Liquid discharge head and liquid discharge apparatus

Abstract

The liquid discharge head includes a nozzle plate, a pressure chamber base plate, a piezoelectric element, and a heater. The nozzle plate has a nozzle. The pressure chamber base plate is disposed on the nozzle plate. The pressure chamber base plate has a pressure chamber communicating with the nozzle. The piezoelectric element is disposed on the portion of the nozzle plate facing the pressure chamber. The piezoelectric element surrounds the nozzle and is driven to deform the nozzle plate, causing liquid in the pressure chamber to be discharged from the nozzle in the liquid discharge direction. The heater is disposed on the portion of the nozzle plate facing the pressure chamber. The heater surrounds the nozzle to heat the liquid in the pressure chamber.

Description

Technical Field

[0001] This disclosure relates to a liquid discharge head and a liquid discharge device. Background Technology

[0002] In the prior art, a liquid discharge head drives a piezoelectric element to discharge liquid from a nozzle. Patent Document 1 describes a liquid discharge head that discharges molten solder from a nozzle to form solder bumps on, for example, a semiconductor chip. A piezoelectric element is disposed on a opposing wall of a pressure chamber opposite to the nozzle forming wall, and molten solder is discharged from the nozzle by vibrating the opposing wall. A heater is disposed on a cover covering the liquid discharge head to heat the solder inside the liquid discharge head to a temperature equal to or higher than the melting temperature.

[0003] List of cited references

[0004] Patent documents

[0005] [Patent Document 1] Japanese Patent No. 4138266 Summary of the Invention

[0006] Technical issues

[0007] However, the materials that can be discharged in Patent Document 1 may be limited. Furthermore, the need for a large-capacity heater could lead to a larger-scale device.

[0008] Solution to the problem

[0009] A liquid discharge head includes a nozzle plate, a pressure chamber base plate, a piezoelectric element, and a heater. The nozzle plate has a nozzle. The pressure chamber base plate is disposed on the nozzle plate. The pressure chamber base plate has a pressure chamber communicating with the nozzle. The piezoelectric element is disposed on the portion of the nozzle plate facing the pressure chamber. The piezoelectric element surrounds the nozzle and is driven to deform the nozzle plate, causing liquid in the pressure chamber to be discharged from the nozzle in a liquid discharge direction. The heater is disposed on the portion of the nozzle plate facing the pressure chamber. The heater surrounds the nozzle to heat the liquid in the pressure chamber.

[0010] Effects of the present invention

[0011] According to one aspect of this disclosure, the liquid discharge head (device) can discharge materials with high melting temperatures and can be miniaturized. Attached Figure Description

[0012] A more complete understanding of the embodiments of the present disclosure and its many incidental advantages and features can be readily obtained and understood from the following detailed description with reference to the accompanying drawings.

[0013] [ Figure 1 ]

[0014] Figure 1 This is a schematic three-dimensional view of the nozzle surface of the liquid discharge head.

[0015] [ Figure 2 ]

[0016] Figure 2 It is along Figure 1 A cross-sectional view of line AA.

[0017] [ Figure 3A and Figure 3B ]

[0018] Figure 3A and Figure 3B These are stylized diagrams representing the heating elements of the heaters.

[0019] [ Figure 4 ]

[0020] Figure 4 This is a block diagram representing the timing of the heater's temperature control.

[0021] [ Figure 5 ]

[0022] Figure 5 It is a cross-sectional view of the liquid discharge head based on the modified example.

[0023] [ Figure 6 ]

[0024] Figure 6 This diagram illustrates the process of forming a wiring layer and a diaphragm on a flow path substrate.

[0025] [ Figure 7 ]

[0026] Figure 7 This is a diagram showing the process of forming the heater.

[0027] [ Figure 8 ]

[0028] Figure 8 This diagram illustrates the process of forming the first electrode layer, the piezoelectric layer, and the second electrode layer.

[0029] [ Figure 9 ]

[0030] Figure 9 This diagram illustrates the process of forming the first insulating film.

[0031] [ Figure 10 ]

[0032] Figure 10 This is a diagram showing the process of forming multiple contacts.

[0033] [ Figure 11 ]

[0034] Figure 11 This is a diagram showing the process of forming the lead wire.

[0035] [ Figure 12 ]

[0036] Figure 12 This diagram illustrates the process of forming the second insulating film.

[0037] [ Figure 13 ]

[0038] Figure 13 This diagram illustrates the process of forming the nozzle forming section.

[0039] [ Figure 14 ]

[0040] Figure 14 This is a diagram illustrating the nozzle forming process.

[0041] [ Figure 15 ]

[0042] Figure 15 This is a diagram showing the process of forming a pressure chamber.

[0043] [ Figure 16 ]

[0044] Figure 16 This is a diagram of a printer.

[0045] [ Figure 17 ]

[0046] Figure 17 This is a schematic floor plan of part of another printer.

[0047] [ Figure 18 ]

[0048] Figure 18 yes Figure 17 A schematic side view of a portion of a printer.

[0049] [ Figure 19 ]

[0050] Figure 19 This is a schematic plan view of a part of the liquid discharge unit.

[0051] [ Figure 20 ]

[0052] Figure 20 This is a schematic front view of part of another liquid discharge unit.

[0053] The accompanying drawings are intended to illustrate embodiments of this disclosure and should not be construed as limiting its scope. Unless explicitly stated otherwise, the drawings should not be considered to be drawn to scale. Furthermore, throughout several views, the same or similar reference numerals denote the same or similar parts. Detailed Implementation

[0054] In describing the embodiments shown in the accompanying drawings, specific terminology has been used for clarity. However, the disclosure of this specification is not intended to be limited to the specific terminology chosen, and it should be understood that each particular component includes all technical equivalents that have similar functionality, operate in a similar manner, and achieve similar results.

[0055] Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0056] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be understood that those skilled in the art can readily modify and alter this disclosure to form other embodiments within the scope of the appended claims, and such modifications and alterations are included within the scope of the appended claims. The following embodiments are illustrative and do not limit the scope of the appended claims.

[0057] Figure 1 This is a schematic three-dimensional view of the nozzle surface of the liquid discharge head. Figure 2 It is along Figure 1 A cross-sectional view of line AA.

[0058] The liquid discharge head 1 includes a nozzle plate 110 and a pressure chamber base plate 100. The nozzle plate 110 is a thin film and includes a plurality of nozzles 2 for discharging liquid, a piezoelectric element 5 arranged in annular shape as an electromechanical conversion element around each nozzle 2, and a heater 20.

