Cold plate and server

Abstract

The application provides a cold plate and a server, and relates to the technical field of heat dissipation. The cold plate provided by the application comprises a substrate, a top surface of the substrate is provided with a boss, and the boss is provided with a plurality of flow guide grooves; a partition plate assembly comprises a plurality of main partition plates and at least two shunt partition plates, the bottom end of the main partition plate extends into the flow guide groove and leaves a gap with the bottom of the groove, the top end of the main partition plate extends out of the flow guide groove, the two main partition plates and the boss surround to form a flow guide cavity, the flow guide cavity comprises a first flow guide cavity with an open top and a second flow guide cavity with a sealed top which are staggered in a first direction, and the at least two shunt partition plates are arranged in the first flow guide cavity in a spaced manner; a cover plate is arranged on the outside of the boss, the cover plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is opposite to the space between the two shunt partition plates, and the end of the first flow guide cavity or the end of the second flow guide cavity is communicated with the liquid outlet. The cold plate and the server provided by the application have low thermal resistance and low flow resistance.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a cold plate and a server. Background Technology

[0002] As the integration of high-power chips continues to increase, the heat flux density of devices is rising significantly, which places higher demands on the heat exchange efficiency, temperature uniformity, and heat dissipation energy consumption of liquid cooling.

[0003] Current mainstream liquid cooling structures have significant technical flaws. Traditional parallel microchannel cold plates rely on uniform flow distribution for heat dissipation, but the heat generation in the heat-generating areas of the heat-generating elements is non-uniform, leading to temperature dead zones in high-heat-flux areas. Furthermore, as the coolant flows, its temperature rises, reducing its cooling efficiency. Additionally, the coolant in parallel microchannel cold plates experiences significant flow resistance because it must flow across the entire plate. While single-jet impingement flow channels can enhance local heat transfer and improve hotspots, the flow-distribution structure reduces the overall coolant velocity, limiting the overall heat transfer improvement. Moreover, traditional jetting distributes the flow across the entire area, resulting in low flow rate and slow velocity after a single jet.

[0004] Therefore, how to balance low thermal resistance and low flow resistance is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] To address at least one of the problems mentioned in the background art, this application provides a cold plate and a server having low thermal resistance and low flow resistance.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] In a first aspect, this application provides a cold plate, comprising:

[0008] The substrate has a boss on its top surface, and multiple flow channels arranged in an array on the boss. The openings of the flow channels are located on the top surface of the boss, and the bottom surface of the substrate is configured to abut against the heating element.

[0009] A partition assembly includes multiple main partitions and at least two diversion partitions. The multiple main partitions are spaced apart on the boss along a first direction. The main partitions extend along a second direction. The first end of the main partition extends into the guide groove along a third direction and leaves a gap with the bottom of the groove. The second end extends out of the guide groove. The top surfaces of two adjacent main partitions and the boss enclose a guide cavity extending along the second direction. The openings of two adjacent guide grooves along the first direction are connected to the same guide cavity. The guide cavity includes a first guide cavity with an open top structure and a second guide cavity with a sealed top structure, which are staggered along the first direction. At least two diversion partitions are spaced apart in the first guide cavity along the second direction. The first direction, the second direction, and the third direction are the width, length, and thickness directions of the substrate, respectively.

[0010] A cover plate is installed on the outside of the boss and seals the second end of the main partition plate. The cover plate has an inlet and an outlet. The projection of the inlet along the third direction falls between two adjacent diversion partitions in the second direction. The end of the first guide cavity along the second direction and / or the end of the second guide cavity along the second direction are connected to the outlet.

[0011] As an optional implementation, the side of the cover plate, the side of the boss, and the top surface of the substrate together form a liquid outlet channel. The end of the first guide cavity along the second direction and / or the end of the second guide cavity along the second direction are connected to the liquid outlet channel. The liquid outlet channel is connected to the liquid outlet. The guide cavity extends along the second direction to the opposite ends of the boss.

[0012] As an optional implementation, the boss has a plurality of first partitions spaced apart along a first direction and a plurality of second partitions spaced apart along a second direction. The first partitions extend along the second direction to opposite ends of the boss, and the second partitions extend along the first direction to opposite ends of the boss. Adjacent first partitions and adjacent second partitions together form a guide channel.

[0013] As an optional implementation, the guide channel is a rectangular guide channel, and the dimension of the guide channel along the first direction is larger than the dimension of the guide channel along the second direction, and the main baffle is located in the middle of the guide channel along the first direction.

