Coil electronic component

Abstract

The invention provides a coil electronic component. The coil electronic component includes: a body including a magnetic material; a coil embedded in the main body and having a plating layer; and an insulating member including glass covering the coil. The plating layer comprises a first plating layer and a second plating layer arranged on the first plating layer. The insulating member includes an inner insulating member between the first coil pattern and the second coil pattern and insulating walls extending between adjacent turns of the coil to enhance electrical insulation and structural integrity. First and second external electrodes are located outside the body and electrically connected to the coil. The insulating member improves mechanical stability and electrical performance, reduces deformation and potential shorting.

Description

Technical Field

[0001] This disclosure relates to a coil electronic assembly. Background Technology

[0002] In recent years, due to the diversification of functions and increased power consumption of mobile devices, coil electronics with low loss and high efficiency have been used around power management integrated circuits (PMICs) to increase battery life in mobile devices.

[0003] The demand for thin-film power inductors is growing to enable slimmer products and greater flexibility in component placement. Thin-film inductors are manufactured by forming coils on a support member using sputtering or plating. During the manufacturing process of thin-film inductors, the support member may deform due to heat or pressure. When the support member deforms, the alignment of the coils may be disrupted, exposing the coils to the outside or causing short circuits, which can reduce the reliability of the thin-film inductor. Summary of the Invention

[0004] One aspect of the embodiments is intended to provide a coil electronics assembly with enhanced reliability.

[0005] However, the problems solved by the embodiments are not limited to those described above, but can be extended in various ways within the scope of the technical spirit included in the embodiments.

[0006] An embodiment provides a coil electronic assembly, comprising: a body comprising a magnetic material; a coil embedded in the body and comprising a plating layer; and an insulating member made of glass covering the coil, wherein the plating layer comprises a first plating layer and a second plating layer covering the first plating layer.

[0007] A portion of the first coating may contact the second coating, and the remainder of the first coating may contact the insulating member.

[0008] The coil may include a first coil pattern and a second coil pattern, and the insulating member may include an inner insulating member located between the first coil pattern and the second coil pattern.

[0009] The inner insulating member may include a first support surface and a second support surface opposite to each other, the first coil pattern may be disposed on the first support surface, and the second coil pattern may be disposed on the second support surface.

[0010] The coil electronics may further include a first via that passes through the inner insulating member and connects the first coil pattern and the second coil pattern.

[0011] The insulating component may include an external insulating component disposed between the coil and the body.

[0012] The external insulation component may be disposed on the outer surface of the coil.

[0013] The second coating may come into contact with the outer insulating component.

[0014] The body may include a first surface and a second surface opposite to each other along a first direction, the coil may include a plurality of turns wound around a winding axis in the first direction, and the insulating member may include an insulating wall located between the turns of the coil.

[0015] The insulating component may include photosensitive glass.

[0016] The insulating component may include at least one of SiO2-B2O3-based glass, SiO2-B2O3-K2O-based glass, SiO2-B2O3-Li2O-CaO-based glass, SiO2-B2O3-Li2O-CaO-ZnO-based glass, and Bi2O3-B2O3-SiO2-Al2O3-based glass.

[0017] The insulating component may also include at least one of quartz, alumina, magnesium oxide, silicon dioxide, forsterite (Mg2SiO4), talc (H2Mg3(SiO3)4), and zirconium oxide.

[0018] The body may include a first surface and a second surface opposite to each other along a first direction, the coil may be wound around a winding axis in the first direction, and the coil may include lead-out terminals exposed at the first surface or the second surface of the body.

[0019] The coil electronics may further include an external electrode disposed outside the body and connected to the lead-out terminal.

[0020] The external electrode may be disposed on the first surface or the second surface of the main body.

[0021] The coil electronic assembly may further include a surface insulating layer disposed on the outer surface of the body.

[0022] An embodiment provides a coil electronic assembly, comprising: a body comprising a magnetic material; a coil embedded in the body and comprising a plating layer; an insulating member made of glass covering the coil; and a first external electrode and a second external electrode disposed outside the body and connected to the coil, wherein the insulating member comprises an insulating wall extending in the thickness direction between adjacent turns of the coil.