[0059] The pressure chamber substrate 100 has multiple pressure chambers 4, which can be referred to as individual liquid chambers or pressurization chambers. The multiple pressure chambers 4 are respectively connected to multiple nozzles 2. A nozzle 2 and a vibrating diaphragm 103 are arranged on one side of the pressure chamber 4, and an opening 4a of the pressure chamber 4 is arranged on the other side of the pressure chamber 4.

[0060] The nozzle plate 110 and the pressure chamber substrate 100 are formed and processed using semiconductor manufacturing technology. The pressure chamber 4, nozzle 2, piezoelectric element 5, and heater 20 are mounted at a high density at the semiconductor wafer level.

[0061] The pressure chamber substrate 100 is an SOI (Silicon On Insulator) substrate. The pressure chamber substrate 100 has a driving circuit and a wiring layer 102 on the side where the diaphragm 103 is formed. The driving circuit includes transistors and resistors. The wiring layer 102 includes wiring for applying a driving waveform to the first electrode 51 and wiring for applying a driving waveform to the second electrode 53. The wiring layer 102 also includes wiring for applying voltage to the heating element 21 of the heater 20 and wiring for applying voltage to the temperature sensor 22 for detecting the temperature of the heater 20.

[0062] By forming the drive circuit on the pressure chamber substrate 100, the process of mounting the drive circuit on other substrates can be omitted, the area of ​​the external connection portion can be reduced, and the liquid discharge head 1 can be miniaturized. When the pressure chamber substrate 100 does not have a built-in drive circuit, but an opening is formed on the nozzle plate 110 and the drive control is performed from the outside, the pressure chamber substrate 100 can also be a silicon substrate without the wiring layer 102.

[0063] The nozzle plate 110 includes a nozzle forming portion (film) 111. A plurality of nozzles 2 are formed in the nozzle forming portion 111, and the piezoelectric element 5 is covered by the nozzle forming portion 111. A hydrophobic film may also be formed on the nozzle surface of the nozzle forming portion 111.

[0064] When liquid is continuously discharged, the mist generated simultaneously with the liquid discharge adheres to the nozzle surface. When a large amount of mist adheres to the nozzle surface, the liquid discharged from nozzle 2 may be affected by the liquid adhering to the nozzle surface and may deviate from the desired landing position. The hydrophobic film on the nozzle surface prevents liquid from adhering to the nozzle surface. Therefore, the liquid discharged from nozzle 2 is not affected by the liquid adhering to the nozzle surface.

[0065] The piezoelectric element 5 of the nozzle plate 110 has a first electrode 51, a piezoelectric body 52, and a second electrode 53. The first electrode 51 can be referred to as the lower electrode, and the second electrode 53 can be referred to as the upper electrode. The piezoelectric element 5 is covered by a first insulating film 8a. The first insulating film 8a has: a hole-shaped third contact 7c that electrically connects the first electrode 51 to the first lead 9a; and a hole-shaped fourth contact 7d that electrically connects the second electrode 53 to the second lead 9b.

[0066] The first lead 9a is disposed on the first insulating film 8a and electrically connects the first electrode 51 of the piezoelectric element 5 to the wiring layer 102 of the pressure chamber substrate 100. The second lead 9b is disposed on the first insulating film 8a and electrically connects the second electrode 53 of the piezoelectric element 5 to the wiring layer 102 of the pressure chamber substrate 100.

[0067] The first lead 9a is electrically connected to the first electrode 51 via the third contact 7c, and is also electrically connected to the wiring layer 102 via the first contact 7a. The second lead 9b is electrically connected to the second electrode 53 via the fourth contact 7d, and is also electrically connected to the wiring layer 102 via the second contact 7b. The first lead 9a and the second lead 9b are covered by a second insulating film 8b. In this embodiment, the second insulating film 8b also covers the piezoelectric element 5 to prevent moisture that has entered the resin nozzle forming portion 111 from reaching the piezoelectric element 5, thus protecting the piezoelectric element 5.

[0068] Lead-out wiring portions can be provided on the first electrode 51 and the second electrode 53 respectively, and directly electrically connected to the wiring layer 102 via contacts formed on the vibrating diaphragm 103. Alternatively, a contact improvement film for ensuring a tight seal with the nozzle forming portion 111 can be formed on the second insulating film 8b.

[0069] The heater 20 is disposed between the vibrating diaphragm 103 and the piezoelectric element 5, and includes a heating element 21, a temperature sensor 22, and an insulating film 23. Materials for the heating element 21 include, for example, molybdenum (Mo) and platinum (Pt). By using Mo or Pt as the heating element 21, efficient heating with high resistivity can be achieved.

[0070] The outer end of the heating element 21 (the position furthest from the nozzle 2) is located at approximately the same position as the outer end of the first electrode 51, which has the largest area of ​​the piezoelectric element 5. Therefore, the heating area of ​​the heater 20 is the maximum area of ​​the piezoelectric element 5 (i.e., equal to the area of ​​the first electrode 51), corresponding to the cross-sectional area of ​​the pressure chamber 4 on the plane orthogonal to the liquid discharge direction. Thus, the liquid inside the pressure chamber 4 can be heated uniformly.

[0071] Furthermore, when the temperature sensor 22 is formed of Pt, by using Pt as the material of the heating element 21, the heating element 21 and the temperature sensor 22 can be formed simultaneously on the same surface (i.e., the same layer of the nozzle plate 110). By using Pt as the temperature sensor 22, the temperature can be detected using the positive temperature coefficient of Pt. Therefore, the heater 20 can be controlled based on the temperature detected by the temperature sensor 22, enabling high-precision temperature control. The heater 20 has a thickness of 1 μm and is formed using a thin-film forming process.

[0072] In the liquid discharge head of this embodiment, a metallic material such as solder, a material that is solid at room temperature such as wax ink, or a liquid with high viscosity at room temperature such as ultraviolet (UV) ink is used as the discharge material discharged from the nozzle 2. Specifically, the discharge material that is solid at room temperature is heated to a temperature above its melting point, and the liquid that is high in viscosity at room temperature is heated to a temperature above a temperature at which its viscosity becomes below a specified viscosity, and then discharged from the nozzle 2. As described above, by providing the heater 20 on the nozzle plate 110, the discharge material in the pressure chamber 4 can be melted or reduced in viscosity. As a result, the material (liquid) can be discharged well from the nozzle 2. In addition, since the nozzle plate 110 can be heated, the liquid adhering to the nozzle surface can be prevented from solidifying.

[0073] The heater 20 may also be formed on the partition wall of the pressure chamber substrate 100 that divides the pressure chamber 4.

[0074] Therefore, compared to a structure in which a heater is formed only on the nozzle plate 110, the discharged material in the pressure chamber 4 can be maintained at a temperature above the melting temperature or at a temperature below the specified viscosity.

[0075] Figure 3A and Figure 3B These are schematic diagrams representing the heating elements 21 of the heater 20.

