Profile processing methods, apparatus, equipment and storage media
By defining the processing restriction area and modifying the marking trajectory in H-beam processing, the problem of collision between the laser processing head and the profile was solved, and a safe and reliable marking process was achieved.
Patent Information
- Application Number
- CN202610110122.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-27
- Publication Date
- 2026-05-26
AI Technical Summary
In H-beam processing, excessively long markings on the plate surface can cause the laser processing head to collide with the profile.
By acquiring the dimensional information of the profile and the physical parameters of the laser processing head, the processing restriction area is delineated, the part of the original marking trajectory that interferes with the processing restriction area is identified and modified, and an actual marking trajectory that avoids the processing restriction area is generated.
This avoids collisions between the laser processing head and the profile, ensuring the safety and accuracy of the processing.
Smart Images
Figure CN122077232A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of laser processing technology, and in particular relates to a profile processing method, apparatus, equipment and storage medium. Background Technology
[0002] H-beam processing often involves marking on the surface of the steel plates to provide positioning marks for subsequent secondary processing, such as welding the steel sections together in later stages. Therefore, both the web and flange surfaces of H-beams require marking. Currently, during the marking process on the web surface, the cutting head frequently collides with the profile. Summary of the Invention
[0003] The embodiments of this application provide a profile processing method, apparatus, equipment, and storage medium that can avoid collisions between the laser processing head and the profile caused by excessively long marking trajectories.
[0004] The profile processing method proposed in this application includes: Obtain the dimensional information of the profile and the physical parameters of the laser processing head; Based on the dimensional information and the physical parameters, at least one processing restriction area is defined on the surface of the profile to be processed; Obtain the first original marking trajectory preset on the profile; Identify the portion of the first original marking trajectory that interferes with the processing restriction area; Modify the marking trajectory of the interfering portion to generate a first actual marking trajectory that avoids the processing restriction area.
[0005] Optionally, the profile is an H-beam, which includes a web, a first flange, and a second flange. The first flange and the second flange are arranged opposite to each other in the width direction, and the web connects the first flange and the second flange. The acquisition of the profile's dimensional information and the physical parameters of the laser processing head includes: Establish a workpiece coordinate system, with the surface of the web plate being an XY plane, the X direction being parallel to the length direction of the H-beam, and the Y direction being parallel to the width direction; Obtain the Y-coordinate value Y1 of the inner surface of the first wing plate in the workpiece coordinate system, and obtain the Y-coordinate value Y2 of the inner surface of the second wing plate in the workpiece coordinate system, wherein Y2 > Y1.
[0006] Optionally, defining at least one processing restriction area on the surface to be processed based on the size information and the physical parameters includes: Based on the maximum physical radius of the laser processing head, a safe processing offset D along the width direction of the processing restriction area is determined, wherein the safe processing offset is greater than the maximum physical radius of the laser processing head; A first machining restriction region and a second machining restriction region are defined on the web. The first machining restriction region is defined by a first restriction boundary, and the Y-coordinate value of the first restriction boundary in the workpiece coordinate system is Y. limit1 =Y1+D; The second machining restriction area is defined by a second restriction boundary, and the Y-coordinate value of the second restriction boundary in the workpiece coordinate system is Y1+D; limit2 =Y2-D.
[0007] Optionally, identifying the portion of the first original marking trajectory that interferes with the processing restriction area includes: Traverse each trajectory segment in the first original marked trajectory; Obtain the starting and ending coordinates of each trajectory segment; Determine the Y-coordinate range of the trajectory line segment and the Y-coordinate range [Y1, Y2] of the first processing restriction area. limit1 ] or the Y coordinate range of the second processing restriction area [Y limit2 Does [Y2] have an intersection? If it exists, the trajectory segment is determined to be an interference segment.
[0008] Optionally, modifying the marking trajectory of the interfering portion includes: Based on the coordinates of the intersection point of the interference line segment and the corresponding constraint boundary; Break the interference line segment at the intersection point; At the intersection point, the interference line segment is split into two segments, and the portion located within the inner processing restriction area of the restriction boundary is removed; Based on the intersection coordinates, the intersection is connected to the endpoints that are not located in the first processing restriction area or the second processing restriction area.
