Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a circuit board, a laminated piece and a first solder connecting piece. A first recess is formed in a first side of the circuit board, and the circuit board comprises a first conductive layer. The laminated piece is arranged on the first side of the circuit board. The first solder connecting piece is fixedly connected to the bottom of the first recess at one end. The other end of the first solder connecting piece is fixedly connected to one side of the laminated piece facing the circuit board. The first solder connecting piece is electrically connected to the first conductive layer and the laminated piece respectively, so as to electrically connect the circuit board and the laminated piece.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] Circuit boards in electronic devices are commonly interconnected with upper-layer stacked components using surface-mount soldering, where the solder balls are situated in the open space between the circuit board and the upper-layer components. Under conditions such as alternating temperature and mechanical vibration, the solder balls will be subjected to significant concentrated stress, making the solder joints prone to cracking and detachment, thus affecting the stability of the electrical connection. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that can improve the stability of the electrical connection between the circuit board and the stacked components.

[0004] In a first aspect, embodiments of this application provide an electronic device, including: a circuit board, a laminate, and a first solder connector; a first groove is formed on a first side of the circuit board, and the circuit board includes a first conductive layer; the laminate is disposed on the first side of the circuit board; the first solder connector has one end fixedly connected to the bottom of the first groove; the other end of the first solder connector is fixedly connected to the side of the laminate facing the circuit board, and the first solder connector is electrically connected to the first conductive layer and the laminate, respectively, so as to electrically connect the circuit board and the laminate.

[0005] In this embodiment, the electronic device includes a circuit board, a laminate, and a first solder connector. A first groove is formed on a first side of the circuit board, the laminate is disposed on the first side of the circuit board, and the circuit board includes a first conductive layer. One end of the first solder connector is fixedly connected to the bottom of the first groove and electrically connected to the first conductive layer. The other end of the first solder connector is fixedly connected to the side of the laminate facing the circuit board and electrically connected to the side of the laminate facing the circuit board. Thus, the first conductive layer and the laminate can be electrically connected through the first solder connector. Based on the above configuration, the connection point of the first solder connector is shifted from the outer surface of the circuit board to the bottom of the inwardly recessed first groove, changing the stress reference position of the first solder connector. This reduces the concentrated tensile and shear stress borne by the first solder connector under temperature alternation and mechanical vibration conditions, reducing the likelihood of cracking or desoldering of the first solder connector, and improving the stability of the electrical connection between the circuit board and the laminate. Attached Figure Description

[0006] Figure 1 This is one of the schematic structural diagrams of the electronic device provided in the embodiments of this application;

[0007] Figure 2 This is the second schematic structural diagram of the electronic device provided in the embodiments of this application.

[0008] Reference numerals: 10, electronic device; 100, circuit board; 101, first groove; 102, third groove; 110, first conductive layer; 120, shielding layer; 200, laminate; 201, mounting cavity; 202, second groove; 203, first through hole; 204, second through hole; 210, second conductive layer; 220, dielectric layer; 230, third conductive layer; 240, first pin; 250, second pin; 300, first solder connector; 400, filler; 500, first component; 600, second component; 700, second solder connector; 810, conductive connector; 820, grounding connector. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0010] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0011] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0012] like Figure 1 and Figure 2 As shown, this application provides an electronic device 10, including: a circuit board 100, a laminate 200, and a first solder connector 300; a first groove 101 is formed on the first side of the circuit board 100, and the circuit board 100 includes a first conductive layer 110; the laminate 200 is disposed on the first side of the circuit board 100; one end of the first solder connector 300 is fixedly connected to the bottom of the groove 101; the other end of the first solder connector 300 is fixedly connected to the side of the laminate 200 facing the circuit board 100, and the first solder connector 300 is electrically connected to the first conductive layer 110 and the laminate 200 respectively, so as to electrically connect the circuit board 100 and the laminate 200.

