Hardware hazard monitoring method and device, electronic equipment and storage medium

Abstract

The invention discloses a hardware hazard monitoring method and device, electronic equipment and a storage medium, and relates to the field of product design, and the method comprises the steps: carrying out the hardware function recognition of obtained hardware demand description contents, and determining a function unit contained in a hardware demand product; and determining the fault mode of the functional unit according to the description content of the function realized by the functional unit and the interface associated with the functional unit. And according to the historical statistical data of the occurrence condition of the fault mode, the occurrence probability of the fault mode is evaluated, and a fault rate score representing the severity of the fault probability is obtained. And performing fault severity evaluation on the functional unit according to the influence degree on other functional units in the required hardware product after the functional unit fails. And finally, according to the fault rate score and the severity score, determining a risk hazard value of the functional unit, and according to an interval range in which the risk hazard value is located, determining a corresponding processing suggestion. Guidance is provided for subsequent hardware design, and product reliability is improved.

Description

Technical Field

[0001] This application relates to the field of product design technology, and in particular to a hardware hazard monitoring method, device, electronic device, and storage medium. Background Technology

[0002] Instrumentation and control products typically refer to core equipment and systems used in industrial processes (especially in critical sectors such as nuclear power, chemical industry, and electric power) to detect, measure, display, control, and protect process parameters (such as temperature, pressure, flow rate, and liquid level). They integrate sensors, actuators, controllers, and other devices, and are key equipment for achieving industrial automation and intelligence. Therefore, improving the reliability of instrumentation and control products has become an urgent problem to be solved. Summary of the Invention

[0003] In view of the above problems, this application provides a hardware hazard monitoring method, device, electronic device, and storage medium to improve product reliability. The specific solution is as follows:

[0004] The first aspect of this application provides a hardware hazard monitoring method, including:

[0005] The hardware function is identified from the obtained hardware requirement description to determine the functional units included in the required hardware product.

[0006] Based on the description of the functions implemented by the functional unit and the interfaces associated with the functional unit, the fault mode of the functional unit is determined.

[0007] Based on historical statistical data on the occurrence of the failure modes, the probability of occurrence of the failure modes is evaluated to obtain a failure rate score that characterizes the severity of the failure probability.

[0008] Based on the degree of impact of the failure of the functional unit on other functional units in the required hardware product, the severity of the failure of the functional unit is assessed to obtain a severity score that characterizes the scope of the failure's impact.

[0009] Based on the failure rate score and the severity score, the risk hazard value of the functional unit is determined, and corresponding handling suggestions are determined based on the range of the risk hazard value.

[0010] In one possible implementation, the hardware hazard monitoring method further includes:

[0011] Based on the degree of influence on the failure probability, the hardware design results data of the functional unit are used to identify components, and at least one target component in the functional unit is determined.

[0012] The failure rate score is updated based on the degree of influence of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score.

[0013] Based on the mapping relationship between the failure modes and the fault modes, new fault modes are determined, and the severity score is updated based on the failure of the functional units caused by the new fault modes.

[0014] In one possible implementation, when the failure mode is natural component failure, the failure rate score is updated based on the degree of influence of the target component's failure mode on the failure rate of the functional unit, resulting in an updated failure rate score, including:

[0015] Based on the failure mode mapping relationship, the failure rates of each target component that causes the same type of failure mode of the functional unit are superimposed to obtain the total failure rate;

[0016] Based on the interval in which the sum of the failure rates falls, the current failure rate score is determined, and based on the comparison between the current failure rate score and the failure rate score, the updated failure rate score is obtained.

[0017] In one possible implementation, when the failure mode is component failure caused by product manufacturing process, the failure rate score is updated based on the degree of influence of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score, including:

[0018] The failure rate score is updated based on the location of the target component and whether there are components with heat generation exceeding the threshold around the location, resulting in the updated failure rate score.

