A method for scanning cross-section measurement and data processing of silicon steel

Abstract

This invention discloses a scanning cross-sectional measurement and data processing method for silicon steel, belonging to the field of automated inspection technology in the metallurgical industry. The method includes: arranging two laser ultrasonic probes; wherein, the first laser ultrasonic probe is fixedly installed at the centerline of the strip width direction; the second laser ultrasonic probe performs reciprocating scanning motion along the strip width direction; measuring the strip thickness using the two laser ultrasonic probes respectively; based on the measurement data from the first and second laser ultrasonic probes, obtaining the true transverse cross-sectional contour data by removing longitudinal interference, thus reconstructing the cross-sectional contour data; and calculating a preset quality index based on the reconstructed cross-sectional contour data. This invention utilizes the collaborative work of two laser ultrasonic probes, combined with a specific data compensation algorithm, to eliminate longitudinal fluctuation interference in the strip, achieving high-precision cross-sectional contour reconstruction and quality assessment.

Description

Technical Field

[0001] This invention relates to the field of automated testing technology in the metallurgical industry, and in particular to a method for scanning cross-section measurement and data processing of silicon steel. Background Technology

[0002] Silicon steel is an essential alloy in the power, electronics, and military industries, primarily used to manufacture the cores of various transformers, motors, and generators. With downstream industries increasingly demanding higher energy efficiency, the requirements for the dimensional accuracy of silicon steel products are becoming increasingly stringent, particularly regarding the control of transverse cross-sectional profile parameters such as strip thickness variation, wedge shape, and edge thinning. Accurate and real-time online monitoring is a prerequisite for achieving closed-loop control and quality assessment.

[0003] Traditional X-ray or isotope thickness gauge technology uses a C-frame or multi-point arrangement to measure strip steel. Although the technology is mature, the X-ray spot diameter is relatively large and the spatial resolution is limited. For the edge thinning area unique to silicon steel, it is often difficult to capture the details of high-gradient thickness changes. In addition, there are safety management risks associated with the radiation source. With the further improvement of edge reduction control requirements, the edge resolution capability of this technology is slightly insufficient. Summary of the Invention

[0004] This invention provides a method for scanning cross-section measurement and data processing of silicon steel, which at least partially solves the aforementioned technical problems existing in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: On one hand, the present invention provides a method for scanning cross-section measurement and data processing of silicon steel, including: A first laser ultrasonic probe and a second laser ultrasonic probe are arranged in a cold-rolled silicon steel production line. During the measurement process, the strip being measured moves at a preset speed and along a preset direction. The first laser ultrasonic probe is fixedly installed at the center line of the strip width direction. The second laser ultrasonic probe performs reciprocating scanning motion along the strip width direction. The excitation time difference between the first laser ultrasonic probe and the second laser ultrasonic probe is set. When the strip starts running, the first laser ultrasonic probe and the second laser ultrasonic probe are excited to start working according to the set excitation time difference. The thickness of the strip is measured by the first laser ultrasonic probe and the second laser ultrasonic probe respectively. The process of the second laser ultrasonic probe moving from the transmission side to the operation side and then back to the transmission side is defined as one sweep. For each scan, based on the measurement data from the first and second laser ultrasonic probes, the true transverse cross-sectional contour data is obtained by removing longitudinal interference, thus realizing the reconstruction of the cross-sectional contour data. For each scanning pass, a preset quality index is calculated based on the reconstructed cross-sectional contour data.

[0006] Furthermore, the formula for calculating the excitation time difference is: ; in, To stimulate the time difference; d The straight-line distance between the first laser ultrasonic probe and the second laser ultrasonic probe along the running direction of the strip; v The speed at which the strip runs; Let the excitation time of the first laser ultrasonic probe be... t Then the excitation time of the second laser ultrasonic probe is t + .

[0007] Furthermore, the measurement data based on the first and second laser ultrasonic probes, after removing longitudinal interference, yields the true transverse cross-sectional contour data, including: A preset adaptive filtering algorithm is used to filter the measurement data of the first laser ultrasonic probe to obtain the filtered result of the measurement data of the first laser ultrasonic probe, which is used as the longitudinal fluctuation component at the corresponding measurement point. Subtracting the longitudinal fluctuation component at the corresponding measurement point from the measurement data of the second laser ultrasonic probe yields the true transverse cross-sectional profile data.

