A plate thickness measuring and lettering integrated device

CN122590734APending Publication Date: 2026-08-18SHENZHEN TECHSTAR PRECISION IND CO LTD
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Patent Information

Application Number
CN202610947602.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-29
Publication Date
2026-08-18

AI Technical Summary

Technical Problem

[0004]本发明公开一种板材测厚刻字一体设备,旨在解决背景技术中铜厚、板厚测量与刻字无法连线,效率低,同时板厚测量时易受打滑、转速波动致镭射定位失准,导致板厚测量精度下降的技术问题

Benefits of technology

[0015] As can be seen from the above, the integrated plate thickness measurement and engraving device provided by the present invention can realize the entire process of copper thickness measurement, engraving and plate thickness measurement in a line, which greatly improves efficiency. The follow-up synchronous measurement frame is directly dragged forward by the plate, eliminating the interference of conveyor roller slippage, motor speed fluctuation and plate inertial displacement on the positioning of the measurement point from the physical level. The laser sampling is mechanically triggered by gear rack and triggering plate. The positioning accuracy is determined only by the mechanical processing accuracy, which is stable and reliable, ensuring the authenticity and accuracy of plate thickness measurement data. It also has the advantages of controllable cost and strong adaptability.

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Abstract

The application belongs to the technical field of circuit board processing, and particularly relates to a plate thickness measurement and lettering integrated equipment. The copper thickness measurement, lettering and plate thickness measurement cannot be connected, the efficiency is low, and the plate thickness measurement is prone to slipping, speed fluctuation and laser positioning error, which leads to the decline of plate thickness measurement accuracy. The present application discloses a plate thickness measurement and lettering integrated equipment which has copper thickness measurement, lettering and plate thickness measurement full-process connection operation, greatly improves the efficiency, and through the direct dragging of the plate by the follow-up synchronous measurement frame, the interference of the conveying roller slipping, motor speed fluctuation and plate inertia displacement on the measurement point positioning is eliminated from the physical layer. The gear rack and the trigger dial mechanical trigger laser sampling are adopted, the positioning accuracy is only determined by the machining accuracy, and the effect of strong adaptability is achieved.
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Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to an integrated device for measuring board thickness and engraving characters. Background Technology

[0002] PCB boards are a key basic component in integrated circuit manufacturing. In the PCB board lamination process, PP is used to bond and insulate the inner core layer at high temperature, while copper foil is applied to the outer layer for subsequent pattern processing of the outer layer circuitry. To prevent the PP or copper foil from being used incorrectly due to visual similarity, after lamination, intelligent sensors are used to accurately identify the board's position, and laser measuring instruments are used to perform high-precision board thickness measurement, copper foil thickness measurement, and edge character engraving on the PCB board, thereby ensuring that the key parameters of each board are traceable and controllable.

[0003] Existing methods for measuring copper thickness, board thickness, and edge marking on PCBs cannot be performed in a continuous line, resulting in low efficiency. Furthermore, the method of determining the laser measurement position by calculating the board size and conveyor speed during board thickness measurement is problematic. In actual operation, slippage occurs between the conveyor roller and the board due to dust and oil, and the motor experiences speed fluctuations during start-up, shutdown, and speed changes. The board itself also slides due to inertia, making it impossible for the laser head to align with the preset measurement point, thus severely reducing the accuracy of board thickness measurement. Summary of the Invention

[0004] This invention discloses an integrated plate thickness measurement and engraving device, which aims to solve the technical problems in the background art where copper thickness and plate thickness measurement and engraving cannot be connected, resulting in low efficiency. At the same time, the plate thickness measurement is easily affected by slippage and speed fluctuations, which leads to laser positioning inaccuracy and a decrease in plate thickness measurement accuracy.

[0005] The present invention proposes an integrated device for measuring and engraving thickness of sheet metal, comprising: An integrated tooling cabinet, wherein tooling vertical rods are equally spaced on the top of the integrated tooling cabinet, and the same tooling horizontal rod is fixedly connected to one side of two tooling vertical rods located on the same side; the same copper thickness measuring mechanism is provided on one side of the two tooling horizontal rods; and the same laser engraving mechanism is provided on one side of the two tooling horizontal rods. A follow-up synchronous measurement module is set above two tooling crossbars. The follow-up synchronous measurement module includes two limiting rails. The same guide round rod is fixedly connected to the opposite side of the two limiting rails. Follow-up sliders are slidably connected to the outside of the two guide round rods. A cleaning module is positioned above two tooling crossbars, and the cleaning module includes two tooling blocks.

[0006] In a preferred embodiment, the follow-up synchronous measurement module further includes: A follow-up synchronous measuring frame is fixedly connected to one side of two follow-up sliders. A laser head is provided on one side of the follow-up synchronous measuring frame. Two support plates are fixedly connected to one side of the laser head. The same laser head is provided on one side of the two support plates. The same tooling rod is fixedly connected to one side of the two support plates located on the same side. Two lifting limit rods are symmetrically slidably connected to one side of the follow-up synchronous measuring frame, and telescopic cylinders are symmetrically arranged on one side of the follow-up synchronous measuring frame.

