Methods for fabricating packaging substrates and packaging substrates
By embedding a glass or ceramic substrate into a through groove in the frame layer and setting an adhesive layer and a metal layer, the problem of substrate breakage due to stress during processing is solved, thereby reducing costs and expanding applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2026-01-06
- Publication Date
- 2026-05-26
AI Technical Summary
Glass or ceramic substrates are prone to breakage due to stress during processing, which increases production costs and limits their application and development.
A glass or ceramic substrate is embedded in a through groove in the frame layer, and an adhesive layer and a metal layer are provided on both sides of the frame layer. The encapsulation substrate is formed by lamination and layering, thereby reducing stress.
Reduce stress on glass or ceramic substrates during processing, prevent breakage, lower production costs, and enhance their applications and development.
Smart Images
Figure CN122094513A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of packaging substrate technology, and in particular to a method for manufacturing a packaging substrate and a packaging substrate. Background Technology
[0002] In related technologies, substrates using glass or ceramic as the base material generally suffer from the problem of glass or ceramic easily breaking due to stress during the processing. This not only increases production costs but also limits the application and development of glass or ceramic substrates. Summary of the Invention
[0003] This application provides a method for manufacturing a packaging substrate and a packaging substrate, wherein a glass substrate or a ceramic substrate is formed into a smaller-sized substrate and embedded in the through groove of the frame layer, which can reduce the stress on the glass substrate or ceramic substrate during the processing and avoid substrate breakage. Therefore, it can reduce production costs and enhance the application and development of glass substrates or ceramic substrates.
[0004] This application provides a method for manufacturing a packaging substrate, including: A plurality of substrates are provided, wherein the substrates are glass substrates or ceramic substrates; A frame layer is provided, and multiple through slots corresponding to the number of substrates are formed in the frame layer; One of the substrates is embedded sequentially in each of the through slots; Pre-bonded adhesive layers and metal layers are sequentially arranged on both sides of the frame layer in the thickness direction, and then pressed together to add more layers.
[0005] In some embodiments, the lamination process includes: Heating is performed in a vacuum environment to bond the frame layer, the pre-bonded adhesive layer, and the metal layer together. Bake to cure the adhesive layer.
[0006] In some embodiments, after the lamination layering is performed, the method further includes: Patterns are created on the metal layer to form metal circuits.
[0007] In some embodiments, the substrate has alignment targets, and before patterning is performed on the metal layer to form metal lines, the method further includes: The metal layer is etched or laser-ablated at the position directly opposite the alignment target to form a window; Laser ablation is performed on the adhesive layer at the bottom of the window to expose the alignment target; When creating patterns on the metal layer to form metal circuits, alignment is performed according to the alignment target and the patterns are created.
[0008] In some embodiments, the substrate has metal lines on both sides in the thickness direction, and the metal lines on both sides are electrically connected through metallized vias.
[0009] In some embodiments, the cross-sectional dimension of the through groove is larger than the dimension of the substrate, and the thickness of the frame layer is larger than the thickness of the substrate.
[0010] In some embodiments, the frame layer is a BT core board or a metal frame.
[0011] This application also provides a packaging substrate, including: A frame layer, wherein a plurality of through slots are provided, and a substrate is embedded in each through slot, wherein the substrate is a glass substrate or a ceramic substrate. Pre-bonded adhesive layers and metal layers are disposed on both sides of the frame layer in the thickness direction. The frame layer is pressed together with the adhesive layers and metal layers on both sides, and metal lines are formed on the metal layer.
[0012] In some embodiments, the substrate has an alignment target for alignment when forming the metal lines on the metal layer; The substrate has metal lines on both sides in the thickness direction, and the metal lines on both sides are electrically connected through metallized through-holes.
[0013] In some embodiments, the cross-sectional dimension of the through groove is larger than the dimension of the substrate, and the thickness of the frame layer is larger than the thickness of the substrate.
[0014] In the packaging substrate manufacturing method of this application embodiment, a glass substrate or ceramic substrate is formed into a smaller-sized substrate and embedded in the through groove of the frame layer. Compared with the overall large-sized substrate, the embodiment of this application can reduce the stress on the glass substrate or ceramic substrate during the processing, avoid substrate breakage, and thus reduce production costs and enhance the application and development of glass substrates or ceramic substrates. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic flowchart of a packaging substrate fabrication method according to an embodiment of this application.
[0017] Figure 2This is a schematic diagram of the substrate in the packaging substrate of this application embodiment.
[0018] Figure 3 This is a schematic diagram of the frame layer in the packaging substrate of this application embodiment.
