, cooling water flows through refrigerant supply path C11 in the positive x-axis direction and enters the first to fourth refrigerant supply paths A11 to A14 via outlet ports 416a to 416h.

[0131] In the first refrigerant flow path A11, cooling water introduced from the refrigerant supply flow path C11 via the outlet port 416a flows through the manifold 417a along the negative y-axis and passes through flow paths A11a to A11c, where it converges at the manifold 417b. Then, the cooling water is discharged from the manifold 417b via the outlet port 419a to the refrigerant discharge flow path D11.

[0132] Similarly, cooling water introduced into manifold 417c from outlet port 416b flows along the negative y-axis through flow paths A11d to A11f, and is discharged into refrigerant discharge flow path D11 via manifold 417d and outlet port 419b. Cooling water introduced into refrigerant flow paths A12 to A14 from refrigerant supply flow path C11 via outlet ports 416c to 416h is also discharged into refrigerant discharge flow path D11 via outlet ports 419c to 419h.

[0133] Cooling water discharged to refrigerant discharge path D11 flows in the negative x-axis direction and is introduced into refrigerant discharge path D12. Then, cooling water flows in the positive y-axis direction through refrigerant discharge path D12 to the opening 418 and is discharged from the opening 418.

[0134] In this way, cooling water can be supplied independently and in parallel to each refrigerant flow path A11 to A14, and the flow rate of cooling water in each refrigerant flow path A11 to A14 can be controlled according to the heat generation of the stacked unit S under the responsibility of each refrigerant flow path A11 to A14 through the throttling orifice function of the discharge ports 419a to 419h.

[0135] With this cooling section, by utilizing the back side area of ​​the substrate section 402 where no stacked unit S is configured, the refrigerant supply flow path C11, C12 and the refrigerant discharge flow path D11, D12 can be configured, thereby reducing the height of the cooling plate (the dimension in the thickness direction, i.e., the z-axis direction, of the substrate section 402).

[0136] Furthermore, the walls of the refrigerant flow paths can be constructed by connecting multiple metal plates 411a to 411c together to form a cooling plate, thus allowing for easy addition or removal of each refrigerant flow path A11 to A14. For example, by inserting two metal plates 411b between each of the metal plates 411b and 411c shown in FIG. 12, a cooling system extending to the 5th and 6th refrigerant flow paths can be manufactured. As shown in FIG. 12, the metal plates 411a to 411c have recesses whose shape is linearly symmetrical with respect to an axis of symmetry extending along the x-axis and passing through the center of these metal plates in the y-direction. Therefore, it is also possible to combine and arrange some of the metal plates with their orientation reversed in the y-axis direction.

[0137] In the above description, metal plates 411a to 411c correspond to the first plate, the second plate, and the third plate, but when they are welded together by connecting parts 413a to 413d, they function as cooling plates. Multiple openings are formed on this cooling plate.

[0138] More specifically, respectively in

[0139] (1) Between the refrigerant supply path C12 and the refrigerant discharge path D12 and the first path group of the first refrigerant path A11,

[0140] (2) Between the first flow path group and the second flow path group of the first refrigerant flow path A11,

[0141] (3) Between the second flow path group of the first refrigerant flow path A11 and the first flow path group of the second refrigerant flow path A12,

[0142] (4) Between the first flow path group and the second flow path group of the second refrigerant flow path A12,

[0143] (5) Between the second flow path group of the second refrigerant flow path A12 and the first flow path group of the third refrigerant flow path A13,

[0144] (6) Between the first and second flow path groups of the third refrigerant flow path A13,

[0145] (7) Between the second flow path group of the third refrigerant flow path A13 and the first flow path group of the fourth refrigerant flow path A14,

[0146] (8) Between the first and second flow path groups of the fourth refrigerant flow path A14,

[0147] It forms an opening.

[0148] Each refrigerant flow path A11 to A14 is separated from each other by the openings formed at (1) to (8) above. In addition, the first flow path group and the second flow path group of each refrigerant flow path A11 to A14 are also separated from each other.

[0149] The cooling system according to this embodiment can be manufactured, for example, by the following manufacturing method. The manufacturing method includes: a step of preparing a substrate portion; a first forming step of forming a first plate having a first refrigerant flow path forming recess and a first refrigerant supply flow path forming recess; a second forming step of forming a second plate having a second refrigerant flow path forming recess and a second refrigerant supply flow path forming recess; a first welding step of welding the opposing surfaces of the first and second plates; a second welding step of welding the opposing surfaces of the first and second refrigerant supply flow path forming recesses; and a step of welding the cooling plate obtained by the first and second welding steps to the back side of the substrate portion.

[0150] In the first forming step, the first plate is formed such that the portion to be welded to the second plate protrudes beyond the other portions. In the second forming step, the second plate is formed such that the portion to be welded to the first plate protrudes beyond the other portions.

[0151] The outer periphery of the cooling plate and the periphery of the openings formed at (1) to (8) above are welded to the back side of the substrate portion 402 in a liquid-tight manner (the same applies to subsequent embodiments). As a welding method, existing known methods can be used.

[0152] (Fifth Embodiment)

[0153] Figures 17 to 21 show the cooling section on the bottom surface of the housing portion of the energy storage device according to the fifth embodiment. In Figures 17 to 21, the same reference numerals are given to the same elements as in Figures 12, etc., and their descriptions are omitted. In addition, the reference numerals given to the same elements are sometimes omitted as well.

[0154] In the cooling section shown in FIG17, the connecting portions 513a-513d used to connect the metal plates 511a-511c to each other are formed into a flat plate shape, and the portion of the substrate portion 502 opposite to this flat plate shape has a stepped portion. These are different from the energy storage device shown in the fourth embodiment. Here, the term "flat plate shape" is not limited to a flat plate in the strict sense, but may also include a generally flat plate shape.

[0155] As shown in Figures 17 to 21, at the position opposite to the connecting portions 513a and 513b on the base plate portion 502, there are stepped portions 530a and 530b that are offset in the positive z-axis direction.

[0156] Although the cross-section is not shown in the figure, the situation is the same as described above at the connecting portions 513c and 513d that connect the metal plates 511b and 511c to each other. That is, the base plate portion 502 has a stepped portion at the position opposite to the connecting portions 513c and 513d, and the metal plates 511b and 511c are generally flat.

