Multistage interconnected high-sensitivity piezoelectric vibration sensing chip based on hexagonal cantilever beam structure and preparation method thereof

By employing a hexagonal cantilever beam structure design and differential series electrode lead technology, the high-frequency sensitivity and adaptability to complex environments of the piezoelectric MEMS vibration sensor are enhanced, solving the bottleneck problems in existing technologies and achieving a balance between high sensitivity and stability.

CN122448346APending Publication Date: 2026-07-24XI AN JIAOTONG UNIV
0 Cites 0 Cited by

Patent Information

Application Number
CN202610540773.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-22
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing piezoelectric MEMS vibration sensors have bottlenecks in terms of high-frequency sensitivity, adaptability to complex environments, and long-term service stability, and the application of traditional bulk vibration sensors is limited in large-scale, distributed, and strong interference monitoring scenarios.

Method used

The design employs a hexagonal cantilever beam structure. By increasing stress concentration at the cantilever beam connection end and achieving electrode potential superposition through differential series connection of electrode leads, the piezoelectric effect and output sensitivity are enhanced.

Benefits of technology

This improves the sensor's ability to capture weak high-frequency vibration signals, enhances its robustness and output sensitivity in complex environments, and maintains structural stability.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a multistage interconnected high-sensitivity piezoelectric vibration sensing chip based on a hexagonal cantilever beam structure and a preparation method thereof, the sensitive structure sequentially comprises a mass block, a cantilever beam and an outer frame from the center to the outside, and the mass block and the outer frame are concentrically arranged and are connected through the hexagonal cantilever beam; the cantilever beam structure is composed of a passivation layer, an upper electrode layer, a piezoelectric layer, a lower electrode layer, an insulating layer, upper silicon and a buried oxide layer from top to bottom and is distributed in a central symmetry mode. The lower electrode layer, the piezoelectric layer and the upper electrode layer are used for etching gaps and partition gaps at the two connecting ends and the middle position of the cantilever beam to form a plurality of independent piezoelectric sensing units; and each electrode of the piezoelectric sensing unit is connected with an external lead, so that differential interconnection of charges output by the plurality of sensing units is realized. According to the invention, the stress concentration of the connecting end of the cantilever beam is enhanced through the hexagonal cantilever beam structure design, and a plurality of piezoelectric sensitive units are divided by introducing the structure partition design and are connected in series, so that the output sensitivity is obviously improved.
Need to check novelty before this filing date? Find Prior Art