Control methods, equipment, media and products of liquid cooling systems

Abstract

This application provides a control method, device, medium, and product for a liquid cooling system, applied to electronic devices including a liquid cooling system. The method includes: controlling the operation of a piezoelectric micropump in the liquid cooling system; adjusting the driving parameters of the piezoelectric micropump when there is a correlation between the noise of the electronic device and the piezoelectric micropump, until the noise information of the electronic device meets noise constraints and the temperature information of the electronic device meets temperature constraints when the piezoelectric micropump is operated based on the adjusted driving parameters, then determining the adjusted driving parameters as target driving parameters; and controlling the piezoelectric micropump to operate with the target driving parameters. The method provided in this embodiment can adaptively adjust the driving parameters of the piezoelectric micropump, thereby achieving stable and effective noise reduction for the piezoelectric micropump.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a control method, device, medium, and product for a liquid cooling system. Background Technology

[0002] Liquid cooling systems rely on the piezoelectric effect of piezoelectric micropumps to drive the reciprocating vibration of a thin film, thereby circulating the coolant to achieve heat dissipation. The operating frequency of piezoelectric micropump liquid cooling systems is typically in the hundreds of hertz range. If installed in terminal devices such as mobile phones, the vibrations generated by the piezoelectric micropumps will be transmitted to the entire device through various structural components such as the pump body, adhesive layer, support bracket, circuit board, device frame, and back cover, thus causing low-frequency vibration noise in the electronic device.

[0003] Related technologies often reduce low-frequency vibration noise in piezoelectric micropump liquid cooling systems by changing the micropump placement, adding buffer materials, or setting two piezoelectric micropumps to operate in opposite phases. However, these noise reduction methods are all preset, fixed, and uniform adjustment schemes. Due to differences in the actual operating conditions of different terminals, the noise reduction effect often varies and the noise reduction capability is weakened in practical applications. Summary of the Invention

[0004] This application provides a control method, device, medium, and product for a liquid cooling system, which aims to provide stable and effective noise reduction for electronic devices.

[0005] In a first aspect, a control method for a liquid cooling system is applied to an electronic device including the liquid cooling system, the method comprising: Control the operation of the piezoelectric micropump in the liquid cooling system; When the noise of the electronic device is correlated with the piezoelectric micropump, the driving parameters of the piezoelectric micropump are adjusted until the noise information of the electronic device meets the noise constraint condition and the temperature information of the electronic device meets the temperature constraint condition when the piezoelectric micropump is run based on the adjusted driving parameters. Then the adjusted driving parameters are determined to be the target driving parameters. The piezoelectric micropump is controlled to operate with the target drive parameters.

[0006] Secondly, embodiments of this application provide an electronic device, characterized in that it includes: At least one processor; At least one memory for storing at least one program; The method described in the first aspect above is implemented when at least one of the programs is executed by at least one of the processors.

[0007] Thirdly, embodiments of this application provide a computer-readable storage medium, characterized in that the computer-readable storage medium stores computer-executable instructions, which are used to perform the method described in the first aspect above.

[0008] Fourthly, embodiments of this application provide a computer program product, including a computer program or computer instructions, characterized in that the computer program or computer instructions are stored in a computer-readable storage medium, a processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium, and the processor executes the computer program or computer instructions, causing the computer device to perform the method described in the first aspect above.

[0009] In this embodiment, the electronic device can adjust the driving parameters of the piezoelectric micropump when there is a correlation between noise and the piezoelectric micropump, until the temperature information of the electronic device meets the temperature constraint condition and the noise information meets the noise constraint condition. At this point, the target driving parameters are determined, and the piezoelectric micropump is controlled to operate with the target driving parameters. Through the method provided in this embodiment, the electronic device can adaptively adjust the driving parameters of the piezoelectric micropump, and simultaneously consider both noise and temperature constraints during the iterative adjustment of the driving parameters, ultimately selecting the target driving parameters that achieve low vibration and noise while ensuring heat dissipation. Therefore, the method provided in this embodiment can reduce the problems of unstable noise reduction effect and attenuated noise reduction capability caused by poor adaptability in traditional noise reduction schemes, thereby providing a stable and effective noise reduction solution for electronic devices.

[0010] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of a liquid cooling control system provided in an embodiment of this application; Figure 2 This is a schematic diagram of a noise reduction control module provided in an embodiment of this application; Figure 3 This is a schematic flowchart of a control method for a liquid cooling system provided in an embodiment of this application; Figure 4 This is a flowchart illustrating a correlation determination method provided in an embodiment of this application; Figure 5 This is a schematic diagram of a method for extracting noise feature information provided in an embodiment of this application; Figure 6This is a flowchart illustrating a method for adjusting driving parameters provided in an embodiment of this application; Figure 7 This is a schematic diagram of an adaptive optimization provided in an embodiment of this application; Figure 8 This is a schematic diagram of the control flow of a liquid cooling system provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0013] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0014] In the description of the embodiments of this application, unless otherwise expressly limited, terms such as setting, installing, and connecting should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in the embodiments of this application in combination with the specific content of the technical solution.

[0015] In this application, the terms "furthermore," "exemplarily," or "optionally" are used as examples, illustrations, or descriptions and should not be construed as being more preferred or advantageous than other embodiments or designs. The use of terms such as "furthermore," "exemplarily," or "optionally" is intended to present the relevant concepts in a specific manner.

[0016] The technical solutions of this application embodiment can be applied to various communication systems, such as: Wideband Code Division Multiple Access (WCDMA) mobile communication system, Evolved Universal Terrestrial Radio Access Network (EUTRAN) system, Next Generation Radio Access Network (NGRAN) system, Long Term Evolution (LTE) system, Worldwide Interoperability For Microwave Access (WiMAX) communication system, 5th Generation (5G) system, such as New Radio Access Technology (NR), and future communication systems, such as 6G system, etc.

[0017] With the rapid development of technology, users have increasingly higher demands for the performance of terminal devices such as mobile phones, tablets, and laptops, making the heat generation problem caused by high-load operation of these devices more and more prominent. To alleviate the temperature rise of terminal devices and ensure stable performance, researchers have successively applied various heat dissipation solutions to terminal devices, including graphite sheets, heat pipes, air cooling, and liquid cooling. Among them, liquid cooling systems, with their advantages of high heat dissipation efficiency and excellent temperature control, have become a key heat dissipation technology route currently under research.

[0018] Piezoelectric micropump liquid cooling systems represent a new generation of liquid cooling solutions. These systems typically rely on the piezoelectric effect of a piezoelectric crystal to drive the reciprocating vibration of a thin film, thereby propelling the coolant through the internal heat dissipation circuit of electronic devices. This allows the coolant to exchange heat with the heat-generating components, achieving a cooling effect. However, piezoelectric micropumps operate at frequencies reaching hundreds of hertz, with a common operating frequency of approximately 200 hertz. Due to this high operating frequency, the vibrations generated during operation are not confined to the pump body but are transmitted and diffused throughout the entire device via adhesive layers, mounting brackets, printed circuit boards (PCBs), the device frame, and the back cover. When the micropump's operating frequency and its harmonics fall into the low-to-mid-frequency range sensitive to human hearing, users may hear low-frequency vibrations such as "humming" or "clicking" from the device. This is especially noticeable with devices like mobile phones and tablets, which are frequently held close to the ear; due to the proximity, these low-frequency vibrations are easily perceived by users. Especially in scenarios where noise reduction or heat dissipation is critical, such as nighttime scenes, recording scenarios, video call scenarios, voice call scenarios, and gaming scenarios, the low-frequency vibration noise generated by the piezoelectric micropump can severely damage the user experience.

[0019] In related technologies, the operating noise of liquid cooling systems is often reduced by directly shutting down the piezoelectric micropumps in work scenarios with high noise reduction requirements, such as recording and making calls; changing the arrangement position of the piezoelectric micropumps; adding buffer materials to the piezoelectric micropumps; or setting the two piezoelectric micropumps to operate in opposite phases.

[0020] However, the relevant noise reduction technologies still have the following shortcomings: 1. Directly shutting down the piezoelectric micropump will prevent the liquid cooling system from dissipating heat from the heat-generating components, thus affecting the heat dissipation effect of electronic devices and failing to balance heat dissipation performance and quiet operation. 2. Uniform structural vibration reduction schemes, such as changing the placement of piezoelectric micropumps or adding buffer materials to the piezoelectric micropump accessories, cannot be adaptively adjusted according to the actual assembly of the terminal equipment. Due to assembly differences between different terminal equipment during the manufacturing process, the noise reduction effect varies in different terminal equipment. In addition, vibration reduction structures such as buffer materials require additional space, thereby increasing the size of electronic devices.

[0021] In summary, most existing noise reduction solutions are fixed designs and cannot be dynamically adjusted according to the actual structural state of the terminal device, the way it is held, the way it is placed on the table, the working scenario, and other conditions.