[0157] As shown in Figures 18 to 20, the substrate portion 502 has a stepped portion 530a, which ensures the cross-sectional area of ​​the refrigerant supply flow path C11 and allows a generally flat plate shape to be formed near the connecting portion 513a. Since the opposing surfaces of the generally flat metal plate 511a (the surfaces opposite to the metal plate 511b) and the opposing surfaces of the generally flat metal plate 511b (the surfaces opposite to the metal plate 511a) can be connected to each other at the connecting portion 513a by welding or the like, a simple and reliable connection can be achieved.

[0158] In the above description, to achieve a generally flat connecting portion 513a, the recess 526a of the metal plate 511a (first plate), which forms the wall of the refrigerant supply flow path C11, extends toward the connecting portion 513a (in the positive x-axis direction) in a way that curves upward in the positive z-axis direction, until it terminates at the flat portion of the metal plate 511a. The terminating end of the recess 526a is integrally connected to the first plate connecting portion (511a-1) of the metal plate 511a, which is a flat portion. The first plate connecting portion (511a-1) is equivalent to a protruding member that protrudes in the positive x-axis direction from the portion of the metal plate 511a in which the recess 526a is formed.

[0159] Similarly, the recess 526b of the metal plate 511b (the second plate), which forms the enclosure of the refrigerant supply flow path C11, extends toward the connecting portion 513a (in the negative x-axis direction) in a way that curves upward in the positive z-axis direction, until it terminates at the flat portion of the metal plate 511b. The terminating end of the recess 526b is integrally connected to the second plate connecting portion (511b-1) of the metal plate 511b, which is the flat portion. The second plate connecting portion (511b-1) is equivalent to a protruding member that protrudes in the negative x-axis direction from the portion of the metal plate 511b in which the recess 526b is formed.

[0160] As described above, metal plate 511a (an example of the first plate) has a generally flat first plate connecting portion 511a-1 that follows the recess for forming the first refrigerant supply flow path, and metal plate 511b (an example of the second plate) has a generally flat second plate connecting portion 511b-1 that follows the recess for forming the second refrigerant supply flow path. The first plate connecting portion 511a-1 and the second plate connecting portion 511b-1 are joined together by their opposing surfaces, thereby connecting metal plates 511a and 511b to each other.

[0161] Regarding the substrate portion 502, it has a stepped portion 530a that is offset towards the front side of the substrate portion 502 at the portion opposite to the first plate connection portion 511a-1 and the second plate connection portion 511b-1. Therefore, a refrigerant supply flow path C11 can be formed at the connection portion 513a by the stepped portion 530a and the first plate connection portion 511a-1 and the second plate connection portion 511b-1. At the connection portion 513a, not only is the refrigerant supply flow path C11 secured, but the opposing surfaces of the generally flat first plate connection portion 511a-1 and the second plate connection portion 511b-1 can also be joined together by welding or the like, thus achieving an easy and reliable connection.

[0162] As shown in Figure 21, the substrate portion 502 also has a stepped portion 530b at the connection portion 513b of the refrigerant discharge flow path D11, thereby ensuring the flow path cross-sectional area of ​​the refrigerant discharge flow path D11 and forming a generally flat plate shape near the connection portion 513b. Since the opposing surfaces (the surfaces opposite to the metal plate 511b) of the generally flat metal plate 511a and the opposing surfaces (the surfaces opposite to the metal plate 511a) of the generally flat metal plate 511b can be connected to each other at the connection portion 513b by welding or the like, a simple and reliable connection can be achieved.

[0163] In this case, a protruding member is formed from the portion of metal plate 511a (first plate) with the recess 529a, protruding in the positive x-axis direction, namely the third plate connecting portion (511a-2). Similarly, a protruding member is formed from the portion of metal plate 511b (second plate) with the recess 529b, protruding in the negative x-axis direction, namely the fourth plate connecting portion (511b-2). Although not shown, the cases of other connecting portions 513c and 513d are the same as described above, that is, metal plate 511b and metal plate 511c are connected to each other by welding their respective generally flat opposing surfaces.

[0164] (Sixth Embodiment)

[0165] Figure 22 shows the cooling section on the bottom surface of the housing portion of the energy storage device according to the sixth embodiment. In Figure 22, the same reference numerals as those in Figure 12 are used, and their descriptions are omitted. Furthermore, the reference numerals assigned to the same element are sometimes omitted as well.

[0166] In the cooling section shown in Figure 22, the cooling plate is composed of four metal plates 611a to 611d, which is different from the energy storage device shown in the fourth embodiment.

[0167] Metal plates 611a to 611d each have corresponding first to fourth refrigerant flow paths A11 to A14. Metal plates 611b and 611c have the same shape. Metal plates 611a to 611d are connected to each other via connecting parts 613a to 613f. Since the cooling plate is composed of four metal plates 611a to 611d, and each of the metal plates 611a to 611d corresponds to the first to fourth refrigerant flow paths A11 to A14 corresponding to the four stacked units S, the refrigerant flow paths can be added or removed more flexibly and easily.

[0168] Here, metal plates 411a-411c and metal plates 611a-611d shown in FIG12 can also be used in combination. The number of metal plates can be the same as or different from the number of stacked units S and the corresponding refrigerant flow path groups. For example, the recesses for forming the first to fourth refrigerant flow paths A11-A14 used to form the walls of the first to fourth refrigerant flow paths A11-A14 can be provided on 4 metal plates as in this embodiment, or on fewer metal plates such as 2 or 3 metal plates, or on more metal plates such as 5 or more metal plates.

[0169] (Seventh Embodiment)

[0170] Figure 23 shows the cooling section on the bottom surface of the housing portion of the energy storage device according to the seventh embodiment. In Figure 23, the same reference numerals are used for the same elements as in Figure 17, and their descriptions are omitted. Furthermore, the reference numerals assigned to the same elements are sometimes omitted as well.

[0171] In the cooling section shown in FIG23, similarly to FIG22, the cooling plate is composed of four metal plates 711a to 711d. Furthermore, in the cooling section of FIG23, similarly to FIG17, the connecting portions 713a to 713f that connect the metal plates 711a to 711d are generally flat, and the portion of the base plate portion 702 opposite to the generally flat portion has a stepped portion.

[0172] (Eighth Embodiment)

[0173] Figures 24 to 27 show the cooling section on the bottom surface of the housing portion of the energy storage device according to the eighth embodiment. In Figure 24, the same reference numerals are used for the same elements as in Figure 17, and their descriptions are omitted. Furthermore, the reference numerals assigned to the same elements are sometimes omitted as well.