[0023] According to embodiments, coil electronics components with enhanced reliability can be provided. Attached Figure Description

[0024] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment.

[0025] Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0026] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line III-III'.

[0027] Figure 4 It is shown schematically. Figure 1 A cross-sectional view of the coil.

[0028] Figures 5 to 19 The diagrams sequentially illustrate a method for manufacturing a coil electronic component according to an embodiment. Detailed Implementation

[0029] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the embodiments of the present disclosure. The drawings and description should be considered illustrative in nature and not restrictive. Throughout the specification, the same reference numerals denote the same elements. Furthermore, some components in the drawings may be exaggerated, omitted, or shown schematically, and the dimensions of each component do not perfectly reflect the actual dimensions.

[0030] It should be understood that the accompanying drawings are provided only to facilitate understanding of the embodiments disclosed in this specification, and the technical spirit disclosed in this specification is not limited to the drawings. Furthermore, this disclosure includes all variations, equivalents, and alternatives included within the spirit and scope of this disclosure.

[0031] Terms including ordinal numbers such as first and second are used to describe various components, but components are not limited by terms. These terms are only used to distinguish one component from another.

[0032] Furthermore, it should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element, or there may be intermediate elements present. In contrast, when an element is referred to as being "directly on" another element, there are no intermediate elements present. Additionally, when an element is referred to as being "above" or "on" a reference portion, the element is located "above" or "below" the reference portion, and does not specifically mean that the element is located "above" or "on" in a direction opposite to the direction of gravity.

[0033] Throughout this specification, it should be understood that the terms "comprising" or "having" mean the presence of features, quantities, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof. Therefore, unless explicitly stated to the contrary, the words "comprising," "including," and "having" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0034] Furthermore, throughout the specification, the term "plan view" refers to a diagram obtained by observing the target portion from the top, and "section view" refers to a cross-sectional view of the vertically cut target portion observed from the side.

[0035] Furthermore, throughout the specification, the term "connection" does not necessarily refer to a direct connection between two or more components, but may refer to an indirect connection to two or more components via other components, or an electrical connection to two or more components, or two or more components that may be called by different names depending on their location or function, but may actually be a single unit.

[0036] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment. Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line II-II'. Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line III-III'.

[0037] Reference Figure 1 , Figure 2 and Figure 3 The coil electronic assembly 1000 includes a main body 100, a coil 200, an insulating component 300, a first external electrode 700, a second external electrode 800, and a surface insulating layer 900.

[0038] The main body 100 may have a substantially cuboid shape, but the embodiments are not limited to this. Due to the shrinkage of magnetic powder and the like during sintering, the main body 100 may not have a perfect cuboid shape, but may have a substantially cuboid shape. For example, although the main body 100 has a substantially cuboid shape, the portions corresponding to the corners or vertices may have rounded corners.

[0039] In this embodiment, for ease of description, the two surfaces of the main body that are opposite each other in the length direction (L-axis direction) will be defined as the first surface S1 and the second surface S2, the two surfaces of the main body 100 that are opposite each other in the width direction (W-axis direction) will be defined as the third surface S3 and the fourth surface S4, and the two surfaces of the main body 100 that are opposite each other in the thickness direction (T-axis direction) will be defined as the fifth surface S5 and the sixth surface S6.

[0040] The length of the coil electronic component 1000 can refer to the maximum length of a plurality of line segments that connect the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (T-axis direction) in the cross-sectional image taken at the center of the coil electronic component 1000 in the width direction (W-axis direction) and along the length direction (L-axis direction). Alternatively, the length of the coil electronic component 1000 can refer to the minimum length of a plurality of line segments that connect the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) in the cross-sectional image. Optionally, the length of the coil electronics component 1000 may refer to the arithmetic mean of the lengths of at least two of the multiple line segments that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) of the two outermost boundary lines of the coil electronics component 1000 shown in the cross-sectional photograph.

[0041] The thickness of the coil electronic component 1000 can refer to the maximum value of the lengths of multiple line segments connected to the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in an optical microscope or scanning electron microscope (SEM) photograph taken at the center of the width direction (W-axis direction) of the coil electronic component 1000 along the length direction (L-axis direction) and thickness direction (T-axis direction). Alternatively, the thickness of the coil electronic component 1000 can refer to the minimum value of the lengths of multiple line segments connected to the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) in the cross-sectional photograph. Optionally, the thickness of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments that are respectively connected to the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph and are opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction).