[0007] In a preferred embodiment, the follow-up synchronous measurement module further includes: The lifting clamping plate is fixedly connected to one end of the two lifting limit round rods, and one side of the lifting clamping plate is fixedly connected to the drive end of the telescopic cylinder. Multiple adaptive cylinders are equidistantly slidably connected to one side of the lifting clamping plate. One end of each adaptive cylinder is fixedly connected to a rubber base. The same telescopic spring is fixedly connected to the opposite side of the adaptive cylinder and the lifting clamping plate. The telescopic spring is located outside the adaptive cylinder.

[0008] In a preferred embodiment, the follow-up synchronous measurement module further includes: Two laser-triggered racks are fixedly connected to one side of two limit rails respectively. The follower slider is fixedly connected to the same follower return spring on the opposite side of the limit rail. The follower return spring is located outside the guide rod. Two gear shafts are connected to both sides of the follow-up synchronous measuring frame via bearings. Trigger gears are fixedly connected to the outside of both gear shafts. The trigger gears mesh with the laser trigger rack. Trigger plate one and trigger plate two are respectively provided at one end of the two gear shafts. Photoelectric trigger switch groups are respectively provided on one side of the two tooling crossbars.

[0009] In a preferred embodiment, the cleaning module further includes: The cleaning horizontal plate is fixedly connected to one side of two tooling blocks, and the tooling blocks are fixedly connected to one side of the tooling crossbar; Two electric telescopic rods are symmetrically positioned on one side of the cleaning horizontal board.

[0010] In a preferred embodiment, the cleaning module further includes: Two cleaning limit posts are symmetrically slidably connected to one side of the cleaning horizontal plate. One end of the two cleaning limit posts is fixedly connected to the same U-shaped lifting frame. One side of the U-shaped lifting frame is fixedly connected to the drive end of the electric telescopic rod. The cleaning brush cylinder is connected to the U-shaped lifting frame via bearings.

[0011] In a preferred embodiment, it also includes: Two conveyor plates are fixedly connected to one side of two tooling crossbars, and multiple conveyor rollers are provided on the opposite side of the two conveyor plates. Two support plates are fixedly connected to one side of two conveyor plates, and two guide cylinders are fixedly connected to the opposite side of the two support plates. Two slapping plate brackets are symmetrically slidably connected to the outside of the two guide cylinders.

[0012] In a preferred embodiment, it also includes: A bidirectional electric telescopic cylinder is installed on one side of the two support plates, and the drive end of the bidirectional electric telescopic cylinder is fixedly connected to one side of the clapper bracket. Multiple electric telescopic cylinders are mounted on top of the integrated tooling cabinet, and the drive ends of the multiple electric telescopic cylinders are equipped with the same whole plate guide wheel.

[0013] In a preferred embodiment, it also includes: Two baffle lifting cylinders are symmetrically arranged above the integrated tooling cabinet, and the driving end of the two baffle lifting cylinders is equipped with the same baffle. Two side guard frames are symmetrically positioned above the integrated tooling cabinet.

[0014] In a preferred embodiment, it also includes: The upper guard frame is located on one side of the two side guard frames, and a controller is installed on one side of the upper guard frame; The feed sensor and the plate discharge sensor are respectively installed at the feed end and the discharge end of the integrated tooling cabinet; The laser generator is mounted on the laser engraving mechanism.

[0015] As can be seen from the above, the integrated plate thickness measurement and engraving device provided by the present invention can realize the entire process of copper thickness measurement, engraving and plate thickness measurement in a line, which greatly improves efficiency. The follow-up synchronous measurement frame is directly dragged forward by the plate, eliminating the interference of conveyor roller slippage, motor speed fluctuation and plate inertial displacement on the positioning of the measurement point from the physical level. The laser sampling is mechanically triggered by gear rack and triggering plate. The positioning accuracy is determined only by the mechanical processing accuracy, which is stable and reliable, ensuring the authenticity and accuracy of plate thickness measurement data. It also has the advantages of controllable cost and strong adaptability. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of an integrated plate thickness measurement and engraving device proposed in this invention; Figure 2 This is a side view of the integrated plate thickness measurement and engraving device proposed in this invention. Figure 3 This is a schematic diagram of the integrated tooling cabinet structure of the integrated plate thickness measurement and engraving device proposed in this invention; Figure 4This is a schematic diagram of the copper thickness measuring mechanism of an integrated plate thickness measuring and engraving device proposed in this invention; Figure 5 This is a schematic diagram of the cleaning module structure of an integrated plate thickness measurement and engraving device proposed in this invention; Figure 6 This is a schematic diagram of the baffle section structure of an integrated plate thickness measurement and engraving device proposed in this invention; Figure 7 This is a schematic diagram of the follow-up synchronous measurement module structure of an integrated plate thickness measurement and engraving device proposed in this invention; Figure 8 for Figure 7 A magnified structural diagram of part A; Figure 9 This is a schematic diagram of the follow-up synchronous measurement module of the integrated plate thickness measurement and engraving device proposed in this invention; Figure 10 for Figure 9 A magnified structural diagram of part B.