[0019] In one possible implementation, when the failure mode is component failure caused by abnormal operating conditions, the failure rate score is updated based on the degree of influence of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score, including:

[0020] Based on the external interfaces of the associated functional units and other affected functional units under the abnormal operating conditions, the associated components are determined, and the failure rate score is updated based on the failure mode of the associated components.

[0021] In one possible implementation, the hardware hazard monitoring method further includes:

[0022] Based on the fault hazards associated with the functional units described in the hardware design phase, a hazard identification method is determined, and fault hazard identification is performed according to the identification process indicated by the hazard identification method.

[0023] In one possible implementation, the severity assessment of the functional unit based on its impact on other functional units in the required hardware product after failure, to obtain a severity score characterizing the scope of the failure's impact, includes:

[0024] The severity level is assessed based on the interface status of the interface associated with the functional unit and the fault status of other functional units associated with the interface, resulting in a severity score.

[0025] A second aspect of this application provides a hardware hazard monitoring device, comprising:

[0026] The hardware function identification module is used to identify the hardware functions in the obtained hardware requirement description and determine the functional units contained in the required hardware product.

[0027] The fault mode determination module is used to determine the fault mode of the functional unit based on the description of the function implemented by the functional unit and the interface associated with the functional unit.

[0028] The failure rate scoring module is used to evaluate the probability of occurrence of the failure mode based on historical statistical data of the occurrence of the failure mode, and obtain a failure rate score that characterizes the severity of the failure probability.

[0029] The severity rating module is used to assess the severity of a functional unit based on its impact on other functional units in the required hardware product after the functional unit fails, thereby obtaining a severity rating that characterizes the scope of the failure's impact; and...

[0030] The risk and hazard determination module is used to determine the risk and hazard value of the functional unit based on the failure rate score and the severity score, and to determine the corresponding handling suggestions based on the range of the risk and hazard value.

[0031] A third aspect of this application provides a computer program product including computer-readable instructions that, when executed on an electronic device, cause the electronic device to implement the hardware hazard monitoring method of the first aspect or any implementation thereof.

[0032] A fourth aspect of this application provides an electronic device, including at least one processor and a memory connected to the processor, wherein:

[0033] The memory is used to store computer programs;

[0034] The processor is used to execute the computer program so that the electronic device can implement the hardware hazard monitoring method of the first aspect or any implementation thereof.

[0035] The fifth aspect of this application provides a computer storage medium carrying one or more computer programs, which, when executed by an electronic device, enable the electronic device to implement the hardware hazard monitoring method of the first aspect or any implementation thereof.

[0036] By employing the above technical solution, the hardware hazard monitoring method provided in this application identifies the functional units contained in the required hardware product by performing hardware function identification on the obtained hardware requirement description. Based on the description of the functions implemented by the functional units and the interfaces associated with them, the failure modes of the functional units are determined. Based on historical statistical data of the occurrence of failure modes, the probability of occurrence of the failure modes is evaluated, resulting in a failure rate score characterizing the severity of the failure probability. Based on the impact of the functional unit's failure on other functional units in the required hardware product, the severity of the failure is evaluated, resulting in a severity score characterizing the scope of the failure's impact. Finally, based on the failure rate score and the severity score, the risk hazard value of the functional unit is determined, and corresponding handling suggestions are determined based on the range of the risk hazard value. This achieves the identification of fault hazards existing in the hardware requirement stage, thereby timely discovering defects at the design source of the hardware product, providing guidance for subsequent hardware design, and improving the reliability of subsequent products. Attached Figure Description

[0037] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0038] Figure 1 A flowchart of a hardware hazard monitoring method provided in this application;

[0039] Figure 2 A structural diagram of a hardware function provided in this application;

[0040] Figure 3 A structural diagram of another hardware function provided in this application;

[0041] Figure 4 The structural diagram of the hardware sub-functions provided in this application;

[0042] Figure 5A structural diagram of a hardware hazard monitoring device provided in this application;

[0043] Figure 6 This is a structural diagram of an electronic device provided in this application. Detailed Implementation

[0044] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0045] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0046] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0047] This application provides a hardware hazard monitoring method. The hardware hazard monitoring method of this application embodiment will be described in detail below with reference to the accompanying drawings.