[0009] Optionally, the profile processing method further includes: Obtain the processing length constraint value of the profile in the length direction; Determine whether the continuous length of the processing segment extending along the length direction in the first actual marking trajectory is greater than the processing length constraint value; If so, along the length direction, the length processing segment is divided into at least two processing sub-segments, the length of which is less than or equal to the processing length constraint value.
[0010] Optionally, the profile processing method further includes: Obtain the second original marking trajectory located on the surface of the web plate; In response to an operation command, the second original marking trajectory located on the surface of the web plate is projected onto the first wing plate or the second wing plate in a direction perpendicular to the surface of the web plate, thereby generating a projected marking trajectory located on the surface of the first wing plate or the second wing plate; wherein, along the length direction, the length of the projected marking trajectory is the same as the length of the second original marking trajectory.
[0011] This application provides a profile processing apparatus, comprising: The first acquisition module is used to acquire the dimensional information of the profile and the physical parameters of the laser processing head; The delineation module is used to delineate at least one processing restriction area on the surface of the profile to be processed based on the dimensional information and the physical parameters. The second acquisition module is used to acquire the first original marking trajectory preset by the profile; The identification module is used to identify the portion of the first original marking trajectory that interferes with the processing restriction area; and The modification module modifies the marking trajectory of the interfering portion to generate a first actual marking trajectory that avoids the processing restriction area.
[0012] This application provides a processing apparatus, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the profile processing method as described in any of the above embodiments.
[0013] This application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the profile processing method as described in any of the above embodiments.
[0014] In the profile processing method, apparatus, equipment and storage medium provided in this application, the processing restriction area is determined based on the size information of the profile and the parameters of the laser processing head. It is then determined whether the first original marking trajectory of the profile interferes with the processing restriction area. If interference occurs, the marking trajectory of that part is modified to generate an actual marking trajectory that avoids the processing restriction area, thereby avoiding collision between the laser processing head and the profile due to the excessive length of the marking trajectory. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0016] Figure 1This is a schematic flowchart of the profile processing method provided in the embodiments of this application.
[0017] Figure 2 This is a cross-sectional schematic diagram of the profile and laser processing head provided in the embodiments of this application.
[0018] Figure 3 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0019] Figure 4 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0020] Figure 5 This is a top view of the H-beam provided in an embodiment of this application.
[0021] Figure 6 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0022] Figure 7 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0023] Figure 8 This is a schematic diagram of the H-beam processing process provided in the embodiments of this application.
[0024] Figure 9 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0025] Figure 10 This is another schematic diagram of the H-beam steel processing process provided in the embodiments of this application.
[0026] Figure 11 This is another schematic diagram of the profile processing method provided in the embodiments of this application.
[0027] Figure 12 This is a schematic diagram of the profile processing apparatus provided in the embodiments of this application.
[0028] Figure 13 A schematic diagram of the processing equipment provided in the embodiments of this application.
[0029] Explanation of reference numerals in the attached figures: Profile 100, H-beam 10, web 11, first wing plate 12, second wing plate 13, laser processing head 20; First processing restriction area A1, first restriction boundary a1, second processing restriction area A2, second restriction boundary a2; Length direction X, width direction Y. The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0031] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0033] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0035] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.
[0036] Please see Figure 1 The profile processing method proposed in this application includes steps S10 to S50.
[0037] Step S10: Obtain the dimensional information of the profile 100 and the physical parameters of the laser processing head 20.
[0038] Profile 100 can be an H-beam or H-beam-like steel that requires marking. The dimensional information of profile 100 includes the overall and partial dimensions, outline, and structural features of the profile 100 to be processed. The dimensional information of profile 100 can be obtained through methods such as importing drawings, analyzing 3D models, or on-site measurement.
[0039] Step S20: Based on the dimensional information and physical parameters, delineate at least one processing restriction area on the surface of the profile 100 to be processed.
[0040] The physical parameters of the laser processing head 20 include, but are not limited to, the minimum working distance, focusing range, radial dimensions, or the outline of the external protective cover. The processing restriction area refers to the physical area on the surface of the profile 100 that is unsuitable or impossible to mark. This could be an area containing uneven structures, holes, or groove edges on the surface of the profile 100, or an area where, due to the structural dimensions of the laser processing head 20 itself, collisions or focal misalignment may occur when the laser processing head 20 approaches the edge of the profile 100.