[0076] like Figure 3A As shown, the heating element 21 is patterned in a vortex shape. Alternatively, as... Figure 3B As shown, the entire surface of the heater 20 at the position corresponding to the pressure chamber 4 can be used as the heating element 21. Figure 3A In the structure shown, with Figure 3B Compared to the structure shown, the heating efficiency is lower, but compared to Figure 3B Compared to the structure shown, the thickness of the vibrating portion of the diaphragm 103 can be locally reduced, thus increasing the displacement of the diaphragm 103. On the other hand, when... Figure 3B When the entire surface of the heater 20 shown is the heating element 21 at the position corresponding to the pressure chamber 4, it is in harmony with... Figure 3A Compared to the vortex pattern shown, heating efficiency can be improved.

[0077] like Figure 3A and Figure 3B As shown, the temperature sensor 22 is closer to the nozzle 2 than the heating element 21, and is patterned as a ring.

[0078] Multiple annular heating elements 21 can also be formed in a concentric circle. These multiple heating elements 21 can be controlled individually. For example, during head cleaning, only the heating element 21 near the nozzle 2 can generate heat to melt and remove the liquid solidified near the nozzle 2.

[0079] Figure 4 This is a block diagram representing the timing of temperature control for heater 20.

[0080] like Figure 4 As shown, temperature sensor 22 inputs the output value (current value) corresponding to the temperature of the controlled liquid in pressure chamber 4 (or nozzle 2) as an observed value to input unit 25c of temperature regulator 25. Based on the observed value of temperature sensor 22 input to input unit 25c, the temperature of the liquid in pressure chamber 4 (or nozzle 2) is detected, and the detected temperature is compared with the target temperature in comparison unit 25d. Then, comparison unit 25d calculates the difference between the target temperature and the detected temperature, and outputs this difference to adjustment unit 25a. Adjustment unit 25a sets the power value (operational quantity) input to heating unit 21, which is the operation unit, through PID (Proportional-Integral-Derivative) control. Then, the power value as the operation quantity is input to heating unit 21 via output unit 25b, and the liquid in pressure chamber 4, which is the control target, is controlled to the desired temperature.

[0081] The piezoelectric element 52 is heated by the heater 20, causing its temperature to rise. When the discharged material is a metallic material such as solder, the discharged material (liquid) in the pressure chamber 4 is maintained at a temperature of approximately 220°C or higher by the heater 20. Therefore, the temperature of the heating element 21 of the heater 20 becomes 300°C or higher. As a result, the piezoelectric element 52 of the nozzle plate 110 is exposed to a high temperature of at least 220°C.

[0082] Lead titanium zirconate (PZT), used as an electrostrictive material for the piezoelectric element of inkjet printheads, is widely used due to its excellent piezoelectric properties. PZT is a strong dielectric, possessing locally charged electric dipoles even without an externally applied electric field. However, strong dielectrics like PZT depolarize at temperatures above 200°C, losing their piezoelectricity and failing to undergo displacement.

[0083] Therefore, aluminum nitride (AlN) is used as the electrostrictive material for the piezoelectric element 52. Since the displacement of AlN does not change even at high temperatures, the piezoelectric element 52 can be driven well even when exposed to temperatures above 220°C.

[0084] Furthermore, a nozzle vibration method is employed whereby a piezoelectric element 5 is disposed on the nozzle plate 110. By utilizing the piezoelectric element 5 of the nozzle plate 110, the pressure of the liquid within the pressure chamber 4 is changed, thereby causing the liquid within the pressure chamber 4 to be discharged from the nozzle 2. In this nozzle vibration system, compared to a typical single-piezoelectric type piezoelectric head (which vibrates the surface of the pressure chamber opposite to the wall of the communication port (nozzle communication wall) that communicates with the nozzle to discharge liquid), droplets can be discharged with less power. Therefore, even when using AlN, which has a smaller displacement compared to PZT, as the electrostrictive material of the piezoelectric element 52, liquid discharge is still achieved effectively.

[0085] Therefore, even discharge materials with high melting temperatures, such as solder, can be melted and discharged. In devices using electrostrictive materials with low heat resistance, for example, the piezoelectric element 52 is insulated from the heat or molten discharge material from the heater 20 using an insulating material, so that the piezoelectric element 52 does not become overheated. Devices using AlN with high heat resistance can be miniaturized without the need for an insulating material.

[0086] Furthermore, by using AlN, which has high heat resistance and whose displacement does not change even at high temperatures, as the electrostrictive material of the piezoelectric body 52, a heater 20 can be formed on the nozzle plate 110. This allows for efficient heating of the discharged material within the pressure chamber 4, maintaining the discharged material within the pressure chamber 4 above its melting temperature with a relatively small heater capacity. Therefore, the power consumption of the equipment can be reduced. Additionally, the heater 20 can be miniaturized, preventing the equipment from becoming too large.

[0087] Furthermore, the nozzle plate 110 and the pressure chamber substrate 100 are formed and processed using semiconductor manufacturing technology, and the pressure chamber 4, nozzle 2, piezoelectric element 5, and heater 20 are mounted in a thin film form with high density at the semiconductor wafer level. Therefore, the liquid discharge head can be miniaturized, and its heat capacity can be reduced. This allows for more efficient heating of the discharged material within the pressure chamber 4.

[0088] AlN, as an electrostrictive material, offers the following advantages. The piezoelectric properties are improved by ensuring consistent crystal orientation in the piezoelectric body 52. ​​Furthermore, an orientation control layer for controlling crystal orientation can be formed between the vibrating membrane 103 and the first electrode 51. When AlN is the electrostrictive material of the piezoelectric body 52, by using AlN as the orientation control layer, the lattice constant of the first electrode 51, which is made of Mo, can be made close to that of AlN. Therefore, the crystal orientation of the piezoelectric body 52 is consistent, thereby improving its piezoelectric properties.

[0089] Furthermore, AlN, comprising at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium, and boron, can also be used as the electrostrictive material of the piezoelectric body 52. ​​Specifically, a portion of the aluminum (Al) in AlN is replaced by at least one of the aforementioned materials. Therefore, AlN can include at least one of the aforementioned materials. Using AlN as an electrostrictive material, wherein a portion of the Al in AlN is replaced by at least one of the aforementioned materials, can enhance the piezoelectric properties. Furthermore, the electrostrictive material of the piezoelectric body 52 is not limited to AlN; any electrostrictive material with high heat resistance and whose displacement does not change even at high temperatures is acceptable.

[0090] Figure 5 It is a cross-sectional view of the liquid discharge head based on the modified example.