[0013] In this embodiment of the application, the electronic device 10 includes a circuit board 100, a laminate 200, and a first solder connector 300; wherein, a first groove 101 is formed on the first side of the circuit board 100, the laminate 200 is disposed on the first side of the circuit board 100, the circuit board 100 includes a first conductive layer 110, one end of the first solder connector 300 is fixedly connected to the bottom of the groove 101 and electrically connected to the first conductive layer 110, and the other end of the first solder connector 300 is fixedly connected to the side of the laminate 200 facing the circuit board 100 and electrically connected to the side of the laminate 200 facing the circuit board 100, thereby the first conductive layer 110 and the laminate 200 can be electrically connected through the first solder connector 300. Based on the above configuration, the connection point of the first solder connector 300 is moved from the outer surface of the circuit board 100 to the bottom of the inwardly recessed first groove 101, changing the stress reference position of the first solder connector 300. This can reduce the concentrated tensile and shear stress borne by the first solder connector 300 under temperature alternation and mechanical vibration conditions, reduce the occurrence of cracking and desoldering of the first solder connector 300, and improve the stability of the electrical connection between the circuit board 100 and the laminate 200.

[0014] Under normal conditions of alternating temperature and mechanical vibration, temperature changes will cause thermal expansion and contraction differences between the circuit board 100 and the laminate 200, while mechanical vibration and bending will cause relative oscillation displacement between the circuit board 100 and the laminate 200. If the first solder connector 300 is directly placed on the outer surface of the circuit board 100, the thermal stress generated by thermal expansion and contraction and the reciprocating shear stress caused by relative oscillation will continuously concentrate on the first solder connector 300, which is prone to causing solder joint cracking and failure under long-term action. Setting the fixing point of the first solder connector 300 at the bottom of the inwardly recessed first groove 101 can shorten the length of the support section of the first solder connector 300 between the circuit board 100 and the laminate 200, reduce the bending deformation amplitude of the first solder connector 300 during relative displacement, and thus reduce the concentrated stress borne by the first solder connector 300. This reduces the occurrence of cracking and desoldering of the first solder connector 300 and improves the stability of the electrical connection between the circuit board 100 and the laminate 200.

[0015] It is understandable that the solder connector is prone to fatigue cracking if it is directly placed on the flat surface of the circuit board 100. The first solder connector 300 is accommodated in the first groove 101 to shorten the support section and reduce bending deformation.

[0016] For example, the stacked component 200 can be a frame board or a chip. The first groove 101 can be formed by laser engraving, fixed-depth drilling, or fixed-depth milling. The depth of the first groove 101 can be flexibly adjusted according to the size of the first solder connector 300 and the specifications of the stacked component 200. The bottom of the first groove 101 exposes the first conductive layer 110 of the circuit board 100, realizing electrical conduction between the first solder connector 300 and the circuit board 100.

[0017] For example, the first conductive layer 110 may be a copper layer within a circuit board.

[0018] like Figure 1 As shown, in some embodiments of this application, a shielding layer 120 is provided in the first groove 101, the shielding layer 120 is electrically connected to the grounding structure of the circuit board 100, and the shielding layer 120 is provided around the first solder connector 300.

[0019] In the above embodiment, a shielding layer 120 is arranged inside the first groove 101, the shielding layer 120 is connected to the grounding structure of the circuit board 100, and the shielding layer 120 surrounds the first solder connector 300. The first solder connector 300 serves as a signal transmission channel between the circuit board 100 and the laminate 200. During operation, it is prone to radiating electromagnetic interference and is easily affected by external electromagnetic noise in terms of transmission quality. The grounded shielding layer 120 is arranged around the outer periphery of the first solder connector 300, which can form a continuous grounded shielding barrier on the outside of the first solder connector 300. On the one hand, it blocks the first solder connector 300 from radiating electromagnetic signals, and on the other hand, it isolates external electromagnetic interference from intruding into the first solder connector 300, thereby improving the stability of signal transmission inside the first solder connector 300.

[0020] like Figure 1 As shown, in some embodiments of this application, the shielding layer 120 includes a metal layer disposed on the sidewall of the first groove 101, the shielding layer 120 extending along the sidewall of the first groove 101 and surrounding the first solder connector 300.

[0021] In the above embodiment, the shielding layer 120 is a metal layer attached to the sidewall of the first groove 101. The metal layer extends along the sidewall of the first groove 101 and circumferentially surrounds the first solder connector 300. The shielding layer 120 is directly formed on the sidewall of the first groove 101, eliminating the need for additional independent shielding components and simplifying the overall assembly process of the electronic device 10. The metal layer, which extends continuously along the sidewall, can achieve a seamless 360-degree surround of the first solder connector 300, eliminating shielding blind spots and further improving the electromagnetic isolation capability of the shielding layer 120.