[0042] The width of the coil electronic component 1000 can refer to the maximum length of a plurality of line segments, which are connected to the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken at the center of the coil electronic component 1000 in the thickness direction (T-axis direction) along the length direction (L-axis direction) and width direction (W-axis direction) shown in the cross-sectional photograph. Alternatively, the width of the coil electronic component 1000 can refer to the minimum length of a plurality of line segments, which are connected to the two outermost boundary lines of the coil electronic component 1000 that are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) shown in the cross-sectional photograph. Optionally, the width of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments that are opposite each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) of the two outermost boundary lines of the coil electronic component 1000 shown in the cross-sectional photograph.

[0043] The length, width, and thickness of the coil electronics assembly 1000 can also be measured using a micrometer. In this method, a micrometer providing repeatability and reproducibility (gauge R&R) is zeroed, the coil electronics assembly 1000 according to this embodiment is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated to perform the measurement. When measuring the length of the coil electronics assembly 1000 using this method, the length can refer to a single measurement or the arithmetic mean of multiple measurements. The same applies to measuring the width and thickness of the coil electronics assembly 1000.

[0044] The main body 100 constitutes the appearance of the coil electronic assembly 1000 and is the space that forms a magnetic circuit when current is applied to the coil 200 through the first external electrode 700 and the second external electrode 800. This magnetic circuit is the path through which the magnetic flux generated by the coil 200 passes.

[0045] The body 100 surrounds and encloses the coil 200 and the insulating member 300, and includes a magnetic material. The body 100 may include magnetic particles, and the insulating material may be interposed between the magnetic particles.

[0046] The magnetic material may comprise first metallic magnetic particles, second metallic magnetic particles with a particle size smaller than the first metallic magnetic particles, and third metallic magnetic particles with a particle size smaller than the second metallic magnetic particles. The average particle size D of the first metallic magnetic particles... 50 The average particle size D of the second metallic magnetic particles can range from about 5 μm to about 30 μm. 50It can be in the range of about 1 μm to about 5 μm, and the average particle size D of the third metallic magnetic particles 50 It can be in the range of about 0.05 μm to about 0.5 μm.

[0047] Magnetic particles can be ferrite particles or metallic magnetic particles that exhibit magnetism.

[0048] Ferrite particles may include, for example, at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0049] The metallic magnetic particles may be composed of two or more types of powders with different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one of pure iron, Fe-Si based alloys, Fe-Si-Al based alloys, Fe-Ni based alloys, Fe-Ni-Mo based alloys, Fe-Ni-Mo-Cu based alloys, Fe-Co based alloys, Fe-Ni-Co based alloys, Fe-Cr based alloys, Fe-Cr-Si based alloys, Fe-Si-Cu-Nb based alloys, Fe-Ni-Cr based alloys, and Fe-Cr-Al based alloys. Here, different compositions of the metallic magnetic particles may mean different contents.

[0050] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloys, but the embodiments are not limited thereto. The metallic magnetic particles can have an average particle size in the range of about 0.1 μm to about 30 μm, but the embodiments are not limited thereto.

[0051] In this specification, the average particle size may refer to D 90 D 50 Particle size distribution, expressed as such. Particle size distribution, as an indicator of the proportion of particles of a given size within a test particle group, is well-known to those skilled in the art. D 50 (Particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0052] Metallic magnetic particles can be two or more different types of metallic magnetic particles. Here, different types of metallic magnetic particles refer to metallic magnetic particles that can be distinguished from each other by at least one of the following: average particle size, composition, composition ratio, crystallinity, and shape.

[0053] The insulating material may include epoxy resin, polyimide, liquid crystal polymer, etc., either alone or in combination, but the embodiments are not limited thereto.

[0054] The insulating member 300 may be disposed inside the main body 100 and may cover and support the coil 200.

[0055] The insulating component 300 may include glass.

