A power supply module and heat spreader with high thermal conductivity and high reliability

Abstract

This invention discloses a high thermal conductivity and high reliability power supply module and a vapor chamber, comprising a carrier plate, a thermally conductive material, and a vapor chamber, with the thermally conductive material disposed between the vapor chamber and the carrier plate. The vapor chamber includes a primary edge region, a secondary edge region, and a connecting region. The primary edge region is positioned above the primary edge region of the carrier plate, and the secondary edge region is positioned above the secondary edge region of the carrier plate. The primary and secondary edge regions form an integral structure through the connecting region. The power supply module of this invention divides the vapor chamber into a primary edge region and a secondary edge region. The primary edge region is attached to the primary edge of the carrier plate, and the secondary edge region is attached to the secondary edge of the carrier plate. This eliminates the need for additional Mylar plates between the vapor chamber and the primary edge components of the carrier plate to address safety regulations. Consequently, the thermal resistance between the primary edge components of the carrier plate and the primary edge region of the vapor chamber is only the thermal resistance of the thermally conductive material, achieving a thermal resistance that is 10% to 30% of existing thermal resistances, significantly reducing the thermal resistance from the heat-generating components to the vapor chamber.

Description

Technical Field

[0001] This invention belongs to the field of power module technology, and particularly relates to a power module heat spreader with high thermal conductivity and high reliability. Background Technology

[0002] Currently, high-voltage power supply modules employ two types of heat dissipation structures:

[0003] One approach involves designing separate heat sinks for the primary and secondary sides of the carrier board, which are then assembled separately. The primary side heat sink is bonded to the primary side components using adhesive, while the secondary side heat sink is assembled to the carrier board using screws. However, this method has limited applicability, primarily because the module can only be wave soldered at the customer's site and cannot be used for reflow soldering. This is because the primary side heat sink is bonded to the primary side components with adhesive; during reflow soldering, the solder paste remelts, and the thermal expansion of the heat sink pulls the primary side components apart, resulting in open circuits at the solder joints.

[0004] Another approach is to place a single vapor chamber on top of the carrier board and secure it to the carrier board's screw holes. This requires attaching at least two layers of Mylar film to the contact area between the carrier board's primary edge and the vapor chamber. To ensure proper coverage at corners, the vapor chamber needs to extend outwards so that its corners directly avoid the carrier board's primary edge components, thus meeting the safety regulations for the vapor chamber between the carrier board's primary and secondary edges. However, this inevitably results in the vapor chamber being larger than the carrier board, wasting board space for the customer. Furthermore, due to the poor thermal conductivity of Mylar film, the interface thermal resistance between the carrier board's primary edge components and the vapor chamber increases, leading to poor heat dissipation. Moreover, to meet the safety regulations for the carrier board's primary edge components and the vapor chamber, the Mylar film must adhere very tightly to the vapor chamber, and the distance between each layer of Mylar film must also meet safety regulations. This necessitates making the vapor chamber above the carrier board's primary edge components as flat as possible for better Mylar film adhesion. If the vapor chamber has steps, it is difficult to properly cover the Mylar film at the step locations, making it difficult to meet the safety regulations for distance. To meet the safety requirements of the heat exchange plate and the carrier plate, the heat exchange plate has no support points on the original side of the carrier plate. When the heat exchange plate is subjected to force, it is prone to deformation.