[0014] As an optional implementation, the boss is biased along a first direction on a first side of the top surface of the substrate, and the second side of the top surface of the substrate and the liquid outlet are opposite each other along a third direction. The first side of the top surface of the substrate and the second side of the top surface of the substrate are opposite sides of the top surface of the substrate.

[0015] As an optional implementation, the bottom of the guide channel has an arc-shaped structure that protrudes towards the substrate.

[0016] As an alternative implementation, the bottom of the flow channel extends to the substrate.

[0017] As an optional implementation, at least two flow dividers are provided in both the first flow guide cavity and the second flow guide cavity. The flow dividers in the first flow guide cavity include a first flow divider and a second flow divider. The first flow divider and the second flow divider are spaced apart in the middle of the first flow guide cavity along the second direction, and the projection of the liquid inlet along the third direction falls between the first flow divider and the second flow divider.

[0018] The flow divider in the second flow guide cavity includes a third flow divider and a fourth flow divider. The third flow divider and the fourth flow divider are spaced apart in the middle of the second flow guide cavity along the second direction. Along the second direction, the first flow divider and the second flow divider are both located between the third flow divider and the fourth flow divider. The end of the second flow guide cavity along the second direction is connected to the liquid outlet channel.

[0019] As an optional implementation, the flow divider in the first flow guide cavity further includes a fifth flow divider and a sixth flow divider. The fifth flow divider and the sixth flow divider are located at opposite ends of the first flow guide cavity along the second direction, and the first flow divider and the fifth flow divider are adjacent to each other along the second direction, as are the second flow divider and the sixth flow divider.

[0020] Secondly, this application also provides a server, including the cold plate mentioned in the first aspect.

[0021] The cold plate provided in this application allows coolant to flow in through the inlet of the cover plate. Because the projection of the inlet along the third direction falls between two adjacent flow dividers in the second direction, the coolant flows directly into the large cavity area formed by the two flow dividers and the open first guide cavity. This cavity has sufficient flow space, and the flow resistance of the fluid is small. Subsequently, the coolant is evenly distributed into the interior of each guide channel below. After entering the guide channel, the coolant bypasses the main partition through the gap between the end of the main partition extending into the guide channel and the bottom of the guide channel, completing a rapid return and flowing into the adjacent second guide cavity. During the return process, the fluid velocity is high and the flow rate is large. The high-speed fluid directly impacts the substrate at the bottom of the guide channel, which can quickly remove the heat accumulated on the substrate, significantly enhancing the heat exchange capacity and reducing the overall heat dissipation thermal resistance and flow resistance. After heat exchange, the coolant is discharged from the outlet through the end of the first or second guide cavity along the second direction. In addition, by adjusting the position of the flow divider, the heat dissipation capacity of different areas of the cold plate can be adjusted to adapt to the heat-generating components under different operating conditions, effectively improving the problem of temperature dead zone and the decrease in heat dissipation capacity caused by the flow of coolant. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structure of the cold plate provided in the embodiments of this application;

[0024] Figure 2 for Figure 1 Top view;

[0025] Figure 3 for Figure 2 Sectional view at point aa;

[0026] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0027] Figure 5 for Figure 1 Side view;

[0028] Figure 6 for Figure 5 Sectional view at point bb;

[0029] Figure 7 for Figure 6 Enlarged view of point B in the middle;

[0030] Figure 8 This is a schematic diagram of the structure of the cold plate after the cover plate is removed, as provided in an embodiment of this application.

[0031] Figure 9 for Figure 8 Enlarged view of point C in the middle;

[0032] Figure 10 Exploded view of the cold plate provided in the embodiments of this application;

[0033] Figure 11 for Figure 10 Enlarged view at point D;

[0034] Figure 12 This is a schematic diagram of the structure of the cover plate in the cold plate provided in the embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Cold plate; 110. Substrate; 120. Boss; 121. Flow guide groove; 122. First partition; 123. Second partition; 130. Partition assembly; 131. Main partition; 132. Diversion partition; 1321. First diversion partition; 1322. Second diversion partition; 1323. Third diversion partition; 1324. Fourth diversion partition; 1325. Fifth diversion partition; 1326. Sixth diversion partition; 140. First flow guide cavity; 150. Second flow guide cavity; 160. Cover plate; 161. Liquid inlet; 162. Liquid outlet; 163. Reinforcing rib; 170. Liquid outlet channel; 180. Diffusion cavity; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] In this application, the terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” “outer,” “vertical,” “horizontal,” “lateral,” and “longitudinal” indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0039] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0040] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0041] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0042] As the integration density of high-power chips continues to increase, the heat flux density of devices is rising significantly, placing higher demands on the heat transfer efficiency, temperature uniformity, and energy consumption of liquid cooling. Existing mainstream liquid cooling structures have significant technical shortcomings. Traditional parallel microchannel cold plates rely on uniform flow distribution for heat dissipation, but the heat generation in the heat-generating areas of the heat-generating components is not uniform, leading to temperature dead zones in high-heat-flux areas. Furthermore, as the coolant temperature rises during flow, the heat dissipation effect decreases. Additionally, because the coolant needs to flow across the entire cold plate, the flow resistance is relatively high. While single-jet impingement flow channels can enhance local heat transfer and improve hotspot issues, the flow distribution structure reduces the overall coolant flow velocity, limiting the overall heat transfer improvement. Moreover, traditional jet impingement distributes the flow across the entire area, resulting in low flow rate and slow velocity after a single jet.