[0091] In the liquid discharge head 1a of this modified example, the nozzle plate 110 has a vibrating diaphragm 103, a piezoelectric element 5, and a heater 20 sequentially from the pressure chamber 4 side. In this modified example, since the piezoelectric element 5 is formed on the vibrating diaphragm 103, the vibrating diaphragm 103 can vibrate well, and the displacement of the vibrating diaphragm 103 can be increased.

[0092] On the other hand, Figure 2 In the liquid discharge head 1 shown, compared to the liquid discharge head 1a of this modified example, the heater 20 is closer to the pressure chamber 4, thus enabling efficient heating of the discharged material within the pressure chamber 4. Therefore, the heat generated by the heating element 21 can be reduced, and the discharged material within the pressure chamber 4 can be maintained above the melting temperature or above a temperature at which the viscosity becomes below a specified viscosity, thereby reducing power consumption.

[0093] Alternatively, multiple heaters can be formed on the nozzle plate 110, with the vibrating diaphragm 103, inner heater, piezoelectric element 5, and outer heater arranged sequentially from the pressure chamber 4 side. The outer heater has a heating element only near the nozzle; during nozzle cleaning, the area near the nozzle is heated by the outer heater, thereby melting and removing the liquid solidified near the nozzle.

[0094] The following describes a method for manufacturing a liquid discharge head.

[0095] The liquid discharge head of this embodiment achieves high-density installation at low cost by utilizing semiconductor manufacturing processes to form and process the pressure chamber 4, nozzle 2, piezoelectric element 5, and heater 20.

[0096] Figures 6 to 15 It is a cross-sectional view of the liquid discharge head taken in a direction orthogonal to the arrangement direction of the nozzle orifices, which shows the manufacturing process of the liquid discharge head manufactured by semiconductor manufacturing process.

[0097] like Figure 6As shown, a drive circuit including transistors and resistors, and a wiring layer 102 are formed on a silicon film of the pressure chamber substrate 100, which serves as an SOI substrate. The wiring layer 102 is formed, for example, by an inlay method, forming a silicon dioxide (SiO2) film and patterning it to form trenches, filling the trenches with wiring metal, and covering the wiring metal within the trenches with the SiO2 film. The above process is repeated. Specifically, the wiring metal is planarized by chemical mechanical polishing (CMP), and the SiO2 film formation and patterning are repeated again. As a result, fine wiring with a three-dimensional structure can be formed. Thus, wiring for applying a drive waveform to the first electrode 51 and wiring for applying a drive waveform to the second electrode 53 are formed. In addition, wiring for applying voltage to the heating part 21 of the heater 20 and wiring for applying voltage to the temperature sensor 22 for detecting the temperature of the heater 20 are formed.

[0098] Then, a diaphragm 103 is formed on the surface of the pressure chamber substrate 100 where the wiring layer 102 is formed.

[0099] The diaphragm 103 can be made of a material that has at least electrical insulating properties, such as SiO2, silicon nitride (SiN), metal oxides, or resin. However, the material used for the diaphragm 103 is preferably a material with a low Young's modulus to increase the displacement. Considering the difference in the coefficient of linear expansion between the material and the pressure chamber substrate 100, SiO2, which has a relatively small difference in the coefficient of linear expansion, is most preferably used as the material for the diaphragm 103.

[0100] Next, as Figure 7 As shown, a heater 20 is formed on the vibrating diaphragm 103.

[0101] A Pt film is formed on the vibrating membrane 103 by sputtering, and the Pt film is processed by photolithography and etching to form the heating element 21 and temperature sensor 22 of the heater 20 in a desired pattern. Then, an insulating film 23 is formed to complete the heater 20. Therefore, the heater 20 can be formed in the portion of the nozzle plate 110 surrounding the nozzle 2 and opposite to the pressure chamber 4 (i.e., the nozzle forming wall). The heater 20 can be formed by an inlay method as in the case of the wiring layer 102 described above. Specifically, a SiO2 film is formed and patterned to form trenches, which are filled with Pt. The Pt-filled trenches are covered with SiO2, thereby forming the heater 20 on the vibrating membrane 103.

[0102] After that, as Figure 8 As shown, a first electrode layer 151, a piezoelectric layer 152, and a second electrode layer 153 are formed on the heater 20. The first electrode layer 151 and the second electrode layer 153 are preferably made of metals with low resistance and low reactivity, such as Pt, iridium (Ir), or Mo.

[0103] By using AlN as the electrostrictive material for forming the piezoelectric layer 152, the film formation temperature can be set to below 450°C. When a drive circuit (i.e., a complementary metal-oxide-semiconductor (CMOS) circuit) is formed in the portion corresponding to the wiring layer 102, for example, thermal damage to the transistors and resistors constituting the drive circuit can be prevented.

[0104] The first electrode layer 151 and the second electrode layer 153 can be formed by sputtering or sol-gel method. Since the film formation temperature of the sol-gel method is relatively high, when the drive circuit or wiring part is built into the pressure chamber substrate 100, it is preferable to form the first electrode layer 151 and the second electrode layer 153 by sputtering.

[0105] After film formation, such as Figure 9 As shown, the first electrode layer 151, the piezoelectric layer 152, and the second electrode layer 153 are formed into a desired shape to obtain a piezoelectric element 5 having a first electrode 51, a piezoelectric element 52, and a second electrode 53. The first electrode layer 151, the piezoelectric layer 152, and the second electrode layer 153 are processed by photolithography and etching to obtain the desired shape of the first electrode 51, the piezoelectric element 52, and the second electrode 53. Etching includes wet etching and dry etching, but dry etching is preferred to prevent corrosion of the first electrode 51, the second electrode 53, and the piezoelectric element 52. After dry etching, residues generated by the dry etching process may remain. Therefore, a cleaning process for removing residues may be performed after forming the first electrode 51, the piezoelectric element 52, and the second electrode 53.

[0106] After forming the first electrode 51, the piezoelectric element 52, and the second electrode 53, as follows Figure 9 As shown, a first insulating film 8a is formed. Like the vibrating diaphragm 103, the first insulating film 8a preferably has electrical insulation properties and a low Young's modulus, with a linear expansion coefficient close to that of the other components. Specifically, it is preferably made of the same material as the vibrating diaphragm 103, namely SiO2. Alternatively, to improve reliability, an extremely thin metal oxide can also be used as the material for the first insulating film 8a.

[0107] After the first insulating film 8a is formed, as Figure 10 As shown, the third contact 7c and the fourth contact 7d are formed in the first insulating film 8a by photolithography and etching. In addition, the first contact 7a and the second contact 7b are formed in the form of holes in the insulating film 23 that penetrates the vibrating film 103 and the heater 20.

