Turnover device of electronic component and device and method for detecting packaging line by adopting turnover device

Abstract

The invention relates to the technical field of electronic component processing, and discloses an electronic component turn-over device and a packaging line detection device and method adopting the electronic component turn-over device, integrated automatic operation of electronic component detection, turn-over, sorting and packaging is achieved, a material box is driven by a rotating table to sequentially pass through a testing assembly and a turn-over mechanism, and the automatic detection of the electronic component is achieved. The linkage of the first double-shaft moving arm, the second double-shaft moving arm, the linear vibration rail and the braiding machine is matched, manual work does not need to participate in the links of material box transferring, element transferring, sorting and the like, the operation efficiency of the whole process is greatly improved, meanwhile, the problem of element damage caused by manual operation is avoided, the product yield of electronic elements is effectively guaranteed, and the production cost is reduced. According to the turnover mechanism, the independent on-off communication valves are matched with the suction cups and the communication pipes which are in one-to-one correspondence, the adsorption state of each suction cup can be independently regulated and controlled, normal operation of other suction cups cannot be affected even if an individual suction cup fails in adsorption, and stability and continuity of batch turnover operation are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of electronic component processing technology, specifically to an apparatus and method for flipping electronic components and for using the apparatus in a testing and packaging line. Background Technology

[0002] In the processing, testing and packaging of electronic components such as chip bottom electrode capacitors, the electronic components must first undergo electrical and other index tests, and then be flipped over and adjusted in their placement before being packaged in tape and reel to meet the process requirements of subsequent assembly and transportation.

[0003] In the existing technology, the testing, flipping and packaging of electronic components are mostly decentralized operations, lacking an integrated testing and packaging line. This not only requires manual intervention in the process of positioning the material box and transferring components, resulting in low operational efficiency, but also makes it easy for electronic components to be bumped and damaged due to manual intervention, affecting product yield. Meanwhile, traditional electronic component flipping devices are mostly single-unit flipping structures, which cannot achieve batch synchronous flipping. Furthermore, the component positioning accuracy is poor during the flipping process, which can easily lead to problems such as adsorption offset and inconsistent posture after flipping. Some flipping devices use overall on / off control of the adsorption components, which cannot individually control individual adsorption units. If the adsorption of individual components fails, it will affect the flipping operation of the entire batch of components. In addition, good and defective products need to be sorted manually after inspection, which is inefficient and prone to misjudgment. The subsequent transfer of components to the tape and reel machine also lacks an automated connection structure. The overall automation level of the process is low and it is difficult to adapt to the needs of large-scale electronic component production. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides an apparatus and method for flipping electronic components and for a testing and packaging line using the apparatus, which has advantages and solves a series of problems.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an apparatus and method for flipping electronic components and for using the apparatus in a testing and packaging line, comprising, The testing and packaging line includes a workbench, a rotary table rotatably connected to the top of the workbench, several material boxes placed on the top of the rotary table, and several test components for testing electronic components in the material boxes fixedly installed on the top of the workbench, with the test components arranged around the outer periphery of the rotary table. The flipping mechanism includes a fixed platform fixedly connected to the top of the workbench, a flipping motor fixedly installed on one side of the fixed platform, a vacuum cylinder fixedly connected to the output end of the flipping motor, a flipping frame fixedly connected to the outside of the vacuum cylinder, a flipping table fixedly connected to the top of the flipping frame, and positioning plates that are adapted to the top of several material boxes. The top of the flipping table is provided with a suction cup array, which includes a number of suction cups. A positioning plate is slidably connected to the top of the flipping table. The positioning plate is provided with a positioning groove array. The bottom of each positioning groove corresponds to one of the suction cups in the suction cup array. The vacuum cylinder is connected to a vacuum pump and a number of connecting valves. One end of each of the connecting valves is connected to a connecting pipe. The connecting pipes are respectively connected to the corresponding suction cups on the flipping table. The top of the workbench is also fixedly installed with a first dual-axis moving arm and a linear vibrating rail. The moving end of the first dual-axis moving arm is fixedly installed with a transfer block. The transfer block includes several transfer suction heads, which are adapted to the top of the turnover table. The linear vibrating rail is located on one side of the electronic component unloading position of the turnover mechanism. The electronic components in the material box are batch-turned by the turnover mechanism and the flipped electronic components are placed on the top of the linear vibrating rail by the transfer suction heads on the first dual-axis moving arm. A second dual-axis moving arm and a tape feeding machine are arranged on one side of the linear vibrating rail. The electronic components on the linear vibrating rail are placed on the tape feeding machine by the second dual-axis moving arm for tape feeding and packaging.

