A MEMS inertial measurement device

Abstract

This application relates to a MEMS inertial measurement device, comprising: a structural support member, the structural support member having a temperature regulating element, and the temperature regulating element having a temperature sensor; a sensor board, fixed to the structural support member, with the sensor board and the structural support member forming a mounting cavity, the sensor board having a MEMS sensor, and the MEMS sensor, temperature regulating element, and temperature sensor all located within the mounting cavity; and an interface board, fixed to the sensor board, the interface board having an external communication chip and a temperature control circuit, the external communication chip being connected to an FPGA chip, the FPGA chip being signal-connected to the MEMS sensor, and the temperature control circuit being signal-connected to the temperature sensor and the temperature regulating element, the temperature control circuit being used to control the heating or cooling of the temperature regulating element based on the temperature measured by the temperature sensor. This application can achieve precise control of the ambient temperature around the MEMS sensor, ensuring the working environment of the MEMS sensor, thereby reducing the impact of external ambient temperature on the accuracy of the MEMS sensor.

Description

Technical Field

[0001] This application relates to the field of inertial measurement technology, specifically to a MEMS inertial measurement device. Background Technology

[0002] Currently, inertial measurement units (INS) are the core product of aircraft control systems. They primarily measure the angular rate and linear acceleration of the vehicle in real time, feeding this data back to the control system for navigation calculations, thereby enabling precise control and correction of the trajectory. Common methods for measuring vehicle motion include inertial navigation, satellite navigation, visual navigation, image matching, and radar detection. Among these, inertial navigation based on gyroscopes and accelerometers offers advantages such as complete autonomy, freedom from time and geographical limitations, and continuous, real-time navigation. It is a fundamental configuration for measuring vehicle motion and is widely used in various fields of vehicle motion measurement.

[0003] Among related technologies, mainstream optical inertial navigation systems (INS) are difficult to meet the requirements of low cost and miniaturization as carrier motion measurement INS due to their high cost and large size. MEMS (Micro-Electro-Mechanical Systems) INS have advantages such as small size and low cost. However, MEMS devices have the problem that their accuracy is greatly affected by changes in temperature environment.

[0004] Therefore, it is necessary to design a new MEMS inertial measurement device to overcome the above problems. Summary of the Invention

[0005] This application provides a MEMS inertial measurement device that can solve the technical problem in related technologies where the accuracy of MEMS devices is greatly affected by changes in temperature environment.

[0006] In a first aspect, embodiments of this application provide a MEMS inertial measurement device, comprising: a structural support member, wherein the structural support member is provided with a temperature regulating element, and the temperature regulating element is provided with a temperature sensor; a sensor plate, which is fixed to the structural support member, and the sensor plate and the structural support member form a mounting cavity, the sensor plate being provided with a MEMS sensor, and the MEMS sensor, the temperature regulating element, and the temperature sensor are all located within the mounting cavity; and an interface plate, which is fixed to the sensor plate, the interface plate being provided with an external communication chip and a temperature control circuit, the external communication chip being signal-connected to the MEMS sensor, and the temperature control circuit being signal-connected to the temperature sensor and the temperature regulating element, the temperature control circuit being used to control the temperature regulating element to heat or cool based on the temperature measured by the temperature sensor.

[0007] In conjunction with the first aspect, in one embodiment, the sensor board is provided with a plurality of MEMS sensors, the plurality of MEMS sensors being of the same model and arrayed on the sensor board, and the plurality of MEMS sensors being located within the mounting cavity; the sensor board is also provided with an FPGA chip, the plurality of MEMS sensors being signal-connected to the external communication chip through the FPGA chip, the FPGA chip being used to perform fusion estimation calculations on the output data of all the MEMS sensors, and sending the calculation results to the external communication chip.

[0008] In conjunction with the first aspect, in one embodiment, the sensor board is fixed with a plurality of pin headers, the interface board is fixed to the sensor board via the pin headers, and the FPGA chip is connected to the external communication chip via the pin headers; the pin headers are used for power supply and signal transmission.

[0009] In conjunction with the first aspect, in one embodiment, the interface board is provided with a secondary power supply chip, which is electrically connected to the MEMS sensor and also electrically connected to the FPGA chip.