[0048] Reference Figure 1 , Figure 1 This is a flowchart illustrating a hardware hazard monitoring method provided in an embodiment of this application, as follows: Figure 1 As shown in the figure, the hardware hazard monitoring method provided in this application embodiment may include steps S101 to S105, which are described in detail below.

[0049] S101. The hardware function is identified from the obtained hardware requirement description to determine the functional units included in the required hardware product.

[0050] Specifically, in the hardware requirements phase, there are no complex relationships between the internal hardware functional units of a single product, and the impact of external interface failures on the system is generally clear. Here, a functional unit refers to the smallest indivisible unit contained within a hardware product. The smallest functional unit can be determined by identifying the hardware structure diagram from the requirements phase. Since this diagram is drawn based on the hardware structure in the requirements document, it reflects information about hardware functional units, internal interfaces (interfaces between hardware functional units), and external interfaces (interfaces to the outside world). During identification, a large language model can be invoked, inputting the requirements document and corresponding prompts to parse the principle diagram from the requirements document, guiding the large language model to identify the smallest functional unit. The obtained hardware functional units cover the hardware requirements; for details, refer to... Figure 2 The hardware functional structure block diagram of the product shown is illustrated, and the functional units obtained after identification are shown in Table 1 below:

[0051] Table 1

[0052]

[0053] S102. Based on the description of the functions implemented by the functional unit and the interfaces associated with the functional unit, determine the fault mode of the functional unit.

[0054] Specifically, the corresponding fault modes can be determined according to the functional units as a whole. The fault mode is the manifestation of a failure (malfunction) of a certain part of the equipment. For example, for a display screen, there are three fault modes: black screen, screen flickering, and partial garbled text.

[0055] When performing fault mode identification, the specific functions of the hardware functional units and their associated internal and external interfaces can be used for identification. Specifically, the functional unit and its associated structural identifier can be used as lookup keys to match values ​​from the database, thereby determining the corresponding fault mode. For example, fault modes may include: potential fault occurrence, partial loss of function, complete loss of function, abnormal electrical characteristics of internal interfaces (such as power short circuit), and abnormal electrical characteristics of external interfaces (exhibiting abnormal states such as overvoltage, overcurrent, high or low resistance, open circuit, and short circuit).

[0056] S103. Based on historical statistical data on the occurrence of failure modes, assess the probability of occurrence of failure modes to obtain a failure rate score that characterizes the severity of the failure probability.

[0057] Specifically, when assessing the failure rate of a failure mode, it can be matched with the failure rate statistics from historical data. Further classification can be made based on the failure rate score, as shown in Table 2 below:

[0058] Table 2

[0059]

[0060] The OPR score represents the corresponding failure rate score.

[0061] S104. Based on the degree of impact of the failure of a functional unit on other functional units in the required hardware product, conduct a fault severity assessment of the functional unit to obtain a severity score that characterizes the scope of the fault's impact.

[0062] Specifically, among the numerous hardware functions of a product, not all functions bear the responsibility of providing security within the overall protection system. The failure of a product hardware function that does not perform a security function will not compromise the system's security capabilities. Severity levels can be assessed based on the interface status of the interfaces associated with the functional units, as well as the fault status of other functional units associated with those interfaces, resulting in a severity score.

[0063] Based on the characteristics of the product's hardware circuitry, the impact of a malfunction can be categorized into several scenarios, as shown in Table 3:

[0064] Table 3

[0065]

[0066] Based on the above classification, the system can be further graded according to the degree of impact of the failure on the system's safety functions, as shown in Table 4.

[0067] Table 4

[0068]

[0069] The ESR rating represents the severity level.

[0070] S105. Based on the failure rate score and severity score, determine the risk hazard value of the functional unit, and determine the corresponding handling recommendations based on the range of the risk hazard value.