[0022] In view of this, this application proposes a control method for liquid cooling systems, which is applied to electronic devices equipped with liquid cooling systems. The method provided in this application can dynamically adjust the driving parameters of a piezoelectric micropump, thereby adaptively reducing noise based on the real-time operating status of the electronic device. Furthermore, in this application embodiment, when the electronic device dynamically adjusts the driving parameters, it can also determine whether the noise information and temperature information of the electronic device meet noise constraints and temperature constraints when the piezoelectric micropump operates with the adjusted driving parameters. The driving parameters when both noise and temperature information meet the noise and temperature constraints are determined as target driving parameters, and the piezoelectric micropump operation is controlled according to these target driving parameters. Therefore, the method provided in this embodiment can dynamically adjust the driving parameters of the piezoelectric micropump, such as the driving phase, driving amplitude, operating frequency, and driving duty cycle, while ensuring liquid cooling heat dissipation capacity. This allows the electronic device to reduce perceptible noise from the micropump in different operating scenarios, thereby significantly improving the user experience and enhancing the product competitiveness of the electronic device.

[0023] Furthermore, the method provided in this embodiment can acquire vibration and / or sound signals transmitted to the entire device or the user's perceived location in real time when the piezoelectric micropump is working, and determine whether the noise is related to the piezoelectric micropump based on the noise characteristic information corresponding to the vibration and / or sound signals. If there is a correlation between the noise and the piezoelectric micropump, the driving parameters of the piezoelectric micropump are adjusted. Since the noise sources of electronic devices are complex, in addition to the piezoelectric micropump, other devices such as chips, camera modules, and radio frequency modules also generate noise. The method provided in this embodiment determines whether the noise is related to the piezoelectric micropump through noise characteristic information, and only adjusts the driving parameters when the noise is caused by the micropump. This not only maintains the original heat dissipation conditions of the piezoelectric micropump in noise scenarios not caused by the piezoelectric micropump, providing a stable heat dissipation effect for the electronic device, but also reduces meaningless adjustment operations and lowers the overall power consumption of the electronic device.

[0024] Figure 1 This is a schematic diagram of a liquid cooling control system provided in an embodiment of this application. The electronic device 11 may include a heating module 1101, a liquid cooling circulation module 1102, a micro-pump drive circuit 1103, a sensor unit 1104, and a system processor 1105. It should be noted that the electronic device described in any embodiment of this application can be any device capable of installing a liquid cooling system, such as a smartphone, foldable phone, gaming phone, tablet computer, laptop computer, handheld gaming device, augmented reality (AR) device, virtual reality (VR) device, computer, server, or network device. This application embodiment is not intended to specifically limit the electronic device.

[0025] The system processor 1105 may include a noise reduction control module to control the liquid cooling circulation module 1102 and the micropump drive circuit 1103, thereby controlling the operation of the liquid cooling system. Specifically, the liquid cooling circulation module 1102 may include a liquid cooling plate and coolant piping. The liquid cooling plate is attached to the heat-generating components such as the electronic device's heat-generating chip and processor to quickly absorb the heat generated by these components. The coolant piping is connected to the liquid cooling plate, forming a circulation channel through which coolant flows to the liquid cooling plate to remove heat generated by the heat-generating components, achieving heat dissipation and cooling. The liquid cooling system may include at least one piezoelectric micropump, which is the power unit driving the coolant circulation. The micropump drive circuit is connected to the piezoelectric micropump and outputs a drive signal to the piezoelectric micropump to drive the reciprocating vibration of the diaphragm inside the piezoelectric micropump using the piezoelectric effect, thereby providing circulation power for the coolant in the coolant piping and propelling the coolant to circulate within the liquid cooling circulation module.

[0026] Figure 2 This is a schematic diagram of a noise reduction control module provided in an embodiment of this application. Figure 2 As shown, the noise reduction control module 12 may include a micro-pump drive module 1201, a vibration and sound detection module 1202, a thermal state detection module 1203, a scene recognition module 1204, an adaptive control module 1205, and a parameter storage module 1206.

[0027] The micropump drive module 1201 can output a drive signal to the piezoelectric micropump through the micropump drive circuit. The piezoelectric micropump can respond to the drive signal to make the coolant circulate in the liquid cooling circulation module. At the same time, the diaphragm of the piezoelectric micropump will drive other structural components on the electronic equipment to vibrate during the reciprocating operation, thereby generating noise.

[0028] The vibration and sound detection module 1202 can acquire vibration signals and / or sound signals from the electronic device and transmit the acquired vibration signals and / or sound signals to the adaptive control module. Specifically, the vibration and sound detection module 1202 can acquire vibration signals collected by the accelerometer on the electronic device and / or sound signals collected by the microphone. Both the vibration signals and sound signals can be piezoelectric self-inductance signals.

[0029] The adaptive control module 1205 can recalculate the driving parameters of the piezoelectric micropump by combining the operating scenario of the electronic device provided by the scene recognition module and the temperature information of each target component collected by the thermal state detection module. Specifically, the driving parameters may include at least one of phase, driving amplitude, operating frequency, and duty cycle. The adaptive control module 1205 can send the adjusted driving parameters to the micropump driving module 1201, so that the micropump driving module 1201 controls the operation of the piezoelectric micropump according to the adjusted driving parameters. Specifically, the adaptive control module 1205 can minimize the noise value at the target noise reduction location under temperature constraints. The temperature constraints are related to industry standards and enterprise standards, and different products have different temperature constraints in different application scenarios. The noise value can be obtained through professional instrumentation, subjective human evaluation, or calculation from signals collected by sensors such as microphones, accelerometers, and piezoelectric sensors.

[0030] The thermal status detection module 1203 can collect temperature information of various target components on electronic devices. For example, temperature information such as System on Chip (SoC) temperature, battery temperature, charging chip temperature, liquid cooler temperature, and ambient temperature.

[0031] The scene recognition module 1204 is used to determine the current working scene of the electronic device. This module can determine the working scene based on information such as the running status of applications, screen orientation, touch area, audio recording status, call status, charging status, ambient noise, and user grip status, and transmit the working scene to the adaptive control module. The adaptive control module 1205 can adjust the driving parameters of the piezoelectric micropump according to the working scene of the electronic device. For example, in a gaming scene, heat dissipation is a high priority, and the adaptive control module 1205 needs to prioritize heat dissipation while reducing significant low-frequency vibration noise when adjusting the driving parameters; in a recording or video conferencing scene, noise reduction is a high priority, and the adaptive control module 1205 prioritizes reducing low-frequency vibration noise that can enter the microphone when adjusting the driving parameters; in a nighttime scene, users are more sensitive to faint humming sounds, and the adaptive control module 1205 further reduces low-frequency vibration noise.

[0032] The parameter storage module 1206 is used to store the driving parameters corresponding to the electronic device under various usage states. For example, the system can determine the driving parameters corresponding to different usage states of the electronic device at the factory stage and store each usage state and its corresponding driving parameters in a driving parameter table. During actual use, the parameter storage module 1206 can also update the driving parameter table according to the target driving parameters determined by the adaptive control module. The parameter storage module 1206 can reduce the search time when the liquid cooling system starts up, enabling the liquid cooling system to quickly recall driving parameters under similar temperatures, similar attitudes, and similar scenarios, so as to control the piezoelectric micropump operation based on the low-noise driving parameters determined during use. At the same time, since the state of the piezoelectric micropump, adhesive layer, structural components, and coolant may change over time, the parameter storage module 1206 can also adjust the stored driving parameters according to the aging state of the liquid cooling system, assembly differences of the electronic device, and environmental changes, so that the driving parameters are more consistent with the actual operating state of the electronic device.

[0033] The adaptive control module 1205 is the core component of this application. This module can receive the current driving parameters of the piezoelectric micropump, vibration signals and / or sound signals, temperature information of various components on the electronic device, and the operating scenario of the electronic device. It adjusts the driving parameters of the piezoelectric micropump when noise is correlated with the piezoelectric micropump. It should be noted that the adaptive control module can calculate the driving parameters using rule-based models, lookup table models, lightweight optimization algorithms, or machine learning models. It can also calculate the adjusted driving parameters through any method known to those skilled in the art, such as sequential traversal adjustment. As long as it dynamically adjusts the driving parameters of the piezoelectric micropump based on vibration signals and / or sound signals, it falls within the scope of this invention. The embodiments in this application are not intended to specifically limit the calculation method of the driving parameters.

[0034] Therefore, the control system of the liquid cooling system provided in this application embodiment can form a closed-loop control link of "micro-pump driving - acquisition of vibration / sound signals - extraction of noise feature information - updating of driving parameters - judgment of temperature constraints". Thus, unlike the related art schemes that fix the driving parameters of the piezoelectric micropump, the method provided in this application embodiment can continuously correct the working state of the piezoelectric micropump according to the actual noise feedback and temperature constraints of the electronic device, thereby achieving a technical effect of balancing heat dissipation and noise reduction.