[0056] For example, the glass included in the insulating member 300 may be SiO2-B2O3-based glass, SiO2-B2O3-K2O-based glass, SiO2-B2O3-Li2O-CaO-based glass, SiO2-B2O3-Li2O-CaO-ZnO-based glass, and Bi2O3-B2O3-SiO2-Al2O3-based glass. As another example, the insulating member 300 may be made of photosensitive glass comprising silicon dioxide, lithium oxide, aluminum (Al), and cerium oxide.

[0057] In an embodiment, the glass included in the insulating member 300 may further include fillers. Fillers included in the glass may include, for example, quartz, alumina, magnesium oxide, silicon dioxide, forsterite (Mg2SiO4), talc (H2Mg3(SiO3)4), and zirconium oxide.

[0058] The insulating member 300 may include an inner insulating member 300i, an outer insulating member 300e, and an insulating wall 300x.

[0059] The inner insulating member 300i can be used as a support member for the coil 200. The first coil pattern 210 and the second coil pattern 220, which will be described later, can both be arranged to contact the inner insulating member 300i. In other words, the inner insulating member 300i can be disposed between the first coil pattern 210 and the second coil pattern 220.

[0060] When viewed in the thickness direction (T-axis direction), the inner insulating member 300i may have a shape wider than the shape formed by the edge of the coil 200.

[0061] The inner insulating member 300i may include a first support surface 320 and a second support surface 330 that are opposite each other in the thickness direction (T-axis direction).

[0062] An outer insulating member 300e may be disposed between the coil 200 and the body 100. The outer insulating member 300e may be disposed along the surface of the coil 200. That is, the outer insulating member 300e may be disposed on each of the outer surface of the coil 200 facing the body 100 and the outer surface of the coil 200 facing the core 110. However, the outer insulating member 300e is not present at the portion of the coil 200 connected to the first external electrode 700 and the second external electrode 800.

[0063] Insulating walls 300x can be disposed between the turns of coil 200. That is, insulating walls 300x can be disposed between adjacent coils of coil patterns 210 and 220.

[0064] The coil 200 is disposed inside the main body 100 and exhibits the characteristics of the coil electronics 1000. For example, when the coil electronics 1000 of the embodiment is used as a power inductor, when current is applied to the coil 200, the coil electronics can be used to stabilize the power supply of the electronic device by storing energy in the form of a magnetic field and maintaining the output voltage.

[0065] When viewed in the thickness direction (T-axis direction), coil 200 can be helical.

[0066] The coil 200 can be disposed on the first support surface 320 and the second support surface 330 of the inner insulating member 300i.

[0067] Figure 4 It is shown schematically. Figure 1 A cross-sectional view of the coil.

[0068] Reference Figure 4 The coil 200 may have a multilayer structure including two or more plating layers.

[0069] The coil 200 can be formed on the seed layer by a plating process, and for example, by an anisotropic plating process. When forming a coil by plating, if it is difficult to form a coil of the target thickness in a single plating, the plating process can be divided into several steps, thereby becoming a multilayer structure with two or more plating layers.

[0070] For example, coil 200 may include a first plating layer 200a and a second plating layer 200b. However, this embodiment is not limited to this, and coil 200 may include three or more plating layers.

[0071] The first plating layer 200a may contact the inner insulating member 300i and may have a shape that protrudes in the thickness direction (T-axis direction).

[0072] The second plating layer 200b does not contact the inner insulating member 300i, but can cover the surface of the first plating layer 200a in the thickness direction (T-axis direction).

[0073] When the cross-section of the coil electronic component according to the embodiment is polished and then etched in a sulfuric acid solution, the coil having the above-described multilayer structure can be observed under a microscope.

[0074] The coil 200 may include a first coil pattern 210 and a second coil pattern 220, and the first coil pattern 210 and the second coil pattern 220 may be connected to each other through a first through-hole 230 penetrating the inner insulating member 300i. The first coil pattern 210 and the second coil pattern 220 connected in this way may form a helical coil 200 having one or more turns.

[0075] The first coil pattern 210 is disposed on the first support surface 320 of the inner insulating member 300i.