[0071] Specifically, the Risk Hazard Value (RPN) is equal to the product of the Severity Rating (ESR) and the Failure Rate Rating (OPR) of the failure mode: RPN = ESR × OPR.

[0072] The higher the RPN number, the greater the hazard. Based on the hazard analysis score, the following treatment recommendations are given according to Table 5:

[0073] Table 5

[0074]

[0075] Considering that common compensation measures include redundancy, failure protection, component derating, electrical isolation, and additional fault diagnosis measures, before formulating compensation measures, it is advisable to first identify the hazard control methods already implemented during the hardware requirements phase and the system design phase, based on the description in the hardware requirements. Fault detection methods for fault diagnosis include the following, as shown in Table 6:

[0076] Table 6

[0077]

[0078] Based on the hazard assessment results and the identified fault detection methods already implemented in the hardware requirements, identify which functional units in the product require additional compensation measures for their failure modes. For example, failure modes with an RPN score greater than 15 require compensation measures. For instance, the "channel power failure" failure mode in the "IO channel" functional unit has an RPN score of 20 (representing a relatively high hazard), so compensation measures are needed for this failure mode. These compensation measures include: improving product design (e.g., adding fault diagnosis functions), adjusting system design (e.g., implementing functional redundancy design), and using management methods to enforce constraints (e.g., standardizing operating requirements in the product user manual). The final overall results of hardware hazard monitoring are shown in Table 7.

[0079] Table 7

[0080]

[0081] This hardware hazard monitoring method enables the identification of fault hazards existing in the hardware requirements stage, thereby discovering defects in a timely manner at the source of hardware product design, providing guidance for subsequent hardware design, and improving the reliability of subsequent products.

[0082] In another embodiment, considering that circuit design, component selection, and PCB design are already defined during the hardware design phase, the hazard analysis structure is updated based on this defined design information, thereby further improving the reliability of hazard monitoring. This hardware hazard monitoring method also includes the following processing steps:

[0083] Step 11: Identify components in the hardware design results data of the functional unit according to their impact on the probability of failure, and determine at least one target component in the functional unit.

[0084] Step 12: Update the failure rate score based on the impact of the failure mode of the target component on the failure rate of the functional unit, and obtain the updated failure rate score.

[0085] Step 13: Based on the mapping relationship between failure modes and fault modes, determine the new fault modes, and update the severity score based on the failure of the functional units caused by the new fault modes.

[0086] Specifically, introducing new hazards during the hardware design phase can include the following aspects:

[0087] 1) A new fault mode has appeared;

[0088] 2) The severity level of existing failure modes has been increased;

[0089] 3) The probability of the hazards of the original failure mode occurring increases.

[0090] By identifying the circuit block diagrams in the hardware design phase, we can determine which circuits and key components are included in the sub-functions of the hardware functional units. For example, referring to... Figure 3 As shown, during the requirements phase, the granularity of product hardware functions is relatively coarse. For example, for an I / O product, during the requirements phase, it is believed that the product contains three functional units: power supply, I / O function, and communication function. Each function is implemented through an independent circuit board, and the boards are connected by cables.

[0091] During the design phase, the power supply function on this circuit board further includes many sub-functions, such as... Figure 4 As shown, the circuit is subdivided into protection functions, filtering functions, DC / DC conversion functions, and fault detection functions. During identification, the entire schematic can be divided into multiple functional unit circuits according to their functions and represented in tabular form, as shown in Table 8 below:

[0092] Table 8

[0093]

[0094] Key components include core components that make up the functional circuit and components with high failure rates identified based on technical experience. For example, for a DC / DC conversion function, the circuit consists of a DC / DC power conversion module plus discrete components such as capacitors and resistors. In this functional circuit, the DC / DC conversion module is the core component and also the component with a relatively high failure rate; therefore, it is identified as a key component of this functional circuit.