[0174] In the cooling section of Figure 24, the cooling plate includes four metal plates 811a-811d and flat plate-shaped members 881a-881f. In the example of Figure 17 (and also in Figure 22), each of the metal plates 511a-511c (or metal plates 611a-611d in the example of Figure 22) has a first and a second plate connecting portion as a flat plate-shaped protruding member. In this example, the aforementioned plate connecting portions are replaced by plate-shaped members. These plate-shaped members are welded to the end of the refrigerant supply flow path forming recesses of the opposing metal plates.

[0175] Specifically, one end of plate-shaped component 881a is welded to the end of metal plate 811a on the positive y-axis side of the refrigerant supply flow path forming recess, and the other end is welded to the end of metal plate 811b on the negative y-axis side of the refrigerant supply flow path forming recess. One end of plate-shaped component 881b is welded to the end of metal plate 811a on the negative y-axis side of the refrigerant discharge flow path forming recess, and the other end is welded to the end of metal plate 811b on the negative y-axis side of the refrigerant discharge flow path forming recess. Plate-shaped components 881c to 881f are similarly welded to the opposing metal plates 811b to 811d.

[0176] Because a stepped portion 830a is formed in the area of ​​the substrate portion 802 opposite to the connecting portion 813 (see Figures 26 and 27), the function of the refrigerant supply flow path C11 is ensured. Although a cross-section is not shown in the figures, a plate-shaped member 881b can also be used at the connecting portion 813b to replace the third plate connecting portion 511a-2 and the fourth plate connecting portion 511b-2 shown as protruding members in Figure 20. Because a stepped portion is also provided in the area of ​​the substrate portion 802 opposite to the connecting portion 813b, the function of the refrigerant discharge flow path D11 is ensured. Furthermore, the same applies to the cases of connecting portions 813c to 813f.

[0177] By employing the aforementioned plate-shaped components, protruding members (connecting portions 511a-1, 511b-1, 511a-2, and 511b-2 of plates 1 to 4; see Figures 18 to 21) can be eliminated. This improves the manufacturing yield of metal plates 811a and 811b, reducing manufacturing costs. The same applies to the other metal plates 811c to d.

[0178] Although in the first to eighth embodiments described above, each of the first and second flow path groups of the first to fourth refrigerant flow paths A11 to A14 has three parallel flow paths, this is not a limitation. The number of flow paths included in each flow path group of the first to fourth refrigerant flow paths A11 to A14 can be appropriately changed.

[0179] (9th embodiment)

[0180] Figure 28 shows the cooling section on the bottom surface of the housing portion of the energy storage device according to the ninth embodiment. In Figure 28, the same reference numerals are used for the same elements as in Figure 22, and their descriptions are omitted. Furthermore, the reference numerals assigned to the same elements are sometimes omitted as well.

[0181] The cooling section shown in Figure 28 differs from the energy storage device according to the sixth embodiment in the shape of the first to fourth refrigerant flow paths A31 to A34. The first to fourth refrigerant flow paths A31 to A34 have the same shape and are composed of two flow paths (e.g., flow paths A31a and A31b) that meander along the y-axis. Flow paths A31a and A31b are configured to be linearly symmetrical with respect to the axis of symmetry P1 parallel to the y-axis shown in Figure 28.

[0182] Alternatively, the other first to fourth refrigerant flow paths described in the above embodiments can be replaced with the first to fourth refrigerant flow paths A31 to A34.

[0183] (10th Embodiment)

[0184] Figures 29 to 36 show the cooling section on the bottom surface of the housing portion of the energy storage device according to the tenth embodiment. In Figures 29 to 36, the same reference numerals as in Figure 12 are used for the same elements, and their descriptions are omitted. Furthermore, the reference numerals assigned to the same elements are sometimes omitted as well.

[0185] The energy storage device according to the 10th embodiment differs from the energy storage device according to the 6th embodiment in terms of the shape of the substrate portion 1002 and the shape of the metal plates 1011a to 1011d that correspond to the cooling plate.

[0186] As shown in FIG29, the back surface (bottom surface) of the substrate 1002 is provided with first to fourth refrigerant flow paths A41 to A44 as a cooling section. A refrigerant supply flow path C41 is provided at the periphery of the first to fourth refrigerant flow paths A41 to A44 on the positive y-axis side. As shown in FIGS.29 to 31, the walls of the first to fourth refrigerant flow paths A41 to A44 and the refrigerant supply flow path C41 are formed by recesses (refrigerant flow path forming recess 1010 and refrigerant supply flow path forming recess 1026) formed on the back surface (negative z-axis side) of the substrate 1002 and on the metal plates 1011a to 1011d.

[0187] As shown in Figures 29 and 32, a refrigerant discharge path D41 is provided on the front side (positive z-axis side) of the substrate 1002, at a position opposite to the end of the first to fourth refrigerant flow paths A41 to A44 on the positive y-axis side. The surrounding wall of the refrigerant discharge path D41 is formed by a protrusion (refrigerant discharge path forming protrusion 1029) formed on the front side of the substrate 1002 and the metal plate 1080. Here, the shape protruding towards the positive z-axis side is referred to as a protrusion.

[0188] An opening 1015 is provided at approximately the center of the x-axis at the end of the substrate 1002 on the positive y-axis side. The opening 1015 corresponds to an inlet port for introducing cooling water into the refrigerant supply path C41. An opening 1018 is provided at approximately the center of the x-axis at the metal plate 1080. The opening 1018 corresponds to an outlet port for discharging cooling water from the refrigerant discharge path D41.

[0189] The refrigerant supply path C41 is connected to the first to fourth refrigerant paths A41 to A44 via two outlet ports. The refrigerant discharge path D41 is connected to the first to fourth refrigerant paths A41 to A44 via four discharge ports.

[0190] The refrigerant supply path C41 is connected to the first refrigerant path A41 via outlet ports 1016a and 1016b. The refrigerant discharge path D41 is connected to the first refrigerant path A41 via outlet ports 1019a to 1019d. The cross-sectional area of ​​the outlet ports 1016a and 1016b is smaller than that of the refrigerant supply path C41, thus the outlet ports 1016a and 1016b function as throttling orifices.

[0191] Here, the outlet ports 1016a and 1016b are formed in the same way as the discharge port 1016e shown in FIG. 34. Similarly, the flow path cross-sectional area of ​​the discharge ports 1019a to 1019d is smaller than the flow path cross-sectional area of ​​the refrigerant discharge flow path D41, therefore the discharge ports 1019a to 1019d function as throttling orifices. Here, the discharge ports 1019a to 1019d are formed in the same way as the discharge port 1019i shown in FIG. 35.