[0076] The first coil pattern 210 includes a first lead-out portion 213. The first lead-out portion 213 can be electrically connected to the first external electrode 700 via a first lead-out terminal 400. For example, the first lead-out terminal 400 can be exposed on the sixth surface S6 of the body 100 and connected to the first external electrode 700.

[0077] The second coil pattern 220 is disposed on the second support surface 330 of the inner insulating member 300i.

[0078] The second coil pattern 220 includes a second lead-out portion 223. A connecting portion 250 is disposed on the first support surface 320 of the inner insulating member 300i, and the connecting portion 250 and the second lead-out portion 223 are opposite to each other in the thickness direction (T-axis direction). The connecting portion 250 is connected to the second lead-out portion 223 via a second through-hole 240 penetrating the inner insulating member 300i. The second lead-out portion 223 can be electrically connected to the second external electrode 800 via a second lead-out terminal 500. For example, the second lead-out terminal 500 can be exposed on the sixth surface S6 of the body 100 and connected to the second external electrode 800.

[0079] Each of the coil 200 and the first via 230 may be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), alloys thereof, etc., but the embodiments are not limited thereto.

[0080] An insulating wall 300x is disposed between adjacent coils of the first coil pattern 210 and the second coil pattern 220. The insulating wall 300x may have a shape that extends from the surface of the inner insulating member 300i along the thickness direction (T-axis direction) and connects to the outer insulating member 300e.

[0081] Like the inner insulating member 300i and the outer insulating member 300e, the insulating wall 300x comprises glass. Glass is stronger than polymer, and therefore less likely to cause leakage current or short circuit in the coil.

[0082] Unlike this embodiment, manufacturing coil electronics by forming coils on a PCB, stacking magnetic bodies on the coils, and then pressing and curing the stacked magnetic bodies can lead to PCB deformation. Because PCBs have relatively low rigidity and are susceptible to thermal deformation, they may undergo repeated pressure-induced deformation and thermal contraction / expansion during the pressing / curing of the magnetic bodies. If the PCB deforms, the coils are exposed to the outside of the body, causing short circuits or the coils to shift to one side within the body, resulting in a decrease in inductance and saturation current (Isat).

[0083] Conversely, according to this embodiment, the insulating member 300 covering the coil 200 is made of glass, and the glass serves as both a support member and an insulating film. Glass has higher strength than polymers such as parylene and is less prone to deformation. Although glass has high strength, it is also highly brittle and may crack under pressure. To prevent this, in this embodiment, the insulating member 300 is formed after the body 100 is formed. This will be described later.

[0084] The first external electrode 700 and the second external electrode 800 are disposed outside the main body 100 and connected to the coil 200.

[0085] The first external electrode 700 may be disposed on the sixth surface S6 of the main body 100 and connected to the first lead-out portion 213 of the coil 200 via the first lead-out terminal 400.

[0086] The first external electrode 700 may include a first metal layer 701, a second metal layer 702, and a third metal layer 703.

[0087] The first metal layer 701 may be a plating layer that contacts the outer surface (i.e., the sixth surface S6) of the first lead-out terminal 400 and the body 100, and may include copper (Cu). The second metal layer 702 may be a plating layer covering the first metal layer 701, and may include nickel (Ni). The third metal layer 703 may be a plating layer covering the second metal layer 702, and may include tin (Sn). However, the embodiments are not limited to a three-layer structure, and a two-layer structure in which only one metal layer is superimposed on the first metal layer 701 is also feasible.

[0088] The first lead-out terminal 400 may be made of the same material as the coil 200. For example, both the first lead-out terminal 400 and the coil 200 may comprise copper (Cu).

[0089] The first lead terminal 400 may also be made of a different material than the coil 200. For example, the coil 200 may include copper (Cu), and the first lead terminal 400 may include gold (Au), aluminum (Al), silver (Ag), or alloys thereof. When the first lead terminal 400 is made of a different material than the coil 200, an intermetallic compound may be formed at the interface between the first lead terminal 400 and the coil 200.

[0090] The second external electrode 800 may be disposed on the sixth surface S6 of the main body 100 and connected to the connection portion 250 of the coil 200 via the second lead-out terminal 500.

[0091] The second external electrode 800 may include a first metal layer 801, a second metal layer 802, and a third metal layer 803.