[0019] Figure 4 This is a schematic diagram of the packaging substrate lamination layer in an embodiment of this application. Detailed Implementation
[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0021] This application provides a packaging substrate that can reduce the stress on glass or ceramic substrates during processing, prevent substrate breakage, and thus reduce production costs and enhance the application and development of glass or ceramic substrates.
[0022] Please refer to the above. Figures 1 to 4 ,in, Figure 1 This is a schematic flowchart of the packaging substrate fabrication method according to an embodiment of this application. Figure 2 This is a schematic diagram of the substrate in the packaging substrate of this application embodiment. Figure 3 This is a schematic diagram of the frame layer in the packaging substrate according to an embodiment of this application. Figure 4 This is a schematic diagram of the packaging substrate lamination layer in an embodiment of this application.
[0023] like Figure 1 As shown, the method for manufacturing a packaging substrate includes the following steps: 110, provides multiple substrates, the substrates being glass substrates or ceramic substrates; 120, provides a frame layer, and opens multiple through slots in the frame layer corresponding to the number of substrates; 130, a substrate is embedded in each through slot in sequence; 140. Pre-bonded adhesive layers and metal layers are sequentially set on both sides of the frame layer thickness direction, and then pressed together to add layers.
[0024] First, in step 110, a plurality of substrates are provided. The substrates are glass substrates or ceramic substrates, wherein the glass substrates or ceramic substrates are double-sided copper-clad laminates.
[0025] In some embodiments, metal lines are present on both sides of the substrate in the thickness direction. These metal lines are used to transmit electrical signals, and the metal lines on both sides are electrically connected through metallized vias. For example, the metal lines can be formed by the copper layer of a double-sided copper-clad laminate. In practical applications, the lines can be formed on the copper layer of the double-sided copper-clad laminate through processes such as exposure, development, and etching. For glass substrates, the metallized vias can be TGV interconnects; for ceramic substrates, the metallized vias can be TCV interconnects. In practical applications, through-holes penetrating both sides can be formed on the substrate through mechanical drilling or laser drilling, and a metal layer can be formed inside the through-holes through processes such as metal sputtering and electroplating to achieve metallization of the holes.
[0026] In some embodiments, such as Figure 2 As shown, the substrate has alignment targets, which can be holes or special patterns formed through the copper layer on the substrate. The alignment targets are used for alignment during subsequent circuit fabrication of the packaging substrate.
[0027] In step 120, a frame layer is provided, and multiple through slots corresponding to the number of substrates are formed in the frame layer. In some embodiments, the frame layer is formed of a material with a low coefficient of thermal expansion (CTE), such as a BT core board or a metal frame. The multiple through slots can be formed in the frame layer by machining, such as mechanical milling. The number of through slots is the same as the number of substrates; for example, there can be 2, 4, 5, or 9 through slots, corresponding to 2, 4, 5, or 9 substrates. In some embodiments, the multiple through slots can be arranged in an array.
[0028] It should be noted that in practical applications, there is no absolute order to the above steps 110 and 120. Step 110 can be performed first and then step 120, or step 120 can be performed first and then step 110, or steps 110 and 120 can be performed simultaneously. This application does not impose any specific restrictions on the execution order of the above steps 110 and 120.
[0029] Subsequently, in step 130, a substrate is sequentially embedded in each through-slot. For example... Figure 3 As shown, taking a base plate and nine through slots as an example, the nine through slots of the frame layer can be arranged in a 3*3 array, and a base plate is embedded in each through slot.
[0030] In some embodiments, the cross-sectional dimension of the through groove is larger than the dimension of the substrate, and the thickness of the frame layer is greater than the thickness of the substrate, so as to ensure that the substrate can be smoothly embedded into the frame layer, and the substrate can be encapsulated and protected by the thicker frame layer.
[0031] Subsequently, in step 140, pre-bonded adhesive layers and metal layers are sequentially applied to both sides of the frame layer in the thickness direction, and then laminated together. The adhesive layers and metal layers can be pre-bonded by bonding. Figure 4 As shown, taking copper foil as the metal layer as an example, a pre-bonded adhesive layer and copper foil are disposed above the frame layer after the substrate is embedded, and a pre-bonded adhesive layer and copper foil are disposed below the frame layer. Subsequently, lamination is performed to bond the layers together to form a packaging substrate.