[0192] The first refrigerant flow path A41 has a first flow path and a second flow path with the same shape. The first flow path of the first refrigerant flow path A41 includes an upstream flow path A41a extending from the outlet port 1016a toward the negative y-axis direction, and downstream flow paths A41b and A41c connected to the end of the upstream flow path A41a on the negative y-axis direction side. The downstream flow paths A41b and A41c, starting from the end of the upstream flow path A41a on the negative y-axis direction side, each make a U-shaped turn on both the positive and negative sides of the x-axis direction (the left and right sides shown in FIG. 29), and extend toward the outlet ports 1019a and 1019b on the positive y-axis direction side.

[0193] Similarly, the second flow path of the first refrigerant flow path A41 includes an upstream flow path A41d extending from the outlet port 1016b toward the negative y-axis direction, and downstream flow paths A41e and A41f connected to the end of the upstream flow path A41d on the negative y-axis direction side and extending to the outlet ports 1019c and 1019d. The first flow path and the second flow path are separated from each other by a recess 1020 provided on the substrate portion 1002.

[0194] Cooling water introduced into the refrigerant supply path C41 from the opening 1015 is introduced into the first refrigerant path A41 via the outlet ports 1016a and 1016b. In the first refrigerant path A41, the cooling water flows from the outlet ports 1016a and 1016b in the negative y-axis direction through the upstream paths A41a and A41d, and is introduced into the downstream paths A41b, A41c, A41e, and A41f.

[0195] Cooling water flows in the positive y-axis direction through downstream flow paths A41b, A41c, A41e, and A41f, and is discharged through discharge ports 1019a to 1019d to refrigerant discharge flow path D41. The cooling water discharged to refrigerant discharge flow path D41 is then discharged from opening 1018.

[0196] The second to fourth refrigerant flow paths A42 to A44 are configured in the same way as the first refrigerant flow path A41. Similar to the sixth embodiment, refrigerant flow path forming recesses 1010 are formed on the metal plates 1011a to 1011d such that the first to fourth refrigerant flow paths A41 to A44 are arranged opposite to the lamination units S on the back side of the substrate portion 1002. Each of the first to fourth refrigerant flow paths A41 to A44 is arranged opposite to the corresponding lamination unit S across the substrate portion 1002.

[0197] The first to fourth refrigerant flow paths, A41 to A44, are arranged sequentially along the positive x-axis. These paths are spaced apart from each other. A refrigerant supply flow path, C41, is located around each of the first to fourth refrigerant flow paths, A41 to A44. The first to fourth refrigerant flow paths, A41 to A44, and the refrigerant supply flow path, C41, are arranged in the same plane (xy plane).

[0198] The refrigerant supply path C41 is not located in the area opposite the laminated unit S across the substrate 1002. Instead, a refrigerant discharge path D41 is located near the area opposite the periphery of the first to fourth refrigerant paths A41 to A44 across the substrate 1002. The refrigerant discharge path D41 is also not located in the area opposite the laminated unit S across the substrate 1002.

[0199] The first to fourth refrigerant flow paths A41 to A44 can be configured in a U-shaped turn as in this embodiment, or the shape and configuration of the refrigerant supply flow path C41 and the refrigerant discharge flow path D41 can be changed depending on the shape of the first to fourth refrigerant flow paths A41 to A44.

[0200] According to this embodiment, one of the refrigerant supply path C41 and the refrigerant discharge path D41 can be disposed on the back side of the substrate portion 1002, and the other can be disposed on the front side of the substrate portion. Therefore, even if the outlet and outlet ports of the first to fourth refrigerant paths A41 to A44 are all located on the same periphery of the first to fourth refrigerant paths A41 to A44, the height (dimension in the z-axis direction) of the cooling plate can be reduced.

[0201] While the embodiments described above illustrate an example of an energy storage device as a battery device, the embodiments are not limited to this, and may also be primary batteries or fuel cells. Furthermore, while a stacked unit S is illustrated as an example of a battery pack, the embodiments are not limited to this, and may also be single cells containing a pair of electrodes, or modularized single cells or stacked units. Additionally, a battery pack may be a stack of single cells capable of discharging electricity, or a stacked body or stacked body module thereof. When used as a battery, it includes typical secondary batteries such as lithium batteries that generate heat during charging and discharging, and fuel cells that use hydrogen or other fuel gases.

[0202] While the embodiments described above exemplify structures that function as orifices by providing both the outlet and discharge ports, this is not a limitation. The structure may also function as an orifice only on either the outlet or discharge port. Furthermore, the structure functioning as an orifice may not be of a single form; it may be a structure in which the throttling flow rate is appropriately adjusted for each port. For example, the throttling flow rates of the outlet and discharge ports connected to the same refrigerant flow path may be different.

[0203] Furthermore, for example, the throttling flow rates of the outlet ports connected to different refrigerant flow paths can be different, and similarly, the throttling flow rates of the discharge ports connected to different refrigerant flow paths can also be different. In this way, by appropriately providing mechanisms that function as throttling orifices in the inlet and / or outlet of each refrigerant flow path, the flow rates of the refrigerants flowing in parallel in each refrigerant flow path can be optimally set individually.

[0204] Although the substrate portion has been illustrated and described as being flat in the above embodiments, it is not limited to this. Furthermore, the forming material of at least the back side of the substrate portion is required to have thermal conductivity and resistance to refrigerant corrosion, and therefore stainless steel is used, for example.

[0205] (Effects)

[0206] The cooling system disclosed in Method 1 is a cooling system for a battery device, comprising: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack of the battery device; and a cooling plate mounted on the base plate portion. The cooling system further comprises a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path. The back side of the base plate portion forms a wall surrounding the first refrigerant flow path and the second refrigerant flow path. The cooling plate comprises a first plate forming the remaining wall surrounding the first refrigerant flow path and a second plate forming the remaining wall surrounding the second refrigerant flow path. The first plate and the second plate are mounted on the back side of the base plate portion facing the area where the battery pack is disposed.