[0108] Next, as Figure 11As shown, a first lead 9a and a second lead 9b are formed. The materials of the first lead 9a and the second lead 9b are typically Al or an aluminum-copper (Al-Cu) alloy, but precious metals can be used to enhance reliability. Thus, the first lead 9a is electrically connected to the first electrode 51 via the third contact 7c, and is also electrically connected to the wiring layer 102 via the first contact 7a. The second lead 9b is electrically connected to the second electrode 53 via the fourth contact 7d, and is also electrically connected to the wiring layer 102 via the second contact 7b.

[0109] Next, as Figure 12 As shown, a second insulating film 8b is formed to cover the first lead 9a, the second lead 9b, and the piezoelectric element 5. The second insulating film 8b can also be made of SiO2, just like the first insulating film 8a; however, to improve reliability against humidity, SiN, a moisture-resistant material commonly used in semiconductor protective films, is preferred. Since the second insulating film 8b has both electrical insulation and moisture-proof properties, the nozzle plate 110 can be made thinner compared to forming a moisture-proof protective film on the second insulating film 8b.

[0110] Through the above processes, the piezoelectric element 5, which serves as the driving object, can be completed. Thus, the piezoelectric element 5 can be formed on the portion of the nozzle plate 110 surrounding the nozzle 2 and opposite the pressure chamber 4 (i.e., the nozzle forming wall).

[0111] like Figure 13 As shown, a nozzle forming portion 111 is formed, which is used to form the nozzle 2. The nozzle forming portion 111 is formed by spin coating. The material of the nozzle forming portion 111 is preferably a resin that can be coated by spin coating. For example, from the viewpoint of chemical resistance, epoxy resin SU-8 and benzocyclobutene (BCB) are preferred.

[0112] Then, as Figure 14 As shown, nozzle 2 is formed by etching. Nozzle 2 is formed by dry etching.

[0113] Finally, as Figure 15 As shown, the pressure chamber substrate 100 is processed by Si etching to form multiple pressure chambers 4 in the shape of circular holes, thereby completing the liquid discharge head 1.

[0114] With this structure, when the piezoelectric element 5 is driven, the nozzle plate 110 deforms. As a result, the pressure of the liquid in the pressure chamber 4 changes, and the liquid in the pressure chamber 4 is discharged from the nozzle 2 in the liquid discharge direction.

[0115] The liquid discharge device will be described below.

[0116] Figure 16 This is a schematic diagram illustrating the structure of a printer 300, which serves as a liquid dispensing device.

[0117] like Figure 16 As shown, the printer 300 includes a liquid discharge unit 301 and a worktable 320. The liquid discharge unit 301 includes a liquid discharge head 1 and a supply device 302. A substrate 310, serving as a medium, is placed on the worktable 320.

[0118] The liquid discharge head 1 includes a supply chamber base plate having a common chamber 3, which serves as a supply chamber for supplying molten solder (molten metal) to each pressure chamber 4. A heater 3a is provided on the wall of the common chamber 3. The supply device 302 includes a particle loader 302a for loading solder particles. Solder particles are supplied from the particle loader 302a to the common chamber 3. The solder particles supplied to the common chamber 3 are heated by the heater 3a, which acts as a second heater, and melt within the common chamber 3 (i.e., molten solder 303). The supply device 302 may also include a heater to supply molten solder 303 to the common chamber 3.

[0119] Liquid discharge unit 301 can Figure 16 The left and right directions (which can be called the sub-scanning directions) and in relation to Figure 16 The liquid discharge unit 301 moves in the direction orthogonal to the paper (which can be called the main scanning direction). When the liquid discharge unit 301 moves in the main scanning direction and the sub-scanning direction, molten solder 303 (i.e., liquid) is discharged from the nozzle 2, and solder bumps are formed at the desired positions on the substrate 310 on the worktable 320.

[0120] The liquid discharge unit 301 can also discharge liquid (i.e., molten solder 303) from one end to the other in the main scanning direction. With this configuration, the liquid discharge unit 301 can be fixed, and the substrate 310 can be transported in the sub-scanning direction by a conveyor to form solder bumps at the desired positions on the substrate 310.

[0121] In printer 300, solder is used as the ejector material, but solid inks such as wax ink can also be used as the ejector material.

[0122] The following reference Figure 17 and Figure 18 Another printer 500 is described as a liquid discharge device.

[0123] Figure 17 This is a floor plan of part of printer 500. Figure 18 yes Figure 17 A side view of a portion of the printer 500 shown.

[0124] Printer 500 is a serial type device. The carriage 403 reciprocates in the main scanning direction via a main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide 401, a main scanning motor 405, and a timing belt 408. The guide 401 is mounted between the left and right side plates 491A and 491B, holding the carriage 403 in a movable position.

[0125] The main scanning motor 405 causes the carriage 403 to reciprocate in the main scanning direction via a timing belt 408 wound around the drive pulley 406 and the driven pulley 407.

[0126] The carriage 403 is equipped with a liquid discharge unit 440, in which the liquid discharge head 1 and the head tank 441 are configured as a single unit. The liquid discharge head 1 discharges liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K).

[0127] The liquid discharge head 1 is mounted on the liquid discharge unit 440 in a manner in which a nozzle array consisting of multiple nozzles 2 is arranged in a sub-scanning direction orthogonal to the main scanning direction. The liquid discharge head 1 discharges colored liquid downward from the multiple nozzles 2.

[0128] Printer 500 includes a conveying mechanism 495 for conveying sheet 410 (i.e., media). The conveying mechanism 495 includes a conveyor belt 412 (i.e., a conveyor) and a secondary scanning motor 416 that drives the conveyor belt 412. The conveyor belt 412 attracts and conveys the sheet 410 at a position facing the liquid discharge head 1. The conveyor belt 412 is an annular belt mounted around a conveyor roller 413 and a tension roller 414. The sheet 410 can be attracted to the conveyor belt 412 by, for example, electrostatic attraction or air suction. The conveyor belt 412 moves circumferentially in the secondary scanning direction as the conveyor roller 413 is rotated by the secondary scanning motor 416 via a synchronous belt 417 and synchronous pulleys 418.

[0129] At one end of the main scanning direction within the travel range of the carriage 403, a maintenance mechanism 420 for maintaining and restoring the liquid discharge head 1 is disposed on the side of the conveyor belt 412. The maintenance mechanism 420 includes, for example, a cover 421 for covering the nozzle surface of the liquid discharge head 1 and a wiper 422 for wiping the nozzle surface. The main scanning movement mechanism 493, the maintenance mechanism 420, and the conveying mechanism 495 are mounted on a housing including side plates 491A and 491B and a back plate 491C.

[0130] In the printer 500 having the above-described structure, the sheet 410 is supplied and adsorbed onto the conveyor belt 412, and is conveyed in the sub-scanning direction by the circumferential movement of the conveyor belt 412. While the carriage 403 moves along the main scanning direction, the liquid discharge head 1 is driven in response to an image signal to discharge liquid onto the stationary sheet 410 to form an image.