[0005] In summary, high-voltage power supply modules urgently need to achieve the following four functions:

[0006] (1) The power supply module must meet both reflow soldering and wave soldering requirements;

[0007] (2) Reduce the thermal resistance from the primary-side components of the carrier board to the housing;

[0008] (3) The heat exchange plate has strong bending resistance;

[0009] (4) The size of the heat spreader is similar to that of the carrier plate, saving space for the customer's plate. Summary of the Invention

[0010] To achieve the above objectives, the first aspect of the present invention provides a power module with high thermal conductivity and high reliability, characterized in that it includes a carrier plate, a thermally conductive material and a heat spreader, wherein the carrier plate includes a primary edge portion and a secondary edge portion, the primary edge portion is provided with a primary edge device, the secondary edge portion is provided with a secondary edge device, the heat spreader is disposed on the carrier plate, and the thermally conductive material is disposed between the heat spreader and the carrier plate;

[0011] The heat exchange plate includes a primary edge area, a secondary edge area, and a connecting area. The primary edge area is located above the primary edge of the carrier plate, and the secondary edge area is located above the secondary edge of the carrier plate. The primary edge area and the secondary edge area form an integral structure through the connecting area.

[0012] Preferably, the connection area is a first insulating component, and the primary and secondary sides of the heat spreader are heat-conducting components; the primary and secondary sides of the carrier plate are electrically isolated.

[0013] Preferably, the original edge area of ​​the heat exchange plate is provided with a boss structure, which is used to support the heat exchange plate and the carrier plate.

[0014] Preferably, the device further includes a radiator, a ceramic plate is disposed between the radiator and the heat spreader, the ceramic plate is fixed to the heat spreader by a thermally conductive adhesive, and a thermally conductive material is disposed between the ceramic plate and the radiator.

[0015] Preferably, the thermally conductive material includes thermally conductive gel, thermally conductive silicone grease, or thermally conductive pad.

[0016] In another aspect, the present invention provides a heat spreader, which includes a primary edge region, a secondary edge region, and a connecting region. The primary edge region is disposed above the primary edge portion of a carrier plate, and the secondary edge region is disposed above the secondary edge portion of the carrier plate. The primary edge region and the secondary edge region form an integral structure through the connecting region. The primary edge portion and the secondary edge portion of the carrier plate are electrically isolated.

[0017] Preferably, the connection area is a first insulating component, and the primary and secondary side areas of the heat spreader are heat-conducting components.

[0018] Preferably, the original edge area of ​​the heat exchange plate is provided with a boss structure, which is used to support the heat exchange plate and the carrier plate.

[0019] Preferably, a first Mylar sheet and a second Mylar sheet are attached to the upper surface of the heat spreader. Both the first Mylar sheet and the second Mylar sheet have a bent portion that extends from the side of the heat spreader to the lower surface of the heat spreader. The first Mylar sheet and the second Mylar sheet are attached above the original edge area of ​​the heat spreader.

[0020] Preferably, a second insulating component and a third insulating component are respectively provided at the two corners on the outer side of the original edge area of ​​the temperature distribution plate.

[0021] Preferably, the original edge area of ​​the temperature distribution plate is provided with a first support area, a second support area and a third support area, the first support area is matched with the first insulating component, the second support area is adapted to the second insulating component, and the third support area is adapted to the third insulating component.

[0022] Preferably, the first support area, the second support area, and the third support area are each provided with a positioning pin, and the first insulating component, the second insulating component, and the third insulating component are each provided with a positioning hole, wherein the positioning pin is adapted to the positioning hole.

[0023] Preferably, the sidewall of the first insulating component is provided with a groove structure.

[0024] Preferably, the primary edge region and the secondary edge region of the heat exchange plate are respectively provided with heat dissipation fins.

[0025] Preferably, the primary edge region of the heat spreader is made of a non-metallic insulating material with good thermal conductivity, the primary edge region of the heat spreader includes a primary edge overlapping region, the secondary edge region of the heat spreader includes a secondary edge overlapping region, and the primary edge overlapping region and the secondary edge overlapping region are arranged overlappingly.

[0026] Preferably, the secondary side overlap area is located above the primary side overlap area, and the primary side overlap area is located above the primary side device.

[0027] Preferably, a buffer material is provided between the overlapping area of ​​the primary edge region and the secondary edge region of the heat exchanger.

[0028] Preferably, fastening holes are provided in both the secondary edge overlap area and the primary edge overlap area, and fasteners pass through the carrier plate and are fastened to the fastening holes.