[0207] According to the above scheme, the first refrigerant flow path and the second refrigerant flow path share the back side of the substrate portion of the housing as a surrounding wall, thus enabling efficient cooling of the battery pack inside the housing by the refrigerant such as cooling water flowing through each flow path. Furthermore, the first refrigerant flow path and the second refrigerant flow path are separated from each other, and the first plate constituting the remaining surrounding wall of the first refrigerant flow path (the surrounding wall excluding the substrate portion; the same below) and the second plate constituting the remaining surrounding wall of the second refrigerant flow path are mounted on the back side of the substrate portion facing the area where the battery pack is disposed. Therefore, in the cooling system of the battery device according to Embodiment 1, the refrigerant flow paths (the first and second refrigerant flow paths) of the cooling unit use the portion of the substrate of the housing facing the battery pack placement position (the actual cooling target substrate portion) as a surrounding wall.

[0208] Therefore, the refrigerant is less susceptible to thermal influence from areas outside the substrate being cooled, allowing it to efficiently absorb heat from the substrate and thus efficiently cool the battery pack. This contributes to improving the cooling effect of the refrigerant on the battery device.

[0209] With the increasing power output and lifespan of batteries, significant heat can sometimes be generated from the battery pack. In such cases, if there is only one refrigerant flow path in the cooling section, the refrigerant temperature will differ between the upstream and downstream sides (the downstream side will be hotter), resulting in a difference in cooling capacity. This difference is particularly pronounced in designs where the back side of the substrate portion of the housing forms part of the enclosure for the refrigerant flow path.

[0210] In the cooling system of Method 2 disclosed herein, which is based on Method 1 above, it may further include: a refrigerant supply unit that supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

[0211] According to the above scheme, since the refrigerant is supplied to the first refrigerant flow path and the second refrigerant flow path in parallel and independently, the temperature of the refrigerant flowing through one refrigerant flow path is no longer affected by the temperature of the other refrigerant flow path, and the temperature of the refrigerant flowing through the first and second refrigerant flow paths can be controlled independently. Therefore, the battery packs supplied by the first refrigerant flow path and the battery packs supplied by the second refrigerant flow path can be cooled under their respective suitable conditions (including the same conditions).

[0212] Here, supplying refrigerant independently to the first and second refrigerant flow paths means that the first and second refrigerant flow paths are parallel to each other in relation to the refrigerant supply flow paths. This includes not only providing independent refrigerant supply paths from the refrigerant supply source to each refrigerant flow path, but also diverting refrigerant from a single refrigerant supply flow path connected to the refrigerant supply source to supply refrigerant to each refrigerant flow path.

[0213] In the cooling system of Method 3 disclosed herein based on Method 2 above, the following scheme may also be adopted: the refrigerant supply unit has a refrigerant supply flow path, which has: an inlet port for taking in the refrigerant; a first outlet port for discharging the refrigerant into the first refrigerant flow path; and a second outlet port for discharging the refrigerant into the second refrigerant flow path.

[0214] According to the above scheme, a simple refrigerant supply flow path is adopted as the refrigerant supply unit for independently supplying refrigerant to the first and second refrigerant flow paths. This refrigerant supply flow path has one inlet port and two outlet ports (a first outlet port facing the first refrigerant flow path and a second outlet port facing the second refrigerant flow path). As a result, the assembly of the cooling system becomes easier, and the manufacturing costs of the cooling system, as well as the cooling components and battery devices that include the cooling system, can be reduced.

[0215] In the cooling system of Method 4 of this disclosure based on Method 3 above, the following scheme can also be adopted: the cross-sectional area of ​​the refrigerant supply flow path at the first outlet port and the second outlet port is formed to be relatively small.

[0216] According to the above scheme, the flow path cross-sectional area of ​​the first and second outlet ports is smaller than that of other parts of the refrigerant supply flow path. Therefore, the first and second outlet ports function as throttling orifices.

[0217] Since the first and second outlet ports each function as throttling orifices, they can resist the flow of refrigerant introduced into the refrigerant supply path. This prevents refrigerant from preferentially flowing into one refrigerant path. In other words, it prevents refrigerant from becoming unable to flow into a particular refrigerant path.

[0218] As a method to reduce the cross-sectional area of ​​the flow path, in addition to reducing the space within the enclosure, other components such as flow dampers can be inserted into each outlet port. In the refrigerant supply flow path, by gradually increasing the cross-sectional area of ​​each outlet port as it moves further away from the refrigerant inlet, the refrigerant supply to each flow path can be made more uniform. Furthermore, the cross-sectional area of ​​each outlet port can be adjusted according to the required cooling capacity of each refrigerant flow path.

[0219] In the cooling system of this disclosure based on the above-described method 3, the following scheme may also be adopted: the wall of the refrigerant supply flow path is separated from the base plate portion of the housing.

[0220] According to the above scheme, the enclosure of the refrigerant supply flow path is separated from the substrate portion of the housing, thereby suppressing the influence of the heat of the substrate portion on the refrigerant flowing through the refrigerant supply flow path, and thus ensuring the cooling capacity of the refrigerant supplied from each outlet port of the refrigerant supply flow path in the first and second refrigerant flow paths.

[0221] In the cooling system of this disclosure based on the above-described method 5, the following scheme may also be adopted: the enclosure of the first refrigerant flow path and the enclosure of the second refrigerant flow path are disposed between the enclosure of the refrigerant supply flow path and the substrate portion.

[0222] According to the above scheme, the first and second refrigerant flow paths are located between the refrigerant supply flow path and the substrate portion. In other words, the refrigerant supply flow path overlaps with the first and second refrigerant flow paths, and the refrigerant supply flow path is separated from the substrate portion, which serves as a heat source. Therefore, the thermal impact of the substrate portion on the refrigerant within the refrigerant supply flow path can be suppressed.

[0223] In the cooling system of this disclosure based on the above-described method 5, the following approach can also be adopted: a substrate portion that is separate from the first and second refrigerant flow paths and is not affected by the heat of the battery pack is used as the enclosure of the refrigerant supply flow path.

[0224] According to the above scheme, the refrigerant supply flow path is formed on a substrate portion that is not affected by heat from the battery pack, thus suppressing the thermal impact of the substrate portion on the refrigerant in the refrigerant supply flow path.

[0225] In the cooling system of this disclosure method 8 based on the above method 6, the following scheme can also be adopted: the interior of the housing is used to accommodate the first battery pack and the second battery pack side by side, the first refrigerant flow path is configured opposite to the first battery pack, and the second refrigerant flow path is configured opposite to the second battery pack.

[0226] According to the above scheme, the first refrigerant flow path and the second refrigerant flow path are respectively configured opposite to the first battery pack and the second battery pack, thus enabling efficient cooling of each battery pack.