[0035] This embodiment provides a control method for a liquid cooling system applied to the above-mentioned liquid cooling control system. Figure 3 This is a schematic flowchart illustrating a control method for a liquid cooling system provided in an embodiment of this application. Figure 3 As shown, the control methods for the liquid cooling system may include, but are not limited to, S301 to S303: S301, Control the operation of the piezoelectric micropump in the liquid cooling system; S302. When there is a correlation between the noise of the electronic device and the piezoelectric micropump, the driving parameters of the piezoelectric micropump are adjusted until the noise information of the electronic device meets the noise constraint condition and the temperature information of the electronic device meets the temperature constraint condition when the piezoelectric micropump is run based on the adjusted driving parameters. Then the adjusted driving parameters are determined as the target driving parameters. S303 controls the piezoelectric micropump to operate with the target drive parameters.

[0036] In S301, after the electronic device controls the piezoelectric micropump to run, it can determine whether there is a correlation between the current noise of the electronic device and the piezoelectric micropump. If it is determined that there is no correlation between the current noise of the electronic device and the piezoelectric micropump, the electronic device does not need to adjust the driving parameters of the piezoelectric micropump, that is, the electronic device can maintain the piezoelectric micropump running with the current driving parameters.

[0037] In S302, when there is a correlation between the noise of the electronic device and the piezoelectric micropump, the electronic device can adjust the driving parameters of the piezoelectric micropump and control its operation according to the adjusted driving parameters. Then, while the piezoelectric micropump is operating with the adjusted driving parameters, the electronic device can acquire its noise and temperature information and determine whether the noise information meets the noise constraint condition and the temperature information meets the temperature constraint condition.

[0038] If the electronic device determines that the noise information does not meet the noise constraint conditions and / or the temperature information does not meet the temperature constraint conditions, the electronic device may return to the step of adjusting the drive parameters of the piezoelectric micropump and subsequent steps. Specifically, if the electronic device determines that the noise information does not meet the noise constraint conditions and / or the temperature information does not meet the temperature constraint conditions, the electronic device may return to the step of adjusting the drive parameters of the piezoelectric micropump and control the operation of the piezoelectric micropump according to the new adjusted drive parameters to readjust the drive parameters of the piezoelectric micropump until the noise information of the electronic device meets the noise constraint conditions and the temperature information of the electronic device meets the temperature constraint conditions when the piezoelectric micropump is running based on the adjusted drive parameters.

[0039] When the electronic device determines that the noise information meets the noise constraint condition and the temperature information meets the temperature constraint condition, the electronic device can determine the adjusted driving parameters currently used to control the operation of the piezoelectric micropump as the target driving parameters.

[0040] In S303, after the electronic device determines the target drive parameters, it can maintain the piezoelectric micropump operating at those target drive parameters.

[0041] In one embodiment, the electronic device can control the piezoelectric micropump to operate at the target drive parameters during the current cooling cycle. The cooling cycle can be a pre-set time period. The electronic device can maintain the piezoelectric micropump operating at the target drive parameters during the current cooling cycle, and upon reaching the next cooling cycle, return to the step of determining whether there is a correlation between the noise of the electronic device and the piezoelectric micropump, and subsequent steps. That is, upon reaching the next cooling cycle, if the electronic device determines that there is a correlation between the noise and the piezoelectric micropump, the electronic device can readjust the drive parameters of the piezoelectric micropump.

[0042] In one embodiment, the electronic device can control the piezoelectric micropump to operate with the target driving parameters during the current operating cycle of the liquid cooling system. The operating cycle of the liquid cooling system can be determined based on the on / off state of the piezoelectric micropump; that is, after determining the target driving parameters, the electronic device can control the piezoelectric micropump to operate based on those parameters until it is turned off.

[0043] In one embodiment, after the electronic device determines the target driving parameters and controls the piezoelectric micropump to operate at the target driving parameters, it can periodically determine whether there is a correlation between the noise of the electronic device and the piezoelectric micropump within a preset time interval during the current operating cycle of the liquid cooling system. If the electronic device determines that there is no correlation between the noise and the piezoelectric micropump, it can maintain the piezoelectric micropump operating at the target driving parameters. If the electronic device determines that there is a correlation between the noise and the piezoelectric micropump, it can return to execute S302~S303.

[0044] In S301 to S303 above, the electronic device can adjust the driving parameters of the piezoelectric micropump when there is a correlation between noise and the piezoelectric micropump, and control the piezoelectric micropump to operate with target driving parameters that satisfy both noise and temperature constraints. In this embodiment, since the electronic device can adaptively adjust the driving parameters of the piezoelectric micropump until both noise and temperature constraints are met, the method provided in this embodiment enables the electronic device to reduce the noise caused by the piezoelectric micropump while ensuring the heat dissipation effect of the liquid cooling system.

[0045] Furthermore, in the method provided in this embodiment, the electronic device does not adjust the piezoelectric micropump according to fixed parameters, but rather adaptively adjusts the driving parameters of the piezoelectric micropump based on the actual temperature and noise information of the electronic device. Therefore, the method provided in this embodiment can make the target driving parameters conform to the actual operating conditions of the electronic device, reducing noise reduction errors caused by differences in the actual operating state or assembly of the electronic device, thereby providing a stable noise reduction effect and improving the noise reduction capability of the electronic device. Thus, this application embodiment provides a closed-loop parameter adjustment method, that is, instead of setting the driving parameters all at once, the driving parameters are continuously adjusted according to the actual state of the electronic device during operation, so that the noise reduction effect of the piezoelectric micropump can adapt to different structural states and operating scenarios of the electronic device.

[0046] Furthermore, in this embodiment, the electronic device only adjusts the driving parameters of the piezoelectric micropump when there is a correlation between the noise and the piezoelectric micropump. That is, when the noise is unrelated to the piezoelectric micropump, the electronic device will not adjust the driving parameters of the piezoelectric micropump, thereby reducing invalid parameter adjustment operations, saving the computing resources of the electronic device, and making the noise reduction operation of the electronic device more accurate.

[0047] The above is a general description of S301 to S303. The following is a detailed description of the specific implementation process of S301 to S303.

[0048] In one embodiment, the process before S301 may include: If the temperature of the heating element in the electronic device meets the start-up conditions, obtain the current usage status information of the electronic device. Based on the usage status information of the electronic device, the drive parameter table is queried to determine the preset drive parameters; the preset drive parameters are used to control the initial operation of the piezoelectric micropump of the liquid cooling system.

[0049] In one embodiment, S301 may include: The piezoelectric micropump is controlled based on preset driving parameters.

[0050] In one embodiment, S303 may include: Update the drive parameter table with the target drive parameters, which includes the preset drive parameters of the piezoelectric micropump.

[0051] Specifically, the drive parameter table can contain multiple different usage status information and the corresponding initial drive parameters for each usage status. The usage status information of the electronic device can be used to represent the current usage status of the electronic device. This usage status information may include, but is not limited to, the electronic device's temperature, micro-pump frequency, grip status, or common usage scenarios. In one embodiment, when the electronic device is in the powered-on state, the first temperature information of each heat-generating component on the electronic device can be acquired, and the power-on condition can be determined based on the temperature information of the heat-generating components. The heat-generating components of the electronic device may include, but are not limited to, components such as a System-on-Chip (SOC), earpiece, battery, and casing. If the temperature information of the heat-generating components of the electronic device does not meet the power-on condition, the electronic device can keep the liquid cooling system and the piezoelectric micropump in a powered-off state. The electronic device can also operate in a low-power standby state.

[0052] In one embodiment, the first temperature information can be the first temperature value corresponding to the heating element. After obtaining the first temperature value corresponding to each heating element on the electronic device, it can be determined whether the first temperature value of the heating element is greater than or equal to the first temperature threshold corresponding to the heating element. If the first temperature value of at least one heating element is greater than or equal to the first temperature threshold corresponding to the heating element, it can be determined that the temperature information of the heating element meets the start-up condition, and the usage status information of the electronic device can be obtained to query the parameter table based on the usage status information. If the first temperature values ​​of all heating elements are less than the first temperature threshold corresponding to the heating element, it can be determined that the temperature information of the heating element does not meet the start-up condition, and the electronic device can keep the liquid cooling system in the off state.

[0053] For example, when the electronic device is powered on, the first temperature values ​​corresponding to the earpiece, battery, casing, and on-chip system can be obtained respectively. If the first temperature value of the earpiece is greater than the first temperature threshold corresponding to the earpiece, the first temperature value of the battery is less than the first temperature threshold corresponding to the battery, the first temperature value of the casing is less than the first temperature threshold corresponding to the casing, and the first temperature value of the on-chip system is less than the first temperature threshold corresponding to the on-chip system, then it can be determined that the temperature information of the heating element meets the startup conditions. If the first temperature value of the earpiece is less than the first temperature threshold corresponding to the earpiece, the first temperature value of the battery is less than the first temperature threshold corresponding to the battery, the first temperature value of the casing is less than the first temperature threshold corresponding to the casing, and the first temperature value of the on-chip system is less than the first temperature threshold corresponding to the on-chip system, then it can be determined that the temperature information of the heating element does not meet the startup conditions.