[0029] Preferably, an insulating material is provided around the upper and / or lower surfaces of the carrier plate near the periphery of the fastener.

[0030] Preferably, the primary edge area of ​​the temperature distribution plate is bonded to the carrier plate by an adhesive material, and the secondary edge area of ​​the temperature distribution plate is fixed independently of the carrier plate.

[0031] Compared with the prior art, the beneficial effects of the present invention are:

[0032] (1) The power module of the present invention divides the heat spreader into a primary edge area and a secondary edge area. The primary edge area of ​​the heat spreader is attached to the primary edge of the carrier plate, and the secondary edge area of ​​the heat spreader is attached to the secondary edge of the carrier plate. This eliminates the need for additional Mylar plates between the heat spreader and the primary edge devices of the carrier plate to address safety regulations. Consequently, the thermal resistance between the primary edge devices of the carrier plate and the primary edge area of ​​the heat spreader is only the thermal resistance of the thermally conductive material, significantly reducing the thermal resistance from the heat-generating device to the heat spreader. The structure described in this invention, by eliminating the Mylar plate within the effective heat dissipation area, reduces the heat dissipation risk of the product and significantly extends its lifespan.

[0033] (2) Since there is no need to consider safety rules between the original edge area of ​​the heat spreader and the original edge device of the carrier plate, a boss can be set at any position of the original edge area of ​​the heat spreader to support the carrier plate, thereby achieving better support between the heat spreader and the carrier plate and avoiding deformation of the heat spreader.

[0034] (3) Since the primary and secondary components of the carrier board have corresponding heat spreaders attached to them, the size of the heat spreader can be made to be comparable to that of the carrier board. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the boss structure disclosed in an embodiment of the present invention;

[0038] Figure 3 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram of the structure of a heat spreader disclosed in an embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of the interference fit structure of the heat spreader disclosed in an embodiment of the present invention.

[0041] Figure 6 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention;

[0042] Figure 7This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention;

[0043] Figure 8 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention;

[0044] Figure 9 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention;

[0045] Figure 10 This is a schematic diagram of creepage at the primary fastener of the high thermal conductivity and high reliability power module disclosed in the previous embodiment of the present invention.

[0046] Figure 11 This is a schematic diagram of the creepage path of a high thermal conductivity and high reliability power module disclosed in another embodiment of the present invention;

[0047] Figure 12 This is a schematic diagram of the structure of a high thermal conductivity and high reliability power supply module disclosed in another embodiment of the present invention. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Figure 1 This invention discloses a high thermal conductivity and high reliability power module according to an embodiment of the present invention, including a carrier plate 100, a thermally conductive material 300, and a heat spreader 200. The carrier plate 100 includes a primary edge portion 110 and a secondary edge portion 120. The primary edge portion 110 is provided with primary edge devices, and the secondary edge portion 120 is provided with secondary edge devices. The primary edge portion 110 and the secondary edge portion 120 are electrically isolated. The heat spreader 200 is disposed on the carrier plate 100, and the thermally conductive material 300 is disposed between the heat spreader 200 and the carrier plate 100. The thermally conductive material 300 includes, but is not limited to, thermally conductive gel and thermally conductive grease. Because this type of thermally conductive material has very low hardness, it will not cause open circuit or short circuit problems in the devices during reflow soldering, thus meeting the requirements of both reflow soldering and wave soldering.

[0050] The heat spreader 200 is an assembled structure, comprising a primary edge region 210, a secondary edge region 220, and a connecting region 230. The primary edge region 210 is positioned above the primary edge portion 110 of the carrier plate, and the secondary edge region 220 is positioned above the secondary edge portion 120 of the carrier plate. The primary edge region 210 and the secondary edge region 220 form an integral structure through the connecting region 230. Preferably, the primary edge region 210 and the secondary edge region 220 are typically metal plates with thermal conductivity, and the connecting region 230 is a first insulating component.

