Heat exchange device and power conversion device

Abstract

This application relates to a heat exchange device and a power conversion device, belonging to the field of heat exchange technology. The heat exchange device includes a bottom liquid-cooled plate; at least one side liquid-cooled plate, the side liquid-cooled plate and the bottom liquid-cooled plate forming an enclosing plate surface of a temperature-regulating space for accommodating electronic components; the bottom liquid-cooled plate has a flow channel for the heat exchange medium inside; the side liquid-cooled plate has a first heat exchange channel for accommodating the flow of the heat exchange medium inside; the surface of the side liquid-cooled plate is provided with first fins facing the temperature-regulating space. Therefore, this application achieves multi-faceted heat exchange for electronic components by setting the bottom liquid-cooled plate and the side liquid-cooled plate, increasing the heat exchange area. Simultaneously, multiple first fins are provided on the side liquid-cooled plate to allow gas to circulate within the temperature-regulating space. Therefore, this heat exchange device employs a liquid and gas co-exchange heat method to improve heat exchange efficiency.

Description

[0001] This application claims priority to Chinese Patent Application No. 202510152854.X, filed on February 11, 2025, entitled “Heat Dissipation Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat exchange technology, and in particular to a heat exchange device and a power conversion device. Background Technology

[0003] Converters, as small power electronic devices, are core components of energy storage systems. With the rapid development of energy storage technology, converters of the same power are becoming increasingly smaller, which places higher demands on the heat exchange performance of energy storage converters. Summary of the Invention

[0004] This application provides a heat exchange device and a power conversion device, which improve the heat exchange efficiency of the temperature regulation space, thereby at least partially solving the above-mentioned technical problems.

[0005] To achieve the above objectives, a heat exchange device is provided according to this application, comprising:

[0006] Bottom liquid cooling plate;

[0007] At least one side liquid cooling plate, the side liquid cooling plate and the bottom liquid cooling plate forming an enclosing plate surface of a temperature regulation space, the temperature regulation space being used to accommodate electronic devices;

[0008] The bottom liquid cooling plate has a flow channel for the heat exchange medium inside;

[0009] The side liquid cooling plate has a first heat exchange channel for accommodating the flow of heat exchange medium; the surface of the side liquid cooling plate is provided with a first fin, which is used to dissipate heat for the temperature regulation space.

[0010] This application also discloses a power conversion device, comprising:

[0011] Such as the heat exchanger and electronic components mentioned above;

[0012] The electronic devices are disposed in the temperature regulation space, wherein the electronic devices include one or a combination of IGBT, MOSFET, capacitor, inductor, and resistor.

[0013] In the heat dissipation device of this application embodiment, multi-faceted heat exchange is achieved for electronic components by setting a bottom liquid cooling plate and a side liquid cooling plate, thereby increasing the heat exchange area. Simultaneously, multiple first fins are arranged on the side liquid cooling plate, and a first airflow channel is formed between adjacent first fins to allow gas to circulate within the temperature regulation space. Therefore, this heat exchange device employs a combination of liquid and gas heat exchange to improve heat exchange efficiency.

[0014] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0017] Figure 1 This is a schematic diagram of the split-type heat exchange device provided in the embodiments of this application;

[0018] Figure 2 This is a schematic diagram of the integrated heat exchange device structure provided in the embodiments of this application;

[0019] Figure 3 This is a schematic diagram of the heat exchange device after it is covered, as provided in the embodiments of this application;

[0020] Figure 4 This is a schematic diagram of the structure provided in the embodiment of this application, showing that the side liquid cooling plate has fins on its surface;

[0021] Figure 5 This is a schematic diagram of the connection between the side liquid cooling plate and the first fin provided in the embodiment of this application. Figure 1 ;

[0022] Figure 6 This is a schematic diagram of the connection between the side liquid cooling plate and the first fin provided in the embodiment of this application. Figure 2 ;

[0023] Figure 7 This is a schematic diagram of the connection between the side liquid cooling plate and the first fin provided in the embodiment of this application. Figure 3 ;

[0024] Figure 8 This is a schematic diagram of the connection between the side liquid cooling plate and the first fin provided in the embodiment of this application. Figure 4 ;

[0025] Figure 9 This is a schematic diagram of the connection between the side liquid cooling plate and the first fin provided in the embodiment of this application. Figure 5 ;

[0026] Figure 10 This is a schematic diagram of the side liquid cooling plate with heat exchange protrusions provided in the embodiments of this application;

[0027] Figure 11 This is a schematic diagram of the overall structure of the side liquid cooling plate provided in the embodiments of this application. Figure 1 ;

[0028] Figure 12 This is a schematic diagram of the structure of the side liquid cooling plate and the air guide plate cooperating with each other, provided in the embodiment of this application.

[0029] Figure 13 yes Figure 11 The cross-sectional view along the AA direction mainly shows the schematic diagram of the split structure of the side liquid cooling plate and the manifold working together.

[0030] Figure 14 yes Figure 11 The cross-sectional view along the AA direction mainly shows the integrated structure of the side liquid cooling plate and the manifold.

[0031] Figure 15 This is a schematic diagram of the structure of the combiner provided in the embodiments of this application;

[0032] Figure 16 This is a schematic diagram of the overall structure of the side liquid cooling plate provided in the embodiments of this application. Figure 2 ;

[0033] Figure 17 yes Figure 16 The cross-sectional view along the BB direction mainly shows the connection structure between the side liquid cooling plate and the first fin.

[0034] Figure 18 yes Figure 16 The cross-sectional view along the BB direction mainly shows the connection structure between the side liquid cooling plate and the first fin.

[0035] Figure 19 This is a schematic diagram of the connection structure between the combiner and the side liquid cooling plate provided in the embodiments of this application;

[0036] Figure 20 This is a schematic diagram of the split heat exchange device structure provided in the embodiments of this application, mainly showing the heat exchange path of the side liquid cooling plate;

[0037] Figure 21 This is a top view of the heat exchange device provided in the embodiments of this application;

[0038] Figure 22 This is an exploded view of the side liquid cooling plate, air guide plate, and frame in cooperation with each other, as provided in the embodiments of this application.

[0039] Figure 23 This is a schematic diagram of the overall structure of the side liquid cooling plate, air guide plate, and frame provided in the embodiments of this application;

[0040] Figure 24 The explosion is caused by the side liquid cooling plate, air guide plate, and frame cooperating in the embodiments of this application. Figure 1 ;

[0041] Figure 25 This is a first-view structural schematic diagram of the side liquid cooling plate, air guide plate, and frame provided in the embodiments of this application;

[0042] Figure 26 This is a second-view structural schematic diagram of the side liquid cooling plate, air guide plate, and frame provided in the embodiments of this application;

[0043] Figure 27 This is a schematic diagram of the structure of two side liquid cooling plates and heat exchange structure provided in the embodiments of this application. The main structure has two first airflow chambers and one second airflow chamber.

[0044] Figure 28 The explosion is caused by the side liquid cooling plate, air guide plate, and frame cooperating in the embodiments of this application. Figure 2 ;

[0045] Figure 29 This is a schematic diagram of the structure in which the gap between the two side liquid cooling plates forms a second airflow cavity, as provided in an embodiment of this application.

[0046] Figure 30 This is a schematic diagram of the structure in which the spacing between the three side liquid cooling plates forms a second airflow cavity, as provided in the embodiments of this application.

[0047] Figure 31 This is a schematic diagram of a structure provided in an embodiment of this application, showing a sealing structure between the side liquid cooling plate and the frame.

[0048] Explanation of reference numerals in the attached figures:

[0049] 1-Bottom liquid cooling plate; 111-Flow channel;

[0050] 2-Side liquid cooling plate; 21-Sub-side liquid cooling plate; 2a-Liquid inlet end; 2b-Liquid outlet end; 20-Heat exchange protrusion; 201-Heat exchange section; 202-Bending section;

[0051] 3-Enclosing side panel; 4-Cover body; 5-Transfer pipe;

[0052] 101 - Temperature regulation space; 102 - First airflow chamber; 1021 - First sub-chamber; 1022 - Second sub-chamber; 103 - Second airflow chamber;

[0053] 71-First fin; 71a-First connecting end; 71b-Second connecting end; 711-Connecting part; 72-Second fin; 701-First airflow channel; 702-First heat exchange channel; 7021-Heat exchange capillary tube; 703-Second airflow channel; 704-Second heat exchange channel; 702a-Sub-heat exchange channel; 73-Third fin; 74-Flat tube;

[0054] 8-Air guide plate; 9-Frame; 10-Sealing structure; 11-Sealing element; 12-Fan;

[0055] 13-Merger; 130-Merging cavity; 131-Slit; 132-Side wall; 133-Heat exchange cavity; 134-Baffle; 133a-Diversion area; 133b-Merging area; 135-Flow channel baffle; 136-Merging hole;

[0056] 14a - First air inlet; 14b - First air outlet; 15a - Second air inlet; 15b - Second air outlet; 16a - Main liquid inlet; 16b - Main liquid outlet; 17a - Secondary liquid inlet; 17b - Secondary liquid outlet;

[0057] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0059] Example 1

[0060] like Figures 1 to 4 As shown, this application provides a heat exchange device, including a bottom liquid cooling plate 1 and multiple side liquid cooling plates 2. Taking the heat exchange device as a hexahedral structure as an example, the bottom liquid cooling plate 1, one or more side liquid cooling plates 2, and the cover 4 all serve as enclosing plates. The bottom liquid cooling plate 1 can serve as the lower plate of the heat exchange device, the cover 4 can serve as the upper plate of the heat exchange device, and the side liquid cooling plates 2 can serve as the side enclosing plates. The space enclosed by the bottom liquid cooling plate 1 and the multiple enclosing plates 2 is a temperature regulation space 101. The temperature regulation space 101 contains electronic devices, including but not limited to one or a combination of IGBTs, MOSFETs, capacitors, inductors, and resistors.