[0092] The first metal layer 801 may be a plating layer that contacts the outer surface (i.e., the sixth surface S6) of the second lead terminal 500 and the body 100, and may include copper (Cu). The second metal layer 802 may be a plating layer covering the first metal layer 801, and may include nickel (Ni). The third metal layer 803 may be a plating layer covering the second metal layer 802, and may include tin (Sn). However, the embodiments are not limited to a three-layer structure, and a two-layer structure in which only one metal layer is superimposed on the first metal layer 801 is also feasible.

[0093] The second lead 500 may also be made of a different material than the coil 200. For example, the coil 200 may include copper (Cu), and the second lead 500 may include gold (Au), aluminum (Al), silver (Ag), or alloys thereof. When the second lead 500 is made of a different material than the coil 200, an intermetallic compound may be formed at the interface between the second lead 500 and the coil 200.

[0094] As another example, the first external electrode 700 and the second external electrode 800 may comprise a conductive metal and glass. The conductive metal may be, for example, a conductive metal comprising copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or alloys thereof. The glass component included in the first external electrode 700 and the second external electrode 800 may be a mixture of oxides. The glass component may comprise, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxides, alkali metal oxides, alkaline earth metal oxides, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni); the alkali metal may be selected from lithium (Li), sodium (Na), or potassium (K); and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba). There are no particular limitations on the method used to form the first external electrode 700 and the second external electrode 800. For example, the first external electrode 700 and the second external electrode 800 can be formed by immersing the body 100 in a conductive paste containing metal or glass, or by printing the conductive paste onto the surface of the body 100 using, for example, screen printing or gravure printing. Furthermore, various methods, such as coating the surface of the body 100 with conductive paste or transferring a dry film formed by drying the conductive paste onto the body 100, can be used to form the first external electrode 700 and the second external electrode 800.

[0095] A surface insulating layer 900 may be disposed on the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6 of the main body 100. However, the surface insulating layer 900 may only partially cover the sixth surface S6 of the main body 100. That is, the first external electrode 700 and the second external electrode 800 may be disposed on the sixth surface S6 of the main body 100, and the surface insulating layer 900 may not cover the first external electrode 700 and the second external electrode 800.

[0096] Alternatively, the surface insulating layer 900 may also be disposed on the third surface S3 and the fourth surface S4 of the main body 100.

[0097] As described above, the surface insulating layer 900 is disposed on at least a portion of the first surface S1, second surface S2, third surface S3, fourth surface S4, fifth surface S5 and sixth surface S6 of the body 100 to prevent electrical short circuits between other electronic components and the external electrodes 700 and 800.

[0098] When the first external electrode 700 and the second external electrode 800 are formed by electroplating, the surface insulating layer 900 can be used as a plating resist, but is not limited thereto.

[0099] The surface insulating layer may include polymer resins, pigments, fillers, etc. The polymer resins may include thermosetting polymer resins (such as epoxy resins) or thermoplastic polymer resins (such as acrylic resins). Pigments capable of producing colors such as black may include carbon black, manganese (Mn)-based spinel powder, etc., and the surface insulating layer may also include additives such as SiO2 and talc to control strength and / or coefficient of thermal expansion.

[0100] For example, the surface insulating layer 900 may include thermoplastic resins (such as polystyrene-based resins, vinyl acetate-based resins, polyester-based resins, polyethylene-based resins, polypropylene-based resins, polyamide-based resins, rubber-based resins, acrylic-based resins, etc.), thermosetting resins (such as phenol-based resins, epoxy-based resins, polyurethane-based resins, melamine-based resins, alkyd resins), photosensitive resins, parylene, SiO2, etc. x or SiN x .

[0101] The surface insulating layer 900 can be formed by processes such as screen printing, pad printing, dipping, and inkjet printing. For example, the surface insulating layer 900 can be formed by coating a liquid insulating resin onto the surface of the body 100, stacking an insulating film (such as a dry film) on the surface of the body 100, or using a thin film process (such as vapor deposition). For the insulating film, an Ajinomoto stacked film (ABF) or a polyimide film that does not contain a photosensitive insulating resin can be used.

