High-melting-point liquid metal heat conduction structure and equipment

Abstract

Disclosed is a high-melting-point liquid metal heat conduction structure. Liquid metal with the melting point higher than the working temperature of a heat source is arranged on a heat conduction interface between the heat source and a heat dissipation component. During installation, liquid metal is heated and melted to fill a contact gap, and the liquid metal cannot be melted when the working temperature of a heat source is lower than the melting point of the liquid metal. The liquid metal is only melted during installation, is easy to control and does not overflow, and the packaging cost is low. The liquid metal is not melted and is in a solid state during working, so that the advantages of good heat-conducting property, capability of filling contact gaps in a flowing manner, high temperature resistance and the like of the liquid metal are utilized, and the defects that the liquid metal is easy to flow and overflow, high in electrical conductivity, corrosive to most metals and the like are overcome. Due to the fact that the working temperature of the electric heating component of the household appliance cooker is high, zinc alloy, aluminum alloy and the like can be used as liquid metal. Lubricating materials such as graphite powder are doped in the liquid metal, or a lubricating agent is smeared on the heat source and the heat dissipation component. The equipment comprises the heat conduction structure.

Description

Technical Field

[0001] This invention relates to the field of heat transfer, and more particularly to the field of heat conduction in electronic products and household appliances. Background Technology

[0002] In the home appliance industry, cookware is generally made of stainless steel. However, during prolonged high-temperature heating, heavy metals can leach out, which is detrimental to human health. Therefore, cookware made entirely of glass or ceramic has become popular. However, glass and ceramic have relatively slow heat conduction, and their manufacturing process can easily cause deformation, resulting in an uneven bottom and poor contact with the heating element. Therefore, all-glass or all-ceramic cookware generally has a lower power rating to avoid overheating the heating element. Titanium kettles also present similar problems. The melting and crystallization process during manufacturing makes them prone to deformation, resulting in an uneven bottom and poor contact with the heating element.

[0003] In the field of electronic products, the power of electronic components in servers, new energy vehicles, wearable devices and other products is getting higher and higher, and their heat dissipation requirements are facing greater challenges.

[0004] Traditional thermal interface materials include thermal grease, phase change materials, and thermally conductive silicone rubber sheets. They are usually composed of polymer materials and thermally conductive particles, have poor thermal conductivity, and are not resistant to high temperatures, making it difficult to meet the ever-increasing heat dissipation requirements.

[0005] Liquid metal is a novel thermally conductive material with thermal conductivity far exceeding that of polymer materials. It can flow and fill the contact gap at the thermal interface between the heat source and the heat dissipation component, effectively solving the aforementioned heat dissipation problems. However, due to its high fluidity, high surface tension, high conductivity, and corrosiveness to most metals, liquid metal presents challenges such as high packaging costs and a tendency to overflow. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a high-melting-point liquid metal heat-conducting structure and device.

[0007] A high-melting-point liquid metal thermally conductive structure includes a liquid metal with a melting point higher than the operating temperature of the heat source arranged at the thermal interface between the heat source and the heat dissipation component. During installation, the liquid metal is heated and melted to fill the contact gap. When the heat source operates at a temperature lower than its melting point, the liquid metal will not melt. Since the heating elements in household cooking appliances operate at high temperatures, zinc alloys, aluminum alloys, etc., can be used as the liquid metal. Lubricating materials such as graphite powder are added to the liquid metal, or a lubricant is applied to components such as chips, glass, or ceramic cookware that come into contact with the liquid metal to prevent them from sticking.