[0095] The failure rate refers to the expected number of times an item will fail in a given mode per unit time, and the unit of failure rate is fit. For each type of component, there is a relevant failure model and how to select or calculate each parameter (failure factor) in that model. The failure rate of a component can be calculated based on the failure model. Then, based on the percentage of failure rates for different failure modes, the failure rate for a specific failure mode can be obtained. For example, a surface-mount thick-film resistor has a failure rate of 5 fits and three failure modes: open circuit, short circuit, and parameter drift, with failure rate percentages of 30%, 40%, and 30%, respectively. Therefore, the failure rates for open circuit, short circuit, and parameter drift are 1.5 fits, 2 fits, and 1.5 fits, respectively. Analyzing the circuit structure, we can determine the failure modes of the entire functional circuit when the resistor experiences open circuit, short circuit, and parameter drift. For example, in a DC / DC power conversion circuit, an open circuit in a resistor results in no voltage output; a short circuit results in overvoltage output; and parameter drift causes voltage drift in the circuit's output. Therefore, the three failure modes of this resistor lead to three corresponding fault modes in the entire DC / DC conversion circuit: no voltage output, output overvoltage, and output voltage drift. By analyzing each component in the circuit one by one in this way, and then summarizing the results, we can obtain all the failure modes of this functional circuit, as well as their corresponding failure rates (the sum of the failure rates of all components that cause a certain failure mode in the functional circuit).

[0096] Hazard analysis can be performed on newly added failure modes following the hazard analysis process at the hardware requirement stage. The main factors determining the failure rate of hardware functional units are as follows:

[0097] 1) The natural failure of components under normal operating conditions leads to the failure of circuit function;

[0098] 2) Poor product process design leads to premature failure of components (including PCB);

[0099] 3) Abnormal operating conditions cause premature failure of components in the circuit.

[0100] When the failure mode is natural component failure, the failure rate score is updated based on the impact of the target component's failure mode on the functional unit's failure rate, resulting in an updated failure rate score, which may specifically include:

[0101] Based on the failure mode mapping relationship, the failure rates of each target component that causes the same type of failure mode in the functional unit are superimposed to obtain the total failure rate.

[0102] The current failure rate score is determined based on the interval in which the sum of failure rates falls, and the updated failure rate score is obtained based on the comparison between the current failure rate score and the failure rate score.

[0103] Specifically, based on the above analysis, the overall failure rate (the sum of the failure rates of all components corresponding to the failure modes) for each failure mode, and the corresponding relationship between the failure rate and failure rate score of the above functional unit circuits are shown in Table 9 below:

[0104] Table 9

[0105]

[0106] It can be seen that as the failure rate gradually increases, the failure rate score gradually increases.

[0107] When the failure mode is component failure caused by product manufacturing process, the failure rate score is updated based on the impact of the target component's failure mode on the functional unit's failure rate, resulting in an updated failure rate score, which may specifically include:

[0108] The failure rate score is updated based on the location of the target component and whether there are components around the target component whose heat generation exceeds the threshold.

[0109] Specifically, a comprehensive judgment can be made by identifying the design location in the design drawing and the situation of nearby heat-generating devices. For example, if one or more of the following conditions exist, the failure rate of the corresponding failure mode of the sub-functional unit where the component is located will be increased by one level (that is, the failure rate level shown in Table 9 will be increased by one level, and the corresponding score will also be increased by one level).

[0110] 1) The components are positioned too close to components that generate a lot of heat on the PCB;

[0111] 2) Surface mount components are positioned too close to mounting screw holes, equipment housings, or the edges of other structural components on the PCB;

[0112] 3) Components need to be disassembled during production assembly, testing, calibration, and repair.

[0113] When the failure mode is component failure due to abnormal operating conditions, the failure rate score is updated based on the impact of the target component's failure mode on the functional unit's failure rate. The updated failure rate score can specifically include:

[0114] Based on the external interfaces of the associated functional units and other affected functional units under abnormal operating conditions, the associated components are identified, and the failure rate score is updated according to the failure mode of the associated components.