[0227] In the cooling system of this disclosure based on the above-described method 8, the following scheme may also be adopted: the refrigerant supply path overlaps with the first refrigerant path and the second refrigerant path, and is arranged perpendicularly to the arrangement direction of these refrigerant paths.

[0228] According to the above scheme, the refrigerant supply path is configured to overlap with the first and second refrigerant flow paths, and a first outlet port is provided at the position of the refrigerant supply path opposite to the first refrigerant flow path, and similarly, a second outlet port is provided at the position opposite to the second refrigerant flow path. In this scheme, by arranging the refrigerant supply path perpendicular to the arrangement direction of the first and second refrigerant flow paths, the length of the refrigerant supply path can be shortened as much as possible. Therefore, the thermal influence of the substrate portion on the refrigerant within the refrigerant supply path can be suppressed.

[0229] In the cooling system of this disclosure method 10 based on the above method 9, the following scheme can also be adopted: in plan view, the refrigerant supply flow path is arranged at the end edge of the first refrigerant flow path and the end edge of the second refrigerant flow path.

[0230] In the cooling system of this disclosure based on the above-mentioned method 9, the following scheme can also be adopted: in plan view, the refrigerant supply flow path is configured in a way that divides the first refrigerant flow path and the second refrigerant flow path, preferably in a way that divides them into two equal parts.

[0231] In the cooling system of embodiment 12 disclosed herein based on embodiment 3 above, the following scheme may also be adopted: the refrigerant supply path, the first refrigerant path and the second refrigerant path are arranged in the same plane parallel to the back surface of the substrate.

[0232] According to the above solution, for example, when there is a non-battery pack placement area at the periphery of the substrate, by arranging the refrigerant supply flow path in the periphery area, the refrigerant supply flow path, the first refrigerant flow path and the second refrigerant flow path can be arranged in the same plane, thereby reducing the height of the cooling plate (the dimension in the substrate thickness direction).

[0233] In the cooling system of this disclosure based on the above-described method 12, the following scheme may also be adopted: the refrigerant supply flow path is arranged around the periphery of the first refrigerant flow path and the periphery of the second refrigerant flow path in a manner that surrounds the first refrigerant flow path and the second refrigerant flow path.

[0234] According to the above scheme, the refrigerant supply paths are configured to surround each refrigerant flow path, thus the distance between the refrigerant flow paths and the refrigerant supply paths is close. As a result, the cooling plate can be made compact.

[0235] In the cooling system of embodiment 14 of this disclosure based on the above embodiment 12, the following scheme may also be adopted: the first plate has a first refrigerant supply flow path forming recess, the second plate has a second refrigerant supply flow path forming recess, the first and second refrigerant supply flow path forming recesses are connected by joining the first and second plates, and the refrigerant supply flow path is formed by the first and second refrigerant supply flow path forming recesses after joining and the back side of the substrate portion.

[0236] According to the above scheme, each of the independent first and second plates has a region for forming the refrigerant supply flow path (the first and second refrigerant supply flow path forming recesses), which helps to achieve high functionality of the component and even reduce the number of components. In addition, a cooling plate with a refrigerant supply flow path can be formed simply by connecting the first and second plates together, which helps to suppress manufacturing costs.

[0237] By connecting the first and second plates as described above to form a cooling plate, the first and second refrigerant flow paths can be easily added or removed. Of course, by preparing the third to nth plates with the same or similar structure as the first and second plates described above, the refrigerant flow paths can be arbitrarily added depending on the shape of the back side of the substrate.

[0238] In the cooling system of embodiment 15 of this disclosure based on embodiment 14 described above, the following scheme may also be adopted: the first plate has a flat first plate connecting portion that is continuous with the recess for forming the first refrigerant supply flow path, the second plate has a flat second plate connecting portion that is continuous with the recess for forming the second refrigerant supply flow path, the first plate connecting portion and the second plate connecting portion are connected when the first plate and the second plate are joined together, the base plate portion has a stepped portion that is offset toward the front side of the base plate portion at the portion opposite to the first plate connecting portion and the second plate connecting portion, and the refrigerant supply flow path is formed through the stepped portion and the first and second plate connecting portions.

[0239] According to the above scheme, by making the connecting part of the first and second plates flat, the welding operation between them becomes easier. Here, flat means that the plate-shaped components constituting the first and second plates are not subjected to any roughing or uneven processing. In addition, flat includes generally flat.

[0240] In the cooling system of the present disclosure based on the above-described method 15, the following scheme may also be adopted: the first plate connecting part and the second plate connecting part are a plate-shaped component, one end of which is connected to the first refrigerant supply flow path forming recess and the other end is connected to the second refrigerant supply flow path forming recess.

[0241] According to the above solution, the protruding components from the first and second plates are replaced with inexpensive flat plate-shaped components, thus eliminating the need for protruding components. Therefore, the yield rate during the manufacturing of each plate is increased, thereby helping to reduce manufacturing costs.

[0242] The cooling assembly involved in Method 17 of this disclosure may include: the cooling system based on any of Methods 1 to 16 above; and a housing, which houses the battery pack of the battery device and includes the substrate portion of the cooling system.

[0243] According to the above scheme, it can achieve the same effect as the cooling system involved in methods 1 to 16 of this disclosure.

[0244] In the cooling assembly of this disclosure based on the above-described method 17, the following scheme may also be adopted: the cooling assembly has a refrigerant supply section that supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel and independently, the housing has a first side plate portion with a U-shaped cross section, the base plate portion has an extension edge, the first side plate portion is connected to the extension edge to form a cantilever portion, the refrigerant supply section has a refrigerant supply flow path, and the inlet port of the refrigerant supply flow path for taking in the refrigerant is open in the cantilever portion.

[0245] According to the above scheme, at least one side plate portion (first side plate portion) of the housing is designed with a U-shaped cross-section, thereby ensuring the shape maintenance of the entire housing. The extension edge of the base plate portion is connected to the first side plate portion to form an overhang. The first side plate portion with a U-shaped cross-section has high shape maintenance, i.e., high mechanical rigidity, so it is not easily deformed even when subjected to external impact. Therefore, the piping from the refrigerant pump located outside the cooling assembly can be stably arranged in the overhang portion. Furthermore, by opening the inlet port of the refrigerant supply flow path in the overhang portion, the connection between the refrigerant supply flow path and the external refrigerant piping is stabilized.