[0008] Furthermore, the preset adaptive filtering algorithm is the Least Mean Square (LMS) algorithm.

[0009] Furthermore, the quality indicators include: the same-plate difference during the current scanning process, wedge shape, thinning value of the operating side and the thinning value of the transmission side, as well as the removal of the head and tail portions respectively. N After analyzing the data corresponding to each sweep stroke, the following data is collected for the entire strip steel coil: the average difference between the same plate, the average wedge shape, the average thinning value on the operating side, the average thinning value on the transmission side, and the percentage of sweep strokes with the same plate difference less than or equal to different preset thresholds out of the total number of sweep strokes; among these, N This is the default value.

[0010] Furthermore, the formula for calculating the difference between the same plates is: ; in, Differences between boards of the same type; The second laser ultrasonic probe is located at the edge of the transmission side. x The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; The second laser ultrasonic probe is located at the edge of the operating side. xThe difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; x This is the default value.

[0011] Furthermore, the formula for calculating the wedge shape is: ; in, It is wedge-shaped; The second laser ultrasonic probe is located at the edge of the operating side. y The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; The second laser ultrasonic probe is located at the edge of the transmission side. y The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; y This is the default value.

[0012] Furthermore, the formula for calculating the thinning value of the operating side portion is as follows: ; in, This refers to the thinning value of the operating side portion; The difference between the thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe when the second laser ultrasonic probe is 120 mm away from the edge on the operating side. The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 20 mm from the edge on the operating side. The formula for calculating the thinning value of the transmission side is: ; in, This refers to the thinning value of the transmission side portion; The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 120mm from the edge on the transmission side. The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 20mm from the edge on the transmission side.

[0013] Furthermore, x The value is 20; y The value is 20.

[0014] Furthermore, the different preset thresholds include: , , , and .

[0015] In another aspect, the present invention also provides an electronic device comprising a processor and a memory; wherein the memory stores at least one instruction, which is loaded and executed by the processor to implement the above-described method.

[0016] In another aspect, the present invention also provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to implement the above method.

[0017] The beneficial effects of the technical solution provided by this invention include at least the following: The silicon steel scanning cross-section measurement and data processing method provided by this invention adopts a dual-probe structure, uses a fixed probe as a reference benchmark, and effectively eliminates longitudinal thickness fluctuation interference during high-speed strip operation using the LMS algorithm, thereby improving the accuracy of transverse cross-section contour restoration and achieving high-precision quality assessment. It proposes a head and tail data rejection mechanism based on the sweep stroke, avoiding interference from unstable sections at the beginning and end of rolling to improve the overall coil quality rating, making the data analysis results more consistent with actual user needs. Furthermore, it establishes a comprehensive evaluation system including plate difference, wedge angle, edge thinning, and yield distribution, providing detailed data support for optimizing silicon steel production processes. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of the silicon steel scanning cross-section measurement and data processing method provided in the embodiments of the present invention; Figure 2 This is a schematic diagram of the probe arrangement and data measurement provided in an embodiment of the present invention; Figure 3 This is a system block diagram of the electronic device provided in the embodiments of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0021] First, it should be noted that in the embodiments of the present invention, the words "exemplarily," "for example," etc., are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the term "exemplarily" is intended to present the concept in a specific manner. Furthermore, in the embodiments of the present invention, the meaning expressed by "and / or" can be both, or it can be either one or the other.

[0022] First Embodiment

[0023] This embodiment provides a method for scanning cross-section measurement and data processing of silicon steel for cold-rolled silicon steel production lines. This method can be implemented by electronic devices, such as terminals or servers.

