Heater structure

Abstract

This invention relates to a heater structure, comprising a heater section, two thick-film busbars, an anisotropic conductive film, two thin-film connecting portions, and an insulating coating, and having a planar shape, wherein: each thick-film busbar has a main body and a first connecting portion; the main bodies of the thick-film busbars are arranged separately from each other; the heater section is planar and connected between the main bodies of the thick-film busbars; the anisotropic conductive film has two second connecting portions; the thin-film connecting portions correspond to the first connecting portions of the thick-film busbars and to the second connecting portions respectively; the thin-film connecting portions respectively connect the corresponding first connecting portions to the corresponding second connecting portions; the thick-film busbars do not directly contact the anisotropic conductive film; and except for the connecting portions with the thick-film busbars, each thin-film connecting portion is covered by an insulating coating and anisotropic conductive film, so that it is not exposed.

Description

Technical Field

[0001] This invention relates to a heater structure, and more particularly to a planar heater structure. Background Technology

[0002] As a connection method for connecting flexible printed circuits (FPCs) to circuit boards, the use of anisotropic conductive films (ACFs) is known. For example, this method is disclosed in JP 2007-35546 A (Patent Document 1).

[0003] like Figure 13 As shown, the method disclosed in Patent Document 1 is performed as follows: First, a liquid crystal display panel 110, an anisotropic conductive film 120, and a flexible plate 130 are placed on a pressing table 100. At this time, the anisotropic conductive film 120 is placed between the electrode terminals 111 of the liquid crystal display panel 110 and the electrode terminals 131 of the flexible plate 130. Then, the flexible plate 130, the anisotropic conductive film 120, and the liquid crystal display panel 110 are pressed and heated via a heating rod 140 through a buffer member 150. Therefore, the anisotropic conductive film 120 mechanically connects the liquid crystal display panel 110 and the flexible plate 130, and electrically connects the electrode terminals 111 of the liquid crystal display panel 110 and the electrode terminals 131 of the flexible plate 130. Summary of the Invention

[0004] In planar heating structures, there is a need to use anisotropic conductive films to connect flexible printed circuits and heater sections. On the other hand, in order to generate heat efficiently in planar heating structures, it is necessary to reduce the resistance of components other than the heater section.

[0005] Therefore, the object of the present invention is to provide a heater structure that can be connected to a flexible printed circuit using an anisotropic conductive thin film and generate heat efficiently.

[0006] One aspect of the present invention provides a heater structure including a heater section, two thick-film busbars, an anisotropic conductive film, two thin-film connecting portions, and an insulating coating, and having a planar shape. Each thick-film busbar has a main body and a first connecting portion. The main bodies of the thick-film busbars are arranged separately from each other. The heater section is planar and connected between the main bodies of the thick-film busbars. The anisotropic conductive film has two second connecting portions. The thin-film connecting portions correspond to the first connecting portions of the thick-film busbars and to the second connecting portions, respectively. The thin-film connecting portions respectively connect the corresponding first connecting portions to the corresponding second connecting portions. The thick-film busbars do not directly contact the anisotropic conductive film. Except for the connecting portions with the thick-film busbars, each thin-film connecting portion is covered by an insulating coating and anisotropic conductive film, so that it is not exposed.

[0007] In the heater structure described above, the heater section is connected between the main body sections of the thick-film busbar. The use of the thick-film busbar enables the heater structure to generate heat efficiently. Furthermore, in the heater structure described above, each thin-film connection section connects the first connection section of the corresponding thick-film busbar to the second connection section of the corresponding anisotropic conductive film. Therefore, the flexible printed circuit and the heater structure can be connected without direct contact between the anisotropic conductive film and the thick-film busbar. Thus, the flexible printed circuit can be separated from the thick-film busbar, and corrosion of the thick-film busbar can be easily and reliably prevented.

[0008] The purpose of the invention and its structure can be better understood by studying the following description of preferred embodiments and referring to the accompanying drawings. Attached Figure Description

[0009] Figure 1 This is a transparent plan view of the heater structure according to an embodiment of the present invention.

[0010] Figure 2 yes Figure 1 An enlarged view of the area enclosed by the dashed circle B.

[0011] Figure 3 yes Figure 1 Enlarged view of the area enclosed by the dashed circle C.

[0012] Figure 4 yes Figure 1 Enlarged view of the area enclosed by the dashed circle D.

[0013] Figure 5 yes Figure 1 An enlarged view of the area enclosed by the dashed circle E.

[0014] Figure 6 It is used for explanation Figure 1 The first step in the manufacturing process of the heater structure is shown in a plan view, with all components represented by opaque elements.