[0010] In conjunction with the first aspect, in one embodiment, the FPGA chip communicates with multiple MEMS sensors via an SPI interface, wherein the SPI interface uses clock pins for multiplexing.

[0011] In conjunction with the first aspect, in one embodiment, a plurality of the MEMS sensors are symmetrically and uniformly distributed around the sensor board, and each MEMS sensor is installed in the same direction, and the signal traces of the MEMS sensors are of equal length and matched.

[0012] In conjunction with the first aspect, in one embodiment, the temperature control circuit is electrically connected to a filter circuit.

[0013] In conjunction with the first aspect, in one embodiment, the temperature control circuit includes a data acquisition chip, a temperature control chip, and a driver chip. The data acquisition chip is signal-connected to the temperature sensor, the temperature control chip is electrically connected to the data acquisition chip and the driver chip, and the driver chip is signal-connected to the temperature adjustment element.

[0014] In conjunction with the first aspect, in one embodiment, the temperature regulating element and the MEMS sensor are filled with thermally conductive silicone grease.

[0015] In conjunction with the first aspect, in one embodiment, the inner wall of the mounting cavity is surrounded by an insulation layer.

[0016] The beneficial effects of the technical solutions provided in this application include: By mounting a MEMS sensor within a cavity defined by a structural support and a sensor board, and by placing a temperature sensor and a temperature regulating element within the cavity, the temperature of the environment surrounding the MEMS sensor can be detected. Simultaneously, the temperature regulating element can be controlled by a temperature control circuit to achieve precise control of the ambient temperature around the MEMS sensor, ensuring the working environment of the MEMS sensor and thus reducing the impact of external ambient temperature on the accuracy of the MEMS sensor. This solves the technical problem in related technologies where the accuracy of MEMS devices is greatly affected by changes in the temperature environment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a MEMS inertial measurement device provided in an embodiment of this application; Figure 2 Power supply diagram of the MEMS inertial measurement device provided in the embodiments of this application; Figure 3 Signal diagram of the MEMS inertial measurement device provided in the embodiments of this application; Figure 4 Temperature control diagram of the MEMS inertial measurement device provided in the embodiments of this application; Figure 5 A layout diagram of the sensor board provided in an embodiment of this application; Figure 6 This is a layout diagram of the interface board provided in an embodiment of this application.

[0019] In the picture: 1. Structural load-bearing components; 11. Mounting cavity; 2. Temperature regulating element; 3. Temperature sensor; 4. Sensor board; 41. MEMS sensor; 42. FPGA chip; 43. First fixing pad; 5. Interface board; 51. External communication chip; 52. Temperature control circuit; 521. Temperature control chip; 53. Secondary power supply chip; 54. Second fixing pad; 55. Filtering circuit; 6. Needle row; 7. Insulation layer. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0021] This application provides a MEMS inertial measurement device that can solve the technical problem in related technologies where the accuracy of MEMS devices is greatly affected by changes in temperature environment.

[0022] See Figure 1 and Figure 4 As shown, an embodiment of this application provides a MEMS inertial measurement device, which includes: a structural support 1, wherein the structural support 1 is provided with a temperature regulating element 2, and the temperature regulating element 2 is provided with a temperature sensor 3; a sensor plate 4, which is fixed to the structural support 1, and the sensor plate 4 and the structural support 1 form a mounting cavity 11, the sensor plate 4 is provided with a MEMS sensor 41, and the MEMS sensor 41, the temperature regulating element 2 and the temperature sensor 3 are all located in the mounting cavity 11; an interface plate 5, which is fixed to the sensor plate 4, the interface plate 5 is provided with an external communication chip 51 and a temperature control circuit 52, the external communication chip 51 is signal-connected to the MEMS sensor 41, and the temperature control circuit 52 is signal-connected to the temperature sensor 3 and the temperature regulating element 2, the temperature control circuit 52 is used to control the temperature regulating element 2 to heat or cool based on the temperature measured by the temperature sensor 3.