[0043] In view of this, this application provides a cold plate in which coolant flows in through the inlet of the cover plate. Since the projection of the inlet along the third direction falls between two adjacent flow dividers in the second direction, the coolant flows directly into the large cavity area formed by the two flow dividers and the open first guide cavity. This cavity has sufficient flow space and the flow resistance of the fluid is small. Subsequently, the coolant is evenly distributed into the interior of each guide channel below. After entering the guide channel, the coolant bypasses the main partition through the gap between the end of the main partition extending into the guide channel and the bottom of the guide channel, and quickly turns back and flows into the adjacent second guide cavity. During the turning back process, the fluid velocity is fast and the flow rate is large. The high-speed fluid directly impacts the substrate at the bottom of the guide channel, which can quickly remove the heat accumulated on the substrate, significantly enhance the heat exchange capacity, and reduce the overall heat dissipation thermal resistance and flow resistance. After heat exchange, the coolant is discharged from the outlet through the end of the first guide cavity or the second guide cavity along the second direction. In addition, by adjusting the position of the flow divider, the heat dissipation capacity of different areas of the cold plate can be adjusted to adapt to the heat-generating components under different operating conditions, effectively improving the problem of temperature dead zone and the decrease in heat dissipation capacity caused by the flow of coolant.

[0044] Figure 1 This is a schematic diagram of the overall structure of the cold plate provided in the embodiments of this application; Figure 2 for Figure 1 Top view; Figure 3 for Figure 2 Sectional view at point aa; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 for Figure 1 Side view; Figure 6 for Figure 5 Sectional view at point bb; Figure 7 for Figure 6 Enlarged view of point B in the middle; Figure 8 This is a schematic diagram of the structure of the cold plate after the cover plate is removed, as provided in an embodiment of this application. Figure 9 for Figure 8Enlarged view of point C in the middle; Figure 10 Exploded view of the cold plate provided in the embodiments of this application; Figure 11 for Figure 10 Enlarged view at point D; Figure 12 This is a schematic diagram of the structure of the cover plate in the cold plate provided in the embodiment of this application.

[0045] You can refer to this. Figures 1 to 12 This application provides a cold plate 100, comprising:

[0046] The substrate 110 has a boss 120 on its top surface, and a plurality of flow channels 121 arranged in an array on the boss 120. The opening of the flow channels 121 is located on the top surface of the boss 120, and the bottom surface of the substrate 110 is configured to abut against the heating element.

[0047] The partition assembly 130 includes a plurality of main partitions 131 and at least two diversion partitions 132. The plurality of main partitions 131 are spaced apart on the boss 120 along the first direction X. The main partitions 131 extend along the second direction Y. The first end of the main partition 131 extends into the guide groove 121 along the third direction Z and leaves a gap with the bottom of the groove. The second end extends out of the guide groove 121. The top surfaces of two adjacent main partitions 131 and the boss 120 enclose a guide cavity extending along the second direction Y. The openings of two adjacent guide grooves 121 along the first direction X are connected to the same guide cavity. The guide cavity includes a first guide cavity 140 with an open top structure and a second guide cavity 150 with a sealed top structure, which are staggered along the first direction X. At least two diversion partitions 132 are spaced apart on the first guide cavity 140 along the second direction Y. The first direction X, the second direction Y and the third direction Z are the width, length and thickness directions of the substrate 110, respectively.

[0048] A cover plate 160 is provided on the outside of the boss 120 and seals the second end of the main partition 131. The cover plate 160 has an inlet 161 and an outlet 162. The projection of the inlet 161 along the third direction Z falls between two adjacent diversion partitions 132 in the second direction Y. The end of the first guide cavity 140 along the second direction Y and / or the end of the second guide cavity 150 along the second direction Y are connected to the outlet 162.