[0054] In one embodiment, after the electronic device determines the target driving parameters, it can obtain the current usage status information of the electronic device, and then update the driving parameter table according to the current usage status information and the target driving parameters.

[0055] In this embodiment, after the electronic device determines the target driving parameters, it can update the driving parameter table based on the target driving parameters. The driving parameter table is used to determine the driving parameters controlling the initial operation of the piezoelectric micropump when it starts up. When the electronic device restarts the piezoelectric micropump under the same usage conditions, the system can preferentially call the preset driving parameters in the driving parameter table, reducing the adjustment time of the driving parameters. Through the method provided in this embodiment, the electronic device can continuously update the preset driving parameters in the driving parameter table, so that the piezoelectric micropump can directly operate according to the adjusted and optimized driving parameters upon the next startup. This shortens the startup response time of the piezoelectric micropump and allows the piezoelectric micropump to automatically reuse the driving parameters most suitable for the current state upon startup, further reducing the adjustment time of the driving parameters.

[0056] In one embodiment, the temperature constraint condition in S302 can be obtained according to the following steps: Determine the heat dissipation constraints of the electronic equipment based on its operating environment; Based on the heat dissipation constraint information, determine the temperature constraint conditions.

[0057] Table 1 is a schematic table of heat dissipation constraint information provided in an embodiment of this application. As shown in Table 1, the heat dissipation constraint information may include heat dissipation constraint objects and temperature constraint conditions. Temperature constraint conditions include that the current temperature of the heat dissipation constraint object is less than or equal to the temperature threshold corresponding to the heat dissipation constraint object. Heat dissipation constraint objects may include, but are not limited to, heat-generating components such as SOC, earpiece, battery, and casing. The working scenario can be determined based on information such as the running status of the application in the electronic device, screen orientation, touch area, audio recording status, call status, charging status, ambient noise, and user grip status. It should be noted that the electronic device can determine the working scenario by any method known to those skilled in the art, and the embodiments of this application are not intended to specifically limit the method for determining the working scenario. The working scenario may include, but is not limited to, nighttime scenarios, quiet environment scenarios, recording scenarios, video conferencing scenarios, voice call scenarios, and gaming scenarios.

[0058] Table 1. Schematic diagram of heat dissipation constraint information

[0059] In one embodiment, the noise constraint condition in S302 includes that the adjusted noise value of the electronic device is less than the original noise value of the electronic device. The noise value characterizes the noise level of the electronic device. The original noise value corresponds to the noise value generated by the piezoelectric micropump operating with the original driving parameters. Specifically, the original driving parameters can be preset driving parameters, meaning the original noise value can correspond to the noise value generated by the piezoelectric micropump operating with the preset driving parameters. The adjusted noise value corresponds to the noise value generated by the piezoelectric micropump operating with the adjusted driving parameters.

[0060] In one possible implementation of S302, when there is a correlation between noise and the piezoelectric micropump, the electronic device can obtain the noise value before adjustment and determine the heat dissipation constraint object and temperature constraint condition based on the current working scenario. The noise value before adjustment can be calculated based on the sound signal and / or vibration signal collected when the electronic device is running with the drive parameters before adjustment. The electronic device can calculate the noise value using any method known to those skilled in the art, such as the frequency domain noise power integration method, the harmonic characteristic weighted summation method, or the root mean square (RMS) calculation method. This application embodiment is not intended to specifically limit the method for calculating the noise value.

[0061] The electronic device can determine the adjusted driving parameters and control the piezoelectric micropump to operate based on these parameters. Then, while the piezoelectric micropump operates with the adjusted driving parameters, the electronic device can collect the second temperature value and the adjusted noise value corresponding to each heat dissipation constraint.

[0062] The electronic device can determine whether the second temperature value of the heat dissipation constraint object is less than or equal to the temperature threshold corresponding to the heat dissipation constraint object, and whether the noise value after adjustment is less than the noise value of the electronic device before adjustment.

[0063] If the electronic device determines that the second temperature value of at least one heat dissipation constraint object is greater than the temperature threshold corresponding to the heat dissipation constraint object, and / or the adjusted noise value is greater than or equal to the original noise value of the electronic device, the electronic device may return to the step of adjusting the drive parameters of the piezoelectric micropump and redetermine the adjusted drive parameters.

[0064] If the electronic device determines that the second temperature value of all heat dissipation constraint objects is less than or equal to the temperature threshold corresponding to the heat dissipation constraint object, and the adjusted noise value is less than the original noise value of the electronic device, then the electronic device can determine the currently adjusted driving parameter as the target driving parameter.

[0065] Figure 4 This is a flowchart illustrating a correlation determination method provided in an embodiment of this application. For example... Figure 4 The specific process for determining the correlation between noise and the piezoelectric micropump before S302 may include, but is not limited to, S401 to S402: S401. Based on the vibration signal and / or sound signal of the electronic device, determine the noise characteristic information corresponding to the piezoelectric micropump; S402. Determine the correlation between the noise of electronic devices and piezoelectric micropumps based on noise characteristic information.

[0066] In S401, the electronic device can acquire sound signals via a microphone and vibration signals via an accelerometer or structural vibration sensor. The sampling frequencies of the microphone, accelerometer, and structural vibration sensor can cover the operating frequency of the piezoelectric micropump and its corresponding harmonic frequency band. For example, when the piezoelectric micropump operates around several hundred hertz, the microphone sampling frequency can be set to several times the maximum operating frequency of the piezoelectric micropump to ensure that the relevant signals of the piezoelectric micropump's operating frequency, its second harmonic, and its third harmonic can all be acquired by the microphone.

[0067] In S401, the noise characteristic information may include at least one of the following: Fundamental frequency amplitude, used to represent the amplitude of vibration and / or sound signals at the operating frequency of the piezoelectric micropump; Second harmonic amplitude, which can represent the amplitude of vibration signal and / or sound signal under second harmonic conditions; the second harmonic is twice the current operating frequency of the piezoelectric micropump; The third harmonic amplitude can represent the amplitude of a vibration signal and / or sound signal under the third harmonic; the third harmonic is three times the operating frequency of the piezoelectric micropump. Broadband vibration energy can represent the average amplitude of vibration signals and / or sound signals within a frequency range; the frequency range is determined based on the operating frequency of the piezoelectric micropump. Noise amplitude, which can represent the amplitude of the noise signal of electronic equipment when the piezoelectric micropump is in operation; First-time synchronization information can represent the time synchronization between the noise signal and the drive signal of the piezoelectric micropump; The second time synchronization information can represent the time synchronization between the abrupt change signal in the noise signal and the drive signal of the piezoelectric micropump; the abrupt change signal is the signal in the noise signal whose amplitude change satisfies the abrupt change threshold.

[0068] Specifically, after an electronic device collects a sound signal through a microphone, it can determine the noise signal of the electronic device based on the sound signal. Specifically, the electronic device can extract the noise signal from the sound signal using any algorithm known to those skilled in the art, such as electrical signal noise recognition algorithms, frequency domain filtering, or Multiple Signal Classification (MUSIC) algorithms. It should be noted that the embodiments in this application are not intended to specifically limit the method for extracting noise signals.

[0069] After the electronic device extracts the noise signal, it can determine the first time synchronization information based on the occurrence time of the noise signal and the output time of the piezoelectric micropump's drive signal to the micropump drive circuit. Specifically, the first time synchronization information can be the time difference between the occurrence time of the noise signal and the output time of the drive signal.

[0070] After the electronic device extracts the noise signal, it can also determine the second time synchronization information based on the occurrence time of the abrupt change signal in the noise signal and the output time of the piezoelectric micropump's drive signal to the micropump drive circuit. Specifically, the second time synchronization information can be the time difference between the occurrence time of the abrupt change signal and the output time of the drive signal.

[0071] In this embodiment, the electronic device does not directly determine whether the driving parameters of the piezoelectric micropump need to be adjusted based on the magnitude of the noise value. Instead, it determines the correlation between the noise and the piezoelectric micropump based on noise characteristic information. Since noise characteristic information such as the fundamental frequency amplitude, second harmonic amplitude, third harmonic amplitude, broadband vibration energy, noise amplitude, first time synchronization information, and second time synchronization information are all determined based on the operating frequency of the piezoelectric micropump or the timing of its driving signal, this noise characteristic information can accurately characterize the correlation between the noise and the piezoelectric micropump. Therefore, using the method provided in this embodiment, the electronic device can accurately determine whether the noise is caused by the piezoelectric micropump, and only adjust the driving parameters of the piezoelectric micropump when the noise is indeed caused by it, thereby improving the accuracy of the noise reduction operation performed by the electronic device.

