A copper alloy with low thermal expansion and high thermal conductivity, preparation and application thereof
By introducing a third element into Cu-Zn shape memory alloy and performing cold rolling, the martensitic phase transformation is controlled, and a low thermal expansion and high thermal conductivity copper alloy is prepared. This solves the problem that traditional alloys cannot simultaneously achieve thermal conductivity and thermal expansion performance in high-power electronic packaging, and realizes the coupling of high thermal conductivity and low expansion, making it suitable for high-precision electronic packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH BEIJING
- Filing Date
- 2026-04-15
- Publication Date
- 2026-07-17
AI Technical Summary
Existing traditional Invar alloys are difficult to balance low thermal expansion and high thermal conductivity in high-power electronic packaging, resulting in insufficient thermal management and dimensional stability, which has become a bottleneck restricting the reliability and performance improvement of electronic systems.
By introducing a third element M (Al, Sn, Si, Ni) into Cu-Zn shape memory alloys and controlling the martensitic phase transformation through cold rolling to form a plate texture, dynamic offsetting of thermal expansion properties is achieved. Combined with the high thermal conductivity of Cu-based alloys, a low thermal expansion and high thermal conductivity copper alloy is prepared.
It achieves a coupling of high thermal conductivity and low expansion, the material has good dimensional stability over a wide temperature range, and is low in cost, making it suitable for high-precision electronic packaging.
Smart Images
Figure CN122406005A_ABST