[0049] The cold plate 100 provided in this embodiment of the application has coolant flowing in through the inlet 161 of the cover plate 160. Since the projection of the inlet 161 along the third direction Z falls between two adjacent diversion baffles 132 in the second direction Y, the coolant flows directly into the large cavity area formed by the two diversion baffles 132 and the open first guide cavity 140. This cavity has ample flow space, resulting in low flow resistance for the fluid. Subsequently, the coolant is evenly distributed into the lower guide channels 121. After entering the guide channels 121, the coolant flows through the main... The gap between the end of the baffle 131 extending into the guide channel 121 and the bottom of the guide channel 121 allows the fluid to quickly fold back and flow into the adjacent second guide cavity 150. During the folding process, the fluid velocity is high, and the high-speed fluid directly impacts the substrate 110 at the bottom of the guide channel 121, which can quickly remove the heat accumulated on the substrate 110, significantly enhancing the heat exchange capacity and reducing the overall heat dissipation thermal resistance and flow resistance. After heat exchange, the coolant is discharged from the outlet 162 through the end of the first guide cavity 140 or the second guide cavity 150 along the second direction Y. In addition, by adjusting the position of the diversion baffle, the heat dissipation capacity of different areas of the cold plate can be adjusted to adapt to the heat-generating elements under different operating conditions, effectively improving the problem of temperature dead zone and the decrease in heat dissipation capacity caused by the flow of coolant.

[0050] like Figure 4 and 12 As shown, the inner wall of the cover plate 160 may have reinforcing ribs 163 that match the shape of the boss 120. The long side of the reinforcing rib 163 is welded to the main partition 131 at the edge of the boss 120, and the wide side of the reinforcing rib 163 is welded to the top of the diversion partition 132, thereby forming different diffusion cavities 180 between the cover plate 160, the reinforcing rib 163 and the top of the partition assembly 130. After the coolant enters from the inlet 161, it enters the corresponding diffusion cavity 180 and then diffuses through the diffusion cavity 180 to the first guide cavity 140 between the diversion partitions 132 at the bottom.

[0051] In the above embodiment, the side of the cover plate 160, the side of the boss 120, and the top surface of the base plate 110 together form a liquid outlet channel 170. The end of the first guide cavity 140 along the second direction Y and / or the end of the second guide cavity 150 along the second direction Y are connected to the liquid outlet channel 170. The liquid outlet channel 170 is connected to the liquid outlet 162. The guide cavities can extend along the second direction Y to the opposite ends of the boss 120. After heat exchange, the coolant can flow into the liquid outlet channel 170 through the end of the first guide cavity 140 or the second guide cavity 150 along the second direction Y, and is finally discharged from the liquid outlet 162. The flow guide cavity extends along the second direction Y to the opposite ends of the boss 120, which allows the fluid after heat exchange in the flow guide channel 121 to flow into the liquid outlet channel 170 from both ends of the flow guide cavity. This shortens the discharge stroke of the coolant in the flow guide channel 121 at different positions, eliminates the flow resistance difference caused by the excessively long flow path of the fluid at the far end, avoids insufficient flow at the far end and local heat accumulation problems, further balances the flow distribution of the entire substrate 110, and improves temperature uniformity.

[0052] In the above embodiments, the boss 120 may have a plurality of first partitions 122 spaced apart along the first direction X and a plurality of second partitions 123 spaced apart along the second direction Y. The first partitions 122 extend along the second direction Y to the opposite ends of the boss 120, and the second partitions 123 extend along the first direction X to the opposite ends of the boss 120. Two adjacent first partitions 122 and two adjacent second partitions 123 enclose a guide channel 121. It is understandable that two adjacent first partitions 122 and two adjacent second partitions 123 intersect and enclose each other to form an independent and uniform array of flow channels 121. The arrangement of the first partitions 122 and the second partitions 123 penetrating both ends of the boss 120 can uniformly limit the flow width, flow length and flow cross-section of each flow channel 121, so that all flow channels 121 have the same fluid flow geometry parameters. This eliminates the flow distribution deviation caused by the inconsistency of size and flow channel length in different areas of the flow channels 121 from the structural source, avoids the formation of temperature dead zones and local overheating due to insufficient coolant supply and insufficient heat exchange in the far-end flow channels 121, and improves the heat-generating substrate. The 110-area temperature uniformity is achieved. Simultaneously, the through-type baffles cross-divide to form regular guide channels 121. The inner wall of the flow channel is free of protrusions, local narrowing, or other structures that easily generate eddies. When the coolant flows inside the guide channels 121, the local resistance loss is smaller, which is conducive to maintaining a stable and high-speed flow state. This fully utilizes the heat transfer enhancement effect of the fluid impacting the bottom surface of the substrate 110, increases the effective heat transfer contact area between the coolant and the substrate 110, and continuously reduces the overall heat dissipation thermal resistance. In addition, the uniformly through-type baffles can achieve full coverage of the guide channel 121 array. The substrate 110 area corresponding to the heat-generating element can be completely covered by the guide channels 121, further balancing the overall heat transfer efficiency.