[0051] In this embodiment of the invention, the heat spreader 200 is divided into a primary edge region 210 and a secondary edge region 220. The primary edge region 210 is bonded to the primary edge portion 110 of the carrier plate, and the secondary edge region 220 is bonded to the secondary edge portion 120 of the carrier plate. This eliminates the need for additional Mylar sheets between the heat spreader 200 and the primary edge components of the carrier plate to address safety regulations. Consequently, the thermal resistance between the primary edge components of the carrier plate and the primary edge region 210 of the heat spreader is only the thermal resistance of the thermally conductive material, which typically has a thermal conductivity of 3 W / (mK) or higher, and can even reach 10 W / (mK). Existing methods require Mylar sheets to be laid between the primary edge components of the carrier plate and the heat spreader 200 to address insulation and safety regulations. Additionally, thermally conductive material is placed between the Mylar sheets and the primary edge components of the carrier plate. Typically, at least two layers of Mylar sheets are used, with a thickness of 0.1 mm and a thermal conductivity generally between 0.1 and 0.3 W / (mK). Using the formula for thermal resistance, R = t / (λA), where R is thermal resistance, t is thickness, λ is thermal conductivity, and A is area, it is easy to see that, with a fixed thickness, the thermal resistance achieved by this invention is 10% to 30% of that of existing thermal resistances, significantly reducing the thermal resistance between the heating element and the heat spreader 200. During long-term use, the bonding strength of the Mylar sheet will gradually decrease; in severe cases, the Mylar sheet may peel off directly from the heat spreader 200, resulting in a significant reduction in heat dissipation performance. The structure described in this invention, by eliminating the Mylar sheet within the effective heat dissipation area, reduces the risk of heat dissipation and significantly extends the product's lifespan.

[0052] like Figure 2 As shown, since there is no need to consider safety rules between the original edge area 210 of the heat spreader and the original edge device of the carrier plate, a boss structure 211 can be set at any position of the original edge area 210 of the heat spreader to support the carrier plate 100, thereby achieving better support between the heat spreader 200 and the carrier plate 100 and preventing the heat spreader 200 from deforming.

[0053] Since both the primary and secondary components of the carrier board have corresponding vapor chamber areas for bonding, the vapor chamber 200 can be made to be approximately the same size as the carrier board 100.

[0054] like Figure 3As shown, considering the system-end application of this power supply module, a second insulating component 212 and a third insulating component 213 are respectively provided at the two corners outside the original edge area 210 of the heat spreader 200. A first Mylar sheet 410 and a second Mylar sheet 420 are attached to the upper surface of the heat spreader 200 and bent to extend from the side to the lower surface of the heat spreader 200 to meet safety requirements. The thickness of the second insulating component 212 and the third insulating component 213 is usually set to 4 to 8 mm.

[0055] A Mylar sheet is laid above the original edge area 210 of the heat spreader 200. Compared to the existing method where the Mylar sheet is laid between the heat spreader 200 and the heating element, it still exhibits sufficiently good thermal resistance. Specifically, the heating element transfers heat to the heat spreader 200 through the thermally conductive material. The uniform temperature of the heat spreader 200 expands the upward heat transfer area to the entire original edge area 210 of the heat spreader, and then the heat is transferred to the customer's heat sink after passing through the first Mylar sheet 410 and the second Mylar sheet 420. According to the above thermal resistance calculation formula, even with an increase in the thermally conductive area A, the thermal resistance will still decrease significantly.

[0056] The assembly method of the heat spreader 200 is as follows: Figure 4 As shown, the primary edge area 210 of the heat spreader is provided with a first support area 214, a second support area 215 and a third support area 216. The second support area 215 is adapted to the second insulating component 212, and the third support area 216 is adapted to the third insulating component 213. The side wall of the first insulating component 230 is provided with a groove structure 231. The first support area 214 is adapted to the groove structure 231. The groove structure 231 and the groove structure 232 are used to increase the creepage distance between the primary edge area 210 and the secondary edge area 220 of the heat spreader. The above connection method is not limited to bonding and welding.