[0017] In the diagram: 1. Integrated tooling cabinet; 2. Side guard frame; 3. Upper guard frame; 4. Controller; 5. Follow-up synchronous measurement module; 501. Limiting rail; 502. Guide rod; 503. Follow-up slider; 504. Follow-up synchronous measurement frame; 505. Lifting limit rod; 506. Telescopic cylinder; 507. Lifting clamping plate; 508. Adaptive cylinder; 509. Rubber base; 510. Telescopic spring; 511. Laser head one; 512. Support plate; 513. Tooling rod; 514. Laser head two; 515. Follow-up return spring; 516. Gear shaft; 517. Trigger gear; 518. Laser trigger rack; 519. Trigger lever one; 520. 521. Photoelectric trigger switch assembly; 6. Trigger lever 2; 7. Cleaning module; 8. Tooling block; 9. Cleaning horizontal plate; 10. Electric telescopic rod; 11. U-shaped lifting frame; 12. Cleaning brush cylinder; 13. Cleaning limit post; 14. Tooling vertical rod; 15. Conveying horizontal plate; 16. Tooling horizontal rod; 17. Conveying roller; 18. Feed sensor; 19. Plate output sensor; 20. Copper thickness measuring mechanism; 21. Laser engraving mechanism; 22. Laser generator; 23. Plate support bracket; 24. Electric telescopic cylinder; 25. Plate guide wheel; 26. Support plate; 27. Guide cylinder; 28. Bidirectional electric telescopic cylinder; 29. ​​Baffle lifting cylinder; 20. Baffle. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] The integrated plate thickness measurement and engraving device disclosed in this invention is mainly used in scenarios where copper thickness and plate thickness measurement and engraving cannot be connected, resulting in low efficiency. At the same time, the plate thickness measurement is easily affected by slippage and speed fluctuations, which can cause laser positioning inaccuracy and reduce the accuracy of plate thickness measurement.

[0020] Reference Figures 1-10 A sheet metal thickness measurement and engraving integrated device, comprising: An integrated tooling cabinet 1 has tooling vertical bars 7 arranged at equal intervals on the top of the integrated tooling cabinet 1. The same tooling horizontal bar 9 is fixedly connected to one side of the two tooling vertical bars 7 located on the same side. The same copper thickness measuring mechanism 13 is arranged on one side of the two tooling horizontal bars 9. The same laser engraving mechanism 14 is arranged on one side of the two tooling horizontal bars 9. The follow-up synchronous measurement module 5 is set above the two tooling crossbars 9. The follow-up synchronous measurement module 5 includes two limiting rails 501. The same guide round rod 502 is fixedly connected to the opposite side of the two limiting rails 501. The follow-up slider 503 is slidably connected to the outside of the two guide round rods 502. The cleaning module 6 is positioned above the two tooling crossbars 9, and the cleaning module 6 includes two tooling blocks 601.

[0021] Reference Figures 1-10 In a preferred embodiment, the follow-up synchronous measurement module 5 further includes: The follow-up synchronous measuring frame 504 is fixedly connected to one side of the two follow-up sliders 503. A laser head 511 is provided on one side of the follow-up synchronous measuring frame 504. Two support plates 512 are fixedly connected to one side of the laser head 511. The same laser head 514 is provided on one side of the two support plates 512. The same tooling rod 513 is fixedly connected to one side of the two support plates 512 located on the same side. Two lifting limit rods 505 are symmetrically slidably connected to one side of the follow-up synchronous measuring frame 504, and telescopic cylinders 506 are symmetrically arranged on one side of the follow-up synchronous measuring frame 504.

[0022] Reference Figures 1-10 In a preferred embodiment, the follow-up synchronous measurement module 5 further includes: The lifting clamping plate 507 is fixedly connected to one end of the two lifting limit round rods 505, and one side of the lifting clamping plate 507 is fixedly connected to the drive end of the telescopic cylinder 506. Multiple adaptive cylinders 508 are equidistantly slidably connected to one side of the lifting clamping plate 507. One end of each of the multiple adaptive cylinders 508 is fixedly connected to a rubber base 509. The same telescopic spring 510 is fixedly connected to the opposite side of the adaptive cylinders 508 and the lifting clamping plate 507. The telescopic spring 510 is located outside the adaptive cylinders 508.

[0023] Reference Figures 1-10 In a preferred embodiment, the follow-up synchronous measurement module 5 further includes: Two laser-triggered racks 518 are fixedly connected to one side of two limiting rails 501 respectively. The follower slider 503 is fixedly connected to the same follower return spring 515 on the opposite side of the limiting rail 501. The follower return spring 515 is located outside the guide rod 502. Two gear shafts 516 are connected to both sides of the follow-up synchronous measuring frame 504 via bearings. Trigger gears 517 are fixedly connected to the outside of each gear shaft 516. The trigger gears 517 mesh with the laser trigger rack 518. One end of each gear shaft 516 is provided with a trigger paddle 1 519 and a trigger paddle 2 521. Photoelectric trigger switch groups 520 are provided on one side of each of the two tooling crossbars 9.