[0032] Understandably, in practical applications, after the above layers are bonded together to form a package substrate, pre-bonded adhesive layers and copper foils can be added to one or both sides of the package substrate, and then the layers can be added again by lamination to form a package substrate with more layers. In practical applications, by repeating the above steps of setting adhesive layers and copper foils and laminating to add layers, package substrates with various numbers of layers can be formed as required.
[0033] In some embodiments, the adhesive layer may be a prepreg (PP), which may be composed of resin and fiberglass cloth.
[0034] In some embodiments, lamination can be performed by the following steps: Heating is performed in a vacuum environment to bond the frame layer, pre-bonded adhesive layer, and metal layer together. Bake to cure the adhesive layer.
[0035] In this process, after pre-bonded adhesive and metal layers are placed on both sides of the frame layer in the thickness direction, heating is first performed in a vacuum environment (high-temperature vacuum thermal bonding). The heating temperature can be determined according to actual needs, such as the material composition and thickness of the adhesive layer, to melt the adhesive layer, thereby enabling the frame layer, adhesive layer, and metal layer to bond together. Subsequently, baking is performed to cure the adhesive layer (high-temperature thermal curing), thereby solidifying the overall structure formed by the frame layer, adhesive layer, and metal layer to form the encapsulation substrate. The baking temperature can also be determined according to actual needs, such as the curing speed of the adhesive layer.
[0036] Understandably, when the adhesive layer melts under vacuum heating, it forms a flowing adhesive. Since the cross-sectional dimension of the through-groove is larger than the substrate dimension, and the thickness of the frame layer is greater than the substrate thickness, some of the flowing adhesive will enter the gap between the substrate and the frame layer. Therefore, after baking to cure the adhesive layer, the substrate within the through-groove can be fixed in place.
[0037] In some embodiments, after step 140 performs lamination and layering, the method further includes the following step: patterning on the metal layer to form metal circuits.
[0038] In this process, after lamination and layering to form the packaging substrate, patterns can be fabricated on the laminated metal layer to form metal circuits, which can be used to transmit electrical signals. In practical applications, taking copper foil as the metal layer as an example, patterns can be fabricated as follows: After pre-treating the copper foil surface (e.g., cleaning with a polishing brush and chemical cleaning), photoresist is applied to the copper foil surface using a dry film or wet film process; ultraviolet light is used to irradiate (expose) a portion of the photoresist, causing a photochemical reaction to form a basic pattern; then, a chemical solution is used to dissolve the photoresist in the unexposed areas (i.e., areas not irradiated by ultraviolet light), exposing the copper surface to be etched; then, acidic or alkaline solutions are used to etch away the exposed copper surface, leaving the unetched copper surface and the photoresist attached to it to form the desired circuit pattern; finally, a special stripping solution is used to remove any remaining photoresist.
[0039] In some embodiments, such as Figure 2 As shown, the substrate has alignment targets. Before patterning is performed on the metal layer to form metal lines, the following steps are also included: The metal layer is etched or laser-ablated at the position directly opposite the target to create a window; Laser ablation is performed on the adhesive layer at the bottom of the window to expose the alignment target; When creating patterns on a metal layer to form a metal circuit, alignment is performed based on an alignment target and the patterns are created.
[0040] Before pattern fabrication, the area on the laminated metal layer corresponding to the alignment target on the substrate is etched or laser-ablated to create a window. For example, etching solution can be used to create the window, exposing the adhesive layer at the bottom of the window. Then, the adhesive layer at the bottom of the window is laser-ablated to remove the material at the bottom of the window, exposing the alignment target. Subsequently, when fabricating the pattern on the metal layer, alignment is performed according to the alignment target to ensure pattern processing accuracy and create a high-precision circuit pattern that meets the requirements.
[0041] In the packaging substrate manufacturing method of this application embodiment, a glass substrate or ceramic substrate is formed into a smaller-sized substrate and embedded in the through groove of the frame layer. Compared with the overall large-sized substrate, the embodiment of this application can reduce the stress on the glass substrate or ceramic substrate during the processing, avoid substrate breakage, and thus reduce production costs and enhance the application and development of glass substrates or ceramic substrates.
[0042] This application also provides a packaging substrate. (See reference...) Figure 4 The packaging substrate includes a frame layer, an adhesive layer, and a metal layer.
[0043] The frame layer has multiple through slots, each containing a substrate, which can be a glass substrate or a ceramic substrate. For example, in one embodiment, such as... Figure 3 As shown, the frame layer has 9 through slots, which are arranged in a 3*3 array, and a substrate is embedded in each through slot.