[0024] The execution flow of this method is as follows: Figure 1 As shown, it includes the following steps: S1, the first laser ultrasonic probe and the second laser ultrasonic probe are arranged in the cold-rolled silicon steel production line; During the measurement process, the strip being measured moves at a preset speed and in a preset direction; specifically, in this embodiment, as follows: Figure 2 As shown, the first laser ultrasonic probe, denoted as probe 1, is fixedly installed at the centerline of the strip width direction and is used to measure the thickness of the strip centerline at a fixed point; the second laser ultrasonic probe, denoted as probe 2, is installed on the scanning mechanism and performs reciprocating scanning motion along the strip width direction.

[0025] S2, set the excitation time difference between the first laser ultrasonic probe and the second laser ultrasonic probe. When the strip starts running, the first laser ultrasonic probe and the second laser ultrasonic probe are excited to start working according to the set excitation time difference. The first laser ultrasonic probe and the second laser ultrasonic probe are used to measure the thickness of the strip respectively. In this embodiment, the process of the second laser ultrasonic probe moving from the transmission side (DS) to the operation side (OS) and back to the DS side is defined as a complete measurement scan; the process from the DS side to the OS side or vice versa is defined as a half scan.

[0026] The measurement principle of the laser ultrasonic probe is as follows: During the strip's operation, the laser ultrasonic probe emits an excitation laser pulse. The high-energy short-pulse laser is focused onto the strip surface, and ultrasonic waves are excited within the material using a thermoelastic mechanism. These ultrasonic waves propagate along the strip's thickness direction, are reflected from the bottom surface, and return to the top surface, causing minute surface displacement vibrations. Simultaneously, another continuous laser beam is irradiated near the excitation point. The surface vibration signal is demodulated using a dual-wavelength hybrid interferometer, and combined with the sound velocity of the material, the two thickness values ​​at the same moment are determined.

[0027] Let the distance between the centers of the two probes along the length of the strip be... The real-time speed of the strip is To compensate for the installation distance and ensure that both probes measure the same cross-section, the excitation times of the two probes must differ by: (1) During the strip steel operation, probe 1 is set to operate at a specific time. The measured centerline thickness is (corresponding sequence) ); Set probe 2 at time The measured thickness of the scanning point is (corresponding sequence) ).

[0028] S3, for each scan, based on the measurement data of the first laser ultrasonic probe and the second laser ultrasonic probe, the true transverse cross-sectional contour data is obtained by removing longitudinal interference, and the cross-sectional contour data is reconstructed. Specifically, in this embodiment, a longitudinal fluctuation stripping algorithm based on LMS adaptive filtering is used to reconstruct the cross-sectional contour data. The specific process is as follows: The centerline thickness sequence measured by the first laser ultrasonic probe during one scan was used as a reference signal. The scanning thickness sequence measured by the second laser ultrasonic probe in the same scan stroke is used as the desired signal. Construct a system of order . A transverse finite impulse response (FIR) filter. In the... At the next iteration, the filter's input vector is represented as: (2) The weight coefficient vector of the filter is represented as: (3) By filtering the reference signal using the current weighting coefficients, the longitudinal fluctuation component at the measurement point of the second laser ultrasonic probe is estimated. The calculation formula is: (4) Calculate the desired response signal Compared with the estimated longitudinal fluctuation component The difference between The difference This refers to the true transverse cross-sectional profile data after removing longitudinal interference.

[0029] (5)

[0030] Simultaneously, according to the LMS algorithm rules, the weight coefficients are dynamically adjusted along the negative direction of the gradient to minimize the mean square error. The update formula is as follows: (6) in, This is the step size factor (convergence factor), used to control the convergence speed and steady-state error of the algorithm. Its value range satisfies... , It is the largest eigenvalue of the autocorrelation matrix of the input signal.

[0031] S4 calculates the preset quality index for each scan based on the reconstructed cross-sectional contour data.

[0032] Specifically, this embodiment calculates the same-plate difference of the current sweep based on the reconstructed cross-sectional contour data. wedge Thinning of the operating side E OS Thinning of the transmission side E DS and the average thinning at the edges; among which, The formula for calculating the difference between the same plate is: (7) in, The second laser ultrasonic probe is located at the edge of the transmission side. x The thickness difference between the first and second laser ultrasonic probes was measured in millimeters. The second laser ultrasonic probe is located at the edge of the operating side. x The thickness difference between the first and second laser ultrasonic probes was measured in millimeters. x It can be set; the default value is 20mm.