[0008] The beneficial effects of this invention are:

[0009] A high-melting-point liquid metal thermally conductive structure comprises a liquid metal with a melting point higher than the operating temperature of the heat source, arranged at the thermal interface between the heat source and the heat dissipation component. During installation, the liquid metal is heated and melted to fill the contact gap. During operation, the heat source temperature is below the liquid metal's melting point, preventing it from melting. The liquid metal only melts during installation, making it easy to control and preventing overflow, resulting in low encapsulation costs. The liquid metal remains solid during operation, thus utilizing the advantages of liquid metal, such as good thermal conductivity, ability to flow and fill contact gaps, and high-temperature resistance, while avoiding its disadvantages, such as easy overflow, high electrical conductivity, and corrosiveness to most metals.

[0010] Because the heating elements of household cooking appliances operate at high temperatures, zinc alloys, aluminum alloys, etc., can be used as liquid metals; using zinc alloys, aluminum alloys, etc. as liquid metals also has the advantage of low cost.

[0011] Adding lubricating materials such as graphite powder to liquid metal, or applying lubricant to components such as chips, glass, or ceramic cookware that come into contact with liquid metal, can prevent them from sticking to the liquid metal. This can prevent the parts from cracking due to the difference in their coefficients of thermal expansion after the liquid metal cools down.

[0012] A device comprising the above-described heat-conducting structure.

[0013] The beneficial effects of this invention are: This device has the same advantages as the aforementioned heat-conducting structure, and will not be repeated here. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the CPU heat dissipation structure according to the present invention.

[0015] Figure 2 This is a schematic diagram of the structure of the glass pot according to the present invention.

[0016] In the diagram, 1. CPU chip, 2. Heat sink, 3. Liquid metal, 4. Heating plate, 5. Glass pot, 6. High-temperature lubricant. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Example 1 An embodiment of the present invention is a server; like Figure 1The image shows a server comprising a high-melting-point liquid metal heat-conducting structure. Liquid metal 3, with a melting point higher than the operating temperature, is disposed at the heat-conducting interface between a CPU chip 1 and a heat sink 2. The operating temperature of the CPU chip 1 is below 100 degrees Celsius, while the melting point of the liquid metal 3 is 120 degrees Celsius. During installation, the heat sink 2 is heated, causing the liquid metal 3 to melt and fill the contact gap. Graphite powder is doped into the liquid metal 3 to prevent it from adhering to the CPU chip 1, thus preventing the CPU chip 1 from cracking due to the difference in expansion coefficients after cooling. During operation, the operating temperature of the CPU chip 1 is lower than the melting point of the liquid metal 3, so the liquid metal 3 remains solid and does not melt.

[0019] Example 2 An embodiment of the present invention is a glass pot; like Figure 2 The image shows a glass pitcher comprising a high-melting-point liquid metal heat-conducting structure. Liquid metal 3, with a melting point higher than the operating temperature, is arranged on the heat-conducting interface between a heating plate 4 at the bottom and the glass pitcher 5. The operating temperature of the heating plate 4 is below 300 degrees Celsius. The liquid metal 3 is a zinc alloy with a melting point of 385 degrees Celsius. During installation, the entire piece is heated to melt the zinc alloy and fill the contact gap. A high-temperature lubricant 6 is applied to the bottom of the glass pitcher 5 to prevent the molten zinc alloy from adhering to the glass, thus preventing the pitcher 5 from cracking due to the difference in expansion coefficients after the molten zinc alloy cools. During operation, the operating temperature of the heating plate 4 is lower than the melting point of the liquid metal 3, so the liquid metal 3 remains solid and does not melt.

Claims

1. A high-melting-point liquid metal thermally conductive structure, characterized in that: A liquid metal with a melting point higher than the operating temperature of the heat source is arranged on the thermally conductive interface between the heat source and the heat dissipation component; the liquid metal is heated and melted during installation to fill the contact gap.

2. The thermally conductive structure according to claim 1, characterized in that: The liquid metal is doped with a lubricating material.

3. The thermally conductive structure according to claim 1, characterized in that: The heat source and / or heat dissipation components are coated with lubricant to prevent them from sticking to the liquid metal.

4. A device comprising the heat-conducting structure as described in any one of the preceding claims.

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