[0246] In the cooling assembly of this disclosure based on the above-described method 18, the following scheme may also be adopted: the housing has the first side plate portion and the second side plate portion with a U-shaped cross section, the first side plate portion being wider than the second side plate portion, and a refrigerant supply pipe for supplying the refrigerant to the inlet port is disposed on the first side plate portion.

[0247] According to the above scheme, both the first and second side plates are designed with a U-shaped cross-section, thus further ensuring the overall mechanical rigidity of the casing. By designing the first side plate, which is used to house the refrigerant supply pipe, to be wider, and the second side plate, which does not require the corresponding component, to be narrower, the internal volume of the casing can be maximized while ensuring the overall mechanical rigidity of the casing.

[0248] The battery device involved in this disclosure 20 may include: a cooling system based on any of the above-described embodiments 1 to 16; a housing containing a base plate portion of the cooling system; and a battery pack housed inside the housing.

[0249] According to the above scheme, it can achieve the same effect as the cooling system involved in methods 1 to 16 of this disclosure.

[0250] The battery device according to Method 21 disclosed herein includes: a housing for accommodating a battery pack; and a cooling section disposed on the back side of a substrate portion of the housing, wherein the cooling section includes a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the back side of the substrate portion forms a wall surrounding the first refrigerant flow path and the second refrigerant flow path, the remaining walls of the first refrigerant flow path are formed by a first plate, the remaining walls of the second refrigerant flow path are formed by a second plate, and the first plate and the second plate are mounted on the back side of the substrate portion facing the area where the battery pack is disposed.

[0251] The cooling method disclosed in Method 22 is a cooling method for a battery device, wherein the battery device includes: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack; a cooling plate mounted on the base plate portion; the battery device further includes a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path; the back side of the base plate portion forms a wall surrounding the first refrigerant flow path and the second refrigerant flow path; the cooling plate includes a first plate forming the remaining wall surrounding the first refrigerant flow path and a second plate forming the remaining wall surrounding the second refrigerant flow path; the first plate and the second plate are mounted on the back side of the base plate portion facing the area where the battery pack is disposed; in this cooling method, refrigerant is supplied to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

[0252] The cooling plate disclosed in Method 23 is used to be mounted to the base plate portion of the housing and together with the base plate portion constitutes a cooling system for the battery device. The interior of the housing is used to accommodate the battery pack of the battery device. The back side of the base plate portion forms a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path. The cooling plate includes: a first plate having a first refrigerant flow path forming recess for forming the remaining walls of the first refrigerant flow path; a second plate having a second refrigerant flow path forming recess for forming the remaining walls of the second refrigerant flow path; and a refrigerant supply section forming recess for supplying refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

[0253] In the cooling plate of embodiment 24 of this disclosure based on embodiment 23 described above, the following scheme may also be adopted: the refrigerant flow path forming recess, the first refrigerant flow path forming recess, and the second refrigerant flow path forming recess are arranged in the same plane parallel to the back surface of the substrate portion.

[0254] In the cooling plate of embodiment 25 of this disclosure based on the above embodiment 24, the following scheme may also be adopted: the first plate and the second plate are independent components, the first plate also has a first refrigerant supply flow path forming recess, and the second plate also has a second refrigerant supply flow path forming recess. Through the mutual engagement of the first plate and the second plate, the first refrigerant supply flow path forming recess and the second refrigerant supply flow path forming recess are connected to form part of the refrigerant supply flow path forming recess.

[0255] In the cooling system of the present disclosure based on the above-described method 2, the following approach can also be adopted: the cooling system further includes a refrigerant discharge section formed on the front side of the substrate.

[0256] According to the above scheme, the refrigerant discharge section is located on the side (front) of the substrate opposite to the side where the refrigerant supply section and the refrigerant flow path are formed, thus ensuring the design freedom of the refrigerant discharge section, the refrigerant supply section and the refrigerant flow path.

[0257] In the cooling system of this disclosure based on the above-described method 26, the following approach may also be adopted: the refrigerant discharge section is formed on the front side of the substrate, opposite to the back side for which the refrigerant supply section is formed.

[0258] According to the above solution, the refrigerant supply section and the refrigerant discharge section can be integrated into the same area on the substrate. Therefore, the area of ​​the refrigerant flow path configuration region on the substrate can be more comprehensively ensured.

[0259] The above description, taken in conjunction with the accompanying drawings, illustrates embodiments with specific configurations for the purpose of describing this disclosure. However, the scope of this disclosure should not be construed as being limited to these embodiments. It is self-evident that appropriate modifications can be made within the scope of the overall described technical concept and the matters set forth in the specification.

[0260] <Explanation of Figure Markers>

[0261] 2. 202, 402, 502, 702, 802, 1002 substrate department

[0262] A1, A11, A31, A41 1st refrigerant flow path

[0263] A2, A12, A32, A42 2nd refrigerant flow path

[0264] 411a, 511a, 611a, 711a, 811a, 1011a - Plate 1 (Metal Plate)

[0265] 411b, 511b, 611b, 711b, 811b, 1011b - Second Plate (Metal Plate)

[0266] C1, C2, C11, C12, C41 Refrigerant Supply Flow Path

[0267] D1, D2, D3, D4, D11, D12, D41 refrigerant discharge flow path

[0268] S-layer unit

Claims

1. A cooling system for a battery device, comprising: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack of the battery device; and a cooling plate mounted on the base plate portion, the cooling system further comprising a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the back side of the base plate portion forming a wall between the first refrigerant flow path and the second refrigerant flow path, the cooling plate comprising a first plate forming the remaining wall of the first refrigerant flow path and a second plate forming the remaining wall of the second refrigerant flow path, the first plate and the second plate being mounted on the back side of the base plate portion facing the area where the battery pack is disposed.

2. The cooling system according to claim 1, further comprising: a refrigerant supply unit that supplies refrigerant in parallel and independently to the first refrigerant flow path and the second refrigerant flow path.

3. The cooling system according to claim 2, wherein, The refrigerant supply unit has a refrigerant supply path, which includes: an inlet port for taking in the refrigerant; a first outlet port for discharging the refrigerant into the first refrigerant path; and a second outlet port for discharging the refrigerant into the second refrigerant path.

4. The cooling system according to claim 3, wherein, The refrigerant supply path has a smaller cross-sectional area at the first and second outlet ports.

5. The cooling system according to claim 3, wherein, The wall surrounding the refrigerant supply path is separated from the base plate portion of the housing.