[0072] Furthermore, the first and second time synchronization information can represent the correlation between noise and the piezoelectric micropump in the time domain; the fundamental frequency amplitude, second harmonic amplitude, third harmonic amplitude, broadband vibration energy, and noise amplitude can represent the correlation between noise and the piezoelectric micropump in the frequency domain. The method provided in this embodiment allows electronic devices to determine the correlation between noise and the piezoelectric micropump from both time and frequency domain dimensions, reducing misjudgments caused by relying solely on single-dimensional features and thus increasing the accuracy of correlation judgment. Therefore, combining multi-dimensional correlation judgment of noise sources improves accuracy and reliability, enabling precise identification of whether electronic device noise is caused by the operation of the piezoelectric micropump. This provides an accurate basis for subsequent targeted adjustment of micropump drive parameters and suppression of pump source vibration noise, reducing interference from irrelevant noise on noise reduction control logic and improving the overall noise suppression effect.

[0073] In one embodiment, S401 may include: Frequency domain analysis of vibration and / or sound signals is performed to determine the noise characteristics of the piezoelectric micropump.

[0074] Figure 5This is a schematic diagram of a method for extracting noise feature information provided in an embodiment of this application. For example... Figure 5 As shown, after acquiring the vibration and sound signals, Fourier transforms can be performed on them respectively to obtain the frequency spectra of the vibration and sound signals. Then, frequency domain analysis can be performed based on the frequency spectra of the vibration and sound signals to determine the noise characteristics of the piezoelectric micropump.

[0075] Specifically, frequency domain analysis may include, but is not limited to, determining the amplitude corresponding to the operating frequency based on the spectrum diagrams of the vibration signal and the sound signal; determining the amplitude corresponding to the second harmonic based on the spectrum diagrams of the vibration signal and the sound signal, wherein the second harmonic is twice the operating frequency of the piezoelectric micropump; and determining the amplitude corresponding to the third harmonic based on the spectrum diagrams of the vibration signal and the sound signal, wherein the third harmonic is three times the operating frequency of the piezoelectric micropump.

[0076] In one embodiment, for vibration signals, the electronic device can also calculate the root mean square values ​​of acceleration corresponding to the operating frequency fp, second harmonic 2fp, and third harmonic 3fp of the piezoelectric micropump, respectively, to determine the fundamental frequency amplitude, second harmonic amplitude, and third harmonic amplitude.

[0077] The method provided in this embodiment does not determine whether the drive parameters of the piezoelectric micropump need to be adjusted based solely on the magnitude of the noise value. Instead, it determines whether the current noise of the electronic device is caused by the operation of the piezoelectric micropump and whether the noise's performance in the overall structure needs to be adjusted.

[0078] In one embodiment, when the noise characteristic information meets the correlation condition, the electronic device can determine that there is a correlation between the noise of the electronic device and the piezoelectric micropump. When the noise characteristic information does not meet the correlation condition, the electronic device can determine that there is no correlation between the noise of the electronic device and the piezoelectric micropump.

[0079] In one embodiment, the first time synchronization information may include a first time difference. The first time difference may be the time difference between the occurrence time of the noise signal and the output time of the drive signal. The second time synchronization information may include a second time difference. The second time difference may be the time difference between the occurrence time of the abrupt change signal in the noise signal and the output time of the drive signal. When the fundamental frequency amplitude is greater than a first amplitude threshold, the second harmonic amplitude is greater than a second amplitude threshold, the third harmonic amplitude is greater than a third amplitude threshold, the broadband vibration energy is greater than an energy threshold, the noise amplitude is greater than a fourth amplitude threshold, the first time difference is less than the first time threshold, and the second time difference is less than the second time threshold, and all of the above conditions are simultaneously met, it can be determined that the noise characteristic information satisfies the correlation condition.

[0080] If at least one of the following conditions is not met, it can be determined that the noise characteristic information does not meet the correlation condition: the fundamental frequency amplitude is greater than the first amplitude threshold, the second harmonic amplitude is greater than the second amplitude threshold, the third harmonic amplitude is greater than the third amplitude threshold, the broadband vibration energy is greater than the energy threshold, the noise amplitude is greater than the fourth amplitude threshold, the first time difference is less than the first time threshold, and the second time difference is less than the second time threshold.

[0081] Figure 6 This is a flowchart illustrating a driving parameter adjustment method provided in an embodiment of this application. Figure 6 The specific process for adjusting the drive parameters in S302 may include, but is not limited to, S601: S601. Determine the driving parameters of the piezoelectric micropump based on the working scenario of the electronic device. The driving parameters are used to adjust the piezoelectric micropump.

[0082] In one embodiment, S601 includes: Determine the adjustment strategy for the piezoelectric micropump based on the working scenario of the electronic device; Adjust the driving parameters of the piezoelectric micropump according to the adjustment strategy.

[0083] In one possible implementation, the adjustment strategy may include an adjustment method. The electronic device can directly determine the adjustment method of the piezoelectric micropump based on its operating scenario. The adjustment method includes the driving parameters to be adjusted and / or the target noise reduction position. The driving parameters of the piezoelectric micropump are adjusted according to the driving parameters to be adjusted and / or the target noise reduction position. The driving parameters to be adjusted may include at least one of the following: driving phase, driving phase difference, operating frequency, driving amplitude, driving duty cycle, and the piezoelectric micropump activation order. The driving phase difference can be used to represent the phase difference between any two piezoelectric micropumps. The target noise reduction position can be any location on the electronic device. For example, in a gaming scenario, the target noise reduction position may be the casing of the electronic device; in a recording or video conferencing scenario, the target noise reduction position may be the microphone. The piezoelectric micropump activation order can be used to represent the order in which each piezoelectric micropump is activated when multiple piezoelectric micropumps are installed in the electronic device.

[0084] Because users have varying degrees of noise sensitivity in different scenarios, the noise reduction targets of electronic devices for piezoelectric micropumps also differ. For example, in gaming scenarios, users have a higher tolerance for slight noise; therefore, when adjusting drive parameters, priority should be given to ensuring heat dissipation performance and avoiding significant frequency throttling of the electronic device. In recording scenarios, the thermal load of the electronic device is low, but the noise generated by the piezoelectric micropump is easily picked up by the microphone, thus affecting recording quality; therefore, priority should be given to reducing the noise caused by the piezoelectric micropump. Thus, the method provided in this embodiment determines the adjustment method based on the working scenario, solving the technical problem that a single parameter cannot adapt to all scenarios. It takes into account the device performance requirements and noise control requirements in different scenarios, dynamically balancing heat dissipation and noise reduction requirements while ensuring user experience, thereby providing a better user experience.

[0085] Table 2 is a configuration table of adjustment methods provided in the embodiments of this application. As shown in Table 2, when the working scenario of the electronic device is a game scenario, the driving parameters to be adjusted can be determined as phase difference and working frequency; when the working scenario of the electronic device is a fast charging scenario, the target noise reduction position can be determined as the housing; when the working scenario of the electronic device is a recording scenario or a video conferencing scenario, the target noise reduction position can be determined as the microphone; when the working scenario of the electronic device is a night scenario, the driving parameters to be adjusted can be determined as driving amplitude and driving duty cycle; when the working scenario of the electronic device is a desktop placement scenario, the driving parameters to be adjusted can be determined as working frequency and driving phase.

[0086] Table 2 Adjustment Method Configuration Table

[0087] In one possible implementation, the adjustment strategy may include heat dissipation priority and / or noise reduction priority. The electronic device can first determine the heat dissipation priority and / or noise reduction priority of the piezoelectric micropump based on its operating scenario. Then, the electronic device can determine the adjustment method for the piezoelectric micropump based on these priorities.

[0088] The method provided in this embodiment first determines the heat dissipation priority and / or noise reduction priority according to the working scenario, and then determines the adjustment method of the piezoelectric micropump according to the heat dissipation priority and / or noise reduction priority. This decouples the working scenario from the adjustment method, so that R&D personnel do not need to set the adjustment method separately for each working scenario, and the adjustment method of newly added working scenarios can also be quickly configured by configuring priorities, reducing development and debugging costs.

[0089] Table 3 is a priority configuration table provided in an embodiment of this application. As shown in Table 3, in the case of a gaming scenario or a fast charging scenario, the priority of heat dissipation can be determined to be high and the priority of noise reduction to be low; in the case of a recording scenario, a video conferencing scenario, or a nighttime scenario, the priority of heat dissipation can be determined to be low to medium and the priority of noise reduction to be high; in the case of a desktop placement scenario, the priority of heat dissipation can be determined to be medium and the priority of noise reduction to be medium to high.

[0090] Table 3 Priority Configuration Table

[0091] In one embodiment, the working scenario in S601 includes a first working scenario, and the piezoelectric micropump in the electronic device includes a first piezoelectric micropump and a second piezoelectric micropump. The first working scenario is a scenario where the processor operating power of the electronic device exceeds a preset power threshold. For example, the first working scenario can be a game scenario.