[0015] Figure 7 It is used for explanation Figure 1 The plan view of the second step of the heater structure manufacturing process, with all components represented by opaque elements.

[0016] Figure 8 It is used for explanation Figure 1 The plan view of the third step of the heater structure manufacturing process, with all components represented by opaque elements.

[0017] Figure 9 It is used for explanation Figure 1 The plan view of the fourth step of the heater structure manufacturing process, with all components represented by opaque elements.

[0018] Figure 10It is used for explanation Figure 1 The plan view of the fifth step of the heater structure manufacturing process. All components are represented by opaque components, and some electrodes of the flexible printed circuit are represented by dashed lines.

[0019] Figure 11 It is used for explanation Figure 1 The plan view of the sixth step of the heater structure manufacturing process. All components are represented by opaque components, and some electrodes of the flexible printed circuit are represented by dashed lines.

[0020] Figure 12 It is along Figure 11 A schematic cross-sectional view taken from line AA shows the structure of the heater and the construction of the flexible printed circuit; the size and aspect ratio of each component are shown. Figure 11 They are not consistent.

[0021] Figure 13 This is a schematic diagram illustrating the connection method for connecting a circuit board and a flexible printed circuit (FPC) according to Patent Document 1.

[0022] While the present invention can be modified and substituted in various ways, specific embodiments thereof have been illustrated by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that the drawings and their detailed description are not intended to limit the invention to the specific forms disclosed, but rather are intended to cover all modifications, equivalents, and substitutions falling within the spirit and scope of the invention, as defined in the appended claims. Detailed Implementation

[0023] Reference Figures 1 to 5 According to an embodiment of the present invention, the heater structure 10 is a planar heater structure. The heater structure 10 includes a base member 20, a heater section 30, two thick-film busbars 40 and 42, an anisotropic conductive film 50, two thin-film connecting sections 60 and 62, and an insulating coating 70. In this embodiment, the heater structure 10 further includes two thin-film busbars 64 and 66, an expansion insulating coating 72, and sealing members 80 and 82.

[0024] like Figures 1 to 5As shown, when viewed from above, the base member 20 has a rectangular shape. In this embodiment, the vertical direction is the Z-direction. The positive Z-direction is upward, and the negative Z-direction is downward. The base member 20 is an insulating resin film, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), or polyimide. In this embodiment, the base member 20 is flexible. Furthermore, in this embodiment, the base member 20 is transparent. However, the invention is not limited thereto. The base member 20 can be rigid. However, when the base member 20 is flexible, the heater structure 10 can be bent or placed on a curved surface of the structure. Furthermore, the base member 20 can also be opaque. Moreover, the base member 20 can be made of glass. Furthermore, the base member 20 can have a shape other than rectangular, such as circular or trapezoidal.

[0025] like Figures 1 to 6 As shown, the heater portion 30 is formed on the surface of the base member 20 and unfolds in a planar shape. In this embodiment, the heater portion 30 is a metal film with a mesh pattern. The material used for the metal film can be a metal such as gold, silver, aluminum, or copper. However, the present invention is not limited thereto. The heater portion 30 can be a transparent conductive film, such as an indium tin oxide (ITO) film, provided that it can generate heat by passing an electric current through it. In addition, the heater portion 30 can also have other shapes such as striped patterns or rectangles, besides the mesh pattern.

[0026] like Figures 1 to 5 and Figure 8 As shown, thick-film busbars 40 and 42 each have a main body portion 401 and 421, and each has a first connecting portion 403 and 423. In this embodiment, thick-film busbars 40 and 42 also have a connecting portion 405 and 425, respectively. In each thick-film busbar 40 and 42, the main body portion 401 or 421, the connecting portion 405 or 425, and the first connecting portion 403 or 423 are all integrally formed using the same material. For example, thick-film busbars 40 and 42 can be formed by screen printing using a conductive paste containing gold, silver, palladium, nickel, or copper.

[0027] like Figures 1 to 5 and Figure 8 As shown, thick-film busbars 40 and 42 are spaced apart from each other along a first horizontal direction. The main body portions 401 and 421 of the thick-film busbars 40 and 42 extend along a second horizontal direction perpendicular to the first horizontal direction. The main body portions 401 and 421 are spaced apart from each other along the first horizontal direction, and the heater portion 30 is located between the main body portions 401 and 421. In this embodiment, the first horizontal direction is the X direction, and the second horizontal direction is the Y direction.

[0028] like Figures 1 to 5 and Figure 8As shown, the first connecting portions 403 and 423 of the thick film busbars 40 and 42 extend along the first horizontal direction. The connecting portions 405 and 425 also extend along the first horizontal direction and connect one end of the main body portions 401 and 421 to one end of the first connecting portions 403 and 423, respectively.