[0041] In subsequent processing, the laser processing head 20 avoids the processing restriction area of the profile 100, thereby preventing the laser processing head 20 from getting stuck in the physical area of the profile 100 where it cannot be marked, or preventing the laser processing head 20 from colliding with the profile 100.
[0042] Step S30: Obtain the first original marking trajectory S preset by the profile 100.
[0043] The first original marking trajectory S corresponding to the preset marking content can be obtained from the marking process file. The marking trajectory is usually composed of a series of continuous vector line segments. It can be understood that the marking content corresponding to the first original marking trajectory S is the content originally intended to be marked on the surface of the profile 100 without considering the processing restriction area.
[0044] Step S40: Identify the portion of the first original marking trajectory S that interferes with the processing restriction area.
[0045] The first original marking trajectory S is compared with the processing restriction area determined in step S20 by position comparison and geometric relationship analysis to identify the part of the marking trajectory that falls into the processing restriction area.
[0046] Step S50: Modify the marking trajectory of the interfering part to generate the first actual marking trajectory to avoid the processing restriction area.
[0047] The marking trajectories of all interfering portions identified in step S40 are modified to avoid processing restriction areas while ensuring the recognizability of the marking content and meeting process requirements. Modification methods may include truncating the interfering line segments at the boundary of the restriction area and reconnecting them to a safe point outside the boundary, or shifting the marking trajectories of the interfering portions. All modified marking trajectories, together with the original trajectory portions where no interference occurred, constitute the first actual marking trajectory. The laser processing head 20 performs corresponding marking operations on the profile 100 according to the first actual marking trajectory.
[0048] In the profile processing method, apparatus, equipment and storage medium provided in this application, the processing restriction area is determined according to the size information of the profile and the parameters of the laser processing head. It is determined whether the first original marking trajectory S of the profile 100 interferes with the processing restriction area. If interference occurs, the marking trajectory of that part is modified to generate an actual marking trajectory that avoids the processing restriction area, thereby avoiding the collision between the laser processing head and the profile due to the excessive length of the marking trajectory.
[0049] Please see Figure 2 Optionally, the profile 100 is an H-beam 10, which includes a web 11, a first flange 12 and a second flange 13. The first flange 12 and the second flange 13 are arranged opposite to each other along the width direction Y, and the web 11 connects the first flange 12 and the second flange 13.
[0050] The H-beam 10 has an H-shaped cross-section, consisting of a central web 11 and two side flanges 12 and 13. In actual manufacturing, laser marking is often required on the surface of the web 11 of the H-beam 10 to record information such as model number or batch number.
[0051] The movement of the laser processing head 20 along the width direction Y of the H-beam 10 is restricted by the first flange 12 and the second flange 13. If the marking trajectory is too close to the inner surfaces of the first flange 12 and the second flange 13, a collision may occur. Therefore, the specific division of the processing restriction area is related to the relative positions of the first flange 12 and the second flange 13 on the web 11.
[0052] Please see Figure 3 Optionally, the dimensional information of the profile 100 and the physical parameters of the laser processing head 20 are obtained, including: Step S11: Establish the workpiece coordinate system. The surface of the web 11 is the XY plane. The X direction is parallel to the length direction X of the H-beam 10, and the Y direction is parallel to the width direction Y.
[0053] A workpiece coordinate system is established using the surface to be machined on the web 11 as the XY plane. When establishing the workpiece coordinate system, a specific corner point of the surface to be machined on the web 11 is used as the origin; for example, the intersection of the centerline of the web 11 along the width direction Y and the side end of the web 11 is used as the origin. The length direction X of the H-beam 10 is used as the X-axis, and the width direction Y is used as the Y-axis.
[0054] Step S12: Obtain the Y coordinate value Y1 of the inner surface of the first wing plate 12 in the workpiece coordinate system, and obtain the Y coordinate value Y2 of the inner surface of the second wing plate 13 in the workpiece coordinate system, where Y2 > Y1.