[0006] Preferably, the top of the worktable is also provided with a collection shell, which is used to collect defective electronic components discarded by the transfer nozzle during the transfer of electronic components by the first dual-axis moving arm.

[0007] Preferably, the top of the rotary table is fixedly connected to several placement plates for placing material boxes, the top of the rotary table is fixedly connected to several slide rails, the top of the slide rails is slidably connected to a slider, the top of the slider is fixedly connected to a positioning block, and the positioning block abuts against the outside of the adjacent material box.

[0008] Preferably, the positioning plate is restricted to move on the top of the tilting table by a mounting pin screwed to the top of the tilting table. A telescopic spring is movably sleeved on the outside of the mounting pin, and the two ends of the telescopic spring abut against the opposite sides of the tilting table and the mounting pin, respectively.

[0009] Compared with the prior art, the present invention provides an apparatus and method for flipping electronic components and for inspecting packaging lines using the same device, which has the following advantages: 1. This invention realizes the integrated automated operation of electronic component testing, flipping, sorting and packaging. The rotating table drives the material box to pass through the test components and flipping mechanism in sequence. With the linkage of the first and second dual-axis moving arms, linear vibrating rail and tape machine, there is no need for manual participation in the material box transfer, component transfer and sorting. This greatly improves the overall process efficiency and avoids the component damage caused by manual operation, effectively ensuring the product yield of electronic components. In addition, the rotary table achieves rapid positioning and fixation of the material box through the cooperation of slide rails, sliders and positioning blocks. The fixed table of the flipping mechanism can drive the flipping table to move parallel to or away from the material box. The positioning plate and the telescopic spring cooperate to achieve precise positioning during flipping. The multi-positioning structure ensures the stability of the electronic components in the process of detection, flipping and transfer, and improves the processing accuracy of the process.

[0010] 2. The flipping mechanism of this invention uses an independently on / off connecting valve in conjunction with a one-to-one corresponding suction cup and connecting pipe, which can individually control the adsorption state of each suction cup. Even if the adsorption of individual suction cups fails, it will not affect the normal operation of other suction cups, thus ensuring the stability and continuity of batch flipping operations. Meanwhile, the positioning groove array on the positioning plate works in conjunction with the suction cup array. After adsorption, the suction cup can retract below the bottom plane of the positioning groove, effectively limiting the electronic components and preventing the components from shifting or falling off during the flipping and transfer process. In addition, the first dual-axis moving arm can release defective products into the collection shell and then transfer good products to the linear vibrating rail when transferring components, realizing automated and accurate sorting of good and defective products. Moreover, the electrode surface and marking surface of the electronic components are uniform in posture after flipping, which provides a good process foundation for subsequent tape and reel packaging and is suitable for the needs of large-scale electronic component production and processing. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the linear vibration track part of the present invention; Figure 2 This is a three-dimensional structural diagram of the fixing platform portion of the present invention; Figure 3 for Figure 2 A magnified structural diagram of part A; Figure 4 This is a three-dimensional structural diagram of the tape-tapping machine part of the present invention; Figure 5 for Figure 4 A magnified structural diagram of part B.