[0029] like Figures 1 to 5 and Figure 9 As shown, the anisotropic conductive film 50 has a strip shape and extends along a first horizontal direction. The anisotropic conductive film 50 is a thin film in which conductive particles are dispersed in a thermosetting resin. As conductive particles, resin particles with a surface plated with metals such as nickel (Ni), gold (Au), or palladium (Pd) can be used, or metal particles made of metals such as nickel (Ni), gold (Au), or palladium (Pd) can be used. In this embodiment, the anisotropic conductive film 50 has two second connecting portions 501 and 503. In this embodiment, the second connecting portions 501 and 503 are located at opposite ends of the anisotropic conductive film 50. However, the invention is not limited thereto. The heater structure 10 of the present invention may have two anisotropic conductive films corresponding to the second connecting portions 501 and 503, instead of the anisotropic conductive film 50.

[0030] like Figures 1 to 6 As shown, each thin film connection portion 60 and 62 is formed using a conductive thin film and has a generally rectangular shape. In this embodiment, the thin film connection portions 60 and 62 are formed using the same material as the heater portion 30 or the metal thin film, and are formed simultaneously with the heater portion 30.

[0031] like Figures 1 to 6 As shown, thin-film connectors 60 and 62 are spaced apart from each other along a first horizontal direction. Thin-film connectors 60 and 62 correspond to the first connectors 403 and 423 of the thick-film busbars 40 and 42, respectively, and to the second connectors 501 and 503 of the anisotropic conductive film 50, respectively. Specifically, the front ends of thin-film connectors 60 and 62 are respectively provided with comb-shaped front ends 601 and 621, and the rear ends are respectively provided with bases 603 and 623. In this embodiment, the front-to-back direction is the same as the second horizontal direction. The positive Y direction is forward, while the negative Y direction is backward.

[0032] like Figures 1 to 5As shown, when viewed from above, the front portions 601 and 621 of the thin-film connectors 60 and 62 overlap with the second connectors 501 and 503 of the anisotropic conductive film 50, respectively. When viewed from above, the base portions 603 and 623 of the thin-film connectors 60 and 62 overlap with the first connectors 403 and 423 of the thick-film busbars 40 and 42, respectively. In this embodiment, when viewed from above, the thin-film connectors 60 and 62 protrude from the first connectors 403 and 423 of the thick-film busbars 40 and 42 along a second horizontal direction. In other words, in this embodiment, the thin-film connectors 60 and 62 protrude in a direction perpendicular to the extending direction of the first connectors 403 and 423. However, the invention is not limited thereto. When viewed from above, the thin-film connectors 60 and 62 may protrude from the first connectors 403 and 423 of the thick-film busbars 40 and 42 along a first horizontal direction, respectively. In other words, the thin film connectors 60 and 62 can protrude along the extending directions of the first connectors 403 and 423. However, when the thin film connectors 60 and 62 protrude in a direction perpendicular to the extending directions of the first connectors 403 and 423, the contact area with the second connectors 501 and 503 can be easily increased. This increased contact area reduces resistance, thereby improving the heat generation efficiency of the heater structure 10.

[0033] like Figures 1 to 6 As shown, thin film connecting portions 60 and 62 are respectively connected to thin film busbars 64 and 66. In this embodiment, thin film busbars 64 and 66 are integrally formed using the same material as heater portion 30 and thin film connecting portions 60 and 62.

[0034] like Figures 1 to 6 and Figure 8 As shown, the shapes of thin-film busbars 64 and 66 are similar to those of thick-film busbars 40 and 42, respectively. Specifically, as... Figures 1 to 6 As shown, the thin film busbars 64 and 66 have main bodies 641 and 661, respectively, and extensions 643 and 663.

[0035] like Figures 1 to 6 As shown, the main bodies 641 and 661 of thin-film buses 64 and 66 extend along a first horizontal direction and connect to the heater section 30. Furthermore, the extensions 643 and 663 of thin-film buses 64 and 66 extend along a second horizontal direction. The main bodies 641 and 661 of thin-film buses 64 and 66 are located below the main bodies 401 and 421 of thick-film buses 40 and 42, respectively. Furthermore, the extensions 643 and 663 of thin-film buses 64 and 66 are located below the joints 405 and 425 of thick-film buses 40 and 42, respectively. The main bodies 641 and 661 of thin-film buses 64 and 66 connect the main bodies 401 and 421 of thick-film buses 40 and 42 to the heater section 30. Using thick-film buses 40 and 42 reduces the resistance of the power supply lines to the heater section 30 and improves the heat generation efficiency of the heater structure 10.