[0131] The following reference Figure 19 Another liquid discharge unit 440 is described.

[0132] Figure 19 This is a plan view of a portion of the liquid discharge unit 440.

[0133] Liquid discharge unit 440 includes as Figure 17 The printer 500 shown with liquid discharge device includes a housing, a main scanning movement mechanism 493, a carriage 403, and a liquid discharge head 1. Side plates 491A, 491B and a back plate 491C constitute the housing.

[0134] In the liquid discharge unit 440, the aforementioned maintenance mechanism 420 can be installed, for example, on the side plate 491B.

[0135] The following reference Figure 20 Describes another liquid discharge unit 440.

[0136] Figure 20 This is a front view of a portion of the liquid discharge unit 440.

[0137] The liquid discharge unit 440 includes a liquid discharge head 1 on which a flow path component 444 is mounted and a pipe 456 connected to the flow path component 444.

[0138] The flow path component 444 is disposed within the cover 442. Alternatively, the liquid discharge unit 440 may include a head tank 441 instead of the flow path component 444. A connector 443 for electrical connection to the liquid discharge head 1 is disposed on the upper part of the flow path component 444.

[0139] In the printer 500 described above, by using the liquid ejection head according to this embodiment, various types of ink can be used as ejection material, such as UV ink whose viscosity is reduced by heating or solid ink used by heating and melting.

[0140] The liquid ejection head according to this embodiment can also be applied to printers that use metallic ink containing metal nanoparticles as the ejection material to print wiring patterns on a substrate. By heating and ejecting the metallic ink using the liquid ejection head according to this embodiment, the solvent of the metallic ink can begin to evaporate from the moment the metallic ink is ejected onto the substrate, preventing the metallic ink from wetting and spreading on the substrate, thereby forming fine wiring patterns.

[0141] The above embodiments are illustrative and do not limit the embodiments of this disclosure. Therefore, many additional modifications and variations are possible based on the above teachings. For example, within the scope of this disclosure, elements and / or features of different illustrative embodiments may be combined with and / or substituted for each other.

[0142] In this disclosure, the discharged liquid is not particularly limited, as long as the liquid has the viscosity or surface tension required for discharge from the head (liquid discharge head). However, it is preferable that the viscosity of the liquid, through heating, is not greater than 30 mPa·s. Examples of liquids include solutions, suspensions, and emulsions containing water, solvents such as organic solvents, dyes, pigments such as pigments, polymeric compounds, resins, functional materials such as surfactants, biocompatible materials such as DNA (deoxyribonucleic acid), amino acids, proteins, calcium, edible materials such as natural pigments, and molten metals such as solder. Such solutions, suspensions, emulsions, or molten metals can be used, for example, in inkjet inks, surface treatment solutions, liquids for forming resist patterns on components or electronic circuits of electronic components or light-emitting elements, liquids for forming solder bumps, or material solutions for three-dimensional manufacturing.

[0143] A "liquid discharge unit" is an assembly of components related to liquid discharge. The term "liquid discharge unit" refers to a structure that includes a liquid discharge head and functional components or mechanisms combined with the liquid discharge head as a single unit. For example, a "liquid discharge unit" includes a combination of a liquid discharge head and at least one of a head tank, a carriage, a supply mechanism, a maintenance mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0144] The aforementioned integration can be achieved through combinations such as: a liquid discharge head and one or more functional components or mechanisms that are fixed to each other by means of fastening, bonding, or joining; and a combination in which one of the liquid discharge head and functional components or mechanisms is movably held by the other. The liquid discharge head can be detachably mounted to the functional components or mechanisms.

[0145] For example, the liquid discharge head and the head tank can be formed as an integrated liquid discharge unit. Alternatively, the liquid discharge head and the head tank connected by pipes or the like can be formed as an integrated liquid discharge unit. A unit including a filter can be added at the location between the head tank and the liquid discharge head of the liquid discharge unit.

[0146] In another example, the liquid discharge head and carriage can be formed as an integrated liquid discharge unit.

[0147] As another example, the liquid discharge unit is a single unit combining a liquid discharge head and a main scanning movement mechanism. The liquid discharge head is movably held by a guide that is part of the main scanning movement mechanism. The liquid discharge unit may include a liquid discharge head, a carriage, and a main scanning movement mechanism as an integrated single unit.

[0148] In another example, a cover forming part of the maintenance mechanism can be fixed to a carriage on which a liquid discharge head is mounted, so that the liquid discharge head, carriage, and maintenance mechanism are integrated to form a liquid discharge unit.

[0149] In another example, the liquid discharge unit includes a pipe connected to a liquid discharge head on which a flow path component or head tank is mounted, thus integrating the liquid discharge head and the supply mechanism. Liquid from a liquid storage source is supplied to the liquid discharge head via this pipe.

[0150] The main scanning movement mechanism can be just a guide. The supply mechanism can be just a tube or just a filler.

[0151] "Liquid discharge unit" also includes a head module or head unit that includes the liquid discharge head and is integrated with the functional components and mechanisms described above.

[0152] The term "liquid discharge device" as used above also includes devices that include a liquid discharge head, a liquid discharge unit, a head module, a head unit, etc., and drive the liquid discharge head to discharge liquid. A liquid discharge device can be not only a device for discharging liquid onto a material to which the liquid can adhere, but also a device for discharging liquid into a gas or liquid.

[0153] Liquid discharge devices may include devices related to the supply, transport, and discharge of media to which liquids can adhere, and may also include pretreatment devices, posttreatment devices, etc.

[0154] "Liquid ejection device" is, for example, an image forming device that forms an image on a sheet by ejecting ink, or a three-dimensional shaping device that forms a three-dimensional object by ejecting a shaping liquid onto a powder layer of stacked powder material.

[0155] "Liquid dispensing device" is not limited to devices that visualize meaningful images such as letters or graphics by dispensing liquid. For example, liquid dispensing devices also include devices for forming patterns that do not have meaning on their own, or devices for creating three-dimensional images.

[0156] The term "liquid-adhesive medium" as used above refers to materials to which liquids can adhere at least temporarily, materials to which liquids adhere and solidify, or materials to which liquids adhere and permeate. Specific examples of "liquid-adhesive materials" include, but are not limited to, paper, recording paper, recording media such as film and cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers, organ models, inspection units, and other media. Unless otherwise specified, it includes all objects to which liquids adhere.

[0157] Examples of materials that can be attached to a liquid include any material that can be attached, such as paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, and ceramics, even temporarily.