[0055] The inner surface of the first wing plate 12 refers to the vertical surface of the first wing plate 12 that is closer to the web plate 11, and the inner surface of the second wing plate 13 is the vertical surface of the second wing plate 13 that is closer to the web plate 11. Obtaining their Y coordinate values Y1 and Y2 in the workpiece coordinate system essentially marks the boundary where the surface of the web plate 11 interferes with the inner wall of the wing plate in the Y direction. When the Y coordinate of the endpoint of the marked trajectory line segment crosses Y1 or Y2, the laser processing head 20 will collide with the first wing plate 12 or the second wing plate 13.
[0056] The movement of the laser processing head 20 along the width direction Y of the H-beam 10 is restricted by the first wing plate 12 and the second wing plate 13. By obtaining the Y coordinate values of the inner side surface of the first wing plate 12 and the inner side surface of the second wing plate 13 in the workpiece coordinate system, the boundary where the surface of the web plate 11 interferes with the inner sidewalls of the first wing plate 12 and the second wing plate 13 in the Y direction is defined, and the laser processing head 20 is controlled to avoid the boundary to prevent collision.
[0057] Please see Figure 4 Optionally, step S20, based on dimensional information and physical parameters, delineates at least one processing restriction area on the surface to be processed, including: Step S21: Based on the maximum physical radius of the laser processing head 20, determine the safe processing offset D along the width direction Y of the processing restriction area. The safe processing offset is greater than the maximum physical radius of the laser processing head 20.
[0058] Understandably, the safe machining offset not only covers the physical radius of the laser processing head 20 itself, but also includes a certain safety margin to compensate for equipment installation errors, coordinate calibration errors, profile 100 positioning tolerances, and possible following errors of the motion control system. For example, if the maximum physical radius of the laser processing head 20 is 50mm, the safe machining offset D can be set to 60mm or 70mm.
[0059] If the safe processing offset is equal to the maximum physical radius of the laser processing head 20, the laser processing head 20 may be tangent to the first wing plate 12 or the second wing plate 13. Due to the existence of the error, the laser processing head 20 may collide with the first wing plate 12 and the second wing plate 13.
[0060] Step S22: Determine the first machining restriction area A1 and the second machining restriction area A2 on the web 11. The first machining restriction area A1 is defined by the first restriction boundary a1, and the Y-coordinate value of the first restriction boundary a1 in the workpiece coordinate system is Y. limit1 =Y1+D; The second machining restriction area A2 is defined by the second restriction boundary a2, and the Y-coordinate value of the second restriction boundary a2 in the workpiece coordinate system is Y1+D; limit2 =Y2-D.
[0061] If the Y coordinate value of the optical axis center of the laser processing head 20 is equal to Y1 or Y2, the outermost point of the outer shell of the laser processing head 20 has already collided with the inner side of the first wing plate 12 or the second wing plate 13. Therefore, the optical axis center should be moved away from the first wing plate 12 or the second wing plate 13 by at least a certain distance in the Y direction, which is the safe processing offset.
[0062] Please see Figure 5 The first processing restriction area A1 is close to the inner surface of the first wing plate 12. The range of the first processing restriction area A1 is defined by the Y coordinate and is located in [Y1, Y2]. limit1 Between ], where Y limit1 =Y1+D. That is, the first processing restriction area A1 is a strip-shaped area with a width of D that extends from the inner side of the first wing plate 12 toward the center of the web plate 11.
[0063] Similarly, the second processing restriction area A2 is close to the inner surface of the second wing plate 13. The range of the second processing restriction area A2 is defined by the Y coordinate and is located in [Y]. limit2 Between [Y1, Y2], where Y limit2 =Y2-D. That is, the second processing restriction area A2 is a strip-shaped area with a width of D extending from the inner side of the second flange 13 towards the center of the web 11. It can be understood that on the surface to be processed on the web 11, the Y coordinate is within (Y2-D). limit1 Y limit2 The central area between the two is the safe processing area.
[0064] Through steps S21 and S22, a practically usable safe machining area is defined on the XY plane of the web 11 of the H-beam 10. The effective range of the safe machining area in the Y direction is Y limit1 ≤Y≤Y limit2 The physical dimensions of the machining head and the necessary engineering safety margins were taken into account to ensure that the machining head would not collide with the wing plate during the machining process.