[0033] The formula for calculating the wedge shape is: (8) in, The second laser ultrasonic probe is located at the edge of the transmission side. y The thickness difference between the first and second laser ultrasonic probes was measured in millimeters. The second laser ultrasonic probe is located at the edge of the operating side. y The thickness difference between the first and second laser ultrasonic probes was measured in millimeters. y It can be set; the default value is 20mm.

[0034] The formula for calculating edge thinning is: (9) in, The thickness difference between the first and second laser ultrasonic probes is measured when the second laser ultrasonic probe is 120 mm from the edge on the operating side. The difference in thickness between the first and second laser ultrasonic probes is measured when the second laser ultrasonic probe is 20 mm from the edge on the operating side.

[0035] The calculation method is the same.

[0036] Furthermore, the method in this embodiment also includes: S5, Overall Quality Assessment; For each coil of strip steel, all scanning data for the entire coil are statistically analyzed, and the strip steel before the head is forcibly removed. Each sweep and the final step Data for each scan cycle ( ); for the remaining scan strokes corresponding to the same plate difference wedge The edge thinning amount is calculated using an arithmetic mean. Simultaneously, the differences between the same plate are statistically analyzed. Less than or equal to , , , and The percentage of the number of scans to the total number of effective scans is used to generate the same-plate tolerance ratio, that is: A) Same-plate tolerance δ≤5 full length pass rate; B) Same-plate tolerance δ≤6 full length pass rate; C) Same-plate tolerance δ≤7 full length pass rate; D) Same-plate tolerance δ≤8 full length pass rate; E) Same-plate tolerance δ≤10 full length pass rate.

[0037] In summary, this embodiment provides a method for scanning cross-section measurement and data processing of silicon steel. This method employs a dual-probe structure, using a fixed probe as a reference, and utilizes the LMS algorithm to effectively eliminate longitudinal thickness fluctuation interference during high-speed strip operation, improving the accuracy of transverse cross-sectional profile restoration and achieving high-precision quality assessment. A head and tail data rejection mechanism based on the scanning stroke is proposed to avoid interference from unstable sections at the beginning and end of the rolling process on the overall coil quality rating, making the data analysis results more consistent with actual user needs. A comprehensive evaluation system including plate difference, wedge angle, edge thinning, and yield distribution is established, providing detailed data support for optimizing silicon steel production processes.

[0038] Second Embodiment

[0039] This embodiment applies the solution of the present invention to a cold-rolled silicon steel production line, and the implementation steps are as follows: Step 1: Install the laser ultrasonic probes on-site; the first laser ultrasonic probe is fixed to the center of the strip, and the second laser ultrasonic probe is mounted on the linear module. Set the strip width. strip running speed The scanning speed of the second laser ultrasonic probe is set to... .

[0040] Step 2: Measure the physical installation center distance between the first and second laser ultrasonic probes along the length of the strip. The excitation time difference required for both probes to measure the same cross-section is calculated according to formula (1). : Based on this, the system automatically establishes a length of The data buffer queue aligns the data from the first laser ultrasound probe with the data from the second laser ultrasound probe after a delay.

[0041] Step 3, Set the LMS filter order Step size factor Acquire raw scanning data from the second laser ultrasound probe within one scan range. Data from the aligned first laser ultrasound probe The original data contained data with an amplitude of approximately [missing information]. The periodic longitudinal fluctuations. Substitute the data into formulas (2) to (6) for iterative calculation. After adaptive filtering, the true cross-sectional contour data after removing longitudinal interference is obtained. The processed curves remove high-frequency and low-frequency longitudinal vibration noise, accurately restoring the actual shape of the transverse section.

[0042] Step 4, based on the reconstructed data, set The plate difference for this scanning process is calculated. ;Calculation operation side thinning .

[0043] Step 5: First, remove 20 scans each from the unstable sections at the head and tail; then, evaluate the overall quality of a 3000m long steel coil based on the measurement data after removing the head and tail data.