[0158] A "liquid discharge device" is a device that has a liquid discharge head and a medium on which liquid can adhere move relative to each other, but is not limited to this. Specific examples include serial devices that move the liquid discharge head and linear devices that do not move the liquid discharge head.

[0159] Examples of "liquid discharge devices" also include treatment liquid coating devices that discharge treatment liquid onto the sheet surface for purposes such as modifying the surface of the sheet, and spray granulation devices that granulate raw materials into microparticles by spraying a combination liquid in which raw materials are dispersed in a solution through a nozzle.

[0160] The terms "image formation," "recording," "printing," "image printing," and "modeling" used in this manual may be used as synonyms.

[0161] The above embodiments are limited examples, and this disclosure includes, for example, the following aspects that have advantageous effects.

[0162] Aspect 1

[0163] Liquid discharge head 1 discharges liquid from nozzle 2 via drive piezoelectric element 52. Piezoelectric element 52 and heater 20 are disposed on the nozzle forming wall of pressure chamber 4 which communicates with nozzle 2.

[0164] That is, the liquid discharge head includes a nozzle plate, a pressure chamber base plate, a piezoelectric element, and a heater. The nozzle plate has a nozzle. The pressure chamber base plate is disposed on the nozzle plate. The pressure chamber base plate has a pressure chamber communicating with the nozzle. The piezoelectric element is disposed on the portion of the nozzle plate facing the pressure chamber. The piezoelectric element surrounds the nozzle and is driven to deform the nozzle plate, causing liquid in the pressure chamber to be discharged from the nozzle in the liquid discharge direction. The heater is disposed on the portion of the nozzle plate facing the pressure chamber. The heater surrounds the nozzle to heat the liquid in the pressure chamber.

[0165] In an apparatus for discharging materials that are solid at room temperature, such as solder (hereinafter referred to as the discharge material), from a nozzle, the discharge material is heated to a temperature equal to or higher than its melting point by a heater. Therefore, the temperature of the piezoelectric element rises due to the heating of the discharge material above its melting point. When using PZT, which has high piezoelectric properties, as the piezoelectric element material, PZT loses its piezoelectricity due to depolarization at temperatures above 200°C, and the piezoelectric element does not displace even when a voltage is applied. Therefore, the discharge material is limited to materials with a melting point below 200°C. When using materials such as AlN, whose displacement does not change even at high temperatures, as the piezoelectric element material, the piezoelectric properties are lower compared to PZT. Therefore, in the comparative example where the piezoelectric element is disposed in a counterwall opposite to the nozzle forming wall of the pressure chamber, there is a possibility that sufficient pressure cannot be generated, resulting in poor liquid discharge from the nozzle.

[0166] In contrast, in aspect 1, a piezoelectric element is disposed on the nozzle-forming wall, causing the nozzle-forming wall of the pressure chamber, which contains the nozzle, to vibrate, thereby discharging liquid. The nozzle-forming wall is the portion of the nozzle plate surrounding the nozzle and facing the pressure chamber. According to this structure, compared to a structure that discharges liquid by vibrating the opposing wall of the pressure chamber opposite the nozzle-forming wall, liquid can be discharged well from the nozzle at a lower pressure. Therefore, even when using materials such as AlN, which have low piezoelectric properties and generate low pressure but high heat resistance and whose displacement does not change even at high temperatures, as the piezoelectric element material, liquid can still be discharged well from the nozzle. As a result, materials with high melting temperatures can be discharged.

[0167] Furthermore, by arranging a heater on the nozzle forming wall, the discharged material in the pressure chamber can be effectively heated. Therefore, compared to a structure where the heater is arranged on a cover covering the liquid discharge head, the discharged material in the pressure chamber can be maintained above the melting temperature with a smaller heater capacity. This reduces the power consumption of the device. Additionally, the heater can be miniaturized, preventing the need for large-scale equipment.

[0168] Aspect 2

[0169] In aspect 1, the heater 20 is disposed on the side of the pressure chamber 4 relative to the piezoelectric element 52.

[0170] In other words, the heater on the nozzle plate is closer to the pressure chamber in the direction of liquid discharge than the piezoelectric element.

[0171] According to this structure, as described in the above embodiment, compared with the structure in which the piezoelectric element 52 is disposed on the side of the pressure chamber 4 compared with the heater 20, the discharged material in the pressure chamber can be heated more effectively.

[0172] Aspect 3

[0173] In aspect 1, the piezoelectric element 52 is disposed on the side of the pressure chamber 4 relative to the heater 20.

[0174] In other words, the piezoelectric element on the nozzle plate is closer to the pressure chamber in the direction of liquid discharge than the heater.

[0175] According to this structure, as referenced Figure 5 As explained, compared to the structure in which the heater 20 is positioned on the side of the pressure chamber 4 relative to the piezoelectric element 52, the diaphragm 103 can vibrate more efficiently.

[0176] Aspect 4

[0177] In any one of aspects 1 to 3, the heating element 21 of the heater 20 is made of molybdenum or platinum.

[0178] In other words, the heater has a heating element made of molybdenum or platinum.

[0179] According to this structure, as described in the above embodiments, heating can be performed efficiently with high resistivity.

[0180] Aspect 5

[0181] In any one of aspects 1 to 4, a temperature sensor 22 is disposed on the nozzle forming wall.

[0182] In other words, the liquid nozzle according to any one of aspects 1 to 4 further includes a temperature sensor disposed on the portion of the nozzle plate facing the pressure chamber. The temperature sensor surrounds the nozzle and detects the temperature of the liquid within the pressure chamber.

[0183] According to this structure, as described in the above embodiment, the heater 20 can be controlled based on the temperature detected by the temperature sensor 22. As a result, the liquid in the pressure chamber 4 can be well maintained at the target temperature.

[0184] Aspect 6

[0185] In aspect 5, the temperature sensor 22 and the heating element 21 are formed on the same layer, and the temperature sensor 22 and the heating element 21 are made of platinum.

[0186] In other words, the heater has a heating element. The temperature sensor and the heating element are disposed in the same layer of the nozzle plate in the liquid discharge direction. The temperature sensor and the heating element are made of platinum.

[0187] This structure enables high-precision temperature detection and efficient heating. Furthermore, the heating element 21 and temperature sensor 22 can be formed in a single process, reducing manufacturing steps.

[0188] Aspect 7

[0189] In any one of aspects 1 to 6, the piezoelectric element 52 is aluminum nitride, or aluminum nitride comprising at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium and boron.

[0190] In other words, the piezoelectric element comprises: aluminum nitride; or aluminum nitride containing at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium, or boron.

[0191] According to this structure, as described in the above embodiment, the heat resistance of the piezoelectric element 52 can be improved. According to this structure, even if the temperature of the piezoelectric element 52 rises due to the heated liquid or heater in the pressure chamber, the piezoelectric element 52 will still be displaced well, thereby enabling the liquid to be discharged well from the nozzle.