[0092] In this embodiment, S601 may include: Based on the first working scenario, the driving parameters to be adjusted include the driving phase difference and driving amplitude between the first piezoelectric micropump and the second piezoelectric micropump. Select at least one candidate driving phase difference from the candidate set of driving phase differences, and adjust the driving amplitudes of the first piezoelectric micropump and the second piezoelectric micropump based on the candidate driving phase differences.

[0093] Specifically, the target driving parameters may include the target driving phase difference, the target driving amplitude corresponding to the first piezoelectric micropump, and the target driving amplitude corresponding to the second piezoelectric micropump. When adjusting the driving phase difference and driving amplitude, the electronic device can first control the piezoelectric micropump to run based on the first candidate phase difference in the phase difference candidate set. While the piezoelectric micropump is running at the first candidate phase difference, the noise and temperature information of the electronic device are acquired. It is then determined whether the noise information meets the noise constraint conditions and whether the temperature information meets the temperature constraint conditions. If the noise information does not meet the noise constraint conditions and / or the temperature information does not meet the temperature constraint conditions, the piezoelectric micropump can be controlled to run based on the second candidate phase difference in the phase difference candidate set, and the process returns to the steps of acquiring the noise and temperature information of the electronic device and subsequent steps.

[0094] If the noise information meets the noise constraint and / or the temperature information meets the temperature constraint, the candidate driving phase difference currently in operation of the piezoelectric micropump can be selected as the target driving phase difference. Based on the target driving phase difference, the driving amplitudes corresponding to the first and second piezoelectric micropumps are adjusted respectively. The currently operating candidate driving phase difference can be any candidate phase difference from the candidate phase difference set; that is, the currently operating candidate driving phase difference can be either the first or the second candidate phase difference.

[0095] When adjusting the drive amplitudes corresponding to the first and second piezoelectric micropumps, the electronic device can sequentially adjust the drive amplitudes corresponding to the first and second piezoelectric micropumps. That is, the electronic device can first keep the drive amplitude of the first piezoelectric micropump unchanged and adjust the drive amplitude corresponding to the second piezoelectric micropump; after determining the target drive amplitude corresponding to the second piezoelectric micropump, while keeping the second piezoelectric micropump running at that target drive amplitude, the electronic device can adjust the drive amplitude of the first piezoelectric micropump to determine the target drive amplitude of the first piezoelectric micropump.

[0096] In this embodiment, when the processor operating power of the electronic device exceeds a preset power threshold, the electronic device first selects a target driving phase difference from the candidate phase difference set, and then adjusts the driving amplitude of the two piezoelectric micropumps according to the target driving phase difference. Since adjusting the driving phase difference does not affect the heat dissipation efficiency and coolant flow rate of the liquid cooling system, while adjusting the driving amplitude will affect the heat dissipation effect of the liquid cooling system, adjusting the driving phase difference first can achieve noise reduction without sacrificing heat dissipation capacity when the processor operating power exceeds the preset power threshold, thus balancing the heat dissipation requirements and noise control requirements under high load conditions.

[0097] In one embodiment, the working scenario in S601 includes a second working scenario, and the piezoelectric micropump in the electronic device includes a first piezoelectric micropump and a second piezoelectric micropump. The first working scenario is a noise-sensitive scenario. For example, the first working scenario could be a recording scenario, a video conferencing scenario, a voice call scenario, etc.

[0098] In this embodiment, S601 may include: According to the second working scenario, the driving parameters to be adjusted include the driving phase difference between the first piezoelectric micropump and the second piezoelectric micropump, as well as at least one of the working frequency, driving amplitude, driving duty cycle and piezoelectric micropump start-up sequence corresponding to the first piezoelectric micropump and the second piezoelectric micropump respectively, and the target noise reduction position includes the microphone. Select at least one candidate driving phase difference from the candidate set of driving phase differences, and based on the candidate driving phase difference, adjust at least one of the following: the operating frequency, driving amplitude, driving duty cycle and starting order of the first piezoelectric micropump and the second piezoelectric micropump, respectively, so as to reduce microphone noise.

[0099] In one embodiment, in the second working scenario, the electronic device can adjust at least one of the following: the driving phase difference, driving amplitude, driving duty cycle, and piezoelectric micropump start-up sequence between the first and second piezoelectric micropumps, based on the sound signal acquired by the microphone.

[0100] Specifically, when the target driving parameters include a target operating frequency, the electronic device can adjust the operating frequencies of the first and second piezoelectric micropumps respectively based on the sound signal acquired by the microphone. The electronic device can first determine the first operating frequency based on the sound signal acquired by the microphone. Then, the electronic device can sequentially adjust the operating frequencies of the first and second piezoelectric micropumps based on the frequency candidate set and the first operating frequency. That is, the electronic device can first keep the operating frequency of the first piezoelectric micropump unchanged and adjust the operating frequency of the second piezoelectric micropump; after determining the target operating frequency of the second piezoelectric micropump, while keeping the second piezoelectric micropump operating at the target operating frequency, the electronic device can adjust the operating frequency of the first piezoelectric micropump to determine the target operating frequency of the first piezoelectric micropump.

[0101] Specifically, when adjusting the operating frequency of the first or second piezoelectric micropump, a candidate operating frequency different from the first operating frequency can be selected from the frequency candidate set. The operation of the first or second piezoelectric micropump is then controlled according to the candidate operating frequency. The electronic device can sequentially traverse each candidate operating frequency different from the first operating frequency in the frequency candidate set until the noise information meets the noise constraint condition and the temperature information meets the temperature constraint condition. At this point, the electronic device can determine the current candidate operating frequency used to control the operation of the piezoelectric micropump as the target operating frequency.

[0102] In this embodiment, when the working scenario is a noise-sensitive scenario, the electronic device can identify the microphone as the target noise reduction location and perform targeted noise reduction on the area where the microphone is located. Therefore, the method provided in this embodiment can effectively reduce the probability of noise caused by piezoelectric micro-pumps being picked up by the microphone, thereby reducing noise in noise-sensitive scenarios such as recording, video calls, and voice calls, and thus improving the user experience in noise-sensitive scenarios.

[0103] In addition, the electronic device determines the first operating frequency based on the sound signal collected by the microphone, and adjusts the operating frequency of the piezoelectric micropump accordingly. This allows the piezoelectric micropump to operate in the non-sensitive frequency band of the microphone, thereby reducing the probability of resonance superposition between the operating frequency of the piezoelectric micropump and the microphone's audio band, and further reducing the possibility of pump noise being recorded by the microphone.

[0104] The control method of the liquid cooling system of this application will be described in general detail below through different specific embodiments. It should be understood that the following embodiments are all for the purpose of better illustrating the control method of the liquid cooling system of this application and are not intended to limit the scope of the application.

[0105] Example 1: This embodiment uses a gaming phone as an example. The phone internally includes coolant piping, piezoelectric micropumps P1 and P2. The two piezoelectric micropumps work together to circulate the coolant, dissipating heat from the SoC (System-on-a-Chip) area and battery area of ​​the electronic device. The electronic device also includes an accelerometer and a microphone; the accelerometer can be used to detect structural vibrations, and the microphone can be used to collect noise.

[0106] In related technologies, if it is desired to cancel vibrations using two micropumps, the two micropumps are usually set to operate in fixed out-of-phase mode, i.e., the phase difference between piezoelectric micropumps P1 and P2 is set to 180°. However, in this embodiment, the electronic device does not assume that 180° is necessarily the optimal value. Since the installation paths of piezoelectric micropumps P1 and P2 to structural components such as the PCB board, mid-frame, and back cover are different, their vibration transfer functions are different. Due to the different vibration transfer functions, even if piezoelectric micropumps P1 and P2 are out of phase in electrical signals, their vibrations may not completely cancel each other out after reaching the user's grip area, and may even superimpose at certain structural frequency points.

[0107] Figure 7 This is a schematic diagram of an adaptive optimization provided in an embodiment of this application. Figure 7 This illustration shows a curve representing the noise value versus phase difference, as provided in an embodiment of this application. The horizontal axis represents the phase difference between two piezoelectric micropumps, and the vertical axis represents the noise value. Different curve formats can represent the noise value versus phase difference curves of two piezoelectric micropumps under different amplitude combinations. Figure 7 As shown, the noise level of the electronic device is not at its lowest when the phase difference between the two piezoelectric micropumps is 180°. Instead, the noise level is lowest when the phase difference is approximately 60°. The noise level can be measured using specialized instruments, subjectively evaluated by the human ear, or calculated from piezoelectric self-induction signals collected by sensors such as microphones, accelerometers, and piezoelectric sensors.

[0108] The specific process of the control method for the liquid cooling system in this embodiment is as follows: First, once the SoC temperature reaches the liquid cooling start-up threshold, the electronic device can activate two piezoelectric micropumps to dissipate heat from the SoC area via the liquid cooling system. Piezoelectric micropumps P1 and P2 operate according to preset driving parameters; for example, they can operate at the same operating frequency, the same driving amplitude, and a preset phase difference. Subsequently, an accelerometer collects vibration signals from the electronic device's frame or overall structure, and a microphone collects sound signals from the piezoelectric micropumps during operation. The controller extracts the fundamental frequency and harmonic components related to the operating frequency of the piezoelectric micropumps from the vibration and sound signals as noise characteristic information to determine whether there is a correlation between the noise and the piezoelectric micropumps. The electronic device can also calculate a first noise value based on the vibration and sound signals.