[0024] Specifically, after the equipment is started, the PCB board enters from the feeding end of the integrated tooling cabinet 1. When the board reaches the detection area of ​​the feeding sensor 11, the feeding sensor 11 sends a board presence signal to the controller 4. The controller 4 then controls the two baffle lifting cylinders 22 to drive the baffle 23 to rise, physically stopping the board at the front end. At the same time, the conveying roller 10 stops rotating after receiving the baffle arrival signal, so that the board stops precisely at the preset initial processing position. After the board is stopped by the baffle 23, multiple electric telescopic cylinders 17 set above the integrated tooling cabinet 1 drive the board guide wheel 18 to rise, lifting the board from below. At the same time, the bidirectional electric telescopic cylinder 21 set between the two support plates 19 drives the two side plate supports 16 to slide towards each other along the guide cylinder 20. The movement pushes the plate to the center position in the horizontal direction, ensuring that the positioning reference for subsequent copper thickness measurement and engraving is consistent. After the plate is fixed in the center, the copper thickness measuring mechanism 13, which is set on the two tooling crossbars 9, is activated. Its measuring head contacts the upper and lower surfaces of the plate respectively to complete the data acquisition of copper foil thickness. After the copper thickness measurement is completed, the laser engraving mechanism 14 is activated, and the laser generator 15 generates a laser beam to engrave characters on the upper surface of the plate. After the laser engraving is completed, the controller 4 sends a descent command to the baffle lifting cylinder 22. The baffle 23 descends and resets, and the conveying roller 10 restarts, conveying the plate towards the discharge end. At the moment the plate starts to be conveyed, the follow-up synchronous measurement module 5 enters the working state. The two follow-up synchronous measurement modules 504 are set on the follow-up synchronous measurement frame 504. Simultaneously, the telescopic cylinder 506 extends its drive end downward, pushing the lifting clamping plate 507 downward along the two lifting limit rods 505. During the downward movement of the lifting clamping plate 507, the rubber bases 509 at the ends of the multiple adaptive cylinders 508 on its lower surface gradually approach and finally press against the upper surface of the plate. During this process, due to the elastic material properties of the rubber bases 509 and the fact that each adaptive cylinder 508 is fitted with a telescopic spring 510, when there is slight warping or unevenness on the surface of the plate, each adaptive cylinder 508 can be independently compressed or extended, so that each rubber base 509 can tightly fit against the surface of the plate, forming multi-point uniform pressing. The telescopic spring 510 provides continuous downward pressure to the adaptive cylinders 508, ensuring that the rubber bases 509... Sufficient static friction is generated between the rubber base 509 and the plate. Once a stable static friction contact is established between the rubber base 509 and the upper surface of the plate, the follower synchronous measuring frame 504 is slidably connected to the guide rod 502 via the follower slider 503, forming a floating support structure that can move freely along the conveying direction. At this time, when the plate moves forward, the static friction between the rubber base 509 and the plate directly drags the entire follower synchronous measuring frame 504 forward synchronously along the two limit tracks 501. The moving speed of the follower synchronous measuring frame 504 is completely consistent with the moving speed of the plate, and the moving distance is always equal to the actual moving distance of the plate, regardless of whether the conveyor roller 10 slips, whether the speed of the conveyor drive motor fluctuates, or whether the plate has inertial slippage.As the follow-up synchronous measuring frame 504 is dragged along the guide rod 502 by the plate, two gear shafts 516 on both sides of the follow-up synchronous measuring frame 504 move synchronously with the measuring frame. A trigger gear 517 fixedly connected to each gear shaft 516 maintains constant mesh with a laser trigger rack 518 fixed to one side of the limit track 501. When the measuring frame moves, the trigger gear 517 rolls on the laser trigger rack 518. The rotation angle of the gear shaft 516 has a strict linear relationship with the moving distance of the measuring frame. This relationship is determined by the pitch circle circumference of the gear and the tooth pitch of the rack, without any electronic integration or time variables. A trigger lever 1 519 and a trigger lever 2 52 are fixedly installed at one end of each gear shaft 516. 1. The installation angle of the two levers on the gear shaft 516 is preset according to the preset plate thickness measurement point position. At the same time, photoelectric trigger switch group 520 is set at the corresponding position on one side of the two tooling crossbars 9. When the follow-up synchronous measuring frame 504 starts to move from the initial position, the gear shaft 516 starts to rotate from zero angle. When the measuring frame moves a distance to the first preset value, such as the position of the first measurement point on the plate, the gear shaft 516 rotates to the set angle of the trigger lever 519. The trigger lever 519 just triggers the corresponding switch in the photoelectric trigger switch group 520. The switch sends a trigger signal to the controller 4. The controller 4 then collects the measurement data of the laser head 511 set on the follow-up synchronous measuring frame 504. When the measurement... When the frame continues to move to the second preset distance, the gear shaft 516 continues to rotate to the set angle of the trigger lever 521. The trigger lever 521 actuates another switch in the photoelectric trigger switch group 520, triggering the laser head 514 to collect plate thickness data. It should be noted that both the laser head 511 and the laser head 514 are fixedly mounted on the follow-up synchronous measuring frame 504 via the support plate 512 and the tooling rod 513. Their positions