[0023] See Figure 1 As shown, in this embodiment, both the interface board 5 and the sensor board 4 are circuit boards, and the interface board 5 and the sensor board 4 are installed in two layers, with the interface board 5 on top and the sensor board 4 on the bottom. The two circuit boards are preferably connected by a pin header 6. On the one hand, the pin header 6 can transmit power and communication signals. On the other hand, the relative positional relationship between the two circuit boards is constrained by the precise horizontal positioning and height dimension control of the pin header 6 between the two circuit boards.

[0024] See Figure 1 As shown, in this embodiment, the interface board 5 and the sensor board 4 are fixed inside the structural support 1 by potting glue around them. The gap between the outer surface of the interface board 5 and the sensor board 4 and the inner wall of the structural support 1 is small. After fixing their relative positions, the connection can be solidified by glue seeping through the gaps, and glue can be applied locally for reinforcement.

[0025] In this embodiment, a mounting cavity 11 is formed between the sensor plate 4 and the inner bottom wall of the structural support 1. The temperature regulating element 2 is mounted on the bottom of the structural support 1. The temperature regulating element 2 preferably uses a TEC (Thermo-Electric Cooler) heating / cooling element for temperature control. In other embodiments, other components can be used for the temperature regulating element 2, which is not limited here. The temperature regulating element 2 is connected to the bottom of the structural support 1 by thermally conductive silicone grease to facilitate heat dissipation or cooling. In this embodiment, a temperature sensor 3 for temperature measurement is mounted on the temperature regulating element 2 through a heat-insulating adhesive plate to measure the ambient temperature around the MEMS sensor 41 in real time and send the data to the temperature control circuit 52.

[0026] In this embodiment, the MEMS sensor 41 is installed in the mounting cavity 11 defined by the structural support 1 and the sensor plate 4. A temperature sensor 3 and a temperature regulating element 2 are set in the mounting cavity 11. The temperature sensor 3 can detect the temperature of the environment around the MEMS sensor 41 and send the temperature information to the temperature control circuit 52. The temperature control circuit 52 can determine whether the temperature measured by the temperature sensor 3 meets the requirements. If the temperature does not meet the requirements, the temperature control circuit 52 can drive the temperature regulating element 2 to heat or cool, thereby achieving temperature regulation and precise control of the ambient temperature around the MEMS sensor 41. This allows the MEMS sensor 41 to work at the set temperature point, thereby reducing the impact of the external ambient temperature on the accuracy of the MEMS sensor 41. This solves the technical problem in related technologies where the accuracy of MEMS devices is greatly affected by changes in the temperature environment.

[0027] Further, in one embodiment, the temperature control circuit 52 includes a data acquisition chip, a temperature control chip 521, and a driver chip. The data acquisition chip is signal-connected to the temperature sensor 3, and the temperature control chip 521 is electrically connected to the data acquisition chip and the driver chip. The driver chip is signal-connected to the temperature regulating element 2. In this embodiment, the temperature control circuit 52 is mounted on the lower surface of the interface board 5. The data acquisition chip is used to acquire the temperature signal from the temperature sensor 3 and convert the temperature signal into a voltage signal, which is output to the digital temperature control chip 521. After amplification, modulation, and comparison processing within the temperature control chip 521, a PWM pulse width modulation signal is output to the driver chip. The driver chip drives the TEC temperature regulating element 2 to heat or cool, forming a closed-loop temperature control.

[0028] In this embodiment, the external communication chip 51 is installed on the upper surface of the interface board 5 to facilitate the conversion of external communication signals. The external communication chip 51 is, for example, an RS422 communication chip, which is mainly used to receive external commands and send internally processed data to the outside.

[0029] Furthermore, in some embodiments, the sensor board 4 is provided with a plurality of MEMS sensors 41, the plurality of MEMS sensors 41 being of the same model and arrayed on the sensor board 4, and all the plurality of MEMS sensors 41 being located within the mounting cavity 11; the sensor board 4 is also provided with an FPGA (Field-Programmable Gate Array) chip 42, the plurality of MEMS sensors 41 being signal-connected to the external communication chip 51 through the FPGA chip 42, the FPGA chip 42 being used to perform fusion estimation calculations on the output data of all the MEMS sensors 41, and sending the calculation results to the external communication chip 51. See also Figure 1 and Figure 5 As shown, in this embodiment, multiple MEMS sensors 41 of the same model are arrayed at the bottom of the sensor board 4. The MEMS sensors 41 output data to the FPGA chip 42 at fixed time intervals. After fusion calculation, the FPGA chip 42 sends the result to the external communication chip 51. In this embodiment, after receiving the output data from all MEMS sensors 41, the FPGA chip 42 identifies the status of the MEMS sensors 41, removes abnormal data, and then performs parameter fusion estimation calculation according to the Kalman filter model of the array MEMS sensor data. The calculation result is then sent to the external communication chip 51 via the header pin 6. The external communication chip 51 sends the result to an external device after conversion and driving. When the interface board 5 receives external command information from the external communication chip 51, it also transmits the information to the FPGA chip 42 for processing via the header pin 6.