[0061] The bottom liquid cooling plate 1 has a heat exchange medium flow channel 111 inside, which is used for the flow of the heat exchange medium. Since the temperature regulation space 101 is enclosed by the bottom liquid cooling plate 1 and multiple side liquid cooling plates 2, the heat exchange medium filled in the bottom liquid cooling plate 1 and the side liquid cooling plates 2 is a cooling medium. This cooling medium may include a gaseous cooling medium or a liquid cooling medium, so that the heat exchange device can dissipate heat from the heat-generating electronic devices disposed inside the temperature regulation space 101. The cooling medium may include a gaseous cooling medium or a liquid cooling medium.

[0062] It should be noted that the bottom liquid cooling plate 1 can serve as the base plate of the heat exchange device, and the side liquid cooling plate 2 can serve as the side plate of the heat exchange device. The base plate and the side plate can be filled with a medium other than the cooling medium, such as a heating medium. In this way, when it is necessary to raise the temperature of the temperature regulation space 101, the temperature of the heating medium can be adjusted to meet diverse needs. The heating medium can include a gaseous heating medium or a liquid heating medium.

[0063] For example, if the cooling medium flows within the heat exchange medium flow channel 111, and the temperature of the cooling medium is low, the heat in the temperature regulating space 101 is conducted to the cooling medium through the wall of the bottom liquid cooling plate 1, causing the cooling medium to heat up. This heat can then be carried away from the temperature regulating space 101, thereby lowering the temperature of the temperature regulating space 101. Similarly, the side liquid cooling plate 2 has a first heat exchange channel 702 for accommodating the flow of the cooling medium, and the first heat exchange channel 702 is also used for the flow of the heat exchange medium. Figure 4 As shown, the surface of the side liquid cooling plate 2 facing the temperature regulation space 101 is also provided with a first fin 71. The first fin 71 is a strip-shaped plate structure that protrudes towards the temperature regulation space 101. For example, the surface of the side liquid cooling plate 2 facing the temperature regulation space 101 has one or more first fins 71. If there is only one first fin 71, the first fin 71 can be arranged parallel to the plane formed by the first direction X and the second direction Y, and the length direction of the first fin 71 is consistent with the length direction of the side liquid cooling plate 2, for example... Figure 4 The length direction of the right-side liquid cooling plate 2 is along the first direction X, and the length direction of the first fin 71 on the right-side liquid cooling plate 2 is consistent with the first direction X; thus, two first airflow channels 701 are separated in the third direction Z (it can be understood that the first fin 71, the part of the bottom liquid cooling plate 1 opposite to the first fin 71, and the side liquid cooling plate 2 connecting the first fin 71 and the bottom liquid cooling plate 1 form the lower first airflow channel 701; the first fin 71, the part of the cover 4 opposite to the first fin 71, and the side liquid cooling plate 2 connecting the first fin 71 and the cover 4 form the upper first airflow channel 701). At this time, the air in the temperature regulation space 101 flows in the horizontal direction and exchanges heat with the first fin 71.

[0064] Similarly, the length direction of the first fin 71 can also be set along the third direction Z. In this case, the air in the temperature regulation space 101 flows along the third direction Z and then exchanges heat with the first fin 71.

[0065] If there are multiple first fins 71 Figure 4 The length direction of the first fin 71 on the side liquid cooling plate 2 on the right side can be set along the first direction XY, that is, the first fin 71 extends into a plate shape in the horizontal direction; similarly, multiple first fins 71 can also be set at intervals along the third direction Z, and the interval between two adjacent first fins 71 can also form a first airflow channel 701. Figure 4 The length direction of the first fin 71 on the middle side liquid cooling plate 2 can be arranged along the second direction Y, in which case the first fin 71 extends into a plate shape in the horizontal direction; similarly, multiple first fins 71 can also be spaced apart along the third direction Z, and the interval between two adjacent first fins 71 can also form a first airflow channel 701. The first airflow channel 701 is connected to the temperature regulation space 101, which can promote the circulation of gas, thereby enhancing the heat exchange efficiency and making the temperature regulation more rapid and uniform. Of course, if there are multiple first fins 71, the first fins 71 can extend along the third direction Z, and multiple first fins 71 can be spaced apart along the first direction X or the second direction Y, and the interval between two adjacent first fins 71 can also form a first airflow channel 701.

[0066] Hot air in the temperature regulating space 101 comes into contact with the first fin 71, transferring heat to the first fin 71 and then to the cooling medium in the first heat exchange channel 702. The cooling medium heats up, thus carrying away the heat in the temperature regulating space 101 and lowering its temperature. The cooling medium can be a gaseous or liquid medium. A gaseous cooling medium can be a phase change refrigerant, while a liquid medium can be water, ethylene glycol, transformer oil, etc.

[0067] The number of side liquid cooling plates 2 can be adjusted according to actual needs. The number includes, but is not limited to, 1-4. For example, 1 bottom liquid cooling plate, 4 side liquid cooling plates and 1 cover can work together to form a hexahedral structure. The cover can be made of ordinary metal or non-metal sheet, thus forming a hexahedral structure.

[0068] Alternatively, the side enclosure may include 1-3 side liquid cooling plates 2, and the other side enclosures may be ordinary metal or non-metal sheets.

[0069] Alternatively, to further enhance heat dissipation, the cover 4 can be configured as a top liquid cooling plate, and the side enclosure can include four side liquid cooling plates 2; or, the cover 4 can be a top liquid cooling plate, and the side enclosure can include one to three side liquid cooling plates 2, with the other side enclosures made of ordinary metal or non-metal sheets; the heat exchange device can also be a structure with more surfaces formed by more enclosures, thus adapting to more diverse needs. The more cooling components there are in the bottom liquid cooling plate 1, side liquid cooling plates 2, and cover 4, the better the heat dissipation effect of the temperature regulation space 101, and the more uniform the temperature of each part of the temperature regulation space 101, avoiding local overheating and improving the stability and service life of the heat exchange device.

[0070] Furthermore, for ease of installation, multiple side liquid cooling plates 2 can be mounted on the bottom liquid cooling plate 1.

[0071] Or, such as Figure 3 As shown, the side enclosure panel may include at least one side liquid cooling plate 2 and at least one other side enclosure panel, wherein the other side enclosure panels are ordinary metal or non-metal sheets as enclosure side panels 3. The enclosure side panels 3, the side liquid cooling plates 2, and the bottom liquid cooling plate 1 cooperate to form a temperature regulation space 101, wherein at least one enclosure side panel 3 is used to install wiring terminals. Wiring terminals are electrical connectors used to connect wires and cables, and are typically used to realize electrical connections and distribution of circuits. The wiring terminals installed on the enclosure side panels 3 can have various types and functions, depending on the application requirements.

[0072] Furthermore, if the heating medium flows within the heat exchange medium flow channel 111, and the temperature of the heating medium is relatively high, the heating medium conducts heat to the temperature regulation space 101 through the wall of the bottom liquid cooling plate 1, thereby increasing the temperature of the temperature regulation space 101. Both the bottom liquid cooling plate 1 and the side liquid cooling plate 2 can achieve heating or cooling effects, optimizing the temperature regulation of the bottom liquid cooling plate 1 and the side liquid cooling plate 2 and reducing energy consumption. For example, when it is necessary to maintain a constant temperature in the temperature regulation space 101, the system can intelligently adjust the temperature of each part to achieve optimal energy efficiency. In addition, the heat exchange device can operate in different operating modes, such as needing to heat in some situations and cooling in others; this flexibility allows the equipment to adapt to various application requirements.

[0073] Example 2

[0074] The heat exchange device provided in this embodiment includes at least some of the technical solutions of Embodiment 1.

[0075] like Figure 5 or Figure 6As shown, the first fin 71 extends along a direction perpendicular to the third direction Z, and is spaced apart along this direction. This "spaced apart" arrangement can be equal or unequal. The side liquid cooling plate 2 has multiple first heat exchange channels 702 arranged along the third direction Z. The first fins 71 are correspondingly located on the side of the side liquid cooling plate 2 facing the temperature regulation space 101 of the 702. The first fins 71 increase the surface area of ​​the first heat exchange channels 702, promoting heat transfer from the temperature regulation space 101 to the first heat exchange channels 702, thus improving the overall heat transfer efficiency.