[0012] In the diagram: 1. Inspection and packaging line; 2. Workbench; 3. Rotary table; 4. Placement plate; 5. Material box; 6. Test assembly; 7. Slide rail; 8. Slider; 9. Positioning block; 10. Tilting mechanism; 11. Fixed table; 12. Tilting motor; 13. Vacuum cylinder; 14. Tilting frame; 15. Tilting table; 16. Connecting valve; 17. Connecting pipe; 18. Positioning plate; 19. Mounting pin; 20. First dual-axis moving arm; 21. Transfer block; 22. Transfer suction head; 23. Linear vibrating rail; 24. Second dual-axis moving arm; 25. Tape and reel machine. Detailed Implementation

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] As described in the background section, there are shortcomings in the existing technology. In order to solve the above-mentioned technical problems, this application proposes an apparatus and method for flipping electronic components and for inspecting packaging lines using the apparatus.

[0015] In one typical implementation of this application, such as Figure 1-5 As shown, an apparatus and method for flipping electronic components and for using the apparatus in a testing and packaging line include, The testing and packaging line 1 includes a workbench 2, a rotary table 3 rotatably connected to the top of the workbench 2, several material boxes 5 placed on the top of the rotary table 3, and several test components 6 for testing electronic components inside the material boxes 5 fixedly installed on the top of the workbench 2. The test components 6 are arranged around the outer periphery of the rotary table 3 and are used to test the electronic components inside the material boxes 5 placed on the rotary table 3. The top of the rotary table 3 is fixedly connected to several placement plates 4 for placing material boxes 5. The top of the rotary table 3 is fixedly connected to several slide rails 7. The top of the slide rails 7 is slidably connected to sliders 8. The top of the sliders 8 is fixedly connected to positioning blocks 9. The positioning blocks 9 abut against the outside of the adjacent material boxes 5.

[0016] With the above-described structure, the electronic components in the material box 5 can be quickly and in batches tested. Specifically, the material box 5 containing the electronic components to be tested is placed on the empty placement plate 4 on the top of the rotary table 3 and abuts against both sides of the placement plate 4. At this time, the slider 8 slides outside the slide rail 7 and drives the positioning block 9 to move, so that the two sides of the positioning block 9 abut against the two sides of the adjacent placement plate 4 to position and fix the material box 5. After the material box 5 is positioned and fixed, the rotary table 3 rotates and moves the material box 5 directly under one of the test components 6 so that the electronic components in the material box 5 can be tested.

[0017] The flipping mechanism 10 includes a fixed platform 11 fixedly connected to the top of the workbench 2. A flipping motor 12 is fixedly installed on one side of the fixed platform 11. A vacuum cylinder 13 is fixedly connected to the output end of the flipping motor 12. A flipping frame 14 is fixedly connected to the outside of the vacuum cylinder 13. A flipping table 15 is fixedly connected to the top of the flipping frame 14. The positioning plates 18 are all adapted to the top of several material boxes 5. The top of the flipping table 15 is provided with a suction cup array, which includes several suction cups. The top of the flipping table 15 is slidably connected to a positioning plate 18, which is provided with a positioning groove array. The bottom of each positioning groove corresponds to one suction cup in the suction cup array. The vacuum cylinder 13 is connected to a vacuum pump and several connecting valves 16. One end of each of the several connecting valves 16 is connected to a connecting pipe 17, and the several connecting pipes 17 are respectively connected to the corresponding suction cups on the flipping table 15. The positioning plate 18 is screwed onto the top of the tilting table 15 by a mounting pin 19, which restricts its movement on the top of the tilting table 15. A telescopic spring is movably sleeved on the outside of the mounting pin 19, and the two ends of the telescopic spring abut against the opposite sides of the tilting table 15 and the mounting pin 19, respectively.