[0022] For example, the shielding layer 120 can be formed by a side copper plating process.

[0023] For example, the metal layer constituting the shielding layer 120 may be a conductive metal layer such as a copper layer or a silver layer.

[0024] like Figure 1 As shown, in some embodiments of this application, the bottom of the first groove 101 exposes the first conductive layer 110, and the first solder connector 300 is fixedly connected to the first conductive layer 110.

[0025] In the above embodiment, the bottom of the first groove 101 exposes the first conductive layer 110, and the first solder connector 300 is fixedly connected to the surface of the first conductive layer 110. The exposure of the bottom of the first groove 101 to the first conductive layer 110 enables the first solder connector 300 to form a large-area direct soldering contact with the first conductive layer 110, reducing the connection contact impedance and ensuring the reliability of signal transmission from the circuit board 100 to the laminate 200 through the first conductive layer 110 and the first solder connector 300.

[0026] For example, when the first conductive layer 110 is electrically connected to the grounding structure of the circuit board 100 and is used to conduct grounding signals, the shielding layer 120 extends to connect with the first conductive layer 110 to achieve common ground. At this time, the ground potential can completely surround the first solder connector 300, and the shielding effect is optimal. When the first conductive layer 110 is used to conduct non-grounded signals, the shielding layer 120 and the first conductive layer 110 are spaced apart to form an insulating gap to avoid short circuit between the shielding layer 120 and the first conductive layer 110. At the same time, the shielding layer 120 can still be arranged around the first solder connector 300 to continuously play the electromagnetic shielding role.

[0027] like Figure 1 As shown, in some embodiments of this application, the electronic device 10 further includes:

[0028] A filler 400 is filled in the first groove 101 and covers at least part of the first solder connector 300.

[0029] In the above embodiment, the filler 400 is completely filled inside the first groove 101, and the filler 400 covers at least a portion of the first solder connector 300. The filler 400 can form an integrated bonding structure with the circuit board 100, the first solder connector 300, and the laminate 200. On the one hand, the filler 400 can absorb the vibration energy generated by mechanical vibration and buffer the shear force applied to the first solder connector 300 when the circuit board 100 and the laminate 200 swing relative to each other, further reducing the fatigue stress caused by vibration. On the other hand, the filler 400 can constrain the deformation amplitude of the first solder connector 300, share the thermal stress generated by temperature alternation, and avoid all stress being concentrated on the first solder connector 300, which can further reduce the risk of cracking and desoldering of the first solder connector 300 and strengthen the connection strength between the circuit board 100 and the laminate 200.

[0030] For example, the filler 400 is a bottom filler. The filler 400 fills into the first groove 101 to form an anchoring structure, which increases the contact area with the circuit board 100, the first solder connector 300, and the laminate 200, and improves the resistance to external forces and thermal cycling.

[0031] like Figure 1 As shown, in some embodiments of this application, at least a portion of the laminate 200 is located within the first groove 101, and the filler 400 encapsulates the first solder connector 300 and at least a portion of the laminate 200; or

[0032] The first solder connector 300 is located inside the first groove 101, the filler 400 wraps around the first solder connector 300, and the laminate 200 is located outside the first groove 101.

[0033] In the above embodiment, at least a portion of the laminate 200 extends into the first groove 101. The filler 400 simultaneously wraps the first solder connector 300 and the portion of the laminate 200 extending into the groove. The contact area between the filler 400 and the laminate 200, the circuit board 100, and the first solder connector 300 is significantly increased, forming a deep anchoring structure. When the electronic device 10 is subjected to compression, drop, or continuous vibration, the filler 400 can simultaneously constrain the portion of the laminate 200 extending into the groove, reducing the relative offset between the laminate 200 and the circuit board 100, further reducing the bending deformation of the first solder connector 300, and more effectively dispersing thermal stress and mechanical shear stress, which is beneficial for ensuring the reliability of interlayer electrical connections in the long term.

[0034] In the above embodiment, the laminate 200 is arranged entirely outside the first groove 101, with only the first solder connector 300 housed inside the first groove 101. The filler 400 fills the inside of the first groove 101 and completely covers the first solder connector 300. The filler 400 completely covers the first solder connector 300, which can buffer the thermal expansion and contraction forces caused by temperature changes, absorb the vibration energy generated during mechanical vibration, limit the deformation amplitude of the first solder connector 300, continuously disperse the concentrated tensile and shear stress borne by the first solder connector 300, and reduce the phenomenon of cracking and desoldering of the first solder connector 300.