[0076] The first fin 71 can be a flank-shaped fin or a columnar protrusion. Both the fin and the protrusion can be hollow structures, so as to achieve heat exchange while reducing the overall weight of the heat exchange device.

[0077] Specifically, such as Figure 7 As shown, the first fin 71 has along Figure 7 The first connecting end 71a and the second connecting end 71b are arranged opposite each other in the lateral direction, and the first connecting end 71a is connected to the side liquid cooling plate 2. If the first fin 71 is Figure 4 The side liquid cooling plate 2 on the right side of the middle, then the first connecting end 71a and the second connecting end 71b of the first fin 71 are distributed along the second direction Y; if the first fin 71 is Figure 4 The side liquid cooling plate 2 on the middle side has the first connecting end 71a and the second connecting end 71b of the first fin 71 distributed along the first direction X.

[0078] The dimension of the second connecting end 71b in the third direction Z is larger than the dimension of the first connecting end 71a in the third direction Z, so that the cross-sectional area of ​​the first airflow channel 701 between two adjacent first fins 71 increases in the direction away from the first heat exchange channel 702. For example, Figure 7 The cross-sectional area of ​​the first airflow channel 701 gradually increases in the direction away from the first heat exchange channel 702, which helps to guide the airflow to be more evenly distributed between the fins, reduce airflow blockage, and improve the overall heat exchange efficiency.

[0079] like Figure 7 As shown, in the direction perpendicular to the length of the first fin 71 (the extension direction of the first heat exchange channel 702) and perpendicular to the third direction Z (i.e. Figure 7In the transverse direction (as shown in the diagram), the dimension of the cross-section of the first fin 71 in the third direction Z is greater at the end furthest from the first heat exchange channel 702 than at the end closest to the first heat exchange channel 702. The first connecting end 71a (the end where the first fin 71 connects to the side liquid cooling plate 2) is thinner, which can increase the distance between the roots of two adjacent first fins 71 in the third direction Z. Since the root temperature of the first fin 71 is lower, increasing the ventilation volume of the first connecting end 71a can improve the cooling effect. Alternatively, the dimension of the cross-section of the first fin 71 in the third direction Z is smaller at the end furthest from the first heat exchange channel 702 than at the end closest to the first heat exchange channel 702. The thicker the first connecting end 71a of the first fin 71, the stronger the connection between the first fin 71 and the side liquid cooling plate 2. It can be understood that the cross-section of the first fin 71 in the plane perpendicular to its length is generally V-shaped. The V-shaped structure helps guide airflow, reduce air resistance, and improve airflow efficiency. This design increases the surface area of ​​the first fin 71, thereby improving heat exchange efficiency. The larger surface area allows for more efficient heat dissipation.

[0080] Alternatively, the first fin 71 may have an uneven surface, which can be a regular uneven surface (such as a wavy surface or a rectangular wave surface) or an irregular surface. An uneven surface can increase airflow disturbance, break the boundary layer effect, thereby improving convective heat transfer efficiency and helping to remove heat from the surface of the first fin 71 more quickly. For example, the waves of the first fin 71 may be spaced apart in the first direction X, and the waves may advance along the second direction Y. Alternatively, the waves of the first fin 71 may be spaced apart in the second direction Y, and the waves may advance along the second direction Y, as long as the heat transfer efficiency of the heat exchanger can be improved.

[0081] like Figure 6 or Figure 7 As shown, the inner surface of each first heat exchange channel 702 is a concave-convex surface, which increases the total area of ​​the inner surface of the first heat exchange channel 702, thereby providing more contact area for heat exchange and improving heat exchange efficiency.

[0082] Example 3

[0083] The heat exchange device provided in this embodiment includes at least some of the technical solutions of Embodiment 1 and Embodiment 2.

[0084] like Figure 8 As shown, the first heat exchange channel 702 has an inner surface and an outer surface that are opposite to each other, and one or both of the inner surface and the outer surface can be provided with first fins 71; taking the side liquid cooling plate 2 as a hexahedral structure as an example, as Figure 22 As shown, the first heat exchange channel 702 has first fins 71 on the inner surface of the side liquid cooling plate 2, for example... Figure 8It is shown that first fins 71 are provided on both outer surfaces of the first heat exchange channel 702 in the third direction Z. As Figure 24 shown, first fins 71 are respectively provided on the inner surface and the outer surface of the side liquid cooling plate 2 in the X direction. The plurality of first fins 71 are arranged at intervals in the third direction Z, and the ends of each first fin 71 close to the first heat exchange channel 702 are connected through a connecting portion 711 to form a heat dissipation structure. This heat dissipation structure is in a Ш shape, which facilitates the connection between the first fins 71 and the side liquid cooling plate 2, and provides better mechanical stability and rigidity, reducing the possibility of deformation of the first fins 71 under vibration or impact. The Ш-shaped fin structure can be formed by a stamping process, and the first fins 71 and the side liquid cooling plate 2 can be connected by welding or bonding.

[0085] Embodiment 4

[0086] The heat exchange device provided in this embodiment includes at least part of the technical solutions of Embodiment 1 and Embodiment 2.

[0087] As Figure 8 shown, the first heat exchange channel 702 has opposite inner and outer surfaces. Taking the side liquid cooling plate 2 as a hexahedron structure as an example, first fins 71 are provided on at least one inner surface and at least one outer surface of the first heat exchange channel 702 in the third direction Z, and the first fins 71 on the inner and outer surfaces are located on the same side. For example, Figure 8 in the first fins 71 on the inner and outer surfaces are both located on the left side. The first fins 71 on the inner and outer surfaces can be symmetrically arranged or staggeredly arranged, and no special limitation is made here. In this embodiment, as Figure 9 shown, the first fin 71 and the side liquid cooling plate 2 are of an integrated structure, and the first fin 71 and the side liquid cooling plate 2 are connected to form a 卌-shaped structure to further perform heat exchange treatment on the temperature adjustment space 101.

[0088] Embodiment 5

[0089] The heat exchange device provided in this embodiment includes at least part of the technical solutions of Embodiments 1 to 4.

[0090] As Figure 10 shown, there are heat exchange protrusions 20 convex towards the heat exchange medium flow channel 111 inside the side liquid cooling plate 2. The heat exchange protrusions 20 can be columnar protrusions, or conical protrusions, or hemispherical protrusions, or a combination of them. The heat exchange protrusions 20 increase the surface area in contact with the heat exchange medium, can disturb the flow of the heat exchange medium, increase the turbulence effect, and thus improve the heat exchange efficiency. Moreover, the heat exchange protrusions 20 can increase the mechanical strength and rigidity of the side liquid cooling plate 2, enhancing its pressure resistance and anti-deformation ability.

[0091] Embodiment 6

[0092] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 5.

[0093] like Figure 1 As shown, the three side liquid cooling plates 2 are arranged end to end to form a C-shaped structure. Figure 1 The length direction of the side liquid cooling plates 2 on the right and left sides is along the first direction X, the width direction is along the third direction, and the thickness direction is along the second direction Y. Figure 1 The length of the central side liquid-cooled plate 2 is along the second direction Y, the width is along the third direction Z, and the thickness is along the first direction X. The first heat exchange channels 702 of two adjacent side liquid-cooled plates 2 are connected by a transfer pipe 5. The transfer pipe 5 provides a continuous flow path, allowing the heat exchange medium to flow smoothly between multiple side liquid-cooled plates 2, which helps to form a unified heat exchange loop and improve the overall heat exchange efficiency.

[0094] like Figure 5 , Figure 6 or Figure 7 As shown, the side liquid cooling plate 2 is provided with multiple sub-heat exchange channels 702a, which are also the first heat exchange channels 702 (see...). Figure 1 The heat exchange channel 702a is divided into multiple sub-heat exchange channels 702a, which are arranged vertically along the third direction Z, where the third direction Z is the width direction of the side liquid cooling plate 2.

[0095] For example, in two adjacent side liquid cooling plates 2, the sub-heat exchange channels 702a of one side liquid cooling plate 2 can be selectively connected to the other side liquid cooling plate 2 via a connecting pipe 5. For instance, the side liquid cooling plate 2 has 5 first heat exchange channels 702, of which 23 sub-heat exchange channels 702a are connected to the other side liquid cooling plate 2 702a via the connecting pipe 5. The other two of the 5 first heat exchange channels 702 of the side liquid cooling plate 2 can be connected to the aforementioned 3 first heat exchange channels 702 to accommodate more diverse needs.

[0096] Alternatively, the side liquid cooling plate 2 may be provided with multiple sub-heat exchange channels 702a, which are arranged in the third direction Z. Each side liquid cooling plate 2 may have its sub-heat exchange channels 702a connected separately.