relative to the measuring frame itself are fixed. However, since the measuring frame moves synchronously with the plate, the triggering time is precisely determined by the mechanical displacement. Therefore, the two measurements correspond to two different points on the plate with fixed physical positions. Since the trigger signal comes entirely from the mechanical rotation angle of the gear shaft 516, and this angle is only related to... The physical displacement of the measuring frame is related to the rotational speed of the conveyor roller 10, the instantaneous speed of the motor, and the sliding state of the plate. Therefore, the actual physical positions of the multiple measuring points on the plate, configured according to the number of laser heads, remain constant and are unaffected by any conveying interference factors, fundamentally ensuring the accuracy of plate thickness measurement. After the follow-up synchronous measuring frame 504 completes data acquisition from all preset measuring points, the controller 4 sends a lifting command to the telescopic cylinder 506. The telescopic cylinder 506 drives the lifting clamping plate 507 to rise, and the rubber base 509 detaches from the upper surface of the plate. At this time, the static friction connection between the follow-up synchronous measuring frame 504 and the plate is released, and under the elastic restoring force of the follow-up return spring 515...The follower slider 503 drives the follower synchronous measuring frame 504 to slide back to its initial position along the guide rod 502. Simultaneously, the trigger gear 517 rolls in the opposite direction on the laser trigger rack 518, and trigger paddles 1 and 2 simultaneously reset, awaiting the arrival of the next board. After the board completes all processes of copper thickness measurement, engraving, and board thickness measurement, it continues to be conveyed to the discharge end by the conveyor roller 10. When the board reaches the board discharge sensor 12 at the discharge end, the board discharge sensor 12 sends a board discharge signal to the controller 4, completing the entire processing and inspection process for that board. In specific application scenarios, this invention integrates the copper thickness measurement mechanism 13, the laser engraving mechanism 14, and the follow-up synchronous measurement module 5 onto the same equipment along the board conveying direction by setting a gantry-type support frame composed of a tooling vertical rod 7 and a tooling horizontal rod 9 above the integrated tooling cabinet 1. Driven by the conveying roller 10, the board can continuously complete the three processes of copper thickness measurement, laser engraving, and board thickness measurement on the same equipment, eliminating the need for manual transfer and secondary positioning between different devices. Compared to the traditional multi-station operation mode, this invention significantly reduces the board loading and unloading time and turnover time, and reduces the frequency of manual intervention. This invention significantly improves the overall production efficiency of PCB board inspection and marking. It abandons the traditional control method of calculating the laser measurement position by integrating conveyor speed and conveyor time in board thickness measurement. Instead, it uses a follow-up synchronous measuring frame 504 and a telescopic cylinder 506 to drive the lifting clamping plate 507 downwards. This causes the rubber bases 509 at the ends of multiple adaptive cylinders 508 to press against the upper surface of the board. Static friction causes the follow-up synchronous measuring frame 504 to be directly dragged forward by the board. During this process, the displacement of the follow-up synchronous measuring frame 504 is strictly equal to the actual displacement of the board, with no cumulative error. Even during transport... When the feeding roller 10 slips due to dust or oil, or when the conveyor drive motor experiences speed fluctuations during start-up, shutdown, or speed changes, or when the sheet material slips due to inertia and impact, the displacement of the follow-up synchronous measuring frame 504 remains consistent with that of the sheet material itself, physically isolating the interference of unstable factors in the conveying system on the measurement and positioning. Gear shafts 516 and trigger gears 517 are installed on both sides of the follow-up synchronous measuring frame 504, meshing with a laser trigger rack 518 fixed on the limit track 501. When the follow-up synchronous measuring frame 504 moves, the rotation angle of the trigger gear 517 has a precise linear relationship with the displacement, without any electronic interference. The delay or speed conversion error is mitigated by installing trigger paddle 1 519 and trigger paddle 2 521 at a preset angle on the gear shaft 516 and cooperating with the photoelectric trigger switch group 520 to achieve mechanical trigger sampling of laser head 1 511 and laser head 2 514. This triggering method does not depend on the timing accuracy of the controller, the pulse count of the encoder, or the stability of the speed feedback signal. Its positioning accuracy is determined only by the machining accuracy of the trigger gear 517 and the laser trigger rack 518 and the installation angle accuracy of trigger paddle 1 519 and trigger paddle 2 521. There is no electrical drift or software accumulation error after long-term use.Multiple adaptive cylinders 508, evenly spaced below the lifting clamping plate 507, are each independently equipped with a telescopic spring 510 and a rubber base 509 at their ends. When pressing on plates of different thicknesses or with slightly warped surfaces, each adaptive cylinder 508 can independently extend and retract according to the actual local height of the plate, ensuring that all rubber bases 509 simultaneously contact the plate surface and form a uniformly distributed clamping force. This structure ensures a reliable static friction connection between the follow-up synchronous measuring frame 504 and the plate, preventing relative slippage due to insufficient clamping force at a single point, and also avoids indentations or damage to the plate surface caused by rigid clamping. Furthermore, it is compatible with PCBs of different thicknesses, improving the equipment's versatility.