[0018] With the above-described structure, batch flipping of the tested electronic components is possible. Specifically, after the electronic components on the material box 5 are tested by the test component 6, the tested material box 5 is rotated by the rotary table 3 to the working position of the flipping mechanism 10. At this time, the flipping motor 12 is started. The output end of the flipping motor 12 rotates, driving the vacuum cylinder 13 to rotate. The vacuum cylinder 13 rotates, driving the flipping frame 14 to rotate. The flipping frame 14 rotates, driving the flipping table 15 to rotate, causing the flipping table 15 to rotate 180° and gradually come into contact with the top of the material box 5. As the rotating platform 18 gradually comes into contact with the material box 5, one side of the positioning plate 18 first gradually comes into contact with the top of the material box 5. At this time, the rotating platform 15 continues to rotate and move. The telescopic spring that is movably sleeved outside the mounting nail 19 is compressed, causing the positioning plate 18 to slide outside the mounting nail 19. At this time, the suction cups on the rotating platform 15 correspond one-to-one with the electronic components on the material box 5. The vacuum pump can then be started to pass through the vacuum cylinder 13, the connecting valve 16 and the connecting pipe 17 in sequence until the suction cups on the rotating platform 15 effectively adsorb the electronic components. At this time, the rotating motor 12 is started in reverse to flip the adsorbed electronic components.

[0019] The top of the workbench 2 is also fixedly installed with a first dual-axis moving arm 20 and a linear vibrating rail 23. The moving end of the first dual-axis moving arm 20 is fixedly installed with a transfer block 21. The transfer block 21 includes several transfer suction heads 22. The transfer suction heads 22 are adapted to the top of the flipping table 15. The linear vibrating rail 23 is located on one side of the electronic component unloading position of the flipping mechanism 10. The electronic components in the material box 5 are flipped in batches by the flipping mechanism 10 and the flipped electronic components are placed on the top of the linear vibrating rail 23 by the transfer suction heads 22 on the first dual-axis moving arm 20. The top of the workbench 2 is also provided with a collection shell, which is used to collect defective electronic components discarded by the transfer nozzle 22 during the process of the first dual-axis moving arm 20 transferring electronic components. After the flipping mechanism 10 picks up the capacitor from the material box 5 on the rotary table 3 and flips it, a row of transfer suction heads 22 picks up one or more rows of capacitors from the flipping platform, forming a longitudinal queue along the longer direction of the capacitors. The capacitors are first released through the defective product collection box area according to their defect type, and then the remaining good capacitors are placed into the linear vibrating rail 23.

[0020] A second dual-axis moving arm 24 and a tape machine 25 are provided on one side of the linear vibrating rail 23. The electronic components on the linear vibrating rail 23 are placed on the tape machine 25 by the second dual-axis moving arm 24 for tape packaging.

[0021] The fixed platform 11 is a prior art lifting drive structure, which will not be described in detail here. The fixed platform 11 can drive the flipping platform 15 to approach or move away from the material box 5 in a manner parallel to the upper surface of the material box 5.

[0022] The positioning plate 18 can move slightly on top of the tilting table 15. When the tilting table 15 presses on the material box 5, the positioning plate 18 gradually comes into contact with the tilting table 15, so that the suction cup array on the tilting table 15 approaches the electronic components in the material box 5 to complete the adsorption. After adsorption, it can be retracted into the bottom plane of the positioning groove to limit the electronic components.

[0023] The electronic component is a chip-type bottom electrode capacitor. The capacitors in the material box 5 are arranged with the electrode surface facing up. After being flipped by the flipping mechanism 10, the electrode surface of the capacitor faces down and the marking surface faces up.