[0097] Alternatively, to reduce the number of transfer pipes 5, thereby reducing manufacturing difficulty and cost, the side liquid cooling plate 2 is provided with multiple sub-heat exchange channels 702a. These sub-heat exchange channels 702a are arranged in the third direction Z. The sub-heat exchange channels 702a of two adjacent side liquid cooling plates 2 are connected through a manifold 130 (see...). Figure 11 , Figure 12 or Figure 13The connection is configured such that the five first heat exchange channels 702 of one side liquid cooling plate 2 are connected to the manifold 130 of its own liquid outlet end 2b. The manifold 130 is then connected to the liquid inlet end 2a of the other side liquid cooling plate 2. When the coolant flows, the coolant first flows from the five first heat exchange channels 702 of one side liquid cooling plate 2 to the manifold 130 of its own liquid outlet end 2b, and then flows through the manifold 130 to the liquid inlet end 2a of the other side liquid cooling plate 2.

[0098] Example 7

[0099] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 6.

[0100] like Figures 2 to 4 As shown, the side liquid cooling plate 2 includes: a heat exchange section 201 and a bending section 202, wherein the bending section 202 is connected to the opposite ends of two adjacent heat exchange sections 201. Figure 2 In the middle section, the left end of the left-side liquid cooling plate 2 is connected to one end of the first bend 202, the other end of the first bend 202 is connected to the left end of the middle side liquid cooling plate 2, the right end of the middle side liquid cooling plate 2 is connected to one end of the second bend 202, and the other end of the second bend 202 is connected to the right-side side liquid cooling plate 2. The heat exchange section 201, the bend 202, and the bottom liquid cooling plate 1 enclose the temperature regulation space 101, which helps reduce heat loss to the outside and improves the efficiency and effect of heat exchange. Furthermore, the bend 202 provides additional support and stability, enhancing the structural integrity and durability of the entire heat exchange device.

[0101] The heat exchange section 201 and the bending section 202 are integrated into one structure, which reduces the number of welding or bolting connections, improves structural strength and airtightness, simplifies the manufacturing process, and reduces assembly costs.

[0102] Example 8

[0103] The heat exchange device provided in this embodiment includes at least some of the technical solutions in embodiment 7.

[0104] like Figure 4 As shown, the bending portion 202 is also provided with a plurality of second fins 72 facing the temperature adjustment space 101. The extension method of the second fins 72 is the same as that of the first fins 71: for example, one or more second fins 72 are provided on the surface of the side liquid cooling plate 2 facing the temperature adjustment space 101. The length direction of each second fin 72 extends along the direction, the length direction of the side liquid cooling plate 2 extends along the first direction X or the second direction Y, and the second fins 72 are spaced along the third direction Z.

[0105] If there is only one second fin 72, the second fin 72 divides into two second airflow channels 703 in the third direction Z. It can be understood that the second fin 72, the portion of the bottom liquid cooling plate 1 opposite to the second fin 72, and the side liquid cooling plate 2 connecting the second fin 72 and the bottom liquid cooling plate 1 form the lower second airflow channel 703; the second fin 72, the portion of the cover 4 opposite to the second fin 72, and the side liquid cooling plate 2 connecting the second fin 72 and the cover 4 form the upper second airflow channel 703. If there are multiple second fins 72, the second fins 72 can extend along the first direction X or the second direction Y, that is, the second fins 72 are arranged horizontally, and multiple second fins 72 are spaced apart in the third direction Z. The interval between two adjacent second fins 72 can also form the second airflow channel 703. The second airflow channel 703 communicates with the temperature regulation space 101, which can promote gas circulation, thereby enhancing heat exchange efficiency and making temperature regulation more rapid and uniform. Of course, if there are multiple second fins 72, the second fins 72 are arranged to extend along the third direction Z, and the multiple second fins 72 are arranged at intervals along the first direction X or the second direction Y. The interval between two adjacent second fins 72 can also form a second airflow channel 703. The second airflow channel 703 is connected to the temperature regulation space 101, which can promote the circulation of gas, thereby enhancing the heat exchange efficiency and making the temperature regulation more rapid and uniform.

[0106] like Figure 4 As shown, the second airflow channel 703 is connected to the first airflow channel 701 to form a more efficient airflow circulation system, promoting the flow of the heat exchange medium and improving heat exchange efficiency. Alternatively, the second airflow channel 703 is connected to the temperature regulation space 101, which can promote the circulation of gas, thereby enhancing heat exchange efficiency and making temperature regulation more rapid and uniform.

[0107] like Figure 2 As shown, the bending section 202 is provided with a second heat exchange channel 704, which is connected to the first heat exchange channel 702 of the side liquid cooling plate 2 to form a continuous heat exchange path, increasing the flow area and contact time of the heat exchange medium, thereby improving the overall heat exchange efficiency.

[0108] like Figure 4 As shown, the first fin 71 and the second fin 72 can be flank-shaped fins or columnar protrusions. Both the fins and the protrusions can be hollow structures, so as to achieve heat exchange while reducing the overall weight of the heat exchange device.

[0109] Example 9

[0110] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 8.

[0111] like Figures 10 to 13 As shown, the heat exchange device also includes a manifold 13. The two ends of the flat tubes 74, which are distributed at intervals along the Z direction, are respectively connected to a manifold 13. The manifold 13 is provided with a manifold cavity 130. One end of the manifold cavity 130 is connected to the first heat exchange channel 702 inside the flat tube 74. Figure 12 One end of the manifold 130 of the manifold 13 on the left side serves as the liquid inlet 2a, and the other end serves as the liquid outlet 2b of the manifold 130. The discharged liquid enters the first heat exchange channel 702. Figure 12 One end of the manifold 13 on the right side serves as the inlet end 2a to receive the coolant flowing out of the first heat exchange channel 702, and the other end serves as the outlet end 2b. The manifold 13 effectively distributes and collects fluid through the manifold 130, ensuring a more uniform flow of the heat exchange medium when entering and leaving the side liquid cooling plate 2.

[0112] In the heat exchange device, each side liquid cooling plate 2 has a manifold 13 at both ends. One of the manifolds 13 is connected to the liquid inlet 2a of the side liquid cooling plate 2, and the other is connected to the liquid outlet 2b of the side liquid cooling plate 2. The manifolds 13 of two adjacent side liquid cooling plates 2 can be connected by a transfer pipe 5. Alternatively, in the heat exchange device, along the flow direction of the heat exchange medium, the first side liquid cooling plate 2 has a manifold 13 at its beginning end, and the last side liquid cooling plate 2 has a manifold 13 at its end, and two adjacent side liquid cooling plates 2 are connected by a transfer pipe 5.

[0113] like Figure 12 and Figure 13 As shown, the manifold 13 and the side liquid cooling plate 2 are separate structures, allowing for more flexible installation and configuration, which can be adjusted and optimized according to specific space and design requirements. For example, the manifold 13 and the side liquid cooling plate 2 can be connected by welding or other methods.

[0114] like Figure 14 As shown, the manifold 13 and the side liquid cooling plate 2 are an integral structure. An integral structure is generally more robust than a multi-part assembly, reduces the number of connection points, thereby lowering the risk of damage due to vibration or other external forces, and also reduces the steps and processes required in manufacturing and assembly. It can be understood that when the manifold 13 is located at the liquid inlet end 2a of the side liquid cooling plate 2, the other end of the manifold cavity 130 is also the liquid inlet end 2a; conversely, when the manifold 13 is located at the liquid outlet end 2b of the side liquid cooling plate 2, the other end of the manifold cavity 130 is also the liquid outlet end 2b.

[0115] like Figures 13 to 14 As shown, the length of the first heat exchange channel 702 is equal to the length of the side liquid cooling plate 2, ensuring that the fluid flows uniformly across the entire side plate, reducing local overheating or uneven cooling, and providing a more uniform temperature distribution.

[0116] Example 10

[0117] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 9.

[0118] like Figure 13 As shown, when the manifold 13 and the side liquid cooling plate 2 are separate structures, the manifold 13 includes a sidewall 132 facing the flat tube 74, and a slit 131 is formed in the sidewall 132. One end of the flat tube 74 is connected to the slit 131, thereby realizing the communication between the first heat exchange channel 702 of the flat tube 74 and the manifold 130. This ensures that the fluid can be evenly distributed when entering or leaving the heat exchange device. This uniform distribution helps to improve heat exchange efficiency and avoid local overheating or insufficient cooling.

[0119] Multiple slits 131 are arranged along the third direction Z, and each slit 131 is connected to the first heat exchange channel 702 (see reference). Figure 12 The system is configured with one-to-one correspondence and interconnection to ensure that the fluid can be evenly distributed to each of the first heat exchange channels 702. This precise distribution helps to improve heat exchange efficiency and ensures that the temperature distribution of the entire heat exchange device is uniform, thereby enabling effective heat exchange for electronic devices (such as IGBTs) within the temperature regulation space 101.