[0109] Then, once the electronic device determines that there is a correlation between the noise and the piezoelectric micropump, it can perform a small-range scan around a preset phase difference. For example, the electronic device can sequentially drive the piezoelectric micropump based on multiple candidate phase differences such as 150°, 165°, 180°, 195°, and 210°. After each time the electronic device controls the piezoelectric micropump to run with a set of candidate phase differences, it can collect the current vibration and sound signals to calculate the noise value. If the second noise value of the electronic device is less than the first noise value and the SoC temperature value is less than the SoC temperature threshold when the piezoelectric micropump is running with a certain candidate phase difference, then the system takes that phase difference as the current target phase difference.

[0110] Next, the electronic device can further adjust the driving amplitudes of piezoelectric micropumps P1 and P2. Specifically, the electronic device can first adjust the driving amplitude of piezoelectric micropump P1 while keeping the driving amplitude of piezoelectric micropump P2 unchanged, and obtain the current noise value Y1. Then, the electronic device can adjust the driving amplitude of piezoelectric micropump P2 while keeping the driving amplitude of piezoelectric micropump P1 unchanged, and obtain the noise value Y2 again. If the noise value Y1 is less than the noise value Y2, the electronic device can determine that piezoelectric micropump P1 has a greater impact on the vibration noise of the user's grip side shell. At this time, the electronic device can appropriately reduce the driving amplitude of piezoelectric micropump P1 while increasing the driving amplitude of piezoelectric micropump P2, so that the total pumping capacity of the two piezoelectric micropumps is kept within the target range while reducing the vibration noise of the electronic device. The method provided in this embodiment can avoid the problem of insufficient heat dissipation caused by simply reducing the driving amplitude of the two piezoelectric micropumps.

[0111] The control method provided in Example 1 can solve the problem of poor adaptability of the fixed anti-phase scheme. For different user grip states, different phone back cover materials, different micropump bonding states, and different game loads, the system can find more suitable driving parameters through feedback signals. Even for the same phone, the vibration transmission path of the piezoelectric micropump may differ under different placement and grip states. Therefore, the method provided in this example can also correct the driving parameters of each piezoelectric micropump based on actual feedback.

[0112] Example 2: This embodiment uses noise-sensitive work scenarios such as mobile phone recording, video conferencing, or voice calls as examples. In these scenarios, the thermal load of the electronic device may not necessarily reach its maximum value, but users are very sensitive to the noise caused by the piezoelectric micropump. If the operating sound of the piezoelectric micropump is picked up by the microphone, it may cause low-frequency humming noise or periodic noise in the recording, thereby affecting the voice quality.

[0113] In this embodiment, the system first identifies whether it is in a noise-sensitive working scenario by checking the application status, microphone activation status, audio path status, and foreground task. When the current working scenario of the electronic device is a mobile phone recording scenario, video conferencing scenario, voice call scenario, or voice input scenario, the adaptive control module can increase the noise reduction weight and decrease the heat dissipation weight. In addition, during the adjustment of the piezoelectric micropump's drive parameters, the electronic device can use the sound signal collected by the microphone as the main basis for calculating the noise value.

[0114] In the above working scenario, the electronic device does not pursue the maximum liquid cooling flow rate, but rather aims to minimize the noise value associated with the piezoelectric micropump collected by the microphone, while meeting the current temperature constraints.

[0115] In a specific operational scenario, after a user opens a video conferencing application, the electronic device detects continuous microphone operation, and the SoC's temperature rises slightly, requiring the liquid cooling system to assist in heat dissipation. At this point, the electronic device can activate the liquid cooling system.

[0116] The specific control actions are as follows: 1. The electronic device first selects the preset phase difference and preset operating frequency from the drive parameter table based on the current usage status information of the electronic device, and controls the operation of the two piezoelectric micro pumps according to the preset phase difference and preset operating frequency.

[0117] 2. Then, when the electronic device determines that there is a correlation between noise and piezoelectric micropump, it can adjust the phase difference between piezoelectric micropump P1 and piezoelectric micropump P2 to reduce the noise transmitted to the microphone by the piezoelectric micropump without temporarily reducing the heat dissipation capacity of the liquid cooling system. 3. The microphone continuously detects noise components related to the operating frequency of the piezoelectric micropump. If noise related to the operating frequency of the piezoelectric micropump is detected entering the voice link, the electronic device can adjust the operating frequency of the piezoelectric micropump to a frequency band where the microphone pickup is weaker or the overall structure response is lower.

[0118] 4. Reduce the driving amplitude of the piezoelectric micropump, but keep the SOC temperature value less than or equal to the SOC temperature threshold; 5. When the device is in the working state of collecting user voice, the drive duty cycle of the piezoelectric micropump can be reduced to weaken vibration noise; specifically, the drive parameters of the piezoelectric micropump can be reduced during low noise sensitive periods, and the drive parameters of the piezoelectric micropump can be increased during voice intermittent periods to balance the noise reduction effect and the heat dissipation requirements of the whole machine. 6. When the thermal load of electronic equipment is low, only one piezoelectric micropump can be kept in operation with a low drive amplitude, or two piezoelectric micropumps can be used to operate alternately with a low drive amplitude.

[0119] 7. If the SoC temperature continues to rise during the meeting, the system will not simply disable low-noise control. Instead, it will increase the total flow rate of the piezoelectric micropump while maintaining the phase difference and operating frequency of the piezoelectric micropump within the low-noise region. If the SoC temperature is already close to its upper limit, the thermal weight can be temporarily increased, allowing a slight increase in low-frequency vibration noise caused by the piezoelectric micropump to prevent the chip from overheating. After the SoC temperature drops, the drive parameters of the piezoelectric micropump can be adjusted to reduce low-frequency vibration noise.

[0120] In this embodiment, the electronic device can identify noise-sensitive scenarios and dynamically adjust the driving parameters of the piezoelectric micropump based on the noise actually detected by the microphone related to the piezoelectric micropump, so that the piezoelectric micropump will not generate significant noise interference in noise-sensitive scenarios such as recording, video conferencing, or voice calls. The method provided in this embodiment does not perform noise filtering on the sound signal after the noise enters the microphone, but rather adjusts the driving parameters of the piezoelectric micropump, such as phase difference, driving amplitude, operating frequency, and duty cycle, thereby reducing the probability of noise entering the microphone at its source.

[0121] Figure 8 This is a schematic diagram of the control flow of a liquid cooling system provided in an embodiment of this application. Figure 8 As shown, during operation, the electronic device can determine whether the liquid cooling system needs to be activated. If the liquid cooling system does not need to be activated, the electronic device can keep the liquid cooling system off or maintain the electronic device in a low-power state.

[0122] If the liquid cooling system needs to be activated, the electronic device can determine the preset drive parameters of the piezoelectric micropump through the drive parameter table, control the operation of the piezoelectric micropump according to the preset drive parameters, and collect vibration or sound signals of the piezoelectric micropump running at the preset drive parameters. The electronic device can extract noise feature information from the vibration or sound signals. The electronic device can determine whether there is a correlation between noise and the piezoelectric micropump based on the noise features. When there is no correlation between noise and the piezoelectric micropump, the electronic device can maintain the piezoelectric micropump running at the current drive parameters. When there is a correlation between noise and the piezoelectric micropump, the electronic device can determine temperature constraints according to the current working scenario. The electronic device can also determine heat dissipation priority and noise reduction priority according to the working scenario.

[0123] The electronic device can calculate adjusted drive parameters based on heat dissipation and noise reduction priorities, and control the piezoelectric micropump to execute the adjusted drive parameters. While the piezoelectric micropump is running with the adjusted drive parameters, the electronic device can detect the noise reduction and heat dissipation effects. Specifically, the electronic device can determine whether the noise has decreased and whether the temperature information meets the temperature constraints. If the noise has not decreased and / or the temperature information does not meet the temperature constraints, the electronic device can return to the step of calculating the adjusted drive parameters. If the noise has decreased and the temperature information meets the temperature constraints, the electronic device can determine the current adjusted drive parameters as the target drive parameters and control the piezoelectric micropump to run with the target drive parameters. The electronic device can also update the drive parameter table based on the target drive parameters.

[0124] Figure 9 This is a schematic diagram of the structure of an electronic device provided according to an embodiment of this application. The electronic device can be any of the electronic devices described in the above embodiments. For example... Figure 9 As shown, the electronic device 2000 includes a memory and a processor. The number of memories and processors can be one or more. Figure 9 Taking a memory 2101 and a processor 2201 as an example; the memory 2101 and the processor 2201 in the electronic device can be connected through a bus or other means. Figure 9 Taking the example of a connection between China and Israel via a bus.