[0102] Figures 5 to 19 The diagrams sequentially illustrate a method for manufacturing a coil electronic component according to an embodiment.

[0103] Reference Figure 5 A magnetic strip 10 is provided. For example, the magnetic strip 10 can be manufactured by stacking molded sheets.

[0104] Reference Figure 6 The first trench 11 is formed by etching the magnetic strip 10. For example, the first trench 11 can be formed by irradiating the magnetic strip 10 with a laser beam or by performing a wet etching process on the magnetic strip 10.

[0105] The first groove 11 can be formed around the core 110.

[0106] Reference Figure 7 The first insulating member 300a is formed by filling the first groove 11 with glass.

[0107] Reference Figure 8 The second trench 12 is formed by etching the first insulating member 300a. For example, the second trench 12 can be formed by irradiating the first insulating member 300a with a laser beam or by performing a wet etching process on the first insulating member 300a.

[0108] The second groove 12 can be formed with various patterns. For example, the second groove 12 can be formed as a spiral.

[0109] Since the first insulating member 300a is made of glass, the second trench 12 can be formed with a relatively large aspect ratio. That is, when a laser beam irradiates the first insulating member 300a made of glass, the straightness of the laser beam is excellent, thereby increasing the aspect ratio of the second trench 12. For example, the aspect ratio of the second trench 12 can be 3:1 or more and 20:1 or less. As a result, the second trenches 12 can be arranged in the first insulating member 300a at a relatively high density, and are therefore arranged closer to each other with fine spacing.

[0110] Reference Figure 9 The second coil pattern 220 is formed by filling the second trench 12 with metal. The metal filling the second trench 12 forms the second coil pattern 220. For example, the second coil pattern 220 can be formed by plating the second trench 12 with copper (Cu). As a result, the second coil pattern 220, the second lead 223, etc. can be formed.

[0111] Reference Figure 10 The second insulating member 300b is formed by filling the remaining portion of the first groove 11 with glass to cover the second coil pattern 220.

[0112] Reference Figure 11 The third trench 13, the fourth trench 14, and the trench for forming the first via 230 are formed by etching the second insulating member 300b. For example, the third trench 13, the fourth trench 14, and the trench for forming the first via 230 can be formed by irradiating the second insulating member 300b with a laser beam or by performing a wet etching process on the second insulating member 300b.

[0113] The third groove 13 can be formed with various patterns. For example, the third groove 13 can be formed as a spiral.

[0114] Reference Figure 12 The first coil pattern 210 is formed by filling the third trench 13 with metal, the second via 240 is formed by filling the fourth trench 14 with metal, and the first via 230 is formed by filling the trench used to form the first via 230 with metal. The metal filled in the third trench 13 forms the first coil pattern 210. For example, the first coil pattern 210 can be formed by plating the third trench 13 with copper (Cu). As a result, the first coil pattern 210, the first lead-out portion 213, the first via 230, the second via 240, the connecting portion 250, etc., can be formed.

[0115] Reference Figure 13The third insulating member 300c is formed by filling the remaining portion of the first groove 11 with glass to cover the first coil pattern 210.

[0116] Reference Figure 14 The fifth trench 15 and the sixth trench 16 are formed by etching the third insulating member 300c.

[0117] Reference Figure 15 The first lead terminal 400 and the second lead terminal 500 are formed by filling the fifth trench 15 and the sixth trench 16 with metal. For example, the first lead terminal 400 and the second lead terminal 500 can be formed by plating the fifth trench 15 and the sixth trench 16 with copper (Cu).

[0118] Reference Figure 16 The seventh trench 17 is formed by etching the third insulating member 300c.

[0119] Reference Figure 17 The main body 100 is formed by filling the seventh groove 17 with magnetic material.

[0120] Reference Figure 18 A first external electrode 700 and a second external electrode 800 are formed on the outer surface of the main body 100. For example, the first external electrode 700 may be formed to contact the first lead terminal 400 by plating with metal, and the second external electrode 800 may be formed to contact the second lead terminal 500 by plating with metal. As a result, the first external electrode 700 is connected to the first lead terminal 400, and the second external electrode 800 is connected to the second lead terminal 500.