[0025] Reference Figures 1-5 In a preferred embodiment, the cleaning module 6 further includes: The cleaning horizontal plate 602 is fixedly connected to one side of the two tooling blocks 601, and the tooling blocks 601 are fixedly connected to one side of the tooling crossbar 9; Two electric telescopic rods 603 are symmetrically arranged on one side of the cleaning horizontal plate 602.

[0026] Reference Figures 1-5 In a preferred embodiment, the cleaning module 6 further includes: Two cleaning limit posts 606 are symmetrically slidably connected to one side of the cleaning horizontal plate 602. One end of the two cleaning limit posts 606 is fixedly connected to the same U-shaped lifting frame 604. One side of the U-shaped lifting frame 604 is fixedly connected to the drive end of the electric telescopic rod 603. The cleaning brush cylinder 605 is connected to the U-shaped lifting frame 604 via a bearing.

[0027] Specifically, during continuous operation, the equipment periodically or as needed activates the cleaning module 6. Two electric telescopic rods 603 set on the cleaning horizontal plate 602 drive the U-shaped lifting frame 604 to descend along the cleaning limit post 606, so that the cleaning brush cylinder 605 contacts the upper surface of the plate. As the plate is conveyed, the cleaning brush cylinder 605 removes dust and oil stains from the surface of the plate, reducing the adverse effects of foreign objects on subsequent measurement and conveying friction, and further improving the stability of follow-up synchronous measurement.

[0028] Reference Figures 1-6 In a preferred embodiment, it further includes: Two conveyor plates 8 are fixedly connected to one side of two tooling crossbars 9 respectively, and multiple conveyor rollers 10 are provided on the opposite side of the two conveyor plates 8. Two support plates 19 are fixedly connected to one side of two conveying horizontal plates 8 respectively. Two guide cylinders 20 are fixedly connected to the opposite side of the two support plates 19. Two slapping plate brackets 16 are symmetrically slidably connected to the outside of the two guide cylinders 20.

[0029] Reference Figures 1-6 In a preferred embodiment, it further includes: A bidirectional electric telescopic cylinder 21 is installed on one side of the two support plates 19, and the drive end of the bidirectional electric telescopic cylinder 21 is fixedly connected to one side of the clapper bracket 16. Multiple electric telescopic cylinders 17 are installed above the integrated tooling cabinet 1, and the drive end of the multiple electric telescopic cylinders 17 is equipped with the same whole plate guide wheel 18.

[0030] Reference Figures 1-6 In a preferred embodiment, it further includes: Two baffle lifting cylinders 22 are symmetrically arranged above the integrated tooling cabinet 1, and the driving end of the two baffle lifting cylinders 22 is provided with the same baffle 23. Two side frames 2 are symmetrically positioned above the integrated tooling cabinet 1.

[0031] Reference Figures 1-6 In a preferred embodiment, it further includes: The upper guard frame 3 is located on one side of the two side guard frames 2, and a controller 4 is located on one side of the upper guard frame 3; The feed sensor 11 and the plate discharge sensor 12 are respectively installed at the feed end and the discharge end of the integrated tooling cabinet 1; A laser generator 15 is mounted on a laser engraving mechanism 14.