[0035] It is understandable that, compared to the structure in which at least part of the stacked component 200 extends into the first groove 101, there is no interlocking relationship between the stacked component 200 and the first groove 101, which can accommodate more types of stacked components 200 and has a larger assembly tolerance.

[0036] like Figure 1 As shown, in some embodiments of this application, the laminate 200 includes a frame stacked with the circuit board 100, and the electronic device 10 also includes electronic components mounted on the laminate 200 and / or the circuit board 100.

[0037] The laminate 200 has a mounting cavity 201 for accommodating electronic components on the side facing the circuit board 100; the bottom of the mounting cavity 201 is opposite to the first side of the circuit board 100.

[0038] A second groove 202 communicating with the mounting cavity 201 is provided at the bottom of the cavity, and electronic components are disposed in the second groove 202; and / or,

[0039] The first side of the circuit board 100 has a third groove 102 that communicates with the mounting cavity 201, and the electronic components are disposed in the third groove 102.

[0040] In the above embodiment, the stacked component 200 is a frame plate stacked with the circuit board 100. The stacked component 200 has a mounting cavity 201 on the side facing the circuit board 100. The mounting cavity 201 is used to accommodate electronic components. The bottom of the mounting cavity 201 is directly opposite the first side of the circuit board 100. The bottom of the mounting cavity 201 is provided with a communicating second groove 202, and the first side of the circuit board 100 is provided with a communicating third groove 102. The electronic components can be selectively accommodated in the second groove 202 or the third groove 102.

[0041] By providing an inwardly recessed mounting cavity 201, a second groove 202, and a third groove 102 between the laminate 200 and the circuit board 100, electronic components can be housed within the interlayer space formed by the laminate 200 and the circuit board 100, eliminating the need to occupy additional external assembly space for the electronic device 10. This effectively reduces the overall thickness of the electronic device 10, achieving a miniaturized design. Simultaneously, the second groove 202 and the third groove 102 can limit the movement of electronic components, preventing lateral displacement under vibration or drop conditions and ensuring stable assembly positions. The two groove arrangements can be flexibly selected to accommodate electronic components of different sizes and installation positions, improving the overall structural versatility.

[0042] It is understandable that in related technologies, the height of the mounting cavity is limited by the tallest electronic component, which increases the overall thickness of the device; however, in the embodiments of this application, the provision of the second groove 202 and the third groove 102 enables the electronic components to meet the safe spacing without thickening the mounting cavity 201.

[0043] like Figure 1 As shown, in some embodiments of this application, the laminate 200 includes a frame stacked with the circuit board 100, and the electronic device 10 further includes electronic components mounted on the laminate 200 and / or the circuit board 100; the laminate 200 has a mounting cavity 201 for accommodating the electronic components on the side facing the circuit board 100; the electronic components include:

[0044] The first element 500 is at least partially housed in the mounting cavity 201, and the first element 500 is disposed on the side of the laminate 200 facing the circuit board 100;

[0045] The second element 600 is at least partially housed in the mounting cavity 201, and the second element 600 is disposed on the side of the circuit board 100 facing the laminate 200;

[0046] The laminate 200 and the circuit board 100 are stacked along a first direction, the first element 500 and the second element 600 are arranged opposite each other in the first direction, and an assembly gap is provided between the first element 500 and the second element 600, which is greater than a preset safety gap.

[0047] In the above embodiments, both the first component 500 and the second component 600 are at least partially housed inside the mounting cavity 201 and are arranged opposite to each other along the first direction in which the laminate 200 and the circuit board 100 are stacked, with an assembly gap between them that is larger than a preset safety gap. Under conditions of temperature fluctuations, mechanical vibration, and bending, the laminate 200 and the circuit board 100 of the electronic device 10 are prone to slight relative deformation and proximity displacement. By setting the assembly gap between the first component 500 and the second component 600 to be larger than the preset safety gap, the risks of component contact, compression, and collision caused by deformation under operating conditions can be effectively avoided, preventing physical damage or electrical short circuits between the first component 500 and the second component 600. Based on the above configuration, there is no need to increase the stacking thickness between the laminate 200 and the circuit board 100, ensuring the assembly safety and operational reliability of the internal components of the electronic device 10 while maintaining the thin and light structural design of the electronic device 10.