[0065] Please see Figure 6 Optionally, step S40 identifies the portion of the first original marking trajectory S that interferes with the processing restriction area, including: Step S41: Traverse each trajectory segment in the first original marked trajectory S.
[0066] The initial marking trajectory S typically consists of a series of continuous line segments, which together form the graphic or text to be marked. These line segments are accessed and processed one by one, following the order in which the trajectory was generated. For example, a rectangular marking trajectory might be decomposed into four straight line segments.
[0067] Step S42: Obtain the starting and ending coordinates of each trajectory segment; For each trajectory segment to be inspected, read the coordinate values of its two endpoints in the workpiece coordinate system, especially the coordinates in the width direction Y, that is, the coordinates on the Y-axis.
[0068] Step S43: Determine the Y-coordinate range of the trajectory line segment and the Y-coordinate range [Y1, Y2] of the first processing restriction area A1. limit1 [Y] or the Y coordinate range of the second processing restriction area A2 limit2 Y 2] Does the intersection exist? Step S44: If it exists, determine that the trajectory line segment is an interference line segment.
[0069] Calculate the Y-coordinate range of the line segment itself. Then compare this range with the Y-coordinate range [Y1, Y2] of the first processing restriction area A1. limit1 ] and the Y coordinate range of the second processing restriction area A2 [Y limit2 The Y-coordinate range of the trajectory segment itself is compared with the Y-coordinate range of the two processing limit regions. If there is an overlap, the trajectory segment is determined to be an interference segment.
[0070] Transforming the spatial interference problem into a numerical comparison problem of a one-dimensional coordinate interval reduces computational complexity. Furthermore, traversing all marked trajectories ensures that interference-affected trajectory segments are identified without omission, facilitating subsequent modifications to these segments to prevent collisions during laser processing head 20 processing.
[0071] Please see Figure 7 Optionally, step S50 modifies the marking trajectory of the interfering portion, including: Step S51: Based on the coordinates of the intersection point of the interference line segment and the corresponding constraint boundary; For each line segment identified as interfering, calculate its intersection point with the corresponding constraint boundary. For example, if a line segment interferes with the first processing constraint area A1, then its intersection with the first constraint boundary a1 is also its coordinate Y. limit1 Intersecting; if it interferes with the second processing restriction region A2, then it intersects with the second restriction boundary a2, which is also the coordinate Y. limit2 intersect.
[0072] Step S52: Break the interference line segment at the intersection point; Step S53: At the intersection, split the interference line segment into two line segments and remove the portion located within the inner processing restriction area of the restriction boundary; After obtaining the intersection coordinates, the original line segment from start point A to end point B is now split at the intersection, forming line segments AP and PB. To determine which of these two line segments lies within the processing restriction area, the line segment intersecting the first restriction boundary a1 has a Y-coordinate less than Y. limit1 The portion lies within the processing restriction area. For the line segment intersecting the second restriction boundary a2, its Y-coordinate is greater than Y. limit2 The portion of the line is located within the processing restriction area. Line segments located within the processing restriction area are removed. For example, if line segment AB is drawn from the safe area into the second processing restriction area A2, then after splitting, the portion located within the second processing restriction area A2, i.e., line segment PB, will be removed.
[0073] Step S54: Based on the intersection coordinates, connect the intersection to the endpoints within the first processing restriction area A1 or the second processing restriction area A2.
[0074] After removing the portion of the line segment located within the processing restriction area, the original line segment may be reduced to a single safe AP line segment. To ensure the integrity and continuity of the marking pattern, a connecting line is generated along the restriction boundary at the intersection point P, and the endpoint of this connecting line is then connected to the endpoint of the original trajectory located within the safe processing area.
[0075] Please see Figure 8 , Figure 8 The upper half shows the original, unmodified marking trajectory S of the web 11, while the lower half shows the modified original marking trajectory S of the web 11. Six patterns are expected to be marked on the surface of the web 11 of the H-beam 10 to be machined, with one pattern having an original marking trajectory S of ABCE. Segments AB and CE are at least partially located within the second processing restriction area A2, and segment BC is also located within the second processing restriction area A2.