[0044] The adhesive layer and the metal layer are pre-bonded together and disposed on both sides of the frame layer in the thickness direction. The metal layer can be, for example, copper foil, on which metal circuitry is formed. The frame layer is then pressed together with the pre-bonded adhesive layer and metal layer on both sides.
[0045] In some embodiments, the cross-sectional dimension of the through groove formed on the frame layer is larger than the dimension of the embedded substrate, and the thickness of the frame layer is larger than the thickness of the embedded substrate.
[0046] In some embodiments, the substrate has alignment targets, such as Figure 2 As shown, the alignment target is used for alignment when forming metal lines on a metal layer (e.g., copper foil). The substrate has metal lines on both sides in the thickness direction, and the metal lines on both sides are electrically connected through metallized vias. For example, the substrate can be a double-sided copper-clad laminate, where the copper layer forms the metal lines, and electrical connections are achieved through metallized vias (e.g., TGV interconnects or TCV interconnects) penetrating both sides.
[0047] It should be noted that the specific implementation methods of the various embodiments of the above-described packaging substrate can be found in the detailed descriptions of the various embodiments of the above-described manufacturing method, and will not be repeated here.
[0048] In the packaging substrate of this application embodiment, the glass substrate or ceramic substrate forms a smaller substrate and is embedded in the through groove of the frame layer. Compared with the overall large-size substrate, the embodiment of this application can reduce the stress on the glass substrate or ceramic substrate during the processing, avoid substrate breakage, and thus reduce production costs and enhance the application and development of glass substrate or ceramic substrate.
[0049] It should be noted that, in the embodiments of this application, "electrical connection" can be a direct connection between two electrical components or an indirect connection. For example, the electrical connection between A and B can be achieved by A and B being directly connected, or by A and B being indirectly connected through one or more other electrical components.
[0050] The foregoing has provided a detailed description of the fabrication method and the packaging substrate provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A method for manufacturing a packaging substrate, characterized in that, include: A plurality of substrates are provided, wherein the substrates are glass substrates or ceramic substrates; A frame layer is provided, and multiple through slots corresponding to the number of substrates are formed in the frame layer; One of the substrates is embedded sequentially in each of the through slots; Pre-bonded adhesive layers and metal layers are sequentially arranged on both sides of the frame layer in the thickness direction, and then pressed together to add more layers.
2. The method for manufacturing a packaging substrate according to claim 1, characterized in that, The process of lamination and layering includes: Heating is performed in a vacuum environment to bond the frame layer, the pre-bonded adhesive layer, and the metal layer together. Bake to cure the adhesive layer.
3. The method for manufacturing a packaging substrate according to claim 1, characterized in that, After the lamination and layering process, the method further includes: Patterns are created on the metal layer to form metal circuits.
4. The method for manufacturing a packaging substrate according to claim 3, characterized in that, The substrate has alignment targets, and before patterning is performed on the metal layer to form metal lines, the process further includes: The metal layer is etched or laser-ablated at the position directly opposite the alignment target to form a window; Laser ablation is performed on the adhesive layer at the bottom of the window to expose the alignment target; When creating patterns on the metal layer to form metal circuits, alignment is performed according to the alignment target and the patterns are created.
5. The method for manufacturing a packaging substrate according to any one of claims 1 to 4, characterized in that, The substrate has metal lines on both sides in the thickness direction, and the metal lines on both sides are electrically connected through metallized through-holes.
6. The method for manufacturing a packaging substrate according to any one of claims 1 to 4, characterized in that, The cross-sectional dimension of the through groove is larger than the dimension of the substrate, and the thickness of the frame layer is greater than the thickness of the substrate.
7. The method for manufacturing a packaging substrate according to any one of claims 1 to 4, characterized in that, The frame layer is a BT core board or a metal frame.
8. A packaging substrate, characterized in that, include: A frame layer, wherein a plurality of through slots are provided, and a substrate is embedded in each through slot, wherein the substrate is a glass substrate or a ceramic substrate. Pre-bonded adhesive layers and metal layers are disposed on both sides of the frame layer in the thickness direction. The frame layer is pressed together with the adhesive layers and metal layers on both sides, and metal lines are formed on the metal layer.
9. The packaging substrate according to claim 8, characterized in that: The substrate has an alignment target, which is used for alignment when forming the metal line on the metal layer; The substrate has metal lines on both sides in the thickness direction, and the metal lines on both sides are electrically connected through metallized through-holes.
10. The packaging substrate according to claim 8, characterized in that, The cross-sectional dimension of the through groove is larger than the dimension of the substrate, and the thickness of the frame layer is greater than the thickness of the substrate.