[0120] When the coolant flows, the coolant first enters the manifold 130 of the inlet end 2a of the side liquid cooling plate 2, and then flows from the manifold 130 into each slit 131. Then it flows out from the slit 131 into the inlet end 2a of each flat tube 74, and then flows out from the outlet end 2b of the flat tube 74. It then merges in the manifold 130 of the outlet end 2b of the side liquid cooling plate 2, and then enters the manifold 130 of the inlet end 2a of the next side liquid cooling plate 2.

[0121] Example 11

[0122] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 9.

[0123] like Figures 16 to 17 As shown, the side liquid cooling plate 2 includes multiple flat tubes 74 arranged in a Z-array along a third direction, with a first heat exchange channel 702 inside each flat tube 74. The shape of the flat tubes 74 increases the contact area between the fluid and the tube wall, thereby improving heat transfer efficiency. The array arrangement of multiple flat tubes 74 further increases the overall heat exchange area.

[0124] The space between adjacent flat tubes 74 accommodates a first fin 71, which is disposed on the outer surface of the flat tube 74, increasing the contact area with the surrounding air and thus improving heat exchange efficiency. The first heat exchange channel 702 and the first fin 71 can be an integrally formed structure, allowing heat to be transferred more directly and efficiently from the first heat exchange channel 702 to the first fin 71. An integrally formed design is generally more robust than a multi-part assembly structure, reduces the number of connection points, thereby reducing the risk of damage due to vibration or other external forces, and also reduces the steps and processes required in manufacturing and assembly.

[0125] like Figure 17 As shown, the first fin 71 is disposed between the previous first heat exchange channel 702 and the next heat exchange channel. For example, the connecting end of the first fin 71 is connected to the previous first heat exchange channel 702; or, the connecting end of the first fin 71 is connected to the next first heat exchange channel 702; or, some connecting ends of the first fins 71 are connected to the previous first heat exchange channel 702, and the connecting ends of other first fins 71 are connected to the next first heat exchange channel 702. A gap exists between the non-connecting ends of the first fins 71 and the first heat exchange channel 702. Figure 17 The cross-section of the first fin 71 is shown to be a folded structure, which is composed of multiple continuous arc segments, providing more contact surfaces for heat exchange, thereby improving heat exchange efficiency.

[0126] Example 12

[0127] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 9.

[0128] like Figure 18 As shown, the side liquid cooling plate 2 includes multiple heat exchange capillaries 7021 arranged in a Z-array along a third direction. Each heat exchange capillary 7021 has a first heat exchange flow channel 702 inside. One end of each heat exchange capillary 7021 is connected to a first manifold 13, and the other end is connected to a second manifold 13. Each heat exchange capillary 7021 is connected to a heat exchange chamber 133, ensuring uniform distribution of fluid as it enters or leaves the side liquid cooling plate 2. This uniform distribution helps improve heat exchange efficiency and avoids localized overheating or insufficient cooling.

[0129] When the coolant flows, the coolant first enters the manifold 130 of the liquid inlet end 2a of the side liquid cooling plate 2, and then flows from the manifold 130 into the liquid inlet end 2a of each thin tube, and then flows out from the liquid outlet end 2b of each thin tube, and then merges in the manifold 130 of the liquid outlet end 2b of the side liquid cooling plate 2, and then enters the manifold 130 of the liquid inlet end 2a of the next side liquid cooling plate 2.

[0130] Example 13

[0131] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 9.

[0132] like Figure 19 As shown, Figure 19 The vertical direction is the length extension direction of the side liquid cooling plate 2, and the horizontal direction is the width direction of the side liquid cooling plate 2. The side liquid cooling plate 2 includes several flow channel baffles 135. The heat exchange medium flow channel 111 of the side liquid cooling plate 2 is divided into multiple first heat exchange channels 702 by the flow channel baffles 135. The outer surface of the first heat exchange channel 702 is provided with third fins.

[0133] The length of the first heat exchange channel 702 is less than the length of the side liquid cooling plate 2, so that there is a gap D between the end of the channel partition 135 and the inner wall of the end of the side liquid cooling plate 2; the spaces corresponding to several gaps D form a manifold 130.

[0134] For example, the side liquid cooling plate 2 is provided with a heat exchange cavity 133 and a baffle 134. The baffle 134 is used to divide the heat exchange cavity 133 into a diversion region 133a and a confluence region 133b. The diversion region 133a and the confluence region 133b are arranged in the height direction of the heat exchange device. The diversion region 133a is provided with a plurality of spaced flow channel baffles 135. The baffle 134 is provided with a confluence hole 136 connecting the diversion region 133a and the confluence region 133b. The first fin 71 is disposed on the outer peripheral wall of the flow channel baffle 135. The interval between two adjacent flow channel baffles 135 forms a first heat exchange flow channel 702. The port of each first heat exchange flow channel 702 near the baffle 134 is connected to the corresponding confluence hole 136. The confluence region 133b of the heat exchange cavity 133 serves as the confluence cavity 130 of the side liquid cooling plate 2.

[0135] During the heat exchange process, the fluid enters from the inlet end 2a of the side liquid-cooled plate 2 and converges in the confluence region 133b near the inlet end 2a. It then flows into the first heat exchange channel 702 through the confluence hole 136 near the inlet end 2a, and converges again from the confluence hole 136 near the outlet end 2b to the confluence region 133b at the outlet end 2b of the side liquid-cooled plate 2, finally exiting to the outside of the heat exchange device. Therefore, the flow path of the fluid entering and leaving the heat exchange device is optimized; the diversion region 133a ensures uniform fluid distribution, while the confluence region 133b effectively collects the fluid.

[0136] Example 14

[0137] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 12.

[0138] like Figures 20 to 21As shown, the bottom liquid cooling plate 1 has a main liquid inlet 16a and a main liquid outlet 16b. The main liquid inlet 16a is connected to the liquid inlet end 2a of the bottom liquid cooling plate 1 and the liquid inlet end 2a of the side liquid cooling plate 2, and the main liquid outlet 16b is connected to the liquid outlet end 2b of the bottom liquid cooling plate 1 and the liquid outlet end 2b of the side liquid cooling plate 2. This design forms a parallel fluid path, allowing the fluid to flow through both the bottom liquid cooling plate 1 and the side liquid cooling plate 2 simultaneously. Through parallel flow, the fluid in this heat dissipation device can simultaneously contact multiple heat exchange surfaces, increasing the heat exchange area and thus improving heat exchange efficiency.

[0139] The bottom liquid cooling plate 1 is provided with a secondary liquid inlet 17a and a secondary liquid outlet 17b. The liquid inlet end 2a of the side liquid cooling plate 2 is connected to the secondary liquid outlet 17b of the bottom liquid cooling plate 1, and the liquid outlet end 2b of the side liquid cooling plate 2 is connected to the secondary liquid inlet 17a of the bottom liquid cooling plate 1.

[0140] During operation, the fluid entering from the main inlet is diverted to the bottom liquid cooling plate 1 and the side liquid cooling plate 2. The fluid flowing out from the outlet 2b of the side liquid cooling plate 2 flows to the auxiliary outlet 17b. Finally, the fluid flowing out from the auxiliary outlet 17b and the fluid flowing out from the bottom liquid cooling plate 1 also flows out to the outside through the main outlet 16b. Of course, the fluid flowing into the side liquid cooling plate 2 can flow directly out from the auxiliary outlet 17b, and the fluid flowing into the bottom liquid cooling plate 1 can flow directly out from the main outlet 16b; no special restrictions are imposed here.

[0141] like Figure 21 As shown, the main liquid inlet 16a, the main liquid outlet 16b, the auxiliary liquid inlet 17a, and the auxiliary liquid outlet 17b are located on the same side of the bottom liquid cooling plate 1. For example, the main liquid inlet 16a, the main liquid outlet 16b, the auxiliary liquid inlet 17a, and the auxiliary liquid outlet 17b are located on the top surface of the bottom liquid cooling plate 1 facing the temperature regulating space 101, and the main liquid inlet 16a, the main liquid outlet 16b, the auxiliary liquid inlet 17a, and the auxiliary liquid outlet 17b are located on the same side of the top surface, for example, they are set on the top surface. Figure 21 The bottom edge of the center allows for the installation of all piping on the same side, facilitating wiring. Furthermore, during product installation... Figure 21 The arrow in the image points to the ground. At this time, Figure 21 The height above is higher than Figure 21 If any of the four coolant ports—main inlet 16a, main outlet 16b, auxiliary inlet 17a, and auxiliary outlet 17b—leaks at the lower part of the equipment, the leaked coolant will drip onto the ground and will not affect the operation of the equipment.