[0076] After steps S51-S53, the coordinates of the intersection point P of line segment AB and the constraint boundary are calculated, and the portion from P to B is discarded. In step S54, the line segment from point A to intersection point P is retained. Then, starting from intersection point P, it is moved horizontally along the constraint boundary to C', and then extended vertically to connect with point E, which is not located within the processing constraint area. Finally, the actual marking trajectory becomes A-B'(P)-C'-E. The marking trajectories of the remaining 5 patterns are processed in the same way. The processing results can be found in [reference needed]. Figure 8 .
[0077] Please see Figure 9 Optionally, the profile processing method also includes: Step S61: Obtain the machining length constraint value L of profile 100 in the length direction X; The processing length constraint value L is a key parameter, representing the maximum effective distance that the laser processing head 20 can move in the length direction X of the profile 100 during a single continuous marking operation, under the required process conditions. The specific setting of the processing length constraint value L can be related to the following factors: the travel range of the laser processing head 20, the length of the profile 100 being processed, and the stability of the processing technology.
[0078] Step S62: Determine whether the continuous length of the processing segment extending along the length direction X in the first actual marking trajectory is greater than the processing length constraint value L.
[0079] After avoiding the machining restriction area in the width direction Y, it is also necessary to evaluate whether the first actual marking trajectory satisfies the constraint in the length direction X. Specifically, the spatial span of the marking trajectory in the X-axis direction of the workpiece coordinate system is analyzed. For the marking content arranged along the length direction X on the web 11, the difference between the maximum and minimum X coordinates of the point set of the marking trajectory is the continuous length of the trajectory in the length direction X. Then, it is compared whether this continuous length exceeds the machining length constraint value L.
[0080] Step S63: If so, along the length direction X, divide the length processing segment into at least two processing sub-segments, the length of which is less than or equal to the processing length constraint value L.
[0081] If the aforementioned continuous length exceeds the processing length constraint value L, it indicates that the current marking trajectory cannot be processed in one go and needs to be segmented. Specifically, along the length direction X of the profile 100, the first actual marking trajectory is divided into several processing sub-segments. Each sub-segment is a continuous part of the original first actual marking trajectory, and its length in the X direction must be less than or equal to the processing length constraint value L. Adjacent processing sub-segments are smoothly connected at the dividing point to ensure the continuity of the entire marking pattern.
[0082] Please see Figure 10The first actual marking trajectory of profile 100 is FGHJ, and the processing trajectory after automatic segmentation in the length direction X is F'-G'-K'-H, KMNH, M-H'-J'-N.
[0083] The excessively long marking trajectory of the marking pattern in the length direction X is divided into several segments for sequential processing, thereby actively interrupting the long contour feature and avoiding the problem of large feature positioning offset after processing due to the actual profile 100's own torque or large deviation of the profile 100 before and after placement.
[0084] During the processing of H-beam 10, sometimes, according to the requirements of the drawings or the needs of subsequent processes, certain identical or related marking information may need to appear simultaneously or selectively on both sides of the web 11. When the H-beam 10 is processed, it remains stationary, and the laser processing head 20, being a rotary type device, cannot rotate to the other side of the web 11 for marking processing.
[0085] Based on this, this application proposes a method for projecting the marking trajectory on the surface of the web 11 onto the side of the flange for marking. The profile processing method also includes: Step S71: Obtain the second original marking trajectory located on the surface of the web plate 11; Step S72: In response to the operation command, the second original marking trajectory located on the surface of the web plate 11 is projected onto the first wing plate 12 or the second wing plate 13 in a direction perpendicular to the surface of the web plate 11, thereby generating a projected marking trajectory located on the surface of the first wing plate 12 or the second wing plate 13; wherein, along the length direction X, the length of the projected marking trajectory is the same as the length of the second original marking trajectory.
[0086] The second original marking trajectory is located on the side of the web plate 11 facing away from the initially set processing surface. The second original marking trajectory is the preset path data that needs to be marked on the surface. It can be the same as, related to or completely different from the first original marking trajectory S.
[0087] The operation instructions can be selected from the operator's human-machine interface or automatically triggered by the host computer according to preset process rules. Each path point on the second original marking trajectory is projected onto the first wing plate 12 or the second wing plate 13 along the normal of the web plate 11. The projection transformation does not change the length of the trajectory along the length direction X.