[0192] Aspect 8

[0193] In any one of aspects 1 to 7, the heating area of ​​the heater 20 is equal to the maximum cross-sectional area of ​​the piezoelectric element 5 including the piezoelectric body 52. ​​The maximum cross-sectional area is orthogonal to the liquid discharge direction.

[0194] In other words, the heating area of ​​the heater is equal to the maximum cross-sectional area of ​​the piezoelectric element in a plane orthogonal to the direction of liquid discharge.

[0195] According to this structure, as described in the above embodiments, the liquid in the pressure chamber can be heated uniformly.

[0196] Aspect 9

[0197] In any one of aspects 1 to 8, a second heater 3a is provided on the wall of a supply chamber such as a common chamber 3 that supplies liquid to the pressure chamber 4.

[0198] In other words, the liquid discharge head according to any one of aspects 1 to 8 further includes: a supply chamber substrate having a supply chamber in communication with the pressure chamber; and another heater on the wall of the supply chamber substrate.

[0199] According to this structure, as described in the above embodiment, the molten discharge material can be supplied to the pressure chamber 4.

[0200] Aspect 10

[0201] In any one of aspects 1 to 9, the liquid discharged from nozzle 2 is molten metal such as solder.

[0202] In other words, the piezoelectric element is driven to deform the nozzle plate, thereby discharging the molten metal, which is liquid, from the nozzle in the liquid discharge direction within the pressure chamber.

[0203] According to this structure, as described in the above embodiments, solder bumps and wiring patterns can be formed on the substrate.

[0204] Aspect 11

[0205] In a liquid discharge device including a liquid discharge head, the liquid discharge head described in any one of aspects 1 to 10 is used as the liquid discharge head.

[0206] In other words, a liquid discharge device includes: a liquid discharge head according to any one of aspects 1 to 10, for discharging liquid onto a medium; and a carriage on which the liquid discharge head is mounted, allowing the liquid discharge head to move relative to the medium.

[0207] Based on this structure, liquids with high viscosity at room temperature, such as UV inks, can be discharged as low-viscosity liquids. Furthermore, discharge materials that are solid at room temperature, such as wax inks or solder, can be melted and discharged.

[0208] The above embodiments are illustrative and do not limit the invention. Therefore, many additional modifications and variations are possible based on the above teachings. For example, within the scope of the invention, elements and / or features of different illustrative embodiments can be combined with and / or substituted for each other.

[0209] This patent application is based on and claims priority to Japanese Patent Application No. 2024-007965, filed with the Japan Patent Office on January 23, 2024, the entire disclosure of which is incorporated herein by reference.

[0210] List of reference numerals

[0211] 1: Liquid discharge head

[0212] 2: Nozzle

[0213] 3: Shared liquid chamber

[0214] 3a: Heater

[0215] 4: Pressure chamber

[0216] 4a: Opening

[0217] 5: Piezoelectric elements

[0218] 7a: First contact point

[0219] 7b: Second contact point

[0220] 7c: Third contact point

[0221] 7d: Fourth contact point

[0222] 8a: First insulating film

[0223] 8b: Second insulating film

[0224] 9a: First lead

[0225] 9b: Second lead

[0226] 20: Heater

[0227] 21: Heating section

[0228] 22: Temperature sensor

[0229] 23: Insulating film

[0230] 25: Temperature regulator

[0231] 25a: Adjustment Unit

[0232] 25c: Input Unit

[0233] 25d: Comparison Unit

[0234] 51: First electrode

[0235] 52: Piezoelectric element

[0236] 53: Second electrode

[0237] 100: Pressure chamber substrate

[0238] 102: Wiring layer

[0239] 103: Vibrating diaphragm

[0240] 110: Nozzle plate

[0241] 111: Nozzle forming section

[0242] 300: Printer

[0243] 301: Liquid Discharge Unit

[0244] 302: Supply device

[0245] 302a: Particle Loader

[0246] 310:Substrate

[0247] 320: Workbench

[0248] 440: Liquid Discharge Unit

[0249] 441: First Can

[0250] 500: Printer

Claims

1. A liquid discharge head, comprising: Nozzle plate, having nozzles; A pressure chamber base plate is disposed on the nozzle plate, the pressure chamber base plate having a pressure chamber communicating with the nozzle; A piezoelectric element is disposed on the portion of the nozzle plate facing the pressure chamber, the piezoelectric element being configured as follows: Surrounding the nozzle; and The nozzle plate is deformed by the drive, causing the liquid in the pressure chamber to be discharged from the nozzle in the liquid discharge direction; and A heater, disposed on the portion of the nozzle plate facing the pressure chamber, surrounds the nozzle to heat the liquid within the pressure chamber.

2. The liquid discharge head according to claim 1, in, The heater on the nozzle plate is closer to the pressure chamber than the piezoelectric element in the direction of liquid discharge.

3. The liquid discharge head according to claim 1, in, The piezoelectric element is located on the nozzle plate in the direction of liquid discharge, closer to the pressure chamber than the heater.

4. The liquid discharge head according to any one of claims 1 to 3, in, The heater has a heating element made of molybdenum or platinum.

5. The liquid discharge head according to any one of claims 1 to 4, further comprising: A temperature sensor is disposed on the portion of the nozzle plate facing the pressure chamber; and The temperature sensor surrounds the nozzle and detects the temperature of the liquid in the pressure chamber.

6. The liquid discharge head according to claim 5, in, The heater has a heating element. The temperature sensor and the heating element are disposed in the same layer of the nozzle plate in the liquid discharge direction, and The temperature sensor and the heating element are made of platinum.

7. The liquid discharge head according to any one of claims 1 to 6, in, The piezoelectric element includes: Aluminum nitride; or Aluminum nitride comprising at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium, or boron.

8. The liquid discharge head according to any one of claims 1 to 7, in, The heating area of ​​the heater is equal to the maximum cross-sectional area of ​​the piezoelectric element in a plane orthogonal to the direction of liquid discharge.

9. The liquid discharge head according to any one of claims 1 to 8, further comprising: A supply chamber base plate having a supply chamber communicating with the pressure chamber; and Another heater on the wall of the supply chamber substrate.

10. The liquid discharge head according to any one of claims 1 to 9, in, The piezoelectric element is driven to deform the nozzle plate, thereby discharging the molten metal, which is liquid, from the nozzle in the liquid discharge direction from the pressure chamber.

11. A liquid discharge device, comprising: A liquid discharge head according to any one of claims 1 to 10, for discharging liquid onto a medium; and A carriage is equipped with the liquid discharge head, allowing the liquid discharge head to move relative to the medium.

Images