[0115] Specifically, when abnormal operating conditions occur, the failure rate score is updated by identifying the overstress damage or failure of components caused by the operating conditions.

[0116] Furthermore, based on the fault severity scoring method in the hazard analysis methodology of the requirements phase, the newly added fault modes are scored for severity. Fault severity reflects the impact on product safety-related functions, including the scope of the fault's impact and the impact of product interface faults on the safety-related functions of other hardware devices in the system.

[0117] In some embodiments, to assist users in making more precise hardware improvements and increase product reliability, the hardware hazard monitoring method further includes the following processing steps:

[0118] Based on the fault hazards associated with the functional units in the hardware design phase, determine the hazard identification method, and perform fault hazard identification according to the identification process indicated by the hazard identification method.

[0119] Specifically, for hazard mitigation measures already defined in the hardware requirements, their effectiveness should be further confirmed during the hardware design phase; for hazard mitigation measures identified as needing to be added during the hardware requirement hazard analysis phase, their effectiveness should be confirmed; for newly identified hazard mitigation measures needing to be added during the hardware design phase, corresponding improvement requirements or suggestions can be given.

[0120] During the hardware implementation phase, physical testing verifies that the hardware's functionality, performance, interfaces, assembly processes, and design requirements are consistent. Since the boards tested at this stage are only used to verify functionality and performance and are not used in the engineering field, any hazards incurred at this stage only affect the correctness and validity of the verification results.

[0121] Based on the above background, the sources of harm and their identification methods at this stage are shown in Table 10 below:

[0122] Table 10

[0123]

[0124] For newly identified hazards at this stage, the corresponding identification methods can be obtained by searching Table 11 below, which can then guide relevant personnel in the identification process.

[0125] Table 11

[0126]

[0127] This hardware hazard monitoring method identifies existing hazards early by conducting hazard analysis activities during the product hardware requirements, design, and implementation stages, and guides remediation to ensure that no hazards affecting the product's performance of safety-related functions are introduced at each stage, thereby improving the reliability of hardware products.

[0128] The above describes a hardware hazard monitoring method provided by the embodiments of this application. The following describes the apparatus for performing the above hardware hazard monitoring method.

[0129] Please see Figure 5 , Figure 5 This is a schematic diagram of a hardware hazard monitoring device provided in an embodiment of this application. Figure 5 As shown, the hardware hazard monitoring device includes:

[0130] The hardware function identification module 501 is used to identify the hardware function of the acquired hardware requirement description and determine the functional units contained in the required hardware product.

[0131] The fault mode determination module 502 is used to determine the fault mode of the functional unit based on the description of the function implemented by the functional unit and the interface associated with the functional unit.

[0132] The failure rate scoring module 503 is used to evaluate the probability of occurrence of failure modes based on historical statistical data of failure mode occurrences, and obtain a failure rate score that characterizes the severity of the failure probability.

[0133] Severity rating module 504 is used to assess the severity of a functional unit's failure based on its impact on other functional units in the required hardware product, obtaining a severity rating that characterizes the scope of the failure's impact; and...

[0134] The risk and hazard determination module 505 is used to determine the risk and hazard value of the functional unit based on the failure rate score and the severity score, and to determine the corresponding handling suggestions based on the range of the risk and hazard value.

[0135] In one possible implementation, the risk hazard determination module 505 is also used for:

[0136] Based on the degree of influence on the failure probability, the hardware design results data of the functional unit are used to identify components and determine at least one target component in the functional unit.

[0137] The failure rate score is updated based on the impact of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score.

[0138] Based on the mapping relationship between failure modes and fault modes, new fault modes are identified, and the severity score is updated according to the failure of functional units caused by the new fault modes.

[0139] In one possible implementation, when the failure mode is natural component failure, the risk hazard determination module 505 updates the failure rate score based on the impact of the target component's failure mode on the functional unit's failure rate, obtaining the updated failure rate score. This process includes:

[0140] Based on the failure mode mapping relationship, the failure rates of each target component that causes the same type of failure mode in the functional unit are superimposed to obtain the total failure rate;

[0141] The current failure rate score is determined based on the interval in which the sum of failure rates falls, and the updated failure rate score is obtained based on the comparison between the current failure rate score and the failure rate score.