[0044] Third Embodiment

[0045] This embodiment provides an electronic device, such as... Figure 3 As shown, the electronic device includes a processor and a memory; wherein the processor and the memory can be connected via a communication bus; the memory stores at least one instruction, which is loaded and executed by the processor to implement the method of the first embodiment described above. Furthermore, the electronic device may also include a transceiver, the processor and the transceiver can be connected via a communication bus, and the transceiver is used to communicate with other devices.

[0046] Below, in conjunction with Figure 3 A detailed introduction to each component of this electronic device is provided below: The processor is the control center of the electronic device. The electronic device may include multiple processors, each of which can be a single-core processor (single-CPU) or a multi-core processor (multi-CPU). The term "processor" can refer to a single processor or a collective term for multiple processing elements. For example, a processor can be one or more central processing units (CPUs), other general-purpose processors, application-specific integrated circuits (ASICs), or one or more integrated circuits configured to implement embodiments of the present invention, such as one or more digital signal processors (DSPs), one or more field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor. The processor can perform various functions of the electronic device by running or executing software programs stored in memory and by calling data stored in memory.

[0047] In a specific implementation, as one example, the processor may include one or more CPUs, for example... Figure 3 CPU0 and CPU1 shown are, of course, merely illustrative examples.

[0048] The memory is used to store the software program that executes the solution of the present invention, and the processor controls its execution. For specific implementation methods, please refer to the above method embodiments, which will not be repeated here.

[0049] Optionally, the memory may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto. The memory may be integrated with the processor or exist independently, and may be accessed through the interface circuit of the electronic device ( Figure 3 (Not shown in the image) is coupled to the processor; however, this embodiment of the invention does not impose specific limitations on this.

[0050] The transceiver may include a receiver and a transmitter. Figure 3 (Not shown separately). The receiver is used to implement the receiving function, and the transmitter is used to implement the transmitting function. The transceiver can be integrated with the processor or exist independently, and can be connected through the interface circuit of the electronic device (…). Figure 3 (Not shown in the image) is coupled to the processor, and this embodiment of the invention does not specifically limit this.

[0051] In addition, it should be noted that, Figure 3 The structure of the electronic device shown is not intended to limit the device. Actual devices may include more or fewer components than shown, or combine certain components, or have different component arrangements. Furthermore, the technical effects achieved by this electronic device when performing the method of the first embodiment described above can be referenced to the technical effects described in the first embodiment; therefore, they will not be repeated here.

[0052] Fourth embodiment

[0053] This embodiment provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to implement the method of the first embodiment described above. The computer-readable storage medium may be a ROM, random access memory, CD-ROM, magnetic tape, floppy disk, or optical data storage device, etc. The instruction stored therein can be loaded and executed by a processor in a terminal.

[0054] Furthermore, it should be noted that the present invention can be provided as a method, apparatus, or computer program product. Therefore, embodiments of the present invention can take the form of a completely or partially hardware embodiment, a completely or partially software embodiment, or an embodiment combining software and hardware aspects. Moreover, when implemented in software, embodiments of the present invention can take the form of a computer program product implemented on one or more computer-usable storage media containing computer-usable program code. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any usable medium accessible to a computer or a data storage device such as a server or data center containing one or more sets of usable media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. A semiconductor medium can be a solid-state drive (SSD).

[0055] Embodiments of the present invention are described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0056] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing terminal equipment to cause a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0057] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element. Furthermore, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. Additionally, the character " / " in this text generally indicates an "or" relationship between the preceding and following objects, but it can also indicate an "AND / OR" relationship. Please refer to the context for specific interpretations. "At least one" refers to one or more items, while "more than" refers to two or more items. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can be represented as: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0058] Furthermore, it is understood that in various embodiments of the present invention, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0059] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0060] In the several embodiments provided by this invention, it should be understood that the disclosed devices, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of functional modules / units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings or direct couplings or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms. Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, i.e., they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs. Additionally, the functional units in the various embodiments of this invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0061] If the method is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0062] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention. It should be pointed out that although preferred embodiments of the present invention have been described, those skilled in the art, once they understand the basic inventive concept of the present invention, can make several improvements and modifications without departing from the principles described herein. These improvements and modifications should also be considered within the scope of protection of the present invention. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