[0142] For example, such as Figure 20 As shown, Figure 20 The left side liquid cooling plate 2 corresponds to Figure 21At the top position of the bottom liquid cooling plate 1 along the first direction X, a main liquid inlet 16a and a main liquid outlet 16b are provided on the bottom liquid cooling plate 1 near the enclosing side plate 3. Auxiliary liquid inlets 17a and auxiliary liquid outlets 17b are respectively provided at both ends of the side liquid cooling plate 2 which is opposite to the enclosing side plate 3. This can extend the fluid path through the two oppositely arranged side liquid cooling plates 2, so that more fluid stays on the two oppositely arranged side liquid cooling plates 2, thereby further improving the heat exchange efficiency of the heat exchange device. Figure 20 The diagram illustrates that the fluid flows twice across the two opposing side liquid cooling plates 2. Coolant flows out from the secondary inlet 17a of the bottom liquid cooling plate 1 and enters... Figure 20 In the first heat exchange channel 702 of the side liquid cooling plate 2 on the right side, and then... Figure 20 The liquid-cooled plate 2 on the right side first flows from left to right along the first direction X, then reverses direction X and flows from right to left, and then from... Figure 20 The liquid flows out from the right-side side liquid cooling plate 2, enters the transfer pipe 5, and then flows out from the transfer pipe 5 into the middle side liquid cooling plate 2. In the middle side liquid cooling plate 2, it flows from right to left along the Y direction, and then enters the left-side side liquid cooling plate 2. In the left-side side liquid cooling plate 2, it first flows from left to right along the first direction X, then turns back and flows from right to left along the first direction X, and then flows out from the left-side side liquid cooling plate 2 into the auxiliary outlet 17b, and then flows back into the bottom liquid cooling plate 1.

[0143] like Figure 21 As shown, the heat exchange device also includes a sealing element 11, which is an annular sealing element 11. This sealing element 11 is disposed on the top surface of the bottom liquid cooling plate 1 facing the side liquid cooling plate 2, and is located close to the side liquid cooling plate 2. This sealing element 11 is used to seal the temperature regulating space 101. Normally, the bottom surface of the side liquid cooling plate 2 facing the bottom liquid cooling plate 1 is pressed against the sealing element 11, thereby achieving a seal. The auxiliary liquid inlet 17a and auxiliary liquid outlet 17b are located outside the annulus of the sealing element 11 to effectively prevent fluid leakage into the temperature regulating space 101, ensuring the airtightness of the temperature regulating space 101 and achieving the effect of water and electricity isolation.

[0144] Example 15

[0145] The heat exchange device provided in this embodiment includes at least some of the technical solutions in Embodiments 1 to 13.

[0146] like Figure 22As shown, the heat exchange device also includes an air guide plate 8, which covers the side of the side liquid cooling plate 2 facing the temperature regulation space 101. It can be understood that the side liquid cooling plate 2 has two opposing surfaces in the third direction Z, with the inward surface facing the temperature regulation space 101 and the outward surface facing away from the temperature regulation space 101. The air guide plate 8 covers the inner surface of the side liquid cooling plate 2 and has a gap between it and the inner surface. The space formed by this gap is the first airflow cavity 102. The air guide plate 8 is an inner air guide plate 8, used for heat exchange treatment of the temperature regulation space 101.

[0147] like Figures 22 to 23 As shown, in the case where the heat exchange device includes one air guide plate 8 and one side liquid cooling plate 2, the air guide plate 8 covers the side of the side liquid cooling plate 2 facing the temperature regulating space 101, and the gap between the air guide plate 8 and the temperature regulating space 101 forms a first airflow cavity 102, ensuring that the airflow flows evenly over the side liquid cooling plate 2 and improving the heat exchange efficiency. The inner surface of the side liquid cooling plate 2 is provided with a first fin 71, and the first fin 71 is located in the first airflow cavity 102, that is, directly exposed to the flowing air. This maximizes the contact area with the airflow, thereby improving the heat exchange efficiency. The air guide plate 8 covering the side of the side liquid cooling plate 2 facing the temperature regulating space 101 has a first vent. The first airflow channel 701 in the first airflow cavity 102 is connected to the temperature regulating space 101 through the first vent, and the airflow can circulate effectively in the first airflow cavity 102. This airflow circulation helps to quickly remove heat and improve the heat exchange efficiency.

[0148] The first vent includes a first air inlet 14a and a first air outlet 14b, so that during operation of the heat exchange device, airflow flows from the first air inlet 14a into the first airflow chamber 102, ensuring that fresh air enters and effectively transfers heat to the heat exchange surface; airflow flows from the first airflow chamber 102 into the first air outlet 14b, effectively discharging the heat-exchanged air and carrying away heat or cold. Alternatively, the liquid collection chamber at one end of the side liquid cooling plate 2 has an air outlet; or the air guide plate 8 has a notch as an air outlet; or the air guide plate 8 is along... Figure 23 The length in the Y direction shown is shorter than the length of the side liquid cooling plate 2, thus exposing part of the first fin 71 to the temperature regulation space 101. At this time, the interval between the first fins 71 serves as an air outlet; similarly, the above structure can also serve as an air inlet. Furthermore, a fan 12 is provided on the first vent to improve the heat exchange effect.

[0149] Alternatively, in other examples, to fully utilize the cooling capacity of the side liquid cooling plate 2, air guide plates 8 can be simultaneously covered on both the side of the side liquid cooling plate 2 facing the temperature regulating space 101 and the side of the side liquid cooling plate 2 away from the temperature regulating space 101. The side liquid cooling plate 2 has an inner surface and an outer surface that are opposite each other in the third direction Z. The air guide plate 8 covers the outer surface of the side liquid cooling plate 2 and is an outer air guide plate 8 to perform heat exchange treatment on the temperature regulating space 101.

[0150] like Figure 24 As shown, in the case where the heat exchange device includes two air guide plates 8 and one side liquid cooling plate 2, the air guide plates 8 cover the side of the side liquid cooling plate 2 away from the temperature regulating space 101, and the gap between the air guide plate 8 covering the inner surface of the side liquid cooling plate 2 and the temperature regulating space 101 forms the inner first airflow cavity 102. The gap between the air guide plate 8 covering the outer surface of the side liquid cooling plate 2 and the side liquid cooling plate 2 forms the outer first airflow cavity 102.

[0151] The side liquid cooling plate 2 has a second ventilation opening; the first airflow cavity 102 on the outer side of the side wall 132 of the side liquid cooling plate 2 opposite to the temperature regulation space 101 is connected to the temperature regulation space 101 through the first ventilation opening, thereby connecting the first airflow channel 701 in the first airflow cavity 102 to the temperature regulation space 101; wherein, the second ventilation opening includes: a second air inlet 15a and a second air outlet 15b. For example, the second air inlet 15a is opposite to and connected to the first air inlet 14a, and the second air outlet 15b is opposite to and connected to the first air outlet 14b. Therefore, by arranging multiple air inlets and multiple air outlets opposite to each other, the airflow can be distributed more evenly, reducing the temperature gradient, ensuring uniform temperature distribution, and avoiding local overheating or overcooling.

[0152] like Figure 24 As shown, in the case where the heat exchange device includes two air guide plates 8 and one side liquid cooling plate 2, the side liquid cooling plate 2 is disposed between the two air guide plates 8. The gap between the side liquid cooling plate 2 closest to the inner air guide plate 8 and the inner air guide plate 8 forms an inner first airflow cavity 102, and the gap between the side liquid cooling plate 2 closest to the outer air guide plate 8 and the outer air guide plate 8 forms an outer first airflow cavity 102. The inner first airflow cavity 102 and the outer first airflow cavity 102 are interconnected.

[0153] like Figure 27As shown, in the case where the heat exchange device includes two air guide plates 8 and two side liquid cooling plates 2 including two sub-side liquid cooling plates 21, the two sub-side liquid cooling plates 21 are arranged at intervals along the direction towards the interior of the temperature regulating space 101. The interval between the sub-side liquid cooling plate 21 closest to the inner air guide plate 8 and the inner air guide plate 8 forms an inner first airflow cavity 102, and the interval between the sub-side liquid cooling plate 21 closest to the outer air guide plate 8 and the outer air guide plate 8 forms another outer first airflow cavity 102. Two adjacent sub-side liquid cooling plates 21 cooperate to form a second airflow cavity 103. The second airflow cavity 103 is disposed between the inner first airflow cavity 102 and the outer first airflow cavity 102. The inner first airflow cavity 102, the outer first airflow cavity 102 are interconnected, and the second airflow cavity 103 is interconnected. Therefore, the heat exchange device can have three airflow paths to further improve the heat exchange efficiency. Figure 27 In the heat exchange device of the embodiment, during operation, airflow originates from the first air inlet 14a (see...). Figure 25 It enters and passes through the first airflow chamber 102 and the second airflow chamber 103, and finally exits from the first air outlet 14b (see...). Figure 25 ) flows to temperature regulation space 101 (see Figure 1 or Figure 2 Within the space, airflow is circulated.