[0048] Figure 1 In the diagram, the direction indicated by arrow W is the first direction, and the double-headed arrow C is used to indicate the assembly gap between the first component 500 and the second component 600.

[0049] Schematic illustration: the first component 500 is disposed within the second groove 202, and the second component 600 is arranged to conform to the first side plane of the circuit board 100. The second groove 202 forms a recessed limiting and fixing of the first component 500, preventing the first component 500 from shifting or tilting. With the help of a preset safety gap, it can stably maintain the insulation distance between the first component 500 and the second component 600, which is suitable for assembly scenarios of large-sized and thick first components 500.

[0050] Schematic illustration: The second component 600 is disposed within the third groove 102, and the first component 500 is arranged in a plane facing the side of the laminate 200 toward the circuit board 100. The third groove 102 can provide a recessed limiting fixation for the second component 600, preventing the second component 600 from shifting or tilting. With the help of a preset safety gap, it can stably maintain the insulation distance between the first component 500 and the second component 600, adapting to assembly scenarios of large-sized and thick second components 600.

[0051] Schematic illustration: neither the first component 500 nor the second component 600 is located inside the recess. The first component 500 is flatly mounted on the bottom plane of the mounting cavity 201, and the second component 600 is flatly mounted on the first side plane of the circuit board 100. This arrangement eliminates the need for limiting assembly using the second recess 202 and the third recess 102, resulting in greater structural adaptability. It can accommodate miniaturized, surface-mount first component 500 and second component 600, and the assembly process is simpler and more universal.

[0052] Schematic illustration: The preset safety gap is set differently based on the size and package type of the first component 500 and the second component 600. The preset safety gap between the first component 500 and the second component 600 for small surface mount components is 0.05mm; the preset safety gap between the first component 500 and the second component 600 for conventional chip components is 0.1mm; and the preset safety gap between the first component 500 and the second component 600 for large-size, high-thickness, high-power components is 0.15mm. Different specifications of electronic components have different deformation offsets and body heights. Setting matching preset safety gaps ensures stable isolation between the first component 500 and the second component 600, preventing short circuits and damage from impacts, while avoiding unrestricted increases in the overall thickness of the stacked components 200, thus balancing the overall thinness of the device with the safety of component operation.

[0053] like Figure 1 As shown, in some embodiments of this application, the laminate 200 includes: a second conductive layer 210, a dielectric layer 220 and a third conductive layer 230, with the dielectric layer 220 sandwiched between the second conductive layer 210 and the third conductive layer 230.

[0054] The dielectric layer 220 has a first through hole 203 and at least one second through hole 204 spaced apart. Both the first through hole 203 and the second through hole 204 penetrate the dielectric layer 220. The first through hole 203 is provided with a conductive connector 810 electrically connected to the second conductive layer 210 and / or the third conductive layer 230. The second through hole 204 is provided with a grounding connector 820 electrically connected to the grounding structure of the laminate 200. At least one second through hole 204 is arranged around the first through hole 203.

[0055] In the above embodiment, the dielectric layer 220 is sandwiched between the second conductive layer 210 and the third conductive layer 230, forming a layered substrate structure of the laminate 200. A first through-hole 203 and a second through-hole 204 are formed on the dielectric layer 220, arranged at intervals, both of which completely penetrate the dielectric layer 220. A conductive connector 810 is disposed inside the first through-hole 203, enabling simultaneous conduction of one or both of the second conductive layer 210 and the third conductive layer 230, serving as a signal transmission channel within the laminate 200. A grounding connector 820 is disposed inside the second through-hole 204 and electrically connected to the grounding structure of the laminate 200. At least one second through-hole 204 is arranged around the first through-hole 203, forming a ring-shaped grounding shield loop around the conductive connector 810. The conductive connector 810 is prone to radiating electromagnetic interference during signal transmission and is also susceptible to transmission quality issues caused by external electromagnetic clutter. The surrounding grounding connector 820 forms a complete grounding shield, which on the one hand blocks the conductive connector 810 from radiating electromagnetic signals, and on the other hand isolates external electromagnetic interference from entering the conductive connector 810, reducing signal crosstalk and improving the signal transmission stability within the laminate 200. The dielectric layer 220 isolates the second conductive layer 210 and the third conductive layer 230, preventing abnormal short circuits between them and ensuring that the conductive connector 810 and the grounding connector 820 operate independently.