[0053] In the above embodiments, the guide channel 121 can be a rectangular guide channel 121, and the dimension of the guide channel 121 along the first direction X is larger than the dimension of the guide channel 121 along the second direction Y. The main partition plate 131 is located in the middle of the guide channel 121 along the first direction X. The guide channel 121 adopts a rectangular structure, which has sufficient fluid carrying space. When the coolant flows down from the upper first guide cavity 140 into the guide channel 121, it will not form a local diameter reduction effect due to the narrow flow channel cross section, and can smoothly complete the fluid transition, reduce the flow loss caused by eddies at the inlet and local high pressure loss, and effectively reduce the overall flow resistance. At the same time, the larger dimension in the first direction X widens the contact range between the coolant and the bottom heating surface of the substrate 110, increases the effective heat exchange area of ​​a single guide channel 121, and can cover a wider heat exchange area when the high-speed fluid impacts the substrate 110, fully remove the heat accumulated in the substrate 110, and significantly reduce the heat dissipation thermal resistance. The main partition plate 131 is centrally arranged to hold the single rectangular guide channel 121 1. The flow channel is divided into two symmetrical flow channel regions on the left and right sides along the first direction X. After the coolant seeps down, it can be symmetrically and evenly distributed to both sides of the main baffle 131. The fluid flow rate and flow volume on both sides are completely consistent, avoiding the problem of lateral temperature difference and local heat accumulation on the substrate 110 caused by excessive flow on one side and insufficient flow on the other side. This further improves the overall temperature uniformity of the heating element. The main baffle 131 and the bottom of the guide channel 121 have a reserved flow gap. The fluid on the left and right sides of the guide channel 121 can be simultaneously turned back through the gap and merge into the adjacent second guide cavity 150. The flow velocity and impact intensity of the fluid turned back on both sides are kept uniform, which can reduce fluid turbulence and vortex generation, further reduce flow resistance and system pressure drop, and reduce energy consumption.

[0054] In the above embodiment, the boss 120 can be biased along the first direction X to the first side of the top surface of the substrate 110, and the second side of the top surface of the substrate 110 and the liquid outlet 162 are opposite to each other along the third direction Z. The first side of the top surface of the substrate 110 and the second side of the top surface of the substrate 110 are opposite sides of the top surface of the substrate 110. The bosses 120 are centrally arranged on one side of the substrate 110. After heat exchange, all the fluid flows uniformly to the liquid outlet channel 170 on the other side of the substrate 110. This allows for centralized planning of the side confluence area, preventing the confluence structure from encroaching on the heat exchange area of ​​the bosses 120. It ensures that the array of guide channels 121 on the bosses 120 completely covers the heat exchange area corresponding to the heat-generating element, and the effective heat exchange area is not reduced due to the confluence structure occupying space, thus ensuring heat exchange efficiency and maintaining low thermal resistance. The fluid flows from the heat exchange channel of one boss 120 to the other side, and the overall flow direction of the fluid is uniform and orderly, with a regular flow field distribution. This reduces the additional flow loss caused by multi-directional turbulence and cross vortices, reduces the overall flow resistance and system pressure drop, and reduces water pump energy consumption. At the same time, the bosses 120 and the liquid outlet channel 170 are arranged in separate areas, so the heat exchange area and the confluence area do not interfere with each other. The confluence fluid will not flow back and impact the coolant in the heat exchange area, preventing disordered flow distribution and local flow velocity imbalance in the heat exchange tank, avoiding heat exchange temperature difference and local overheating problems, and improving chip temperature uniformity.