[0036] like Figures 1 to 5 and Figure 7 As shown, the insulating coating 70 is configured to intersect the film connectors 60 and 62 in a first horizontal direction. The front portions 601 and 621 of the film connectors 60 and 62 are located in front of the insulating coating 70, while the base portions 603 and 623 of the film connectors 60 and 62 are located behind the insulating coating 70. Furthermore, the expanding insulating coating 72 is configured to cover the entire heater portion 30. The insulating coating 70 and the expanding insulating coating 72, also referred to as a coating layer, are made of resin, such as a thermosetting resin or a photocurable resin.

[0037] like Figures 1 to 5 , Figure 10 and Figure 11 As shown, sealing members 80 and 82 are formed to cover thick film busbars 40 and 42, respectively. Sealing members 80 and 82 are made of resin, such as thermosetting resin or light-curing resin. Sealing members 80 and 82 may be made of the same or different material as the insulating coating 70 and the intumescent insulating coating 72.

[0038] The following reference Figures 6 to 12 The manufacturing method of heater structure 10 is described, and the structure of heater structure 10 is further described.

[0039] First, such as Figure 6 As shown, heater section 30, thin film connecting sections 60 and 62, and thin film busbars 64 and 66 are formed on the surface of base member 20. Heater section 30, thin film connecting sections 60 and 62, and thin film busbars 64 and 66 can be formed simultaneously by patterning a metal thin film formed on base member 20. In this invention, thin film busbars 64 and 66 are not essential. However, thin film busbars 64 and 66 facilitate the formation of thick film busbars 40 and 42 and help improve the reliability of the electrical connection between each thick film busbar 40 and 42 and heater section 30.

[0040] Next, as Figure 7 As shown, an insulating coating 70 and an expanded insulating coating 72 are formed. The insulating coating 70 and the expanded insulating coating 72 can be formed simultaneously by forming and patterning an insulating film. The insulating coating 70 can be divided into two parts to correspond to the film bonding portions 60 and 62, respectively.

[0041] Next, as Figure 8As shown, thick film busbars 40 and 42 are formed. Thick film busbars 40 and 42 can be simultaneously formed using a conductive paste by methods such as screen printing. Thick film busbars 40 and 42 are formed to overlap with thin film busbars 64 and 66 and the bases 603 and 623 of thin film connecting portions 60 and 62. Therefore, the first connecting portions 403 and 423 of thick film busbars 40 and 42 are electrically connected to the thin film connecting portions 60 and 62, respectively. Furthermore, thick film busbars 40 and 42 are connected to heater portion 30 via thin film busbars 64 and 66. However, the invention is not limited thereto. Thick film busbars 40 and 42 can be directly connected to heater portion 30. In any case, heater portion 30 is connected between the main body portions 401 and 421 of thick film busbars 40 and 42.

[0042] Next, as Figure 9 As shown, an anisotropic conductive film 50 is attached to cover the front portions 601 and 621 of the film connections 60 and 62. The anisotropic conductive film 50 is attached to overlap with the insulating coating 70. As described above, anisotropic conductive films corresponding to the film connections 60 and 62 may be used instead of the anisotropic conductive film 50. However, to avoid increasing the number of components and process steps, a single-layer film or anisotropic conductive film 50 is preferably used.

[0043] Next, as Figure 10 As shown, the flexible printed circuit (FPC) 90 is connected and fixed to the heater structure 10 using an anisotropic conductive film 50. Specifically, the flexible printed circuit (FPC) 90 is placed on the anisotropic conductive film 50, and the flexible printed circuit (FPC) 90 is pressed against the base member 20 and heated.

[0044] Finally, as Figure 11 As shown, sealing members 80 and 82 are formed to cover the thick-film busbars 40 and 42, respectively. Sealing members 80 and 82 cover the thick-film busbars 40 and 42, respectively, preventing them from being exposed. Sealing members 80 and 82 act as moisture-proof or waterproof materials, preventing corrosion of the thick-film busbars 40 and 42. This achieves a heater structure 10 connected to the flexible printed circuit (FPC) 90.

[0045] like Figure 12 As shown, in the implemented heater structure 10, the thin-film connector 60 connects the first connector 403 of the thick-film busbar 40 to the second connector 501 of the anisotropic conductive film 50. Similarly, the thin-film connector 62 connects the first connector 423 of the thick-film busbar 42 to the second connector 503 of the anisotropic conductive film 50. As described above, each thin-film connector 60 and 62 connects the corresponding first connector 403 or 423 to the corresponding second connector 501 or 503.