[0154] Alternatively, in other embodiments, when the heat exchange device includes two air guide plates 8 and the side liquid cooling plate 2 includes two or more sub-side liquid cooling plates 21, the multiple sub-side liquid cooling plates 21 are arranged at intervals along the direction toward the interior of the temperature regulating space 101. The interval between the sub-side liquid cooling plate 21 closest to the inner air guide plate 8 and the inner air guide plate 8 forms an inner first airflow cavity 102, and the interval between the sub-side liquid cooling plate 21 closest to the outer air guide plate 8 and the outer air guide plate 8 forms another outer first airflow cavity 102. Each pair of adjacent sub-side liquid cooling plates 21 cooperate to form a second airflow cavity 103. The second airflow cavity 103 is disposed between the inner first airflow cavity 102 and the outer first airflow cavity 102, and the inner first airflow cavity 102 and the outer first airflow cavity 102 are interconnected, as are the multiple second airflow cavities 103. Therefore, the heat exchange device can have three or more airflow paths, allowing more airflow to contact the side liquid cooling plate 2, thereby further improving the heat dissipation efficiency.

[0155] Alternatively, in other embodiments, where the heat exchange device includes only at least two sub-side liquid cooling plates 21, each pair of adjacent sub-side liquid cooling plates 21 cooperate to form a second airflow cavity 103, providing an airflow path to improve the heat exchange efficiency of the heat exchange device.

[0156] like Figures 28 to 30As shown, in the case of a heat exchange device with two air guide plates 8 and at least two sub-side liquid cooling plates 21, the sub-side liquid cooling plate 21 closest to the inner air guide plate 8 is fitted with the inner air guide plate 8, and the sub-side liquid cooling plate 21 closest to the outer air guide plate 8 is fitted with the outer air guide plate 8. Each pair of adjacent sub-side liquid cooling plates 21 cooperate to form a second airflow cavity 103. Figure 28 and Figure 29 A second airflow cavity 103 is shown. Figure 30 Two second airflow chambers 103 are shown.

[0157] like Figure 1 As shown, in the case of a split structure for the heat exchange device, one or more air guide plates 8 corresponding to the side liquid cooling plate 2 each include a first ventilation opening. For example, each air guide plate 8 corresponding to the side liquid cooling plate 2 has a first air inlet 14a, and a fan 12 is installed at the first air inlet 14a. Alternatively, each air guide plate 8 corresponding to the side liquid cooling plate 2 has a first air outlet 14b, and a fan 12 is installed at the first air outlet 14b. Alternatively, each air guide plate 8 corresponding to the side liquid cooling plate 2 has a first air inlet 14a and a first air outlet 14b. The fan 12 is installed at the first air inlet 14a or the first air outlet 14b so that the gas (such as air) generated by the fan 12 blows toward the first fin 71. In this way, the heat exchange efficiency is improved by accelerating the gas flow near the first fin 71, so that the heat exchange medium can quickly exchange heat in a short time.

[0158] like Figure 2 As shown, in the case where the heat exchange device is an integral structure, a first air inlet 14a is provided at the first end of the side enclosure plate along the flow direction of the heat exchange medium (refer to...). Figure 22 or Figure 23 A first air outlet 14b is provided at the end of the side enclosure panel (refer to...). Figure 22 or Figure 23 A fan 12 is installed at the first air inlet 14a or the first air outlet 14b so that the gas (such as air) generated by the fan 12 blows toward the first fin 71. This improves the heat exchange efficiency by accelerating the gas flow near the first fin 71, allowing the heat exchange medium to exchange heat rapidly in a short time. Alternatively, in other embodiments, the first air inlet 14a may be provided only at the beginning or end of the side enclosure plate (see...). Figure 22 or Figure 23 Alternatively, a first air outlet 14b may be provided at the first or last end of the side enclosure panel (refer to...). Figure 22 or Figure 23 ).

[0159] Example 16

[0160] The heat exchange device provided in this embodiment includes at least some of the technical solutions in embodiment 14.

[0161] like Figure 1 and Figure 22 As shown, the heat exchange device further includes a fan 12 disposed at the first air inlet 14a or the first air outlet 14b. For example, if the first vent includes the first air inlet 14a, a fan 12 is disposed at the first air inlet 14a. This fan 12 can be an exhaust type, which agitates the airflow within the first airflow chamber 102, thereby enhancing air circulation within the first airflow chamber 102 and ensuring more effective airflow within the temperature regulation space 101. Alternatively, if the first vent includes the first air outlet 14b, a fan 12 is disposed at the first air outlet 14b. This fan 12 can be an intake type, which agitates the airflow within the first airflow chamber 102, thereby enhancing air circulation within the first airflow chamber 102 and ensuring more effective airflow within the temperature regulation space 101. Alternatively, if the first ventilation opening includes a first air inlet 14a and a first air outlet 14b, the fan 12 is located at either the first air inlet 14a or the first air outlet 14b. If the fan 12 is an exhaust type, then the fan 12 is located at the first air inlet 14a (see reference). Figure 22 The fan 12 is positioned at the first air inlet 14a and guides the air entering the first air inlet 14a to the first air outlet 14b, and finally discharges it into the temperature regulation space 101. Alternatively, the fan 12 can be a suction type, in which case it is positioned at the first air outlet 14b to guide air from the first air inlet 14a to the first air outlet 14b and discharge it into the temperature regulation space 101.

[0162] The heat exchange device also includes a turbulence fan 12 disposed in the temperature regulation space 101. This turbulence fan 12 promotes air mixing within the temperature regulation space 101 and the airflow channel by agitating the airflow, ensuring a more uniform temperature distribution and reducing uneven heating / cooling. For example, the turbulence fan 12 can be disposed near the first air inlet, immediately agitating and mixing the incoming airflow to ensure uniform distribution before it enters the temperature regulation space 101. Alternatively, the turbulence fan 12 can be disposed near the first air outlet 14b, further promoting contact between the airflow and the heat exchange surface of the side liquid cooling plate 2, improving heat transfer efficiency, and ensuring the air reaches the ideal temperature upon entering the temperature regulation space 101.

[0163] Example 17

[0164] The heat exchange device provided in this embodiment includes most of the technical solutions in embodiment 15 or 16. The difference is that the second airflow cavity 103 is connected to the temperature regulation space 101, allowing air to flow through, thereby removing the heat on the surface of the sub-side liquid cooling plate 21 and enhancing the overall heat dissipation effect.

[0165] Example 18

[0166] The heat exchange device provided in this embodiment includes at least some of the technical solutions in embodiments 15, 16 or 17.

[0167] like Figures 22 to 27 As shown, the heat exchange device also includes a frame 9, which is a rectangular and annular frame. The first fin 71 can be connected to the side liquid cooling plate 2 by welding, and the frame 9 can also be connected to the side liquid cooling plate 2 by welding and surround the outer periphery of the first fin 71. The air guide plate 8 can also be welded onto the frame 9 and close the opening of the frame 9 to form a sealed first airflow cavity 102.

[0168] like Figure 31 As shown, in order to further improve the sealing performance between the airflow channel and the interior of the side liquid cooling plate 2 (i.e., the heat exchange channel) and prevent airflow from entering the heat exchange channel, a sealing structure 10 can be provided between the side liquid cooling plate 2 and the frame 9, and between the air guide plate 8 and the frame 9. The sealing structure 10 can be a gasket, sealant, etc., and no special limitation is made here.

[0169] To ensure the airtightness of the first airflow cavity 102, sealing strips (not shown) are provided at both the first air inlet 14a and the first air outlet 14b to effectively improve heat exchange efficiency.

[0170] Example 19

[0171] This embodiment provides a power conversion device, including at least some of the technical solutions in Embodiments 1 to 18.

[0172] The power conversion device includes a heat exchange device and electronic components. The electronic components are disposed in the temperature regulation space 101, and include one or a combination of IGBT (Insulated-Gate Bipolar Transistor), MOS (Metal-Oxide-Semiconductor Field-Effect Transistor), capacitor, inductor, and resistor.

[0173] The aforementioned heat exchange device can be a heat dissipation device or a heating device. This heat exchange device achieves multi-faceted heat exchange for electronic components by setting a bottom liquid cooling plate 1 and side liquid cooling plates 2, increasing the heat exchange area. Simultaneously, multiple first fins 71 are arranged on the side liquid cooling plates 2, and a first airflow channel 701 is formed between adjacent first fins 71, allowing gas to circulate within the temperature regulation space 101. Therefore, this heat exchange device employs a combined liquid and gas heat exchange method to improve heat exchange efficiency.

[0174] Heat exchange devices can also be used for heat dissipation. Converters typically have a bottom liquid cooling plate 1 at the bottom of the enclosure for heat dissipation. However, while this layout is effective for cooling attached IGBTs, the bottom liquid cooling plate 1 has a small heat dissipation area within the enclosure, resulting in poor heat dissipation for other non-attached electronic components. As the power density of converters increases, the heat generation also increases dramatically, leading to increasingly demanding requirements for cooling technology. Therefore, this application achieves multi-faceted liquid cooling of electronic components by using a bottom liquid cooling plate 1 and side liquid cooling plates 2, increasing the heat dissipation area. Simultaneously, multiple fins are arranged on the sidewall of the side liquid cooling plate 2, forming airflow channels between adjacent fins to allow gas to circulate within the liquid cooling enclosure. Therefore, this heat dissipation device employs a combination of liquid cooling and air cooling to improve heat dissipation efficiency.

