Wafer detection device and method
By separating the paths of reflected and scattered light in the wafer inspection device and using diffractive optical elements and digital micromirror devices to capture the signals respectively, the problem of low signal-to-noise ratio in optical inspection equipment is solved, and efficient and accurate defect detection is achieved.
Patent Information
- Application Number
- CN202580004245.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-10
- Filing Date
- 2025-09-10
- Publication Date
- 2026-05-26
AI Technical Summary
Existing optical inspection equipment, when inspecting wafer defects, is limited by the diffraction limit of light, making it difficult to simultaneously and effectively collect reflected and scattered light signals. This results in a low signal-to-noise ratio, severe background signal interference, and difficulty in accurately identifying the location and shape of defects.
Design a wafer inspection device that guides reflected and scattered light to different paths through a light receiving optical system, and uses diffractive optical elements and digital micromirror devices to separate the signals, which are then captured by different image sensors to achieve clear image generation of reflected and scattered light and improve contrast.
It improves the sensitivity and accuracy of defect detection, reduces background signal interference, achieves efficient defect identification and location determination, and can achieve optimal detection conditions without replacing components.
Smart Images
Figure CN122095241A_ABST
Abstract
Citation Information
Patent Citations
Method of inspecting the profile of the connection zone between the cylindrical portion and the taper of a roller for a turbomachine roller bearing
US20070005295A1