[0088] For example, a line segment with a length of 100mm on the surface of the web 11 will still have a length of 100mm when projected onto the first wing 12, thus ensuring the accurate transmission of dimensional information. Projecting the second original marking trajectory on the surface of the web 11 onto the first wing 12 and the second wing 13 can solve the positioning reference problem in subsequent processes of actual production to a certain extent, and can provide guidance for production personnel.
[0089] This application provides a profile processing apparatus 40, comprising: The first acquisition module 41 is used to acquire the dimensional information of the profile 100; The delineation module 42 is used to delineate at least one processing restriction area on the surface of the profile 100 to be processed based on dimensional information and physical parameters. The second acquisition module 43 is used to acquire the first original marking trajectory S preset by the profile 100; The identification module 44 is used to identify the portion of the first original marking trajectory S that interferes with the processing restriction area; and Modify module 45 to modify the marking trajectory of the interfering part and generate the first actual marking trajectory to avoid the processing restriction area.
[0090] Please see Figure 13 This application provides a processing device 30, including a memory 32 and a processor 31. The memory 32 stores a computer program, and the processor 31 executes the computer program to implement the profile processing method as described in any of the above embodiments.
[0091] The processing equipment 30 may include, but is not limited to, the processor 31 and the memory 32. Those skilled in the art will understand that... Figure 13 This is merely an example of processing equipment 30 and does not constitute a limitation on processing equipment 30. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, buses, etc.
[0092] The processor 31 can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.
[0093] In some embodiments, memory 32 may be an internal storage unit of the processing equipment 30, such as a hard drive or memory of the processing equipment. In other embodiments, memory 32 may be an external storage device of the processing equipment, such as a plug-in hard drive, smart media card (SMC), secure digital (SD) card, flash card, etc., provided on the processing equipment. Furthermore, memory 32 may include both internal and external storage units of the processing equipment. Memory 32 is used to store operating systems, applications, bootloaders, data, and other programs, such as program code for computer programs. Memory 32 may also be used to temporarily store data that has been output or will be output.
[0094] For example, computer program 33 may be divided into one or more modules / units, one or more of which are stored in memory 32 and executed by processor 31 to complete this application. One or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of computer program 33 in processing equipment 30.
[0095] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.
[0096] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.
[0097] If the aforementioned integrated units are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. This computer program can be stored in a computer-readable storage medium; when executed by a processor, the computer program can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. Computer-readable media include: any entity or device capable of carrying computer program code to a device / terminal equipment, recording media, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.
[0098] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the profile processing method of any of the above embodiments.
[0099] For example, when the program is executed by a processor, the following steps of the profile processing method are implemented: Step S10: Obtain the dimensional information of the profile 100 and the physical parameters of the laser processing head 20; Step S20: Based on the dimensional information and physical parameters, delineate at least one processing restriction area on the surface of the profile 100 to be processed; Step S30: Obtain the first original marking trajectory S preset by the profile 100; Step S40: Identify the portion of the first original marking trajectory S that interferes with the processing restriction area; Step S50: Modify the marking trajectory of the interfering part to generate the first actual marking trajectory to avoid the processing restriction area.
[0100] The embodiments of this application provide a computer program product that, when run on a terminal device, enables the terminal device to implement the steps of the profile processing method of any of the above embodiments.
[0101] For example, when a computer program product runs on a terminal device, the terminal device can perform the following steps of the profile processing method: Step S10: Obtain the dimensional information of profile 100; Step S20: Based on the dimensional information and physical parameters, delineate at least one processing restriction area on the surface of the profile 100 to be processed; Step S30: Obtain the first original marking trajectory S preset by the profile 100; Step S40: Identify the portion of the first original marking trajectory S that interferes with the processing restriction area; Step S50: Modify the marking trajectory of the interfering part to generate the first actual marking trajectory to avoid the processing restriction area.
[0102] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0103] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0104] In the embodiments provided in this application, it should be understood that the disclosed apparatus / devices and methods can be implemented in other ways. For example, the apparatus / device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0105] The units described above as separate components may or may not be physically separate. Similarly, the components shown as units may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.