[0175] In other embodiments, the heat exchange device can be a heating device, with the bottom liquid cooling plate 1 replaced by a bottom heating plate and the side liquid cooling plate 2 replaced by a side heating plate. In cold environments, electronic devices may require heating to maintain their optimal operating temperature range. Heating devices can prevent device performance degradation or damage due to low temperatures. For example, for battery packs in electric vehicles or energy storage systems, heating devices can preheat the batteries under low-temperature conditions to improve battery charging and discharging efficiency and extend battery life. Therefore, this application can achieve multi-faceted heating of electronic devices by setting a bottom heating plate and side heating plates, increasing the heating area. Simultaneously, multiple heating fins are arranged on the sidewalls of the side heating plates, forming airflow channels between adjacent heating fins to allow gas to circulate within the heating chamber. Therefore, this heating device employs a combination of liquid and gas heat dissipation to improve heating efficiency.

[0176] Power conversion devices can be one of the following: inverters, PCS (Power Conversion System), wind power converters, energy storage cabinets, DC-DC converters, DC-AC converters, or AC-DC converters. Inverters convert direct current (DC) to alternating current (AC) and are widely used in solar power systems, converting DC power generated by solar panels into AC power usable by households or the power grid. PCS manages the charging and discharging process of energy storage systems, converting the form of electrical energy. Used in battery energy storage systems, they support grid stability and power dispatch by converting DC power stored in batteries into AC power for grid use, or converting AC power into DC power for battery charging. Wind power converters convert the electrical energy generated by wind turbines into grid-compatible electrical energy for wind power systems, ensuring that the output power of the wind turbine matches the power specifications required by the grid. Energy storage cabinets integrate the power conversion and management functions of energy storage systems, used for centralized management and control of the charging and discharging process of the energy storage system, and typically include a PCS and a battery management system. DC-DC converters convert one DC voltage to another, used in electric vehicles, solar systems, and other applications requiring different voltage levels, supporting voltage regulation and power transmission. A DC-AC converter converts direct current to alternating current. Similar to an inverter, it is widely used to convert DC power to AC power for equipment use. An AC-DC converter converts alternating current to direct current and is used in power adapters, chargers, and other devices, converting AC power from the grid into the DC power required by the equipment.

[0177] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0178] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0179] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0180] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat exchange device, characterized by, include: Bottom liquid cooling plate; At least one side liquid cooling plate, the at least one side liquid cooling plate and the bottom liquid cooling plate forming an enclosing plate surface of a temperature regulation space, the temperature regulation space being used to accommodate electronic devices; The bottom liquid cooling plate has a flow channel for the heat exchange medium inside; The side liquid cooling plate has a first heat exchange channel for accommodating the flow of heat exchange medium; the surface of the side liquid cooling plate is provided with a first fin, which is used to dissipate heat for the temperature regulation space.

2. The heat exchange device according to claim 1, wherein The first fin is provided on the side wall of the side liquid cooling plate facing the temperature regulation space and / or the first fin is provided on the side wall of the side liquid cooling plate away from the temperature regulation space. The interval between two adjacent first fins forms a first airflow channel, which is connected to the temperature regulation space.

3. The heat exchange device according to claim 2, wherein The length direction of the first fin extends along either a first direction or a second direction.

4. The heat exchange device according to claim 2, characterized in that, In a plane perpendicular to the length direction of the first fin, the dimension of the cross-section of the first fin away from the first heat exchange channel in the third direction is greater than the dimension of the cross-section of the first fin near the first heat exchange channel; or, the dimension of the cross-section of the first fin away from the first heat exchange channel in the third direction is smaller than the dimension of the cross-section of the first fin near the first heat exchange channel. Alternatively, the surface of the first fin may have an uneven surface.

5. The heat exchange device according to claim 1, characterized in that, The first heat exchange channels of two adjacent side liquid cooling plates are connected by a transfer pipe.

6. The heat exchange device according to claim 5, wherein The side liquid cooling plate is provided with multiple sub-heat exchange channels, which are arranged in a third direction; wherein, the third direction is the height direction of the heat exchange device.

7. The heat exchange device according to claim 2, wherein The side liquid cooling plate includes a heat exchange section and a bending section. The bending section is disposed at the ends of two adjacent heat exchange sections facing each other, and the heat exchange section, the bending section, and the bottom liquid cooling plate are used to enclose the temperature regulation space.

8. The heat exchange device according to claim 7, wherein The bending portion is also provided with a plurality of second fins, which are spaced apart on the side wall of the bending portion perpendicular to the third direction. The gap between two adjacent second fins is used to form a second airflow channel, wherein the second airflow channel is connected to the first airflow channel, or the second airflow channel is connected to the temperature regulation space.

9. The heat exchange device according to claim 7, characterized in that, The heat exchange section is provided with a first heat exchange segment, and the bending section is provided with a second heat exchange segment. The first heat exchange segment and the second heat exchange segment are connected to form the first heat exchange flow channel.

10. The heat exchange device of claim 1, wherein It also includes a junction box, which has a junction cavity inside; One end of the manifold is connected to the first heat exchange channel; the other end of the manifold is provided with a liquid inlet or a liquid outlet.

11. The heat exchange device according to claim 10, wherein The manifold and the side liquid cooling plate are separate structures.

12. The heat exchange device according to claim 11, wherein The side liquid cooling plate includes a plurality of flat tubes arranged in a third direction, and the first heat exchange channel is provided inside the flat tubes. The space between adjacent flat tubes accommodates the first fin, which is disposed on the outer surface of the flat tube. Alternatively, the side liquid cooling plate includes multiple heat exchange tubes arranged in a third direction, and the heat exchange tubes are provided with a first heat exchange flow channel inside.

13. The heat exchange device of claim 10, wherein The side liquid cooling plate includes several flow channel baffles inside, and the heat exchange medium flow channel of the side liquid cooling plate is divided into multiple first heat exchange channels by the flow channel baffles; the outer surface of the first heat exchange channel is provided with third fins. The length of the first heat exchange channel is less than the length of the side liquid cooling plate, so that there is a gap between the end of the channel partition and the inner wall of the end of the side liquid cooling plate; the spaces corresponding to the gaps form a confluence cavity.

14. The heat exchange device according to claim 10, characterized in that, The bottom liquid cooling plate is provided with a secondary liquid inlet and a secondary liquid outlet. The liquid inlet end of the side liquid cooling plate is connected to the secondary liquid outlet of the bottom liquid cooling plate, and the liquid outlet end of the side liquid cooling plate is connected to the secondary liquid inlet of the bottom liquid cooling plate.

15. The heat exchange device according to claim 14, characterized in that, Also includes: A sealing element is disposed on the top surface of the bottom liquid cooling plate facing the side liquid cooling plate; The secondary liquid inlet and the secondary liquid outlet are located outside the area enclosed by the orthographic projection of the seal onto the bottom liquid cooling plate.

16. The heat exchange device according to claim 14, characterized in that, The bottom liquid cooling plate is equipped with a main liquid inlet and a main liquid outlet; The main liquid inlet, the main liquid outlet, the auxiliary liquid inlet, and the auxiliary liquid outlet are located on the same side of the bottom liquid cooling plate.

17. The heat exchange device according to any one of claims 1-16, characterized in that, The side liquid cooling plate includes a plurality of sub-side liquid cooling plates arranged at intervals in the direction toward the interior of the temperature regulation space; The gap between two adjacent sub-side liquid cooling plates forms a second airflow cavity; the second airflow cavity is connected to the temperature regulation space; The first fin is disposed on the surface of the sub-side liquid cooling plate.

18. The heat exchange device according to any one of claims 1 to 16, wherein It also includes an air guide plate that covers the side of the side liquid cooling plate facing the temperature regulation space. Alternatively, the air guide plate covers the side of the side liquid cooling plate away from the temperature regulation space.

19. The heat exchange device of claim 18, wherein A first ventilation opening is provided on the air guide plate covering the side of the side liquid cooling plate facing the temperature regulation space. A first airflow channel is connected to the temperature regulation space through the first ventilation opening. The first ventilation opening includes a first air inlet and a first air outlet.

20. The heat exchange device of claim 19, wherein The side liquid cooling plate is provided with a second ventilation opening; The first airflow channel on the side wall of the side liquid cooling plate away from the temperature regulation space is connected to the temperature regulation space through the first vent, wherein the second vent includes: a second air inlet and a second air outlet.

21. The heat exchange device of claim 19, wherein Also includes: A fan installed at the first air inlet or the first air outlet; And / or, a turbulence fan disposed in the temperature regulation space.

22. The heat exchange device of claim 1, wherein Also includes: The enclosing side plate, the side liquid cooling plate, and the bottom liquid cooling plate cooperate to form the temperature regulation space, wherein at least one of the enclosing side plates is used to set wiring terminals.

23. A power conversion device, characterized by include: Electronic devices and heat exchange devices as described in any one of claims 1-22; The electronic devices are disposed in the temperature regulation space, wherein the electronic devices include one or a combination of IGBT, MOSFET, capacitor, inductor, and resistor.

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