[0030] In this embodiment, the MEMS sensor 41 is mounted on the back of the sensor board 4, and the FPGA chip 42 is mounted on the front of the sensor board 4. The FPGA chip 42, with its built-in Flash memory and a separate 3.3V power supply, is selected to reduce the circuit size. Because the FPGA chip 42 has flexible pin definitions, it can simultaneously sample and transmit multiple signals, significantly improving transmission efficiency.

[0031] This embodiment, based on the same type of MEMS sensor 41, improves overall performance by distributing multiple MEMS sensors 41 in an array. Simultaneously, it employs localized temperature control in its structure, effectively reducing the impact of temperature on the output accuracy of the MEMS sensor 41. Under constraints of size, space, and cost, this represents a superior MEMS inertial measurement combination technology solution.

[0032] Furthermore, in some optional embodiments, the sensor board 4 is fixedly provided with a plurality of pin headers 6, the interface board 5 is fixed to the sensor board 4 through the pin headers 6, and the FPGA chip 42 is signal-connected to the external communication chip 51 through the pin headers 6; the pin headers 6 are used for power supply and signal transmission. See also Figure 5 As shown, multiple first fixing pads 43 are provided on the edge of the sensor board 4. These first fixing pads 43 are used for soldering the pin headers 6 between the interface board 5 and the sensor board 4, which can both realize signal transmission and fix the structure between the interface board 5 and the sensor board 4. See Figure 6 As shown, multiple second fixing pads 54 are provided on the edge of the interface board 5 for soldering the pin headers 6 between the interface board 4 and the sensor board 4. In this embodiment, the sensor board 4 and the interface board 5 are fixedly connected by symmetrical pin headers 6, which not only realizes the transmission of power and signals, but also constrains the installation of the interface board 5 and the sensor board 4, eliminating the need for mounting screws and facilitating the product's potting and fixing.

[0033] In some embodiments, the interface board 5 is provided with a secondary power supply chip 53, which is electrically connected to the MEMS sensor 41 and the FPGA chip 42. See also Figure 2 As shown, in this embodiment, the input power supply of the MEMS inertial measurement device is a +5V DC power supply. The interface board 5 divides the input power supply into two paths. One path is converted to 3.3V DC power supply by the secondary power chip 53 and transmitted to the sensor board 4 through the header pin 6 to power the array MEMS sensor 41 and FPGA chip 42. The other path is +5V, which directly powers the temperature control circuit 52 and the external communication chip 51. Because the temperature control circuit 52 uses 5V drive and has a large power, a filter circuit 55 can be added at the temperature control input of the 5V power supply to reduce electrical interference to the MEMS sensor 41. In this embodiment, the secondary power chip 53 is mainly used to convert the external power supply into an internal 3.3V operating power supply.

[0034] Furthermore, in one embodiment, the FPGA chip 42 communicates with multiple MEMS sensors 41 via an SPI (Serial Peripheral Interface) interface, which uses a clock pin for multiplexing. In this embodiment, the output signal of the MEMS inertial measurement device is an RS422 serial port signal. After the product is powered on, the FPGA chip 42 communicates with multiple MEMS sensors 41 via the SPI interface at 5ms intervals. Figure 3As shown, to reduce interface pins, the SPI chip select (CS) and clock (CLK) pins are multiplexed, enabling simultaneous control of multiple MEMS sensors 41 with a single pin. After receiving output data from all MEMS sensors 41, the FPGA chip 42 identifies the status of the MEMS sensors 41, eliminates abnormal data, and then performs parameter fusion estimation calculations according to the array MEMS data Kalman filter model. The calculation results are then sent to the external communication chip 51 on the interface board 5 via pin header 6, and after conversion and driving, are sent to external devices. When the interface board 5 receives external command information from the external communication chip 51, it also transmits the information to the FPGA chip 42 for processing via pin header 6.