[0142] In one possible implementation, when the failure mode is component failure caused by product manufacturing process, the risk hazard determination module 505 updates the failure rate score based on the impact of the target component's failure mode on the functional unit's failure rate, obtaining the updated failure rate score. This process includes:

[0143] The failure rate score is updated based on the location of the target component and whether there are components around the target component whose heat generation exceeds the threshold.

[0144] In one possible implementation, when the failure mode is component failure caused by abnormal operating conditions, the risk hazard determination module 505 updates the failure rate score based on the impact of the target component's failure mode on the functional unit's failure rate, obtaining the updated failure rate score. This process includes:

[0145] Based on the external interfaces of the associated functional units and other affected functional units under abnormal operating conditions, the associated components are identified, and the failure rate score is updated according to the failure mode of the associated components.

[0146] In one possible implementation, the risk hazard determination module 505 is also used for:

[0147] Based on the fault hazards associated with the functional units in the hardware design phase, determine the hazard identification method, and perform fault hazard identification according to the identification process indicated by the hazard identification method.

[0148] In one possible implementation, the severity scoring module 504 assesses the severity of a functional unit based on its impact on other functional units in the required hardware product after the functional unit fails, obtaining a severity score that characterizes the scope of the failure's impact. This process includes:

[0149] The severity level is assessed based on the interface status of the interfaces associated with the functional unit, as well as the fault status of other functional units associated with the interface, to obtain a severity score.

[0150] This application also provides an electronic device in its embodiments. (See reference...) Figure 6 The diagram illustrates a structural schematic suitable for implementing the electronic device in the embodiments of this application. The electronic device in the embodiments of this application may include, but is not limited to, fixed terminals such as laptops, desktop computers, etc. Figure 6 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0151] like Figure 6 As shown, the electronic device may include a processing unit (e.g., a central processing unit, a graphics processing unit, etc.) 601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage device 608 into a random access memory (RAM) 603. When the electronic device is powered on, the RAM 603 also stores various programs and data required for the operation of the electronic device. The processing unit 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0152] Typically, the following devices can be connected to I / O interface 605: input devices 606 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 607 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 608 including, for example, memory cards, hard drives, etc.; and communication devices 609. Communication device 609 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 6 Electronic devices with various devices are shown, but it should be understood that it is not required to implement or have all of the devices shown. More or fewer devices may be implemented or have alternatively.

[0153] This application also provides a computer program product including computer-readable instructions, which, when executed on an electronic device, cause the electronic device to implement any of the hardware hazard monitoring methods provided in this application.

[0154] This application also provides a computer-readable storage medium that carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement any of the hardware hazard monitoring methods provided in this application.

[0155] It should also be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. In addition, in the device embodiment drawings provided in this application, the connection relationship between modules indicates that they have a communication connection, which can be implemented as one or more communication buses or signal lines.

[0156] Through the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware, or it can be implemented by special-purpose hardware including application-specific integrated circuits, special-purpose CPUs, special-purpose memory, special-purpose components, etc. Generally, any function performed by a computer program can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be diverse, such as analog circuits, digital circuits, or special-purpose circuits. However, for this application, software program implementation is more often the preferred implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, training equipment, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0157] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0158] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, training device, or data center to another website, computer, training device, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state drives (SSDs)).

Claims

1. A method for monitoring hardware hazards, characterized in that, include: The hardware function is identified from the obtained hardware requirement description to determine the functional units included in the required hardware product. Based on the description of the functions implemented by the functional unit and the interfaces associated with the functional unit, the fault mode of the functional unit is determined. Based on historical statistical data on the occurrence of the failure modes, the probability of occurrence of the failure modes is assessed to obtain a failure rate score that characterizes the severity of the failure probability. Based on the degree of impact of the failure of the functional unit on other functional units in the required hardware product, the severity of the failure of the functional unit is assessed to obtain a severity score that characterizes the scope of the failure's impact. Based on the failure rate score and the severity score, the risk hazard value of the functional unit is determined, and corresponding handling suggestions are determined based on the range of the risk hazard value.