[0056] Schematic illustration: only a single second through hole 204 is provided. The second through hole 204 is an annular hole. The single second through hole 204 is arranged around the first through hole 203 and surrounds the first through hole 203.

[0057] Schematic representation: three or more second through holes 204 are provided, all of which are arranged at intervals along the circumference of the first through hole 203, and there are gaps between adjacent second through holes 204.

[0058] like Figure 2 As shown, in some embodiments of this application, the electronic device 10 further includes:

[0059] The second solder connector 700 has one end fixedly connected to the first side of the circuit board 100 and located outside the first groove 101. The second solder connector 700 is electrically connected to the circuit board 100. The other end of the second solder connector 700 is fixedly connected to the side of the laminate 200 facing the circuit board 100 and is electrically connected to the laminate 200. The volume of the first solder connector 300 is larger than the volume of the second solder connector 700.

[0060] In the above embodiment, the second solder connector 700 is disposed outside the first groove 101. Both ends of the second solder connector 700 are fixed to the corresponding sides of the circuit board 100 and the laminate 200, respectively, and electrically connected. It cooperates with the first solder connector 300 housed inside the first groove 101 to form a layered interconnect structure. The first groove 101 recesses and houses the first solder connector 300, reducing the interlayer height margin occupied by the first solder connector 300. The first solder connector 300 has a larger volume, a larger conductive cross-sectional area, and stronger current carrying capacity. It can also withstand greater thermal and shear stresses, making it suitable for high-power main signal paths. The smaller second solder connector 700 occupies less interlayer space and is suitable for low-current ordinary signal traces. This partitioned arrangement ensures the reliability of high-power path connections while fully utilizing interlayer planar space, reducing the overall thickness of the electronic device 10.

[0061] Schematic representation: both the first solder connector 300 and the second solder connector 700 are solder balls, with the first solder connector 300 having a diameter of 0.3 mm and the second solder connector 700 having a diameter of 0.15 mm.

[0062] Schematic, the first solder connector 300 is housed inside the first groove 101, and the second solder connector 700 is flatly arranged on the first side of the circuit board 100 in the groove-free area.

[0063] Schematic, the first solder connector 300 is arranged in the high-power trace area, and the second solder connector 700 is arranged in the low-speed signal trace area.

[0064] It is understandable that a large-diameter first solder connector 300 is used in high-stress areas, while a small-diameter second solder connector 700 is used in normal areas. The first groove 101 provides space for the solder to avoid short circuits caused by solder connection after adjacent solder joints melt.

[0065] like Figure 2 As shown, in some embodiments of this application, the laminate 200 is an electronic component mounted on the first side of the circuit board 100, and the electronic component includes a first pin 240 and a second pin 250 that are spaced apart and adjacent to each other.

[0066] The first pin 240 is electrically connected to the circuit board 100 through the first solder connector 300, and the second pin 250 is electrically connected to the circuit board 100 through the second solder connector 700.

[0067] In the above embodiment, the laminate 200 is assembled as an integral electronic component on the first side of the circuit board 100. Adjacent to each other, first pins 240 and second pins 250 are arranged on the laminate 200. The first pin 240 achieves electrical connection with the circuit board 100 via a first solder connector 300, and the second pin 250 achieves electrical connection with the circuit board 100 via a second solder connector 700, realizing independent signal transmission between the laminate 200 and the circuit board 100 at two points. Simultaneously, the first groove 101 provides sufficient space for solder, increasing solder usage and strengthening solder joints while effectively preventing short circuits caused by solder connection after adjacent solder joints melt.

[0068] Understandably, the volume of the first solder connector 300 is larger than that of the second solder connector 700. Therefore, the first pin 240 corresponding to the high-power transmission line is matched with the large-volume first solder connector 300 and housed inside the first groove 101. On the one hand, the large-volume solder joint has a larger conductive cross-sectional area, stronger current carrying capacity, and can withstand greater thermal and mechanical stress. On the other hand, the second pin 250 corresponding to the ordinary low-current signal line is matched with the small-volume second solder connector 700 and directly mounted on the planar area of ​​the circuit board 100, saving interlayer stacking space. At the same time, the first pin 240 and the second pin 250 are arranged alternately to further isolate the two types of solder connectors and ensure that the signals of each line do not interfere with each other.