[0035] This embodiment uses an array of identical MEMS sensors 41 combined with an FPGA chip 42 to acquire data, achieving one-to-many synchronous signal acquisition. Furthermore, the multiplexing of chip select, clock, and input signals reduces the complexity of signal transmission and improves transmission efficiency.

[0036] Furthermore, in some embodiments, multiple MEMS sensors 41 are symmetrically and uniformly distributed around the sensor board 4, and each MEMS sensor 41 has the same mounting direction. The signal traces of the MEMS sensors 41 are of equal length and matched. In this embodiment, the sensor board 4 includes an FPGA chip 42, multiple MEMS sensors 41, and configuration circuitry. The multiple MEMS sensors 41 of the same model are symmetrically and uniformly distributed around the sensor board 4 to reduce the influence of environmental factors and installation stress. Each MEMS sensor 41 has 6 output channels: 3 orthogonal angular velocities and 3 orthogonal accelerations. All MEMS sensors 41 maintain the same mounting direction. To reduce mutual interference between MEMS sensors 41, the spacing between sensors must meet certain requirements, and the signal traces of the sensors must also be of equal length and matched to ensure the consistency of sensitive data.

[0037] In one embodiment, see Figure 2 As shown, the temperature control circuit 52 is electrically connected to the filter circuit 55. In this embodiment, a filter circuit 55 (EMI) is set at the 5V input position. The 5V power supply first passes through the filter circuit 55 before being transmitted to the temperature control circuit 52, which can reduce the electrical interference to the MEMS sensor 41.

[0038] In the above embodiments, the secondary power supply chip 53, the external communication chip 51, and the filter circuit 55 are mounted on the upper surface of the interface board 5 to facilitate the conversion of external power and communication signals.

[0039] Preferably, the temperature regulating element 2 and the MEMS sensor 41 are filled with thermally conductive silicone grease. In this embodiment, the space between the MEMS sensor 41 and the temperature regulating element 2 inside the structural support 1 is filled with thermally conductive silicone grease, which ensures both temperature uniformity and improves heat conduction efficiency.

[0040] Furthermore, in one embodiment, the temperature sensor 3 is mounted on the temperature regulating element 2 via a heat-insulating adhesive plate. In this embodiment, a temperature sensor is mounted at the center of the temperature regulating element 2 via a heat-insulating adhesive plate to measure the ambient temperature around the MEMS sensor 41 in real time and send the data to the temperature control circuit 52.

[0041] Furthermore, in some embodiments, the inner wall of the mounting cavity 11 is surrounded by a heat insulation layer 7. See also Figure 1 As shown, in this embodiment, to ensure temperature control, a ring of insulating material is installed on the lower side of the sensor board 4 to form a heat insulation layer 7, which surrounds the MEMS sensor 41 array in a sealed cavity for heat insulation. Within a limited space, precise local temperature control is achieved through TEC temperature control within the sealed cavity, ensuring the working environment of the MEMS sensor 41.

[0042] To reduce the impact of external temperature on the accuracy of the MEMS sensor 41, this embodiment incorporates localized thermal insulation for the MEMS sensor 41 array. A ring-shaped cavity is formed through a sealed annular thermal pad, minimizing heat exchange with the external environment. Simultaneously, a TEC (thermal energy dispersive rectifier) ​​heating / cooling element is added to the lower surface of the annular cavity. A temperature sensor 3 is located at the center of the TEC. When the temperature measured by the temperature sensor 3 does not meet the requirements, the temperature control circuit 52 drives the TEC to heat or cool, thus regulating the temperature and ensuring the MEMS inertial measurement device operates at the set temperature. To guarantee efficient temperature control, thermally conductive silicone grease is applied to both the upper and lower surfaces of the TEC to ensure good heat exchange.