[0055] In the above embodiments, the bottom of the flow channel 121 can be an arc-shaped structure, which protrudes towards the substrate 110. The bottom of the flow channel 121 is provided with an arc-shaped structure protruding towards the substrate 110. Compared with a flat bottom, the protruding arc-shaped surface can reduce the thickness of the fluid layer between the coolant and the heating surface of the substrate 110. The fluid flows closely to the surface of the substrate 110, weakening the thermal resistance of the heat exchange boundary layer and improving the heat transfer efficiency from the substrate 110 to the coolant, effectively reducing the overall heat dissipation thermal resistance. When the high-speed folding fluid impacts the arc-shaped surface, the arc-shaped surface can smoothly guide the fluid to change direction, avoiding the generation of severe eddies and stagnant areas at the bottom of the right-angled channel, reducing local flow losses, reducing local pressure drop in the flow channel, and reducing system pump consumption. The protruding arc-shaped surface also expands the effective contact heat exchange area between the coolant and the substrate 110. The flow channel 121 of the same size can carry more heat exchange, which is suitable for high heat flux conditions. At the same time, the arc-shaped surface can evenly disperse the fluid impact force, and the fluid impact intensity at all parts of the bottom of the channel tends to be consistent, further weakening the local temperature difference of the substrate 110 and improving the overall temperature uniformity of the device.

[0056] In the above embodiment, the bottom of the flow channel 121 extends to the substrate 110. The direct extension of the bottom of the flow channel 121 to the substrate 110 allows the bottom of the flow channel 121 to form an integrated continuous structure with the heating substrate 110. Heat can be directly conducted from the substrate 110 to the coolant within the flow channel 121, eliminating the contact thermal resistance caused by the assembly contact between the boss 120 and the substrate 110, shortening the heat transfer path, and reducing the overall heat dissipation thermal resistance. The coolant flows at high speed within the flow channel 121 and directly washes over the substrate 110 body. The fluid impact heat transfer effect can directly act on the core heating area, enhancing the convective heat transfer effect and adapting to the high heat flux density heat dissipation requirements of high-power chips.

[0057] In the above embodiments, at least two flow dividers 132 can be provided in both the first flow guiding cavity 140 and the second flow guiding cavity 150. The flow dividers 132 in the first flow guiding cavity 140 include a first flow divider 1321 and a second flow divider 1322. The first flow divider 1321 and the second flow divider 1322 are spaced apart along the second direction Y and located at the middle position of the first flow guiding cavity 140. The projection of the liquid inlet 161 along the third direction Z falls between the first flow divider 1321 and the second flow divider 1322.

[0058] The flow divider 132 in the second flow guide cavity 150 includes a third flow divider 1323 and a fourth flow divider 1324. The third flow divider 1323 and the fourth flow divider 1324 are spaced apart along the second direction Y at the middle position of the second flow guide cavity 150. Along the second direction Y, the first flow divider 1321 and the second flow divider 1322 are both located between the third flow divider 1323 and the fourth flow divider 1324. The end of the second flow guide cavity 150 along the second direction Y is connected to the liquid outlet channel 170.

[0059] It can be understood that the coolant flows in from the inlet 161 and enters the first guide cavity 140 area between the first and second diversion baffles 1321 and 1322. It then evenly disperses downwards into the bottom guide channels 121. After reaching the bottom of the guide channels 121, the coolant quickly turns back and flows upwards through the gap below the main baffle 131, merging into the second guide cavity 150 between the third and fourth diversion baffles 1323 and 1324. Since the first and second diversion baffles 1321 and 1322 are positioned along the second direction Y, they are generally within the area between the third and fourth diversion baffles 1323 and 1324. Within the interval 1324, the coolant that gathers in the area between the third diversion baffle 1323 and the fourth diversion baffle 1324 can be diverted to both sides and flow back from the two side guide channels 121 to the remaining area in the first guide cavity 140 except for the area between the first diversion baffle 1321 and the second diversion baffle 1322. The coolant continues to flow back and forth between the first guide cavity 140 and the second guide cavity 150, while gradually spreading to both sides along the second direction Y. Finally, all the fluid flows through the second guide cavity 150 and into the outlet channel 170 at both ends of the second direction Y and is discharged.