[0032] Working principle: After the equipment is started, the PCB board enters from the feeding end of the integrated tooling cabinet 1. When the board reaches the detection area of ​​the feeding sensor 11, the feeding sensor 11 sends a board presence signal to the controller 4. The controller 4 then controls the two baffle lifting cylinders 22 to drive the baffle 23 to rise, physically stopping the board at the front end. At the same time, the conveying roller 10 stops rotating after receiving the baffle arrival signal, so that the board stops precisely at the preset initial processing position. After the board is stopped by the baffle 23, multiple electric telescopic cylinders 17 set above the integrated tooling cabinet 1 drive the board guide wheel 18 to rise, lifting the board from below. At the same time, the bidirectional electric telescopic cylinder 21 set between the two support plates 19 drives the two side plate supports 16 to slide towards each other along the guide cylinder 20. The movement pushes the plate to the center position in the horizontal direction, ensuring that the positioning reference for subsequent copper thickness measurement and engraving is consistent. After the plate is fixed in the center, the copper thickness measuring mechanism 13, which is set on the two tooling crossbars 9, is activated. Its measuring head contacts the upper and lower surfaces of the plate respectively to complete the data acquisition of copper foil thickness. After the copper thickness measurement is completed, the laser engraving mechanism 14 is activated, and the laser generator 15 generates a laser beam to engrave characters on the upper surface of the plate. After the laser engraving is completed, the controller 4 sends a descent command to the baffle lifting cylinder 22. The baffle 23 descends and resets, and the conveying roller 10 restarts, conveying the plate towards the discharge end. At the moment the plate starts to be conveyed, the follow-up synchronous measurement module 5 enters the working state. The two follow-up synchronous measurement modules 504 are set on the follow-up synchronous measurement frame 504. Simultaneously, the telescopic cylinder 506 extends its drive end downward, pushing the lifting clamping plate 507 downward along the two lifting limit rods 505. During the downward movement of the lifting clamping plate 507, the rubber bases 509 at the ends of the multiple adaptive cylinders 508 on its lower surface gradually approach and finally press against the upper surface of the plate. During this process, due to the elastic material properties of the rubber bases 509 and the fact that each adaptive cylinder 508 is fitted with a telescopic spring 510, when there is slight warping or unevenness on the surface of the plate, each adaptive cylinder 508 can be independently compressed or extended, so that each rubber base 509 can tightly fit against the surface of the plate, forming multi-point uniform pressing. The telescopic spring 510 provides continuous downward pressure to the adaptive cylinders 508, ensuring that the rubber bases 509... Sufficient static friction is generated between the rubber base 509 and the plate. Once a stable static friction contact is established between the rubber base 509 and the upper surface of the plate, the follower synchronous measuring frame 504 is slidably connected to the guide rod 502 via the follower slider 503, forming a floating support structure that can move freely along the conveying direction. At this time, when the plate moves forward, the static friction between the rubber base 509 and the plate directly drags the entire follower synchronous measuring frame 504 forward synchronously along the two limit tracks 501. The moving speed of the follower synchronous measuring frame 504 is completely consistent with the moving speed of the plate, and the moving distance is always equal to the actual moving distance of the plate, regardless of whether the conveyor roller 10 slips, whether the speed of the conveyor drive motor fluctuates, or whether the plate has inertial slippage.As the follow-up synchronous measuring frame 504 is dragged along the guide rod 502 by the plate, two gear shafts 516 on both sides of the follow-up synchronous measuring frame 504 move synchronously with the measuring frame. A trigger gear 517 fixedly connected to each gear shaft 516 maintains constant mesh with a laser trigger rack 518 fixed to one side of the limit track 501. When the measuring frame moves, the trigger gear 517 rolls on the laser trigger rack 518. The rotation angle of the gear shaft 516 has a strict linear relationship with the moving distance of the measuring frame. This relationship is determined by the pitch circle circumference of the gear and the tooth pitch of the rack, without any electronic integration or time variables. A trigger lever 1 519 and a trigger lever 2 52 are fixedly installed at one end of each gear shaft 516. 1. The installation angle of the two levers on the gear shaft 516 is preset according to the preset plate thickness measurement point position. At the same time, photoelectric trigger switch group 520 is set at the corresponding position on one side of the two tooling crossbars 9. When the follow-up synchronous measuring frame 504 starts to move from the initial position, the gear shaft 516 starts to rotate from zero angle. When the measuring frame moves a distance to the first preset value, such as the position of the first measurement point on the plate, the gear shaft 516 rotates to the set angle of the trigger lever 519. The trigger lever 519 just triggers the corresponding switch in the photoelectric trigger switch group 520. The switch sends a trigger signal to the controller 4. The controller 4 then collects the measurement data of the laser head 511 set on the follow-up synchronous measuring frame 504. When the measurement... When the frame continues to move to the second preset distance, the gear shaft 516 continues to rotate to the set angle of the trigger lever 521. The trigger lever 521 actuates another switch in the photoelectric trigger switch group 520, triggering the laser head 514 to collect plate thickness data. It should be noted that both the laser head 511 and the laser head 514 are fixedly mounted on the follow-up synchronous measuring frame 504 via the support plate 512 and the tooling rod 513. Their positions relative to the measuring frame itself are fixed. However, since the measuring frame moves synchronously with the plate, the triggering time is precisely determined by the mechanical displacement. Therefore, the two measurements correspond to two different points on the plate with fixed physical positions. Since the trigger signal comes entirely from the mechanical rotation angle of the gear shaft 516, and this angle is only related to... The physical displacement of the measuring frame is related to the rotational speed of the conveyor roller 10, the instantaneous speed of the motor, and the sliding state of the plate. Therefore, the actual physical positions of the multiple measuring points on the plate, configured according to the number of laser heads, remain constant and are unaffected by any conveying interference factors, fundamentally ensuring the accuracy of plate thickness measurement. After the follow-up synchronous measuring frame 504 completes data acquisition from all preset measuring points, the controller 4 sends a lifting command to the telescopic cylinder 506. The telescopic cylinder 506 drives the lifting clamping plate 507 to rise, and the rubber base 509 detaches from the upper surface of the plate. At this time, the static friction connection between the follow-up synchronous measuring frame 504 and the plate is released, and under the elastic restoring force of the follow-up return spring 515...The follower slider 503 drives the follower synchronous measuring frame 504 to slide back to the initial position along the guide rod 502. Simultaneously, the trigger gear 517 rolls in the opposite direction on the laser trigger rack 518, and trigger paddles 1 and 2 reset synchronously, awaiting the arrival of the next board. After the board completes all processes of copper thickness measurement, engraving, and board thickness measurement, it continues to be conveyed to the discharge end by the conveyor roller 10. When the board reaches the board discharge sensor 12 at the discharge end, the board discharge sensor 12 sends a board discharge signal to the controller 4, completing the entire processing and inspection process for the board. During continuous operation, the equipment periodically or as needed activates the cleaning module 6. Two electric telescopic rods 603, mounted on the cleaning horizontal plate 602, drive the U-shaped lifting frame 604 to descend along the cleaning limit post 606, causing the cleaning brush cylinder 605 to contact the upper surface of the board. As the board is conveyed, the cleaning brush cylinder 605 removes dust and oil from the board surface, reducing the adverse effects of foreign objects on subsequent measurements and conveying friction, further improving the stability of the follower synchronous measurement.

[0033] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A plate thickness measuring and lettering integrated device, characterized in that, include: An integrated tooling cabinet (1) is provided with tooling vertical rods (7) at equal intervals above it. The same tooling horizontal rod (9) is fixedly connected to one side of the two tooling vertical rods (7) located on the same side. The same copper thickness measuring mechanism (13) is provided on one side of the two tooling horizontal rods (9). The same laser engraving mechanism (14) is provided on one side of the two tooling horizontal rods (9). The follow-up synchronous measurement module (5) is set above the two tooling crossbars (9). The follow-up synchronous measurement module (5) includes two limiting rails (501). The same guide rod (502) is fixedly connected to the opposite side of the two limiting rails (501). Follow-up sliders (503) are slidably connected to the outside of the two guide rods (502). A cleaning module (6) is positioned above two tooling crossbars (9), and the cleaning module (6) includes two tooling blocks (601).