[0057] like Figure 5 As shown, to improve connection strength, the first support area 214, the second support area 215, and the third support area 216 of the original edge area 210 of the heat spreader are each provided with a positioning pin 240, and the first insulating component 230, the second insulating component 212, and the third insulating component 213 are each provided with a pin hole 250. The positioning pins 240 and the pin holes 250 are matched, so that the first support area 214 and the first insulating component 230, the second support area 215 and the second insulating component 212, and the third support area 216 and the third insulating component 213 form an interference fit, thereby improving connection strength. In addition, adhesive can be applied between the insulating components and the support areas to further improve the strength of the heat spreader 200. The adhesive must meet high temperature resistance requirements, such as being able to withstand reflow soldering.

[0058] like Figure 6As shown, to further reduce the thermal resistance between the vapor chamber 200 and the client HSK, the primary edge region 210 of the vapor chamber also includes a fin structure 260 for heat dissipation of the primary edge devices on the carrier board, and the secondary edge region 220 of the vapor chamber also includes a fin structure 260 for heat dissipation of the secondary edge devices on the carrier board. This embodiment reduces the thermal resistance of the Mylar plate and improves heat dissipation performance. In this embodiment, the primary edge region 210 of the vapor chamber is bound to the secondary edge region 220 of the vapor chamber through the connecting area 230, and then interlocked with the carrier board 100 through the screw holes of the secondary edge region 220 of the vapor chamber. This ensures that the primary edge region 210 of the vapor chamber does not need to be bonded to the carrier board 100 or the devices on the carrier board 100, while still ensuring sufficient strength to withstand external vibration and impact.

[0059] In some applications, the radiator 500 is not at the same potential as the primary edge region 210 and the secondary edge region 220 of the vapor chamber, and must meet the insulation requirements of safety regulations. Therefore, it is necessary to ensure that the radiator 500 has sufficient safe distance from both the primary edge region 210 and the secondary edge region 220 of the vapor chamber. Figure 7 As shown, a ceramic plate 600 is placed between the heat sink 500 and the vapor chamber 200 to meet the safety regulations for insulation between them. The heat sink 500 is secured to the ceramic plate 600 with screws. The threads on the ceramic plate 600 are achieved by inserting metal nuts. All four holes in the ceramic plate 600 are depth-controlled holes to further ensure the safety regulations for insulation between the screws and the vapor chamber 200. Specifically, the ceramic plate 600 and the vapor chamber 200 are fixed together using thermally conductive adhesive. Thermally conductive materials, such as thermal adhesive, thermal grease, or thermal pads, are placed between the ceramic plate 600 and the heat sink 500, but are not limited to these.

[0060] like Figure 8 As shown, to achieve better heat dissipation and safety, the primary edge region 210 of the vapor chamber is made of a non-metallic insulating material with good thermal conductivity. During assembly, the primary edge region 210 and the secondary edge region 220 of the vapor chamber have an overlapping area. The primary edge region 210 includes a primary edge overlapping area 210a, and the secondary edge region 220 includes a secondary edge overlapping area 220a. That is, the secondary edge overlapping area 220a of the secondary edge region can extend above the primary edge device. The primary edge overlapping area 220a and the secondary edge overlapping area 220a are overlapped. The primary edge region 210 of the vapor chamber is set between the primary edge device and the secondary edge region 220 of the vapor chamber to meet the safety insulation requirements of the primary and secondary edges. A threaded hole is provided on the secondary side area 220 of the heat spreader. The primary side area 210 and the secondary side area 220 of the heat spreader overlap at the screw hole location. A fastener 270 can pass through the carrier plate 100 and the threaded hole on the primary side area 210 and the secondary side area 220 of the heat spreader for fastening. Since the primary side area 210 of the heat spreader is a non-metallic insulating material with good thermal conductivity, such as ceramic, it can effectively dissipate heat for the product while meeting the product's safety and insulation requirements.