[0060] This flow pattern, in which the coolant oscillates back and forth between the first guide cavity 140 and the second guide cavity 150, and gradually diffuses to both sides along the second direction Y, allows the coolant to repeatedly scour the area where the bottom of the guide channel 121 meets the substrate 110, continuously forming a high-speed impact flow. This constantly disrupts the heat transfer boundary layer on the surface of the substrate 110, significantly improving the convective heat transfer coefficient, effectively reducing the overall heat dissipation thermal resistance, and enhancing the heat removal capability. Secondly, the fluid diffuses gradually from the center of the cavity to both sides, ensuring that all guide channels 121 receive a continuous and similar flow rate of coolant, eliminating the problem of excessively long fluid paths and flow rate attenuation in the far guide channels 121. This addresses the issue of uneven flow distribution across the entire substrate 110, eliminating temperature dead zones caused by low local flow velocities and heat accumulation, and significantly improving the temperature uniformity of the heating elements. Furthermore, the orderly stratification of the flow field through reciprocating and lateral diffusion eliminates large-scale cross-turbulence and concentrated eddies, resulting in lower fluid flow losses and effectively reducing the overall flow pressure drop of the cold plate 100, thus reducing the power consumption of the liquid cooling system's pump. Simultaneously, the multi-stage reciprocating and diffusion flow channel structure lengthens the effective heat exchange path, fully utilizing all the guide grooves 121 array of the bosses 120 for heat exchange, maximizing the heat exchange area of ​​the substrate 110, and adapting to the high heat flux dissipation conditions of high-power devices. In addition, it allows for easy adjustment of the optimal cooling area of ​​the cold plate 100 by controlling the distance between the first and second flow dividers 1321 and their positions within the first guide cavity 140, thereby adapting to the cooling requirements of different scenarios.

[0061] In the above embodiments, the flow divider 132 in the first flow guiding cavity 140 may further include a fifth flow divider 1325 and a sixth flow divider 1326. The fifth flow divider 1325 and the sixth flow divider 1326 are located at opposite ends of the first flow guiding cavity 140 along the second direction Y, and the first flow divider 1321 and the fifth flow divider 1325 are adjacent along the second direction Y, and the second flow divider 1322 and the sixth flow divider 1326 are adjacent along the second direction Y. It can be understood that the coolant flows in from the inlet 161, enters the first guide cavity 140 area between the first and second diversion baffles 1321 and 1322, and then evenly disperses downwards into the bottom guide channels 121. After reaching the bottom of the guide channel 121, the coolant quickly turns back and flows upwards through the gap below the main baffle 131 into the second guide cavity 150 between the third and fourth diversion baffles 1323 and 1324, converging in the area between the third and fourth diversion baffles 1323 and 1324. The coolant can be split to both sides, flowing back from the side guide channels 121 into the first guide cavity 140 between the first and fifth guide plates 1321 and 1325, and into the first guide cavity 140 between the second and sixth guide plates 1322 and 1326. After flowing back through the guide channels 121, it enters the second guide cavity 150 outside the area between the third and fourth guide plates 1323 and 1324, and finally flows from the second guide cavity 150 into the outlet channel 170 along the second direction Y. The coolant undergoes multiple jet backflows, impacting the bottom of all guide channels 121, quickly removing heat from the substrate 110, resulting in high heat exchange efficiency.

[0062] Furthermore, this application embodiment also provides a server, including the cold plate 100 in the above embodiment. When the cold plate 100 is working, coolant flows in through the inlet 161 of the cover plate 160. Because the projection of the inlet 161 along the third direction Z falls between two adjacent diversion baffles 132 in the second direction Y, the coolant directly flows into the large cavity area formed by the two diversion baffles 132 and the open first guide cavity 140. This cavity has sufficient flow space, and the flow resistance of the fluid is small when it flows through this area. Subsequently, the coolant is evenly distributed into the interior of each guide groove 121 below. After the coolant enters the guide groove 121, it passes through... The fluid extending from the end of the main partition 131 into the guide channel 121 passes through the gap between the end of the main partition 131 and the bottom of the guide channel 121, bypassing the main partition 131 to complete a rapid return and flow into the adjacent second guide cavity 150. During the return process, the fluid velocity is high and the flow rate is large. The high-speed fluid directly impacts the bottom substrate 110 of the guide channel 121, which can quickly remove the heat accumulated on the substrate 110, significantly enhancing the heat exchange capacity and reducing the overall heat dissipation thermal resistance and flow resistance. After the heat exchange is completed, the coolant is discharged from the outlet 162 through the end of the first guide cavity 140 or the second guide cavity 150 along the second direction Y, thereby improving the reliability of the server.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various implementations of this application.