2. The hardware hazard monitoring method according to claim 1, characterized in that, Also includes: Based on the degree of influence on the failure probability, the hardware design results data of the functional unit are used to identify components, and at least one target component in the functional unit is determined. The failure rate score is updated based on the degree of influence of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score. Based on the mapping relationship between the failure modes and the fault modes, new fault modes are determined, and the severity score is updated based on the failure of the functional units caused by the new fault modes.

3. The hardware hazard monitoring method according to claim 2, characterized in that, When the failure mode is natural component failure, the failure rate score is updated based on the impact of the target component's failure mode on the failure rate of the functional unit, resulting in an updated failure rate score, including: Based on the failure mode mapping relationship, the failure rates of each target component that causes the same type of failure mode of the functional unit are superimposed to obtain the total failure rate; Based on the interval in which the sum of the failure rates falls, the current failure rate score is determined, and based on the comparison between the current failure rate score and the failure rate score, the updated failure rate score is obtained.

4. The hardware hazard monitoring method according to claim 2, characterized in that, When the failure mode is component failure caused by product manufacturing process, the failure rate score is updated based on the impact of the failure mode of the target component on the failure rate of the functional unit, resulting in an updated failure rate score, including: The failure rate score is updated based on the location of the target component and whether there are components with heat generation exceeding the threshold around the location, resulting in the updated failure rate score.

5. The hardware hazard monitoring method according to claim 2, characterized in that, When the failure mode is component failure caused by abnormal operating conditions, the failure rate score is updated based on the impact of the target component's failure mode on the failure rate of the functional unit, resulting in an updated failure rate score, including: Based on the external interfaces of the associated functional units and other affected functional units under the abnormal operating conditions, the associated components are determined, and the failure rate score is updated based on the failure modes of the associated components.

6. The hardware hazard monitoring method according to any one of claims 1 to 5, characterized in that, Also includes: Based on the fault hazards associated with the functional units described in the hardware design phase, a hazard identification method is determined, and fault hazard identification is performed according to the identification process indicated by the hazard identification method.

7. The hardware hazard monitoring method according to claim 1, characterized in that, The severity assessment of the functional unit is performed based on the impact of its failure on other functional units in the required hardware product, resulting in a severity score characterizing the scope of the failure's impact. This score includes: The severity level is assessed based on the interface status of the interface associated with the functional unit and the fault status of other functional units associated with the interface, resulting in a severity score.

8. A hardware hazard monitoring device, characterized in that, include: The hardware function identification module is used to identify the hardware functions in the obtained hardware requirement description and determine the functional units contained in the required hardware product. The fault mode determination module is used to determine the fault mode of the functional unit based on the description of the function implemented by the functional unit and the interface associated with the functional unit. The failure rate scoring module is used to evaluate the probability of occurrence of the failure mode based on historical statistical data of the occurrence of the failure mode, and obtain a failure rate score that characterizes the severity of the failure probability. The severity rating module is used to assess the severity of a functional unit based on the degree of impact of the failure of the functional unit on other functional units in the required hardware product, and to obtain a severity rating that characterizes the scope of the failure's impact. as well as, The risk and hazard determination module is used to determine the risk and hazard value of the functional unit based on the failure rate score and the severity score, and to determine the corresponding handling suggestions based on the range of the risk and hazard value.

9. An electronic device, characterized in that, It includes at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is used to execute the computer program to enable the electronic device to implement the hardware hazard monitoring method as described in any one of claims 1 to 7.

10. A computer storage medium, characterized in that, The storage medium carries one or more computer programs that, when executed by an electronic device, enable the electronic device to implement the hardware hazard monitoring method as described in any one of claims 1 to 7.

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