Claims

1. A method of silicon steel scanning section measurement and data processing, characterized by, include: A first laser ultrasonic probe and a second laser ultrasonic probe are arranged in a cold-rolled silicon steel production line. During the measurement process, the strip being measured moves at a preset speed and along a preset direction. The first laser ultrasonic probe is fixedly installed at the center line of the strip width direction. The second laser ultrasonic probe performs reciprocating scanning motion along the strip width direction. The excitation time difference between the first laser ultrasonic probe and the second laser ultrasonic probe is set. When the strip starts running, the first laser ultrasonic probe and the second laser ultrasonic probe are excited to start working according to the set excitation time difference. The thickness of the strip is measured by the first laser ultrasonic probe and the second laser ultrasonic probe respectively. The process of the second laser ultrasonic probe moving from the transmission side to the operation side and then back to the transmission side is defined as one sweep. For each scan, based on the measurement data from the first and second laser ultrasonic probes, the true transverse cross-sectional contour data is obtained by removing longitudinal interference, thus realizing the reconstruction of the cross-sectional contour data. For each scanning pass, a preset quality index is calculated based on the reconstructed cross-sectional contour data.

2. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 1, characterized in that, The formula for calculating the excitation time difference is: ； in, To stimulate the time difference; d The straight-line distance between the first laser ultrasonic probe and the second laser ultrasonic probe along the running direction of the strip; v The speed at which the strip runs; Let the excitation time of the first laser ultrasonic probe be... t Then the excitation time of the second laser ultrasonic probe is t + .

3. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 1, characterized in that, The measurement data based on the first and second laser ultrasonic probes, after removing longitudinal interference, yields the true transverse cross-sectional contour data, including: A preset adaptive filtering algorithm is used to filter the measurement data of the first laser ultrasonic probe to obtain the filtered result of the measurement data of the first laser ultrasonic probe, which is used as the longitudinal fluctuation component at the corresponding measurement point. Subtracting the longitudinal fluctuation component at the corresponding measurement point from the measurement data of the second laser ultrasonic probe yields the true transverse cross-sectional profile data.

4. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 3, characterized in that, The preset adaptive filtering algorithm is the Least Mean Square (LMS) algorithm.

5. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 1, characterized in that, The quality indicators include: the difference between the same plate size during the current sweep, wedge shape, thinning value of the operating side and the thinning value of the transmission side, and the removal of the head and tail portions respectively. N After analyzing the data corresponding to each sweep stroke, the following data is collected for the entire strip steel coil: the average difference between the same plate, the average wedge shape, the average thinning value on the operating side, the average thinning value on the transmission side, and the percentage of sweep strokes with the same plate difference less than or equal to different preset thresholds out of the total number of sweep strokes; among these, N This is the default value.

6. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 5, characterized in that, The formula for calculating the difference between plates of the same type is: ； in, Differences between boards of the same type; The second laser ultrasonic probe is located at the edge of the transmission side. x The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; The second laser ultrasonic probe is located at the edge of the operating side. x The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; x This is the default value.

7. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 6, characterized in that, The formula for calculating a wedge is: ； in, It is wedge-shaped; The second laser ultrasonic probe is located at the edge of the operating side. y The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; The second laser ultrasonic probe is located at the edge of the transmission side. y The difference in thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe at millimeters; y This is the default value.

8. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 5, characterized in that, The formula for calculating the thinning value of the operating side is: ； in, This refers to the thinning value of the operating side portion; The difference between the thickness measured by the first laser ultrasonic probe and the second laser ultrasonic probe when the second laser ultrasonic probe is 120 mm away from the edge on the operating side. The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 20 mm from the edge on the operating side. The formula for calculating the thinning value of the transmission side is: ； in, This refers to the thinning value of the transmission side portion; The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 120mm from the edge on the transmission side. The difference between the thickness measured by the first and second laser ultrasonic probes when the second laser ultrasonic probe is 20mm from the edge on the transmission side.

9. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 7, characterized in that, x The value is 20; y The value is 20.

10. The method for scanning cross-section measurement and data processing of silicon steel as described in claim 5, characterized in that, The different preset thresholds include: , , , and .

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