Claims

1. A cold-rolled steel plate, characterized in that, include: The substrate (110) has a boss (120) on its top surface, and a plurality of flow channels (121) arranged in an array on the boss (120). The opening of the flow channels (121) is located on the top surface of the boss (120), and the bottom surface of the substrate (110) is configured to abut against the heating element. The baffle assembly (130) includes a plurality of main baffles (131) and at least two diversion baffles (132). The plurality of main baffles (131) are spaced apart on the boss (120) along a first direction (X). The main baffles (131) extend along a second direction (Y). The first end of the main baffle (131) extends into the guide groove (121) along a third direction (Z) and leaves a gap with the bottom of the groove. The second end extends out of the guide groove (121). The top surfaces of two adjacent main baffles (131) and the boss (120) together form a guide groove extending along the second direction (Y). The flow cavity is connected to the openings of two adjacent flow channels (121) along the first direction (X). The flow cavity includes a first flow cavity (140) with an open top and a second flow cavity (150) with a sealed top, which are staggered along the first direction (X). At least two flow dividers (132) are spaced apart in the first flow cavity (140) along the second direction (Y). The first direction (X), the second direction (Y) and the third direction (Z) are the width, length and thickness directions of the substrate (110), respectively. A cover plate (160) is provided on the outside of the boss (120) and seals the second end of the main partition plate (131). The cover plate (160) has an inlet (161) and an outlet (162). The projection of the inlet (161) along the third direction (Z) falls between two adjacent diversion partition plates (132) in the second direction (Y). The end of the first flow guide cavity (140) along the second direction (Y) and / or the end of the second flow guide cavity (150) along the second direction (Y) are connected to the outlet (162).

2. The cold-rolled plate according to claim 1, characterized in that, The side of the cover plate (160), the side of the boss (120), and the top surface of the substrate (110) together form a liquid outlet channel (170). The end of the first guide cavity (140) along the second direction (Y) and / or the end of the second guide cavity (150) along the second direction (Y) are connected to the liquid outlet channel (170). The liquid outlet channel (170) is connected to the liquid outlet (162). The guide cavity extends along the second direction (Y) to the opposite ends of the boss (120).

3. The cold-rolled plate according to claim 1, characterized in that, The boss (120) has a plurality of first partitions (122) spaced apart along the first direction (X) and a plurality of second partitions (123) spaced apart along the second direction (Y). The first partitions (122) extend along the second direction (Y) to opposite ends of the boss (120), and the second partitions (123) extend along the first direction (X) to opposite ends of the boss (120). The flow channel (121) is formed between two adjacent first partitions (122) and two adjacent second partitions (123).

4. The cold-rolled plate according to claim 1, characterized in that, The guide channel (121) is a rectangular guide channel (121), and the dimension of the guide channel (121) along the first direction (X) is greater than the dimension of the guide channel (121) along the second direction (Y). The main partition (131) is located in the middle of the guide channel (121) along the first direction (X).

5. The cold-rolled plate according to claim 1, characterized in that, The boss (120) is offset along the first direction (X) on the first side of the top surface of the substrate (110), and the second side of the top surface of the substrate (110) and the liquid outlet (162) are opposite to each other along the third direction (Z). The first side of the top surface of the substrate (110) and the second side of the top surface of the substrate (110) are opposite sides of the top surface of the substrate (110).

6. The cold-rolled plate according to claim 1, characterized in that, The bottom of the flow channel (121) is an arc-shaped structure, which protrudes toward the substrate (110).

7. The cold-rolled plate according to claim 1, characterized in that, The bottom of the flow channel (121) extends to the substrate (110).

8. The cold-rolled plate according to claim 2, characterized in that, Both the first flow guiding cavity (140) and the second flow guiding cavity (150) are provided with at least two flow dividing baffles (132). The flow dividing baffles (132) in the first flow guiding cavity (140) include a first flow dividing baffle (1321) and a second flow dividing baffle (1322). The first flow dividing baffle (1321) and the second flow dividing baffle (1322) are spaced apart along the second direction (Y) at the middle position of the first flow guiding cavity (140). The projection of the liquid inlet (161) along the third direction (Z) falls between the first flow dividing baffle (1321) and the second flow dividing baffle (1322). The flow divider (132) in the second flow guide cavity (150) includes a third flow divider (1323) and a fourth flow divider (1324). The third flow divider (1323) and the fourth flow divider (1324) are spaced apart along the second direction (Y) at the middle position of the second flow guide cavity (150). Along the second direction (Y), the first flow divider (1321) and the second flow divider (1322) are both located between the third flow divider (1323) and the fourth flow divider (1324). The end of the second flow guide cavity (150) along the second direction (Y) is connected to the liquid outlet channel (170).

9. The cold plate according to claim 8, characterized in that, The flow divider (132) in the first flow guide cavity (140) further includes a fifth flow divider (1325) and a sixth flow divider (1326). The fifth flow divider (1325) and the sixth flow divider (1326) are located at opposite ends of the first flow guide cavity (140) along the second direction (Y). The first flow divider (1321) and the fifth flow divider (1325) are adjacent along the second direction (Y), and the second flow divider (1322) and the sixth flow divider (1326) are adjacent along the second direction (Y).

10. A server, characterized in that, Includes the cold plate as described in any one of claims 1 to 9.

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