[0024] The working principle of this invention is as follows: When in use, the box 5 containing the electronic components to be tested is placed on the empty placement plate 4 at the top of the rotary table 3 and abuts against both sides of the placement plate 4. At this time, the slider 8 slides outside the slide rail 7 and drives the positioning block 9 to move, so that the two sides of the positioning block 9 abut against the two sides of the adjacent placement plate 4 to position and fix the box 5. After the box 5 is positioned and fixed, the rotary table 3 rotates and moves the box 5 directly under one of the test components 6 so that the electronic components in the box 5 can be tested. After the electronic components on the material box 5 are tested by the test component 6, the tested material box 5 is rotated by the rotary table 3 to the working position of the flipping mechanism 10. At this time, the flipping motor 12 is started. The output end of the flipping motor 12 rotates and drives the vacuum cylinder 13 to rotate. The rotation of the vacuum cylinder 13 drives the flipping frame 14 to rotate. The rotation of the flipping frame 14 drives the flipping table 15 to rotate, so that the flipping table 15 flips 180° and gradually comes into contact with the top of the material box 5. During the process of the flipping table 15 flipping and gradually coming into contact with the material box 5, one side of the positioning plate 18 first gradually comes into contact with the top of the material box 5. At this time, the flipping table 15 continues to flip and move. The telescopic spring that is movably sleeved outside the mounting nail 19 is compressed, so that the positioning plate 18 slides outside the mounting nail 19. At this time, the suction cup on the flipping table 15 corresponds one-to-one with the electronic components on the material box 5. The vacuum pump is started and passes through the vacuum cylinder 13, the connecting valve 16 and the connecting pipe 17 in sequence until the suction cup on the flipping table 15 effectively adsorbs the electronic components. At this time, the flipping motor 12 is started in reverse, so that the adsorbed electronic components can be flipped. After the flipping mechanism 10 picks up the capacitor from the material box 5 on the rotary table 3 and flips it, a row of transfer suction heads 22 picks up one or more rows of capacitors from the flipping platform. The longitudinal queue formed by the longer direction of the capacitors is a row. First, the defective products are released through the defective product collection box area according to the defect type. Then, the remaining good capacitors are placed into the linear vibration rail 23. The second dual-axis moving arm 24 then places the electronic components on the linear vibrating rail 23 onto the tape machine 25 for tape packaging.

[0025] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for flipping electronic components and a testing and packaging line using the device, characterized in that: include, Inspection of packaging lines and flipping mechanisms; The testing and packaging line includes a workbench, a rotary table rotatably connected to the top of the workbench, and several placement plates for placing material boxes on the top of the rotary table. Electronic components are placed inside the material boxes. Several test components for testing the electronic components inside the material boxes are arranged around the outer periphery of the rotary table on the top of the workbench. Several slide rails are also provided on the top of the rotary table, and sliders are slidably connected to the slide rails. A positioning block that abuts against the outside of the material box is fixed on the top of the slider. The flipping mechanism includes a fixed platform on the top of the workbench, a flipping motor installed on one side of the fixed platform, a vacuum cylinder fixed to the output end of the flipping motor, a flipping frame fixed to the outside of the vacuum cylinder, a flipping platform fixed to the top of the flipping frame, a suction cup array on the top of the flipping platform, the distribution of the suction cup array being consistent with the arrangement array of electronic components in the material box, a positioning plate slidably connected to the top of the flipping platform, an array of positioning slots on the positioning plate, the bottom of each positioning slot corresponding to one of the suction cups in the suction cup array, the vacuum cylinder being connected to a vacuum pump and several connecting valves, each of the connecting valves being connected to a connecting pipe, and each of the connecting pipes being connected to one of the suction cups of the flipping platform; The top of the workbench is also equipped with a first dual-axis moving arm, a linear vibrating rail, a second dual-axis moving arm, and a tape feeding machine. The moving end of the first dual-axis moving arm is fixed with a transfer block. The transfer block is equipped with a transfer suction head array that is adapted to the top of the turnover table. The linear vibrating rail is located on the side of the electronic component unloading position of the turnover mechanism. The second dual-axis moving arm is located on one side of the linear vibrating rail and cooperates with the tape feeding machine.

2. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: The positioning plate is fixed to the top of the tilting table by a screw threaded onto the mounting pin. A telescopic spring is movably sleeved on the outside of the mounting pin, and the two ends of the telescopic spring abut against the tilting table and the mounting pin, respectively.

3. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: Each suction cup in the suction cup array is connected to the vacuum cylinder through an independent connecting pipe and a connecting valve, and each connecting valve is an independently on / off switch valve.

4. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: The tilting table can rotate 180° under the drive of the tilting motor. When the tilting table rotates to fit against the material box, the positioning plate first contacts the top of the material box and slides on the tilting table as the tilting table continues to move.

5. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: The top of the workbench is also equipped with a collection shell, which is located on the working path of the first dual-axis moving arm and is used to collect defective electronic components released by the transfer suction head array.

6. The device for flipping an electronic component and the detection and packaging line using the device according to claim 1, characterized in that: The fixed platform is a lifting drive structure, which can drive the flipping platform to move closer to or away from the material box in a manner parallel to the upper surface of the material box.

7. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: The positioning plate can move slightly on the top of the tilting table. When the tilting table presses on the material box, the positioning plate gradually comes into contact with the tilting table, so that the suction cup array on the tilting table approaches the electronic components in the material box to complete the adsorption. After adsorption, it can be retracted into the bottom plane of the positioning groove to limit the electronic components.

8. The device for flipping electronic components and the detection and packaging line using the device according to claim 1, characterized in that: The positioning plate can move slightly on the top of the tilting table. When the tilting table presses on the material box, the positioning plate gradually comes into contact with the tilting table, so that the suction cup array on the tilting table approaches the electronic components in the material box to complete the adsorption. After adsorption, it can be retracted into the bottom plane of the positioning groove to limit the electronic components.

9. The device for flipping an electronic component and the detection and packaging line using the device according to claim 1, characterized in that: The top of the workbench is arranged around the outer perimeter of the rotary table with several test components for testing electronic components in the material box, including one or more of the following: charging, leakage current testing, capacity testing, loss testing, and ESR testing.

10. A testing and packaging line for electronic components, characterized in that, A flipping device for electronic components as described in any one of claims 1-8.

11. A method for flipping electronic components and for inspecting packaging lines using the same device, used in the apparatus described in any one of claims 1-8, characterized in that, Includes the following steps: S1: Place the box containing the electronic components to be tested on the placement plate of the rotary table. The slider on the sliding rail drives the positioning block to move, so that the positioning block abuts against the outside of the box to complete the positioning and fixing of the box. S2: The rotating table moves the positioned material box to directly below the testing component, and the testing component tests the electronic components inside the material box; S3: The rotating table continues to rotate, bringing the tested material box to the working position of the flipping mechanism. The flipping motor drives the flipping table to rotate and cooperates with the lifting action of the fixed table to make the flipping table fit with the top of the material box. The positioning plate first contacts the material box and slides. After the suction cup array corresponds to the electronic components one by one, the vacuum pump supplies air to the suction cups through the vacuum cylinder, connecting valve and connecting pipe. The suction cups adsorb the electronic components in the material box. S4: The flipping motor drives the flipping table to rotate 180° in the opposite direction to complete the flipping of the electronic components. After flipping, the flipping table is in the horizontal unloading position with the suction cup array facing upward. S5: The first dual-axis moving arm drives the transfer suction head array to the flipping table, adsorbs the flipped electronic components, first moves to the collection shell area to release the defective electronic components, and then places the good electronic components on the linear vibrating rail. S6: The second dual-axis moving arm transfers the good electronic components on the linear vibrating rail to the tape and reel machine, which then completes the tape and reel packaging of the electronic components.

12. The method for flipping an electronic component and the detection packaging line using the device according to claim 11, characterized in that, S5 involves picking up the flipped electronic components arranged in a row along the length direction, removing defective products, placing them in a linear vibration track, and then performing the same operation on all the flipped electronic components row by row.

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