[0125] The memory 2101, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as program instructions / modules corresponding to the methods provided in any embodiment of this application. The processor 2201 implements the parameter configuration method of the wireless network provided in any of the above embodiments by running the software programs, instructions, and modules stored in the memory 2101.

[0126] Memory 2101 may primarily include a program storage area and a data storage area, wherein the program storage area may store the operating system and application programs required for at least one function. Furthermore, memory 2101 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some instances, memory 2101 further includes memory remotely located relative to processor 2201, and this remote memory can be connected to the device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0127] In addition, one embodiment of this application discloses a computer-readable storage medium storing computer-executable instructions for performing a control method for a liquid cooling system as described in any of the preceding embodiments.

[0128] Furthermore, one embodiment of this application discloses a computer program product, including a computer program or computer instructions, which are stored in a computer-readable storage medium. The processor of a network node reads the computer program or computer instructions from the computer-readable storage medium and executes the computer program or computer instructions, causing the network node to perform the control method of the liquid cooling system as described in any of the preceding embodiments.

[0129] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0130] The above is a detailed description of the preferred embodiments of this application. However, this application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A control method for a liquid cooling system, applied to an electronic device including the liquid cooling system, the method comprising: Control the operation of the piezoelectric micropump in the liquid cooling system; When the noise of the electronic device is correlated with the piezoelectric micropump, the driving parameters of the piezoelectric micropump are adjusted until the noise information of the electronic device meets the noise constraint condition and the temperature information of the electronic device meets the temperature constraint condition when the piezoelectric micropump is run based on the adjusted driving parameters. Then the adjusted driving parameters are determined to be the target driving parameters. The piezoelectric micropump is controlled to operate with the target drive parameters.

2. The control method according to claim 1, characterized in that, Before adjusting the driving parameters of the piezoelectric micropump when there is a correlation between the noise of the electronic device and the piezoelectric micropump, the following steps are included: Based on the vibration signal and / or sound signal of the electronic device, the noise characteristic information corresponding to the piezoelectric micropump is determined; The correlation between the noise of the electronic device and the piezoelectric micropump is determined based on the noise characteristic information.

3. The control method according to claim 2, characterized in that, The determination of the noise characteristic information corresponding to the piezoelectric micropump based on the vibration signal and / or sound signal of the electronic device includes: Frequency domain analysis is performed on the vibration signal and / or sound signal to determine the noise characteristic information corresponding to the piezoelectric micropump.

4. The control method according to claim 2 or 3, characterized in that, The noise characteristic information includes at least one of the following: The fundamental frequency amplitude represents the amplitude of the vibration signal and / or sound signal at the operating frequency of the piezoelectric micropump; The second harmonic amplitude represents the amplitude of the vibration signal and / or sound signal under the second harmonic; the second harmonic is twice the operating frequency of the piezoelectric micropump. The third harmonic amplitude represents the amplitude of the vibration signal and / or sound signal under the third harmonic; the third harmonic is three times the operating frequency of the piezoelectric micropump. Broadband vibration energy, which represents the average amplitude of the vibration signal and / or sound signal within a frequency range; the frequency range is determined based on the operating frequency of the piezoelectric micropump. Noise amplitude, which represents the amplitude of the noise signal of the electronic device when the piezoelectric micropump is in operation; First time synchronization information, which indicates the time synchronization between the noise signal and the drive signal of the piezoelectric micropump; The second time synchronization information represents the time synchronization between the abrupt change signal in the noise signal and the drive signal of the piezoelectric micropump; the abrupt change signal is a signal in the noise signal whose amplitude change satisfies the abrupt change threshold.

5. The control method according to claim 2, characterized in that, Adjusting the driving parameters of the piezoelectric micropump includes: Based on the operating scenario of the electronic device, the driving parameters of the piezoelectric micropump are determined, and the driving parameters are used to adjust the piezoelectric micropump.

6. The control method according to claim 5, characterized in that, Determining the driving parameters of the piezoelectric micropump based on the operating scenario of the electronic device includes: The adjustment strategy for the piezoelectric micropump is determined based on the operating scenario of the electronic device. The driving parameters of the piezoelectric micropump are adjusted according to the adjustment strategy.

7. The control method according to claim 6, characterized in that, The adjustment strategy includes the adjustment method; The step of determining the adjustment strategy of the piezoelectric micropump based on the operating scenario of the electronic device includes: Based on the working scenario of the electronic device, the adjustment method of the piezoelectric micropump is determined, and the adjustment method includes the driving parameters to be adjusted and / or the target noise reduction position.

8. The control method according to claim 7, characterized in that, The adjustment strategy also includes heat dissipation priority and / or noise reduction priority; Determining the adjustment method of the piezoelectric micropump based on the operating scenario of the electronic device includes: Based on the operating scenario of the electronic device, determine the heat dissipation priority and / or the noise reduction priority of the piezoelectric micropump; The adjustment method of the piezoelectric micropump is determined based on the heat dissipation priority and / or the noise reduction priority.

9. The control method according to any one of claims 7 to 8, characterized in that, The driving parameters to be adjusted include at least one of the following: driving phase, driving phase difference, operating frequency, driving amplitude, driving duty cycle, and piezoelectric micropump start-up sequence; the target noise reduction position includes any position of the electronic device.

10. The control method according to claim 5, characterized in that, The temperature constraint condition is obtained through the following steps: Based on the operating scenario of the electronic device, determine the heat dissipation constraint information of the electronic device; Based on the heat dissipation constraint information, the temperature constraint condition is determined.

11. The control method according to claim 10, characterized in that, The heat dissipation constraint information includes a heat dissipation constraint object and a temperature constraint condition, wherein the temperature constraint condition includes the current temperature of the heat dissipation constraint object being less than or equal to the temperature threshold corresponding to the heat dissipation constraint object.

12. The control method according to claim 5, characterized in that, The noise constraint condition includes that the adjusted noise value of the electronic device is less than the original noise value of the electronic device; wherein, the noise value is used to characterize the noise level of the electronic device, the original noise value corresponds to the noise value generated by the piezoelectric micropump operating with the original driving parameters, and the adjusted noise value corresponds to the noise value generated by the piezoelectric micropump operating with the adjusted driving parameters.

13. The control method according to claim 7, characterized in that, The working scenario is a first working scenario, which is a scenario where the processor operating power of the electronic device is greater than a preset power threshold, and the piezoelectric micropump includes a first piezoelectric micropump and a second piezoelectric micropump. The adjustment strategy of the piezoelectric micropump is determined based on the working scenario of the electronic device; According to the adjustment strategy, the driving parameters of the piezoelectric micropump are adjusted, including: Based on the first working scenario, the driving parameters to be adjusted include the driving phase difference and driving amplitude between the first piezoelectric micropump and the second piezoelectric micropump. At least one candidate driving phase difference is selected from the candidate set of driving phase differences, and the driving amplitude corresponding to the first piezoelectric micropump and the second piezoelectric micropump is adjusted based on the candidate driving phase difference.

14. The control method according to claim 7, characterized in that, The working scenario is the second working scenario, which is a noise-sensitive scenario, and the piezoelectric micropump includes a first piezoelectric micropump and a second piezoelectric micropump. The adjustment strategy of the piezoelectric micropump is determined based on the working scenario of the electronic device; According to the adjustment strategy, the driving parameters of the piezoelectric micropump are adjusted, including: According to the second working scenario, the driving parameters to be adjusted include the driving phase difference between the first piezoelectric micropump and the second piezoelectric micropump, and at least one of the working frequency, driving amplitude, driving duty cycle and starting order of the piezoelectric micropump and the first piezoelectric micropump respectively. The target noise reduction position includes the microphone. At least one candidate driving phase difference is selected from the candidate set of driving phase differences, and based on the candidate driving phase difference, at least one of the operating frequency, driving amplitude, driving duty cycle and starting order of the piezoelectric micropump and the second piezoelectric micropump is adjusted respectively to reduce the microphone noise.

15. The control method according to claim 1, characterized in that, After controlling the piezoelectric micropump to operate at the target drive parameters, the method further includes: The target driving parameters are used to update the driving parameter table, which includes the preset driving parameters of the piezoelectric micropump.

16. An electronic device, characterized in that, include: At least one processor; At least one memory for storing at least one program; The control method for the liquid cooling system as described in any one of claims 1 to 15 is implemented when at least one of the programs is executed by at least one of the processors.

17. A computer-readable storage medium storing computer-executable instructions, characterized in that, The computer-executable instructions are used to execute the control method of the liquid cooling system as described in any one of claims 1 to 15.

18. A computer program product, comprising a computer program or computer instructions, characterized in that, The computer program or the computer instructions are stored in a computer-readable storage medium. The processor of the electronic device reads the computer program or the computer instructions from the computer-readable storage medium and executes the computer program or the computer instructions, causing the electronic device to perform the control method of the liquid cooling system according to any one of claims 1 to 15.

Images