[0043] In the above embodiments, the structural support 1 mainly provides a carrier for installation and provides local heat insulation for the MEMS sensor 41; the temperature regulating element 2, together with the temperature control circuit 52 on the interface board 5, controls the temperature of the MEMS sensor 41, and heats or cools it according to the different external ambient temperatures; the sensor board 4 is equipped with multiple MEMS sensors 41 of the same model and an FPGA chip 42, and the FPGA chip 42 simultaneously acquires signals from multiple MEMS sensors 41, performs Kalman filtering calculations, and obtains the output accuracy after array combination; the interface board 5 mainly completes the functions of internal secondary power conversion and external interface communication.

[0044] This application provides a temperature-controlled array-type MEMS inertial measurement device, which can solve the problems of low accuracy and large influence of temperature environment changes in MEMS devices. By adopting an array design of MEMS sensor 41 and performing local temperature control, high-precision output of industrial-grade MEMS sensor 41 with small size is achieved.

[0045] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0046] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0047] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A MEMS inertial measurement device, characterized by, It includes: The structural support component (1) is provided with a temperature regulating element (2), and the temperature regulating element (2) is provided with a temperature sensor (3). A sensor plate (4) is fixed to the structural support member (1), and the sensor plate (4) and the structural support member (1) form a mounting cavity (11). The sensor plate (4) is provided with a MEMS sensor (41). The MEMS sensor (41), the temperature regulating element (2) and the temperature sensor (3) are all located in the mounting cavity (11). An interface board (5) is fixed to the sensor board (4). The interface board (5) is provided with an external communication chip (51) and a temperature control circuit (52). The external communication chip (51) is connected to the MEMS sensor (41) and the temperature control circuit (52) is connected to the temperature sensor (3) and the temperature regulating element (2). The temperature control circuit (52) is used to control the temperature regulating element (2) to heat or cool based on the temperature measured by the temperature sensor (3).

2. The MEMS inertial measurement device as described in claim 1, characterized in that, The sensor board (4) is provided with a plurality of MEMS sensors (41), the plurality of MEMS sensors (41) are of the same type and are arrayed on the sensor board (4), and the plurality of MEMS sensors (41) are all located in the mounting cavity (11); The sensor board (4) is also provided with an FPGA chip (42). Multiple MEMS sensors (41) are connected to the external communication chip (51) via the FPGA chip (42). The FPGA chip (42) is used to perform fusion estimation calculation on the output data of all MEMS sensors (41) and send the calculation result to the external communication chip (51).

3. The MEMS inertial measurement device as described in claim 2, characterized in that, The sensor board (4) is fixed with a plurality of pin headers (6), the interface board (5) is fixed to the sensor board (4) through the pin headers (6), and the FPGA chip (42) is connected to the external communication chip (51) through the pin headers (6); the pin headers (6) are used for power supply and signal transmission.

4. The MEMS inertial measurement device as described in claim 2, characterized in that, The interface board (5) is provided with a secondary power supply chip (53), which is electrically connected to the MEMS sensor (41) and the FPGA chip (42).

5. The MEMS inertial measurement device as described in claim 2, characterized in that, The FPGA chip (42) communicates with multiple MEMS sensors (41) via an SPI interface, which uses clock pins for multiplexing.

6. The MEMS inertial measurement device as described in claim 2, characterized in that, Multiple MEMS sensors (41) are symmetrically and evenly distributed around the sensor board (4), and each MEMS sensor (41) is installed in the same direction. The signal traces of the MEMS sensors (41) are of equal length and matched.

7. The MEMS inertial measurement device of claim 1, wherein, The temperature control circuit (52) is electrically connected to the filter circuit (55).

8. The MEMS inertial measurement device as described in claim 1, characterized in that, The temperature control circuit (52) includes a data acquisition chip, a temperature control chip (521) and a driving chip. The data acquisition chip is connected to the temperature sensor (3) via a signal. The temperature control chip (521) is electrically connected to the data acquisition chip and the driving chip via a signal. The driving chip is connected to the temperature regulating element (2) via a signal.

9. The MEMS inertial measurement device as described in claim 1, characterized in that, The temperature regulating element (2) and the MEMS sensor (41) are filled with thermally conductive silicone grease.

10. The MEMS inertial measurement device of claim 1, wherein, The inner wall of the mounting cavity (11) is surrounded by an insulation layer (7).

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