[0106] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A method for processing profiles, characterized in that, include: Obtain the dimensional information of the profile and the physical parameters of the laser processing head; Based on the dimensional information and the physical parameters, at least one processing restriction area is defined on the surface of the profile to be processed; Obtain the first original marking trajectory preset on the profile; Identify the portion of the first original marking trajectory that interferes with the processing restriction area; Modify the marking trajectory of the interfering portion to generate a first actual marking trajectory that avoids the processing restriction area.
2. The profile processing method according to claim 1, characterized in that, The profile is an H-beam, which includes a web, a first flange, and a second flange. The first flange and the second flange are arranged opposite to each other along the width direction, and the web connects the first flange and the second flange. The step of basing information on the size information and the physical parameters includes: Establish a workpiece coordinate system, with the surface of the web plate being an XY plane, the X direction being parallel to the length direction of the H-beam, and the Y direction being parallel to the width direction; Obtain the Y-coordinate value Y1 of the inner surface of the first wing plate in the workpiece coordinate system, and obtain the Y-coordinate value Y2 of the inner surface of the second wing plate in the workpiece coordinate system, wherein Y2 > Y1.
3. The profile processing method according to claim 2, characterized in that, The step of defining at least one processing restriction area on the surface to be processed based on the size information and the physical parameters includes: Based on the maximum physical radius of the laser processing head, a safe processing offset D along the width direction of the processing restriction area is determined, wherein the safe processing offset is greater than the maximum physical radius of the laser processing head; A first machining restriction region and a second machining restriction region are defined on the web. The first machining restriction region is defined by a first restriction boundary, and the Y-coordinate value of the first restriction boundary in the workpiece coordinate system is Y. limit1 =Y1+D; The second machining restriction area is defined by a second restriction boundary, and the Y-coordinate value of the second restriction boundary in the workpiece coordinate system is Y1+D; limit2 =Y2-D.
4. The profile processing method according to claim 3, characterized in that, The identification of the portion of the first original marking trajectory that interferes with the processing restriction area includes: Traverse each trajectory segment in the first original marked trajectory; Obtain the starting and ending coordinates of each trajectory segment; Determine the Y-coordinate range of the trajectory line segment and the Y-coordinate range [Y1, Y2] of the first processing restriction area. limit1 ] or the Y coordinate range of the second processing restriction area [Y limit2 Does [Y2] have an intersection? If it exists, the trajectory segment is determined to be an interference segment.
5. The profile processing method according to claim 4, characterized in that, The modification of the marking trajectory of the phase interference portion includes: Based on the coordinates of the intersection point of the interference line segment and the corresponding constraint boundary; Break the interference line segment at the intersection point; At the intersection point, the interference line segment is split into two segments, and the portion located within the inner processing restriction area of the restriction boundary is removed; Based on the intersection coordinates, the intersection is connected to the endpoints that are not located in the first processing restriction area or the second processing restriction area.
6. The profile processing method according to any one of claims 1 to 5, characterized in that, The profile processing method further includes: Obtain the processing length constraint value of the profile in the length direction; Determine whether the continuous length of the processing segment extending along the length direction in the first actual marking trajectory is greater than the processing length constraint value; If so, along the length direction, the length processing segment is divided into at least two processing sub-segments, the length of which is less than or equal to the processing length constraint value.
7. The profile processing method according to any one of claims 2 to 5, characterized in that, The profile processing method further includes: Obtain the second original marking trajectory located on the surface of the web plate; In response to an operation command, the second original marking trajectory located on the surface of the web plate is projected onto the first wing plate or the second wing plate in a direction perpendicular to the surface of the web plate, thereby generating a projected marking trajectory located on the surface of the first wing plate or the second wing plate; wherein, along the length direction, the length of the projected marking trajectory is the same as the length of the second original marking trajectory.
8. A profile processing device, characterized in that, include: The first acquisition module is used to acquire the dimensional information of the profile and the physical parameters of the laser processing head; The delineation module is used to delineate at least one processing restriction area on the surface of the profile to be processed based on the dimensional information and the physical parameters. The second acquisition module is used to acquire the first original marking trajectory preset by the profile; The identification module is used to identify the portion of the first original marking trajectory that interferes with the processing restriction area; as well as The modification module modifies the marking trajectory of the interfering portion to generate a first actual marking trajectory that avoids the processing restriction area.
9. A processing equipment, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the profile processing method as described in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the profile processing method as described in any one of claims 1 to 7.