[0061] To prevent the non-metallic insulating material from cracking during the fastening process, a buffer material (not shown in the figure) can be added to the overlapping area of ​​the primary edge region 210 and the secondary edge region 220 of the heat spreader.

[0062] Based on the previous embodiment, further, to achieve higher power density and integration, it is often necessary to arrange more devices or lines in a smaller space. However, to meet safety creepage distance requirements, a large area around the mounting holes of the metal fasteners in the original edge area 110 is prohibited from having lines or components, resulting in significant space waste. This embodiment, based on the previous embodiment, arranges a ring of insulating material 700 around the fasteners 270 in the original edge area 110, such as... Figure 9 As shown, fastener 270 is a metal fastener. The minimum creepage path between the fastener and the device or circuit in the original edge area 110 needs to cross the insulating material 700, which greatly increases the creepage distance. The creepage path is as follows: Figure 10 This illustrates how increasing product power density and integration while also enhancing product safety. The insulating material 700 is typically a cured adhesive, plastic, or other insulating material.

[0063] In certain low-mechanical-strength applications, to better achieve the application effect of the previous embodiment, the fastener can be replaced with an insulating fastener 270a, such as a ceramic screw or plastic screw. It should be noted that even when using non-metallic fasteners, if the original edge components or wiring are too close to the mounting hole, there is still a risk of not meeting the creepage distance requirements. Therefore, in this embodiment, the non-metallic fastener 270a can be used alone, or, to further save space, the non-metallic fastener 270a can be used in combination with the insulating material 700 for better results. Figure 11 As shown, the creepage distance A of the device on the carrier board 100 near the non-metallic fastener 270a meets the safety requirements, but the creepage distance B of the carrier board 100 away from the non-metallic fastener 270a does not meet the safety requirements. Adding insulating material 700 around the screw holes on the side that does not meet the safety requirements increases the bend in the creepage distance B path, thus meeting the safety creepage distance requirements. Similarly, it can be determined whether it is necessary to use insulating material 700 while using insulating fasteners, depending on specific needs.

[0064] To further reduce the space wastage caused by safety regulations, such as Figure 12As shown, in this embodiment, adhesive material 800 is used instead of the original fastener 270. Adhesive material 800 is usually epoxy resin or silicone structural adhesive. During installation, the original edge area 210 of the heat spreader is bonded to the carrier plate 100 through adhesive material 800, and the secondary edge area 220 of the heat spreader is independently fixed to the carrier plate 100. In this application, the carrier plate 100 plays a similar function to the connection area 230 in the above embodiment. Since the original edge area 210 of the heat spreader is an insulating material, the creepage path caused by the mounting holes and fasteners in the above embodiment is blocked, which greatly ensures the safety requirements of the product. At the same time, the elimination of mounting holes can also provide more space for the layout of electronic components and circuits.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power supply module with high thermal conductivity and high reliability, characterized in that, The device includes a carrier plate, a thermally conductive material, and a heat spreader. The carrier plate includes a primary edge portion and a secondary edge portion. The primary edge portion is provided with a primary edge device, and the secondary edge portion is provided with a secondary edge device. The heat spreader is disposed on the carrier plate, and the thermally conductive material is disposed between the heat spreader and the carrier plate. The heat exchange plate includes a primary edge area, a secondary edge area, and a connecting area. The primary edge area is located above the primary edge of the carrier plate, and the secondary edge area is located above the secondary edge of the carrier plate. The primary edge area and the secondary edge area form an integral structure through the connecting area.

2. The power module according to claim 1, characterized in that, The connection area is a first insulating component, and the primary and secondary sides of the heat spreader are heat-conducting components; the primary and secondary sides of the carrier plate are electrically isolated.

3. The power supply module according to claim 1, characterized in that, The original edge area of ​​the heat exchange plate is provided with a boss structure, which is used to support the heat exchange plate and the carrier plate.