[0069] For example, both the first solder connector 300 and the second solder connector 700 can be solder.

[0070] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0071] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: A circuit board, wherein a first groove is formed on a first side of the circuit board, and the circuit board includes a first conductive layer; A laminated component is disposed on the first side of the circuit board; A first solder connector, one end of which is fixedly connected to the bottom of the first groove; the other end of which is fixedly connected to the side of the laminate facing the circuit board; the first solder connector is electrically connected to the first conductive layer and the laminate, respectively, to electrically connect the circuit board and the laminate.

2. The electronic device according to claim 1, characterized in that, A shielding layer is provided in the first groove, and the shielding layer is electrically connected to the grounding structure of the circuit board. The shielding layer is arranged around the first solder connector.

3. The electronic device according to claim 2, characterized in that, The shielding layer includes a metal layer disposed on the sidewall of the first groove, the shielding layer extending along the sidewall of the first groove and surrounding the first solder connector.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The bottom of the first groove exposes the first conductive layer, and the first solder connector is fixedly connected to the first conductive layer.

5. The electronic device according to claim 1, characterized in that, Also includes: A filler adhesive is provided, which fills the first groove and covers at least a portion of the first solder connector.

6. The electronic device according to claim 5, characterized in that, At least a portion of the laminate is located within the first groove, and the filler encapsulates the first solder connector and at least a portion of the laminate; or The first solder connector is located inside the first groove, the filler adhesive wraps around the first solder connector, and the laminate is located outside the first groove.

7. The electronic device according to claim 1, characterized in that, The laminate includes a frame stacked with the circuit board, and the electronic device further includes electronic components mounted on the laminate and / or the circuit board; The laminate has a mounting cavity on the side facing the circuit board for accommodating the electronic component; the bottom of the mounting cavity is opposite to the first side of the circuit board. The bottom of the cavity has a second groove communicating with the mounting cavity, and the electronic component is disposed in the second groove; and / or The circuit board has a third groove on its first side that communicates with the mounting cavity, and the electronic component is disposed in the third groove.

8. The electronic device according to claim 1, characterized in that, The laminate is a frame stacked with the circuit board. The electronic device further includes electronic components mounted on the laminate and / or the circuit board. The laminate has a mounting cavity on one side facing the circuit board for accommodating the electronic components. The electronic components include: A first element is at least partially housed in the mounting cavity, and the first element is disposed on the side of the laminate facing the circuit board; A second element is at least partially housed in the mounting cavity, and the second element is disposed on the side of the circuit board facing the laminate; The laminated components and the circuit board are stacked along a first direction, the first element and the second element are arranged opposite to each other in the first direction, and an assembly gap is provided between the first element and the second element, the assembly gap being greater than a preset safety gap.

9. The electronic device according to claim 1, characterized in that, The laminate includes: A second conductive layer, a dielectric layer, and a third conductive layer, wherein the dielectric layer is sandwiched between the second conductive layer and the third conductive layer; The dielectric layer has a first through hole and at least one second through hole spaced apart. Both the first through hole and the second through hole penetrate the dielectric layer. The first through hole has a conductive connector electrically connected to the second conductive layer and / or the third conductive layer. The second through hole has a grounding connector electrically connected to the grounding structure of the laminate. The at least one second through hole is arranged around the first through hole.

10. The electronic device according to claim 1, characterized in that, Also includes: The second solder connector has one end fixedly connected to the first side of the circuit board and located outside the first groove. The second solder connector is electrically connected to the circuit board. The other end of the second solder connector is fixedly connected to the side of the laminate facing the circuit board and electrically connected to the laminate. The volume of the first solder connector is larger than the volume of the second solder connector.

11. The electronic device according to claim 10, characterized in that, The laminate is an electronic component mounted on a first side of the circuit board, and the electronic component includes a first pin and a second pin that are spaced apart and adjacent to each other; The first pin is electrically connected to the circuit board via the first solder connector, and the second pin is electrically connected to the circuit board via the second solder connector.

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