[0121] Reference Figure 19 The coil electronic assembly 1000 is manufactured by forming a surface insulating layer 900 on the outer surface of the body 100, excluding the portions forming the first outer electrode 700 and the second outer electrode 800.

[0122] Although embodiments of the present disclosure have been described above, the present disclosure is not limited thereto. Various modifications may be made within the scope of the claims, description, and drawings of this disclosure, and all such modifications fall within the scope of this disclosure.

[0123] 1000: Coil Electronic Components 100: Main Body 200: Coil 200a: First coating 200b: Second coating 210: First coil pattern 220: Second coil pattern 213: First Introduction 223: Second Introduction 300: Insulating components 300i: Internal insulation components 300e: External insulation component 300x: Insulating wall 400: First lead-out terminal 500: Second lead terminal 700: First external electrode 800: Second external electrode 900: Surface insulation layer.

Claims

1. A coil electronic assembly, comprising: The main body includes magnetic materials; A coil, embedded in the body and including a plating; and An insulating component, including glass, covers the coil. The coating includes a first coating and a second coating covering the first coating.

2. The coil electronic assembly according to claim 1, wherein: A portion of the first coating is in contact with the second coating, and the remainder of the first coating is in contact with the insulating member.

3. The coil electronic assembly according to claim 1, wherein: The coil includes a first coil pattern and a second coil pattern, and The insulating component includes an inner insulating component located between the first coil pattern and the second coil pattern.

4. The coil electronic assembly according to claim 3, wherein: The inner insulating member includes a first support surface and a second support surface that are opposite each other. The first coil pattern is located on the first support surface, and The second coil pattern is located on the second support surface.

5. The coil electronic assembly according to claim 4, further comprising: A first via passes through the inner insulating member and connects the first coil pattern and the second coil pattern.

6. The coil electronics assembly according to any one of claims 1-5, wherein: The insulating component includes an outer insulating component located between the coil and the body.

7. The coil electronics assembly according to claim 6, wherein: The outer insulating member is located on the outer surface of the coil.

8. The coil electronics assembly according to claim 6, wherein: The second coating is in contact with the outer insulating component.

9. The coil electronics assembly according to any one of claims 1-5, wherein: The main body includes a first surface and a second surface that are opposite to each other along a first direction. The coil comprises a plurality of turns wound around a winding axis in the first direction, and The insulating component includes an insulating wall located between the turns of the coil.

10. The coil electronics assembly according to claim 1, wherein: The insulating component includes photosensitive glass material.

11. The coil electronics assembly according to claim 1, wherein: The insulating component includes at least one selected from the group consisting of SiO2-B2O3-based glass, SiO2-B2O3-K2O-based glass, SiO2-B2O3-Li2O-CaO-based glass, SiO2-B2O3-Li2O-CaO-ZnO-based glass and Bi2O3-B2O3-SiO2-Al2O3-based glass.

12. The coil electronics assembly according to claim 11, wherein: The insulating component further includes at least one selected from the group consisting of quartz, alumina, magnesium oxide, silicon dioxide, forsterite (Mg2SiO4), talc (H2Mg3(SiO3)4) and zirconium oxide.

13. The coil electronics assembly according to claim 1, wherein: The main body includes a first surface and a second surface that are opposite to each other along a first direction. The coil is wound around a winding axis in the first direction, and The coil includes lead-out terminals exposed on the first or second surface of the body.

14. The coil electronics assembly of claim 13, further comprising: An external electrode is disposed outside the body and connected to the lead-out terminal.

15. The coil electronics assembly according to claim 14, wherein: The external electrode is disposed on the first surface or the second surface of the body.

16. The coil electronic assembly according to claim 1, further comprising: A surface insulating layer is disposed on the outer surface of the main body.

17. A coil electronic assembly, comprising: The main body includes magnetic materials; A coil, embedded in the body and including a plating layer; An insulating component, made of glass, covers the coil; as well as The first and second external electrodes are disposed outside the main body and connected to the coil. The insulating member includes an insulating wall extending along the thickness direction between adjacent turns of the coil.

18. The coil electronics assembly according to claim 17, wherein: The insulating wall is in direct contact with both the first coil pattern and the second coil pattern of the coil.

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