4. The power supply module according to claim 1, characterized in that, It also includes a heat sink, a ceramic plate is disposed between the heat sink and the heat spreader, the ceramic plate is fixed to the heat spreader by thermally conductive adhesive, and a thermally conductive material is disposed between the ceramic plate and the heat sink.

5. The power supply module according to claim 1 or 4, characterized in that, The thermally conductive material includes thermally conductive gel, thermally conductive grease, or thermally conductive pad.

6. A heat spreader, characterized in that, The heat spreader includes a primary edge area, a secondary edge area, and a connecting area. The primary edge area is located above the primary edge portion of a carrier plate, and the secondary edge area is located above the secondary edge portion of the carrier plate. The primary edge area and the secondary edge area form an integral structure through the connecting area. The primary edge portion and the secondary edge portion of the carrier plate are electrically isolated.

7. The temperature distribution plate according to claim 6, characterized in that, The connection area is a first insulating component, and the primary and secondary side areas of the heat exchange plate are heat-conducting components.

8. The temperature distribution plate according to claim 7, characterized in that, The original edge area of ​​the heat exchange plate is provided with a boss structure, which is used to support the heat exchange plate and the carrier plate.

9. The temperature distribution plate according to claim 7, characterized in that, The upper surface of the heat spreader is attached to a first Mylar sheet and a second Mylar sheet. Both the first Mylar sheet and the second Mylar sheet have a bent portion that extends from the side of the heat spreader to the lower surface of the heat spreader. The first Mylar sheet and the second Mylar sheet are attached above the original edge area of ​​the heat spreader.

10. The temperature distribution plate according to claim 7, characterized in that, The two corners on the outer side of the original edge area of ​​the heat exchange plate are respectively provided with a second insulating component and a third insulating component.

11. The temperature distribution plate according to claim 10, characterized in that, The original edge area of ​​the heat spreader is provided with a first support area, a second support area and a third support area. The first support area matches the first insulating component, the second support area matches the second insulating component, and the third support area matches the third insulating component.

12. The temperature distribution plate according to claim 11, characterized in that, The first support area, the second support area and the third support area are respectively provided with positioning pins, and the first insulating component, the second insulating component and the third insulating component are respectively provided with positioning holes, and the positioning pins are adapted to the positioning holes.

13. The temperature distribution plate according to claim 7, characterized in that, The sidewall of the first insulating component is provided with a groove structure.

14. The temperature distribution plate according to claim 6, characterized in that, The primary and secondary sides of the heat exchange plate are respectively provided with heat dissipation fins.

15. The temperature distribution plate according to claim 6, characterized in that, The primary edge region of the heat exchange plate is made of a non-metallic insulating material with good thermal conductivity. The primary edge region of the heat exchange plate includes a primary edge overlapping region, and the secondary edge region of the heat exchange plate includes a secondary edge overlapping region. The primary edge overlapping region and the secondary edge overlapping region are arranged in an overlapping manner.

16. The temperature distribution plate according to claim 15, characterized in that, The secondary side overlap area is located above the primary side overlap area, and the primary side overlap area is located above the primary side device.

17. The temperature distribution plate according to claim 15, characterized in that, A buffer material is provided between the overlapping area of ​​the primary edge region and the secondary edge region of the heat exchange plate.

18. The temperature distribution plate according to claim 15, characterized in that, Fastening holes are provided in both the secondary edge overlap area and the primary edge overlap area, and fasteners pass through the carrier plate and are fastened to the fastening holes.

19. The temperature distribution plate according to claim 18, characterized in that, An insulating material is provided around the upper and / or lower surfaces of the carrier plate near the fastener.

20. The temperature distribution plate according to claim 6, characterized in that, The original edge area of ​​the temperature distribution plate is bonded to the carrier plate by an adhesive material, while the secondary edge area of ​​the temperature distribution plate is fixed independently of the carrier plate.

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