6. The cooling system according to claim 5, wherein, The walls of the first refrigerant flow path and the walls of the second refrigerant flow path are disposed between the walls of the refrigerant supply flow path and the substrate portion.

7. The cooling system according to claim 5, wherein, The substrate portion, which is separate from the first and second refrigerant flow paths and is not affected by the heat of the battery pack, serves as the enclosure of the refrigerant supply flow path.

8. The cooling system according to claim 6, wherein, The interior of the housing is used to house the first battery pack and the second battery pack side by side, with the first refrigerant flow path positioned opposite the first battery pack and the second refrigerant flow path positioned opposite the second battery pack.

9. The cooling system according to claim 8, wherein, The refrigerant supply path overlaps with the first and second refrigerant paths and is arranged perpendicularly to the arrangement direction of these refrigerant paths.

10. The cooling system according to claim 9, wherein, Viewed in plan, the refrigerant supply path is disposed at the end edge of the first refrigerant path and the end edge of the second refrigerant path.

11. The cooling system according to claim 9, wherein, Viewed from a planar perspective, the refrigerant supply path is configured in a way that divides the first refrigerant path and the second refrigerant path, preferably in a way that divides them into two equal parts.

12. The cooling system according to claim 3, wherein, The refrigerant supply path, the first refrigerant path, and the second refrigerant path are arranged in the same plane parallel to the back surface of the substrate.

13. The cooling system according to claim 12, wherein, The refrigerant supply path is arranged around the periphery of the first refrigerant path and the periphery of the second refrigerant path, in a manner that surrounds the first refrigerant path and the second refrigerant path.

14. The cooling system according to claim 12, wherein, The first plate has a recess for forming a first refrigerant supply flow path, and the second plate has a recess for forming a second refrigerant supply flow path. The first and second refrigerant supply flow path recesses are connected by joining the first and second plates. The refrigerant supply flow path is formed by the joined first and second refrigerant supply flow path recesses and the back side of the substrate portion.

15. The cooling system according to claim 14, wherein, The first plate has a flat first plate connecting portion that is continuous with the recess for forming the first refrigerant supply flow path, and the second plate has a flat second plate connecting portion that is continuous with the recess for forming the second refrigerant supply flow path. The first plate connecting portion and the second plate connecting portion are connected when the first plate and the second plate are joined together. The base plate portion has a stepped portion that is offset toward the front side of the base plate portion at the portion opposite to the first plate connecting portion and the second plate connecting portion. The refrigerant supply flow path is formed through the stepped portion and the first and second plate connecting portions.

16. The cooling system according to claim 15, wherein, The first plate connecting portion and the second plate connecting portion are configured as a plate-shaped component, one end of which is connected to the first refrigerant supply flow path forming recess and the other end is connected to the second refrigerant supply flow path forming recess.

17. A cooling assembly comprising: a cooling system according to any one of claims 1 to 16; and a housing having an interior for housing a battery pack of a battery device, and including a substrate portion of the cooling system.

18. The cooling assembly of claim 17, wherein, The cooling assembly includes a refrigerant supply section that supplies refrigerant in parallel and independently to the first refrigerant flow path and the second refrigerant flow path. The housing includes a first side plate portion with a U-shaped cross-section. The base plate portion includes an extension edge. The first side plate portion is connected to the extension edge to form a cantilever portion. The refrigerant supply section includes a refrigerant supply flow path. An inlet port of the refrigerant supply flow path for taking in the refrigerant is open in the cantilever portion.

19. The cooling assembly of claim 18, wherein, The housing includes a first side plate portion and a second side plate portion with a U-shaped cross-section. The first side plate portion is wider than the second side plate portion, and a refrigerant supply pipe for supplying refrigerant to the inlet port is disposed on the first side plate portion.

20. A battery device comprising: a cooling system according to any one of claims 1 to 16; a housing having a base portion including the cooling system; and a battery pack housed inside the housing.

21. A battery device comprising: a housing for accommodating a battery pack; and a cooling section disposed on the back side of a substrate portion of the housing, wherein... The cooling section includes a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path. The back side of the substrate portion forms the enclosure walls of the first refrigerant flow path and the second refrigerant flow path. The remaining enclosure walls of the first refrigerant flow path are formed by a first plate, and the remaining enclosure walls of the second refrigerant flow path are formed by a second plate. The first plate and the second plate are mounted on the back side of the substrate portion facing the area where the battery pack is disposed.

22. A cooling method for a battery device, wherein, The battery device includes: a base plate portion of a housing, wherein the interior of the housing is used to accommodate a battery pack; and a cooling plate mounted on the base plate portion; the battery device also includes a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the back side of the base plate portion forming a wall between the first refrigerant flow path and the second refrigerant flow path, the cooling plate including a first plate forming the remaining wall of the first refrigerant flow path and a second plate forming the remaining wall of the second refrigerant flow path, the first plate and the second plate being mounted on the back side of the base plate portion facing the area where the battery pack is disposed, and in this cooling method, refrigerant is supplied to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

23. A cooling plate, which is mounted to a base plate portion of a housing and together with said base plate portion constitutes a cooling system for a battery device, wherein, The interior of the housing is used to accommodate the battery pack of the battery device. The back side of the substrate portion forms the enclosure of a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path. The cooling plate includes: a first plate having a first refrigerant flow path forming recess for forming the remaining enclosure of the first refrigerant flow path; a second plate having a second refrigerant flow path forming recess for forming the remaining enclosure of the second refrigerant flow path; and a refrigerant supply section forming recess for supplying refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel and independently.

24. The cooling plate according to claim 23, wherein, The refrigerant flow path forming recess, the first refrigerant flow path forming recess, and the second refrigerant flow path forming recess are arranged in the same plane parallel to the back surface of the substrate.

25. The cooling plate according to claim 24, wherein, The first plate and the second plate are independent components. The first plate also has a first refrigerant supply flow path forming recess, and the second plate also has a second refrigerant supply flow path forming recess. Through the mutual engagement of the first plate and the second plate, the first refrigerant supply flow path forming recess and the second refrigerant supply flow path forming recess are connected to form part of the refrigerant supply flow path forming recess.

26. The cooling system according to claim 2, wherein, The cooling system also includes a refrigerant discharge section formed on the front side of the substrate.

27. The cooling system according to claim 26, wherein, The refrigerant discharge section is formed on the front side of the substrate, opposite to the back side for which the refrigerant supply section is formed.

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