[0046] like Figure 12As shown, due to the use of thin-film connectors 60 and 62, the thick-film busbars 40 and 42 are spaced apart from the anisotropic conductive film 50 and do not directly contact each other. Therefore, when viewed from above, the flexible printed circuit (FPC) 90 connected to the heater structure 10 does not overlap with the thick-film busbars 40 and 42. With this structure, the flexible printed circuit (FPC) 90 does not hinder the formation of the sealing members 80 and 82 during their formation. Therefore, the sealing members 80 and 82 can completely cover the thick-film busbars 40 and 42 respectively, preventing corrosion of the thick-film busbars 40 and 42. Furthermore, except for the connection portions with the thick-film busbars 40 and 42, the thin-film connectors 60 and 62 are covered by the insulating coating 70 and the anisotropic conductive film 50, thus not being exposed. In particular, the anisotropic conductive film 50 covers the edge portions at the connection portions between the thin-film connectors 60 and 62 and the flexible printed circuit board (FPC) 90 with a certain thickness, completely sealing the connection portions. Therefore, corrosion of the thin film connectors 60 and 62 is also prevented. Preventing corrosion of the thick film busbars 40 and 42, as well as the thin film connectors 60 and 62, avoids increased resistance due to corrosion and maintains the high heat generation efficiency of the heater structure 10.

[0047] Although the present invention has been specifically described above with reference to specific embodiments, the present invention is not limited thereto, and various modifications and substitutions can be made without departing from the spirit of the present invention. For example, in the above embodiments, thick film busbars 40 and 42 respectively have connecting portions 405 and 425, and each thick film busbar 40 and 42 has an L-shape. However, the present invention is not limited thereto. Thick film busbars 40 and 42 may not have connecting portions 405 and 425, and each thick film busbar 40 and 42 may have an I-shape. In this case, thin film connecting portions 60 and 62 can protrude outward from the first connecting portions 403 and 423 of the thick film busbars 40 and 42 extending along the second horizontal direction, along the first horizontal direction or the second horizontal direction. However, when the thin film connecting portions 60 and 62 protrude in a direction perpendicular to the extending direction of the first connecting portions 403 and 423, the contact area with the second connecting portions 501 and 503 can be easily increased. Therefore, in this case, when the thin film connecting portions 60 and 62 protrude along the second horizontal direction, the contact area with the second connecting portions 501 and 503 can also be easily increased. The increased contact area reduces the resistance, thereby improving the heat generation efficiency of the heater structure 10.

[0048] Furthermore, in the above embodiments, the thick-film busbars 40 and 42 are formed to overlap with the insulating coating 70 and the expanding insulating coating 72. However, the thick-film busbars 40 and 42 may not overlap with either the insulating coating 70 or the expanding insulating coating 72, or they may not overlap with either the insulating coating 70 or the expanding insulating coating 72. However, the sealing members 80 and 82 should be formed to overlap with the insulating coating 70 and the expanding insulating coating 72.

[0049] While preferred embodiments of the invention have been described, those skilled in the art will understand that other and further modifications may be made thereto without departing from the spirit of the invention, and the invention is intended to claim protection for all such embodiments that fall within the true scope of the invention.

Claims

1. A heater structure, comprising a heater section, two thick-film busbars, an anisotropic conductive film, two thin-film connecting sections, and an insulating coating, and having a planar shape, wherein: Each of the thick film busbars has a main body and a first connecting part; The main bodies of the thick film busbars are arranged to be separated from each other; The heater section is planar and connected between the main body sections of the thick film busbar; The anisotropic conductive film has two second connecting portions; The thin film connecting portions correspond to the first connecting portions of the thick film busbar, and also correspond to the second connecting portions; The thin film connecting portion respectively connects the corresponding first connecting portion to the corresponding second connecting portion; The thick-film busbar does not directly contact the anisotropic conductive film; and Except for the connection portion with the thick film busbar, each of the thin film connection portions is covered by the insulating coating and the anisotropic conductive film, so that it is not exposed.

2. The heater structure according to claim 1, wherein, The heater structure also includes a sealing component that covers the thick film busbar, so that the thick film busbar is not exposed.

3. The heater structure according to claim 1, wherein: The first connecting portions of the thick-film busbars each extend along a first horizontal direction; and When viewed from above, each of the thin film connecting portions protrudes from its corresponding first connecting portion along a second horizontal direction perpendicular to the first horizontal direction.

4. The heater structure according to claim 1, wherein: The heater structure also includes two thin-film busbars; The thin-film busbars are respectively arranged below the thick-film busbars, and the thick-film busbars are connected to the heater section; and The thin film connecting parts are integrally formed with the thin film busbar.

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