2. The integrated plate thickness measurement and engraving device according to claim 1, characterized in that, The follow-up synchronous measurement module (5) also includes: A follow-up synchronous measuring frame (504) is fixedly connected to one side of two follow-up sliders (503). A laser head (511) is provided on one side of the follow-up synchronous measuring frame (504). Two support plates (512) are fixedly connected to one side of the laser head (511). The same laser head (514) is provided on one side of the two support plates (512). The same tooling rod (513) is fixedly connected to one side of the two support plates (512) located on the same side. Two lifting limit rods (505) are symmetrically slidably connected to one side of the follow-up synchronous measuring frame (504), and telescopic cylinders (506) are symmetrically arranged on one side of the follow-up synchronous measuring frame (504).

3. The integrated plate thickness measurement and engraving device according to claim 2, characterized in that, The follow-up synchronous measurement module (5) also includes: The lifting clamping plate (507) is fixedly connected to one end of the two lifting limit round rods (505), and one side of the lifting clamping plate (507) is fixedly connected to the drive end of the telescopic cylinder (506). Multiple adaptive cylinders (508) are equidistantly slidably connected to one side of the lifting clamping plate (507). One end of each of the multiple adaptive cylinders (508) is fixedly connected to a rubber base (509). The same telescopic spring (510) is fixedly connected to the opposite side of the adaptive cylinder (508) and the lifting clamping plate (507). The telescopic spring (510) is located outside the adaptive cylinder (508).

4. The integrated plate thickness measurement and engraving device according to claim 3, characterized in that, The follow-up synchronous measurement module (5) also includes: Two laser-triggered racks (518) are fixedly connected to one side of two limit rails (501), and the follower slider (503) is fixedly connected to the same follower return spring (515) on the opposite side of the limit rail (501). The follower return spring (515) is located outside the guide rod (502). Two gear shafts (516) are connected to both sides of the follow-up synchronous measuring frame (504) by bearings. Both gear shafts (516) are fixedly connected to trigger gears (517). The trigger gears (517) mesh with the laser trigger rack (518). One end of the two gear shafts (516) is provided with trigger paddle one (519) and trigger paddle two (521). One side of the two tooling crossbars (9) is provided with photoelectric trigger switch groups (520).

5. The integrated plate thickness measurement and engraving device according to claim 1, characterized in that, The cleaning module (6) also includes: The cleaning horizontal plate (602) is fixedly connected to one side of two tooling blocks (601), and the tooling blocks (601) are fixedly connected to one side of the tooling crossbar (9); Two electric telescopic rods (603) are symmetrically arranged on one side of the cleaning crossbar (602).

6. The integrated plate thickness measurement and engraving device according to claim 5, characterized in that, The cleaning module (6) also includes: Two cleaning limit posts (606) are symmetrically slidably connected to one side of the cleaning horizontal plate (602). One end of the two cleaning limit posts (606) is fixedly connected to the same U-shaped lifting frame (604). One side of the U-shaped lifting frame (604) is fixedly connected to the drive end of the electric telescopic rod (603). The cleaning brush cylinder (605) is connected to the U-shaped lifting frame (604) via a bearing.

7. The integrated plate thickness measurement and engraving device according to claim 6, characterized in that, Also includes: Two conveyor plates (8) are fixedly connected to one side of two tooling crossbars (9), and multiple conveyor rollers (10) are provided on the opposite side of the two conveyor plates (8). Two support plates (19) are fixedly connected to one side of two conveying horizontal plates (8), and two guide cylinders (20) are fixedly connected to the opposite side of the two support plates (19). Two slapping brackets (16) are symmetrically slidably connected to the outside of the two guide cylinders (20).

8. The integrated plate thickness measurement and engraving device according to claim 7, characterized in that, Also includes: A bidirectional electric telescopic cylinder (21) is set on one side of the two support plates (19), and the driving end of the bidirectional electric telescopic cylinder (21) is fixedly connected to one side of the clapper bracket (16). Multiple electric telescopic cylinders (17) are set above the integrated tooling cabinet (1), and the drive end of the multiple electric telescopic cylinders (17) is equipped with the same whole plate guide wheel (18).

9. The integrated plate thickness measurement and engraving device according to claim 8, characterized in that, Also includes: Two baffle lifting cylinders (22) are symmetrically arranged above the integrated tooling cabinet (1), and the driving end of the two baffle lifting cylinders (22) is provided with the same baffle (23). Two side guard frames (2) are symmetrically set above the integrated tooling cabinet (1).

10. The integrated plate thickness measurement and engraving device according to claim 9, characterized in that, Also includes: The upper guard frame (3) is located on one side of the two side guard frames (2), and a controller (4) is provided on one side of the upper guard frame (3). The feed sensor (11) and the plate discharge sensor (12) are respectively installed at the feed end and the discharge end of the integrated tooling cabinet (1); A laser generator (15) is mounted on a laser engraving mechanism (14).